Freescale Semiconductor Technical Data Document Number: MC33290 Rev 8.0, 8/2008 ISO K Line Serial Link Interface 33290 The 33290 is a serial link bus interface device designed to provide bi-directional half-duplex communication interfacing in automotive diagnostic applications. It is designed to interface between the vehicle’s on-board microcontroller and systems off-board the vehicle via the special ISO K line. The 33290 is designed to meet the Diagnostic Systems ISO9141 specification. The device’s K line bus driver’s output is fully protected against bus shorts and overtemperature conditions. The 33290 derives its robustness to temperature and voltage extremes by being built on a SMARTMOS process, incorporating CMOS logic, bipolar/MOS analog circuitry, and DMOS power FETs. Although the 33290 was principally designed for automotive applications, it is suited for other serial communication applications. It is parametrically specified over an ambient temperature range of -40ºC ≤ TA ≤ 125ºC and 8.0 V ≤ VBB ≤ 18 V supply. The economical SO-8 surface-mount plastic package makes the 33290 very cost effective. ISO9141 PHYSICAL INTERFACE D SUFFIX EF SUFFIX (PB-FREE) 98ASB42564B 8-PIN SOICN ORDERING INFORMATION Features • • • • • • • • • • • Device Operates Over Wide Supply Voltage of 8.0 to 18V Operating Temperature of -40 to 125°C MC33290D/R2 Interfaces Directly to Standard CMOS Microprocessors MCZ33290EF/R2 ISO K Line Pin Protected Against Shorts to Ground Thermal Shutdown with Hysteresis ISO K Line Pin Capable of High Currents ISO K Line Can Be Driven with up to 10 nF of Parasitic Capacitance 8.0 kV ESD Protection Attainable with Few Additional Components Standby Mode: No VBat Current Drain with VDD at 5.0 V Low Current Drain During Operation with VDD at 5.0 V Pb-Free Packaging Designated by Suffix Code EF Temperature Range (TA) Package -40 to 125°C 8-SOICN +VBAT VDD 33290 VDD VDD VBB CEN RX TX ISO MCU Dx SCIRx D SCITx D ISO K-Line GND Figure 1. 33290 Simplified Application Diagram Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as may be required, to permit improvements in the design of its products. © Freescale Semiconductor, Inc., 2006-2008. All rights reserved. T xD R xD INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM VBB 1 3.0 kΩ 50 V 20 V 200 Ω 10 V 10 V RX 6 ISO 4 RHys Master Bias CEN 8 VDD 7 TX 5 40 V 125 kΩ Thermal Shutdown 125 kΩ GND 2.0 kΩ 10 V 3 10 V Figure 2. 33290 Simplified Block Diagram 33290 2 Analog Integrated Circuit Device Data Freescale Semiconductor PIN CONNECTIONS PIN CONNECTIONS VBB 11 88 NC 22 77 CEN VDD GND 33 66 RX ISO 44 55 TX Figure 3. 33290 Pin Connections Table 1. 33290 Pin Definitions Pin Number Pin Name 1 VBB Battery power through external resistor and diode. Definition 2 NC Not to be connected. (1) 3 GND Common signal and power return. 4 ISO Bus connection. 5 TX Logic level input for data to be transmitted on the bus. 6 RX Logic output of data received on the bus. 7 VDD Logic power source input. 8 CEN Chip enable. Logic “1” for active state. Logic “0” for sleep state. Notes 1. NC pins should not have any connections made to them. NC pins are not guaranteed to be open circuits. 33290 Analog Integrated Circuit Device Data Freescale Semiconductor 3 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Rating Symbol Value Unit VDD -0.3 to 7.0 V VBB(LD) 45 V VISO 40 V IISO(LIM) 1.0 A Human Body Model (4) VESD1 ±2000 Machine Model (4) VESD2 ±200 ISO Clamp Energy (5) Eclamp 10 mJ Storage Temperature Tstg -55 to +150 °C Operating Case Temperature TC -40 to +125 °C Operating Junction Temperature TJ -40 to +150 °C Power Dissipation PD VDD DC Supply Voltage VBB Load Dump Peak Voltage ISO Pin Load Dump Peak Voltage (2) ISO Short Circuit Current Limit ESD Voltage (3) V TA = 25°C Peak Package Reflow Temperature During Reflow Thermal Resistance Junction-to-Ambient W 0.8 (6) (7) , TPPRT Note 7. °C °C/W RθJA 150 Notes 2. Device will survive double battery jump start conditions in typical applications for 10 minutes duration, but is not guaranteed to remain within specified parametric limits during this duration. 3. ESD data available upon request. 4. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 5. 6. 7. Nonrepetitive clamping capability at 25°C. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 33290 4 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics Characteristics noted under conditions of 4.75 V ≤ VDD ≤ 5.25 V, 8.0 V ≤ VBB ≤ 18 V, -40°C ≤ TC ≤ 125°C, unless otherwise noted. Characteristic Symbol Min Typ Max Unit POWER AND CONTROL VDD Sleep State Current IDD(SS) mA – Tx = 0.8 VDD, CEN = 0.3 VDD VDD Quiescent Operating Current 0.1 IDD(Q) mA – Tx = 0.2 VDD, CEN = 0.7 VDD VBB Sleep State Current – – 1.0 IBB(SS) µA – VBB = 16 V, Tx = 0.8 VDD, CEN = 0.3 VDD VBB Quiescent Operating Current – 50 IBB(Q) mA – TX = 0.2 VDD, CEN = 0.7 VDD – 1.0 Chip Enable V Input High-Voltage Threshold (8) VIH(CEN) 0.7 VDD – – Input Low-Voltage Threshold (9) VIL(CEN) – – 0.3 VDD Chip Enable Pull-Down Current (10) IPD(CEN) 2.0 – 40 – – 0.3 x VDD 0.7 x VDD – – -40 – -2.0 – – 0.2 VDD 0.8 VDD – – 150 170 – TX Input Low-Voltage Threshold VIL(Tx) V RISO = 510 Ω (11) TX Input High-Voltage Threshold RISO = 510 Ω VIH(Tx) (12) TX Pull-Up Current (13) IPU(Tx) RX Output Low-Voltage Threshold VOL(Rx) V VOH(Rx) RISO = 510 Ω, TX = 0.8 VDD, RX Sourcing 250 µA Thermal Shutdown (14) µA V RISO = 510 Ω, TX = 0.2 VDD, Rx Sinking 1.0 mA RX Output High-Voltage Threshold µA V TLIM °C Notes 8. When IBB transitions to >100 µA. 9. When IBB transitions to <100 µA. 10. Enable pin has an internal current pull-down. Pull-down current is measured with CEN pin at 0.3 VDD. 11. Measured by ramping TX down from 0.7 VDD and noting TX value at which ISO falls below 0.2 VBB. 12. Measured by ramping TX up from 0.3 VDD and noting the value at which ISO rises above 0.9 VBB. 13. Tx pin has internal current pull-up. Pull-up current is measured with TX pin at 0.7 VDD. 14. Thermal Shutdown performance (TLIM) is guaranteed by design but not production tested. 33290 Analog Integrated Circuit Device Data Freescale Semiconductor 5 ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (Continued) Characteristics noted under conditions of 4.75 V ≤ VDD ≤ 5.25 V, 8.0 V ≤ VBB ≤ 18 V, -40°C ≤ TC ≤ 125°C, unless otherwise noted. Characteristic Symbol Min Typ Max Unit ISO I/O Input Low Voltage Threshold RISO = 0 Ω, TX = 0.8 VDD VIL(ISO) (15) Input High Voltage Threshold Internal Pull-Up Current VHys(ISO) RISO = ∞ Ω, TX = 0.8 VDD 0.7 x VBB – – 0.05 x VBB – 0.1 x VBB -5.0 – -140 50 – 1000 – – 0.1 x VBB 0.95 x VBB – – V V µA mA VOL(ISO) RISO = 510 Ω, TX = 0.2 VDD Output High Voltage 0.4 x VBB ISC(ISO) RISO = 0 Ω, TX = 0.4 VDD, VISO = VBB Output Low Voltage – IPU(ISO) RISO = ∞ Ω, TX = 0.8 VDD, VISO = 9.0 V, VBB = 18 V Short Circuit Current Limit (18) – VIH(ISO) RISO = 0 Ω, TX = 0.8 VDD (16) Input Hysteresis (17) V V VOH(ISO) V Notes 15. ISO ramped from 0.8 VBB to 0.4 VBB, Monitor RX, Value of ISO voltage at which RX transitions to 0.3 VDD. 16. ISO ramped from 0.4 VBB to 0.8 VBB, Monitor RX, Value of ISO voltage at which RX transitions to 0.7 VDD. 17. Input Hysteresis, VHys(ISO) = VIH(ISO) - VIL(ISO). 18. ISO has internal current limiting. 33290 6 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics Characteristics noted under conditions of 4.75 V ≤ VDD ≤ 5.25 V, 8.0 V ≤ VBB ≤ 18 V, -40°C ≤ TC ≤ 125°C, unless otherwise noted. Characteristic Fall Time (19) Symbol High to Low: RISO = 510 Ω, CISO = 500 pF (21) Low to High: RISO = 510 Ω, CISO = 500 pF (22) Typ Max – – 2.0 tfall(ISO) RISO = 510 Ω to VBB, CISO = 10 nF to Ground ISO Propagation Delay (20) Min Unit µs tPD(ISO) µs – – 2.0 – – 2.0 Notes 19. Time required ISO voltage to transition from 0.8 VBB to 0.2 VBB. 20. Changes in the value of CISO affect the rise and fall time but have minimal effect on Propagation Delay. 21. Step TX voltage from 0.2 VDD to 0.8 VDD. Time measured from VIH(ISO) until VISO reaches 0.3 VBB. 22. Step TX voltage from 0.8 VDD to 0.2 VDD. Time measured from VIL(ISO) until VISO reaches 0.7 VBB. 33290 Analog Integrated Circuit Device Data Freescale Semiconductor 7 ELECTRICAL CHARACTERISTICS ELECTRICAL PERFORMANCE CURVES 0.6 VIH; VDD = 5.25 V, VBB = 18 V VIH; VDD = 4.75 V, VBB = 8.0 V 0.575 0.55 0.525 0.5 0.475 -50 VIL; VDD = 5.25 V, VBB = 18 V VIL; VDD = 4.75 V, VBB = 8.0 V 0 50 100 150 TA, AMBIENT TEMPERATURE (°C) VOL and VOH, ISO OUTPUT (RATIO) VIL and VIH, INPUT THRESHOLD (RA- ELECTRICAL PERFORMANCE CURVES 1.2 0.8 0.4 0.2 VOL 0 -50 VDD = 5.25 V, VBB = 18 V 0.85 0.8 0.75 VDD = 4.75 V, VBB = 8.0 V 0.7 0.65 -50 0 50 100 TA, AMBIENT TEMPERATURE (°C) Figure 5. ISO Output/VBB vs. Temperature 150 0 50 100 150 TA, AMBIENT TEMPERATURE (°C) Figure 6. ISO Fall Time vs. Temperature tPD(ISO), PROPAGATION DELAY (µs) tfall(ISO), ISO FALL TIME (µs) 0.9 VDD = 4.75 V, VBB = 8.0 V and VDD = 5.25 V, VBB = 18 V 0.6 Figure 4. ISO Input Threshold/VBB vs. Temperature 0.95 VOH 1.0 0.7 VDD = 5.25 V, VBB = 18 V PdH-L 0.6 VDD = 4.75 V, VBB = 8.0 V 0.5 0.4 0.3 0.2 -50 VDD = 5.25 V, VBB = 18 V PdL-H VDD = 4.75 V, VBB = 8.0 V 0 50 100 150 TA, AMBIENT TEMPERATURE (°C) Figure 7. ISO Propagation Delay vs. Temperature 33290 8 Analog Integrated Circuit Device Data Freescale Semiconductor TYPICAL APPLICATIONS INTRODUCTION TYPICAL APPLICATIONS INTRODUCTION The 33290 is a serial link bus interface device conforming to the ISO 9141 physical bus specification. The device was designed for automotive environment usage compliant with On-Board Diagnostic (OBD) requirements set forth by the California Air Resources Board (CARB) using the ISO K line. The device does not incorporate an ISO L line. It provides bidirectional half-duplex communications interfacing from a microcontroller to the communication bus. The 33290 incorporates circuitry to interface the digital translations from 5.0 V microcontroller logic levels to battery level logic and from battery level logic to 5.0 V logic levels. The 33290 is built using Freescale Semiconductor’s SMARTMOS process and is packaged in an 8-pin plastic SOIC. FUNCTIONAL DESCRIPTION The 33290 transforms 5.0 V microcontroller logic signals to battery level logic signals and visa versa. The maximum data rate is set by the fall time and the rise time. The fall time is set by the output driver. The rise time is set by the bus capacitance and the pull-up resistors on the bus. The fall time of the 33290 allows data rates up to 150 kbps using a 30 percent maximum bit time transition value. The serial link interface will remain fully functional over a battery voltage range of 6.0 to 18 V. The device is parametrically specified over a dynamic VBB voltage range of 8.0 to 18 V. Required input levels from the microcontroller are ratiometric with the VDD voltage normally used to power the microcontroller. This enhances the 33290’s ability to remain in harmony with the RX and TX control input signals of the microcontroller. The RX and TX control inputs are compatible with standard 5.0 V CMOS circuitry. For fault-tolerant purposes the TX input from the microcontroller has an internal passive pull-up to VDD, while the CEN input has an internal passive pull-down to ground. A pull-up to battery is internally provided as well as an active data pull-down. The internal active pull-down is current-limit-protected against shorts to battery and further protected by thermal shutdown. Typical applications have reverse battery protection by the incorporation of an external 510 Ω pull-up resistor and diode to battery. Reverse battery protection of the device is provided by using a reverse battery blocking diode (“D” in the Simplified Application Diagram on page 1). Battery line transient protection of the device is provided for by using a 45 V zener and a 500 Ω resistor connected to the VBB source as shown in the same diagram. Device ESD protection from the communication lines exiting the module is through the use of the capacitor connected to the VBB device pin and the capacitor used in conjunction with the 27 V zener connected to the ISO pin. 33290 Analog Integrated Circuit Device Data Freescale Semiconductor 9 PACKAGING PACKAGE DIMENSIONS PACKAGING PACKAGE DIMENSIONS For the most current package revision, visit www.freescale.com and perform a keyword search using the “98A” listed below. D SUFFIX EF SUFFIX (PB-FREE) 8-PIN PLASTIC PACKAGE 98ASB42564B REV. U 33290 10 Analog Integrated Circuit Device Data Freescale Semiconductor REVISION HISTORY REVISION HISTORY REVISION DATE 6.0 7/2006 7.0 10/2006 8.0 8/2008 DESCRIPTION OF CHANGES • • • • Implemented Revision History page Converted to Freescale format and updated to the prevailing for and style Added Pb-free suffix EF Removed MC33290EG/R2 and replaced with MCZ33290EG/R2 in the Ordering Information block • Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from Maximum Ratings on page 4. Added note with instructions to obtain this information from www.freescale.com. • Corrected the Document header information. • Updated to the current Freescale form and style. 33290 Analog Integrated Circuit Device Data Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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