OMAP5912 Applications Processor Data Manual Literature Number: SPRS231E December 2003 − Revised December 2005 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. This page intentionally left blank Revision History REVISION HISTORY This data sheet revision history highlights the technical changes made to SPRS231D to generate SPRS231E. Scope: Added 289-ball GDY package. Added Section 4.2, Differences Between Production and Experimental Devices. Updated parametric values, added Section 5.7.1.1, updated timing diagrams, etc. PAGE(S) NO. ADDITIONS/CHANGES/DELETIONS Global: − added 289-ball GDY package 23 Section 2.1.1.1, DSP Tools Support: − removed “Visual Linker” from list of Code Composer Studio code generation tools 26 Table 2−1, ZDY/GDY Package Terminal Assignments: − M17: changed “GPIO4(0) / MCBSP3.FSX(2) / TIMER.EVENT4(3) / SPIF.DIN(4)” to “GPIO4(0) / SPI.CS2(1) / MCBSP3.FSX(2) / TIMER.EVENT4(3) / SPIF.DIN(4)” − T15: changed “Reserved” to “TDO” − added “For special consideration with respect to the connection of the VSS pin (ZDY/GDY ball H8), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock.” footnote 33 Table 2−2, ZZG Package Terminal Assignments: − P20: changed “GPIO4(0) / MCBSP3.FSX(2) / TIMER.EVENT4(3) / SPIF.DIN(4)” to “GPIO4(0) / SPI.CS2(1) / MCBSP3.FSX(2) / TIMER.EVENT4(3) / SPIF.DIN(4)” − AA19: changed “Reserved” to “TDO” − added “For special consideration with respect to the connection of the VSS pin (ZZG ball Y13), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock.” footnote 40 Table 2−3, ZDY/GDY Package Terminal Characteristics: − SDRAM.A[13:0]: transposed ball numbers C8 and D9 − E15: updated MUX CTRL SETTING column − H14: updated SUPPLY column − K17: updated MUX CTRL SETTING column − K13: added row for RTDX.D[3] − L15: added row for RTDX.D[2] − L14: changed “MCBSP3.ESX” to “MCBSP3.FSX” − M17: added row for SPIF.DIN − M16: added row for RTDX.D[0] − added row for TDO signal (Ball T15) − U15: updated MUX CTRL SETTING column − M8: updated MUX CTRL SETTING column − T1: updated MUX CTRL SETTING column − G3: updated RESET STATE column − J8: updated MUX CTRL SETTING column − J5: updated PULLUP/PULLDN column − added “Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1.” footnote − added “Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1.” footnote December 2003 − Revised December 2005 SPRS231E 3 Revision History PAGE(S) NO. 4 ADDITIONS/CHANGES/DELETIONS 61 Table 2−4, ZZG Package Terminal Characteristics: − E18: updated MUX CTRL SETTING column − J20: updated SUPPLY column − M18: updated MUX CTRL SETTING column − N20: added row for RTDX.D[3] − M15: added row for RTDX.D[2] − P19: changed “MCBSP3.ESX” to “MCBSP3.FSX” − P20: added row for SPIF.DIN − M14: added row for RTDX.D[0] − added row for TDO signal (Ball AA19) − P14: updated MUX CTRL SETTING column − V11: updated MUX CTRL SETTING column − Y1: updated MUX CTRL SETTING column − K8: updated RESET STATE column − M4: updated MUX CTRL SETTING column − M7: updated PULLUP/PULLDN column − added “Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1.” footnote − added “Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1.” footnote 81 Table 2−5, Signal Descriptions: − CAMERA INTERFACE section: added CAM.EXCLK signal − TDO signal: added Ball T15 for ZDY/GDY package added Ball AA19 for ZZG package − MPU_BOOT signal: updated DESCRIPTION − added “GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3.” footnote 100 Figure 3−1, OMAP5912 Functional Block Diagram: − moved Camera I/F from the block on the right to the left under the memory interface traffic controller block 104 Section 3.2.1, MPU Global Memory Map: − updated “CS1 and CS2 can be split by software to provide ...” NOTE 135 Table 3−29, McBSP2 Registers: − added DSP WORD ADDRESS column 138 Table 3−35, I2C1 Registers: − added DSP WORD ADDRESS column 140 Table 3−38, MMC/SDIO2 Registers: − added DSP WORD ADDRESS column 142 Table 3−40, MPU GPIO3 Registers: − added DSP WORD ADDRESS column 143 Table 3−41, MPU GPIO4 Registers: − added DSP WORD ADDRESS column 148 Table 3−47, McBSP1 Registers: − updated addresses of MCBSP1_RCERB through MCBSP1_REV registers 151 Table 3−50, McBSP3 Registers: − updated addresses of MCBSP1_RCERB through MCBSP3_REV registers 153 Table 3−51: − changed title from “MPU UART TIPB Bus Switch Registers” to “MPU TIPB Bus Switch Registers” SPRS231E December 2003 − Revised December 2005 Revision History PAGE(S) NO. ADDITIONS/CHANGES/DELETIONS 163 Table 3−70, DSP DMA Controller Registers: − updated address of DSP_DMA_CDFI1 (Channel 1 Destination Frame Index) − updated address of DSP_DMA_CDEI1 (Channel 1 Destination Element Index) − updated address of DSP_DMA_CDFI2 (Channel 2 Destination Frame Index) − updated address of DSP_DMA_CDEI2 (Channel 2 Destination Element Index) − updated address of DSP_DMA_CDFI3 (Channel 3 Destination Frame Index) − updated address of DSP_DMA_CDEI3 (Channel 3 Destination Element Index) − updated address of DSP_DMA_CDFI4 (Channel 4 Destination Frame Index) − updated address of DSP_DMA_CDEI4 (Channel 4 Destination Element Index) − updated address of DSP_DMA_CDFI5 (Channel 5 Destination Frame Index) − updated address of DSP_DMA_CDEI5 (Channel 5 Destination Element Index) 167 Table 3−77, DSP Level 2.1 Interrupt Handler Registers: − updated addresses of DSP_L21_SIR_IRQ_CODE through DSP_L21_ILR15 registers − removed DSP_L21_ISR (Software Interrupt Set Register) from 0x00 4C0Ah 168 Table 3−78, DSP TIPB Bridge Configuration Register: − 0x00 0000: − changed REGISTER NAME from DSP_ID to DSP_CMR − changed DESCRIPTION from “Identification Register” to “DSP Control Mode Register” − removed all the registers from 0x00 0002 to 0x00 006E 168 Table 3−79, DSP EMIF Configuration Registers: − 0x00 0800 (DSP_EMIF_CNTL): changed RESET VALUE from 002xh to 0000h − 0x00 0801: changed from Reserved to DSP_EMIF_GRR (DSP EMIF Global Reset Register) − removed all the registers from 0x00 0802 to 0x00 0814 170 Section 3.4, DSP External Memory (Managed by MMU): − updated “When the DSP MMU is on, ...” paragraph 170 Figure 3−2, DSP MMU Off: − DSP Memory: changed “0x05 0000” to “0x02 8000” 171 Figure 3−3, DSP MMU On: − DSP Memory: changed “0x05 0000” to “0x02 8000” 176 Updated Section 3.6.6, Pulse-Width Light (PWL) 176 Updated Section 3.6.8, HDQ/1-Wire Interface 177 Section 3.6.10, MPUIO Interface: − updated “The MPUIO feature allows communication ...” paragraph 180 Section 3.7.2, Multichannel Serial Interfaces (MCSI1 and 2): − changed “Programmable interrupt occurrence time (TX and RX)” to “Programmable interrupt condition (TX and RX)” 181 Section 3.8.2, General-Purpose Timers: − changed “Interrupts generated on overflow, compare, and capture” to “Interrupts generated on overflow and compare” 182 Section 3.8.3, Serial Port Interface (SPI): − updated “The serial port interface is a bidirectional ...” paragraph 182 Updated Section 3.8.4, Universal Asynchronous Receiver/Transmitter (UART) 184 Updated Section 3.8.5, I2C Master/Slave Interface 185 Section 3.8.7, Multimedia Card/Secure Digital (MMC/SDIO2) Interface: − changed “OMAP5912 also support control signals ...” bullet item to “The MMC2 provides auxiliary signals for external level shifters ...” December 2003 − Revised December 2005 SPRS231E 5 Revision History PAGE(S) NO. 6 ADDITIONS/CHANGES/DELETIONS 186 Section 3.8.9, 32-kHz Synchro Counter: − changed “This is a 32-bit ordinary counter, ...” to “This is a 32-bit simple counter, ...” 187 Section 3.9, System DMA Controller: − changed “Software enabling” to “Software triggering” − changed “Hardware enabling” to “Hardware triggering” 189 Updated Section 3.12.1, MPU/DSP Mailbox Registers 190 Section 3.12.3, MPU/DSP Shared Memory: − updated “The OMAP5912 implements a shared memory architecture via the traffic controller ...” paragraph 191 Section 3.14.1, Core and I/O Voltage Supply Connections: − updated “The OMAP5912 device is ...” paragraph 191 Figure 3−4, Supply Connections for a Typical System: − updated footnote 193 Section 4.1, Device and Development-Support Tool Nomenclature: − under “Device development evolutionary flow”, changed “X or P” to “X” 194 Added Section 4.2, Differences Between Production and Experimental Devices 199 Section 5.3, Electrical Characteristics Over Recommended Operating Case Temperature Range (Unless Otherwise Noted): − added IDDC(Q) , IDDC(A) , IDDCP(A) , VDD4 − added footnotes 204 Section 5.5.2, Base Oscillator (12, 13, or 19.2 MHz) and Input Clock: − updated “The crystal must be in fundamental-mode operation ...” paragraph 205 Table 5−4: − changed title from “12-MHz to 19.2-MHz Input Clock Timing Requirements” to “12-MHz, 13-MHz, and 19.2-MHz Input Clock Timing Requirements” 206 Table 5−5, OMAP5912 Device Reset Timing Requirements: − added footnote about PWRON_RESET 208 Section 5.7.1, EMIFS/NOR Flash Interface Timing: − added “Section 5.7.1.1 provides information on and an example of how to calculate OMAP5912 EMIFS NOR Flash timings.” paragraph 208 Table 5−9, EMIFS/NOR Flash Interface Timing Requirements: − removed parameter F8 [tsu(RDYIV-OEH) , Setup time, FLASH.RDY high before FLASH.OE high] − changed “async modes” to “async page mode” on F21 and F22 SPRS231E December 2003 − Revised December 2005 Revision History PAGE(S) NO. ADDITIONS/CHANGES/DELETIONS 209 Table 5−10, EMIFS/NOR Flash Interface Switching Characteristics: − Added rows for F17 and F18 − F27: − updated symbol and description − changed MIN value from “H − 6.6” ns to “H − 3.29” ns − changed MAX value from “H + 3.29” ns to “H + 6.6” ns − F29: updated symbol and description − F30: updated symbol and description − F31: updated symbol and description − F40: updated symbol and description − F41: updated symbol and description − F42: updated symbol and description − F43: updated symbol and description − added “See Section 5.7.1.1 for information on and an example of how to calculate OMAP5912 EMIFS NOR Flash timings.” to second footnote 211 Added Section 5.7.1.1, EMIFS NOR Flash Timing Calculation Example 213 Table 5−11, Sample Timing Calculation of Table 5−9 Parametric Values Using Constraints Calculated Above: − changed “async modes” to “async page mode” on F21 and F22 214 Table 5−12, Sample Timing Calculation of Table 5−10 Parametric Values Using Constraints Calculated Above: − modified values for F13 and f15 − added rows for F17/F18 218 Figure 5−10, EMIFS/NOR Flash—Single Word Asynchronous Read, Full-Handshaking Mode Timing: − removed parameter F8 219 Figure 5−11, EMIFS/NOR Flash—Asynchronous 32-Bit Read Timing: − changed F13 to F17 − changed F15 to F18 220 Figure 5−13: − changed title from “EMIFS/NOR Flash—Single Word Asynchronous Write Timing” to “EMIFS/NOR Flash—Single Word Asynchronous Write Timing, Full-Handshaking Mode” − removed parameter F8 221 Figure 5−14: − changed title from “EMIFS/NOR Flash—Single Word Asynchronous Write, Full-Handshaking Mode” to “EMIFS/NOR Flash—Single Word Asynchronous Write” 224 Figure 5−18, EMIFS/Multiplexed NOR Flash—Single Word Asynchronous Read Timing: − changed F13 to F17 225 Figure 5−20, EMIFS/Multiplexed NOR Flash—Synchronous Burst Read Timing (Retiming Off): − changed F13 to F17 226 Table 5−14, EMIFS/NAND Flash Switching Characteristics: − NFE5: updated symbol 229 Table 5−15, EMIFF/SDR SDRAM Interface Timing Requirements: − added footnote about the CONF_VOLTAGE_SDRAM_R control bit December 2003 − Revised December 2005 SPRS231E 7 Revision History PAGE(S) NO. 8 ADDITIONS/CHANGES/DELETIONS 229 Table 5−16, EMIFF/SDR SDRAM Interface Switching Characteristics: − SD1 [tc(CLK) , DVDD4 = 1.8 V]: changed MIN value from P ns to 10.41 ns − SD1 [tc(CLK) , DVDD4 = 2.75 V/3.3 V]: changed MIN value from P ns to 10.41 ns − SD3 [td(CLKH–DQMV) , DVDD4 = 1.8 V]: changed MAX value from “1.20 + D” ns to 1.20 ns − SD3 [td(CLKH–DQMV) , DVDD4 = 2.75 V/3.3 V]: changed MAX value from “1.22 + D” ns to 1.22 ns − SD4 [td(CLKH–DQMIV) , DVDD4 = 1.8 V]: changed MIN value from “0 + D” ns to 0.23 ns − SD4 [td(CLKH–DQMIV) , DVDD4 = 2.75 V/3.3 V]: changed MIN value from “0 + D” ns to 0.30 ns − added footnote about the CONF_VOLTAGE_SDRAM_R control bit − revised “P = SDRAM.CLK period in nanoseconds” footnote − revised footnote about external delay element 230 Updated Figure 5−25, EMIFF/SDR Two SDRAM RD (Read) Commands (Active Row) 230 Updated Figure 5−26, EMIFF/SDR Two SDRAM WRT (Write) Commands (Active Row) 231 Updated Figure 5−27, EMIFF/SDR SDRAM ACTV (Activate Row) Command 231 Updated Figure 5−28, EMIFF/SDR SDRAM DCAB (Precharge/Deactivate Row) Command 232 Updated Figure 5−29, EMIFF/SDR SDRAM REFR (Refresh) Command 232 Updated Figure 5−30, EMIFF/SDR SDRAM MRS (Mode Register Set) Command 233 Table 5−17, EMIFF/Mobile DDR SDRAM Timing Requirements: − DD17 [tsu(DV-DQSL/H)]: changed MIN value from “0.76 − 0.2P” ns to −1.32 ns − DD18 [th(DQSL/H-DV)]: changed MIN value from “0.2P + 0.8” ns to 2.88 ns − removed “P = SDRAM.CLK period in nanoseconds” footnote − added “The control bit CONF_VOLTAGE_SDRAM_R of the register VOLTAGE_CTRL_0 must be set to 1 regardless of the DVDD4 voltage level.” footnote SPRS231E December 2003 − Revised December 2005 Revision History PAGE(S) NO. ADDITIONS/CHANGES/DELETIONS 233 Table 5−18, EMIFF/Mobile DDR SDRAM Switching Characteristics: − DD1 [tc(CLK)]: changed MIN value from P ns to 10.42 ns − removed parameter DD2 [tw(CLK) , Pulse duration, SDRAM.CLK/SDRAM.DDR-CLK] − DD3 [tosu(CLKH-CSL)]: changed MIN value from “0.5P − 3.21” ns to 2.00 ns − DD4 [toh(CLKH-CSH)]: changed MIN value from “0.5P − 3.21” ns to 2.00 ns − DD5 [tosu(CLKH-RASL)]: − changed MIN value from “0.5P − 3.21” ns to 2.00 ns − added MAX value of 5.21 ns − DD5A [tosu(CLKH-CASL)]: − changed MIN value from “0.5P − 3.21” ns to 2.00 ns − added MAX value of 5.40 ns − DD6 [toh(CLKH-RASH)]: − changed MIN value from “0.5P − 3.21” ns to 2.00 ns − added MAX value of 6.88 ns − DD6A [toh(CLKH-CASH)]: − changed MIN value from “0.5P − 3.21” ns to 2.00 ns − added MAX value of 8.83 ns − DD7 [tosu(CLKH-BAV)]: changed MIN value from “0.5P − 3.21” ns to 2.00 ns − DD8 [toh(CLKH-BAIV)]: changed MIN value from “0.5P − 3.21” ns to 2.00 ns − DD9 [tosu(CLKH-AV)]: changed MIN value from “0.5P − 3.71” ns to 1.50 ns − DD10 [toh(CLKH-AIV)]: changed MIN value from “0.5P − 3.71” ns to 1.50 ns − DD11 [tosu(CLKH-WEL)]: − changed MIN value from “0.5P − 3.21” ns to 2.00 ns − added MAX value of 5.37 ns − DD12 [toh(CLKH-WEH)]: − changed MIN value from “0.5P − 3.21” ns to 2.00 ns − added MAX value of 6.47 ns − DD13: − updated symbol − changed MIN value from “0.3P − 2.12” ns to 1.00 ns − DD14: − updated symbol and description − changed MIN value from “0.7P − 6.28” ns to 1.01 ns − removed “P = SDRAM.CLK period in nanoseconds” footnote − removed footnote about maximum EMIFF/SDRAM clock rate − added “The control bit CONF_VOLTAGE_SDRAM_R of the register VOLTAGE_CTRL_0 must be set to 1 regardless of the DVDD4 voltage level.” footnote − added footnote about DLL phase value − added footnote about delay time 234 Updated Figure 5−31, EMIFF/Mobile DDR SDRAM—Command and Address Output Timing Definition 234 Updated Figure 5−32, EMIFF/Mobile DDR SDRAM—Memory Read Timing 235 Updated Figure 5−33, EMIFF/Mobile DDR SDRAM—Memory Write Timing 247 Table 5−33, Camera Interface Timing Requirements: − C1 {1/[tc(LCLK)]}: changed MAX value from 48 MHz to 80 MHz − C9: changed symbol from tsu(LCLKH-DV) to tsu(DV-LCLKH) − C10: changed symbol from th(DV-LCLKH) to th(LCLKH-DV) − C11: changed symbol from tsu(LCLKH-DV) to tsu(CAM.VS/HS-LCLKH) − C12: changed symbol from th(DV-LCLKH) to th(LCLKH-CAM.VS/HS) 248 Table 5−34, LCD Controller and LCDCONV Switching Characteristics: − L5: changed symbol from td(CLK-HS) to td(CLK-VS) − L6: changed symbol from td(CLK-VS) to td(CLK-HS) December 2003 − Revised December 2005 SPRS231E 9 Revision History 10 SPRS231E December 2003 − Revised December 2005 Contents Contents Section Page 1 OMAP5912 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1.1 TMS320C55x DSP Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1.2 ARM926EJ-S RISC Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Terminal Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 Terminal Characteristics and Multiplexing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 22 23 24 24 40 81 3 Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Functional Block Diagram Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 MPU Memory Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.1 MPU Global Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.2 MPU Subsystem Registers Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 DSP Memory Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3.1 DSP Global Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3.2 On-Chip Dual-Access RAM (DARAM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3.3 On-Chip Single-Access RAM (SARAM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3.4 DSP I/O Space Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 DSP External Memory (Managed by MMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 MPU and DSP Private Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.1 Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.2 Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.3 Interrupt Handlers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.4 LCD Controller (MPU Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.5 LCDCONV (MPU Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.6 Random Number Generator (RNG) (MPU Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.7 DES/3DES (MPU Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5.8 SHA1/MD5 (MPU Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6 MPU Public Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.1 USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.2 Camera Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.3 MICROWIRE Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.4 Real-Time Clock (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.5 Pulse-Width Tone (PWT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.6 Pulse-Width Light (PWL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.7 Keyboard Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.8 HDQ/1-Wire Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.9 Multimedia Card/Secure Digital (MMC/SDIO1) Interface . . . . . . . . . . . . . . . . . . . . . . 3.6.10 MPUIO Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.11 LED Pulse Generators (LPG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.12 Frame Adjustment Counter (FAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6.13 Operating System (OS) Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 101 104 104 106 161 161 161 162 162 170 172 172 172 172 172 173 173 174 174 174 174 175 175 175 176 176 176 176 176 177 177 177 178 December 2003 − Revised December 2005 SPRS231E 11 Contents Section 3.7 Page DSP Public Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.7.1 Multichannel Buffered Serial Ports (McBSP1 and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . 3.7.2 Multichannel Serial Interfaces (MCSI1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Shared Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8.1 Mailbox Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8.2 General-Purpose Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8.3 Serial Port Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8.4 Universal Asynchronous Receiver/Transmitter (UART) . . . . . . . . . . . . . . . . . . . . . . . 3.8.5 I2C Master/Slave Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8.6 Multichannel Buffered Serial Port (McBSP2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8.7 Multimedia Card/Secure Digital (MMC/SDIO2) Interface . . . . . . . . . . . . . . . . . . . . . . 3.8.8 General-Purpose I/O (GPIO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8.9 32-kHz Synchro Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System DMA Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP DMA Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Traffic Controller (Memory Interfaces) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interprocessor Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.1 MPU/DSP Mailbox Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.2 MPU Interface (MPUI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.12.3 MPU/DSP Shared Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP Hardware Accelerators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.13.1 DCT/iDCT Accelerator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.13.2 Motion Estimation Accelerator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.13.3 Pixel Interpolation Accelerator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power Supply Connection Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.14.1 Core and I/O Voltage Supply Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.14.2 Core Voltage Noise Isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179 179 180 181 181 181 182 182 184 184 185 186 186 187 188 188 189 189 189 190 190 190 190 190 191 191 192 4 Documentation Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 Device and Development-Support Tool Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 Differences Between Production and Experimental Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193 193 194 5 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3 Electrical Characteristics Over Recommended Operating Case Temperature Range . . . . . . . 5.4 Timing Parameter Symbology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 Clock Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5.1 32-kHz Oscillator and Input Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5.2 Base Oscillator (12, 13, or 19.2 MHz) and Input Clock . . . . . . . . . . . . . . . . . . . . . . . . 5.6 Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.6.1 OMAP5912 Device Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.6.2 OMAP5912 MPU Core Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.7 External Memory Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.7.1 EMIFS/NOR Flash Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.7.2 EMIFS/NAND Flash Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196 196 197 199 201 202 202 204 206 206 207 208 208 226 3.8 3.9 3.10 3.11 3.12 3.13 3.14 12 SPRS231E December 2003 − Revised December 2005 Contents Section 5.8 5.9 5.10 Page EMIFF/SDR SDRAM Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFF/Mobile DDR SDRAM Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Multichannel Buffered Serial Port (McBSP) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.10.1 McBSP Transmit and Receive Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.10.2 McBSP as SPI Master or Slave Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Multichannel Serial Interface (MCSI) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Serial Port Interface (SPI) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Parallel Camera Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LCD Controller and LCDCONV Interfaces Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Multimedia Card/Secure Digital (MMC/SD) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Inter-Integrated Circuit (I2C) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Universal Serial Bus (USB) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MICROWIRE Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HDQ/1-Wire Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Embedded Trace Macrocell (ETM) Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 233 236 236 240 244 246 247 248 250 252 253 254 255 257 6 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 259 7 Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.1 Package Thermal Resistance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.2 Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264 264 264 5.11 5.12 5.13 5.14 5.15 5.16 5.17 5.18 5.19 5.20 December 2003 − Revised December 2005 SPRS231E 13 Figures List of Figures Figure Page 2−1 2−2 OMAP5912 289-Ball ZDY/GDY Plastic Ball Grid Array (Bottom View) . . . . . . . . . . . . . . . . . . . . . . . OMAP5912 289-Ball ZZG Plastic Ball Grid Array (Bottom View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 25 3−1 3−2 3−3 3−4 3−5 OMAP5912 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP MMU Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP MMU On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Supply Connections for a Typical System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . External RC Circuits for Noise Isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 170 171 191 192 4−1 Example Markings for OMAP5912 ZDY Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194 5−1 5−2 5−3 5−4 5−5 5−6 5−7 5−8 5−9 5−10 5−11 5−12 5−13 5−14 5−15 5−16 5−17 5−18 5−19 5−20 5−21 5−22 5−23 5−24 5−25 5−26 5−27 5−28 3.3-V Test Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32-kHz Oscillator External Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32-kHz Oscillator External Crystal With PI-Network . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32-kHz Input Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internal System Oscillator External Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input Clock Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Device Reset Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU Core Reset Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFS/NOR Flash—Single Word Asynchronous Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFS/NOR Flash—Single Word Asynchronous Read, Full-Handshaking Mode Timing . . . . . . . . EMIFS/NOR Flash—Asynchronous 32-Bit Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFS/NOR Flash—Asynchronous Read, Page Mode 8 x 16-Bit Timing . . . . . . . . . . . . . . . . . . . . . EMIFS/NOR Flash—Single Word Asynchronous Write Timing, Full-Handshaking Mode . . . . . . . . EMIFS/NOR Flash—Single Word Asynchronous Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFS/NOR Flash—Synchronous Burst Read Timing (Retiming Off, Mode 4) . . . . . . . . . . . . . . . . EMIFS/NOR Flash—Synchronous Burst Read Timing (Retiming On, Mode 4) . . . . . . . . . . . . . . . . EMIFS/NOR Flash—Synchronous Burst Read Timing (Retiming Off, Mode 5) . . . . . . . . . . . . . . . . EMIFS/Multiplexed NOR Flash—Single Word Asynchronous Read Timing . . . . . . . . . . . . . . . . . . . EMIFS/Multiplexed NOR Flash—Single Word Asynchronous Write Timing . . . . . . . . . . . . . . . . . . . EMIFS/Multiplexed NOR Flash—Synchronous Burst Read Timing (Retiming Off) . . . . . . . . . . . . . EMIFS/NAND Flash—Command Latch Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFS/NAND Flash—Address Latch Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFS/NAND Flash—Memory Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFS/NAND Flash—Memory Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFF/SDR Two SDRAM RD (Read) Commands (Active Row) . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFF/SDR Two SDRAM WRT (Write) Commands (Active Row) . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFF/SDR SDRAM ACTV (Activate Row) Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFF/SDR SDRAM DCAB (Precharge/Deactivate Row) Command . . . . . . . . . . . . . . . . . . . . . . . . 201 202 203 203 204 205 206 207 218 218 219 219 220 221 222 222 223 224 225 225 227 227 228 228 230 230 231 231 14 SPRS231E December 2003 − Revised December 2005 Figures Figure 5−29 5−30 5−31 5−32 5−33 5−34 5−35 5−36 5−37 5−38 5−39 5−40 5−41 5−42 5−43 5−44 5−45 5−46 5−47 5−48 5−49 5−50 5−51 5−52 5−53 5−54 5−55 5−56 5−57 5−58 5−59 5−60 5−61 Page EMIFF/SDR SDRAM REFR (Refresh) Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFF/SDR SDRAM MRS (Mode Register Set) Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFF/Mobile DDR SDRAM—Command and Address Output Timing Definition . . . . . . . . . . . . . . EMIFF/Mobile DDR SDRAM—Memory Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFF/Mobile DDR SDRAM—Memory Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP Receive Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP Transmit Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP Timings as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 . . . . . . . . . . . . . . . . . . . . . . . McBSP Timings as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 . . . . . . . . . . . . . . . . . . . . . . . McBSP Timings as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 . . . . . . . . . . . . . . . . . . . . . . . McBSP Timings as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 . . . . . . . . . . . . . . . . . . . . . . . MCSI Master Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MCSI Slave Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI Interface—Transmit and Receive in Master or Slave Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . Camera Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TFT Mode (LCD.HS/LCD.VS on Falling and LCD.Px on Rising LCD.PCLK—PCD = 2) . . . . . . . . . TFT Mode (LCD.HS/LCD.VS on Rising and LCD.Px on Falling LCD.PCLK—PCD = 3) . . . . . . . . . MMC/SD Host Command Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MMC/SD Card Response Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MMC/SD Host Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MMC/SD Host Read and Card CRC Status Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I2C Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USB Integrated Transceiver Interface Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MICROWIRE Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HDQ Break (Reset) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HDQ Interface Reading From HDQ Slave Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HDQ Interface Writing to HDQ Slave Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Typical Communication Between OMAP5912 HDQ and HDQ Slave . . . . . . . . . . . . . . . . . . . . . . . . . HDQ/1-Wire Break (Reset) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-Wire Interface Reading from 1-Wire Slave Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-Wire Interface Writing to 1-Wire Slave Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Normal Mode—Half Rate Clock, Rising and Falling Clock Edge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Demultiplexed Mode of Full Rate Clock—Rising Clock Edge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . December 2003 − Revised December 2005 SPRS231E 232 232 234 234 235 238 239 240 241 242 243 245 245 246 247 249 249 250 250 251 251 252 253 254 255 255 256 256 256 256 256 257 258 15 Tables List of Tables Table Page 2−1 2−2 2−3 2−4 2−5 ZDY/GDY Package Terminal Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZZG Package Terminal Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZDY/GDY Package Terminal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ZZG Package Terminal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 33 40 61 81 3−1 3−2 3−3 3−4 3−5 3−6 3−7 3−8 3−9 3−10 3−11 3−12 3−13 3−14 3−15 3−16 3−17 3−18 3−19 3−20 3−21 3−22 3−23 3−24 3−25 3−26 3−27 3−28 3−29 3−30 3−31 3−32 3−33 3−34 OMAP5912 MPU Global Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Chip-Select Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU Level 2 Interrupt Handler Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LCDCONV Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LCD Controller Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU Timer1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU Timer2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU Timer3 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU Watchdog Timer Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU Level 1 Interrupt Handler Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . System DMA Controller Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USB On-the-Go (OTG) Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MICROWIRE Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USB Client Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Real-Time Clock (RTC) Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPUIO (Keyboard) Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pulse Width Light (PWL) Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pulse Width Tone (PWT) Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MMC/SDIO1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OS Timer 32-kHz Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USB Host Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Frame Adjustment Counter (FAC) Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HDQ/1-Wire Interface Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LED Pulse Generator 1 (LPG1) Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LED Pulse Generator 2 (LPG2) Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UART1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UART2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General-Purpose Timer1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General-Purpose Timer2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General-Purpose Timer3 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General-Purpose Timer4 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General-Purpose Timer5 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 105 106 107 108 108 108 108 108 109 110 123 124 124 126 127 127 127 127 128 128 129 129 130 130 132 133 134 135 136 136 137 137 138 16 SPRS231E December 2003 − Revised December 2005 Tables Table 3−35 3−36 3−37 3−38 3−39 3−40 3−41 3−42 3−43 3−44 3−45 3−46 3−47 3−48 3−49 3−50 3−51 3−52 3−53 3−54 3−55 3−56 3−57 3−58 3−59 3−60 3−61 3−62 3−63 3−64 3−65 3−66 3−67 3−68 3−69 3−70 3−71 3−72 3−73 3−74 3−75 3−76 Page I2C1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General-Purpose Timer6 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General-Purpose Timer7 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MMC/SDIO2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UART3 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU GPIO3 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU GPIO4 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32-kHz Synchro Count Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . General-Purpose Timer8 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU GPIO1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU GPIO2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU/DSP Shared Mailbox Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MCSI1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MCSI2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP3 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU TIPB Bus Switch Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ultra Low-Power Device Peripheral Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OMAP5912 Configuration Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Device Die Identification Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Production Identification Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . L3 OCP Initiator Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU Interface (MPUI) Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TIPB (Private) Bridge 1 Configuration Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Traffic Controller EMIFS Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Traffic Controller OCP−T1/OCP−T2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Traffic Controller OCPI Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Traffic Controller EMIFF Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MPU Clock/Reset/Power Mode Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DPLL1 Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP MMU Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TIPB (Public) Bridge 2 Configuration Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP Global Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DARAM Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SARAM Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP DMA Controller Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP Timer1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP Timer2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP Timer3 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP Watchdog Timer Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP Level 2.0 Interrupt Handler Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP Interrupt Interface Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . December 2003 − Revised December 2005 SPRS231E 138 139 139 140 141 142 143 143 144 145 146 147 148 149 150 151 153 154 154 156 156 156 156 157 157 158 158 159 159 160 160 160 161 161 162 163 165 165 166 166 166 167 17 Tables Table Page 3−77 3−78 DSP Level 2.1 Interrupt Handler Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP TIPB Bridge Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 168 3−79 DSP EMIF Configuration Registers .................................................... 168 3−80 DSP I-Cache Registers .............................................................. 168 3−81 3−82 DSP Clock Mode Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DSP TIPB Bus Switch Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169 169 4−1 Changes to the OMAP5912 .......................................................... 194 5−1 5−2 32-kHz Oscillator Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32-kHz Input Clock Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203 203 5−3 Base Oscillator Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204 5−4 12-MHz, 13-MHz, and 19.2-MHz Input Clock Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . 205 5−5 5−6 OMAP5912 Device Reset Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OMAP5912 Device Reset Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206 206 5−7 MPU_RST Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 5−8 MPU_RST Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207 5−9 5−10 EMIFS/NOR Flash Interface Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFS/NOR Flash Interface Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208 209 5−11 Sample Timing Calculation of Table 5−9 Parametric Values Using Constraints Calculated Above . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213 5−12 5−13 Sample Timing Calculation of Table 5−10 Parametric Values Using Constraints Calculated Above . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFS/NAND Flash Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214 226 5−14 EMIFS/NAND Flash Switching Characteristics 226 5−15 EMIFF/SDR SDRAM Interface Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 5−16 5−17 EMIFF/SDR SDRAM Interface Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EMIFF/Mobile DDR SDRAM Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229 233 5−18 EMIFF/Mobile DDR SDRAM Switching Characteristics§ .................................. 233 5−19 McBSP Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236 5−20 5−21 McBSP Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0) . . . . . . . . . . . 237 240 5−22 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0) . . . . . . . 240 5−23 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0) . . . . . . . . . . . 241 5−24 5−25 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0) . . . . . . . McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1) . . . . . . . . . . . 241 242 5−26 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1) . . . . . . . 242 5−27 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1) . . . . . . . . . . . 243 5−28 5−29 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1) . . . . . . . MCSI Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243 244 5−30 MCSI Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244 18 SPRS231E .......................................... December 2003 − Revised December 2005 Tables Table Page 5−31 5−32 5−33 5−34 5−35 5−36 5−37 5−38 5−39 5−40 5−41 5−42 5−43 SPI Interface Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SPI Interface Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Camera Interface Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . LCD Controller and LCDCONV Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MMC/SD Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MMC/SD Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I2C Signals (I2C.SDA and I2C.SCL) Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . USB Integrated Transceiver Interface Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . MICROWIRE Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MICROWIRE Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HDQ/1-Wire Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HDQ/1-Wire Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ETM Interface Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 246 246 247 248 250 250 252 253 254 254 255 255 257 7−1 7−2 OMAP5912 Thermal Resistance Characteristics (ZZG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OMAP5912 Thermal Resistance Characteristics (ZDY/GDY) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 264 264 December 2003 − Revised December 2005 SPRS231E 19 Tables 20 SPRS231E December 2003 − Revised December 2005 Features 1 OMAP5912 Features D Low-Power, High-Performance CMOS D D D D D D Technology − 0.13-µm Technology − 192-MHz Maximum Frequency − 1.6 + 5% V Core Voltage ARM926EJ-S (MPU) Core − Support for 32-Bit and 16-Bit (Thumb Mode) Instruction Sets − 16K-Byte Instruction Cache − 8K-Byte Data Cache − Data and Program Memory Management Unit (MMU) − 17-Word Write Buffer − Two 64-Entry Translation Look-Aside Buffers (TLBs) for MMUs TMS320C55x (C55x) DSP Core − One/Two Instructions Executed per Cycle − Dual Multipliers (Two Multiply-Accumulates per Cycle) − Two Arithmetic/Logic Units − Five Internal Data/Operand Buses (3 Read Buses and 2 Write Buses) − 32K x 16-Bit On-Chip Dual-Access RAM (DARAM) (64K Bytes) − 48K x 16-Bit On-Chip Single-Access RAM (SARAM) (96K Bytes) − Instruction Cache (24K Bytes) − Video Hardware Accelerators for DCT, iDCT, Pixel Interpolation, and Motion Estimation for Video Compression 250K Bytes of Shared Internal SRAM Memory Traffic Controller (TC) − 16-Bit EMIFS Supports up to 256M Bytes of External Memory (i.e., Async. ROM/RAM, NOR/NAND Flash, and Sync. Burst Flash) − 16-Bit EMIFF to Access up to 64M Bytes of SDRAM, Mobile SDRAM, or Mobile DDR DSP Memory Management Unit DSP Peripherals − Three 32-Bit Timers and Watchdog Timer − Six-Channel DMA Controller − Two Multichannel Buffered Serial Ports − Two Multichannel Serial Interfaces D MPU Peripherals D D D D D D D − Three 32-Bit Timers and Watchdog Timer − USB 1.1 Host and Client Controllers − USB On-the-Go (OTG) Controller − 3 USB Ports, One With an Integrated Transceiver − Camera Interface for Parallel CMOS Sensors − Real-Time Clock (RTC) − Pulse-Width Tone (PWT) Interface − Pulse-Width Light (PWL) Interface − Keyboard Matrix Interface (6 x 5 or 8 x 8) − HDQ/1-Wire Interface − Multimedia Card (MMC) and Secure Digital (SD) Interface − Up to 16 MPU General-Purpose I/Os − Two LED Pulse Generators (LPGs) − ETM9 Trace Module for ARM926EJ-S Debug − 16-/18-Bit LCD Controller With Dedicated System DMA Channel − 32-kHz Operating System (OS) Timer Shared Peripherals − 8 General-Purpose Timers − Serial Port Interface (SPI) − Three Universal Asynchronous Receiver/Transmitters (UARTs) (Two Supporting SIR mode for IrDA) − Inter-Integrated Circuit (I2C) Master and Slave Interface − Multimedia Card (MMC) and Secure Digital (SD) Interface − Multichannel Buffered Serial Port − Up to 64 Shared General-Purpose I/Os − 32-kHz Synchro Counter Endian Conversion Unit Hardware Accelerators for Cryptographic Functions − Random Number Generation − DES and 3DES − SHA-1 and MD5 Individual Power-Saving Modes for MPU/DSP/TC On-Chip Scan-Based Emulation Logic IEEE Std 1149.1† (JTAG) Boundary Scan Logic Three 289-Ball BGA (Ball Grid Array) Packages (ZDY and ZZG − Lead-Free; GDY − With Lead) All trademarks are the property of their respective owners. † IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary Scan Architecture. December 2003 − Revised December 2005 SPRS231E 21 Introduction 2 Introduction This section describes the main features of the OMAP5912 device, lists the terminal assignments, and describes the function of each terminal. This data manual also provides a detailed description section, electrical specifications, parameter measurement information, and mechanical data about the available packaging. 2.1 Description OMAP5912 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices. The OMAP platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution. The dual-core architecture provides benefits of both DSP and reduced instruction set computer (RISC) technologies, incorporating a TMS320C55x DSP core and a high-performance ARM926EJ-S ARM core. The OMAP5912 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS software kernel foundation, and is available in three 289-ball ball grid array (BGA) packages (ZDY and ZZG − lead-free; GDY − with lead). The OMAP5912 device is targeted at the following applications: • Applications Processing Devices • Mobile Communications − − − − WAN 802.11X Bluetooth GSM, GPRS, EDGE CDMA • Video and Image Processing (MPEG4, JPEG, Windows Media Video, etc.) • Advanced Speech Applications (text-to-speech, speech recognition) • Audio Processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and Other GSM Speech Codecs) • Graphics and Video Acceleration • Generalized Web Access • Data Processing TMS320C55x, C55x, OMAP, and DSP/BIOS are trademarks of Texas Instruments. ARM926EJ-S and ETM9 are trademarks of ARM Limited in the EU and other countries. Thumb and ARM are registered trademarks of ARM Limited in the EU and other countries. 1-Wire is a registered trademark of Dallas Semiconductor Corporation. Bluetooth is a trademark owned by Bluetooth SIG, Inc. Windows is a registered trademark of Microsoft Corporation in the United States and/or other countries. 22 SPRS231E December 2003 − Revised December 2005 Introduction 2.1.1 TMS320C55x DSP Core The DSP core of the OMAP5912 device is based on the TMS320C55x DSP generation CPU processor core. The C55x DSP architecture achieves high performance and low power through increased parallelism and total focus on reduction in power dissipation. The CPU supports an internal bus structure composed of one program bus, three data read buses, two data write buses, and additional buses dedicated to peripheral and DMA activity. These buses provide the ability to perform up to three data reads and two data writes in a single cycle. In parallel, the DMA controller can perform up to two data transfers per cycle independent of the CPU activity. The C55x CPU provides two multiply-accumulate (MAC) units, each capable of 17-bit x 17-bit multiplication in a single cycle. A central 40-bit arithmetic/logic unit (ALU) is supported by an additional 16-bit ALU. Use of the ALUs is under instruction set control, providing the ability to optimize parallel activity and power consumption. These resources are managed in the address unit (AU) and data unit (DU) of the C55x CPU. The C55x DSPs support a variable byte width instruction set for improved code density. The instruction unit (IU) performs 32-bit program fetches from internal or external memory and queues instructions for the program unit (PU). The program unit decodes the instructions, directs tasks to AU and DU resources, and manages the fully protected pipeline. Predictive branching capability avoids pipeline flushes on execution of conditional instructions. The OMAP5912 DSP core also includes a 24K-byte instruction cache to minimize external memory accesses, improving data throughput and conserving system power. 2.1.1.1 DSP Tools Support The 55x DSP core is supported by the industry’s leading eXpressDSP software environment including the Code Composer Studio Integrated Development Environment (IDE), DSP/BIOS software kernel foundation, the TMS320 DSP Algorithm Standard, and the industry’s largest third-party network. Code Composer Studio features code generation tools including a C-Compiler, simulator, Real-Time Data Exchange (RTDX), XDS510 emulation device drivers, and Chip Support Libraries (CSL). DSP/BIOS is a scalable real-time software foundation available for no cost to users of Texas Instruments’ DSP products, providing a preemptive task scheduler and real-time analysis capabilities with very low memory and megahertz overhead. The TMS320 DSP Algorithm Standard is a specification of coding conventions allowing fast integration of algorithms from different teams, sites, or third parties into the application framework. Texas Instruments’ extensive DSP third-party network of over 400 providers brings focused competencies and complete solutions to customers. 2.1.1.2 DSP Software Support Texas Instruments has also developed foundation software available for the 55x DSP core. The C55x DSP Library (DSPLIB) features over 50 C-callable software routines (FIR/IIR filters, Fast Fourier Transforms (FFTs), and various computational functions). The DSP Image/Video Processing Library (IMGLIB) contains over 20 software routines highly optimized for C55x DSPs and is compiled with the latest revision of the C55x DSP code generation tools. These imaging functions support a wide range of applications that include compression, video processing, machine vision, and medical imaging. eXpressDSP, Code Composer Studio, TMS320, RTDX, and XDS510 are trademarks of Texas Instruments. December 2003 − Revised December 2005 SPRS231E 23 Introduction 2.1.2 ARM926EJ-S RISC Processor The MPU core is a ARM926EJ-S reduced instruction set computer (RISC) processor. The ARM926EJ-S is a 32-bit processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously. The MPU core incorporates: • A coprocessor 15 (CP15) and protection module • Data and program Memory Management Units (MMUs) with table look-aside buffers. • Separate 16K-byte instruction and 8K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT). The OMAP5912 device uses the ARM926EJ-S core in little-endian mode only. To minimize external memory access time, the ARM926EJ-S includes an instruction cache, data cache, and a write buffer. In general, these are transparent to program execution. 2.2 Terminal Assignments Figure 2−1 illustrates the ball locations for the 289-ball ZDY/GDY package and Figure 2−2 illustrates the ball locations for the 289-ball ZZG package. Figure 2−1 and Figure 2−2 are used in conjunction with Table 2−1 and Table 2−2, respectively, to locate signal names and ball grid numbers. BGA ball numbers in Table 2−1 and Table 2−2 are read from left-to-right, top-to-bottom. U T R P N M L K J H G F E D C B A 1 3 2 5 4 7 6 9 8 11 10 13 12 15 14 17 16 Bottom View Figure 2−1. OMAP5912 289-Ball ZDY/GDY Plastic Ball Grid Array (Bottom View) 24 SPRS231E December 2003 − Revised December 2005 Introduction Y V T P M K H F D B AA W U R N L J G E C A 1 3 5 7 9 11 13 15 17 19 21 2 4 6 8 10 12 14 16 18 20 Bottom View Figure 2−2. OMAP5912 289-Ball ZZG Plastic Ball Grid Array (Bottom View) In Table 2−1 and Table 2−2, signals with multiplexed functions are highlighted in gray. Signals within a multiplexed pin name are separated with forward slashes as follows: • signal1/signal2/signal3 (e.g., MPUIO1/RTCK/SPIF.SCK) Signals which are associated with specific peripherals are denoted by using the peripheral name, followed by a period, and then the signal name; as follows: • peripheral1.signal1 (i.e., MCSI1.DOUT) December 2003 − Revised December 2005 SPRS231E 25 Introduction Table 2−1. ZDY/GDY Package Terminal Assignments ZDY/ GDY BALL NO. SIGNAL ZDY/ GDY BALL NO. SIGNAL ZDY/ GDY BALL NO. SIGNAL ZDY/ GDY BALL NO. A1 SDRAM.A[1] A2 SDRAM.DQSL A5 SDRAM.D[3] A6 SDRAM.CLKX A3 SDRAM.D[6] A4 SDRAM.D[2] A7 SDRAM.CLK A8 SDRAM.DQMU A9 CVDDDLL A10 SDRAM.A[7] A11 SDRAM.D[11] A12 SDRAM.DQSH A13 LCD.P[12](0)/ Z_STATE†(1)/ GPIO33(7) A14 LCD.PCLK(0)/ Z_STATE†(1) A15 LCD.P[10](0)/ Z_STATE†(1)/ GPIO31(7) A16 LCD.P[6](0)/ Z_STATE†(1) A17 LCD.P[0](0)/ Z_STATE†(1) B1 DVDD5 B2 SDRAM.A[0] B3 SDRAM.D[4] B4 SDRAM.D[0] B5 SDRAM.D[1] B6 SDRAM.D[5] B7 SDRAM.D[7] B8 SDRAM.D[10] B9 SDRAM.D[12] B10 SDRAM.D[15] B11 SDRAM.D[13] B12 SDRAM.D[9] B13 SDRAM.CKE B14 LCD.P[11](0)/ Z_STATE†(1)/ GPIO32(7) B15 LCD.VS(0)/ Z_STATE†(1) B16 LCD.P[1](0)/ Z_STATE†(1) B17 KB.C[2](0)/ GPIO61(7) C1 FLASH.A[6](0) C2 FLASH.A[2](0) C3 SDRAM.A[3] C4 SDRAM.BA[1] C5 SDRAM.BA[0] C6 SDRAM.A[8] C7 SDRAM.DQML C8 SDRAM.A[5] C9 SDRAM.D[8] C10 SDRAM.D[14] C11 CVDD C12 LCD.P[15](0)/ Z_STATE†(1)/ GPIO2(7) C13 LCD.P[8](0)/ Z_STATE†(1)/ GPIO29(7) C14 DVDD1 C15 LCD.P[5](0)/ Z_STATE†(1) C16 LCD.P[2](0)/ Z_STATE†(1) C17 KB.C[1](0)/ MPUIO6(1) D1 FLASH.A[8](0) D2 FLASH.A[5](0) D3 FLASH.A[1](0) D4 SDRAM.RAS D5 SDRAM.CAS D6 DVDD4 D7 DVDD4 D8 DVDD4 D9 SDRAM.A[4] D10 SDRAM.A[13] D11 DVDD4 D12 LCD.P[14](0)/ Z_STATE†(1)/ GPIO35(7) D13 LCD.P[7](0)/ Z_STATE†(1) D14 LCD.P[3](0)/ Z_STATE†(1) D15 LCD.HS(0)/ Z_STATE†(1) D16 KB.C[4](0)/ GPIO27(7) D17 KB.R[3](0)/ MPUIO13(1) E1 FLASH.A[9](0) E2 FLASH.A[7](0) E3 FLASH.A[4](0) E4 FLASH.A[3](0) E5 VSS E6 SDRAM.WE E7 SDRAM.CS E8 SDRAM.A[12] E12 LCD.P[4](0)/ Z_STATE†(1) E16 KB.R[2[(0)/ MPUIO10(1) E9 SDRAM.A[11] E10 SDRAM.A[6] E11 LCD.P[13](0)/ Z_STATE†(1)/ GPIO34(7) E13 VSS E14 NC‡ E15 KB.C[3](0)/ GPIO63(6) SIGNAL † Z_STATE = high-impedance “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZDY/GDY ball H8), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). ‡ 26 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−1. ZDY/GDY Package Terminal Assignments (Continued) ZDY/ GDY BALL NO. SIGNAL ZDY/ GDY BALL NO. SIGNAL ZDY/ GDY BALL NO. SIGNAL ZDY/ GDY BALL NO. SIGNAL E17 KB.R[1](0)/ MPUIO9(1) F1 FLASH.A[11](0) F2 FLASH.A[10](0) F3 FLASH.A[25] F4 FLASH.A[20] F5 FLASH.A[12](0) F6 VSS F7 SDRAM.A[2] F8 SDRAM.A[10] F9 SDRAM.A[9] F10 LCD.AC(0)/ SYS_CLK_OUT(1)/ Z_STATE†(2) F11 LCD.P[9](0)/ Z_STATE†(1)/ GPIO30(7) F12 VSS F13 KB.R[4](0)/ MPUIO15(1) F14 KB.C[0](0)/ MPUIO0(1) F15 KB.R[0](0)/ MPUIO8(1) F16 MCBSP1.CLKX(0)/ GPIO54(7) F17 KB.C[5](0)/ GPIO28(7) G1 DVDD5 G2 FLASH.A[15](0) G3 FLASH.A[13](0) G4 FLASH.A[14](0) G5 FLASH.A[16](0) G6 FLASH.A[17] G7 VSS G8 CVDD2 G9 CVDD2 G10 CVDD3 G12 DVDD1 G13 MCBSP1.CLKS(0)/ GPIO62(7) G14 MCBSP1.DX(0)/ MCBSP1.FSX(1)/ MCBSP1.DXZ(2)/ GPIO52(7) G15 MCBSP1.FSX(0)/ MCBSP1.DX(1)/ MCBSP1.DXZ(2) GPIO53(7) G16 CAM.LCLK(0)/ ETM.CLK(1)/ UWIRE.SCLK(2)/ GPIO39(7) G17 MCBSP1.DR(0)/ GPIO51(7) H1 LDO.FILTER H2 FLASH.A[22] H3 FLASH.A[18] H4 FLASH.A[19] H5 FLASH.A[21] H8 VSS# H9 VSS H12 CAM.EXCLK(0)/ ETM.SYNC[0](1)/ UWIRE.SDO(2)/ LOW_STATE§ (6)/ GPIO57(7) H13 CAM.D[3](0)/ ETM.D[3](1)/ UART3.RX(2)/ GPIO31(7) H17 CAM.D[5](0)/ ETM.D[5](1)/ UWIRE.SDI(2)/ GPIO33(7) G11 VSS H6 H10 FLASH.ADV VSS H7 CVDD2 H11 CVDD3 H14 MPU_BOOT(0)/ USB1.SUSP(2) H15 CAM.D[6](0)/ ETM.D[6](1)/ UWIRE.CS3(2)/ MMC2.CMD/ GPIO34(7) H16 CAM.D[7](0)/ ETM.D[7](1)/ UWIRE.CS0(2)/ MMC2.DAT2(3)/ GPIO35(7) J1 FLASH.BE[0](0)/ FLASH.CS2UOE(1)/ GPIO59(7) J2 FLASH.A[23] J3 FLASH.CS1(0)/ FLASH.CS1L(1) J4 FLASH.A[24] J5 GPIO62(0)/ FLASH.CS0(1) J6 FLASH.CS3(0)/ GPIO3(7) J7 FLASH.D[3] J8 FLASH.CS2(0)/ FLASH.BAA(1)/ FLASH.CS2L(2) † Z_STATE = high-impedance “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZDY/GDY ball H8), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). ‡ December 2003 − Revised December 2005 SPRS231E 27 Introduction Table 2−1. ZDY/GDY Package Terminal Assignments (Continued) ZDY/ GDY BALL NO. SIGNAL J9 VSS ZDY/ GDY BALL NO. SIGNAL ZDY/ GDY BALL NO. SIGNAL J11 CAM.D[4](0)/ ETM.D[4](1)/ UART3.TX(2)/ GPIO32(7) ZDY/ GDY BALL NO. SIGNAL J12 CAM.HS(0)/ ETM.PSTAT[1](1)/ UART2.CTS(2)/ MMC2.DAT0/ GPIO38(7) J10 CVDD3 J13 CAM.VS(0)/ ETM.PSTAT[2](1)/ MPUIO14(2)/ MMC2.DAT1(3) J14 CAM.D[2](0)/ ETM.D[2](1)/ UART3.CTS(2)/ GPIO30(7) J15 DVDD8 J16 CAM.D[1](0)/ ETM.D[1](1)/ UART3.RTS(2)/ GPIO29(7) J17 CAM.D[0](0)/ ETM.D[0](1)/ MPUIO12(2)/ MMC2.DAT3(3) K1 FLASH.CLK(0)/ FLASH.CS2UOE(1) K2 FLASH.BE[1](0)/ FLASH.CS2UWE(1)/ GPIO60(7) K3 FLASH.CS2U(0)/ GPIO5(1) K4 NC‡ K5 CVDD K6 FLASH.D[6] K7 FLASH.D[12] K8 VSS K9 VSS K10 VSS K11 CVDD3 K12 CAM.RSTZ(0)/ ETM.PSTAT[0](1)/ UART2.RTS(2)/ MMC2.CLK(3)/ LOW_STATE§(6)/ GPIO37(7) K13 GPIO11(0)/ HDQ(1)/ ETM.PSTAT[5](5)/ RTDX.D[3](7) K14 GPIO14(0)/ KB.R[6](1)/ LCD.RED0(2)/ Z_STATE†(3) K15 UART3.RX(0)/ PWL(1)/ UART2.RX(3)/ TIMER.PWM1(4)/ GPIO49(7) L1 FLASH.D[0] L2 FLASH.D[2] L5 FLASH.D[8] L6 FLASH.RDY(0)/ GPIO10(1) L10 BCLK(0)/ UART3.RTS(1)/ CAM.OUTCLK(6)/ GPIO17(7) L14 GPIO6(0)/ MCBSP3.FSX(2)/ TIMER.EVENT3(3)/ MCSI1.DIN(4)/ TMS(5) K16 GPIO15(0)/ KB.R[7](1)/ TIMER.PWM2(2) K17 LOW_STATE§(0)/ UART3.TX(1)/ PWT(2)/ UART2.TX(4) TIMER.PWM0(5)/ GPIO50(7) L3 DVDD5 L4 FLASH.D[5] L8 MCBSP2.DR(0)/ MCBSP2.DX(1)/ MCBSP2.DXZ(2)/ GPIO22(7) L12 MPUIO2(0)/ EXT_DMA_REQ0(1)/ UWIRE.CS1(2)/ SPIF.CS1(6) L7 VSS L11 VSS L9 CVDDRTC L13 GPIO3(0)/ MCBSP3.FSX(2)/ LED1(3)/ ETM.PSTAT[3](5)/ RTDX.D[1](7) † Z_STATE = high-impedance “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZDY/GDY ball H8), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). ‡ 28 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−1. ZDY/GDY Package Terminal Assignments (Continued) ZDY/ GDY BALL NO. ZDY/ GDY BALL NO. SIGNAL ZDY/ GDY BALL NO. SIGNAL L15 GPIO7(0)/ MMC.DAT2(1)/ TCK(3)/ MCSI1.CLK(4)/ ETM.SYNC[1](5)/ RTDX.D[2](7) M2 FLASH.D[4] SIGNAL ZDY/ GDY BALL NO. SIGNAL L16 GPIO12(0)/ MCBSP3.FSX(1)/ TIMER.EXTCLK(3) L17 GPIO13(0)/ KB.R[5](1)/ LCD.BLUE0(2)/ Z_STATE†(3) M1 FLASH.D[1] M3 FLASH.D[11] M4 FLASH.D[10] M5 FLASH.OE M6 VSS M7 CVDD M8 MMC.CLK(0)/ GPIO57(7) M9 UART1.CTS(0)/ UART1.IRSEL(2)/ GPIO38(7) M10 TMS M11 I2C.SDA(0)/ GPIO48(7) M12 VSS M13 DVDD9 M14 MPUIO4(0)/ EXT_DMA_REQ1(1)/ LED2(2)/ UWIRE.CS2(3)/ SPIF.CS2(4)/ MCBSP3.DR(6) M15 GPIO1(0)/ UART3.RTS(1) M16 GPIO2(0)/ ETM.PSTAT[4](5)/ RTDX.D[0] (7) M17 GPIO4(0)/ SPI.CS2(1)/ MCBSP3.FSX(2)/ TIMER.EVENT4(3)/ SPIF.DIN(4) N1 FLASH.D[7] N2 FLASH.D[9] N3 FLASH.RP(0)/ FLASH.CS2UWE(1) N4 FLASH.D[15] N5 VSS N6 MCBSP2.FSX(0)/ GPIO21(7) N7 MMC.CMD/ GPIO55(7) N8 PWRON_RESET N9 RTC_WAKE_INT(0)/ USB1.SE0(4)/ RST_HOST_OUT(5)/ GPIO55(7) N10 MCSI1.SYNC(0)/ MCBSP3.DR(1)/ USB1.VP(2)/ MCBSP3.FSX(4) N11 EMU1 N12 RST_OUT(0)/ GPIO41(7) N15 MPUIO1(0)/ RTCK(1)/ SPIF.SCK(6) N16 MPUIO5(0)/ LOW_PWR(1)/ UART3.RTS(3)/ UART1.DTR(4) P2 OSC1_OUT P3 FLASH.WE N13 VSS N14 MPU_RST(0)/ MPUIO14(6) N17 GPIO0(0)/ USB.VBUS(2)/ SPIF.DOUT(3)/ MMC2.CLKIN(6) P1 FLASH.D[13] † Z_STATE = high-impedance “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZDY/GDY ball H8), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). ‡ December 2003 − Revised December 2005 SPRS231E 29 Introduction Table 2−1. ZDY/GDY Package Terminal Assignments (Continued) ZDY/ GDY BALL NO. ZDY/ GDY BALL NO. SIGNAL SIGNAL P4 USB.PUEN(0)/ USB.CLKO(1)/ USB.PUDIS(3)/ Z_STATE†(4)/ LOW_POWER(6)/ GPIO58(7) P5 UART2.BCLK(0)/ SYS_CLK_IN(6) P8 MCSI2.CLK(0)/ USB2.SUSP(1)/ USB0.SUSP(5)/ MMC2.CLK(6)/ GPIO27(7) P12 MCSI1.DIN(0)/ USB1.RCV(1)/ EMU1(3)/ MCBSP3.DR(4)/ GPIO56(7) P13 P16 I2C.SCL P17 P9 MMC.DAT3(0)/ MPUIO9(1)/ MPUIO6(2) ZDY/ GDY BALL NO. SIGNAL P6 UART2.CTS(0)/ USB2.RCV(1)/ GPIO7(2)/ USB0.RCV(5) ZDY/ GDY BALL NO. SIGNAL P7 GPIO8(0)/ TRST(3)/ MCSI1.DOUT(4)/ MMC2.CMD P11 MCSI1.DOUT(0)/ USB1.TXD(1)/ TDO(3)/ MCBSP3.DX(4)/ GPIO18(7)/ MCBSP3.DOUT_HIZ P10 RTC_ON_NOFF(0) TCK P14 UWIRE.SDI(0)/ UART3.DSR(1)/ UART1.DSR(2)/ MCBSP3.DR(3)/ SPIF.DIN(6)/ GPIO47(7) P15 UWIRE.SCLK(0)/ KB.C[7](1)/ MPUIO1(2)/ UART3.CTS(4) CVDDA R1 FLASH.D[14] R2 OSC1_IN R5 MCBSP2.FSR(0)/ GPIO12(1) R6 MPUIO3(0)/ MMC2.DAT1(6) LOW_STATE§(0)/ UART2.TX(1)/ USB2.TXD(2)/ USB0.TXD(5)/ Z_STATE†(6)/ GPIO17(7) R3 FLASH.WP R4 R7 MCSI2.DIN(0)/ USB2.VP(1)/ USB0.VP(5)/ GPIO26(7) R8 MMC.DAT0/ Z_STATE†(1)/ GPIO58(7) R9 VSS R10 DVDDRTC R11 LOW_STATE§(0)/ UART1.RTS(1)/ UART1.IRSHDN(2)/ Z_STATE†(6)/ GPIO39(7) R12 BCLKREQ(0)/ UART3.CTS(1)/ MMC2.DAT2(6)/ GPIO40(7) R13 TRST R14 CONF¶ † Z_STATE = high-impedance “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZDY/GDY ball H8), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). ‡ 30 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−1. ZDY/GDY Package Terminal Assignments (Continued) ZDY/ GDY BALL NO. SIGNAL R15 UWIRE.SDO(0)/ UART3.DTR(1)/ UART1.DTR(2)/ MCBSP3.DX(3)/ UART3.RTS(4)/ MCBSP3.DXZ(5)/ SPIF.DOUT(6)/ GPIO46(7) T2 USB.DP(0)/ I2C.SDA(4) UART1.RX(5)/ USB.PUEN(7) ZDY/ GDY BALL NO. SIGNAL R16 Z_STATE†(0)/ UWIRE.CS3(1)/ KB.C[6](2)/ SPIF.CS3(3)/ UART3.RX(4)/ Z_STATE†(6)/ GPIO44(7) T4 LOW_STATE§(0)/ UART2.RTS(1)/ USB2.SE0(2)/ MPUIO5(3)/ MPUIO12(4)/ USB0.SE0(5)/ LOW_STATE§(6) T5 MCBSP2.DX(0)/ MCBSP2.DR(1)/ MCBSP2.DXZ(2)/ GPIO19(7) T9 MMC.DAT2(0)/ Z_STATE†(1)/ MPUIO11(2) T13 DVDD7 T17 BFAIL/EXT_FIQ(0)/ UART3.CTS(1)/ UART1.DSR(2)/ MMC.DATDIR1(6) U4 UART2.RX(0)/ USB2.VM(1)/ USB0.VM(5)/ GPIO18(7) U8 MCSI2.SYNC(0)/ GIOP7(1)/ USB2.SPEED(2)/ USB0.SPEED(5)/ MMC2.CMDDIR(6) LOW_STATE§(0)/ UART1.TX(1)/ UART1.IRTX(2) DVDD6 T11 CLK32K_IN MCBSP2.CLKX(0)/ GPIO20(7) FLASH.CS1U(0)/ GPIO16(7) T12 T10 U5 T1 T8 T7 U1 R17 Z_STATE†(0)/ UWIRE.CS0(1)/ MCBSP3.CLKX(2)/ UART3.TX(4)/ SPIF.CS0(6)/ GPIO45(7) MCSI2.DOUT(0)/ USB2.TXEN(1)/ USB0.TXEN(5)/ Z_STATE†(6)/ GPIO25(7) DVDD3 USB.DM(0)/ I2C.SCL(4)/ UART1.TX(5)/ Z_STATE†(7) SIGNAL CVDD1 T6 RTCK SIGNAL ZDY/ GDY BALL NO. T3 MCLKREQ(0)/ EXT_MASTER_REQ(1)/ UART2.RX(2)/ MMC2.DAT3(6)/ GPIO23(7) T14 ZDY/ GDY BALL NO. T15 U2 U6 TDO DVDD2 MCBSP2.CLKR(0)/ GPIO11(1) T16 CVDD U3 MCLK(0)/ MMC2.DATDIR0(6)/ GPIO24(7) U7 GPIO9(0)/ EMU0(3)/ MCSI1.SYNC(4)/ MMC2.DAT0 † Z_STATE = high-impedance “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZDY/GDY ball H8), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). ‡ December 2003 − Revised December 2005 SPRS231E 31 Introduction Table 2−1. ZDY/GDY Package Terminal Assignments (Continued) ZDY/ GDY BALL NO. SIGNAL U9 MMC.DAT1(0)/ MPUIO10(1)/ MPUIO7(2) U13 UART1.RX(0)/ UART1.IRRX(2)/ GPIO37(7) U17 TDI ZDY/ GDY BALL NO. SIGNAL U10 OSC32K_OUT U14 Z_STATE†(0)/ MCBSP3.CLKX(1)/ USB1.TXEN(2)/ MCSI1.DIN_OUT(3)/ MCSI1.DIN(4)/ Z_STATE†(6)/ GPIO42(7) ZDY/ GDY BALL NO. SIGNAL ZDY/ GDY BALL NO. SIGNAL U11 OSC32K_IN U12 CLK32K_OUT(0)/ MPUIO0(4)/ USB1.SPEED(5)/ UART1.TX(6)/ GPIO36(7) U15 MCSI1.CLK(0)/ MCBSP3.DX(1)/ USB1.VM(2)/ TDI(3)/ MCBSP3.CLKX(4)/ GPIO43(7) U16 EMU0 † Z_STATE = high-impedance “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZDY/GDY ball H8), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). ‡ 32 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−2. ZZG Package Terminal Assignments ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL A1 SDRAM.A[3] A2 SDRAM.A[0] A3 CVDD2 A5 DVDD4 A7 DVDD4 A9 CVDD2 A11 CVDDDLL A13 VSS A15 CVDD A17 LCD.P[13](0)/ Z_STATE†(1)/ GPIO34(7) A19 DVDD1 A20 LCD.P[5](0)/ Z_STATE†(1) A21 VSS B1 VSS B2 SDRAM.A[1] B3 SDRAM.BA[0] B4 SDRAM.CAS B5 VSS B6 SDRAM.A[2] B7 VSS B8 SDRAM.A[10] B9 SDRAM.A[5] B10 DVDD4 B12 SDRAM.A[9] B13 CVDD3 B14 DVDD4 B15 LCD.AC(0)/ SYS_CLK_OUT(1)/ Z_STATE†(2) B16 VSS B17 LCD.P[11](0)/ Z_STATE†(1)/ GPIO32(7) B18 LCD.VS(0)/ Z_STATE†(1) B19 LCD.P[6](0)/ Z_STATE†(1) B20 CVDD3 B21 LCD.P[1](0)/ Z_STATE†(1) C1 FLASH.A[3](0) C2 DVDD5 C3 SDRAM.BA[1] C4 SDRAM.D[6] C5 SDRAM.D[2] C6 SDRAM.D[1] C7 SDRAM.D[5] C8 SDRAM.DQML C9 SDRAM.CLK C10 SDRAM.D[8] C11 SDRAM.D[12] C12 SDRAM.D[15] C13 SDRAM.D[11] C14 SDRAM.DQSH C15 LCD.PCLK(0)/ Z_STATE†(1) C16 LCD.P[14](0)/ Z_STATE†(1)/ GPIO35(7) C17 LCD.P[10](0)/ Z_STATE†(1)/ GPIO31(7) C18 LCD.P[7](0)/ Z_STATE†(1) C19 LCD.P[2](0)/ Z_STATE†(1) C20 LCD.HS(0)/ Z_STATE†(1) C21 KB.C[4](0)/ GPIO27(7) D2 FLASH.A[5](0) D3 FLASH.A[2](0) D4 SDRAM.DQSL D5 SDRAM.D[4] D6 SDRAM.D[0] D7 SDRAM.D[3] D8 SDRAM.D[7] D9 SDRAM.CLKX D10 SDRAM.DQMU D11 SDRAM.D[10] D12 SDRAM.D[14] D13 SDRAM.D[13] D14 SDRAM.D[9] D15 LCD.P[15](0)/ Z_STATE†(1)/ GPIO2(7) D16 LCD.P[9](0)/ Z_STATE†(1)/ GPIO30(7) D17 LCD.P[8](0)/ Z_STATE†(1)/ GPIO29(7) D18 LCD.P[0](0)/ Z_STATE†(1) D19 KB.C[2](0)/ GPIO61(7) D20 KB.C[1](0)/ MPUIO6(1) E1 FLASH.A[25] E2 CVDD2 E3 FLASH.A[7](0) E4 FLASH.A[4](0) E5 NC‡ E18 KB.C[3](0)/ GPIO63(6) E19 KB.R[4](0)/ MPUIO15(1) † Z_STATE = high-impedance “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZZG ball Y13), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). ‡ December 2003 − Revised December 2005 SPRS231E 33 Introduction Table 2−2. ZZG Package Terminal Assignments (Continued) ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL E20 KB.R[3](0)/ MPUIO13(1) E21 DVDD1 F2 FLASH.A[20] F3 FLASH.A[9](0) F4 FLASH.A[6](0) F18 KB.C[0](0)/ MPUIO0(1) F19 KB.R[1](0)/ MPUIO9(1) F20 VSS G1 VSS G2 FLASH.A[12](0) G3 FLASH.A[11](0) G4 FLASH.A[10](0) G8 SDRAM.CS G9 SDRAM.A[8] G10 SDRAM.A[4] G11 SDRAM.A[7] G12 SDRAM.A[6] G13 LCD.P[12](0)/ Z_STATE†(1)/ GPIO33(7) G14 LCD.P[3](0)/ Z_STATE†(1) G18 KB.R[0](0)/ MPUIO8(1) G19 KB.C[5](0)/ GPIO28(7) G20 MCBSP1.CLKS(0)/ GPIO62(7) G21 MCBSP1.CLKX(0)/ GPIO54(7) H2 DVDD5 H3 FLASH.A[15](0) H4 FLASH.A[14](0) H7 SDRAM.RAS H8 SDRAM.WE H9 SDRAM.A[12] H10 SDRAM.A[11] H11 SDRAM.A[13] H12 SDRAM.CKE H13 LCD.P[4](0)/ Z_STATE†(1) H14 KB.R[2[(0)/ MPUIO10(1) H15 MCBSP1.FSX(0)/ MCBSP1.DX(1)/ MCBSP1.DXZ(2) GPIO53(7) H18 MCBSP1.DX(0)/ MCBSP1.FSX(1)/ MCBSP1.DXZ(2)/ GPIO52(7) H19 CAM.EXCLK(0)/ ETM.SYNC[0](1)/ UWIRE.SDO(2)/ LOW_STATE§(6)/ GPIO57(7) H20 MCBSP1.DR(0)/ GPIO51(7) J1 LDO.FILTER J2 FLASH.A[17] J3 FLASH.A[19] J4 FLASH.A[18] J7 FLASH.A[8](0) J8 FLASH.A[1](0) J14 CAM.D[5](0)/ ETM.D[5](1)/ UWIRE.SDI(2)/ GPIO33(7) J15 CAM.LCLK(0)/ ETM.CLK(1)/ UWIRE.SCLK(2)/ GPIO39(7) J18 CAM.D[7](0)/ ETM.D[7](1)/ UWIRE.CS0(2)/ MMC2.DAT2(3)/ GPIO35(7) J19 CAM.D[6](0)/ ETM.D[6](1)/ UWIRE.CS3(2)/ MMC2.CMD/ GPIO34(7) J20 MPU_BOOT(0)/ USB1.SUSP(2) J21 CVDD3 K2 VSS K3 FLASH.A[23] K4 FLASH.A[22] K15 CAM.D[2](0)/ ETM.D[2](1)/ UART3.CTS(2)/ GPIO30(7) K7 FLASH.A[16](0) K18 CAM.D[4](0)/ ETM.D[4](1)/ UART3.TX(2)/ GPIO32(7) K8 FLASH.A[13](0) K14 CAM.D[1](0)/ ETM.D[1](1)/ UART3.RTS(2)/ GPIO29(7) K19 CAM.D[3](0)/ ETM.D[3](1)/ UART3.RX(2)/ GPIO31(7) K20 VSS † Z_STATE = high-impedance “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZZG ball Y13), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). ‡ 34 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−2. ZZG Package Terminal Assignments (Continued) ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL L1 NC‡ L3 FLASH.BE[0](0)/ FLASH.CS2UOE(1)/ GPIO59(7) L4 FLASH.ADV L7 FLASH.A[24] L15 CAM.HS(0)/ ETM.PSTAT[1](1)/ UART2.CTS(2)/ MMC2.DAT0/ GPIO38(7) L18 CAM.VS(0)/ ETM.PSTAT[2](1)/ MPUIO14(2)/ MMC2.DAT1(3) L8 FLASH.A[21] L14 UART3.RX(0)/ PWL(1)/ UART2.RX(3)/ TIMER.PWM1(4)/ GPIO49(7) L19 CAM.D[0](0)/ ETM.D[0](1)/ MPUIO12(2)/ MMC2.DAT3(3) L21 DVDD8 M2 CVDD M3 FLASH.CS1(0)/ FLASH.CS1L(1) M4 FLASH.CS2(0)/ FLASH.BAA(1)/ FLASH.CS2L(2) M7 GPIO62(0)/ FLASH.CS0(1) M8 FLASH.BE[1](0)/ FLASH.CS2UWE(1)/ GPIO60(7) M14 GPIO2(0)/ ETM.PSTAT[4](5)/ RTDX.D[0] (7) M15 GPIO7(0)/ MMC.DAT2(1)/ TCK(3)/ MCSI1.CLK(4)/ ETM.SYNC[1](5)/ RTDX.D[2](7) M18 LOW_STATE§(0)/ UART3.TX(1)/ PWT(2)/ UART2.TX(4) TIMER.PWM0(5)/ GPIO50(7) M19 CAM.RSTZ(0)/ ETM.PSTAT[0](1)/ UART2.RTS(2)/ MMC2.CLK(3)/ LOW_STATE§(6)/ GPIO37(7) M20 GPIO15(0)/ KB.R[7](1)/ TIMER.PWM2(2) N1 VSS N2 FLASH.D[1] N3 FLASH.CLK(0)/ FLASH.CS2UOE(1) N4 FLASH.D[0] N14 Z_STATE†(0)/ UWIRE.CS0(1)/ MCBSP3.CLKX(2)/ UART3.TX(4)/ SPIF.CS0(6)/ GPIO45(7) N15 MPUIO2(0)/ EXT_DMA_REQ0(1)/ UWIRE.CS1(2)/ SPIF.CS1(6) N21 GPIO14(0)/ KB.R[6](1)/ LCD.RED0(2)/ Z_STATE†(3) N8 FLASH.CS3(0)/ GPIO3(7) N18 GPIO12(0)/ MCBSP3.FSX(1)/ TIMER.EXTCLK(3) N19 GPIO13(0)/ KB.R[5](1)/ LCD.BLUE0(2)/ Z_STATE†(3) N20 GPIO11(0)/ HDQ(1)/ ETM.PSTAT[5](5)/ RTDX.D[3](7) P2 FLASH.D[3] P3 FLASH.CS2U(0)/ GPIO5(1) P4 FLASH.D[4] P7 FLASH.D[5] P9 USB.DP(0)/ I2C.SDA(4) UART1.RX(5)/ USB.PUEN(7) P10 MCBSP2.DR(0)/ MCBSP2.DX(1)/ MCBSP2.DXZ(2)/ GPIO22(7) P11 MMC.CMD/ GPIO55(7) N7 FLASH.D[2] P8 FLASH.D[11] † Z_STATE = high-impedance “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZZG ball Y13), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). ‡ December 2003 − Revised December 2005 SPRS231E 35 Introduction Table 2−2. ZZG Package Terminal Assignments (Continued) ZZG BALL NO. SIGNAL P12 VSS P18 GPIO3(0)/ MCBSP3.FSX(2)/ LED1(3)/ ETM.PSTAT[3](5)/ RTDX.D[1](7) ZZG BALL NO. SIGNAL P13 CLK32K_IN P19 GPIO6(0)/ MCBSP3.FSX(2)/ TIMER.EVENT3(3)/ MCSI1.DIN(4)/ TMS(5) ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL P14 MCSI1.CLK(0)/ MCBSP3.DX(1)/ USB1.VM(2)/ TDI(3)/ MCBSP3.CLKX(4)/ GPIO43(7) P15 Z_STATE†(0)/ UWIRE.CS3(1)/ KB.C[6](2)/ SPIF.CS3(3)/ UART3.RX(4)/ Z_STATE†(6)/ GPIO44(7) P20 GPIO4(0)/ SPI.CS2(1)/ MCBSP3.FSX(2)/ TIMER.EVENT4(3)/ SPIF.DIN(4) R1 DVDD5 R3 FLASH.D[7] R4 FLASH.D[8] R8 USB.DM(0)/ I2C.SCL(4)/ UART1.TX(5)/ Z_STATE†(7) R10 MCLKREQ(0)/ EXT_MASTER_REQ(1)/ UART2.RX(2)/ MMC2.DAT3(6)/ GPIO23(7) R11 MMC.DAT0/ Z_STATE†(1)/ GPIO58(7) R12 PWRON_RESET R13 CLK32K_OUT(0)/ MPUIO0(4)/ USB1.SPEED(5)/ UART1.TX(6)/ GPIO36(7) R14 UART1.CTS(0)/ UART1.IRSEL(2)/ GPIO38(7) R18 GPIO0(0)/ USB.VBUS(2)/ SPIF.DOUT(3)/ MMC2.CLKIN(6) R19 GPIO1(0)/ UART3.RTS(1) R20 CVDD3 R21 VSS T2 FLASH.D[9] T3 FLASH.D[10] T20 MPUIO5(0)/ LOW_PWR(1)/ UART3.RTS(3)/ UART1.DTR(4) R2 FLASH.D[6] R9 UART2.RX(0)/ USB2.VM(1)/ USB0.VM(5)/ GPIO18(7) T4 FLASH.D[14] T18 I2C.SCL T19 MPUIO4(0)/ EXT_DMA_REQ1(1)/ LED2(2)/ UWIRE.CS2(3)/ SPIF.CS2(4)/ MCBSP3.DR(6) U1 FLASH.D[12] U2 VSS U3 FLASH.D[13] U4 FLASH.OE U18 UWIRE.SDI(0)/ UART3.DSR(1)/ UART1.DSR(2)/ MCBSP3.DR(3)/ SPIF.DIN(6)/ GPIO47(7) U19 MPUIO1(0)/ RTCK(1)/ SPIF.SCK(6) U20 MPU_RST(0)/ MPUIO14(6) U21 DVDD9 † Z_STATE = high-impedance “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZZG ball Y13), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). ‡ 36 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−2. ZZG Package Terminal Assignments (Continued) ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL V2 FLASH.RDY(0)/ GPIO10(1) V3 FLASH.D[15] V4 FLASH.WP V5 MCLK(0)/ MMC2.DATDIR0(6)/ GPIO24(7) V6 LOW_STATE§(0)/ UART2.TX(1)/ USB2.TXD(2)/ USB0.TXD(5)/ Z_STATE†(6)/ GPIO17(7) V7 MCBSP2.CLKR(0)/ GPIO11(1) V8 MPUIO3(0)/ MMC2.DAT1(6) V9 MCSI2.SYNC(0)/ GIOP7(1)/ USB2.SPEED(2)/ USB0.SPEED(5)/ MMC2.CMDDIR(6) V10 MMC.DAT1(0)/ MPUIO10(1)/ MPUIO7(2) V11 MMC.CLK(0)/ GPIO57(7) V12 DVDDRTC V13 OSC32K_IN V14 UART1.RX(0)/ UART1.IRRX(2)/ GPIO37(7) V15 MCSI1.DIN(0)/ USB1.RCV(1)/ EMU1(3)/ MCBSP3.DR(4)/ GPIO56(7) V16 EMU0 V17 TMS V19 UWIRE.SCLK(0)/ KB.C[7](1)/ MPUIO1(2)/ UART3.CTS(4) V20 I2C.SDA(0)/ GPIO48(7) W1 FLASH.RP(0)/ FLASH.CS2UWE(1) W4 USB.PUEN(0)/ USB.CLKO(1)/ USB.PUDIS(3)/ Z_STATE†(4)/ LOW_POWER(6)/ GPIO58(7) W5 LOW_STATE§(0)/ UART2.RTS(1)/ USB2.SE0(2)/ MPUIO5(3)/ MPUIO12(4)/ USB0.SE0(5)/ LOW_STATE§(6) W8 GPIO9(0)/ EMU0(3)/ MCSI1.SYNC(4)/ MMC2.DAT0 W9 MCSI2.DOUT(0)/ USB2.TXEN(1)/ USB0.TXEN(5)/ Z_STATE†(6)/ GPIO25(7) W13 RTC_WAKE_INT(0)/ USB1.SE0(4)/ RST_HOST_OUT(5)/ GPIO55(7) V18 W2 CONF¶ FLASH.WE W6 MCBSP2.FSR(0)/ GPIO12(1) W10 MMC.DAT2(0)/ Z_STATE†(1)/ MPUIO11(2) W3 OSC1_OUT W7 MCBSP2.FSX(0)/ GPIO21(7) W11 MMC.DAT3(0)/ MPUIO9(1)/ MPUIO6(2) W12 CVDDRTC † Z_STATE = high-impedance “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZZG ball Y13), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). ‡ December 2003 − Revised December 2005 SPRS231E 37 Introduction Table 2−2. ZZG Package Terminal Assignments (Continued) ZZG BALL NO. SIGNAL W14 MCSI1.DOUT(0)/ USB1.TXD(1)/ TDO(3)/ MCBSP3.DX(4)/ GPIO18(7)/ MCBSP3.DOUT_HIZ ZZG BALL NO. W15 SIGNAL BCLKREQ(0)/ UART3.CTS(1)/ MMC2.DAT2(6)/ GPIO40(7) ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL W16 Z_STATE†(0)/ MCBSP3.CLKX(1)/ USB1.TXEN(2)/ MCSI1.DIN_OUT(3)/ MCSI1.DIN(4)/ Z_STATE†(6)/ GPIO42(7) W17 EMU1 W20 VSS W21 UWIRE.SDO(0)/ UART3.DTR(1)/ UART1.DTR(2)/ MCBSP3.DX(3)/ UART3.RTS(4)/ MCBSP3.DXZ(5)/ SPIF.DOUT(6)/ GPIO46(7) Y3 VSS Y4 UART2.BCLK(0)/ SYS_CLK_IN(6) W18 TCK W19 BFAIL/EXT_FIQ(0)/ UART3.CTS(1)/ UART1.DSR(2)/ MMC.DATDIR1(6) Y1 FLASH.CS1U(0)/ GPIO16(7) Y2 OSC1_IN Y5 UART2.CTS(0)/ USB2.RCV(1)/ GPIO7(2)/ USB0.RCV(5) Y6 MCBSP2.CLKX(0)/ GPIO20(7) Y7 DVDD3 Y8 GPIO8(0)/ TRST(3)/ MCSI1.DOUT(4)/ MMC2.CMD Y10 MCSI2.CLK(0)/ USB2.SUSP(1)/ USB0.SUSP(5)/ MMC2.CLK(6)/ GPIO27(7) Y12 RTC_ON_NOFF(0) Y13 VSS# Y16 DVDD7 Y17 RTCK Y20 CVDD Y21 CVDDA Y9 CVDD Y14 LOW_STATE§(0)/ UART1.TX(1)/ UART1.IRTX(2) Y15 BCLK(0)/ UART3.RTS(1)/ CAM.OUTCLK(6)/ GPIO17(7) Y18 TRST Y19 TDI AA1 VSS AA7 VSS AA2 DVDD2 AA3 CVDD1 AA5 MCBSP2.DX(0)/ MCBSP2.DR(1)/ MCBSP2.DXZ(2)/ GPIO19(7) AA9 MCSI2.DIN(0)/ USB2.VP(1)/ USB0.VP(5)/ GPIO26(7) AA11 DVDD6 AA13 OSC32K_OUT † Z_STATE = high-impedance “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZZG ball Y13), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). ‡ 38 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−2. ZZG Package Terminal Assignments (Continued) ZZG BALL NO. SIGNAL AA15 LOW_STATE§(0)/ UART1.RTS(1)/ UART1.IRSHDN(2)/ Z_STATE†(6)/ GPIO39(7) AA21 VSS ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL ZZG BALL NO. SIGNAL AA17 MCSI1.SYNC(0)/ MCBSP3.DR(1)/ USB1.VP(2)/ MCBSP3.FSX(4) AA19 TDO AA20 RST_OUT(0)/ GPIO41(7) † Z_STATE = high-impedance ‡ “NC” denotes “No Connect”. § LOW_STATE = 0 ¶ Signal must be tied low. # For special consideration with respect to the connection of the V SS pin (ZZG ball Y13), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. NOTES: 1. Shading denotes signals with multiplexed functions. 2. The number within parenthesis at the end of a signal name denotes the Pin Mux setting (see the MUX CTRL SETTING column in Table 2−3 and Table 2−4). December 2003 − Revised December 2005 SPRS231E 39 Introduction 2.3 Terminal Characteristics and Multiplexing Table 2−3 describes terminal characteristics and the signals multiplexed on each ball for the ZDY/GDY package. Table 2−4 describes terminal characteristics and the signals multiplexed on each ball for the ZZG package. The table column headers are explained below: • BALL NO.: The package ball number. • SIGNAL NAME: The names of all the signals that are multiplexed on each ball. • TYPE: The signal direction. • MUX CTRL SETTING: Shows control of multiplexing modes. • PULLUP/PULLDN: Denotes the presence of an internal pullup or pulldown. Pullups and pulldowns can be enabled or disabled via software. • BUFFER STRENGTH: Drive strength of the associated output buffer. • OTHER: Contains various terminal information, such as buffer type, boundary scan capability, and gating/inhibit functionality. • RESET STATE: The state of the terminal at reset. • SUPPLY: The voltage supply which powers the terminal’s I/O buffers. NOTE: Care must be taken to avoid assigning multiple balls to the same signal. Violations may cause unexpected results. Table 2−3. ZDY/GDY Package Terminal Characteristics ZDY/ GDY BALL NO. SIGNAL NAME TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ OTHER¶ RESET STATE# SUPPLY E7 SDRAM.CS O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD4 A12 SDRAM.DQSH I/O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD4 A2 SDRAM.DQSL I/O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD4 D5 SDRAM.CAS O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD4 D4 SDRAM.RAS O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD4 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 40 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. SIGNAL NAME TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ OTHER¶ RESET STATE# SUPPLY C7 SDRAM.DQML O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD4 A8 SDRAM.DQMU O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD4 E6 SDRAM.WE O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD4 D10 E8 E9 F8 F9 C6 A10 E10 C8 D9 C3 F7 A1 B2 SDRAM.A[13:0] O NA 2 mA (Lv) 3 mA (Hv) A 0 DVDD4 C4 C5 SDRAM.BA[1:0] O NA 2 mA (Lv) 3 mA (Hv) A 0 DVDD4 B10 C10 B11 B9 SDRAM.D[15:0] I/O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD4 A7 SDRAM.CLK O NA 2 mA (Lv) 3 mA (Hv) A, K U DVDD4 A6 SDRAM.CLKX O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD4 B13 SDRAM.CKE O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD4 A11 B8 B12 C9 B7 A3 B6 B3 A5 A4 B5 B4 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 41 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. F10 A14 C12 TYPE† MUX CTRL SETTING (see Notes 3 and 4) LCD.AC O RegD[11:9] = 000 SYS_CLK_OUT O RegD[11:9] = 001 Z_STATE Z RegD[11:9] = 010 LCD.PCLK O RegD[17:15] = 000 Z_STATE Z RegD[17:15] = 001 LCD.P[15] O RegD[20:18] = 000 Z RegD[20:18] = 001 SIGNAL NAME Z_STATE D12 GPIO2 I/O RegD[20:18] = 111 LCD.P[14] O RegD[23:21] = 000 Z RegD[23:21] = 001 Z_STATE E11 GPIO35 I/O RegD[23:21] = 111 LCD.P[13] O RegD[26:24] = 000 Z_STATE A13 Z RegD[26:24] = 001 GPIO34 I/O RegD[26:24] = 111 LCD.P[12] O RegD[29:27] = 000 Z_STATE B14 A15 F11 B15 Z RegD[29:27] = 001 GPIO33 I/O RegD[29:27] = 111 LCD.P[11] O RegE[2:0] = 000 Z_STATE Z RegE[2:0] = 001 GPIO32 I/O RegE[2:0] = 111 LCD.P[10] O RegE[5:3] = 000 Z_STATE Z RegE[5:3] = 001 GPIO31 I/O RegE[5:3] = 111 LCD.P[9] O RegE[8:6] = 000 Z_STATE Z RegE[8:6] = 001 GPIO30 I/O RegE[8:6] = 111 LCD.VS O RegE[11:9] = 000 Z_STATE Z RegE[11:9] = 001 PULLUP/ PULLDN‡ BUFFER STRENGTH§ OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) F, A, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 42 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. C13 SIGNAL NAME LCD.P[8] Z_STATE D13 A16 C15 E12 D14 C16 B16 A17 D15 D16 E15 B17 C17 TYPE† MUX CTRL SETTING (see Notes 3 and 4) O RegE[14:12] = 000 Z RegE[14:12] = 001 GPIO29 I/O RegE[14:12] = 111 LCD.P[7] O RegE[17:15] = 000 Z_STATE Z RegE[17:15] = 001 LCD.P[6] O RegE[20:18] = 000 Z_STATE Z RegE[20:18] = 001 LCD.P[5] O RegE[23:21] = 000 Z_STATE Z RegE[23:21] = 001 LCD.P[4] O RegE[26:24] = 000 Z_STATE Z RegE[26:24] = 001 LCD.P[3] O RegE[29:27] = 000 Z_STATE Z RegE[29:27] = 001 LCD.P[2] O RegF[2:0] = 000 Z_STATE Z RegF[2:0] = 001 LCD.P[1] O RegF[5:3] = 000 Z_STATE Z RegF[5:3] = 001 LCD.P[0] O RegF[8:6] = 000 PULLUP/ PULLDN‡ Z_STATE Z RegF[8:6] = 001 LCD.HS O RegD[14:12] = 000 Z_STATE Z RegD[14:12] = 001 KB.C[4] O Reg3[5:3] = 000 PU20, GPIO27 I/O Reg3[5:3] = 111 PD20 KB.C[3] O Reg3[8:6] = 000 PU20, GPIO63 I/O Reg3[8:6] = 110 PD20 KB.C[2] O Reg3[11:9] = 000 PU20, GPIO61 I/O Reg3[11:9] = 111 PD20 KB.C[1] O Reg3[14:12] = 000 PU20, MPUIO6 I/O Reg3[14:12] = 001 PD20 BUFFER STRENGTH§ OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD1 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 43 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. F14 F13 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ KB.C[0] O Reg3[17:15] = 000 MPUIO0 I/O Reg3[17:15] = 001 PU20, PD20 KB.R[4] I Reg3[20:18] = 000 I/O Reg3[20:18] = 001 I Reg3[23:21] = 000 I/O SIGNAL NAME MPUIO15 D17 KB.R[3] MPUIO13 E16 F15 F17 G13 F16 G15 G14 G17 RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD1 PU100, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD1 PU100, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD1 Reg3[23:21] = 001 2 mA (Lv) 3 mA (Hv) A, F Z DVDD1 2 mA (Lv) 3 mA (Hv) A, F Z DVDD1 I Reg3[26:24] = 000 PU100, I/O Reg3[26:24] = 001 PD20 KB.R[1] I Reg3[29:27] = 000 PU100, MPUIO9 I/O Reg3[29:27] = 001 PD20 KB.R[0] I Reg4[2:0] = 000 PU100, Z DVDD1 I/O Reg4[2:0] = 001 PD20 2 mA (Lv) 3 mA (Hv) A, F MPUIO8 KB.C[5] O Reg3[2:0] = 000 DVDD1 Reg3[2:0] = 111 2 mA (Lv) 3 mA (Hv) 0 I/O PU20, PD20 A, F GPIO28 I Reg4[8:6] = 000 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F − DVDD1 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD1 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD1 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD1 KB.R[2] MPUIO10 E17 OTHER¶ MCBSP1.CLKS GPIO62 I/O Reg4[8:6] = 111 MCBSP1.CLKX I/O Reg4[11:9] = 000 GPIO54 I/O Reg4[11:9] = 111 MCBSP1.FSX I/O Reg4[14:12] = 000 MCBSP1.DX O Reg4[14:12] = 001 MCBSP1.DXZ O/Z Reg4[14:12] = 010 GPIO53 I/O Reg4[14:12] = 111 MCBSP1.DX O Reg4[17:15] = 000 MCBSP1.ESX I/O Reg4[17:15] = 001 MCBSP1.DXZ O/Z Reg4[17:15] = 010 GPIO52 I/O Reg4[17:15] = 111 I Reg4[20:18] = 000 I/O Reg4[20:18] = 111 MCBSP1.DR GPIO51 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 44 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. H12 G16 H14 H16 H15 H17 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ CAM.EXCLK O Reg4[23:21] = 000 PU20, ETM.SYNC[0] O Reg4[23:21] = 001 PD20 UWIRE.SDO O Reg4[23:21] = 010 LOW_STATE O Reg4[23:21] = 110 GPIO57 I/O Reg4[23:21] = 111 CAM.LCLK I Reg4[26:24] = 000 PU20, ETM.CLK O Reg4[26:24] = 001 PD20 UWIRE.SCLK O Reg4[26:24] = 010 GPIO39 I/O Reg4[26:24] = 111 MPU_BOOT I Reg8[29:27] = 000 USB1.SUSP O Reg8[29:27] = 010 CAM.D[7] I Reg4[29:27] = 000 PU20, ETM.D[7] O Reg4[29:27] = 001 UWIRE.CS0 O Reg4[29:27] = 010 MMC2.DAT2 I/O Reg4[29:27] = 011 GPIO35 I/O Reg4[29:27] = 111 CAM.D[6] I Reg5[2:0] = 000 ETM.D[6] O Reg5[2:0] = 001 UWIRE.CS3 O Reg5[2:0] = 010 MMC2.CMD I/O Reg5[2:0] = 011 GPIO34 SIGNAL NAME RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD8 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 2 mA (Lv) 3 mA (Hv) A, F − DVDD8 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 PD20 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 I/O Reg5[2:0] = 111 CAM.D[5] I Reg5[5:3] = 000 ETM.D[5] O Reg5[5:3] = 001 UWIRE.SDI I Reg5[5:3] = 010 I/O Reg5[5:3] = 111 I Reg5[8:6] = 000 PU20, PD20 GPIO33 J11 OTHER¶ CAM.D[4] ETM.D[4] O Reg5[8:6] = 001 UART3.TX O Reg5[8:6] = 010 GPIO32 I/O Reg5[8:6] = 111 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 45 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. H13 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ CAM.D[3] I Reg5[11:9] = 000 ETM.D[3] O Reg5[11:9] = 001 PU20, PD20 UART3.RX I Reg5[11:9] = 010 SIGNAL NAME GPIO31 J14 I/O Reg5[11:9] = 111 CAM.D[2] I Reg5[14:12] = 000 ETM.D[2] O Reg5[14:12] = 001 I Reg5[14:12] = 010 UART3.CTS GPIO30 J16 J17 J13 J12 I/O Reg5[14:12] = 111 CAM.D[1] I Reg5[17:15] = 000 ETM.D[1] O Reg5[17:15] = 001 UART3.RTS O Reg5[17:15] = 010 GPIO29 I/O Reg5[17:15] = 111 CAM.D[0] I Reg5[20:18] = 000 ETM.D[0] O Reg5[20:18] = 001 MPUIO12 I/O Reg5[20:18] = 010 MMC2.DAT3 I/O Reg5[20:18] = 011 I Reg5[23:21] = 000 ETM.PSTAT[2] O Reg5[23:21] = 001 MPUIO14 I/O Reg5[23:21] = 010 MMC2.DAT1 I/O Reg5[23:21] = 011 CAM.HS I Reg5[26:24] = 000 ETM.PSTAT[1] O Reg5[26:24] = 001 UART2.CTS I Reg5[26:24] = 010 MMC2.DAT0 I/O Reg5[26:24] = 011 GPIO38 I/O Reg5[26:24] = 111 CAM.VS OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 † I = Input, O = Output, Z = High-Impedance ‡ PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 46 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. K12 K17 K15 K16 K14 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ CAM.RSTZ O Reg5[29:27] = 000 ETM.PSTAT[0] O Reg5[29:27] = 001 PU20, PD20 UART2.RTS O Reg5[29:27] = 010 MMC2.CLK O Reg5[29:27] = 011 LOW_STATE O Reg5[29:27] = 110 GPIO37 I/O Reg5[29:27] = 111 LOW_STATE O Reg6[2:0] = 000 UART3.TX O Reg6[2:0] = 001 PWT O Reg6[2:0] = 010 UART2.TX O Reg6[2:0] = 100 TIMER.PWM0 O Reg6[2:0] = 101 GPIO50 I/O Reg6[2:0] = 111 UART3.RX I Reg6[5:3] = 000 PWL O Reg6[5:3] = 001 SIGNAL NAME RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD8 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F − DVDD9 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 UART2.RX I Reg6[5:3] = 011 TIMER.PWM1 O Reg6[5:3] = 100 GPIO49 I/O Reg6[5:3] = 111 GPIO15 I/O Reg6[8:6] = 000 PU100, KB.R[7] I Reg6[8:6] = 001 PD20 TIMER.PWM2 O Reg6[8:6] = 010 GPIO14 I/O Reg6[11:9] = 000 PU100, LZ DVDD9 I Reg6[11:9] = 001 PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 KB.R[6] LCD.RED0 O Reg6[11:9] = 010 PU100, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 Z_STATE L17 OTHER¶ Z Reg6[11:9] = 011 GPIO13 I/O Reg6[14:12] = 000 KB.R[5] I Reg6[14:12] = 001 LCD.BLUE0 O Reg6[14:12] = 010 Z_STATE Z Reg6[14:12] = 011 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 47 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. L16 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ GPIO12 I/O Reg6[17:15] = 000 MCBSP3.FSX I/O Reg6[17:15] = 001 PU20, PD20 I Reg6[17:15] = 011 GPIO11 I/O Reg6[20:18] = 000 HDQ I/O Reg6[20:18] = 001 ETM.PSTAT[5] O Reg6[20:18] = 101 RTDX.D[3] I/O Reg6[20:18] = 111 GPIO7 I/O Reg6[23:21] = 000 MMC.DAT2 I/O Reg6[23:21] = 001 SIGNAL NAME TIMER.EXTCLK K13 L15 TCK L14 M17 L13 M16 I Reg6[23:21] = 011 MCSI1.CLK I/O Reg6[23:21] = 100 ETM.SYNC[1] O Reg6[23:21] = 101 RTDX.D[2] I/O Reg6[23:21] = 111 GPIO6 I/O Reg6[26:24] = 000 MCBSP3.FSX I/O Reg6[26:24] = 010 TIMER.EVENT3 I Reg6[26:24] = 011 MCSI1.DIN I Reg6[26:24] = 100 TMS I Reg6[26:24] = 101 GPIO4 I/O Reg6[29:27] = 000 MCBSP3.FSX I/O Reg6[29:27] = 010 TIMER.EVENT4 I Reg6[29:27] = 011 SPIF.DIN I Reg6[29:27] = 100 GPIO3 I/O Reg7[2:0] = 000 MCBSP3.FSX I/O Reg7[2:0] = 010 LED1 O Reg7[2:0] = 011 ETM.PSTAT[3] O Reg7[2:0] = 101 GPIO2 I/O Reg7[5:3] = 000 ETM.PSTAT[4] O Reg7[5:3] = 101 RTDX.D[0] I/O Reg7[5:3] = 111 OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PD100, PU20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PD100, PU20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU100, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU100, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 48 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. M15 N17 N16 M14 L12 N14 N15 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ GPIO1 I/O Reg7[8:6] = 000 UART3.RTS O Reg7[8:6] = 001 PU100, PD20 GPIO0 SIGNAL NAME I/O Reg7[11:9] = 000 USB.VBUS I Reg7[11:9] = 010 SPIF.DOUT O Reg7[11:9] = 011 MMC2.CLKIN I Reg7[11:9] = 110 MPUIO5 I/O Reg7[14:12] = 000 LOW_PWR O Reg7[14:12] = 001 UART3.RTS O Reg7[14:12] = 011 UART1.DTR O Reg7[14:12] = 100 MPUIO4 I/O Reg7[17:15] = 000 EXT_DMA_REQ1 || I Reg7[17:15] = 001 LED2 O Reg7[17:15] = 010 UWIRE.CS2 O Reg7[17:15] = 011 SPIF.CS2 O Reg7[17:15] = 100 MCBSP3.DR I Reg7[17:15] = 110 MPUIO2 OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU20, PD20 2 mA (Lv) A, F LZ DVDD9 3 mA (Hv) PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU100, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 2 mA (Lv) 3 mA (Hv) A, F − DVDD9 2 mA (Lv) 3 mA (Hv) A, F Z DVDD9 I/O Reg7[20:18] = 000 EXT_DMA_REQ0 k I Reg7[20:18] = 001 UWIRE.CS1 O Reg7[20:18] = 010 SPIF.CS1 O Reg7[20:18] = 110 MPU_RST I Reg9[8:6] = 000 MPUIO14 I/O Reg9[8:6] = 110 MPUIO1 I/O Reg7[23:21] = 000 PU100, RTCK I/O Reg7[23:21] = 001 PD20 SPIF.SCK I/O Reg7[23:21] = 110 P16 I2C.SCL I/O/Z Reg7[26:24] = 000 2 mA (Lv) 3 mA (Hv) D Z DVDD9 M11 I2C.SDA I/O/Z Reg7[29:27] = 000 Z DVDD9 I Reg7[29:27] = 111 2 mA (Lv) 3 mA (Hv) D GPIO48 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 49 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. P14 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ UWIRE.SDI I Reg8[2:0] = 000 UART3.DSR O Reg8[2:0] = 001 PU20, PD20 UART1.DSR I Reg8[2:0] = 010 SIGNAL NAME MCBSP3.DR R15 P15 R17 I Reg8[2:0] = 011 SPIF.DIN I/O Reg8[2:0] = 110 GPIO47 I/O Reg8[2:0] = 111 UWIRE.SDO O Reg8[5:3] = 000 UART3.DTR O Reg8[5:3] = 001 UART1.DTR O Reg8[5:3] = 010 MCBSP3.DX O Reg8[5:3] = 011 UART3.RTS O Reg8[5:3] = 100 MCBSP3.DXZ O/Z Reg8[5:3] = 101 SPIF.DOUT I/O Reg8[5:3] = 110 GPIO46 I/O Reg8[5:3] = 111 UWIRE.SCLK O Reg8[8:6] = 000 KB.C[7] O Reg8[8:6] = 001 MPUIO1 I/O Reg8[8:6] = 010 UART3.CTS I Reg8[8:6] = 100 Z_STATE Z Reg8[11:9] = 000 UWIRE.CS0 O Reg8[11:9] = 001 MCBSP3.CLKX I/O Reg8[11:9] = 010 UART3.TX O Reg8[11:9] = 100 SPIF.CS0 I/O Reg8[11:9] = 110 GPIO45 I/O Reg8[11:9] = 111 OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD9 PU100, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD9 † I = Input, O = Output, Z = High-Impedance ‡ PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 50 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. R16 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ Z_STATE Z Reg8[14:12] = 000 UWIRE.CS3 O Reg8[14:12] = 001 PU20, PD20 KB.C[6] O Reg8[14:12] = 010 SPIF.CS3 O Reg8[14:12] = 011 UART3.RX I Reg8[14:12] = 100 Z_STATE Z Reg8[14:12] = 110 SIGNAL NAME GPIO44 T17 N12 I/O Reg8[14:12] = 111 BFAIL/EXT_FIQ I Reg8[17:15] = 000 UART3.CTS I Reg8[17:15] = 001 UART1.DSR I Reg8[17:15] = 010 MMC2.DATDIR1 O Reg8[17:15] = 110 RST_OUT O Reg9[11:9] = 000 GPIO41 I/O Reg9[11:9] = 111 OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F Z DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD9 R14 CONF I NA PU20, PD20 A LZ DVDD9 U17 TDI I NA PD100, PU20 A LZ DVDD9 T15 TDO O 0 Z DVDD9 M10 TMS I NA PD100, PU20 A LZ DVDD9 P13 TCK I NA PD100, PU20 A LZ DVDD9 R13 TRST I NA PU20, PD20 A − DVDD9 U16 EMU0 I/O NA PU100, PD20 2 mA (Lv) 3 mA (Hv) A Input DVDD9 N11 EMU1 I/O NA PU100, PD20 2 mA (Lv) 3 mA (Hv) A Input DVDD9 T14 RTCK I/O NA 2 mA (Lv) 3 mA (Hv) A − DVDD9 2 mA (Lv) 3 mA (Hv) † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 51 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. N10 U15 U14 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ MCSI1.SYNC I/O RegA[5:3] = 000 MCBSP3.DR I RegA[5:3] = 001 PU20, PD20 USB1.VP I RegA[5:3] = 010 MCBSP3.FSX I/O RegA[5:3] = 100 MCSI1.CLK I/O RegA[8:6] = 000 MCBSP3.DX O RegA[8:6] = 001 USB1.VM I RegA[8:6] = 010 TDI I RegA[8:6] = 011 MCBSP3.CLKX I/O RegA[8:6] = 100 GPIO43 I/O RegA[8:6] = 111 Z Reg9[5:3] = 000 MCBSP3.CLKX I/O Reg9[5:3] = 001 USB1.TXEN O Reg9[5:3] = 010 MCSI1.DIN_OUT O Reg9[5:3] = 011 MCSI1.DIN I Reg9[5:3] = 100 Z_STATE Z Reg9[5:3] = 110 I/O Reg9[5:3] = 111 MCSI1.DIN I RegA[11:9] = 000 USB1.RCV I RegA[11:9] = 001 I/O RegA[11:9] = 011 I RegA[11:9] = 100 SIGNAL NAME Z_STATE GPIO42 P12 EMU1 MCBSP3.DR GPIO56 R12 I/O RegA[11:9] = 111 I Reg9[29:27] = 000 UART3.CTS I Reg9[29:27] = 001 MMC2.DAT2 I/O Reg9[29:27] = 110 GPIO40 I/O Reg9[29:27] = 111 BCLKREQ OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD7 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD7 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD7 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD7 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD7 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 52 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. L10 R11 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ BCLK O RegA[2:0] = 000 UART3.RTS O RegA[2:0] = 001 PU20, PD20 CAM.OUTCLK O RegA[2:0] = 110 GPIO17 I/O RegA[2:0] = 111 LOW_STATE O Reg9[14:12] = 000 UART1.RTS O Reg9[14:12] = 001 UART1.IRSHDN O Reg9[14:12] = 010 Z_STATE Z Reg9[14:12] = 110 I/O Reg9[14:12] = 111 I Reg9[17:15] = 000 UART1.IRSEL O Reg9[17:15] = 010 GPIO38 I/O Reg9[17:15] = 111 UART1.RX I Reg9[20:18] = 000 UART1.IRRX I Reg9[20:18] = 010 SIGNAL NAME GPIO39 M9 U13 T12 P11 U12 U11 UART1.CTS GPIO37 I/O Reg9[20:18] = 111 LOW_STATE O Reg9[23:21] = 000 UART1.TX O Reg9[23:21] = 001 UART1.IRTX O Reg9[23:21] = 010 MCSI1.DOUT O Reg9[26:24] = 000 USB1.TXD O Reg9[26:24] = 001 TDO O Reg9[26:24] = 011 MCBSP3.DX O Reg9[26:24] = 100 GPIO18 I/O Reg9[26:24] = 111 CLK32K_OUT O RegA[14:12] = 000 MPUIO0 I/O RegA[14:12] = 100 USB1.SPEED O RegA[14:12] = 101 UART1.TX O RegA[14:12] = 110 GPIO36 I/O RegA[14:12] = 111 − NA OSC32K_IN OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD7 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD7 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD7 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD7 2 mA (Lv) 3 mA (Hv) A, B, F, G1 0 DVDD7 2 mA (Lv) 3 mA (Hv) A, B, F, G1, H3 0 DVDD7 2 mA (Lv) 3 mA (Hv) A U DVDDRTC E NA NA PU20, PD20 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 53 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. SIGNAL NAME TYPE† MUX CTRL SETTING (see Notes 3 and 4) U10 OSC32K_OUT − NA N9 RTC_WAKE_INT O Reg9[2:0] = 000 USB1.SE0 O Reg9[2:0] = 100 RST_HOST_OUT O Reg9[2:0] = 101 GPIO55 I/O Reg9[2:0] = 111 P10 RTC_ON_NOFF I Reg8[20:18] = 000 T11 CLK32K_IN I RegA[17:15] = 000 N8 PWRON_RESET I NA P9 MMC.DAT3 I/O Reg10[17:15] = 000 MPUIO9 I/O Reg10[17:15] = 001 MPUIO6 I/O Reg10[17:15] = 010 MMC.CLK O RegA[23:21] = 000 GPIO57 I/O RegA[23:21] = 111 MMC.DAT0 I/O RegB[2:0] = 000 Z RegB[2:0] = 001 M8 R8 Z_STATE T9 U9 N7 P8 GPIO58 I/O RegB[2:0] = 111 MMC.DAT2 I/O RegA[20:18] = 000 Z_STATE Z RegA[20:18] = 001 MPUIO11 I/O RegA[20:18] = 010 MMC.DAT1 I/O RegA[26:24] = 000 MPUIO10 I/O RegA[26:24] = 001 MPUIO7 I/O RegA[26:24] = 010 MMC.CMD I/O RegA[29:27] = 000 GPIO55 I/O RegA[29:27] = 111 MCSI2.CLK I/O RegB[5:3] = 000 USB2.SUSP O RegB[5:3] = 001 USB0.SUSP O RegB[5:3] = 101 MMC2.CLK O RegB[5:3] = 110 GPIO27 I/O RegB[5:3] = 111 PULLUP/ PULLDN‡ BUFFER STRENGTH§ OTHER¶ RESET STATE# SUPPLY E NA NA 2 mA (Lv) 3 mA (Hv) A, B 0 DVDDRTC 2 mA (Lv) 3 mA (Hv) A, B, G1 Z DVDDRTC A Input DVDDRTC A Input DVDDRTC PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD6 PD100, PU20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD6 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD6 PD100, PU20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD6 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD6 PD100, PU20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD6 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD3 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 54 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. R7 T8 U8 T7 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ MCSI2.DIN I RegB[8:6] = 000 USB2.VP I RegB[8:6] = 001 PU20, PD20 USB0.VP I RegB[8:6] = 101 SIGNAL NAME GPIO26 I/O RegB[8:6] = 111 MCSI2.DOUT O RegB[11:9] = 000 USB2.TXEN O RegB[11:9] = 001 USB0.TXEN O RegB[11:9] = 101 Z_STATE Z RegB[11:9] = 110 GPIO25 I/O RegB[11:9] = 111 MCSI2.SYNC I/O RegB[14:12] = 000 GPIO7 I/O RegB[14:12] = 001 USB2.SPEED O RegB[14:12] = 010 USB0.SPEED O RegB[14:12] = 110 MMC2.CMDDIR O RegB[14:12] = 111 MCLKREQ I RegB[20:18] = 000 EXT_MASTER_REQ O RegB[20:18] = 001 UART2.RX U7 P7 R6 I RegB[20:18] = 010 MMC2.DAT3 I/O RegB[20:18] = 110 GPIO23 I/O RegB[20:18] = 111 GPIO9 I/O RegB[23:21] = 000 EMU0 I/O RegB[23:21] = 011 MCSI1.SYNC I/O RegB[23:21] = 100 MMC2.DAT0 I/O RegB[23:21] = 110 GPIO8 I/O RegB[26:24] = 000 TRST I RegB[26:24] = 011 MCSI1.DOUT O RegB[26:24] = 100 MMC2.CMD I/O RegB[26:24] = 110 MPUIO3 I/O RegB[29:27] = 000 MMC2.DAT1 I/O RegB[29:27] = 110 OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G2 0 DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G3 LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G3 LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD3 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 55 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. L8 SIGNAL NAME MCBSP2.DR MCBSP2.DX N6 U6 U5 R5 T5 U4 MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ I RegC[2:0] = 000 PU20, PD20 O RegC[2:0] = 001 MCBSP2.DXZ O/Z RegC[2:0] = 010 GPIO22 I/O RegC[2:0] = 111 MCBSP2.FSX I/O RegC[5:3] = 000 GPIO21 I/O RegC[5:3] = 111 MCBSP2.CLKR I/O RegC[8:6] = 000 GPIO11 I/O RegC[8:6] = 001 MCBSP2.CLKX I/O RegC[11:9] = 000 GPIO20 I/O RegC[11:9] = 111 MCBSP2.FSR I/O RegC[14:12] = 000 GPIO12 I/O RegC[14:12] = 001 MCBSP2.DX O RegC[17:15] = 000 MCBSP2.DR I RegC[17:15] = 001 MCBSP2.DXZ O/Z RegC[17:15] = 010 GPIO19 I/O RegC[17:15] = 111 UART2.RX I RegC[20:18] = 000 USB2.VM I RegC[20:18] = 001 USB0.VM I RegC[20:18] = 101 I/O RegC[20:18] = 111 UART2.CTS I RegC[23:21] = 000 USB2.RCV I RegC[23:21] = 001 I/O RegC[23:21] = 010 I RegC[23:21] = 101 GPIO18 P6 TYPE† GPIO7 USB0.RCV OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G2 LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G2 LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G2 LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G2 0 DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD3 † I = Input, O = Output, Z = High-Impedance ‡ PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 56 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. T4 R4 P5 U3 P4 T2 TYPE† MUX CTRL SETTING (see Notes 3 and 4) LOW_STATE O UART2.RTS USB2.SE0 MPUIO5 I/O RegC[26:24] = 011 MPUIO12 I/O RegC[26:24] = 100 USB0.SE0 O RegC[26:24] = 101 LOW_STATE O RegC[26:24] = 110 LOW_STATE O RegC[29:27] = 000 UART2.TX O RegC[29:27] = 001 USB2.TXD O RegC[29:27] = 010 USB0.TXD O RegC[29:27] = 101 Z_STATE Z RegC[29:27] = 110 GPIO17 I/O RegC[29:27] = 111 UART2.BCLK O RegD[2:0] = 000 SIGNAL NAME BUFFER STRENGTH§ OTHER¶ RESET STATE# SUPPLY RegC[26:24] = 000 2 mA (Lv) A, F, G2 0 DVDD3 O RegC[26:24] = 001 3 mA (Hv) O RegC[26:24] = 010 2 mA (Lv) 3 mA (Hv) A, F, G2 0 DVDD3 2 mA (Lv) 3 mA (Hv) A, F, G2 0 DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 1 DVDD2 18.3 mA (in USB mode) C Z DVDD2 SYS_CLK_IN I RegD[2:0] = 110 MCLK O RegB[17:15] = 000 MMC2.DATDIR0 O RegB[17:15] = 110 GPIO24 I/O RegB[17:15] = 111 USB.PUEN O RegD[5:3] = 000 USB.CLKO O RegD[5:3] = 001 USB.PUDIS O RegD[5:3] = 011 Z_STATE Z RegD[5:3] = 100 LOW_POWER O RegD[5:3] = 110 GPIO58 I/O RegD[5:3] = 111 USB.DP I/O USBTCTL[6:4] = 000 I2C.SDA I/O/Z USBTCTL[6:4] = 100 UART1.RX I USBTCTL[6:4] = 101 USB.PUEN O USBTCTL[6:4] = 111 PULLUP/ PULLDN‡ PU20, PD20 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 57 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. U1 SIGNAL NAME TYPE† USB.DM I/O I2C.SCL MUX CTRL SETTING (see Notes 3 and 4) I/O/Z USBTCTL[6:4] = 100 UART1.TX O USBTCTL[6:4] = 101 Z_STATE Z USBTCTL[6:4] = 111 R2 OSC1_IN I NA P2 OSC1_OUT O NA T1 FLASH.CS1U O RegF[14:12] = 000 PULLUP/ PULLDN‡ BUFFER STRENGTH§ 18.3 mA (in USB mode) OTHER¶ RESET STATE# SUPPLY C Z DVDD2 E NA NA E NA NA 2 mA (Lv) 3 mA (Hv) A, F 1 DVDD5 GPIO16 I/O RegF[14:12] = 111 R3 FLASH.WP O NA 2 mA (Lv) 3 mA (Hv) A 0 DVDD5 P3 FLASH.WE O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD5 N3 FLASH.RP O RegF[23:21] = 000 2 mA (Lv) 3 mA (Hv) A 0 DVDD5 FLASH.CS2UWE O RegF[23:21] = 001 M5 FLASH.OE O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD5 F3 J4 FLASH.A[25:17] O NA 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 G5 FLASH.A[16] O Reg11[5:3] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 G2 FLASH.A[15] O Reg11[8:6] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 G4 FLASH.A[14] O Reg11[11:9] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 G3 FLASH.A[13] O Reg11[14:12] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 F5 FLASH.A[12] O Reg11[17:15] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 J2 H2 H5 F4 H4 H3 G6 PU20, PD20 PU20, PD20 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 58 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. SIGNAL NAME TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ OTHER¶ RESET STATE# SUPPLY F1 FLASH.A[11] O Reg11[20:18] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 F2 FLASH.A[10] O Reg11[23:21] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 E1 FLASH.A[9] O Reg11[26:24] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 D1 FLASH.A[8] O Reg12[5:3] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 E2 FLASH.A[7] O Reg12[8:6] = 000 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 C1 FLASH.A[6] O Reg12[11:9] = 000 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 D2 FLASH.A[5] O Reg12[14:12] = 000 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 E3 FLASH.A[4] O Reg12[17:15] = 000 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 E4 FLASH.A[3] O Reg12[20:18] = 000 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 C2 FLASH.A[2] O Reg12[23:21] = 000 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 D3 FLASH.A[1] O Reg12[26:24] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 N4 R1 FLASH.D[15:0] I/O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD5 P1 K7 PU20, PD20 M3 M4 N2 L5 N1 K6 L4 M2 J7 L2 M1 L1 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 59 Introduction Table 2−3. ZDY/GDY Package Terminal Characteristics (Continued) ZDY/ GDY BALL NO. K1 L6 TYPE† MUX CTRL SETTING (see Notes 3 and 4) FLASH.CLK O Reg10[23:21] = 000 FLASH.CS2UOE O Reg10[23:21] = 001 FLASH.RDY I RegF[29:27] = 000 SIGNAL NAME PULLUP/ PULLDN‡ PU100, PD20 BUFFER STRENGTH§ OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, K, G1 0 DVDD5 2 mA (Lv) 3 mA (Hv) A, F Input DVDD5 GPIO10 I/O RegF[29:27] = 001 H6 FLASH.ADV O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD5 J8 FLASH.CS2 O RegD[8:6] = 000 1 DVDD5 O RegD[8:6] = 001 2 mA (Lv) 3 mA (Hv) A FLASH.BAA 2 mA (Lv) 3 mA (Hv) A, F, G1 Input DVDD5 2 mA (Lv) 3 mA (Hv) A 1 DVDD5 2 mA (Lv) 3 mA (Hv) A, F 1 DVDD5 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD5 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD5 2 mA (Lv) 3 mA (Hv) A, F 1 DVDD5 J5 J3 K3 J1 K2 J6 FLASH.CS2L O RegD[8:6] = 010 GPIO62 I/O Reg10[2:0] = 000 FLASH.CS0 O Reg10[2:0] = 001 FLASH.CS1 O Reg10[29:27] = 000 FLASH.CS1L O Reg10[29:27] = 001 FLASH.CS2U O Reg10[20:18] = 000 GPIO5 I/O Reg10[20:18] = 001 FLASH.BE[0] O Reg10[8:6] = 000 FLASH.CS2UOE O Reg10[8:6] = 001 GPIO59 I/O Reg10[8:6] = 111 FLASH.BE[1] O Reg10[5:3] = 000 FLASH.CS2UWE O Reg10[5:3] = 001 GPIO60 I/O Reg10[5:3] = 111 FLASH.CS3 O Reg10[26:24] = 000 GPIO3 I/O Reg10[26:24] = 111 PU100 † I = Input, O = Output, Z = High-Impedance ‡ PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 60 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−4. ZZG Package Terminal Characteristics ZZG BALL NO. SIGNAL NAME TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ OTHER¶ RESET STATE# SUPPLY G8 SDRAM.CS O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD4 C14 SDRAM.DQSH I/O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD4 D4 SDRAM.DQSL I/O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD4 B4 SDRAM.CAS O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD4 H7 SDRAM.RAS O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD4 C8 SDRAM.DQML O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD4 D10 SDRAM.DQMU O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD4 H8 SDRAM.WE O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD4 H11 H9 H10 B8 B12 G9 G11 G12 B9 G10 A1 B6 B2 A2 SDRAM.A[13:0] O NA 2 mA (Lv) 3 mA (Hv) A 0 DVDD4 C3 B3 SDRAM.BA[1:0] O NA 2 mA (Lv) 3 mA (Hv) A 0 DVDD4 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 61 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. SIGNAL NAME TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ OTHER¶ RESET STATE# SUPPLY C12 D12 D13 C11 C13 D11 D14 C10 D8 C4 C7 D5 D7 C5 C6 D6 SDRAM.D[15:0] I/O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD4 C9 SDRAM.CLK O NA 2 mA (Lv) 3 mA (Hv) A, K U DVDD4 D9 SDRAM.CLKX O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD4 H12 SDRAM.CKE O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD4 B15 LCD.AC O RegD[11:9] = 000 0 DVDD1 O RegD[11:9] = 001 2 mA (Lv) 3 mA (Hv) A, F, G1 SYS_CLK_OUT 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) F, A, G1 0 DVDD1 C15 D15 C16 A17 Z_STATE Z RegD[11:9] = 010 LCD.PCLK O RegD[17:15] = 000 Z_STATE Z RegD[17:15] = 001 LCD.P[15] O RegD[20:18] = 000 Z_STATE Z RegD[20:18] = 001 GPIO2 I/O RegD[20:18] = 111 LCD.P[14] O RegD[23:21] = 000 Z_STATE Z RegD[23:21] = 001 GPIO35 I/O RegD[23:21] = 111 LCD.P[13] O RegD[26:24] = 000 Z_STATE Z RegD[26:24] = 001 I/O RegD[26:24] = 111 GPIO34 † I = Input, O = Output, Z = High-Impedance ‡ PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 62 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. G13 B17 TYPE† MUX CTRL SETTING (see Notes 3 and 4) LCD.P[12] O RegD[29:27] = 000 Z_STATE Z RegD[29:27] = 001 GPIO33 I/O RegD[29:27] = 111 LCD.P[11] O RegE[2:0] = 000 Z RegE[2:0] = 001 SIGNAL NAME Z_STATE C17 GPIO32 I/O RegE[2:0] = 111 LCD.P[10] O RegE[5:3] = 000 Z RegE[5:3] = 001 Z_STATE D16 GPIO31 I/O RegE[5:3] = 111 LCD.P[9] O RegE[8:6] = 000 Z RegE[8:6] = 001 Z_STATE B18 D17 C18 B19 A20 H13 G14 C19 GPIO30 I/O RegE[8:6] = 111 LCD.VS O RegE[11:9] = 000 Z_STATE Z RegE[11:9] = 001 LCD.P[8] O RegE[14:12] = 000 Z_STATE Z RegE[14:12] = 001 GPIO29 I/O RegE[14:12] = 111 LCD.P[7] O RegE[17:15] = 000 Z_STATE Z RegE[17:15] = 001 LCD.P[6] O RegE[20:18] = 000 Z_STATE Z RegE[20:18] = 001 LCD.P[5] O RegE[23:21] = 000 Z_STATE Z RegE[23:21] = 001 LCD.P[4] O RegE[26:24] = 000 Z_STATE Z RegE[26:24] = 001 LCD.P[3] O RegE[29:27] = 000 Z_STATE Z RegE[29:27] = 001 LCD.P[2] O RegF[2:0] = 000 Z_STATE Z RegF[2:0] = 001 PULLUP/ PULLDN‡ OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 BUFFER STRENGTH§ † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset H1 = Terminal may be 3-stated by BFAIL input D = I2C input/output buffers E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 63 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. B21 D18 C20 C21 E18 D19 D20 F18 E19 TYPE† MUX CTRL SETTING (see Notes 3 and 4) LCD.P[1] O RegF[5:3] = 000 Z_STATE Z RegF[5:3] = 001 LCD.P[0] O RegF[8:6] = 000 Z_STATE Z RegF[8:6] = 001 LCD.HS O RegD[14:12] = 000 Z_STATE Z RegD[14:12] = 001 KB.C[4] O Reg3[5:3] = 000 PU20, GPIO27 I/O Reg3[5:3] = 111 PD20 KB.C[3] O Reg3[8:6] = 000 PU20, GPIO63 I/O Reg3[8:6] = 110 PD20 KB.C[2] O Reg3[11:9] = 000 PU20, GPIO61 I/O Reg3[11:9] = 111 PD20 KB.C[1] O Reg3[14:12] = 000 PU20, SIGNAL NAME G18 G19 G20 SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD1 I/O Reg3[14:12] = 001 KB.C[0] O Reg3[17:15] = 000 DVDD1 Reg3[17:15] = 001 2 mA (Lv) 3 mA (Hv) 0 I/O PU20, PD20 A, F MPUIO0 PU100, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD1 KB.R[4] KB.R[3] I Reg3[20:18] = 000 I/O Reg3[20:18] = 001 I Reg3[23:21] = 000 2 mA (Lv) 3 mA (Hv) Z DVDD1 Reg3[23:21] = 001 PU100, PD20 A, F I/O 2 mA (Lv) 3 mA (Hv) A, F Z DVDD1 2 mA (Lv) 3 mA (Hv) A, F Z DVDD1 I Reg3[26:24] = 000 PU100, I/O Reg3[26:24] = 001 PD20 KB.R[1] I Reg3[29:27] = 000 PU100, MPUIO9 I/O Reg3[29:27] = 001 PD20 KB.R[0] I Reg4[2:0] = 000 PU100, 2 mA (Lv) 3 mA (Hv) A, F Z DVDD1 KB.R[2] MPUIO10 F19 RESET STATE# MPUIO6 MPUIO13 H14 OTHER¶ BUFFER STRENGTH§ PD20 MPUIO15 E20 PULLUP/ PULLDN‡ MPUIO8 I/O Reg4[2:0] = 001 PD20 KB.C[5] O Reg3[2:0] = 000 DVDD1 Reg3[2:0] = 111 2 mA (Lv) 3 mA (Hv) 0 I/O PU20, PD20 A, F GPIO28 I Reg4[8:6] = 000 2 mA (Lv) 3 mA (Hv) − DVDD1 Reg4[8:6] = 111 PU20, PD20 A, F I/O MCBSP1.CLKS GPIO62 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 64 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. G21 H15 H18 H20 H19 J15 J20 J18 OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD1 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD1 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD1 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD1 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD8 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 2 mA (Lv) 3 mA (Hv) A, F − DVDD8 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ MCBSP1.CLKX I/O Reg4[11:9] = 000 GPIO54 I/O Reg4[11:9] = 111 PU20, PD20 MCBSP1.FSX I/O Reg4[14:12] = 000 MCBSP1.DX O Reg4[14:12] = 001 MCBSP1.DXZ O/Z Reg4[14:12] = 010 GPIO53 I/O Reg4[14:12] = 111 MCBSP1.DX O Reg4[17:15] = 000 MCBSP1.ESX I/O Reg4[17:15] = 001 MCBSP1.DXZ O/Z Reg4[17:15] = 010 GPIO52 I/O Reg4[17:15] = 111 I Reg4[20:18] = 000 SIGNAL NAME GPIO51 I/O Reg4[20:18] = 111 PU20, PD20 CAM.EXCLK O Reg4[23:21] = 000 PU20, PD20 MCBSP1.DR ETM.SYNC[0] O Reg4[23:21] = 001 UWIRE.SDO O Reg4[23:21] = 010 LOW_STATE O Reg4[23:21] = 110 GPIO57 I/O Reg4[23:21] = 111 CAM.LCLK I Reg4[26:24] = 000 PU20, ETM.CLK O Reg4[26:24] = 001 PD20 UWIRE.SCLK O Reg4[26:24] = 010 GPIO39 I/O Reg4[26:24] = 111 MPU_BOOT I Reg8[29:27] = 000 USB1.SUSP O Reg8[29:27] = 010 CAM.D[7] I Reg4[29:27] = 000 PU20, PD20 ETM.D[7] O Reg4[29:27] = 001 UWIRE.CS0 O Reg4[29:27] = 010 MMC2.DAT2 I/O Reg4[29:27] = 011 GPIO35 I/O Reg4[29:27] = 111 † I = Input, O = Output, Z = High-Impedance ‡ PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 65 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. J19 J14 L19 A, F Z DVDD8 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 A, F Z DVDD8 CAM.D[6] I Reg5[2:0] = 000 ETM.D[6] O Reg5[2:0] = 001 PU20, PD20 UWIRE.CS3 O Reg5[2:0] = 010 MMC2.CMD I/O Reg5[2:0] = 011 GPIO34 I/O Reg5[2:0] = 111 CAM.D[5] I Reg5[5:3] = 000 ETM.D[5] O Reg5[5:3] = 001 I Reg5[5:3] = 010 I/O Reg5[5:3] = 111 CAM.D[4] I Reg5[8:6] = 000 PU20, ETM.D[4] O Reg5[8:6] = 001 PD20 2 mA (Lv) 3 mA (Hv) UART3.TX O Reg5[8:6] = 010 GPIO32 I/O Reg5[8:6] = 111 CAM.D[3] I Reg5[11:9] = 000 DVDD8 Reg5[11:9] = 001 2 mA (Lv) 3 mA (Hv) Z O PU20, PD20 A, F ETM.D[3] UART3.RX I Reg5[11:9] = 010 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 I/O Reg5[11:9] = 111 CAM.D[2] I Reg5[14:12] = 000 ETM.D[2] O Reg5[14:12] = 001 UART3.CTS I Reg5[14:12] = 010 I/O Reg5[14:12] = 111 CAM.D[1] I Reg5[17:15] = 000 ETM.D[1] O Reg5[17:15] = 001 UART3.RTS O Reg5[17:15] = 010 GPIO29 GPIO30 K14 2 mA (Lv) 3 mA (Hv) BUFFER STRENGTH§ GPIO31 K15 SUPPLY PULLUP/ PULLDN‡ GPIO33 K19 RESET STATE# MUX CTRL SETTING (see Notes 3 and 4) UWIRE.SDI K18 OTHER¶ TYPE† SIGNAL NAME I/O Reg5[17:15] = 111 CAM.D[0] I Reg5[20:18] = 000 ETM.D[0] O Reg5[20:18] = 001 MPUIO12 I/O Reg5[20:18] = 010 MMC2.DAT3 I/O Reg5[20:18] = 011 † I = Input, O = Output, Z = High-Impedance ‡ PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset H1 = Terminal may be 3-stated by BFAIL input D = I2C input/output buffers E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 66 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. L18 L15 M19 M18 L14 M20 OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD8 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD8 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F − DVDD9 Reg6[8:6] = 000 PU100, A, F, G1 LZ DVDD9 I Reg6[8:6] = 001 PD20 2 mA (Lv) 3 mA (Hv) O Reg6[8:6] = 010 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ CAM.VS I Reg5[23:21] = 000 ETM.PSTAT[2] O Reg5[23:21] = 001 PU20, PD20 MPUIO14 I/O Reg5[23:21] = 010 MMC2.DAT1 I/O Reg5[23:21] = 011 CAM.HS I Reg5[26:24] = 000 ETM.PSTAT[1] O Reg5[26:24] = 001 UART2.CTS I Reg5[26:24] = 010 MMC2.DAT0 I/O Reg5[26:24] = 011 GPIO38 I/O Reg5[26:24] = 111 CAM.RSTZ O Reg5[29:27] = 000 ETM.PSTAT[0] O Reg5[29:27] = 001 UART2.RTS O Reg5[29:27] = 010 MMC2.CLK O Reg5[29:27] = 011 LOW_STATE O Reg5[29:27] = 110 GPIO37 I/O Reg5[29:27] = 111 LOW_STATE O Reg6[2:0] = 000 UART3.TX O Reg6[2:0] = 001 PWT O Reg6[2:0] = 010 UART2.TX O Reg6[2:0] = 100 TIMER.PWM0 O Reg6[2:0] = 101 GPIO50 I/O Reg6[2:0] = 111 UART3.RX I Reg6[5:3] = 000 PWL O Reg6[5:3] = 001 UART2.RX I Reg6[5:3] = 011 TIMER.PWM1 O Reg6[5:3] = 100 GPIO49 I/O Reg6[5:3] = 111 GPIO15 I/O KB.R[7] TIMER.PWM2 SIGNAL NAME † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset H1 = Terminal may be 3-stated by BFAIL input D = I2C input/output buffers E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 67 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. N21 N19 N18 M15 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU100, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PD100, PU20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PD100, PU20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 BUFFER STRENGTH§ GPIO14 I/O Reg6[11:9] = 000 PU100, KB.R[6] I Reg6[11:9] = 001 PD20 LCD.RED0 O Reg6[11:9] = 010 Z_STATE Z Reg6[11:9] = 011 GPIO13 I/O Reg6[14:12] = 000 KB.R[5] I Reg6[14:12] = 001 LCD.BLUE0 O Reg6[14:12] = 010 Z_STATE Z Reg6[14:12] = 011 GPIO12 I/O Reg6[17:15] = 000 MCBSP3.FSX I/O Reg6[17:15] = 001 I Reg6[17:15] = 011 GPIO11 I/O Reg6[20:18] = 000 HDQ I/O Reg6[20:18] = 001 ETM.PSTAT[5] O Reg6[20:18] = 101 RTDX.D[3] I/O Reg6[20:18] = 111 GPIO7 I/O Reg6[23:21] = 000 MMC.DAT2 I/O Reg6[23:21] = 001 I Reg6[23:21] = 011 MCSI1.CLK I/O Reg6[23:21] = 100 ETM.SYNC[1] O Reg6[23:21] = 101 RTDX.D[2] I/O Reg6[23:21] = 111 GPIO6 I/O Reg6[26:24] = 000 MCBSP3.FSX I/O Reg6[26:24] = 010 TIMER.EVENT3 I Reg6[26:24] = 011 MCSI1.DIN I Reg6[26:24] = 100 TMS P20 SUPPLY PULLUP/ PULLDN‡ TCK P19 RESET STATE# MUX CTRL SETTING (see Notes 3 and 4) TIMER.EXTCLK N20 OTHER¶ TYPE† SIGNAL NAME I Reg6[26:24] = 101 GPIO4 I/O Reg6[29:27] = 000 MCBSP3.FSX I/O Reg6[29:27] = 010 TIMER.EVENT4 I Reg6[29:27] = 011 SPIF.DIN I Reg6[29:27] = 100 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 68 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. P18 M14 R19 R18 T20 T19 N15 U20 OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU100, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU100, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU20, PD20 2 mA (Lv) A, F LZ DVDD9 3 mA (Hv) PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 PU100, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD9 2 mA (Lv) 3 mA (Hv) A, F − DVDD9 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ GPIO3 I/O Reg7[2:0] = 000 MCBSP3.FSX I/O Reg7[2:0] = 010 PU100, PD20 LED1 O Reg7[2:0] = 011 ETM.PSTAT[3] O Reg7[2:0] = 101 GPIO2 I/O Reg7[5:3] = 000 ETM.PSTAT[4] O Reg7[5:3] = 101 RTDX.D[0] I/O Reg7[5:3] = 111 GPIO1 I/O Reg7[8:6] = 000 UART3.RTS O Reg7[8:6] = 001 GPIO0 I/O Reg7[11:9] = 000 USB.VBUS I Reg7[11:9] = 010 SPIF.DOUT O Reg7[11:9] = 011 MMC2.CLKIN I Reg7[11:9] = 110 MPUIO5 I/O Reg7[14:12] = 000 LOW_PWR O Reg7[14:12] = 001 UART3.RTS O Reg7[14:12] = 011 UART1.DTR O Reg7[14:12] = 100 MPUIO4 I/O Reg7[17:15] = 000 EXT_DMA_REQ1 || I Reg7[17:15] = 001 LED2 O Reg7[17:15] = 010 UWIRE.CS2 O Reg7[17:15] = 011 SPIF.CS2 O Reg7[17:15] = 100 MCBSP3.DR I Reg7[17:15] = 110 I/O Reg7[20:18] = 000 EXT_DMA_REQ0 k I Reg7[20:18] = 001 UWIRE.CS1 O Reg7[20:18] = 010 SPIF.CS1 O Reg7[20:18] = 110 MPU_RST I Reg9[8:6] = 000 MPUIO14 I/O Reg9[8:6] = 110 SIGNAL NAME MPUIO2 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset H1 = Terminal may be 3-stated by BFAIL input D = I2C input/output buffers E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 69 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. U19 OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F Z DVDD9 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ MPUIO1 I/O Reg7[23:21] = 000 PU100, RTCK I/O Reg7[23:21] = 001 PD20 SIGNAL NAME I/O Reg7[23:21] = 110 T18 SPIF.SCK I2C.SCL I/O/Z Reg7[26:24] = 000 2 mA (Lv) 3 mA (Hv) D Z DVDD9 V20 I2C.SDA I/O/Z Reg7[29:27] = 000 D Z DVDD9 GPIO48 I Reg7[29:27] = 111 2 mA (Lv) 3 mA (Hv) UWIRE.SDI I Reg8[2:0] = 000 DVDD9 Reg8[2:0] = 001 2 mA (Lv) 3 mA (Hv) LZ O PU20, PD20 A, F UART3.DSR UART1.DSR I Reg8[2:0] = 010 MCBSP3.DR I Reg8[2:0] = 011 SPIF.DIN I/O Reg8[2:0] = 110 GPIO47 I/O Reg8[2:0] = 111 UWIRE.SDO O Reg8[5:3] = 000 DVDD9 Reg8[5:3] = 001 2 mA (Lv) 3 mA (Hv) 0 O PU20, PD20 A, F, G1 UART3.DTR UART1.DTR O Reg8[5:3] = 010 MCBSP3.DX O Reg8[5:3] = 011 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD9 U18 W21 UART3.RTS V19 O Reg8[5:3] = 100 MCBSP3.DXZ O/Z Reg8[5:3] = 101 SPIF.DOUT I/O Reg8[5:3] = 110 GPIO46 I/O Reg8[5:3] = 111 UWIRE.SCLK O Reg8[8:6] = 000 KB.C[7] O Reg8[8:6] = 001 MPUIO1 I/O Reg8[8:6] = 010 I Reg8[8:6] = 100 UART3.CTS † I = Input, O = Output, Z = High-Impedance ‡ PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset H1 = Terminal may be 3-stated by BFAIL input D = I2C input/output buffers E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 70 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. N14 P15 AA20 RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F Z DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD9 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD9 MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ Z_STATE Z Reg8[11:9] = 000 UWIRE.CS0 O Reg8[11:9] = 001 PU100, PD20 MCBSP3.CLKX I/O Reg8[11:9] = 010 UART3.TX O Reg8[11:9] = 100 SPIF.CS0 I/O Reg8[11:9] = 110 GPIO45 I/O Reg8[11:9] = 111 Z_STATE Z Reg8[14:12] = 000 UWIRE.CS3 O Reg8[14:12] = 001 KB.C[6] O Reg8[14:12] = 010 SPIF.CS3 O Reg8[14:12] = 011 UART3.RX I Reg8[14:12] = 100 Z_STATE Z Reg8[14:12] = 110 GPIO44 W19 OTHER¶ TYPE† SIGNAL NAME I/O Reg8[14:12] = 111 BFAIL/EXT_FIQ I Reg8[17:15] = 000 UART3.CTS I Reg8[17:15] = 001 UART1.DSR I Reg8[17:15] = 010 MMC2.DATDIR1 O Reg8[17:15] = 110 RST_OUT O Reg9[11:9] = 000 GPIO41 I/O Reg9[11:9] = 111 V18 CONF I NA PU20, PD20 A LZ DVDD9 Y19 TDI I NA PD100, PU20 A LZ DVDD9 AA19 TDO O 0 Z DVDD9 V17 TMS I NA PD100, PU20 A LZ DVDD9 W18 TCK I NA PD100, PU20 A LZ DVDD9 Y18 TRST I NA PU20, PD20 A − DVDD9 2 mA (Lv) 3 mA (Hv) † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 71 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. SIGNAL NAME TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ OTHER¶ RESET STATE# SUPPLY V16 EMU0 I/O NA PU100, PD20 2 mA (Lv) 3 mA (Hv) A Input DVDD9 W17 EMU1 I/O NA PU100, PD20 2 mA (Lv) 3 mA (Hv) A Input DVDD9 Y17 RTCK I/O NA 2 mA (Lv) 3 mA (Hv) A − DVDD9 AA17 MCSI1.SYNC I/O RegA[5:3] = 000 LZ DVDD7 I RegA[5:3] = 001 2 mA (Lv) 3 mA (Hv) A, F, G1 MCBSP3.DR PU20, PD20 USB1.VP I RegA[5:3] = 010 MCBSP3.FSX I/O RegA[5:3] = 100 MCSI1.CLK I/O RegA[8:6] = 000 DVDD7 RegA[8:6] = 001 2 mA (Lv) 3 mA (Hv) LZ O PU20, PD20 A, F, G1 MCBSP3.DX USB1.VM I RegA[8:6] = 010 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD7 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD7 P14 TDI W16 I RegA[8:6] = 011 MCBSP3.CLKX I/O RegA[8:6] = 100 GPIO43 I/O RegA[8:6] = 111 Z_STATE Z Reg9[5:3] = 000 MCBSP3.CLKX I/O Reg9[5:3] = 001 USB1.TXEN O Reg9[5:3] = 010 MCSI1.DIN_OUT O Reg9[5:3] = 011 MCSI1.DIN I Reg9[5:3] = 100 Z Reg9[5:3] = 110 Z_STATE GPIO42 V15 MCSI1.DIN USB1.RCV EMU1 MCBSP3.DR GPIO56 I/O Reg9[5:3] = 111 I RegA[11:9] = 000 I RegA[11:9] = 001 I/O RegA[11:9] = 011 I RegA[11:9] = 100 I/O RegA[11:9] = 111 † I = Input, O = Output, Z = High-Impedance ‡ PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 72 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. W15 Y15 AA15 V14 Y14 W14 RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD7 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD7 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD7 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD7 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD7 2 mA (Lv) 3 mA (Hv) A, B, F, G1 0 DVDD7 2 mA (Lv) 3 mA (Hv) A, B, F, G1, H3 0 DVDD7 MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ BCLKREQ I Reg9[29:27] = 000 UART3.CTS I Reg9[29:27] = 001 PU20, PD20 MMC2.DAT2 I/O Reg9[29:27] = 110 GPIO40 I/O Reg9[29:27] = 111 BCLK O RegA[2:0] = 000 UART3.RTS O RegA[2:0] = 001 CAM.OUTCLK O RegA[2:0] = 110 GPIO17 I/O RegA[2:0] = 111 LOW_STATE O Reg9[14:12] = 000 UART1.RTS O Reg9[14:12] = 001 UART1.IRSHDN O Reg9[14:12] = 010 Z_STATE Z Reg9[14:12] = 110 I/O Reg9[14:12] = 111 UART1.CTS I Reg9[17:15] = 000 UART1.IRSEL O Reg9[17:15] = 010 GPIO38 I/O Reg9[17:15] = 111 UART1.RX I Reg9[20:18] = 000 UART1.IRRX I Reg9[20:18] = 010 GPIO39 R14 OTHER¶ TYPE† SIGNAL NAME GPIO37 I/O Reg9[20:18] = 111 LOW_STATE O Reg9[23:21] = 000 UART1.TX O Reg9[23:21] = 001 UART1.IRTX O Reg9[23:21] = 010 MCSI1.DOUT O Reg9[26:24] = 000 USB1.TXD O Reg9[26:24] = 001 TDO O Reg9[26:24] = 011 MCBSP3.DX O Reg9[26:24] = 100 GPIO18 I/O Reg9[26:24] = 111 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 73 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. R13 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ CLK32K_OUT O RegA[14:12] = 000 MPUIO0 I/O RegA[14:12] = 100 PU20, PD20 2 mA (Lv) 3 mA (Hv) USB1.SPEED O RegA[14:12] = 101 UART1.TX O RegA[14:12] = 110 GPIO36 SIGNAL NAME OTHER¶ RESET STATE# SUPPLY A U DVDDRTC I/O RegA[14:12] = 111 V13 OSC32K_IN − NA E NA NA AA13 OSC32K_OUT − NA E NA NA W13 RTC_WAKE_INT O Reg9[2:0] = 000 0 DVDDRTC O Reg9[2:0] = 100 2 mA (Lv) 3 mA (Hv) A, B USB1.SE0 RST_HOST_OUT O Reg9[2:0] = 101 GPIO55 2 mA (Lv) 3 mA (Hv) A, B, G1 Z DVDDRTC A Input DVDDRTC I/O Reg9[2:0] = 111 Y12 RTC_ON_NOFF I Reg8[20:18] = 000 P13 CLK32K_IN I RegA[17:15] = 000 R12 PWRON_RESET I NA W11 MMC.DAT3 I/O Reg10[17:15] = 000 MPUIO9 I/O Reg10[17:15] = 001 MPUIO6 I/O Reg10[17:15] = 010 MMC.CLK O RegA[23:21] = 000 GPIO57 I/O RegA[23:21] = 111 MMC.DAT0 I/O RegB[2:0] = 000 Z RegB[2:0] = 001 GPIO58 I/O RegB[2:0] = 111 MMC.DAT2 V11 R11 Z_STATE W10 V10 I/O RegA[20:18] = 000 Z_STATE Z RegA[20:18] = 001 MPUIO11 I/O RegA[20:18] = 010 MMC.DAT1 I/O RegA[26:24] = 000 MPUIO10 I/O RegA[26:24] = 001 MPUIO7 I/O RegA[26:24] = 010 A Input DVDDRTC PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD6 PD100, PU20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD6 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD6 PD100, PU20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD6 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD6 † I = Input, O = Output, Z = High-Impedance ‡ PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 74 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. P11 Y10 AA9 W9 V9 R10 W8 OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G1 Z DVDD6 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G2 0 DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G3 LZ DVDD3 TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ MMC.CMD I/O RegA[29:27] = 000 GPIO55 I/O RegA[29:27] = 111 PD100, PU20 MCSI2.CLK I/O RegB[5:3] = 000 USB2.SUSP O RegB[5:3] = 001 USB0.SUSP O RegB[5:3] = 101 MMC2.CLK O RegB[5:3] = 110 GPIO27 SIGNAL NAME I/O RegB[5:3] = 111 MCSI2.DIN I RegB[8:6] = 000 USB2.VP I RegB[8:6] = 001 USB0.VP I RegB[8:6] = 101 GPIO26 I/O RegB[8:6] = 111 MCSI2.DOUT O RegB[11:9] = 000 USB2.TXEN O RegB[11:9] = 001 USB0.TXEN O RegB[11:9] = 101 Z_STATE Z RegB[11:9] = 110 GPIO25 I/O RegB[11:9] = 111 MCSI2.SYNC I/O RegB[14:12] = 000 GPIO7 I/O RegB[14:12] = 001 USB2.SPEED O RegB[14:12] = 010 USB0.SPEED O RegB[14:12] = 110 MMC2.CMDDIR O RegB[14:12] = 111 MCLKREQ I RegB[20:18] = 000 EXT_MASTER_REQ O RegB[20:18] = 001 UART2.RX I RegB[20:18] = 010 MMC2.DAT3 I/O RegB[20:18] = 110 GPIO23 I/O RegB[20:18] = 111 GPIO9 I/O RegB[23:21] = 000 EMU0 I/O RegB[23:21] = 011 MCSI1.SYNC I/O RegB[23:21] = 100 MMC2.DAT0 I/O RegB[23:21] = 110 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 75 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. Y8 V8 P10 W7 V7 Y6 W6 AA5 R9 RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, F, G3 LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G2 LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G2 LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G2 LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F Z DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G2 0 DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F LZ DVDD3 MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ BUFFER STRENGTH§ GPIO8 I/O RegB[26:24] = 000 TRST I RegB[26:24] = 011 PU20, PD20 MCSI1.DOUT O RegB[26:24] = 100 MMC2.CMD I/O RegB[26:24] = 110 MPUIO3 I/O RegB[29:27] = 000 MMC2.DAT1 I/O RegB[29:27] = 110 MCBSP2.DR I RegC[2:0] = 000 MCBSP2.DX O RegC[2:0] = 001 MCBSP2.DXZ O/Z RegC[2:0] = 010 GPIO22 I/O RegC[2:0] = 111 MCBSP2.FSX I/O RegC[5:3] = 000 GPIO21 I/O RegC[5:3] = 111 MCBSP2.CLKR I/O RegC[8:6] = 000 GPIO11 I/O RegC[8:6] = 001 MCBSP2.CLKX I/O RegC[11:9] = 000 GPIO20 I/O RegC[11:9] = 111 MCBSP2.FSR I/O RegC[14:12] = 000 GPIO12 I/O RegC[14:12] = 001 MCBSP2.DX O RegC[17:15] = 000 MCBSP2.DR I RegC[17:15] = 001 MCBSP2.DXZ O/Z RegC[17:15] = 010 GPIO19 I/O RegC[17:15] = 111 UART2.RX I RegC[20:18] = 000 USB2.VM I RegC[20:18] = 001 USB0.VM I RegC[20:18] = 101 GPIO18 Y5 OTHER¶ TYPE† SIGNAL NAME UART2.CTS USB2.RCV GPIO7 USB0.RCV I/O RegC[20:18] = 111 I RegC[23:21] = 000 I RegC[23:21] = 001 I/O RegC[23:21] = 010 I RegC[23:21] = 101 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 76 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. W5 V6 Y4 V5 W4 P9 BUFFER STRENGTH§ OTHER¶ RESET STATE# SUPPLY RegC[26:24] = 000 2 mA (Lv) A, F, G2 0 DVDD3 RegC[26:24] = 001 3 mA (Hv) 2 mA (Lv) 3 mA (Hv) A, F, G2 0 DVDD3 2 mA (Lv) 3 mA (Hv) A, F, G2 0 DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 0 DVDD3 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, F, G1 1 DVDD2 18.3 mA (in USB mode) C Z DVDD2 TYPE† MUX CTRL SETTING (see Notes 3 and 4) LOW_STATE O UART2.RTS O USB2.SE0 O RegC[26:24] = 010 MPUIO5 I/O RegC[26:24] = 011 MPUIO12 I/O RegC[26:24] = 100 USB0.SE0 O RegC[26:24] = 101 LOW_STATE O RegC[26:24] = 110 LOW_STATE O RegC[29:27] = 000 UART2.TX O RegC[29:27] = 001 USB2.TXD O RegC[29:27] = 010 USB0.TXD O RegC[29:27] = 101 Z_STATE Z RegC[29:27] = 110 GPIO17 I/O RegC[29:27] = 111 UART2.BCLK O RegD[2:0] = 000 SYS_CLK_IN I RegD[2:0] = 110 MCLK O RegB[17:15] = 000 MMC2.DATDIR0 O RegB[17:15] = 110 GPIO24 I/O RegB[17:15] = 111 USB.PUEN O RegD[5:3] = 000 USB.CLKO O RegD[5:3] = 001 USB.PUDIS O RegD[5:3] = 011 Z_STATE Z RegD[5:3] = 100 LOW_POWER O RegD[5:3] = 110 GPIO58 I/O RegD[5:3] = 111 USB.DP I/O USBTCTL[6:4] = 000 I2C.SDA I/O/Z USBTCTL[6:4] = 100 UART1.RX I USBTCTL[6:4] = 101 USB.PUEN O USBTCTL[6:4] = 111 SIGNAL NAME PULLUP/ PULLDN‡ PU20, PD20 † I = Input, O = Output, Z = High-Impedance ‡ PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 77 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. R8 SIGNAL NAME TYPE† MUX CTRL SETTING (see Notes 3 and 4) USB.DM I/O I2C.SCL I/O/Z USBTCTL[6:4] = 100 UART1.TX O USBTCTL[6:4] = 101 Z_STATE Z USBTCTL[6:4] = 111 PULLUP/ PULLDN‡ BUFFER STRENGTH§ 18.3 mA (in USB mode) OTHER¶ RESET STATE# SUPPLY C Z DVDD2 Y2 OSC1_IN I NA E NA NA W3 OSC1_OUT O NA E NA NA Y1 FLASH.CS1U O RegF[14:12] = 000 1 DVDD5 I/O RegF[14:12] = 111 2 mA (Lv) 3 mA (Hv) A, F GPIO16 V4 FLASH.WP O NA 2 mA (Lv) 3 mA (Hv) A 0 DVDD5 W2 FLASH.WE O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD5 W1 FLASH.RP O RegF[23:21] = 000 0 DVDD5 O RegF[23:21] = 001 2 mA (Lv) 3 mA (Hv) A FLASH.CS2UWE U4 FLASH.OE O NA 2 mA (Lv) 3 mA (Hv) A 1 DVDD5 E1 L7 K3 K4 L8 F2 J3 J4 J2 FLASH.A[25:17] O NA 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 K7 FLASH.A[16] O Reg11[5:3] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 H3 FLASH.A[15] O Reg11[8:6] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 H4 FLASH.A[14] O Reg11[11:9] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 K8 FLASH.A[13] O Reg11[14:12] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 G2 FLASH.A[12] O Reg11[17:15] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 G3 FLASH.A[11] O Reg11[20:18] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 PU20, PD20 PU20, PD20 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 78 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. SIGNAL NAME TYPE† MUX CTRL SETTING (see Notes 3 and 4) PULLUP/ PULLDN‡ OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 BUFFER STRENGTH§ G4 FLASH.A[10] O Reg11[23:21] = 000 F3 FLASH.A[9] O Reg11[26:24] = 000 J7 FLASH.A[8] O Reg12[5:3] = 000 E3 FLASH.A[7] O Reg12[8:6] = 000 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 F4 FLASH.A[6] O Reg12[11:9] = 000 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 D2 FLASH.A[5] O Reg12[14:12] = 000 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 E4 FLASH.A[4] O Reg12[17:15] = 000 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 C1 FLASH.A[3] O Reg12[20:18] = 000 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 D3 FLASH.A[2] O Reg12[23:21] = 000 PU20, PD20 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 J8 FLASH.A[1] O Reg12[26:24] = 000 2 mA (Lv) 3 mA (Hv) A, G1 0 DVDD5 V3 T4 U3 U1 P8 T3 T2 R4 R3 R2 P7 P4 P2 N7 N2 N4 FLASH.D[15:0] I/O NA 2 mA (Lv) 3 mA (Hv) A, K 0 DVDD5 N3 FLASH.CLK O Reg10[23:21] = 000 0 DVDD5 O Reg10[23:21] = 001 2 mA (Lv) 3 mA (Hv) A, K, G1 FLASH.CS2UOE 2 mA (Lv) 3 mA (Hv) A, F Input DVDD5 2 mA (Lv) 3 mA (Hv) A 1 DVDD5 V2 L4 FLASH.RDY I RegF[29:27] = 000 GPIO10 I/O RegF[29:27] = 001 FLASH.ADV O NA PU20, PD20 PU100, PD20 † I = Input, O = Output, Z = High-Impedance PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low ‡ || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x December 2003 − Revised December 2005 SPRS231E 79 Introduction Table 2−4. ZZG Package Terminal Characteristics (Continued) ZZG BALL NO. M4 M7 M3 P3 L3 M8 N8 TYPE† MUX CTRL SETTING (see Notes 3 and 4) FLASH.CS2 O RegD[8:6] = 000 FLASH.BAA O RegD[8:6] = 001 SIGNAL NAME FLASH.CS2L O RegD[8:6] = 010 GPIO62 I/O Reg10[2:0] = 000 FLASH.CS0 O Reg10[2:0] = 001 FLASH.CS1 O Reg10[29:27] = 000 FLASH.CS1L O Reg10[29:27] = 001 FLASH.CS2U O Reg10[20:18] = 000 GPIO5 I/O Reg10[20:18] = 001 FLASH.BE[0] O Reg10[8:6] = 000 FLASH.CS2UOE O Reg10[8:6] = 001 GPIO59 I/O Reg10[8:6] = 111 FLASH.BE[1] O Reg10[5:3] = 000 FLASH.CS2UWE O Reg10[5:3] = 001 GPIO60 I/O Reg10[5:3] = 111 FLASH.CS3 O Reg10[26:24] = 000 GPIO3 I/O Reg10[26:24] = 111 PULLUP/ PULLDN‡ PU100 OTHER¶ RESET STATE# SUPPLY 2 mA (Lv) 3 mA (Hv) A 1 DVDD5 2 mA (Lv) 3 mA (Hv) A, F, G1 Input DVDD5 2 mA (Lv) 3 mA (Hv) A 1 DVDD5 2 mA (Lv) 3 mA (Hv) A, F 1 DVDD5 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD5 2 mA (Lv) 3 mA (Hv) A, F 0 DVDD5 2 mA (Lv) 3 mA (Hv) A, F 1 DVDD5 BUFFER STRENGTH§ † I = Input, O = Output, Z = High-Impedance ‡ PD20 = 20-µA internal pulldown, PD100=100-µA internal pulldown, PU20 = 20-µA internal pullup, PU100 = 100-µA internal pullup. Pullup or pulldown can be enabled or disabled by software. § Lv = Low voltage (1.65 V), Hv = High voltage (2.5 V) ¶ A = Standard LVCMOS input/output G1 = Terminal may be gated by BFAIL B = SUBLVDS input/ouput G2 = Terminal may be gated by GPIO9 and MPUIO3 C = USB transceiver input/ouput G3 = Terminal my be gated by BFAIL and OMAP5912 Internal Reset D = I2C input/output buffers H1 = Terminal may be 3-stated by BFAIL input E = Analog oscillator terminals H3 = MCSI1.DOUT pin can be forced into a high-impedance F = Boundary-scannable terminal state by the OMAP5912 HIGH_IMP3 control bit K = Output buffer includes a serial resistor of 20 Ω to match with PCB line impedance and ensure proper signal integrity # Z = High-Impedance, LZ = Low-Impedance (pin is driven), 1 = Output driven high, 0 = Output driven low || Slew time constraint of the EXT_DMA_REQ1 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. k Slew time constraint of the EXT_DMA_REQ0 must be lower than or equal to 10 ns (from 10% to 90% of DVDD) in Mode 1. NOTES: 3. NA denotes no multiplexing on the ball 4. ‘Regx’ denotes the terminal multiplexing register that controls the specified terminal where Regx = FUNC_MUX_CTRL_x 80 SPRS231E December 2003 − Revised December 2005 Introduction 2.4 Signal Description Table 2−5 provides a description of the signals on OMAP5912. Many signals are available on multiple pins, depending upon the software configuration of the pin multiplexing options. Table 2−5. Signal Descriptions SIGNAL ZDY/ GDY BALL# ZZG BALL# TYPE† DESCRIPTION EXTERNAL MEMORY INTERFACE FAST (EMIFF) SDRAM INTERFACE SDRAM.CS E7 G8 SDRAM chip-select O SDRAM.DQSH A12 C14 DDR DQ strobe high I/O SDRAM.DQSL A2 D4 DDR DQ strobe low I/O SDRAM.CAS D5 B4 SDRAM column address strobe. SDRAM.CAS is active (low) during reads, writes, and the REFR and MRS commands to SDRAM memory. O SDRAM.DQML C7 C8 SDRAM lower data mask. Active-high data mask for the lower byte of the SDRAM data bus (SDRAM.D[7:0]). The data mask outputs allow for both 16-bit-wide and 8-bit-wide accesses to SDRAM memory. O SDRAM.DQMU A8 D10 SDRAM upper data mask. Active-high data mask for the upper byte of the SDRAM data bus (SDRAM.D[15:8]). The data mask outputs allow for both 16-bit-wide and 8-bit-wide accesses to SDRAM memory. O SDRAM.RAS D4 H7 SDRAM row address strobe. SDRAM.RAS is active (low) during ACTV, DCAB, REFR, and MRS commands to SDRAM memory. O SDRAM.WE E6 H8 SDRAM write enable. SDRAM.WE is active (low) during writes, DCAB, and MRS commands to SDRAM memory. O D10 E8 E9 F8 F9 C6 A10 E10 C8 D9 C3 F7 A1 B2 H11 H9 H10 B8 B12 G9 G11 G12 B9 G10 A1 B6 B2 A2 SDRAM address bus. Provides row and column address information to the SDRAM memory as well as MRS command data. SDRAM.A[10] also serves as a control signal to define specific commands to SDRAM memory. O SDRAM bank address bus. Provides the bank address to SDRAM memories O SDRAM data bus. SDRAM.D[15:0] provides data exchange between the traffic controller and SDRAM memory. I/O SDRAM.A[13:0] SDRAM.BA[1:0] C4 C5 C3 B3 SDRAM.D[15:0] B10 C10 B11 B9 A11 B8 B12 C9 B7 A3 B6 B3 A5 A4 B5 B4 C12 D12 D13 C11 C13 D11 D14 C10 D8 C4 C7 D5 D7 C5 C6 D6 SDRAM.CLK A7 C9 SDRAM clock. Clock for synchronization SDRAM memory commands/accesses. O SDRAM.CLKX A6 D9 DDR clock. Inverted clock for synchronization DDR memory commands/accesses O SDRAM.CKE B13 H12 SDRAM clock enable (active-high). Asserting this signal enables the SDRAM clock for normal operation; negating puts SDRAM memory into low-power mode. O † ‡ I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. December 2003 − Revised December 2005 SPRS231E 81 Introduction Table 2−5. Signal Descriptions (Continued) SIGNAL ZDY/ GDY BALL# ZZG BALL# DESCRIPTION TYPE† EXTERNAL MEMORY INTERFACE SLOW (EMIFS) FLASH AND ASYNCHRONOUS MEMORY INTERFACE FLASH.A[25:1] F3 J4 J2 H2 H5 F4 H4 H3 G6 G5 G2 G4 G3 F5 F1 F2 E1 D1 E2 C1 D2 E3 E4 C2 D3 E1 L7 K3 K4 L8 F2 J3 J4 J2 K7 H3 H4 K8 G2 G3 G4 F3 J7 E3 F4 D2 E4 C1 D3 J8 EMIFS address bus. Address output bus for all EMIFS accesses. O FLASH.D[15:0] N4 R1 P1 K7 M3 M4 N2 L5 N1 K6 L4 M2 J7 L2 M1 L1 V3 T4 U3 U1 P8 T3 T2 R4 R3 R2 P7 P4 P2 N7 N2 N4 EMIFS data bus. Bidirectional 16-bit data bus used to transfer read and write data during EMIFS accesses. The 16-bit data bus becomes address/data in case the EMIFS is configured in address/data multiplexed mode. I/O FLASH.CLK K1 N3 Flash clock. Clock output that is active during synchronous modes of flash operation for synchronous burst flash memories. O FLASH.RDY L6 V2 Flash ready. Active-high ready input used to suspend the flash interface when the external memory or asynchronous device is not ready to continue the current cycle. I FLASH.ADV H6 L4 Flash address valid. Active-low control signal used to indicate a valid address is present on the FLASH.A[25:1] bus. O FLASH.BAA J8 M4 Flash burst advance acknowledge. Active-low control signal used with Advanced Micro Devices E burst flash. O K2 J1 M8 L3 Flash byte enables. Active-low byte enable signals used to perform byte-wide accesses to memories or devices that support byte enables. O FLASH.CS0 J5 M7 Flash chip-select bit 0 O FLASH.CS1 J3 M3 Flash chip-select bit 1 O FLASH.CS1L J3 M3 Lower half of FLASH.CS1 address range O FLASH.CS1U T1 Y1 Upper half of FLASH.CS1 address range O FLASH.CS2 J8 M4 Flash chip-select bit 2 O FLASH.CS2L J8 M4 Lower half of FLASH.CS2 address range O FLASH.CS2U K3 P3 Upper half of FLASH.CS2 address range O FLASH.CS2UOE J1 L3 O K1 N3 FLASH.CS2U gated with FLASH.OE. Output enable if EMIFS is used to interface with external flash. FLASH.CS2U gated with FLASH.WE. Write enable if EMIFS is used to interface with external flash. O Flash chip-select bit 3. If MPU_BOOT is high and the device is an emulation device, select external boot memory. O FLASH.BE[1:0] FLASH.CS2UWE FLASH.CS3 † ‡ K2 M8 N3 W1 J6 N8 I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. Advanced Micro Devices is a trademark of Advanced Micro Devices, Inc. 82 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−5. Signal Descriptions (Continued) SIGNAL ZDY/ GDY BALL# ZZG BALL# TYPE† DESCRIPTION EXTERNAL MEMORY INTERFACE SLOW (EMIFS) FLASH AND ASYNCHRONOUS MEMORY INTERFACE (CONTINUED) FLASH.OE M5 U4 Flash output enable. Active-low output enable output for Flash or SRAM memories or asynchronous devices. O FLASH.RP N3 W1 Flash power down (TI Flash devices) or reset output (Intel Flash devices) O FLASH.WE P3 W2 Flash write enable. Active-low write enable output for Flash or SRAM memories or asynchronous devices. O FLASH.WP R3 V4 Flash write protect. Active-low output for hardware write protection feature on standard memory devices. O MULTIMEDIA CARD/SECURE DIGITAL INPUT/OUTPUT INTERFACES (MMC/SDIOs) MMC.CLK M8 V11 MMC/SDIO1 clock. Clock output to the MMC/SD card. O MMC.CMD N7 P11 MMC/SDIO1 command. MMC/SD commands are transferred to/from this pin. I/O MMC.DAT0 R8 R11 MMC/SDIO1 data bit 0. MMC.DAT0 functions as data bit 0 during MMC and secure digital operation. I/O MMC.DAT1 U9 V10 SD card data bit 1. Data bit 1 is used in 4-bit secure digital mode. I/O MMC.DAT2 T9 W10 SD card data bit 2. Data bit 2 is used in 4-bit secure digital mode. I/O L15 M15 MMC.DAT3 P9 W11 SD card data bit 3. Data bit 3 is used in 4-bit secure digital mode. I/O MMC2.CLK K12 M19 MMC/SDIO2 clock. Clock output to the MMC/SD card. O P8 Y10 MMC2.CLKIN N17 R18 P7 Y8 H15 MMC2.CMD MMC/SDIO2 clock feedback I J19 MMC/SDIO2 command. MMC/SD commands are transferred to/from this pin. MMC2.CMDDIR U8 V9 MMC/SDIO2 command direction control O MMC2.DAT0 J12 L15 I/O U7 W8 MMC/SDIO2 data bit 0. MMC2.DAT0 functions as data bit 0 during MMC and secure digital operation. MMC2.DAT1 J13 L18 MMC/SDIO2 card data bit 1 I/O R6 V8 MMC2.DAT2 H16 J18 MMC/SDIO2 card data bit 2 I/O R12 W15 MMC/SDIO2 card data bit 3 I/O MMC/SDIO2 data bit 0 direction control O MMC/SDIO2 data bit 1, 2, 3 direction control O MMC2.DAT3 J17 L19 T7 R10 MMC2.DATDIR0 U3 V5 MMC2.DATDIR1 T17 W19 I/O † I = Input, O = Output, Z = High-Impedance ‡ GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. Intel is a registered trademark of Intel Corporation. December 2003 − Revised December 2005 SPRS231E 83 Introduction Table 2−5. Signal Descriptions (Continued) SIGNAL ZDY/ GDY BALL# ZZG BALL# DESCRIPTION TYPE† MULTICHANNEL BUFFERED SERIAL PORTS (McBSPs) MCBSP1.CLKX F16 G21 McBSP1 bit clock MCBSP1.CLKS G13 G20 McBSP1 clock input I MCBSP1.DR G17 H20 McBSP1 data input I MCBSP1.DX G14 H18 McBSP1 data output O G15 H15 G15 H15 G14 H18 G15 H15 G14 H18 MCBSP2.CLKR U6 MCBSP2.CLKX U5 MCBSP1.DXZ MCBSP1.FSX MCBSP2.DR MCBSP2.DX MCBSP2.DXZ McBSP1 data output (for multichannel mode) O/Z McBSP1 frame synchronization I/O V7 McBSP2 receive clock I/O Y6 McBSP2 transmit clock I/O McBSP2 data input I McBSP2 data output O L8 P10 T5 AA5 L8 P10 T5 AA5 McBSP2 data output (for multichannel mode) O/Z W6 McBSP2 receive frame synchronization I/O W7 McBSP2 transmit frame synchronization I/O U14 W16 McBSP3 clock I/O R17 N14 U15 P14 N10 AA17 P14 U18 P12 V15 L8 P10 T5 AA5 MCBSP2.FSR R5 MCBSP2.FSX N6 MCBSP3.CLKX MCBSP3.DR MCBSP3.DX I/O M14 T19 U15 P14 R15 W21 McBSP3 data input I McBSP3 data output O P11 W14 MCBSP3.DXZ R15 W21 McBSP3 data output (for multichannel mode) O/Z MCBSP3.FSX L16 N18 McBSP3 frame synchronization I/O L13 P18 L14 P19 † ‡ 84 M17 P20 N10 AA17 I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. SPRS231E December 2003 − Revised December 2005 Introduction Table 2−5. Signal Descriptions (Continued) SIGNAL ZDY/ GDY BALL# ZZG BALL# TYPE† DESCRIPTION MULTICHANNEL SERIAL INTERFACES (MCSIs) MCSI1.CLK MCSI1.DIN MCSI1.DOUT U15 P14 L15 M15 L14 P19 P12 V15 U14 W16 P11 W14 P7 Y8 MCSI1 bit clock I/O MCSI1 data input I MCSI1 data output O MCSI1.DIN_OUT U14 W16 MCSI1 data-in looped backout O MCSI1.SYNC N10 AA17 MCSI1 frame synchronization I/O I/O U7 W8 MCSI2.CLK P8 Y10 MCSI2 bit clock MCSI2.DIN R7 AA9 MCSI2 data input I MCSI2.DOUT T8 W9 MCSI2 data output O MCSI2.SYNC U8 V9 MCSI2 frame synchronization I/O SPIF.CS0 R17 N14 SPIF.CS1 L12 N15 SPIF.CS2 M14 T19 SPIF.CS3 R16 P15 SPIF.SCK N15 SPIF.DIN M17 P14 U18 SPIF.DOUT N17 R18 R15 W21 SERIAL PORT INTERFACE (SPI) SPI output chip-selects in master mode/input chip-select when SPI is in slave mode. I/O U19 SPI output clock in master mode. SPI input clock in slave mode. I/O P20 SPI data-In in master mode. SPI data-out in slave mode. I/O O I/O SPI data-out in master mode. SPI data-in in slave mode. I/O I/O UNIVERSAL ASYNCHRONOUS RECEIVER/TRANSMITTER (UART) INTERFACES UART1.CTS M9 R14 UART1 clear to send I UART1.DSR P14 U18 UART1 data set ready I T17 W19 UART1.DTR R15 W21 UART1 data terminal ready O UART1 request to send O UART1 receive data I UART1 transmit data O N16 T20 UART1.RTS R11 AA15 UART1.RX U13 V14 T2 P9 T12 Y14 U1 R8 U12 R13 UART1.IRTX T12 Y14 UART1 IrDA transmit data O UART1.IRRX U13 V14 UART1 IrDA receive data I UART1.TX † ‡ I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. December 2003 − Revised December 2005 SPRS231E 85 Introduction Table 2−5. Signal Descriptions (Continued) SIGNAL ZDY/ GDY BALL# ZZG BALL# DESCRIPTION TYPE† UNIVERSAL ASYNCHRONOUS RECEIVER/TRANSMITTER (UART) INTERFACES (CONTINUED) UART1.IRSEL M9 R14 UART1 IrDA mode select for external transceiver O UART1.IRSHDN R11 AA15 UART1 IrDA mode select for external transceiver O UART2.BCLK P5 Y4 UART2 baud clock. A clock of 16x O UART2 clear to send I UART2 request to send O UART2 receive data I UART2 transmit data O UART3 clear to send I UART2.CTS UART2.RTS UART2.RX P6 Y5 J12 L15 T4 W5 K12 M19 U4 R9 T7 R10 K15 L14 UART2.TX R4 V6 K17 M18 UART3.CTS R12 W15 T17 W19 J14 K15 P15 V19 P14 U18 UART3 data set ready I UART3.DTR R15 W21 UART3 data terminal ready O UART3.RTS M15 R19 UART3 request to send in UART mode SD_MODE in IrDA mode O L10 Y15 UART3 receive data I UART3 transmit data O UART3.DSR UART3.RX J16 K14 N16 T20 R15 W21 K15 L14 H13 K19 R16 P15 K17 M18 J11 K18 R17 N14 USB.DM U1 R8 USB differential (–) line I/O USB.DP T2 P9 USB differential (+) line I/O UART3.TX USB (INTEGRATED TRANSCEIVER) † I = Input, O = Output, Z = High-Impedance ‡ GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. 86 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−5. Signal Descriptions (Continued) ZDY/ GDY BALL# ZZG BALL# P6 Y5 USB port 0 receive data I USB0.SE0 T4 W5 USB port 0 single-ended zero O USB0.SPEED U8 V9 USB 0 speed O USB0.SUSP P8 Y10 USB 0 suspend O USB0.TXD R4 V6 USB port 0 transmit data O USB0.TXEN T8 W9 USB port 0 transmit enable O USB0.VM U4 R9 USB port 0 V minus receive data I USB0.VP R7 AA9 USB port 0 V plus receive data I USB1.RCV P12 V15 USB port 1 receive data I USB1.SE0 N9 W13 USB port 1 single-ended zero O USB1.SPEED U12 R13 USB port 1 bus segment speed control O USB1.SUSP H14 J20 USB port 1 bus segment suspend control O USB1.TXD P11 W14 USB port 1 transmit data O USB1.TXEN U14 W16 USB port 1 transmit enable O USB1.VM U15 P14 USB port 1 V minus receive data I USB1.VP N10 AA17 USB port 1 V plus receive data I SIGNAL TYPE† DESCRIPTION USB PORT 0 USB0.RCV USB PORT 1 USB PORT 2 USB2.RCV P6 Y5 USB port 2 receive data I USB2.SE0 T4 W5 USB port 2 single-ended zero O USB2.SPEED U8 V9 Low-speed USB device or full-speed USB device O USB2.SUSP P8 Y10 USB port 2 bus segment suspend control O USB2.TXD R4 V6 USB port 2 transmit data O USB2.TXEN T8 W9 USB port 2 transmit enable O USB2.VM U4 R9 USB port 2 V minus receive data I USB2.VP R7 AA9 USB port 2 V plus receive data I USB.CLKO P4 W4 USB clock output. 6-MHz divided clock output of the internal USB DPLL provided for reference. Common for all USB host and function peripherals. O USB.VBUS N17 R18 USB voltage bus enable. USB.VBUS is an input which allows the OMAP5912 device to detect whether the USB cable is connected or not. USB.VBUS must be connected to USB power from the USB cable through a voltage translation buffer to convert the 5-V power from the USB cable to within the 3.3-V nominal range specified for the OMAP device input. I USB.PUEN P4 W4 USB pullup enable O T2 P9 USB.PUDIS P4 W4 USB pullup disable O UNIVERSAL SERIAL BUS (USB) MISCELLANEOUS SIGNALS † I = Input, O = Output, Z = High-Impedance ‡ GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. December 2003 − Revised December 2005 SPRS231E 87 Introduction Table 2−5. Signal Descriptions (Continued) SIGNAL ZDY/ GDY BALL# ZZG BALL# DESCRIPTION TYPE† INTER-INTEGRATED CIRCUIT (I2C) MASTER AND SLAVE INTERFACE I2C.SCL P16 U1 R8 I2C.SDA M11 V20 T2 P9 K13 N20 T18 I2C serial clock I/O I2C serial data I/O HDQ/1-Wire INTERFACE HDQ HDQ/1-Wire interface. HDQ optionally implements one of two serial protocols: HDQ or 1-Wire. I/O MICROWIRE INTERFACE UWIRE.CS0 R17 N14 H16 J18 MICROWIRE chip-select 0. The output selects a single MICROWIRE device (configurable as active-high or active-low). UWIRE.CS1 L12 N15 MICROWIRE chip-select 1 UWIRE.CS2 M14 T19 MICROWIRE chip-select 2 UWIRE.CS3 R16 P15 MICROWIRE chip-select 3 UWIRE.SCLK UWIRE.SDI H15 J19 P15 V19 J15 MICROWIRE serial clock. This pin drives a clock to a MICROWIRE device. The active edge is software-configurable. O G16 MICROWIRE serial data input I MICROWIRE serial data output O P14 U18 H17 J14 R15 W21 H12 H19 L10 Y15 H16 H15 H17 J11 H13 J14 J16 J17 J18 J19 J14 K18 K19 K15 K14 L19 CAM.HS J12 CAM.LCLK CAM.RSTZ UWIRE.SDO O CAMERA INTERFACE CAM.OUTCLK CAM.D[7:0] Camera output clock O Camera digital image data bits I L15 Camera interface horizontal synchronization. Horizontal synchronization input from external camera sensor. I G16 J15 Camera interface line clock. Input clock to provide external timing reference from camera sensor logic I K12 M19 Camera interface reset. Reset output used to reset or Initialize external camera sensor logic. O CAM.VS J13 L18 Camera vertical synchronization I CAM.EXCLK H12 H19 Camera interface external clock. Output clock used to provide a timing reference to a camera sensor. O † ‡ I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. MICROWIRE is a registered trademark of National Semiconductor Corporation. 88 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−5. Signal Descriptions (Continued) ZDY/ GDY BALL# ZZG BALL# LCD.AC F10 B15 LCD AC-bias. LCD.AC signals the LCD display to switch the polarity of the row and column power supplies to counteract charge buildup causing DC offset. In TFT mode, LCD.AC is used as the output enable to latch LCD pixel data using the pixel clock. O LCD.BLUE0 L17 N19 Blue bit 0 in 18-bit LCD output mode O LCD.HS D15 C20 LCD horizontal sync. LCD_HSYNC is the line clock that signals the end of a line of pixels to the LCD display panel. In TFT mode, LCD_HSYNC is the horizontal synchronization signal. O LCD.PCLK A14 C15 LCD pixel clock output. Clock output provided to synchronize pixel data to LCD display panels. In passive mode, LCD_PCLK transitions only when LCD.P[15:0] is valid. In active mode, LCD_PCLK transitions continuously and LCD.AC is used as the output enable when LCD.P[15:0] is valid. O LCD.P[15:0] C12 D12 E11 A13 B14 A15 F11 C13 D13 A16 C15 E12 D14 C16 B16 A17 D15 C16 A17 G13 B17 C17 D16 D17 C18 B19 A20 H13 G14 C19 B21 D18 LCD pixel data bits O LCD.RED0 K14 N21 Red bit 0 in 18-bit LCD output mode O LCD.VS B15 B18 LCD vertical synchronization (sync) output. LCD.VS is the frame clock that signals the start of a new frame of pixels to the LCD display panel. In TFT mode, LCD.VS is the vertical synchronization signal. O SIGNAL TYPE† DESCRIPTION LCD AND LCDCONV INTERFACE † ‡ I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. December 2003 − Revised December 2005 SPRS231E 89 Introduction Table 2−5. Signal Descriptions (Continued) SIGNAL ZDY/ GDY BALL# ZZG BALL# P13 W18 L15 M15 DESCRIPTION TYPE† JTAG/EMULATION INTERFACE TCK RTCK IEEE Standard 1149.1 test clock. TCK is normally a free-running clock signal with a 50% duty cycle. The changes on the test access port (TAP) of input signals TDI and TMS are clocked into the TAP controller, instruction register, or selected test data register on the rising edge of TCK. Changes at the TAP output signal TDO occur on the falling edge of TCK. I ARM926EJ-S return clock emulation I/O M14 Emulation data transmit I/O P18 Emulation data transmit I/O L15 M15 Emulation data transmit I/O RTDX.D[3] K13 N20 Emulation data transmit I/O TDI U17 Y19 IEEE Standard 1149.1 test data input. TDI is clocked into the selected register (instruction or data) on the rising edge of TCK. I IEEE Standard 1149.1 test data output. The contents of the selected register (instruction or data) are shifted out of TDO on the falling edge of TCK. TDO is in the high-impedance state except when the scanning of data is in progress. O IEEE Standard 1149.1 test mode select. This serial control input is clocked into the TAP controller on the rising edge of TCK. I IEEE Standard 1149.1 test reset. TRST, when high, gives the IEEE standard 1149.1 scan system control of the operations of the device. If TRST is not connected, or driven low, the device operates in its functional mode, and the IEEE standard 1149.1 signals are ignored. I T14 Y17 N15 U19 RTDX.D[0] M16 RTDX.D[1] L13 RTDX.D[2] TDO TMS TRST U15 P14 P11 W14 T15 AA19 M10 V17 L14 P19 R13 Y18 P7 Y8 WARNING: By default, the internal pulldown on TRST is disabled. An external pulldown is needed for proper operation of the device in functional mode. EMU1 EMU0 † ‡ 90 N11 W17 P12 V15 U16 V16 U7 W8 Emulation pin 1. When TRST is driven high, EMU1 is used as an interrupt to or from the emulator system and is defined as input/output by way of the IEEE standard 1149.1 scan system. I/O EMU0 V16 Emulation pin 0. When TRST is driven high, EMU0 is used as an interrupt to or from the emulator system and is defined as input/output by way of the IEEE standard 1449.1 scan system. I/O I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. SPRS231E December 2003 − Revised December 2005 Introduction Table 2−5. Signal Descriptions (Continued) SIGNAL ZDY/ GDY BALL# ZZG BALL# E15 E18 DESCRIPTION TYPE† SHARED GENERAL-PURPOSE IO MODULES (GPIOs) GPIO63 GPIO62 J5 M7 G13 G20 GPIO61 B17 D19 GPIO60 K2 M8 GPIO59 J1 L3 GPIO58 R8 R11 GPIO57 P4 W4 M8 V11 H12 H19 GPIO56 P12 V15 GPIO55 N7 P11 N9 W13 GPIO54 F16 G21 GPIO53 G15 H15 GPIO52 G14 H18 GPIO51 G17 H20 GPIO50 K17 M18 GPIO49 K15 L14 GPIO48 M11 V20 † ‡ General-Purpose IOs module 4. GPIO pins can be accessed and controlled by either the DSP Public Peripheral Bus or the MPU Public Peripheral Bus. I/O I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. December 2003 − Revised December 2005 SPRS231E 91 Introduction Table 2−5. Signal Descriptions (Continued) SIGNAL ZDY/ GDY BALL# ZZG BALL# DESCRIPTION TYPE† SHARED GENERAL-PURPOSE IO MODULES (GPIOs) (CONTINUED) GPIO47 P14 U18 GPIO46 R15 W21 GPIO45 R17 N14 GPIO44 R16 P15 GPIO43 U15 P14 GPIO42 U14 W16 GPIO41 N12 AA20 GPIO40 R12 W15 GPIO39 R11 AA15 GPIO38 GPIO37 G16 J15 M9 R14 J12 L15 U13 V14 K12 M19 GPIO36 U12 R13 GPIO35 H16 J18 D12 C16 GPIO34 GPIO33 GPIO32 † ‡ 92 H15 J19 E11 A17 H17 J14 A13 G13 J11 K18 B14 B17 General-Purpose IOs module 3. GPIO pins can be accessed and controlled by either the DSP Public Peripheral Bus or the MPU Public Peripheral Bus. I/O I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. SPRS231E December 2003 − Revised December 2005 Introduction Table 2−5. Signal Descriptions (Continued) SIGNAL ZDY/ GDY BALL# ZZG BALL# DESCRIPTION TYPE† SHARED GENERAL-PURPOSE IO MODULES (GPIOs) (CONTINUED) GPIO31 GPIO30 GPIO29 H13 K19 A15 C17 J14 K15 F11 D16 J16 K14 C13 D17 GPIO28 F17 G19 GPIO27 P8 Y10 D16 C21 GPIO26 R7 AA9 GPIO25 T8 W9 GPIO24 U3 V5 GPIO23 T7 R10 GPIO22 L8 P10 GPIO21 N6 W7 GPIO20 U5 Y6 GPIO19 T5 AA5 GPIO18 P11 W14 GPIO17 GPIO16 U4 R9 L10 Y15 R4 V6 T1 Y1 General-Purpose IOs module 2. GPIO pins can be accessed and controlled by either the DSP Public Peripheral Bus or the MPU Public Peripheral Bus. I/O † I = Input, O = Output, Z = High-Impedance ‡ GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. December 2003 − Revised December 2005 SPRS231E 93 Introduction Table 2−5. Signal Descriptions (Continued) SIGNAL ZDY/ GDY BALL# ZZG BALL# DESCRIPTION TYPE† SHARED GENERAL-PURPOSE IO MODULES (GPIOs) (CONTINUED) GPIO15 K16 M20 GPIO14 K14 N21 GPIO13‡ L17 N19 GPIO12 L16 N18 GPIO11 R5 W6 K13 N20 U6 V7 GPIO10 L6 V2 GPIO9 U7 W8 GPIO8 P7 Y8 GPIO7 L15 M15 U8 V9 GPIO6 P6 Y5 L14 P19 GPIO5 K3 P3 GPIO4 M17 P20 GPIO3 L13 P18 J6 N8 GPIO2 M16 M14 C12 D15 GPIO1 M15 R19 GPIO0 N17 R18 General-Purpose IOs module 1. GPIO pins can be accessed and controlled by either the DSP Public Peripheral Bus or the MPU Public Peripheral Bus. I/O Value sampled at power-up reset selects protocol on EMIFS interface. If 0 is sampled, protocol is non-address/data multiplexed. If 1 is sampled, protocol is address/data multiplexed. I/O † I = Input, O = Output, Z = High-Impedance ‡ GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. 94 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−5. Signal Descriptions (Continued) SIGNAL ZDY/ GDY BALL# ZZG BALL# F13 E19 TYPE† DESCRIPTION MPU GENERAL-PURPOSE IO (MPUIOs) MPUIO15 MPUIO14 J13 L18 N14 U20 MPUIO13 D17 E20 MPUIO12 J17 L19 T4 W5 MPUIO11 T9 W10 MPUIO10 U9 V10 E16 H14 P9 W11 MPUIO9 MPUIO8 E17 F19 F15 G18 MPUIO7 U9 V10 MPUIO6 C17 D20 P9 W11 MPUIO5 N16 T20 T4 W5 MPUIO4 M14 T19 MPUIO3 R6 V8 MPUIO2 L12 N15 MPUIO1 N15 U19 P15 V19 F14 F18 U12 R13 MPUIO0 MPU general-purpose I/O. MPUIO pins may only be used by the MPU core. I/O KEYBOARD MATRIX INTERFACE KB.C[7:0] P15 R16 F17 D16 E15 B17 C17 F14 V19 P15 G19 C21 E18 D19 D20 F18 Keyboard matrix column outputs. KB.Cx column outputs are used in conjunction with the KB.Rx row inputs to implement a 6 x 5 or 8 x 8 keyboard matrix. O KB.R[7:0] K16 K14 L17 F13 D17 E16 E17 F15 M20 N21 N19 E19 E20 H14 F19 G18 Keyboard matrix row inputs. KB.Rx row inputs are used in conjunction with the KB.Cx column outputs to implement a 6 x 5 or 8 x 8 keyboard matrix. I LED PULSE GENERATOR (LPG) LED1 L13 P18 LED pulse generator output 1. LED1 produces a static or pulsing output used to drive an external LED indicator. O LED2 M14 T19 LED pulse generator output 2. LED2 produces a static or pulsing output used to drive an external LED indicator. O † ‡ I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. December 2003 − Revised December 2005 SPRS231E 95 Introduction Table 2−5. Signal Descriptions (Continued) SIGNAL ZDY/ GDY BALL# ZZG BALL# DESCRIPTION TYPE† PULSE-WIDTH TONE (PWT) AND PULSE-WIDTH LIGHT (PWL) INTERFACE PWL K15 L14 Pulse-width light output. The PWL output pin provides a pseudo-random modulated voltage output used for LCD or keypad backlighting. O PWT K17 M18 Pulse-width tone output. The PWT output pin provides a modulated output for use with an external buzzer. O GENERAL-PURPOSE TIMERS TIMER.EVENT3 L14 P19 Event capture input signal for GP timer 3 I TIMER.EVENT4 M17 P20 Event capture input signal for GP timer 4 I TIMER.EXTCLK L16 N18 Input clock for the GP timers I TIMER.PWM2 K16 M20 PWM output of GP timer 2 O TIMER.PWM1 K15 L14 PWM output of GP timer 1 O TIMER.PWM0 K17 M18 PWM output of GP timer 0 O ETM.CLK G16 J15 ETM.PSTAT[5:0] K13 M16 L13 J13 J12 K12 ETM.D[7:0] ETM.SYNC[1:0] EMBEDDED TRACE MACROCELL (ETM) INTERFACE ETM9 trace clock O N20 M14 P18 L18 L15 M19 ETM9 trace pipe state bits O H16 H15 H17 J11 H13 J14 J16 J17 J18 J19 J14 K18 K19 K15 K14 L19 ETM9 trace packet bits O L15 H12 M15 H19 ETM9 trace synchronization bits O DEVICE CLOCK PINS CLK32K_IN T11 P13 32-kHz clock input. Digital CMOS 32-kHz clock input driven by an external 32-kHz oscillator if the internal 32-kHz oscillator is not used. I CLK32K_OUT U12 R13 32-kHz clock output. Clock output reflecting the internal 32-kHz clock. O OSC32K_IN U11 V13 32-kHz crystal XI connection. Analog clock input to 32-kHz oscillator for use with external crystal. I OSC32K_OUT U10 AA13 32-kHz crystal XO connection. Analog output from 32-kHz oscillator for use with external crystal. O SYS_CLK_IN P5 Y4 Reserved I SYS_CLK_OUT F10 B15 Reserved O OSC1_IN R2 Y2 Base crystal XI connection. Analog input to base oscillator for use with external crystal or to be driven by external 19.2-MHz or 12/13-MHz oscillator. (Reset Mode 0) I OSC1_OUT P2 W3 Base crystal XO connection. Analog output from base oscillator for use with external 19.2-MHz or 12/13-MHz crystal. (Reset Mode 0) O BCLK L10 Y15 General-purpose clock output that can be configured to run at 12 or 13 MHz (depending on base oscillator frequency) or 48 MHz. BCLK can be configured to drive constantly or only when the BCLKREQ signal is asserted active-high. O BCLKREQ R12 W15 BCLK clock request. Active-high request input that allows an external device to request that BCLK be driven. I † ‡ I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. Embedded Trace Macrocell, ETM, and ETM9 are trademarks of ARM Limited in the EU and other countries. 96 SPRS231E December 2003 − Revised December 2005 Introduction Table 2−5. Signal Descriptions (Continued) ZDY/ GDY BALL# ZZG BALL# MCLK U3 V5 General-purpose master clock output that may be configured to run at 12 or 13 MHz (depending on base oscillator frequency) or 48 MHz. MCLK can be configured to drive constantly or only when the MCLKREQ signal is asserted active-high. O MCLKREQ T7 R10 MCLK clock request. Active-high request input that allows an external device to request that MCLK be driven. I SIGNAL TYPE† DESCRIPTION DEVICE CLOCK PINS (CONTINUED) RESET LOGIC PINS PWRON_RESET N8 R12 Reset input to device. Active-low asynchronous reset input resets the entire OMAP5912 device. I MPU_RST N14 U20 MPU reset input. Active-low asynchronous reset input resets the MPU core. NOTE: MPU_RST must meet minimum specified pulse width requirements and must be free of glitching to guard against potential operational issues. I RST_OUT N12 AA20 Reset output. Active-low output is asserted when RST_OUT is active (after synchronization). O INTERRUPTS AND MISCELLANEOUS CONTROL AND CONFIGURATION PINS MPU_BOOT H14 J20 MPU boot mode. Pull this signal high to the I/O rail during boot. Protocol (address/data multiplexed or address/data non-multiplexed) is determined by the value on GPIO1. I BFAIL/EXT_FIQ T17 W19 Battery power failure and external FIQ interrupt input. BFAIL can be used to gate certain input pins when battery power is low or failing. The pins that can be gated are configured via software. This pin can also optionally be used as an external FIQ interrupt source to the MPU. The function of this pin is configurable via software. For more details, see the OMAP5912 Multimedia Processor Power Management Reference Guide (literature number SPRU753). I EXT_DMA_REQ0 L12 N15 External DMA request. EXT_DMA_REQ0 provides DMA request inputs which external devices can use to trigger system DMA transfers. The system DMA must be configured in software to respond to these external requests. I EXT_DMA_REQ1 M14 T19 External DMA request. EXT_DMA_REQ1 provides DMA request inputs which external devices may use to trigger system DMA transfers. The system DMA must be configured in software to respond to these external requests. I LOW_PWR N16 T20 Low-power request output. This active-high output indicates that the OMAP5912 device is in a LOW_PWR sleep mode. During reset and functional modes, LOW_PWR is driven low. This signal can be used to indicate a low-power state to external power management devices in a system. O LOW_POWER P4 W4 Inverted polarity of the LOW_PWR signal O RTC_ON_NOFF P10 Y12 Active-low asynchronous reset signal if real-time clock (RTC) is used. I RTC_WAKE_INT N9 W13 RTC wake-up interrupt. RTC periodic interrupt to external power device to restart the main power supplies when RTC times out. O † ‡ I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. December 2003 − Revised December 2005 SPRS231E 97 Introduction Table 2−5. Signal Descriptions (Continued) ZDY/ GDY BALL# SIGNAL ZZG BALL# DESCRIPTION TYPE† INTERRUPTS AND MISCELLANEOUS CONTROL AND CONFIGURATION PINS (CONTINUED) EXT_MASTER_REQ T7 R10 External master request. If the base clock is provided by an external device instead of an on-chip oscillator, a high level on this output indicates to the external device that the clock must be driven. A low level indicates that the OMAP5912 device is in sleep mode and the 12- or 13-MHz external clock source is not necessary. O RST_HOST_OUT N9 W13 A software-controllable reset or shutdown output to an external device O CONF R14 V18 OMAP5912 configuration input. Must be tied low for normal operations. I CVDD C11 K5 M7 T16 A15 M2 Y9 Y20 CVDD1 T3 AA3 CVDD2 H7 G9 G8 CVDD3 POWER SUPPLIES Core supply voltage. Supplies power to OMAP5912 core logic and low-voltage sections of I/O. Power Core supply voltage 1. Supplies power to OMAP5912 core logic. Power A3 A9 E2 Core supply voltage 2. Supplies power to the MPU subsystem logic and memory. Power G10 H11 K11 J10 B13 B20 J21 R20 Core supply voltage 3. Supplies power to the DSP subsystem logic and memory. If the DSP system is not used, can be grounded after the isolation control in ULPD is set. Power L9 W12 Core supply voltage for the RTC. Supplies power to the RTC core logic. Can be connected to CVDD if the RTC is not used as a standalone. Power CVDDA P17 Y21 Analog supply voltage. Supplies power to the analog phase-locked loop (APLL) used to provide 48-MHz clock to peripherals such as USB, UART, or MMC/SD/SDIO peripherals. Note: The voltage to this supply pin must be kept as clean as possible to maximize performance by minimizing clock jitter. Power CVDDDLL A9 A11 Core supply voltage for the digitally controlled delay element (calibration module) used to control read and write timings to external dual data rate (DDR) SDRAM. It is recommended that an RC (R = 10 Ω, C = 100 nF) low-pass filter be implemented externally to filter switching noises. Power DVDD1 C14 G12 A19 E21 I/O supply voltage 1. Supplies power to the majority of peripheral I/O buffers. DVDD1 can be connected in common with the other DVDD supplies if the same operating voltage is desired. Power DVDD2 U2 AA2 I/O supply voltage 2. Supplies power to the internal USB transceiver buffers of USB port 0. DVDD2 can optionally be used for USB connect and disconnect detection by connecting DVDD2 to the power from the USB bus in the system. DVDD2 can be connected in common with the other DVDD supplies if the same operating voltage is desired. Power DVDD3 T6 Y7 I/O supply voltage 3. Supplies power to the MCSI2 and McBSP2 peripheral I/O buffers as well as to GPIO[9:8] I/O buffers. The DVDD3 supply can operate within a high-voltage or low-voltage range. DVDD3 can be connected in common with the other DVDD supplies if the same operating voltage is desired. Power DVDD4 D6 D7 D8 D11 A5 A7 B10 B14 I/O supply voltage 4. Supplies power to the DDR/SDRAM interface I/O buffers. The DVDD4 supply can operate within a high-voltage or low-voltage range. DVDD4 can be connected in common with the other DVDD supplies if the same operating voltage is desired. Power DVDD5 B1 G1 L3 C2 H2 R1 I/O supply voltage 5. Supplies power to the flash interface I/O buffers. The DVDD5 supply can operate within a high-voltage or low-voltage range. DVDD5 can be connected in common with the other DVDD supplies if the same operating voltage is desired. Power CVDDRTC † ‡ 98 I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. SPRS231E December 2003 − Revised December 2005 Introduction Table 2−5. Signal Descriptions (Continued) ZDY/ GDY BALL# ZZG BALL# DVDD6 T10 AA11 I/O supply voltage 6. Supplies power to the MMC/SD1 interface I/O buffers. DVDD6 can be connected in common with the other DVDD supplies if the same operating voltage is desired. Power DVDD7 T13 Y16 I/O supply voltage 7. Supplies power to the McBSP3, MCSI1, UART, and USB port 1 I/O buffers. DVDD7 can be connected in common with the other DVDD supplies if the same operating voltage is desired. Power DVDD8 J15 L21 I/O supply voltage 8. Supplies power to the camera interface (I/F) and embedded trace macrocell (ETM) I/O buffers. DVDD8 can be connected in common with the other DVDD supplies if the same operating voltage is desired. Power DVDD9 M13 U21 I/O supply voltage 9. Supplies power to the GPIO (except GPIO[9:8]), MPUIO, and MICROWIRE I/O buffers. DVDD9 can be connected in common with the other DVDD supplies if the same operating voltage is desired. Power DVDDRTC R10 V12 I/O supply voltage for the RTC I/O. (RTC_ON_NOFF, RTC_WAKE_INT, CLK32K_IN, CLK32K_OUT, OSC32K_OUT, OSC32K_IN, PWRON_RESET). DVDDRTC can be connected in common with the other DVDD supplies if the same operating voltage is desired and the RTC is not used in standalone. Power LDO.FILTER H1 J1 A regulated supply is delivered by an embedded LDO to the DPLL macro(s).The regulated supply is available on the bond pad. A decoupling capacitor of 1 µF must be connected externally between LDO.FILTER and the ground. Power F6 E13 E5 G7 F12 K10 K9 H9 H10 M12 J9 R9 M6 K8 L11 N5 H8 G11 N13 L7 A13 A21 B1 B5 B7 B16 F20 G1 K2 K20 N1 P12 R21 U2 W20 Y3 Y13 AA1 AA7 AA21 Common ground for all core and I/O-Voltage supplies. Power SIGNAL TYPE† DESCRIPTION POWER SUPPLIES (CONTINUED) VSS † ‡ I = Input, O = Output, Z = High-Impedance GPIO13 is used to select between full and fast boot. Set GPIO13 high to boot from the USB peripheral. Set GPIO13 low to boot from external flash on CS3. December 2003 − Revised December 2005 SPRS231E 99 Functional Overview 3 Functional Overview The following functional overview is based on the block diagram in Figure 3−1. OMAP5912 Endianism Conversion 32 E M I F S 16 MPU Interface E M I F F 16 SDRAM MPU Peripheral Bridge 32 System DMA Controller McBSP3 MPU/DSP Shared Peripherals Mailbox MPU/DSP Static Shared 8 x GPTIMERS SPI UART1,2,3 I2C MMC/SDIO2 McBSP2 MPU/DSP Dynamic Shared GPIO1,2,3,4 32−kHz Synchro Counter 32 MPU Public Peripherals USB Controllers O O C C P P − − T1 T2 Frame Buffer MPU Public Peripheral Bus 32 32 Memory Interface Traffic Controller (TC) McBSP1 DSP Public (Shared) Peripheral Bus 16 32 DSP Public Peripherals MCSI1 MCSI2 16 MPU Bus Flash and SRAM 16 Endianism Conversion DSP MMU 32 DSP Private Peripherals Timers (3) Watchdog Timer Level 1/2 Interrupt Handlers DSP Public Peripheral Bus TMS320C55x DSP (Instruction Cache, SARAM, DARAM, DMA, H/W Accelerators) 32 O C P − I OCP MPU Private Peripheral Bus Switch Switch Camera I/F JTAG/Emulation I/F 32 MPU Core ARM926EJ-S (Instruction Cache, Data Cache, MMU) ETM9 32 LCD I/F ULPD Clock and Reset Management OSC OSC 12 MHz 32 kHz MPU Private Peripherals Timers (3) Watchdog Timer Level 1/2 Interrupt Handlers Configuration Registers System DMA MICROWIRE I/F RTC PWT PWL Keyboard I/F HDQ/1-Wire MMC/SDIO1 MPUIO LPG1,2 FAC QS Timer 32−kHz Watchdog LCD CONV 16 Clock Reset External Clock Requests Figure 3−1. OMAP5912 Functional Block Diagram 100 SPRS231E December 2003 − Revised December 2005 Functional Overview 3.1 Functional Block Diagram Features The OMAP5912 devices include the following functional blocks: • ARM926EJS megacell including: − − − − ARM926EJS, supporting the operating system MMU with translation lookaside buffer (TLBx) L1 16K-byte, four-way, set-associative instruction cache L1 8K-byte, four-way, set-associative data cache with write buffer • MPU interrupt handler level 1 • Embedded trace macrocell module, ETM version 2.a in a 13-bit mode configuration or in a 17-bit demultiplexed mode configuration • C55x DSP subsystem: − − − − − − − − − − − − Embedded ICE emulator interface through JTAG port TMS320C55x (C55x) DSP rev 2.1 L1 cache (24K bytes) 16K-byte, two-way, set-associative instruction cache 2 × 4K-byte RAM set for instruction DARAM 64K-byte, zero-wait state, 32-bit organization SARAM 96K-byte, zero-wait state, 32-bit organization PDROM (32K bytes) DMA controller: Six physical channels, five ports DSP trace module Hardware accelerators motion estimation (ME), discrete/inverse discrete cosine transform (DCT/IDCT), and pixel interpolation (PI) DSP interrupt handler level 1 in the C55x DSP core • DSP MMU • DSP level 2 interrupt handler enabling connection to 16 additional interrupt lines outside OMAP. The priority of each interrupt line is controlled by software. • DSP interrupt interface enabling connection to the interrupt lines coming out of the level 2 interrupt handler and the interrupt lines requiring higher priority. The outcome interrupt of this module is then connected to the DSP megacell to be processed by the DSP. This module mainly ensures that all interrupts going to the DSP megacell are level-sensitive. • DSP peripherals: − − • 3 × 16-bit DSP private timers 1 × 16-bit DSP private watchdog Mailboxes: Four mailboxes are implemented: − − Two read/write accessible by MPU, read-only by the DSP Two read/write accessible by the DSP, read-only by the MPU Each mailbox is implemented with 2 × 16-bit registers. When a write is done into a register by one processor, it generates an interrupt; this interrupt is released by the read access of the other processor. December 2003 − Revised December 2005 SPRS231E 101 Functional Overview • MPU peripherals − − • External LCD controller support, in addition to the OMAP LCD controller − • • LCD controller with its own tearing-effect logic Memory traffic controller − External memory interface slow (EMIFS); connects external device memories (such as common flash and SRAM memories). This interface enables 16-bit data accesses and provides four chip-selects; each chip-select is able to support up to 64M bytes address space through a 25-bit address bus. − External memory interface fast (EMIFF) is a memory interface that enables16-bit data SDRAM memory access. It supports connection to a maximum of 64M bytes of SDRAM. The address width is 16 bits and two bank selection bits are also provided. The OMAP5912 chip provides interfacing with a maximum of four banks of 64M × 16-bit SDRAM memory with DDR capability. Hardware security accelerators − − − − − DES/3DES SHA1/MD5 Random number generator Support provided by third-party software library Bootloader • Emulator interface through JTAG port • Two DPLLs: − − − • − Two coupled domains in scalable mode. This means that only one DPLL is active and the other clocks are a multiple of it. − Mixed mode: In this case only one domain is working in asynchronous mode. The other domains are in scalable mode. Endianism conversion for DSP − • OMAP provides a single DPLL for the following clock domains: MPU/traffic controller clock domain DSP clock domain The OMAP gigacell enables the software to define either: − The DSP uses big-endian format, whereas the MPU uses little-endian format. Also, as a rule, the OMAP5912 chip works in little endian format. Thus, the endianism conversion is useful for all memory or peripheral accesses from on-chip peripherals or all shared memories to the C55x DSP. The OMAP3.2 is considered to be a subchip of OMAP5912. To connect the OMAP peripherals, six buses are delivered: − − − − − − 102 3 × 32-bit private timers; their clock is either the OMAP3.2 reference input clock or the divided MPU clock. 1 × 16-bit private watchdog; can be configured as a 16-bit general-purpose timer by software. Its clock is the OMAP3.2 reference input clock divided by 14. SPRS231E MPU shared TIPB MPU private TIPB DSP shared TIPB DSP private TIPB OCP T1/T2 (master) OCP-I (slave) December 2003 − Revised December 2005 Functional Overview • MPU private peripherals (accessible only by the MPU) − − − − − − − − • DSP private peripherals (accessible only by the DSP) − − − • USB interface Camera interface providing connectivity to CMOS image sensors MICROWIRE serial interface Real-time clock module (RTC) Pulse-width tone (PWT) Pulse-width light (PWL) Keyboard interface (6×5 or 8×8 matrix) HDQ/1-Wire interface for serial communication to battery management devices Multimedia card/secure digital (MMC/SDIO1) Up to 16 MPU general-purpose I/Os (MPUIOs) LED pulse generators (LPG) Frame adjustment counter (FAC) 32-kHz OS timer DSP public peripherals (accessible by the DSP, DSP DMA, and the MPU via the MPU interface) − − • Three 32-bit general-purpose timers Watchdog timer Level 1/level 2 interrupt handlers MPU public peripherals (accessible by the MPU and the system DMA) − − − − − − − − − − − − − • Three 32-bit general-purpose timers Watchdog timer Level 1/level 2 interrupt handlers Configuration registers for pin multiplexing and other device-level configurations DES/3DES SHA1/MD5 LCD controller supporting monochrome panels or STN and TFT color panels LCDCONV to provide 18 bits (instead of 16 bits) to the LCD interface Two multichannel buffered serial port (McBSP1 and 3) Two multichannel serial interfaces (MCSI1 and 2) MPU/DSP shared peripherals (controlling processor is selected by the MPU) − − − − − − − − − Four mailboxes for interprocessor communications Eight general-purpose timers Serial port interface (SPI) Three UARTs (UART1 and UART3 have SIR mode for IrDA operation) Inter-integrated circuit (I2C) multimode master and slave interface Multimedia card/secure digital (MMC/SDIO2) Multichannel buffered serial port (McBSP2) Up to 64 general-purpose I/O pins with interrupt capability to either processor 32-kHz synchro counter • MPU/DSP shared peripherals (accessible via OCP-T2 port) • MPU/DSP shared peripherals (accessible via OCP-T2 or OCP-T1 port) − TI Camera I/F (//) December 2003 − Revised December 2005 SPRS231E 103 Functional Overview 3.2 MPU Memory Maps 3.2.1 MPU Global Memory Map The MPU has a unified address space; therefore, the internal and external memories for program and data, as well as peripheral registers and configuration registers, are all accessed within the same address space. The MPU space is always addressed using byte addressing. Table 3−1 provides a high level illustration of the entire MPU addressable space. Table 3−2 shows the chip-select mapping. More details about the peripheral and configuration registers are provided in Section 3.2.2, MPU Subsystem Registers Memory Map. Table 3−1. OMAP5912 MPU Global Memory Map BGA BALL # DEVICE NAME SIGNAL START ADDRESS (HEX) BGA BALL # END ADDRESS (HEX) CS0 0000 0000 03FF FFFF Boot ROM 0000 0000 0000 FFFF 64K bytes 32-bit Ex/R Reserved boot ROM 0001 0000 0003 FFFF 192K bytes 32-bit Ex/R Reserved 0004 0000 001F FFFF Reserved 0020 0000 0020 3FFF Reserved 0020 4000 0020 FFFF Reserved 0021 0000 0021 000F Reserved 0021 0010 0021 002F Reserved 0021 0030 01FF FFFF NOR flash 0200 0000 03FF FFFF 32M bytes 8/16/32-bit Ex/R/W 16-bit or 32-bit organized CS1 0400 0000 07FF FFFF 64M bytes NOR flash 0400 0000 07FF FFFF 64M bytes 8/16/32-bit Ex/R/W 16-bit or 32-bit organized CS2 0800 0000 0BFF FFFF 64M bytes NOR flash 0800 0000 0BFF FFFF 64M bytes 8/16/32-bit Ex/R/W 16-bit or 32-bit organized CS3 0C00 0000 0FFF FFFF 64M bytes NOR flash 0C00 0000 0FFF FFFF 64M bytes 8/16/32-bit Ex/R/W 16-bit or 32-bit organized SDRAM external 1000 0000 13FF FFFF 64M bytes 16-bit Ex/R/W Reserved 1400 0000 1FFF FFFF 250K bytes 32-bit Ex/R/W 2K bytes 32-bit Ex/R/W 2K bytes 32-bit Ex/R/W SIGNAL SIZE SIGNAL DATA ACCESS TYPE SIGNAL COMMENT EMIFS 64M bytes EMIFF L3 OCP T1 Frame buffer 2000 0000 2003 E7FF Reserved 2003 E800 2007 CFFF Reserved 2007 D000 2007 D3FF Reserved 2007 D400 2007 D7FF TI Camera I/F (//) 2007 D800 2007 DFFF L3 OCP T2 104 Reserved 3000 0000 3000 0FFF Reserved 3000 1000 3000 1FFF Reserved 3000 2000 3000 21FF Reserved 3000 2200 3007 D7FF TI Camera I/F (//) 3007 D800 3007 DFFF Reserved 3007 E000 30FF FFFF SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−1. OMAP5912 MPU Global Memory Map (Continued) BGA BALL # DEVICE NAME SIGNAL START ADDRESS (HEX) BGA BALL # END ADDRESS (HEX) Reserved 3100 0000 34FF FFFF Reserved 3500 0000 7FFF FFFF SIGNAL SIZE SIGNAL DATA ACCESS TYPE SIGNAL COMMENT DSP MPUI Interface MPUI memory + MPUI peripheral E000 0000 Reserved E102 0000 Reserved memory space E101 FFFF EFFF FFFF TIPB Peripheral and Control Registers Reserved F000 0000 FFFA FFFF OMAP5912 peripherals FFFB 0000 FFFE FFFF Reserved FFFF 0000 FFFF FFFF NOTE: CS1 and CS2 can be split by software to provide up to four chip-selects. In this case, each chip-select can support 32M bytes of asynchronous memory. Table 3−2. Chip-Select Mapping CHIP SELECT START ADDRESS END ADDRESS NOR FLASH SIZE CS1a 0x0400 0000 0x05FF FFFF 32M bytes CS1b 0x0600 0000 0x07FF FFFF 32M bytes CS2a 0x0800 0000 0x09FF FFFF 32M bytes CS2b 0x0A00 0000 0x0BFF FFFF 32M bytes December 2003 − Revised December 2005 SPRS231E 105 Functional Overview 3.2.2 MPU Subsystem Registers Memory Map The MPU accesses peripheral and configuration registers in the same way that internal and external memory are accessed. The following tables specify the MPU base addresses where each set of registers is accessed. All accesses to these registers must utilize the appropriate access width (8-, 16-, or 32-bit-wide accesses) as indicated in the tables. Accessing registers with the incorrect access width are illegal. WARNING: Access to Reserved areas is illegal. 3.2.2.1 MPU Private Peripheral Registers The MPU private peripheral registers include the following: • MPU Level 2 Interrupt Handler Registers • LCDCONV Registers • LCD Controller Registers • MPU Timer1 Registers • MPU Timer2 Registers • MPU Timer3 Registers • MPU Watchdog Timer Registers • MPU Level 1 Interrupt Handler Registers • System DMA Controller Registers Table 3−3. MPU Level 2 Interrupt Handler Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:0000 MPU_L2_ITR Interrupt Register 32 R/W 0000 0000h FFFE:0004 MPU_L2_MIR Interrupt Mask Register 32 R/W FFFFFFFFh FFFE:0008 RESERVED Reserved FFFE:000C RESERVED Reserved FFFE:0010 MPU_L2_SIR_IRQ Interrupt Encoded Source (IRQ) Register 32 R 0000 0000h FFFE:0014 MPU_L2_SIR_FIQ Interupt Encoded Source (FIQ) Register 32 R 0000 0000h FFFE:0018 MPU_L2_CONTROL Interrupt Control Register 32 R/W 0000 0000h FFFE:001C MPU_L2_ILR0 Interrupt Priority Level For IRQ 0 Register 32 R/W 0000 0000h FFFE:0020 MPU_L2_ILR1 Interrupt Priority Level For IRQ 1 Register 32 R/W 0000 0000h FFFE:0024 MPU_L2_ILR2 Interrupt Priority Level For IRQ 2 Register 32 R/W 0000 0000h FFFE:0028 MPU_L2_ILR3 Interrupt Priority Level For IRQ 3 Register 32 R/W 0000 0000h FFFE:002C MPU_L2_ILR4 Interrupt Priority Level For IRQ 4 Register 32 R/W 0000 0000h FFFE:0030 MPU_L2_ILR5 Interrupt Priority Level For IRQ 5 Register 32 R/W 0000 0000h FFFE:0034 MPU_L2_ILR6 Interrupt Priority Level For IRQ 6 Register 32 R/W 0000 0000h FFFE:0038 MPU_L2_ILR7 Interrupt Priority Level For IRQ 7 Register 32 R/W 0000 0000h FFFE:003C MPU_L2_ILR8 Interrupt Priority Level For IRQ 8 Register 32 R/W 0000 0000h FFFE:0040 MPU_L2_ILR9 Interrupt Priority Level For IRQ 9 Register 32 R/W 0000 0000h FFFE:0044 MPU_L2_ILR10 Interrupt Priority Level For IRQ 10 Register 32 R/W 0000 0000h 106 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−3. MPU Level 2 Interrupt Handler Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:0048 MPU_L2_ILR11 Interrupt Priority Level For IRQ 11 Register 32 R/W 0000 0000h FFFE:004C MPU_L2_ILR12 Interrupt Priority Level For IRQ 12 Register 32 R/W 0000 0000h FFFE:0050 MPU_L2_ILR13 Interrupt Priority Level For IRQ 13 Register 32 R/W 0000 0000h FFFE:0054 MPU_L2_ILR14 Interrupt Priority Level For IRQ 14 Register 32 R/W 0000 0000h FFFE:0058 MPU_L2_ILR15 Interrupt Priority Level For IRQ 15 Register 32 R/W 0000 0000h FFFE:005C MPU_L2_ILR16 Interrupt Priority Level For IRQ 16 Register 32 R/W 0000 0000h FFFE:0060 MPU_L2_ILR17 Interrupt Priority Level For IRQ 17 Register 32 R/W 0000 0000h FFFE:0064 MPU_L2_ILR18 Interrupt Priority Level For IRQ 18 Register 32 R/W 0000 0000h FFFE:0068 MPU_L2_ILR19 Interrupt Priority Level For IRQ 19 Register 32 R/W 0000 0000h FFFE:006C MPU_L2_ILR20 Interrupt Priority Level For IRQ 20 Register 32 R/W 0000 0000h FFFE:0070 MPU_L2_ILR21 Interrupt Priority Level For IRQ 21 Register 32 R/W 0000 0000h FFFE:0074 MPU_L2_ILR22 Interrupt Priority Level For IRQ 22 Register 32 R/W 0000 0000h FFFE:0078 MPU_L2_ILR23 Interrupt Priority Level For IRQ 23 Register 32 R/W 0000 0000h FFFE:007C MPU_L2_ILR24 Interrupt Priority Level For IRQ 24 Register 32 R/W 0000 0000h FFFE:0080 MPU_L2_ILR25 Interrupt Priority Level For IRQ 25 Register 32 R/W 0000 0000h FFFE:0084 MPU_L2_ILR26 Interrupt Priority Level For IRQ 26 Register 32 R/W 0000 0000h FFFE:0088 MPU_L2_ILR27 Interrupt Priority Level For IRQ 27 Register 32 R/W 0000 0000h FFFE:008C MPU_L2_ILR28 Interrupt Priority Level For IRQ 28 Register 32 R/W 0000 0000h FFFE:0090 MPU_L2_ILR29 Interrupt Priority Level For IRQ 29 Register 32 R/W 0000 0000h FFFE:0094 MPU_L2_ILR30 Interrupt Priority Level For IRQ 30 Register 32 R/W 0000 0000h FFFE:0098 MPU_L2_ILR31 Interrupt Priority Level For IRQ 31 Register 32 R/W 0000 0000h FFFE:009C MPU_L2_ISR Software Interrupt Set Register 32 W 0000 0000h FFFE:00A0 MPU_L2_STATUS Status Register 32 R 0000 0000h FFFE:00A4 MPU_L2_OCP_CFG OCP Configuration Register 32 R/W 0000 0000h FFFE:00A8 MPU_L2_INTH_REV Interrupt Controller Revision ID 32 R 0000 0000h ACCESS WIDTH ACCESS TYPE Table 3−4. LCDCONV Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFE:3000 − LCDCONV_R_LOOK_UP FFFE:301F R Look-up Table Register File 8 R/W undefined FFFE:3020 − LCDCONV_B_LOOK_UP FFFE:303F B Look-up Table Register File 8 R/W undefined FFFE:3040− FFFE:307F LCDCONV_G_LOOK_UP G Look-up Table Register File 8 R/W undefined FFFE:3080 LCDCONV_CONTROL Control Register 8 R/W 0000h FFFE:3084 LCDCONV_DEV_REV Device Revision Register 8 R December 2003 − Revised December 2005 undefined SPRS231E 107 Functional Overview Table 3−5. LCD Controller Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:C000 LCD_CONTROL LCD Control Register 32 R/W xx00 0000h FFFE:C004 LCD_TIMING0 LCD Timing0 Register 32 R/W 0000 000Fh FFFE:C008 LCD_TIMING1 LCD Timing1 Register 32 R/W 0000 0000h FFFE:C00C LCD_TIMING2 LCD TIming2 Register 32 R/W xx00 0000h FFFE:C010 LCD_STATUS LCD Status Register 32 R/W xxxx xxx0h FFFE:C014 LCD_SUBPANEL LCD Subpanel Display Register 32 R/W xx00 0000h FFFE:C018 LCD_LINEINT LCD Line Interrupt Register 32 R/W xxxx xx00h FFFE:C01C LCD_DISPLAYSTATUS LCD Display Status Register 32 R/W xxxx x3FFh ACCESS WIDTH ACCESS TYPE Table 3−6. MPU Timer1 Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFE:C500 MPU_CNTL_TIMER1 MPU Timer1 Control Register 32 R/W 0000 0000h FFFE:C504 MPU_LOAD_TIMER1 MPU Timer1 Load Register 32 W undefined FFFE:C508 MPU_READ_TIMER1 MPU Timer1 Read Register 32 R undefined ACCESS WIDTH ACCESS TYPE Table 3−7. MPU Timer2 Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFE:C600 MPU_CNTL_TIMER2 MPU Timer2 Control Register 32 R/W FFFE:C604 MPU_LOAD_TIMER2 MPU Timer2 Load Register 32 W 0000 0000h undefined FFFE:C608 MPU_READ_TIMER2 MPU Timer2 Read Register 32 R undefined ACCESS WIDTH ACCESS TYPE Table 3−8. MPU Timer3 Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFE:C700 MPU_CNTL_TIMER3 MPU Timer3 Control Register 32 R/W FFFE:C704 MPU_LOAD_TIME3 MPU Timer3 Load Register 32 W 0000 0000h undefined FFFE:C708 MPU_READ_TIMER3 MPU Timer3 Read Register 32 R undefined ACCESS WIDTH ACCESS TYPE Table 3−9. MPU Watchdog Timer Registers BYTE ADDRESS REGISTER NAME FFFE:C800 MPU_WDT_CNTL_TIMER MPU Watchdog Timer Control Register 32 R/W 0000 0E02h FFFE:C804 MPU_WDT_LOAD_TIMER MPU Watchdog Timer Load Register 32 W xxxx FFFFh FFFE:C804 MPU_WDT_READ_TIMER MPU Watchdog Timer Read Register 32 R xxxx FFFFh FFFE:C808 MPU_WDT_TIMER_MODE MPU Watchdog Timer Mode Register 32 R/W 0000 8000h 108 SPRS231E DESCRIPTION RESET VALUE December 2003 − Revised December 2005 Functional Overview Table 3−10. MPU Level 1 Interrupt Handler Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:CB00 MPU_L1_ITR Interrupt Register 32 R/W 0000 0000h FFFE:CB04 MPU_L1_MIR Interrupt Mask Register 32 R/W FFFF FFFFh R 0000 0000h FFFE:CB08 RESERVED Reserved FFFE:CB0C RESERVED Reserved FFFE:CB10 MPU_L1_SIR_IRQ_CODE Interrupt Encoded Source (IRQ) Register 32 FFFE:CB14 MPU_L1_SIR_FIQ_CODE Interupt Encoded Source (FIQ) Register 32 R 0000 0000h FFFE:CB18 MPU_L1_CONTROL Interrupt Control Register 32 R/W 0000 0000h FFFE:CB1C MPU_L1_ILR0 Interrupt Priority Level For IRQ 0 Register 32 R/W 0000 0000h FFFE:CB20 MPU_L1_ILR1 Interrupt Priority Level For IRQ 1 Register 32 R/W 0000 0000h FFFE:CB24 MPU_L1_ILR2 Interrupt Priority Level For IRQ 2 Register 32 R/W 0000 0000h FFFE:CB28 MPU_L1_ILR3 Interrupt Priority Level For IRQ 3 Register 32 R/W 0000 0000h FFFE:CB2C MPU_L1_ILR4 Interrupt Priority Level For IRQ 4 Register 32 R/W 0000 0000h FFFE:CB30 MPU_L1_ILR5 Interrupt Priority Level For IRQ 5 Register 32 R/W 0000 0000h FFFE:CB34 MPU_L1_ILR6 Interrupt Priority Level For IRQ 6 Register 32 R/W 0000 0000h FFFE:CB38 MPU_L1_ILR7 Interrupt Priority Level For IRQ 7 Register 32 R/W 0000 0000h FFFE:CB3C MPU_L1_ILR8 Interrupt Priority Level For IRQ 8 Register 32 R/W 0000 0000h FFFE:CB40 MPU_L1_ILR9 Interrupt Priority Level For IRQ 9 Register 32 R/W 0000 0000h FFFE:CB44 MPU_L1_ILR10 Interrupt Priority Level For IRQ 10 Register 32 R/W 0000 0000h FFFE:CB48 MPU_L1_ILR11 Interrupt Priority Level For IRQ 11 Register 32 R/W 0000 0000h FFFE:CB4C MPU_L1_ILR12 Interrupt Priority Level For IRQ 12 Register 32 R/W 0000 0000h FFFE:CB50 MPU_L1_ILR13 Interrupt Priority Level For IRQ 13 Register 32 R/W 0000 0000h FFFE:CB54 MPU_L1_ILR14 Interrupt Priority Level For IRQ 14 Register 32 R/W 0000 0000h FFFE:CB58 MPU_L1_ILR15 Interrupt Priority Level For IRQ 15 Register 32 R/W 0000 0000h FFFE:CB5C MPU_L1_ILR16 Interrupt Priority Level For IRQ 16 Register 32 R/W 0000 0000h FFFE:CB60 MPU_L1_ILR17 Interrupt Priority Level For IRQ 17 Register 32 R/W 0000 0000h FFFE:CB64 MPU_L1_ILR18 Interrupt Priority Level For IRQ 18 Register 32 R/W 0000 0000h FFFE:CB68 MPU_L1_ILR19 Interrupt Priority Level For IRQ 19 Register 32 R/W 0000 0000h FFFE:CB6C MPU_L1_ILR20 Interrupt Priority Level For IRQ 20 Register 32 R/W 0000 0000h FFFE:CB70 MPU_L1_ILR21 Interrupt Priority Level For IRQ 21 Register 32 R/W 0000 0000h FFFE:CB74 MPU_L1_ILR22 Interrupt Priority Level For IRQ 22 Register 32 R/W 0000 0000h FFFE:CB78 MPU_L1_ILR23 Interrupt Priority Level For IRQ 23 Register 32 R/W 0000 0000h FFFE:CB7C MPU_L1_ILR24 Interrupt Priority Level For IRQ 24 Register 32 R/W 0000 0000h FFFE:CB80 MPU_L1_ILR25 Interrupt Priority Level For IRQ 25 Register 32 R/W 0000 0000h FFFE:CB84 MPU_L1_ILR26 Interrupt Priority Level For IRQ 26 Register 32 R/W 0000 0000h FFFE:CB88 MPU_L1_ILR27 Interrupt Priority Level For IRQ 27 Register 32 R/W 0000 0000h FFFE:CB8C MPU_L1_ILR28 Interrupt Priority Level For IRQ 28 Register 32 R/W 0000 0000h FFFE:CB90 MPU_L1_ILR29 Interrupt Priority Level For IRQ 29 Register 32 R/W 0000 0000h FFFE:CB94 MPU_L1_ILR30 Interrupt Priority Level For IRQ 30 Register 32 R/W 0000 0000h FFFE:CB98 MPU_L1_ILR31 Interrupt Priority Level For IRQ 31 Register 32 R/W 0000 0000h FFFE:C9C MPU_L1_ISR Interrupt Priority Level For IRQ 0 Register 32 R/W 0000 0000h MPU_L1_ENHANCED_CNTL Enhanced Control Register 32 R/W 0000 0000h FFFE:CBA0 December 2003 − Revised December 2005 SPRS231E 109 Functional Overview Table 3−11. System DMA Controller Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:D800 SYS_DMA_CSDP_CH0 Logical Channel 0 Source/Destination Parameters Register 16 RW 0000h FFFE:D802 SYS_DMA_CCR_CH0 Logical Channel 0 Control Register 16 RW 0000h FFFE:D804 SYS_DMA_CICR_CH0 Logical Channel 0 Interrupt Control Register 16 RW 0003h FFFE:D806 SYS_DMA_CSR_CH0 Logical Channel 0 Status Register 16 R 0000h FFFE:D808 SYS_DMA_CSSA_L_CH0 Logical Channel 0 Source Start Address Register LSB 16 RW undef FFFE:D80A SYS_DMA_CSSA_U_CH0 Logical Channel 0 Source Start Address Register MSB 16 RW undef FFFE:D80C SYS_DMA_CDSA_L_CH0 Logical Channel 0 Destination Start Address Register LSB 16 RW undef FFFE:D80E SYS_DMA_CDSA_U_CH0 Logical Channel 0 Destination Start Address Register MSB 16 RW undef FFFE:D810 SYS_DMA_CEN_CH0 Logical Channel 0 Element Number Register 16 RW undef FFFE:D812 SYS_DMA_CFN_CH0 Logical Channel 0 Frame Number Register 16 RW undef FFFE:D814 SYS_DMA_CSFI_CH0 Logical Channel 0 Source Frame Index Register 16 RW undef FFFE:D816 SYS_DMA_CSEI_CH0 Logical Channel 0 Source Element Index Register 16 RW undef FFFE:D818 SYS_DMA_CSAC_CH0 Logical Channel 0 Source Address Counter Register 16 R undef FFFE:D81A SYS_DMA_CDAC_CH0 Logical Channel 0 Destination Address Counter Register 16 R undef FFFE:D81C SYS_DMA_CDEI_CH0 Logical Channel 0 Destination Element Index Register 16 RW undef FFFE:D81E SYS_DMA_CDFI_CH0 Logical Channel 0 Destination Frame Index Register 16 RW undef FFFE:D820 SYS_DMA_COLOR_L_CH0 Logical Channel 0 Color Parameter Register, Lower Bits 16 RW undef FFFE:D822 SYS_DMA_COLOR_U_CH0 Logical Channel 0 Color Parameter Register, Upper Bits 16 RW undef FFFE:D824 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:D828 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:D82A SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:D82C − FFFE:D83F Reserved FFFE:D840 SYS_DMA_CSDP_CH1 Logical Channel 1 Source/Destination Parameters Register 16 RW 0000h FFFE:D842 SYS_DMA_CCR_CH1 Logical Channel 1 Control Register 16 RW 0000h FFFE:D844 SYS_DMA_CICR_CH1 Logical Channel 1 Interrupt Control Register 16 RW 0003h FFFE:D846 SYS_DMA_CSR_CH1 Logical Channel 1 Status Register 16 R 0000h FFFE:D848 SYS_DMA_CSSA_L_CH1 Logical Channel 1 Source Start Address Register LSB 16 RW undef FFFE:D84A SYS_DMA_CSSA_U_CH1 Logical Channel 1 Source Start Address Register MSB 16 RW undef FFFE:D84C SYS_DMA_CDSA_L_CH1 Logical Channel 1 Destination Start Address Register LSB 16 RW undef FFFE:D84E SYS_DMA_CDSA_U_CH1 Logical Channel 1 Destination Start Address Register MSB 16 RW undef 110 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−11. System DMA Controller Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:D850 SYS_DMA_CEN_CH1 Logical Channel 1 Element Number Register 16 RW undef FFFE:D852 SYS_DMA_CFN_CH1 Logical Channel 1 Frame Number Register 16 RW undef FFFE:D854 SYS_DMA_CSFI_CH1 Logical Channel 1 Source Frame Index Register 16 RW undef FFFE:D856 SYS_DMA_CSEI_CH1 Logical Channel 1 Source Element Index Register 16 RW undef FFFE:D858 SYS_DMA_CSAC_CH1 Logical Channel 1 Source Address Counter Register 16 R undef FFFE:D85A SYS_DMA_CDAC_CH1 Logical Channel 1 Destination Address Counter Register 16 R undef FFFE:D85C SYS_DMA_CDEI_CH1 Logical Channel 1 Destination Element Index Register 16 RW undef FFFE:D85E SYS_DMA_CDFI_CH1 Logical Channel 1 Destination Frame Index Register 16 RW undef FFFE:D860 SYS_DMA_COLOR_L_CH0 Logical Channel 1 Color Parameter Register, Lower Bits 16 RW undef FFFE:D862 SYS_DMA_COLOR_U_CH0 Logical Channel 1 Color Parameter Register, Upper Bits 16 RW undef FFFE:D864 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:D868 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:D86A SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:D86C − FFFE:D87F Reserved FFFE:D880 SYS_DMA_CSDP_CH2 Logical Channel 2 Source/Destination Parameters Register 16 RW 0000h FFFE:D882 SYS_DMA_CCR_CH2 Logical Channel 2 Control Register 16 RW 0000h FFFE:D884 SYS_DMA_CICR_CH2 Logical Channel 2 Interrupt Control Register 16 RW 0003h FFFE:D886 SYS_DMA_CSR_CH2 Logical Channel 2 Status Register 16 R 0000h FFFE:D888 SYS_DMA_CSSA_L_CH2 Logical Channel 2 Source Start Address Register LSB 16 RW undef FFFE:D88A SYS_DMA_CSSA_U_CH2 Logical Channel 2 Source Start Address Register MSB 16 RW undef FFFE:D88C SYS_DMA_CDSA_L_CH2 Logical Channel 2 Destination Start Address Register LSB 16 RW undef FFFE:D88E SYS_DMA_CDSA_U_CH2 Logical Channel 2 Destination Start Address Register MSB 16 RW undef FFFE:D890 SYS_DMA_CEN_CH2 Logical Channel 2 Element Number Register 16 RW undef FFFE:D892 SYS_DMA_CFN_CH2 Logical Channel 2 Frame Number Register 16 RW undef FFFE:D894 SYS_DMA_CSFI_CH2 Logical Channel 2 Source Frame Index Register 16 RW undef FFFE:D896 SYS_DMA_CSEI_CH2 Logical Channel 2 Source Element Index Register 16 RW undef FFFE:D898 SYS_DMA_CSAC_CH2 Logical Channel 2 Source Address Counter Register 16 R undef FFFE:D89A SYS_DMA_CDAC_CH2 Logical Channel 2 Destination Address Counter Register 16 R undef FFFE:D89C SYS_DMA_CDEI_CH2 Logical Channel 2 Destination Element Index Register 16 RW undef December 2003 − Revised December 2005 SPRS231E 111 Functional Overview Table 3−11. System DMA Controller Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:D89E SYS_DMA_CDFI_CH2 Logical Channel 2 Destination Frame Index Register 16 RW undef FFFE:D8A0 SYS_DMA_COLOR_L_CH0 Logical Channel 2 Color Parameter Register, Lower Bits 16 RW undef FFFE:D8A2 SYS_DMA_COLOR_U_CH0 Logical Channel 2 Color Parameter Register, Upper Bits 16 RW undef FFFE:D8A4 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:D8A8 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:D8AA SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:D8AC − FFFE:D8BF Reserved FFFE:D8C0 SYS_DMA_CSDP_CH3 Logical Channel 3 Source/Destination Parameters Register 16 RW 0000h FFFE:D8C2 SYS_DMA_CCR_CH3 Logical Channel 3 Control Register 16 RW 0000h FFFE:D8C4 SYS_DMA_CICR_CH3 Logical Channel 3 Interrupt Control Register 16 RW 0003h FFFE:D8C6 SYS_DMA_CSR_CH3 Logical Channel 3 Status Register 16 R 0000h FFFE:D8C8 SYS_DMA_CSSA_L_CH3 Logical Channel 3 Source Start Address Register LSB 16 RW undef FFFE:D8CA SYS_DMA_CSSA_U_CH3 Logical Channel 3 Source Start Address Register MSB 16 RW undef FFFE:D8CC SYS_DMA_CDSA_L_CH3 Logical Channel 3 Destination Start Address Register LSB 16 RW undef FFFE:D8CE SYS_DMA_CDSA_U_CH3 Logical Channel 3 Destination Start Address Register MSB 16 RW undef FFFE:D8D0 SYS_DMA_CEN_CH3 Logical Channel 3 Element Number Register 16 RW undef FFFE:D8D2 SYS_DMA_CFN_CH3 Logical Channel 3 Frame Number Register 16 RW undef FFFE:D8D4 SYS_DMA_CSFI_CH3 Logical Channel 3 Source Frame Index Register 16 RW undef FFFE:D8D6 SYS_DMA_CSEI_CH3 Logical Channel 3 Source Element Index Register 16 RW undef FFFE:D8D8 SYS_DMA_CSAC_CH3 Logical Channel 3 Source Address Counter Register 16 R undef FFFE:D8DA SYS_DMA_CDAC_CH3 Logical Channel 3 Destination Address Counter Register 16 R undef FFFE:D8DC SYS_DMA_CDEI_CH3 Logical Channel 3 Destination Element Index Register 16 RW undef FFFE:D8DE SYS_DMA_CDFI_CH3 Logical Channel 3 Destination Frame Index Register 16 RW undef FFFE:D8E0 SYS_DMA_COLOR_L_CH3 Logical Channel 3 Color Parameter Register, Lower Bits 16 RW undef FFFE:D8E2 SYS_DMA_COLOR_U_CH3 Logical Channel 3 Color Parameter Register, Upper Bits 16 RW undef FFFE:D8E4 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:D8E8 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:D8EA SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef 16 RW 0000h FFFE:D8EC − FFFE:D8FF FFFE:D900 112 Reserved SYS_DMA_CSDP_CH4 SPRS231E Logical Channel 4 Source/Destination Parameters Register December 2003 − Revised December 2005 Functional Overview Table 3−11. System DMA Controller Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:D902 SYS_DMA_CCR_CH4 Logical Channel 4 Control Register 16 RW 0000h FFFE:D904 SYS_DMA_CICR_CH4 Logical Channel 4 Interrupt Control Register 16 RW 0003h FFFE:D906 SYS_DMA_CSR_CH4 Logical Channel 4 Status Register 16 R 0000h FFFE:D908 SYS_DMA_CSSA_L_CH4 Logical Channel 4 Source Start Address Register LSB 16 RW undef FFFE:D90A SYS_DMA_CSSA_U_CH4 Logical Channel 4 Source Start Address Register MSB 16 RW undef FFFE:D90C SYS_DMA_CDSA_L_CH4 Logical Channel 4 Destination Start Address Register LSB 16 RW undef FFFE:D90E SYS_DMA_CDSA_U_CH4 Logical Channel 4 Destination Start Address Register MSB 16 RW undef FFFE:D910 SYS_DMA_CEN_CH4 Logical Channel 4 Element Number Register 16 RW undef FFFE:D912 SYS_DMA_CFN_CH4 Logical Channel 4 Frame Number Register 16 RW undef FFFE:D914 SYS_DMA_CSFI_CH4 Logical Channel 4 Source Frame Index Register 16 RW undef FFFE:D916 SYS_DMA_CSEI_CH4 Logical Channel 4 Source Element Index Register 16 RW undef FFFE:D918 SYS_DMA_CSAC_CH4 Logical Channel 4 Source Address Counter Register 16 R undef FFFE:D91A SYS_DMA_CDAC_CH4 Logical Channel 4 Destination Address Counter Register 16 R undef FFFE:D91C SYS_DMA_CDEI_CH4 Logical Channel 4 Destination Element Index Register 16 RW undef FFFE:D91E SYS_DMA_CDFI_CH4 Logical Channel 4 Destination Frame Index Register 16 RW undef FFFE:D920 SYS_DMA_COLOR_L_CH4 Logical Channel 4 Color Parameter Register, Lower Bits 16 RW undef FFFE:D822 SYS_DMA_COLOR_U_CH4 Logical Channel 4 Color Parameter Register, Upper Bits 16 RW undef FFFE:D824 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:D828 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:D82A SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:D92C − FFFE:D93F Reserved FFFE:D940 SYS_DMA_CSDP_CH5 Logical Channel 5 Source/Destination Parameters Register 16 RW 0000h FFFE:D942 SYS_DMA_CCR_CH5 Logical Channel 5 Control Register 16 RW 0000h FFFE:D944 SYS_DMA_CICR_CH5 Logical Channel 5 Interrupt Control Register 16 RW 0003h FFFE:D946 SYS_DMA_CSR_CH5 Logical Channel 5 Status Register 16 R 0000h FFFE:D948 SYS_DMA_CSSA_L_CH5 Logical Channel 5 Source Start Address Register LSB 16 RW undef FFFE:D94A SYS_DMA_CSSA_U_CH5 Logical Channel 5 Source Start Address Register MSB 16 RW undef FFFE:D94C SYS_DMA_CDSA_L_CH5 Logical Channel 5 Destination Start Address Register LSB 16 RW undef FFFE:D94E SYS_DMA_CDSA_U_CH5 Logical Channel 5 Destination Start Address Register MSB 16 RW undef FFFE:D950 SYS_DMA_CEN_CH5 Logical Channel 5 Element Number Register 16 RW undef December 2003 − Revised December 2005 SPRS231E 113 Functional Overview Table 3−11. System DMA Controller Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:D952 SYS_DMA_CFN_CH5 Logical Channel 5 Frame Number Register 16 RW undef FFFE:D954 SYS_DMA_CSFI_CH5 Logical Channel 5 Source Frame Index Register 16 RW undef FFFE:D956 SYS_DMA_CSEI_CH5 Logical Channel 5 Source Element Index Register 16 RW undef FFFE:D958 SYS_DMA_CSAC_CH5 Logical Channel 5 Source Address Counter Register 16 R undef FFFE:D95A SYS_DMA_CDAC_CH5 Logical Channel 5 Destination Address Counter Register 16 R undef FFFE:D95C SYS_DMA_CDEI_CH5 Logical Channel 5 Destination Element Index Register 16 RW undef FFFE:D95E SYS_DMA_CDFI_CH5 Logical Channel 5 Destination Frame Index Register 16 RW undef FFFE:D960 SYS_DMA_COLOR_L_CH0 Logical Channel 5 Color Parameter Register, Lower Bits 16 RW undef FFFE:D962 SYS_DMA_COLOR_U_CH0 Logical Channel 5 Color Parameter Register, Upper Bits 16 RW undef FFFE:D964 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:D968 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:D96A SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:D96C − FFFE:D97F Reserved FFFE:D980 SYS_DMA_CSDP_CH6 Logical Channel 6 Source/Destination Parameters Register 16 RW 0000h FFFE:D982 SYS_DMA_CCR_CH6 Logical Channel 6 Control Register 16 RW 0000h FFFE:D984 SYS_DMA_CICR_CH6 Logical Channel 6 Interrupt Control Register 16 RW 0003h FFFE:D986 SYS_DMA_CSR_CH6 Logical Channel 6 Status Register 16 R 0000h FFFE:D988 SYS_DMA_CSSA_L_CH6 Logical Channel 6 Source Start Address Register LSB 16 RW undef FFFE:D98A SYS_DMA_CSSA_U_CH6 Logical Channel 6 Source Start Address Register MSB 16 RW undef FFFE:D98C SYS_DMA_CDSA_L_CH6 Logical Channel 6 Destination Start Address Register LSB 16 RW undef FFFE:D98E SYS_DMA_CDSA_U_CH6 Logical Channel 6 Destination Start Address Register MSB 16 RW undef FFFE:D990 SYS_DMA_CEN_CH6 Logical Channel 6 Element Number Register 16 RW undef FFFE:D992 SYS_DMA_CFN_CH6 Logical Channel 6 Frame Number Register 16 RW undef FFFE:D994 SYS_DMA_CSFI_CH6 Logical Channel 6 Source Frame Index Register 16 RW undef FFFE:D996 SYS_DMA_CSEI_CH6 Logical Channel 6 Source Element Index Register 16 RW undef FFFE:D998 SYS_DMA_CSAC_CH6 Logical Channel 6 Source Address Counter Register 16 R undef FFFE:D99A SYS_DMA_CDAC_CH6 Logical Channel 6 Destination Address Counter Register 16 R undef FFFE:D99C SYS_DMA_CDEI_CH6 Logical Channel 6 Destination Element Index Register 16 RW undef FFFE:D99E SYS_DMA_CDFI_CH6 Logical Channel 6 Destination Frame Index Register 16 RW undef 114 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−11. System DMA Controller Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:D9A0 SYS_DMA_COLOR_L_CH6 Logical Channel 6 Color Parameter Register, Lower Bits 16 RW undef FFFE:D9A2 SYS_DMA_COLOR_U_CH6 Logical Channel 6 Color Parameter Register, Upper Bits 16 RW undef FFFE:D9A4 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:D9A8 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:D9AA SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:D9AC − FFFE:D9BF Reserved FFFE:D9C0 SYS_DMA_CSDP_CH7 Logical Channel 7 Source/Destination Parameters Register 16 RW 0000h FFFE:D9C2 SYS_DMA_CCR_CH7 Logical Channel 7 Control Register 16 RW 0000h FFFE:D9C4 SYS_DMA_CICR_CH7 Logical Channel 7 Interrupt Control Register 16 RW 0003h FFFE:D9C6 SYS_DMA_CSR_CH7 Logical Channel 7 Status Register 16 R 0000h FFFE:D9C8 SYS_DMA_CSSA_L_CH7 Logical Channel 7 Source Start Address Register LSB 16 RW undef FFFE:D9CA SYS_DMA_CSSA_U_CH7 Logical Channel 7 Source Start Address Register MSB 16 RW undef FFFE:D9CC SYS_DMA_CDSA_L_CH7 Logical Channel 7 Destination Start Address Register LSB 16 RW undef FFFE:D9CE SYS_DMA_CDSA_U_CH7 Logical Channel 7 Destination Start Address Register MSB 16 RW undef FFFE:D9D0 SYS_DMA_CEN_CH7 Logical Channel 7 Element Number Register 16 RW undef FFFE:D9D2 SYS_DMA_CFN_CH7 Logical Channel 7 Frame Number Register 16 RW undef FFFE:D9D4 SYS_DMA_CSFI_CH7 Logical Channel 7 Source Frame Index Register 16 RW undef FFFE:D9D6 SYS_DMA_CSEI_CH7 Logical Channel 7 Source Element Index Register 16 RW undef FFFE:D9D8 SYS_DMA_CSAC_CH7 Logical Channel 7 Source Address Counter Register 16 R undef FFFE:D9DA SYS_DMA_CDAC_CH7 Logical Channel 7 Destination Address Counter Register 16 R undef FFFE:D9DC SYS_DMA_CDEI_CH7 Logical Channel 7 Destination Element Index Register 16 RW undef FFFE:D9DE SYS_DMA_CDFI_CH7 Logical Channel 7 Destination Frame Index Register 16 RW undef FFFE:D9E0 SYS_DMA_COLOR_L_CH7 Logical Channel 7 Color Parameter Register, Lower Bits 16 RW undef FFFE:D9E2 SYS_DMA_COLOR_U_CH7 Logical Channel 7 Color Parameter Register, Upper Bits 16 RW undef FFFE:D9E4 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:D9E8 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:D9EA SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:D9EC − FFFE:D9FF Reserved FFFE:DA00 SYS_DMA_CSDP_CH8 Logical Channel 8 Source/Destination Parameters Register 16 RW 0000h FFFE:DA02 SYS_DMA_CCR_CH8 Logical Channel 8 Control Register 16 RW 0000h December 2003 − Revised December 2005 SPRS231E 115 Functional Overview Table 3−11. System DMA Controller Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:DA04 SYS_DMA_CICR_CH8 Logical Channel 8 Interrupt Control Register 16 RW 0003h FFFE:DA06 SYS_DMA_CSR_CH8 Logical Channel 8 Status Register 16 R 0000h FFFE:DA08 SYS_DMA_CSSA_L_CH8 Logical Channel 8 Source Start Address Register LSB 16 RW undef FFFE:DA0A SYS_DMA_CSSA_U_CH8 Logical Channel 8 Source Start Address Register MSB 16 RW undef FFFE:DA0C SYS_DMA_CDSA_L_CH8 Logical Channel 8 Destination Start Address Register LSB 16 RW undef FFFE:DA0E SYS_DMA_CDSA_U_CH8 Logical Channel 8 Destination Start Address Register MSB 16 RW undef FFFE:DA10 SYS_DMA_CEN_CH8 Logical Channel 8 Element Number Register 16 RW undef FFFE:DA12 SYS_DMA_CFN_CH8 Logical Channel 8 Frame Number Register 16 RW undef FFFE:DA14 SYS_DMA_CSFI_CH8 Logical Channel 8 Source Frame Index Register 16 RW undef FFFE:DA16 SYS_DMA_CSEI_CH8 Logical Channel 8 Source Element Index Register 16 RW undef FFFE:DA18 SYS_DMA_CSAC_CH8 Logical Channel 8 Source Address Counter Register 16 R undef FFFE:DA1A SYS_DMA_CDAC_CH8 Logical Channel 8 Destination Address Counter Register 16 R undef FFFE:DA1C SYS_DMA_CDEI_CH8 Logical Channel 8 Destination Element Index Register 16 RW undef FFFE:DA1E SYS_DMA_CDFI_CH8 Logical Channel 8 Destination Frame Index Register 16 RW undef FFFE:DA20 SYS_DMA_COLOR_L_CH8 Logical Channel 8 Color Parameter Register, Lower Bits 16 RW undef FFFE:DA22 SYS_DMA_COLOR_U_CH8 Logical Channel 8 Color Parameter Register, Upper Bits 16 RW undef FFFE:DA24 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:DA28 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:DA2A SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:DB2C − FFFE:DA3F Reserved FFFE:DA40 SYS_DMA_CSDP_CH9 Logical Channel 9 Source/Destination Parameters Register 16 RW 0000h FFFE:DA42 SYS_DMA_CCR_CH9 Logical Channel 9 Control Register 16 RW 0000h FFFE:DA44 SYS_DMA_CICR_CH9 Logical Channel 9 Interrupt Control Register 16 RW 0003h FFFE:DA46 SYS_DMA_CSR_CH9 Logical Channel 9 Status Register 16 R 0000h FFFE:DA48 SYS_DMA_CSSA_L_CH9 Logical Channel 9 Source Start Address Register LSB 16 RW undef FFFE:DA4A SYS_DMA_CSSA_U_CH9 Logical Channel 9 Source Start Address Register MSB 16 RW undef FFFE:DA4C SYS_DMA_CDSA_L_CH9 Logical Channel 9 Destination Start Address Register LSB 16 RW undef FFFE:DA4E SYS_DMA_CDSA_U_CH9 Logical Channel 9 Destination Start Address Register MSB 16 RW undef FFFE:DA50 SYS_DMA_CEN_CH9 Logical Channel 9 Element Number Register 16 RW undef FFFE:DA52 SYS_DMA_CFN_CH9 Logical Channel 9 Frame Number Register 16 RW undef 116 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−11. System DMA Controller Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:DA54 SYS_DMA_CSFI_CH9 Logical Channel 9 Source Frame Index Register 16 RW undef FFFE:DA56 SYS_DMA_CSEI_CH9 Logical Channel 9 Source Element Index Register 16 RW undef FFFE:DA58 SYS_DMA_CSAC_CH9 Logical Channel 9 Source Address Counter Register 16 R undef FFFE:DA5A SYS_DMA_CDAC_CH9 Logical Channel 9 Destination Address Counter Register 16 R undef FFFE:DA5C SYS_DMA_CDEI_CH9 Logical Channel 9 Destination Element Index Register 16 RW undef FFFE:DA5E SYS_DMA_CDFI_CH9 Logical Channel 9 Destination Frame Index Register 16 RW undef FFFE:DA60 SYS_DMA_COLOR_L_CH9 Logical Channel 9 Color Parameter Register, Lower Bits 16 RW undef FFFE:DA62 SYS_DMA_COLOR_U_CH9 Logical Channel 9 Color Parameter Register, Upper Bits 16 RW undef FFFE:DA64 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:DA68 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:DA6A SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:DA6C − FFFE:DA7F Reserved FFFE:DA80 SYS_DMA_CSDP_CH10 Logical Channel 10 Source/Destination Parameters Register 16 RW 0000h FFFE:DA82 SYS_DMA_CCR_CH10 Logical Channel 10 Control Register 16 RW 0000h FFFE:DA84 SYS_DMA_CICR_CH10 Logical Channel 10 Interrupt Control Register 16 RW 0003h FFFE:DA86 SYS_DMA_CSR_CH10 Logical Channel 10 Status Register 16 R 0000h FFFE:DA88 SYS_DMA_CSSA_L_CH10 Logical Channel 10 Source Start Address Register LSB 16 RW undef FFFE:DA8A SYS_DMA_CSSA_U_CH10 Logical Channel 10 Source Start Address Register MSB 16 RW undef FFFE:DA8C SYS_DMA_CDSA_L_CH10 Logical Channel 10 Destination Start Address Register LSB 16 RW undef FFFE:DA8E SYS_DMA_CDSA_U_CH10 Logical Channel 10 Destination Start Address Register MSB 16 RW undef FFFE:DA90 SYS_DMA_CEN_CH10 Logical Channel 10 Element Number Register 16 RW undef FFFE:DA92 SYS_DMA_CFN_CH10 Logical Channel 10 Frame Number Register 16 RW undef FFFE:DA94 SYS_DMA_CSFI_CH10 Logical Channel 10 Source Frame Index Register 16 RW undef FFFE:DA96 SYS_DMA_CSEI_CH10 Logical Channel 10 Source Element Index Register 16 RW undef FFFE:DA98 SYS_DMA_CSAC_CH10 Logical Channel 10 Source Address Counter Register 16 R undef FFFE:DA9A SYS_DMA_CDAC_CH10 Logical Channel 10 Destination Address Counter Register 16 R undef FFFE:DA9C SYS_DMA_CDEI_CH10 Logical Channel 10 Destination Element Index Register 16 RW undef FFFE:DA9E SYS_DMA_CDFI_CH10 Logical Channel 10 Destination Frame Index Register 16 RW undef December 2003 − Revised December 2005 SPRS231E 117 Functional Overview Table 3−11. System DMA Controller Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:DAA0 SYS_DMA_COLOR_L_CH0 Logical Channel 10 Color Parameter Register, Lower Bits 16 RW undef FFFE:DAA2 SYS_DMA_COLOR_U_CH0 Logical Channel 10 Color Parameter Register, Upper Bits 16 RW undef FFFE:DAA4 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:DAA8 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:DAAA SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:DAAC − FFFE:DABF Reserved FFFE:DAC0 SYS_DMA_CSDP_CH11 Logical Channel 11 Source/Destination Parameters Register 16 RW 0000h FFFE:DAC2 SYS_DMA_CCR_CH11 Logical Channel 11 Control Register 16 RW 0000h FFFE:DAC4 SYS_DMA_CICR_CH11 Logical Channel 11 Interrupt Control Register 16 RW 0003h FFFE:DAC6 SYS_DMA_CSR_CH11 Logical Channel 11 Status Register 16 R 0000h FFFE:DAC8 SYS_DMA_CSSA_L_CH11 Logical Channel 11 Source Start Address Register LSB 16 RW undef FFFE:DACA SYS_DMA_CSSA_U_CH11 Logical Channel 11 Source Start Address Register MSB 16 RW undef FFFE:DACC SYS_DMA_CDSA_L_CH11 Logical Channel 11 Destination Start Address Register LSB 16 RW undef FFFE:DACE SYS_DMA_CDSA_U_CH11 Logical Channel 11 Destination Start Address Register MSB 16 RW undef FFFE:DAD0 SYS_DMA_CEN_CH11 Logical Channel 11 Element Number Register 16 RW undef FFFE:DAD2 SYS_DMA_CFN_CH11 Logical Channel 11 Frame Number Register 16 RW undef FFFE:DAD4 SYS_DMA_CSFI_CH11 Logical Channel 11 Source Frame Index Register 16 RW undef FFFE:DAD6 SYS_DMA_CSEI_CH11 Logical Channel 11 Source Element Index Register 16 RW undef FFFE:DAD8 SYS_DMA_CSAC_CH11 Logical Channel 11 Source Address Counter Register 16 R undef FFFE:DADA SYS_DMA_CDAC_CH11 Logical Channel 11 Destination Address Counter Register 16 R undef FFFE:DADC SYS_DMA_CDEI_CH11 Logical Channel 11 Destination Element Index Register 16 RW undef FFFE:DADE SYS_DMA_CDFI_CH11 Logical Channel 11 Destination Frame Index Register 16 RW undef FFFE:DAE0 SYS_DMA_COLOR_L_C11 Logical Channel 11 Color Parameter Register, Lower Bits 16 RW undef FFFE:DAE2 SYS_DMA_COLOR_U_CH11 Logical Channel 11 Color Parameter Register, Upper Bits 16 RW undef FFFE:DAE4 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:DAE8 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:DAEA SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:DAEC − FFFE:DAFF Reserved FFFE:DB00 SYS_DMA_CSDP_CH12 Logical Channel 12 Source/Destination Parameters Register 16 RW 0000h FFFE:DB02 SYS_DMA_CCR_CH12 Logical Channel 12 Control Register 16 RW 0000h 118 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−11. System DMA Controller Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:DB04 SYS_DMA_CICR_CH12 Logical Channel 12 Interrupt Control Register 16 RW 0003h FFFE:DB06 SYS_DMA_CSR_CH12 Logical Channel 12 Status Register 16 R 0000h FFFE:DB08 SYS_DMA_CSSA_L_CH12 Logical Channel 12 Source Start Address Register LSB 16 RW undef FFFE:DB0A SYS_DMA_CSSA_U_CH12 Logical Channel 12 Source Start Address Register MSB 16 RW undef FFFE:DB0C SYS_DMA_CDSA_L_CH12 Logical Channel 12 Destination Start Address Register LSB 16 RW undef FFFE:DB0E SYS_DMA_CDSA_U_CH12 Logical Channel 12 Destination Start Address Register MSB 16 RW undef FFFE:DB10 SYS_DMA_CEN_CH12 Logical Channel 12 Element Number Register 16 RW undef FFFE:DB12 SYS_DMA_CFN_CH12 Logical Channel 12 Frame Number Register 16 RW undef FFFE:DB14 SYS_DMA_CSFI_CH12 Logical Channel 12 Source Frame Index Register 16 RW undef FFFE:DB16 SYS_DMA_CSEI_CH12 Logical Channel 12 Source Element Index Register 16 RW undef FFFE:DB18 SYS_DMA_CSAC_CH12 Logical Channel 12 Source Address Counter Register 16 R undef FFFE:DB1A SYS_DMA_CDAC_CH12 Logical Channel 12 Destination Address Counter Register 16 R undef FFFE:DB1C SYS_DMA_CDEI_CH12 Logical Channel 12 Destination Element Index Register 16 RW undef FFFE:DB1E SYS_DMA_CDFI_CH12 Logical Channel 12 Destination Frame Index Register 16 RW undef FFFE:DB20 SYS_DMA_COLOR_L_CH12 Logical Channel 12 Color Parameter Register, Lower Bits 16 RW undef FFFE:DB22 SYS_DMA_COLOR_U_CH12 Logical Channel12 Color Parameter Register, Upper Bits 16 RW undef FFFE:DB24 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:DB28 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:DB2A SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:DB2C − FFFE:DB3F Reserved FFFE:DB40 SYS_DMA_CSDP_CH13 Logical Channel 13 Source/Destination Parameters Register 16 RW 0000h FFFE:DB42 SYS_DMA_CCR_CH13 Logical Channel 13 Control Register 16 RW 0000h FFFE:DB44 SYS_DMA_CICR_CH13 Logical Channel 13 Interrupt Control Register 16 RW 0003h FFFE:DB46 SYS_DMA_CSR_CH13 Logical Channel 13 Status Register 16 R 0000h FFFE:DB48 SYS_DMA_CSSA_L_CH13 Logical Channel 13 Source Start Address Register LSB 16 RW undef FFFE:DB4A SYS_DMA_CSSA_U_CH13 Logical Channel 13 Source Start Address Register MSB 16 RW undef FFFE:DB4C SYS_DMA_CDSA_L_CH13 Logical Channel 13 Destination Start Address Register LSB 16 RW undef FFFE:DB4E SYS_DMA_CDSA_U_CH13 Logical Channel 13 Destination Start Address Register MSB 16 RW undef December 2003 − Revised December 2005 SPRS231E 119 Functional Overview Table 3−11. System DMA Controller Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:DB50 SYS_DMA_CEN_CH13 Logical Channel 13 Element Number Register 16 RW undef FFFE:DB52 SYS_DMA_CFN_CH13 Logical Channel 13 Frame Number Register 16 RW undef FFFE:DB54 SYS_DMA_CSFI_CH13 Logical Channel 13 Source Frame Index Register 16 RW undef FFFE:DB56 SYS_DMA_CSEI_CH13 Logical Channel 13 Source Element Index Register 16 RW undef FFFE:DB58 SYS_DMA_CSAC_CH13 Logical Channel 13 Source Address Counter Register 16 R undef FFFE:DB5A SYS_DMA_CDAC_CH13 Logical Channel 13 Destination Address Counter Register 16 R undef FFFE:DB5C SYS_DMA_CDEI_CH13 Logical Channel 13 Destination Element Index Register 16 RW undef FFFE:DB5E SYS_DMA_CDFI_CH13 Logical Channel 13 Destination Frame Index Register 16 RW undef FFFE:DB60 SYS_DMA_COLOR_L_CH13 Logical Channel 13 Color Parameter Register, Lower Bits 16 RW undef FFFE:DB62 SYS_DMA_COLOR_U_CH13 Logical Channel 13 Color Parameter Register, Upper Bits 16 RW undef FFFE:DB64 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:DB68 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:DB6A SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:DB60 − FFFE:DB7F Reserved FFFE:DB80 SYS_DMA_CSDP_CH14 Logical Channel 14 Source/Destination Parameters Register 16 RW 0000h FFFE:DB82 SYS_DMA_CCR_CH14 Logical Channel 14 Control Register 16 RW 0000h FFFE:DB84 SYS_DMA_CICR_CH14 Logical Channel 14 Interrupt Control Register 16 RW 0003h FFFE:DB86 SYS_DMA_CSR_CH14 Logical Channel 14 Status Register 16 R 0000h FFFE:DB88 SYS_DMA_CSSA_L_CH14 Logical Channel 14 Source Start Address Register LSB 16 RW undef FFFE:DB8A SYS_DMA_CSSA_U_CH14 Logical Channel 14 Source Start Address Register MSB 16 RW undef FFFE:DB8C SYS_DMA_CDSA_L_CH14 Logical Channel 14 Destination Start Address Register LSB 16 RW undef FFFE:DB8E SYS_DMA_CDSA_U_CH14 Logical Channel 14 Destination Start Address Register MSB 16 RW undef FFFE:DB90 SYS_DMA_CEN_CH14 Logical Channel 14 Element Number Register 16 RW undef FFFE:DB92 SYS_DMA_CFN_CH14 Logical Channel 14 Frame Number Register 16 RW undef FFFE:DB94 SYS_DMA_CSFI_CH14 Logical Channel 14 Source Frame Index Register 16 RW undef FFFE:DB96 SYS_DMA_CSEI_CH14 Logical Channel 14 Source Element Index Register 16 RW undef FFFE:DB98 SYS_DMA_CSAC_CH14 Logical Channel 14 Source Address Counter Register 16 R undef FFFE:DB9A SYS_DMA_CDAC_CH14 Logical Channel 14 Destination Address Counter Register 16 R undef 120 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−11. System DMA Controller Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:DB9C SYS_DMA_CDEI_CH14 Logical Channel 14 Destination Element Index Register 16 RW undef FFFE:DB9E SYS_DMA_CDFI_CH14 Logical Channel 14 Destination Frame Index Register 16 RW undef FFFE:DBA0 SYS_DMA_COLOR_L_CH14 Logical Channel 14 Color Parameter Register, Lower Bits 16 RW undef FFFE:DBA2 SYS_DMA_COLOR_U_CH14 Logical Channel 14 Color Parameter Register, Upper Bits 16 RW undef FFFE:DBA4 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:DBA8 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:DBAA SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef FFFE:DBAC − FFFE:DBBF Reserved FFFE:DBC0 SYS_DMA_CSDP_CH15 Logical Channel 15 Source/Destination Parameters Register 16 RW 0000h FFFE:DBC2 SYS_DMA_CCR_CH15 Logical Channel 15 Control Register 16 RW 0000h FFFE:DBC4 SYS_DMA_CICR_CH15 Logical Channel 15 Interrupt Control Register 16 RW 0003h FFFE:DBC6 SYS_DMA_CSR_CH15 Logical Channel 15 Status Register 16 R 0000h FFFE:DBC8 SYS_DMA_CSSA_L_CH15 Logical Channel 15 Source Start Address Register LSB 16 RW undef FFFE:DBCA SYS_DMA_CSSA_U_CH15 Logical Channel 15 Source Start Address Register MSB 16 RW undef FFFE:DBCC SYS_DMA_CDSA_L_CH15 Logical Channel 15 Destination Start Address Register LSB 16 RW undef FFFE:DBCE SYS_DMA_CDSA_U_CH15 Logical Channel 15 Destination Start Address Register MSB 16 RW undef FFFE:DBD0 SYS_DMA_CEN_CH15 Logical Channel 15 Element Number Register 16 RW undef FFFE:DBD2 SYS_DMA_CFN_CH15 Logical Channel 15 Frame Number Register 16 RW undef FFFE:DBD4 SYS_DMA_CSFI_CH15 Logical Channel 15 Source Frame Index Register 16 RW undef FFFE:DBD6 SYS_DMA_CSEI_CH15 Logical Channel 15 Source Element Index Register 16 RW undef FFFE:DBD8 SYS_DMA_CSAC_CH15 Logical Channel 15 Source Address Counter Register 16 R undef FFFE:DBDA SYS_DMA_CDAC_CH15 Logical Channel 15 Destination Address Counter Register 16 R undef FFFE:DBDC SYS_DMA_CDEI_CH15 Logical Channel 15 Destination Element Index Register 16 RW undef FFFE:DBDE SYS_DMA_CDFI_CH15 Logical Channel 15 Destination Frame Index Register 16 RW undef FFFE:DBE0 SYS_DMA_COLOR_L_CH15 Logical Channel 15 Color Parameter Register, Lower Bits 16 RW undef FFFE:DBE2 SYS_DMA_COLOR_U_CH15 Logical Channel 15 Color Parameter Register, Upper Bits 16 RW undef FFFE:DBE4 SYS_DMA_CCR2 Channel Control Register 2 16 RW undef FFFE:DBE8 SYS_DMA_CLNK_CTRL Channel Link Control Register 16 RW undef FFFE:DBEA SYS_DMA_LCH_CTRL Logical Channel Control Register 16 RW undef December 2003 − Revised December 2005 SPRS231E 121 Functional Overview Table 3−11. System DMA Controller Registers (Continued) BYTE ADDRESS REGISTER NAME FFFE:DBEC − FFFE:DBFF FFFE:DC00 SYS_DMA_GCR ACCESS TYPE RESET VALUE System DMA Global Control Register 16 RW 0000h 16 RW 0000h 16 RW 0000h Reserved SYS_DMA_GSCR FFFE:DC06 FFFE:DC08 ACCESS WIDTH Reserved FFFE:DC02 FFFE:DC04 DESCRIPTION System DMA Software Compatible Register Reserved SYS_DMA_GRST FFFE:DC0A − FFFE:DC41 System DMA Global Software Reset Control Register Reserved FFFE:DC42 SYS_DMA_HW_ID System DMA Version ID Register 16 R 0001h FFFE:DC44 SYS_DMA_PCh2_ID System DMA Physical Channel 2 Version ID Register 16 R 0001h FFFE:DC46 SYS_DMA_PCh0_ID System DMA Physical Channel 0 Version ID Register 16 R 0001h FFFE:DC48 SYS_DMA_PCh1_ID System DMA Physical Channel 1 Version ID Register 16 R 0001h FFFE:DC4A − FFFE:DC4D Reserved FFFE:DC4E SYS_DMA_CAPS_0_U System DMA Global DMA Capability U Register 0 16 R 000Ch FFFE:DC50 SYS_DMA_CAPS_0_L System DMA Global DMA Capability L Register 0 16 R 0000h FFFE:DC52 SYS_DMA_CAPS_1_U System DMA Global DMA Capability U Register 1 16 R undef FFFE:DC54 SYS_DMA_CAPS_1_L System DMA Global DMA Capability L Register 1 16 R 0000h FFFE:DC56 SYS_DMA_CAPS_2 System DMA Global DMA Capability Register 2 16 R 01FFh FFFE:DC58 SYS_DMA_CAPS_3 System DMA Global DMA Capability Register 3 16 R 001Fh FFFE:DC5A SYS_DMA_CAPS_4 System DMA Global DMA Capability Register 4 16 R 007Fh 16 R 00FFh FFFE:DC5C − FFFE:DC5F FFFE:DC60 Reserved SYS_DMA_PCh2_SR FFFE:DC62 − FFFE:DC7F System DMA Physical Channel 2 Status Register Reserved FFFE:DC80 SYS_DMA_PCh0_SR System DMA Physical Channel 0 Status Register 16 R 00FFh FFFE:DC82 SYS_DMA_PCh1_SR System DMA Physical Channel 1 Status Register 16 R 00FFh FFFE:DC84 − FFFE:DCC0 122 SPRS231E Reserved December 2003 − Revised December 2005 Functional Overview 3.2.2.2 MPU Public Peripheral Registers The MPU public peripheral registers include the following: • USB On-the-Go (OTG) Registers • MICROWIRE Registers • USB Client Registers • Real-Time Clock (RTC) Registers • MPUIO (Keyboard Included) Registers • Pulse Width Light (PWL) Registers • Pulse Width Tone (PWT) Registers • MMC/SDIO1 Registers • OS Timer 32-kHz Registers • USB Host Registers • Frame Adjustment Counter (FAC) Registers • HDQ/1-Wire Interface Registers • LED Pulse Generator 1 (LPG1) Registers • LED Pulse Generator 2 (LPG2) Registers Table 3−12. USB On-the-Go (OTG) Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFB:0700 USB_OTG_REV USB On-the-Go Revision Number 32 R 0000 0000h FFFB:0704 USB_OTG_SYSCON1 USB On-the-Go Configuration Register 1 32 R/W 0000 0000h FFFB:0708 USB_OTG_SYSCON2 USB On-the-Go Configuration Register 2 32 R/W 0000 0000h FFFB:070C USB_OTG_CTRL USB On-the-Go Control Register 32 R/W 0000 0000h FFFB:0710 USB_OTG_IRQ_EN USB On-the-Go Interrupt Enable Register 32 R/W 0000 0000h FFFB:0714 USB_OTG_IRQ_SRC USB On-the-Go Interrtup Status Register 32 R/W 0000 0000h FFFB:0718 USB_OTG_OUTCTRL USB On-the-Go Output Pins Control Register 32 R/W 0000 0000h FFFB:0720 USB_OTG_TEST USB On-the-Go Test Register 32 R/W 0000 0000h FFFB:07FC USB_OTG_VC USB On-the-Go Vendor Code Register 32 R December 2003 − Revised December 2005 undefined SPRS231E 123 Functional Overview Table 3−13. MICROWIRE Registers BYTE ADDRESS REGISTER NAME ACCESS WIDTH DESCRIPTION ACCESS TYPE RESET VALUE FFFB:3000 MWIRE_RDR MICROWIRE Receive Data Register 16 R undefined FFFB:3000 MWIRE_TDR MICROWIRE Transmit Data Register 16 W undefined FFFB:3004 MWIRE_CSR MICROWIRE Control And Status Register 16 R/W undefined FFFB:3008 MWIRE_SR1 MICROWIRE Setup Register for CS0 and CS1 16 R/W undefined FFFB:300C MWIRE_SR2 MICROWIRE Setup Register for CS2 and CS3 16 R/W undefined FFFB:3010 MWIRE_SR3 MICROWIRE Setup Register for Internal Clock 16 R/W undefined FFFB:3014 MWIRE_SR4 MICROWIRE Setup Register for Clock Polarity 16 R/W undefined FFFB:3018 MWIRE_SR5 MICROWIRE Setup Register for Transmit Mode 16 R/W 0000h ACCESS WIDTH ACCESS TYPE Table 3−14. USB Client Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFB:4000 USB_CLNT_REV USB Client Revision Register 16 R 0x0021 FFFB:4004 USB_CLNT_EP_NUM USB Client Endpoint Selection Register 16 R/W 0x0000 FFFB:4008 USB_CLNT_DATA USB Client Data Register 16 R/W 0x0000 FFFB:400C USB_CLNT_CTRL USB Client Control Register 16 R 0x0000 FFFB:4010 USB_CLNT_STAT_FLG USB Client Status Flag Register 16 R 0x8202 FFFB:4014 USB_CLNT_RXFSTAT USB Client Receive FIFO Status Register 16 R 0x0000 FFFB:4018 USB_CLNT_SYSCON1 USB Client System Configuration 1 Register 16 R/W 0x0000 FFFB:401C USB_CLNT_SYSCON2 USB Client System Configuration 2 Register 16 R/W 0x0000 FFFB:4020 USB_CLNT_DEVSTAT USB Client Device Status Register 16 R 0x0000 FFFB:4024 USB_CLNT_SOF USB Client Start of Frame Register 16 R 0x0000 FFFB:4028 USB_CLNT_IRQ_EN USB Client Interrupt Enable Register 16 R/W 0x0000 FFFB:402C USB_CLNT_DMA_IRQ_EN USB Client DMA Interrupt Enable Register 16 R/W 0x0000 FFFB:4030 USB_CLNT_IRQ_SRC USB Client Interrupt Source Register 16 R/W 0x0000 FFFB:4034 USB_CLNT_EPN_STAT USB Client Non-ISO Endpoint Interrupt Enable Register 16 R 0x0000 FFFB:4038 USB_CLNT_DMAIN_STAT USB Client Non-ISO DMA Interrupt Enable Register 16 R 0x0000 FFFB:403C Reserved FFFB:4040 USB_CLNT_RXDMA_CFG USB Client DMA Receive Channels Configuration Register 16 R/W 0x0000 FFFB:4044 USB_CLNT_TXDMA_CFG USB Client DMA Transmit Channels Configuration Register 16 R/W 0x0000 FFFB:4048 USB_CLNT_DATA_DMA USB Client DMA FIFO Data Register 16 R/W 0x0000 FFFB:404C Reserved FFFB:4050 USB_CLNT_TXDMA0 USB Client Transmit DMA Control 0 Register 16 R/W 0x0000 FFFB:4054 USB_CLNT_TXDMA1 USB Client Transmit DMA Control 1 Register 16 R/W 0x0000 FFFB:4058 USB_CLNT_TXDMA2 USB Client Transmit DMA Control 2 Register 16 R/W 0x0000 FFFB:405C Reserved FFFB:4060 USB_CLNT_RXDMA0 USB Client Receive DMA Control 0 Register 16 R 0x0000 FFFB:4064 USB_CLNT_RXDMA1 USB Client Receive DMA Control 1 Register 16 R 0x0000 FFFB:4068 USB_CLNT_RXDMA2 USB Client Receive DMA Control 2 Register 16 R 0x0000 † During reset, Bit 15 is zero and other bit values are undetermined (i.e., the values are unknown until the first write access.) 124 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−14. USB Client Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFB:406C − FFFB:407F Reserved FFFB:4084 USB_CLNT_EP1_RX USB Client Receive Endpoint Configuration 1 Register 16 R/W 0x0† FFFB:4088 USB_CLNT_EP2_RX USB Client Receive Endpoint Configuration 2 Register 16 R/W 0x0† FFFB:408C USB_CLNT_EP3_RX USB Client Receive Endpoint Configuration 3 Register 16 R/W 0x0† FFFB:4090 USB_CLNT_EP4_RX USB Client Receive Endpoint Configuration 4 Register 16 R/W 0x0† FFFB:4094 USB_CLNT_EP5_RX USB Client Receive Endpoint Configuration 5 Register 16 R/W 0x0† FFFB:4098 USB_CLNT_EP6_RX USB Client Receive Endpoint Configuration 6 Register 16 R/W 0x0† FFFB:409C USB_CLNT_EP7_RX USB Client Receive Endpoint Configuration 7 Register 16 R/W 0x0† FFFB:40A0 USB_CLNT_EP8_RX USB Client Receive Endpoint Configuration 8 Register 16 R/W 0x0† FFFB:40A4 USB_CLNT_EP9_RX USB Client Receive Endpoint Configuration 9 Register 16 R/W 0x0† FFFB:40A8 USB_CLNT_EP10_RX USB Client Receive Endpoint Configuration 10 Register 16 R/W 0x0† FFFB:40AC USB_CLNT_EP11_RX USB Client Receive Endpoint Configuration 11 Register 16 R/W 0x0† FFFB:40B0 USB_CLNT_EP12_RX USB Client Receive Endpoint Configuration 12 Register 16 R/W 0x0† FFFB:40B4 USB_CLNT_EP13_RX USB Client Receive Endpoint Configuration 13 Register 16 R/W 0x0† FFFB:40B8 USB_CLNT_EP14_RX USB Client Receive Endpoint Configuration 14 Register 16 R/W 0x0† FFFB:40BC USB_CLNT_EP15_RX USB Client Receive Endpoint Configuration 15 Register 16 R/W 0x0† FFFB:40C0 Reserved FFFB:40C4 USB_CLNT_EP1_TX USB Client Transmit Endpoint Configuration 1 Register 16 R/W 0x0† FFFB:40C8 USB_CLNT_EP2_TX USB Client Transmit Endpoint Configuration 2 Register 16 R/W 0x0† FFFB:40CC USB_CLNT_EP3_TX USB Client Transmit Endpoint Configuration 3 Register 16 R/W 0x0† FFFB:40D0 USB_CLNT_EP4_TX USB Client Transmit Endpoint Configuration 4 Register 16 R/W 0x0† FFFB:40D4 USB_CLNT_EP5_TX USB Client Transmit Endpoint Configuration 5 Register 16 R/W 0x0† FFFB:40D8 USB_CLNT_EP6_TX USB Client Transmit Endpoint Configuration 6 Register 16 R/W 0x0† FFFB:40DC USB_CLNT_EP7_TX USB Client Transmit Endpoint Configuration 7 Register 16 R/W 0x0† FFFB:40E0 USB_CLNT_EP8_TX USB Client Transmit Endpoint Configuration 8 Register 16 R/W 0x0† † During reset, Bit 15 is zero and other bit values are undetermined (i.e., the values are unknown until the first write access.) December 2003 − Revised December 2005 SPRS231E 125 Functional Overview Table 3−14. USB Client Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFB:40E4 USB_CLNT_EP9_TX USB Client Transmit Endpoint Configuration 9 Register 16 R/W 0x0† FFFB:40E8 USB_CLNT_EP10_TX USB Client Transmit Endpoint Configuration 10 Register 16 R/W 0x0† FFFB:40EC USB_CLNT_EP11_TX USB Client Transmit Endpoint Configuration 11 Register 16 R/W 0x0† FFFB:40F0 USB_CLNT_EP12_TX USB Client Transmit Endpoint Configuration 12 Register 16 R/W 0x0† FFFB:40F4 USB_CLNT_EP13_TX USB Client Transmit Endpoint Configuration 13 Register 16 R/W 0x0† FFFB:40F8 USB_CLNT_EP14_TX USB Client Transmit Endpoint Configuration 14 Register 16 R/W 0x0† FFFB:40FC USB_CLNT_EP15_TX USB Client Transmit Endpoint Configuration 15 Register 16 R/W 0x0† † During reset, Bit 15 is zero and other bit values are undetermined (i.e., the values are unknown until the first write access.) Table 3−15. Real-Time Clock (RTC) Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFB:4800 SECONDS_REG RTC Seconds Register 8 R/W 00h FFFB:4804 MINUTES_REG RTC Minutes Register 8 R/W 00h FFFB:4808 HOURS_REG RTC Hours Register 8 R/W 00h FFFB:480C DAYS_REG RTC Days Register 8 R/W 01h FFFB:4810 MONTHS_REG RTC Months Register 8 R/W 01h FFFB:4814 YEARS_REG RTC Years Register 8 R/W 00h FFFB:4818 WEEK_REG RTC Weeks Register 8 R/W 00h FFFB:481C Reserved FFFB:4820 ALARM_SECONDS_REG RTC Alarm Seconds Register 8 R/W 00h FFFB:4824 ALARM_MINUTES_REG RTC Alarm Minutes Register 8 R/W 00h FFFB:4828 ALARM_HOURS_REG RTC Alarm Hours Register 8 R/W 00h FFFB:482C ALARM_DAYS_REG RTC Alarm Days Register 8 R/W 01h FFFB:4830 ALARM_MONTHS_REG RTC Alarm Months Register 8 R/W 01h FFFB:4834 ALARM_YEARS_REG RTC Alarm Years Register 8 R/W 00h FFFB:4838 − FFFB:483F Reserved FFFB:4840 RTC_CTRL_REG RTC Control Register 8 R/W 00h FFFB:4844 RTC_STATUS_REG RTC Status Register 8 R/W 00h FFFB:4848 RTC_INTERRUPTS_REG RTC Interrupts Register 8 R/W 00h FFFB:484C RTC_COMP_LSB_REG RTC Compensation LSB Register 8 R/W 00h FFFB:4850 RTC_COMP_MSB_REG RTC Compensation MSB Register 8 RW 00h FFFB:4854 RTC_OSC_REG RTC Oscillator Register 8 RW 0Bh 126 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−16. MPUIO (Keyboard) Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFB:5000 MPUIO_INPUT_LATCH MPUIO General Purpose Input Register 16 R 0000h FFFB:5004 MPUIO_OUTPUT MPUIO General Purpose Output Register 16 R/W 0000h FFFB:5008 MPUIO_IO_CNTL MPUIO In/Out Control Register for General-Purpose I/O 16 R/W FFFFh FFFB:5010 MPUIO_KBD_LATCH MPUIO Keyboard Row Input Register 16 R FFFFh FFFB:5014 MPUIO_KBC MPUIO Keyboard Column Ouput Register 16 R/W FF00h FFFB:5018 MPUIO_GPIO_EVENT MPUIO GPIO Event Mode Register 16 R/W 0FE0h FFFB:501C MPUIO_GPIO_EDGE MPUIO GPIO Interrupt Edge Register 16 R/W 0000h FFFB:5020 MPUIO_KBD_INT MPUIO Keyboard Interrupt Register 16 R FFFFh FFFB:5024 MPUIO_GPIO_INT MPUIO GPIO Interrupt Register 16 R 0000h FFFB:5028 MPUIO_KBD_MASKIT MPUIO Keyboard Interrupt Mask Register 16 R/W FFFEh FFFB:502C MPUIO_GPIO_MASKIT MPUIO GPIO Interrupt Mask Register 16 R/W 0000h FFFB:5030 MPUIO_GPIO_DBNC MPUIO GPIO Debouncing Register 16 R/W EF00h FFFB:5034 MPUIO_GPIO_LATCH MPUIO GPIO Latch Register 16 R 0000h ACCESS WIDTH ACCESS TYPE Table 3−17. Pulse Width Light (PWL) Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFB:5800 PWL_LEVEL PWL Level Register 8 R/W 00h FFFB:5804 PWL_CONTROL PWL Control Register 8 R/W 00h ACCESS WIDTH ACCESS TYPE Table 3−18. Pulse Width Tone (PWT) Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFB:6000 PWT_FRC PWT Frequency Control Register 8 R/W 00h FFFB:6004 PWT_VRC PWT Volume Control Register 8 R/W 00h FFFB:6008 PWT_GCR PWT General Control Register 8 R/W 00h ACCESS WIDTH ACCESS TYPE Table 3−19. MMC/SDIO1 Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFB:7800 MPU_MMC_CMD MMC Command Register 16 R/W 0000h FFFB:7804 MPU_MMC_ARGL MMC Argument Register Low 16 R/W 0000h FFFB:7808 MPU_MMC_ARGH MMC Argument Register High 16 R/W 0000h FFFB:780C MPU_MMC_CON MMC Module Configuration Register 16 R/W 0000h FFFB:7810 MPU_MMC_STAT MMC Module Status Register 16 R/W 0000h FFFB:7814 MPU_MMC_IE MMC System Interrupt Enable Register 16 R/W 0000h FFFB:7818 MPU_MMC_CTO MMC Command Time−Out Register 16 R/W 0000h FFFB:781C MPU_MMC_DTO MMC Data Read Time−Out Register 16 R/W 0000h FFFB:7820 MPU_MMC_DATA MMC Data Access Register 16 R/W 0000h FFFB:7824 MPU_MMC_BLEN MMC Block Length Register 16 R/W 0000h FFFB:7828 MPU_MMC_NBLK MMC Numberf of Blocks Register 16 R/W 0000h FFFB:782C MPU_MMC_BUF MMC Buffer Configuration Register 16 R/W 0000h December 2003 − Revised December 2005 SPRS231E 127 Functional Overview Table 3−19. MMC/SDIO1 Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION FFFB:7830 ACCESS WIDTH ACCESS TYPE RESET VALUE Reserved FFFB:7834 MPU_MMC_SDIO MMC SDIO Configuration Register 16 R/W 0000h FFFB:7838 MPU_MMC_SYST MMC System Test Register 16 R/W 0000h FFFB:783C MPU_MMC_REV MMC Module Revision Register 16 R undefined FFFB:7840 MPU_MMC_RSP0 MMC Command Response Register 0 16 R 0000h FFFB:7844 MPU_MMC_RSP1 MMC Command Response Register 1 16 R 0000h FFFB:7848 MPU_MMC_RSP2 MMC Command Response Register 2 16 R 0000h FFFB:784C MPU_MMC_RSP3 MMC Command Response Register 3 16 R 0000h FFFB:7850 MPU_MMC_RSP4 MMC Command Response Register 4 16 R 0000h FFFB:7854 MPU_MMC_RSP5 MMC Command Response Register 5 16 R 0000h FFFB:7858 MPU_MMC_RSP6 MMC Command Response Register 6 16 R 0000h FFFB:785C MPU_MMC_RSP7 MMC Command Response Register 7 16 R 0000h FFFB:7860 MPU_MMC_IOSR MMC Command Response IOSR Register 16 R/W 0000h FFFB:7864 MPU_MMC_SYSC MMC System Control Register 16 R/W 0000h FFFB:7868 MPU_MMC_SYSS MMC System Status Register 16 R 0000h Table 3−20. OS Timer 32-kHz Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFB:9000 OS_TIMER_TICK_VAL OS Timer 32K Tick Value Register 32 R/W 00FF FFFFh FFFB:9004 OS_TIMER_TICK_CNTR OS TIimer 32k Tick Counter Register 32 R 00FF FFFFh FFFB:9008 OS_TIMER_CTRL OS Timer 32k Timer Control Register 32 R/W 0000 0008h ACCESS WIDTH ACCESS TYPE R 32 0000 0010h Table 3−21. USB Host Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFB:A000h USB_HC_REVISION USB Host Controller OHCI Revision Number Register FFFB:A004h USB_HC_CONTROL USB Host Controller Operating Mode Register R/W 32 xxxx xx00h FFFB:A008h USB_HC_CMD_STAT USB Host Controller Command and Status Register R/W 32 xxxx 0000h FFFB:A00Ch USB_HC_INT_STAT USB Host Controller Interrupt Status Register R/W 32 xxxx xxx0h FFFB:A010h USB_HC_INT_EN USB Host Controller Interrupt Enable Register R/W 32 xxxx xx00h FFFB:A014h USB_HC_INT_NEN USB Host Controller Interrupt Disable Register R/W 32 xxxx xxx0h FFFB:A018h USB_HC_HCCA USB Host Controller HCCA Physical Address Register R/W 32 0000 0000h FFFB:A01Ch USB_HC_PRD_CUR_EN USB Host Controller Physical Address of Current Period Endpoint Descriptor Register R/W 32 0000 0000h FFFB:A020h USB_HC_CTRL_HEAD USB Host Controller Physical Address of Head of Control Endpoint Descriptor List Register R/W 32 0000 0000h FFFB:A024h USB_HC_CTRL_CUR_EN USB Host Controller Physical Address of Current Control Endpoint Descriptor Register R/W 32 0000 0000h FFFB:A028h USB_HC_BLK_HEAD_EN USB Host Controller Physical Address of Head of Bulk End Point Descriptor List Register R/W 32 0000 0000h FFFB:A02Ch USB_HC_BLK_CUR_EN USB Host Controller Physical Address of Current Bulk Endpoint Descriptor Register R/W 32 0000 0000h † Bit 0 is zero. 128 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−21. USB Host Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION FFFB:A030h USB_HC_DN_HEAD USB Host Controller Physical Address of Head of List of Retired Transfer Descriptor Register FFFB:A034h USB_HC_FM_INTVRL USB Host Controller Frame Interval Register FFFB:A038h USB_HC_FM_RMN USB Host Controller Frame Remaining Register FFFB:A03Ch USB_HC_FM_NMB USB Host Controller Frame Number Remaining Register FFFB:A040h USB_HC_PRD_SRT FFFB:A044h ACCESS ACCESS WIDTH TYPE RESET VALUE R 32 0000 0000h R/W 32 0000 xEDFh R 32 0000 0000h R 32 0000 0000h USB Host Controller Period Start Register R/W 32 xxxx x000h USB_HC_LSPD_TRSH USB Host Controller Low Speed Threshold Register R/W 32 0Axx X203h FFFB:A048h USB_HC_RH_DSC_A USB Host Controller Root Hub A Register R/W 32 0000 0000h FFFB:A04Ch USB_HC_RH_DSC_B USB Host Controller Root Hub B Register R/W 32 0000 0000h FFFB:A050h USB_HC_RH_STS USB Host Controller Root Hub Register R/W 32 0000 0000h FFFB:A054h USB_HC_RH_PRT_STS1 USB Host Controller Port 1 Control and Status Register R/W 32 0000 0100h FFFB:A058h USB_HC_RH_PRT_STS2 USB Host Controller Port 2 Control and Status Register R/W 32 0000 0100h FFFB:A05Ch USB_HC_RH_PRT_STS3 USB Host Controller Port 3 Control and Status Register R/W 32 0000 0100h FFFB:A060h− FFFB:A0DFh Reserved FFFB:A0E0h USB_HC_UE_ADDR USB Host Contrroller Host UE Address Register R 32 0000 0000h FFFB:A0E4h USB_HC_UE_STAT USB Host Contrroller Host UE Status Register R 32 XXXX XXX† FFFB:A0E8h USB_HC_TM_OUT_CTRL USB Host Controller Time Out Control Register R/W 32 0000 0000h FFFB:A0ECh USB_HC_HST_REV USB Host Controller Host Revision Register R 32 XXXX XXX† † Bit 0 is zero. Table 3−22. Frame Adjustment Counter (FAC) Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFB:A800 FAC_CNT FAC Frame Adjustment Reference Counter Register 16 R/W 0000h FFFB:A810 FAC_SYNC_CNT FAC Sync Counter Register 16 R 0000h FFFB:A814 FAC_START_CNT FAC Start Counter Register 16 R 0000h FFFB:A804 FAC_CNT_RSLT FAC Frame Starter Count Register 16 R 0000h FFFB:A808 FAC_CTRL FAC Control Register 16 R/W 0000h FFFB:A80C FAC_STATUS FAC Status Register 16 R 0000h ACCESS WIDTH ACCESS TYPE R/W 0000 0000h Table 3−23. HDQ/1-Wire Interface Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFB:C000 HDQ_TX_DATA HDQ Transmit Register 32 FFFB:C004 HDQ_RX_BUF HDQ Receive Buffer Register 32 R 0000 0000h FFFB:C008 HDQ_CNTL_STAT HDQ Control and Status Register 32 R/W 0000 0000h FFFB:C00C HDQ_INT_STAT HDQ Interrupt Status Register 32 R 0000 0000h December 2003 − Revised December 2005 SPRS231E 129 Functional Overview Table 3−24. LED Pulse Generator 1 (LPG1) Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFB:D000 LPG1_CNTL LPG1 Control Register 8 R/W 00h FFFB:D004 LPG1_PWR_MNGT LPG1 Power Mangement Register 8 R/W 00h ACCESS WIDTH ACCESS TYPE Table 3−25. LED Pulse Generator 2 (LPG2) Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFB:D800 LPG2_CNTL LPG2 Control Register 8 R/W 00h FFFB:D804 LPG2_PWR_MNGT LPG2 Power Mangement Register 8 R/W 00h 130 SPRS231E December 2003 − Revised December 2005 Functional Overview 3.2.2.3 MPU/DSP Shared Peripheral Registers The MPU public peripheral registers include the following: • UART1 Registers • UART2 Registers • SPI1 Registers • McBSP2 Registers • General-Purpose Timer 1 Registers • General-Purpose Timer 2 Registers • General-Purpose Timer 3 Registers • General-Purpose Timer 4 Registers • General-Purpose Timer 5 Registers • I2C1 Registers • General-Purpose Timer 6 Registers • General-Purpose Timer 7 Registers • MMC/SDIO2 Registers • UART 3 Registers • MPU GPIO3 Registers • MPU GPIO4 Registers • 32-kHz Synchro Count Registers • General-Purpose Timer 8 Registers • MPU GPIO1 Registers • MPU GPIO2 Registers • MPU/DSP Shared Mailbox Registers December 2003 − Revised December 2005 SPRS231E 131 Functional Overview Table 3−26. UART1 Registers DSP WORD ADDRESS MPU BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE R Undefined 0x00 8000h FFFB:0000 UART1_RHR UART1 receive holding register 8 0x00 8000h FFFB:0000 UART1_THR UART1 transmit holding register 8 W 0x00 8000h FFFB:0000 UART1_DLL UART1 divisor latch low register 8 R/W 00h 0x00 8001h FFFB:0004 UART1_IER UART1 interrupt enable register 8 R/W 00h 0x00 8001h FFFB:0004 UART1_DLH UART1 divisor latch high register 8 R/W 00h 0x00 8002h FFFB:0008 UART1_IIR UART1 interrupt identification register 8 R 01h 0x00 8002h FFFB:0008 UART1_FCR UART1 FIFO control register 8 W 00h 0x00 8002h FFFB:0008 UART1_EFR UART1 enhanced feature register 8 R/W 00h 0x00 8003h FFFB:000C UART1_LCR UART1 line control register 8 R/W 00h 0x00 8004h FFFB:0010 UART1_MCR UART1 modem control register 8 R/W 00h 0x00 8004h FFFB:0010 UART1_XON1 UART1 XON1 register 8 R/W 00h 0x00 8005h FFFB:0014 UART1_LSR UART1 mode register 8 R 60h 0x00 8005h FFFB:0014 UART1_XON2 UART1 XON2 register 8 R/W 00h 0x00 8006h FFFB:0018 UART1_MSR UART1 modem status register 8 R 0x00 8006h FFFB:0018 UART1_TCR UART1 transmission control register 8 R/W 0Fh 0x00 8006h FFFB:0018 UART1_XOFF1 UART1 XOFF1 register 8 R/W 00h 0x00 8007h FFFB:001C UART1_SPR UART1 scratchpad register 8 R/W 00h 0x00 8007h FFFB:001C UART1_TLR UART1 trigger level register 8 R/W 00h 0x00 8007h FFFB:001C UART1_XOFF2 UART1 XOFF2 register 8 R/W 00h 0x00 8008h FFFB:0020 UART1_MDR1 UART1 mode definition 1 register 8 R/W 07h 0x00 8009h FFFB:0024 UART1_MDR2 UART1 mode definition register 2 8 R/W 00h 0x00 800Ah FFFB:0028 UART1_SFLSR UART1 status FIFO line status register 8 R 00h 0x00 800Ah FFFB:0028 UART1_TXFLL UART1 transmit frame length low 8 W 00h 0x00 800Bh FFFB:002C UART1_RESUME UART1 resume register 8 R 00h 0x00 800Bh FFFB:002C UART1_TXFLH UART1 transmit frame length high 8 W 00h 0x00 800Ch FFFB:0030 UART1_SFREGL UART1 status FIFO low register 8 R Undefined 0x00 800Ch FFFB:0030 UART1_RXFLL UART1 receive frame length low 8 W 00h 0x00 800Dh FFFB:0034 UART1_SFREGH UART1 status FIFO high register 8 R Undefined 0x00 800Dh FFFB:0034 UART1_RXFLH UART1 receive frame length high 8 W 00h 0x00 800Eh FFFB:0038 UART1_UASR UART1 autobauding status register 8 R 00h 0x00 800Eh FFFB:0038 UART1_BLR UART1 BOF control register 8 R/W 40h 0x00 800Fh FFFB:003C UART1_ACREG UART1 auxiliary control register 8 R/W 00h 0x00 8010h FFFB:0040 UART1_SCR UART1 supplementary control register 8 R/W 00h 0x00 8011h FFFB:0044 UART1_SSR UART1 supplementary status register 8 R 00h 0x00 8012h FFFB:0048 UART1_EBLR UART1 BOF length register 8 R/W 00h 0x00 8013h FFFB:004C 0x00 8014h FFFB:0050 UART1_MVR UART1 module version register 8 R − 0x00 8015h FFFB:0054 UART1_SYSC UART1 system configuration register 8 R/W 00h 0x00 8016h FFFB:0058 UART1_SYSS UART1 system status register 8 R/W 00h 0x00 8017h FFFB:005C UART1_WER UART1 wake-up enable register 8 R/W 7Fh 132 SPRS231E Undefined Undefined Reserved December 2003 − Revised December 2005 Functional Overview Table 3−27. UART2 Registers DSP WORD ADDRESS MPU BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE R Undefined 0x00 8400h FFFB:0800 UART2_RHR UART2 receive holding register 8 0x00 8400h FFFB:0800 UART2_THR UART2 transmit holding register 8 W 0x00 8400h FFFB:0800 UART2_DLL UART2 divisor latch low register 8 R/W 00h 0x00 8401h FFFB:0804 UART2_IER UART2 interrupt enable register 8 R/W 00h 0x00 8401h FFFB:0804 UART2_DLH UART2 divisor latch high register 8 R/W 00h 0x00 8402h FFFB:0808 UART2_IIR UART2 interrupt identification register 8 R 01h 0x00 8402h FFFB:0808 UART2_FCR UART2 FIFO control register 8 W 00h 0x00 8402h FFFB:0808 UART2_EFR UART2 enhanced feature register 8 R/W 00h 0x00 8403h FFFB:080C UART2_LCR UART2 line control register 8 R/W 00h 0x00 8404h FFFB:0810 UART2_MCR UART2 modem control register 8 R/W 00h 0x00 8404h FFFB:0810 UART2_XON1 UART2 XON1 register 8 R/W 00h 0x00 8405h FFFB:0814 UART2_LSR UART2 mode register 8 R 60h 0x00 8405h FFFB:0814 UART2_XON2 UART2 XON2 register 8 R/W 00h 0x00 8406h FFFB:0818 UART2_MSR UART2 modem status register 8 R 0x00 8406h FFFB:0818 UART2_TCR UART2 transmission control register 8 R/W 0Fh 0x00 8406h FFFB:0818 UART2_XOFF UART2 XOFF1 register 8 R/W 00h 0x00 8407h FFFB:081C UART2_SPR UART2 scratchpad register 8 R/W 00h 0x00 8407h FFFB:081C UART2_TLR UART2 trigger level register 8 R/W 00h 0x00 8407h FFFB:081C UART2_XOFF2 UART2 XOFF2 register 8 R/W 00h 0x00 8408h FFFB:0820 UART2_MDR1 UART2 mode definition 1 register 8 R/W 07h 0x00 8409h FFFB:0824 UART2_MDR2 UART2 mode definition register 2 8 R/W 00h 0x00 840Ah FFFB:0828 UART2_SFLSR UART2 status FIFO line status register 8 R 00h 0x00 840Ah FFFB:0828 UART2_TXFLL UART2 transmit frame length low 8 W 00h 0x00 840Bh FFFB:082C UART2_RESUME UART2 resume register 8 R 00h 0x00 840Bh FFFB:082C UART2_TXFLH UART2 transmit frame length high 8 W 00h 0x00 840Ch FFFB:0830 UART2_SFREGL UART2 status FIFO low register 8 R Undefined 0x00 840Ch FFFB:0830 UART2_RXFLL UART2 receive frame length low 8 W 00h 0x00 840Dh FFFB:0834 UART2_SFREGH UART2 status FIFO high register 8 R Undefined 0x00 840Dh FFFB:0834 UART2_RXFLH UART2 receive frame length high 8 W 00h 0x00 840Eh FFFB:0838 UART2_UASR UART2 autobauding status register 8 R 00h 0x00 840Eh FFFB:0838 UART2_BLR UART2 BOF control register 8 R/W 40h 0x00 840Fh FFFB:083C UART2_ACREG UART2 auxiliary control register 8 R/W 00h 0x00 8410h FFFB:0840 UART2_SCR UART2 supplementary control register 8 R/W 00h 0x00 8411h FFFB:0844 UART2_SSR UART2 supplementary status register 8 R 00h 0x00 8412h FFFB:0848 UART2_EBLR UART2 BOF length register 8 R/W 00h 0x00 8413h FFFB:084C 0x00 8414h FFFB:0850 UART2_MVR UART2 module version register 8 R 0x00 8415h FFFB:0854 UART2_SYSC UART2 system configuration register 8 R/W 00h 0x00 8416h FFFB:0858 UART2_SYSS UART2 system status register 8 R/W 00h 0x00 8417h FFFB:085C UART2_WER UART2 wake-up enable register 8 R/W 7Fh Undefined Undefined Reserved December 2003 − Revised December 2005 − SPRS231E 133 Functional Overview Table 3−28. SPI1 Registers DSP WORD ADDRESS BYTE ADDRESS REGISTER NAME ACCESS TYPE RESET VALUE 32 R 0000 00XXh R/W 0000 0020h FFFB:0C00 0x00 8602h − 0x00 8607h FFFB:0C04 − FFFB:0C0F 0x00 8608h FFFB:0C10 SPI1_SCR System Configuration Register 32 0x00 860Ah FFFB:0C14 SPI1_SSR System Status Register 32 R 0000 0000h 0x00 860Ch FFFB:0C18 SPI1_ISR Interrupt Status Register 32 R/W 0000 0000h 0x00 860Eh FFFB:0C1C SPI1_IER Interrupt Enable Register 32 R/W 0000 0000h 0x00 8610h FFFB:0C20 0x00 8612h FFFB:0C24 SPI1_SET1 Setup 1 Register 32 R/W 0000 0000h 0x00 8614h FFFB:0C28 SPI1_SET2 Setup 2 Register 32 R/W 0000 0000h 0x00 8616h FFFB:0C2C SPI1_CTRL Control Register 32 R/W 0000 0000h 0x00 8618h FFFB:0C30 SPI1_DSR Data Status Register 32 R 0000 0002h 0x00 861Ah FFFB:0C34 SPI1_TX Transmit Register 32 R/W 0000 0000h 0x00 861Ch FFFB:0C38 SPI1_RX Receive Register 32 R 0000 0000h 0x00 861Eh FFFB:0C3C SPI1_TEST Test Register 32 R/W 0000 0000h SPRS231E Module Version Register ACCESS WIDTH 0x00 8600h 134 SPI1_REV DESCRIPTION Reserved Reserved December 2003 − Revised December 2005 Functional Overview Table 3−29. McBSP2 Registers DSP WORD ADDRESS MPU BYTE ADDRESS ACCESS WIDTH ACCESS TYPE 0x00 8800h FFFB:1000 MCBSP2_DRR2 McBSP2 Data receive register 2 16 R/W 0000h 0x00 8801h FFFB:1002 0x00 8802h FFFB:1004 MCBSP2_DRR1 McBSP2 Data receive register 1 16 R/W 0000h MCBSP2_DXR2 McBSP2 Data transmit register 2 16 R/W 0x00 8803h 0000h FFFB:1006 MCBSP2_DXR1 McBSP2 Data transmit register 1 16 R/W 0000h 0x00 8804h FFFB:1008 MCBSP2_SPCR2 McBSP2 Serial port control register 2 16 R/W 0000h 0x00 8805h FFFB:100A MCBSP2_SPCR1 McBSP2 Serial port control register 1 16 R/W 0000h 0x00 8806h FFFB:100C MCBSP2_RCR2 McBSP2 Receive control register 2 16 R//W 0000h 0x00 8807h FFFB:100E MCBSP2_RCR1 McBSP2 Receive control register 1 16 R/W 0000h 0x00 8808h FFFB:1010 MCBSP2_XCR2 McBSP2 Transmit control register 2 16 R/W 0000h 0x00 8809h FFFB:1012 MCBSP2_XCR1 McBSP2 Transmit control register 1 16 R/W 0000h 0x00 880Ah FFFB:1014 MCBSP2_SRGR2 McBSP2 Sample rate generator register 2 16 R/W 2000h 0x00 880Bh FFFB:1016 MCBSP2_SRGR1 McBSP2 Sample rate generator register 1 16 R/W 0001h 0x00 880Ch FFFB:1018 MCBSP2_MCR2 McBSP2 Multichannel register 2 16 R/W 0000h 0x00 880Dh FFFB:101A MCBSP2_MCR1 McBSP2 Multichannel register 1 16 R/W 0000h 16 R/W 0000h REGISTER NAME DESCRIPTION RESET VALUE 0x00 880Eh FFFB:101C MCBSP2_RCERA McBSP2 Receive channel enable register partition A 0x00 880Fh FFFB:101E MCBSP2_RCERB McBSP2 Receive channel enable register partition B 16 R/W 0000h 0x00 8810h FFFB:1020 MCBSP2_XCERA McBSP2 Transmit channel enable register partition A 16 R/W 0000h 0x00 8811h FFFB:1022 MCBSP2_XCERB McBSP2 Transmit channel enable register partition B 16 R/W 0000h 0x00 8812h FFFB:1024 MCBSP2_PCR0 McBSP2 Pin control register 0 16 R/W 0000h 0x00 8813h FFFB:1026 MCBSP2_RCERC McBSP2 Receive channel enable register partition C 16 R/W 0000h 0x00 8814h FFFB:1028 MCBSP2_RCERD McBSP2 Receive channel enable register partition D 16 R/W 0000h 0x00 8815h FFFB:102A MCBSP2_XCERC McBSP2 Transmit channel enable register partition C 16 R/W 0000h 0x00 8816h FFFB:102C MCBSP2_XCERD McBSP2 Transmit channel enable register partition D 16 R/W 0000h 0x00 8817h FFFB:102E MCBSP2_RCERE McBSP2 Receive channel enable register partition E 16 R/W 0000h 0x00 8818h FFFB:1030 MCBSP2_RCERF McBSP2 Receive channel enable register partition F 16 R/W 0000h 0x00 8819h FFFB:1032 MCBSP2_XCERE McBSP2 Transmit channel enable register partition E 16 R/W 0000h 0x00 881Ah FFFB:1034 MCBSP2_XCERF McBSP2 Transmit channel enable register partition F 16 R/W 0000h 0x00 881Bh FFFB:1036 MCBSP2_RCERG McBSP2 Receive channel enable register partition G 16 R/W 0000h 0x00 881Ch FFFB:1038 MCBSP2_RCERH McBSP2 Receive channel enable register partition H 16 R/W 0000h 0x00 881Dh FFFB:103A MCBSP2_XCERG McBSP2 Transmit channel enable register partition G 16 R/W 0000h 0x00 881Eh FFFB:103C MCBSP2_XCERH McBSP2 Transmit channel enable register partition H 16 R/W 0000h 0x00 881Fh FFFB:103E MCBSP2_REV McBSP2 Version register 16 R/W 0011h December 2003 − Revised December 2005 SPRS231E 135 Functional Overview Table 3−30. General-Purpose Timer1 Registers DSP WORD ADDRESS MPU BYTE ADDRESS REGISTER NAME ACCESS TYPE RESET VALUE 16/32 R 0000 0010h FFFB:1400 0x00 8A02h FFFB:1404 0x00 8A08h FFFB:1410 GPTMR1_TIOCP_CFG GPTimer1 OCP Configuration Register 16/32 R/W 0000 0000h 0x00 8A0Ah FFFB:1414 GPTMR1_TISTAT GPTimer1 System Status Register 16/32 R 0000 0000h 0x00 8A0Ch FFFB:1418 GPTMR1_TISR GPTimer1 Status Register 16/32 R/W 0000 0000h 0x00 8A0Eh FFFB:141C GPTMR1_TIER GPTimer1 Interrupt Enable Register 16/32 R/W 0000 0000h 0x00 8A10h FFFB:1420 GPTMR1_TWER GPTimer1 Wake Up Enable Register 16/32 R/W 0000 0000h 0x00 8A12h FFFB:1424 GPTMR1_TCLR GPTimer1 Control Register 16/32 R/W 0000 0000h 0x00 8A14h FFFB:1428 GPTMR1_TCRR GPTimer1 Counter Register 16/32 R/W 0000 0000h 0x00 8A16h FFFB:142C GPTMR1_TLDR GPTimer1 Load Register 16/32 R/W 0000 0000h 0x00 8A18h FFFB:1430 GPTMR1_TTGR GPTimer1 Trigger Register 16/32 R/W FFFF FFFFh 0x00 8A1Ah FFFB:1434 GPTMR1_TWPS GPTimer1 Write Posted Register 16/32 R 0000 0000h 0x00 8A1Ch FFFB:1438 GPTMR1_TMAR GPTimer1 Match Register 16/32 R/W 0000 0000h GPTMR1_TSICR GPTimer1 Synchronization Interface Control Register 16/32 R/W 0000 0004h ACCESS WIDTH ACCESS TYPE 16/32 R 0000 0010h FFFB:1440 GPTimer1 Identification Register ACCESS WIDTH 0x00 8A00h 0x00 8A20h GPTMR1_TIDR DESCRIPTION Reserved Table 3−31. General-Purpose Timer2 Registers DSP WORD ADDRESS MPU BYTE ADDRESS REGISTER NAME FFFB:1C00 0x00 8E02h FFFB:1C04 0x00 8E08h FFFB:1C10 GPTMR2_TIOCP_CFG GPTimer2 OCP Configuration Register 16/32 R/W 0000 0000h 0x00 8E0Ah FFFB:1C14 GPTMR2_TISTAT GPTimer2 System Status Register 16/32 R 0000 0000h 0x00 8E0Ch FFFB:1C18 GPTMR2_TISR GPTimer2 Status Register 16/32 R/W 0000 0000h 0x00 8E0Eh FFFB:1C1C GPTMR2_TIER GPTimer2 Interrupt Enable Register 16/32 R/W 0000 0000h 0x00 8E10h FFFB:1C20 GPTMR2_TWER GPTimer2 Wake Up Enable Register 16/32 R/W 0000 0000h 0x00 8E12h FFFB:1C24 GPTMR2_TCLR GPTimer2 Control Register 16/32 R/W 0000 0000h 0x00 8E14h FFFB:1C28 GPTMR2_TCRR GPTimer2 Counter Register 16/32 R/W 0000 0000h 0x00 8E16h FFFB:1C2C GPTMR2_TLDR GPTimer2 Load Register 16/32 R/W 0000 0000h 0x00 8E18h FFFB:1C30 GPTMR2_TTGR GPTimer2 Trigger Register 16/32 R/W FFFF FFFFh 0x00 8E1Ah FFFB:1C34 GPTMR2_TWPS GPTimer2 Write Posted Register 16/32 R 0000 0000h 0x00 8E1Ch FFFB:1C38 GPTMR2_TMAR GPTimer2 Match Register 16/32 R/W 0000 0000h GPTMR2_TSICR GPTimer2 Synchronization Interface Control Register 16/32 R/W 0000 0004h 136 FFFB:1C40 SPRS231E GPTimer2 Identification Register RESET VALUE 0x00 8E00h 0x00 8E20h GPTMR2_TIDR DESCRIPTION Reserved December 2003 − Revised December 2005 Functional Overview Table 3−32. General-Purpose Timer3 Registers DSP WORD ADDRESS MPU BYTE ADDRESS REGISTER NAME ACCESS TYPE RESET VALUE 16/32 R 0000 0010h FFFB:2400 0x00 9202h FFFB:2404 0x00 9208h FFFB:2410 GPTMR3_TIOCP_CFG GPTimer3 OCP Configuration Register 16/32 R/W 0000 0000h 0x00 920Ah FFFB:2414 GPTMR3_TISTAT GPTimer3 System Status Register 16/32 R 0000 0000h 0x00 920Ch FFFB:2418 GPTMR3_TISR GPTimer3 Status Register 16/32 R/W 0000 0000h 0x00 920Eh FFFB:241C GPTMR3_TIER GPTimer3 Interrupt Enable Register 16/32 R/W 0000 0000h 0x00 9210h FFFB:2420 GPTMR3_TWER GPTimer3 Wake Up Enable Register 16/32 R/W 0000 0000h 0x00 9212h FFFB:2424 GPTMR3_TCLR GPTimer3 Control Register 16/32 R/W 0000 0000h 0x00 9214h FFFB:2428 GPTMR3_TCRR GPTimer3 Counter Register 16/32 R/W 0000 0000h 0x00 9216h FFFB:242C GPTMR3_TLDR GPTimer3 Load Register 16/32 R/W 0000 0000h 0x00 9218h FFFB:2430 GPTMR3_TTGR GPTimer3 Trigger Register 16/32 R/W FFFF FFFFh 0x00 921Ah FFFB:2434 GPTMR3_TWPS GPTimer3 Write Posted Register 16/32 R 0000 0000h 0x00 921Ch FFFB:2438 GPTMR3_TMAR GPTimer3 Match Register 16/32 R/W 0000 0000h GPTMR3_TSICR GPTimer3 Synchronization Interface Control Register 16/32 R/W 0000 0004h ACCESS WIDTH ACCESS TYPE 16/32 R 0000 0010h FFFB:2440 GPTimer3 Identification Register ACCESS WIDTH 0x00 9200h 0x00 9220h GPTMR3_TIDR DESCRIPTION Reserved Table 3−33. General-Purpose Timer4 Registers DSP WORD ADDRESS MPU BYTE ADDRESS REGISTER NAME FFFB:2C00 0x00 9602h FFFB:2C04 0x00 9608h FFFB:2C10 GPTMR4_TIOCP_CFG GPTimer4 OCP Configuration Register 16/32 R/W 0000 0000h 0x00 960Ah FFFB:2C14 GPTMR4_TISTAT GPTimer4 System Status Register 16/32 R 0000 0000h 0x00 960Ch FFFB:2C18 GPTMR4_TISR GPTimer4 Status Register 16/32 R/W 0000 0000h 0x00 960Eh FFFB:2C1C GPTMR4_TIER GPTimer4 Interrupt Enable Register 16/32 R/W 0000 0000h 0x00 9610h FFFB:2C20 GPTMR4_TWER GPTimer4 Wake Up Enable Register 16/32 R/W 0000 0000h 0x00 9612h FFFB:2C24 GPTMR4_TCLR GPTimer4 Control Register 16/32 R/W 0000 0000h 0x00 9614h FFFB:2C28 GPTMR4_TCRR GPTimer4 Counter Register 16/32 R/W 0000 0000h 0x00 9616h FFFB:2C2C GPTMR4_TLDR GPTimer4 Load Register 16/32 R/W 0000 0000h 0x00 9618h FFFB:2C30 GPTMR4_TTGR GPTimer4 Trigger Register 16/32 R/W FFFF FFFFh 0x00 961Ah FFFB:2C34 GPTMR4_TWPS GPTimer4 Write Posted Register 16/32 R 0000 0000h 0x00 961Ch FFFB:2C38 GPTMR4_TMAR GPTimer4 Match Register 16/32 R/W 0000 0000h GPTMR4_TSICR GPTimer4 Synchronization Interface Control Register 16/32 R/W 0000 0004h FFFB:2C40 GPTimer4 Identification Register RESET VALUE 0x00 9600h 0x00 9620h GPTMR4_TIDR DESCRIPTION Reserved December 2003 − Revised December 2005 SPRS231E 137 Functional Overview Table 3−34. General-Purpose Timer5 Registers DSP WORD ADDRESS MPU BYTE ADDRESS REGISTER NAME ACCESS TYPE RESET VALUE 16/32 R 0000 0010h FFFB:3400 0x00 9A02h FFFB:3404 0x00 9A08h FFFB:3410 GPTMR5_TIOCP_CFG GPTimer5 OCP Configuration Register 16/32 R/W 0000 0000h 0x00 9A0Ah FFFB:3414 GPTMR5_TISTAT GPTimer5 System Status Register 16/32 R 0000 0000h 0x00 9A0Ch FFFB:3418 GPTMR5_TISR GPTimer5 Status Register 16/32 R/W 0000 0000h 0x00 9A0Eh FFFB:341C GPTMR5_TIER GPTimer5 Interrupt Enable Register 16/32 R/W 0000 0000h 0x00 9A10h FFFB:3420 GPTMR5_TWER GPTimer5 Wake Up Enable Register 16/32 R/W 0000 0000h 0x00 9A12h FFFB:3424 GPTMR5_TCLR GPTimer5 Control Register 16/32 R/W 0000 0000h 0x00 9A14h FFFB:3428 GPTMR5_TCRR GPTimer5 Counter Register 16/32 R/W 0000 0000h 0x00 9A16h FFFB:342C GPTMR5_TLDR GPTimer5 Load Register 16/32 R/W 0000 0000h 0x00 9A18h FFFB:3430 GPTMR5_TTGR GPTimer5 Trigger Register 16/32 R/W FFFF FFFFh 0x00 9A1Ah FFFB:3434 GPTMR5_TWPS GPTimer5 Write Posted Register 16/32 R 0000 0000h 0x00 9A1Ch FFFB:3438 GPTMR5_TMAR GPTimer5 Match Register 16/32 R/W 0000 0000h GPTMR5_TSICR GPTimer5 Synchronization Interface Control Register 16/32 R/W 0000 0004h FFFB:3440 GPTimer5 Identification Register ACCESS WIDTH 0x00 9A00h 0x00 9A20h GPTMR5_TIDR DESCRIPTION Reserved Table 3−35. I2C1 Registers DSP WORD ADDRESS MPU BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 9C00h FFFB:3800 I2C1_REV I2C1 Module Version Register 16 R/W 0022h 0x00 9C02h FFFB:3804 I2C1_IE I2C1 Interrupt Enable Register 16 R/W 0000h I2C1_STAT I2C1 16 R 0000h 0x00 9C04h FFFB:3808 0x00 9C06h FFFB:380C Status Register 0x00 9C08h FFFB:3810 I2C1_SYSS I2C1 System Status Register 16 R 0000h 0x00 9C0Ah FFFB:3814 I2C1_BUF I2C1 Buffer Configuration Register 16 R/W 0000h 0x00 9C0Ch FFFB:3818 I2C1_CNT I2C1 Data Counter Register 16 R/W 0000h Reserved 0x00 9C0Eh FFFB:381C I2C1_DATA I2C1 16 R/W 0000h 0x00 9C10h FFFB:3820 I2C1_SYSC I2C1 System Configuration Register 16 R/W 0000h Data Access Register 0x00 9C12h FFFB:3824 I2C1_CON I2C1 Configuration Register 16 R/W 0000h 0x00 9C14h FFFB:3828 I2C1_OA I2C1 Own Address Register 16 R/W 0000h 0x00 9C16h FFFB:382C I2C1_SA I2C1 Slave Address Register 16 R/W 03FFh 0x00 9C18h FFFB:3830 I2C1_PSC I2C1 Clock Prescaler Register 16 R/W 0000h 0x00 9C1Ah FFFB:3834 I2C1_SCLL I2C1 SCL Low Timer Register 16 R/W 0000h 0x00 9C1Ch FFFB:3838 I2C1_SCLH I2C1 SCL High Timer Register 16 R/W 0000h I2C1_SYSTEST I2C1 16 R/W 0000h 0x00 9C1Eh 138 FFFB:383C SPRS231E System Test Register December 2003 − Revised December 2005 Functional Overview Table 3−36. General-Purpose Timer6 Registers DSP WORD ADDRESS MPU BYTE ADDRESS REGISTER NAME ACCESS TYPE RESET VALUE 16/32 R 0000 0010h FFFB:3C00 0x00 9E02h FFFB:3C04 0x00 9E08h FFFB:3C10 GPTMR6_TIOCP_CFG GPTimer6 OCP Configuration Register 16/32 R/W 0000 0000h 0x00 9E0Ah FFFB:3C14 GPTMR6_TISTAT GPTimer6 System Status Register 16/32 R 0000 0000h 0x00 9E0Ch FFFB:3C18 GPTMR6_TISR GPTimer6 Status Register 16/32 R/W 0000 0000h 0x00 9E0Eh FFFB:3C1C GPTMR6_TIER GPTimer6 Interrupt Enable Register 16/32 R/W 0000 0000h 0x00 9E10h FFFB:3C20 GPTMR6_TWER GPTimer6 Wake Up Enable Register 16/32 R/W 0000 0000h 0x00 9E12h FFFB:3C24 GPTMR6_TCLR GPTimer6 Control Register 16/32 R/W 0000 0000h 0x00 9E14h FFFB:3C28 GPTMR6_TCRR GPTimer6 Counter Register 16/32 R/W 0000 0000h 0x00 9E16h FFFB:3C2C GPTMR6_TLDR GPTimer6 Load Register 16/32 R/W 0000 0000h 0x00 9E18h FFFB:3C30 GPTMR6_TTGR GPTimer6 Trigger Register 16/32 R/W FFFF FFFFh 0x00 9E1Ah FFFB:3C34 GPTMR6_TWPS GPTimer6 Write Posted Register 16/32 R 0000 0000h 0x00 9E1Ch FFFB:3C38 GPTMR6_TMAR GPTimer6 Match Register 16/32 R/W 0000 0000h GPTMR6_TSICR GPTimer6 Synchronization Interface Control Register 16/32 R/W 0000 0004h ACCESS WIDTH ACCESS TYPE 16/32 R 0000 0010h FFFB:3C40 GPTimer6 Identification Register ACCESS WIDTH 0x00 9E00h 0x00 9E20h GPTMR6_TIDR DESCRIPTION Reserved Table 3−37. General-Purpose Timer7 Registers DSP WORD ADDRESS BYTE ADDRESS REGISTER NAME FFFB:7400 0x00 BA02h FFFB:7404 0x00 BA08h FFFB:7410 GPTMR7_TIOCP_CFG GPTimer7 OCP Configuration Register 16/32 R/W 0000 0000h 0x00 BA0Ah FFFB:7414 GPTMR7_TISTAT GPTimer7 System Status Register 16/32 R 0000 0000h 0x00 BA0Ch FFFB:7418 GPTMR7_TISR GPTimer7 Status Register 16/32 R/W 0000 0000h 0x00 BA0Eh FFFB:741C GPTMR7_TIER GPTimer7 Interrupt Enable Register 16/32 R/W 0000 0000h 0x00 BA10h FFFB:7420 GPTMR7_TWER GPTimer7 Wake Up Enable Register 16/32 R/W 0000 0000h 0x00 BA12h FFFB:7424 GPTMR7_TCLR GPTimer7 Control Register 16/32 R/W 0000 0000h 0x00 BA14h FFFB:7428 GPTMR7_TCRR GPTimer7 Counter Register 16/32 R/W 0000 0000h 0x00 BA16h FFFB:742C GPTMR7_TLDR GPTimer7 Load Register 16/32 R/W 0000 0000h 0x00 BA18h FFFB:7430 GPTMR7_TTGR GPTimer7 Trigger Register 16/32 R/W FFFF FFFFh 0x00 BA1Ah FFFB:7434 GPTMR7_TWPS GPTimer7 Write Posted Register 16/32 R 0000 0000h 0x00 BA1Ch FFFB:7438 GPTMR7_TMAR GPTimer7 Match Register 16/32 R/W 0000 0000h GPTMR7_TSICR GPTimer7 Synchronization Interface Control Register 16/32 R/W 0000 0004h FFFB:7440 GPTimer7 Identification Register RESET VALUE 0x00 BA00h 0x00 BA20h GPTMR7_TIDR DESCRIPTION Reserved December 2003 − Revised December 2005 SPRS231E 139 Functional Overview Table 3−38. MMC/SDIO2 Registers DSP WORD ADDRESS MPU BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 BE00h FFFB:7C00 MMC2_CMD MMC2 Command Register 16 R/W 0000h 0x00 BE02h FFFB:7C04 MMC2_ARGL MMC2 Argument Register Low 16 R/W 0000h 0x00 BE04h FFFB:7C08 MMC2_ARGH MMC2 Argument Register High 16 R/W 0000h 0x00 BE06h FFFB:7C0C MMC2_CON MMC2 Module Configuration Register 16 R/W 0000h 0x00 BE08h FFFB:7C10 MMC2_STAT MMC2 Module Status Register 16 R/W 0000h 0x00 BE0Ah FFFB:7C14 MMC2_IE MMC2 System Interrupt Enable Register 16 R/W 0000h 0x00 BE0Ch FFFB:7C18 MMC2_CTO MMC2 Command Time-Out Register 16 R/W 0000h 0x00 BE0Eh FFFB:7C1C MMC2_DTO MMC2 Data Read Time-Out Register 16 R/W 0000h 0x00 BE10h FFFB:7C20 MMC2_DATA MMC2 Data Access Register 16 R/W 0000h 0x00 BE12h FFFB:7C24 MMC2_BLEN MMC2 Block Length Register 16 R/W 0000h 0x00 BE14h FFFB:7C28 MMC2_NBLK MMC2 Numberf of Blocks Register 16 R/W 0000h 0x00 BE16h FFFB:7C2C MMC2_BUF MMC2 Buffer Configuration Register 16 R/W 0000h 0x00 BE18h FFFB:7C30 0x00 BE1Ah FFFB:7C34 MMC2_SDIO MMC2 SDIO Configuration Register 16 R/W 0000h 0x00 BE1Ch FFFB:7C38 MMC2_SYST MMC2 System Test Register 16 R/W 0000h 0x00 BE1Eh FFFB:7C3C MMC2_REV MMC2 Module Revision Register 16 R undefined 0x00 BE20h FFFB:7C40 MMC2_RSP0 MMC2 Command Response Register 0 16 R 0000h 0x00 BE22h FFFB:7C44 MMC2_RSP1 MMC2 Command Response Register 1 16 R 0000h 0x00 BE24h FFFB:7C48 MMC2_RSP2 MMC2 Command Response Register 2 16 R 0000h 0x00 BE26h FFFB:7C4C MMC2_RSP3 MMC2 Command Response Register 3 16 R 0000h 0x00 BE28h FFFB:7C50 MMC2_RSP4 MMC2 Command Response Register 4 16 R 0000h 0x00 BE2Ah FFFB:7C54 MMC2_RSP5 MMC2 Command Response Register 5 16 R 0000h 0x00 BE2Ch FFFB:7C58 MMC2_RSP6 MMC2 Command Response Register 6 16 R 0000h 0x00 BE2Eh FFFB:7C5C MMC2_RSP7 MMC2 Command Response Register 7 16 R 0000h 0x00 BE30h FFFB:7C60 MMC2_IOSR MMC2 Command Response IOSR Register 16 R/W 0000h 0x00 BE32h FFFB:7C64 MMC2_SYSC MMC2 System Control Register 16 R/W 0000h 0x00 BE34h FFFB:7C68 MMC2_SYSS MMC2 System Status Register 16 R 0000h 140 SPRS231E Reserved December 2003 − Revised December 2005 Functional Overview Table 3−39. UART3 Registers DSP WORD ADDRESS MPU BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE R Undefined 0x00 CC00h FFFB:9800 UART3_RHR UART3 receive holding register 8 0x00 CC00h FFFB:9800 UART3_THR UART3 transmit holding register 8 W 0x00 CC00h FFFB:9800 UART3_DLL UART3 divisor latch low register 8 R/W 00h 0x00 CC01h FFFB:9804 UART3_IER UART3 interrupt enable register 8 R/W 00h 0x00 CC01h FFFB:9804 UART3_DLH UART3 divisor latch high register 8 R/W 00h 0x00 CC02h FFFB:9808 UART3_IIR UART3 interrupt identification register 8 R 01h 0x00 CC02h FFFB:9808 UART3_FCR UART3 FIFO control register 8 W 00h 0x00 CC02h FFFB:9808 UART3_EFR UART3 enhanced feature register 8 R/W 00h 0x00 CC03h FFFB:980C UART3_LCR UART3 line control register 8 R/W 00h 0x00 CC04h FFFB:9810 UART3_MCR UART3 modem control register 8 R/W 00h 0x00 CC04h FFFB:9810 UART1_XON1 UART3 XON1 register 8 R/W 00h 0x00 CC05h FFFB:9814 UART3_LSR UART3 mode register 8 R 60h 0x00 CC05h FFFB:9814 UART3_XON2 UART3 XON2 register 8 R/W 00h 0x00 CC06h FFFB:9818 UART3_MSR UART3 modem status register 8 R 0x00 CC06h FFFB:9818 UART3_TCR UART3 transmission control register 8 R/W 0Fh 0x00 CC06h FFFB:9818 UART3_XOFF1 UART3 XOFF1 register 8 R/W 00h 0x00 CC07h FFFB:981C UART3_SPR UART3 scratchpad register 8 R/W 00h 0x00 CC07h FFFB:981C UART3_TLR UART3 trigger level register 8 R/W 00h 0x00 CC07h FFFB:981C UART3_XOFF2 UART3 XOFF2 register 8 R/W 00h 0x00 CC08h FFFB:9820 UART3_MDR1 UART3 mode definition 1 register 8 R/W 07h 0x00 CC09h FFFB:9824 UART3_MDR2 UART3 mode definition register 2 8 R/W 00h 0x00 CC0Ah FFFB:9828 UART3_SFLSR UART3 status FIFO line status register 8 R 00h 0x00 CC0Ah FFFB:9828 UART3_TXFLL UART3 transmit frame length low 8 W 00h 0x00 CC0Bh FFFB:982C UART3_RESUME UART3 resume register 8 R 00h 0x00 CC0Bh FFFB:982C UART3_TXFLH UART3 transmit frame length high 8 W 00h 0x00 CC0Ch FFFB:9830 UART3_SFREGL UART3 status FIFO low register 8 R Undefined 0x00 CC0Ch FFFB:9830 UART3_RXFLL UART3 receive frame length low 8 W 00h 0x00 CC0Dh FFFB:9834 UART3_SFREGH UART3 status FIFO high register 8 R Undefined 0x00 CC0Dh FFFB:9834 UART3_RXFLH UART3 receive frame length high 8 W 00h 0x00 CC0Eh FFFB:9838 UART3_UASR UART3 autobauding status register 8 R 00h 0x00 CC0Eh FFFB:9838 UART3_BLR UART3 BOF control register 8 R/W 40h 0x00 CC0Fh FFFB:983C UART3_ACREG UART3 auxiliary control register 8 R/W 00h 0x00 CC10h FFFB:9840 UART3_SCR UART3 supplementary control register 8 R/W 00h 0x00 CC11h FFFB:9844 UART3_SSR UART3 supplementary status register 8 R 00h 0x00 CC12h FFFB:9848 UART3_EBLR UART3 BOF length register 8 R/W 00h 0x00 CC13h FFFB:984C 0x00 CC14h FFFB:9850 UART3_MVR UART3 module version register 8 R − 0x00 CC15h FFFB:9854 UART3_SYSC UART3 system configuration register 8 R/W 00h 0x00 CC16h FFFB:9858 UART3_SYSS UART3 system status register 8 R/W 00h 0x00 CC17h FFFB:985C UART3_WER UART3 wake-up enable register 8 R/W 7Fh Undefined Undefined Reserved December 2003 − Revised December 2005 SPRS231E 141 Functional Overview Table 3−40. MPU GPIO3 Registers DSP WORD ADDRESS 0x00 DA00h MPU BYTE ADDRESS FFFB:B400 REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE GPIO3_REVISION GPIO3 Revision Register 16/32 R 0000 00xxh 16/32 R/W 0000 0000h 0x00 DA08h FFFB:B410 GPIO3_SYSCONFIG GPIO3 System Configuration Register 0x00 DA0Ah FFFB:B414 GPIO3_SYSSTATUS GPIO3 System Status Register 16/32 R 0000 0000h 0x00 DA0Ch FFFB:B418 GPIO3_IRQSTATUS1 GPIO3 Interrupt Status1 Register 16/32 R/W 0000 0000h 0x00 DA0Eh FFFB:B41C GPIO3_IRQENABLE1 GPIO3 Interrupt Enable1 Register 16/32 R/W 0000 0000h 0x00 DA10h FFFB:B420 GPIO3_IRQSTATUS2 GPIO3 Interrupt Status2 Register 16/32 R/W 0000 0000h 0x00 DA12h FFFB:B424 GPIO3_IRQENABLE2 GPIO3 Interrupt Enable2 Register 16/32 R/W 0000 0000h 0x00 DA14h FFFB:B428 GPIO3_WAKEUPENABLE GPIO3 Wake-up Enable Register 16/32 R/W 0000 0000h 0x00 DA16h FFFB:B42C GPIO3_DATAIN GPIO3 Data Input Register 16/32 R 0000 0000h 0x00 DA18h FFFB:B430 GPIO3_DATAOUT GPIO3 Data Output Register 16/32 R/W 0000 0000h 16/32 R/W 0000 FFFFh 0x00 DA1Ah FFFB:B434 GPIO3_DIRECTION GPIO3 Direction Control Register 0x00 DA1Ch FFFB:B438 GPIO3_EDGE_CTRL1 GPIO3 Edge Control 1 Register 16/32 R/W 0000 0000h 0x00 DA1Eh FFFB:B43C GPIO3_EDGE_CTRL2 GPIO3 Edge Control 2 Register 16/32 R/W 0000 0000h 16/32 R/W 0000 0000h 0x00 DA4Eh FFFB:B49C GPIO3_CLEAR_IRQENABLE1 GPIO3 Clear Interrupt Enable1 Register 0x00 DA52h FFFB:B4A4 GPIO3_CLEAR_IRQENABLE2 GPIO3 Clear Interrupt Enable2 Register 16/32 R/W 0000 0000h 0x00 DA54h FFFB:B4A8 GPIO3_CLEAR_WAKEUPENA GPIO3 Clear Wake-up Enable Register 16/32 R/W 0000 0000h 0x00 DA58h FFFB:B4B0 GPIO3_CLEAR_DATAOUT GPIO3 Clear Data Output Register 16/32 R/W 0000 0000h 0x00 DA6Eh FFFB:B4DC GPIO3_SET_IRQENABLE1 GPIO3 Set Interrupt Enable1 Register 16/32 R/W 0000 0000h 0x00 DA72h FFFB:B4E4 GPIO3_SET_IRQENABLE2 GPIO3 Set Interrupt Enable2 Register 16/32 R/W 0000 0000h 0x00 DA74h FFFB:B4E8 GPIO3_SET_WAKEUPENA GPIO3 Set Wake-up Enable Register 16/32 R/W 0000 0000h 0x00 DA78h FFFB:B4F0 GPIO3_SET_DATAOUT GPIO3 Set Data Output Register 16/32 R/W 0000 0000h 142 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−41. MPU GPIO4 Registers DSP WORD ADDRESS 0x00 DE00h MPU BYTE ADDRESS FFFB:BC00 REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE GPIO4_REVISION GPIO4 Revision Register 16/32 R 0000 00xxh 16/32 R/W 0000 0000h 0x00 DE08h FFFB:BC10 GPIO4_SYSCONFIG GPIO4 System Configuration Register 0x00 DE0Ah FFFB:BC14 GPIO4_SYSSTATUS GPIO4 System Status Register 16/32 R 0000 0000h 0x00 DE0Ch FFFB:BC18 GPIO4_IRQSTATUS1 GPIO4 Interrupt Status1 Register 16/32 R/W 0000 0000h 0x00 DE0Eh FFFB:BC1C GPIO4_IRQENABLE1 GPIO4 Interrupt Enable1 Register 16/32 R/W 0000 0000h 0x00 DE10h FFFB:BC20 GPIO4_IRQSTATUS2 GPIO4 Interrupt Status2 Register 16/32 R/W 0000 0000h 0x00 DE12h FFFB:BC24 GPIO4_IRQENABLE2 GPIO4 Interrupt Enable2 Register 16/32 R/W 0000 0000h 0x00 DE14h FFFB:BC28 GPIO4_WAKEUPENABLE GPIO4 Wake-up Enable Register 16/32 R/W 0000 0000h 0x00 DE16h FFFB:BC2C GPIO4_DATAIN GPIO4 Data Input Register 16/32 R 0000 0000h 16/32 R/W 0000 0000h 0x00 DE18h FFFB:BC30 GPIO4_DATAOUT GPIO4 Data Output Register 0x00 DE1Ah FFFB:BC34 GPIO4_DIRECTION GPIO4 Direction Control Register 16/32 R/W 0000 FFFFh 0x00 DE1Ch FFFB:BC38 GPIO4_EDGE_CTRL1 GPIO4 Edge Control 1 Register 16/32 R/W 0000 0000h 0x00 DE1Eh FFFB:BC3C GPIO4_EDGE_CTRL2 GPIO4 Edge Control 2 Register 16/32 R/W 0000 0000h 0x00 DE4Eh FFFB:BC9C GPIO4_CLEAR_IRQENABLE1 GPIO4 Clear Interrupt Enable1 Register 16/32 R/W 0000 0000h 0x00 DE52h FFFB:BCA4 GPIO4_CLEAR_IRQENABLE2 GPIO4 Clear Interrupt Enable2 Register 16/32 R/W 0000 0000h 0x00 DE54h FFFB:BCA8 GPIO4_CLEAR_WAKEUPENA GPIO4 Clear Wake-up Enable Register 16/32 R/W 0000 0000h 0x00 DE58h FFFB:BCB0 GPIO4_CLEAR_DATAOUT GPIO4 Clear Data Output Register 16/32 R/W 0000 0000h 0x00 DE6Eh FFFB:BCDC GPIO4_SET_IRQENABLE1 GPIO4 Set Interrupt Enable1 Register 16/32 R/W 0000 0000h 0x00 DE72h FFFB:BCE4 GPIO4_SET_IRQENABLE2 GPIO4 Set Interrupt Enable2 Register 16/32 R/W 0000 0000h 0x00 DE74h FFFB:BCE8 GPIO4_SET_WAKEUPENA GPIO4 Set Wake-up Enable Register 16/32 R/W 0000 0000h 0x00 DE78h FFFB:BCF0 GPIO4_SET_DATAOUT GPIO4 Set Data Output Register 16/32 R/W 0000 0000h ACCESS WIDTH ACCESS TYPE Table 3−42. 32-kHz Synchro Count Registers MPU BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFB:D400 32K_SYNC_CNT_REV 32k Synchro Count CID Revision Register 32 R 0000 0010h FFFB:D410 32K_SYNC_CNT_CR 32k Synchro Count Counter Register 32 R 0000 0003h December 2003 − Revised December 2005 SPRS231E 143 Functional Overview Table 3−43. General-Purpose Timer8 Registers DSP WORD ADDRESS MPU BYTE ADDRESS REGISTER NAME ACCESS TYPE RESET VALUE 16/32 R 0000 0010h FFFB:D400 0x00 C202h FFFB:D404 0x00 C208h FFFB:D410 GPTMR8_TIOCP_CFG GPTimer8 OCP Configuration Register 16/32 R/W 0000 0000h 0x00 C20Ah FFFB:D414 GPTMR8_TISTAT GPTimer8 System Status Register 16/32 R 0000 0000h 0x00 C20Ch FFFB:D418 GPTMR8_TISR GPTimer8 Status Register 16/32 R/W 0000 0000h 0x00 C20Eh FFFB:D41C GPTMR8_TIER GPTimer8 Interrupt Enable Register 16/32 R/W 0000 0000h 0x00 C210h FFFB:D420 GPTMR8_TWER GPTimer8 Wake Up Enable Register 16/32 R/W 0000 0000h 0x00 C212h FFFB:D424 GPTMR8_TCLR GPTimer8 Control Register 16/32 R/W 0000 0000h 0x00 C214h FFFB:D428 GPTMR8_TCRR GPTimer8 Counter Register 16/32 R/W 0000 0000h 0x00 C216h FFFB:D42C GPTMR8_TLDR GPTimer8 Load Register 16/32 R/W 0000 0000h 0x00 C218h FFFB:D430 GPTMR8_TTGR GPTimer8 Trigger Register 16/32 R/W FFFF FFFFh 0x00 C21Ah FFFB:D434 GPTMR8_TWPS GPTimer8 Write Posted Register 16/32 R 0000 0000h 0x00 C21Ch FFFB:D438 GPTMR8_TMAR GPTimer8 Match Register 16/32 R/W 0000 0000h GPTMR8_TSICR GPTimer8 Synchronization Interface Control Register 16/32 R/W 0000 0004h 144 FFFB:D440 SPRS231E GPTimer8 Identification Register ACCESS WIDTH 0x00 C200h 0x00 C220h GPTMR8_TIDR DESCRIPTION Reserved December 2003 − Revised December 2005 Functional Overview Table 3−44. MPU GPIO1 Registers DSP WORD ADDRESS 0x00 F200h MPU BYTE ADDRESS FFFB:E400 REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE GPIO1_REVISION GPIO1 Revision Register 16/32 R 0000 00xxh 16/32 R/W 0000 0000h 0x00 F208h FFFB:E410 GPIO1_SYSCONFIG GPIO1 System Configuration Register 0x00 F20Ah FFFB:E414 GPIO1_SYSSTATUS GPIO1 System Status Register 16/32 R 0000 0000h 0x00 F20Ch FFFB:E418 GPIO1_IRQSTATUS1 GPIO1 Interrupt Status1 Register 16/32 R/W 0000 0000h 0x00 F20Eh FFFB:E41C GPIO1_IRQENABLE1 GPIO1 Interrupt Enable1 Register 16/32 R/W 0000 0000h 0x00 F210h FFFB:E420 GPIO1_IRQSTATUS2 GPIO1 Interrupt Status2 Register 16/32 R/W 0000 0000h 0x00 F212h FFFB:E424 GPIO1_IRQENABLE2 GPIO1 Interrupt Enable2 Register 16/32 R/W 0000 0000h 0x00 F214h FFFB:E428 GPIO1_WAKEUPENABLE GPIO1 Wake-up Enable Register 16/32 R/W 0000 0000h 0x00 F216h FFFB:E42C GPIO1_DATAIN GPIO1 Data Input Register 16/32 R 0000 0000h 16/32 R/W 0000 0000h 0x00 F218h FFFB:E430 GPIO1_DATAOUT GPIO1 Data Output Register 0x00 F21Ah FFFB:E434 GPIO1_DIRECTION GPIO1 Direction Control Register 16/32 R/W 0000 FFFFh 0x00 F21Ch FFFB:E438 GPIO1_EDGE_CTRL1 GPIO1 Edge Control 1 Register 16/32 R/W 0000 0000h 0x00 F21Eh FFFB:E43C GPIO1_EDGE_CTRL2 GPIO1 Edge Control 2 Register 16/32 R/W 0000 0000h 0x00 F24Eh FFFB:E49C GPIO1_CLEAR_IRQENABLE1 GPIO1 Clear Interrupt Enable1 Register 16/32 R/W 0000 0000h 0x00 F252h FFFB:E4A4 GPIO1_CLEAR_IRQENABLE2 GPIO1 Clear Interrupt Enable2 Register 16/32 R/W 0000 0000h 0x00 F254h FFFB:E4A8 GPIO1_CLEAR_WAKEUPENA GPIO1 Clear Wake-up Enable Register 16/32 R/W 0000 0000h 0x00 F258h FFFB:E4B0 GPIO1_CLEAR_DATAOUT GPIO1 Clear Data Output Register 16/32 R/W 0000 0000h 0x00 F26Eh FFFB:E4DC GPIO1_SET_IRQENABLE1 GPIO1 Set Interrupt Enable1 Register 16/32 R/W 0000 0000h 0x00 F272h FFFB:E4E4 GPIO1_SET_IRQENABLE2 GPIO1 Set Interrupt Enable2 Register 16/32 R/W 0000 0000h 0x00 F274h FFFB:E4E8 GPIO1_SET_WAKEUPENA GPIO1 Set Wake-up Enable Register 16/32 R/W 0000 0000h 0x00 F278h FFFB:E4F0 GPIO1_SET_DATAOUT GPIO1 Set Data Output Register 16/32 R/W 0000 0000h December 2003 − Revised December 2005 SPRS231E 145 Functional Overview Table 3−45. MPU GPIO2 Registers DSP WORD ADDRESS 0x00 F600h MPU BYTE ADDRESS FFFB:EC00 REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE GPIO2_REVISION GPIO2 Revision Register 16/32 R 0000 00xxh 16/32 R/W 0000 0000h 0x00 F608h FFFB:EC10 GPIO2_SYSCONFIG GPIO2 System Configuration Register 0x00 F60Ah FFFB:EC14 GPIO2_SYSSTATUS GPIO2 System Status Register 16/32 R 0000 0000h 0x00 F60Ch FFFB:EC18 GPIO2_IRQSTATUS1 GPIO2 Interrupt Status1 Register 16/32 R/W 0000 0000h 0x00 F60Eh FFFB:EC1C GPIO2_IRQENABLE1 GPIO2 Interrupt Enable1 Register 16/32 R/W 0000 0000h 0x00 F610h FFFB:EC20 GPIO2_IRQSTATUS2 GPIO2 Interrupt Status2 Register 16/32 R/W 0000 0000h 0x00 F612h FFFB:EC24 GPIO2_IRQENABLE2 GPIO2 Interrupt Enable2 Register 16/32 R/W 0000 0000h 0x00 F614h FFFB:EC28 GPIO2_WAKEUPENABLE GPIO2 Wake-up Enable Register 16/32 R/W 0000 0000h 0x00 F616h FFFB:EC2C GPIO2_DATAIN GPIO2 Data Input Register 16/32 R 0000 0000h 16/32 R/W 0000 0000h 0x00 F618h FFFB:EC30 GPIO2_DATAOUT GPIO2 Data Output Register 0x00 F61Ah FFFB:EC34 GPIO2_DIRECTION GPIO2 Direction Control Register 16/32 R/W 0000 FFFFh 0x00 F61Ch FFFB:EC38 GPIO2_EDGE_CTRL1 GPIO2 Edge Control 1 Register 16/32 R/W 0000 0000h 0x00 F61Eh FFFB:EC3C GPIO2_EDGE_CTRL2 GPIO2 Edge Control 2 Register 16/32 R/W 0000 0000h 0x00 F64Eh FFFB:EC9C GPIO2_CLEAR_IRQENABLE1 GPIO2 Clear Interrupt Enable1 Register 16/32 R/W 0000 0000h 0x00 F652h FFFB:ECA4 GPIO2_CLEAR_IRQENABLE2 GPIO2 Clear Interrupt Enable2 Register 16/32 R/W 0000 0000h 0x00 F654h FFFB:ECA8 GPIO2_CLEAR_WAKEUPENA GPIO2 Clear Wake-up Enable Register 16/32 R/W 0000 0000h 0x00 F658h FFFB:ECB0 GPIO2_CLEAR_DATAOUT GPIO2 Clear Data Output Register 16/32 R/W 0000 0000h 0x00 F66Eh FFFB:ECDC GPIO2_SET_IRQENABLE1 GPIO2 Set Interrupt Enable1 Register 16/32 R/W 0000 0000h 0x00 F672h FFFB:ECE4 GPIO2_SET_IRQENABLE2 GPIO2 Set Interrupt Enable2 Register 16/32 R/W 0000 0000h 0x00 F674h FFFB:ECE8 GPIO2_SET_WAKEUPENA GPIO2 Set Wake-up Enable Register 16/32 R/W 0000 0000h 0x00 F678h FFFB:ECF0 GPIO2_SET_DATAOUT GPIO2 Set Data Output Register 16/32 R/W 0000 0000h 146 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−46. MPU/DSP Shared Mailbox Registers DSP WORD ADDRESS MPU BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH MPU DSP ACCESS TYPE ACCESS TYPE R 0000h RESET VALUE 0x00 F800h FFFC:F000 ARM2DSP1 MPU to DSP 1 Data Register 16 R/W 0x00 F802h FFFC:F004 ARM2DSP1B MPU to DSP 1 Command Register 16 R/W R 0000h 0x00 F804h FFFC:F008 DSP2ARM1 DSP to MPU 1 Data Register 16 R R/W 0000h 0x00 F806h FFFC:F00C DSP2ARM1B DSP to MPU 1 Command Register 16 R R/W 0000h 0x00 F808h FFFC:F010 DSP2ARM2 DSP to MPU 2 Data Register 16 R R/W 0000h 0x00 F80Ah FFFC:F014 DSP2ARM2B DSP to MPU 2 Command Register 16 R R/W 0000h 0x00 F80Ch FFFC:F018 ARM2DSP1_FLAG MPU to DSP 1 Flag Register 16 R R undef 0x00 F80Eh FFFC:F01C DSP2ARM1_FLAG DSP to MPU 1 Flag Register 16 R R undef 0x00 F810h FFFC:F020 DSP2ARM2_FLAG DSP to MPU 2 Flag Register 16 R R undef 0x00 F812h FFFC:F024 ARM2DSP2 MPU to DSP 2 Data Register 16 R/W R 0000h 0x00 F814h FFFC:F028 ARM2DSP2B MPU to DSP 2 Command Register 16 R/W R 0000h 0x00 F816h FFFC:F02C ARM2DSP2_FLAG MPU to DSP 2 Flag Register 16 R R undef December 2003 − Revised December 2005 SPRS231E 147 Functional Overview 3.2.2.4 DSP Public Peripheral Registers (Accessible Via MPUI Port) The MPU public peripheral registers include the following: • McBSP1 Registers • MCSI1 Registers • MCSI2 Registers • McBSP3 Registers Table 3−47. McBSP1 Registers MPU BYTE ADDRESS (VIA MPUI) DSP WORD ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 8C00h E101:1800 MCBSP1_DRR2 McBSP1 Data receive register 2 16 R/W 0000h 0x00 8C01h E101:1802 MCBSP1_DRR1 McBSP1 Data receive register 1 16 R/W 0000h 0x00 8C02h E101:1804 MCBSP1_DXR2 McBSP1 Data transmit register 2 16 R/W 0000h 0x00 8C03h E101:1806 MCBSP1_DXR1 McBSP1 Data transmit register 1 16 R/W 0000h 0x00 8C04h E101:1808 MCBSP1_SPCR2 McBSP1 Serial port control register 2 16 R/W 0000h 0x00 8C05h E101:180A MCBSP1_SPCR1 McBSP1 Serial port control register 1 16 R/W 0000h 0x00 8C06h E101:180C MCBSP1_RCR2 McBSP1 Receive control register 2 16 R//W 0000h 0x00 8C07h E101:180E MCBSP1_RCR1 McBSP1 Receive control register 1 16 R/W 0000h 0x00 8C08h E101:1810 MCBSP1_XCR2 McBSP1 Transmit control register 2 16 R/W 0000h 0x00 8C09h E101:1812 MCBSP1_XCR1 McBSP1 Transmit control register 1 16 R/W 0000h 0x00 8C0Ah E101:1814 MCBSP1_SRGR2 McBSP1 Sample rate generator register 2 16 R/W 2000h 0x00 8C0Bh E101:1816 MCBSP1_SRGR1 McBSP1 Sample rate generator register 1 16 R/W 0001h 0x00 8C0Ch E101:1818 MCBSP1_MCR2 McBSP1 Multichannel register 2 16 R/W 0000h 0x00 8C0Dh E101:181A MCBSP1_MCR1 McBSP1 Multichannel register 1 16 R/W 0000h 16 R/W 0000h 0x00 8C0Eh E101:181C MCBSP1_RCERA McBSP1 Receive channel enable register partition A 0x00 8C0Fh E101:181E MCBSP1_RCERB McBSP1 Receive channel enable register partition B 16 R/W 0000h 0x00 8C10h E101:1820 MCBSP1_XCERA McBSP1 Transmit channel enable register partition A 16 R/W 0000h 0x00 8C11h E101:1822 MCBSP1_XCERB McBSP1 Transmit channel enable register partition B 16 R/W 0000h 0x00 8C12h E101:1824 MCBSP1_PCR0 McBSP1 Pin control register 0 16 R/W 0000h 0x00 8C13h E101:1826 MCBSP1_RCERC McBSP1 Receive channel enable register partition C 16 R/W 0000h 0x00 8C14h E101:1828 MCBSP1_RCERD McBSP1 Receive channel enable register partition D 16 R/W 0000h 0x00 8C15h E101:182A MCBSP1_XCERC McBSP1 Transmit channel enable register partition C 16 R/W 0000h 0x00 8C16h E101:182C MCBSP1_XCERD McBSP1 Transmit channel enable register partition D 16 R/W 0000h 0x00 8C17h E101:182E MCBSP1_RCERE McBSP1 Receive channel enable register partition E 16 R/W 0000h 0x00 8C18h E101:1830 MCBSP1_RCERF McBSP1 Receive channel enable register partition F 16 R/W 0000h 0x00 8C19h E101:1832 MCBSP1_XCERE McBSP1 Transmit channel enable register partition E 16 R/W 0000h 148 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−47. McBSP1 Registers (Continued) DSP WORD ADDRESS MPU BYTE ADDRESS (VIA MPUI) REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 8C1Ah E101:1834 MCBSP1_XCERF McBSP1 Transmit channel enable register partition F 16 R/W 0000h 0x00 8C1Bh E101:1836 MCBSP1_RCERG McBSP1 Receive channel enable register partition G 16 R/W 0000h 0x00 8C1Ch E101:1838 MCBSP1_RCERH McBSP1 Receive channel enable register partition H 16 R/W 0000h 0x00 8C1Dh E101:183A MCBSP1_XCERG McBSP1 Transmit channel enable register partition G 16 R/W 0000h 0x00 8C1Eh E101:183C MCBSP1_XCERH McBSP1 Transmit channel enable register partition H 16 R/W 0000h 0x00 8C1Fh E101:183E MCBSP1_REV McBSP1 Version register 16 R/W 0011h Table 3−48. MCSI1 Registers DSP WORD ADDRESS MPU BYTE ADDRESS (VIA MPUI) 0x00 9400h E101:2800 MCSI1_CONTROL_REG 0x00 9401h E101:2802 MCSI1_MAIN_PARAMETERS_REG 0x00 9402h E101:2804 0x00 9403h E101:2806 0x00 9404h ACCESS WIDTH ACCESS TYPE MCSI1 control register 16 R/W 0000h MCSI1 main parameters register 16 R/W 0000h MCSI1_INTERRUPTS_REG MCSI1 interrupts register 16 R/W 0000h MCSI1_CHANNEL_USED_REG MCSI1 channel used register 16 R/W 0000h E101:2808 MCSI1_OVER_CLOCK_REG MCSI1 over-clock register 16 R/W 0000h 0x00 9405h E101:280A MCSI1_CLOCK_FREQUENCY_ REG MCSI1 clock frequency register 16 R/W 0000h 0x00 9406h E101:280C MCSI1_STATUS_REG MCSI1 status register 16 R/W 0000h 0x00 9407h− 0x00 941Fh REGISTER NAME DESCRIPTION RESET VALUE Reserved 0x00 9420h E101:2840 MCSI1_TX0 MCSI1 transmit word register 0 16 R/W Undefined 0x00 9421h E101:2842 MCSI1_TX1 MCSI1 transmit word register 1 16 R/W Undefined 0x00 9422h E101:2844 MCSI1_TX2 MCSI1 transmit word register 2 16 R/W Undefined 0x00 9423h E101:2846 MCSI1_TX3 MCSI1 transmit word register 3 16 R/W Undefined 0x00 9424h E101:2848 MCSI1_TX4 MCSI1 transmit word register 4 16 R/W Undefined 0x00 9425h E101:284A MCSI1_TX5 MCSI1 transmit word register 5 16 R/W Undefined 0x00 9426h E101:284C MCSI1_TX6 MCSI1 transmit word register 6 16 R/W Undefined 0x00 9427h E101:284E MCSI1_TX7 MCSI1 transmit word register 7 16 R/W Undefined 0x00 9428h E101:2850 MCSI1_TX8 MCSI1 transmit word register 8 16 R/W Undefined 0x00 9429h E101:2852 MCSI1_TX9 MCSI1 transmit word register 9 16 R/W Undefined 0x00 942Ah E101:2854 MCSI1_TX10 MCSI1 transmit word register 10 16 R/W Undefined 0x00 942Bh E101:2856 MCSI1_TX11 MCSI1 transmit word register 11 16 R/W Undefined 0x00 942Ch E101:2858 MCSI1_TX12 MCSI1 transmit word register 12 16 R/W Undefined 0x00 942Dh E101:285A MCSI1_TX13 MCSI1 transmit word register 13 16 R/W Undefined 0x00 942Eh E101:285C MCSI1_TX14 MCSI1 transmit word register 14 16 R/W Undefined 0x00 942Fh E101:285E MCSI1_TX15 MCSI1 transmit word register 15 16 R/W Undefined 0x00 9430h E101:2860 MCSI1_RX0 MCSI1 receive word register 0 16 R Undefined 0x00 9431h E101:2862 MCSI1_RX1 MCSI1 receive word register 1 16 R Undefined 0x00 9432h E101:2864 MCSI1_RX2 MCSI1 receive word register 2 16 R Undefined December 2003 − Revised December 2005 SPRS231E 149 Functional Overview Table 3−48. MCSI1 Registers (Continued) DSP WORD ADDRESS MPU BYTE ADDRESS (VIA MPUI) 0x00 9433h E101:2866 MCSI1_RX3 0x00 9434h E101:2868 0x00 9435h E101:286A 0x00 9436h 0x00 9437h ACCESS WIDTH ACCESS TYPE RESET VALUE MCSI1 receive word register 3 16 R Undefined MCSI1_RX4 MCSI1 receive word register 4 16 R Undefined MCSI1_RX5 MCSI1 receive word register 5 16 R Undefined E101:286C MCSI1_RX6 MCSI1 receive word register 6 16 R Undefined E101:286E MCSI1_RX7 MCSI1 receive word register 7 16 R Undefined 0x00 9438h E101:2870 MCSI1_RX8 MCSI1 receive word register 8 16 R Undefined 0x00 9439h E101:2872 MCSI1_RX9 MCSI1 receive word register 9 16 R Undefined 0x00 943Ah E101:2874 MCSI1_RX10 MCSI1 receive word register 10 16 R Undefined 0x00 943Bh E101:2876 MCSI1_RX11 MCSI1 receive word register 11 16 R Undefined 0x00 943Ch E101:2878 MCSI1_RX12 MCSI1 receive word register 12 16 R Undefined 0x00 943Dh E101:287A MCSI1_RX13 MCSI1 receive word register 13 16 R Undefined 0x00 943Eh E101:287C MCSI1_RX14 MCSI1 receive word register 14 16 R Undefined 0x00 943Fh E101:287E MCSI1_RX15 MCSI1 receive word register 15 16 R Undefined ACCESS WIDTH ACCESS TYPE RESET VALUE REGISTER NAME DESCRIPTION Table 3−49. MCSI2 Registers DSP WORD ADDRESS MPU BYTE ADDRESS (VIA MPUI) REGISTER NAME DESCRIPTION 0x00 9000h E101:2000 MCSI2_CONTROL_REG MCSI2 control register 16 R/W 0000h 0x00 9001h E101:2002 MCSI2_MAIN_PARAMETERS_REG MCSI2 main parameters register 16 R/W 0000h 0x00 9002h E101:2004 MCSI2_INTERRUPTS_REG MCSI2 interrupts register 16 R/W 0000h 0x00 9003h E101:2006 MCSI2_CHANNEL_USED_REG MCSI2 channel used register 16 R/W 0000h 0x00 9004h E101:2008 MCSI2_OVER_CLOCK_REG MCSI2 over-clock register 16 R/W 0000h 0x00 9005h E101:200A MCSI2_CLOCK_FREQUENCY_ REG MCSI2 clock frequency register 16 R/W 0000h 0x00 9006h E101:200C MCSI2_STATUS_REG MCSI2 status register 16 R/W 0000h 0x00 9007h − 0x00 901Fh Reserved 0x00 9020h E101:2040 MCSI2_TX0 MCSI2 transmit word register 0 16 R/W Undefined 0x00 9021h E101:2042 MCSI2_TX1 MCSI2 transmit word register 1 16 R/W Undefined 0x00 9022h E101:2044 MCSI2_TX2 MCSI2 transmit word register 2 16 R/W Undefined 0x00 9023h E101:2046 MCSI2_TX3 MCSI2 transmit word register 3 16 R/W Undefined 0x00 9024h E101:2048 MCSI2_TX4 MCSI2 transmit word register 4 16 R/W Undefined 0x00 9025h E101:204A MCSI2_TX5 MCSI2 transmit word register 5 16 R/W Undefined 0x00 9026h E101:204C MCSI2_TX6 MCSI2 transmit word register 6 16 R/W Undefined 0x00 9027h E101:204E MCSI2_TX7 MCSI2 transmit word register 7 16 R/W Undefined 0x00 9028h E101:2050 MCSI2_TX8 MCSI2 transmit word register 8 16 R/W Undefined 0x00 9029h E101:2052 MCSI2_TX9 MCSI2 transmit word register 9 16 R/W Undefined 0x00 902Ah E101:2054 MCSI2_TX10 MCSI2 transmit word register 10 16 R/W Undefined 0x00 902Bh E101:2056 MCSI2_TX11 MCSI2 transmit word register 11 16 R/W Undefined 0x00 902Ch E101:2058 MCSI2_TX12 MCSI2 transmit word register 12 16 R/W Undefined 0x00 902Dh E101:205A MCSI2_TX13 MCSI2 transmit word register 13 16 R/W Undefined 0x00 902Eh E101:205C MCSI2_TX14 MCSI2 transmit word register 14 16 R/W Undefined 0x00 902Fh E101:205E MCSI2_TX15 MCSI2 transmit word register 15 16 R/W Undefined 150 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−49. MCSI2 Registers (Continued) DSP WORD ADDRESS MPU BYTE ADDRESS (VIA MPUI) REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 9030h E101:2060 MCSI2_RX0 MCSI2 receive word register 0 16 R Undefined 0x00 9031h E101:2062 MCSI2_RX1 MCSI2 receive word register 1 16 R Undefined 0x00 9032h E101:2064 MCSI2_RX2 MCSI2 receive word register 2 16 R Undefined 0x00 9033h E101:2066 MCSI2_RX3 MCSI2 receive word register 3 16 R Undefined 0x00 9034h E101:2068 MCSI2_RX4 MCSI2 receive word register 4 16 R Undefined 0x00 9035h E101:206A MCSI2_RX5 MCSI2 receive word register 5 16 R Undefined 0x00 9036h E101:206C MCSI2_RX6 MCSI2 receive word register 6 16 R Undefined 0x00 9037h E101:206E MCSI2_RX7 MCSI2 receive word register 7 16 R Undefined 0x00 9038h E101:2070 MCSI2_RX8 MCSI2 receive word register 8 16 R Undefined 0x00 9039h E101:2072 MCSI2_RX9 MCSI2 receive word register 9 16 R Undefined 0x00 903Ah E101:2074 MCSI2_RX10 MCSI2 receive word register 10 16 R Undefined 0x00 903Bh E101:2076 MCSI2_RX11 MCSI2 receive word register 11 16 R Undefined 0x00 903Ch E101:2078 MCSI2_RX12 MCSI2 receive word register 12 16 R Undefined 0x00 903Dh E101:207A MCSI2_RX13 MCSI2 receive word register 13 16 R Undefined 0x00 903Eh E101:207C MCSI2_RX14 MCSI2 receive word register 14 16 R Undefined 0x00 903Fh E101:207E MCSI2_RX15 MCSI2 receive word register 15 16 R Undefined Table 3−50. McBSP3 Registers DSP WORD ADDRESS MPU BYTE ADDRESS (VIA MPUI) REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 B800h E101:7000 MCBSP3_DRR2 McBSP3 Data receive register 2 16 R/W 0000h 0x00 B801h E101:7002 MCBSP3_DRR1 McBSP3 Data receive register 1 16 R/W 0000h 0x00 B802h E101:7004 MCBSP3_DXR2 McBSP3 Data transmit register 2 16 R/W 0000h 0x00 B803h E101:7006 MCBSP3_DXR1 McBSP3 Data transmit register 1 16 R/W 0000h 0x00 B804h E101:7008 MCBSP3_SPCR2 McBSP3 Serial port control register 2 16 R/W 0000h 0x00 B805h E101:700A MCBSP3_SPCR1 McBSP3 Serial port control register 1 16 R/W 0000h 0x00 B806h E101:700C MCBSP3_RCR2 McBSP3 Receive control register 2 16 R//W 0000h 0x00 B807h E101:700E MCBSP3_RCR1 McBSP3 Receive control register 1 16 R/W 0000h 0x00 B808h E101:7010 MCBSP3_XCR2 McBSP3 Transmit control register 2 16 R/W 0000h 0x00 B809h E101:7012 MCBSP3_XCR1 McBSP3 Transmit control register 1 16 R/W 0000h 0x00 B80Ah E101:7014 MCBSP3_SRGR2 McBSP3 Sample rate generator register 2 16 R/W 2000h 0x00 B80Bh E101:7016 MCBSP3_SRGR1 McBSP3 Sample rate generator register 1 16 R/W 0001h 0x00 B80Ch E101:7018 MCBSP3_MCR2 McBSP3 Multichannel register 2 16 R/W 0000h 0x00 B80Dh E101:701A MCBSP3_MCR1 McBSP3 Multichannel register 1 16 R/W 0000h 0x00 B80Eh E101:701C MCBSP3_RCERA McBSP3 Receive channel enable register partition A 16 R/W 0000h 0x00 B80Fh E101:701E MCBSP3_RCERB McBSP3 Receive channel enable register partition B 16 R/W 0000h 0x00 B810h E101:7020 MCBSP3_XCERA McBSP3 Transmit channel enable register partition A 16 R/W 0000h 0x00 B811h E101:7022 MCBSP3_XCERB McBSP3 Transmit channel enable register partition B 16 R/W 0000h 0x00 B812h E101:7024 MCBSP3_PCR0 McBSP3 Pin control register 0 16 R/W 0000h December 2003 − Revised December 2005 SPRS231E 151 Functional Overview Table 3−50. McBSP3 Registers (Continued) MPU BYTE ADDRESS (VIA MPUI) DSP WORD ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 B813h E101:7026 MCBSP3_RCERC McBSP3 Receive channel enable register partition C 16 R/W 0000h 0x00 B814h E101:7028 MCBSP3_RCERD McBSP3 Receive channel enable register partition D 16 R/W 0000h 0x00 B815h E101:702A MCBSP3_XCERC McBSP3 Transmit channel enable register partition C 16 R/W 0000h 0x00 B816h E101:702C MCBSP3_XCERD McBSP3 Transmit channel enable register partition D 16 R/W 0000h 0x00 B817h E101:702E MCBSP3_RCERE McBSP3 Receive channel enable register partition E 16 R/W 0000h 0x00 B818h E101:7030 MCBSP3_RCERF McBSP3 Receive channel enable register partition F 16 R/W 0000h 0x00 B819h E101:7032 MCBSP3_XCERE McBSP3 Transmit channel enable register partition E 16 R/W 0000h 0x00 B81Ah E101:7034 MCBSP3_XCERF McBSP3 Transmit channel enable register partition F 16 R/W 0000h 0x00 B81Bh E101:7036 MCBSP3_RCERG McBSP3 Receive channel enable register partition G 16 R/W 0000h 0x00 B81Ch E101:7038 MCBSP3_RCERH McBSP3 Receive channel enable register partition H 16 R/W 0000h 0x00 B81Dh E101:703A MCBSP3_XCERG McBSP3 Transmit channel enable register partition G 16 R/W 0000h 0x00 B81Eh E101:703C MCBSP3_XCERH McBSP3 Transmit channel enable register partition H 16 R/W 0000h 0x00 B81Fh E101:703E MCBSP3_REV McBSP3 Version register 16 R/W 0011h 152 SPRS231E December 2003 − Revised December 2005 Functional Overview 3.2.2.5 MPU Configuration Registers The MPU public peripheral registers include the following: • MPU TIPB Bus Switch Registers • Ultra Low-Power Device Peripheral Registers • OMAP5912 Configuration Registers • Device Die Identification Registers • Production Identification Registers • L3 OCP Initiator Registers • MPU Interface (MPUI) Registers • TIPB (Private) Bridge 1 Configuration Registers • Traffic Controller Registers • MPU Clock/Reset/Power Mode Control Registers • DPLL1 Configuration Register • DSP MMU Registers • TIPB (Public) Bridge2 Configuration Registers Table 3−51. MPU TIPB Bus Switch Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFB:C800 UART1_SSW_CONF UART1 Peripheral Ownership Register 32 R/W 0000 0001h FFFB:C820 UART2_SSW_CONF UART2 Peripheral Ownership Register 32 R/W 0000 0001h FFFB:C840 UART3_SSW_CONF UART3 Peripheral Ownership Register 32 R/W 0000 0001h FFFB:C890 MCBSP2_SSW_CONF McBSP2 Peirpheral Ownership Register 32 R/W 0000 0001h FFFB:C8A0 I2C_SSW_CONF I2C Peripheral Ownership Register 32 R/W 0000 0001h FFFB:C8B0 SPI_SSW_CONF SPI Peripheral Ownership Register 32 R/W 0000 0001h FFFB:C8C0 DUALMODETIMER1_SSW_CONF Dual Mode Timer1 Ownership Register 32 R/W 0000 0001h FFFB:C8D0 DUALMODETIMER2_SSW_CONF Dual Mode Timer2 Ownership Register 32 R/W 0000 0001h FFFB:C8E0 DUALMODETIMER3_SSW_CONF Dual Mode Timer3 Ownership Register 32 R/W 0000 0001h FFFB:C8F0 DUALMODETIMER4_SSW_CONF Dual Mode Timer4 Ownership Register 32 R/W 0000 0001h FFFB:C900 DUALMODETIMER5_SSW_CONF Dual Mode Timer5 Ownership Register 32 R/W 0000 0001h FFFB:C910 DUALMODETIMER6_SSW_CONF Dual Mode Timer6 Ownership Register 32 R/W 0000 0001h FFFB:C930 DUALMODETIMER7_SSW_CONF Dual Mode Timer7 Ownership Register 32 R/W 0000 0001h FFFB:C940 DUALMODETIMER8_SSW_CONF Dual Mode Timer8 Ownership Register 32 R/W 0000 0001h FFFB:C960 MMCSD2_SSW_CONF MMCSD2 Ownership Register 32 R/W 0000 0001h December 2003 − Revised December 2005 SPRS231E 153 Functional Overview Table 3−52. Ultra Low-Power Device Peripheral Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:0800 COUNTER_32_LSB ULPD 32-kHz Counter Register LSB 16 R 0001h FFFE:0804 COUNTER_32_MSB ULPD 32-kHz Counter Register MSB 16 R 0001h FFFE:0808 COUNTER_HIGH_FREQ_LSB ULPD High-Frequency Counter LSB Register 16 R 0001h FFFE:080C COUNTER_HIGH_FREQ_MSB ULPD High-Frequency Counter MSB Register 16 R 0000h FFFE:0810 GAUGING_CTRL_REG ULPD Gauging Control Register 16 R/W 0000h FFFE:0814 IT_STATUS_REG ULPD Interrupt Status Register 16 R 0000h 16 R/W 03FFh FFFE:0818 − FFFE:0820 FFFE:0824 Reserved SETUP_ULPD1_REG FFFE:0828 − FFFE:082C ULPD Wakeup Time Setup Register Reserved FFFE:0830 CLOCK_CTRL_REG ULPD Clock Control Register 16 R/W 0000h FFFE:0834 SOFT_REQ_REG ULPD Soft Clock Request Register 16 R/W 0000h FFFE:0838 COUNTER_32_FIQ_REG ULPD Modem Shutdown Delay Register 16 R/W 0001h FFFE:083C DPLL_CTRL_REG ULPD USB DPLL Control Register 16 R/W 2211h FFFE:0840 STATUS_REQ_REG ULPD Hardware Request Status Register 16 R/W undef 0960h FFFE:0844 Reserved FFFE:0848 LOCK_TIME_REG ULPD APLL Lock Time Register 16 R/W FFFE:084C APLL_CTRL_REG ULPD APLL Control Register 16 R/W undef FFFE:0850 POWER_CTRL_REG ULPD Power Control Register 16 R/W 0008h ACCESS WIDTH ACCESS TYPE Table 3−53. OMAP5912 Configuration Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFE:1000 FUNC_MUX_CTRL_0 Functional Mux Control Register 0 32 R/W 0000 0000h FFFE:1004 FUNC_MUX_CTRL_1 Functional Mux Control Register 1 32 R/W 0000 0000h FFFE:1008 FUNC_MUX_CTRL_2 Functional Mux Control Register 2 32 R/W 0000 0000h FFFE:100C COMP_MODE_CTRL_0 I/O Multiplex Enable Register 0 32 R/W 0000 0000h FFFE:1010 FUNC_MUX_CTRL_3 Functional Mux Control Register 3 32 R/W 0000 0000h FFFE:1014 FUNC_MUX_CTRL_4 Functional Mux Control Register 4 32 R/W 0000 0000h FFFE:1018 FUNC_MUX_CTRL_5 Functional Mux Control Register 5 32 R/W 0000 0000h FFFE:101C FUNC_MUX_CTRL_6 Functional Mux Control Register 6 32 R/W 0000 0000h FFFE:1020 FUNC_MUX_CTRL_7 Functional Mux Control Register 7 32 R/W 0000 0000h FFFE:1024 FUNC_MUX_CTRL_8 Functional Mux Control Register 8 32 R/W 0000 0000h FFFE:1028 FUNC_MUX_CTRL_9 Functional Mux Control Register 9 32 R/W 0000 0000h FFFE:102C FUNC_MUX_CTRL_A Functional Mux Control Register A 32 R/W 0000 0000h FFFE:1030 FUNC_MUX_CTRL_B Functional Mux Control Register B 32 R/W 0000 0000h FFFE:1034 FUNC_MUX_CTRL_C Functional Mux Control Register C 32 R/W 0000 0000h FFFE:1038 FUNC_MUX_CTRL_D Functional Mux Control Register D 32 R/W 0000 0000h FFFE:1040 PULL_DWN_CTRL_0 Pull Down Control Register 0 32 R/W 0000 0000h FFFE:1044 PULL_DWN_CTRL_1 Pull Down Control Register 1 32 R/W 0000 0000h FFFE:1048 PULL_DWN_CTRL_2 Pull Down Control Register 2 32 R/W 0000 0000h 154 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−53. OMAP5912 Configuration Registers (Continued) BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:104C PULL_DWN_CTRL_3 Pull Down Control Register 3 32 R/W 0000 0000h FFFE:1050 GATE_INH_CTRL_0 Gate Inhibit Control Register 0 32 R/W 0000 0000h FFFE:1058 CONF_REV Configuration Revision 32 R 0000 0002h FFFE:1060 VOLTAGE_CTRL_0 Voltage Control Register 0 32 R/W 0000 0000h FFFE:1064 USB_TRANSCEIVER_CTRL USB Transceiver Control Register 32 R/W 0000 0006h FFFE:1068 LDO_PWRDN_CTRL LDO Power Down Control Register 32 R/W 0000 0000h FFFE:1080 MOD_CONF_CTRL_0 Module Configuration Register 0 32 R/W 0000 0000h FFFE:1090 FUNC_MUX_CTRL_E Function Mux Control Register E 32 R/W 0000 0000h FFFE:1094 FUNC_MUX_CTRL_F Function Mux Control Register F 32 R/W 0000 0000h FFFE:1098 FUNC_MUX_CTRL_10 Function Mux Control Register 10 32 R/W 0000 0000h FFFE:109C FUNC_MUX_CTRL_11 Function Mux Control Register 11 32 R/W 0000 0000h FFFE:10A0 FUNC_MUX_CTRL_12 Function Mux Control Register 12 32 R/W 0000 0000h FFFE:10AC PULL_DWN_CTRL_4 Pull Down Control Register 4 32 R/W 0000 0000h FFFE:10B4 PU_PD_SEL_0 Pull Up Pull Down Slection Register 0 32 R/W 0000 0000h FFFE:10B8 PU_PD_SEL_1 Pull Up Pull Down Slection Register 1 32 R/W 0000 0000h FFFE:10B8 PU_PD_SEL_2 Pull Up Pull Down Slection Register 2 32 R/W 0000 0000h FFFE:10C0 PU_PD_SEL_3 Pull Up Pull Down Slection Register 3 32 R/W 0000 0000h FFFE:10C4 PU_PD_SEL_4 Pull Up Pull Down Slection Register 4 32 R/W 0000 0000h FFFE:10D0 FUNC_MUX_DSP_DMA_A DSP DMA Functional Mux Register A 32 R/W undef FFFE:10D4 FUNC_MUX_DSP_DMA_B DSP DMA Functional Mux Register B 32 R/W undef FFFE:10D8 FUNC_MUX_DSP_DMA_C DSP DMA Functional Mux Register C 32 R/W undef FFFE:10DC FUNC_MUX_DSP_DMA_D DSP DMA Functional Mux Register D 32 R/W undef FFFE:10EC FUNC_MUX_ARM_DMA_A ARM DMA Functional Mux Register A 32 R/W undef FFFE:10F0 FUNC_MUX_ARM_DMA_B ARM DMA Functional Mux Register B 32 R/W undef FFFE:10F4 FUNC_MUX_ARM_DMA_C ARM DMA Functional Mux Register C 32 R/W undef FFFE:10F8 FUNC_MUX_ARM_DMA_D ARM DMA Functional Mux Register D 32 R/W undef FFFE:10FC FUNC_MUX_ARM_DMA_E ARM DMA Functional Mux Register E 32 R/W undef FFFE:1100 FUNC_MUX_ARM_DMA_F ARM DMA Functional Mux Register F 32 R/W undef FFFE:1104 FUNC_MUX_ARM_DMA_G ARM DMA Functional Mux Register G 32 R/W undef FFFE:1110 MOD_CONF_CTRL_1 Module Confguration Control Register 1 32 R/W undef FFFE:1120 SECCTRL Secure Mode Control Register 32 R/W 0000 0D1Ah FFFE:1130 CONF_STATUS Confguration Status Register 32 R 0000 0000h FFFE:1140 RESET_CTRL Reset Control Register 32 R/W 0000 007Fh FFFE:1150 MOD_CONF_CTRL_2 Configuration Control Register 2 32 R/W 0000 0002h December 2003 − Revised December 2005 SPRS231E 155 Functional Overview Table 3−54. Device Die Identification Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:1800 DIE_ID_LSB Device Die Identification Register (LSB) 32 R undef FFFE:1804 DIE_ID_MSB Device Die Identification Register (MSB) 32 R undef ACCESS WIDTH ACCESS TYPE Table 3−55. Production Identification Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFE:2000 PROD_ID_REG0 Production Identification Register0 32 R undef FFFE:2004 PROD_ID_REG1 Production Identification Register1 32 R undef ACCESS WIDTH ACCESS TYPE Table 3−56. L3 OCP Initiator Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFE:C320 ADDR_FAULT Address Fault Register 32 R 0000 0000h FFFE:C324 MCMD_FAULT Master Command Fault Register 32 R 0000 0000h FFFE:C328 S_INTERRUPT0 Interrupt Sensitvity Register0 32 R/W 0000 0003h FFFE:C330 S_INTERRUPT1 Interrupt Sensitvity Register1 32 R/W 0000 0003h FFFE:C334 PROTECT Memory Protect Register 32 R/W 0000 0000h FFFE:C338 SECURE_MODE Secure Mode Register 32 R/W 0000 007Fh FFFE:C32C ABORT_TYPE Abort Type Register 32 R 0000 0000h ACCESS WIDTH ACCESS TYPE Table 3−57. MPU Interface (MPUI) Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFE:C900 CTRL_REG MPUI Control Register 32 R/W 0003 FFFFh FFFE:C904 DEBUG_ADDR MPUI Debug Address Register 32 R 00FF FFFFh FFFE:C908 DEBUG_DATA MPUI Debug Data Register 32 R FFFF FFFFh FFFE:C90C DEBUG_FLAG MPUI Debug Flag Register 32 R 0000 1800h FFFE:C910 STATUS_REG MPUI Status Register 32 R 0000 1FFFh FFFE:C914 DSP_STATUS_REG MPUI DSP Status Register 32 R 0000 0000h FFFE:C918 DSP_BOOT_CONFIG MPUI Boot Configuration Register 32 R/W 0000 0000h FFFE:C91C DSP_API_CONFIG MPUI DSP AP Configuration Register 32 R/W 0000 FFFFh FFFE:C920 DSP_MISC_CONFIG MPUI Miscellaneous Configuration Register 32 R/W 0000 0000h FFFE:C924 ENHANCED_CTL Enhanced Control Register 32 R/W 0000 0000h 156 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−58. TIPB (Private) Bridge 1 Configuration Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:CA00 TIPB_CNTL Private TIPB Control Register 16 or 32 R/W FF11h FFFE:CA04 TIPB_BUS_ALLOC Private TIPB Bus Allocation Register 16 or 32 R/W 0009h FFFE:CA08 MPU_TIPB_CNTL Private MPU TIPB Control Register 16 or 32 R/W 0000h FFFE:CA0C ENHANCED_TIPB_CNTL Private Enhanced TIPB Control Register 16 or 32 R/W 000Fh FFFE:CA10 ADDRESS_DBG Private Debug Address Register 16 or 32 R FFFFh FFFE:CA14 DATA_DEBUG_LOW Private Debug Data LSB Register 16 or 32 R FFFFh FFFE:CA18 DATA_DEBUG_HIGH Private Debug Data MSB Register 16 or 32 R FFFFh FFFE:CA1C DEBUG_CNTR_SIG Private Debug Control Signals Register 16 or 32 R 00FCh FFFE:CA20 ACCESS_CNTL Private Access Control Register 16 or 32 R/W 0001h ACCESS WIDTH ACCESS TYPE Table 3−59. Traffic Controller EMIFS Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFE:CC0C EMIFS_CONFIG_REG EMIFS Configuration Register 32 R/W undef FFFE:CC10 EMIFS_CS0_CONFIG EMIFS nCS0 Configuration Register 32 R/W undef FFFE:CC14 EMIFS_CS1_CONFIG EMIFS nCS1 Configuration Register 32 R/W undef FFFE:CC18 EMIFS_CS2_CONFIG EMIFS nCS2 Configuration Register 32 R/W undef FFFE:CC1C EMIFS_CS3_CONFIG EMIFS nCS3 Configuration Register 32 R/W undef FFFE:CC28 EMIFS_TIMEOUT1 EMIFS Dynamic Priority Timeout 1 Register 32 R/W 0000 0000h FFFE:CC2C EMIFS_TIMEOUT2 EMIFS Dynamic Priority Timeout 2 Register 32 R/W 0000 0000h FFFE:CC30 EMIFS_TIMEOUT3 EMIFS Dynamic Priority Timeout 3 Register 32 R/W 0000 0000h FFFE:CC34 ENDIANISM Endianism Register 32 R/W 0000 0000h FFFE:CC38 Reserved FFFE:CC40 EMIFS_CFG_DYN_WAIT EMIFS Dynamic Wait-States Register 32 R/W 0000 0000h FFFE:CC44 EMIFS_ABORT_ADDR EMIFS Abort Address Register 32 R 0000 0000h FFFE:CC48 EMIFS_ABORT_TYPE EMIFS Abort Type Register 32 R 0000 0000h FFFE:CC4C EMIFS_ABORT_TIMEOUT EMIFS Abort Timeout Register 32 R/W 0000 01FFh FFFE:CC50 EMIFS_ADV_CS0_CONFIG Advanced EMIFS Chip Select Configuration Register nCS0 32 R/W 0000 0000h FFFE:CC54 EMIFS_ADV_CS1_CONFIG Advanced EMIFS Chip Select Configuration Register nCS1 32 R/W 0000 0000h FFFE:CC58 EMIFS_ADV_CS2_CONFIG Advanced EMIFS Chip Select Configuration Register nCS2 32 R/W 0000 0000h FFFE:CC5C EMIFS_ADV_CS3_CONFIG Advanced EMIFS Chip Select Configuration Register nCS3 32 R/W 0000 0000h December 2003 − Revised December 2005 SPRS231E 157 Functional Overview Table 3−60. Traffic Controller OCP−T1/OCP−T2 Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:CC00 OCP_T1_PRIO OCP−T1 LRU Priority Register 32 R/W 0000 0000h FFFE:CCA0 OCP_T1_TIMEOUT1 OCP−T1 Dynamic Priority Time-out Register 1 32 R/W 0000 0000h FFFE:CCA4 OCP_T1_TIMEOUT2 OCP−T1 Dynamic Priority Time-out Register 2 32 R/W 0000 0000h FFFE:CCA8 OCP_T1_TIMEOUT3 OCP−T1 Dynamic Priority Time-out Register 3 32 R/W 0000 0000h FFFE:CCAC OCP_T1_ABORT_TIMEOUT OCP−T1 Abort Time-out Register 32 R/W 0000 01FFh FFFE:CCB0 OCP_T1_ABORT_ADDR OCP−T1 Abort Address Register 32 R 0000 0000h FFFE:CCB4 OCP_T1_ABORT_TYPE OCP−T1 Abort Type Register 32 R 0000 0000h FFFE:CCB8 CONFIG_REG OCP Target Configuration Register 32 R/W 0000 0000h FFFE:CCD0 OCP_T2_PRIO OCP−T2 LRU Priority Register 32 R/W 0000 0000h FFFE:CCD4 OCP_T2_TIMEOUT1 OCP−T2 Dynamic Priority Time-out Register 1 32 R/W 0000 0000h FFFE:CCD8 OCP_T2_TIMEOUT2 OCP−T2 Dynamic Priority Time-out Register 2 32 R/W 0000 0000h FFFE:CCDC OCP_T2_TIMEOUT3 OCP−T2 Dynamic Priority Time-out Register 3 32 R/W 0000 0000h FFFE:CCE0 OCP_T2_ABORT_TIMEOUT OCP−T2 Abort Time-out Register 32 R/W 0000 01FFh FFFE:CCE4 OCP_T2_ABORT_ADDR OCP−T2 Abort Address Register 32 R 0000 0000h FFFE:CCE8 OCP_T2_ABORT_TYPE OCP−T2 Abort Type Register 32 R 0000 0000h ACCESS WIDTH ACCESS TYPE Table 3−61. Traffic Controller OCPI Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFE:C320 OCP_ADDR_FAULT OCPI Address Fault Register 32 R 0000 0000h FFFE:C324 OCP_MCMD_FAULT OCP Master Command Fault Register 32 R 0000 0000h FFFE:C328 OCP_SINT0 OCP Sinterrupt 0 Register 32 R/W 0000 0003h FFFE:C32C OCP_ABORT_TYPE OCP Abort Type Register 32 R/W 0000 0000h FFFE:C330 OCP_SINT1 OCP Sinterrupt 1 Register 32 R/W 0000 0003h FFFE:C334 OCP_PROT OCP Protection Register 32 R/W 0000 0000h FFFE:C338 OCP_SMOD OCPI Secure Mode Register 32 R/W 0000 003Fh 158 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−62. Traffic Controller EMIFF Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:CC08 EMIFF_PRIO_REG EMIFF Priority Register 32 R/W 0000 0000h FFFE:CC20 EMIFF_SDRAM_CONFIG EMIFF SDRAM Configuration Register 32 R/W 0061 8800h FFFE:CC24 EMIFF_MRS EMIFF SDRAM MRS Register 32 R/W 0000 0037h FFFE:CC3C EMIFF_SDRAM_CONFIG_2 EMIFF SDRAM Configuration Register 2 32 R/W 0000 0003h FFFE:CC64 DLL_WRT_CTL DLL WRT Control Register (write byte) 32 R/W 0000 0000h FFFE:CC68 DLL_WRT_STAT DLL WRT Status Register (read lower byte) 32 R 0000 0000h FFFE:CC70 EMIFF_MRS_NEW EMIFF SDRAM MRS Register (duplicate) 32 R/W 0000 0037h FFFE:CC74 EMIFF_EMRS0 EMIFF SDRAM EMRS 0 Register 32 R/W 0000 0000h FFFE:CC78 EMIFF_EMRS1 EMIFF SDRAM EMRS 1 Register 32 R/W 0000 0000h FFFE:CC80 EMIFF_OP EMIFF SDRAM Operation Register 32 R/W 0000 0004h FFFE:CC84 EMIFF_MCMD EMIFF SDRAM Manual Command Register 32 R/W 0000 0000h FFFE:CC8C EMIFF_TIMEOUT1 EMIFF Dynamic Arb. Priority Timeout 1 Register 32 R/W 0000 0000h FFFE:CC90 EMIFF_TIMEOUT2 EMIFF Dynamic Arb. Priority Timeout 2 Register 32 R/W 0000 0000h FFFE:CC94 EMIFF_TIMEOUT3 EMIFF Dynamic Arb. Priority Timeout 3 Register 32 R/W 0000 0000h FFFE:CC98 EMIFF_ABORT_ADDR EMIFF Abort Address Register 32 R 0000 0000h FFFE:CC9C EMIFF_ABORT_TYPE EMIFF Abort Type Register 32 R 0000 0000h FFFE:CCC0 DLL_URD_CTL DLL URD Control Register (read upper byte) 32 R/W 0000 0000h FFFE:CCC4 DLL_URD_STAT DLL URD Status Register (read upper byte) 32 R 0000 0000h FFFE:CCC8 EMIFF_EMRS2 EMIFF SDRAM EMRS 2 Register 32 R/W 0000 0000h FFFE:CCCC DLL_LRD_CTL DLL LRD Control Register (read lower byte) 32 R/W 0000 0000h FFFE:CCBC DLL_LRD_STAT DLL LRD Status Register (read lower byte) 32 R 0000 0000h Table 3−63. MPU Clock/Reset/Power Mode Control Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:CE00 ARM_CKCTL MPU Clock Control Register 32 R/W 3000h FFFE:CE04 ARM_IDLECT1 MPU Idle Control 1 Register 32 R/W 0400h FFFE:CE08 ARM_IDLECT2 MPU Idle Control 2 Register 32 R/W 0100h FFFE:CE0C ARM_EWUPCT MPU External Wakeup Control Register 32 R/W 003Fh FFFE:CE10 ARM_RSTCT1 MPU Reset Control 1 Register 32 R/W 0000h FFFE:CE14 ARM_RSTCT2 MPU Reset Control 2 Register 32 R/W 0000h FFFE:CE18 ARM_SYSST MPU System Status Register 32 R/W 0038h FFFE:CE1C ARM_CKOUT1 MPU Clock Out Definition Register 1 32 R/W 0015h FFFE:CE20 ARM_CKOUT2 MPU Clock Out Definition Register 2 32 R/W 0000h FFFE:CE24 ARM_IDLECT3 MPU Idle Enable Control Register 3 32 R/W 0015h December 2003 − Revised December 2005 SPRS231E 159 Functional Overview Table 3−64. DPLL1 Configuration Register BYTE ADDRESS FFFE:CF00 REGISTER NAME DESCRIPTION DPLL1_CTL_REG DPLL1 Control Register ACCESS WIDTH ACCESS TYPE 32 R/W ACCESS WIDTH ACCESS TYPE RESET VALUE 0000 2002h Table 3−65. DSP MMU Registers BYTE ADDRESS REGISTER NAME DESCRIPTION RESET VALUE FFFE:D200 DSP_MMU_PREFETCH_REG DSP MMU Prefetch Register 16 R/W 0000h FFFE:D204 DSP_MMU_WALKING_ST_REG DSP MMU Prefetch Status Register 16 R 0000h FFFE:D208 DSP_MMU_CNTL_REG DSP MMU Control Register 16 R/W 0000h FFFE:D20C DSP_MMU_FAULT_AD_H_REG DSP MMU Fault Address Register MSB 16 R 0000h FFFE:D210 DSP_MMU_FAULT_AD_L_REG DSP MMU Fault Address Register LSB 16 R 0000h FFFE:D214 DSP_MMU_F_ST_REG DSP MMU Fault Status Register 16 R 0000h FFFE:D218 DSP_MMU_IT_ACK_REG DSP MMU IT Acknowledge Register 16 W 0000h FFFE:D21C DSP_MMU_TTB_H_REG DSP MMU TTB Register MSB 16 R/W 0000h FFFE:D220 DSP_MMU_TTB_L_REG DSP MMU TTB Register LSB 16 R/W 0000h FFFE:D224 DSP_MMU_LOCK_REG DSP MMU Lock Counter Register 16 R/W 0000h FFFE:D228 DSP_MMU_LD_TLB_REG DSP MMU Load Entry TLB Register 16 R/W 0000h FFFE:D22C DSP_MMU_CAM_H_REG DSP MMU CAM Entry Register MSB 16 R/W 0000h FFFE:D230 DSP_MMU_CAM_L_REG DSP MMU CAM Entry Register LSB 16 R/W 0000h FFFE:D234 DSP_MMU_RAM_H_REG DSP MMU RAM Entry Register MSB 16 R/W 0000h FFFE:D238 DSP_MMU_RAM_L_REG DSP MMU RAM Entry Register LSB 16 R/W 0000h FFFE:D23C DSP_MMU_GFLUSH_REG DSP MMU Global Flush Register 16 R/W 0000h FFFE:D240 DSP_MMU_FLUSH_ENTRY_REG DSP MMU Individual Flush Register 16 R/W 0000h FFFE:D244 DSP_MMU_READ_CAM_H_REG DSP MMU Read CAM Register MSB 16 R/W 0000h FFFE:D248 DSP_MMU_READ_CAM_L_REG DSP MMU Read CAM Register LSB 16 R/W 0000h FFFE:D24C DSP_MMU_READ_RAM_H_REG DSP MMU Read RAM Register MSB 16 R/W 0000h FFFE:D250 DSP_MMU_READ_RAM_L_REG DSP MMU Read RAM Register LSB 16 R/W 0000h Table 3−66. TIPB (Public) Bridge 2 Configuration Registers BYTE ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE FFFE:D300 TIPB_CNTL Public TIPB Control Register 16 or 32 R/W FF11h FFFE:D304 TIPB_BUS_ALLOC Public TIPB Bus Allocation Register 16 or 32 R/W 0009h FFFE:D308 MPU_TIPB_CNTL Public MPU TIPB Control Register 16 or 32 R/W 0000h FFFE:D30C ENHANCED_TIPB_CNTL Public Enhanced TIPB Control Register 16 or 32 R/W 0007h FFFE:D310 ADDRESS_DBG Public Debug Address Register 16 or 32 R FFFFh FFFE:D314 DATA_DEBUG_LOW Public Debug Data LSB Register 16 or 32 R FFFFh FFFE:D318 DATA_DEBUG_HIGH Public Debug Data MSB Register 16 or 32 R FFFFh FFFE:D31C DEBUG_CNTR_SIG Public Debug Control Signals Register 16 or 32 R 00F8h 160 SPRS231E December 2003 − Revised December 2005 Functional Overview 3.3 DSP Memory Maps The DSP supports a unified program/data memory map (program and data accesses are made to the same physical space); however, peripheral registers are located in a separate I/O space which is accessed via the DSP’s port instructions. 3.3.1 DSP Global Memory Map The DSP Subsystem contains 160K bytes of on-chip SRAM (64K bytes of DARAM and 96K bytes of SARAM). The MPU also has access to these memories via the MPUI (MPU Interface) port. The DSP also has access to the shared system SRAM (250K bytes) and both EMIF spaces (EMIFF and EMIFS) via the DSP Memory Management Unit (MMU) which is configured by the MPU. Table 3−67 shows the high-level program/data memory map for the DSP subsystem. DSP data accesses utilize 16-bit word addresses while DSP program fetches utilize byte addressing. Table 3−67. DSP Global Memory Map BYTE ADDRESS RANGE WORD ADDRESS RANGE INTERNAL MEMORY 0x00 0000 − 0x00 FFFF 0x00 0000 − 0x00 7FFF DARAM 64K bytes 0x01 0000 − 0x02 7FFF 0x00 8000 − 0x01 3FFF SARAM 96K bytes 0x02 8000 − 0x04 FFFF 0x01 4000 − 0x02 7FFF Reserved 0x05 0000 − 0xFF 7FFF 0x02 8000 − 0x7F BFFF 0xFF 8000 − 0xFF FFFF † 0x7F C000 − 0x7F FFFF EXTERNAL MEMORY† Managed by DSP MMU PDROM (MPNMC = 0) Managed by DSP MMU (MPNMC =1) This space could be external memory or internal shared system memory, depending on the DSP MMU configuration. 3.3.2 On-Chip Dual-Access RAM (DARAM) The DARAM is located in the byte address range 000000h−00FFFFh and is composed of eight blocks of 8K bytes each (see Table 3−68). Each DARAM block can perform two accesses per cycle (two reads, two writes, or a read and a write). Table 3−68. DARAM Blocks DSP BYTE ADDRESS RANGE DSP WORD ADDRESS RANGE MEMORY BLOCK 0x00 0000 − 0x00 1FFF 0x00 0000 − 0x00 0FFF DARAM 0 0x00 2000 − 0x00 3FFF 0x00 1000 − 0x001FFF DARAM 1 0x00 4000 − 0x00 5FFF 0x00 2000 − 0x00 2FFF DARAM 2 0x00 6000 − 0x00 7FFF 0x00 3000 − 0x00 3FFF DARAM 3 0x00 8000 − 0x00 9FFF 0x00 4000 − 0x00 4FFF DARAM 4 0x00 A000 − 0x00 BFFF 0x00 5000 − 0x00 5FFF DARAM 5 0x00 C000 − 0x00 DFFF 0x00 6000 − 0x00 6FFF DARAM 6 0x00 E000 − 0x00 FFFF 0x00 7000 − 0x00 7FFF DARAM 7 December 2003 − Revised December 2005 SPRS231E 161 Functional Overview 3.3.3 On-Chip Single-Access RAM (SARAM) The SARAM is located at the byte address range 010000h−027FFFh and is composed of 12 blocks of 8K bytes each (see Table 3−69). Each SARAM block can perform one access per cycle (one read or one write). Table 3−69. SARAM Blocks DSP BYTE ADDRESS RANGE DSP WORD ADDRESS RANGE MEMORY BLOCK 0x01 0000 − 0x01 1FFF 0x00 8000 − 0x00 8FFF SARAM 0 0x01 2000 − 0x01 3FFF 0x00 9000 − 0x00 9FFF SARAM 1 0x01 4000 − 0x01 5FFF 0x00 A000 − 0x00 AFFF SARAM 2 0x01 6000 − 0x01 7FFF 0x00 B000 − 0x00 BFFF SARAM 3 0x01 8000 − 0x01 9FFF 0x00 C000 − 0x00 CFFF SARAM 4 0x01 A000 − 0x01 BFFF 0x00 D000 − 0x00 DFFF SARAM 5 0x01 C000 − 0x01 DFFF 0x00 E000 − 0x00 EFFF SARAM 6 0x01 E000 − 0x01 FFFF 0x00 F000 − 0x00 FFFF SARAM 7 0x02 0000 − 0x02 1FFF 0x01 0000 − 0x01 0FFF SARAM 8 0x02 2000 − 0x02 3FFF 0x01 1000 − 0x01 1FFF SARAM 9 0x02 4000 − 0x02 5FFF 0x01 2000 − 0x01 2FFF SARAM 10 0x02 6000 − 0x02 7FFF 0x01 3000 − 0x01 3FFF SARAM 11 3.3.4 DSP I/O Space Memory Map The DSP I/O space is a separate address space from the data/program memory space. The I/O space is accessed via the DSP’s port instructions. The DSP I/O space is accessed using 16-bit word addresses. Table 3−70 to Table 3−82 specify the DSP base addresses where each set of registers is accessed. All accesses to these registers must utilize the appropriate access width as indicated in the tables. Accessing registers with the incorrect access width may cause unexpected results, including a TI Peripheral Bus (TIPB) bus error and associated TIPB interrupt. 3.3.4.1 DSP Private Peripheral Registers The DSP Private Registers include the following: 162 • DSP DMA Controller Registers • DSP Timer1 Registers • DSP Timer2 Registers • DSP Timer3 Registers • DSP Watchdog Timer Registers • DSP Level 2.0 Interrupt Handler Registers • DSP Interrupt Interface Registers • DSP Level 2.1 Interrupt Handler Registers SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−70. DSP DMA Controller Registers DSP WORD ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 0C00h DSP_DMA_CSDP0 Channel 0 Source/Destination Parameters Register 16 R/W 0000h 0x00 0C01h DSP_DMA_CCR0 Channel 0 Control Register 16 R/W 0000h 0x00 0C02h DSP_DMA_CICR0 Channel 0 Interrupt Control Register 16 R/W 0003h 0x00 0C03h DSP_DMA_CSR0 Channel 0 Status Register 16 R 0000h 0x00 0C04h DSP_DMA_CSSA_L0 Channel 0 Source Start Address Register LSB 16 R/W undef 0x00 0C05h DSP_DMA_CSSA_U0 Channel 0 Source Start Address Register MSB 16 R/W undef 0x00 0C06h DSP_DMA_CDSA_L0 Channel 0 Destination Start Address Register LSB 16 R/W undef 0x00 0C07h DSP_DMA_CDSA_U0 Channel 0 Destination Start Address Register MSB 16 R/W undef 0x00 0C08h DSP_DMA_CEN0 Channel 0 Element Number Register 16 R/W undef 0x00 0C09h DSP_DMA_CFN0 Channel 0 Frame Number Register 16 R/W undef 0x00 0C0Ah DSP_DMA_CSFI0 Channel 0 Frame Index Register 16 R/W undef 0x00 0C0Bh DSP_DMA_CSEI0 Channel 0 Element Index Register 16 R/W undef 0x00 0C0Ch DSP_DMA_CSAC0 Channel 0 Source Address Counter Register 16 R/W undef 0x00 0C0Dh DSP_DMA_CDAC0 Channel 0 Destination Address Counter Register 16 R/W undef 0x00 0C0Eh DSP_DMA_CDEI0 Channel 0 Destination Element Index 16 R/W undef 0x00 0C0Fh DSP_DMA_CDFI0 Channel 0 Destination Frame Index 16 R/W undef 0x00 0C10h − 0x00 0C1Fh Reserved 0x00 0C20h DSP_DMA_CSDP1 Channel 1 Source/Destination Parameters Register 16 R/W 0000h 0x00 0C21h DSP_DMA_CCR1 Channel 1 Control Register 16 R/W 0000h 0x00 0C22h DSP_DMA_CICR1 Channel 1 Interrupt Control Register 16 R/W 0003h 0x00 0C23h DSP_DMA_CSR1 Channel 1 Status Register 16 R 0000h 0x00 0C24h DSP_DMA_CSSA_L1 Channel 1 Source Start Address Register LSB 16 R/W undef 0x00 0C25h DSP_DMA_CSSA_U1 Channel 1 Source Start Address Register MSB 16 R/W undef 0x00 0C26h DSP_DMA_CDSA_L1 Channel 1 Destination Start Address Register LSB 16 R/W undef 0x00 0C27h DSP_DMA_CDSA_U1 Channel 1 Destination Start Address Register MSB 16 R/W undef 0x00 0C28h DSP_DMA_CEN1 Channel 1 Element Number Register 16 R/W undef 0x00 0C29h DSP_DMA_CFN1 Channel 1 Frame Number Register 16 R/W undef 0x00 0C2Ah DSP_DMA_CSFI1 Channel 1 Frame Index Register 16 R/W undef 0x00 0C2Bh DSP_DMA_CSEI1 Channel 1 Element Index Register 16 R/W undef 0x00 0C2Ch DSP_DMA_CSAC1 Channel 1 Source Address Counter Register 16 R/W undef 0x00 0C2Dh DSP_DMA_CDAC1 Channel 1 Destination Address Counter Register 16 R/W undef 0x00 0C2Eh DSP_DMA_CDEI1 Channel 1 Destination Element Index 16 R/W undef 0x00 0C2Fh DSP_DMA_CDFI1 Channel 1 Destination Frame Index 16 R/W undef 0x00 0C30h − 0x00 0C3Fh Reserved 0x00 0C40h DSP_DMA_CSDP2 Channel 2 Source/Destination Parameters Register 16 R/W 0000h 0x00 0C41h DSP_DMA_CCR2 Channel 2 Control Register 16 R/W 0000h 0x00 0C42h DSP_DMA_CICR2 Channel 2 Interrupt Control Register 16 R/W 0003h 0x00 0C43h DSP_DMA_CSR2 Channel 2 Status Register 16 R 0000h 0x00 0C44h DSP_DMA_CSSA_L2 Channel 2 Source Start Address Register LSB 16 R/W undef 0x00 0C45h DSP_DMA_CSSA_U2 Channel 2 Source Start Address Register MSB 16 R/W undef 0x00 0C46h DSP_DMA_CDSA_L2 Channel 2 Destination Start Address Register LSB 16 R/W undef 0x00 0C47h DSP_DMA_CDSA_U2 Channel 2 Destination Start Address Register MSB 16 R/W undef December 2003 − Revised December 2005 SPRS231E 163 Functional Overview Table 3−70. DSP DMA Controller Registers (Continued) DSP WORD ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 0C48h DSP_DMA_CEN2 Channel 2 Element Number Register 16 R/W undef 0x00 0C49h DSP_DMA_CFN2 Channel 2 Frame Number Register 16 R/W undef 0x00 0C4Ah DSP_DMA_CSFI2 Channel 2 Frame Index Register 16 R/W undef 0x00 0C4Bh DSP_DMA_CSEI2 Channel 2 Element Index Register 16 R/W undef 0x00 0C4Ch DSP_DMA_CSAC2 Channel 2 Source Address Counter Register 16 R/W undef 0x00 0C4Dh DSP_DMA_CDAC2 Channel 2 Destination Address Counter Register 16 R/W undef 0x00 0C4Eh DSP_DMA_CDEI2 Channel 2 Destination Element Index 16 R/W undef 0x00 0C4Fh DSP_DMA_CDFI2 Channel 2 Destination Frame Index 16 R/W undef 0x00 0C50h − 0x00 0C5Fh Reserved 0x00 0C60h DSP_DMA_CSDP3 Channel 3 Source/Destination Parameters Register 16 R/W 0000h 0x00 0C61h DSP_DMA_CCR3 Channel 3 Control Register 16 R/W 0000h 0x00 0C62h DSP_DMA_CICR3 Channel 3 Interrupt Control Register 16 R/W 0003h 0x00 0C63h DSP_DMA_CSR3 Channel 3 Status Register 16 R 0000h 0x00 0C64h DSP_DMA_CSSA_L3 Channel 3 Source Start Address Register LSB 16 R/W undef 0x00 0C65h DSP_DMA_CSSA_U3 Channel 3 Source Start Address Register MSB 16 R/W undef 0x00 0C66h DSP_DMA_CDSA_L3 Channel 3 Destination Start Address Register LSB 16 R/W undef 0x00 0C67h DSP_DMA_CDSA_U3 Channel 3 Destination Start Address Register MSB 16 R/W undef 0x00 0C68h DSP_DMA_CEN3 Channel 3 Element Number Register 16 R/W undef 0x00 0C69h DSP_DMA_CFN3 Channel 3 Frame Number Register 16 R/W undef 0x00 0C6Ah DSP_DMA_CSFI3 Channel 3 Frame Index Register 16 R/W undef 0x00 0C6Bh DSP_DMA_CSEI3 Channel 3 Element Index Register 16 R/W undef 0x00 0C6Ch DSP_DMA_CSAC3 Channel 3 Source Address Counter Register 16 R/W undef 0x00 0C6Dh DSP_DMA_CDAC3 Channel 3 Destination Address Counter Register 16 R/W undef 0x00 0C6Eh DSP_DMA_CDEI3 Channel 3 Destination Element Index 16 R/W undef 0x00 0C6Fh DSP_DMA_CDFI3 Channel 3 Destination Frame Index 16 R/W undef 0x00 0C70h − 0x00 0C7Fh Reserved 0x00 0C80h DSP_DMA_CSDP4 Channel 4 Source/Destination Parameters Register 16 R/W 0000h 0x00 0C81h DSP_DMA_CCR4 Channel 4 Control Register 16 R/W 0000h 0x00 0C82h DSP_DMA_CICR4 Channel 4 Interrupt Control Register 16 R/W 0003h 0x00 0C83h DSP_DMA_CSR4 Channel 4 Status Register 16 R 0000h 0x00 0C84h DSP_DMA_CSSA_L4 Channel 4 Source Start Address Register LSB 16 R/W undef 0x00 0C85h DSP_DMA_CSSA_U4 Channel 4 Source Start Address Register MSB 16 R/W undef 0x00 0C86h DSP_DMA_CDSA_L4 Channel 4 Destination Start Address Register LSB 16 R/W undef 0x00 0C87h DSP_DMA_CDSA_U4 Channel 4 Destination Start Address Register MSB 16 R/W undef 0x00 0C88h DSP_DMA_CEN4 Channel 4 Element Number Register 16 R/W undef 0x00 0C89h DSP_DMA_CFN4 Channel 4 Frame Number Register 16 R/W undef 0x00 0C8Ah DSP_DMA_CSFI4 Channel 4 Frame Index Register 16 R/W undef 0x00 0C8Bh DSP_DMA_CSEI4 Channel 4 Element Index Register 16 R/W undef 0x00 0C8Ch DSP_DMA_CSAC4 Channel 4 Source Address Counter Register 16 R/W undef 0x00 0C8Dh DSP_DMA_CDAC4 Channel 4 Destination Address Counter Register 16 R/W undef 0x00 0C8Eh DSP_DMA_CDEI4 Channel 4 Destination Element Index 16 R/W undef 0x00 0C8Fh DSP_DMA_CDFI4 Channel 4 Destination Frame Index 16 R/W undef 164 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−70. DSP DMA Controller Registers (Continued) DSP WORD ADDRESS REGISTER NAME 0x00 0C90h − 0x00 0C9Fh DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE Reserved 0x00 0CA0h DSP_DMA_CSDP5 Channel 5 Source/Destination Parameters Register 16 RW 0000h 0x00 0CA1h DSP_DMA_CCR5 Channel 5 Control Register 16 R/W 0000h 0x00 0CA2h DSP_DMA_CICR5 Channel 5 Interrupt Control Register 16 R/W 0003h 0x00 0CA3h DSP_DMA_CSR5 Channel 5 Status Register 16 R 0000h 0x00 0CA4h DSP_DMA_CSSA_L5 Channel 5 Source Start Address Register LSB 16 R/W undef 0x00 0CA5h DSP_DMA_CSSA_U5 Channel 5 Source Start Address Register MSB 16 R/W undef 0x00 0CA6h DSP_DMA_CDSA_L5 Channel 5 Destination Start Address Register LSB 16 R/W undef 0x00 0CA7h DSP_DMA_CDSA_U5 Channel 5 Destination Start Address Register MSB 16 R/W undef 0x00 0CA8h DSP_DMA_CEN5 Channel 5 Element Number Register 16 R/W undef 0x00 0CA9h DSP_DMA_CFN5 Channel 5 Frame Number Register 16 R/W undef 0x00 0CAAh DSP_DMA_CSFI5 Channel 5 Frame Index Register 16 R/W undef 0x00 0CABh DSP_DMA_CSEI5 Channel 5 Element Index Register 16 R/W undef 0x00 0CACh DSP_DMA_CSAC5 Channel 5 Source Address Counter Register 16 R/W undef 0x00 0CADh DSP_DMA_CDAC5 Channel 5 Destination Address Counter Register 16 R/W undef 0x00 0CAEh DSP_DMA_CDEI5 Channel 5 Destination Element Index 16 R/W undef 0x00 0CAFh DSP_DMA_CDFI5 Channel 5 Destination Frame Index 16 R/W undef 0x00 0CB0h − 0x00 0DFFh Reserved 0x00 0E00h DSP_DMA_GCR Global Control Register 16 R/W 0008h 0x00 0E01h DSP_DMA_GTCR Global Timeout Control Register 16 R/W 0000h 0x00 0E02h DSP_DMA_GSCR Global Software Incompatible Control Register 16 R/W 0000h Table 3−71. DSP Timer1 Registers DSP WORD ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 2800h DSP_TMR1_CNTL DSP Timer1 Control Register 16 R/W 0000h 0x00 2802h DSP_TMR1_LOAD_LO DSP Timer1 Load Register Low 16 W undef 0x00 2803h DSP_TMR1_LOAD_HI DSP Timer1 Load Register High 16 W undef 0x00 2804h DSP_TMR1_READ_LO DSP Timer1 Read Register Low 16 R undef 0x00 2805h DSP_TMR1_READ_HI DSP Timer1 Read Register High 16 R undef ACCESS WIDTH ACCESS TYPE Table 3−72. DSP Timer2 Registers DSP WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE 0x00 2C00h DSP_TMR2_CNTL DSP Timer2 Control Register 16 R/W 0000h 0x00 2C02h DSP_TMR2_LOAD_LO DSP Timer2 Load Register Low 16 W undef 0x00 2C03h DSP_TMR2_LOAD_HI DSP Timer2 Load Register High 16 W undef 0x00 2C04h DSP_TMR2_READ_LO DSP Timer2 Read Register Low 16 R undef 0x00 2C05h DSP_TMR2_READ_HI DSP Timer2 Read Register High 16 R undef December 2003 − Revised December 2005 SPRS231E 165 Functional Overview Table 3−73. DSP Timer3 Registers DSP WORD ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 3000h DSP_TMR3_CNTL DSP Timer3 Control Register 16 R/W 0000h 0x00 3002h DSP_TMR3_LOAD_LO DSP Timer3 Load Register Low 16 W undef 0x00 3003h DSP_TMR3_LOAD_HI DSP Timer3 Load Register High 16 W undef 0x00 3004h DSP_TMR3_READ_LO DSP Timer3 Read Register Low 16 R undef 0x00 3005h DSP_TMR3_READ_HI DSP Timer3 Read Register High 16 R undef ACCESS WIDTH ACCESS TYPE Table 3−74. DSP Watchdog Timer Registers DSP WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE 0x00 3400h DSP_WD_CNTL_TIMER DSP Watchdog Control Timer 16 R/W 0E02h 0x00 3402h DSP_WD_LOAD_TIMER DSP Watchdog Load Timer 16 W FFFFh 0x00 3402h DSP_WD_READ_TIMER DSP Watchdog Read Timer 16 R FFFFh 0x00 3404h DSP_WD_TIMER_MODE DSP Watchdog Timer Mode 16 R/W 8000h ACCESS WIDTH ACCESS TYPE Table 3−75. DSP Level 2.0 Interrupt Handler Registers DSP WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE 0x00 4800h DSP_L2_ITR Interrupt Register 16 RW 0000h 0x00 4802h DSP_L2_MIR Mask Interrupt Register 16 RW FFFFh 0x00 4804h DSP_L2_SIR_IRQ_CODE IRQ Interrupt Encoded Source Register 16 R 0000h 0x00 4806h DSP_L2_SIR_FIQ_CODE FIQ Interrupt Encoded Source Register 16 R 0000h 0x00 4808h DSP_L2_CONTROL_REG Interrupt Control Register 16 RW 0000h 0x00 480Ah DSP_L2_ISR Software Interrupt Set Register 16 RW 0000h 0x00 480Ch DSP_L2_ILR0 Interrupt 0 Priority Level Register 16 RW 0000h 0x00 480Eh DSP_L2_ILR1 Interrupt 1 Priority Level Register 16 RW 0000h 0x00 4810h DSP_L2_ILR2 Interrupt 2 Priority Level Register 16 RW 0000h 0x00 4812h DSP_L2_ILR3 Interrupt 3 Priority Level Register 16 RW 0000h 0x00 4814h DSP_L2_ILR4 Interrupt 4 Priority Level Register 16 RW 0000h 0x00 4816h DSP_L2_ILR5 Interrupt 5 Priority Level Register 16 RW 0000h 0x00 4818h DSP_L2_ILR6 Interrupt 6 Priority Level Register 16 RW 0000h 0x00 481Ah DSP_L2_ILR7 Interrupt 7 Priority Level Register 16 RW 0000h 0x00 481Ch DSP_L2_ILR8 Interrupt 8 Priority Level Register 16 RW 0000h 0x00 481Eh DSP_L2_ILR9 Interrupt 9 Priority Level Register 16 RW 0000h 0x00 4820h DSP_L2_ILR10 Interrupt 10 Priority Level Register 16 RW 0000h 0x00 4822h DSP_L2_ILR11 Interrupt 11 Priority Level Register 16 RW 0000h 0x00 4824h DSP_L2_ILR12 Interrupt 12 Priority Level Register 16 RW 0000h 0x00 4826h DSP_L2_ILR13 Interrupt 13 Priority Level Register 16 RW 0000h 0x00 4828h DSP_L2_ILR14 Interrupt 14 Priority Level Register 16 RW 0000h 0x00 482Ah DSP_L2_ILR15 Interrupt 15 Priority Level Register 16 RW 0000h 166 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−76. DSP Interrupt Interface Registers DSP WORD ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 3800h ET_LS_CTRL_HI Edge Triggered/Level Sensitive Control Register High 16 R/W 0000h 0x00 3801h ET_LS_CTRL_LO Edge Triggered/Level Sensitive Control Register Low 16 R/W 0000h 0x00 3800h RST_LVL_HI Reset Level Control Register High 16 R/W 0000h 0x00 3801h RST_LVL_LO Reset Level Control Register Low 16 R/W 0000h Table 3−77. DSP Level 2.1 Interrupt Handler Registers DSP WORD ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 4C00h DSP_L21_ITR Interrupt Register 16 R/W 0000h 0x00 4C02h DSP_L21_MIR Mask Interrupt Register 16 R/W FFFFh 0x00 4C08h DSP_L21_SIR_IRQ_CODE IRQ Interrupt Encoded Source Register 16 R 0000h 0x00 4C0Ah DSP_L21_SIR_FIQ_CODE FIQ Interrupt Encoded Source Register 16 R 0000h 0x00 4C0Ch DSP_L21_CONTROL_REG Interrupt Control Register 16 R/W 0000h 0x00 4C0Eh DSP_L21_ILR0 Interrupt 0 Priority Level Register 16 R/W 0000h 0x00 4C10h DSP_L21_ILR1 Interrupt 1 Priority Level Register 16 R/W 0000h 0x00 4C12h DSP_L21_ILR2 Interrupt 2 Priority Level Register 16 R/W 0000h 0x00 4C14h DSP_L21_ILR3 Interrupt 3 Priority Level Register 16 R/W 0000h 0x00 4C16h DSP_L21_ILR4 Interrupt 4 Priority Level Register 16 R/W 0000h 0x00 4C18h DSP_L21_ILR5 Interrupt 5 Priority Level Register 16 R/W 0000h 0x00 4C1Ah DSP_L21_ILR6 Interrupt 6 Priority Level Register 16 R/W 0000h 0x00 4C1Ch DSP_L21_ILR7 Interrupt 7 Priority Level Register 16 R/W 0000h 0x00 4C1Eh DSP_L21_ILR8 Interrupt 8 Priority Level Register 16 R/W 0000h 0x00 4C20h DSP_L21_ILR9 Interrupt 9 Priority Level Register 16 R/W 0000h 0x00 4C22h DSP_L21_ILR10 Interrupt 10 Priority Level Register 16 R/W 0000h 0x00 4C24h DSP_L21_ILR11 Interrupt 11 Priority Level Register 16 R/W 0000h 0x00 4C26h DSP_L21_ILR12 Interrupt 12 Priority Level Register 16 RW 0000h 0x00 4C28h DSP_L21_ILR13 Interrupt 13 Priority Level Register 16 R/W 0000h 0x00 4C2Ah DSP_L21_ILR14 Interrupt 14 Priority Level Register 16 R/W 0000h 0x00 4C2Ch DSP_L21_ILR15 Interrupt 15 Priority Level Register 16 R/W 0000h December 2003 − Revised December 2005 SPRS231E 167 Functional Overview 3.3.4.2 DSP Configuration Registers The DSP Private Registers include the following: • DSP TIPB Bridge Configuration Register • DSP EMIF Configuration Registers • DSP I-CACHE Registers • DSP Clock Mode Registers • DSP TIPB Bus Switch Registers Table 3−78. DSP TIPB Bridge Configuration Register DSP WORD ADDRESS 0x00 0000 REGISTER NAME DSP_CMR DESCRIPTION DSP Control Mode Register ACCESS WIDTH ACCESS TYPE 32 R/W ACCESS WIDTH ACCESS TYPE RESET VALUE 5555 5555h Table 3−79. DSP EMIF Configuration Registers DSP WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE 0x00 0800 DSP_EMIF_CNTL DSP EMIF Global Control Register 16 R/W 0000h 0x00 0801 DSP_EMIF_GRR DSP EMIF Global Reset Register 16 W xxxxh ACCESS WIDTH ACCESS TYPE Table 3−80. DSP I-Cache Registers DSP WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE 0x00 1400 DSP_ICACHE_GCR DSP ICache Global Control Register 16 R/W 0004h 0x00 1401 DSP_ICACHE_FLAR0 DSP ICache Flush Line Address Register 0 16 R/W 0000h 0x00 1402 DSP_ICACHE_FLAR1 DSP ICache Flush Line Address Register 1 16 R/W 0000h 0x00 1403 DSP_ICACHE_NWCR DSP ICache N Way Control Register 16 R/W 0001h 0x00 1404 DSP_ICACHE_SR DSP ICache Status Register 16 R/W 0000h 0x00 1405 DSP_ICACHE_R1_CR DSP ICache 1/2 Ramset 1 Control Register 16 R 0001h 0x00 1406 DSP_ICACHE_R1_TR DSP ICache 1/2 Ramset 1 Tag Register 16 R/W 0000h 0x00 1407 DSP_ICACHE_R2_CR DSP ICache 1/2 Ramset 2 Control Register 16 R/W 0001h 0x00 1408 DSP_ICACHE_R2_TR DSP ICache 1/2 Ramset 2 Tag Register 16 R/W 0000h 168 SPRS231E December 2003 − Revised December 2005 Functional Overview Table 3−81. DSP Clock Mode Registers DSP WORD ADDRESS REGISTER NAME DESCRIPTION ACCESS WIDTH ACCESS TYPE RESET VALUE 0x00 4000 DSP_CKTL DSP Clock Control Register 16 R/W 0190h 0x00 4002 DSP_IDLCT1 DSP Idle Control 1 Register 16 R/W 0040h 0x00 4004 DSP_IDLCT2 DSP Idle Control 2Register 16 R/W 0000h 0x00 4006 Reserved 0x00 4008 Reserved 0x00 400A DSP_RSTCT2 DSP Reset Control 2 Register 16 R/W 0000h 0x00 400C DSP_SYSST DSP System Information Register 16 R/W 0000h ACCESS WIDTH ACCESS TYPE Table 3−82. DSP TIPB Bus Switch Registers DSP WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE 0x00 E400 DSP_UART1_SSW_CONF UART1 Peripheral Ownership Register 32 R/W 0000 00001h 0x00 E410 DSP_UART2_SSW_CONF UART2 Peripheral Ownership Register 32 R/W 0000 00001h 0x00 E420 DSP_UART3_SSW_CONF UART3 Peripheral Ownership Register 32 R/W 0000 00001h 0x00 E448 DSP_MCBSP2_SSW_CONF MCBSP2 Peripheral Ownership Register 32 R/W 0000 00001h 0x00 E450 DSP_I2C_SSW_CONF I2C Peripheral Ownership Register 32 R/W 0000 00001h 0x00 E458 DSP_SPI_SSW_CONF SPI Peripheral Ownership Register 32 R/W 0000 00001h 0x00 E460 DSP_GPTIMER1_SSW_CONF GPTIMER1 Peripheral Ownership Register 32 R/W 0000 00001h 0x00 E468 DSP_GPTIMER2_SSW_CONF GPTIMER2 Peripheral Ownership Register 32 R/W 0000 00001h 0x00 E470 DSP_GPTIMER3_SSW_CONF GPTIMER3 Peripheral Ownership Register 32 R/W 0000 00001h 0x00 E478 DSP_GPTIMER4_SSW_CONF GPTIMER4 Peripheral Ownership Register 32 R/W 0000 00001h 0x00 E480 DSP_GPTIMER5_SSW_CONF GPTIMER5 Peripheral Ownership Register 32 R/W 0000 00001h 0x00 E488 DSP_GPTIMER6_SSW_CONF GPTIMER6 Peripheral Ownership Register 32 R/W 0000 00001h 0x00 E498 DSP_GPTIMER7_SSW_CONF GPTIMER7 Peripheral Ownership Register 32 R/W 0000 00001h 0x00 E4A0 DSP_GPTIMER8_SSW_CONF GPTIMER8 Peripheral Ownership Register 32 R/W 0000 00001h 32 R/W 0000 00001h 0x00 E4A8 0x00 E4B0 Reserved DSP_MMCSD2_SSW_CONF December 2003 − Revised December 2005 MMC/SDIO 2 Peripheral Ownership Register SPRS231E 169 Functional Overview 3.4 DSP External Memory (Managed by MMU) When the DSP MMU is off, the 24 address lines are directly copied to the traffic controller without any modification. There is no virtual-to-physical address translation. All the addresses between 0x05 0000 and 0x00FF 8000 (0x00FF FFFF if DSP bit MP/MC = 1) are redirected to the first sector of Flash (CS0) in the shared memory space (shared by MPU and DSP). See Figure 3−2. Byte Address DSP Memory Shared Memory 0x00 0000 Byte Address 0x0000 0000 Internal RAM 0x02 8000 FLASH CS0 0x0400 0000 FLASH CS1 0x0800 0000 FLASH CS2 0x0C00 0000 FLASH CS3 0xFF 8000 0x1000 0000 ROM SDRAM 0xFF FFFF 0x17FF FFFF Reserved 0x2000 0000 Internal SRAM (Frame Buffer) 0x2003 E7FF Figure 3−2. DSP MMU Off 170 SPRS231E December 2003 − Revised December 2005 Functional Overview When the DSP MMU is on, the 24 address lines (virtual address) are relocated within a physical 32-bit address by the DSP MMU. The DSP MMU is controlled by the MPU. If the DSP MMU is off, the DSP cannot see the MPU address 0x0000 0000. See Figure 3−3. Byte Address DSP Memory Shared Memory Byte Address 0x0000 0000 0x00 0000 Internal RAM 0x02 8000 FLASH CS0 0x0400 0000 FLASH CS1 0x0800 0000 FLASH CS2 0x0C00 0000 FLASH CS3 0x1000 0000 0xFF 8000 ROM SDRAM 0xFF FFFF 0x17FF FFFF Reserved 0x2000 0000 Internal SRAM (Frame Buffer) 0x2003 E7FF Figure 3−3. DSP MMU On December 2003 − Revised December 2005 SPRS231E 171 Functional Overview 3.5 MPU and DSP Private Peripherals The MPU and DSP each have their own separate private peripheral bus. Peripherals on each of these private buses may only be accessed by their respective processors. 3.5.1 Timers The MPU and DSP have three 32-bit timers available on their respective private TIPBs. These timers are used by the operating system to provide general-purpose housekeeping functions or, in the case of the DSP, to also provide synchronization of real-time processing functions. These timers can be configured either in autoreload or one-shot mode with on-the-fly read capability. The timers generate an interrupt to the respective processor (MPU or DSP) when the timer down-counter is equal to zero. 3.5.2 Watchdog Timer The MPU and DSP each have a single watchdog timer. Each watchdog timer can be configured as either a watchdog timer or a general-purpose timer. A watchdog timer requires that the MPU or DSP software or OS periodically write to the appropriate WDT count register before the counter underflows. If the counter underflows, the WDT generates a reset to the appropriate processor (MPU or DSP). The DSP WDT resets only the DSP processor while the MPU WDT resets both processors (MPU and DSP). The watchdog timers are useful for detecting user programs that are stuck in an infinite loop, resulting in loss of program control or in a runaway condition. When used as a general-purpose timer, the WDT is a 16-bit timer configurable either in autoreload or one-shot mode with on-the-fly read capability. The timer generates an interrupt to the respective processor (MPU or DSP) when the timer’s down-counter is equal to zero. 3.5.3 Interrupt Handlers The MPU and DSP have two levels of interrupt handling each, allowing up to 160 interrupts on the MPU and 98 interrupts on the DSP. This is necessary because of the large number of integrated peripherals on the OMAP5912 device. Some peripherals can generate interrupts to both processors. 3.5.4 LCD Controller (MPU Only) The OMAP5912 devices include an LCD controller that interfaces with most industry-standard LCD displays. The LCD controller is configured by the MPU and utilizes a dedicated channel on the system DMA to transfer data from the frame buffer. The frame buffer can be implemented using external SDRAM via the EMIFF. Using the frame buffer as its data source, the system DMA must provide data to the FIFO at the front end of the LCD controller data path at a rate sufficient to support the chosen display mode and resolution. Optimal performance is achieved when using the internal SRAM as the frame buffer. The panel size is programmable and can be any width (line length) from 16 to 1024 pixels in 16-pixel increments. The number of lines is set by programming the total number of pixels in the LCD. The total frame size is programmable up to 1024 × 1024; however, frame sizes and frame rates supported in specific applications depend upon the available memory bandwidth allowed by the specific application as well as the maximum configurable pixel clock rate. The screen is intended to be mapped to the frame buffer as one contiguous block where each horizontal line of pixels is mapped to a set of consecutive bytes of words in the frame memory. 172 SPRS231E December 2003 − Revised December 2005 Functional Overview The main features of the LCD controller are: • • • • • • • • Dedicated 64-entry × 16-bit FIFO Dedicated LCD DMA channel for LCD display Programmable display including support for 2-, 4-, 8-, 12-, and 16-bit graphics modes Programmable display resolutions up to 1024 pixels by 1024 lines (assuming sufficient system bandwidth) Support for passive monochrome (STN) displays Support for passive color (STN) displays Support for active color (TFT) displays Patented dithering algorithm, providing: • • • • − 15 grayscale levels for monochrome passive displays − 3375 colors for color passive displays − 65536 colors for active color displays − 256-entry × 12-bit palette Programmable pixel rate Pixel clock plus horizontal and vertical synchronization signals ac-bias drive signal Active display enable signal 3.5.5 LCDCONV (MPU Only) This module enables to provide a 16-bit to 18-bit LCD data conversion to the LCD interface. It supports two operating modes: • 16-bit LCD mode • 18-bit LCD mode The mode switching is done by software by setting a dedicated bit in its control register. The software is also able to know which mode is currently in use by looking in a status register. When 16-bit LCD mode is used, the module operates in bypass mode, where all the 16-bit LCD pixel data coming from the frame buffer is directly provided to an external LCD interface. When the 18-bit LCD mode is used, the 16-bit LCD pixel signal is converted to an 18-bit LCD pixel signal through a Red, Green, Blue color (RGB) lookup table. Then the 18-bit LCD pixel format adds a LSB bit to the R (coding Red color) and B (Blue color) signals. 3.5.6 Random Number Generator (RNG) (MPU Only) The MPU secure features include a random-number-generator (RNG) module that provides a true, nondeterministic noise source for the purpose of generating keys, initializing vectors (IVs), and other random-number requirements. It is designed for FIPS 140-1 compliance 43, facilitating system certification to this security standard. It also includes built-in self-test (BIST) logic that allows for the testing of the randomness of the module output and its compliance with FIPS 140-1 standard. An ANSI X9.17, annex C post-processor is available to meet the NIST requirements of FIPS 140-1. The RNG module is made of a hardware-based nondeterministic random-number-generator core and a wrapper, which provides bus interface, clock, reset, and test features. NOTES: • It takes 160 RNG clock cycles to generate a new key. • After each host read access to the key output register, a new key starts to be completed. December 2003 − Revised December 2005 SPRS231E 173 Functional Overview 3.5.7 DES/3DES (MPU Only) The DES/3DES module provides hardware-accelerated data encryption/decryption functions. It can run either the single DES algorithm or the triple DES algorithm in compliance with FIPS 46-3 standard. It supports electronic codebook (ECB) and cipher-block chaining (CBC) modes of operation. It does not support the cipher-feedback (CF) and the output-feedback (OFB) modes of operation in hardware. The DES/3DES module includes the following features: • • • • • • • 8-byte input and output buffers 56-bit key size, plus 8-bit error detection per key (up to 3 keys) 16 (DES) round cycles per 8 bytes of data block 48 (3DES) round cycles per 8 bytes of data block Write and read DMA channels MPU write and read No IRQs 3.5.8 SHA1/MD5 (MPU Only) The SHA1/MD5 security module provides hardware-accelerated hash functions. It can run either the SHA-1 algorithm in compliance with FIPS 180-1 standard, or the MD5 message-digest algorithm developed by Rivest in 1991. Up to 227-1 bytes (128M bytes) of data can be hashed in a single operation to produce a 160-bit signature in the case of SHA-1, and 128-bit signature in the case of MD5. NOTE: • • • • • 3.6 The SHA-1 algorithm takes 80 steps per 512-bit block of data to be processed. The MD5 algorithm takes 64 steps per 512-bit block of data to be processed. Each step takes one clock cycle. Blocks are processed sequentially, which means that to start processing a new block, the accelerator must wait for the end of the previous 80 operation steps (for SHA-1, 64 for MD5) of the previous block. The SHA-1/MD5 can interface with a host or with a DMA. MPU Public Peripherals Peripherals on the MPU Public Peripheral bus may only be accessed by the MPU and the system DMA controller, which is configured by the MPU. This bus is called a public bus because it is accessible by the system DMA controller. The DSP cannot access peripherals on this bus. 3.6.1 USB Interface The OMAP5912 processor provides several varieties of USB functionality, including: • USB host: OMAP5912 provides a three-port USB Specification Revision 1.1-compliant host controller, which is based on the OHCI Specification for USB Release 1.0a. • USB device: OMAP5912 provide a full-speed USB device. • USB On-The-Go (OTG): OMAP5912 acts as an OTG dual-role device; the USB device functionality and one port of the USB host controller act in concert to provide an OTG port. Flexible multiplexing of signals from the OMAP5912 USB host controller, USB function controller, and other peripherals allows for a wide variety of system-level USB capabilities. Many of the OMAP5912 pins can be used for USB-related signals or for signals from other peripherals. The top-level pin multiplexing controls each pin individually and allows for the selection of one of several possible internal pin signal interconnections. When these shared pins are programmed for use as USB signals, the OMAP5912 USB signal multiplexing selects how the signals associated with the three OMAP5912 USB host ports and the OMAP5912 USB function controller can be brought out to OMAP5912 pins. 174 SPRS231E December 2003 − Revised December 2005 Functional Overview The USB host controller (HC) is a three-port controller that communicates with USB devices at low-speed (1.5M bit-per-second maximum) and full-speed (12M bit-per-second maximum) data rates. It is compatible with the Universal Serial Bus Specification Revision 2.0 and the OpenHCI − Open Host Controller Interface Specification for USB, Release 1.0a, which is available on the Internet, and is hereafter called the OHCI Specification for USB. It is assumed that users of the OMAP5912 USB host controller are already familiar with the USB Specification and OHCI Specification for USB. The OMAP5912 OTG controller can use one of the USB host controller ports as part of a USB OTG-capable connection. When used for an OTG connection, the host controller port acts as the upstream device when OMAP5912 controls the OTG link, and the USB function controller acts as the downstream device when OMAP5912 acts as an OTG downstream device. The USB host controller implements the register set and makes use of the memory data structures defined in the OHCI Specification for USB. These registers and data structures are the mechanism by which a USB host controller driver software package can control the USB host controller. The OHCI Specification for USB also defines how the USB host controller implementation must interact with those registers and data structures in system memory. The OMAP5912 MPU accesses these registers via the MPU public peripheral bus. NOTE: USB 2.0 hi-speed is not supported. 3.6.2 Camera Interface The camera interface is an 8-bit external port that can be used to accept data from an external camera sensor. The interface handles multiple image formats synchronized on vertical and horizontal synchronization signals. Data transfer to the camera interface can be done synchronously or asynchronously. The camera interface module converts the 8-bit data transfers into 32-bit words and utilizes a 128-word buffer to facilitate efficient data transfer to memory. Data can be transferred from the camera interface buffer to internal memory by the system DMA controller or directly by the MPU. This interface is accessible through the OCP-T1 or OCP-T2 port. 3.6.3 MICROWIRE Serial Interface The MICROWIRE interface is a serial synchronous interface that can drive up to four serial external components. This interface is compatible with the MICROWIRE standard and is seen as the master. MICROWIRE is typically used to transmit control and status information to external peripheral devices or to transmit data to or from small nonvolatile memories such as serial EEPROMs or serial flash devices. 3.6.4 Real-Time Clock (RTC) The RTC peripheral provides an embedded real-time clock module that can be directly accessible from the MPU. The RTC peripheral is powered independently of the OMAP5912 MPU core power. The RTC module has the following features: • Time information (seconds/minutes/hours) directly in BCD code • Calendar information (day/month/year/day of the week) directly in BCD code up to year 2099 • Interrupts generation, periodically (1s/1m/1h/1d period) or at a precise time of the day (alarm function) • 30-s time correction • Oscillator frequency calibration December 2003 − Revised December 2005 SPRS231E 175 Functional Overview 3.6.5 Pulse-Width Tone (PWT) The pulse-width tone (PWT) peripheral generates a modulated frequency signal for use with an external buzzer. The frequency is programmable between 349 Hz and 5276 Hz with 12 half-tone frequencies per octave. The volume level of the output is also programmable. 3.6.6 Pulse-Width Light (PWL) The pulse-width light (PWL) peripheral allows the control of the backlight of the LCD and the keypad by employing a 4096-bit random sequence. This voltage level control technique decreases the spectral power at the modulator harmonic frequencies. The block uses a switchable 32-kHz clock, independent of UPLD. 3.6.7 Keyboard Interface Keyboard is composed of specific MPUIOs dedicated for 6 x 5 or 8 x 8 keyboard connection: • Eight inputs (KB.R[7:0]) for row lines • Eight outputs (KB.C[7:0]) for column lines The keyboard feature allows communication with a keyboard. The MPUIO or keyboard interface supports keyboards with up to eight rows and eight columns and has the capability to detect multiple key presses. A keyboard event is signaled to the host by an interrupt. 3.6.8 HDQ/1-Wire Interface This module allows implementation of both HDQ and 1-Wire protocols. These protocols use a single wire to communicate between a master and a slave device. The HDQ/1-Wire pin is open-drain and requires an external pullup resistor. HDQ and 1-Wire interfaces can be found on commercially available battery and power management devices. The interface can be used to send command and monitor its status between OMAP5912 and such devices. 3.6.9 Multimedia Card/Secure Digital (MMC/SDIO1) Interface The MMC/SDIO1 host controller provides an interface between the MPU and MMC/SD/SDIO memory cards plus up to four serial flash cards, and it also handles MMC/SDIO transactions with minimum local host intervention. The following combinations of external devices are supported: • One or more MMC memory cards sharing the same bus • One single SD memory card or SDIO card The application interface is responsible for managing transaction semantics; the MMC/SDIO1 host controller deals with MMC/SDIO protocol at transmission level, packing data, adding CRC, start/end bit and checking for syntactical correctness. SD mode wide bus width is also supported (1- or 4-bit data lines). The application interface can send every MMC/SDIO command and either poll for the status of the adapter or wait for an interrupt request, which is sent back in case of exceptions or to notify for end of operations. The application interface can read card responses or flag register. It can also mask individually interrupt sources. All these operations can be performed reading and writing control registers. The MMC/SDIO1 peripheral also supports two DMA channels.The main features of the MMC/SDIO1 module are: 176 • Full compliance with MMC command/response sets as defined in the MMC standard specifications v.3.1 • Full compliance with SD command/response sets as defined in the SD physical layer specifications v.1.0 • Full compliance with SDIO command/response sets as defined in the SDIO card specification v1.0 • Flexible architecture, allowing support for new command structure SPRS231E December 2003 − Revised December 2005 Functional Overview • Built-in 64-byte FIFO for buffered read or write • 16-bit-wide access bus to maximize bus throughput • Designed for low power • Wide interrupt capability • Programmable clock generation • Two DMA channels NOTE: The MMC/SDIO1 interface includes all the MMC/SDIO pins except the direction controls (data and control). 3.6.10 MPUIO Interface The MPUIO feature allows communication with an external device through as many as 16 MPUIOs. These MPUIOs can be configured on a pin-by-pin basis as inputs or outputs. When configured as input, each MPUIO can be individually selected to generate interrupts on a level change (rising or falling edge). In normal operation, the MPUIO inputs are latched at the falling edge of 32 kHz. In event capture mode, one of the MPUIO inputs can be assigned a clock source, and all the other inputs are latched on its falling edge. The polarity can be configured with the MPUIO_INT_EDGE_REG register. The MPUIO module functional clock domain is clocked by the OMAP5912 32-kHz clock. This clock is always fed into the block, regardless of the state of the chip (awake, asleep, or idle). This allows external event latching and interrupt generation even when the system is in idle mode, to wake up the system via interrupt. The MPUIO module interfaces with the host through a TIPB bus. The MPU peripheral clock resynchronizes register access to the module and avoids time-out on the TIPB bus caused by the functional clock being too slow. 3.6.11 LED Pulse Generators (LPG) There are two separate LED pulse generator (LPG) modules. Each LPG module provides an output for an indication LED. The blinking period is programmable between 152 ms and 4 s or the LED can be switched on or off permanently. 3.6.12 Frame Adjustment Counter (FAC) The frame adjustment counter (FAC) is a simple peripheral that counts the number of rising edges of one signal (start of frame interrupt of the USB function) during a programmable number of rising edges of a second signal (transmit frame synchronization of McBSP2). The FAC may only be used with these specific USB Function and McBSP2 signals. The count value can be used by system-level software to adjust the duration of the two time domains with respect to each other to reduce overflow and underflow. If the data being transferred is audio data, this module can be part of a solution that reduces pops and clicks. The FAC module generates one second-level interrupt to the MPU. December 2003 − Revised December 2005 SPRS231E 177 Functional Overview 3.6.13 Operating System (OS) Timer A programmable interval timer is required to generate a periodic interrupt, also called system clock tick, to the OS. This is used to keep track of the current time and to control the operation of device drivers. Key functions are: 178 • Read current value of the timer • Generate interrupt as the timer down-counts to zero • Reset the interrupt by writing an 1 to the interrupt bit in the control register • Timer interrupt period: Irq_rate = (Tick_value_reg + 1) / 32768 • Maximum tick value register is 0xFFFF, so maximum timer interrupt period is 2 sec. SPRS231E December 2003 − Revised December 2005 Functional Overview 3.7 DSP Public Peripherals Peripherals on the DSP Public Peripheral bus are directly accessible by the DSP and DSP DMA. These peripherals may also be accessed by the MPU and System DMA Controller via the MPUI interface. The MPUI interface must be properly configured to allow this access. 3.7.1 Multichannel Buffered Serial Ports (McBSP1 and 3) The multichannel buffered serial port (McBSP) provides a high-speed, full-duplex synchronous serial port that allows direct interface to audio codecs and various other system devices. The DSP public peripheral bus has access to two McBSPs: McBSP1 and McBSP3. NOTE: All of the standard McBSP pins are not necessarily available on every McBSP on the OMAP5912 devices. In the case of the two DSP McBSPs, the following pins are available: McBSP1 pins: • CLKX (data bit clock) • FSX (data bit frame sync) • DX and DR (transmit and receive data) • CLKS (external reference to sample rate generator) McBSP3 pins: • CLKX (transmit clock) • FSX (transmit frame sync) • DX and DR (transmit and receive data) CLKX and FSX of McBSP1 and McBSP3 are used for both transmitting and receiving. The functional clock to the McBSP1 and McBSP3 is fixed at the OMAP5912 base operating frequency (12, 13, or 19.2 MHz). The bit-clock rate for these McBSPs is therefore limited to 6, 6.5, or 9.6 MHz (one half the base frequency). Only McBSP1 has the CLKS pin available. If the sample rate generator (SRG) is used on McBSP1, the reference clock to the SRG can be configured to be either an external reference provided on the CLKS pin, or the internal base (12, 13, or 19.2-MHz) device clock. However, if the SRG is used on McBSP3, the only reference clock available to this SRG is the base device clock as clock reference. December 2003 − Revised December 2005 SPRS231E 179 Functional Overview 3.7.2 Multichannel Serial Interfaces (MCSI1 and 2) The MCSI provides a flexible serial interface with multichannel transmission capability. The MCSI allows the DSP to access a variety of external devices, such as audio codecs and other types of analog converters. The DSP public peripheral bus has access to two MCSIs: MCSI1 and MCSI2. These MCSIs provide full-duplex transmission and master or slave clock control. All transmission parameters are configurable to cover the maximum number of operating conditions. The MCSIs have the following features: • − Programmable transmitter clock frequency in master mode of up to one half the OMAP5912 base frequency (12,13, or 19.2 MHz) − Receiver clock frequency in slave mode of up to the base frequency (12,13, or 19.2 MHz) • Single-channel or multichannel (x16) frame structure • Programmable word length: 3 to 16 bits • Full-duplex transmission • Programmable frame configuration • 180 Master or slave clock control (transmitter clock and frame synchronization pulse) − Continuous or burst transmission − Normal or alternate framing − Normal or inverted frame and clock polarities − Short or long frame pulse − Programmable oversize frame length − Programmable frame length Programmable interrupt condition (TX and RX) − Error detection with interrupt generation on wrong frame length − System DMA support for both TX and RX data transfers SPRS231E December 2003 − Revised December 2005 Functional Overview 3.8 Shared Peripherals The shared peripherals are connected to both the MPU Public Peripheral bus and the DSP Public Peripheral bus. Connections are achieved via a TI Peripheral Bus Switch, which must be configured to allow MPU or DSP access. The other shared peripherals have permanent connections to both public peripheral buses, although read and write accesses to each peripheral register may differ. 3.8.1 Mailbox Registers Four sets of shared mailbox registers are available for communication between the DSP and MPU: • • Two reads/writes accessible by the MPU, read-only by the DSP Two reads/writes accessible by the DSP, read-only by the MPU Each mailbox is implemented with 2 × 16-bit registers. When a processor writes to a register, it generates an interrupt; this interrupt is released by a read access by the other processor. These registers are discussed further in Section 3.12, Interprocessor Communication. 3.8.2 General-Purpose Timers OMAP5912 consists of eight 32-bit timers with the following features: • Counter timer with compare and capture modes • Autoreload mode • Start-stop mode • Programmable divider clock source • 16-/32-bit addressing • On-the-fly read/write registers • Interrupts generated on overflow and compare • Interrupt enable • Wake-up enable • Write posted mode • Dedicated input trigger for capture mode and dedicated output trigger/PWM signal Each timer module contains a free-running upward counter with autoreload capability on overflow. The timer counter can be read and written on-the-fly (while counting). The timer module includes compare logic to allow interrupt event on programmable counter matching value. A dedicated output signal can be pulsed or toggled on overflow and match event. This offers timing stamp trigger signal or PWM (pulse width modulation) signal sources. A dedicated input signal can be used to trigger automatic timer counter capture and interrupt event, on programmable input signal transition type. A programmable clock divider (prescaler) allows reduction of the timer input clock frequency. All internal timer interrupt sources are merged into one module interrupt line and one wake-up line. Each internal interrupt sources can be independently enabled/disabled with a dedicated bit of the TIER register for the interrupt features and a dedicated bit of TWER for the wake-up. December 2003 − Revised December 2005 SPRS231E 181 Functional Overview Each timer has three possible clock sources: • the 32-kHz clock • the system clock • an external clock source NOTE: • Three of the eight dual-mode timer PWM outputs are connected at OMAP5912 I/Os. Two of the eight dual-mode timer input capture are connected at OMAP5912 I/Os. The system clock can come either from OMAP or directly from the input clock. • Can wake up the system when the clock is configured as 32-kHz through its own interrupt through a general-purpose timer 3.8.3 Serial Port Interface (SPI) The serial port interface is a bidirectional, four-line interface with: • the clock used to shift-in and shift-out data • the device enable • the data input • the data output This serial port interface is based on a looped shift-register, thus allowing both transmit and receive modes. It can operate either in master or slave mode, using MPU or DMA control. In master mode, the SPI provides up to four chip-selects for external devices. In slave mode, the SPI has its own chip-select. In master mode, the maximum SPI data rate is the same as the system clock frequency; in slave mode, the clock of the serial data out is provided by an external device at lower data rate. 3.8.4 Universal Asynchronous Receiver/Transmitter (UART) The OMAP5912 includes three universal asynchronous receiver/transmitter (UART) peripherals which are accessible on the DSP public and MPU public peripheral buses. All three UARTs are standard 16C750-compatible UARTs implementing an asynchronous transfer protocol with various flow control options. UART1 and UART3 can function as general UART or can optionally function as IrDA interface. NOTE: Unlike dual-mode timers, the UART is a “dynamically” shared peripheral and does not have any configuration (switch) register. The clock source for the UART1 and UART3 is: • APLL output The clock source for the UART2 can be: • system clock or the sleep clock • APLL output The main features of the UART peripherals include: 182 • Selectable UART/autobaud modes • Dual 64-entry FIFOs for received and transmitted data payload SPRS231E December 2003 − Revised December 2005 Functional Overview • Programmable and selectable transmit and receive FIFO trigger levels for DMA and interrupt generation • Programmable sleep mode • Complete status-reporting capabilities in both normal and sleep mode • Frequency prescaler values from 0 to 65535 to generate the variable baud rates • Baud rate from 300 bits/s up to 1.5M bits/s • Autobauding between 1200 bits/s and 115.2K bits/s • Software/hardware flow control • − Programmable XON/XOFF characters − Programmable auto-RTS and auto-CTS Programmable serial interface characteristics − 5-, 6-, 7-, or 8-bit characters − Even-, odd-, or no-parity bit generation and detection − 1, 1.5, or 2 stop-bit generation − False start bit detection − Line break generation and detection • Internal test and loopback capabilities • Modem control functions (CTS, RTS, DSR, DTR) NOTE: DSR and DTR are not available on UART2. The key features of the IrDA mode (UART1 and 3) are: • Support of slow infrared (SIR) configuration (baud rate up to 115.2Kbauds) • Support of medium infrared (MIR) configuration (baud rate 0.576Mbits/s, and 1.152Mbits/s in the following range [1.1508Mbits/s to 1.1532Mbits/s]) • Support of fast infrared (FIR) configuration (baud rate at 4Mbauds, the effective frequency baud rate is 8Mbits/s in the following range [7.9992Mbits/s to 8.0008Mbits/s]) • Frame formatting: addition of variable xBOF characters and EOF characters • Uplink/downlink CRC generation/detection • Asynchronous transparency (automatic insertion of break character) • 8-entry status FIFO available to monitor frame length and frame errors December 2003 − Revised December 2005 SPRS231E 183 Functional Overview 3.8.5 I 2C Master/Slave Interface The I2C peripheral provides an interface between a local host (LH) (e.g., MPU, DSP or system DMA) and I2C-bus compatible devices. External components can serially transmit/receive up to 8 bits of data to/from the LH device through the I2C interface. The I2C peripheral supports multimaster mode, which allows multiple devices to control the bus. Each I2C device is recognized by a unique address and can operate as either transmitter or receiver, depending on its function. Furthermore, the device connected to the I2C bus can also be considered a master or a slave when performing data transfers. A master device generates the clock signals to initiate a data transfer. A slave device is addressed by this master during the data transfer. The I2C interface with the local host is compliant with 8-/16-bit OCP protocol. The interface clock and the functional clock are independent. The I2C master/slave interface supports the following features: • Compliant to Philips I2C-bus specification version 2.1 • Support standard mode (up to 100K bits/s) and fast mode (up to 400K bits/s) • In the master only I2C operating mode of OMAP5912, standard mode is supported up to 83K bits/s. • 7-bit and 10-bit device addressing modes • General call • Start/restart/stop • Multimaster transmitter/slave receiver mode • Multimaster receiver/slave transmitter mode • Combined master transmit/receive and receive/transmit mode • Built-in FIFO for buffered read or write • Module enable/disable capability • Programmable clock generation • Two DMA channels The I2C master/slave interface does not support the following features: • High-speed (HS) mode for transfer rates up to 3.4M bits • C-bus compatibility mode 3.8.6 Multichannel Buffered Serial Port (McBSP2) The multichannel buffered serial port (McBSP) provides a high-speed, full-duplex serial port that allows direct interface to audio codecs, and various other system devices. The McBSP provides: 184 • Full-duplex communication • Double-buffer data registers, which allow a continuous data stream • Independent framing and clocking for receive and transmit SPRS231E December 2003 − Revised December 2005 Functional Overview In addition, the McBSP has the following capabilities: • Direct interface to: − T1/E1 framers − MVIP switching-compatible and ST-BUS compliant devices − IOM-2 compliant device − AC97-compliant device − I2S-compliant device − Serial peripheral interface (SPI) • Multichannel transmit and receive of up to 128 channels per frame • A variety of data sizes, including: 8, 12, 16, 20, 24, or 32 bits • µ-law and A-law companding • Programmable polarity for both frame synchronization and data clocks • Programmable internal clock and frame generation NOTE: All of the standard McBSP signals are not necessarily available on every McBSP on the OMAP5912 device. In the case of the MPU McBSP2, the following pins are available: • CLKX and CLKR (transmit and receive clocks) • FSX and FSR (transmit and receive frame syncs) • DX and DR (transmit and receive data) The functional clock to the McBSP2 peripheral is configurable to the DPLL clock rate with a divider of 1, 2, 4, or 8. McBSP2 does not have a CLKS external clock reference pin. Therefore, if the McBSP2 sample rate generator (SRG) is used, the only reference clock available to the SRG is a programmable clock from the MPU domain. 3.8.7 Multimedia Card/Secure Digital (MMC/SDIO2) Interface The MMC/SDIO2 host controller provides an interface between OMAP5912 and MMC/SD/SDIO memory cards, and handles MMC/SD transactions with minimum local host intervention. The following combinations of external devices are supported: • One or more MMC memory cards sharing the same bus • One single SD memory card or SDIO card The application interface is responsible for managing transaction semantics; the MMC/SDIO2 host controller deals with MMC/SDIO protocol at transmission level, packing data, adding CRC, start/end bit and checking for syntactical correctness. SD mode wide bus width is also supported (1- or 4-bit data lines). The application interface can send every MMC/SDIO command and either poll for the status of the adapter or wait for an interrupt request, which is sent back in case of exceptions or to warn for end of operations. The application interface can read card responses or flag register. It can also mask individually interrupt sources. All these operations can be performed reading and writing control registers. The MMC/SDIO2 peripheral also supports two DMA channels. December 2003 − Revised December 2005 SPRS231E 185 Functional Overview The main features of the MMC/SDIO2 module are: • Full compliance with MMC command/response sets as defined in the MMC standard specifications v.3.1 • Full compliance with SD command/response sets as defined in the SD physical layer specifications v.1.0 • Full compliance with SDIO command/response sets as defined in the SDIO card specification v1.0 • Flexible architecture, allowing support for new command structure • Built-in 64-byte FIFO for buffered read or write • 16-bit-wide access bus between MMC/SDIO2 interface and the local hosts to maximize bus throughput • Designed for low power • Wide interrupt capability • Programmable clock generation • Two DMA channels • The MMC2 provides auxiliary signals for external level shifters. MMC2.CMDDIR indicates the direction of the MMC2.CMD signal. MMC2.DATDIR0 and MMC2.DATDIR1 indicate the direction of the MMC2.DAT0 signal and MMC2.DAT[3:1] signals, respectively. NOTE: • The MMC/SDIO2 clock is multiplexed between the 48-MHz clock (APLL output) and the system clock (19.2 MHz or 12 MHz). • At reset, the MMC/SDIO2 clock selection is the system clock. • The MMC/SDIO2 module is routed at the OMAP5912 level. The OMAP5912 configuration selects only the part of the interface which is required. 3.8.8 General-Purpose I/O (GPIO) OMAP5912 includes 4 GPIO peripherals of 16 GPIO pins each. There are up to 64 shared GPIO pins. Each GPIO pin is independently configurable as either input or output. If configured as input, each pin can be configurable to generate an interrupt upon detection of its signal level change. As both the MPU and the DSP can access the GPIO, consideration must be taken for its arbitration. The general-purpose input/output (GPIO) peripheral can be used for the following types of applications: • Input/output data • Generation of an interrupt in active mode upon the detection of external events • Generation of a wake-up request in idle mode upon the detection of external events 3.8.9 32-kHz Synchro Counter This is a 32-bit simple counter, clocked by the falling edge of the 32-kHz clock. It is reset while the Power Up Reset (PWRON_RESET) primary I/O is active (main OMAP5912 reset), then on the rising edge of PWRON_RESET (PWRON_RESET release), it starts to count indefinitely. When the highest value is reached, it wraps back to zero and starts running again. MPU and DSP have the capability to read the count value at higher frequency from the peripheral interface. The MPU can read it from a 32-bit peripheral access, whereas the DSP can only access it through two consecutive 16-bit accesses. 186 SPRS231E December 2003 − Revised December 2005 Functional Overview 3.9 System DMA Controller The system direct memory access (DMA) controller transfers data between points in the memory space without intervention by the MPU. The system DMA allows movements of data to and from internal memory, external memory, and peripherals to occur in the background of MPU operation. It is designed to off-load the block data transfer function from the MPU processor. The system DMA is configured by the MPU via the MPU private peripheral bus. System DMA consists of: • Seventeen logical channels • Seven physical ports + one for configuration • Four physical channels The ports are connected to the L3 OCP targets, the external memory, the TIPB bridge, the MPUI, and one dedicated port connected to an LCD controller. The system DMA controller can be controlled via the MPU private TIPB or by an external host via the OCP-I port. The system DMA controller is designed for low-power operation. It is partitioned into several clock domains where each clock domain is enabled only when it is used. All clocks are disabled when no DMA transfers are active (synchronous to the MPU TIPB, this feature is totally under hardware control; no specific programming is needed). Five different logical channels types are supported; each one represents a specific feature set: • LCh-2D for memory-to-memory transfers, 1D and 2D • LCh-P for peripheral transfers • LCh-PD for peripheral transfers on a dedicated channel • LCh-G for graphical transfers/operations • LCh-D for display transfers The available features are: • Support for up to four address modes: − Constant − Post-increment − Single indexing − Double indexing • Different indexing for source-respective destination • Logical channel chaining • Software triggering • Hardware triggering • Logical channel interleaving • Logical channel preemption • Two choices of logical channel arbitration of physical resources: round robin or fixed • Two levels of logical channel priority • Constant fill • Transparent copy • Rotation 0, 90, 180, and 270 December 2003 − Revised December 2005 SPRS231E 187 Functional Overview There are seven ports enabling: • Memory-to-memory transfers • Peripheral-to-memory transfers • Memory-to-peripheral transfers • Peripheral-to-peripheral transfers • Binary backward-compatible by default configuration • Up to four logical channels active in parallel The logical channel dedicated to the display, LCh-D, has several additional features: • Channel can be shared by two LCD controllers • Supports both single- and dual-block modes • Supports separate indexing and numbering for dual-block mode for both elements and frames 3.10 DSP DMA Controller The DSP subsystem has its own dedicated DMA controller, which is entirely independent of the MPU or the system DMA controller. The DSP DMA controller has many of the same major features as the system DMA controller. The DSP DMA Controller has six generic channels and five physical ports available for source or destination data. These five ports are the SARAM port, DARAM port, EMIF (external memory port), DSP TIPB port, and MPUI port. The DSP may configure the DSP DMA controller to transfer data between the SARAM, DARAM, EMIF, and TIPB ports; but the MPUI port is a dedicated port used for MPU or system DMA initiated transfers to DSP subsystem resources. The SARAM and DARAM ports are used to access local DSP memories and the TIPB port is used to access the registers of the DSP peripherals. The EMIF port of the DSP DMA controller is used to access the Traffic Controller via the DSP MMU (Memory Management Unit). 3.11 Traffic Controller (Memory Interfaces) The traffic controller (TC) manages all accesses by the MPU, DSP, system DMA, and local bus to the OMAP5912 system memory resources. The TC provides access to three different memory interfaces: external memory interface slow (EMIFS), external memory interface fast (EMIFF), and internal memory interface (OCP T1). The OCP T1 allows access to the 250K bytes of on-chip frame buffer. The EMIFS provides 16-bit-wide access to asynchronous or synchronous memories or devices. The EMIFF provides 16-bit-wide access to SDR, mobile SDR, and mobile DDR memories. The TC provides the functions of arbitrating contending accesses to the same memory interface from different initiators (MPU, DSP, system DMA, local bus), synchronization of accesses due to the initiators and the memory interfaces running at different clock rates, and the buffering of data allowing burst access for more efficient multiplexing of transfers from multiple initiators to the memory interfaces. The TC architecture allows simultaneous transfers between initiators and different memory interfaces without penalty. For instance, if the MPU is accessing the EMIFF at the same time the DSP is accessing the IMIF, transfers may occur simultaneously since there is no contention for resources. There are three separate ports to the TC from the system DMA (one for each of the memory interfaces), allowing for greater bandwidth capability between the system DMA and the TC. 188 SPRS231E December 2003 − Revised December 2005 Functional Overview 3.12 Interprocessor Communication Several mechanisms allow for communication between the MPU and the DSP on the OMAP5912 device. These include mailbox registers, MPU Interface, and shared memory space. 3.12.1 MPU/DSP Mailbox Registers The MPU and DSP processors can communicate with each other via a mailbox-interrupt mechanism. There are four sets of mailbox registers located in public TIPB space. The registers are shared between the two processors, so the MPU and DSP may both access these registers within their own public TIPB space, but read/write accessibility of each register is different for each processor. There are four sets of mailbox registers: two for the MPU to send messages and issue an interrupt to the DSP, the other two for the DSP to send messages and issue an interrupt to the MPU. Each set of mailbox registers consists of two 16-bit registers and a 1-bit flag register. The interrupting processor can use one 16-bit register to pass a data word to the interrupted processor and the other 16-bit register to pass a command word. Communication is achieved when one processor writes to a command-word register, which causes an interrupt to the other processor and sets the corresponding flag register. The interrupted processor acknowledges by reading the command word, which also clears the flag register. A data-word register is also available in each mailbox register for optional 16-bit data. The information communicated by the command and data words are entirely user-defined. The data word can be optionally used to indicate an address pointer or status word. 3.12.2 MPU Interface (MPUI) The MPU interface (MPUI) allows the MPU and the system DMA controller to communicate with the DSP and its peripherals. The MPUI allows access to the full memory space (16M bytes) of the DSP and the DSP public peripheral bus. Thus, the MPU and system DMA controller both have read and write access to the complete DSP I/O space (128K bytes), including the control registers of the DSP public peripherals. The MPUI port supports the following features: • Four access modes: − Shared-access mode (SAM) for MPU access of DSP SARAM, DARAM, and external memory interface − Shared-access mode (SAM) for peripheral bus access − Host-only mode (HOM) for SARAM access − Host-only mode (HOM) for peripheral bus access • Interrupt to MPU if access time-out occurs • Programmable priority scheme (MPU versus DMA) • Packing and unpacking of data (16 bits to 32 bits, and vice versa) • 32-bit single-access support • Software control endianism conversion • System DMA capability to full memory space (16M bytes) • System DMA capability to the DSP public TIPB peripherals (up to 128K bytes space) This port can be used for many functions, such as: MPU loading of program code into DSP program memory space, sharing of data between MPU and DSP, implementing interprocessing communication protocols via shared memory, or allowing MPU to use and control DSP public TIPB peripherals. December 2003 − Revised December 2005 SPRS231E 189 Functional Overview 3.12.3 MPU/DSP Shared Memory The OMAP5912 implements a shared memory architecture via the traffic controller. Therefore, the MPU and DSP both have access to the shared SRAM (250K bytes) as well as to the EMIFF and EMIFS memory space. Through the DSP memory management unit (MMU), the MPU controls which regions of shared memory space the DSP is allowed to access. By setting up regions of shared memory, and defining a protocol for the MPU and DSP to access this shared memory, an interprocessor communication mechanism may be implemented. This method can be used in conjunction with the mailbox registers to create handshaking interrupts that properly synchronize the MPU and DSP accesses to shared memory. Utilizing the shared memory in this fashion may be useful when the desired data to be passed between the MPU and DSP is larger than the two 16-bit words provided by each set of mailbox command and data registers. For example, the MPU may need to provide the DSP with a list of pointers to perform a specific task as opposed to a single command and single pointer. Using shared memory and the mailboxes, the DSP can read the list of pointers from shared memory after receiving the interrupt caused by an MPU write to the mailbox command register. 3.13 DSP Hardware Accelerators The TMS320C55x DSP core within the OMAP5912 device utilizes three powerful hardware accelerator modules which assist the DSP core in implementing specific algorithms that are commonly used in video compression applications such as MPEG4 encoders/decoders. These accelerators allow implementation of such algorithms using fewer DSP instruction cycles and dissipating less power than implementations using only the DSP core. The hardware accelerators are utilized via functions from the TMS320C55x Image/Video Processing Library available from Texas Instruments. Utilizing the hardware accelerators, the Texas Instruments Image/Video Processing Library implements many useful functions, which include the following: • Forward and Inverse Discrete Cosine Transform (DCT) (used for video compression/decompression) • Motion Estimation (used for compression standards such as MPEG video encoding and H.26x encoding) • Pixel Interpolation (enabling high-performance fractal-pixel motion estimation) • Quantization/Dequantization (useful for JPEG, MPEG, H.26x Encoding/Decoding) • Flexible 1D/2D Wavelet Processing (useful for JPEG2000, MPEG4, and other compression standards) • Boundary and Perimeter Computation (useful for Machine Vision applications) • Image Threshold and Histogram Computations (useful for various Image Analysis applications) 3.13.1 DCT/iDCT Accelerator The DCT/iDCT hardware accelerator is used to implement Forward and Inverse DCT (Discrete Cosine Transform) algorithms. These DCT/iDCT algorithms can be used to implement a wide range of video compression standards including JPEG Encode/Decode, MPEG Video Encode/Decode, and H.26x Encode/Decode. 3.13.2 Motion Estimation Accelerator The Motion Estimation hardware accelerator implements a high-performance motion estimation algorithm, enabling MPEG Video encoder or H.26x encoder applications. Motion estimation is typically one of the most computation-intensive operations in video-encoding systems. 3.13.3 Pixel Interpolation Accelerator The Pixel Interpolation Accelerator enables high-performance pixel-interpolation algorithms, which allows for powerful fractal pixel motion estimation when used in conjunction with the Motion Estimation Accelerator. Such algorithms provide significant improvement to video-encoding applications. 190 SPRS231E December 2003 − Revised December 2005 Functional Overview 3.14 Power Supply Connection Examples 3.14.1 Core and I/O Voltage Supply Connections The OMAP5912 device is flexible regarding the implementation of the core and I/O voltage supplies of the device. In a typical system, all of the core voltage supplies (CVDDx) may be connected together and powered from one common supply. Likewise, all of the I/O voltage supplies (DVDDx) may be connected together and powered from a common supply. Figure 3−4 illustrates this common system configuration. OMAP5912 1.5-V Voltage Supply CVDD CVDD1 CVDD2 CVDD3 CVDDA CVDDRTC CVDDDLL 2.75-V Voltage Supply DVDD1 DVDD2 DVDD3 DVDD4 DVDD5 DVDD6 DVDD7 1.8-V Voltage Supply DVDD8 DVDD9 DVDDRTC VSS NOTE: In this example, SDRAM (DVDD4) and FLASH (DVDD5) I/O voltage supplies are connected to 1.8 V and the other I/O voltage supplies are connected to 2.75 V. Each I/O voltage supply (DVDDx) can be configured to either 1.8 V or 2.75 V nominal with corresponding bits in the VOLTAGE_CTRL_0 register. Figure 3−4. Supply Connections for a Typical System In the previous example, all CVDDx pins are connected in common. However, the OMAP5912 has dedicated CVDD pins that supply power to different sections of the chip. This feature can be useful in prototyping phases to troubleshoot power management features and perform advanced power analysis. By isolating each CVDDx bus from the power source through isolation jumpers or current sense resistors, the current draw into different domains may be measured separately. This type of supply isolation must only be done during prototyping as production system designs should connect all the CVDDx pins together, preferably to a common board plane. NOTE: There is no specific power sequencing for the different voltage supplies as long as all CVDDx and DVDDx voltages are ramped to valid operating levels within 500 ms of one another. Additionally, if certain I/O pins are unused in a specific system application, the DVDDx supply pins that power these I/O must still be connected to valid operating voltage levels. December 2003 − Revised December 2005 SPRS231E 191 Functional Overview 3.14.2 Core Voltage Noise Isolation Two CVDD pins on OMAP5912, CVDDA and CVDDDLL, are dedicated to supply power for the ULPD APLL and for the DLL elements of the DDR interface, respectively. In addition to using sound board design principles, these dedicated pins allow for added supply noise isolation circuitry to enable maximum performance. An example circuit is shown in Figure 3−5. OMAP5912 System Clock Oscillator# VSS‡§ ULPD APLL DLLs (DDR) OMAP DPLL LDO CVDDA CVDDDLL‡ CVDDX§ LDO.FILTER¶ C1 100 nF R1 10 W C3 1 mF Voltage Regulator† C2 100 nF R2 10 W NOTES: A. This circuit is provided only as an example. Specific board layout implementation must minimize noise on the OMAP5912 voltage supply pins. B. Unless otherwise noted in this document, all VSS pins on the OMAP5912 are common and must be connected directly to a common ground; however, the discrete capacitor in the RC filter circuit should be placed as close as possible to the VSS pins [ZZG balls AA21 (or W20) and A13; ZDY/GDY balls L7 (or L11) and F6]. C. For special consideration with respect to the connection of VSS pin (ZZG ball Y13; ZDY/GDY ball H8), refer to Section 5.5.1, 32-kHz Oscillator and Input Clock. † The voltage regulator must be selected to provide a voltage source with minimal low frequency noise. ‡ If a dedicated voltage regulator is not available for CV DDDLL in the system, a simple low-pass RC filter can be used to isolate the cells from the switching noise of other digital circuits. § Common CV DD for rest of chip. ¶ A regulated supply is delivered to DPLL macro(s) and available on unique bond pad. A decoupling capacitor of 1 µF must be connected externally between the pin called LDO. FILTER (ZZG ball J1; ZDY/GDY ball H1) and the ground. # System clock oscillator frequency = 12, 13, or 19.2 MHz. Figure 3−5. External RC Circuits for Noise Isolation 192 SPRS231E December 2003 − Revised December 2005 Documentation Support 4 Documentation Support Extensive documentation supports all OMAP platform of devices from product announcement through applications development. The following types of documentation are available to support the design and use of the OMAP platform of applications processor devices: • Device-specific data sheets • Development-support tools • Hardware and software application reports A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal processing research and education. The TMS320 DSP newsletter, Details on Signal Processing, is published quarterly and distributed to update TMS320 DSP customers on product information. Information regarding Texas Instruments (TI) OMAP and DSP products is also available on the Worldwide Web at http://www.ti.com uniform resource locator (URL). 4.1 Device and Development-Support Tool Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all OMAP devices and support tools. Each OMAP commercial family member has one of three prefixes: X, P, or Null (e.g., XOMAP-DM270MGVL-B). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (X/TMDX) through fully qualified production devices/tools (Null/TMDS). Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device’s electrical specifications P Final silicon die that conforms to the device’s electrical specifications but has not completed quality and reliability verification Null Fully-qualified production device Support tool development evolutionary flow: TMDX Development support product that has not yet completed Texas Instruments internal qualification testing. TMDS Fully qualified development support product X and P devices and TMDX development-support tools are shipped against the following disclaimer: “Developmental product is intended for internal evaluation purposes.” Null devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI’s standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. December 2003 − Revised December 2005 SPRS231E 193 Documentation Support The device revision can be determined by the symbols marked on the top of the ZDY package as shown in Figure 4−1. Some prototype devices may have markings different from those shown in Figure 4−1 with the device name in the following format: aOMAP5912xxx where a = product level and xxx = package designator. $ = Internal TI Designator # = Revision Number YMZLLLS = Internal TI Designator OMAP(TM) OMAP5912ZDY $#−YMZLLLS NOTE: Qualified devices are marked with no prefix at the beginning of the device name, while nonqualified devices are marked with the letter X at the beginning of the device name. Figure 4−1. Example Markings for OMAP5912 ZDY Package 4.2 Differences Between Production and Experimental Devices The XOMAP5912 and POMAP5912 devices included some peripherals and functions that are not available on the OMAP5912 production silicon. See Table 4−1 for a list of the differences in peripherals. For more information, see the following reference guides: • OMAP5912 Multimedia Processor OMAP3.2 Subsystem Reference Guide (literature number SPRU749) • OMAP5912 Multimedia Processor Initialization Reference Guide (literature number SPRU752) • OMAP5912 Multimedia Processor Power Management Reference Guide (literature number SPRU753) • OMAP5912 Multimedia Processor Direct Memory Access (DMA) Support Reference Guide (literature number SPRU755) • OMAP5912 Multimedia Processor Camera Interface Support Reference Guide (literature number SPRU763) • OMAP5912 Multimedia Processor Display Interface Support Reference Guide (literature number SPRU764) Table 4−1. Changes to the OMAP5912 XOMAP5912 OR POMAP5912 SUPPORTED OMAP5912 Compact Flash Peripheral Yes No Compact Flash Peripheral SOSSI Peripheral Yes No SOSSI Peripheral VLYNQ Peripheral Yes No VLYNQ Peripheral CCP Peripheral Yes No CCP Peripheral EMIFF DDR interface provides the same performance as SDR Yes Yes EMIFF DDR interface runs at full DDR performance. New register bits and configuration information added in SPRU749. Camera interface connected via TIPB bus Yes Yes Camera interface connected via OCP bus. Performance improvement and new registers added in SPRU763. LCD Interface Yes Yes LCD interface additional register bits added in SPRU764. Only General Purpose (Mode 0) is supported Yes Yes Only General Purpose (Mode 0) is supported 194 SPRS231E December 2003 − Revised December 2005 Documentation Support Table 4−1. Changes to the OMAP5912 (Continued) XOMAP5912 OR POMAP5912 SUPPORTED OMAP5912 MMC SPI mode No No MMC SPI mode Stacked DDR No No Stacked DDR SSI, SST, SSR, STI, GDD No No SSI, SST, SSR, STI, GDD eFUSE, effuses No No eFUSE, effuses Windows tracer No No Windows tracer Mode 1 and 2, high security No No Mode 1 and 2, high security Emulation devices No No Emulation Devices December 2003 − Revised December 2005 SPRS231E 195 Electrical Specifications 5 Electrical Specifications This section provides the absolute maximum ratings and the recommended operating conditions for the OMAP5912 device. All electrical and switching characteristics in this data manual are valid over the recommended operating conditions unless otherwise specified. 5.1 Absolute Maximum Ratings The list of absolute maximum ratings are specified over operating case temperature. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Section 5.2, Recommended Operating Conditions, is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All supply voltage values (core and I/O) are with respect to VSS. This section provides the absolute maximum ratings for the OMAP5912 device. Supply voltage range (core), CVDD, CVDD2, CVDDA,CVDDRTC, CVDDDLL . . . . . . . . . . . . . . . . . . −0.5 V to 2.1 V Supply voltage range (I/O), DVDD1/2/3/4/5/6/7/8/9/RTC, 1.8 V nominal . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 2.1 V 2.75 V and 3.3 V nominal . . . . . . . . . . . . . −0.5 V to 4.2 V Input voltage range, VI (12, 13, or 19.2 MHz and 32-kHz oscillator) . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 2.1 V Input voltage range, VI (standard LVCMOS), 1.8 V nominal . . . . . . . . . . . . . . −0.5 V to (2.1 or DVDD + 0.5)† V 2.75 V and 3.3 V nominal . . . . −0.5 V to (4.2 or DVDD + 0.5)† V Input voltage range, VI (USB transceivers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to DVDD + 0.5 V Input voltage range, VI (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to 4.5 V Output voltage range, VO (standard LVCMOS), 1.8 V nominal . . . . . . . . . . . . −0.5 V to (2.1 or DVDD + 0.5)† V 2.75 V and 3.3 V nominal . . −0.5 V to (4.2 or DVDD + 0.5)† V Output voltage range, VO (USB transceivers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to DVDD + 0.5 V Output voltage range, VO (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.5 V Operating temperature range, TC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Max voltage is the lower value of the two expressions 196 SPRS231E December 2003 − Revised December 2005 Electrical Specifications 5.2 Recommended Operating Conditions CVDD1/2/3/RTC OMAP5912 supply voltage, core†‡ MIN NOM MAX Low-power standby mode§ 1.05 1.1 1.21 Active mode 1.525 1.6 1.65 UNIT V CVDDA Supply voltage for analog PLL 1.525 1.6 1.65 V CVDDDLL Core supply voltage for the DDR interface digitally controlled delay element (DCDL)¶ 1.525 1.6 1.65 V Device supply voltage, I/O‡ Low-voltage range# 1.65 1.8 1.95 DVDD1/2/3/4/5/6/7/8/9/RTC range# 2.5 2.75 or 3.3 3.6 Internal USB transceiver not used 1.65 1.8 1.95 3 3.3 3.6 DVDD2 Device supply voltage, I/O CVDD − DVDD Device supply voltage difference|| DVDD − CVDD difference|| LDO.FILTERk Vss Device supply voltage Internal DPLL and 12, 13, or 19.2-MHz oscillator supply voltageh High-voltage Internal USB transceiver used VIH V VI Low-level input voltage, I/O Input voltage Differential input voltage V 1.21 Active mode 1.43 1.5 1.65 0 ZZG balls P9 and R8 (ZDY/GDY balls T2 and U1) are not used for USB differential voltage ZZG balls P9 and R8 (ZDY/GDY balls T2 and U1) are used for USB V V 2 0.3 DVDD ZZG balls P9 and R8 (ZDY/GDY balls T2 and U1) are not used for USB differential voltage ZZG balls P9 and R8 (ZDY/GDY balls T2 and U1) are used for USB V 0.7 DVDD 0.8 0.8 V 2.5 V OSC1 and OSC32K pins VID 2.55 1.1 Standard LVCMOS VIL V 1.05 Device supply voltage, GND High-level input voltage, I/O 1.65 Low-power standby mode§ Standard LVCMOS V CVDD ±200 mV † All core voltage supplies must be tied to the same voltage level (within 50 mV). In Split-power mode (CVDDx and DVDDx = 0), RTC has to be supplied with CVDDRTC = 1.05 V min and DVDDRTC = 1.65 V min. § Low-power standby is defined as follows: the device is in deep-sleep mode and LOW_PWR = 1. The device runs from 32-kHz clock in this mode. ¶ To filter switching noises, it is recommended that an RC (R = 10 Ω, C = 100 nF) low-pass filter be implemented externally. # Corresponding DV DD mode bit must be configured in the Voltage_control_0 register. || In systems where the CV DDx and DVDDx power supplies are ramped at generally the same time (within 500 ms of one another), there are no specific power sequencing requirements for the supplies. The only sequencing requirement is that the maximum voltage difference between CVDD and DVDD is not exceeded for greater than 500 ms. Likewise, if different voltages are used for the separate DVDDx supplies, all DVDDx supplies should be ramped up to valid voltage levels within 500 ms of one another. k An external capacitor (C = 1 µF ± 10%) must be connected between LDO.FILTER and VSS to provide decoupling capacitance for the regulator. h LDO has to be powered down by setting LDO_PWRDN_CNTL[0] in OMAP5912 configuration. ‡ December 2003 − Revised December 2005 SPRS231E 197 Electrical Specifications 5.2 Recommended Operating Conditions (Continued) MIN IOH IOL TC MAX UNIT High-level output current Low-voltage range DVDDmin = 1.65 V −2 mA High-voltage range DVDDmin = 2.5 V −3 mA −18.3 mA Low-level output current Low-voltage range DVDDmin = 1.65 V 2 High-voltage range DVDDmin = 2.5 V 3 18.3-mA drive strength buffers 18.3-mA drive strength buffers Operating case temperature NOM mA 18.3 −40 85 °C † All core voltage supplies must be tied to the same voltage level (within 50 mV). In Split-power mode (CVDDx and DVDDx = 0), RTC has to be supplied with CVDDRTC = 1.05 V min and DVDDRTC = 1.65 V min. § Low-power standby is defined as follows: the device is in deep-sleep mode and LOW_PWR = 1. The device runs from 32-kHz clock in this mode. ¶ To filter switching noises, it is recommended that an RC (R = 10 Ω, C = 100 nF) low-pass filter be implemented externally. # Corresponding DV DD mode bit must be configured in the Voltage_control_0 register. || In systems where the CV DDx and DVDDx power supplies are ramped at generally the same time (within 500 ms of one another), there are no specific power sequencing requirements for the supplies. The only sequencing requirement is that the maximum voltage difference between CVDD and DVDD is not exceeded for greater than 500 ms. Likewise, if different voltages are used for the separate DVDDx supplies, all DVDDx supplies should be ramped up to valid voltage levels within 500 ms of one another. k An external capacitor (C = 1 µF ± 10%) must be connected between LDO.FILTER and VSS to provide decoupling capacitance for the regulator. h LDO has to be powered down by setting LDO_PWRDN_CNTL[0] in OMAP5912 configuration. ‡ 198 SPRS231E December 2003 − Revised December 2005 Electrical Specifications 5.3 Electrical Characteristics Over Recommended Operating Case Temperature Range (Unless Otherwise Noted) PARAMETER VOH VOL High-level output voltage Low-level output voltage Standard LVCMOS IO = rated, DVDD = 1.65 V to 3.6 V ZZG balls P9 and R8 (ZDY/GDY balls T2 and U1) are not used for USB differential voltage IO = −18.3 mA Standard LVCMOS IO = rated, DVDD = 1.65 V to 3.6 V ZZG balls P9 and R8 (ZDY/GDY balls T2 and U1) are not used for USB differential voltage IO = 18.3 mA I2C II IOZ IDDC(Q) IDDC(A) Input current TEST CONDITIONS MAX UNIT 0.8 DVDD DVDD − 0.5 0.22 DVDD 0.28 V Fast mode at 2-mA load 0 0.4 Fast mode at 3-mA load 0 0.6 Standard mode at 2-mA load 0 0.4 Low-voltage range −1 1 High-voltage range −1 1 Low-voltage range 5 10 25 High-voltage range 15 30 95 Low-voltage range 55 100 185 High-voltage range 35 67 185 Low-voltage range −25 −10 −5 High-voltage range −95 −30 −15 Low-voltage range −185 −100 −55 High-voltage range −185 −67 −35 VI = VI MAX to VI MIN Input pins with 20-µA pulldowns enabled DVDD = MAX, VI = VSS to VDD Input pins with 100-µA pulldowns enabled DVDD = MAX, VI = VSS to VDD Input pins with 20-µA pullups enabled CVDD = MAX, VI = VSS to VDD Input pins with 100-µA pullups enabled CVDD = MAX, VI = VSS to VDD Input current for outputs in high-impedance Core voltage supply current active TYP V Inputs without internal pullups/pulldowns enabled Core voltage supply current quiescent MIN µA − 20 20 Sum of CVDDx currents. (Deep sleep mode with CVDD = 1.6 V and DSP in IDLE at 25°C.) 290 Sum of CVDDx currents. (Deep sleep mode with CVDD = 1.6 V and DSP in RESET at 25°C.) 280 Sum of CVDDx† 326 µA µA A mA † ARM926 running Dhrystone algorithm and DSP runnning GSM Full Rate Vocoder in internal memory. CVDD = 1.6 V, DVDD = 3.3 V, VDD4 = 1.8 V). NOTE: These power measurements were taken at 25°C on an OMAP5912 OSK, running Dhrystone benchmark on the ARM and GSM vocoder on the DSP. These typical case numbers can vary based on board layout or application code being run. Please use this information only as a general guideline. In order to get more accurate power estimates, you should expect to do your own power measurements with your own set up and application code running. December 2003 − Revised December 2005 SPRS231E 199 Electrical Specifications 5.3 Electrical Characteristics Over Recommended Operating Case Temperature Range (Unless Otherwise Noted) (Continued) PARAMETER IDDCP(A) Core and I/O voltage supply current active TEST CONDITIONS Sum of CVDDx and DVDDx currents† VDD4 Ci Co Input capacitance Output capacitance MIN TYP MAX UNIT 393 mA 6 mA ZZG balls P9 and R8 (ZDY/GDY balls T2 and U1) (USB) 7 All other I/O pins 4 ZZG balls P9 and R8 (ZDY/GDY balls T2 and U1) (USB) 7 All other I/O pins 4 pF pF † ARM926 running Dhrystone algorithm and DSP runnning GSM Full Rate Vocoder in internal memory. CVDD = 1.6 V, DVDD = 3.3 V, VDD4 = 1.8 V). NOTE: These power measurements were taken at 25°C on an OMAP5912 OSK, running Dhrystone benchmark on the ARM and GSM vocoder on the DSP. These typical case numbers can vary based on board layout or application code being run. Please use this information only as a general guideline. In order to get more accurate power estimates, you should expect to do your own power measurements with your own set up and application code running. 200 SPRS231E December 2003 − Revised December 2005 Electrical Specifications Tester Pin Electronics 42 Ω Output Under Test 3.5 nH Transmission Line Z0 = 50 Ω (see Note) 4.0 pF Device Pin (see Note) 1.85 pF NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must be taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line effect. The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer) from the data sheet timings. Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin. Figure 5−1. 3.3-V Test Load Circuit 5.4 Timing Parameter Symbology Timing parameter symbols used in the timing requirements and switching characteristics tables are created in accordance with JEDEC Standard 100. To shorten the symbols, some of the pin names and other related terminology have been abbreviated as follows: Lowercase subscripts and their meanings: Letters and symbols and their meanings: a access time H High c cycle time (period) L Low d delay time V Valid dis disable time Z High impedance en enable time f fall time h hold time r rise time su setup time t transition time v valid time w pulse duration (width) X Unknown, changing, or don’t care level December 2003 − Revised December 2005 SPRS231E 201 Electrical Specifications 5.5 Clock Specifications This section provides the timing requirements and switching characteristics for the OMAP5912 system clock signals. 5.5.1 32-kHz Oscillator and Input Clock The 32.768-kHz clock signal (often abbreviated to 32-kHz) may be supplied by either the on-chip 32-kHz oscillator (requiring an external crystal) or an external CMOS signal. The on-chip oscillator requires an external 32.768-kHz crystal connected across the OSC32K_IN and OSC32K_OUT pins. The connection of the required circuit, consisting of the crystal and two load capacitors, is shown in Figure 5−2. The load capacitors, C1 and C2, should be chosen such that the equation below is satisfied (recommended values are C1 = C2 = 10 pF). CL in the equation is the load specified for the crystal. All discrete components used to implement the oscillator circuit should be placed as close as possible to the associated oscillator pins (OSC32K_IN and OSC32K_OUT) and to the VSS pin closest to the oscillator pins (ZZG ball Y13; ZDY/GDY ball H8). NOTE 1: Do not connect VSS (ZZG ball Y13; ZDY/GDY ball H8) to the common board ground but only to the oscillator circuit as shown. CL + OSC32K_IN C 1C 2 (C 1 ) C 2) VSS† (ZZG ball Y13) OSC32K_OUT (ZDY/GDY ball H8) Crystal 32.768 kHz C1 † C2 Do not connect VSS (ZZG ball Y13; ZDY/GDY ball H8) to the common board ground but only to the oscillator circuit as shown. Figure 5−2. 32-kHz Oscillator External Crystal NOTE 2: Recommended maximum series resistance specification of the crystal is 100 kΩ or less at 32 kHz. Series resistance at any other parasitic resonance of the crystal should be greater than 100 kΩ. For crystals whose parasitic resonance has maximum series resistor less than 100 kΩ, a PI-network (Figure 5−3) is needed between the OSC32K_OUT pin and the crystal to suppress oscillation at frequencies other than 32 kHz. The PI-network creates a pole to reduce the negative resistance at frequencies greater than 32 kHz. The recommended PI-network for use with these crystals is CPI = 10 pF total and RPI = 390 kΩ ± 5% 202 SPRS231E December 2003 − Revised December 2005 Electrical Specifications OSC32K_IN Crystal 32.768 kHz RPI C2 CPI C1 † VSS† (ZZG ball Y13) OSC32K_OUT (ZDY/GDY ball H8) Do not connect VSS (ZZG ball Y13; ZDY/GDY ball H8) to the common board ground but only to the oscillator circuit as shown. Figure 5−3. 32-kHz Oscillator External Crystal With PI-Network NOTE 3: When the internal oscillator is used to generate the 32-kHz clock, the CLK32K_IN pin must be tied to VSS. Otherwise, the 32-kHz clock is corrupted and the device fails. If the external CMOS clock is used to provide the 32-kHz clock, the OSC32K_IN (XI) pin must be tied to CVDD. The OSC32K_OUT (XO) pin must be tied to VSS. Table 5−1 shows the switching characteristics of the 32-kHz oscillator and Table 5−2 shows the input requirements of the 32-kHz clock input. Table 5−1. 32-kHz Oscillator Switching Characteristics PARAMETER TEST CONDITIONS Start-up time (from power up until oscillating at stable frequency of 32.768 kHz) MIN C1 = C2 = 10 pF, CVDD = 1.35 V TYP MAX UNIT 200 800 ms 4 µA 32.768 kHz IDDA, active current consumption Oscillation frequency Table 5−2. 32-kHz Input Clock Timing Requirements NO. † MIN NOM MAX CK1 1/tcyc Frequency CK2 tf Fall time 25 ns CK3 tr Rise time 25 ns CK4 Duty cycle (high-to-low ratio) CK5 Frequency stability† 32.768 UNIT kHz 30 70 % −250 250 ppm The frequency stability requirement for the 32-kHz crystal is necessary for proper compensation by the on-chip real-time clock (RTC) module. If the on-chip RTC is not used, the OMAP5912 has no frequency stability requirement. However, specific systems may require tighter frequency stability. TI recommends that designers carefully choose an external crystal that meets their system requirements for frequency stability across the expected temperature range. CK3 CK2 CK1 CLK32K_IN Figure 5−4. 32-kHz Input Clock December 2003 − Revised December 2005 SPRS231E 203 Electrical Specifications 5.5.2 Base Oscillator (12, 13, or 19.2 MHz) and Input Clock The internal base system oscillator is enabled following a device reset. The oscillator requires an external crystal to be connected across the OSC1_IN and OSC1_OUT pins. If the internal oscillator is not used (configured in software), an external clock source (12,13, 19.2 MHz) must be applied to the OSC1_IN pin, and the OSC1_OUT pin must be left unconnected. Because the internal oscillator can be used as a clock source to the OMAP DPLL, the 12-,13-, or 19.2-MHz crystal oscillation frequency can be multiplied to generate the DSP clock, MPU clock, traffic controller clock. The crystal must be in fundamental-mode operation, and parallel resonant, with a maximum effective series resistance of 50 Ω and a power dissipation of 0.5 mW. The connection of the required circuit, consisting of the crystal and two load capacitors, is shown in Figure 5−5. The load capacitors, C1 and C2, must be chosen such that the equation below is satisfied (recommended values are C1 = C2 = 2CL). CL in the equation is the load specified for the crystal. All discrete components used to implement the oscillator circuit must be placed as close as possible to the associated oscillator pins (OSC1_IN and OSC1_OUT) and to the VSS pins closest to the oscillator pins (ZZG balls AA1 and Y3; ZDY/GDY balls G11 and N5). NOTE: The base oscillator is powered by the embedded LDO. If an external clock source is used instead of using the on-chip oscillator, care must be taken that the voltage level driven onto the OSC1_IN pin is no greater than the LDO voltage level. C1 = C2 = 2CL (CL = Crystal Load Capacitance) OSC1_IN OSC1_OUT 12, 13, or 19.2-MHz Crystal C1 C2 Figure 5−5. Internal System Oscillator External Crystal If USB host function is used, it is recommended that a very low PPM crystal (≤ 50 ppm) be used for the 12,13, or 19.2 MHz oscillator circuit. If the USB host function is not used, then a crystal of ≤ 180 ppm is recommended. When selecting a crystal, the system design must take into account the temperature and aging characteristics of a crystal versus the user environment and expected lifetime of the system. Table 5−3 shows the switching characteristics of the base oscillator. Table 5−3. Base Oscillator Switching Characteristics PARAMETER TEST CONDITIONS MIN Start-up time (from power up until oscillating at stable frequency of 12,13, or 19.2 MHz) C1 = C2 = 10 pF, CVDD = 1.3V IDDA, active current consumption C1 = C2 = 10 pF, CVDD = 1.5V Oscillation frequency 204 SPRS231E TYP MAX 1.7 3 UNIT ms 220 µA 12 to 19.2 MHz December 2003 − Revised December 2005 Electrical Specifications Table 5−4 and Figure 5−6 show the clock timing requirements for using an external system clock source. Table 5−4. 12-MHz, 13-MHz, and 19.2-MHz Input Clock Timing Requirements† NO. MIN SCK1 tc(OSC1_IN) Frequency SCK2 tf(OSC1_IN) Fall time SCK3 tr(OSC1_IN) Rise time SCK4 tw(OSC1_IN) Duty cycle (high-to-low ratio) NOM MAX 12 to 19.2 UNIT MHz 5 ns 5 ns 40 60 % −50 50 USB host function is not used −180 † The clock signal level must not exceed CV DD . See Section 5.2, Recommended Operating Conditions. 180 USB host function is used SCK5 tj(OSC1_IN) Frequency stability ppm SCK2 SCK1 SCK3 OSC1_IN Figure 5−6. Input Clock Timings December 2003 − Revised December 2005 SPRS231E 205 Electrical Specifications 5.6 Reset Timing This section provides the timing requirements for the OMAP5912 hardware reset signals. 5.6.1 OMAP5912 Device Reset The PWRON_RESET signal is the active-low asynchronous reset input responsible for the reset of the entire OMAP5912 device. When using an external crystal to supply the 32-kHz system clock, PWRON_RESET must be asserted low a minimum of two 32-kHz clock cycles longer than the worst-case start-up time of the 32-kHz oscillator after stable power supplies (see Figure 5−7). If an external CMOS input signal is used to source 32 kHz, PWRON_RESET must be asserted low a minimum of two 32-kHz clock cycles after stable power supplies. See Table 5−5 and Table 5−6. Table 5−5. OMAP5912 Device Reset Timing Requirements NO. RS1 † MIN tw(PWRON_RST) Pulse duration, PWRON_RESET low† MAX 800 UNIT ms The rising and falling edge duration of PWRON_RESET is characterized with a max tr/tf = 10 ns. (Timing value is given from 10% to 90% of the signal.) Table 5−6. OMAP5912 Device Reset Switching Characteristics NO. RS2 ‡ PARAMETER td(PWRONH-RSTH) MIN Delay time, PWRON_RESET high to RST_OUT high MAX T+ 10‡ UNIT µs T = P*(C + 7), P = period of 32-kHz clock, C = Value of ULPD wakeup time setup register, SETUP_ULPD1_REG (Default 03FFh) CVDDx DVDDx 2 Cycles Worst-case Oscillator Start-up Time OSC32K_IN RS1 PWRON_RESET RS2 RST_OUT Figure 5−7. Device Reset Timings 206 SPRS231E December 2003 − Revised December 2005 Electrical Specifications 5.6.2 OMAP5912 MPU Core Reset The MPU_RST signal is the active-low asynchronous input responsible for the reset of the OMAP5912 MPU core. Stable power supplies are assumed prior to MPU_RST assertion. Figure 5−8 illustrates the behavior of MPU_RST and RST_OUT. In Figure 5−8, a logic-high level is assumed on the PWRON_RESET input. In the case where an application ties the PWRON_RESET and MPU_RST together, the behavior described in Section 5.6.1, OMAP5912 Device Reset, will override. See Table 5−7 and Table 5−8. Table 5−7. MPU_RST Timing Requirements NO. M3 MIN tw(MPU_RST) Pulse duration, MPU_RST low MAX UNIT µs 50 Table 5−8. MPU_RST Switching Characteristics† NO. M1 PARAMETER td(MPUL−RSTL) MIN Delay time, MPU_RST low to RST_OUT low 1 MPU_RST asserted during OMAP5912 awake state M2 † td(MPUH−RSTH) Delay time, MPU_RST high to RST_OUT high MAX MPU_RST asserted during OMAP5912 deep-sleep state UNIT µs 10 µs T + 10† T = P*(C + 7), P = period of 32-kHz clock, C = Value of ULPD wakeup time setup register, SETUP_ULPD1_REG (Default 03FFh) M3 MPU_RST M1 M2 RST_OUT Figure 5−8. MPU Core Reset Timings December 2003 − Revised December 2005 SPRS231E 207 Electrical Specifications 5.7 External Memory Interface Timing Some EMIFF and EMIFS output terminals have the following particularity: A serial resistor of 20 Ω is included at the output of the terminal to match with PCB line impedance and ensure proper signal integrity. See Table 2−3 (ZDY/GDY Package Terminal Characteristics) and Table 2−4 (ZZG Package Terminal Characteristics) for the list of terminals, which are concerned. GZ HHV R 20 W A Y PAD MODE 5.7.1 EMIFS/NOR Flash Interface Timing Table 5−9 and Table 5−10 assume testing over recommended operating conditions (see Figure 5−9 through Figure 5−20). Section 5.7.1.1 provides information on and an example of how to calculate OMAP5912 EMIFS NOR Flash timings. Table 5−9. EMIFS/NOR Flash Interface Timing Requirements† DVDD5 = 1.8 V/2.75 V/3.3 V NOMINAL NO MIN UNIT MAX F5 tsu(DV-OEH) Setup time, read data valid before FLASH.OE high Async modes 20.7 ns F6 th(OEH-DV) Hold time, read data valid after FLASH.OE high Async modes −4.1 ns 2.6‡ ns F7 tw(RDYV) FLASH.RDY low duration Async modes F21 tsu(DV-AIV) Setup time, read data valid before Address invalid Async page mode 3P + 25.3 ns F22 th(AIV-DV) Hold time, read data valid after Address invalid Async page mode −3.5 ns RT=0§ −3.6 RT=1§ 13.54 F33 th(CLKH-DV) Hold time, read data valid after FLASH.CLK Sync modes 16.4 tsu(DV-CLKH) Setup time, read data valid before FLASH.CLK Sync modes RT=0§ F34 RT=1§ 1 18.4 tsu(RDYV-CLKH) Setup time, FLASH.RDY low before FLASH.CLK Sync modes RT=0§ F38 RT=1§ 1.1 −4.7 th(CLKH-RDYIV) Hold time, FLASH.RDY low after FLASH.CLK Sync modes RT=0§ F39 RT=1§ 10.8 ns ns ns ns † The maximum EMIFS/flash clock rate is limited to the maximum traffic controller clock rate for the OMAP5912, provided all EMIFS/flash timing constraints are met. ‡ P = EMIFS clock period (REF_CLK) § When the RT field in the EMIFS configuration register is set, input data is retimed to the external FLASH.CLK signal. The RT = 1 setting is only valid in synchronous modes. The RT = 0 setting in synchronous modes is assured only for EMIFS clock (REF_CLK) frequencies of 50 MHz and lower. 208 SPRS231E December 2003 − Revised December 2005 Electrical Specifications Table 5−10. EMIFS/NOR Flash Interface Switching Characteristics†‡ NO DVDD5 = 1.8 V/2.75 V/3.3 V NOMINAL PARAMETER MIN F1 tw(CSV) FLASH.CSx low duration—Read operation F3 td(CSV-ADIV) Delay time, FLASH.CSx low to FLASH.ADV high F4 td(CSV-OEIV) F9 Async modes UNIT MAX A−7 A+7 ns Async modes B − 8.2 B + 4.53 Sync modes M − 8.2 M + 4.53 Delay time, FLASH.CSx low to FLASH.OE high Async modes C − 7.3 C + 4.11 ns td(CSV-AV) Delay time, FLASH.CSx low to address valid Async and sync modes −8.7 7.8 ns F10 td(CSV-BEV) Delay time, FLASH.CSx low to FLASH.BEx valid Async and sync modes −5.4 3.9 ns F11 td(CSIV-BEIV) Delay time, FLASH.CSx high to FLASH.BEx invalid Async and sync modes −5.4 3.9 ns F12 td(CSV-ADV) Delay time, FLASH.CSx low to FLASH.ADV low Async and sync modes −8.2 4.53 ns F13 td(CSV-OEV) Delay time, FLASH.CSx low to FLASH.OE low Async (OESETUP = 0) and sync modes − 7.3 4.11 ns F14 td(CSIV-ADIV) Delay time, FLASH.CSx high to FLASH.ADV high Async modes −8.2 4.53 ns F15 td(CSIV-OEIV) Delay time, FLASH.CSx high to FLASH.OE high Async (OEHOLD = 0) and sync modes − 7.3 4.11 ns F16 td(CSV−OEV) FLASH.CSx high duration—Read operation Async modes J−7 J+7 ns F17 tw(CSIV) Delay time, FLASH.CSx low to FLASH.OE low Async (OESETUP ≠ 0) modes K − 7.3 K + 4.11 ns F18 tw(CSIV) Delay time, FLASH.OEx high to FLASH.CSx high Async (OEHOLD ≠ 0) modes L − 7.3 L + 4.11 ns F19 tw(AV) Address valid duration—1st access Async modes A − 5.6 A + 6.25 ns duration—2nd, 3rd, 4th ns F20 tw(AV) Address valid Async modes D − 5.6 D + 6.25 ns F23 tw(CSV) FLASH.CSx low duration—Write operation Async modes E−7 E+7 ns F23/2 and accesses tw(WEV) FLASH.WE low duration—Write operation Async modes G − 1.4 G + 1.4 ns F25 td(CSV-WEV) Delay time, FLASH.CSx low to FLASH.WE low Async modes F − 6.6 F + 3.29 ns F27 td(WEIV-CSIV) Delay time, FLASH.WE high to FLASH.CSx high Async modes H − 3.29 H + 6.6 ns † The maximum EMIFS/flash clock rate is limited to the maximum traffic controller clock rate for the OMAP5912, provided all EMIFS/flash timing constraints are met. ‡ See Section 5.7.1.1 for information on and an example of how to calculate OMAP5912 EMIFS NOR Flash timings. A = (RDWST + 2) * EMIFS clock period (REF_CLK) B = (ADVHOLD + 1) * EMIFS clock period (REF_CLK) C = (RDWST – OEHOLD +2) * EMIFS clock period (REF_CLK) D = (PGWST + 1) * EMIFS clock period (REF_CLK) E = (WRWST + WELEN + 3) * EMIFS clock period (REF_CLK) F = (WRWST + 1) * EMIFS clock period (REF_CLK) G = (WELEN + 1) * EMIFS clock period (REF_CLK) H = 1 * EMIFS clock period (REF_CLK) I = 0.5 * EMIFS clock period (REF_CLK) J = (BTWST + 1) * EMIFS clock period (REF_CLK) K = OESETUP * EMIFS clock period (REF_CLK) L = OEHOLD * EMIFS clock period (REF_CLK) M = (ADVHOLD + 1) * EMIFS clock period (REF_CLK) + 1 TC_CK period December 2003 − Revised December 2005 SPRS231E 209 Electrical Specifications Table 5−10. EMIFS/NOR Flash Interface Switching Characteristics†‡ (Continued) NO DVDD5 = 1.8 V/2.75 V/3.3 V NOMINAL PARAMETER MIN UNIT MAX F27/2 td(WEIV-AIV) Delay time, FLASH.WE high to FLASH.A[25:1] invalid Async modes P − 3.5 P + 6.3 ns F27/3 td(WEIV-DIV) Delay time, FLASH.WE high to FLASH.D[15:0] invalid Async modes P − 4.4 P + 1.812 ns F28 td(CSV-DLZ) Delay time, FLASH.CSx low to data bus driven Async modes −13.9 0.4 ns F29 td(CSV-DV) Delay time, FLASH.CSx low to data bus valid Async modes −12.9 2.19 ns F30 td(CSIV-DIV) Delay time, FLASH.CSx high to data bus invalid Async modes −12.9 2.19 ns F31 td(CSIV-DHZ) Delay time, FLASH.CSx high to data bus high Z Async modes −13.9 0.4 ns F35 td(CLKH-BAA) Delay time, FLASH.CLK high to FLASH.BAA transition Sync modes I + 0.68 I+8 ns FLASH.CS0 Sync modes H − 9.3 ns FLASH.CS1, FLASH.CS2, FLASH.CS3 Sync modes H − 8.1 ns H + 0.1 ns F36 td(CSV-CLKV) Delay time, FLASH.CSx low to FLASH.CLK high F37 td(CLKIV-CSIV) Delay time, FLASH.CLK invalid to FLASH.CSx high Sync modes F40 td(OEV-DIV) Delay time, FLASH.OE low to data bus invalid Async and sync modes −4.8 0.64 ns F41 td(OEV-DHZ) Delay time, FLASH.OE low to data bus high Z Async and sync modes −8.9 0.5 ns F42 td(WEV-DIV) Delay time, FLASH.WE low to data bus invalid Async and sync modes −4.5 1.93 ns F43 td(WEV-DV) Delay time, FLASH.WE low to data bus valid Async and sync modes −4.5 1.93 ns † The maximum EMIFS/flash clock rate is limited to the maximum traffic controller clock rate for the OMAP5912, provided all EMIFS/flash timing constraints are met. ‡ See Section 5.7.1.1 for information on and an example of how to calculate OMAP5912 EMIFS NOR Flash timings. A = (RDWST + 2) * EMIFS clock period (REF_CLK) B = (ADVHOLD + 1) * EMIFS clock period (REF_CLK) C = (RDWST – OEHOLD +2) * EMIFS clock period (REF_CLK) D = (PGWST + 1) * EMIFS clock period (REF_CLK) E = (WRWST + WELEN + 3) * EMIFS clock period (REF_CLK) F = (WRWST + 1) * EMIFS clock period (REF_CLK) G = (WELEN + 1) * EMIFS clock period (REF_CLK) H = 1 * EMIFS clock period (REF_CLK) I = 0.5 * EMIFS clock period (REF_CLK) J = (BTWST + 1) * EMIFS clock period (REF_CLK) K = OESETUP * EMIFS clock period (REF_CLK) L = OEHOLD * EMIFS clock period (REF_CLK) M = (ADVHOLD + 1) * EMIFS clock period (REF_CLK) + 1 TC_CK period 210 SPRS231E December 2003 − Revised December 2005 Electrical Specifications 5.7.1.1 EMIFS NOR Flash Timing Calculation Example The following registers/fields and clock settings are used to calculate OMAP5912 EMIFS NOR Flash timings: • FCLKDIV. Bits [1:0] of the EMIFS Chip-Select Configuration Registers (EMIFS_CCS0, EMIFS_CCS1, EMIFS_CCS2, and EMIFS_CCS3). FCLKDIV controls the TC_CK divider REF_CLK: • − If FCLKDIV = 00: REF_CLK = TC_CK divide by 1 − If FCLKDIV = 01: REF_CLK = TC_CK divide by 2 − If FCLKDIV = 10: REF_CLK = TC_CK divide by 4 − If FCLKDIV = 11: REF_CLK = TC_CK divide by 6 RDWST. Bits [7:4] of the EMIFS Chip-Select Configuration Registers (EMIFS_CCS0, EMIFS_CCS1, EMIFS_CCS2, and EMIFS_CCS3). RDWST controls the wait states cycle number for asynchronous read operations and the initial idle time for asynchronous read page mode and synchronous read mode. Value range: 0000 to 1111 • WRWST. Bits [11:8] of the EMIFS Chip-Select Configuration Registers (EMIFS_CCS0, EMIFS_CCS1, EMIFS_CCS2, and EMIFS_CCS3). WRWST controls the wait states cycle number for write operations. Value range: 0000 to 1111 • PGWSTEN. Bit [31] of the EMIFS Chip-Select Configuration Registers (EMIFS_CCS0, EMIFS_CCS1, EMIFS_CCS2, and EMIFS_CCS3). PGWSTEN is specification. • − If PGWSTEN = 0: PGWST is specified by PGWST / WELEN Bits [15:12] − If PGWSTEN = 1: PGWST is specified by PGWST Bits [30:27] PGWST / WELEN. Bits [15:12] of the EMIFS Chip-Select Configuration Registers (EMIFS_CCS0, EMIFS_CCS1, EMIFS_CCS2, and EMIFS_CCS3). PGWST / WELEN controls the wait states cycle number between accesses in a page for asynchronous page mode. It also controls the WE pulse length during a write access. − If PGWSTEN = 0: this bit specifies both PGWST and WELEN − If PGWSTEN = 1: this bit specifies only PGWST Value range: 0000 to 1111 • BTWST. Bits [26:23] of the EMIFS Chip-Select Configuration Registers (EMIFS_CCS0, EMIFS_CCS1, EMIFS_CCS2, and EMIFS_CCS3). BTWST controls the IDLE cycle number for bus turnaround and CS high-pulse-width timing. Value range: 0000 to 1111 December 2003 − Revised December 2005 SPRS231E 211 Electrical Specifications • OE_SETUP. Bits [3:0] of the Advanced EMIFS Chip-Select Configuration Registers (EMIFS_ACS0, EMIFS_ACS1, EMIFS_ACS2, and EMIFS_ACS3). OE_SETUP controls the number of cycles inserted from CS low to OE low. Value range: 0000 to 1111 • OE_HOLD. Bits [7:4] of the Advanced EMIFS Chip-Select Configuration Registers (EMIFS_ACS0, EMIFS_ACS1, EMIFS_ACS2, and EMIFS_ACS3). OE_HOLD controls the number of cycles inserted from OE high to CS high. Value range: 0000 to 1111 • TC_CK. Traffic controller clock • REF_CLK. EMIFS clock period • ADVHOLD. Bit [8] of the Advanced EMIFS Chip-Select Configuration Registers (EMIFS_ACS0, EMIFS_ACS1, EMIFS_ACS2, and EMIFS_ACS3). ADVHOLD controls the ADV pulse width low. Value range: 0 to 1 EXAMPLE REF_CLK = 10.42 ns RDWST = 0 ADVHOLD = 0 TC_CK = 10.42 ns OE_HOLD = 0 PGWST = 0 WRWST = 0 WELEN = 0 BTWST = 0 OE_SETUP = 0 FCLKDIV = 0 Using the above register and clock settings, the following timing constraints are calculated using the EMIFS NOR FLASH timing calculator, which is available through Texas Instruments: P = 10.42 ns A = 20.84 ns B = 10.42 ns M = 20.84 ns C = 20.84 ns D = 10.42 ns E = 31.26 ns 212 SPRS231E December 2003 − Revised December 2005 Electrical Specifications F = 10.42 ns G = 10.42 ns H = 10.42 ns I = 5.21 ns J = 10.42 ns K = 0 ns L = 0 ns Table 5−11 and Table 5−12 show a sample timing calculation of the Table 5−9 and Table 5−10 parametric values using the constraints calculated above. Table 5−11. Sample Timing Calculation of Table 5−9 Parametric Values Using Constraints Calculated Above DATASHEET VALUES (FROM TABLE 5−9) DVDD5 = 1.8 V/2.75 V/3.3 V NOMINAL NO MIN MAX AUTOMATIC TIMING CALCULATIONS DVDD5 = 1.8 V/2.75 V/3.3 V NOMINAL MIN UNIT MAX F5 tsu(DV-OEH) Setup time, read data valid before FLASH.OE high Async modes 20.7 20.7 ns F6 th(OEH-DV) Hold time, read data valid after FLASH.OE high Async modes −4.1 −4.1 ns F7 tw(RDYV) FLASH.RDY low duration Async modes 3P + 2.6‡ 33.86 ns F21 tsu(DV-AIV) Setup time, read data valid before Address invalid Async page mode 25.3 25.3 ns F22 th(AIV-DV) Hold time, read data valid after Address invalid Async page mode −3.5 −3.5 ns Sync modes −3.6 −3.6 th(CLKH-DV) Hold time, read data valid after FLASH.CLK RT=0§ F33 RT=1§ 13.54 13.54 Sync modes 16.4 16.4 tsu(DV-CLKH) Setup time, read data valid before FLASH.CLK RT=0§ F34 RT=1§ 1 1 Sync modes 18.4 18.4 tsu(RDYV-CLKH) Setup time, FLASH.RDY low before FLASH.CLK RT=0§ F38 RT=1§ 1.1 1.1 Sync modes −4.7 −4.7 th(CLKH-RDYIV) Hold time, FLASH.RDY low after FLASH.CLK RT=0§ F39 RT=1§ 10.8 10.8 ns ns ns ns † The maximum EMIFS/flash clock rate is limited to the maximum traffic controller clock rate for the OMAP5912, provided all EMIFS/flash timing constraints are met. ‡ P = EMIFS clock period (REF_CLK) § When the RT field in the EMIFS configuration register is set, input data is retimed to the external FLASH.CLK signal. The RT = 1 setting is only valid in synchronous modes. The RT = 0 setting in synchronous modes is assured only for EMIFS clock (REF_CLK) frequencies of 50 MHz and lower. December 2003 − Revised December 2005 SPRS231E 213 Electrical Specifications Table 5−12. Sample Timing Calculation of Table 5−10 Parametric Values Using Constraints Calculated Above NO DATASHEET VALUES (FROM TABLE 5−10) DVDD5 = 1.8 V/2.75 V/3.3 V NOMINAL PARAMETER MIN F1 F3 tw(CSV) FLASH.CSx low duration—Read operation td(CSV-ADIV) Delay time, FLASH.CSx low to FLASH.ADV high MAX AUTOMATIC TIMING CALCULATIONS DVDD5 = 1.8 V/2.75 V/3.3 V NOMINAL MIN UNIT MAX ns Async modes A−7 A+7 13.84 27.84 Async modes B − 8.2 B + 4.53 2.22 14.95 Sync modes M − 8.2 M + 4.53 12.64 25.37 Async modes C − 7.3 C + 4.11 13.54 24.95 ns ns F4 td(CSV-OEIV) Delay time, FLASH.CSx low to FLASH.OE high F9 td(CSV-AV) Delay time, FLASH.CSx low to address valid Async and sync modes −8.7 7.8 −8.7 7.8 ns td(CSV-BEV) Delay time, FLASH.CSx low to FLASH.BEx valid Async and sync modes −5.4 3.9 −5.4 3.9 ns F11 td(CSIV-BEIV) Delay time, FLASH.CSx high to FLASH.BEx invalid Async and sync modes −5.4 3.9 −5.4 3.9 ns F12 td(CSV-ADV) Delay time, FLASH.CSx low to FLASH.ADV low Async and sync modes −8.2 4.53 −8.2 4.53 ns F13 td(CSV-OEV) Delay time, FLASH.CSx low to FLASH.OE low Async (OESETUP = 0) and sync modes − 7.3 4.11 −7.3 4.11 ns F14 td(CSIV-ADIV) Delay time, FLASH.CSx high to FLASH.ADV high Async modes −8.2 4.53 −8.2 4.53 ns F10 † The maximum EMIFS/flash clock rate is limited to the maximum traffic controller clock rate for the OMAP5912, provided all EMIFS/flash timing constraints are met. ‡ See Section 5.7.1.1 for information on and an example of how to calculate OMAP5912 EMIFS NOR Flash timings. A = (RDWST + 2) * EMIFS clock period (REF_CLK) B = (ADVHOLD + 1) * EMIFS clock period (REF_CLK) C = (RDWST – OEHOLD +2) * EMIFS clock period (REF_CLK) D = (PGWST + 1) * EMIFS clock period (REF_CLK) E = (WRWST + WELEN + 3) * EMIFS clock period (REF_CLK) F = (WRWST + 1) * EMIFS clock period (REF_CLK) G = (WELEN + 1) * EMIFS clock period (REF_CLK) H = 1 * EMIFS clock period (REF_CLK) I = 0.5 * EMIFS clock period (REF_CLK) J = (BTWST + 1) * EMIFS clock period (REF_CLK) K = OESETUP * EMIFS clock period (REF_CLK) L = OEHOLD * EMIFS clock period (REF_CLK) M = (ADVHOLD + 1) * EMIFS clock period (REF_CLK) + 1 TC_CK period 214 SPRS231E December 2003 − Revised December 2005 Electrical Specifications Table 5−12. Sample Timing Calculation of Table 5−10 Parametric Values Using Constraints Calculated Above (Continued) DATASHEET VALUES (FROM TABLE 5−10) DVDD5 = 1.8 V/2.75 V/3.3 V NOMINAL AUTOMATIC TIMING CALCULATIONS DVDD5 = 1.8 V/2.75 V/3.3 V NOMINAL NO PARAMETER F15 td(CSIV-OEIV) Delay time, FLASH.CSx high to FLASH.OE high Async (OEHOLD = 0) and sync modes − 7.3 4.11 −7.3 4.11 ns F16 tw(CSIV) FLASH.CSx high duration—Read operation Async modes J−7 J+7 3.42 17.42 ns F17 td(CSV−OEV) Delay time, FLASH.CSx low to FLASH.OE low Async modes K − 7.3 K + 4.11 − 7.3 4.11 ns F18 td(OEIV−CSIV) Delay time, FLASH..OE high to FLASH.CSx high Async modes L − 7.3 L + 4.11 − 7.3 4.11 ns F19 tw(AV) Address valid duration—1st access Async modes A − 5.6 A + 6.25 15.24 27.07 ns F20 tw(AV) Address valid duration—2nd, 3rd, and 4th accesses Async modes D − 5.6 D + 6.25 4.82 16.65 ns F23 tw(CSV) FLASH.CSx low duration—Write operation Async modes E−7 E+7 24.26 38.26 ns F23/2 tw(WEV) FLASH.WE low duration—Write operation Async modes G − 1.4 G + 1.4 9.02 11.82 ns td(CSV-WEV) Delay time, FLASH.CSx low to FLASH.WE low Async modes F − 6.6 F + 3.29 3.82 13.71 ns MIN F25 MAX MIN UNIT MAX † The maximum EMIFS/flash clock rate is limited to the maximum traffic controller clock rate for the OMAP5912, provided all EMIFS/flash timing constraints are met. ‡ See Section 5.7.1.1 for information on and an example of how to calculate OMAP5912 EMIFS NOR Flash timings. A = (RDWST + 2) * EMIFS clock period (REF_CLK) B = (ADVHOLD + 1) * EMIFS clock period (REF_CLK) C = (RDWST – OEHOLD +2) * EMIFS clock period (REF_CLK) D = (PGWST + 1) * EMIFS clock period (REF_CLK) E = (WRWST + WELEN + 3) * EMIFS clock period (REF_CLK) F = (WRWST + 1) * EMIFS clock period (REF_CLK) G = (WELEN + 1) * EMIFS clock period (REF_CLK) H = 1 * EMIFS clock period (REF_CLK) I = 0.5 * EMIFS clock period (REF_CLK) J = (BTWST + 1) * EMIFS clock period (REF_CLK) K = OESETUP * EMIFS clock period (REF_CLK) L = OEHOLD * EMIFS clock period (REF_CLK) M = (ADVHOLD + 1) * EMIFS clock period (REF_CLK) + 1 TC_CK period December 2003 − Revised December 2005 SPRS231E 215 Electrical Specifications Table 5−12. Sample Timing Calculation of Table 5−10 Parametric Values Using Constraints Calculated Above (Continued) DATASHEET VALUES (FROM TABLE 5−10) DVDD5 = 1.8 V/2.75 V/3.3 V NOMINAL PARAMETER NO MIN MAX AUTOMATIC TIMING CALCULATIONS DVDD5 = 1.8 V/2.75 V/3.3 V NOMINAL MIN UNIT MAX td(WEIV-CSIV) Delay time, FLASH.WE high to FLASH.CSx high Async modes H − 3.29 H + 6.6 7.13 17.02 ns F27/2 td(WEIV-AIV) Delay time, FLASH.WE high to FLASH.A[25:1] invalid Async modes P − 3.5 P + 6.3 6.92 16.72 ns F27/3 td(WEIV-DIV) Delay time, FLASH.WE high to FLASH.D[15:0] invalid Async modes P − 4.4 P + 1.812 6.02 12.23 ns F28 td(CSV-DLZ) Delay time, FLASH.CSx low to data bus driven Async modes −13.9 0.4 −13.9 0.4 ns F29 td(CSV-DV) Delay time, FLASH.CSx low to data bus valid Async modes −12.9 2.19 −12.9 2.19 ns td(CSIV-DIV) Delay time, FLASH.CSx high to data bus invalid Async modes −12.9 2.19 −12.9 2.19 ns td(CSIV-DHZ) Delay time, FLASH.CSx high to data bus high Z Async modes −13.9 0.4 −13.9 0.4 ns td(CLKH-BAA) Delay time, FLASH.CLK high to FLASH.BAA transition Sync modes I + 0.68 I+8 5.89 13.21 ns F27 F30 F31 F35 † The maximum EMIFS/flash clock rate is limited to the maximum traffic controller clock rate for the OMAP5912, provided all EMIFS/flash timing constraints are met. ‡ See Section 5.7.1.1 for information on and an example of how to calculate OMAP5912 EMIFS NOR Flash timings. A = (RDWST + 2) * EMIFS clock period (REF_CLK) B = (ADVHOLD + 1) * EMIFS clock period (REF_CLK) C = (RDWST – OEHOLD +2) * EMIFS clock period (REF_CLK) D = (PGWST + 1) * EMIFS clock period (REF_CLK) E = (WRWST + WELEN + 3) * EMIFS clock period (REF_CLK) F = (WRWST + 1) * EMIFS clock period (REF_CLK) G = (WELEN + 1) * EMIFS clock period (REF_CLK) H = 1 * EMIFS clock period (REF_CLK) I = 0.5 * EMIFS clock period (REF_CLK) J = (BTWST + 1) * EMIFS clock period (REF_CLK) K = OESETUP * EMIFS clock period (REF_CLK) L = OEHOLD * EMIFS clock period (REF_CLK) M = (ADVHOLD + 1) * EMIFS clock period (REF_CLK) + 1 TC_CK period 216 SPRS231E December 2003 − Revised December 2005 Electrical Specifications Table 5−12. Sample Timing Calculation of Table 5−10 Parametric Values Using Constraints Calculated Above (Continued) DATASHEET VALUES (FROM TABLE 5−10) DVDD5 = 1.8 V/2.75 V/3.3 V NOMINAL PARAMETER NO MIN F36 td(CSV-CLKV) Delay time, FLASH.CSx low to FLASH.CLK high MAX AUTOMATIC TIMING CALCULATIONS DVDD5 = 1.8 V/2.75 V/3.3 V NOMINAL MIN UNIT MAX FLASH.CS0 Sync modes H − 9.3 1.12 ns FLASH.CS1, FLASH.CS2, FLASH.CS3 Sync modes H − 8.1 2.32 ns H + 0.1 10.52 ns F37 td(CLKIV-CSIV) Delay time, FLASH.CLK invalid to FLASH.CSx high Sync modes F40 td(OEV-DIV) Delay time, FLASH.OE low to data bus invalid Async and sync modes −4.8 0.64 −4.8 0.64 ns F41 td(OEV-DHZ) Delay time, FLASH.OE low to data bus high Z Async and sync modes −8.9 0.5 −8.9 0.5 ns F42 td(WEV-DIV) Delay time, FLASH.WE low to data bus invalid Async and sync modes −4.5 1.93 −4.5 1.93 ns F43 td(WEV-DV) Delay time, FLASH.WE low to data bus valid Async and sync modes −4.5 1.93 −4.5 1.93 ns † The maximum EMIFS/flash clock rate is limited to the maximum traffic controller clock rate for the OMAP5912, provided all EMIFS/flash timing constraints are met. ‡ See Section 5.7.1.1 for information on and an example of how to calculate OMAP5912 EMIFS NOR Flash timings. A = (RDWST + 2) * EMIFS clock period (REF_CLK) B = (ADVHOLD + 1) * EMIFS clock period (REF_CLK) C = (RDWST – OEHOLD +2) * EMIFS clock period (REF_CLK) D = (PGWST + 1) * EMIFS clock period (REF_CLK) E = (WRWST + WELEN + 3) * EMIFS clock period (REF_CLK) F = (WRWST + 1) * EMIFS clock period (REF_CLK) G = (WELEN + 1) * EMIFS clock period (REF_CLK) H = 1 * EMIFS clock period (REF_CLK) I = 0.5 * EMIFS clock period (REF_CLK) J = (BTWST + 1) * EMIFS clock period (REF_CLK) K = OESETUP * EMIFS clock period (REF_CLK) L = OEHOLD * EMIFS clock period (REF_CLK) M = (ADVHOLD + 1) * EMIFS clock period (REF_CLK) + 1 TC_CK period December 2003 − Revised December 2005 SPRS231E 217 Electrical Specifications Internal_CLK_Ref FLASH.CLK F1 FLASH.CSx F9 FLASH.A[25:1] Valid Address F11 F10 FLASH.BE[1:0] Valid F12 F3 FLASH.ADV F13 F4 FLASH.OE F6 F5 FLASH.D[15:0] Data IN Data IN FLASH.RDY NOTE: RDWST = 2, ADVHOLD = 0, OESETUP = 0, OEHOLD = 0. Figure 5−9. EMIFS/NOR Flash—Single Word Asynchronous Read Internal_Ref_clk FLASH.CLK FLASH.CSx F9 FLASH.A[25:1] Valid Address F11 F10 FLASH.BE[1:0] Valid F12 F3 FLASH.ADV F15 F13 FLASH.OE F6 F5 FLASH.D[15:0] Data IN Data IN F7 FLASH.RDY NOTE: RDWST = 2, ADVHOLD = 0, OESETUP = 0, OEHOLD = 0. Figure 5−10. EMIFS/NOR Flash—Single Word Asynchronous Read, Full-Handshaking Mode Timing 218 SPRS231E December 2003 − Revised December 2005 Electrical Specifications Internal_Ref_clk FLASH.CLK F16 F1 F1 FLASH.CSx F9 F9 FLASH.A[25:1] Address 0 Address 1 F11 F10 Valid FLASH.BE[1:0] F12 F12 F3 F3 FLASH.ADV F17 F18 F17 F18 FLASH.OE F6 F5 F6 F5 FLASH.D[15:0] Data Lower Data Upper FLASH.RDY NOTE: RDWST = 4, ADVHOLD = 0, OESETUP = 1, OEHOLD = 1, BTWST = 0, BTMODE = 0. Figure 5−11. EMIFS/NOR Flash—Asynchronous 32-Bit Read Timing Internal_Ref_clk FLASH.CLK FLASH.CSx F9 F20 F19 FLASH.A[25:1] Add0 F20 F19 Add1 Add2 Add3 Add5 Add6 Add4 Add7 F11 F10 FLASH.BE[1:0] Valid F12 F14 F13 F15 FLASH.ADV FLASH.OE F22 F22 F21 F21 FLASH.D[15:0] D0 D1 D2 D3 D4 D5 D6 D7 D7 FLASH.RDY NOTE: RDWST = 2, PGWST = 0 Figure 5−12. EMIFS/NOR Flash—Asynchronous Read, Page Mode 8 x 16-Bit Timing December 2003 − Revised December 2005 SPRS231E 219 Electrical Specifications Internal_Ref_clk FLASH.CLK FLASH.CSx F9 Valid Address FLASH.A[25:1] F10 F11 FLASH.BE[1:0] F12 F3 FLASH.ADV F27/2 F27 F25 F23/2 FLASH.WE F27/3 F29 F28 F30 F31 FLASH.D[15:0] Data Out F7 FLASH.RDY Figure 5−13. EMIFS/NOR Flash—Single Word Asynchronous Write Timing, Full-Handshaking Mode 220 SPRS231E December 2003 − Revised December 2005 Electrical Specifications Internal_Ref_clk FLASH.CLK F23 FLASH.CSx F9 FLASH.A[25:1] Valid Address F11 F10 FLASH.BE[1:0] F12 F3 FLASH.ADV F27/2 F27 F25 F23/2 FLASH.WE F27/3 F29 F28 FLASH.D[15:0] F30 F31 Data Out FLASH.RDY Figure 5−14. EMIFS/NOR Flash—Single Word Asynchronous Write December 2003 − Revised December 2005 SPRS231E 221 Electrical Specifications FLASH.CLK F36 F37 FLASH.CSx F9 FLASH.A[25:1] Valid Address F10 F11 FLASH.BE[1:0] Valid F12 F3 FLASH.ADV F13 F15 FLASH.OE F33 F34 FLASH.D[15:0] D0 D1 D2 D3 D4 D5 D6 D7 FLASH.RDY F35 F35 FLASH.BAA NOTE: RDWST = 4, ADVHOLD = 0 Figure 5−15. EMIFS/NOR Flash—Synchronous Burst Read Timing (Retiming Off, Mode 4) FLASH.CLK F36 F37 FLASH.CSx F9 FLASH.A[25:1] Valid Address F10 F11 FLASH.BE[1:0] Valid F12 F3 FLASH.ADV F13 F15 FLASH.OE F34 F33 FLASH.D[15:0] D0 D1 D2 D3 D4 D5 D6 D7 FLASH.RDY F35 F35 FLASH.BAA NOTE: RDWST = 4, ADVHOLD = 0 Figure 5−16. EMIFS/NOR Flash—Synchronous Burst Read Timing (Retiming On, Mode 4) 222 SPRS231E December 2003 − Revised December 2005 Electrical Specifications FLASH.CLK F36 F37 FLASH.CSx F9 FLASH.A[25:1] Valid Address F10 F11 FLASH.BE[1:0] Valid F12 F3 FLASH.ADV F13 F15 FLASH.OE F33 F34 FLASH.D[15:0] D0 D1 D2 D3 D4 D5 D6 D7 D7 F39 F38 FLASH.RDY FLASH.BAA NOTE: RDWST = 4, ADVHOLD = 0 Figure 5−17. EMIFS/NOR Flash—Synchronous Burst Read Timing (Retiming Off, Mode 5) December 2003 − Revised December 2005 SPRS231E 223 Electrical Specifications Internal_Ref_clk FLASH_CLK F1 FLASH.CSx F9 FLASH.A[25:17] Address (MSB) F10 F11 FLASH.BE[1:0] Valid F12 F3 FLASH.ADV F4 F17 FLASH.OE FLASH.A[16:1] .D[15:1] F28 F40 F29 F41 Address (LSB) F5 F6 Data IN Data IN FLASH.RDY NOTE: RDWST = 2, ADVHOLD = 0, OESETUP = 2, OEHOLD = 0 Figure 5−18. EMIFS/Multiplexed NOR Flash—Single Word Asynchronous Read Timing 224 SPRS231E December 2003 − Revised December 2005 Electrical Specifications Internal_Ref_clk FLASH.CLK F23 FLASH.CSx F9 FLASH.A[25:17] Valid Address F11 F10 FLASH.BE[1:0] F12 F3 FLASH.ADV F27/2 F27 F25 F23/2 FLASH.WE F29 F28 FLASH.A[16:1] FLASH.D[15:0] F27/3 F43 F42 F30 F31 Address (LSB) Data Out FLASH.RDY Figure 5−19. EMIFS/Multiplexed NOR Flash—Single Word Asynchronous Write Timing FLASH.CLK F36 F37 FLASH.CSx F9 FLASH.A[25:17] Valid Address (MSB) F10 F11 FLASH.BE[1:0] F12 F3 FLASH.ADV F17 F15 FLASH.OE F28 F29 FLASH.A[16:1] .D[15:0] Address (LSB) F40 F41 F34 F33 D0 D1 D2 D3 D4 D5 D6 D7 D7 FLASH.RDY NOTE: RDWST = 4, ADVHOLD = 0, OESETUP = 4 Figure 5−20. EMIFS/Multiplexed NOR Flash—Synchronous Burst Read Timing (Retiming Off) December 2003 − Revised December 2005 SPRS231E 225 Electrical Specifications 5.7.2 EMIFS/NAND Flash Timing Table 5−13 and Table 5−14 assume testing over operating conditions (see Figure 5−21 through Figure 5−24). Table 5−13. EMIFS/NAND Flash Timing Requirements DVDD5 = 1.8 V NOMINAL NO MIN NFE14 tsu(DV-REH) Setup time, input FLASH.D[15:0] valid before FLASH.CS2UOE(RE) high NFE15 th(REH-DV) Hold time, input FLASH.D[15:0] valid after FLASH.CS2UOE(RE) high DVDD5 = 2.75 V/3.3 V NOMINAL MAX MIN UNIT MAX 33.75 30.75 ns −2 −2 ns Table 5−14. EMIFS/NAND Flash Switching Characteristics NO PARAMETER DVDD5 = 1.8 V NOMINAL DVDD5 = 2.75 V/3.3 V NOMINAL MIN MAX MIN MAX UNIT NFE1 td(CEV-CLEV) Delay time, FLASH.CS2U(CE) low to FLASH.A[1] (CLE) high −0.75 −0.15 −1.2 −0.15 ns NFE2 td(CEIV-CLEIV) Delay time, FLASH.CS2U(CE) high to FLASH.A[1] (CLE) low −1.2 −0.15 −1 −0.15 ns NFE3 td(CEV-WEV) Delay time, FLASH.CS2U(CE) low to FLASH.CS2UWE(WE) low −0.6 3.15 −0.6 3.5 ns NFE4 tw(WEV) FLASH.CS2UWE(WE) low duration P − 2.25† P + 0.45† P − 2.1† P + 0.6† ns NFE5 td(WEIV-CEIV) Delay time, FLASH.CS2UWE(WE) high to FLASH.CS2U(CE) high P − 0.9† P + 2† P − 0.9† P + 1.8† ns NFE6 td(CEV-DV) Delay time, FLASH.CS2U(CE) low to FLASH.D[15:0] (I/O) valid −7.35 −0.55 −6.15 −0.65 ns NFE7 td(CEIV-DIV) Delay time, FLASH.CS2U(CE) high to FLASH.D[15:0] (I/O) invalid −7.2 −0.6 −6.15 −0.65 ns NFE8 td(CEV-ALEV) Delay time, FLASH.CS2U(CE) low to FLASH.A[2] (ALE) high −1.65 −0.15 −1.8 −0.2 ns NFE9 td(CEIV-ALEIV) Delay time, FLASH.CS2U(CE) high to FLASH.A[2] (ALE) low −1.65 −0.2 −1.8 −0.2 ns P − 4.5† P + 2.25† P − 0.6† P + 2.1† ns −10.35 −0.5 −9.15 −0.6 ns P − 3.15† P + 3† P − 3.15† P + 2.85† ns 3.15† 3.15† 2.85† 3.15† ns NFE10 tw(WEIV) FLASH.CS2UWE(WE) high duration NFE11 Delay time, FLASH.CS2UWE(WE) low to FLASH.D[15:0] (I/O) valid/invalid td(WEV-DV) NFE12 tw(REV) NFE13 tw(REIV) † FLASH.CS2UOE(RE) low duration FLASH.CS2UOE(RE) high duration P− P+ P− P+ P = EMIFS clock period (Ref_clk). 226 SPRS231E December 2003 − Revised December 2005 Electrical Specifications Internal_Ref_clk FLASH.CS2U(CE) NFE1 NFE2 FLASH.A[1](CLE) FLASH.A[2](ALE) FLASH.CS2UOE(CE) NFE3 NFE5 NFE4 FLASH.CS2UWE(WE) NFE6 FLASH.D[15:0](I/O) NFE7 Command NOTES: A. FLASH.CLK is not driven during this mode of operation. The signal shown represents the internal FLASH.CLK signal given as a reference. B. In case of use of a NAND CE care flash type, FLASH.CS2U is a combination of a GPIO (controlled by software—no timing) and CS2U (internal). Figure 5−21. EMIFS/NAND Flash—Command Latch Timing Internal_ref_clk FLASH.CS2U(CE) FLASH.A[1](CLE) NFE8 NFE9 FLASH.A[2](ALE) FLASH.CS2UOE(RE) NFE3 NFE10 NFE4 NFE5 FLASH.CS2UWE(WE) NFE6 Col Add1 FLASH.D[15:0](I/O) NFE7 NFE11 Col Add2 Row Add1 Row Add2 NOTES: A. FLASH.CLK is not driven during this mode of operation. The signal shown represents the internal FLASH.CLK signal given as a reference. B. In case of use of a NAND CE care flash type, FLASH.CS2U is a combination of a GPIO (controlled by software—no timing) and CS2U (internal). Figure 5−22. EMIFS/NAND Flash—Address Latch Timing December 2003 − Revised December 2005 SPRS231E 227 Electrical Specifications Internal_Ref_clk FLASH.CS2U(CE) FLASH.A[1](CLE) FLASH.A[2](ALE) FLASH.CS2UOE(RE) NFE10 NFE4 FLASH.CS2UWE(WE) NFE11 FLASH.D[15:0](I/O) Dout 0 Dout 1 Dout N NOTES: A. FLASH.CLK is not driven during this mode of operation. The signal shown represents the internal FLASH.CLK signal given as a reference. B. In case of use of a NAND CE care flash type, FLASH.CS2U is a combination of a GPIO (controlled by software—no timing) and CS2U (internal). Figure 5−23. EMIFS/NAND Flash—Memory Write Timing Internal_Ref_clk FLASH.CS2U(CE) FLASH.A[1](CLE) FLASH.A[2](ALE) NFE13 NFE12 FLASH.CS2UOE(RE) FLASH.CS2UWE(WE) NFE15 NFE14 FLASH.D[15:0](I/O) Din N Din N+1 Din M NOTES: A. FLASH.CLK is not driven during this mode of operation. The signal shown represents the internal FLASH.CLK signal given as a reference. B. In case of use of a NAND CE care flash type, FLASH.CS2U is a combination of a GPIO (controlled by software—no timing) and CS2U (internal). Figure 5−24. EMIFS/NAND Flash—Memory Read Timing 228 SPRS231E December 2003 − Revised December 2005 Electrical Specifications 5.8 EMIFF/SDR SDRAM Interface Timing Table 5−15 and Table 5−16 assume testing over recommended operating conditions (see Figure 5−25 through Figure 5−30). Table 5−15. EMIFF/SDR SDRAM Interface Timing Requirements DVDD4 = 1.8 V NOMINAL† NO MIN † SD7 tsu(DV–CLKH) Setup time, read data valid before SDRAM.CLK high SD8 th(CLKH–DV) Hold time, read data valid after SDRAM.CLK high MAX DVDD4 = 2.75 V/3.3 V NOMINAL† MIN UNIT MAX 1 1 ns 1.5 1.5 ns The control bit CONF_VOLTAGE_SDRAM_R of the register VOLTAGE_CTRL_0 must be set to 1 regardless of the DVDD4 voltage level. Table 5−16. EMIFF/SDR SDRAM Interface Switching Characteristics‡§ NO PARAMETER DVDD4 = 1.8 V NOMINAL† MIN DVDD4 = 2.75 V/3.3 V NOMINAL† MAX MIN UNIT MAX SD1 tc(CLK) Cycle time, SDRAM.CLK 10.41 10.41 SD2 tw(CLK) Pulse duration, SDRAM.CLK high or low 0.45P SD3 td(CLKH–DQMV) Delay time, SDRAM.CLK high to SDRAM.DQMx valid SD4 td(CLKH–DQMIV) Delay time, SDRAM.CLK high to SDRAM.DQMx invalid SD5 td(CLKH–AV) Delay time, SDRAM.CLK high to SDRAM.A[13:0] address valid SD6 td(CLKH–AIV) Delay time, SDRAM.CLK high to SDRAM.A[13:0] address invalid 0.5P SD9 td(CLKH–SDCASL) Delay time, SDRAM.CLK high to SDRAM.CAS low 0.5P 0.5P + 1.18 0.5P 0.5P + 1.40 ns SD10 td(CLKH–SDCASH) Delay time, SDRAM.CLK high to SDRAM.CAS high 0.5P 0.5P + 1.18 0.5P 0.5P + 1.40 ns SD11 td(CLKH–DV) Delay time, SDRAM.CLK high to SDRAM.D[15:0] data valid 0.5P + 0.75 ns SD12 td(CLKH–DIV) Delay time, SDRAM.CLK high to SDRAM.D[15:0] data invalid 0.5P SD13 td(CLKH–SDWEL) Delay time, SDRAM.CLK high to SDRAM.WE low 0.5P 0.5P + 1.26 0.5P 0.5P + 1.44 ns SD14 td(CLKH–SDWEH) Delay time, SDRAM.CLK high to SDRAM.WE high 0.5P 0.5P + 1.26 0.5P 0.5P + 1.44 ns SD15 td(CLKH–BAV) Delay time, SDRAM.CLK high to SDRAM.BA[1:0] valid 0.5P + 1.55 ns SD16 td(CLKH–BAIV) Delay time, SDRAM.CLK high to SDRAM.BA[1:0] invalid 0.5P SD17 td(CLKH–RASL) Delay time, SDRAM.CLK high to SDRAM.RAS low 0.5P 0.5P + 1.50 0.5P 0.5P + 1.78 ns SD18 td(CLKH–RASH) Delay time, SDRAM.CLK high to SDRAM.RAS high 0.5P 0.5P + 1.50 0.5P 0.5P + 1.78 ns 0.55P 0.45P 1.20¶ 0.23¶ ns 0.55P ns 1.22¶ ns 0.30¶ 0.5P + 1.49 ns 0.5P + 1.63 0.5P 0.5P + 0.60 ns 0.5P 0.5P + 1.44 ns ns 0.5P ns † The control bit CONF_VOLTAGE_SDRAM_R of the register VOLTAGE_CTRL_0 must be set to 1 regardless of the DVDD4 voltage level. The maximum EMIFF/SDRAM clock rate is limited to the maximum traffic controller clock rate for the OMAP5912. § P = SDRAM.CLK period in nanoseconds. Minimum value of P is determined by maximum traffic controller frequency. ¶ An external delay element of between 1 ns to 5 ns must be added to the OMAP5912 DQM signal for proper operation with SDRAMs. ‡ December 2003 − Revised December 2005 SPRS231E 229 Electrical Specifications READ SD2 SD2 READ SD1 SDRAM.CLK SDRAM.CKE SD3 SDRAM.DQMx SD6 SD5 SDRAM.A[13:0] CA1 CA2 SD16 SD15 SDRAM.BA[1:0] Bank Address SD8 SD7 SDRAM.D[15:0] D1 D2 SDRAM.RAS SD10 SD9 SDRAM.CAS SDRAM.WE Figure 5−25. EMIFF/SDR Two SDRAM RD (Read) Commands (Active Row) WRITE SD2 SD2 WRITE SD1 SDRAM.CLK SDRAM.CKE SD4 SD3 BE1 SDRAM.DQMx BE2 SD15 SDRAM.A[13:0] SD16 CA1 SD15 CA2 SD16 SDRAM.BA[1:0] Bank Address SD11 SDRAM.D[15:0] SD12 D1 D2 SDRAM.RAS SD9 SD10 SD13 SD14 SDRAM.CAS SDRAM.WE Figure 5−26. EMIFF/SDR Two SDRAM WRT (Write) Commands (Active Row) 230 SPRS231E December 2003 − Revised December 2005 Electrical Specifications ACTV SD2 SD2 SD1 SDRAM.CLK SDRAM.CKE SDRAM.DQMx SD5 SDRAM.A[13:0] Row Address SD15 SDRAM.BA[1:0] Bank Activate SDRAM.D[15:0] SD17 SD18 SDRAM.RAS SDRAM.CAS SDRAM.WE Figure 5−27. EMIFF/SDR SDRAM ACTV (Activate Row) Command DCAB SD2 SD2 SD1 SDRAM.CLK SDRAM.CKE SDRAM.DQMx SDRAM.A[13:11,9:0] SDRAM.BA[1:0] SDRAM.D[15:0] SD5 SD6 SDRAM.A[10] SD17 SD18 SD13 SD14 SDRAM.RAS SDRAM.CAS SDRAM.WE Figure 5−28. EMIFF/SDR SDRAM DCAB (Precharge/Deactivate Row) Command December 2003 − Revised December 2005 SPRS231E 231 Electrical Specifications REFR SD2 SD2 SD1 SDRAM.CLK SDRAM.CKE SDRAM.DQMx SDRAM.A[13:11,9:0] SDRAM.BA[1:0] SDRAM.D[15:0] SD6 SD5 SDRAM.A[10] SD17 SD18 SD9 SD10 SDRAM.RAS SDRAM.CAS SDRAM.WE Figure 5−29. EMIFF/SDR SDRAM REFR (Refresh) Command MRS SD2 SD2 SD1 SDRAM.CLK SDRAM.CKE SDRAM.DQMx SD5 SDRAM.A[9:0] SD6 MRS Value SDRAM.BA[1:0] SDRAM.D[15:0] SD5 SD6 SD17 SD18 SD9 SD10 SD13 SD14 SDRAM.A[10] SDRAM.RAS SDRAM.CAS SDRAM.WE Figure 5−30. EMIFF/SDR SDRAM MRS (Mode Register Set) Command 232 SPRS231E December 2003 − Revised December 2005 Electrical Specifications 5.9 EMIFF/Mobile DDR SDRAM Timing Table 5−17 and Table 5−18 assume testing over recommended operating conditions (see Figure 5−31 through Figure 5−33). Table 5−17. EMIFF/Mobile DDR SDRAM Timing Requirements DVDD4 = 1.8 V NOMINAL† NO MIN † ‡ UNIT MAX DD17 tsu(DV-DQSL/H) Setup time, SDRAM.D[15:0] input data valid to SDRAM.DQSL/H input high or low DLL phase‡ = 72° −1.32 ns DD18 th(DQSL/H-DV) Hold time, SDRAM.DQSL/H input high or low to SDRAM.D[15:0] input data valid before SDRAM.D[15:0] expires DLL phase‡ = 72° 2.88 ns The control bit CONF_VOLTAGE_SDRAM_R of the register VOLTAGE_CTRL_0 must be set to 1 regardless of the DVDD4 voltage level. DLL phase value is defined in the EMIFF DLL read control register (DLL_PHASE bit). The delay time assume that WRITE_OFFSET bits value = 0 (in DLL_URD_CONTROL and DLL_LRD_CONTROL registers). Table 5−18. EMIFF/Mobile DDR SDRAM Switching Characteristics§ NO DVDD4 = 1.8 V NOMINAL† PARAMETER MIN DD1 tc(CLK) Cycle time, SDRAM.CLK/SDRAM.DDR-CLK DD3 tosu(CLKH-CSL) DD4 toh(CLKH-CSH) UNIT MAX 10.42 ns Output setup time, SDRAM.CLK high to SDRAM.CS low 2.00 ns Output hold time, SDRAM.CLK high to SDRAM.CS high 2.00 ns DD5 tosu(CLKH-RASL) Output setup time, SDRAM.CLK high to SDRAM.RAS low 2.00 5.21 ns DD5A tosu(CLKH-CASL) Output setup time, SDRAM.CLK high to SDRAM.CAS low 2.00 5.40 ns DD6 toh(CLKH-RASH) Output hold time, SDRAM.CLK high to SDRAM.RAS high 2.00 6.88 ns DD6A toh(CLKH-CASH) Output hold time, SDRAM.CLK high to SDRAM.CAS high 2.00 8.83 ns DD7 tosu(CLKH-BAV) Output setup time, SDRAM.CLK high to SDRAM.BA[1:0] bank select valid 2.00 ns DD8 toh(CLKH-BAIV) Output hold time, SDRAM.CLK high to SDRAM.BA[1:0] bank select invalid 2.00 ns DD9 tosu(CLKH-AV) Output setup time, SDRAM.CLK high to SDRAM.A[13:0] address valid 1.50 ns DD10 toh(CLKH-AIV) Output hold time, SDRAM.CLK high to SDRAM.A[13:0] address invalid 1.50 ns DD11 tosu(CLKH-WEL) Output setup time, SDRAM.CLK high to SDRAM.WE low 2.00 5.37 ns DD12 toh(CLKH-WEH) Output hold time, SDRAM.CLK high to SDRAM.WE high 2.00 6.47 ns DD13 tosu(DQSL/H-DV) Output setup time, SDRAM.DQSL/H (DQML/U) high/low to SDRAM.D[15:0] valid DLL phase‡ = 72° 1.00 ns DD14 toh(DQSL/H-DIV) Output hold time, SDRAM.DQSL/H high or low (DQML/U) to SDRAM.D[15:0] invalid DLL phase‡ = 72° 1.01 ns † The control bit CONF_VOLTAGE_SDRAM_R of the register VOLTAGE_CTRL_0 must be set to 1 regardless of the DVDD4 voltage level. DLL phase value is defined in the EMIFF DLL read control register (DLL_PHASE bit). The delay time assume that WRITE_OFFSET bits value = 0 (in DLL_URD_CONTROL and DLL_LRD_CONTROL registers). § Delay time assumes that WRITE_OFFSET bits value = 0 (in DLL_URD_CONTROL and DLL_LRD_CONTROL registers). ‡ December 2003 − Revised December 2005 SPRS231E 233 Electrical Specifications DD1 SDRAM.CLK SDRAM.CLKX SDRAM.CKE DD3 DD4 DD9 DD10 DD7 DD8 DD5 DD6 DD5A DD6A DD11 DD12 SDRAM.CS SDRAM.A[13:0] SDRAM.BA[1:0] SDRAM.RAS SDRAM.CAS SDRAM.WE Figure 5−31. EMIFF/Mobile DDR SDRAM—Command and Address Output Timing Definition DD1 SDRAM.CLK SDRAM.CLKX SDRAM.DQSL/DQSH (External) DLL phase control SDRAM.DQSL/DQSH (Internal) SDRAM.D[15:0] Din 0 Din 1 Din N NOTE: DQSL and DQSH internal delays are programmable in the EMIFF DLL_URD/LRD_CONTROL Register (72°) Figure 5−32. EMIFF/Mobile DDR SDRAM—Memory Read Timing 234 SPRS231E December 2003 − Revised December 2005 Electrical Specifications DD1 SDRAM.CLK SDRAM.CLKX SDRAM.DQSL/DQSH DD13 SDRAM.D[15:0] DD14 Dout 0 Dout 1 Dout N DD13 DD14 SDRAM.DQML/DQMU NOTE: These timing includes the DLL phase effect on data, programmable in the EMIFF DLL write control register (72°), plus the device delay time (uncertainty). Figure 5−33. EMIFF/Mobile DDR SDRAM—Memory Write Timing December 2003 − Revised December 2005 SPRS231E 235 Electrical Specifications 5.10 Multichannel Buffered Serial Port (McBSP) Timing 5.10.1 McBSP Transmit and Receive Timing Table 5−19 and Table 5−20 assume testing over recommended operating conditions (see Figure 5−34 and Figure 5−35). In Table 5−19 and Table 5−20, ext indicates that the device pin is configured as an input (slave) driven by an external device and int indicates that the pin is configured as an output (master). Table 5−19. McBSP Timing Requirements†‡ NO. MIN MAX UNIT M11 tc(CKRX) Cycle time, CLKR/X CLKR/X ext 2P ns M12 tw(CKRX) Pulse duration, CLKR/X high or CLKR/X low CLKR/X ext 0.45P ns M13 M14 M15 M16 tr tf tsu(FRH-CKRL) th(CKRL-FRH) Rise time, CLKR/X, MCBSP2.FSR/X Fall time, CLKR/X, MCBSP2.FSR/X Setup time, external receiver frame sync (FSR/X) high before CLKR/X low Hold time, external receiver frame sync (FSR/X) high after CLKR/X low McBSP1 CLKR/X ext 18 McBSP2 CLKR/X ext MCBSP2.FSR/X ext 18 McBSP3 CLKR/X ext 9 McBSP1 CLKR/X ext 18 McBSP2 CLKR/X ext MCBSP2.FSR/X ext 18 McBSP3 CLKR/X ext McBSP1 (FSX) CLKX int§ 34 CLKX ext§ 1 McBSP2 (FSR) CLKR int 25 CLKR ext 0 McBSP3 (FSX) CLKX int§ 33 CLKX ext§ 1 McBSP1 (FSX) CLKX int§ −1.5 CLKX ext§ 7.5 McBSP2 (FSR) CLKR int −1 CLKR ext 8.5 McBSP3 (FSX) CLKX int§ −1.25 McBSP1 M17 tsu(DRV-CKRL) Setup time, DR valid before CLKR/X low McBSP2 McBSP3 9 CLKX int§ 33 27.75 CLKR ext 1 CLKX int§ 32 CLKX ext§ 1 int§ −1.5 M18 th(CKRL-DRV) Hold time, DR valid after CLKR/X low McBSP2 McBSP3 CLKX ext§ ns ns 0 CLKR int CLKX McBSP1 ns 9 CLKX ext§ CLKX ext§ ns ns 8 CLKR int −1 CLKR ext 8.25 CLKX int§ −1.25 CLKX ext§ 9.75 ns † Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, the timing references of that signal are also inverted. ‡ P = 1/(DSPPER_CK or DSPXOR_CK) for McBSP 1 and 3, or 1/(ARMPER_CK clock frequency) in nanoseconds (ns) for McBSP 2. § For McBSP1 and McBSP3, the receiver clock and frame sync inputs are driven by FSX and CLKX via internal loopback connections enabled via software configuration. 236 SPRS231E December 2003 − Revised December 2005 Electrical Specifications Table 5−19. McBSP Timing Requirements†‡ (Continued) NO. MIN McBSP1 M19 tsu(FXH-CKXL) Setup time, external transmit frame sync (FSX) high before CLKX low McBSP2 McBSP3 McBSP1 M20 th(CKXL-FXH) Hold time, external transmit frame sync (FSX) high after CLKX low McBSP2 McBSP3 CLKX int§ 33.5 CLKX ext§ 1 CLKX int 25.25 CLKX ext 0 CLKX int§ 33.25 ext§ 1 CLKX int§ −1.5 CLKX ext§ 7.5 CLKX CLKR int −1 CLKR ext 7.75 CLKX int§ −1.25 CLKX ext§ 9.25 MAX UNIT ns ns † Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, the timing references of that signal are also inverted. ‡ P = 1/(DSPPER_CK or DSPXOR_CK) for McBSP 1 and 3, or 1/(ARMPER_CK clock frequency) in nanoseconds (ns) for McBSP 2. § For McBSP1 and McBSP3, the receiver clock and frame sync inputs are driven by FSX and CLKX via internal loopback connections enabled via software configuration. Table 5−20. McBSP Switching Characteristics†‡§ NO. PARAMETER MIN MAX UNIT 3.5 31.5 ns M0 td(CKSH-CKRXH) Delay time, CLKS high to CLKR/X high for internal CLKR/X generated from CLKS input M1 td(CKRX) Cycle time, CLKR/X CLKR/X int 2P M2 td(CKRXH) Pulse duration, CLKR/X high CLKR/X int 0.90D 1.10D ns M3 td(CKRXL) Pulse duration, CLKR/X low CLKR/X int ns M4 td(CKRH-FRV) Delay time, CLKR high to internal FSR valid McBSP1 McBSP2 McBSP1 M5 td(CKXH-FXV) Delay time, CLKX high to internal FSX valid McBSP2 McBSP3 CLKR/X int 0.90C 1.10C CLKR int −7.5 5.5 CLKR ext 3 24 CLKX int −8 7.5 CLKX ext 3.5 32 CLKX int −6.5 7 CLKX ext 3 24 CLKX int −10.5 8.5 CLKX ext 3.25 37.75 ns ns † Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, the timing references of that signal are also inverted. ‡ P = 1/(DSPPER_CK or DSPXOR_CK) for McBSP 1 and 3, or 1/(ARMPER_CK clock frequency) in nanoseconds (ns) for McBSP2. § T = CLKRX period = (1 + CLKGDV) * P C = CLKRX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even D = CLKRX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even ¶ Only DXENA = 0 is supported for all OMAP5912 McBSPs. December 2003 − Revised December 2005 SPRS231E 237 Electrical Specifications Table 5−20. McBSP Switching Characteristics†‡§ (Continued) NO. PARAMETER MIN MAX −8 10.25 CLKX ext 3.5 34.75 CLKX int −6.75 9.75 CLKX ext 2.75 26.75 CLKX int −9.75 9.75 CLKX ext 3 CLKX int McBSP1 Delay time, CLKX high to DX valid. M7 td(CKXH-DXV) McBSP2 This applies to all bits except the first bit transmitted when in data delay 0 (XDATDLY = 00b) mode. McBSP3 McBSP1 Delay time, FSX high to DX valid¶ M9 td(FXH-DXV) Only applies to first bit transmitted when in data delay 0 (XDATDLY = 00b) mode. McBSP2 McBSP3 UNIT ns 39 FSX int 29.5 FSX ext 35.75 FSX int 19.75 FSX ext 24.25 FSX int 15 FSX ext 18 ns † Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, the timing references of that signal are also inverted. ‡ P = 1/(DSPPER_CK or DSPXOR_CK) for McBSP 1 and 3, or 1/(ARMPER_CK clock frequency) in nanoseconds (ns) for McBSP2. § T = CLKRX period = (1 + CLKGDV) * P C = CLKRX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even D = CLKRX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even ¶ Only DXENA = 0 is supported for all OMAP5912 McBSPs. MCBSP1.CLKS M0 M1, M11 M3, M12 M2, M12 MCBSPx.CLKR/X M4 M4 MCBSP2.FSR(internal) M16 M15 MCBSPx.FSR/X(ext) M18 M17 MCBSPx.DR(RDATDLY=00b) Bit (n−1) Bit (n−2) Bit (n−3) Bit (n−4) Bit (n−2) Bit (n−3) M18 M17 MCBSPx.DR(RDATDLY=01b) Bit (n−1) M17 M18 MCBSPx.DR(RDATDLY=10b) Bit (n−1) Bit (n−2) NOTE: For McBSP1 and McBSP3, the receiver clock and frame sync inputs are driven by FSX and CLKX via internal loopback connections enabled via software configuration. Figure 5−34. McBSP Receive Timing 238 SPRS231E December 2003 − Revised December 2005 Electrical Specifications M1, M11 M3, M12 M2, M12 MCBSPx.CLKX M5 M5 MCBSPx.FSX(internal) M20 M19 MCBSPx.FSX(ext) M7 M9 MCBSPx.DX(XDATDLY=00b) Bit 0 Bit (n−1) Bit (n−2) M7 MCBSPx.DX(XDATDLY=01b) Bit 0 Bit (n−3) Bit (n−4) Bit (N−2) Bit (n−3) Bit (n−1) Bit (n−2) M7 Bit (n−1) M7 MCBSPx.DX(XDATDLY=10b) Bit 0 Figure 5−35. McBSP Transmit Timing December 2003 − Revised December 2005 SPRS231E 239 Electrical Specifications 5.10.2 McBSP as SPI Master or Slave Timing Table 5−21 to Table 5−28 assume testing over recommended operating conditions (see Figure 5−36 to Figure 5−39). Table 5−21. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)†‡ MASTER NO. MIN M30 tsu(DRV-CKXL) Setup time, MCBSPx.DR valid before MCBSPx.CLKX low M31 th(CKXL-DRV) Hold time, MCBSPx.DR valid after MCBSPx.CLKX low M32 M33 tsu(BFXL-CKXH) tc(CKX) Setup time, MCBSPx.FSX low before MCBSPx.CLKX high MAX SLAVE MIN MAX UNIT 33.25 0 ns −1 6P + 9 ns McBSP1 5 McBSP2 5 McBSP3 6 Cycle time, MCBSPx.CLKX 2P ns 16P ns † P =1/(DSPPER_CK or DSPXOR_CK) for McBSP1 and McBSP3, or 1/(ARMPER_CK clock frequency) in nanoseconds (ns) for McBSP2. ‡ For all SPI slave modes, CLKG is programmed as 1/2 of the internal reference clock by setting CLKSM = CLKGDV = 1. Table 5−22. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)†‡ MASTER NO. PARAMETER SLAVE MIN MAX th(CKXL-FXL) Hold time, MCBSPx.FSX low after MCBSPx.CLKX low§¶ C − 10.5 P + 8.25 M25 td(FXL-CKXH) Delay time, MCBSPx.FSX low to MCBSPx.CLKX high§# 2C − 10.5 P + 8.25 M26 td(CKXH-DXV) Delay time, MCBSPx.CLKX high to MCBSPx.DX valid −9.75 10.25 M24 MIN MAX UNIT ns ns 2.75 5P + 34.5 ns † P =1/(DSPPER_CK or DSPXOR_CK) for McBSP1 and McBSP3, or 1/(ARMPER_CK clock frequency) in nanoseconds (ns) for McBSP2. ‡ For all SPI slave modes, CLKG is programmed as 1/2 of the internal reference clock by setting CLKSM = CLKGDV = 1. § T = CLKX period = (1 + CLKGDV) * P C = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even. ¶ FSRP = FSXP = 1. As a SPI master, MCBSPx.FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on MCBSPx.FSX and MCBSPx.FSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP # MCBSPx.FSX must be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (MCBSPx.CLKX). LSB MSB M32 M33 MCBSPx.CLKX M24 M25 MCBSPx.FSX M26 MCBSPx.DX_or _DR_(Master) Bit 0 Bit (n−1) Bit (n−2) M30 MCBSPx.DX_or _DR_(Slave) Bit 0 Bit (n−1) Bit (n−2) Bit (n−3) Bit (n−4) M31 Bit (n−3) Bit (n−4) Figure 5−36. McBSP Timings as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 240 SPRS231E December 2003 − Revised December 2005 Electrical Specifications Table 5−23. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)†‡ MASTER NO. M39 tsu(DRV-CKXH) Setup time, MCBSPx.DR valid before MCBSPx.CLKX high M40 th(CKXH-DRV) Hold time, MCBSPx.DR valid after MCBSPx.CLKX high M41 M42 † ‡ MIN tsu(FXL-CKXH) tc(CKX) Setup time, MCBSPx.FSX low before MCBSPx.CLKX high MAX SLAVE MIN MAX UNIT 33.25 0 ns −1 6P + 9 ns McBSP1 5 McBSP2 5 McBSP3 6 Cycle time, MCBSPx.CLKX 2P ns 16P ns P =1/(DSPPER_CK or DSPXOR_CK) for McBSP1 and McBSP3, or 1/(ARMPER_CK clock frequency) in nanoseconds (ns) for McBSP2. For all SPI slave modes, CLKG is programmed as 1/2 of the internal reference clock by setting CLKSM = CLKGDV = 1. Table 5−24. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)†‡ MASTER NO. PARAMETER SLAVE MIN MAX th(CKXL-FXL) Hold time, MCBSPx.FSX low after MCBSPx.CLKX low§¶ 2C − 10.5 P + 8.25 M35 td(FXL-CKXH) Delay time, MCBSPx.FSX low to MCBSPx.CLKX high§# C − 10.5 P + 8.25 M36 td(CKXL-DXV) Delay time, MCBSPx.CLKX low to MCBSPx.DX valid −9.75 10.25 M34 MIN MAX UNIT ns ns 2.75 5P + 34.5 ns † P =1/(DSPPER_CK or DSPXOR_CK) for McBSP1 and McBSP3, or 1/(ARMPER_CK clock frequency) in nanoseconds (ns) for McBSP2. ‡ For all SPI slave modes, CLKG is programmed as 1/2 of the internal reference clock by setting CLKSM = CLKGDV = 1. § T = CLKX period = (1 + CLKGDV) * P C = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even. ¶ FSRP = FSXP = 1. As a SPI master, MCBSPx.FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on MCBSPx.FSX and MCBSPx.FSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP # MCBSPx.FSX must be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (MCBSPx.CLKX). LSB MSB M41 M42 MCBSPx.CLKX M34 M35 MCBSPx.FSX M36 MCBSPx.DX_or _DR_(Master) Bit 0 Bit (n−1) Bit (n−2) M39 MCBSPx.DX_or _DR_(Slave) Bit 0 Bit (n−1) Bit (n−3) Bit (n−4) M40 Bit (n−2) Bit (n−3) Bit (n−4) Figure 5−37. McBSP Timings as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 December 2003 − Revised December 2005 SPRS231E 241 Electrical Specifications Table 5−25. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)†‡ MASTER NO. M49 tsu(DRV-CKXH) Setup time, MCBSPx.DR valid before MCBSPx.CLKX high M50 th(CKXH-DRV) Hold time, MCBSPx.DR valid after MCBSPx.CLKX high M51 M52 † ‡ MIN tsu(FXL-CKXL) tc(CKX) Setup time, MCBSPx.FSX low before MCBSPx.CLKX low MAX SLAVE MIN MAX UNIT 33.25 0 ns −1 6P + 9 ns McBSP1 5 McBSP2 5 McBSP3 6 Cycle time, MCBSPx.CLKX 2P ns 16P ns P =1/(DSPPER_CK or DSPXOR_CK) for McBSP1 and McBSP3, or 1/(ARMPER_CK clock frequency) in nanoseconds (ns) for McBSP2. For all SPI slave modes, CLKG is programmed as 1/2 of the internal reference clock by setting CLKSM = CLKGDV = 1. Table 5−26. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)†‡ MASTER NO. PARAMETER M43 th(CKXH-FXL) Hold time, MCBSPx.FSX low after MCBSPx.CLKX high§¶ M44 td(FXL-CKXL) Delay time, MCBSPx.FSX low to MCBSPx.CLKX low§# M45 td(CKXL-DXV) Delay time, MCBSPx.CLKX low to MCBSPx.DX valid SLAVE MIN MAX C − 10.5 P + 8.25 ns 2C − 10.5 P + 8.25 ns −9.75 10.25 2.75 MAX UNIT MIN 5P + 34.5 ns † P =1/(DSPPER_CK or DSPXOR_CK) for McBSP1 and McBSP3, or 1/(ARMPER_CK clock frequency) in nanoseconds (ns) for McBSP2. ‡ For all SPI slave modes, CLKG is programmed as 1/2 of the internal reference clock by setting CLKSM = CLKGDV = 1. § T = CLKX period = (1 + CLKGDV) * P C = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even. ¶ FSRP = FSXP = 1. As a SPI master, MCBSPx.FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on MCBSPx.FSX and MCBSPx.FSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP # MCBSPx.FSX must be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (MCBSPx.CLKX). LSB MSB M51 M52 MCBSPx.CLKX M43 M44 MCBSPx.FSX M45 MCBSPx.DX_or _DR_(Master) Bit 0 Bit (n−1) Bit (n−2) M49 MCBSPx.DX_or _DR_(Slave) Bit 0 Bit (n−1) Bit (n−3) Bit (n−4) M50 Bit (n−2) Bit (n−3) Bit (n−4) Figure 5−38. McBSP Timings as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 242 SPRS231E December 2003 − Revised December 2005 Electrical Specifications Table 5−27. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)†‡ MASTER NO. M58 tsu(DRV-CKXL) Setup time, MCBSPx.DR valid before MCBSPx.CLKX low M59 th(CKXL-DRV) Hold time, MCBSPx.DR valid after MCBSPx.CLKX low M60 M61 † ‡ MIN tsu(FXL-CKXL) tc(CKX) Setup time, MCBSPx.FSX low before MCBSPx.CLKX low MAX SLAVE MIN MAX UNIT 33.25 0 ns −1 6P + 9 ns McBSP1 5 McBSP2 5 McBSP3 6 Cycle time, MCBSPx.CLKX 2P ns 16P ns P =1/(DSPPER_CK or DSPXOR_CK) for McBSP1 and McBSP3, or 1/(ARMPER_CK clock frequency) in nanoseconds (ns) for McBSP2. For all SPI slave modes, CLKG is programmed as 1/2 of the internal reference clock by setting CLKSM = CLKGDV = 1. Table 5−28. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)†‡ MASTER NO. PARAMETER M53 th(CKXH-FXL) Hold time, MCBSPx.FSX low after MCBSPx.CLKX high§¶ M54 td(FXL-CKXL) Delay time, MCBSPx.FSX low to MCBSPx.CLKX low§# M55 td(CKXH-DXV) Delay time, MCBSPx.CLKX high to MCBSPx.DX valid SLAVE MIN MAX 2C − 10.5 P + 8.25 ns C − 10.5 P + 8.25 ns −9.75 10.25 2.75 MAX UNIT MIN 5P + 34.5 ns † P =1/(DSPPER_CK or DSPXOR_CK) for McBSP1 and McBSP3, or 1/(ARMPER_CK clock frequency) in nanoseconds (ns) for McBSP2. ‡ For all SPI slave modes, CLKG is programmed as 1/2 of the internal reference clock by setting CLKSM = CLKGDV = 1. § T = CLKX period = (1 + CLKGDV) * P C = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even. ¶ FSRP = FSXP = 1. As a SPI master, MCBSPx.FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on MCBSPx.FSX and MCBSPx.FSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP # MCBSPx.FSX must be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (MCBSPx.CLKX). LSB MSB M60 M61 MCBSPx.CLKX M53 M54 MCBSPx.FSX M55 MCBSPx.DX_or _DR_(Master) Bit 0 Bit (n−1) Bit (n−2) M58 MCBSPx.DX_or _DR_(Slave) Bit 0 Bit (n−1) Bit (n−3) Bit (n−4) M59 Bit (n−2) Bit (n−3) Bit (n−4) Figure 5−39. McBSP Timings as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 December 2003 − Revised December 2005 SPRS231E 243 Electrical Specifications 5.11 Multichannel Serial Interface (MCSI) Timing Table 5−29 and Table 5−30 assume testing over recommended operating conditions (see Figure 5−40 and Figure 5−41). Table 5−29. MCSI Timing Requirements NO. MC5 MIN 1/[tc(CLK)] Operating frequency, MCSIx.CLK† MAX UNIT B‡ MHz Slave 0.45P§ 0.55P§ ns 18 ns 18 ns MC6 tw(CLK) Pulse duration, MCSIx.CLK high or low Slave MC7 tr(CLK) Rise time, MCSIx.CLK Slave MC8 tf(CLK) Fall time, MCSIx.CLK Slave MC9 tsu(FSH-CLKL) Setup time, external MCSIx.SYNC high before MCSIx.CLK low¶ Slave 12 ns MC10 th(CLKL-FSH) Hold time, external MCSIx.SYNC high after MCSIx.CLK low¶ Slave 5 ns Master 18 MC11 tsu(DIV-CLKL) Setup time, MCSIx.DIN valid before MCSIx.CLK low Slave 12 MC12 th(CLKL-DIV) Hold time, MCSIx.DIN valid after MCSIx.CLK low Master Slave ns 0 ns 5.8 † The clock polarity can be configured by software (bit CLOCK_POLARITY of MAIN_PARAMETERS_REG register). B = System clock frequency of OMAP5912 (12, 13, or 19.2 MHz) § P = MCSIx.CLK period tc(CLK) in nanoseconds ¶ The frame synchro polarity can be configured by software (bit FRAME_POLARITY of MAIN_PARAMETERS_REG register). ‡ Table 5−30. MCSI Switching Characteristics NO. PARAMETER MIN MAX UNIT 0.5B‡ MHz 0.45P§ 0.55P§ ns Master −2.5 4 ns Master −2.5 3 Slave 2.5 24 MC1 1/[tc(CLK)] Operating frequency, MCSIx.CLK† Master MC2 tw(CLK) Pulse duration, MCSIx.CLK high or low Master MC3 MC4 td(CLKH-FS) td(CLKH-DOV) Delay time, MCSIx.CLK high to MCSIx.SYNC transition¶ Delay time, MCSIx.CLK high to MCSIx.DOUT valid ns † The clock polarity can be configured by software (bit CLOCK_POLARITY of MAIN_PARAMETERS_REG register). B = System clock frequency of OMAP5912 (12, 13, or 19.2 MHz) § P = MCSIx.CLK period tc(CLK) in nanoseconds ¶ The frame synchro polarity can be configured by software (bit FRAME_POLARITY of MAIN_PARAMETERS_REG register). ‡ 244 SPRS231E December 2003 − Revised December 2005 Electrical Specifications MC1 MC2 MC2 MCSIx.CLK MC3 MC3 MCSIx.SYNC (Norm._short) MC3 MC3 MSCIx.SYNC(Alt._short) MC3 MC3 MCSIx.SYNC(Norm._long) MC3 MC3 MCSIx.SYNC(Alt._long) MC4 MCSIx.DOUT Bit (n) Bit (n−1) MC12 MC11 MCSIx.DIN Bit (n) Bit (n−1) Bit (0) Bit (0) Figure 5−40. MCSI Master Mode Timing MC5 MC6 MC6 MCSIx.CLK MC10 MC9 MCSI.SYNC (Norm._short) MC9 MC10 MSCIx.SYNC(Alt._short) MC9 MC10 MCSIx.SYNC(Norm._long) MC9 MC10 MCSIx.SYNC(Alt._long) MC4 MCSIx.DOUT Bit (n) MC11 MCSIx.DIN Bit (n) Bit (n−1) MC12 Bit (n−1) Bit (0) Bit (0) Figure 5−41. MCSI Slave Mode Timing December 2003 − Revised December 2005 SPRS231E 245 Electrical Specifications 5.12 Serial Port Interface (SPI) Timing Table 5−31 and Table 5−32 assume testing over recommended operating conditions (see Figure 5−42) Table 5−31. SPI Interface Timing Requirements NO. SPI1 SPI2 MIN 1/tc(SCLK) Operating frequency, SPIF.SCK tw(SCLKH) Slave mode Pulse duration, SPIF.SCK high or low Slave mode SPI5 tsu(DV-CLKH) Setup time, SPIF.DIN valid before SPIF.SCK active edge§ SPI6 th(CLKH-DV) Hold time, SPIF.DIN valid after SPIF.SCK active edge§ 0.45P‡ Master mode 15 Slave mode 1 Master mode −3 Slave mode 1 MAX UNIT B† MHz 0.55P‡ ns ns ns † B = System clock frequency of OMAP5912 (12, 13, or 19.2 MHz) P = SPIF.SCK period tc(CLK) in nanoseconds § The polarity of SPIF.SCK and the active clock edge (rising or falling) on which DOUT is driven and DIN data is latched is all software configurable. These timing applies to all configurations regardless of SPIF.SCK polarity and which clock edges are used to drive output data and capture input data. ‡ Table 5−32. SPI Interface Switching Characteristics NO. † ‡ PARAMETER MIN MAX UNIT B† MHz SPI1 1/tc(SCLK) Operating frequency, SPIF.SCK Master mode SPI2 tw(SCLKH) Pulse duration, SPIF.SCK high or low Master mode 0.45P‡ 0.55P‡ ns SPI3 td(CS-SCLK) Delay time, SPIF.CSx active to SPIF.SCK active Master mode P‡ P + 5‡ ns Master mode 1 6 SPI4 td(SCLK-DOUT) Delay time, SPIF.SCK active edge to SPIF.DOUT transition Slave mode 5 17 ns B = System clock frequency of OMAP5912 (12, 13, or 19.2 MHz) P = SPIF.SCK period tc(CLK) in nanoseconds SPIF.CSx SPI2 SPI3 SPI1 SPI2 SPI3 SPIF.SCK SPI4 SPIF.DOUT Bit out (n) Bit out (n−1) Bit out (n−2) Bit out (0) Bit in (n−2) Bit in (0) SPI6 SPI5 SPIF.DIN Bit in (n) Bit in (n−1) Figure 5−42. SPI Interface—Transmit and Receive in Master or Slave Timing 246 SPRS231E December 2003 − Revised December 2005 Electrical Specifications 5.13 Parallel Camera Interface Timing Table 5−33 assumes testing over recommended operating conditions (see Figure 5−43). Table 5−33. Camera Interface Timing Requirements NO. MIN C1 1/[tc(LCLK)] Operating frequency, CAM.LCLK C3 tw(LCLK) Pulse duration, CAM.LCLK high or low 0.45P1† CAM.LCLK‡ C5 tr(LCLK) Rise time, C6 tf(LCLK) Fall time, CAM.LCLK‡ MAX UNIT 80 MHz 0.55P1† ns 0.25P1† ns 0.25P1† ns C9 tsu(DV-LCLKH) Setup time, CAM.D[7:0] data valid before CAM.LCLK high 1§ C10 th(LCLKH-DV) Hold time, CAM.D[7:0] data valid after CAM.LCLK high 6§ ns C11 tsu(CAM.VS/HS-LCLKH) Setup time, CAM.VS/CAM.HS active before CAM.LCLK high 1§ ns Hold time, CAM.VS/CAM.HS active after CAM.LCLK high 6§ ns C12 th(LCLKH-CAM.VS/HS) ns † P1 = Period of CAM.LCLK in nanoseconds (ns). ‡ In this table, the timing values of parameters C5 and C6 (CAM.LCLK) are given by considering the CMOS thresholds: 0.3DV DD to 0.7DVDD. By considering tr and tf time from 10% to 90% of DVDD, tr and tf = 0.45P1 for parameters C5 and C6. § The polarity of CAM.LCLK is selectable via the POLCLK bit in the CTRLCLOCK register. Although data is latched on rising CAM.LCLK in the timing diagrams, these timing parameters also apply to falling CAM.LCLK when POLCLK = 1. C3 C1 C3 CAM.LCLK C11 C12 CAM.VS C11 C12 CAM.HS C10 C10 C9 CAM.D[7:0] C9 U1 Y1 V1 Yn Figure 5−43. Camera Interface Timing December 2003 − Revised December 2005 SPRS231E 247 Electrical Specifications 5.14 LCD Controller and LCDCONV Interfaces Timing Table 5−34 assumes testing over recommended operating conditions (see Figure 5−44 and Figure 5−45). Table 5−34. LCD Controller and LCDCONV Switching Characteristics† NO. PARAMETER MIN L1 1/[tc(PCLK)] Operating frequency, LCD.PCLK L2 tw(PCLK) Pulse duration, LCD.PCLK high or low L3 tr(PCLK) L4 tf(PCLK) L5 td(CLK-VS) Delay time, LCD.PCLK to LCD.VS transition L6 td(CLK-HS) Delay time, LCD.PCLK to LCD.HS transition L7 L8 L9 td(CLK-PV) td(CLK-PIV) td(CLK-AC) UNIT 20 MHz 0.6P‡§ ns Rise time, LCD.PCLK 15 ns Fall time, LCD.PCLK 15 ns −1 1.5 ns −1 1.5 ns Delay time, LCD.PCLK to pixel data valid (LCD.P[15:0]) Delay time, LCD.PCLK to pixel data invalid (LCD.P[15:0]) 0.4P‡§ MAX LCD 16-bit mode (LCDCONV bypassed) 2 LCD 18-bit mode through LCDCONV (LCD.RED0 and LCD.BLUE0) 7 LCD 16-bit mode (LCDCONV bypassed) LCD 18-bit mode through LCDCONV (LCD.RED0 and LCD.BLUE0) Delay time, LCD.PCLK to LCD.AC transition ns −1 ns −3.5 B − 2¶ B + 1¶ ns † Although timing diagrams illustrate the logical function of the TFT mode, static timing applies to all supported modes of operation. Likewise, LCD.HS, LCD.VS, and LCD.AC are shown as active-low, but each can optionally be configured as active-high. ‡ P = Period of the LCD pixel clock § The pixel clock is created in a divider that may also be programmed to divide by odd numbers. In such case, the duty cycle at the output of the divider is influenced by the division ratio. ¶ B = Period of internal undivided pixel clock 248 SPRS231E December 2003 − Revised December 2005 Electrical Specifications VSW HFP LCD_clock(internal) VBP HBP HFP PPL LCD.PCLK L5 L5 LCD.VS L6 L6 LCD.HS L8 L7 LCD.RED,BLUE,P[15:0] D2 D1 Dn L9 L9 LCD.AC NOTES: A. Different combinations of LCD signals behaviors can be attained by programming the LCD_TIMING_2 register. This figure corresponds to bits combination: PHSVSRF = 0, IEO = 1, IPC = 0, IHS = 1, IVS = 1, and PCD = 2. B. Delays for HSW (LCD.HS width), VSW (LCD.VS width), VBP (vertical back porch), HFP (horizontal front porch), HBP (horizontal back porch), and PPL (pixels per line) are programmable in number of LCD.PCLK cycles via the LCD configuration registers. C. Pins LCD.RED0 and LCD.BLUE0 have the same behavior than LCD.P[15:0] signals. They are only available in 18-bit LCD mode (through LCDCONV interface). Figure 5−44. TFT Mode (LCD.HS/LCD.VS on Falling and LCD.Px on Rising LCD.PCLK—PCD = 2) VSW HFP VBP HBP HFP PPL LCD_clock(internal) LCD.PCLK L5 L5 LCD.VS L6 L6 LCD.HS L8 L7 LCD.RED,BLUE,P[15:0] D1 L9 D2 Dn L9 LCD.AC NOTES: A. Different combinations of LCD signals behavior are available by programming the LCD_TIMING_2 register. This figure corresponds to bits combination: PHSVSRF = 1, IEO = 1, IPC = 1, IHS = 1, IVS = 1, and PCD = 3. B. Delays for HSW (LCD.HS width), VSW (LCD.VS width), VBP (vertical back porch), HFP (horizontal front porch), HBP (horizontal back porch), and PPL (pixels per line) are programmable in number of LCD.PCLK cycles via the LCD configuration registers. C. Pins LCD.RED0 and LCD.BLUE0 have the same behavior as the LCD.P[15:0] signals. They are only available in 18-bit LCD mode (through LCDCONV interface). Figure 5−45. TFT Mode (LCD.HS/LCD.VS on Rising and LCD.Px on Falling LCD.PCLK—PCD = 3) December 2003 − Revised December 2005 SPRS231E 249 Electrical Specifications 5.15 Multimedia Card/Secure Digital (MMC/SD) Timing Table 5−35 and Table 5−36 assume testing over recommended operating conditions (see Figure 5−46 through Figure 5−49). Table 5−35. MMC/SD Timing Requirements NO. MIN M1 tsu(CMDV-CLKH) Setup time, MMC.CMD valid before MMC.CLK high M2 th(CLKH-CMDV) Hold time, MMC.CMD valid after MMC.CLK high M3 tsu(DATV-CLKH) Setup time, MMC.DATx valid before MMC.CLK high M4 th(CLKH-DATV) Hold time, MMC.DATx valid after MMC.CLK high MAX UNIT 10 ns 2 ns 10 ns 2 ns Table 5−36. MMC/SD Switching Characteristics NO. † PARAMETER MIN MAX UNIT MMC Card 20 MHz SD Card 25 ns M7 1/[tc(CLK)] Operating frequency, MMC.CLK M8 tw(CLKH) Pulse Duration, MMC.CLK low 0.45P† 0.55P† ns 0.45P† 0.55P† ns M9 tw(CLKL) Pulse Duration, MMC.CLK high M10 td(CLKL-CMD) Delay time, MMC.CLK low to MMC.CMD transition −1 5 ns M11 td(CLKL-DAT) Delay time, MMC.CLK low to MMC.DATx transition −1 5 ns P is the period of the MMC.CLK clock. M8 M7 M9 MMC.CLK M10 M10 START MMC.CMD M10 XMIT Valid Valid M10 Valid END Figure 5−46. MMC/SD Host Command Timing M7 M8 M9 MMC.CLK M1 M2 MMC.CMD START M1 M2 XMIT Valid Valid Valid END Figure 5−47. MMC/SD Card Response Timing 250 SPRS231E December 2003 − Revised December 2005 Electrical Specifications M8 M9 M7 MMC.CLK M11 M11 M11 START MMC.DATx D0 D1 M11 Dx END Figure 5−48. MMC/SD Host Write Timing M8 M9 M7 MMC.CLK M4 M4 M3 MMC.DATx Start M3 D0 D1 Dx End Figure 5−49. MMC/SD Host Read and Card CRC Status Timing December 2003 − Revised December 2005 SPRS231E 251 Electrical Specifications 5.16 Inter-Integrated Circuit (I2C) Timing Table 5−37 assumes testing over recommended operating conditions (see Figure 5−50). Table 5−37. I2C Signals (I2C.SDA and I2C.SCL) Switching Characteristics NO. STANDARD MODE PARAMETER MIN FAST MODE MAX MIN UNIT MAX IC1 tc(SCL) Cycle time, I2C.SCL 10† 2.5 µs IC2 tsu(SCLH-SDAL) Setup time, I2C.SCL high before I2C.SDA low (for a repeated START condition) 4.7 0.6 µs IC3 th(SCLL-SDAL) Hold time, I2C.SCL low after I2C.SDA low (for a repeated START condition) 4 0.6 µs IC4 tw(SCLL) Pulse duration, I2C.SCL low 4.7 1.3 µs IC5 tw(SCLH) Pulse duration, I2C.SCL high 4 0.6 µs IC6 tsu(SDA-SDLH) Setup time, I2C.SDA valid before I2C.SCL high 100 ns 250 I2C IC7 th(SDA-SDLL) Hold time, I2C.SDA valid after I2C.SCL low (for IC8 tw(SDAH) Pulse duration, I2C.SDA high between STOP and START conditions bus devices) ‡ 0 0 4.7 1.3 0.9 µs µs IC9 tr(SDA) Rise time, I2C.SDA 1000§ IC10 tr(SCL) Rise time, I2C.SCL 1000§ 300§ ns IC11 tf(SDA) Fall time, I2C.SDA 300§ 300§ ns 300§ 300§ IC12 tf(SCL) Fall time, I2C.SCL IC13 tsu(SCLH-SDAH) Setup time, I2C.SCL high before I2C.SDA high (for STOP condition) IC14 tw(SP) Pulse duration, spike (must be suppressed) IC15 Cb¶ Capacitive load for each bus line 4.0 300§ ns 0 400 ns µs 0.6 50 ns 400 pF In the master-only I2C operating mode of OMAP5912, minimum cycle time for I2C.SCL is 12 µs. ‡ The maximum t h(SCLL-SDAL) has only to be met if the device does not stretch the low period (tw(SCLL)) of the I2C.SCL signal. § Max of fall and rise times were measured while considering an internal pullup value of 520 Ω. ¶ C = The total capacitance of one bus line in pF. b † I2C.SDA IC6 IC8 IC14 IC4 IC13 IC5 IC10 I2C.SCL IC1 IC12 IC3 IC2 IC7 IC3 Stop Start Repeated Start Stop NOTES: A. A device must internally provide a hold time of at least 300 ns for the I2C.SDA signal (referred to the VIHmin of the I2C.SCL signal) to bridge the undefined region of the falling edge of I2C.SCL. B. The maximum th(SCLL−SDAL) has only to be met if the device does not stretch the LOW period (tw(SCLL)) of the I2C.SCL signal. C. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tsu(SDA−SDLH) • 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the I2C.SCL signal. If such a device does stretch the LOW period of the I2C.SCL signal, it must output the next data bit to the I2C.SDA line tr max + tsu(SDA−SDLH) = 1000 + 250 = 1250 ns (according to the standard-mode I2C-bus specification) before the I2C.SCL line is released. D. Cb = total capacitance of one bus line in pF. If mixed with fast-mode devices, faster fall times are allowed. Figure 5−50. I2C Timings 252 SPRS231E December 2003 − Revised December 2005 Electrical Specifications 5.17 Universal Serial Bus (USB) Timing All OMAP5912 USB interfaces are compliant with Universal Serial Bus Specifications, Revision 1.1. Table 5−38 assumes testing over recommended operating conditions (see Figure 5−51). Table 5−38. USB Integrated Transceiver Interface Switching Characteristics NO. U1 LOW SPEED 1.5 Mbsp PARAMETER tr Rise time, USB.DP and USB.DM signals† signals† FULL SPEED 12 Mbsp UNIT MIN MAX MIN MAX 75† 300† 4† 20† ns 75† 300† 4† 20† ns U2 tf Fall time, USB.DP and USB.DM U3 tRFM Rise/Fall time matching‡ 80‡ 125‡ 90‡ 111.11‡ % U4 VCRS Output signal cross-over voltage† 1.3† 2† 1.3† 2† V −25§ 25§ −2§ 2§ ns 12 MHz U5 tjr Differential propagation U6 fop Operating frequency¶ jitter§ 1.5 † Low speed: CL = 200 pF. High speed: CL = 50 pF. tRFM = (tr/tf) × 100 §t =t jr px(1) − tpx(0) ¶ f = 1/t op per ‡ REF clock† tpx(0) USB.DM VCRS USB.DP VOH VOL 10% U1 † tpx(1) tper − tjr 90% U2 “REF clock” is not an actual device signal, but an ideal reference clock against which relative timings are specified. REF clock is assumed to be 12 MHz for full-speed mode or 1.5 MHz for low-speed mode. Figure 5−51. USB Integrated Transceiver Interface Timings December 2003 − Revised December 2005 SPRS231E 253 Electrical Specifications 5.18 MICROWIRE Interface Timing Table 5−39 and Table 5−40 assume testing over recommended operating conditions (see Figure 5−52). Table 5−39. MICROWIRE Timing Requirements NO. † MIN edge† W5 tsu(SDI-SCLK) Setup time, UWIRE.SDI valid before UWIRE.SCLK active W6 th(SCLK-SDI) Hold time, UWIRE.SDI invalid after UWIRE.SCLK active edge† MAX UNIT 16 ns 1 ns Polarity of UWIRE.SCLK and the active clock edge (rising or falling) on which SDO data is driven and SDI data is latched is all software-configurable. These timings apply to all configurations regardless of UWIRE.SCLK polarity and which clock edges are used to drive output data and capture input data. Table 5−40. MICROWIRE Switching Characteristics NO. PARAMETER MIN W1 fop(SCLK) Operating frequency, UWIRE.SCLK W2 tw(SCLK) Pulse duration, UWIRE.SCLK high/low transition† W3 td(SCLK-SDO) Delay time, UWIRE.SCLK active edge to UWIRE.SDO W4 td(CS-SCLK) Delay time, UWIRE.CSx active to UWIRE.SCLK active† MAX UNIT 0.25B‡ MHz 0.45P§ 0.55P§ ns −2 6 ns 1.5P§ ns † Polarity of UWIRE.SCLK and the active clock edge (rising or falling) on which SDO data is driven and SDI data is latched is all software-configurable. These timings apply to all configurations regardless of UWIRE.SCLK polarity and which clock edges are used to drive output data and capture input data. ‡ B = system clock of the OMAP5912 (12, 13, or 19.2 MHz). § P = UWIRE.SCLK cycle time in nanoseconds (ns). UWIRE.CSx W2 W4 [1/W1] W2 W4 UWIRE.SCLK W3 W3 UWIRE.SDO Valid Valid Valid W5 UWIRE.SDI W6 Valid Valid Valid NOTE: The polarities of UWIRE.CSx and UWIRE.SCLK and the active UWIRE.SCLK edges on which SDO is driven and SDI is sampled are all software-configurable. Figure 5−52. MICROWIRE Timings 254 SPRS231E December 2003 − Revised December 2005 Electrical Specifications 5.19 HDQ/1-Wire Interface Timing Table 5−41 and Table 5−42 assume testing over recommended operating conditions (see Figure 5−53 through Figure 5−59). Table 5−41. HDQ/1-Wire Timing Requirements† SYSTEM CLOCK = 12 MHz NO. MIN † H1 t(CYCH) Read bit windows timing H2 t(HW1) Read bit−one time H3 t(HW0) Read bit−zero time W2 t(PDH) Presence pulse delay W3 t(PDL) Presence pulse low W6 t(RDV) + t(REL) Read bit cycle time SYSTEM CLOCK = 13 MHz MAX 253 MIN SYSTEM CLOCK = 19.2 MHz MAX MIN 234 180 63 42 166 63 63 − W2 42 µs µs 42 – W2 102 µs µs 112 68 68 – W2 µs 158 68 UNIT MAX 94 63 µs HDQ timing is OMAP5912 default. 1-Wire timing is selectable through software. Table 5−42. HDQ/1-Wire Switching Characteristics NO. PARAMETER SYSTEM CLOCK = 12 MHz SYSTEM CLOCK = 13 MHz SYSTEM CLOCK = 19.2 MHz UNIT H5 t(CYCD) Write bit windows timing 232 214 145 µs H6 t(DW1) Write bit-one time 1.3 1.2 0.81 µs H7 t(DW0) Write bit-zero time 101 93 63 µs H8 t(B) Break timing 192 178 120 µs H9 t(BR) Break recovery time 63 58 39 µs W1 t(RSTL) Reset time low 484 447 302 µs W4 t(RSTH) Reset time high 484 447 302 µs W5 t(LOWR) Read bit strobe time 13 12 8 µs W7 t(REC) Recovery time 134 124 83 µs W8 t(LOW1) Write bit-one time 1.3 1.2 0.8 µs W9 t(LOW0) Write bit-zero time 101 93 63 µs W10 t(SLOT) Write bit cycle time 102 94 63 µs H8 H9 HDQ Figure 5−53. HDQ Break (Reset) Timing H1 H3 H2 HDQ Read 1 Read 0 Figure 5−54. HDQ Interface Reading From HDQ Slave Device December 2003 − Revised December 2005 SPRS231E 255 Electrical Specifications H5 H7 H6 HDQ Write 1 Write 0 Figure 5−55. HDQ Interface Writing to HDQ Slave Device COMMAND_BYTE_WRITTEN DATA_BYTE_RECEIVED 0_(LSB) Break t(RSPS) 1 6 1 7_(MSB) 0_(LSB) 6 HDQ Figure 5−56. Typical Communication Between OMAP5912 HDQ and HDQ Slave W4 1−WIRE W1 W2 W3 Figure 5−57. HDQ/1-Wire Break (Reset) Timing W7 1−WIRE W5 W6 Figure 5−58. 1-Wire Interface Reading from 1-Wire Slave Device W7 1−WIRE W8 W9 W10 Figure 5−59. 1-Wire Interface Writing to 1-Wire Slave Device 256 SPRS231E December 2003 − Revised December 2005 Electrical Specifications 5.20 Embedded Trace Macrocell (ETM) Interface Timing Table 5−43 assumes testing over recommended operating operations (see Figure 5−60 through Figure 5−61). Table 5−43. ETM Interface Switching Characteristics NO. 1/tc(CLKI) Operating frequency, ETM internal clock ETM2 1/tc(CLK) Operating frequency, ETM.CLK (external) clock ETM3 ETM4 ETM5 † PARAMETER ETM1 td(CLKIH-SYNCV) Delay time, ETM clock high to ETM.SYNCx valid td(CLKIH-SYNCIV) Delay time, ETM clock high to ETM.SYNCx invalid td(CLKH-PSTATV) Delay time, ETM clock high to ETM.PSTATx valid td(CLKH-PSTATIV) Delay time, ETM clock high to ETM.PSTATx invalid td(CLKH-DV) Delay time, ETM clock high to ETM.Dx valid td(CLKH-DIV) Delay time, ETM clock high to ETM.Dx invalid MIN MAX UNIT 192 MHz 96 MHz 0.5P + 0.7† 0.5P − 0.8† ns 0.5P + 0.82† 0.5P − ns 1.75† ns ns 0.5P + 1.6† 0.5P − 1.8† ns ns P = Internal clock period ETM1 INTERNAL_ETM_CLK ETM2 ETM.CLK ETM3 ETM3 ETM4 ETM4 ETM5 ETM5 ETM.SYNC ETM.PSTAT[2:0] ETM.D[7:0] NOTE: Internal_ETM_CLK signal represents the internal ETM clock signal given as reference to express delay time. Figure 5−60. Normal Mode—Half Rate Clock, Rising and Falling Clock Edge December 2003 − Revised December 2005 SPRS231E 257 Electrical Specifications ETM1 INTERNAL_ETM_CLK ETM2 ETM.CLK ETM3 ETM3 ETM4 ETM4 ETM5 ETM5 ETM.SYNC[0]_A ETM.PSTAT[2:0]_A ETM.D[3:0]_A ETM3 ETM3 ETM4 ETM4 ETM5 ETM5 ETM.SYNC[1]_B ETM.PSTAT[5:3]_B ETM.D[7:4]_B NOTE: Internal_ETM_CLK signal represents the internal ETM clock signal given as reference to express delay time. Figure 5−61. Demultiplexed Mode of Full Rate Clock—Rising Clock Edge 258 SPRS231E December 2003 − Revised December 2005 Glossary 6 Glossary ACRONYM DEFINITION 3DES triple data encryption security AAC Advanced Audio Coding (standard) (ISO/IEC 13818-7) AC97 Interface Standard for Codecs ALE address latch enable ALU arithmetic/logic unit AMR adaptive multi-rate APE application chip APLL analog phase-locked loop ASRAM asynchronous static random-access memory AU address unit BCD binary coded decimal BGA ball grid array BIST built-in self-test CBC cipher block chaining CE chip enable CFB cipher feedback CLE common latch enable CMOS complementary metal oxide semiconductor CMT cellular mobile telephone CP15 coprocessor 15 CPU central processing unit CRC cyclic redundancy check CS chip select CSL Chip Support Library CTS clear-to-send DARAM dual-access random-access memory DCDL digitally controlled delay element DCT discrete cosine transform DDR dual data rate DES data encryption security DMA direct memory access DPLL digital phase-locked loop DSP digital signal processor DSPLIB DSP Library DSR data-set-ready DTR data-terminal-ready DU data unit ECB electronic codebook December 2003 − Revised December 2005 SPRS231E 259 Glossary ACRONYM DEFINITION EEPROM electrically erasable programmable read-only memory EMIFF external memory interface fast EMIFS external memory interface slow EOF end of file EP endpoint ESD electrostatic discharge ETM Embedded Trace Macrocell FAC frame adjustment counter FFT Fast Fourier Transform FIFO first-in first out FIQ fast interrupt request FIR fast infrared GP general-purpose GPIO general-purpose input/output GPRS General Packet Radio Service GSM Global System for Mobile Communications H.26x an ITU-TSS standard HBM Human Body Model HC host controller HCI host controller interface HOM host-only mode HS high-speed I-cache instruction cache I2C Inter-integrated circuit I2S Inter-IC Sound (specification) iDCT Inverse Discrete Cosine Transform IDE integrated development environment I/F interface IFR Interrupt Flag Register IMGLIB Image/Video Processing Library IMR Interrupt Mask Register IO input/output IOM-2 ISDN Oriented Modular Interface Revision 2 IrDA infrared data adapter IRQ interrupt request IU instruction unit IV initialization vector JPEG Joint Photographic Experts Group JTAG Joint Test Action Group, IEEE 1149.1 standard 260 SPRS231E December 2003 − Revised December 2005 Glossary ACRONYM DEFINITION LB local bus LCD liquid-crystal display LH local host LPG LED pulse generator light pulse generation LSB least significant bit LVCMOS low-voltage CMOS MAC multiply-accumulate McBSP multichannel buffered serial port MCSI multichannel serial interface MD5 Message-Digest Algorithm developed by R. Rivest MIR medium infrared MMC multimedia card MMC/SD multimedia card/secure digital multimedia card/secure data MMU memory management unit MPEG Moving Picture Experts Group MPU microprocessor unit MPUI microprocessor unit interface MPUIO microprocessor unit I/O MSB most significant bit MVIP multi-vendor integration protocol OCP open core protocol ODM original design manufacturer OEM original equipment manufacturer OFB output feedback OHCI open host controller interface OS operating system OTG on-the-go PCM pulse code modulation PI pixel interpolation PU program unit PWL pulse-width light pulse width length PWM pulse width modulation PWT pulse-width tone pulse width time R/B read/busy RAM random-access memory RE read enable December 2003 − Revised December 2005 SPRS231E 261 Glossary ACRONYM DEFINITION RGB red green blue RISC reduced instruction set computer RNG random number generator ROM read-only memory RTC real-time clock RTS request-to-send RX receive SAM shared-access mode SARAM single-access random-access memory SD secure digital SDR single data rate SDRAM synchronous dynamic random-access memory SDW short distance wireless SIR slow infrared SPI serial port interface serial peripheral interface SRAM static random-access memory SRG Sample Rate Generator STN super twisted nematic T1/E1 T1 is a digital transmission link with a capacity of 1.544 Mbps. It uses two pairs of normal twisted-wires and can handle 24-voice conversations, each digitized using mu-law coding at 64 kbps. T1 is used in USA, Canada, Hong Kong, and Japan. E1 is a digital transmission link with a capacity of 2.048 Mbps. It is the European equivalent of T1. It can handle 30-voice conversations, each digitized using A-law coding at 64 kbps. TAP test access port TC traffic controller TDES triple data encryption security TFT thin-film transistor TI Texas Instruments TIPB TI peripheral bus TLB Translation Look-Aside Buffer TTB Translation Table Base TX transmit UART universal asynchronous receiver/transmitter ULPD ultra low-power device URL uniform resource locator USB universal serial bus VIA versatile interconnection architecture VIVT virtual index virtual tag WB write buffer 262 SPRS231E December 2003 − Revised December 2005 Glossary ACRONYM DEFINITION WDT watchdog timer WE write enable WMA Windows Media Audio WMV Windows Media Video WP write protect December 2003 − Revised December 2005 SPRS231E 263 Mechanical Data 7 Mechanical Data 7.1 Package Thermal Resistance Characteristics Table 7−1 and Table 7−2 provide the thermal resistance characteristics for the recommended package types used on the OMAP5912 device. Table 7−1. OMAP5912 Thermal Resistance Characteristics (ZZG) † RQJA (°C/W) RQJB (°C/W) RQJC (°C/W) BOARD TYPE† 32.2 10.9 10.4 High-K Board types are as defined by JEDEC. Reference JEDEC Standard JESD51−2, Test Boards for Area Array Surface-Mount Package Thermal Measurements. Table 7−2. OMAP5912 Thermal Resistance Characteristics (ZDY/GDY) † RQJA (°C/W) RQJB (°C/W) RQJC (°C/W) BOARD TYPE† 24.6 14.1 12.6 High-K Board types are as defined by JEDEC. Reference JEDEC Standard JESD51−2, Test Boards for Area Array Surface-Mount Package Thermal Measurements. 7.2 Packaging Information The following packaging information reflects the most current released data available for the designated device(s). This data is subject to change without notice and without revision of this document. 264 SPRS231E December 2003 − Revised December 2005 PACKAGE OPTION ADDENDUM www.ti.com 25-Oct-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty OMAP5912ZDY NRND BGA ZDY 289 OMAP5912ZDYA OBSOLETE BGA ZDY 289 OMAP5912ZZG NRND BGA MICROSTAR ZZG 289 84 160 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Pb-Free (RoHS) SNAGCU Level-3-260C-168 HR TBD Call TI Call TI Green (RoHS & no Sb/Br) SNAGCU Level-4-260C-72 HR Op Temp (°C) Device Marking (4/5) OMAP5912 OMAP ZDY OMAP5912ZZG OMAP TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. 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