HSMx-C110/C170/C190/C191/C150 High Performance ChipLED Data Sheet HSMA-C110/C170/C190/C191/C150 HSML-C110/C170/C190/C191/C150 HSMC-C110/C170/C190/C191/C150 HSMZ-C110/C170/C190 Description These chip-type LEDs utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available colors in this surface mount series are 592 nm Amber, 605 nm Orange, 626 nm Red for AS AlInGaP and 631 nm red for TS AlInGaP. All packages are binned by both color and intensity, except for red color. These ChipLEDs come either in two top emitting packages (HSMx-C170/C190/C191/C150) or in a side emitting package (HSMx-C110). The right angle ChipLEDs are suitable for applications such as LCD backlighting. The top emitting ChipLEDs with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel for HSMx-C170/C190/C191 and 3000 units per reel for HSMx-C110/C150. These packages are compatible with IR soldering process. Features • High brightness AlInGaP material • Small size • Industry standard footprint • Diffused optics • • • • • Top emitting or right angle emitting Available in 3 colors (red, orange, amber) Compatible with IR soldering Available in 8 mm tape on 7" diameter reel Reel sealed in zip locked moisture barrier bags Applications • LCD backlighting • Push button backlighting • Front panel indicator • Symbol indicator • Microdisplays • Small message panel signage Package Dimensions CATHODE LINE LED DIE CATHODE MARK LED DIE 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 0.62 (0.024) 2.0 (0.079 ) 3.2 (0.126 ) POLARITY CLEAR EPOXY 1.4 (0.055) DIFFUSED EPOXY 1.5 (0.059) PC BOARD POLARITY 0.3 (0.012) PC BOARD 1.6 (0.063 ) 0.8 (0.031) 0.5 (0.020) 0.3 (0.012) CATHODE LINE 3.2 (0.126 ) 0.4 ± 0.15 (0.016 ± 0.006) 0.8 (0.031) 0.4 ± 0.15 (0.016 ± 0.006) CATHODE LINE 1.0 (0.039) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C110 HSMx-C170 CATHODE MARK LED DIE CATHODE MARK LED DIE 0.8 (0.031) 0.8 (0.031) 0.4 (0.016) 1.6 (0.063 ) 1.0 (0.039) 0.4 (0.016) 1.6 (0.063 ) 1.0 (0.039) POLARITY 0.3 (0.012) 0.3 (0.012) DIFFUSED EPOXY DIFFUSED EPOXY POLARITY PC BOARD PC BOARD CATHODE LINE 0.8 (0.031) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) CATHODE LINE 0.6 (0.023) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN. 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C190 HSMx-C191 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 2 CATHODE MARK LED DIE Package Dimensions, continued 1.6 (0.063) 0.8 (0.031) 3.2 (0.126 ) DIFFUSED EPOXY POLARITY 2.0 (0.079) 0.6 (0.024) 1.1 (0.043) PC BOARD CATHODE LINE 0.50 ± 0.2 (0.020 ± 0.008) SOLDERING TERMINAL HSMx-C150 0.5 (0.020) 0.50 ± 0.2 (0.020 ± 0.008) NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. Device Selection Guide Footprint (mm)[1,2] AS AlInGaP Amber AS AlInGaP Orange AS AlInGaP Red TS AlInGaP Red Package Description 1.6 x 0.8 x 0.8 HSMA-C190 HSML-C190 HSMC-C190 HSMZ-C190 Untinted, Diffused 2.0 x 1.25 x 0.8 HSMA-C170 HSML-C170 HSMC-C170 HSMZ-C170 Untinted, Diffused 3.2 x 1.0 x 1.5 HSMA-C110 HSML-C110 HSMC-C110 HSMZ-C110 Untinted, Nondiffused 1.6 x 0.8 x 0.6 HSMA-C191 HSML-C191 HSMC-C191 Untinted, Diffused 3.2 x 1.6 x 1.1 HSMA-C150 HSML-C150 HSMC-C150 Untinted, Diffused Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted. Absolute Maximum Ratings TA = 25°C Parameter HSMA-C110/170/190/191/150 HSML-C110/170/190/191/150 HSMC-C110/170/190/191/150 HSMZ-C110/170/190 Units DC Forward Current[1,2] 25 25 mA Power Dissipation 60 65 mW Reverse Voltage (IR = 100 µA) 5 5 V LED Junction Temperature 95 95 °C Operating Temperature Range –30 to +85 –30 to +85 °C Storage Temperature Range –40 to +85 –40 to +85 °C Soldering Temperature See reflow soldering profile (Figure 7 & 8) Notes: 1. Derate linearly as shown in Figure 4. 2. Drive currents above 5 mA are recommended for best long term performance. 3 Electrical Characteristics TA = 25°C Parameter Number Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C (pF), VF = 0, f = 1 MHz Typ. Thermal Resistance RθJ-PIN = (°C/W) Typ. HSMA-C110 1.9 2.4 5 45 600 HSML-C110 1.9 2.4 5 45 600 HSMC-C110 1.9 2.4 5 45 600 HSMZ-C110 2.2 2.8 5 35 600 HSMA-C170/190/191/150 1.9 2.4 5 45 300 HSML-C170/190/191/150 1.9 2.4 5 45 300 HSMC-C170/190/191/150 1.9 2.4 5 45 300 HSMZ-C170/190 2.2 2.6 5 35 300 Optical Characteristics TA = 25°C Part Number Color Luminous Intensity Iv (mcd) @ 20 mA[1] Min. Typ. Peak Wavelength λpeak (nm) Typ. Color, Dominant Wavelength λd[2] (nm) Typ. Viewing Angle 2 θ1/2 Degrees[3] Typ. Luminous Efficacy ηv (lm/w) Typ. HSMA-C110 AS Amber 28.5 95 595 592 130 480 HSMA-C170/190/191/150 AS Amber 28.5 90 595 592 170 480 HSML-C110 AS Orange 28.5 95 609 605 130 370 HSML-C170/190/191/150 AS Orange 28.5 90 609 605 170 370 HSMC-C110 AS Red 28.5 95 637 626 130 155 HSMC-C170/190/191/150 AS Red 28.5 90 637 626 170 155 HSMZ-C110 TS Red 45 170 643 631 130 122 HSMZ-C170/190 TS Red 45 165 643 631 170 122 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4 Color Bin Limits[1] Bin ID A B C D E F Orange Color Bins[1] Dom. Wavelength (nm) Min. Max. 597.0 600.0 600.0 603.0 603.0 606.0 606.0 609.0 609.0 612.0 612.0 615.0 Tolerance: ± 1 nm. Bin ID A B C D E F Amber Color Bins[1] Dom. Wavelength (nm) Min. Max. 582.0 584.5 584.5 587.0 587.0 589.5 589.5 592.0 592.0 594.5 594.5 597.0 Tolerance: ± 1 nm. Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 Bin ID N P Q R S T U V W X Y Intensity (mcd) Min. Max. 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 715.00 1125.00 1125.00 1800.00 1800.00 2850.00 2850.00 4500.00 Tolerance: ± 15%. Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 5 1.0 AS AlInGaP RED RELATIVE INTENSITY AS AlInGaP AMBER AS AlInGaP ORANGE 0.5 TS AlInGaP RED 0 500 550 600 650 700 750 WAVELENGTH – nm 1.4 AS AlInGaP LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 100 10 TS AlInGaP 1 0.1 1.5 1.7 1.9 2.1 2.3 2.5 VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. 6 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 IF – FORWARD CURRENT – mA Figure 3. Luminous intensity vs. forward current. 30 IF MAX. – MAXIMUM FORWARD CURRENT – mA Figure 1. Relative intensity vs. wavelength. 30 25 20 HSMx-C110 15 HSMx-C150/170/ 190/191 10 5 0 0 20 40 60 80 100 TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum forward current vs. ambient temperature. 1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C110. 1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150. 7 TEMPERATURE 10 - 30 SEC. TEMPERATURE 10 SEC. MAX. 230°C MAX. 4°C/SEC. MAX. 140-160°C 255 - 260 °C 3 °C/SEC. MAX. 217 °C 200 °C 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. –3°C/SEC. 4°C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. OVER 2 MIN. TIME TIME (Acc. to J-STD-020C) Figure 7. Recommended reflow soldering profile. Figure 8. Recommended Pb-free reflow soldering profile. 5.0 (0.200) 0.9 (0.035) 0.9 (0.035) 1.2 (0.047) 1.0 (0.039) 0.2 (0.008) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 9. Recommended soldering pattern for HSMx-C110. 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) Figure 10. Recommended soldering pattern for HSMx-C170. 0.8 (0.031) 1.5 (0.059) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Figure 11. Recommended soldering pattern for HSMx-C190 and C191. Note: All dimensions in millimeters (inches). 8 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 12. Recommended soldering pattern for HSMx-C150. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 13. Reeling orientation. ;; ;; ;; ;; ;; ;; 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 14. Reel dimensions. Note: All dimensions in millimeters (inches). 9 6 PS 5.0 ± 0.5 (0.197 ± 0.020) ;;; ;;;;;; ;;; ;;;;;;;;; 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) ;;; ;;; ;; DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION COVER TAPE 4.00 (0.157) HSMx-C110 POSITION IN CARRIER TAPE DIM. A (SEE TABLE 1) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) PART NUMBER HSMx-C191 SERIES 1.86 (0.073) 0.89 (0.035) HSMx-C190 SERIES 1.75 (0.069) 0.90 (0.035) 0.87 (0.034) 0.90 (0.035) HSMx-C170 SERIES HSMx-C110 SERIES 2.30 (0.091) 3.40 (0.134) 1.45 (0.057) 1.70 (0.067) 0.95 (0.037) 1.20 (0.047) HSMx-C150 SERIES 3.50 (0.138) 1.88 (0.074) 1.27 (0.050) R 1.0 ± 0.05 (0.039 ± 0.002) DIM. B (SEE TABLE 1) Figure 15. Tape dimensions. END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 16. Tape leader and trailer dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 10 MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30˚C @ 60% RH max. Baking is required under the condition: a) Humidity Indicator Card is >10% when read at 23± 5°C. b) Device exposed to factory conditions <30°C/60% RH more than 672 hours. Baking recommended condition: 60 +/– 5˚C for 20 hours. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3604EN AV02-0112EN January 25, 2007