Catalyst CAT25020LI-GT3 1k/2k/4k spi serial cmos eeprom Datasheet

CAT25010, CAT25020, CAT25040
1K/2K/4K SPI Serial CMOS EEPROM
FEATURES
DESCRIPTION
■ 10 MHz SPI compatible
The CAT25010/20/40 is a 1K/2K/4K Bit SPI Serial
CMOS EEPROM internally organized as 128x8/256x8/
512x8 bits. Catalyst’s advanced CMOS Technology
substantially reduces device power requirements. The
CAT25010/20/40 features a 16-byte page write buffer.
The device operates via the SPI bus serial interface and
is enabled though a Chip Select (CS). The HOLD pin
may be used to suspend any serial communication
without resetting the serial sequence. The CAT25010/
20/40 is designed with software and hardware write
protection features including Block Write protection.
■ 1.8 to 5.5 volt operation
■ SPI modes (00 & 11)
■ 16-byte page write buffer
■ Self-timed write cycle
■ Hardware and software protection
■ Block write protection
– Protect 1/4, 1/2 or all of EEPROM array
■ Low power CMOS technology
■ 1,000,000 program/erase cycles
■ 100 year data retention
■ Industrial temperature range
■ RoHS-compliant 8-lead PDIP, SOIC, TSSOP
and 8-pad TDFN packages.
For Ordering Information details, see page 17.
PIN CONFIGURATION
FUNCTIONAL SYMBOL
PDIP (L)
SOIC (V)
TSSOP (Y)
TDFN (VP2)
VCC
CS
1
8
VCC
SO
2
7
HOLD
WP
3
6
SCK
VSS
4
5
SI
SI
CS
WP
CAT25010
CAT25020
CAT25040
SO
HOLD
SCK
PIN FUNCTIONS
Pin Name
Function
SO
Serial Data Output
SCK
Serial Clock
WP
Write Protect
VCC
+1.8V to +5.5V Power Supply
VSS
Ground
CS
Chip Select
SI
Serial Data Input
HOLD
Suspends Serial Input
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
VSS
1
Doc. No. 1006, Rev. S
CAT25010, CAT25020, CAT25040
ABSOLUTE MAXIMUM RATINGS(1)
Storage Temperature
-65°C to +150°C
Voltage on Any Pin with Respect to Ground(2)
-0.5 V to +6.5 V
RELIABILITY CHARACTERISTICS(3)
Symbol
Parameter
Min
Units
NEND(4)
Endurance
1,000,000
Program/ Erase Cycles
100
Years
TDR
Data Retention
D.C. OPERATING CHARACTERISTICS
VCC = 1.8 V to 5.5 V, TA = -40°C to 85°C, unless otherwise specified.
Symbol
Parameter
Test Conditions
ICC
Supply Current
ISB1
ISB2
Min
Max
Units
Read, Write, VCC = 5.0V, fSCK = 10MHz,
SO open
2
mA
Standby Current
VIN = GND or VCC , CS = VCC , WP = VCC ,
VCC = 5V
2
µA
Standby Current
VIN = GND or VCC , CS = VCC , WP = GND,
VCC = 5V
4
µA
IL
Input Leakage Current
VIN = GND or VCC
-2
2
µA
ILO
Output Leakage Current
CS = VCC , VOUT = GND or VCC
-1
1
µA
VIL
Input Low Voltage
-0.5
0.3VCC
V
VIH
Input High Voltage
0.7VCC
VCC + 0.5
V
VOL1
Output Low Voltage
VCC > 2.5V, IOL = 3.0mA
0.4
V
VOH1
Output High Voltage
VCC > 2.5V, IOH = -1.6mA
VOL2
Output Low Voltage
VCC > 1.8V, IOL = 150µA
VOH2
Output High Voltage
VCC > 1.8V, IOH = -100µA
VCC - 0.8V
V
0.2
V
VCC - 0.2V
V
PIN CAPACITANCE(3)
TA = 25°C, f = 1 MHz, VCC = 5V
Symbol
COUT
CIN
Test Conditions
Max
Conditions
Units
Output Capacitance (SO)
8
VOUT = 0 V
pF
Input Capacitance (CS, SCK, SI, WP, HOLD)
6
VIN = 0 V
pF
Note:
(1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions outside of those listed in the operational sections of this
specification is not implied. Exposure to any absolute maximum rating for extended periods may affect device performance and reliability.
(2) The DC input voltage on any pin should not be lower than -0.5V or higher than VCC + 0.5V. During transitions, the voltage on any pin may
undershoot to no less than -1.5 V or overshoot to no more than VCC + 1.5V, for periods of less than 20ns.
(3) These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC-Q100
and JEDEC test methods.
(4) Page Mode, VCC = 5 V, 25°C
Doc. No. 1006, Rev. S
2
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
A.C. CHARACTERISTICS
TA = -40°C to +85°C, unless otherwise specified.(1)
VCC = 1.8V-5.5V
SYMBOL PARAMETER
Min.
Max.
VCC = 2.5V-5.5V
Min.
Max.
UNITS
tSU
Data Setup Time
30
20
ns
tH
Data Hold Time
30
20
ns
tWH
SCK High Time
75
40
ns
tWL
SCK Low Time
75
40
ns
fSCK
Clock Frequency
DC
5
DC
10
MHz
HOLD to Output Low Z
50
25
ns
tRI(2)
Input Rise Time
2
2
µs
tFI(2)
Input Fall Time
2
2
µs
tHD
HOLD Setup Time
0
0
ns
tCD
HOLD Hold Time
10
10
ns
tWC(4)
Write Cycle Time
5
5
ms
Output Valid from Clock Low
75
40
ns
tLZ
tV
tHO
Output Hold Time
0
0
ns
tDIS
Output Disable Time
50
20
ns
tHZ
HOLD to Output High Z
100
25
ns
tCS
CS High Time
50
15
ns
tCSS
CS Setup Time
50
15
ns
tCSH
CS Hold Time
50
15
ns
tWPS
WP Setup Time
10
10
ns
tWPH
WP Hold Time
10
10
ns
Power-Up Timing(2)(3)
Symbol
Parameter
Max.
Units
tPUR
Power-up to Read Operation
1
ms
tPUW
Power-up to Write Operation
1
ms
NOTE:
(1) AC Test Conditions:
Input Pulse Voltages: 0.3VCC to 0.7VCC
Input rise and fall times: ≤10ns
Input and output reference voltages: 0.5VCC
Output load: current source IOL max/IOH max; CL=50pF
(2) This parameter is tested initially and after a design or process change that affects the parameter.
(3) tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated.
(4) tWC is the time from the rising edge of CS after a valid write sequence to the end of the internal write cycle.
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
3
Doc. No. 1006, Rev. S
CAT25010, CAT25020, CAT25040
FUNCTIONAL DESCRIPTION
PIN DESCRIPTION
The CAT25010/20/40 supports the SPI bus data
transmission protocol. The synchronous Serial Peripheral
Interface (SPI) helps the CAT25010/20/40 to interface
directly with many of today’s popular microcontrollers.
The CAT25010/20/40 contains an 8-bit instruction
register. (The instruction set and the operation codes
are detailed in the instruction set table)
SI: Serial Input
SI is the serial data input pin. This pin is used to input all
opcodes, byte addresses, and data to be written to the
CAT25010/20/40. Input data is latched on the rising
edge of the serial clock for SPI modes (0, 0 & 1, 1).
SO: Serial Output
SO is the serial data output pin. This pin is used to
transfer data out of the CAT25010/20/40. During a read
cycle, data is shifted out on the falling edge of the serial
clock for SPI modes (0,0 & 1,1).
After the device is selected with CS going low, the first
byte will be received. The part is accessed via the SI pin,
with data being clocked in on the rising edge of SCK.
The first byte contains one of the six op-codes that define
the operation to be performed.
Figure 1. Sychronous Data Timing
tCS
VIH
CS
VIL
tCSH
tCSS
VIH
tWL
tWH
SCK
VIL
tH
tSU
VIH
VALID IN
SI
VIL
tRI
tFI
tV
VOH
SO
tHO
tDIS
HI-Z
HI-Z
VOL
Note: Dashed Line= mode (1, 1) – – – – –
INSTRUCTION SET
Instruction
Opcode
Operation
WREN
0000 0110
Enable Write Operations
WRDI
0000 0100
Disable Write Operations
RDSR
0000 0101
Read Status Register
WRSR
0000 0001
Write Status Register
READ
0000 X011(1)
Read Data from Memory
WRITE
0000 X010(1)
Write Data to Memory
Note:
(1) X=0 for CAT25010, CAT25020. X=A8 for CAT25040
Doc. No. 1006, Rev. S
4
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
WP
WP: Write Protect
WP is the Write Protect pin. The Write Protect pin will
allow normal read/write operations when held high.
When WP is tied low all write operations are inhibited.
WP held low while CS is low will interrupt a write to the
CAT25010/20/40. If the internal write cycle has already
been initiated, WP going low will have no effect on any
write operation. Figure 10 illustrates the WP timing
sequence during a write operation.
SCK: Serial Clock
SCK is the serial clock pin. This pin is used to synchronize
the communication between the microcontroller and the
CAT25010/20/40. Opcodes, byte addresses, or data
present on the SI pin are latched on the rising edge of the
SCK. Data on the SO pin is updated on the falling edge
of the SCK for SPI modes (0,0 & 1,1) .
CS
CS: Chip Select
CS is the Chip select pin. CS low enables the CAT25010/
20/40 and CS high disables the CAT25010/20/40. CS
high takes the SO output pin to high impedance and
forces the devices into a Standby Mode (unless an
internal write operation is underway). A high to low
transition on CS is required prior to any sequence being
initiated. A low to high transition on CS after a valid write
sequence is what initiates an internal write cycle.
HOLD
HOLD: Hold
The HOLD pin is used to pause transmission to the
CAT25010/20/40 while in the middle of a serial sequence
without having to re-transmit entire sequence at a later
time. To pause, HOLD must be brought low while SCK
is low. The SO pin is in a high impedance state during
the time the part is paused, and transitions on the SI pins
will be ignored. To resume communication, HOLD is
brought high, while SCK is low. (HOLD should be held
high any time this function is not being used.) HOLD may
be tied high directly to VCC or tied to VCC through a
resistor. Figure 9 illustrates hold timing sequence.
STATUS REGISTER
7
6
5
4
3
2
1
0
1
1
1
1
BP1
BP0
WEL
RDY
BLOCK PROTECTION BITS
Status Register Bits
BP1
BP0
Array Address
Protected
Protection
0
0
None
No Protection
0
1
CAT25010: 60-7F
CAT25020: C0-FF
CAT25040: 180-1FF
Quarter Array Protection
1
0
CAT25010: 40-7F
CAT25020: 80-FF
CAT25040: 100-1FF
Half Array Protection
1
1
CAT25010: 00-7F
CAT25020: 00-FF
CAT25040: 000-1FF
Full Array Protection
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
5
Doc. No. 1006, Rev. S
CAT25010, CAT25020, CAT25040
STATUS REGISTER
DEVICE OPERATION
The Status Register indicates the status of the device.
The RDY (Ready) bit indicates whether the CAT25010/
20/40 is busy with a write operation. When set to 1 a
write cycle is in progress and when set to 0 the device
indicates it is ready. This bit is read only.
Write Enable and Disable
The CAT25010/20/40 contains a write enable latch. This
latch must be set before any write operation. The device
powers up in a write disable state when Vcc is applied.
WREN instruction will enable writes (set the latch) to the
device. If WP pin is held low, the write enable latch is
reset to the write disabe state, regardless of the WREN
Instruction. WRDI instruction will disable writes (reset
the latch) to the device. Disabling writes will protect the
device against inadvertent writes.
The WEL (Write Enable) bit indicates the status of the
write enable latch. When set to 1, the device is in a Write
Enable state and when set to 0 the device is in a Write
Disable state. The WEL bit can only be set by the WREN
instruction and can be reset by the WRDI instruction.
READ Sequence
The part is selected by pulling CS low. The 8-bit read
instruction is transmitted to the CAT25010/20/40, followed
by the 8-bit address for CAT25010/20/40 (for the 25040,
bit 3 of the read data instruction contains address A8).
The BP0 and BP1 (Block Protect) bits indicate which
blocks are currently protected. These bits are set by the
user issuing the WRSR instruction. The user is allowed
to protect quarter of the memory, half of the memory or
the entire memory by setting these bits. Once protected,
the user may only read from the protected portion of the
array. These bits are non-volatile.
After the correct read instruction and address are sent,
the data stored in the memory at the selected address is
shifted out on the SO pin. The data stored in the memory
at the next address can be read sequentially by continuing
Figure 2. WREN Instruction Timing
CS
SCK
SI
0
0
0
0
0
1
1
0
HIGH IMPEDANCE
SO
Note: Dashed Line = mode (1, 1) – – – – –
Figure 3. WRDI Instruction Timing
CS
SCK
SI
SO
0
0
0
0
0
1
0
0
HIGH IMPEDANCE
Note: Dashed Line = mode (1, 1) – – – – –
Doc. No. 1006, Rev. S
6
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
to provide clock pulses. The internal address pointer is
automatically incremented to the next higher address
after each byte of data is shifted out. When the highest
address is reached, the address counter rolls over to
0000h allowing the read cycle to be continued indefinitely.
The read operation is terminated by pulling the CS high.
Read sequece is illustrated in Figure 4.
WRITE Sequence
The CAT25010/20/40 powers up in a Write Disable
state. Prior to any write instructions, the WREN instruction
must be sent to CAT25010/20/40. The device goes into
Write enable state by pulling the CS low and then
clocking the WREN instruction into CAT25010/20/40.
The CS must be brought high after the WREN instruction
to enable writes to the device. If the write operation is
initiated immediately after the WREN instruction without
CS being brought high, the data will not be written to the
array because the write enable latch will not have been
properly set. Also, for a successful write operation the
To read the status register, RDSR instruction should be
sent. The contents of the status register are shifted out
on the SO line. The status register may be read at any
time even during a write cycle. Reading status register
is illustrated in Figure 5.
Figure 4. Read Instruction Timing
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
SCK
BYTE ADDRESS
OPCODE
SI
0
0
0
0
0
X*
0
1
1
A7 A6 A5
A4
A3
A2
A1 A0
DATA OUT
HIGH IMPEDANCE
SO
D7 D6 D5 D4 D3 D2 D1 D0
MSB
*Please check the instruction set table for address
X=0 for 25010, 25020 ; X=A8 for 25040
Note: Dashed line = mode (1,1)----
Figure 5. RDSR Instruction Timing
CS
0
1
2
3
4
5
6
7
1
0
1
8
9
10
11
7
6
5
4
12
13
14
2
1
SCK
OPCODE
SI
0
0
0
0
0
DATA OUT
SO
HIGH IMPEDANCE
3
0
MSB
Note: Dashed Line= mode (1, 1) – – – – –
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
7
Doc. No. 1006, Rev. S
CAT25010, CAT25020, CAT25040
Page Write
The CAT25010/20/40 features page write capability.
After the initial byte, the host may continue to write up to
16 bytes of data to the CAT25010/20/40. After each
byte of data received, lower order address bits are
internally incremented by one; the high order bits of
address will remain constant. The only restriction is that
the X (X=16 for CAT25010/20/40) bytes must reside on
the same page. If the address counter reaches the end
of the page and clock continues, the counter will “roll
over” to the first address of the page and overwrite any
data that may have been written. The CAT25010/20/40
is automatically returned to the write disable state at the
completion of the write cycle. Figure 8 illustrates the
page write sequence.
address of the memory location(s) to be programmed
must be outside the protected address field location
selected by the block protection level.
Byte Write
Once the device is in a Write Enable state, the user may
proceed with a write sequence by setting the CS low,
issuing a write instruction via the SI line, followed by the
8-bit address for 25010/20/40 (for the 25040, bit 3 of the
read data instruction contains address A8). Programming
will start after the CS is brought high. Figure 6 illustrates
byte write sequence.
During an internal write cycle, all commands will be
ignored except the RDSR (Read Status Register)
instruction.
Status Register Write
To write to the status register, the WRSR instruction
should be sent. Only Bit 2 and Bit 3 of the status register
can be written using the WRSR instruction. Figure 7
illustrates the sequence of writing to status register.
The Status Register can be read to determine if the write
cycle is still in progress. If Bit 0 of the Status Register is
set at 1, write cycle is in progress. If Bit 0 is set at 0, the
device is ready for the next instruction
Figure 6. Write Instruction Timing
CS
0
1
2
3
4
5
6
7
8
13
14
15
16
17
18
19
20
21
22
23
SCK
BYTE ADDRESS
OPCODE
SI
0
0
0
0
0X*
0
1
A0 D7 D6 D5 D4 D3 D2 D1 D0
A7
0
DATA IN
HIGH IMPEDANCE
SO
Note: Dashed Line= mode (1, 1) – – – – –
*X=0 for 25010, 25020 ; X=A8 for 25040
Figure 7. WRSR Timing
CS
0
1
2
3
4
5
6
7
8
9
10
11
1
7
6
5
4
12
13
14
15
2
1
0
SCK
OPCODE
SI
0
0
0
0
0
DATA IN
0
0
3
MSB
SO
HIGH IMPEDANCE
Note: Dashed Line= mode (1, 1) – – – – –
Doc. No. 1006, Rev. S
8
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
DESIGN CONSIDERATIONS
The CAT25010/20/40 powers up in a write disable state
and in a low power standby mode. A WREN instruction
must be issued to perform any writes to the device after
power up. After power up, CS must be brought low to
enter a ready state and receive an instruction. After a
successful byte/page write or status register write, the
CAT25010/20/40 goes into a write disable mode. CS
must be set high after the proper number of clock cycles
to start an internal write cycle. Access to the array
during an internal write cycle is ignored and programming is continued. On power up, SO is in a high
impedance. If an invalid opcode is received, no data will
be shifted into the CAT25010/20/40, and the serial
output pin (SO) will remain in a high impedance state
until the falling edge of CS is detected again.
Figure 8. Page Write Instruction Timing
CS
0
1
2
3
4
5
6
7
8
13
14
15 16-23
24-31
16+(N-1)x8-1..16+(N-1)x8 16+Nx8-1
SCK
SI
0
0
0
0
0
X*
0
1
0
A7
A0
Data
Byte 1
Data
Byte 2
Data
Byte 3
Data Byte N
0
7..1
HIGH IMPEDANCE
SO
Note: Dashed Line= mode (1, 1) – – – – –
DATA IN
BYTE ADDRESS
OPCODE
*X=0 for 25010, 25020 ; X=A8 for 25040
Figure 9. HOLD Timing
CS
tCD
tCD
SCK
tHD
tHD
HOLD
tHZ
HIGH IMPEDANCE
SO
tLZ
Note: Dashed Line= mode (1, 1) – – – – –
Figure 10. WP Timing
t WPS
t WPH
CS
SCK
WP
WP
Note: Dashed Line= mode (1, 1) – – – – –
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
9
Doc. No. 1006, Rev. S
CAT25010, CAT25020, CAT25040
8-LEAD 300 MIL WIDE PLASTIC DIP (L)
E1
E
D
A2
A
A1
L
e
eB
b2
b
SYMBOL
A
A1
A2
b
b2
D
E
E1
e
eB
L
MIN
NOM
MAX
4.57
0.38
3.05
0.36
1.14
9.02
7.62
6.09
7.87
0.115
0.46
7.87
6.35
2.54 BSC
0.130
3.81
0.56
1.77
10.16
8.25
7.11
9.65
0.150
24C16_8-LEAD_DIP_(300P).eps
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
Notes:
1. All dimensions are in millimeters.
2. Complies with JEDEC Standard MS001.
3. Dimensioning and tolerancing per ANSI Y14.5M-1982
Doc. No. 1006, Rev. S
10
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
8-LEAD 150 MIL WIDE SOIC (V)
E1
E
h x 45
D
C
A
θ1
e
A1
L
b
SYMBOL
MIN
A1
A
b
C
D
E
E1
e
h
L
θ1
0.10
1.35
0.33
0.19
4.80
5.80
3.80
NOM
MAX
0.25
1.75
0.51
0.25
5.00
6.20
4.00
1.27 BSC
0.25
0.40
0°
0.50
1.27
8°
24C16_8-LEAD_SOIC.eps
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
Notes:
1. All dimensions are in millimeters.
2. Complies with JEDEC specification MS-012.
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
11
Doc. No. 1006, Rev. S
CAT25010, CAT25020, CAT25040
8-LEAD TSSOP (Y)
D
5
8
SEE DETAIL A
c
E
E1
E/2
GAGE PLANE
4
1
PIN #1 IDENT.
0.25
θ1
L
A2
SEATING PLANE
SEE DETAIL A
A
e
A1
b
SYMBOL
A
A1
A2
b
c
D
E
E1
e
L
θ1
MIN
0.05
0.80
0.19
0.09
2.90
6.30
4.30
0.50
0.00
NOM
0.90
3.00
6.4
4.40
0.65 BSC
0.60
MAX
1.20
0.15
1.05
0.30
0.20
3.10
6.50
4.50
0.75
8.00
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
Notes:
1. All dimensions are in millimeters.
2. Complies with JEDEC Standard MO-153
Doc. No. 1006, Rev. S
12
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
8-PAD TDFN 2X3 PACKAGE (VP2)
A
E
PIN 1 INDEX AREA
A1
D
D2
A2
A3
SYMBOL
MIN
NOM
MAX
A
A1
A2
A3
b
D
D2
E
E2
e
L
0.70
0.00
0.45
0.75
0.02
0.55
0.20 REF
0.25
2.00
1.40
3.00
1.30
0.50 TYP
0.30
0.80
0.05
0.65
0.20
1.90
1.30
2.90
1.20
0.20
E2
0.30
2.10
1.50
3.10
1.40
PIN 1 ID
L
0.40
b
e
3xe
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
TDFN2X3 (03).eps
Notes:
1. All dimensions are in millimeters.
2. Complies with JEDEC Standard MO-229
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
13
Doc. No. 1006, Rev. S
CAT25010, CAT25020, CAT25040
8 LEAD MSOP (Z)
E1
E
e
D
A2
b
SYMBOL
MIN
L
A1
NOM
A
MAX
1.10
A1
0.00
0.15
A2
0.75
0.95
b
0.22
0.38
D
2.90
3.00
3.10
E
4.80
4.90
5.00
E1
2.90
3.00
3.10
e
L
GAUGE
PLANE
A
0.65 BSC
0.40
0.8
0°
8°
8-lead_MSOP3.eps
For current Tape and Reel information, download the PDF file from:
http://www.catsemi.com/documents/tapeandreel.pdf.
Notes:
1. All dimensions are in millimeters. Angles in degrees.
2. Complies with JEDEC Specification MO-187.
3. Stand off height/coplanarity are considered as special characteristics.
Doc. No. 1006, Rev. S
14
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
PACKAGE MARKING
8-Lead PDIP
8-Lead SOIC
25040LI
FYYWWC
25040VI
FYYWWC
CSI = Catalyst Semiconductor, Inc.
25040L = Device Code:
25010L
25020L
25040L
I = Temperature Range
YY = Production Year
WW = Production Week
C = Product Revision
F = Lead Finish
4 = NiPdAu
3 = Matte-Tin
CSI = Catalyst Semiconductor, Inc.
25040V = Device Code:
25010V
25020V
25040V
I = Temperature Range
YY = Production Year
WW = Production Week
C = Product Revision
F = Lead Finish
4 = NiPdAu
3 = Matte-Tin
8-Lead MSOP
8-Lead TSSOP
YMCF
NNNN
25040
YMR
Y
M
C
25040
= Production Year
= Production Month
= Product Revision
= Device Code:
25010
25020
25040
I = Industrial Temperature Range
F = Lead Finish
4 = NiPdAu
3 = Matte-Tin
NNNN = Device Code
Matte Tin NiPdAu
25010
ABPH
ABPJ
25020
ABPF
ABKP
25040
ABPG
ABCY
Y = Production Year
M = Production Month
C = Production Revision
Notes:
(1) The circle on the package marking indicates the location of Pin 1.
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
15
Doc. No. 1006, Rev. S
CAT25010, CAT25020, CAT25040
8-Pad TDFN (2x3mm)
XXN
NNN
YM
XX = Device Code
Matte-Tin
25010
FH
25020
FE
25040
FF
NiPdAu
FG
FC
FD
N = Traceability Code
Y = Production Year
M = Production Month
Doc. No. 1006, Rev. S
16
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
CAT25010, CAT25020, CAT25040
EXAMPLE OF ORDERING INFORMATION
Prefix
CAT
Optional
Company ID
Device #
Suffix
25040
V
Product Number
25040: 4K
25020: 2K
25010: 1K(4)
I
–
G
Temperature Range
I = Industrial (-40°C to + 85°C)
A = Automotive (-40°C to + 125°C)(4)
Package
L : PDIP
V : SOIC, JEDEC
Y : TSSOP
VP2 : TDFN
Z : MSOP(4)
T3
Tape & Reel
T: Tape & Reel
3: 3000/Reel
Lead Finish
G: NiPdAu
Blank: Matte-Tin
Notes:
(1) All packages are RoHS-compliant (Lead-free, Halogen-free).
(2) The standard lead finish is NiPdAu.
(3) The device used in the above example is a CAT25040VI-GT3 (SOIC, Industrial Temperature, NiPdAu, Tape & Reel).
(4) For availability, please contact your nearest Catalyst Semiconductor Sales office.
© 2006 by Catalyst Semiconductor, Inc.
Characteristics subject to change without notice
17
Doc. No. 1006, Rev. S
REVISION HISTORY
Date
10/13/05
Rev.
N
12/09/05
O
03/21/06
P
06/30/06
Q
07/31/06
R
10/13/06
S
Reason
Update D.C. Operating Characteristics
Update Ordering Information
Update Pin Configuration
Update D.C. Operating Characteristics
Update Pin Impedance Characteristics
Update Figure 2, 3, 4, 6, 8
Add Tape and Reel
Update Ordering Information
Update D.C. Operating Characteristics
Update A.C. Characteristics
Update Pin Description
Update Features
Update Description
Update A.C. Characteristics
Update Package Marking
Remove Tape and Reel
Update Example of Ordering Information
Add TDFN and MSOP packages
Update Package Marking
Update Ordering Information
Update Example of Ordering Information
Copyrights, Trademarks and Patents
Trademarks and registered trademarks of Catalyst Semiconductor include each of the following:
AE2 ™
Beyond Memory™,
DPP™,
EZDim™,
MiniPot™
Quad-Mode™
Catalyst Semiconductor has been issued U.S. and foreign patents and has patent applications pending that protect its products.
CATALYST SEMICONDUCTOR MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING
THE SUITABILITY OF ITS PRODUCTS FOR ANY PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT
INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE RIGHTS OF THIRD PARTIES WITH RESPECT TO ANY PARTICULAR
USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING OUT OF ANY SUCH USE OR
APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.
Catalyst Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant
into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Catalyst
Semiconductor product could create a situation where personal injury or death may occur.
Catalyst Semiconductor reserves the right to make changes to or discontinue any product or service described herein without notice.
Products with data sheets labeled "Advance Information" or "Preliminary" and other products described herein may not be in production or
offered for sale.
Catalyst Semiconductor advises customers to obtain the current version of the relevant product information before placing orders. Circuit
diagrams illustrate typical semiconductor applications and may not be complete.
Catalyst Semiconductor, Inc.
Corporate Headquarters
2975 Stender Way
Santa Clara, CA 95054
Phone: 408.542.1000
Fax: 408.542.1200
www.catsemi.com
Publication #:
Revison:
Issue date:
1006
S
10/13/06