6N135/6, HCNW135/6 HCPL-2502/0500/0501 Single Channel, High Speed Optocouplers Data Sheet Lead (Pb) Free RoHS 6 fully compliant RoHS 6 fully compliant options available; -xxxE denotes a lead-free product Description Features These diode-transistor optocouplers use an insulating layer between a LED and an integrated photodetector to provide electrical insulation between input and output. Separate connections for the photodiode bias and output-transistor collector increase the speed up to a hundred times that of a conventional phototransistor coupler by reducing the base-collector capacitance. • High speed: 1 Mb/s These single channel optocouplers are available in 8-Pin DIP, SO-8 and Widebody package configurations. The 6N135, HCPL-0500, and HCNW135 are for use in TTL/ CMOS, TTL/LSTTL or wide bandwidth analog applications. Current transfer ratio (CTR) for these devices is 7% minimum at IF = 16 mA. The 6N136, HCPL-2502, HCPL-0501, and HCNW136 are designed for high speed TTL/TTL applications. A standard 16 mA TTL sink current through the input LED will provide enough output current for 1 TTL load and a 5.6 kΩ pull-up resistor. CTR for these devices is 19% minimum at IF = 16 mA. Functional Diagram NC 1 • Available in 8-Pin DIP, SO-8, widebody packages • Open collector output • Safety approval UL Recognized – 3750 Vrms for 1 minute (5000 Vrms for 1 minute for HCNW and Option 020 devices) per UL1577 CSA Approved IEC/EN/DIN EN 60747-5-2 Approved – VIORM = 560 V peak for SO8 devices – VIORM = 630 V peak for DIP 300mil devices – VIORM = 1414 V peak for DIP 400mil (widebody) devices • Dual channel version available (253X/053X/0534) Applications • High voltage insulation • Video signal isolation • Line receivers • Feedback element in switched mode power supplies 8 VCC ANODE 2 7 VB CATHODE 3 6 VO NC 4 • TTL compatible TRUTH TABLE (POSITIVE LOGIC) LED VO ON LOW OFF HIGH 5 GND • High speed logic ground isolation – TTL/TTL, TTL/CMOS, TTL/LSTTL • Replaces pulse transformers • Replaces slow phototransistor isolators • Analog signal ground isolation A 0.1 µF bypass capacitor must be connected between pins 5 and 8. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Schematic ANODE 8 IO 6 VCC IF 2 + VF CATHODE ICC - VO 3 5 SHIELD 7 VB GND IB Selection Guide Minimum CMR Current dV/dt VCM Transfer (V/µs) (V) Ratio (%) 1,000 10 7 19 15 8-Pin DIP (300 Mil) Single Dual Channel Channel Package Package* 6N135 HCPL-2530 Widebody (400 Mil) Single Channel Package HCPL-0500 HCPL-0530 HCNW135 6N136 HCPL-2531 HCPL-0501 HCPL-2502 HCPL-0531 HCNW136 *Technical data for these products are on separate Avago publications. 2 Small-Outline SO-8 Single Dual Channel Channel Package Package* Ordering Information 6N135, 6N136, HCPL-2502, HCPL-0500, HCPL-0501 are UL Recognized with 3750 Vrms for 1 minute per UL1577. HCNW135, HCNW136 are UL Recognized with 5000 Vrms for 1 minute per UL1577. All devices above listed are approved under CSA Component Acceptance Notice #5, File CA 88324. Option Part number 6N135 6N136 HCPL-2502 HCPL-0500 HCPL-0501 HCNW135 HCNW136 RoHS Compliant Non RoHS Compliant -000E No option -300E #300 X X -500E #500 X X -020E #020 -320E #320 -520E #520 -060E #060 -360E #360 X X -560E #560 X X -000E No option -500E #500 -060E #060 -560E #560 -000E No option -300E #300 -500E #500 Package Surface Mount Gull Wing Tape & Reel UL 5000 Vrms/ 1 Minute rating IEC/EN/DIN EN 607475-2 Quantity 50 per tube 300mil DIP-8 X X X X 50 per tube X X 1000 per reel X 50 per tube X 50 per tube X 1000 per reel X X 50 per tube X 50 per tube X 1000 per reel 100 per tube SO-8 400mil Widebody DIP-8 X X X X X X X X X X X 1500 per reel X 100 per tube X 1500 per reel X X 42 per tube X X 42 per tube X X 750 per reel To order, choose a part number from the part number column and combine with the desired option from the option column to form an order entry. Example 1: HCPL-2502-560E to order product of 300mil DIP Gull Wing Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN 60747-5-2 Safety Approval in RoHS compliant. Example 2: HCPL-2502 to order product of 300mil DIP package in tube packaging and non RoHS compliant. Option datasheets are available. Contact your Avago sales representative or authorized distributor for information. Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and RoHS compliant option will use ‘-XXXE‘. 3 Package Outline Drawings 8-Pin DIP Package (6N135/6, HCPL-2502) 7.62 ± 0.25 (0.300 ± 0.010) 9.65 ± 0.25 (0.380 ± 0.010) 8 TYPE NUMBER 7 6 5 6.35 ± 0.25 (0.250 ± 0.010) OPTION CODE* DATE CODE A XXXXZ YYWW RU 1 2 3 UL RECOGNITION 4 1.78 (0.070) MAX. 1.19 (0.047) MAX. + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 5° TYP. 3.56 ± 0.13 (0.140 ± 0.005) 4.70 (0.185) MAX. 0.51 (0.020) MIN. 2.92 (0.115) MIN. DIMENSIONS IN MILLIMETERS AND (INCHES). 0.65 (0.025) MAX. 1.080 ± 0.320 (0.043 ± 0.013) *MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020 "V" = OPTION 060 OPTION NUMBERS 300 AND 500 NOT MARKED. 2.54 ± 0.25 (0.100 ± 0.010) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N135/6) LAND PATTERN RECOMMENDATION 9.65 ± 0.25 (0.380 ± 0.010) 8 7 6 1.016 (0.040) 5 6.350 ± 0.25 (0.250 ± 0.010) 1 2 3 10.9 (0.430) 4 1.27 (0.050) 1.19 (0.047) MAX. 1.780 (0.070) MAX. 9.65 ± 0.25 (0.380 ± 0.010) 7.62 ± 0.25 (0.300 ± 0.010) 3.56 ± 0.13 (0.140 ± 0.005) 1.080 ± 0.320 (0.043 ± 0.013) 0.635 ± 0.130 2.54 (0.025 ± 0.005) (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). 0.635 ± 0.25 (0.025 ± 0.010) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 4 2.0 (0.080) + 0.076 0.254 - 0.051 + 0.003) (0.010 - 0.002) 12° NOM. Small Outline SO-8 Package (HCPL-0500/1) LAND PATTERN RECOMMENDATION 8 7 6 5 5.994 ± 0.203 (0.236 ± 0.008) XXX YWW 3.937 ± 0.127 (0.155 ± 0.005) 7.49 (0.295) TYPE NUMBER (LAST 3 DIGITS) DATE CODE PIN ONE 1 2 3 4 1.9 (0.075) 0.406 ± 0.076 (0.016 ± 0.003) 1.270 BSC (0.050) 0.64 (0.025) * 5.080 ± 0.127 (0.200 ± 0.005) 7° 3.175 ± 0.127 (0.125 ± 0.005) 45° X 0.432 (0.017) 0 ~ 7° 1.524 (0.060) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 5.207 ± 0.254 (0.205 ± 0.010) 0.228 ± 0.025 (0.009 ± 0.001) 0.203 ± 0.102 (0.008 ± 0.004) 0.305 MIN. (0.012) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. 8-Pin Widebody DIP Package (HCNW135/6) 11.00 MAX. (0.433) 11.23 ± 0.15 (0.442 ± 0.006) 8 7 6 5 TYPE NUMBER A HCNWXXXX 9.00 ± 0.15 (0.354 ± 0.006) DATE CODE YYWW 1 2 3 4 10.16 (0.400) TYP. 1.55 (0.061) MAX. 7 TYP. 5.10 MAX. (0.201) 3.10 (0.122) 3.90 (0.154) + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) 0.51 (0.021) MIN. 2.54 (0.100) TYP. 1.8 ± 0.15 (0.071 ± 0.006) 0.40 (0.016) 0.56 (0.022) DIMENSIONS IN MILLIMETERS (INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. 5 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6) 11.23 ± 0.15 (0.442 ± 0.006) 8 7 LAND PATTERN RECOMMENDATION 6 5 9.00 ± 0.15 (0.354 ± 0.006) 1 2 3 13.56 (0.534) 4 2.29 (0.09) 1.3 (0.051) 12.30 ± 0.30 (0.484 ± 0.012) 1.55 (0.061) MAX. 11.00 MAX. (0.433) 4.00 MAX. (0.158) 1.80 ± 0.15 (0.071 ± 0.006) 0.75 ± 0.25 (0.030 ± 0.010) 2.54 (0.100) BSC 1.00 ± 0.15 (0.039 ± 0.006) + 0.076 0.254 - 0.0051 + 0.003) (0.010 - 0.002) DIMENSIONS IN MILLIMETERS (INCHES). 7 NOM. LEAD COPLANARITY = 0.10 mm (0.004 INCHES). NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX. Solder Reflow Temperature Profile 300 PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC. REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC. 200 PEAK TEMP. 245 °C PEAK TEMP. 240 °C TEMPERATURE (°C) 2.5 C ± 0.5 °C/SEC. 30 SEC. 160 °C 150 °C 140 °C PEAK TEMP. 230 °C SOLDERING TIME 200 °C 30 SEC. 3 °C + 1 °C/–0.5 °C 100 PREHEATING TIME 150 °C, 90 + 30 SEC. 50 SEC. TIGHT TYPICAL LOOSE ROOM TEMPERATURE 0 0 50 100 150 TIME (SECONDS) NOTE: NON-HALIDE FLUX SHOULD BE USED. 6 200 250 Recommended Pb-Free IR Profile tp Tp TEMPERATURE TL Tsmax * 260 +0/-5 °C TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE 15 SEC. 217 °C 150 - 200 °C RAMP-UP 3 °C/SEC. MAX. RAMP-DOWN 6 °C/SEC. MAX. NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 °C, Tsmin = 150 °C Tsmin ts PREHEAT 60 to 180 SEC. 25 tL NON-HALIDE FLUX SHOULD BE USED. 60 to 150 SEC. * RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 °C t 25 °C to PEAK TIME Regulatory Information The devices contained in this data sheet have been approved by the following organizations: UL Recognized under UL 1577, Component Recognition Program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. IEC/EN/DIN EN 60747-5-2 Approved under: IEC 60747-5-2:1997 + A1:2002 EN 60747-5-2:2001 + A1:2002 DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01 (HCNW and Option 060 only) Insulation and Safety Related Specifications Parameter Symbol 8-Pin DIP (300 Mil) SO-8 Value Value Widebody (400 Mil) Value Units Conditions Minimum External L(101) 7.1 4.9 9.6 mm Air Gap (External Clearance) Measured from input terminals to output terminals, shortest distance through air. Minimum External L(102) 7.4 4.8 10.0 mm Tracking (External Creepage) Measured from input terminals to output terminals, shortest distance path along body. Minimum Internal 0.08 0.08 1.0 mm Plastic Gap (Internal Clearance) Minimum Internal NA NA 4.0 mm Tracking (Internal Creepage) Measured from input terminals to output terminals, along internal cavity. Tracking Resistance (Comparative Tracking Index) DIN IEC 112/VDE 0303 Part 1 CTI 200 200 200 Volts Isolation Group IIIa IIIa IIIa Option 300 - surface mount classification is Class A in accordance with CECC 00802. 7 Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Material Group (DIN VDE 0110, 1/89, Table 1) IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (OPTION 060 ONLY) Description Symbol Characteristic 8 Pin DIP SO-8 Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤300 V rms I-IV for rated mains voltage ≤450 V rms I-III I-III Climatic Classification 55/100/21 55/100/21 Pollution Degree (DIN VDE 0110/1.89) 2 2 Maximum Working Insulation Voltage Units VIORM 630 560 V peak Input to Output Test Voltage, Method b* VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, Partial Discharge < 5 pC VPR 1181 1050 V peak Input to Output Test Voltage, Method a* VIORM x 1.5 = VPR, Type and sample test, tm = 60 sec, Partial Discharge < 5 pC VPR 945 840 V peak VIOTM 6000 4000 V peak TS IS,INPUT PS,OUTPUT 175 230 600 175 150 600 °C mA mW RS ≥ 109 ≥ 109 Ω Highest Allowable Overvoltage* (Transient Overvoltage, tini = 10 sec) Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 9, Thermal Derating curve.) Case Temperature Input Current Output Power Insulation Resistance at TS, VIO = 500 V *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW135/6 ONLY) Description Symbol Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤600 V rms Characteristic Units I-IV for rated mains voltage ≤1000 V rms I-III Climatic Classification 55/85/21 Pollution Degree (DIN VDE 0110/1.89) Maximum Working Insulation Voltage 2 VIORM 1414 V peak Input to Output Test Voltage, Method b* VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, Partial Discharge < 5 pC VPR 2652 V peak Input to Output Test Voltage, Method a* VIORM x 1.5 = VPR, Type and sample test, tm = 60 sec, Partial Discharge < 5 pC VPR 2121 V peak VIOTM 8000 V peak TS IS,INPUT PS,OUTPUT 150 400 700 °C mA mW RS ≥ 109 Ω Highest Allowable Overvoltage* (Transient Overvoltage, tini = 10 sec) Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 9, Thermal Derating curve.) Case Temperature Input Current Output Power Insulation Resistance at TS, VIO = 500 V *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section IEC/EN/DIN EN 60747-5-2, for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. 8 Absolute Maximum Ratings Parameter Storage Temperature* Symbol Device TS Min. Max. Units -55 125 °C °C Operating Temperature* TA 8-Pin DIP SO-8 -55 100 Widebody -55 85 Average Forward Input Current* IF(AVG) mA 1 Peak Forward Input Current* IF(PEAK) (50% duty cycle, 1 ms pulse width) 8-Pin DIP SO-8 50 mA 2 (50% duty cycle, 1 ms pulse width) Widebody 40 Peak Transient Input Current* IF(TRANS) (≤1 µs pulse width, 300 pps) 8-Pin DIP SO-8 1 Widebody 0.1 Reverse LED Input Voltage* (Pin 3-2) VR 8-Pin DIP SO-8 5 Widebody 3 Input Power Dissipation* PIN 8-Pin DIP SO-8 45 Widebody 40 Average Output Current* (Pin 6) IO(AVG) 8 mA Peak Output Current* IO(PEAK) 16 mA Emitter-Base Reverse Voltage* (Pin 5-7) VEBR 5 V Supply Voltage (Pin 8-5) VCC -0.5 30 V Output Voltage (Pin 6-5) VO -0.5 20 V Supply Voltage* (Pin 8-5) VCC -0.5 15 V Output Voltage* (Pin 6-5) VO -0.5 15 V Base Current* (Pin 7) IB 5 mA Output Power Dissipation* PO 100 mW 260 260 °C °C Lead Solder Temperature* (Through-Hole Parts Only) 1.6 mm below seating plane, 10 seconds TLS up to seating plane, 10 seconds 8-Pin DIP Widebody Reflow Temperature Profile TRP SO-8 and Option 300 *Data has been registered with JEDEC for the 6N135/6N136. 9 25 Note A V mW See Package Outline Drawings section 3 4 Electrical Specifications (DC) Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified. See note 13. Parameter Current Transfer Ratio Logic Low Output Voltage Symbol Device Min. Typ.** Max. Units CTR* 6N135 HCPL-0500 HCNW135 HCPL-2502 7 5 18 19 50 % 15 15 19 15 25 24 25 0.1 0.1 0.4 0.5 0.1 0.1 0.4 0.5 µA µA VOL 6N136 HCPL-0501 HCNW136 6N135 HCPL-0500 HCNW135 6N136 HCPL-2502 HCPL-0501 HCNW136 TA = 25°C VO = 0.4 V VO = 0.5 V 22 TA = 25°C 50 TA = 25°C VO = 0.4 V VO = 0.5 V VO = 0.4 V VO = 0.5 V Logic High Output Current IOH* 0.003 0.01 Logic Low Supply Current Logic High Supply Current ICCL 50 0.5 1 50 200 ICCH* 0.02 1 Input Forward VF* Voltage Input Reverse Breakdown Voltage BVR* Temperature Coefficient of Forward Voltage Input Capacitance ∆VF/ ∆TA Transistor DC Current Gain hFE CIN *For JEDEC registered parts. **All typicals at TA = 25°C. 10 8-Pin DIP SO-8 Widebody 8-Pin DIP SO-8 Widebody 1.5 1.45 1.35 5 1.68 2 1.7 1.8 1.85 1.95 V µA V 8-Pin DIP SO-8 Widebody -1.6 8-Pin DIP SO-8 Widebody 8-Pin DIP SO-8 Widebody 60 TA = 25°C IO = 1.1 mA IO = 0.8 mA TA = 25°C IO = 3.0 mA IO = 2.4 mA TA = 25°C TA = 25°C VO = VCC = 5.5 V VO = VCC = 15 V VO = VCC = 15 V IF = 16 mA, VO = Open, VCC = 15 V TA = 25°C IF = 0 mA, VO = Open, VCC = 15 V TA = 25°C IF = 16 mA TA = 25°C V 3 Test Conditions IF = 16 mA IR = 10 µA IR = 100 µA mV/°C IF = 16 mA -1.9 90 150 130 180 160 pF f = 1 MHz, VF = 0 V VO = 5 V, IO = 3 mA VO = 0.4 V, IB = 20 µA VO = 0.4 V, IB = 20 µA VO = 5 V, IO = 3 mA IF = 16 mA, VCC = 4.5 V Fig. Note 1, 2, 4 5, 11 IF = 16 mA, VCC = 4.5 V IF = 0 mA 7 13 13 3 Switching Specifications (AC) Over recommended temperature (TA = 0°C to 70°C), VCC = 5 V, IF = 16 mA unless otherwise specified. Parameter Sym. Device Min. Typ.** Max. Units Test Conditions 1.5 µs TA = 25°C RL = 4.1 kΩ 2.0 Propagation tPHL* Delay Time to Logic Low at Output 6N135 0.2 HCPL-0500 HCNW135 Propagation tPLH* Delay Time to Logic High at Output Common Mode |CMH| Transient Im munity at Logic High Level Output Common Mode |CML| Transient Im munity at Logic Low Level Output Bandwidth BW 6N135 1.3 HCPL-0500 HCNW135 6N136 1 HCPL-2502 1 HCPL-0501 6N135/6 9 MHz HCPL-2502 HCPL-0500/1 HCNW135/6 *For JEDEC registered parts. **All typicals at TA = 25°C. 11 6N136 0.2 0.8 TA = 25°C HCPL-2502 HCPL-0501 HCNW136 1.0 Note 8, 9 RL = 1.9 kΩ 1.5 µs TA = 25°C RL = 4.1 kΩ 2.0 6N136 0.6 0.8 TA = 25°C HCPL-2502 HCPL-0501 HCNW136 1.0 6N135 1 kV/µs RL = 4.1 kΩ HCPL-0500 1 HCNW135 Fig. 5, 6, 11 5, 6, 11 8, 9 RL = 1.9 kΩ IF = 0 mA, TA = 25°C, 12 VCM = 10 Vp-p CL = 15 pF 7, 8, 9 6N136 1 RL = 1.9 kΩ HCPL-2502 1 HCPL-0501 6N135 1 kV/µs RL = 4.1 kΩ IF = 16 mA, TA = 25°C, 12 7, 8, HCPL-0500 1 VCM = 10 Vp-p 9 HCNW135 CL = 15 pF 11 RL = 1.9 kΩ See Test Circuit 8, 10 10 Package Characteristics Over recommended temperature (TA = 0°C to 70°C) unless otherwise specified. Parameter Sym. Device Min. Typ.* Max. Units Input-Output VISO 8-Pin DIP 3750 V rms Momentary SO-8 Widebody 5000 Withstand Voltage** 8-Pin DIP SO-8 1012 Widebody 1013 Input-Output CI-O Capacitance Fig. RH < 50%, t = 1 min., TA = 25°C 8-Pin DIP 5000 (Option 020) II-O 8-Pin DIP 1 µA Input-Output RI-O Resistance Test Conditions 1012 Ω 10 11 8-Pin DIP SO-8 0.6 Widebody 0.5 pF Note 6, 14 6, 15 6, 12, 15 45% RH, t = 5 s, VI-O = 3 kVdc, TA = 25°C 6, 16 VI-O = 500 Vdc 6 TA = 25°C TA = 100°C f = 1 MHz 6 0.6 *All typicals at TA = 25°C. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table (if applicable), your equipment level safety specification or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage,” publication number 5963-2203E. Notes: 1. Derate linearly above 70°C free-air temperature at a rate of 0.8 mA/°C (8-Pin DIP). Derate linearly above 85°C free-air temperature at a rate of 0.5 mA/°C (SO-8). 2. Derate linearly above 70°C free-air temperature at a rate of 1.6 mA/°C (8-Pin DIP). Derate linearly above 85°C free-air temperature at a rate of 1.0 mA/°C (SO-8). 3. Derate linearly above 70°C free-air temperature at a rate of 0.9 mW/°C (8-Pin DIP). Derate linearly above 85°C free-air temperature at a rate of 1.1 mW/°C (SO-8). 4. Derate linearly above 70°C free-air temperature at a rate of 2.0 mW/°C (8-Pin DIP). Derate linearly above 85°C free-air temperature at a rate of 2.3 mW/°C (SO-8). 5. CURRENT TRANSFER RATIO in percent is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100. 6. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together. 7. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt on the leading edge of the common mode pulse signal, VCM, to assure that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable (negative) dVCM /dt on the trailing edge of the common mode pulse signal, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V). 8. The 1.9 kΩ load represents 1 TTL unit load of 1.6 mA and the 5.6 kΩ pull-up resistor. 9. The 4.1 kΩ load represents 1 LSTTL unit load of 0.36 mA and 6.1 kΩ pull-up resistor. 10. The frequency at which the ac output voltage is 3 dB below its mid-frequency value. 11. The JEDEC registration for the 6N136 specifies a minimum CTR of 15%. Avago guarantees a minimum CTR of 19%. 12. See Option 020 data sheet for more information. 13. Use of a 0.1 µf bypass capacitor connected between pins 5 and 8 is recommended. 14. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 4500 V rms for 1 second (leakage detection current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table if applicable. 15. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 second (leakage detection current limit, II-O ≤ 5 µA). This test is performed before the 100% Production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics Table if applicable. 16. This rating is equally validated by an equivalent ac proof test. 12 T = 25 C 10 VA = 5.0 V CC 35 mA 30 mA 25 mA 5 20 mA 15 mA 10 mA 0 IF = 5 mA 0 10 WIDEBODY 16 40 mA IO Ð OUTPUT CURRENT Ð mA IO Ð OUTPUT CURRENT - mA 8 PIN DIP, SO-8 40 mA 12 35 mA 30 mA 25 mA 8 20 mA 15 mA 4 10 mA IF = 5 mA 0 20 TA = 25 C VCC = 5.0 V 0 10 VO - OUTPUT VOLTAGE - V 20 VO - OUTPUT VOLTAGE - V 8 PIN DIP, SO-8 1.5 6N135, HCPL-0500 6N136, HCPL-2502 HCPL-0501 1.0 0.5 0.1 NORMALIZED I F = 16 mA VO = 0.4 V VCC = 5 V TA = 25 C 0 1 10 100 NORMALIZED CURRENT TRANSFER RATIO NORMALIZED CURRENT TRANSFER RATIO Figure 1. DC and pulsed transfer characteristics. WIDEBODY 1.5 HCNW135/6 1.0 0.5 0 NORMALIZED IF = 16 mA VO = 0.4 V VCC = 4.5 V TA = 25 C 0 1 IF - INPUT CURRENT - mA 10 100 IF - INPUT CURRENT - mA Figure 2. Current transfer ratio vs. input current. 8 PIN DIP, SO-8 100 IF TA = 25 C + VF - 10 1.0 1000 0.1 0.01 0.001 1.1 1.2 1.3 1.4 1.5 VF - FORWARD VOLTAGE - VOLTS Figure 3. Input current vs. forward voltage. 13 IF - FORWARD CURRENT - mA IF - FORWARD CURRENT - mA 1000 1.6 WIDEBODY TA = 25 C 100 10 1.0 IF 0.1 + VF - 0.01 0.001 1.2 1.3 1.4 1.5 1.6 1.7 1.8 VF - FORWARD VOLTAGE - VOLTS 8 PIN DIP, SO-8 1.0 0.9 0.8 0.7 NORMALIZED IF = 16 mA VO = 0.4 V VCC = 5 V TA = 25° C 6N135, HCPL-0500 6N136, HCPL-2502, HCPL-0501 0.6 -60 -40 -20 0 20 40 80 100 60 NORMALIZED CURRENT TRANSFER RATIO NORMALIZED CURRENT TRANSFER RATIO 1.1 WIDEBODY 1.1 1.0 HCNW135/6 0.9 0.8 0.7 NORMALIZED IF = 16 mA VO = 0.4 V VCC = 5 V TA = 25° C 0.6 0.5 0.4 -60 -40 -20 TA - TEMPERATURE - ° C 0 40 20 80 100 60 TA - TEMPERATURE - ° C Figure 4. Current transfer ratio vs. temperature. 1500 8 PIN DIP, SO-8 IF = 16 mA, VCC = 5.0 V 6N135, HCPL-0500 (RL = 4.1 kΩ) 6N136, HCPL-0501, HCPL-2502 (RL = 1.9 kΩ) 1000 tPLH tPHL 500 0 -60 20 -20 60 WIDEBODY 1000 tp - PROPAGATION DELAY - ns tp - PROPAGATION DELAY - ns 2000 IF = 16 mA, VCC = 5.0 V HCNW135 (RL = 4.1 kΩ) HCNW136 (RL = 1.9 kΩ) 800 600 t PLH 400 200 0 -60 -40 -20 100 t PHL 0 20 40 60 80 100 TA - TEMPERATURE - ° C TA - TEMPERATURE - ° C Figure 5. Propagation delay vs. temperature. 2.0 1.0 0.8 0.6 8 PIN DIP, SO-8 I F = 10 mA I F = 16 mA VCC = 5.0 V TA = 25° C tPLH 0.4 t PHL 0.2 0.1 1 2 3 4 5 6 7 8 9 10 RL - LOAD RESISTANCE - (kΩ) Figure 6. Propagation delay time vs. load resistance. 14 WIDEBODY 10.0 tP - PROPAGATION DELAY - µs tP - PROPAGATION DELAY - µs 3.0 I F = 10 mA I t = 16 mA 6.0 4.0 VCC = 5.0 V TA = 25° C t PLH 1.0 0.6 t PHL 0.4 0.2 0.1 1 2 4 10 40 RL - LOAD RESISTANCE - (kΩ) 100 IF = 0 VO = VCC = 5.0 V 10+3 +2 10 10+1 100 10 -1 10 -2 -75 -50 -25 0 +25 +50 +75 +100 IOH - LOGIC HIGH OUTPUT CURRENT - nA IOH - LOGIC HIGH OUTPUT CURRENT - nA 8 PIN DIP, SO-8 10+4 WIDEBODY +3 10 IF = 0 VO = VCC = 15 V +2 10 +1 10 0 10 -60 -40 -20 0 20 40 60 80 100 TA - TEMPERATURE - C TA - TEMPERATURE - C 8 PIN DIP, SO-8 0.30 IO I F - SMALL SIGNAL CURRENT TRANSFER RATIO IO I F - SMALL SIGNAL CURRENT TRANSFER RATIO Figure 7. Logic high output current vs. temperature. WIDEBODY 0.50 TA = 25 C, RL = 100 , VCC = 5 V TA = 25 C, RL = 100 , VCC = 5 V 0.40 0.20 0.30 0.20 0.10 0.10 0 0 4 8 12 16 20 25 IF - QUIESCENT INPUT CURRENT - mA 0 0 4 8 12 16 20 25 IF - QUIESCENT INPUT CURRENT - mA 8-PIN DIP/S0-8 800 PS (mW) IS (mA) For 8-PIN DIP IS (mA) For S0-8 700 600 500 400 300 200 100 0 0 25 50 75 100 125 150 175 200 TS - CASE TEMPERATURE - C OUTPUT POWER - PS, INPUT CURRENT - IS OUTPUT POWER - PS, INPUT CURRENT - IS Figure 8. Small-signal current transfer ratio vs. quiescent input current. HCNW135/6 1000 PS (mW) 900 IS (mA) 800 700 600 500 400 300 200 100 0 0 25 50 75 100 125 150 175 TS - CASE TEMPERATURE - C Figure 9. Thermal derating curve, dependence of safety limiting value with case temperature per IEC/EN/DIN EN 60747-5-2. 15 NORMALIZED RESPONSE - dB +5 6N135/6, HCPL-0500/1, HCPL-2502 TA = 25C 6N135/6, HCPL-0500/1, HCPL-2502 +12 V 1 0.1 µF 0 2 47 µF VFF -10 100 1 K 51 -15 1N4150 1.0 10 Q1 3 5 TRIM FOR UNITY GAIN Figure 10. Frequency response. Q 1 , Q 2 , Q 3 : 2N3904 TYPICAL LINEARITY = ± 3% AT V IN = 1 V p-p TYPICAL SNR = 50dB TYPICAL R T = 375 TYPICAL VO dc = 3.8 V TYPICAL I F = 9 mA 100 HCNW135/6 HCNW135/6 470 � 100 RT 22 VO Q2 0.1 µF 4 0.1 µF Q3 6 f - FREQUENCY - MHz 16 15 K 7 1.2 K 9.1 K -5 -20 0.1 +12 V 8 2.1 K (1 M 12 pF TEST INPUT) IF PULSE GEN. ZO = 50 t r = 5 ns 0 5V VO 1.5 V 10% DUTY CYCLE 1/f < 100 µS 1.5 V VOL 1 8 2 7 3 6 +5 V RL 0.1µF I F MONITOR 4 5 Figure 11. Switching test circuit. IF 1 8 2 7 3 6 +5 V B VCM 0V 10% 90% 90% VO tf 5V SWITCH AT B: I F = 16 mA VO 0.1 µF SWITCH AT A: I F = 0 mA VO RL A 10% tr VFF 4 5 VOL VCM + - PULSE GEN. Figure 12. Test circuit for transient immunity and typical waveforms. For product information and a complete list of distributors, please go to our website: VO CL = 1.5 µF RM t PLH t PHL IF www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes AV01-0550EN AV02-0171EN - January 29, 2010