USB Switch ICs SPST Type (Single Pole Single Throw) BH6260MWX No.11103EAT04 ●Description BH6260MWX is SPST x 2ch and Inverter x 2ch analog switches. Analog SW0 and SW1 pass USB 2.0 high-speed signal. Analog SW2 and SW3 pass UART signal. Moreover, this is guaranteed from 2.9V to 3.7V as for the range of the power-supply voltage. Enable signals ENB0, ENB1, EN2, and EN3 can control Analog SW0, SW1, SW2, and SW3. Furthermore, this is able to pass USB 2.0 high-speed signal without distortion, because of Analog SW0 and SW1 are low capacitance. The electrostatic discharge protection circuit is built-in in all terminals. ●Features 1) 5Ω switches connect inputs to outputs 2) Low Capacity Analog SW 2ch with clamp Diode 3) 1.8V Output Inverter 2ch 4) 16-Pin SON Package (3.3mm x 1.5mm, Height=0.6mm, 0.4mm pitch) 5) It contributes to the miniaturization because all external is built into. ●Applications Digital Still Cameras, Digital Video Camcorders, Portable Navigation Devices, TV, Portable DVD Players, Portable Game Systems, Personal computers, PDA, Mobile phones ●Line up matrix Parameter BH6260MWX BD11600NUX BD11603MWX BD11601NUX 0 μA 18 μA 18 μA 18 μA 2.9～3.7 V 2.5～5.5 V 2.5～5.5 V 2.5～5.5 V Switch ON Resistance ( VIN=0 V ) 5 Ω 3 Ω 3 Ω 2.5 Ω Switch ON Capacitance 10 pF 6 pF 7 pF 6 pF Configuration SPST x 2ch and Inverter x 2ch DPDT MUX x 2Lines DPST Package USON016X3315 VSON010X3020 USON016X3315 VSON008X2020 Supply Quiescent Current Input voltage range ●Absolute maximum ratings (Ta=25℃) Parameter Symbol Ratings Unit Input supply voltage1 Vmax1 -0.3～5.5 V VDD,VDD18,B2,ENB0 ENB1,EN2,EN3 Input supply voltage2 Vmax2 -0.3～VDD+0.3 V A0,B0,A1,B1,A3 Input supply voltage3 Vmax3 -0.3～VDD18+0.3 V B3 Input supply voltage4 Vmax4 -0.3～VDD+0.3 V A2 Input supply voltage5 Vmax5 -0.3～VDD18+0.3 V A2 *4 Pd 850 mW Operating temperature range Topr -40～+85 ℃ Storage temperature range Tstr -55～+125 ℃ Power dissipation *1 When using more than at Ta=25℃, it is reduced 8.5 mW per 1℃. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Conditions *3 *1 ROHM specification board 70mm× 70mm mounting. 1/9 2011.08 - Rev.A Technical Note BH6260MWX ●Operating conditions (Ta=-40～+85℃) Parameter Input voltage range (VDD) Input voltage range (VDD18) Symbol Ratings Unit VDD 2.9～3.7 V VDD18 1.7～3.6 V Conditions * This product does not especially designed to be protected from radioactivity ●Electrical characteristics (Unless otherwise noted, Ta = 25℃, VDD=3.3V, VDD18=1.8V) Limits Parameter Symbol Unit Min. Typ. Max. Conditions ●Total VDD=3.3V, ENB0/1:L, EN2/3:H VDD=3.3V, ENB0/1:H, EN2/3:L Supply Quiescent Current 1 ICC1 - 0 10 A Supply Quiescent Current 2 ICC2 - 0 10 A Switch ON Resistance 1 Ron1 - 5 10 Ω VIN=0V Switch ON Resistance 2 Ron2 - 8 13 Ω VIN=2.4V Switch OFF Capacitance (A2, A3) Coff - 5.0 - pF f=1MHz Switch ON Capacitance (A0, A1) Con - 10 - pF f=1MHz INV2 Input “L” level VILBUF2 - - 0.25× VDD18 V INV2 Input “H” level VIHBUF2 0.75× VDD18 - - V INV2 Output “L” level VOLBUF2 - 0.15 0.3 V Io=3mA INV2 Output “H” level VOHBUF2 1.50 1.65 - V Io=-3mA INV3 Input “L” level VILBUF3 - - 0.25× VDD18 V INV3 Input “H” level VIHBUF3 0.75× VDD18 - - V INV3 Output “L” level VOLBUF3 - 0.15 0.3 V Io=3mA INV3 Output “H” level VOHBUF3 1.50 1.65 - V Io=-3mA ENBn/ENn input “H” level VIHENB 0.75× VDD - - V ENBn/ENn input “L” level VILENB - - 0.25× VDD V INV3 Input Resister RININV3 50 100 150 kΩ Clamp Diode Voltage1 VIK1 -1.2 -0.73 - V Clamp Diode Voltage2 VIK2 - 0.73 1.2 V A0,B0,A1,B1,A2,A3 Propagation Delay (*1) tPLH, tPHL - - 0.25 ns CL=50pF,RL=500Ω BUS Enable Time (*1) tPZH, tPZL - - 200 ns CL=50pF,RL=500Ω BUS Disable Time (*1) tPHZ, tPLZ - - 200 ns CL=50pF,RL=500Ω www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/9 EN3:H 2011.08 - Rev.A Technical Note BH6260MWX ●Electrical characteristic curves (Reference data) 4.0 0.5 3.5 0.4 0.3 Differential Signals, V 3.0 D+, D- Signals, V 2.5 2.0 1.5 1.0 0.5 0.1 0.0 -0.1 -0.2 -0.3 0.0 -0.4 -0.5 -0.5 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Time (x10* -8) s Time (x10* -9) s Fig.1 Eye Pattern Full Speed Fig.2 Eye Pattern High Speed 5 5 4.5 4.5 4 4 3.5 3.5 3 3 IVDD (uA) IVDD (uA) 0.2 2.5 2 1.5 1.5 1 Ta=105°C Ta=25°C Ta=-60°C 0.5 2.0 2.5 2 1 1.8 Ta=105°C Ta=25°C Ta=-60°C 0.5 0 0 0 0.5 1 1.5 2 2.5 3 3.5 VDD (V) 4 4.5 5 5.5 6 6.5 0 7 Fig.3 ICC vs Input Voltage (SW OFF) 0.5 1 1.5 2 2.5 3 3.5 VDD (V) 4 4.5 5 5.5 6 6.5 Fig.4 ICC vs Input Voltage (SW ON) 10 9.5 Ta=105°C 9 8.5 8 Ta=25°C 7.5 Ron (Ω) 7 6.5 Ta=-60°C 6 5.5 5 4.5 4 3.5 3 2.5 2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 A0 (V) 2 2.2 2.4 2.6 2.8 3 3.2 3.4 Fig.5 Ron vs Input Voltage www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/9 2011.08 - Rev.A 7 Technical Note BH6260MWX ●Block diagram and pin configuration VDD A0 Analog SW0 VDD VDD ENB0 A1 Analog SW1 VDD B1 VDD 1 16 VDD ENB0 2 15 EN3 A0 3 14 A3 B0 4 13 B3 ENB1 5 12 EN2 A1 6 11 A2 B1 7 10 B2 GND 8 9 ENB1 VDD18 VDD18 A2 NC B0 VDD18 Analog SW2 VDD18 INV2 VDD B2 VDD VDD EN2 A3 VDD18 Analog SW3 VDD18 INV3 VDD 100k B3 VDD EN3 VDD18 GND Fig.6 Block diagram Fig.7 Pin configuration ●Package Dimensions B 2 H 6 6 0 LOT No. Fig.8 Package Dimensions www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/9 2011.08 - Rev.A Technical Note BH6260MWX ●Pin Description Pin NO. Terminal circuit Pin Name I/O 16 - VDD - Power supply. 9 - VDD18 - Power supply for INV2,3 8 Ground Pin Function - GND - 3,6 4,7 A A 0~1 B 0~1 I/O Analog SW0,1 terminal 11 B A2 O INV2 Output 14 C A3 I INV3 Input 10 D B2 I INV2 Input 13 E B3 O INV3 Output 2,5 F ENB 0-1 I Analog SW0-1 ON/OFF Pin. (ENBn is Low : Analog SW is ON.) 12,15 F EN 2-3 I Analog SW2-3 ON/OFF Pin. (ENn is High : Analog SW is ON.) ●Application Circuit Low Capacitance Switch USB/UART CONNECTOR VDD VDD18 VDD VDD18 B0 A0 USB USB Block Block VDD18 ENB0 B3 A3 100kΩ EN3 B1 A1 UART UART Block Block VDD18 ENB1 B2 A2 EN2 ENB0 ENB1 EN2 EN3 CNT CNT Block Block UART Signal GND Each Enable Signal www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/9 2011.08 - Rev.A Technical Note BH6260MWX ●Equivalent Circuit A B VDD VDD VDD VDD VDD A0,A1 B0,B1 PAD PAD 10k A2 10k C D VDD VDD VDD18 10k 10k B2 A3 10k 100k E F VDD VDD ENB0 ENB1 EN2 EN3 10k B3 PAD www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/9 2011.08 - Rev.A Technical Note BH6260MWX ●Notes for use (1) Absolute maximum ratings If applied voltage (VCC1, VCC2), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there is a risk of damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures. (2) Recommended operating range This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics, it is those that are guaranteed under the conditions for each parameter. Even when these are within the recommended operating range, voltage and temperature characteristics are indicated. (3) Reverse connection of power supply connector There is a risk of damaging the LSI by reverse connection of the power supply connector. For protection from reverse connection, take measures such as externally placing a diode between the power supply and the power supply pin of the LSI. (4) Power supply lines In the design of the board pattern, make power supply and GND line wiring low impedance. When doing so, although the digital power supply and analog power supply are the same potential, separate the digital power supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due to the common impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well. Furthermore, for all power supply pins of the LSI, in conjunction with inserting capacitors between power supply and GND pins, when using electrolytic capacitors, determine constants upon adequately confirming that capacitance loss occurring at low temperatures is not a problem for various characteristics of the capacitors used. (5) GND voltage Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition, confirm that there are no pins for which the potential becomes less than a GND by actually including transition phenomena. (6) Shorts between pins and misinstallation When installing in the set board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is installed erroneously, there is a risk of LSI damage. There also is a risk of damage if it is shorted by a foreign substance getting between pins or between a pin and a power supply or GND. (7) Operation in strong magnetic fields Be careful when using the LSI in a strong magnetic field, since it may malfunction. (8) Inspection in set board When inspecting the LSI in the set board, since there is a risk of stress to the LSI when capacitors are connected to low impedance LSI pins, be sure to discharge for each process. Moreover, when getting it on and off of a jig in the inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the assembly process and take appropriate care in transport and storage. (9) Input pins Parasitic elements inevitably are formed on an LSI structure due to potential relationships. Because parasitic elements operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as damage. Accordingly, take care not to apply a lower voltage than GND to an input pin or use the LSI in other ways such that parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage is not being applied to the LSI. Furthermore, when the power supply voltage is being applied, make each input pin a voltage less than the power supply voltage as well as within the guaranteed values of electrical characteristics. (10) Ground wiring pattern When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND pattern and small signal GND pattern and provide single point grounding at the reference point of the set so that voltage variation due to resistance components of the pattern wiring and large currents do not cause the small signal GND voltage to change. Take care that the GND wiring pattern of externally attached components also does not change. (11) Externally attached capacitors When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a lowering of the rated capacitance due to DC bias and capacitance change due to factors such as temperature. (12) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/9 2011.08 - Rev.A Technical Note BH6260MWX ●Power Dissipation 1 Pd=0.85W Power dissipation :Pd [W] 0.9 0.8 -8.5mW/℃ 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Ta_max=85℃ 0 0 10 20 30 40 50 60 70 80 90 Ambient temperature :Ta [℃] 100 110 120 130 Fig.10 Power dissipation www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/9 2011.08 - Rev.A Technical Note BH6260MWX ●Ordering part number B H Part No. 6 2 Part No. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6 0 M W X パッケージ MWX:USON016X3315 9/9 - E 2 Packaging and forming specification E2: Embossed tape and reel 2011.08 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. 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If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A