AP65SL130AI
Halogen-Free Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ 100% Rg & UIS Test
VDS @ Tj,max.
D
700V
▼ Fast Switching Characteristic
RDS(ON)
0.13Ω
▼ Simple Drive Requirement
3,4
ID
26.2A
G
▼ RoHS Compliant & Halogen-Free
S
Description
AP65SL130A series are from Advanced Power innovated design and
silicon process technology to achieve the lowest possible onresistance and fast switching performance. It provides the designer
with an extreme efficient device for use in a wide range of power
applications.
The TO-220CFM package is widely preferred for all commercialindustrial through hole applications. The mold compound provides a
high isolation voltage capability and low thermal resistance between
the tab and the external heat-sink
G
D
TO-220CFM(I)
S
.
Absolute Maximum Ratings
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID@TC=25℃
ID@TC=100℃
Rating
Units
650
V
+20
V
3,4
26.2
A
3,4
16.5
A
Drain Current, VGS @ 10V
Drain Current, VGS @ 10V
1
IDM
Pulsed Drain Current
66
A
dv/dt
MOSFET dv/dt Ruggedness (VDS = 0 …480V )
50
V/ns
PD@TC=25℃
Total Power Dissipation
33.7
W
PD@TA=25℃
Total Power Dissipation
1.92
W
300
mJ
15
V/ns
5
Single Pulse Avalanche Energy
EAS
6
dv/dt
Peak Diode Recovery dv/dt
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Value
Units
Rthj-c
Maximum Thermal Resistance, Junction-case
3.7
℃/W
Rthj-a
Maximum Thermal Resistance, Junction-ambient
65
℃/W
Data & specifications subject to change without notice
1
201505211
AP65SL130AI
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
BVDSS
Parameter
Test Conditions
Drain-Source Breakdown Voltage
2
Min.
Typ.
Max. Units
VGS=0V, ID=250uA
650
-
-
V
VGS=10V, ID=9.6A
-
-
0.13
Ω
RDS(ON)
Static Drain-Source On-Resistance
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
2
-
5
V
gfs
Forward Transconductance
VDS=10V, ID=14A
-
25
-
S
IDSS
Drain-Source Leakage Current
VDS=480V, VGS=0V
-
-
100
uA
IGSS
Gate-Source Leakage
VGS=+20V, VDS=0V
-
-
+100
nA
Qg
Total Gate Charge
ID=14A
-
82
131.2
nC
Qgs
Gate-Source Charge
VDS=480V
-
21
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=10V
-
33
-
nC
td(on)
Turn-on Delay Time
VDD=300V
-
24
-
ns
tr
Rise Time
ID=14A
-
42
-
ns
td(off)
Turn-off Delay Time
RG=3.3Ω
-
74
-
ns
tf
Fall Time
VGS=10V
-
38
-
ns
Ciss
Input Capacitance
VGS=0V
-
Coss
Output Capacitance
VDS=100V
-
90
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
11
-
pF
Rg
Gate Resistance
f=1.0MHz
-
4.5
9
Ω
Min.
Typ.
.
3380 5408
pF
Source-Drain Diode
Symbol
Parameter
2
Test Conditions
Max. Units
VSD
Forward On Voltage
IS=14A, VGS=0V
-
0.85
-
V
trr
Reverse Recovery Time
IS=14A, VGS=0V
-
430
-
ns
Qrr
Reverse Recovery Charge
dI/dt=30A/µs
-
2.5
-
µC
Notes:
1.Pulse width limited by max. junction temperature.
2.Pulse test
3.Limited by max. junction temperature. Maximum duty cycle D=0.75
4.Ensure that the junction temperature does not exceed TJmax..
5.Starting Tj=25oC , VDD=50V , L=150mH , RG=25Ω
6.ISD ≦ ID, VDD ≦ BVDSS, starting TJ = 25oC
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP65SL130AI
80
40
o
o
T C =150 C
ID , Drain Current (A)
ID , Drain Current (A)
T C =25 C
10V
9 .0V
8 .0V
7 .0V
60
40
20
20
V G =5.0V
0
0
0
8
16
24
0
32
8
16
24
32
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
140
3.4
I D =9.6A
T C =25 o C
I D =9.6A
V G =10V
120
.
Normalized RDS(ON)
3
130
RDS(ON) (mΩ)
0.37Ω
ID3,4
10
V G = 6 .0V
10V
9.0V
8.0V
7.0V
6.0V
30
2.6
2.2
1.8
1.4
1
110
0.6
0.2
100
5
6
7
8
9
-100
10
-50
0
50
100
150
o
V GS Gate-to-Source Voltage (V)
T j , Junction Temperature ( C )
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
2
20
I D =250uA
1.5
IS (A)
Normalized VGS(th)
15
10
T j = 150 o C
T j = 25 o C
1
0.5
5
0
0
0
0.2
0.4
0.6
0.8
1
V SD (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.2
-100
-50
0
50
100
150
T j , Junction Temperature ( o C )
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP65SL130AI
f=1.0MHz
10000
I D =14A
V DS =480V
10
C iss
1000
6
ID3,4
100
oss
C rss
10
4
1
2
0
0.1
0
20
40
60
80
100
0
200
400
600
800
V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1
Operation in this area
limited by RDS(ON)
10
10us
100us
1ms
1
10ms
100ms
0.1
DC
o
T C =25 C
Single Pulse
0.01
.
Normalized Thermal Response (Rthjc)
100
ID (A)
0.37ΩC
8
C (pF)
VGS , Gate to Source Voltage (V)
12
Duty factor=0.5
0.2
0.1
0.1
0.05
0.02
0.01
PDM
Single Pulse
0.01
t
T
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
0.001
1
10
100
1000
0.00001
0.0001
0.001
V DS , Drain-to-Source Voltage (V)
0.01
0.1
1
10
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig10. Effective Transient Thermal Impedance
60
V DS =10V
ID , Drain Current (A)
VG
o
T j =25 C
50
QG
40
10V
QGS
T j =150 o C
30
QGD
20
10
Charge
Q
0
0
2
4
6
8
10
V GS , Gate-to-Source Voltage (V)
Fig 11. Transfer Characteristics
Fig 12. Gate Charge Waveform
4
AP65SL130AI
50
2
I D =1mA
PD, Power Dissipation(W)
Normalized BVDSS
1.6
1.2
0.8
0.4
40
30
20
10
0
0
-100
-50
0
50
100
150
0
o
50
100
150
o
T j , Junction Temperature ( C)
T C , Case Temperature( C)
Fig 13. Normalized BVDSS v.s. Junction
Fig 14. Total Power Dissipation
Temperature
1000
T j =25 o C
RDS(ON) (mΩ)
800
600
.
400
V GS =10V
200
0
0
10
20
30
40
50
60
I D , Drain Current (A)
Fig 15. Typ. Drain-Source on State
Resistance
5
AP65SL130AI
MARKING INFORMATION
Part Number
65SL130A
YWWSSS
Date Code (YWWSSS)
Y：Last Digit Of The Year
WW：Week
SSS：Sequence
.
6