TI CY74FCT162H245T 16-bit transceiver Datasheet

1CY74FCT16445T/2
H245T
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
16-Bit Transceivers
SCCS026B - July 1994 - Revised September 2001
Features
Functional Description
• Ioff supports partial-power-down mode operation
• Edge-rate control circuitry for significantly improved
noise characteristics
• Typical output skew < 250 ps
• ESD > 2000V
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
• Industrial temperature range of –40˚C to +85˚C
• VCC = 5V ± 10%
CY74FCT16245T Features:
• 64 mA sink current, 32 mA source current
• Typical VOLP (ground bounce)<1.0V at VCC = 5V,
TA = 25˚C
These 16-bit transceivers are designed for use in bidirectional
synchronous communication between two buses, where high
speed and low power are required. With the exception of the
CY74FCT16245T, these devices can be operated either as
two independent octals or a single 16-bit transceiver. Direction
of data flow is controlled by (DIR), the Output Enable (OE)
transfers data when LOW and isolates the buses when HIGH.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device
when it is powered down.
The CY74FCT16245T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
The CY74FCT162245T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The
CY74FCT162245T is ideal for driving transmission lines.
CY74FCT162245T Features:
• Balanced output drivers: 24 mA
• Reduced system switching noise
• Typical VOLP (ground bounce) <0.6V at VCC = 5V,
TA= 25˚C
CY74FCT162H245T Features:
• Bus hold on data inputs
• Eliminates the need for external pull-up or pull-down
resistors
The CY74FCT162H245T is a 24-mA balanced output part that
has bus hold on the data inputs. The device retains the input’s
last state whenever the input goes to high impedance. This
eliminates the need for pull-up/down resistors and prevents
floating inputs.
Logic Block Diagrams CY74FCT16245T,CY74FCT162245T,
CY74FCT162H245T
1DIR
Pin Configuration
SSOP/TSSOP
Top View
2DIR
1OE
1A1
2OE
1DIR
1
48
1OE
1B1
2
3
47
46
1A2
GND
1B3
4
5
45
44
GND
1A3
1B4
VCC
1B5
6
2B2
2B3
GND
2A1
1B1
1A2
1B2
2B1
2A2
1B2
1A3
2A3
1B3
1A4
1B4
1A5
2B4
1A6
2A6
1A7
2B6
2A7
1B7
1A8
2B7
2A8
1B8
FCT16245–1
VCC
1A5
GND
1B7
11
38
1A7
1B8
12
13
37
36
1A8
35
34
2A2
GND
14
15
GND
2B3
16
33
2A3
2B4
17
32
2A4
VCC
2B5
18
31
19
30
VCC
2A5
2B2
2B5
1B6
1A4
2B1
2A5
1B5
43
7 16245T 42
8 162245T 41
162H245T
9
40
10
39
1B6
2A4
2B8
1A1
1A6
2A1
2B6
20
29
2A6
GND
21
28
GND
2B7
22
27
2A7
2B8
23
26
2A8
2DIR
24
25
2OE
FCT16245–3
FCT16245–2
Copyright
© 2001, Texas Instruments Incorporated
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
Maximum Ratings[3, 4]
Pin Description
Name
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Storage Temperature ........................Com’l -55°C to +125°C
Description
OE
Three-State Output Enable Inputs (Active LOW)
DIR
Direction Control
A
Inputs or Three-State Outputs[1]
Ambient Temperature with
Power Applied....................................Com’l -55°C to +125°C
B
Inputs or Three-State Outputs[1]
DC Input Voltage ........................................... –0.5V to +7.0V
DC Output Voltage......................................... –0.5V to +7.0V
DC Output Current
(Maximum Sink Current/Pin) ........................–60 to +120 mA
Function Table[2]
Inputs
Power Dissipation .......................................................... 1.0W
OE
DIR
Outputs
L
L
Bus B Data to Bus A
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
L
H
Bus A Data to Bus B
Operating Range
H
X
High Z State
Range
Industrial
Ambient
Temperature
VCC
–40°C to +85°C
5V ± 10%
Notes:
1. On CY74FCT162H245T these pins have bus hold.
2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance.
3. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range.
4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
Electrical Characteristics Over the Operating Range
Parameter
Description
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
VH
Input
Hysteresis[6]
VIK
Input Clamp Diode Voltage
IIH
Input HIGH Current
Test Conditions
Min.
Typ.[5]
2.0
0.8
100
VCC=Min., IIN=–18 mA
Standard
Input LOW Current
Standard
–0.7
VCC=Max., VI=VCC
IBBH
IBBL
Bus Hold Sustain Current on Bus Hold
IBHHO
IBHLO
Bus Hold Overdrive Current on Bus Hold
IOZH
High Impedance Output Current
(Three-State Output pins)
IOZL
IOS
IO
IOFF
Input[7]
V
mV
–1.2
V
±1
µA
±100
VCC=Max., VI=GND
Bus Hold
Input[7]
Unit
V
Bus Hold
IIL
Max.
VCC=Min.
VI=2.0V
–50
VI=0.8V
+50
±1
µA
±100
µA
µA
TBD
mA
VCC=Max., VOUT=2.7V
±1
µA
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=0.5V
±1
µA
Short Circuit Current[8]
VCC=Max., VOUT=GND
–80
–200
mA
Current[8]
VCC=Max., VOUT=2.5V
–50
–180
mA
±1
µA
Output Drive
Power-Off Disable
VCC=Max., VI=1.5V
VCC=0V, VOUT≤4.5V
2
[9]
–140
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
Output Drive Characteristics for CY74FCT16245T
Parameter
VOH
VOL
Min.
Typ.[5]
VCC=Min., IOH=–3 mA
2.5
3.5
V
VCC=Min., IOH=–15 mA
2.4
3.5
V
VCC=Min., IOH=–32 mA
2.0
3.0
V
Description
Output HIGH Voltage
Output LOW Voltage
Test Conditions
VCC=Min., IOL=64 mA
Max.
Unit
0.2
0.55
V
Typ.[5]
Max.
Unit
Output Drive Characteristics for CY74FCT162245T, CY74FCT162H245T
Parameter
Description
[8]
Test Conditions
Min.
IODL
Output LOW Current
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
60
115
150
mA
IODH
Output HIGH Current[8]
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
–60
–115
–150
mA
VOH
Output HIGH Voltage
VCC=Min., IOH=–24 mA
2.4
3.3
VOL
Output LOW Voltage
VCC=Min., IOL=24 mA
0.3
V
0.55
V
Notes:
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.
6. This parameter is specified but not tested.
7. Pins with bus hold are described in Pin Description.
8. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
9. Tested at +25˚C.
Capacitance[6] (TA = +25˚C, f = 1.0 MHz)
Parameter
Description
Test Conditions
Typ.[5]
Max.
Unit
CIN
Input Capacitance
VIN = 0V
4.5
6.0
pF
COUT
Output Capacitance
VOUT = 0V
5.5
8.0
pF
3
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
Power Supply Characteristics
Parameter
Description
Test Conditions
Typ.[5]
Max.
Unit
5
500
µA
0.5
1.5
mA
ICC
Quiescent Power Supply Current VCC=Max.
VIN<0.2V,
VIN>VCC-0.2V
∆ICC
Quiescent Power Supply Current VCC=Max.
(TTL inputs HIGH)
VIN=3.4V[10]
ICCD
Dynamic Power Supply
Current[11]
VCC=Max., One Input Toggling, VIN=VCC or
50% Duty Cycle, Outputs Open, VIN=GND
OE=DIR=GND
60
100
µA/MHz
IC
Total Power Supply Current[12]
VCC=Max., f1=10 MHz,
VIN=VCC or
50% Duty Cycle, Outputs Open, VIN=GND
One Bit Toggling,
VIN=3.4V or
OE=DIR=GND
VIN=GND
0.6
1.5
mA
0.9
2.3
mA
VCC=Max., f1=2.5 MHz, 50%
Duty Cycle, Outputs Open,
Sixteen Bits Toggling,
OE=DIR=GND
VIN=VCC or
VIN=GND
2.4
4.5[13]
mA
VIN=3.4V or
VIN=GND
6.4
16.5[13]
mA
Notes:
10. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
= IQUIESCENT + IINPUTS + IDYNAMIC
12. IC
IC
= ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
DH = Duty Cycle for TTL inputs HIGH
NT = Number of TTL inputs at DH
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
f0
= Input signal frequency
f1
N1 = Number of inputs changing at f1
All currents are in milliamps and all frequencies are in megahertz.
13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
4
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
]
Switching Characteristics Over the Operating Range[14]
74FCT16245T
74FCT162245T
Parameter
Description
74FCT16245AT
74FCT162245AT
74FCT162H245AT
Min.
Max.
Min.
Max.
Unit
Fig.
No.[15]
tPLH
tPHL
Propagation Delay Data to Output
A to B, B to A
1.5
7.0
1.5
4.5
ns
1, 3
tPZH
tPZL
Output Enable Time
OE to A or B
1.5
9.5
1.5
6.2
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
OE to A or B
1.5
7.5
1.5
5.0
ns
1, 7, 8
tPZH
tPZL
Output Enable Time
DIR to A or B
1.5
9.5
1.5
6.2
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
DIR to A or B
1.5
7.5
1.5
5.0
ns
1, 7, 8
tSK(O)
Output Skew[16]
0.5
ns
—
0.5
74FCT16245CT
74FCT162245CT
74FCT162H245CT
Parameter
Description
Min.
Max.
Unit
Fig.
No.[15]
tPLH
tPHL
Propagation Delay Data to Output
A to B, B to A
1.5
4.1
ns
1, 3
tPZH
tPZL
Output Enable Time
OE to A or B
1.5
5.8
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
OE to A or B
1.5
4.8
ns
1, 7, 8
tPZH
tPZL
Output Enable Time
DIR to A or B
1.5
5.8
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
DIR to A or B
1.5
4.8
ns
1, 7, 8
tSK(O)
Output Skew[16]
0.5
ns
—
Note:
14. Minimum limits are specified but not tested on Propagation Delays.
15. See “Parameter Measurement Information” in the General Information section.
16. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.
Ordering Information CY74FCT16245
Speed
(ns)
4.1
4.5
7.0
Ordering Code
Package
Name
Package Type
CY74FCT16245CTPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT16245CTPVC/PVCT
O48
48-Lead (300-Mil) SSOP
CY74FCT16245ATPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT16245ATPVC/PVCT
O48
48-Lead (300-Mil) SSOP
CY74FCT16245TPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT16245TPVC/PVCT
O48
48-Lead (300-Mil) SSOP
5
Operating
Range
Industrial
Industrial
Industrial
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
Ordering Information CY74FCT162245
Speed
(ns)
4.1
4.5
7.0
Ordering Code
Package
Name
Package Type
CY74FCT162245CTPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT162245CTPVC
O48
48-Lead (300-Mil) SSOP
74FCT162245CTPVCT
O48
48-Lead (300-Mil) SSOP
74FCT162245ATPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT162245ATPVC
O48
48-Lead (300-Mil) SSOP
74FCT162245ATPVCT
O48
48-Lead (300-Mil) SSOP
CY74FCT162245TPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT162245TPVC/PVCT
O48
48-Lead (300-Mil) SSOP
Operating
Range
Industrial
Industrial
Industrial
Ordering Information CY74FCT162H245
Speed
(ns)
4.1
4.5
Ordering Code
Package
Name
Package Type
74FCT162H245CTPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT162H245CTPVC
O48
48-Lead (300-Mil) SSOP
74FCT162H245CTPVCT
O48
48-Lead (300-Mil) SSOP
74FCT162H245ATPACT
Z48
48-Lead (240-Mil) TSSOP
CY74FCT162H245ATPVC
O48
48-Lead (300-Mil) SSOP
74FCT162H245ATPVCT
O48
48-Lead (300-Mil) SSOP
6
Operating
Range
Industrial
Industrial
CY74FCT16245T/2245T
CY74FCT16445T/2H245T
Package Diagrams
48-Lead Shrunk Small Outline Package O48
7
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
Package Diagrams
48-Lead Thin Shrunk Small Outline Package Z48
8
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74FCT162245ATPACT
ACTIVE
TSSOP
DGG
48
74FCT162245ATPVCG4
ACTIVE
SSOP
DL
48
74FCT162245ATPVCT
ACTIVE
SSOP
DL
74FCT162245CTPACT
ACTIVE
TSSOP
74FCT162245CTPVCG4
ACTIVE
74FCT162245CTPVCT
2000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DL
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162245ETPACT
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
74FCT162245ETPVCT
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
74FCT162245TPACTE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162245TPACTG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162245TPVCG4
ACTIVE
SSOP
DL
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162245TPVCTG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16245ATPACTE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16245ATPACTG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16245ATPVCG4
ACTIVE
SSOP
DL
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16245ATPVCTG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16245CTPACTE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16245CTPACTG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16245CTPVCG4
ACTIVE
SSOP
DL
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16245CTPVCTG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16245TPACTE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16245TPACTG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16245TPVCG4
ACTIVE
SSOP
DL
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT16245TPVCTG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162H245ATPACT
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162H245ATPVC
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
25
25
25
25
25
25
25
Addendum-Page 1
Green (RoHS &
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74FCT162H245ATPVCT
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162H245CTPACT
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162H245CTPVC
ACTIVE
SSOP
DL
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74FCT162H245CTPVCT
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
no Sb/Br)
25
74FCT162H245ETPAC
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
74FCT162H245ETPACT
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
74FCT162H245ETPVC
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
74FCT162H245ETPVCT
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
CY74FCT162245ATPVC
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT162245CTPVC
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT162245ETPAC
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
CY74FCT162245ETPVC
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
CY74FCT162245TPACT
ACTIVE
TSSOP
DGG
48
CY74FCT162245TPVC
ACTIVE
SSOP
DL
48
CY74FCT162245TPVCT
ACTIVE
SSOP
DL
CY74FCT16245ATPACT
ACTIVE
TSSOP
CY74FCT16245ATPVC
ACTIVE
CY74FCT16245ATPVCT
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DL
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT16245CTPACT
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT16245CTPVC
ACTIVE
SSOP
DL
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT16245CTPVCT
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
25
25
25
CY74FCT16245ETPAC
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
CY74FCT16245ETPACT
OBSOLETE
TSSOP
DGG
48
TBD
Call TI
Call TI
CY74FCT16245ETPVC
OBSOLETE
SSOP
DL
48
TBD
Call TI
Call TI
CY74FCT16245ETPVCT
OBSOLETE
SSOP
DL
48
Call TI
Call TI
CY74FCT16245TPACT
ACTIVE
TSSOP
DGG
48
CY74FCT16245TPVC
ACTIVE
SSOP
DL
48
CY74FCT16245TPVCT
ACTIVE
SSOP
DL
FCT162245ATPACTE4
ACTIVE
TSSOP
DGG
TBD
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
25
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
FCT162245ATPACTG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162245ATPVCTG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162245CTPACTE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162245CTPACTG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162245CTPVCTG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162H245ATPACTE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162H245ATPACTG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162H245ATPVCG4
ACTIVE
SSOP
DL
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162H245ATPVCTG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162H245CTPACTE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162H245CTPACTG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162H245CTPVCG4
ACTIVE
SSOP
DL
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
FCT162H245CTPVCTG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
25
25
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
74FCT162245ATPACT
Package Package Pins
Type Drawing
TSSOP
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
74FCT162245ATPVCT
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
74FCT162245CTPACT
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
74FCT162245CTPVCT
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
74FCT162H245ATPACT
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
74FCT162H245ATPVCT
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
74FCT162H245CTPACT
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
74FCT162H245CTPVCT
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
CY74FCT162245TPACT
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
CY74FCT162245TPVCT
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
CY74FCT16245ATPACT
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
CY74FCT16245ATPVCT
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
CY74FCT16245CTPACT
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
CY74FCT16245CTPVCT
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
CY74FCT16245TPACT
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
CY74FCT16245TPVCT
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74FCT162245ATPACT
TSSOP
DGG
48
2000
346.0
346.0
41.0
74FCT162245ATPVCT
SSOP
DL
48
1000
346.0
346.0
49.0
74FCT162245CTPACT
TSSOP
DGG
48
2000
346.0
346.0
41.0
74FCT162245CTPVCT
SSOP
DL
48
1000
346.0
346.0
49.0
74FCT162H245ATPACT
TSSOP
DGG
48
2000
346.0
346.0
41.0
74FCT162H245ATPVCT
SSOP
DL
48
1000
346.0
346.0
49.0
74FCT162H245CTPACT
TSSOP
DGG
48
2000
346.0
346.0
41.0
74FCT162H245CTPVCT
SSOP
DL
48
1000
346.0
346.0
49.0
CY74FCT162245TPACT
TSSOP
DGG
48
2000
346.0
346.0
41.0
CY74FCT162245TPVCT
SSOP
DL
48
1000
346.0
346.0
49.0
CY74FCT16245ATPACT
TSSOP
DGG
48
2000
346.0
346.0
41.0
CY74FCT16245ATPVCT
SSOP
DL
48
1000
346.0
346.0
49.0
CY74FCT16245CTPACT
TSSOP
DGG
48
2000
346.0
346.0
41.0
CY74FCT16245CTPVCT
SSOP
DL
48
1000
346.0
346.0
49.0
CY74FCT16245TPACT
TSSOP
DGG
48
2000
346.0
346.0
41.0
CY74FCT16245TPVCT
SSOP
DL
48
1000
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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