SLWS138B
GC1012B
3.3V DIGITAL TUNER CHIP
DATASHEET
October 2002
This datasheet contains information which may be changed at any time without notice.
GC1012B 3.3V DIGITAL TUNER CHIP
SLWS138B
REVISION HISTORY
This datasheet is revised from the GC1012A datasheet to reflect the changes in the GC1012B replacement.
Revision
Date
Description
1.0
3 May 2002
First GC1012A datasheet. Major changes in specifications to reflect 3.3volt operation.
1.1
9 October
2002
Corrected checksum table, page 7
0.1
GC1012B TO GC1012A COMPARISON
The GC1012B is designed to be a functional and footprint compatible replacement for the GC1012A chip. The
timing specifications for the GC1012B meet and exceed the timing specifications for the GC1012A. Electrically the
GC1012B is a 3.3 volt only part, making it incompatible with the GC1012A’s 5 volt mode. The GC1012B is fully
compatible with the GC1012A’s 3.3 volt mode, but at a lower power consumption. See Section 4 for timing and electrical
specifications. NOTE: The GC1012B inputs are NOT 5 volt tolerant; chip damage may occur if the input voltages exceed
Vcc + 0.5V (3.8 volts). Designs using the GC1012A at 5 volts will need to add a 3.3 volt supply and voltage level
translators to use the GC1012B.
The function of the GC1012B has been slightly enhanced, but any enhancements are “backward” compatible
with the GC1012A so that a GC1012A user will not need to change any software or processing algorithms to use the
GC1012B chip. The checksums for the diagnostics have changed and are shown on page 7. Highlights of the
enhancements follow.
0.1.1
Clock Loss Detect and Power Down Modes
The GC1012A chip used a slow internal clock to power down the chip or to put it into a low power mode if the
clock is stopped. The slow clock has been removed in the GC1012B and replaced with a mode that will put the chip in
a fully static mode if the clock has stopped. The fully static mode powers down the chip and reduces the power
consumption down to a few microwatts until the clock resumes. The user can also force the power down state if desired.
Two control bits (address 7 bit 5 and address 9 bit 7) are used to control the clock loss detect and power down modes.
One control bit turns off the clock loss detect circuit, the other forces the power down mode. Both bits are cleared at
power up to keep GC1012A compatibility.
See Section 1.9 for details.
0.1.2
Control Interface
The control interface has been enhanced to use either the R/W and CS strobes of the original GC1012A, or to
use the RE, WE and CE strobes used by most memory interfaces. If the RE pin is grounded, then the interface behaves
in the R/W and CS mode, where the WE pin becomes the R/W pin and the CE pin becomes the CS pin. The RE pin on
the GC1012B chip is a ground pin (pin 103) on the GC1012A chip, so that a GC1012B chip soldered into a GC1012A
socket will automatically operate in the GC1012A R/W and CS mode.
See Section 1.3 for details.
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GC1012B 3.3V DIGITAL TUNER CHIP
SLWS138B
TABLE OF CONTENTS
1.0
FUNCTIONAL DESCRIPTION .................................................................................................... 1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
KEY FEATURES ....................................................................................................................................1
BLOCK DIAGRAM .................................................................................................................................2
CONTROL INTERFACE ........................................................................................................................2
DIGITAL OSCILLATOR..........................................................................................................................3
MIXER ....................................................................................................................................................4
PROGRAMMABLE LOW PASS FILTER................................................................................................4
GAIN.......................................................................................................................................................5
OUTPUT FORMATTING ........................................................................................................................6
POWER DOWN AND KEEPALIVE MODES ..........................................................................................6
THE ONE SHOT PULSE GENERATOR ................................................................................................6
DIAGNOSTICS.......................................................................................................................................7
2.0
PIN DESCRIPTIONS ................................................................................................................... 8
3.0
CONTROL REGISTERS............................................................................................................10
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
FREQUENCY WORD REGISTERS.....................................................................................................11
SYNC MODE REGISTER ....................................................................................................................12
FILTER MODE REGISTER ..................................................................................................................13
GAIN CONTROL REGISTERS ............................................................................................................14
OUTPUT MODE REGISTER................................................................................................................15
OUTPUT STATUS REGISTER ............................................................................................................16
ONE SHOT ADDRESS ........................................................................................................................17
CHECKSUM REGISTER .....................................................................................................................17
I AND Q OUTPUT REGISTERS...........................................................................................................17
SPECIFICATIONS .....................................................................................................................18
4.1
4.2
4.3
4.4
4.5
5.0
ABSOLUTE MAXIMUM RATINGS .......................................................................................................18
RECOMMENDED OPERATING CONDITIONS...................................................................................18
THERMAL CHARACTERISTICS .........................................................................................................18
DC CHARACTERISTICS .....................................................................................................................19
AC CHARACTERISTICS .....................................................................................................................20
APPLICATION NOTES..............................................................................................................21
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
POWER AND GROUND CONNECTIONS...........................................................................................21
STATIC SENSITIVE DEVICE ..............................................................................................................21
100 MHZ OPERATION ........................................................................................................................21
REDUCED VOLTAGE OPERATION....................................................................................................21
SYNCHRONIZING MULTIPLE GC1012B CHIPS ................................................................................22
PROCESSING COMPLEX DATA ........................................................................................................22
EXAMPLE RECEIVER ARCHITECTURE ............................................................................................23
LATENCY THROUGH THE GC1012B.................................................................................................24
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GC1012B 3.3V DIGITAL TUNER CHIP
SLWS138B
LIST OF FIGURES
Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
Figure 6:
Figure 7:
GC1012B Block Diagram ................................................................................................................ 2
Filter Response ............................................................................................................................... 5
Sync Controls................................................................................................................................ 12
Output Spectral Formats ............................................................................................................... 13
Timing For Output Modes ............................................................................................................. 15
Processing Complex Input Data.................................................................................................... 22
Example Digital Receiver Architecture.......................................................................................... 23
LIST OF TABLES
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Absolute Maximum Ratings .......................................................................................................... 18
Recommended Operating Conditions ........................................................................................... 18
Thermal Data ................................................................................................................................ 18
DC Operating Conditions .............................................................................................................. 19
AC Characteristics ........................................................................................................................ 20
Latency.......................................................................................................................................... 24
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GC1012B 3.3V DIGITAL TUNER
SLWS138B
GC1012B DATASHEET
1.0
FUNCTIONAL DESCRIPTION
Fabricated in high speed CMOS technology, the GC1012B chip is an all digital tuner which can
downconvert and band limit signals from wide band digitized sources. At full rate operation (100 MHz input
rate), the input bandwidth can be up to 50 MHz wide. Any signal within the input bandwidth can be
down-converted to zero frequency, low pass filtered, and output at a reduced sample rate. The chip’s output
can be formatted as either a complex data stream, or as a real data stream. The complex samples are
output at rates equal to FO=FCK/D, where FO is the output rate, D is 1, 2, 4, 8, 16, 32 or 64 and FCK is the
input sample (clock) rate. The real output rates are FO=2FCK/D for D equal to 2, 4, 8, 16, 32, or 64.
The signal is low pass filtered to remove out of band energy before the sample rate is decreased.
The filter’s out of band rejection is over 75 dB and its passband ripple is less than 0.2 dB peak to peak. The
passband of the output filter covers 80% of the output bandwidth.
The 28 bit accumulator in the chip’s digital oscillator circuit provides a tuning accuracy equal to the
input clock rate divided by 228. The tuning resolution at a clock rate of 50 MHz is less than 0.2 Hz giving a
tuning accuracy of +/- 0.1 Hz. The phase noise in the oscillator is low enough to provide a spur free dynamic
range of over 75 dB.
The chip’s output circuit allows the user to select a real or complex data output format, to select
spectral inversion, or to offset the output spectrum by half of the output sample rate. The output’s signal gain
can be adjusted in 0.03 dB steps. The word size of the output samples are either 10, 12, 14, or 16 bits.
On chip diagnostic circuits are provided to simplify system debug and maintenance.
The chip receives configuration and control information over a microprocessor compatible bus
consisting of an 8 bit data I/O port, a 4 bit address port, read and write strobes, and a control select strobe.
I and Q output registers can be read from the control port to allow an external processor to monitor
or process the chip’s output samples. These registers are valuable for monitoring the chip’s output power
in order to set and adjust gain levels.
1.1
KEY FEATURES
•
100 million samples per second input rate
•
Gain adjust in 0.03 dB steps
•
0.1 Hz tuning resolution
•
•
>75 dB dynamic range
Microprocessor interface
output, and diagnostics
•
Programmable output bandwidth
•
Power down mode
•
12 bit inputs, 10, 12, 14, or 16 bit outputs
•
Auto power down with clock loss detection
•
Real or complex output formats
•
Built in diagnostics
•
Built in strobe/sync generator
•
850 mW at 60 MHz, 3.3 volts
•
Symmetric rounding used throughout
•
120 pin quad flat pack package
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control,
GC1012B 3.3V DIGITAL TUNER
1.2
SLWS138B
BLOCK DIAGRAM
A block diagram illustrating the major functions of the chip is shown in Figure 1
I
MUX
X
(12 BITS)
OUTPUTS
(10,12,14, OR 16 BITS)
PROGRAMMABLE
LOW PASS
FILTER
GAIN
ADJUST
OUTPUT
FORMAT
Q
STROBES
(WS,IFLAG)
COS
DIAGNOSTIC
RAMP
SIN
DIGITAL
OSCILLATOR
DIAG
SELECT
CHECKSUM
FREQ
YNCS IN
S,AS,GS)
BANDWIDTH
GAIN
REAL,
FLIP
AND
OFFSET
OPTIONS
I/Q
SAMPLES
CHECKSUM
SYNCS OUT
CONTROL INTERFACE
(SO,OS,INT,OFLOW)
CK
VCC
GND
C0-C7
A0-A3
CE
(CS)
WE
(R/W)
RE
(GND)
(<- GC1012A Signal Names)
Figure 1. GC1012B Block Diagram
Each of these functions are described below.
1.3
CONTROL INTERFACE
The control interface performs four major functions: It allows an external processor to configure the
chip, it allows an external processor to capture and read output samples from the chip, it allows an external
processor to perform diagnostics, and it generates internal synchronization strobes.
The chip is configured by writing control information into 8 bit control registers within the chip. The
contents of these control registers and how to use them are described in Section 3. The registers are written
to or read from using the C[0:7], A[0:3], WE, RE, and CE pins. Each control register has been assigned a
unique address within the chip. An external processor (a microprocessor, computer, or DSP chip) can write
into a register by setting A[0:3] to the desired register address, setting the CE pin low, setting C[0:7] to the
desired value and then pulsing WE low. RE must remain high
To read from a control register the processor must set A[0:3] to the desired address, set CE low,
and then set RE low. The chip will then drive C[0:7] with the contents of the selected register. After the
processor has read the value from C[0:7] it should set RE and CE high. The C[0:7] pins are turned off (high
impedance) whenever CE is high or WE is low.
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GC1012B 3.3V DIGITAL TUNER
SLWS138B
The chip will only drive these pins when CE is low and RE is high. If RE is held low, then the
interface will behave in the GC1012A mode, where CE is CS, and WE is R/W.
Control register addresses 12, 13, 14, and 15 are reserved to allow an external processor to read
output samples from the chip. Addresses 12 and 13 are the I-registers which store the16 bit in-phase part
of the output sample. Addresses 14 and 15 are the Q-registers which store the quadrature part. In the real
mode the I registers store the even-time output samples and the Q registers store the odd-time output
samples. Output ready and missed flags are provided in control register 9 in order to synchronize the storing
and reading of the output samples. An interrupt output pin is also provided on the chip which can be used
to interrupt the external processor when a new sample is ready. See the description of control register 9 in
Section 3.6 for more details. The setup, hold and pulse width requirements for control read or write
operations are given in Section 4.4.
Checksums are read from the chip during diagnostics using address 11. More details on the
diagnostic modes is given in Section 1.11.
Address 10 is used to generate a one-shot pulse on the OS output pin. This pulse can be used to
synchronize the output timing and/or frequency oscillators of multiple GC1012B chips.
The control interface also generates the chip’s internal sync strobes. The user may select to
synchronize the chip using an external sync strobe (SS), or use the chip’s internal sync counter. The internal
sync counter can be synchronized to SS, or left to free run (See SS_OFF in Section 3.2). The period of the
internal sync counter can be either 256 clocks or 220 clocks. The 256 clock period is intended to be used
for chip test purposes only. The internal sync counter is used during diagnostics to clear the data paths and
strobe the checksum generator. The internal sync counter can also be used to periodically re-synchronize
all of the counters in the chip during normal operating modes.
1.4
DIGITAL OSCILLATOR
The digital oscillator generates sine and cosine sequences which are used to mix the desired signal
down to zero frequency. The digital oscillator contains a 28 bit frequency register, a 28 bit frequency
accumulator, and a sine-cosine generator. The tuning frequency of the oscillator is set by loading a 28 bit
frequency word from the control registers into the frequency register. If the frequency register is set to the
Sample Rate
2
-FREQ .
word FREQ, then the tuning frequency will be: Frequency = --------------------------------28
The tuning frequency
should be set to the middle of the desired output bandwidth.
The frequency word FREQ is stored into the control registers at control addresses 0,1,2 and 3. The
28 bit word is then transferred into the frequency register using one of the following methods:
(1)
The frequency register is always loading (the frequency changes immediately as the
frequency word is loaded into the control registers).
(2)
The frequency register is loaded when the user sets a control register bit.
(3)
The frequency register is synchronously loaded when the accumulator sync strobe (AS) goes
low.
(4)
The frequency register is synchronously loaded when the system sync strobe (SS) goes low.
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GC1012B 3.3V DIGITAL TUNER
SLWS138B
See Section 3.2 for more details on the frequency load modes.
The 28 bit frequency word is accumulated in the 28 bit frequency accumulator. The frequency
accumulator will normally free run, but can be synchronously cleared by either the system sync (SS) or the
accumulator sync (AS). The accumulator clear modes are controlled by bits in control register 4. See
Section 3.2 for details.
The upper 13 frequency accumulator bits are used to generate the oscillator’s sine and cosine
outputs. These sines and cosines are generated to 12 bit accuracy. The oscillator’s peak spur levels are
below -75 dB.
1.5
MIXER
The mixer multiplies the 12 bit input samples by the 12 bit sine and cosine values coming from the
digital oscillator. An input signal at the oscillator’s tuning frequency will be centered at zero frequency after
passing through the mixer. The mixer outputs are rounded to 13 bits using the “round-to-even” rounding
algorithm. The “round-to-even” algorithm prevents a DC rounding bias by detecting fractions which are
exactly equal to 0.5 and rounding them up half of the time and rounding them down half of the time. The
choice to round up or down is made so as to always give an even result.
1.6
PROGRAMMABLE LOW PASS FILTER
The mixer’s output is filtered using a programmable bandwidth low pass filter. The filter allows the
output sample rate to be reduced by a factor of D = 2, 4, 8, 16, 32, or 64. The value of D is set using control
register 5. The filter can be bypassed by setting D equal to 1. This allows the chip to be used as a mixer
without any output filtering.
The low pass filter is a finite impulse response (FIR) filter with linear phase, 0.13 dB peak to peak
ripple and over 75 dB of out of band rejection. The 2 dB output bandwidth is +/- 0.4FS (80% usable
bandwidth) where FS is the complex output rate. The 0.1 dB bandwidth is +/- 0.36 FS (72% usable
bandwidth). The number of taps is equal to 20D.
The coefficients for the 40 tap decimate by 2 filter are:
-12
39
6462
276
-42
-396
3115
82
-52
-293
-409
-145
7
434
-1400
-110
85
714
-273
46
46
-273
714
85
-110
-1400
434
7
-145
-409
-293
-52
82
3115
-396
-42
276
6462
39
-12
The coefficients for the other filters are available from GRAYCHIP.
Figure 2 shows the spectral response of the decimate by 2 low pass filter. The decimate by 4, 8,
16, 32 and 64 filters are similar. Figure 2(a) shows the overall frequency response prior to decimation.Note
that the filter rolls off quickly to 60 dB and is down below 75 dB in the region which aliases back into the
passband. Figure 2(b) shows the 0.13 dB ripple in the passband.
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GC1012B 3.3V DIGITAL TUNER
SLWS138B
(a) Overall
(b) Passband
Figure 2. Filter Response
1.7
GAIN
The programmable bandwidth filter is followed by a gain circuit which adjusts the output level in 0.03
dB steps. The gain is controlled by the power of two gain value S and the fractional gain value F. The input
to output gain of the chip is equal to G = 2(S-B)(1+F/256), where S ranges from 0 to 15, F ranges from 0 to
255, and B is the base gain setting for each value of D. The base gain setting B gives a unity input to output
gain for the chip, i.e., a 12 bit constant going into the chip will come out in the 12 MSBs of the 16 bit output
word. The values of B are:
D
1
2
4
8
16
32
64
B
6
5
4
3
2
1
0
The S and F gain settings are double buffered so that they can be applied synchronously. A new
gain setting takes effect either when S is loaded, or, if the GS_MODE control bit is used, when the GS strobe
is received.
The gain settings and GS_MODE bit are stored in control registers 6 and 7.
Overflow detection circuitry detects overflow conditions in the gain output words and saturates the
samples to plus or minus full scale. Overflows are reported in the STATUS register and on the OFLOW
output pin. The overflow status can be used to detect if the gain settings are too high.
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GC1012B 3.3V DIGITAL TUNER
1.8
SLWS138B
OUTPUT FORMATTING
The output format circuit allows the user to flip the output spectrum, to offset the spectrum by
one-fourth the Nyquist rate, to convert the complex output stream to a real one at twice the rate, to round
the samples to 10, 12, 14 or16 bits, and to multiplexes the I and Q samples together. These options are set
using control register 8.
A word strobe (WS) is generated as an output clock signal. The WS strobe is either one clock cycle
wide or is a 50% duty cycle clock. The polarity of WS is programmable.
The I and Q samples can be multiplexed together onto the I output pins by using the IQMUX mode.
The IFLAG output pin is used in this mode to identify when the I words are being output. The WS strobe
rate is doubled in this mode. The Q output pins are cleared in this mode.
Only the I output pins are used in the real mode. The Q pins are cleared. The output spectrum is
centered from 0 to FO/2 in the real mode. The spectrum is centered from -FO/2 to +FO/2 in the complex
mode. The OFFSET control allows the spectrum to be centered from 0 to FO.
The output format circuitry is synchronized by the SS input sync. This allows one to synchronize the
output timing of multiple GC1012B chips.
1.9
POWER DOWN AND KEEPALIVE MODES
Unused chips in a system can be powered down by setting the POWER_DOWN control bit in
register 9 (See Section 3.6). This reduces the internal clock rate down to 1 KHz to minimize the power
consumed by the chip while still refreshing the internal dynamic nodes at a suitable rate.
The chip includes a “keepalive” circuit which detects when the clock has stopped for more than 2
milliseconds. The chip will automatically go into the power down mode if clock loss is detected. The
keepalive detection circuit can be disabled by setting bit 5 in register 7 (See Section 3.4). NOTE: The chip
will draw up to an Amp of current if the clock is stopped and the keepalive circuit is disabled.
1.10
THE ONE SHOT PULSE GENERATOR
The chip can generate a one-shot pulse which is output on the OS pin by writing to address 10. The
pulse can be connected to the SS, AS, or GS sync input pins of GC1012B chips (including itself) to
synchronize the output timing, frequency oscillators, or gain settings of multiple chips.
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GC1012B 3.3V DIGITAL TUNER
1.11
SLWS138B
DIAGNOSTICS
An input ramp generator, a sync period generator, and a checksum generator are provided on the
chip in order to run diagnostic tests. Diagnostics are performed by turning on the ramp generator, enabling
the diagnostic syncs, letting the chip operate for at least 4 sync periods, reading the checksum and
comparing it to its predicted value. A new checksum is generated every sync period. The input ramp
sequence is the same for every sync period and the chip is re-initialized at the beginning of each sync period
so that each checksum should be the same once the chip’s data path has been flushed. The chip requires
at least 3 sync periods to flush, so the fourth and following checksums should be valid. The test is then
repeated for several different tuning frequencies, decimation settings, and output modes.
The sync period is 220 clocks, or approximately 1 million clock cycles, so four sync periods will be
about 4 million clocks. This represents a delay of less than 67 milliseconds for a clock rate of 60 MHz.
The following table lists the expected checksums for four test configurations. All values are in HEX.
CONTROL REGISTER
TEST 1
TEST 2
TEST 3
TEST 4
FREQ (REG 0,1,2,3)
0000101
0F0F0F0
55AA55A
AA55AA5
SYNC MODE (REG 4)
A9
A9
A9
A9
FILTER MODE (REG 5)
82
93
E4
D7
GAIN FRACTION (REG 6)
AA
55
00
FF
5
4
3
0
16
46
21
80
C5
05
12
C9
GAIN EXPONENT (REG 7)
OUTPUT (REG 8)
EXPECTED CHECKSUMS
(REG 11)
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GC1012B 3.3V DIGITAL TUNER
PIN DESCRIPTIONS
88
87
86
85
84
83
82
81
80
79
78
77
99
100
96
101
7
8
9
10
11
12
13
14
3
4
5
6
118
103
102
76
15
X11 (MSB)
X10
X9
X8
X7
X6
X5
X4
X3
X2
X1
X0
SS
AS
GS
(MSB) Q15
Q14
Q13
Q12
Q11
Q10
Q9
Q8
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
C7 (MSB)
C6
C5
C4
C3
C2
C1
C0
A3 (MSB)
A2
A1
A0
A1
A
L
D
B
90
P (0.8mm)
61
91
60
20
21
22
23
24
25
26
27
28
35
36
37
38
39
40
41
GRAYCHIP
GC1012B-PQ
DIGITAL TUNER
MMMMMLLL YYWW
120
31
1
30
120 PIN QUAD FLAT PACK PACKAGE
GC1012B-PQ = Enhanced Thermal Plastic Package
WE (R/W)
RE (GND)
OEI
OEQ
71
70
69
68
67
66
65
64
63
56
55
54
53
52
51
50
GC1012B
CK
CE (CS)
(MSB) I15
I14
I13
I12
I11
I10
I9
I8
I7
I6
I5
I4
I3
I2
I1
I0
D1 (28 mm)
(1.1")
2.0
SLWS138B
WS
IFLAG
SO
OS
INT
OFLOW
115
116
93
117
95
Package Markings:
MMMMM = Mask Code
LLL = Lot Number
YYWW = Date Code
94
DIMENSION
D (width pin to pin)
D1 (width body)
P (pin pitch)
B (pin width)
L (leg length)
A (height)
A1 (pin thickness)
PLASTIC
31.2 mm (1.228")
28.0 mm (1.102")
0.8 mm (0.031")
0.35 mm (0.014")
0.88 mm (0.035")
4.07 mm (0.160")
0.17 mm (0.007")
CERAMIC
32.0 mm (1.260")
28.0 mm (1.102")
0.8 mm (0.031")
0.35 mm (0.014")
0.70 mm (0.028")
3.25 mm (0.128")
0.2 mm (0.008")
VCC PINS: 2,16,17,29,32,33,43,44,47,48,58,59,62,74,75,89,91,97,
104,105,106,109,110,114,119
GND PINS: 1,18,19,30,31,34,42,45,46,49,57,60,61,72,73,90,92,98,
107,108,111,112,113,120
NOTE: 0.01 to 0.1 µf DECOUPLING CAPACITORS SHOULD BE PLACED
AS CLOSE AS POSSIBLE TO THE MIDDLE OF EACH SIDE OF THE CHIP
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GC1012B 3.3V DIGITAL TUNER
SIGNAL
SLWS138B
DESCRIPTION
X[0:11]
INPUT DATA. Active high
The 12 bit two’s complement input samples. New samples are clocked into the chip on the rising edge of the clock. The input
data rate is assumed to be equal to the clock rate.
CK
CLOCK INPUT. Active high
The clock input to the chip. The X, SS, GS and AS signals are clocked into the chip on the rising edge of this clock. The I,
Q, WS, IFLAG, OS, OFLOW and SO signals are clocked out on the rising edge of this clock.
SS
SYSTEM SYNC. Active low
The sync input to the chip. All timers, accumulators, and control counters are, or can be, synchronized to SS. Bits in control
register 4 (see Section 3.2) determine the operation of SS. This sync is clocked into the chip on the rising edge of the clock.
AS
ACCUMULATOR SYNC. Active low
The accumulator sync is provided to synchronously change tuning frequencies. This sync can be used to load a new tuning
frequency into the frequency register and/or to clear the frequency accumulator. This signal is clocked into the chip on the
rising edge of the clock.
GS
GAIN SYNC. Active low
The gain sync is provided to synchronously change gain settings. This signal is clocked into the chip on the rising edge of
the clock.
I[0:15]
IN-PHASE OUTPUT DATA. Active high
The I part of each complex output sample is output as a 16 bit word on this pin. The bits are clocked out on the rising edge
of the clock.
OEI
IN-PHASE OUTPUT ENABLE. Active low
The I[0:15] output pins are put into a high impedance state when this pin is high.
Q[0:15]
QUADRATURE OUTPUT DATA. Active high
The Q part of each complex output sample is output as a 16 bit word on this pin. The bits are clocked out on the rising edge
of the clock.
OEQ
QUADRATURE OUTPUT ENABLE. Active low
The Q[0:15] output pins are put into a high impedance state when this pin is high.
WS
WORD STROBE. Programmable active high or low level
This strobe is output synchronous with the I and Q data words. The strobe occurs once per bit and is either one clock wide
or has a 50% duty cycle. The high/low polarity of the strobe is programmable. See Section 3.5 for details.
IFLAG
IN-PHASE STROBE. Active high
This strobe identifies the in-phase half of a complex pair when the outputs are in the IQ_MUX mode. See Section 3.5 for
details. This signal is high when the I-half is output and is low when the Q-half is output.
SO
SYNC OUT. Active low
This signal is either a delayed version of the input system sync SS, or, if SS_MUX in control register 4 is set, is the internally
generated sync which has a period of 220 clocks.
INT
INTERRUPT OUT. Active low
This signal is the READY flag from control register 9. This interrupt goes active when a new output sample is ready in control
registers 12, 13, 14, and 15.
OS
ONE SHOT STROBE. Active low
This output is a one-shot sync strobe generated by writing to control address 10. The strobe is one clock cycle wide.
OFLOW
OVERFLOW FLAG. Active low
This signal goes low when an overflow is detected in the gain circuit. The signal will either pulse low for one clock cycle or
will stay low depending upon the state of the OFLOW_MODE bit in control register 9.
C[0:7]
CONTROL DATA I/O BUS. Active high
This is the 8 bit control data I/O bus. Control register data is loaded into the chip or read from the chip through these pins.
The chip will only drive these pins when CS is low and R/W is high.
A[0:3]
CONTROL ADDRESS BUS. Active high
These pins are used to address the 16 control registers within the chip. Each of the 16 control registers within the chip are
assigned a unique address. A control register can be written to or read from by setting A[0:3] to the register’s address.
RE
READ STROBE. Active low
The RE strobe is used to read the control registers. Control register data is output when both RE and CE are low.
WE
WRITE STROBE. Active low
The WE strobe is used to write the control registers. Control register data is written when both WE and CE are low.
CE
CHIP ENABLE. Active low
This control enables the read or write operation. The contents of the register selected by A[0:3] will be output on C[0:7]
when RE is low and CE is low. If WE is low when CE goes low, then the selected register will be loaded with the contents
of C[0:7].
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This document contains information which may be changed at any time without notice
GC1012B 3.3V DIGITAL TUNER
3.0
SLWS138B
CONTROL REGISTERS
The chip is configured and controlled through the use of 16 eight bit control registers. These
registers are accessed for reading or writing using the control bus pins (CS, WE, RE, A[0:3], and C[0:7])
described in the previous section. The register names and their addresses are:
ADDRESS
NAME
ADDRESS
NAME
0
FREQ byte 0
8
Output Mode
1
FREQ byte 1
9
Status
2
FREQ byte 2
10
One Shot
3
FREQ byte 3
11
Checksum
4
Sync mode
12
I-output byte 0
5
Filter mode
13
I-output byte 1
6
Gain Fraction
14
Q-output byte 0
7
Gain Exponent
15
Q-output byte 1
The following sections describe each of these registers. The type of each register bit is either R or
R/W indicating whether the bit is read only or read/write. All bits are active high.
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GC1012B 3.3V DIGITAL TUNER
3.1
SLWS138B
FREQUENCY WORD REGISTERS
Registers 0, 1, 2, and 3 contain the 28 bit frequency tuning word. Bit 0 is the LSB, bit 27 is the MSB.
ADDRESS 0:
FREQUENCY BYTE 0
BIT
TYPE
NAME
DESCRIPTION
0-7
R/W
FREQ[0:7]
Byte 0 (least significant) of frequency word
ADDRESS 1:
FREQUENCY BYTE 1
BIT
TYPE
NAME
DESCRIPTION
0-7
R/W
FREQ[8:15]
Byte 1 of frequency word
ADDRESS 2:
FREQUENCY BYTE 2
BIT
TYPE
NAME
DESCRIPTION
0-7
R/W
FREQ[16:23]
Byte 2 of frequency word
ADDRESS 3:
FREQUENCY BYTE 3
BIT
TYPE
NAME
DESCRIPTION
0-3
R/W
FREQ[24:27]
4 most significant bits of the frequency word
4-7
R/W
-
unused
If the desired tuning frequency is F, then the frequency word should be set to:
FREQ = 228F/(clock rate)
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GC1012B 3.3V DIGITAL TUNER
3.2
SLWS138B
SYNC MODE REGISTER
The sync mode register controls the action of the SS and AS sync strobes and how they affect the
chip’s internal timers, counters, and accumulators.
ADDRESS 4:
BIT
Sync Mode Register
TYPE
NAME
DESCRIPTION
0 (LSB)
R/W
SS_OFF
This bit disables the SS input.
1
R/W
AS_ON
Enables the accumulator sync AS. Normally the frequency accumulator will free
run. This bit causes the frequency accumulator to be initialized to the contents of
the frequency register when AS goes low. SS, instead of AS, will reset the
accumulator if AS_MUX is set and SS is not disabled by SS_OFF.
2
R/W
AS_MUX
Use SS for the accumulator sync. The AS input is ignored and the SS strobe is
used in its place when this bit is set and SS is not disabled by SS_OFF. (See
AS_ON and AS_FREQ).
3
R/W
LD_FREQ
Load the frequency register in the digital oscillator with the contents of the
frequency word registers. If left on, this bit will cause the frequency register to load
whenever a frequency word register is changed.
4
R/W
AS_FREQ
Enables the synchronous frequency load mode. When this bit is set and AS goes
low, the frequency register will be synchronously loaded with the contents of the
frequency control registers. SS, instead of AS, will load the frequency register if
AS_MUX is set and SS is not disabled by SS_OFF.
5
R/W
SS_DIAG
Enables diagnostic syncs. This bit routes the internal sync to the checksum
generator and to all accumulators and control counters within the chip. This forces
the chip to re-initialize at the start of every sync period. The internal sync period will
be 220 clocks if SS_MUX is set, otherwise it will be determined by the period of an
externally provided SS strobe.
6
R/W
TEST
Shortens the internal sync counter period from 220 clocks to 28 clocks. This mode
is used to test chips at the factory.
7 (MSB)
R/W
SS_MUX
Use the sync counter’s terminal count strobe for the internal sync instead of the
sync input SS. The internal sync is output on the SO pin.
The operation of these control bits are illustrated in Figure 3.
SS_OFF
SS
SS_DIAG
COUNTER
TEST
PERIOD =
CK
{
220 IF TEST = 0
28 IF TEST = 1
SYNC TO
CONTROL COUNTERS
AND
OUTPUT CIRCUITS
MUX
1
INTERNAL SYNC
0
SS_MUX
AS_MUX
SYNC TO SO
DIAGNOSTIC SYNCS
MUX
1
AS
0
MUX
1
0
SYNC FREQ
ACCUMULATOR
AS_ON
LOAD FREQ REGISTER
AS_FREQ
LD_FREQ
Figure 3. Sync Controls
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This document contains information which may be changed at any time without notice
GC1012B 3.3V DIGITAL TUNER
3.3
SLWS138B
FILTER MODE REGISTER
This register controls filtering, output formatting and the diagnostic input mode.
ADDRESS 5:
Filter Mode Register
BIT
TYPE
NAME
DESCRIPTION
0-2
R/W
DEC[0:2]
The decimation mode. The output sample rate is set using DEC according to the
following table:
FO
FO
DECCOMPLEX
REAL
(REAL = 0)
(REAL = 1)
0 or 1FCK ?
2 FCK/2 FCK
3 FCK/4 FCK/2
4 FCK/8 FCK/4
5 FCK/16 FCK/8
6 FCK/32 FCK/16
7 FCK/64 FCK/32
Where FCK is the input rate and FO is the output rate.
3
R/W
-
Unused.
4
R/W
REAL
Output real samples instead of complex samples. The output spectrum is centered from
0 to FO/2 where FO is the output rate (see DEC above for the REAL mode). NOTE: The
FLIP bit described below is active low in the real mode.
5
R/W
OFFSET
Offset the complex output spectrum. Used in the complex output mode (REAL=0) to
force the output spectrum to be centered at FO/2, where FO is the output sample rate
(see DEC above for the COMPLEX mode). This mode is useful for single-sideband AM
signals because it moves the lower band edge up to zero frequency where it belongs.
The upper half of the spectrum will appear as negative frequencies.
6
R/W
FLIP
Flip the output spectrum. This bit inverts the output spectrum. In the complex mode the
spectrum is flipped about zero. In the real mode the spectrum is flipped about FO/4,
where FO is the real mode’s output sample rate. In the complex mode FLIP=1 flips the
spectrum. In the real mode FLIP=0 flips the spectrum.
7
R/W
DIAG
Use the diagnostic ramp for the input to the chip instead of the X input. The ramp counts
from -2048 to +2047 and then starts over again.
The effect on the output spectrum of the REAL, OFFSET and FLIP bits is illustrated in the following
diagram. (FO is the output sample rate)
-FO
0
NORMAL (FLIP=0 OFFSET=0 REAL=0)
+FO
-FO
-FO
0
OFFSET (OFFSET=1)
+FO
-FO
+FO/2
-FO/2
0
REAL AND FLIPPED (FLIP=0 REAL=1)
-FO/2
0
REAL MODE (REAL=1 FLIP=1)
FLIPPED (FLIP=1)
0
+FO
0
OFFSET AND FLIPPED (FLIP=1 OFFSET=1)
Figure 4. Output Spectral Formats
Texas Instruments Incorporated
+FO
- 13 -
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+FO/2
GC1012B 3.3V DIGITAL TUNER
3.4
SLWS138B
GAIN CONTROL REGISTERS
These registers set the output gain.
ADDRESS 6:
Gain Control Register
BIT
TYPE
0-7
R/WF[0:7] The 8 bit gain fraction.
ADDRESS 7:
BIT
NAME
DESCRIPTION
Gain Exponent Register
TYPE
NAME
DESCRIPTION
0-3
R/W
S[0:3]
The 4 bit gain exponent.
4
R/W
GS_MODE
Turns on the synchronous gain mode. See below.
5
R/W
CKDET_DISABLE
Provided for testability. Turns off the clock loss detect function in the powerdown
circuit. This bit powers up low and should be kept low.
6
R
-
unused
7
R
-
unused.
The chip’s input to output gain is set using F and S according to the formula:
GAIN = 2(S-B)(1+F/256)
where B is the base gain setting which is a function of the decimation mode of the chip. The unity gain
setting (S=B and F=0) means that a 12 bit DC input will show up in the upper 12 bits of the 16 bit output.
The values of B are:
DEC
0 or 1
2
3
4
5
6
7
B
6
5
4
3
2
1
0
The GS_MODE control bit determines when new gain settings are applied to the output. New gain
settings are double buffered so that they can be synchronized with the output words. If GS_MODE is low,
then the gain settings are applied to the output samples immediately after S has been loaded. If GS_MODE
is high, then the new gain settings are not used until GS goes low.
NOTE: The gain settings must be loaded in the correct order- F first and then S. The circuit detects
new gain settings by sensing when S is loaded. this means that S must be loaded even if one only wishes
to change F.
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GC1012B 3.3V DIGITAL TUNER
3.5
SLWS138B
OUTPUT MODE REGISTER
The output mode register controls the output formatting.
ADDRESS 8:
Output mode register
BIT
TYPE
NAME
DESCRIPTION
0
R/W
IQ_MUX
The IQ_MUX control is used in the complex mode to multiplex the I and Q output
words onto the I[0:15] output pins. Normally the I and Q halves are output on
separate ports. When this bit is high, the halves are multiplexed together so that
the I half is output first, followed by the Q half. The word strobe (WS) rate is doubled
in this mode. The IFLAG output signal is used in this mode to identify the I half of
each complex pair. The Q[0:15] output pins are forced low in this mode.
1
R/W
WS_POL
Changes the polarity of WS.
2
R/W
WS_MODE
Changes the mode of WS. Normally WS pulses high during the clock cycle before
an I or Q output transition. This bit changes WS so that it is a 50% duty cycle clock
with its rising edge in the middle of each output period
3
R/W
-
Unused
4
R/W
R10
Round the output samples to the 10 bits MSBs of the output word.
5
R/W
R12
Round the output samples to the 12 bits MSBs of the output word.
6
R/W
R14
Round the output samples to the 14 bits MSBs of the output word.
7
R/W
R16
Round the output samples to the 16 bits MSBs of the output word.
One and only one of the rounding options should be selected. Unused LSBs are cleared.
The IQ_MUX and WS_MODE controls are illustrated in the timing diagrams shown in Figure 5. Note
that the polarity shown for WS can be changed using the WS_POL control.
DECIMATE BY 2 MODE: (DEC=2)
CK
I or Q
WS
(WS_MODE= 0 or 1)
DECIMATE BY 2 MODE WITH IQ_MUX, OR REAL MODES: (DEC=2, REAL=1 OR IQ_MUX=1)
CK
I
(Q is low, WS is high)
IFLAG
DECIMATE BY 4 MODE: (DEC=3)
CK
I or Q
WS
(WS_MODE= 0)
WS
(WS_MODE= 1)
DECIMATE BY 4 MODE WITH IQ_MUX OR REAL MODES: (DEC=2, REAL=1 OR IQ_MUX=1)
CK
I or Q
WS
(WS_MODE= 0 or 1)
IFLAG
Figure 5. Timing For Output Modes
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GC1012B 3.3V DIGITAL TUNER
3.6
SLWS138B
OUTPUT STATUS REGISTER
This register contains flags and status information for the output samples.
ADDRESS 9:
Output Status Register
BIT
TYPE
NAME
DESCRIPTION
0
R/W
READY
Tells the chip that the user is ready to capture an output sample. The chip clears
this bit when it has captured the sample. See Notes below.
1
R/Clear
MISSED
The chip sets this bit high if a new output sample was ready but the user had not
set READY high. This lets the user know if a sample has been missed. This bit is
cleared by writing a 0 to the bit. Attempting to write a 1 to this bit does nothing.
2
R/W
INT_ENABLE
This bit is used to turn on the interrupt output. If this bit is off the INT output pin is
forced high. When this bit is high the INT output pin is equal to READY. When
READY goes low, meaning that a new sample has been captured, the INT pin will
go low. If INT is tied to a processor’s interrupt input, then the processor will be
interrupted whenever a new sample is ready.
3
R/W
-
Unused
4
R/W
OFLOW_MODE
This bit sets the mode of the OFLOW output. When OFLOW_MODE is low the
OFLOW output is an inverted version of OVERFLOW (see bit 6 below). If
OFLOW_MODE and OFLOW_ENABLE are high, then the OFLOW output pulses
low for one clock cycle each time there is an overflow.
5
R/W
OFLOW_ENABLE
This bit enables the overflow modes. If this bit is low, then OVERFLOW (see bit 6
below) will not be set and the OFLOW output will not go low. This bit does not affect
the overflow detection and saturation logic in the gain circuit.
6
R/Clear
OVERFLOW
The chip sets this bit when an overflow occurs and OFLOW_ENABLE is turned on.
This bit can be used to indicate if the gain is set too high. This bit stays high until
the user clears it. The bit is cleared by writing a 0 to it. Attempting to write a 1 to
this bit does nothing.
7
R/W
POWER_DOWN
This bit is used to put the chip into a power down (standby) mode. In this mode the
chip is put into a static powerdown mode. All control register settings are
preserved, but the output data will be invalid.
The READY signal is used to capture output samples and to read them into an external processor.
The user captures outputs by setting the READY bit and then waiting for the bit to be cleared by the chip.
When the bit goes low the processor can read the samples out of the I and Q output registers described in
section 3.9. The processor can wait for READY to go low by either continuously reading this register, or it
can use the interrupt output INT to tell it when the sample is ready. To use the interrupt output mode the
user must tie the INT output pin from the chip to an interrupt input of the processor. The processor can then
capture samples by setting READY and then setting INT_ENABLE (INT_ENABLE should be set after
READY in order to avoid a spurious interrupt due to the interrupt being enabled before READY has settled
to its high state). The processor will be interrupted when READY goes low again. When it is interrupted the
processor can turn off INT_ENABLE, read the I/Q outputs, and then start over again.
The MISSED flag is provided to let the processor know if it has taken too long to read the I/Q
samples before rearming the READY bit. If the processor wants to use the MISSED flag it should clear the
flag the first time it sets the READY bit and then check it after setting the READY bit thereafter. The READY
bit is set and the MISSED bit cleared by writing a 01(hex) to this register. The READY bit is set and the
MISSED bit is left alone by writing a 03(hex) to this register.
NOTE: The READY bit will not be cleared if the sample is captured while the user is setting the
READY bit. This will cause the READY bit to stay high after the output is captured and will not allow the chip
to capture any more samples until the bit is cleared and set again. The user can detect this incorrect “ready”
state by always clearing the MISSED bit when setting the READY bit. The incorrect state is detected if
MISSED goes high when READY is high. The work-around to guarantee capturing an output sample is to
always clear READY before setting it.
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GC1012B 3.3V DIGITAL TUNER
3.7
SLWS138B
ONE SHOT ADDRESS
The one shot pulse is generated on the OS pin by writing to address 10. This is a write-only address
and the data written to it is irrelevant.
ADDRESS 10:
3.8
ONE SHOT
CHECKSUM REGISTER
This read-only register stores the checksums generated in the diagnostic mode.
ADDRESS 11:
CHECKSUM
BIT
TYPE
NAME
DESCRIPTION
0-7
R
CHECK[0:7]
The 8 bit checksum. The checksum is generated as a non-linear feedback
accumulation of the BS, FS, I, and Q output bits. The current checksum is stored
in this register and the checksum generator is cleared whenever the internal sync
goes low (see SS_MUX in Section 3.2 for the modes of the internal sync).
3.9
I AND Q OUTPUT REGISTERS
These registers are used to capture output samples.
ADDRESS 12:
I-Output Byte 0
BIT
TYPE
NAME
DESCRIPTION
0-7
R
I[0:7]
Least significant 8 bits of the I output.
ADDRESS 13:
I-Output Byte 1
BIT
TYPE
NAME
DESCRIPTION
0-7
R
I[8:15]
Most significant 8 bits of the I output.
ADDRESS 14:
Q-Output Byte 0
BIT
TYPE
NAME
DESCRIPTION
0-7
R
Q[0:7]
Least significant 8 bits of the Q output.
ADDRESS 15:
Q-Output Byte 0
BIT
TYPE
NAME
DESCRIPTION
0-7
R
QI[8:15]
Most significant 8 bits of the Q output.
The user reads the I and Q outputs through these read-only registers. The captured samples can
be used for gain control, analysis, display, or diagnostics.
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GC1012B 3.3V DIGITAL TUNER
SLWS138B
4.0
SPECIFICATIONS
4.1
ABSOLUTE MAXIMUM RATINGS
Table 1: Absolute Maximum Ratings
PARAMETER
SYMBOL
MIN
MAX
UNITS
DC Supply Voltage
VCC
-0.3
4.0
V
Input voltage (undershoot and overshoot)
VIN
-0.7
VCC+0.7
V
TSTG
-65
150
Storage Temperature
Lead Soldering Temperature (10 seconds)
300
Clock Rate
FCK
1
NOTES
°C
°C
KHz
1
Notes:
1. Below 1 KHz the clock loss detect circuit will power down the chip. If the clock loss detect circuit is
disabled (bit 5, address 7) and the clock is stopped, the chip may draw up to one Amp of power supply
current for approximately 10 seconds. After 10 seconds the current will go down to below 50 mAmps.
4.2
RECOMMENDED OPERATING CONDITIONS
Table 2: Recommended Operating Conditions
PARAMETER
SYMBOL
MIN
MAX
UNITS
VCC
3.0
3.6
V
Temperature Ambient, no air flow
TA
-40
+85
Junction Temperature
TJ
DC Supply Voltage
125
NOTES
°C
°C
Notes:
1. Thermal management is required to keep TJ below MAX for full rate operation. See Table 3 below.
4.3
THERMAL CHARACTERISTICS
Table 3: Thermal Data
GC1012B-PQ
THERMAL
CONDUCTIVITY
SYMBOL
Theta Junction to Ambient
Theta Junction to Case
UNITS
2 Watts
4 Watts
6 Watts
θja
18
11
10
θjc
4
4
4
°C/W
°C/W
Note: Air flow will reduce θja and is highly recommended.
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1
1
GC1012B 3.3V DIGITAL TUNER
4.4
SLWS138B
DC CHARACTERISTICS
All parameters are industrial temperature range of 0 to 85 oC ambient unless noted.:
Table 4: DC Operating Conditions
Vcc = 3.3V
PARAMETER
SYMBOL
MIN
UNITS
NOTES
V
1
MAX
Voltage input low
VIL
0.8
Voltage input high
VIH
2.0
V
2
Input current (VIN = 0V)
IIN
Typical +/- 50
uA
2
0.5
V
2
3.3
V
2
Voltage output low (IOL = 2mA)
VOL
Voltage output high (IOH = -2mA)
VOH
Data input capacitance (All inputs except CK
and C[0:15])
CIN
Typical 4
pF
1
Clock input capacitance (CK input)
CCK
Typical 10
pF
1
CCON
Typical 6
pF
1
Control data capacitance (C[0:15] I/O pins)
2.4
Notes:
1. Controlled by design and process and not directly tested. Verified on initial parts evaluation.
2. Each part is tested at 85°C for the given specification.
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GC1012B 3.3V DIGITAL TUNER
4.5
SLWS138B
AC CHARACTERISTICS
Table 5: AC Characteristics (0 TO +85oC Ambient, unless noted)
3.3V +/- 5%
PARAMETER
SYMBOL
MIN
MAX
100
UNITS
NOTES
MHz
2, 3, 4
Clock Frequency
FCK
0.01
Clock low period (Below VIL)
tCKL
4
ns
1
Clock high period (Above VIH)
tCKH
4
ns
1
Data setup before CK goes high
(X, SS, AS or GS)
tSU
4
ns
1
Data hold time after CK goes high
tHD
2
ns
1
Data output delay from rising edge of CK.
(I, Q, WS, IFLAG, OS, OFLOW, SO
tDLY
0
8
ns
1, 5
Data to tristate delay
(I or Q to hiZ from OEI or OEQ)
tDZ
2
5
Tristate to data output delay
(I or Q valid from OEI or OEQ)
tZD
3
8
Control Setup before CS goes low (A, R/W
during read, and A, R/W, C during write)
tCSU
Control hold after CS goes high (A, R/W during
read, and A, R/W, C during write)
1
ns
1, 5
5
ns
1
tCHD
5
ns
1
Control strobe (CS) pulse width
(Write operation)
tCSPW
20
ns
1,6
Control output delay CS low to C
(Read Operation)
tCDLY
20
ns
1,6
tCZ
5
ns
1
ICCQ
200
uA
1
ICC
400
mA
1, 7
Control tristate delay after CS goes high
Quiescent supply current
(VIN=0 or VCC, FCK = 1KHz)
Supply current
(FCK =100MHz)
Notes:
1. Controlled by design and process and not directly tested. Verified on initial part evaluation.
2. Each part is tested at 85 deg C for the given specification.
3. Temperature range is verified by lot sampling.
4. The chip may not operate properly at clock frequencies below MIN and MAX.
5. Current load is 2ma. Delays are measured from the rising edge of the clock to the output level
rising above VIH or Falling below VIL.
6. Capacitive output load is 80pf.
VCC F CK
7. Current changes linearly with voltage and clock speed. Icc (MAX) = ------------ -------------- 400mA
5 100M
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GC1012B 3.3V DIGITAL TUNER
SLWS138B
5.0
APPLICATION NOTES
5.1
POWER AND GROUND CONNECTIONS
The GC1012B chip is a very high performance chip which requires solid power and ground
connections to avoid noise on the VCC and GND pins. If possible the GC1012B chip should be mounted on
a circuit board with dedicated power and ground planes and with at least two decoupling capacitors (0.01
and 0.1 µf) adjacent to each GC1012B chip. If dedicated power and ground planes are not possible, then
the user should place decoupling capacitors adjacent to each VCC and GND pair.
IMPORTANT
The GC1012B chip may not operate properly if these power and ground guidelines are violated.
5.2
STATIC SENSITIVE DEVICE
The GC1012B chip is fabricated in a high performance CMOS process which is sensitive to the high
voltage transients caused by static electricity. These parts can be permanently damaged by static electricity
and should only be handled in static free environments.
5.3
100 MHZ OPERATION
Care must be taken in generating the clock when operating the GC1012B chip at its full 100 MHz
clock rate. The user must insure that the clock is above 2 volts for at least 4 nanoseconds and is below 0.8
volts for at least 4 nanoseconds. At 1000 MHz the clock period is only 10 nanoseconds so that the clock
must have a duty cycle of exactly 50%, and the rise and fall times can only be 1 nanosecond each. One
must also be careful to prevent clock undershoot below ground. An ideal clock at 100 MHz would be a
square wave with a low voltage of 0.5 volts and a high voltage of 2.5 volts.
5.4
REDUCED VOLTAGE OPERATION
The power consumed by the GC1012B chip can be greatly reduced by operating the chip at the
lowest VCC voltage which will meet the application’s timing requirements. When operating at a reduced
voltage, GRAYCHIP recommends driving the GC1012B chip inputs with 5 volt to 3 volt interface chips.
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This document contains information which may be changed at any time without notice
GC1012B 3.3V DIGITAL TUNER
5.5
SLWS138B
SYNCHRONIZING MULTIPLE GC1012B CHIPS
A system containing a bank of GC1012B chips will need to be synchronized so that the output
frames from each chip are aligned, and, if desired, so that their frequency accumulators are running
synchronously. The GC1000 Input Switch chip has built in sync counters which are designed specifically for
this purpose. If the GC1000 chip is not used, then the one-shot strobe (see Section 3.7) can be used. The
bank of chips should be interconnected so that the OS pin of one GC1012B chip is tied to the SS input of
all of the chips. The one-shot strobe mode can then be used to simultaneously synchronize all of the chips.
The OS pin of a second GC1012B chip should be tied to the AS input of all of the chips. The one-shot mode
of the second chip can be used to synchronize the frequency accumulators whenever the tuning frequency
has been changed.
5.6
PROCESSING COMPLEX DATA
Two GC1012B chips can be used to process complex input data by using one chip to process the
I-input data and the other to process the Q-input data. If the two chips are synchronized as discussed above,
then the complex output stream can be reconstructed by adding and subtracting the I and Q outputs of the
two chips. A programmable gate array chip such as from XILINX would be ideal for this post-processing.
The configuration for processing complex data is illustrated in Figure 6.
IIN
I
X
GC1012B
IOUT
Q
SS
OS
AS
QIN
I
X
GC1012B
QOUT
Q
SS
AS
PROGRAMMABLE
GATE
ARRAY
OS
Figure 6. Processing Complex Input Data
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This document contains information which may be changed at any time without notice
GC1012B 3.3V DIGITAL TUNER
5.7
SLWS138B
EXAMPLE RECEIVER ARCHITECTURE
An example digital receiver architecture using the GC1012B chip is shown in Figure 7.
USER
INTERFACE
FROM
ANTENNAE
ANALOG
FRONT
END
• GAIN
• BANDLIMIT
TO
30MHz OR LESS
• DOWNCONVERT
ANALOG
TO
DIGITAL
CONVERTER
• DIGITIZES TO 8, 10
OR 12 BITS
• 60 MHz SAMPLING
RATE
• OUTPUT IS
CENTERED AROUND
15MHz
GC1012B
CHIP
• TUNES TO
DESIRED
FREQUENCY
DIGITAL
TO
ANALOG
CONVERTER
(OPTIONAL)
SIGNAL
OUT
• CONVERTS BACK TO
ANALOG
• NARROWBAND
FILTERS SIGNAL
• REDUCES
SAMPLE RATE
Figure 7. Example Digital Receiver Architecture
The receiver contains an analog front end which downconverts up to 30MHz of radio spectrum to
an IF frequency around 15MHz1. It also adjusts the gain of the signal so that it fills the dynamic range of the
analog to digital converter (ADC). The ADC digitizes the signal using up to 12 bits of resolution at a sampling
rate up to 60 MHZ. The GC1012B chip tunes, downconverts, and narrowband filters desired frequencies
from within the 30 MHz band. The GC1012B output can either be converted back to analog or kept in its
digital state for subsequent signal processing.
1. Note that the HF spectrum (1 to 30MHz) can be digitized directly.
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This document contains information which may be changed at any time without notice
GC1012B 3.3V DIGITAL TUNER
5.8
SLWS138B
LATENCY THROUGH THE GC1012B
Two latencies are of interest, the latency from a step function in to a step function out (midpoint), and the
latency from a step function until the end of the “ringing” in the step function output (endpoint). These latencies are:
Table 6: Latency
Output Mode
Midpoint
Endpoint
Values of D
(decimation)
Real
41 + 20D
41 + 40D
1, 2, 4, 8, 16 and 32
Complex
35 + 10D
35 + 20D
2, 4, 8, 16, 32 and 64
Another latency of interest is the delay from SS input to stable WS. The WS strobe becomes stable and is
low after 9 clocks, before 9 clocks the WS is unknown and may go high at any time. The delay until the first valid
high WS is a function of decimation. For decimate by 2 the delay from SS is 10 clocks, for 4 the delay is 12 clocks,
for 8 the delay is 16 clocks and for decimation ratios of 16, 32 and 64 the delay is 24 clocks. WS is high at clock 24
for all decimations.
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This document contains information which may be changed at any time without notice
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
GC1012B-PQ
ACTIVE
QFP
PBM
Pins Package Eco Plan (2)
Qty
120
24
None
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
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to Customer on an annual basis.
Addendum-Page 1
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