Product Folder Sample & Buy Tools & Software Technical Documents Support & Community LT1013-DIE SLOS881 – JULY 2014 LT1013-DIE Dual Precision Operational Amplifier 1 Features 2 Applications • • • • • • • 1 • • • Single-Supply Operation – Input Voltage Range Extends to Ground – Output Swings to Ground While Sinking Current Low Supply Current Low Peak-to-Peak Noise Voltage Low Current Noise Battery-Powered Precision Instrumentation Instrumentation Amplifiers Thermocouple Amplifiers Multiple-Limit Threshold Detection Active Filters Multiple Gain Blocks 3 Description The LT1013-DIE is a dual precision operational amplifier, featuring high gain, low supply current, low noise, and low-offset-voltage temperature coefficient. Device Information (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE LT1013 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY LT1013TDJ1 100 LT1013TDJ2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LT1013-DIE SLOS881 – JULY 2014 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4 Bare Die Information 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 15 mils Silicon with backgrind Floating TiW/AlCu2% 1627 nm Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated LT1013-DIE www.ti.com SLOS881 – JULY 2014 Bond Pad Coordinates in Microns DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX 1OUT 1 895.35 1699.26 994.41 1798.32 N/C 2 711.2 1779.27 786.13 1854.2 N/C 3 287.528 1655.826 362.458 1730.756 N/C 4 181.356 1655.826 256.286 1730.756 N/C 5 75.184 1655.826 150.114 1730.756 N/C 6 55.118 1548.892 130.048 1623.822 1IN– 7 35.56 1385.57 134.62 1484.63 1IN+ 8 35.56 560.07 134.62 659.13 N/C 9 1079.5 547.37 1178.56 646.43 VCC– 10 1079.5 30.48 1178.56 129.54 2IN+ 11 2123.44 560.07 2222.5 659.13 2IN- 12 2123.44 1385.57 2222.5 1484.63 N/C 13 2128.012 1548.892 2202.942 1623.822 N/C 14 2001.774 1655.826 2076.704 1730.756 N/C 15 2107.946 1655.826 2182.876 1730.756 N/C 16 1895.602 1655.826 1970.532 1730.756 N/C 17 1471.93 1779.27 1546.86 1854.2 2OUT 18 1263.65 1699.26 1362.71 1798.32 VCC+ 19 1079.5 1818.64 1178.56 1917.7 Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 3 PACKAGE OPTION ADDENDUM www.ti.com 13-Jul-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LT1013TDJ1 ACTIVE 8 100 TBD Call TI N / A for Pkg Type 25 Only LT1013TDJ2 ACTIVE 0 10 TBD Call TI N / A for Pkg Type 25 Only (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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