Freescale MMG3007NT1 Heterojunction bipolar transistor (ingap hbt) Datasheet

Freescale Semiconductor
Technical Data
Document Number: MMG3007NT1
Rev. 5, 3/2008
Heterojunction Bipolar Transistor
(InGaP HBT)
Broadband High Linearity Amplifier
MMG3007NT1
The MMG3007NT1 is a General Purpose Amplifier that is internally
input and output matched. It is designed for a broad range of Class A,
small - signal, high linearity, general purpose applications. It is suitable
for applications with frequencies from 0 to 6000 MHz such as Cellular,
P C S , B W A , W L L , P H S , C AT V, V H F, U H F, U M T S a n d g e n e r a l
small - signal RF.
0 - 6000 MHz, 19 dB
16 dBm
InGaP HBT
Features
• Frequency: 0 to 6000 MHz
• P1dB: 16 dBm @ 900 MHz
• Small - Signal Gain: 19 dB @ 900 MHz
• Third Order Output Intercept Point: 30 dBm @ 900 MHz
• Single 5 Volt Supply
• Internally Matched to 50 Ohms
• Low Cost SOT - 89 Surface Mount Package
• RoHS Compliant
• In Tape and Reel. T1 Suffix = 1000 Units per 12 mm, 7 inch Reel.
Table 1. Typical Performance (1)
Symbol
900
MHz
2140
MHz
3500
MHz
Unit
Small - Signal Gain
(S21)
Gp
19
16.5
14
dB
IRL
- 14
- 21
- 21
dB
Output Return Loss
(S22)
ORL
- 20
- 17
- 25
dB
Power Output @1dB
Compression
P1db
16
15.5
16
dBm
IP3
30
29
28.5
dBm
Third Order Output
Intercept Point
3
CASE 1514 - 02, STYLE 1
SOT - 89
PLASTIC
Table 2. Maximum Ratings
Characteristic
Input Return Loss
(S11)
12
Rating
Symbol
Value
Unit
Supply Voltage
VCC
7
V
Supply Current
ICC
250
mA
RF Input Power
Pin
10
dBm
Tstg
- 65 to +150
°C
TJ
150
°C
Storage Temperature Range
Junction Temperature
(2)
2. For reliable operation, the junction temperature should not
exceed 150°C.
1. VCC = 5 Vdc, TC = 25°C, 50 ohm system
Table 3. Thermal Characteristics (VCC = 5 Vdc, ICC = 47 mA, TC = 25°C)
Characteristic
Thermal Resistance, Junction to Case
Symbol
Value (3)
Unit
RθJC
77
°C/W
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes - AN1955.
© Freescale Semiconductor, Inc., 2005-2008. All rights reserved.
RF Device Data
Freescale Semiconductor
MMG3007NT1
1
Table 4. Electrical Characteristics (VCC = 5 Vdc, 900 MHz, TC = 25°C, 50 ohm system, in Freescale Application Circuit)
Symbol
Min
Typ
Max
Unit
Small - Signal Gain (S21)
Characteristic
Gp
18
19
—
dB
Input Return Loss (S11)
IRL
—
- 14
—
dB
Output Return Loss (S22)
ORL
—
- 20
—
dB
Power Output @ 1dB Compression
P1dB
—
16
—
dBm
Third Order Output Intercept Point
IP3
—
30
—
dBm
Noise Figure
NF
—
3.8
—
dB
Supply Current (1)
ICC
39
47
55
mA
Supply Voltage (1)
VCC
—
5
—
V
1. For reliable operation, the junction temperature should not exceed 150°C.
MMG3007NT1
2
RF Device Data
Freescale Semiconductor
Table 5. Functional Pin Description
Pin
Number
2
Pin Function
1
RFin
2
Ground
3
RFout/DC Supply
1
2
3
Figure 1. Functional Diagram
Table 6. ESD Protection Characteristics
Test Methodology
Class
Human Body Model (per JESD 22 - A114)
1A (Minimum)
Machine Model (per EIA/JESD 22 - A115)
A (Minimum)
Charge Device Model (per JESD 22 - C101)
IV (Minimum)
Table 7. Moisture Sensitivity Level
Test Methodology
Per JESD 22 - A113, IPC/JEDEC J - STD - 020
Rating
Package Peak Temperature
Unit
1
260
°C
MMG3007NT1
RF Device Data
Freescale Semiconductor
3
50 OHM TYPICAL CHARACTERISTICS
0
TC = 85°C
−10
25°C
20
S11, S22 (dB)
Gp, SMALL−SIGNAL GAIN (dB)
25
- 40°C
15
S22
−20
S11
−30
VCC = 5 Vdc
ICC = 47 mA
VCC = 5 Vdc
10
−40
0
1
2
3
0
4
3
4
Figure 2. Small - Signal Gain (S21) versus
Frequency
Figure 3. Input/Output Return Loss versus
Frequency
20
P1dB, 1 dB COMPRESSION POINT (dBm)
Gp, SMALL−SIGNAL GAIN (dB)
2
f, FREQUENCY (GHz)
23
21
900 MHz
19
1960 MHz
2140 MHz
17
15
2600 MHz
13
3500 MHz
VCC = 5 Vdc
ICC = 47 mA
11
9
19
18
17
16
15
VCC = 5 Vdc
ICC = 47 mA
14
13
9
10
12
11
13
14
15
1
1.5
2
2.5
3
Pout, OUTPUT POWER (dBm)
f, FREQUENCY (GHz)
Figure 4. Small - Signal Gain versus Output
Power
Figure 5. P1dB versus Frequency
100
80
60
40
20
0
4
0.5
16
4.2
4.4
4.6
4.8
5
5.2
5.4
IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
8
ICC, COLLECTOR CURRENT (mA)
1
f, FREQUENCY (GHz)
3.5
33
30
27
24
VCC = 5 Vdc
ICC = 47 mA
1 MHz Tone Spacing
21
18
0
1
2
3
VCC, COLLECTOR VOLTAGE (V)
f, FREQUENCY (GHz)
Figure 6. Collector Current versus Collector
Voltage
Figure 7. Third Order Output Intercept Point
versus Frequency
4
MMG3007NT1
4
RF Device Data
Freescale Semiconductor
36
33
30
27
24
f = 900 MHz
1 MHz Tone Spacing
21
4.95
4.9
5
5.05
5.1
VCC, COLLECTOR VOLTAGE (V)
IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
IP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
50 OHM TYPICAL CHARACTERISTICS
32
31
30
29
28
27
VCC = 5 Vdc
f = 900 MHz
1 MHz Tone Spacing
26
25
−40
−20
40
60
80
100
T, TEMPERATURE (_C)
106
−30
−40
MTTF (YEARS)
IMD, THIRD ORDER
INTERMODULATION DISTORTION (dBc)
20
Figure 9. Third Order Output Intercept Point
versus Case Temperature
Figure 8. Third Order Output Intercept Point
versus Collector Voltage
−50
−60
−70
105
104
VCC = 5 Vdc
ICC = 47 mA
f = 900 MHz
1 MHz Tone Spacing
103
−80
−3
1
5
9
120
13
125
Pout, OUTPUT POWER (dBm)
6
4
2
VCC = 5 Vdc
ICC = 47 mA
0
1
2
3
135
140
145
150
NOTE: The MTTF is calculated with VCC = 5 Vdc, ICC = 47 mA
Figure 11. MTTF versus Junction Temperature
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
8
0
130
TJ, JUNCTION TEMPERATURE (°C)
Figure 10. Third Order Intermodulation versus
Output Power
NF, NOISE FIGURE (dB)
0
4
−20
VCC = 5 Vdc
ICC = 47 mA
f = 2140 MHz
Single−Carrier W−CDMA, 3.84 MHz Channel Bandwidth
Input Signal PAR = 8.5 dB @ 0.01% Probability (CCDF)
−30
−40
−50
−60
−70
−2
0
2
4
6
8
10
f, FREQUENCY (GHz)
Pout, OUTPUT POWER (dBm)
Figure 12. Noise Figure versus Frequency
Figure 13. Single - Carrier W - CDMA Adjacent
Channel Power Ratio versus Output Power
12
MMG3007NT1
RF Device Data
Freescale Semiconductor
5
50 OHM APPLICATION CIRCUIT: 40- 300 MHz
VSUPPLY
R1
C3
C4
L1
RF
INPUT
Z1
DUT
Z2
C1
Z1, Z5
Z2
Z3
Z3
Z4
Z5
VCC
0.347″ x 0.058″ Microstrip
0.575″ x 0.058″ Microstrip
0.172″ x 0.058″ Microstrip
RF
OUTPUT
C2
Z4
PCB
0.403″ x 0.058″ Microstrip
Getek Grade ML200C, 0.031″, εr = 4.1
Figure 14. 50 Ohm Test Circuit Schematic
30
S21
S21, S11, S22 (dB)
20
R1
10
C4
C3
0
L1
−10
C2
C1
−20
S22
−30
VCC = 5 Vdc
ICC = 47 mA
S11
−40
100
0
200
300
400
MMG30XX
Rev 2
500
f, FREQUENCY (MHz)
Figure 15. S21, S11 and S22 versus Frequency
Figure 16. 50 Ohm Test Circuit Component Layout
Table 8. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2, C3
0.01 μF Chip Capacitors
C0603C103J5RAC
Kemet
C4
1000 pF Chip Capacitor
C0603C102J5RAC
Kemet
L1
470 nH Chip Inductor
BK2125HM471 - T
Taiyo Yuden
R1
0 W Chip Resistor
ERJ3GEY0R00V
Panasonic
MMG3007NT1
6
RF Device Data
Freescale Semiconductor
50 OHM APPLICATION CIRCUIT: 300 - 3600 MHz
VSUPPLY
R1
C3
C4
L1
RF
INPUT
Z1
DUT
Z2
C1
Z1, Z5
Z2
Z3
Z3
Z4
Z5
VCC
0.347″ x 0.058″ Microstrip
0.575″ x 0.058″ Microstrip
0.172″ x 0.058″ Microstrip
RF
OUTPUT
C2
Z4
PCB
0.403″ x 0.058″ Microstrip
Getek Grade ML200C, 0.031″, εr = 4.1
Figure 17. 50 Ohm Test Circuit Schematic
30
S21, S11, S22 (dB)
20
S21
R1
10
C4
C3
L1
VCC = 5 Vdc
ICC = 47 mA
0
−10
C2
C1
S22
−20
−30
300
MMG30XX
Rev 2
S11
800
1300
1800
2300
2800
3300
3800
f, FREQUENCY (MHz)
Figure 18. S21, S11 and S22 versus Frequency
Figure 19. 50 Ohm Test Circuit Component Layout
Table 9. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2
150 pF Chip Capacitors
C0603C151J5RAC
Kemet
C3
0.01 μF Chip Capacitor
C0603C103J5RAC
Kemet
C4
1000 pF Chip Capacitor
C0603C102J5RAC
Kemet
L1
56 nH Chip Inductor
HK160856NJ - T
Taiyo Yuden
R1
0 W Chip Resistor
ERJ3GEY0R00V
Panasonic
MMG3007NT1
RF Device Data
Freescale Semiconductor
7
50 OHM TYPICAL CHARACTERISTICS
Table 10. Common Emitter S - Parameters (VCC = 5 Vdc, ICC = 47 mA, TC = 25°C, 50 Ohm System)
S11
S21
S12
S22
f
MHz
|S11|
∠φ
|S21|
∠φ
|S12|
∠φ
|S22|
∠φ
100
0.03698
162.744
9.488476
175.169
0.07218
- 0.406
0.06601
- 6.062
150
0.0413
161.759
9.431009
172.714
0.073936
- 0.163
0.07813
- 11.706
200
0.04475
159.333
9.37615
169.547
0.07479
- 1.111
0.089562
- 18.834
250
0.046352
159.222
9.34083
167.191
0.0744
- 1.219
0.09748
- 25.724
300
0.048403
155.469
9.29558
164.704
0.07458
- 1.237
0.10124
- 32.775
350
0.05
151.008
9.26495
162.138
0.07444
- 1.639
0.10466
- 36.946
400
0.0499
147.696
9.21219
159.65
0.07473
- 1.957
0.10811
- 41.977
450
0.04922
144.11
9.16094
157.234
0.07499
- 2.087
0.11164
- 46.631
500
0.04838
141.343
9.10787
154.702
0.07517
- 2.464
0.11391
- 50.846
550
0.04902
137.521
9.04991
152.326
0.07536
- 2.681
0.11765
- 55.096
600
0.04911
134.226
8.98419
149.922
0.07567
- 2.89
0.11998
- 59.312
650
0.0497
130.851
8.91939
147.525
0.07584
- 3.227
0.12163
- 63.354
700
0.05086
127.93
8.85099
145.201
0.07618
- 3.577
0.12411
- 67.411
750
0.05247
124.848
8.78068
142.838
0.07642
- 3.81
0.12586
- 71.332
800
0.05441
122.43
8.70765
140.522
0.07659
- 4.138
0.12711
- 75.244
850
0.05624
120.786
8.63598
138.198
0.07702
- 4.463
0.12825
- 79.297
900
0.05818
118.791
8.5575
135.918
0.0774
- 4.812
0.12922
- 83.181
950
0.06054
117.037
8.47718
133.677
0.07767
- 5.244
0.13
- 87.373
1000
0.06284
115.852
8.40286
131.466
0.07806
- 5.558
0.13077
- 91.474
1050
0.06676
114.603
8.31905
129.243
0.07848
- 5.948
0.13124
- 95.143
1100
0.06962
113.845
8.23305
127.045
0.07874
- 6.3
0.13158
- 99.674
1150
0.07142
114.019
8.14799
124.84
0.07912
- 6.731
0.13134
- 104.011
1200
0.07473
113.644
8.05859
122.666
0.07962
- 7.194
0.13136
- 108.404
1250
0.07822
113.329
7.97269
120.536
0.07992
- 7.652
0.13147
- 112.847
1300
0.08137
113.158
7.89042
118.443
0.08035
- 8.105
0.1318
- 117.291
1350
0.08501
112.83
7.80455
116.374
0.08077
- 8.476
0.13257
- 121.809
1400
0.085621
112.341
7.71693
114.349
0.08135
- 8.943
0.13274
- 126.4
1450
0.08691
112.503
7.62844
112.301
0.08168
- 9.492
0.130129
- 130.945
1500
0.087447
112.516
7.55444
110.29
0.08226
- 9.966
0.127178
- 132.429
1550
0.088958
110.702
7.46781
108.325
0.08275
- 10.605
0.125783
- 135.873
1600
0.088598
108.771
7.39276
106.371
0.08326
- 11.086
0.12282
- 139.82
1650
0.089575
107.354
7.30109
104.406
0.08366
- 11.654
0.1228
- 142.9
1700
0.09071
105.666
7.2314
102.488
0.0841
- 12.158
0.12308
- 146.866
1750
0.0938
104.101
7.15066
100.592
0.08459
- 12.724
0.12424
- 150.805
1800
0.097
102.621
7.07137
98.688
0.0851
- 13.319
0.12564
- 154.586
1850
0.10094
101.285
6.98725
96.791
0.08555
- 13.926
0.12718
- 158.448
1900
0.10562
99.475
6.90714
94.976
0.08607
- 14.507
0.12895
- 162.5
1950
0.10927
97.823
6.83262
93.117
0.0865
- 15.154
0.13127
- 166.07
2000
0.11424
96.4
6.75439
91.288
0.08691
- 15.771
0.13415
- 169.355
2050
0.11811
94.531
6.67977
89.43
0.08733
- 16.325
0.13706
- 172.886
2100
0.12221
93.106
6.60249
87.648
0.08781
- 17.024
0.14095
- 175.782
2150
0.12585
91.879
6.53055
85.88
0.0884
- 17.685
0.14488
- 179.155
2200
0.13197
90.391
6.44752
84.16
0.08868
- 18.268
0.14844
178.18
2250
0.13625
88.624
6.37451
82.389
0.08924
- 18.993
0.15223
175.153
(continued)
MMG3007NT1
8
RF Device Data
Freescale Semiconductor
50 OHM TYPICAL CHARACTERISTICS
Table 10. Common Emitter S - Parameters (VCC = 5 Vdc, ICC = 47 mA, TC = 25°C, 50 Ohm System) (continued)
S11
S21
S12
S22
f
MHz
|S11|
∠φ
|S21|
∠φ
|S12|
∠φ
|S22|
∠φ
2300
0.14158
86.951
6.30389
80.681
0.08971
- 19.632
0.15572
172.537
2350
0.14606
85.398
6.23166
78.989
0.09007
- 20.321
0.15962
170.114
2400
0.15065
83.971
6.16179
77.288
0.09053
- 20.98
0.16279
167.517
2450
0.15511
82.457
6.09153
75.581
0.09088
- 21.711
0.16641
165.072
2500
0.15948
80.991
6.02115
73.906
0.09142
- 22.394
0.16996
162.826
2550
0.16385
79.722
5.95767
72.273
0.09177
- 23.024
0.17342
160.459
2600
0.16854
78.35
5.89249
70.612
0.09216
- 23.702
0.17676
157.989
2650
0.17283
76.864
5.82721
68.994
0.09255
- 24.506
0.17953
155.564
2700
0.17698
75.562
5.76221
67.358
0.09293
- 25.194
0.18268
153.165
2750
0.18126
74.328
5.70193
65.748
0.09333
- 25.926
0.18543
150.629
2800
0.1858
72.976
5.64062
64.155
0.09391
- 26.671
0.18837
148.259
2850
0.18957
71.773
5.58104
62.533
0.09428
- 27.402
0.19087
145.593
2900
0.19403
70.699
5.52616
60.973
0.09472
- 28.203
0.19395
143.044
2950
0.19798
69.575
5.46422
59.362
0.09518
- 28.947
0.19629
140.485
3000
0.20132
68.53
5.41159
57.778
0.09558
- 29.733
0.19941
137.461
3050
0.20676
67.445
5.36032
56.228
0.09592
- 30.462
0.20221
135.101
3100
0.21059
66.347
5.30349
54.654
0.09653
- 31.263
0.20477
132.383
3150
0.21388
65.517
5.25234
53.104
0.09687
- 32.035
0.20796
129.58
3200
0.21774
64.628
5.20188
51.53
0.09729
- 32.944
0.21083
126.913
3250
0.22229
63.76
5.15023
49.962
0.09771
- 33.702
0.21442
124.314
3300
0.22492
62.653
5.10104
48.396
0.09812
- 34.531
0.21656
121.289
3350
0.2287
61.882
5.05108
46.866
0.09855
- 35.414
0.22001
118.535
3400
0.23228
60.924
5.00022
45.297
0.099
- 36.284
0.2241
115.888
3450
0.2365
60.161
4.95117
43.756
0.09926
- 37.17
0.22826
113.148
3500
0.24039
59.326
4.90461
42.216
0.09948
- 38.046
0.23275
110.547
3550
0.24401
58.457
4.85739
40.692
0.09979
- 38.943
0.23669
107.983
3600
0.24834
57.659
4.80824
39.155
0.10008
- 39.768
0.24177
105.495
MMG3007NT1
RF Device Data
Freescale Semiconductor
9
1.7
7.62
0.305 diameter
2.49
3.48
5.33
2.54
1.27
1.27
0.58
0.86
0.64
3.86
Recommended Solder Stencil
NOTES:
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
USED IN PCB LAYOUT DESIGN.
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL
AND RF PERFORMANCE.
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM
PITCH.
Figure 20. Recommended Mounting Configuration
MMG3007NT1
10
RF Device Data
Freescale Semiconductor
PACKAGE DIMENSIONS
MMG3007NT1
RF Device Data
Freescale Semiconductor
11
MMG3007NT1
12
RF Device Data
Freescale Semiconductor
MMG3007NT1
RF Device Data
Freescale Semiconductor
13
PRODUCT DOCUMENTATION
Refer to the following documents to aid your design process.
Application Notes
• AN1955: Thermal Measurement Methodology of RF Power Amplifiers
• AN3100: General Purpose Amplifier Biasing
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
3
Mar. 2007
•
Corrected and updated Part Numbers in Tables 8 and 9, Component Designations and Values, to RoHS
compliant part numbers, p. 6, 7
4
July 2007
•
Replaced Case Outline 1514 - 01 with 1514 - 02, Issue D, p. 1, 11 - 13. Case updated to add missing
dimension for Pin 1 and Pin 3.
5
Mar. 2008
• Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,
p. 1
•
Corrected Fig. 13, Single - Carrier W - CDMA Adjacent Channel Power Ratio versus Output Power y - axis
(ACPR) unit of measure to dBc, p. 5
• Corrected S - Parameter table frequency column label to read “MHz” versus “GHz” and corrected
frequency values from GHz to MHz, p. 8, 9
MMG3007NT1
14
RF Device Data
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MMG3007NT1
Document
Number:
RF
Device
Data MMG3007NT1
Rev. 5, 3/2008
Freescale
Semiconductor
15