HCS101 Fixed Code Encoder FEATURES The 8-pin HCS101 operates over a wide voltage range of 3.5V to 13.3V and has three button inputs allowing the system designer the freedom to utilize up to 7 functions. The only components required for device operation are the buttons and RF circuitry, allowing a very low system cost. Operating 2 Programmable 32-bit serial numbers 10-bit serial number 66-bit transmission code length Non-volatile 16-bit counter 3.5V -13.3V operation 3 inputs, 7 functions available Selectable baud rate Automatic code word completion Battery low signal transmitted to receiver PACKAGE TYPES PDIP, SOIC Other • • • • • • S0 1 S1 2 S2 3 NC 4 HCS101 • • • • • • • • • 8 VDD 7 NC 6 DATA 5 VSS KEELOQ® Pin-out compatible with most Encoders Simple programming interface On-chip EEPROM On-chip oscillator and timing components Button inputs have internal pull-down resistors Minimum External Components required HCS101 BLOCK DIAGRAM Power latching and switching Oscillator Controller RESET Circuit Typical Applications The HCS101 is ideal for remote control applications. These applications include: • • • • • • • Low-end automotive alarm systems Low-end automotive immobilizers Gate and garage door openers Identity tokens Low-end burglar alarm systems Fan and lighting controls Toys EEPROM DATA VSS Transmit register Button input port VDD S2 S1 S0 DESCRIPTION The HCS101 from Microchip Technology Inc. is a fixed code encoder designed for remote control systems. It provides a small package outline and low cost to make this device a perfect solution for unidirectional remote control systems. It is also pin compatible with Microchip’s HCS201 Code Hopping Encoder allowing easy upgrading to a more secure remote keyless entry (RKE) system. 1999-2013 Microchip Technology Inc. Preliminary DS41115D-page 1 HCS101 1.0 SYSTEM OVERVIEW The EEPROM data for each transmitter is programmed by the manufacturer at the time of production. As indicated in the block diagram in Figure 1-1, the HCS101 has a small EEPROM array, which must be loaded with several parameters before use. These parameters include: • • • • Any type of controller may be used as a receiver, but it is typically a microcontroller with compatible firmware that allows the receiver to operate in conjunction with a transmitter, based on the HCS101. Two 32-bit serial numbers 16-bit counter value Additional 10-bit serial number Configuration data FIGURE 1-1: BASIC OPERATION OF TRANSMITTER ENCODER Transmitted Information Serial Function Number 3 Bits Counter Serial Number 1 Function Bits EEPROM Array Serial Number 3 Counter Serial Number 1 DS41115D-page 2 Preliminary 1999-2013 Microchip Technology Inc. HCS101 2.0 DEVICE OPERATION As shown in the typical application circuits in Figure 21, the HCS101 is easy to use. It requires only the addition of buttons and RF circuitry for use as the transmitter in your application. A description of each pin is given in Table 2-1. FIGURE 2-1: TYPICAL CIRCUITS VDD B0 B1 S0 VDD S1 NC S2 DATA NC VSS The HCS101 will wake-up upon detecting a switch closure and then delay for a debounce delay (TDB) as shown in Figure 2-2. The device will then update the 16-bit counter before it loads the transmit register. The data is then transmitted serially on the DATA pin in Pulse Width Modulation (PWM) format. If additional buttons are pressed during a transmission, the current transmission is terminated. The HCS101 restarts and the new transmission will contain the latest button information. When all buttons are released, the device completes the current code word and then powers down. Released buttons do not terminate and/or restart transmissions. FIGURE 2-2: ENCODER OPERATION Power-Up (A button has been pressed) Tx out RESET and Debounce Delay 2 button remote control Sample Inputs VDD B3 B2 B1 B0 Update Counter Load Transmit Register S0 VDD S1 NC S2 DATA NC VSS Transmit Tx out Yes Buttons Added ? 4 button remote control Note: Up to 7 functions can be implemented by pressing more than one button simultaneously or by using a suitable diode array. TABLE 2-1: No All No Buttons Released ? Yes Complete Code Word Transmission PIN DESCRIPTIONS Stop Name Pin Number Description S0 1 Switch input 0 S1 2 Switch input 1 S2 3 Switch input 2/Clock pin for Programming mode NC 4 No connection VSS 5 Ground reference connection DATA 6 Pulse Width Modulation (PWM) output pin/Data pin for Programming mode NC 7 No connection VDD 8 Positive supply voltage connection 1999-2013 Microchip Technology Inc. Preliminary DS41115D-page 3 HCS101 3.0 TRANSMITTED WORD 3.2 3.1 Transmission Format (PWM Mode) The HCS101 transmits a 66-bit code word. The 66-bit word is constructed from the serial numbers, counter and function information. The code word format is shown in Figure 3-2. The HCS101 transmission is made up of several code words as shown in Figure 3-1. Each code word starts with a preamble and a header, followed by the data. The code word is followed by a guard period before the next code word begins. The same code word is transmitted as long as the button is pressed. Refer to Table 7-3 for transmission timing requirements. FIGURE 3-1: Code Word Organization Under normal conditions, serial number 1 is transmitted with the counter and serial number 3. If all the buttons are pressed, serial number 2 is transmitted in place of the counter and serial number 3. CODE WORD TRANSMISSION FORMAT TE LOGIC ‘0’ LOGIC ‘1’ Bit Period Preamble Tp Header Th Counter, SER_3 and Function SER_1 and Function Guard Time Tg Start Pulse (Te) FIGURE 3-2: ‘1’ (1 bit) VLOW (1 bit) CODE WORD ORGANIZATION Function** (0/4 bits) Serial Number 1 (32/28 bits)** Counter (16 bits) Function (4 bits) ‘00’ (2 bits) Serial Number 3 (10 bits) S2 S1 S0 S3* Serial Number 2*** (32 bits) S2 S1 S0 S3* LSb MSb * See Section 4.3.6, S3 Setting (S3SET) ** See Section 4.3.7 Extended Serial Number (XSER) Transmission Direction LSb first *** Serial Number 2 is transmitted when all buttons are pressed DS41115D-page 4 Preliminary 1999-2013 Microchip Technology Inc. HCS101 4.0 EEPROM MEMORY ORGANIZATION TABLE 4-2: Bit Number Bit Name 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 OSC0 OSC1 OSC2 OSC3 VLOWS BRS MTX4 TXEN S3SET XSER RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED The HCS101 contains 192 bits (12 x 16-bit words) of EEPROM memory as shown in Table 4-1. Further descriptions of the memory array are given in the following sections. TABLE 4-1: EEPROM MEMORY MAP WORD ADDRESS MNEMONIC DESCRIPTION 0 RESERVED Set to 0000H 1 RESERVED Set to 0000H 2 RESERVED Set to 0000H 3 RESERVED Set to 0000H 4 CNTR Counter 5 RESERVED Set to 0000H 6 SER_1 Device Serial Number 1 (word 0) 16 LSb’s 7 SER_1 Device Serial Number 1 (word 1) 16 MSb’s 4.1 4.3.1 OSCILLATOR TUNING BITS (OSC0 TO OSC3) These bits are used to tune the nominal frequency of the HCS101 to within ±10% of its nominal value over temperature and voltage. 8 SER_2 Device Serial Number 2 (word 0) 16 LSb’s 9 SER_2 Device Serial Number 2 (word 1) 16 MSb’s 4.3.2 10 SER_3 Device Serial Number 3 11 CONFIG Config Word The low voltage trip point select bit (VLOWS) and the S3 setting bit (S3SET) are used to determine the voltage level for the low voltage detector. CNTR (Counter) LOW VOLTAGE TRIP POINT SELECT (VLOWS) VLOWS S3SET* Trip Point 0 0 4.4 0 1 4.4 1 0 9 1 1 6.75 This is the 16-bit gray code counter value that can be used to track the number of times a transmitter has been activated. 4.2 SER_1, SER_2, SER_3 (Encoder Serial Number) SER_1, and SER_2 are the 32-bit device serial numbers. SER_3 is an additional 10-bit serial number transmitted with every transmission. The most significant 6 bits of the 16-bit SER_3 word are reserved and should be set to zero. 4.3 CONFIGURATION WORD Configuration Word The configuration word is a 16-bit word stored in the EEPROM array that is used by the device to store the status configuration options. Further explanations of each of the bits are described in the following sections. 1999-2013 Microchip Technology Inc. * See also Section 4.3.6 4.3.3 BAUDRATE SELECT BITS (BRS) BRS selects the speed of transmission and the code word blanking. Table 4-3 shows how the bit is used to select the different baud rates and Section 5.2 provides a detailed explanation of code word blanking. TABLE 4-3: 0 Basic Pulse Element 400µs Code Words Transmitted All 1 200µs 1 out of 2 BRS Preliminary BAUDRATE SELECT DS41115D-page 5 HCS101 4.3.4 MINIMUM FOUR TRANSMISSIONS (MTX4) If this bit is cleared, at least one code word is completed when the HCS101 is activated. If this bit is set, at least four complete code words are transmitted. 4.3.5 TRANSMIT PULSE ENABLE (TXEN) S3 SETTING (S3SET) 5.1 Code Word Completion 5.2 This bit determines the value of S3 in the function code during a transmission and the high trip point selected by VLOWS in Section 4.3.2. If this bit is cleared, S3 mirrors S2 during a transmission. If the S3SET bit is set, S3 in the function code is always set, independent of the value of S2. 4.3.7 SPECIAL FEATURES Code word completion is an automatic feature that ensures the entire code word is transmitted, even if the button is released before the transmission is complete. If the button is held down beyond the time for one code word, multiple code words will result. If another button is activated during a transmission, the active transmission will be aborted and a new transmission will begin using the new button information. If this bit is cleared, no start pulse occurs before a transmission. If the bit is set, a start pulse (1 TE long) is transmitted before the first code word’s preamble. 4.3.6 5.0 Blank Alternate Code Word Federal Communications Commission (FCC) Rules, Part 15 specify the limits on fundamental power and harmonics that can be transmitted. Power is calculated on the worst case average power transmitted in a 100 ms window. It is therefore advantageous to minimize the duty cycle of the transmission by minimizing the duty cycle of the individual bits and by blanking out consecutive words. The transmission duty cycle can be lowered by setting BRS. This reduces the average power transmitted and hence, assists in FCC approval of a transmitter device. Shortening the code word length and transmitting only every other code word (Figure 5-1) also may allow a higher amplitude transmission for greater range. EXTENDED SERIAL NUMBER (XSER) If this bit is cleared, the most significant four bits of the 32-bit Serial Number 1 are replaced with the function code. If this bit is set, the full 32-bit Serial Number 1 is transmitted. 5.3 Auto-Shutoff The auto-shutoff function automatically stops the device from transmitting if a button inadvertently gets pressed for longer than the time-out period, TTO. This will prevent the device from draining the battery if a button gets pressed while the transmitter is in a pocket or purse. 5.4 VLOW: Voltage LOW Indicator The VLOW bit is included in every transmission and will be transmitted as a one if the operating voltage has dropped below the low voltage trip point. Refer to Figure 3-2. The trip point is selectable based on the battery voltage being used. See Section 4.3.2 for a description of how the low voltage select option is set. FIGURE 5-1: CODE WORD TRANSMISSIONS Amplitude 100ms BRS = 0 BRS = 1 One Code Word 100ms 100ms 100ms A 2A Time DS41115D-page 6 Preliminary 1999-2013 Microchip Technology Inc. HCS101 PROGRAMMING THE HCS101 The HCS101 will signal that the write is complete by sending out a train of ACK pulses, TACKH high, TACKL low on DATA. The ACK pulses will continue until S2 is dropped. These times can be used to calculate the oscillator calibration value. The first pulse’s width should NOT be used for calibration. When using the HCS101 in a system, the user will have to program some parameters into the device, including the serial number and the counter, before it can be used. The programming cycle allows the user to input a 192-bit serial data stream which is then stored internally in EEPROM. Programming will be initiated by forcing the DATA line high after the S2 line has been held high for the appropriate length of time. Refer to Table 6-1 and Figure 6-1. At the end of the programming cycle, the device can be verified as shown in Figure 6-2 by reading back the EEPROM. Reading is done by clocking the S2 line and reading the data bits on the DATA pin. A verify operation can only be done once, immediately following the program cycle. After the Program mode is entered, a delay must be provided to the device for the automatic bulk write cycle to complete. This will write all locations in the EEPROM to all zeros. The device can then be programmed by clocking in 16 bits at a time, using S2 as the clock line and DATA as the data in line. After each 16-bit word is loaded, a programming delay is required for the internal program cycle to complete. This delay can take up to Twc. To ensure that the device does not accidentally enter Programming mode, DATA should never be pulled high by the circuit connected to it. Special care should be taken when driving PNP RF transistors. PROGRAMMING WAVEFORMS Initiate Data Polling Here HO LD TPBW TDS TCLKH TP Enter Program Mode TCLKL DATA (Data) Bit 0 Bit 1 TWC TDH TCLKL Bit 2 Bit 3 TA C TPS TPH1 C LK L S2 (Clock) LK H FIGURE 6-1: Note: TA 6.0 Bit 14 Bit 15 TPH2 Bit 16 Bit 17 Write Cycle Complete Here Calibration Pulses Data for Word 1 Repeat 12 times for each word Note: S0 and S1 button inputs to be held to ground during the entire programming sequence. FIGURE 6-2: VERIFY WAVEFORMS End of Programming Cycle DATA (Data) Bit190 Bit191 Begin Verify Cycle Here Bit 0 Data in Word 0 Bit 1 Bit 2 Bit 3 Bit 14 Bit 15 Bit 16 Bit 17 Bit190 Bit191 TDV S2 (Clock) TWC Note: If a Verify operation is to be done, then it must immediately follow the Program cycle. 1999-2013 Microchip Technology Inc. Preliminary DS41115D-page 7 HCS101 TABLE 6-1: PROGRAMMING/VERIFY TIMING REQUIREMENTS VDD = 5.0V ± 10% 25C ± 5C Parameter Symbol Min. Max. Units TPS 2.0 5.0 ms Hold time 1 TPH1 4.0 — ms Hold time 2 TPH2 50 — µs Bulk Write time TPBW 4.0 — ms Program delay time TPROG 4.0 — ms Program cycle time TWC 50 — ms Clock low time TCLKL 50 — µs Clock high time TCLKH 50 — µs Data setup time TDS 0 — µs Data hold time TDH 30 — µs Data out valid time TDV — 30 µs TPHOLD 100 — µs (1) Acknowledge low time TACKL 800 — µs (1) Acknowledge high time TACKH 800 — µs (1) Program mode setup time Hold time Note 1: Typical values - not tested in production DS41115D-page 8 Preliminary 1999-2013 Microchip Technology Inc. HCS101 7.0 ELECTRICAL CHARACTERISTICS FOR HCS101 Absolute Maximum Ratings† VDD Supply voltage .....................................................................................................................................-0.3 to 13.5 V VIN Input voltage ................................................................................................................................ -0.3 to VDD + 0.3 V VOUT Output voltage .......................................................................................................................... -0.3 to VDD + 0.3 V IOUT Max output current ......................................................................................................................................... 50 mA TSTG Storage temperature (Note) .............................................................................................................. -55 to +125°C TLSOL Lead soldering temp (Note)......................................................................................................................... 300°C VESD ESD rating ....................................................................................................................................................2000 V † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 7-1: DC CHARACTERISTICS Commercial (C):TAMB = 0C to +70C Industrial (I):TAMB = -40C to +85C 3.5V < VDD < 5.0V Parameter Sym. Min. Typ1 Max. — 0.5 5.0V < VDD < 13.3V Min. Typ1 Max. Unit — 2 mA mA Operating Current (avg)(2) ICC Standby Current ICCS 0.1 1.0 0.1 1.0 µA Auto-shutoff Current(3,4) ICCS 40 75 160 300 µA High Level Input Voltage VIH 0.55VDD VDD+0.3 2.75 VDD+0.3 V Low Level Input Voltage VIL -0.3 0.15VDD -0.3 0.75 V High Level Output Voltage VOH 0.6VDD Low Level Output Voltage VOL Conditions V V IOH = -1.0 mA VDD = 3.5V IOH = -2.0 mA VDD = 10V 0.4 V V IOL = 1.0 mA VDD = 3.5V IOL = 2.0 mA VDD = 10V 3.3 0.08VDD Pull-down Resistance; S0-S2 RSO-2 40 60 80 40 60 80 k VDD = 4.0V Pull-down Resistance; DATA RDATA 80 120 160 80 120 160 k VDD = 4.0V Note 1: 2: 3: 4: Typical values are at 25C. No load. Auto-shutoff current specification does not include the current through the input pulldown resistors. Auto-shutoff current is periodically sampled and not 100% tested. 1999-2013 Microchip Technology Inc. Preliminary DS41115D-page 9 HCS101 FIGURE 7-1: POWER-UP AND TRANSMIT TIMING Button Press Detect Code Word Transmission TBP TTD TDB DATA Code Word 1 TS Code Word 2 Code Word 3 Code Word n TTO Sn TABLE 7-2: POWER-UP AND TRANSMIT TIMING(2) Standard Operating Conditions (unless otherwise specified): Commercial (C): 0°C TA +70°C Industrial (I):-40°C TA +85°C Symbol Parameters Min. Typ. Max. Units Conditions 10 + Code Word Time — 26 + Code Word Time ms (Note 1) 12 — 26 ms TBP Time to second button press TTD Transmit delay from button detect TDB Debounce delay 6 — 20 ms TTO Auto-shutoff time-out period — 27 — s Start pulse delay — 4.5 — ms Ts Note 1: TBP is the time in which a second button can be pressed without completion of the first code word and the intention was to press the combination of buttons. 2: Typical values - not tested in production. FIGURE 7-2: PREAMBLE/HEADER FORMAT Preamble P1 Data Word Transmission Bit 0 Bit 1 Header P12 23 TE FIGURE 7-3: 10 TE DATA WORD FORMAT (XSER = 0) Counter & Serial Number 3 & Function Code LSB Bit 0 Bit 1 MSB LSB Serial Number 1 Function Code MSB S0 S1 S2 Vlow Bit 30 Bit 31 Bit 32 Bit 33 Bit 58 Bit 59 Bit 60 Bit 61 Bit 62 Bit 63 Bit 64 Bit 65 Header DS41115D-page 10 S3* Status * See S3SET Preliminary Guard Time 1999-2013 Microchip Technology Inc. HCS101 TABLE 7-3: CODE WORD TRANSMISSION TIMING REQUIREMENTS VDD = +3.5 to 13.3V Commercial (C):TAMB = 0C to +70C Industrial (I):TAMB = -40C to +85C Symbol Characteristic Code Words Transmitted All 1 out of 2 Number of TE Min. Typ. Max. Min. Typ. Max. Units TE Basic pulse element 1 360 400 440 180 200 220 µs TBP PWM bit pulse width 3 — 3 — — 3 — ms TP Preamble duration 24 8.64 9.6 10.56 4.32 4.8 5.28 ms TH Header duration 10 3.6 4.0 4.4 1.8 2.0 2.2 ms THOP Hopping code duration 96 34.56 38.4 42.24 17.28 19.2 21.12 ms TFIX Fixed code duration 102 36.72 40.8 44.88 18.36 20.4 22.44 ms TG Guard Time 39 14.04 15.6 17.16 7.02 7.8 8.58 ms Total Transmit Time 271 97.56 108.4 119.24 48.78 54.2 59.62 ms PWM data rate 925 833 757 1851 1667 1515 bps Note: The timing parameters are not tested but derived from the oscillator clock. 1999-2013 Microchip Technology Inc. Preliminary DS41115D-page 11 HCS101 8.0 PACKAGING INFORMATION 8.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW HCS101 XXXXXNNN 0025 8-Lead SOIC (150 mil) XXXXXXX XXXYYWW NNN HCS101 XXX0025 NNN Legend: XX...X Y YY WW NNN e3 * Note: DS41115D-page 12 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Preliminary 1999-2013 Microchip Technology Inc. HCS101 8.2 Package Details 8-Lead Plastic Dual In-line (P) - 300 mil (PDIP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E1 D 2 n 1 E A2 A L c A1 B1 p eB B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L c § B1 B eB MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 INCHES* NOM MAX 8 .100 .155 .130 .170 .145 .313 .250 .373 .130 .012 .058 .018 .370 10 10 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 1999-2013 Microchip Technology Inc. Preliminary DS41115D-page 13 HCS101 8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 p D 2 B n 1 h 45 c A2 A L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D h L c B MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 A1 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MIN MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 DS41115D-page 14 Preliminary 1999-2013 Microchip Technology Inc. HCS101 ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web (WWW) site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape or Microsoft Explorer. Files are also available for FTP download from our FTP site. Connecting to the Microchip Internet Web Site The Microchip web site is available by using your favorite Internet browser to attach to: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: • Latest Microchip Press Releases • Technical Support Section with Frequently Asked Questions • Design Tips • Device Errata • Job Postings • Microchip Consultant Program Member Listing • Links to other useful web sites related to Microchip Products • Conferences for products, Development Systems, technical information and more • Listing of seminars and events 1999-2013 Microchip Technology Inc. Preliminary DS41115D-page 15 HCS101 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this Data Sheet. To: Technical Publications Manager RE: Reader Response Total Pages Sent From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: HCS101 Y N Literature Number: DS41115D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this data sheet easy to follow? If not, why? 4. What additions to the data sheet do you think would enhance the structure and subject? 5. What deletions from the data sheet could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? 8. How would you improve our software, systems, and silicon products? DS41115D-page 16 Preliminary 1999-2013 Microchip Technology Inc. HCS101 HCS101 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. HCS101 - /P Package: P = Plastic DIP (300 mil Body), 8-lead) SN = Plastic SOIC (150 mil Body), 8-lead Temperature Range: Device: Blank = 0°C to +70°C I = –40°C to +85°C HCS101 = Code Hopping Encoder HCS101T = Code Hopping Encoder (Tape and Reel) Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. Your local Microchip sales office. The Microchip Worldwide Site. (www.microchip.com) REVISION HISTORY Revision D (January 2013) Added a note to each package outline drawing. 1999-2013 Microchip Technology Inc. Preliminary DS41115D-page 17 HCS101 NOTES: DS41115D-page 18 Preliminary 1999-2013 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 1999-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620769775 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 1999-2013 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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