NXP IP4254CZ8 Integrated 4-, 6- and 8-channel passive filter network with esd protection to iec 61000-4-2, level 4 Datasheet

IP4253CZ8/CZ12/CZ16;
IP4254CZ8/CZ12/CZ16
Integrated 4-, 6- and 8-channel passive filter network with
ESD protection to IEC 61000-4-2, level 4
Rev. 02 — 8 November 2007
Product data sheet
1. Product profile
1.1 General description
The IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 family consists of 4-, 6- and
8-channel RC low-pass filter arrays which are designed to provide filtering of undesired
RF signals on the I/O ports of portable communication or computing devices. In addition,
the IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 family incorporates diodes to
provide protection to downstream components from ElectroStatic Discharge (ESD)
voltages as high as ±30 kV.
The IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 family is fabricated using monolithic
silicon technology and integrates up to 8 resistors and 16 diodes in a 0.4 mm pitch 8-, 12or 16-pin MicroPak (compatible with QFN) lead-free plastic package with a height of
0.5 mm only.
1.2 Features
n Pb-free and dark green compliant
n 4-, 6- and 8-channel integrated π-type RC filter network
n IP4253CZ8/CZ12/CZ16: 200 Ω channel series resistance, 30 pF (at 2.5 V DC)
channel capacitance
n IP4254CZ8/CZ12/CZ16: 100 Ω channel series resistance, 30 pF (at 2.5 V DC)
channel capacitance
n ESD protection to ±30 kV contact discharge according to IEC 61000-4-2 standard far
exceeding level 4
n MicroPak (QFN compatible) plastic package with 0.4 mm pitch
1.3 Applications
n General purpose ElectroMagnetic Interference (EMI) and Radio-Frequency
Interference (RFI) filtering and downstream ESD protection for:
u Cellular and Personal Communication System (PCS) mobile handsets
u Cordless telephones
u Wireless data (WAN/LAN) systems
u PDAs
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
2. Pinning information
Table 1.
Pin
Pinning IP4253CZx and IP4254CZx
Description
Simplified outline
Symbol
CZ8
1 and 8
filter channel 1
2 and 7
filter channel 2
3 and 6
filter channel 3
4 and 5
filter channel 4
ground pad
ground
8
Rs(ch)
5
1, 2, 3, 4
5, 6, 7, 8
Cch
2
1
4
Transparent
top view
Cch
2
GND
001aaf978
CZ12
1 and 12
filter channel 1
2 and 11
filter channel 2
3 and 10
filter channel 3
4 and 9
filter channel 4
5 and 8
filter channel 5
6 and 7
filter channel 6
ground pad
ground
12
Rs(ch)
7
1, 2, 3,
4, 5, 6
1
Cch
2
Cch
2
7, 8, 9,
10, 11, 12
6
Transparent
top view
GND
001aaf979
CZ16
1 and 16
filter channel 1
2 and 15
filter channel 2
3 and 14
filter channel 3
4 and 13
filter channel 4
5 and 12
filter channel 5
6 and 11
filter channel 6
7 and 10
filter channel 7
8 and 9
filter channel 8
ground pad
ground
16
1, 2, 3, 4,
5, 6, 7, 8
1
Cch
2
Cch
2
9, 10, 11, 12,
13, 14, 15, 16
8
Transparent
top view
IP4253_54_CZ8_CZ12_CZ16_2
Product data sheet
Rs(ch)
9
GND
001aaf980
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 8 November 2007
2 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
HXSON8
plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.5 mm
SOT983-1
IP4253CZ12-6 HXSON12
plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.5 mm
SOT984-1
IP4253CZ16-8 HXSON16
plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.5 mm
SOT985-1
IP4254CZ8-4
plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; body 1.35 × 1.7 × 0.5 mm
SOT983-1
IP4254CZ12-6 HXSON12
plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; body 1.35 × 2.5 × 0.5 mm
SOT984-1
IP4254CZ16-8 HXSON16
plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; body 1.35 × 3.3 × 0.5 mm
SOT985-1
IP4253CZ8-4
HXSON8
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VCC
supply voltage
Vesd
electrostatic discharge
voltage
Min
Max
Unit
−0.5
+5.6
V
all pins to ground
contact discharge
[1]
−30
+30
kV
air discharge
[1]
−30
+30
kV
contact discharge
−8
+8
kV
air discharge
−15
+15
kV
IEC 61000-4-2, Level 4;
all pins to ground
Pch
channel power dissipation Tamb = 85 °C
-
60
mW
Ptot
total power dissipation
Tamb = 85 °C
-
200
mW
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−40
+85
°C
[1]
Device withstands ≥ 1000 discharges with ±30 kV using the IEC 61000-4-2 model without degradation.
5. Thermal characteristics
Table 4.
Thermal characteristics
Symbol
Parameter
Rth(j-pcb)
[1]
Conditions
thermal resistance from junction to 2 layer printed-circuit
printed-circuit board
board
Unit
120[1]
K/W
Depends on layout details.
IP4253_54_CZ8_CZ12_CZ16_2
Product data sheet
Typ
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 8 November 2007
3 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
6. Characteristics
Table 5.
Channel resistance
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Rs(ch)
channel series resistance IP4253CZ8/CZ12/CZ16
IP4254CZ8/CZ12/CZ16
Min
Typ
Max
Unit
160
-
240
Ω
80
-
120
Ω
Min
Typ
Max
Unit
-
30
-
pF
-
45
-
pF
Table 6.
Channel characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Cch
channel capacitance
for the total channel;
f = 100 kHz
Vbias(DC) = 2.5 V
Vbias(DC) = 0 V
[1]
ILR
reverse leakage current
per channel; VI = 3.5 V
-
-
0.1
µA
VBR
breakdown voltage
positive clamp; II = 1 mA
5.8
-
9
V
VF
forward voltage
negative clamp; IF = 1 mA
0.4
-
1.5
V
Min
Typ
Max
Unit
[1]
Guaranteed by design.
Table 7.
Frequency characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
IP4253CZ8/CZ12/CZ16
αil
αct
insertion loss
crosstalk attenuation
Rsource = 50 Ω; RL = 50 Ω
800 MHz < f < 3 GHz
-
25
-
dB
f = 1 GHz
30
-
-
dB
-
25
-
dB
800 MHz < f < 3 GHz
-
20
-
dB
f = 1 GHz
25
-
-
dB
-
21
-
dB
Rsource = 50 Ω; RL = 50 Ω;
800 MHz < f < 3 GHz
IP4254CZ8/CZ12/CZ16
αil
αct
insertion loss
crosstalk attenuation
Rsource = 50 Ω; RL = 50 Ω
Rsource = 50 Ω; RL = 50 Ω;
800 MHz < f < 3 GHz
IP4253_54_CZ8_CZ12_CZ16_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 8 November 2007
4 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
7. Package outline
HXSON8: plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; body 1.35 x 1.7 x 0.5 mm
SOT983-1
X
B
D
A
A
E
A1
terminal 1
index area
detail X
e1
1/2 e
terminal 1
index area
v
w
b
e
1
L1
M
M
C
C A B
C
y
y1 C
4
L
Eh
8
5
Dh
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
Dh
E
Eh
e
e1
L
L1
v
w
y
y1
mm
0.5
0.05
0.00
0.25
0.15
1.75
1.65
1.5
1.3
1.4
1.3
0.5
0.3
0.4
1.2
0.35
0.15
0.09
0.00
0.1
0.05
0.05
0.1
REFERENCES
OUTLINE
VERSION
IEC
SOT983-1
---
JEDEC
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
07-01-04
07-01-12
Fig 1. Package outline SOT983-1 (HXSON8)
IP4253_54_CZ8_CZ12_CZ16_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 8 November 2007
5 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
HXSON12: plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; body 1.35 x 2.5 x 0.5 mm
SOT984-1
X
B
D
A
A
E
A1
terminal 1
index area
detail X
e1
terminal 1
index area
e
v
w
b
1/2 e
1
L1
M
M
C
C A B
C
y
y1 C
6
L
Eh
12
7
Dh
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
Dh
E
Eh
e
e1
L
L1
v
w
y
y1
mm
0.5
0.05
0.00
0.25
0.15
2.55
2.45
2.3
2.1
1.4
1.3
0.5
0.3
0.4
2
0.35
0.15
0.09
0.00
0.1
0.05
0.05
0.1
REFERENCES
OUTLINE
VERSION
IEC
SOT984-1
---
JEDEC
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
07-01-04
07-01-12
Fig 2. Package outline SOT984-1 (HXSON12)
IP4253_54_CZ8_CZ12_CZ16_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 8 November 2007
6 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
HXSON16: plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; body 1.35 x 3.3 x 0.5 mm
SOT985-1
X
B
D
A
A
E
A1
terminal 1
index area
detail X
e1
terminal 1
index area
e
v
w
b
1/2 e
1
L1
M
M
C
C A B
C
y
y1 C
8
L
Eh
16
9
Dh
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
Dh
E
Eh
e
e1
L
L1
v
w
y
y1
mm
0.5
0.05
0.00
0.25
0.15
3.35
3.25
3.1
2.9
1.4
1.3
0.5
0.3
0.4
2.8
0.35
0.15
0.09
0.00
0.1
0.05
0.05
0.1
REFERENCES
OUTLINE
VERSION
IEC
SOT985-1
---
JEDEC
JEITA
---
EUROPEAN
PROJECTION
ISSUE DATE
07-01-04
07-01-12
Fig 3. Package outline SOT985-1 (HXSON16)
IP4253_54_CZ8_CZ12_CZ16_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 8 November 2007
7 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
8. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change
notice
Supersedes
IP4253_54_CZ8_CZ12_CZ16_2
20071108
Product data sheet
-
IP4253_54_CZ8_CZ12_CZ16_1
Modifications:
IP4253_54_CZ8_CZ12_CZ16_1
•
All <tbd> values filled in.
20070209
Objective data sheet -
IP4253_54_CZ8_CZ12_CZ16_2
Product data sheet
-
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 8 November 2007
8 of 10
IP425xCZ8/CZ12/CZ16
NXP Semiconductors
Integrated 4-, 6- and 8-channel passive filter network
9. Legal information
9.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
9.3
Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [email protected]
IP4253_54_CZ8_CZ12_CZ16_2
Product data sheet
© NXP B.V. 2007. All rights reserved.
Rev. 02 — 8 November 2007
9 of 10
NXP Semiconductors
IP425xCZ8/CZ12/CZ16
Integrated 4-, 6- and 8-channel passive filter network
11. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
9.1
9.2
9.3
9.4
10
11
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 November 2007
Document identifier: IP4253_54_CZ8_CZ12_CZ16_2
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