LP3944 www.ti.com SNVS264 – MAY 2004 LP3944 RGB/White/Blue 8-LED Fun Light Driver Check for Samples: LP3944 FEATURES DESCRIPTION • • • • LP3944 is an integrated device capable of independently driving 8 LEDs. This device also contains an internal precision oscillator that provides all the necessary timing required for driving each LED. Two prescaler registers along with two PWM registers provide a versatile duty cycle control. The LP3944 contains the ability to dim LEDs in SMBUS/I2C applications where it is required to cut down on bus traffic. 1 2 Internal Power-on Reset Active Low Reset Internal Precision Oscillator Variable Dim Rates (from 6.25 ms to 1.6s; 160 Hz–0.625 Hz) APPLICATIONS • • • • • • Customized Flashing LED Lights for Cellular Phones Portable Applications Digital Cameras Indicator Lamps General Purpose I/O Expander Toys Traditionally, to dim LEDs using a serial shift register such as 74LS594/5 would require a large amount of traffic to be on the serial bus. LP3944 instead requires only the setup of the frequency and duty cycle for each output pin. From then on, only a single command from the host is required to turn each individual open drain output ON, OFF, or to cycle a programmed frequency and duty cycle. Maximum output sink current is 25 mA per pin and 200 mA per package. Any ports not used for controlling the LEDs can be used for general purpose input/output expansion. KEY SPECIFICATIONS • • 8 LED Driver (Multiple Programmable States—On, Off, Input, and Dimming at a Specified Rate) 8 Open Drain Outputs Capable of Driving up to 25 mA per LED Typical Application Circuit +5V 5V R SMBUS G B 2 +5V /I C Blue LEDs VDD LED7 SDA SCL PORTx.D SDA SCL LED6 LED5 RESET LED4 A2 Cell Phone Baseband Controller/PController A1 A0 LED3 LED2 LED1 LED0 GND 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004, Texas Instruments Incorporated LP3944 SNVS264 – MAY 2004 www.ti.com LP3944 Pin Out 18 17 16 15 14 13 19 12 20 11 21 10 22 9 23 8 24 7 1 2 3 4 5 6 Figure 1. (Top View) Package Number RTW0024A LP3944 PIN DESCRIPTION Pin # Name Description 1 LED0 Output of LED0 Driver 2 LED1 Output of LED1 Driver 3 LED2 Output of LED2 Driver 4 LED3 Output of LED3 Driver 5 LED4 Output of LED4 Driver 6 LED5 Output of LED5 Driver 7 LED6 Output of LED6 Driver 8 LED7 Output of LED7 Driver 9 GND Ground 10 NC No Connect 11 NC No Connect 12 NC No Connect 13 NC No Connect 14 NC No Connect 15 NC No Connect 16 NC No Connect 17 NC No Connect 18 RST Active Low Reset Input 19 SCL Clock Line for I2C Interface 20 SDA Serial Data Line for I2C Interface 21 VDD Power Supply 22 A0 Address Input 0 23 A1 Address Input 1 24 A2 Address Input 2 2 Submit Documentation Feedback Copyright © 2004, Texas Instruments Incorporated Product Folder Links: LP3944 LP3944 www.ti.com SNVS264 – MAY 2004 Architectural Block Diagram A2 A1 A0 SCL SDA Input Register 2 2 I C Bus Control I C Filters Bit0 of Input Reg 1 LED Select Register Bit1 0 Bit0 of Select Register LS0 1 LED0 VDD RST Power-On Reset Oscillator Prescalar 0 Register Prescalar 1 Register PWM 0 Register PWM 1 Register COPIES Bit 7 of Input Register1 Bit 6 of Select Register LS1 Bit 7 of Select Register LS1 0 1 LED7 PWM0 Register Programming Example (See end of datasheet for complete example) PWM1 Register Figure 2. For Explanation of LP3944 Operation, Please Refer to Theory of Operation in Application Notes. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Submit Documentation Feedback Copyright © 2004, Texas Instruments Incorporated Product Folder Links: LP3944 3 LP3944 SNVS264 – MAY 2004 www.ti.com Absolute Maximum Ratings (1) (2) (3) −0.5V to 6V VDD A0, A1, A2, SCL, SDA, RST (Collectively called digital pins) 6V VSS−0.5V to 6V Voltage on LED pins Junction Temperature 150°C Storage Temperature −65°C to 150°C Power Dissipation (4) 1.76W Human Body Model ESD (5) Machine Model Charge Device Model (1) (2) (3) (4) (5) 2 kV 150V 1 kV Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. All voltages are with respect to the potential at the GND pin. If Military/Aerospace specified devices are required, please contact Texas Instruments for availability and specifications. The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formulaP = (TJ—TA)/θJA, where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. The 1.76W rating appearing under Absolute Maximum Ratings results from substituting the Absolute Maximum junction temperature, 150°C, for TJ, 85°C for TA, and 37°C/W for θJA. More power can be dissipated safely at ambient temperature below 85°C. Less power can be dissipated safely at ambient temperatures above 85°C. The Absolute Maximum power dissipation can be increased by 27 mW for each degree below 85°C, and it must be de-rated by 27 mW for each degree above 85°C. For Operating Ratings maximum power dissipation, TJ = 125°C and TA = 85°C The human-body model is 100 pF discharged through 1.5 kΩ. The machine model is 0Ω in series with 220 pF. Operating Ratings (1) (2) VDD 2.3V to 5.5V −40°C to +125°C Junction Temperature −40°C to +85°C Operating Ambient Temperature Thermal Resistance (θJA) WQFN-24 (3) Power Dissipation (1) (2) (3) 4 37°C/W 1.08W Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. All voltages are with respect to the potential at the GND pin. The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formulaP = (TJ—TA)/θJA, where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. The 1.76W rating appearing under Absolute Maximum Ratings results from substituting the Absolute Maximum junction temperature, 150°C, for TJ, 85°C for TA, and 37°C/W for θJA. More power can be dissipated safely at ambient temperature below 85°C. Less power can be dissipated safely at ambient temperatures above 85°C. The Absolute Maximum power dissipation can be increased by 27 mW for each degree below 85°C, and it must be de-rated by 27 mW for each degree above 85°C. For Operating Ratings maximum power dissipation, TJ = 125°C and TA = 85°C Submit Documentation Feedback Copyright © 2004, Texas Instruments Incorporated Product Folder Links: LP3944 LP3944 www.ti.com SNVS264 – MAY 2004 Electrical Characteristics Unless otherwise noted, VDD = 5.5V. Typical values and limits appearing in normal type apply for TJ = 25°C. Limits appearing in boldface type apply over the entire junction temperature range for operation, TJ = −40°C to +125°C. (1) Symbol Parameter Conditions Typical Limit Min Units Max POWER SUPPLY VDD Supply Voltage IQ Supply Current 5 2.3 5.5 No Load 350 550 Standby 2.0 5 ΔIQ Additional Standby Current VPOR Power-On Reset Voltage 1.8 tw Reset Pulse Width 10 VDD = 5.5V, every LED pin at 4.3V V µA 2 mA 1.96 V ns LED VIL LOW Level Input Voltage VIH HIGH Level Input Voltage IOL Low Level Output Current (2) ILEAK Input Leakage Current CI/O Input/Output Capacitance −0.5 0.8 V 2.0 5.5 V VOL = 0.4V, VDD = 2.3V 9 VOL = 0.4V, VDD = 3.0V 12 VOL = 0.4V, VDD = 5.0V 15 VOL = 0.7V, VDD = 2.3V 15 VOL = 0.7V, VDD = 3.0V 20 VOL = 0.7V, VDD = 5.0V 25 −1 VDD = 3.6, VIN = 0V or VDD See (3) 2.6 mA 1 µA 5 pF V ALL DIGITAL PINS (EXCEPT SCL AND SDA PINS) VIL LOW Level Input Voltage −0.5 0.8 VIH HIGH Level Input Voltage 2.0 5.5 V ILEAK Input Leakage Current −1 1 µA CIN Input Capacitance 5 pF VIN = 0V (3) 2.3 2 I C INTERFACE (SCL AND SDA PINS) VIL LOW Level Input Voltage -0.5 0.3VDD V VIH HIGH Level Input Voltage 0.7VDD 5.5 V VOL LOW Level Output Voltage 0 0.2VDD IOL LOW Level Output Current VOL = 0.4V FCLK Clock Frequency See (3) tHOLD Hold Time Repeated START Condition µs 1.3 µs 0.6 µs See See (3) See (3) 0.6 µs See (3) 300 ns (3) 100 ns 0.6 µs tDATA-SU Data Set-Up Time See tSU Set-Up Time for STOP Condition See (3) tTRANS Maximum Pulse Width of Spikes that Must Be Suppressed by the Input Filter of Both DATA & CLK Signals See (3) (1) (2) (3) kHz 0.6 CLK High Period Data Hold Time 400 (3) CLK Low Period tDATA-HOLD mA See tCLK-HP Set-Up Time Repeated START Condition V 3 (3) tCLK-LP tSU 6.5 50 ns Limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with TJ = 25°C. All hot and cold limits are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control. Each LED pin should not exceed 25 mA and the package should not exceed a total of 200 mA. Guaranteed by design. Submit Documentation Feedback Copyright © 2004, Texas Instruments Incorporated Product Folder Links: LP3944 5 LP3944 SNVS264 – MAY 2004 www.ti.com Typical Performance Characteristics Frequency vs. Temp (TA = −40°C to +85°C), VDD = 2.3V to 3.0V PERCENT VARIATION (%) 10 5 0 -5 -10 -40 -20 0 20 40 60 80 TEMPERATURE (°) Figure 3. 6 Submit Documentation Feedback Copyright © 2004, Texas Instruments Incorporated Product Folder Links: LP3944 LP3944 www.ti.com SNVS264 – MAY 2004 APPLICATION INFORMATION Theory of Operation The LP3944 takes incoming data and feed them into several registers that control the frequency and the duty cycle of the LEDs. Two prescaler registers and two PWM registers provide two individual rates to dim or blink the LEDs (for more information on these registers, refer to Table 1). The baseband controller/microprocessor can program each LED to be in one of four states—on, off, DIM0 rate or DIM1 rate. One read-only registers provide status on all 8 LEDs. The LP3944 can be used to drive RGB LEDs and/or single-color LEDs to create a colorful, entertaining, and informative setting. This is particularly suitable for accessory functions in cellular phones and toys. Any LED pins not used to drive LED can be used for General Purpose Parallel Input/Output (GPIO) expansion. The LP3944 is equipped with Power-On Reset that holds the chip in a reset state until VDD reaches VPOR during power up. Once VPOR is achieved, the LP3944 comes out of reset and initializes itself to the default state. To bring the LP3944 into reset, hold the RST pin LOW for a period of TW. This will put the chip to its default state. The LP3944 can only be programmed after RST signal is HIGH again. I2C Data Validity The data on SDA line must be stable during the HIGH period of the clock signal (SCL). In other words, state of the data line can only be changed when CLK is LOW. Figure 4. I2C Data Validity I2C Start and Stop Conditions START and STOP bits classify the beginning and the end of the I2C session. START condition is defined as SDA signal transitioning from HIGH to LOW while SCL line is HIGH. STOP condition is defined as the SDA transitioning from LOW to HIGH while SCL is HIGH. The I2C master always generates START and STOP bits. The I2C bus is considered to be busy after START condition and free after STOP condition. During data transmission, I2C master can generate repeated START conditions. First START and repeated START conditions are equivalent, function-wise. Figure 5. I2C START and STOP Conditions Transferring Data Every byte put on the SDA line must be eight bits long with the most significant bit (MSB) being transferred first. The number of bytes that can be transmitted per transfer is unrestricted. Each byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated by the master. The transmitter releases the SDA line (HIGH) during the acknowledge clock pulse. The receiver must pull down the SDA line during the 9th clock pulse, signifying an acknowledge. A receiver which has been addressed must generate an acknowledge after each byte has been received. Submit Documentation Feedback Copyright © 2004, Texas Instruments Incorporated Product Folder Links: LP3944 7 LP3944 SNVS264 – MAY 2004 www.ti.com After the START condition, a chip address is sent by the I2C master. This address is seven bits long followed by an eighth bit which is a data direction bit (R/W). The LP3944 hardwires bits 7 to 4 and leaves bits 3 to 1 selectable, as shown in Figure 6. For the eighth bit, a “0” indicates a WRITE and a “1” indicates a READ. The LP3944 supports only a WRITE during chip addressing. The second byte selects the register to which the data will be written. The third byte contains data to write to the selected register. Figure 6. Chip Address Byte ack from slave msb Chip Address lsb w ack start ack from slave msb Register Add lsb ack from slave msb ack DATA lsb ack stop SCL SDA start id = h'xx w ack addr = h'02 address h'02 data ack ack stop w = write (SDA = “0”) r = read (SDA = “1”) ack = acknowledge (SDA pulled down by either master or slave) rs = repeated start xx = 60 to 67 Figure 7. LP3944 Register Write However, if a READ function is to be accomplished, a WRITE function must precede the READ function, as shown in Figure 8. ack from slave start msb Chip Address lsb w ack ack from slave msb Register Add lsb repeated start ack rs ac k r s ack from slave msb Chip Address lsb r ack r ac k data from slave msb DATA lsb ack from master ack stop SC L SD A star t id = h'xx w ac k addr = h'00 id = h'xx address h'00 data ac k sto p w = write (SDA = “0”) r = read (SDA = “1”) ack = acknowledge (SDA pulled down by either master or slave) rs = repeated start xx = 60 to 67 Figure 8. LP3944 Register Read Auto Increment Auto increment is a special feature supported by the LP3944 to eliminate repeated chip and register addressing when data are to be written to or read from registers in sequential order. The auto increment bit is inside the register address byte, as shown in Figure 9. Auto increment is enabled when this bit is programmed to “1” and disabled when it is programmed to “0”. 8 Submit Documentation Feedback Copyright © 2004, Texas Instruments Incorporated Product Folder Links: LP3944 LP3944 www.ti.com SNVS264 – MAY 2004 Figure 9. Register Address Byte In the READ mode, when auto increment is enabled, I2C master could receive any number of bytes from LP3944 without selecting chip address and register address again. Every time the I2C master reads a register, the LP3944 will increment the register address and the next data register will be read. When I2C master reaches the last register (09H register), the register address will roll over to 00H. In the WRITE mode, when auto increment is enabled, the LP3944 will increment the register address every time I2C master writes to register. When the last register (09H register) is reached, the register address will roll over to 02H, because the first two registers in LP3944 are read-only registers. It is possible to write to these two registers, and the LP3944 will acknowledge, but the data will be ignored. In the LP3944, registers 0x01, 0x08 and 0x09 are not functional. However, it is still necessary to read from 0x01 and to write to 0x08 and 0x09 in Auto Increment mode. They cannot be skipped. If auto increment is disabled, and the I2C master does not change register address, it will continue to write data into the same register. Figure 10. Programming with Auto Increment Disabled (in WRITE Mode) Figure 11. Programming with Auto Increment Enabled (in WRITE Mode) Table 1. LP3944 Register Table Address (Hex) Register Name Read/Write Register Function 0x00 Input 1 Read Only LED0–7 Input Register 0x01 Register 1 Read Only None 0x02 PSC0 R/W Frequency Prescaler 0 0x03 PWM0 R/W PWM Register 0 0x04 PSC1 R/W Frequency Prescaler 1 0x05 PWM1 R/W PWM Register 1 0x06 LS0 R/W LED0–3 Selector 0x07 LS1 R/W LED4–7 Selector Submit Documentation Feedback Copyright © 2004, Texas Instruments Incorporated Product Folder Links: LP3944 9 LP3944 SNVS264 – MAY 2004 www.ti.com Table 1. LP3944 Register Table (continued) Address (Hex) Register Name Read/Write Register Function 0x08 Register 8 R/W None 0x09 Register 9 R/W None Binary Fomat for Input Registers (Read Only)—Address 0x00 and 0x01 Table 2. Address 0x00 Bit # 7 6 5 4 3 2 1 0 Default value X X X X X X X X LED7 LED6 LED5 LED4 LED3 LED2 LED1 LED0 Binary Format for Frequency Prescaler and PWM Registers — Address 0x02 to 0x05 Table 3. Address 0x02 (PSC0) Bit # 7 6 5 4 3 2 1 0 Default value 0 0 0 0 0 0 0 0 Table 4. Address 0x03 (PWM0) Bit # 7 6 5 4 3 2 1 0 Default value 1 0 0 0 0 0 0 0 Table 5. Address 0x04 (PSC1) Bit # 7 6 5 4 3 2 1 0 Default value 0 0 0 0 0 0 0 0 Table 6. Address 0x05 (PWM1) Bit # 7 6 5 4 3 2 1 0 Default value 1 0 0 0 0 0 0 0 0 Binary Format for Selector Registers — Address 0x06 to 0x07 Table 7. Address 0x06 (LS0) Bit # 7 6 5 4 3 2 1 Default value 0 0 0 0 0 0 0 0 B1 B0 B1 B0 B1 B0 B1 B0 LED3 LED2 LED1 LED0 Table 8. Address 0x07 (LS1) Bit # 7 6 5 4 3 2 1 Default value 0 0 0 0 0 0 0 0 B1 B0 B1 B0 B1 B0 B1 B0 LED7 LED6 LED5 0 LED4 Table 9. LED States With Respect To Values in "B1" and "B0" 10 B1 B0 0 0 Output Hi-Z (LED off) 0 1 Output LOW (LED on) Submit Documentation Feedback Function Copyright © 2004, Texas Instruments Incorporated Product Folder Links: LP3944 LP3944 www.ti.com SNVS264 – MAY 2004 Table 9. LED States With Respect To Values in "B1" and "B0" (continued) B1 B0 1 0 Output dims (DIM0 rate) Function 1 1 Output dims (DIM1 rate) Programming Example: Dim LEDs 0 to 7 at 1 Hz at 25% duty cycle 1. Set PSC0 to achieve DIM0 of 1s 2. Set PWM0 duty cycle to 25% 3. Set PSC1 to achieve DIM1 of 0.2s 4. Set LEDs 0 to 7 to point to DIM0 Register Name Set to (Hex) 1 Step Set DIM0 = 1s 1 = (PSC0 + 1)/160 PSC0 = 159 Description PSC0 0x09F 2 Set duty cycle to 25% Duty Cycle = PWM0/256 PWM0 = 64 PWM0 0x40 3 Set DIM1 = 0.2s 0.2 = (PSC1 + 1)/160 PSC1 = 31 PSC1 0x1F 4 LEDs 0 to 7 Output = DIM0 LS0, LS1 LS0 = 0xAA LS1 = 0xAA Reducing IQ When LEDS are Off In many applications, the LEDs and the LP3944 share the same VDD, as shown in Typical Application Circuit. When the LEDs are off, the LED pins are at a lower potential than VDD, causing extra supply current (ΔIQ). To minimize this current, consider keeping the LED pins at a voltage equal to or greater than VDD. Figure 12. Methods to Reduce IQ When LEDs Are Off VOUT VDD LED 7 2.2 PF VIN LM2750-5.0 2.7V to 5.5V 2.2 PF CAP+ CFLY 1 PF LP3944 CAPLED 0 Figure 13. Application Circuit Submit Documentation Feedback Copyright © 2004, Texas Instruments Incorporated Product Folder Links: LP3944 11 PACKAGE OPTION ADDENDUM www.ti.com 9-Mar-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LP3944ISQ ACTIVE WQFN RTW 24 1000 TBD Call TI Call TI -40 to 85 3944SQ LP3944ISQ/NOPB ACTIVE WQFN RTW 24 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 3944SQ LP3944ISQX ACTIVE WQFN RTW 24 4500 TBD Call TI Call TI -40 to 85 3944SQ LP3944ISQX/NOPB ACTIVE WQFN RTW 24 4500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 3944SQ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. 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Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 17-Nov-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LP3944ISQ WQFN RTW 24 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LP3944ISQ/NOPB WQFN RTW 24 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LP3944ISQX WQFN RTW 24 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 LP3944ISQX/NOPB WQFN RTW 24 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Nov-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP3944ISQ WQFN RTW 24 1000 203.0 190.0 41.0 LP3944ISQ/NOPB WQFN RTW 24 1000 203.0 190.0 41.0 LP3944ISQX WQFN RTW 24 4500 358.0 343.0 63.0 LP3944ISQX/NOPB WQFN RTW 24 4500 358.0 343.0 63.0 Pack Materials-Page 2 MECHANICAL DATA RTW0024A SQA24A (Rev B) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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