TI CD74HCT154M96 High-speed cmos logic 4- to 16-line decoder/demultiplexer Datasheet

[ /Title
(CD74
HC154
,
CD74
HCT15
4)
/Subject
(High
Speed
CMOS
Logic
4-to-16
Line
Decod
er/Dem
CD54HC154, CD74HC154,
CD54HCT154, CD74HCT154
Data sheet acquired from Harris Semiconductor
SCHS152D
High-Speed CMOS Logic
4- to 16-Line Decoder/Demultiplexer
September 1997 - Revised June 2004
Features
A High on either enable input forces the output into the High
state. The demultiplexing function is performed by using the
four input lines, A0 to A3, to select the output lines Y0 to
Y15, and using one enable as the data input while holding
the other enable low.
• Two Enable Inputs to Facilitate Demultiplexing and
Cascading Functions
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Ordering Information
• Wide Operating Temperature Range . . . -55oC to 125oC
TEMP. RANGE
(oC)
PACKAGE
CD54HC154F3A
-55 to 125
24 Ld CERDIP
CD54HCT154F3A
-55 to 125
24 Ld CERDIP
CD74HC154E
-55 to 125
24 Ld PDIP
CD74HC154EN
-55 to 125
24 Ld PDIP
CD74HC154M
-55 to 125
24 Ld SOIC
CD74HC154M96
-55 to 125
24 Ld SOIC
CD74HCT154E
-55 to 125
24 Ld PDIP
CD74HCT154EN
-55 to 125
24 Ld PDIP
CD74HCT154M
-55 to 125
24 Ld SOIC
CD74HCT154M96
-55 to 125
24 Ld SOIC
PART NUMBER
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30%of VCC at
VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
Description
The ’HC154 and ’HCT154 are 4- to 16-line
decoders/demultiplexers with two enable inputs, E1 and E2.
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel.
Pinout
CD54HC154, CD54HCT154
(CERDIP)
CD74HC154, CD74HCT154
(PDIP, SOIC)
TOP VIEW
Y0 1
24 VCC
Y1 2
23 A0
Y2 3
22 A1
Y3 4
21 A2
Y4 5
20 A3
Y5 6
19 E2
Y6 7
18 E1
Y7 8
17 Y15
Y8 9
16 Y14
Y9 10
15 Y13
Y10 11
14 Y12
GND 12
13 Y11
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2004, Texas Instruments Incorporated
1
CD54HC154, CD74HC154, CD54HCT154, CD74HCT154
Functional Diagram
1
2
3
4
5
6
7
A0 23
8
A1 22
9
A2
A3
21
10
20
11
13
14
15
E1
E2
18
16
19
17
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
Y10
Y11
Y12
Y13
Y14
Y15 GND = 12
VCC = 24
TRUTH TABLE
INPUTS
OUTPUTS
E1
E2
A3
A2
A1
A0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
Y9
Y10
Y11
Y12
Y13
Y14
Y15
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
H
L
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
H
L
L
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
L
L
L
H
L
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
L
L
L
H
H
L
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
H
L
L
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
H
L
L
H
L
L
L
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
H
L
L
H
L
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
H
L
L
H
L
H
L
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
H
L
L
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
L
L
H
H
L
L
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
L
L
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
L
L
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
L
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
H
X
X
X
X
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
X
X
X
X
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
X
X
X
X
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H = High Voltage Level, L = Low Voltage Level, X = Don’t Care
2
CD54HC154, CD74HC154, CD54HCT154, CD74HCT154
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Thermal Resistance (Typical)
θJA (oC/W)
E (PDIP) Package (.600) (Note 1) . . . . . . . . . . . . . .
67
EN (PDIP) Package (.300) (Note 1). . . . . . . . . . . . .
67
M (SOIC) Package (Note 2). . . . . . . . . . . . . . . . . . .
46
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. The package thermal impedance is calculated in accordance with JESD 51-3.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
High Level Input
Voltage
VIH
-
-
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
Low Level Input
Voltage
VIL
PARAMETER
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
HC TYPES
High Level Output
Voltage
CMOS Loads
VOH
-
VIH or VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
-
6
4.2
-
-
4.2
-
4.2
-
V
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
-
-
-
-
-
-
-
-
-
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
II
VCC or
GND
-
6
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
6
-
-
8
-
80
-
160
µA
3
CD54HC154, CD74HC154, CD54HCT154, CD74HCT154
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
SYMBOL
VI (V)
IO (mA)
High Level Input
Voltage
VIH
-
-
Low Level Input
Voltage
VIL
-
High Level Output
Voltage
CMOS Loads
VOH
VIH or VIL
PARAMETER
25oC
VCC
(V)
-40oC TO 85oC -55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
4.5 to
5.5
2
-
-
2
-
2
-
V
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
±0.1
-
±1
-
±1
µA
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
II
VCC and
GND
0
5.5
-
ICC
VCC or
GND
0
5.5
-
-
8
-
80
-
160
µA
∆ICC
(Note 3)
VCC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
NOTE:
3. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
A0 - A3
1.4
E1, E2
1.3
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g.,
360µA max at 25oC.
Switching Specifications Input tr, tf = 6ns
PARAMETER
SYMBOL
TEST
CONDITIONS
-40oC TO
85oC
25oC
-55oC TO 125oC
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
175
-
220
-
265
ns
4.5
-
-
35
-
44
-
53
ns
CL =15pF
5
-
14
-
-
-
-
-
ns
CL = 50pF
6
-
-
30
-
37
-
45
ns
HC TYPES
Propagation Delay (Figure 1)
tPLH, tPHL CL = 50pF
Address to Output
4
CD54HC154, CD74HC154, CD54HCT154, CD74HCT154
Switching Specifications Input tr, tf = 6ns
PARAMETER
E1 to Output
E2 to Output
Output Transition Time
(Figure 1)
(Continued)
TEST
CONDITIONS
-40oC TO
85oC
25oC
-55oC TO 125oC
VCC (V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
175
-
220
-
265
ns
4.5
-
-
35
-
44
-
53
ns
CL =15pF
5
-
14
-
-
-
-
-
ns
CL = 50pF
6
-
-
30
-
37
-
45
ns
tPLH, tPHL CL = 50pF
2
-
-
175
-
220
-
265
ns
4.5
-
-
35
-
44
-
53
ns
CL =15pF
5
-
14
-
-
-
-
-
ns
CL = 50pF
6
-
-
30
-
37
-
45
ns
tTLH, tTHL CL = 50pF
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
6
-
-
13
-
16
-
19
ns
SYMBOL
tPLH, tPHL CL = 50pF
Input Capacitance
CIN
-
-
-
-
10
-
10
-
10
pF
Power Dissipation Capacitance
(Notes 4, 5)
CPD
-
5
-
88
-
-
-
-
-
pF
CL = 50pF
4.5
-
-
35
-
44
-
53
ns
CL =15pF
5
-
14
-
-
-
-
ns
4.5
-
-
34
-
43
-
51
ns
5
-
14
-
-
-
-
-
ns
4.5
-
34
-
43
-
51
ns
5
-
14
-
-
-
-
-
ns
4.5
-
-
15
-
19
-
22
ns
-
-
10
-
10
-
10
pF
84
-
-
-
-
-
pF
HCT TYPES
Propagation Delay (Figure 2)
tPLH, tPHL
Address to Output
E1 to Output
tPLH, tPHL CL = 50pF
CL =15pF
E2 to Output
tPLH, tPHL CL = 50pF
CL =15pF
Output Transition Time
tTLH, tTHL CL = 50pF
Input Capacitance
CIN
-
-
Power Dissipation Capacitance
(Notes 4, 5)
CPD
-
5
NOTES:
4. CPD is used to determine the dynamic power consumption, per gate.
5. PD = VCC2 fi (CPD + CL) where fi = input frequency, CL = output load capacitance, VCC = supply voltage.
5
Test Circuits and Waveforms
tr = 6ns
tf = 6ns
90%
50%
10%
INPUT
GND
tTLH
GND
tTHL
90%
50%
10%
INVERTING
OUTPUT
3V
2.7V
1.3V
0.3V
INPUT
tTHL
tPHL
tf = 6ns
tr = 6ns
VCC
tTLH
90%
1.3V
10%
INVERTING
OUTPUT
tPHL
tPLH
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
tPLH
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
6
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-8670101JA
ACTIVE
CDIP
J
24
1
TBD
A42 SNPB
N / A for Pkg Type
5962-8682201JA
ACTIVE
CDIP
J
24
1
TBD
A42 SNPB
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
CD54HC154F3A
ACTIVE
CDIP
J
24
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HCT154F3A
ACTIVE
CDIP
J
24
1
TBD
A42 SNPB
N / A for Pkg Type
CD74HC154E
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC154EE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC154EN
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC154ENE4
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC154M
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC154M96
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC154M96E4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC154M96G4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC154ME4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC154MG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT154E
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT154EE4
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT154EN
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT154ENE4
ACTIVE
PDIP
NT
24
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT154M
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT154M96
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT154M96E4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT154M96G4
ACTIVE
SOIC
DW
24
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT154ME4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT154MG4
ACTIVE
SOIC
DW
24
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD74HC154M96
SOIC
DW
24
2000
330.0
24.4
10.75
15.7
2.7
12.0
24.0
Q1
CD74HCT154M96
SOIC
DW
24
2000
330.0
24.4
10.75
15.7
2.7
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD74HC154M96
SOIC
DW
24
2000
346.0
346.0
41.0
CD74HCT154M96
SOIC
DW
24
2000
346.0
346.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002
N (R–PDIP–T24)
PLASTIC DUAL–IN–LINE
1.222 (31,04) MAX
24
13
0.360 (9,14) MAX
1
12
0.070 (1,78) MAX
0.200 (5,08) MAX
0.425 (10,80) MAX
0.020 (0,51) MIN
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0’–15’
0.021 (0,53)
0.015 (0,38)
0.010 (0,25)
0.010 (0,25) NOM
4040051–3/D 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS–010
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI004 – OCTOBER 1994
NT (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
PINS **
A
24
28
A MAX
1.260
(32,04)
1.425
(36,20)
A MIN
1.230
(31,24)
1.385
(35,18)
B MAX
0.310
(7,87)
0.315
(8,00)
B MIN
0.290
(7,37)
0.295
(7,49)
DIM
24
13
0.280 (7,11)
0.250 (6,35)
1
12
0.070 (1,78) MAX
B
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0°– 15°
0.010 (0,25) M
0.010 (0,25) NOM
4040050 / B 04/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997
J (R-GDIP-T**)
CERAMIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
B
13
24
C
1
12
0.065 (1,65)
0.045 (1,14)
Lens Protrusion (Lens Optional)
0.010 (0.25) MAX
0.175 (4,45)
0.140 (3,56)
0.090 (2,29)
0.060 (1,53)
A
Seating Plane
0.018 (0,46) MIN
24
PINS **
DIM
”A”
”B”
”C”
NARR
0.125 (3,18) MIN
0.022 (0,56)
0.014 (0,36)
0.100 (2,54)
0.012 (0,30)
0.008 (0,20)
28
WIDE
NARR
40
32
WIDE
NARR
WIDE
NARR
WIDE
MAX
0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85)
MIN
0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99)
MAX
1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53)
MIN
1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61)
MAX
0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19)
MIN
0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50)
4040084/C 10/97
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI008 – OCTOBER 1994
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PIN SHOWN
A
24
13
0.560 (14,22)
0.520 (13,21)
1
12
0.060 (1,52) TYP
0.200 (5,08) MAX
0.610 (15,49)
0.590 (14,99)
0.020 (0,51) MIN
Seating Plane
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.125 (3,18) MIN
0.010 (0,25) M
PINS **
0°– 15°
0.010 (0,25) NOM
24
28
32
40
48
52
A MAX
1.270
(32,26)
1.450
(36,83)
1.650
(41,91)
2.090
(53,09)
2.450
(62,23)
2.650
(67,31)
A MIN
1.230
(31,24)
1.410
(35,81)
1.610
(40,89)
2.040
(51,82)
2.390
(60,71)
2.590
(65,79)
DIM
4040053 / B 04/95
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Falls within JEDEC MS-011
Falls within JEDEC MS-015 (32 pin only)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated