± SLLS350L − APRIL 1999 − REVISED MARCH 2004
D Single-Chip and Single-Supply Interface for
D
D
D
D
D
D
D
D
D
D
D
D
D
D
DB, DW, OR PW PACKAGE
(TOP VIEW)
IBM PC/AT Serial Port
RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Three Drivers and Five Receivers
Operates Up To 250 kbit/s
Designed to Transmit at a Data Rate of
250 kbit/s
Low Standby Current . . . 1 µA Typical
External Capacitors . . . 4 × 0.1 µF
Accepts 5-V Logic Input With 3.3-V Supply
Always-Active Noninverting Receiver
Output (ROUT2B)
Alternative High-Speed Pin-Compatible
Device (1 Mbit/s)
− SNx5C3243
Serial-Mouse Driveability
Auto-Powerdown Feature to Disable Driver
Outputs When No Valid RS-232 Signal Is
Sensed
Applications
− Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
C2+
C2−
V−
RIN1
RIN2
RIN3
RIN4
RIN5
DOUT1
DOUT2
DOUT3
DIN3
DIN2
DIN1
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
C1+
V+
VCC
GND
C1−
FORCEON
FORCEOFF
INVALID
ROUT2B
ROUT1
ROUT2
ROUT3
ROUT4
ROUT5
description/ordering information
The MAX3243 consists of three line drivers, five line receivers, and a dual charge-pump circuit with ±15-kV ESD
(HBM) protection pin to pin (serial-port connection pins, including GND). The device meets the requirements
of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and
the serial-port connector. This combination of drivers and receivers matches that needed for the typical serial
port used in an IBM PC/AT, or compatible. The charge pump and four small external capacitors allow operation
from a single 3-V to 5.5-V supply. In addition, the device includes an always-active noninverting output
(ROUT2B), which allows applications using the ring indicator to transmit data while the device is powered down.
The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
AT, IBM, and PC are trademarks of International Business Machines Corporation.
Copyright 2004, Texas Instruments Incorporated
!"#$%&'(!$" !) *+%%,"( ') $# -+./!*'(!$" 0'(,
%$0+*() *$"#$%& ($ )-,*!#!*'(!$") -,% (1, (,%&) $# ,2') ")(%+&,"()
)('"0'%0 3'%%'"(4 %$0+*(!$" -%$*,))!"5 0$,) "$( ",*,))'%!/4 !"*/+0,
(,)(!"5 $# '// -'%'&,(,%)
POST OFFICE BOX 655303
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1
± SLLS350L − APRIL 1999 − REVISED MARCH 2004
description/ordering information (continued)
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF
is set low, both drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 µA.
Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high and should be done when driving
a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is
applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any
receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than −2.7 V
or has been between −0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver input
voltages are between −0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC (DW)
0°C to 70°C
SSOP (DB)
TSSOP (PW)
SOIC (DW)
−40°C to 85°C
SSOP (DB)
TSSOP (PW)
Tube of 20
MAX3243CDW
Reel of 1000
MAX3243CDWR
Tube of 50
MAX3243CDB
Reel of 2000
MAX3243CDBR
Tube of 50
MAX3243CPW
Reel of 2000
MAX3243CPWR
Tube of 20
MAX3243IDW
Reel of 1000
MAX3243IDWR
Tube of 50
MAX3243IDB
Reel of 2000
MAX3243IDBR
Tube of 50
MAX3243IPW
Reel of 2000
MAX3243IPWR
TOP-SIDE
MARKING
MAX3243C
MAX3243C
MA3243C
MAX3243I
MAX3243I
MB3243I
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Function Tables
EACH DRIVER
INPUTS
OUTPUT
DOUT
DRIVER STATUS
X
Z
Powered off
Normal operation with
auto-powerdown disabled
DIN
FORCEON
FORCEOFF
VALID RIN
RS-232 LEVEL
X
X
L
L
H
H
X
H
H
H
H
X
L
L
L
H
Yes
H
H
L
H
Yes
L
L
L
H
No
Z
H
L
H
No
Z
H = high level, L = low level, X = irrelevant, Z = high impedance
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Normal operation with
auto-powerdown enabled
Powered off by
auto-powerdown feature
± SLLS350L − APRIL 1999 − REVISED MARCH 2004
EACH RECEIVER
INPUTS
OUTPUTS
RIN2
RIN1,
RIN3−RIN5
FORCEOFF
VALID RIN
RS-232 LEVEL
L
X
L
H
X
L
L
L
L
H
H
L
ROUT2B
ROUT
X
L
Z
X
H
Z
H
Yes
L
H
H
Yes
L
L
H
Yes
H
H
RECEIVER STATUS
Powered off while
ROUT2B is active
H
H
H
Yes
H
L
Open
Open
H
No
L
H
Normal operation with
auto-powerdown
disabled/enabled
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected
driver off
logic diagram (positive logic)
DIN1
DIN2
DIN3
FORCEOFF
FORCEON
ROUT1
ROUT2B
ROUT2
14
9
13
10
12
11
DOUT1
DOUT2
DOUT3
22
23
21
Auto-powerdown
19
4
20
5 kΩ
18
5
INVALID
RIN1
RIN2
5 kΩ
ROUT3
17
6
RIN3
5 kΩ
ROUT4
7
16
RIN4
5 kΩ
ROUT5
8
15
RIN5
5 kΩ
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
± SLLS350L − APRIL 1999 − REVISED MARCH 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, VI: Driver (FORCEOFF, FORCEON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V
Output voltage range, VO: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V
Receiver (INVALID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V
Package thermal impedance, θJA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 6)
VCC = 3.3 V
VCC = 5 V
Supply voltage
VIH
Driver and control high-level input voltage
DIN, FORCEOFF, FORCEON
VIL
VI
Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON
Driver and control input voltage
DIN, FORCEOFF, FORCEON
VI
Receiver input voltage
TA
VCC = 3.3 V
VCC = 5 V
MAX3243C
Operating free-air temperature
MAX3243I
MIN
NOM
MAX
3
3.3
3.6
4.5
5
5.5
UNIT
V
2
V
2.4
0.8
V
0
5.5
V
−25
25
V
0
70
−40
85
°C
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
II
Input leakage
current
TEST CONDITIONS
FORCEOFF,
FORCEON
Auto-powerdown
disabled
ICC
Supply current
Powered off
VCC = 3.3 V or 5 V,
25 C
TA = 25°C
Auto-powerdown
enabled
No load,
FORCEOFF and
FORCEON at VCC
No load, FORCEOFF at GND
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded,
All DIN are grounded
MIN
TYP‡
MAX
±0.01
±1
µA
0.3
1
mA
1
10
1
10
‡ All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
µA
± SLLS350L − APRIL 1999 − REVISED MARCH 2004
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
VOH
VOL
VO
IIH
IIL
TEST CONDITIONS
MIN
TYP†
MAX
UNIT
High-level output voltage
All DOUT at RL = 3 kΩ to GND
5
5.4
V
Low-level output voltage
All DOUT at RL = 3 kΩ to GND
−5
−5.4
V
Output voltage
(mouse driveability)
DIN1 = DIN2 = GND, DIN3 = VCC, 3-kΩ to GND at DOUT3,
DOUT1 = DOUT2 = 2.5 mA
±5
High-level input current
VI = VCC
VI at GND
Low-level input current
IOS
Short-circuit output current‡
VCC = 3.6 V,
VCC = 5.5 V,
ro
Output resistance
VCC, V+, and V− = 0 V,
VO = 0 V
VO = 0 V
VO = ±2 V
VO = ±12 V,
300
V
±0.01
±1
µA
±0.01
±1
µA
±35
±60
mA
Ω
10M
±25
VCC = 3 V to 3.6 V
µA
VO = ±10 V,
VCC = 4.5 V to 5.5 V
±25
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
Ioff
Output leakage current
FORCEOFF = GND
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
TEST CONDITIONS
Maximum data rate
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ,
See Figure 1
tsk(p)
Pulse skew§
CL = 150 pF to 2500 pF
RL = 3 kΩ to 7 kΩ,
See Figure 2
SR(tr)
Slew rate, transition region
(see Figure 1)
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ
MIN
TYP†
150
250
kbit/s
100
ns
MAX
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
UNIT
V/µs
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
§ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
± SLLS350L − APRIL 1999 − REVISED MARCH 2004
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER
VOH
VOL
TEST CONDITIONS
High-level output voltage
IOH = −1 mA
IOL = 1.6 mA
Low-level output voltage
VIT+
Positive-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
VIT−
Negative-going input threshold voltage
VCC = 3.3 V
VCC = 5 V
Vhys
Ioff
Input hysteresis (VIT+ − VIT−)
MIN
TYP†
VCC−0.6 V
VCC−0.1 V
MAX
V
0.4
1.6
2.4
1.9
2.4
0.6
1.1
0.8
1.4
±0.05
FORCEOFF = 0 V
ri
Input resistance
VI = ±3 V to ±25 V
3
5
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
V
V
V
0.5
Output leakage current (except ROUT2B)
UNIT
V
±10
µA
7
kΩ
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
PARAMETER
TEST CONDITIONS
tPLH
tPHL
Propagation delay time, low- to high-level output
ten
tdis
Output enable time
Propagation delay time, high- to low-level output
Output disable time
Pulse skew‡
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ,
kΩ See Figure 4
MIN
TYP†
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
150
ns
150
ns
200
ns
200
ns
tsk(p)
See Figure 3
50
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
6
MAX
ns
± SLLS350L − APRIL 1999 − REVISED MARCH 2004
AUTO-POWERDOWN SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
VT+(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VT−(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−2.7
VT(invalid)
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
−0.3
VOH
INVALID high-level output voltage
IOH = −1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
TYP†
MAX
UNIT
2.7
V
V
0.3
V
VCC−0.6
V
0.4
V
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
tvalid
tinvalid
MIN
TYP†
MAX
UNIT
Propagation delay time, low- to high-level output
1
µs
Propagation delay time, high- to low-level output
30
µs
100
µs
ten
Supply enable time
† All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
0V
CL
(see Note A)
tTHL
3V
FORCEOFF
TEST CIRCUIT
Output
SR(tr) +
6V
t THL or t TLH
tTLH
3V
−3 V
3V
−3 V
VOH
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
± SLLS350L − APRIL 1999 − REVISED MARCH 2004
PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
RS-232
Output
50 Ω
Input
0V
CL
(see Note A)
RL
1.5 V
1.5 V
tPHL
tPLH
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
tPHL
CL
(see Note A)
3V
FORCEOFF
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
3V
Input
3 V or 0 V
FORCEON
VCC
S1
1.5 V
0V
tPZH
(S1 at GND)
tPHZ
(S1 at GND)
RL
3 V or 0 V
1.5 V
GND
VOH
Output
50%
Output
CL
(see Note A)
FORCEOFF
Generator
(see Note B)
0.3 V
tPLZ
(S1 at VCC)
50 Ω
tPZL
(S1 at VCC)
0.3 V
Output
50%
VOL
TEST CIRCUIT
NOTES: A.
B.
C.
D.
VOLTAGE WAVEFORMS
CL includes probe and jig capacitance.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
Figure 4. Receiver Enable and Disable Times
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
± SLLS350L − APRIL 1999 − REVISED MARCH 2004
PARAMETER MEASUREMENT INFORMATION
2.7 V
2.7 V
0V
Receiver
Input
0V
50 Ω
−2.7 V
−2.7 V
ROUT
Generator
(see Note B)
3V
−3 V
tvalid
tinvalid
VCC
INVALID
Output
Autopowerdown
50% VCC
0V
ten
INVALID
CL = 30 pF
(see Note A)
≈V+
V+
0.3 V
VCC
0V
0.3 V
Supply
Voltages
FORCEOFF
FORCEON
50% VCC
DIN
DOUT
≈V−
V−
TEST CIRCUIT
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
2.7 V
Indeterminate
0.3 V
0V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
−0.3 V
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
† Auto-powerdown disables drivers and reduces
supply current to 1 µA.
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 5. INVALID Propagation Delay Times and Supply Enabling Time
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
± SLLS350L − APRIL 1999 − REVISED MARCH 2004
APPLICATION INFORMATION
C1+
1
+
C2
−
2
3
V−
GND
C1−
RIN2
RIN3
RIN4
RIN5
DOUT1
RS-232 Outputs
VCC
+
RIN1
RS-232 Inputs
C2−
DOUT2
4
27
+
−
26
25
C3†
+ CBYPASS
− = 0.1 µF
+
−
C1
24
23
FORCEON
5
Autopowerdown
C4
−
V+
C2+
28
6
7
22
FORCEOFF
8
21
9
20
10
19
INVALID
ROUT2B
ROUT1
5 kΩ
DOUT3
11
18
ROUT2
5 kΩ
DIN3
12
Logic Outputs
17
ROUT3
5 kΩ
Logic Inputs
DIN2
13
16
ROUT4
5 kΩ
DIN1
14
15
ROUT5
5 kΩ
† C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized
tantalum or electrolytic capacitors are used, they should be
connected as shown.
VCC vs CAPACITOR VALUES
VCC
C1
C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Aug-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MAX3243CDB
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CDBE4
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CDBG4
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CDBR
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CDBRE4
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CDBRG4
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CDW
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CDWE4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CDWG4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CDWR
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CDWRG4
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CPW
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CPWE4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CPWG4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CPWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CPWRE4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243CPWRG4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IDB
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IDBE4
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IDBG4
ACTIVE
SSOP
DB
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IDBR
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IDBRE4
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IDBRG4
ACTIVE
SSOP
DB
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IDW
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IDWG4
ACTIVE
SOIC
DW
28
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
25-Aug-2009
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MAX3243IDWR
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IDWRE4
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IDWRG4
ACTIVE
SOIC
DW
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IPW
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IPWG4
ACTIVE
TSSOP
PW
28
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IPWR
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IPWRE4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MAX3243IPWRG4
ACTIVE
TSSOP
PW
28
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MAX3243 :
• Enhanced Product: MAX3243-EP
NOTE: Qualified Version Definitions:
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Aug-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
MAX3243CDBR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SSOP
DB
28
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
MAX3243CDWR
SOIC
DW
28
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
MAX3243CPWR
TSSOP
PW
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
MAX3243CPWR
TSSOP
PW
28
2000
330.0
16.4
7.1
10.4
1.6
12.0
16.0
Q1
MAX3243IDBR
SSOP
DB
28
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
MAX3243IDWR
SOIC
DW
28
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
MAX3243IPWR
TSSOP
PW
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
MAX3243IPWR
TSSOP
PW
28
2000
330.0
16.4
7.1
10.4
1.6
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Aug-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MAX3243CDBR
SSOP
DB
28
2000
346.0
346.0
33.0
MAX3243CDWR
SOIC
DW
28
1000
346.0
346.0
49.0
MAX3243CPWR
TSSOP
PW
28
2000
346.0
346.0
33.0
MAX3243CPWR
TSSOP
PW
28
2000
346.0
346.0
33.0
MAX3243IDBR
SSOP
DB
28
2000
346.0
346.0
33.0
MAX3243IDWR
SOIC
DW
28
1000
346.0
346.0
49.0
MAX3243IPWR
TSSOP
PW
28
2000
346.0
346.0
33.0
MAX3243IPWR
TSSOP
PW
28
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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