TI1 LP5522 Programmable led driver Datasheet

LP5522
www.ti.com
SNVS488 – JUNE 2007
Programmable LED Driver
Check for Samples: LP5522
FEATURES
•
•
•
1
•
2
•
•
Programmable blinking sequence
– 1 to 3 programmable pulses
– 1 ms to 255 ms LED on time
– 10 ms to 2500 ms LED off time
– Single or continuous run of programmed
blinking sequence
Constant current high side output driver
Adjustable current with external resistor
0.2 uA typical shutdown current
Autonomous operation without external clock
Micro SMD-6 package with 0.4 mm pitch:
– 1.215 mm x 0.815 mm x 0.6 mm (LxWxH)
APPLICATIONS
•
•
•
Indicator lights
Phone cosmetics
Toys
DESCRIPTION
The LP5522 is a simple single wire programmable LED controller in six bump micro SMD package. It provides
constant current flow through high side driver. Output current can be set from 1 mA to 20 mA by using an
external resistor on the ISET pin. If no external resistor is used, output current is set to 5 mA default current. The
LP5522 is controlled using only one signal. The signal controls either directly the LED driver or it launches
previously programmed blinking sequence.
The LP5522 works autonomously without a clock signal from the master device. Very low LED driver headroom
voltage makes possible to use supply voltages close to LED forward voltage. Current consumption of the LP5522
is minimized when LED is turned off and once controller is disabled all supporting functions are also shut down.
Very small micro SMD package together with minimum number of external components is a best fit for handheld
devices.
Typical Application
VIN
VDD
ISET
+
-
LP5522
LED
CTRL
GND
GNDT
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
LP5522
SNVS488 – JUNE 2007
www.ti.com
Connection Diagrams and Package Mark Information
Connection Diagram
Figure 1. Micro SMD-6 package, 0.815 x 1.215 x 0.60 mm body size, 0.4 mm pitch
2
LED
GND
GNDT
1
VDD
ISET
CTRL
A
B
C
Figure 2. Top View
Figure 3. Micro SMD-6 package, 0.815 x 1.215 x 0.60 mm body size, 0.4 mm pitch
GNDT
GND
LED
2
CTRL
ISET
VDD
1
C
B
A
Figure 4. Bottom View
PACKAGE MARK
X
V
6
X = 1 Digit Date Code
V = Die Traceability
6 = Product Identification
= Pin A1
PIN DESCRIPTIONS
Pin
Name
Type
A1
VDD
P
Power supply pin
Description
B1
ISET
AI
Current set input
C1
CTRL
DI
Digital control input
A2
LED
AO
Current source output
B2
GND
G
Ground
C2
GNDT
G
Ground
A: Analog Pin, D: Digital Pin, G: Ground Pin, P: Power Pin, I: Input Pin, O: Output Pin
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Links: LP5522
LP5522
www.ti.com
SNVS488 – JUNE 2007
Absolute Maximum Ratings
(1) (2)
V (VDD, LED, ISET)
-0.3V to +6.0V
Voltage on logic pin (CTRL)
Continuous Power Dissipation
-0.3V to VDD +0.3V
with 6.0V max
(3)
Internally Limited
Junction Temperature (TJ-MAX)
125°C
Storage Temperature Range
-65°C to +150°C
Maximum Lead Temperature (Reflow soldering, 3 times)
260°C
(4)
ESD Rating (5)
Human Body Model
(1)
(2)
(3)
(4)
(5)
2 kV
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
All voltages are with respect to the potential at the GND pins.
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=160°C (typ.) and
disengages at TJ=140°C (typ.).
For detailed soldering specifications and information, please refer to National Semiconductor Application Note AN1112 : Micro SMD
Wafer Level Chip Scale Package.
The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. MIL-STD-883 3015.7
Operating Ratings
(1) (2)
Voltage on power pin (VDD)
2.7V to 5.5V
Recommended Load Current
1 mA to 20 mA
Junction Temperature (TJ) Range
Ambient Temperature (TA) Range
(1)
(2)
(3)
-30°C to +125°C
(3)
-30°C to +85°C
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
All voltages are with respect to the potential at the GND pins.
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
Thermal Properties
Junction-to-Ambient Thermal Resistance (θJA),
TMD06 Package (1)
(1)
87°C/W
.Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Links: LP5522
3
LP5522
SNVS488 – JUNE 2007
www.ti.com
Electrical Characteristics
(1) (2)
Limits in standard typeface are for TJ = 25°C. Limits in boldface type apply over the operating ambient temperature range (30°C < TA < +85°C). Unless otherwise noted, specifications apply to the LP5522 Block Diagram with: VIN = 3.6V, RISET = 24
kΩ, CIN = 100 nF.
Symbol
IVDD
Typ
Max
Units
Standby supply current
Parameter
CTRL = L
Condition
0.2
1
µA
Active Mode Supply Current
CTRL = H, LED = off
40
55
µA
5
ILEAKAGE
LED Pin Leakage Current
IOUT
LED Output Current
Without external resistor
LED Output Current
With external 24kΩ 0.04% resistor
Min
1
µA
+8
mA
%
+8
mA
%
35
50
mV
−8
20
−8
IMIRROR
External RISET
Mirroring Ratio
1:400
VISET
ISET Reference Voltage
VHR
Minimum Headroom Voltage
(VIN - VLED) (3)
70
100
mV
T_CYCLE_H
Minimum LED On Time
0.9
1.0
1.1
ms
T_CYCLE_L
Minimum LED Off Time
9
10
11
ms
ONRESOLUTION
LED On Time Resolution
1
ms
OFFRESOLUTIO
LED Off Time Resolution
10
ms
1.23
IOUT set to 10 mA
IOUT set to 20 mA
V
N
T_Timeout_H
LED Timeout On Time
287
319
351
ms
T_Timeout_L
LED Timeout Off Time
2.87
3.19
3.51
s
VIL
Logic Input Low Level
0.5
V
VIH
Logic Input High Level
1.2
IIN
CTRL Input Current
-1
1
µA
tON
CTRL Pulse ON Time
15
µs
tOFF
CTRL Pulse OFF Time
30
µs
tENTER
Command Entering Period
500
tENTER+tBLANK
Command Entering Period +
Blank Period
(1)
(2)
(3)
4
V
µs
1500
µs
All voltages are with respect to the potential at the GND pins.
Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the
most likely norm.
The current source is connected internally between VIN an VLED. The voltage across the current source, (VIN - VLED), is referred to a
headroom voltage (VHR). Minimum headroom voltage is defined as the VHR voltage when the LED current has dropped 10% from the
value measured at VLED = VIN - 1V.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Links: LP5522
LP5522
www.ti.com
SNVS488 – JUNE 2007
LP5522 Block Diagram
Modes of Operation
POR
RESET
POR = H
POR = L
STANDBY
Control command
Control command
ends
ACTIVE
RESET In the reset mode all functions are off and all registers are reset to the default values. Reset is entered
always if internal Power On Reset (POR) is active. Power On Reset will activate during the device startup
or when the supply voltage VIN falls below 1.5V (typ.).
STANDBY: After Power On Reset device is in Standby mode. This is the low power consumption mode, when
all circuit functions are disabled.
ACTIVE: Once rising edge of CTRL signal is detected device goes into Active mode. In Active mode four sub
modes are present:
RUN: Run mode is divided into two sub modes depending on whether a blinking sequence is programmed into
memory or not.
Non-programmed mode: No blinking sequence programmed to memory. LED output follows CTRL input
Programmed mode: Blinking sequence programmed to memory. LED output follows the programmed blinking
sequence
RUN ONCE: In Run once mode, programmed blinking sequence is performed once and after that device
returns into Standby mode. Run once mode is available only if a blinking sequence is programmed into
memory.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Links: LP5522
5
LP5522
SNVS488 – JUNE 2007
www.ti.com
TRAINING: In Training mode new blinking sequence can be programmed. LED output follows CTRL signal
during the programming
TSD: If chip temperature rises above 160°C (typ.) device goes into Thermal Shut Down (TSD) mode. In TSD
mode output is disabled but supporting functions are on.
LED Driver Operational Description
The LP5522 LED driver is constant current source. Current can be set with external resistor (RISET) so that the
current ratio between resistor and LED is 1:400. RISET current correlates to ISET reference voltage (VISET).
Consequently, current through LED can be adjusted using equation IOUT = 480/RISET.
Use of external resistor is optional. If external resistor is not connected, default output current is 5 mA. When
external resistor is not used ISET pin should be connected to VDD.
6
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Links: LP5522
LP5522
www.ti.com
SNVS488 – JUNE 2007
LED Driver Typical Performance Characteristics
TJ = 25°C. Unless otherwise noted, typical performance characteristics apply to the LP5522 Block Diagram with: VIN = 3.6V,
RISET = 24 kΩ, CIN = 100 nF.
Output Current vs RISET (Expanded Range)
Output Current vs RISET
Output Current vs Input Voltage
(ISET Connected To VDD)
Output Current vs Headroom Voltage
Line Regulation
LED Startup
Control Interface Operational Description
LP5522 has one digital control input, CTRL. Threshold levels of CTRL input are fixed to enable control from low
voltage controller. CTRL signal is used to control the mode of the circuit. A rising edge of the CTRL signal
activates the circuit and starts a command entering period. During the command entering period all rising edges
are counted. After command entering period there is a blank period when no rising edges are allowed. If CTRL is
left high after command entering period, the consequent command is performed right after the blank period.
Note that timing diagrams are not on scale!
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Links: LP5522
7
LP5522
SNVS488 – JUNE 2007
www.ti.com
CTRL
LED
Command entering period
Blank period
Command execution
starts
If CTRL signal is low after command entering period, command execution starts when CTRL is pulled high. This
does not apply to Run command. With Run command CTRL must be high. Note that no rising edges are allowed
during blank period.
CTRL
LED
Command entering period
Command execution
starts
Blank period
LED Controller Commands and Operation
There are four commands available for LP5522.
Command
Number of rising edges during command entering period
Run
One rising edge
Training start
Two rising edges
Training end
Three rising edges
Run once
Four rising edges
RUN COMMAND
One rising edge of CTRL signal within command entering period is interpreted as Run command. In programmed
mode blinking sequence is started right after Blank period and it is repeated as long as CTRL signal is kept high.
When CTRL signal is set low device goes into Standby mode.
CTRL
To Standby
LED
Command entering
period
Blank period
Programmed sequence
In non-programmed mode LED is on as long as CTRL is kept high. When CTRL signal is set low device goes
into Standby mode.
8
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Links: LP5522
LP5522
www.ti.com
SNVS488 – JUNE 2007
CTRL
To Standby
LED
Command entering
period
Blank period
RUN ONCE COMMAND
Programmed blinking sequence is performed once after Run Once command. Four rising edges of CTRL signal
within command entering period is interpreted as Run Once command. If CTRL is kept high after command
entering period the programmed blinking sequence starts right after the blank period has elapsed. CTRL signal
must stay high as long as programmed blinking sequence is executed. If CTRL is set low during execution of
blinking sequence, device goes to standby and execution of blinking sequence is stopped.
CTRL
To Standby
Programmed sequence
LED
Command entering
period
Blank period
If CTRL signal is low after command entering period, Run Once command is executed once the CTRL is set
high.
CTRL
To Standby
Programmed sequence
LED
Command entering
period
Blank period
TRAINING START COMMAND
Blinking sequence is programmed into memory in training mode. Blinking sequence is stored into volatile
memory, thus removing input voltage VIN resets the memory. Memory can also be reset by giving Training Start
and Training End commands without any valid LED ON/OFF times.
LP5522 enters to Training mode after Training Start command. Two rising edges within command entering
period is interpreted as the Training Start command. The first LED ON time capturing is started once the rising
edge of CTRL signal is detected after the blank period. LED output follows CTRL signal during the programming.
The first LED ON time is recorded once CTRL signal is set low. Same time the first LED OFF time capturing is
started. Programmed blinking sequence can have one to three LED ON/OFF times. In order to be programmed
correctly, at least one valid LED ON and LED OFF time must be recorded.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Links: LP5522
9
LP5522
SNVS488 – JUNE 2007
www.ti.com
CTRL
LED
Command entering
period
Blank period
1st ON Time
1st OFF Time
starts
TRAINING END COMMAND
Blinking sequence programming ends once Training End command is introduced. Three rising edges within time
period of tENTER is interpreted as Training End command. Note that blank period is also reguired after Training
End command. During blanc period no rising edges are allowed.
When Training End command is introduced during LED OFF time capturing, LED OFF time is recorded and chip
goes to standby mode.
To Standby
CTRL
LED
1st ON time
1st OFF time
2nd ON
time
2nd OFF
time
tENTER
Blank period
If Training End command is introduced during LED ON time capturing, the associated LED ON period is not
recorded and hence neither OFF time. Notice that valid OFF time before Training End is longer than half of
Minimum LED OFF period (T_CYCLE_L).
To Standby
CTRL
LED
1st ON time
1st OFF time
2nd ON
time
tENTER
Blank period
t < ½*T_CYCLE_L
LED TIMEOUT ON/OFF TIMES
When LP5522 is in training mode and CTRL signal is high longer than LED Timeout ON time, the ON time
counter saturates. In this case saturated ON time is recorded and LED OFF time capturing is started. At the
same time LED is switched off even if the CTRL signal is still high.
If ON time counter has saturated, LED OFF time recording is terminated either by giving a Train End command
or setting the CTRL signal to low and back to high. Setting the CTRL signal back to high records the LED OFF
time and starts next ON time capturing.
If anyhow CTRL is still high after the LED Timeout OFF time has been elapsed the OFF time counter saturates
and saturated OFF time is recorded. After that chip waits the CTRL signal to go low which cause the chip to go
Standby.
10
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Links: LP5522
LP5522
www.ti.com
SNVS488 – JUNE 2007
To Standby
Run command
CTRL
LED
tENTER + tBLANK
T_TIMEOUT_H T_TIMEOUT_L
LED OFF time counter can saturate also if Training end command is not given or no new ON time has been
started. In this case saturated OFF time is recorded and chip goes to Standby.
To Standby
Run once command
To Standby
CTRL
LED
tENTER + tBLANK
T_TIMEOUT_L
Recommended External Components
INPUT CAPACITOR, CIN
Although not required for normal operation, a capacitor can be added to VIN to reduce line noise. A surfacemount multi-layer ceramic capacitor (MLCC) is recommended. MLCCs with a X7R or X5R temperature
characteristic are preferred.
CURRENT SET RESISTOR, RISET
If other than 5 mA current is required, RISET resistor can be used to adjust the current. For 20 mA current 24 kΩ
resistor is required. Accuracy of the resistor directly effects to the accuracy of the LED current. 1% or better is
recommended.
LED
Forward voltage of LED must be less than minimum input voltage minus minimum headroom voltage (VHR). For
example with 2.7V input voltage and 20 mA LED current the maximum LED forward voltage is 2.7V - 100 mV =
2.6V.
List of Recommended External Components
Symbol
Symbol Explanation
Value
Unit
Type
CIN
VDD Bypass Capacitor
100
nF
Ceramic, X7R or X5R
RISET
Current Set Resistor for 20 mA LED Current
24
kΩ
1%
LED
User defined
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Links: LP5522
11
PACKAGE OPTION ADDENDUM
www.ti.com
17-Nov-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Samples
(3)
(Requires Login)
LP5522TM/NOPB
ACTIVE
DSBGA
YFQ
6
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
LP5522TMX/NOPB
ACTIVE
DSBGA
YFQ
6
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Nov-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LP5522TM/NOPB
DSBGA
YFQ
6
250
178.0
8.4
LP5522TMX/NOPB
DSBGA
YFQ
6
3000
178.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.04
1.4
0.76
4.0
8.0
Q1
1.04
1.4
0.76
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Nov-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP5522TM/NOPB
DSBGA
YFQ
LP5522TMX/NOPB
DSBGA
YFQ
6
250
203.0
190.0
41.0
6
3000
206.0
191.0
90.0
Pack Materials-Page 2
MECHANICAL DATA
YFQ0006xxx
TMD06XXX (Rev B)
D: Max = 1.26 mm, Min = 1.16 mm
E: Max = 0.86 mm, Min = 0.76 mm
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
LP5522TMEV