ON NCV51199PDR2G Ddr 2-amp source / sink termination regulator Datasheet

NCP51199, NCV51199
DDR 2-Amp Source / Sink
VTT Termination Regulator
The NCP/NCV51199 is a linear regulator designed to supply a
regulated VTT termination voltage for DDR−2 and DDR−3 memory
applications. The regulator is capable of actively sourcing and sinking
±2 A peak currents for DDR−2, and DDR−3 up to ±1.5 A while
regulating the VTT output voltage to within ±10 mV. The output
termination voltage is regulated to track VDDQ / 2 by two external
voltage divider resistors connected to the PVCC, GND, and VREF pins.
The NCP/NCV51199 incorporates a high−speed differential
amplifier to provide ultra−fast response to line and load transients.
Other features include source/sink current limiting, soft−start and
on−chip thermal shutdown protection.
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MARKING
DIAGRAM
8
8
1
XXXXXX
ALYW
G
SOIC8−NB EP
PD SUFFIX
CASE 751BU
1
Features
•
•
•
•
•
•
•
•
•
•
Supports DDR−2 VTT Termination to ±2 A, DDR−3 to ±1.5 A (peak)
Stable with 10 mF Ceramic Capacitance on VTT Output
Integrated Power MOSFETs
High Accuracy VTT Output at Full−Load
Fast Transient Response
Built−in Soft−Start
Shutdown for Standby or Suspend Mode
Integrated Thermal and Current−Limit Protection
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
• SDRAM Termination Voltage for DDR−2 / DDR−3
• Motherboard, Notebook, and VGA Card Memory Termination
• Set Top Box, Digital TV, Printers
March, 2014 − Rev. 2
PIN CONNECTION
PVCC
1
8
GND
VREF
NC
NC
VCC
NC
VTT
SOIC−8 EP
Typical Applications
© Semiconductor Components Industries, LLC, 2014
XXXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
WW
= Work Week
G
= Pb−Free Package
1
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
Publication Order Number:
NCP51199/D
NCP51199, NCV51199
NCP51199
PVCC = 1.5 to 5.0 V*
1
PVCC
VCC
C2
R2
100k
5V
6
C3
2
GND
3
VREF
VTT = 0.75 to 2.5 V*
4
C1
R1
100k
Enable
VTT
C4
R3
*For DDR2: PVCC = 1.8 V, VTT = 0.9 V
DDR3: PVCC = 1.5 V, VTT = 0.75 V
C1 = 1 mF (Low ESR)
C2 = 470 mF (Low ESR)
C3 = 47 mF
C4 = 1000 mF + 10 mF (10 mF ceramic)
R3 = Optional VTT discharge resistor
N−ch MOSFET = Optional Enable / Disable
Figure 1. Application Diagram
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
Description
1
PVCC
Input voltage which supplies current to the output pin. CIN = 470 mF with low ESR.
2
GND
Common Ground
3
VREF
Buffered reference voltage input equal to ½ of VDDQ and active low shutdown pin. An external resistor
divider dividing down the PVCC voltage creates the regulated output voltage. Pulling the pin to ground
(0.15 V maximum) turns the device off.
4
VTT
Regulator output voltage capable of sourcing and sinking current while regulating the output rail.
COUT = 1000 mF + 10 mF ceramic with low ESR.
5
NC
True No Connect
6
VCC
The VCC pin is a 5 V input pin that provides internal bias to the controller. PVCC should always be kept
lower or equal to VCC.
7
NC
True No Connect
8
NC
True No Connect
EP
Thermal Pad
Pad for thermal connection. The exposed pad must be connected to the ground plane using multiple
vias for maximum power dissipation performance.
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2
NCP51199, NCV51199
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
PVCC,
VCC
−0.3 to 6
V
Output Voltage Range
VTT
−0.3 to 6
V
Reference Input Range
VREF
−0.3 to 6
V
Maximum Junction Temperature
TJ(max)
125
°C
Storage Temperature Range
TSTG
−65 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2
kV
ESD Capability, Machine Model (Note 2)
ESDMM
150
V
TSLD
260
°C
Input Supply Voltage Range (Vcc w PVCC) (Note 1)
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions (Note 3)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78
3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, SO8−EP (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
Power Rating at 25°C Ambient = 1.19 W, derate 12 mW/°C
Thermal Reference, Junction−to−Lead2 (Note 5)
Symbol
Value
RqJA
84
RYJL
20
Unit
°C/W
4. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
OPERATING RANGES (Note 6)
Rating
Symbol
Min
Max
Unit
PVCC
1.5
5.5
V
VCC
4.75
5.25
V
Ambient Temperature
TA
−40
85
°C
Junction Temperature
TJ
−40
125
°C
Input Voltage
Bias Supply Voltage
6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
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3
NCP51199, NCV51199
ELECTRICAL CHARACTERISTICS
PVCC = 1.8 V / 1.5 V; VCC = 5 V; VREF = 0.9 V / 0.75 V; COUT = 10 mF (Ceramic); TA = +25°C, unless otherwise noted.
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
Iout = 0 A
VOS
−20
−
+20
mV
VREF = 900 mV, Iout = ±1.8 A, PVCC = 1.8 V
VREF = 750 mV, Iout = ±1.4 A, PVCC = 1.5 V
Regload
−10
−
+10
Iout = 0 A
IBIAS
−
0.8
2.5
mA
VREF < 0.2 V (Shutdown), RLOAD = 180W
ISTB
−
1
90
mA
2.0
−
3.5
1.5
−
3.5
REGULATOR OUTPUT
Output Offset Voltage
Load Regulation
mV
INPUT AND STANDBY CURRENTS
Bias Supply Current
Standby Current
CURRENT LIMIT PROTECTION
Current Limit
PVCC = 1.8 V, VREF = 0.9 V
PVCC = 1.5 V, VREF = 0.75 V
ILIM
A
SHUTDOWN THRESHOLDS
Enable
VIH
0.6
−
−
Shutdown
VIL
−
−
0.15
Thermal Shutdown Temperature
VCC = 5 V
TSD
160
168
176
°C
Thermal Shutdown Hysteresis
VCC = 5 V
TSH
35
35
40
°C
Shutdown Threshold Voltage
V
THERMAL SHUTDOWN
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4
NCP51199, NCV51199
TYPICAL CHARACTERISTICS
0.915
0.770
PVCC = 1.8 V, VCC = 5 V
OUTPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
0.905
0.900
0.895
0.890
0.885
0.880
−50
0.760
0.755
0.750
0.745
0.740
0.735
−25
0
25
50
75
100
125
0.730
−50
25
50
75
100
Figure 2. Output Voltage vs. Temperature
Figure 3. Output Voltage vs. Temperature
125
1.2
PVCC = 1.8 V, VCC = 5 V
VCC = 5 V
1.0
VCC CURRENT (mA)
SHUTDOWN THRESHOLD (V)
0
TEMPERATURE (°C)
0.50
0.45
Enabled
0.40
0.35
Shutdown
0.30
0.8
0.6
0.4
0.25
0.20
−50
−25
0
25
50
75
100
0.2
−50
125
0
25
50
75
100
TEMPERATURE (°C)
Figure 4. Shutdown Threshold vs.
Temperature
Figure 5. VCC Current vs. Temperature
125
3.5
SOURCE CURRENT LIMIT (A)
PVCC = 1.8 V, VCC = 5 V
2.5
2.0
1.5
1.0
0.5
0
−50
−25
TEMPERATURE (°C)
3.0
PVCC CURRENT (mA)
−25
TEMPERATURE (°C)
0.60
0.55
PVCC = 1.5 V, VCC = 5 V
0.765
0.910
−25
0
25
50
75
100
3.0
2.5
2.0
1.5
0.5
0
−50
125
PVCC = 1.8 V, VCC = 5 V
PVCC = 1.5 V, VCC = 5 V
1.0
−25
0
25
50
75
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 6. PVCC Current vs. Temperature
Figure 7. Source Current Limits vs.
Temperature
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5
125
NCP51199, NCV51199
TYPICAL CHARACTERISTICS
20
VTT, TRANSIENT RESPONSE (mV)
SINK CURRENT LIMIT (A)
3.5
3.0
2.5
2.0
1.5
PVCC = 1.8 V, VCC = 5 V
PVCC = 1.5 V, VCC = 5 V
1.0
0.5
0
−50
15
10
5
0
−5
−10
−15
−20
−25
0
25
50
75
100
125
TEMPERATURE (°C)
TIME (100 msec / div)
Figure 8. Sink Current Limits vs. Temperature
Figure 9. 1.25 V, +1.6 A Transient Response
Table 1. ORDERING INFORMATION
Marking
Package
Shipping †
NCP51199PDR2G
51199
NCV51199PDR2G*
V51199
SOIC−8
(Pb-Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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6
NCP51199, NCV51199
PACKAGE DIMENSIONS
SOIC8−NB EP
CASE 751BU
ISSUE B
D
A
8
NOTE 5
F
2X
0.10 C D
5
NOTE 6
A1
E
E1
NOTE 4
L2
L
2X 4 TIPS
0.20 C
4
1
NOTE 5
8X
B
TOP VIEW
b
0.25
M
C A-B D
2X
0.10 C A-B
NOTE 4
D
0.10 C
DETAIL A
8X
0.10 C
A
SEATING
PLANE
C
DETAIL A
h
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.10mm IN EXCESS OF MAXIMUM MATERIAL
CONDITION.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH,
PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15mm PER SIDE. DIMENSION E DOES
NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25mm PER
SIDE. DIMENSIONS D AND E ARE DETERMINED AT
DATUM F.
5. DIMENSIONS A AND B ARE TO BE DETERMINED
AT DATUM F.
6. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
7. TAB CONTOUR MAY VARY MINIMALLY TO INCLUDE
TOOLING FEATURES.
DIM
A
A1
b
b1
c
c1
D
E
E1
e
F
G
h
L
L2
B
e
C
SIDE VIEW
END VIEW
SEATING
PLANE
b
NOTE 7
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
b1
F
G
c c1
SECTION B−B
MILLIMETERS
MIN
MAX
1.35
1.75
−−−
0.10
0.31
0.51
0.28
0.48
0.17
0.25
0.17
0.23
4.90 BSC
6.00 BSC
3.90 BSC
1.27 BSC
1.55
3.07
1.55
3.07
0.25
0.50
0.40
1.27
0.25 BSC
RECOMMENDED
SOLDERING FOOTPRINT
BOTTOM VIEW
3.30
3.10
8X 1.52
7.00
1
8X
0.60
1.27
PITCH
DIMENSION: MILLIMETERS
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NCP51199/D
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