05153 LC0408FC3.3C thru LC0408FC36C LOW CAPACITANCE FLIP CHIP ARRAY APPLICATIONS ✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Notebook Computers ✔ SMART Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns 0402 CHIP SHOWN FEATURES ✔ ESD Protection > 25 kilovolts ✔ Available in Voltages Ranging From 3.3V to 36V ✔ 200 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Low Clamping Voltage ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 4 to 7 Lines ✔ Low Capacitance ✔ Low Leakage Current ✔ RoHS Compliant MECHANICAL CHARACTERISTICS ✔ Standard EIA Chip Size: 0408 ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Lead-Free Plating ✔ Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Consult Factory for Leaded Device Availability ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal) PIN CONFIGURATION 05153.R7 2/07 1 www.protekdevices.com LC0408FC3.3C thru LC0408FC36C DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER SYMBOL VALUE UNITS PPP 200 Watts TA -55 to 150 °C TSTG -55 to 150 °C Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature ELECTRICAL CHARACTERISTICS PER LINE PART NUMBER (See Note 1) LC0408FC3.3C LC0408FC05C LC0408FC08C LC0408FC12C LC0408FC15C LC0408FC24C LC0408FC36C @ 25°C Unless Otherwise Specified RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT (See Note 2) TYPICAL CAPACITANCE VWM VOLTS @ 1mA V(BR) VOLTS @ IP = 1A VC VOLTS @8/20µs VC @ IPP @VWM ID µA @0V, 1 MHz C pF 3.3 5.9 8.0 12.0 15.0 24.0 36.0 4.0 6.0 8.5 13.3 16.7 26.7 40.0 7.0 11.0 13.2 19.8 25.4 37.2 70.0 12.5V @ 16A 13V @ 15A 18V @ 11A 26.9V @ 7.4A 34.5V @ 5.8A 50.6V @ 4A 80.0V @ 2.5A 75* 10** 1 1 1 1 1 70 35 32 30 25 20 18 Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V. FIGURE 1 PEAK PULSE POWER VS PULSE TIME IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 10,000 1,000 200W, 8/20µs Waveform 100 10 0.01 05153.R7 2/07 FIGURE 2 PULSE WAVE FORM 120 tf 100 TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs Peak Value IPP 80 e-t 60 40 td = t I /2 PP 20 0 1 10 100 td - Pulse Duration - µs 1,000 10,000 2 0 5 10 15 t - Time - µs 20 25 30 www.protekdevices.com LC0408FC3.3C thru LC0408FC36C GRAPHS FIGURE 3 POWER DERATING CURVE 100 Peak Pulse Power 8/20µs % Of Rated Power 80 60 40 20 Average Power 0 0 25 50 75 100 125 TA - Ambient Temperature - °C 150 FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR LC0408FC05C 5 Volts per Division 35 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0408FC05C VC - Clamping Voltage - Volts 14 12 10 8 6 4 2 0 0 5 10 15 20 IPP - Peak Pulse Current - Amps 05153.R7 2/07 3 www.protekdevices.com LC0408FC3.3C thru LC0408FC36C APPLICATION INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS VALUE PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm 60 Seconds 270°C RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION REQUIREMENTS Non-Solder Mask Defined Pad 0.275mm DIA. Temperature: TP for Lead-Free (SnAgCu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Temperature - °C Ramp-up Ramp-down TL TSMAX 155° TSMIN 140° TS - Preheat t 25°C to Peak 30-60 seconds 05153.R7 2/07 Ramp-up 15 seconds 4 Solder Time 15-20 seconds Ramp-down www.protekdevices.com LC0408FC3.3C thru LC0408FC36C 0408 PACKAGE OUTLINE & DIMENSIONS PACKAGE DIMENSIONS A B C SIDE PACKAGE OUTLINE MILLIMETERS INCHES A 0.56 NOM 0.022 NOM B 0.86 NOM 0.034 NOM C 0.99 ± 0.0254 0.039 ± 0.001 E 0.15 SQ 0.006 SQ F 2.0 ± 0.0254 0.079 ± 0.001 G 0.15 NOM 0.006 NOM H 0.127 MAX 0.005 MAX G TOP DIM I E 0.003 MIN 0.406 NOM 0.016 NOM NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). F H END 0.076 MIN I PAD DIMENSIONS MOUNTING PAD LAYOUT - Option 1 D A C MILLIMETERS INCHES A C D E F G H I 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020 E DIE SOLDER BUMP DIM NOTE: H G 1. Preferred: Using 0.1mm (0.004”) stencil. F I SOLDER PADS SOLDER PRINT 0.010” - 0.012” DIA. SOLDER MASK 05153.R7 2/07 5 www.protekdevices.com LC0408FC3.3C thru LC0408FC36C 0408 PACKAGE OUTLINE & DIMENSIONS PACKAGE DIMENSIONS MOUNTING PAD LAYOUT - Option 2 MILLIMETERS DIM COPPER CONTACT 0.009” [0.23] DIA. A DIE SOLDER BUMP INCHES A 0.51 0.020 F 0.15 SQ 0.006 SQ G 0.71 0.028 H 0.99 0.039 I 0.51 0.020 H G NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. Preferred: Using 0.1mm (0.004”) stencil. I F TAPE & REEL ORIENTATION SOLDER PRINT 0.014” [0.36] DIA. SOLDER MASK Quad Die - 0408 NOTE: 1. Top view of tape. Solder bumps are face down in tape package. TAPE & REEL ORDERING NOMENCLATURE 1. 2. 3. 4. Surface mount product is taped and reeled in accordance with EIA 481. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. OrderingSuffix: -T75-1, i.e., LC0408FC05C-T75-1. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2, i.e., LC0408FC05C-T75-2. Suffix - LF = Lead-Free, i.e., LC0408FC05C-LF-T75-1. Outline & Dimensions: Rev 4 - 2/04, 06021 COPYRIGHT © ProTek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. 05153.R7 2/07 6 ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com www.protekdevices.com