IRF3708S SMPS MOSFET Applications l High Frequency DC-DC Isolated Converters with Synchronous Rectification for Telecom and Industrial Use l High Frequency Buck Converters for Computer Processor Power D2Pak IRF3708S Benefits l Ultra-Low Gate Impedance l Very Low RDS(on) at 4.5V VGS l Fully Characterized Avalanche Voltage and Current VDSS RDS(on) max ID 30V 12mΩ 62A Absolute Maximum Ratings Symbol VDS VGS ID @ TC = 25°C ID @ TC = 70°C IDM PD @TC = 25°C PD @TC = 70°C TJ , TSTG Parameter Drain-Source Voltage Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Maximum Power Dissipation Maximum Power Dissipation Linear Derating Factor Junction and Storage Temperature Range Max. Units 30 ±12 62 52 248 87 61 0.58 -55 to + 175 V V A W W W/°C °C Thermal Resistance RθJC RθCS RθJA RθJA Parameter Typ. Max. Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient Junction-to-Ambient (PCB mount)* ––– 0.50 ––– ––– 1.73 ––– 62 40 Units °C/W * When mounted on 1" square PCB (FR-4 or G-10 Material) . For recommended footprint and soldering techniques refer to application note #AN-994 2014-8-13 1 www.kersemi.com IRF3708S Static @ TJ = 25°C (unless otherwise specified) Parameter Drain-to-Source Breakdown Voltage ∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient V(BR)DSS RDS(on) VGS(th) IDSS IGSS Min. 30 ––– ––– Static Drain-to-Source On-Resistance ––– ––– Gate Threshold Voltage 0.6 ––– Drain-to-Source Leakage Current ––– Gate-to-Source Forward Leakage ––– Gate-to-Source Reverse Leakage ––– Typ. ––– 0.028 8 9.5 14.5 ––– ––– ––– ––– ––– Max. Units ––– V ––– V/°C 12.0 13.5 mΩ 29 2.0 V 20 µA 100 200 nA -200 Conditions VGS = 0V, ID = 250µA Reference to 25°C, ID = 1mA VGS = 10V, ID = 15A VGS = 4.5V, I D = 12A VGS = 2.8V, ID = 7.5A VDS = VGS, ID = 250µA VDS = 24V, VGS = 0V VDS = 24V, VGS = 0V, TJ = 125°C VGS = 12V VGS = -12V Dynamic @ TJ = 25°C (unless otherwise specified) Symbol gfs Qg Qgs Qgd Qoss td(on) tr td(off) tf Ciss Coss Crss Parameter Forward Transconductance Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Output Gate Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Min. 49 ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– Typ. ––– 24 6.7 5.8 14 7.2 50 17.6 3.7 2417 707 52 Max. Units Conditions ––– S VDS = 15V, ID = 50A ––– ID = 24.8A VDS = 15V ––– nC ––– VGS = 4.5V 21 VGS = 0V, ID = 24.8A, VDS = 15V ––– VDD = 15V ––– ID = 24.8A ns ––– RG = 0.6Ω ––– VGS = 4.5V ––– VGS = 0V ––– VDS = 15V ––– pF ƒ = 1.0MHz Avalanche Characteristics Parameter Symbol EAS IAR Single Pulse Avalanche Energy Avalanche Current Typ. Max. Units ––– ––– 213 62 mJ A Diode Characteristics Symbol IS ISM VSD trr Qrr trr Qrr 2014-8-13 Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Reverse Reverse Reverse Recovery Recovery Recovery Recovery Time Charge Time Charge Min. Typ. Max. Units ––– ––– 62 ––– ––– 248 ––– ––– ––– ––– ––– ––– 0.88 0.80 41 64 43 70 1.3 ––– 62 96 65 105 A 2 V ns nC ns nC Conditions D MOSFET symbol showing the G integral reverse S p-n junction diode. TJ = 25°C, IS = 31A, VGS = 0V TJ = 125°C, I S = 31A, VGS = 0V TJ = 25°C, IF = 31A, VR=20V di/dt = 100A/µs TJ = 125°C, IF = 31A, VR=20V di/dt = 100A/µs www.kersemi.com IRF3708S 1000 VGS TOP 10.0V 5.0V 4.5V 4.0V 3.5V 3.3V 3.0V BOTTOM 2.7V 100 2.7V 10 VGS 10.0V 5.0V 4.5V 4.0V 3.5V 3.3V 3.0V BOTTOM 2.7V TOP ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A) 1000 100 2.7V 10 20µs PULSE WIDTH Tj = 175°C 20µs PULSE WIDTH Tj = 25°C 1 1 0.1 1 10 100 0.1 VDS, Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 2.5 TJ = 175 ° C V DS = 15V 20µs PULSE WIDTH 3.0 4.0 5.0 6.0 100 ID = 62A 2.0 1.5 1.0 0.5 0.0 -60 -40 -20 VGS = 10V 0 20 40 60 80 100 120 140 160 180 TJ , Junction Temperature ( °C) VGS, Gate-to-Source Voltage (V) Fig 3. Typical Transfer Characteristics 2014-8-13 R DS(on) , Drain-to-Source On Resistance (Normalized) I D , Drain-to-Source Current (A) TJ = 25 ° C 10 2.0 10 Fig 2. Typical Output Characteristics 1000 100 1 VDS, Drain-to-Source Voltage (V) 3 Fig 4. Normalized On-Resistance Vs. Temperature www.kersemi.com IRF3708S VGS = 0V, f = 1MHz Ciss = Cgs + Cgd , Cds SHORTED Crss = Cgd Coss = Cds + Cgd C, Capacitance (pF) 2800 Ciss 2100 1400 C oss 700 10 VGS , Gate-to-Source Voltage (V) 3500 C rss 0 1 10 ID = 24.8A VDS = 15V 8 6 4 2 0 100 0 VDS , Drain-to-Source Voltage (V) 10 20 30 40 50 QG , Total Gate Charge (nC) Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 1000 1000 OPERATION IN THIS AREA LIMITED BY R TJ = 175 ° C 100 I D , Drain Current (A) ISD , Reverse Drain Current (A) DS(on) 1 0us 100 TJ = 25 ° C 10 1 00us 1 ms 10 1 0.1 0.2 V GS = 0 V 0.8 1.4 2.0 2.6 VSD ,Source-to-Drain Voltage (V) 1 0.1 1 10 100 VDS , Drain-to-Source Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage 2014-8-13 1 0ms TC = 25 ° C TJ = 175 ° C Single Pulse Fig 8. Maximum Safe Operating Area 4 www.kersemi.com IRF3708S 70 RD VDS VGS 60 D.U.T. I D , Drain Current (A) RG + -VDD 50 10V 40 Pulse Width ≤ 1 µs Duty Factor ≤ 0.1 % 30 Fig 10a. Switching Time Test Circuit 20 VDS 90% 10 0 25 50 75 100 125 150 175 TC , Case Temperature ( ° C) 10% VGS td(on) Fig 9. Maximum Drain Current Vs. Case Temperature tr t d(off) tf Fig 10b. Switching Time Waveforms Thermal Response (Z thJC ) 10 1 D = 0.50 0.20 0.10 P DM 0.05 0.1 0.02 0.01 0.01 0.00001 SINGLE PULSE (THERMAL RESPONSE) t1 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak T J = P DM x Z thJC + TC 0.0001 0.001 0.01 0.1 1 t1 , Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case 2014-8-13 5 www.kersemi.com IRF3708S ( RDS(on), Drain-to -Source On Resistance Ω) RDS ( on ) , Drain-to-Source On Resistance (Ω ) 0.025 0.020 0.015 VGS = 4.5V 0.010 VGS = 10V 0.005 50 0 100 150 200 250 0.017 0.015 0.013 0.011 ID = 31A 0.009 0.007 2.0 300 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 VGS, Gate -to -Source Voltage (V) ID , Drain Current ( A ) Fig 12. On-Resistance Vs. Drain Current Fig 13. On-Resistance Vs. Gate Voltage Current Regulator Same Type as D.U.T. QG VGS QGS .3µF D.U.T. + V - DS QGD VGS 3mA Charge IG ID Current Sampling Resistors Fig 14a&b. Gate Charge Test Circuit and Waveform 15V V (B R )D S S tp L VD S D.U .T RG IA S 20 V IAS tp DRIVER + - VD D 0.0 1 Ω Fig 15a&b. Unclamped Inductive Test circuit and Waveforms 2014-8-13 600 VG EAS , Single Pulse Avalanche Energy (mJ) 50KΩ .2µF 12V A ID 10A 20.7A BOTTOM 24.8A TOP 480 360 240 120 0 25 50 75 100 125 150 175 Starting TJ , Junction Temperature ( ° C) Fig 15c. Maximum Avalanche Energy Vs. Drain Current 6 www.kersemi.com IRF3708S TO-220AB Package Outline Dimensions are shown in millimeters (inches) 2 .8 7 (.1 1 3 ) 2 .6 2 (.1 0 3 ) 1 0 .5 4 (.4 1 5 ) 1 0 .2 9 (.4 0 5 ) -B - 3 .7 8 (.1 4 9 ) 3 .5 4 (.1 3 9 ) 4 .6 9 (.1 8 5 ) 4 .2 0 (.1 6 5 ) -A - 1 .3 2 (.05 2 ) 1 .2 2 (.04 8 ) 6 .4 7 (.2 5 5 ) 6 .1 0 (.2 4 0 ) 4 1 5 .2 4 (.6 0 0 ) 1 4 .8 4 (.5 8 4 ) 1 .1 5 (.0 4 5 ) M IN 1 2 3 1 4 .0 9 (.5 5 5 ) 1 3 .4 7 (.5 3 0 ) 4 .0 6 (.1 6 0 ) 3 .5 5 (.1 4 0 ) 3X 1 .4 0 (.0 5 5 ) 3X 1 .1 5 (.0 4 5 ) L E A D A S S IG N M E N T S 1 - GATE 2 - D R A IN 3 - S OU R CE 4 - D R A IN 0 .93 (.0 3 7 ) 0 .69 (.0 2 7 ) 0 .3 6 (.0 1 4 ) 3X M B A M 0.5 5 (.0 2 2 ) 0.4 6 (.0 1 8 ) 2 .9 2 (.11 5 ) 2 .6 4 (.10 4 ) 2 .5 4 (.1 0 0 ) 2X N O TE S : 1 D IM E N S IO N IN G & T O L E R A N C IN G P E R A N S I Y 1 4 .5 M , 1 9 8 2 . 2 C O N T R O L L IN G D IM E N S IO N : IN C H 3 O U T L IN E C O N F O R M S T O J E D E C O U T L IN E T O -2 2 0 A B . 4 H E A T S IN K & L E A D M E A S U R E M E N T S D O N O T IN C L U D E B U R R S . TO-220AB Part Marking Information E X A M P L E : T H IS IS A N IR F 1 0 1 0 W IT H A S S E M B L Y LOT C ODE 9B1M A IN T E R N A T IO N A L R E C T IF IE R LOGO ASSEMBLY LOT CODE 2014-8-13 7 PART NU M BER IR F 1 0 1 0 9246 9B 1M D ATE CO DE (Y Y W W ) YY = YEAR W W = W EEK www.kersemi.com IRF3708S D2Pak Package Outline Dimensions are shown in millimeters (inches) 1 0.54 (.415 ) 1 0.29 (.405 ) 1.4 0 (.055 ) M AX. -A- 1.3 2 (.05 2) 1.2 2 (.04 8) 2 1.7 8 (.07 0) 1.2 7 (.05 0) 1 10 .1 6 (.4 00 ) R E F. -B- 4 .6 9 (.18 5) 4 .2 0 (.16 5) 6.47 (.2 55 ) 6.18 (.2 43 ) 3 1 5.49 (.6 10) 1 4.73 (.5 80) 2.7 9 (.110 ) 2.2 9 (.090 ) 2.61 (.1 03 ) 2.32 (.0 91 ) 5.28 (.2 08 ) 4.78 (.1 88 ) 3X 1.40 (.0 55) 1.14 (.0 45) 5 .08 (.20 0) 0.55 (.0 22) 0.46 (.0 18) 0.9 3 (.0 37 ) 3X 0.6 9 (.0 27 ) 0.25 (.0 10 ) M 8.8 9 (.3 50 ) R E F. 1.3 9 (.0 55 ) 1.1 4 (.0 45 ) B A M M IN IM U M R EC O M M E ND E D F O O TP R IN T 1 1.43 (.4 50 ) NO TE S: 1 D IM EN S IO N S A FTER SO LD E R D IP . 2 D IM EN S IO N IN G & TO LE R AN C IN G P ER AN S I Y1 4.5M , 19 82 . 3 C O N TRO L LIN G D IM EN S IO N : IN C H. 4 H E ATSINK & L EA D D IM E N SIO N S DO N O T IN C LU D E B U R RS . LE AD AS SIG N M E N TS 1 - G ATE 2 - D RA IN 3 - SO U R C E 8 .89 (.35 0) 17 .78 (.70 0) 3.81 (.1 5 0) 2.0 8 (.08 2) 2X 2.5 4 (.100 ) 2X D2Pak Part Marking Information IN TE R N A TIO N A L R E C T IF IE R LO G O A PART NUM BER F530S 9 24 6 9B 1M A S S E M B LY LO T C O D E 2014-8-13 8 DATE CODE (Y YW W ) YY = Y E A R W W = W EEK www.kersemi.com IRF3708S TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262 Part Marking Information 2014-8-13 9 www.kersemi.com IRF3708S D2Pak Tape & Reel Information Dimensions are shown in millimeters (inches) TR R 1 .6 0 (.0 63 ) 1 .5 0 (.0 59 ) 4 .1 0 ( .1 6 1) 3 .9 0 ( .1 5 3) F E ED D IRE C TIO N 1 .8 5 (.0 7 3 ) 1.60 (.06 3) 1.50 (.05 9) 1 1.60 (.457 ) 1 1.40 (.449 ) 1 .6 5 (.0 6 5 ) 0 .3 68 (.0 145 ) 0 .3 42 (.0 135 ) 15 .4 2 (.60 9) 15 .2 2 (.60 1) 24.30 (.95 7) 23.90 (.94 1) TR L 1.75 (.0 69 ) 1.25 (.0 49 ) 10 .9 0 (.42 9) 10 .7 0 (.42 1) 4 .7 2 (.13 6) 4 .5 2 (.17 8) 16 .1 0 (.63 4) 15 .9 0 (.62 6) F E ED D IR E CT IO N 13.50 (.532) 12.80 (.504) 27.40 (1.079) 23.90 (.941) 4 33 0.00 (14.173) M AX . 60.00 (2.362) M IN. NO TE S : 1. CO MF OR M S TO EIA-418. 2. CO N TRO LLIN G DIM ENSIO N : MILLIM ET ER . 3. DIM ENS ION MEAS URED @ HU B. 4. INC LUD ES FLAN GE DIS TO RTIO N @ OU TER ED G E. 30.40 (1.197) MA X. 26.40 (1.039) 24.40 (.961) 4 3 Notes: Repetitive rating; pulse width limited by max. junction temperature. Starting TJ = 25°C, L = 0.7 mH Pulse width ≤ 300µs; duty cycle ≤ 2%. This is only applied to TO-220AB package RG = 25Ω, IAS = 24.8 A. 2014-8-13 10 www.kersemi.com