Material Content Data Sheet Sales Product Name TLE7240SL Issued MA# MA000920372 Package PG-SSOP-24-7 5. December 2014 Weight* 147.00 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 4.342 2.95 0.016 0.01 0.062 0.04 424 1.245 0.85 8472 50.568 34.40 35.30 344005 353007 0.780 0.53 0.53 5307 5307 0.172 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.95 29540 29540 106 1172 7.925 5.39 78.042 53.09 58.60 530905 585988 1.680 1.14 1.14 11427 11427 0.365 0.25 0.25 2485 2485 0.396 0.27 1.404 0.96 53911 2694 1.23 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 9552 12246 1000000