MC10H124 Quad TTL−to−MECL Translator With TTL Strobe Input The MC10H124 is a quad translator for interfacing data and control signals between a saturated logic section and the MECL section of digital systems. The 10H part is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in propagation delay, and no increase in power−supply current. • Propagation Delay, 1.5 ns Typical • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K−Compatible • Pb−Free Packages are Available* 5 4 6 2 7 3 MARKING DIAGRAMS 16 CDIP−16 L SUFFIX CASE 620A 1 16 1 PLCC−20 FN SUFFIX CASE 775 15 10H124 AWLYYWW 16 13 EIAJ−16 M SUFFIX CASE 966 14 GND = PIN 16 VCC ( +5.0 VDC) = PIN 9 VEE ( −5.2 VDC) = PIN 8 10H124 ALYW 1 A WL, L YY, Y WW, W Figure 1. Logic Diagram BOUT 1 16 GND AOUT 2 15 COUT BOUT 3 14 DOUT AOUT 4 13 DOUT AIN 5 12 COUT COMMON 6 11 DIN BIN 7 10 CIN VEE 8 9 VCC STROBE MC10H124P AWLYYWW 1 12 11 MC10H124L AWLYYWW PDIP−16 P SUFFIX CASE 648 1 10 http://onsemi.com = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. Pin assignment is for Dual−in−Line Package. For PLCC pin assignment, see Table 1. Figure 2. Pin Assignment *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2004 September, 2004 − Rev. 8 1 Publication Order Number: MC10H124/D MC10H124 Table 1. DIP CONVERSION TABLE 16−Pin DIL to 20−Pin PLCC 16 PIN DIL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 20 PIN PLCC 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 Table 2. MAXIMUM RATINGS Rating Unit VEE Symbol Power Supply (VCC = 5.0 V) Characteristic −8.0 to 0 Vdc VCC Power Supply (VEE = −5.2 V) 0 to +7.0 Vdc VI Input Voltage (VCC = 5.0 V) TTL 0 to VCC Vdc Iout Output Current − Continuous − Surge 50 100 mA TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range − Plastic − Ceramic −55 to +150 −55 to +165 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 3. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%, VCC = 5.0 V ± 5.0%) 0° Symbol 25° 75° Max Unit IE Negative Power Supply Drain Current − 72 − 66 − 72 mA ICCH ICCL Positive Power Supply Drain Current − − 16 25 − − 16 25 − − 18 25 mA Reverse Current Pin 6 Pin 7 − − 200 50 − − 200 50 − − 200 50 Forward Current Pin 6 Pin 7 − − −12.8 −3.2 − − −12.8 −3.2 − − −12.8 −3.2 5.5 − 5.5 − 5.5 − Vdc IR IF V(BR)in Characteristic Input Breakdown Voltage Min Max Min Max Min A mA VI Input Clamp Voltage − −1.5 − −1.5 − −1.5 Vdc VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc VIH High Input Voltage 2.0 − 2.0 − 2.0 − Vdc VIL Low Input Voltage − 0.8 − 0.8 − 0.8 Vdc 1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50 resistor to −2.0 V. Table 4. AC CHARACTERISTICS 0° Symbol Characteristic 25° 75° Min Max Min Max Min Max Unit tpd Propagation Delay 0.55 2.5 0.55 2.65 0.85 3.1 ns tr Rise Time 0.5 1.5 0.5 1.6 0.5 1.7 ns tf Fall Time 0.5 1.5 0.5 1.6 0.5 1.7 ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. http://onsemi.com 2 MC10H124 APPLICATIONS INFORMATION An advantage of this device is that TTL−level information can be transmitted differentially, via balanced twisted pair lines, to MECL equipment, where the signal can be received by the MC10H115 or MC10H116 differential line receivers. The power supply requirements are ground, +5.0 V, and −5.2 V. The MC10H124 has TTL−compatible inputs and MECL complementary open−emitter outputs that allow use as an inverting/non−inverting translator or as a differential line driver. When the common strobe input is at the low−logic level, it forces all true outputs to a MECL low−logic state and all inverting outputs to a MECL high−logic state. ORDERING INFORMATION Package Shipping† MC10H124L CDIP−16 25 Units/Rail MC10H124P PDIP−16 25 Units/Rail MC10H124PG PDIP−16 (Pb−Free) 25 Units/Rail MC10H124FN PLCC−20 46 Units/Rail MC10H124FNG PLCC−20 (Pb−Free) 46 Units/Rail MC10H124FNR2 PLCC−20 1000 Tape & Reel MC10H124M* EIAJ−16 (Pb−Free) 50 Units/Rail MC10H124MEL* EIAJ−16 (Pb−Free) 2000 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This device is manufactured with a Pb−Free external lead finish only. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPS I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1642/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 3 MC10H124 PACKAGE DIMENSIONS PLCC−20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 775−02 ISSUE D 0.007 (0.180) B Y BRK −N− M T L−M 0.007 (0.180) U M N S T L−M S G1 0.010 (0.250) S N S D −L− −M− Z W 20 D 1 X V 0.007 (0.180) M T L−M S N S R 0.007 (0.180) M T L−M S N S Z S H 0.004 (0.100) G J −T− 0.007 (0.180) M T L−M 0.007 (0.180) F M T L−M VIEW S N S S N S K SEATING PLANE VIEW S S N K1 E G1 0.010 (0.250) S T L−M T L−M VIEW D−D A C S S NOTES: 1. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 4 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2 10 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2 10 7.88 8.38 1.02 −−− S N S MC10H124 PACKAGE DIMENSIONS CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A−01 ISSUE O B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620−10. A A M 16 9 B L 1 8 16X 0.25 (0.010) E M DIM A B C D E F G H K L M N J T B F C K T N INCHES MIN MAX 0.750 0.785 0.240 0.295 −−− 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0 15 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 −−− 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0 15 0.51 1.01 SEATING PLANE G D 16X 0.25 (0.010) M T A PDIP−16 P SUFFIX PLASTIC DIP PACKAGE CASE 648−08 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. −A− 16 9 1 8 B F C L S −T− SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M T A M http://onsemi.com 5 DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0 10 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0 10 0.51 1.01 MC10H124 PACKAGE DIMENSIONS EIAJ−16 M SUFFIX 16 PIN PLASTIC EIAJ PACKAGE CASE 966−01 ISSUE O 16 LE 9 Q1 M E HE 1 8 L DETAIL P Z D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M 0.10 (0.004) MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 −−− 0.031 ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 6 For additional information, please contact your local Sales Representative. MC10H124/D