ATMEL ATA6829 Dual triple dmos output driver with serial input control Datasheet

Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Supply Voltage up to 40V
RDSon Typically 0.5Ω at 25°C, Maximum 1.1Ω at 150°C
Up to 1.5A Output Current
Three High-side and Three Low-side Drivers Usable as Single Outputs or Half Bridges
Capable to Switch all Kinds of Loads such as DC Motors, Bulbs, Resistors, Capacitors
and Inductors
PWM Capability for Each Output Controlled by External PWM Signal
No Shoot-through Current
Very Low Quiescent Current IS < 5 µA in Standby Mode over Total Temperature Range
Outputs Short-circuit Protected
Selective Overtemperature Protection for Each Switch and Overtemperature
Prewarning
Undervoltage Protection
Various Diagnostic Functions such as Shorted Output, Open Load, Overtemperature
and Power-supply Fail Detection
Serial Data Interface, Daisy Chain Capable, up to 2 MHz Clock Frequency
SO16 Power Package
1. Description
Dual Triple
DMOS Output
Driver with
Serial Input
Control
ATA6829
The ATA6829 is a fully protected driver interface designed in 0.8-µm BCDMOS technology. It is used to control up to six different loads by a microcontroller in automotive
and industrial applications.
Each of the three high-side and three low-side drivers is capable to drive currents up
to 1.5A. Each driver is freely configurable and can be controlled separately from a
standard serial data interface. Therefore, all kinds of loads such as bulbs, resistors,
capacitors and inductors can be combined. The IC design especially supports the
applications of H-bridges to drive DC motors. The capability to control each output
with an external PWM signal opens additional applications.
Protection is guaranteed regarding short-circuit conditions, overtemperature and
undervoltage. Various diagnostic functions and a very low quiescent current in
stand-by mode opens a wide range of applications. Automotive qualification (protection against conducted interferences, EMC protection and 2-kV ESD protection) gives
added value and enhanced quality for exacting requirements of automotive
applications.
4531G–BCD–07/09
Figure 1-1.
Block Diagram
OUT3H
OUT2H
4
OUT1H
14
13
Charge
pump
Fault
detect
Fault
detect
Fault
detect
12
6
DI
7
CLK
O
C
S
S
I
O
L
D
P
H
3
P
L
3
P
H
2
P
L
2
Input register
Output register
5
P
H
1
H
S
3
P
L
1
L
S
3
H
S
2
H
S
1
L
S
2
S
R
R
L
S
1
Control
logic
Serial interface
CS
P
S
F
I
N
H
n.
u.
O
V
L
n.
u.
n. n.
u. u.
n. n.
u. u.
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
VS
UV protection
Power-on
reset
11
VCC
L T
S P
1
10
DO
16
PWM
8
Fault
detect
Fault
detect
Thermal
protection
Fault
detect
9
1
15
3
OUT3L
2
OUT2L
GND
GND
GND
2
OUT1L
ATA6829
4531G–BCD–07/09
ATA6829
2. Pin Configuration
Figure 2-1.
Pinning PSO16
GND
OUT1L
OUT3L
OUT3H
CS
DI
CLK
PWM
Table 2-1.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
OUT2L
OUT2H
OUT1H
VS
VCC
DO
GND
Pin Description
Pin
Symbol
1
GND
Function
2
OUT1L
Low-side driver output 1; power MOS open drain with internal reverse diode; short-circuit protection;
overtemperature protection; diagnosis for short and open load; PWM ability
3
OUT3L
Low-side driver output 3; see pin 2
4
OUT3H
High-side driver output 3; power MOS open source with internal reverse diode; short-circuit protection;
overtemperature protection; diagnosis for short and open load; PWM ability
5
CS
Chip select input; 5-V CMOS logic level input with internal pull up;
low = serial communication is enabled, high = disabled
6
DI
Serial data input; 5-V CMOS logic level input with internal pull down; receives serial data from the control
device; DI expects a 16-bit control word with LSB being transferred first
7
CLK
Serial clock input; 5-V CMOS logic level input with internal pull down; controls serial data input interface
and internal shift register (fmax = 2 MHz)
8
PWM
PWM input; 5-V CMOS logic level input with internal pull down; receives PWM signal to control outputs
which are selected for PWM mode by the serial data interface, high = outputs on, low = outputs off
9
GND
Ground; see pin 1
10
DO
11
VCC
Ground; reference potential; internal connection to pin 9 and pin 16; connection to heat slug
Serial data output; 5-V CMOS logic-level tri-state output for output (status) register data; sends 16-bit
status information to the microcontroller (LSB is transferred first); output will remain tri-stated unless
device is selected by CS = low, therefore, several ICs can operate on one data-output line only.
Logic supply voltage (5V)
12
VS
13
OUT1H
Power supply for high-side output stages OUT1H, OUT2H, OUT3H, internal supply
High-side driver output 1; see pin 4
14
OUT2H
High-side driver output 2; see pin 4
15
OUT2L
Low-side driver output 2; see pin 2
16
GND
Ground; see pin 1
3
4531G–BCD–07/09
3. Functional Description
3.1
Serial Interface
Data transfer starts with the falling edge of the CS signal. Data must appear at DI synchronized
to CLK and are accepted on the falling edge of the CLK signal. LSB (bit 0, SRR) has to be transferred first. Execution of new input data is enabled on the rising edge of the CS signal. When CS
is high, pin DO is in tri-state condition. This output is enabled on the falling edge of CS. Output
data will change their state with the rising edge of CLK and stay stable until the next rising edge
of CLK appears. LSB (bit 0, TP) is transferred first.
Figure 3-1.
Data Transfer
CS
DI
SRR
LS1
HS1
LS2
HS2
LS3
HS3
PL1
PH1
PL2
0
1
2
3
4
5
6
7
8
9
10
11
S1L
S1H
S2L
S2H
S3L
S3H
n. u.
n. u.
n. u.
n. u.
n. u.
PH2
PL3
PH3
OLD
OCS
12
13
14
n. u.
OVL
SI
15
CLK
DO
TP
Table 3-1.
Bit
4
INH
PSF
Input Data Protocol
Input Register
Function
0
SRR
Status register reset (high = reset; the bits PSF and OVL in the output
data register are set to low)
1
LS1
Controls output LS1 (high = switch output LS1 on)
2
HS1
Controls output HS1 (high = switch output HS1 on)
3
LS2
See LS1
4
HS2
See HS1
5
LS3
See LS1
6
HS3
See HS1
7
PL1
Output LS1 additionally controlled by PWM Input
8
PH1
Output HS1 additionally controlled by PWM Input
9
PL2
See PL1
10
PH2
See PH1
11
PL3
See PL1
12
PH3
See PH1
13
OLD
Open load detection (low = on)
14
OCS
Overcurrent shutdown (high = overcurrent shutdown is active)
15
SI
Software inhibit; low = standby, high = normal operation
(data transfer is not affected by standby function because the digital part
is still powered)
ATA6829
4531G–BCD–07/09
ATA6829
Table 3-2.
Output Data Protocol
Bit
Output (Status)
Register
0
TP
Function
Temperature prewarning: high = warning
Status LS1
Normal operation: high = output is on, low = output is off
Open-load detection: high = open load, low = no open load
(correct load condition is detected if the corresponding output is switched
off); not affected by SRR
2
Status HS1
Normal operation: high = output is on, low = output is off
Open-load detection: high = open load, low = no open load
(correct load condition is detected if the corresponding output is switched
off); not affected by SRR
3
Status LS2
Description see LS1
4
Status HS2
Description see HS1
5
Status LS3
Description see LS1
6
Status HS3
Description see HS1
7
n. u.
Not used
8
n. u.
Not used
9
n. u.
Not used
10
n. u.
Not used
11
n. u.
Not used
12
n. u.
Not used
13
OVL
Over-load detected: set high, when at least one output is switched off by
a short-circuit condition or an overtemperature event. Bits 1 to 6 can be
used to detect the affected switch.
(open-load detection bit OLD = high)
14
INH
Inhibit: this bit is controlled by software (bit SI in input register)
High = standby, low = normal operation
15
PSF
Power-supply fail: undervoltage at pin VS detected
1
After power-on reset, the input register has the following status:
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SI
OCS
OLD
PH3
PL3
PH2
PL2
PH1
PL1
HS3
LS3
HS2
LS2
HS1
LS1
SRR
H
H
H
L
L
L
L
L
L
L
L
L
L
L
L
L
The following patterns are used to enable internal test modes of the IC. It is not recommended to use these patterns during
normal operation.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
(OCS)
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
(HS3)
(LS3)
(HS2)
(LS2)
(HS1)
(LS1)
(SRR)
H
H
H
H
H
L
L
L
L
L
L
L
L
L
L
L
H
H
H
L
L
H
H
L
L
L
L
L
L
L
L
L
H
H
H
L
L
L
L
H
H
L
L
L
L
L
L
L
5
4531G–BCD–07/09
3.2
Power-supply Fail
In case of undervoltage at pin VS, the Power-Supply Fail bit (PSF) in the output register is set
and all outputs are disabled. To detect an undervoltage, its duration has to last longer than the
undervoltage detection delay time tdUV. The outputs are enabled immediately when supply voltage recovers normal operation value. The PSF bit stays high until it is reset by the SRR bit in the
input register.
3.3
Open-load Detection
If the open-load detection bit (OLD) is set to low, a pull-up current for each high-side switch and
a pull-down current for each low-side switch is turned on (open-load detection current IOUT1-3). If
the current through the external load does not reach the open-load detection current, the corresponding bit of the output in the output register is set to high.
Switching on an output stage with OLD bit set to low disables the open-load function for this
output.
3.4
Overtemperature Protection
If the junction temperature of one ore more output stages exceeds the thermal prewarning
threshold, TjPW set, the temperature prewarning bit (TP) in the output register is set. When the
temperature falls below the thermal prewarning threshold, TjPW reset, the bit TP is reset. The TP
bit can be read without transferring a complete 16-bit data word. The status of TP is available at
pin DO with the falling edge of CS. After the microcontroller has read this information, CS is set
high and the data transfer is interrupted without affecting the status of input and output registers.
If the junction temperature of an output stage exceeds the thermal shutdown threshold,
Tj switch off, the affected output is disabled and the corresponding bit in the output register is set to
low. Additional the overload detection bit (OVL) in the output register is set. The output can be
enabled again when the temperature falls below the thermal shutdown threshold, Tjswitch on and
the SRR bit in the input register is set to high. Hysteresis of thermal prewarning and shutdown
threshold avoids oscillations.
3.5
Short-circuit Protection
The output currents are limited by a current regulator. Overcurrent detection is activated by writing a high to the OCS bit in the input register. When the current in an output stage exceeds the
overcurrent limitation and shut-down threshold, it is switched off after a delay time (tdSd). The
over-load detection bit (OVL) is set and the corresponding status bit in the output register is set
to low. For OCS = low the overcurrent shutdown is inactive and the OVL bit is not set by an overcurrent. By writing a high to the SRR bit in the input register the OVL bit is reset and the disabled
outputs are enabled.
3.6
Inhibit
The SI bit in the input register has to be set to zero to inhibit the ATA6829.
All output stages are then turned off but the serial interface stays active. The current consumption is reduced to less than 5 µA at pin VS and less than 100 µA at pin VCC. The output stages
can be activated again by bit SI = 1.
6
ATA6829
4531G–BCD–07/09
ATA6829
4. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
All values refer to GND pins.
Parameters
Pin
Symbol
Value
Unit
Supply voltage
12
VVS
–0.3 to +40
V
Supply voltage
t < 0.5s; IS > –2A
12
VVS
–1
V
Logic supply voltage
11
VVCC
–0.3 to +7
V
5 to 8
VCS, VDI, VCLK, VPWM
–0.3 to VVCC + 0.3
V
10
VDO
–0.3 to VVCC + 0.3
V
5 to 8
ICS, IDI, ICLK, IPWM
–10 to +10
mA
Output current
10
IDO
–10 to +10
mA
Output current
2 to 4
13 to 15
IOut3H, IOut2H, IOut1H
IOut3L, IOut2L, IOut1L
Internally limited, see output specification
Output voltage
2 to 4
13 to 15
IOut3H, IOut2H, IOut1H
IOut3L, IOut2L, IOut1L
–0.3 to +40
V
2 to 4
13 to 15
towards pin 12
IOut3H, IOut2H, IOut1H
IOut3L, IOut2L, IOut1L
17
A
Junction temperature range
TJ
–40 to +150
°C
Storage temperature range
TSTG
–55 to +150
°C
Logic input voltage
Logic output voltage
Input current
Reverse conducting current
(tpulse = 150 µs)
5. Thermal Resistance
Parameters
Test Conditions
Junction pin
Measured to heat slug
GND pins 1, 9 and 16
Junction ambient
Symbol
Value
Unit
RthJP
5
K/W
RthJA
30
K/W
6. Operating Range
Parameters
Supply voltage
Logic supply voltage
Symbol
VVS
Value
VUV(1) to
Unit
40
V
VVCC
4.75 to 5.25
V
VCS,VDI, VCLK, VPWM
–0.3 to VVCC
V
Serial interface clock frequency
fCLK
2
MHz
PWM input frequency
fPWM
1
kHz
Tj
–40 to +150
°C
Logic input voltage
Junction temperature range
Note:
1. Threshold for undervoltage detection.
7
4531G–BCD–07/09
7. Noise and Surge Immunity
Parameters
Test Conditions
Conducted interferences
ISO 7637-1
Interference suppression
VDE 0879 Part 2
ESD (Human Body Model)
ESD S 5.1
ESD (Machine Model)
JEDEC A115A
Note:
Value
Level 4(1)
Level 5
2 kV
200 V
1. Test pulse 5: Vsmax = 40V.
8. Electrical Characteristics
7.5V < VS < 40V; 4.75V < VCC < 5.25V; INH = High; -40° C < Tj < 150° C; unless otherwise specified, all values refer to GND pins.
No.
1
Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
Current Consumption
1.1
Quiescent current VS
VVS < 20V, SI = low
12
IVS
1
5
µA
A
1.2
Quiescent current VCC
4.75V < VVCC < 5.25V,
SI = low
11
IVCC
60
100
µA
A
1.3
Supply current VS
VVS < 20V normal
operating, all outputs
off, input register bit 13
(OLD) = high
12
IVS
4
6
mA
A
1.4
Supply current VCC
4.75V < VVCC < 5.25V,
normal operating
11
IVCC
350
650
µA
A
1.5
Discharge current VS
VVS = 32.5V, INH = low
12
IVS
0.5
5.5
mA
A
1.6
Discharge current VS
VVS = 40V, INH = low
12
IVS
2.5
10
mA
A
11
VVCC
3.2
3.9
4.4
V
A
tdPor
30
95
190
µs
A
5.6
7.0
V
A
V
A
40
µs
A
2
Undervoltage Detection, Power-on Reset
2.1
Power-on reset
threshold
2.2
Power-on reset delay
time
2.3
Undervoltage-detection
VCC = 5V
threshold
12
VUv
2.4
Undervoltage-detection
VCC = 5V
hysteresis
12
ΔVUv
2.5
Undervoltage-detection
delay time
3
After switching on VCC
0.6
tdUV
10
TjPW set
120
145
170
°C
B
105
130
155
°C
B
K
B
°C
B
Thermal Prewarning and Shutdown
3.1
Thermal prewarning set
3.2
Thermal prewarning
reset
TjPW reset
3.3
Thermal prewarning
hysteresis
ΔTjPW
3.4
Thermal shutdown off
Tj switch off
15
150
175
200
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1. Delay time between rising edge of input signal at pin CS after data transmission and switch on/off output stages to 90% of
final level. Device not in standby for t > 1 ms.
2. Delay time between rising/falling edge of input signal at pin PWM and switch on/off output stages to 90% of final level.
3. Difference between switch-on and switch-off delay time of input signal at pin PWM to output stages in PWM mode.
8
ATA6829
4531G–BCD–07/09
ATA6829
8. Electrical Characteristics (Continued)
7.5V < VS < 40V; 4.75V < VCC < 5.25V; INH = High; -40° C < Tj < 150° C; unless otherwise specified, all values refer to GND pins.
No.
Parameters
3.5
Thermal shutdown on
3.6
Thermal shutdown
hysteresis
ΔTj switch off
3.7
Ratio thermal shutdown
off/thermal prewarning
set
Tj switch off/
TjPW set
1.05
1.2
B
3.8
Ratio thermal shutdown
on/thermal prewarning
reset
Tj switch on/
TjPW reset
1.05
1.2
B
4
4.1
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
Tj switch on
135
160
185
°C
B
K
B
15
Output Specification (OUT1-OUT3)
On resistance
4.2
IOut 1-3 H = –1.3A
IOut 1-3 L = 1.3A
4, 13,
14
RDSOn1-3H
1.1
Ω
A
2, 3, 15
RDSOn1-3L
1.1
Ω
A
µA
A
4.3
High-side output
leakage current
VOut 1-3 H = 0V,
output stages off
4, 13,
14
IOut1-3H
4.4
Low-side output
leakage current
VOut 1-3 L = VVS,
output stages off
2, 3, 15
IOut1-3L
5
µA
A
4.5
High-side switch
reverse diode forward
voltage
IOut = 1.5A
4, 13,
14
VOut1-3 – VVS
1.5
V
A
4.6
Low-side switch reverse
IOut 1-3 L = –1.5A
diode forward voltage
2, 3, 15
VOut1-3L
–1.5
V
A
4.7
High-side overcurrent
limitation and shutdown
threshold
4, 13,
14
IOut1-3H
–2.5
–2
–1.5
A
A
4.8
Low-side overcurrent
limitation and shutdown
threshold
2, 3, 15
IOut1-3L
1.5
2
2.5
A
A
4.9
Overcurrent shutdown
delay time
tdSd
10
40
µs
A
4.10
High-side open load
detection current
Input register bit 13
(OLD) = low, output off
4, 13,
14
IOut1-3H
–2.5
–0.2
mA
A
4.11
Low-side open load
detection current
Input register bit 13
(OLD) = low, output off
2, 3, 15
IOut1-3L
0.2
2.5
mA
A
4.12
High-side output switch VVS = 13V
on delay(1),(2)
RLoad = 30Ω
tdon
20
µs
A
4.13
Low-side output switch VVS = 13V
on delay(1),(2)
RLoad = 30Ω
tdon
20
µs
A
4.14
High-side output switch VVS =13V
off delay(1),(2)
RLoad = 30Ω
tdoff
20
µs
A
–5
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1. Delay time between rising edge of input signal at pin CS after data transmission and switch on/off output stages to 90% of
final level. Device not in standby for t > 1 ms.
2. Delay time between rising/falling edge of input signal at pin PWM and switch on/off output stages to 90% of final level.
3. Difference between switch-on and switch-off delay time of input signal at pin PWM to output stages in PWM mode.
9
4531G–BCD–07/09
8. Electrical Characteristics (Continued)
7.5V < VS < 40V; 4.75V < VCC < 5.25V; INH = High; -40° C < Tj < 150° C; unless otherwise specified, all values refer to GND pins.
No.
Parameters
4.15
Low-side output switch VVS =13V
off delay(1),(2)
RLoad = 30Ω
4.16
Dead time between
corresponding highand low-side switches
VVS =13V
RLoad = 30Ω
tdon – tdoff
4.17
ΔtdPWM
low-side switch(3)
VVS = 13V
RLoad = 30Ω
ΔtdPWM =
tdon – tdoff
4.18
ΔtdPWM
high-side switch(3)
VVS = 13V
RLoad = 30Ω
ΔtdPWM =
tdon – tdoff
3
0.3 ×
VVCC
5
Test Conditions
Pin
Symbol
Min.
tdoff
Typ.
Max.
Unit
Type*
3
µs
A
µs
A
20
µs
A
7
µs
A
V
A
0.7 ×
VVCC
V
A
1
Logic Inputs DI, CLK, CS, PWM
5.1
Input voltage low-level
threshold
5-8
VIL
5.2
Input voltage high-level
threshold
5-8
VIH
5.3
Hysteresis of input
voltage
5-8
ΔVI
50
700
mV
A
5.4
Pull-down current
Pins DI, CLK, PWM
VDI, VCLK, VPWM = VCC
6, 7, 8
IPD
10
65
µA
A
5.5
Pull-up current
Pin CS
VCS = 0V
5
IPU
–65
–10
µA
A
0.4
V
A
V
A
10
µA
A
100
µs
A
6
Serial Interface – Logic Output DO
6.1
Output-voltage low level IDOL = 2 mA
10
VDOL
6.2
Output-voltage high
level
IDOL = –2 mA
10
VDOH
VVCC –
0.7 V
6.3
Leakage current
(tri-state)
VCS = VCC
0V < VDO < VVCC
10
IDO
–10
7
7.1
Inhibit Input – Timing
Delay time from
standby to normal
operation
tdINH
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1. Delay time between rising edge of input signal at pin CS after data transmission and switch on/off output stages to 90% of
final level. Device not in standby for t > 1 ms.
2. Delay time between rising/falling edge of input signal at pin PWM and switch on/off output stages to 90% of final level.
3. Difference between switch-on and switch-off delay time of input signal at pin PWM to output stages in PWM mode.
10
ATA6829
4531G–BCD–07/09
ATA6829
9. Serial Interface – Timing
Pin
Timing Chart No.(1)
Symbol
DO enable after CS
CDO = 100 pF
falling edge
10
1
8.2
DO disable after CS
CDO = 100 pF
rising edge
10
8.3
DO fall time
CDO = 100 pF
10
8.4
DO rise time
CDO = 100 pF
10
8.5
DO valid time
CDO = 100 pF
10
8.6
CS setup time
5
4
tCSSethl
8.7
CS setup time
5
8
8.8
CS high time
5
8.9
CLK high time
7
8.10 CLK low time
No.
Parameters
8.1
Test Conditions
Min.
Typ.
Max.
Unit
Type*
tENDO
200
ns
D
2
tDISDO
200
ns
D
-
tDOf
100
ns
D
-
tDOr
100
ns
D
10
tDOVal
200
ns
D
225
ns
D
tCSSetlh
225
ns
D
9
tCSh
500
ns
D
5
tCLKh
225
ns
D
7
6
tCLKl
225
ns
D
8.11 CLK period time
7
-
tCLKp
500
ns
D
8.12 CLK setup time
7
7
tCLKSethl
225
ns
D
8.13 CLK setup time
7
3
tCLKSetlh
225
ns
D
8.14 DI setup time
6
11
tDIset
40
ns
D
8.15 DI hold time
6
12
tDIHold
40
ns
D
*) Type means: A =100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note:
1. See Figure 9-1 on page 12
11
4531G–BCD–07/09
Figure 9-1.
Serial Interface Timing with Chart Number
1
2
CS
DO
9
CS
4
7
CLK
5
3
6
8
DI
11
CLK
10
12
DO
Inputs DI, CLK, CS: High level = 0.7 x VCC, low level = 0.3 x VCC
Output DO: High level = 0.8 x VCC, low level = 0.2 x VCC
12
ATA6829
4531G–BCD–07/09
ATA6829
10. Application Circuit
VCC
U5021M
M
M
OUT3H
Trigger
Reset
Watchdog
OUT2H
4
OUT1H
14
13
Charge
VS
pump
Fault
detect
Fault
detect
Fault
detect
12
6
DI
VBatt
VS
0 to 40 V
+
Microcontroller
7
CLK
S
I
O
C
S
O
L
D
P
H
3
P
L
3
P
H
2
P
L
2
P
H
1
H
S
3
P
L
1
L
S
3
H
S
2
L
S
2
H
S
1
L
S
1
S
R
R
Control
Input register
Serial interface
Output register
5
logic
Power-on
reset
CS
I
N
H
n.
u.
O
V
L
n.
u.
n. n.
u. u.
n.
u.
n.
u.
H
S
3
L
S
3
H
S
2
L
S
2
H
S
1
VCC
11
VCC
5V
L T
S P
1
+
P
S
F
UV protection
10
DO
16
PWM
8
Fault
detect
Fault
detect
Thermal
protection
Fault
detect
9
1
15
3
OUT3L
OUT2L
GND
GND
GND
2
OUT1L
VCC
10.1
Application Notes
It is strongly recommended to connect the blocking capacitors at VCC and VS as close as possible to the power supply and GND pins.
Recommended value for capacitors at VS:
Electrolytic capacitor C > 22 µF in parallel with a ceramic capacitor C = 100 nF. Value for electrolytic capacitor depends on external loads, conducted interferences and reverse conducting
current IOut1,2,3 (see “Absolute Maximum Ratings” on page 7).
Recommended value for capacitors at VCC:
Electrolytic capacitor C > 10 µF in parallel with a ceramic capacitor C = 100 nF.
To reduce thermal resistance it is recommended to place cooling areas on the PCB as close as
possible to the GND pins. Negative spikes at the output pins (e.g. negative spikes caused by an
inductive load switched off with a high side driver) may activate the overtemperature protection
function of the ATA6829. In this condition, the affected output will be switched off. If this behavior
is not acceptable or compatible with the specific application functionally, it is necessary, that for
switching on required outputs again, the SRR bit (Status Register Reset) is set, to ensure a reset
of the overtemperature function.
13
4531G–BCD–07/09
11. Ordering Information
Extended Type Number
Package
ATA6829-T3QY
PSO16
Remarks
Power package with heat slug, taped and reeled, lead-free
12. Package Information
1
heat slug exposed
8
∅ 0.4 A B
9
16
2.54-0.5
Package: PSO16
with heat slug
Dimensions in mm
6.86
technical drawings
according to DIN
specifications
A
0.41
1.27 nom.
1.52 max.
0.1 max.
0.23
1.62 max.
9.9±0.1
3.99 max.
B
4.27±0.4
6±0.2
7 x 1.27 = 8.89 nom.
Drawing-No.: 6.541-5050.01-4
Issue: 2; 18.08.05
14
ATA6829
4531G–BCD–07/09
ATA6829
13. Revision History
Please note that the following page numbers referred to in this section refer to the specific revision
mentioned, not to this document.
Revision No.
History
4531G-BCD-07/09
• Complete datasheet: T6819 deleted
4531F-BCD-09/05
• Complete datasheet: T6829 changed in ATA6829
• Ordering Information on page 14 changed
• Package drawing on page 15 changed
15
4531G–BCD–07/09
Headquarters
International
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Atmel Asia
Unit 1-5 & 16, 19/F
BEA Tower, Millennium City 5
418 Kwun Tong Road
Kwun Tong, Kowloon
Hong Kong
Tel: (852) 2245-6100
Fax: (852) 2722-1369
Atmel Europe
Le Krebs
8, Rue Jean-Pierre Timbaud
BP 309
78054
Saint-Quentin-en-Yvelines Cedex
France
Tel: (33) 1-30-60-70-00
Fax: (33) 1-30-60-71-11
Atmel Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Technical Support
[email protected]
Sales Contact
www.atmel.com/contacts
Product Contact
Web Site
www.atmel.com
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY
WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF
THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no
representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications
and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided
otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use
as components in applications intended to support or sustain life.
© 2009 Atmel Corporation. All rights reserved. Atmel®, logo and combinations thereof, and others are registered trademarks or trademarks of
Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
4531G–BCD–07/09