LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only FOUR DIGIT LED DISPLAY (0.33 Inch) Pb Lead-Free Parts LFD355/61-XX-PF DATA SHEET DOC. NO : QW0905- LFD355/61-XX-PF REV. : B DATE : 02 - Sep. - 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 PART NO. LFD355/61-XX-PF Package Dimensions 7.0 (0.28") 30.0(1.18") DIG.1 DP1 8.4 (0.33") DIG.3 DIG.2 DIG.4 DP3 14.0 (0.55') DP4 10.16 (0.4") DP2 DP5 DP6 LFD355/61-XX-PF LIGITEK A F G E D 4.0±0.5 Ø 0.51 TYP 2.54*9=22.86(0.9") PIN Note : 1.All dimension are in millimeters and (lnch) tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. B C DP LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD355/61-XX-PF Page 2/8 Internal Circuit Diagram LFD3551-XX-PF 1 20 14 13 4 3 18 15 11 16 DP2 19 DP1 DIG. 1 B 2 C A DIG. 2 B C D 17 E F G DP3 5 DP4 A DIG. 3 B C D 6 E F G A B C D E F G 7 10 LFD3561-XX-PF DP5 DP6 1 20 14 13 4 3 18 15 11 16 DP2 19 DP1 DIG. 1 B 2 C A DIG. 2 B C D 17 E F G DP3 5 DP4 A DIG. 3 B C D 6 E F G A B C D E F G DIG. 4 12 8 7 9 10 DP5 DP6 DIG. 4 12 8 9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD355/61-XX-PF Page 3/8 Electrical Connection PIN NO.1 LFD3551-XX-PF PIN NO.1 LFD3561-XX-PF 1 Anode DP2 1 Cathode DP2 2 Common Cathode Dig.1 2 Common Anode Dig.1 3 Anode D 3 Cathode D 4 Anode C 4 Cathode C 5 Common Cathode DP3,4 5 Common Anode DP3,4 6 Common Cathode Dig.3 6 Common Anode Dig.3 7 Anode DP5 7 Cathode DP5 8 Cathode DP5 8 Anode DP5 9 Cathode DP6 9 Anode DP6 10 Anode DP6 10 Cathode DP6 11 Anode G 11 Cathode G 12 Common Cathode Dig.4 12 Common Anode Dig.4 13 Anode B 13 Cathode B 14 Anode A 14 Cathode A 15 Anode F 15 Cathode F 16 Anode DP3,4 16 Cathode DP3,4 17 Common Cathode Dig.2 17 Common Anode Dig.2 18 Anode E 18 Cathode E 19 Cathode DP2 19 Anode DP2 20 Anode DP1 20 Cathode DP1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD355/61-XX-PF Page 4/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT H Forward Current Per Chip IF 15 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 60 mA Power Dissipation Per Chip PD 40 mW Ir 10 μA Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Reverse Current Per Any Chip Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25℃) common cathode Material Emitted or anode CHIP PART NO △λ Vf(v) (nm) Iv(mcd) IV-M Min. Typ. Max. Min. Typ. Common Cathode LFD3551-XX-PF GaP LFD3561-XX-PF Electrical λP (nm) Red 697 90 1.7 2.1 Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 2.6 0.2 0.35 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/8 PART NO. LFD355/61-XX-PF Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λP nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD355/61-XX-PF Page 6/8 Typical Electro-Optical Characteristics Curve H CHIP Fig.2 Relative Intensity vs. Forward Current Fig.1 Forward current vs. Forward Voltage 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 2.0 1.0 3.0 4.0 5.0 10 1.0 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 600 700 800 900 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 1000 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD355/61-XX-PF Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ° C 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LFD355/61-XX-PF Page 8/8 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11