MOTOROLA MCM6949 1m x 4 bit static random access memory Datasheet

MOTOROLA
Order this document
by MCM6949/D
SEMICONDUCTOR TECHNICAL DATA
Advance Information
MCM6949
1M x 4 Bit Static Random
Access Memory
The MCM6949 is a 4,194,304 bit static random access memory organized as
1,048,576 words of 4 bits. Static design eliminates the need for external clocks
or timing strobes.
The MCM6949 is equipped with chip enable (E) and output enable (G) pins,
allowing for greater system flexibility and eliminating bus contention problems.
Either input, when high, will force the outputs into high–impedance.
The MCM6949 is available in a 400 mil, 32–lead surface–mount SOJ package.
•
•
•
•
•
•
Single 3.3 V – 5%, + 10% Power Supply
Fast Access Time: 8/10/12/15 ns
Equal Address and Chip Enable Access Time
All Inputs and Outputs are TTL Compatible
Three–State Outputs
Power Operation: 195/165/160/155 mA Maximum, Active AC
YJ PACKAGE
400 MIL SOJ
CASE 857A–02
PIN NAMES
A0 – A19 . . . . . . . . . . . . . . . . Address Inputs
W . . . . . . . . . . . . . . . . . . . . . . . Write Enable
G . . . . . . . . . . . . . . . . . . . . . . Output Enable
E . . . . . . . . . . . . . . . . . . . . . . . . . Chip Enable
DQ . . . . . . . . . . . . . . . . . . Data Input/Output
NC . . . . . . . . . . . . . . . . . . . . . No Connection
VCC . . . . . . . . . . . . . . + 3.3 V Power Supply
VSS . . . . . . . . . . . . . . . . . . . . . . . . . . Ground
This document contains information on a new product. Specifications and information herein are subject to change without notice.
REV 4
4/2/98

Motorola, Inc. 1998
MOTOROLA
FAST SRAM
MCM6949
1
BLOCK DIAGRAM
A
A
A
A
A
A
ROW
DECODER
MEMORY MATRIX
A
A
A
A
COLUMN I/O
DQ
INPUT
DATA
CONTROL
COLUMN DECODER
DQ
A
A
A
A
A
A
A
A
A
A
DQ
E
W
G
MCM6949
2
DQ
MOTOROLA FAST SRAM
PIN ASSIGNMENT
MOTOROLA FAST SRAM
A
1
32
A
A
2
31
A
A
3
30
A
A
4
29
A
A
5
28
A
E
6
27
G
DQ
7
26
DQ
VCC
8
25
VSS
VSS
9
24
VCC
DQ
10
23
DQ
W
11
22
A
A
12
21
A
A
13
20
A
A
14
19
A
A
15
18
A
A
16
17
NC
MCM6949
3
TRUTH TABLE (X = Don’t Care)
E
G
W
Mode
I/O Pin
Cycle
Current
H
X
X
Not Selected
High–Z
—
ISB1, ISB2
L
H
H
Output Disabled
High–Z
—
ICCA
L
L
H
Read
Dout
Read
ICCA
L
X
L
Write
High–Z
Write
ICCA
ABSOLUTE MAXIMUM RATINGS (See Note)
Symbol
Value
Unit
VCC
– 0.5 to + 5.0
V
Vin, Vout
– 0.5 to VCC + 0.5
V
Output Current (per I/O)
Iout
± 20
mA
Power Dissipation
PD
1.0
W
Temperature Under Bias
Tbias
– 10 to + 85
°C
Operating Temperature
TA
0 to + 70
°C
Tstg
– 55 to + 150
°C
Rating
Power Supply Voltage Relative to VSS
Voltage Relative to VSS for Any Pin
Except VCC
Storage Temperature — Plastic
This device contains circuitry to protect the
inputs against damage due to high static voltages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maximum rated voltages to these high–impedance
circuits.
This BiCMOS memory circuit has been
designed to meet the dc and ac specifications
shown in the tables, after thermal equilibrium
has been established. The circuit is in a test
socket or mounted on a printed circuit board and
transverse air flow of at least 500 linear feet per
minute is maintained.
NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPERATING CONDITIONS. Exposure to higher than recommended voltages for
extended periods of time could affect device reliability.
MCM6949
4
MOTOROLA FAST SRAM
DC OPERATING CONDITIONS AND CHARACTERISTICS
(VCC = 3.3 V – 5%, + 10%, TA = 0 to + 70°C, Unless Otherwise Noted)
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Min
Typ
Max
Unit
Supply Voltage (Operating Voltage Range)
VCC
3.0
3.3
3.465
V
Input High Voltage
VIH
2.2
—
VCC + 0.3
V
Input Low Voltage
VIL
– 0.5*
—
0.8
V
Symbol
Min
Max
Unit
Input Leakage Current (All Inputs, Vin = 0 to VCC)
Ilkg(I)
—
± 1.0
µA
Output Leakage Current (E = VIH, Vout = 0 to VCC)
Ilkg(O)
—
± 1.0
µA
* VIL (min) = – 0.5 V dc; VIL (min) = – 2.0 V ac (pulse width ≤ 2.0 ns).
DC CHARACTERISTICS
Parameter
Output Low Voltage (IOL = + 8.0 mA)
VOL
—
0.4
V
Output High Voltage (IOH = – 4.0 mA)
VOH
2.4
—
V
Symbol
0 to + 70°C
– 40 to
+ 85°C
Unit
POWER SUPPLY CURRENTS
Parameter
AC Active Supply Current
(Iout = 0 mA, VCC = Max)
MCM6949–8: tAVAV = 8 ns
MCM6949–10: tAVAV = 10 ns
MCM6949–12: tAVAV = 12 ns
MCM6949–15: tAVAV = 15 ns
ICC
195
165
160
155
195
175
170
165
mA
AC Standby Current (VCC = Max, E = VIH,
No Other Restrictions on Other Inputs)
MCM6949–8: tAVAV = 8 ns
MCM6949–10: tAVAV = 10 ns
MCM6949–12: tAVAV = 12 ns
MCM6949–15: tAVAV = 15 ns
ISB1
55
50
50
45
55
55
55
50
mA
ISB2
15
15
mA
Symbol
Typ
Max
Unit
All Inputs Except Clocks and DQs
E, G, W
Cin
Cck
4
5
6
8
pF
DQ
CI/O
5
8
pF
CMOS Standby Current (E ≥ VCC – 0.2 V, Vin ≤ VSS + 0.2 V or ≥ VCC – 0.2 V)
(VCC = Max, f = 0 MHz)
CAPACITANCE (f = 1.0 MHz, dV = 3.3 V, TA = 25°C, Periodically Sampled Rather Than 100% Tested)
Parameter
Input Capacitance
Input/Output Capacitance
MOTOROLA FAST SRAM
MCM6949
5
AC OPERATING CONDITIONS AND CHARACTERISTICS
(VCC = 3.3 V – 5%, + 10%, TA = 0 to + 70°C, Unless Otherwise Noted)
Input Pulse Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 3.0 V
Input Rise/Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 ns
Input Timing Measurement Reference Level . . . . . . . . . . . . . . . 1.5 V
Output Timing Measurement Reference Level . . . . . . . . . . . . . 1.5 V
Output Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Figure 1
READ CYCLE TIMING (See Notes 1 and 2)
MCM6949–8
P
Parameter
S b l
Symbol
MCM6949–10
Min
Max
Min
MCM6949–12
Max
Min
MCM6949–15
Max
Min
Max
U i
Unit
N
Notes
3
Read Cycle Time
tAVAV
8
—
10
—
12
—
15
—
ns
Address Access Time
tAVQV
—
8
—
10
—
12
—
15
ns
Enable Access Time
tELQV
—
8
—
10
—
12
—
15
ns
Output Enable Access Time
tGLQV
—
4
—
5
—
6
—
7
ns
Output Hold from Address Change
tAXQX
2
—
2
—
2
—
2
—
ns
Enable Low to Output Active
tELQX
3
—
3
—
3
—
3
—
ns
5, 6, 7
Output Enable Low to Output Active
tGLQX
0
—
0
—
0
—
0
—
ns
5, 6, 7
Enable High to Output High–Z
tEHQZ
0
4
0
5
0
6
0
7
ns
5, 6, 7
Output Enable High to Output High–Z
tGHQZ
0
4
0
5
0
6
0
7
ns
5, 6, 7
4
NOTES:
1. W is high for read cycle.
2. Product sensitivities to noise require proper grounding and decoupling of power supplies as well as minimization or elimination of bus
contention conditions during read and write cycles.
3. All read cycle timings are referenced from the last valid address to the first transitioning address.
4. Addresses valid prior to or coincident with E going low.
5. At any given voltage and temperature, tEHQZ max tELQX min, and tGHQZ max tGLQX min, both for a given device and from device
to device.
6. Transition is measured ± 200 mV from steady–state voltage.
7. This parameter is sampled and not 100% tested.
8. Device is continuously selected (E ≤ VIL, G ≤ VIL).
t
t
TIMING LIMITS
RL = 50 Ω
OUTPUT
Z0 = 50 Ω
VL = 1.5 V
The table of timing values shows either a minimum
or a maximum limit for each parameter. Input requirements are specified from the external system point of
view. Thus, address setup time is shown as a minimum since the system must supply at least that much
time. On the other hand, responses from the memory
are specified from the device point of view. Thus, the
access time is shown as a maximum since the device
never provides data later than that time.
Figure 1. AC Test Load
MCM6949
6
MOTOROLA FAST SRAM
READ CYCLE 1 (See Note 8)
tAVAV
A (ADDRESS)
tAXQX
Q (DATA OUT)
PREVIOUS DATA VALID
DATA VALID
tAVQV
READ CYCLE 2 (See Note 4)
tAVAV
A (ADDRESS)
tELQV
E (CHIP ENABLE)
tEHQZ
tELQX
G (OUTPUT ENABLE)
tGLQV
tGHQZ
tGLQX
Q (DATA OUT)
HIGH–Z
DATA VALID
tAVQV
SUPPLY CURRENT
ICC
ISB
MOTOROLA FAST SRAM
MCM6949
7
WRITE CYCLE 1 (W Controlled; See Notes 1, 2, and 3)
MCM6949–8
P
Parameter
MCM6949–10
MCM6949–12
MCM6949–15
S b l
Symbol
Min
Max
Min
Max
Min
Max
Min
Max
U i
Unit
N
Notes
Write Cycle Time
tAVAV
8
—
10
—
12
—
15
—
ns
4
Address Setup Time
tAVWL
0
—
0
—
0
—
0
—
ns
Address Valid to End of Write
tAVWH
8
—
9
—
10
—
12
—
ns
Address Valid to End of Write (G High)
tAVWH
7
—
8
—
9
—
10
—
ns
Write Pulse Width
tWLWH
tWLEH
8
—
9
—
10
—
12
—
ns
Write Pulse Width (G High)
tWLWH
tWLEH
7
—
8
—
9
—
10
—
ns
Data Valid to End of Write
tDVWH
5
—
5
—
6
—
7
—
ns
Data Hold Time
tWHDX
0
—
0
—
0
—
0
—
ns
Write Low to Data High–Z
tWLQZ
0
4
0
5
0
6
0
7
ns
5, 6, 7
Write High to Output Active
tWHQX
3
—
3
—
3
—
3
—
ns
5, 6, 7
Write Recovery Time
tWHAX
0
—
0
—
0
—
0
—
ns
NOTES:
1. A write occurs during the overlap of E low and W low.
2. Product sensitivities to noise require proper grounding and decoupling of power supplies as well as minimization or elimination of bus
contention conditions during read and write cycles.
3. If G goes low coincident with or after W goes low, the output will remain in a high–impedance state.
4. All write cycle timings are referenced from the last valid address to the first transitioning address.
5. Transition is measured ± 200 mV from steady–state voltage.
6. This parameter is sampled and not 100% tested.
7. At any given voltage and temperature, tWLQZ max < tWHQX min, both for a given device and from device to device.
WRITE CYCLE 1 (W Controlled; See Notes 1, 2, and 3)
tAVAV
A (ADDRESS)
tAVWH
tWHAX
E (CHIP ENABLE)
tWLWH
tWLEH
W (WRITE ENABLE)
tAVWL
tDVWH
DATA VALID
D (DATA IN)
tWLQZ
Q (DATA OUT)
MCM6949
8
tWHDX
HIGH–Z
tWHQX
HIGH–Z
MOTOROLA FAST SRAM
WRITE CYCLE 2 (E Controlled; See Notes 1, 2, and 3)
MCM6949–8
P
Parameter
MCM6949–10
MCM6949–12
MCM6949–15
S b l
Symbol
Min
Max
Min
Max
Min
Max
Min
Max
U i
Unit
N
Notes
Write Cycle Time
tAVAV
8
—
10
—
12
—
15
—
ns
4
Address Setup Time
tAVEL
0
—
0
—
0
—
0
—
ns
Address Valid to End of Write
tAVEH
7
—
9
—
10
—
12
—
ns
Address Valid to End of Write (G High)
tAVEH
7
—
8
—
9
—
10
—
ns
Enable Pulse Width
tELEH,
tELWH
8
—
9
—
10
—
12
—
ns
5, 6
Enable Pulse Width (G High)
tELEH,
tELWH
7
—
8
—
9
—
10
—
ns
5, 6
Data Valid to End of Write
tDVEH
5
—
5
—
6
—
7
—
ns
Data Hold Time
tEHDX
0
—
0
—
0
—
0
—
ns
Write Recovery Time
tEHAX
0
—
0
—
0
—
0
—
ns
NOTES:
1. A write occurs during the overlap of E low and W low.
2. Product sensitivities to noise require proper grounding and decoupling of power supplies as well as minimization or elimination of bus
contention conditions during read and write cycles.
3. If G goes low coincident with or after W goes low, the output will remain in a high–impedance state.
4. All write cycle timing is referenced from the last valid address to the first transitioning address.
5. If E goes low coincident with or after W goes low, the output will remain in a high–impedance condition.
6. If E goes high coincident with or before W goes high, the output will remain in a high–impedance condition.
WRITE CYCLE 2 (E Controlled; See Notes 1, 2, and 3)
tAVAV
A (ADDRESS)
tAVEH
tELEH
E (CHIP ENABLE)
tAVEL
tELWH
tEHAX
W (WRITE ENABLE)
tDVEH
DATA VALID
D (DATA IN)
tEHDX
HIGH–Z
Q (DATA OUT)
ORDERING INFORMATION
(Order by Full Part Number)
MCM 6949 XX XX XX
Motorola Memory Prefix
Shipping Method (R = Tape and Reel, Blank = Rails)
Part Number
Speed (8 = 8 ns, 10 = 10 ns, 12 = 12 ns,
15 = 15 ns)
Package (YJ = 400 mil SOJ)
Full Part Numbers — MCM6949YJ8
MCM6949YJ8R
MOTOROLA FAST SRAM
MCM6949YJ10
MCM6949YJ10R
MCM6949YJ12
MCM6949YJ12R
MCM6949YJ15
MCM6949YJ15R
MCM6949
9
PACKAGE DIMENSIONS
YJ PACKAGE
400 MIL SOJ
CASE 857A–02
32
F
17
0.17 (0.007)
N
1
32 PL
0.17 (0.007)
S
P
0.17 (0.007)
L
G
T B
DETAIL Z
16
-A-
S
D 32 PL
T B S A
S
T A
S
NOTE 3
B
S
S
-BE
0.10 (0.004)
K
DETAIL Z
-T-
SEATING
PLANE
R
0.25 (0.010)
C
S RADIUS
S
T A
S
B
S
NOTE 3
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TO BE DETERMINED AT PLANE -T-.
4. DIMENSION A & B DO NOT INCLUDE MOLD
PROTRUSION. MOLD PROTRUSION SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
5. DIMENSION A & B INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT THE PARTING LINE.
6. 857A-01 IS OBSOLETE, NEW STANDARD 857A-02.
DIM
A
B
C
D
E
F
G
K
L
N
P
R
S
MILLIMETERS
MIN
MAX
20.83 21.08
10.03 10.29
3.75
3.26
0.50
0.41
2.48
2.24
0.81
0.67
1.27 BSC
1.14
0.89
0.64 BSC
1.14
0.76
11.30
11.05
9.52
9.27
1.01
0.77
INCHES
MIN
MAX
0.820 0.830
0.395 0.405
0.128 0.148
0.016 0.020
0.088 0.098
0.026 0.032
0.050 BSC
0.035 0.045
0.025 BSC
0.030 0.045
0.435 0.445
0.365 0.375
0.030 0.040
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
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MCM6949
10
◊
MCM6949/D
MOTOROLA FAST
SRAM
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