HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6705 Issued Date : 1995.01.27 Revised Date : 2001.09.13 Page No. : 1/3 HSB857 / 2SB857 PNP EPITAXIAL PLANAR TRANSISTOR Description Low frequency power amplifier. Absolute Maximum Ratings (Ta=25°C) • Maximum Temperatures Storage Temperature ............................................................................................ -50 ~ +150 °C Junction Temperature .................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Tc=25°C) ..................................................................................... 40 W • Maximum Voltages and Currents BVCBO Collector to Base Voltage...................................................................................... -70 V BVCEO Collector to Emitter Voltage................................................................................... -50 V BVEBO Emitter to Base Voltage.......................................................................................... -5 V IC Collector Current.............................................................................................................. -4 A IC Collector Current (IC Peak).............................................................................................. -8 A Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) *VBE(on) *hFE1 *hFE2 fT Min. -70 -50 -5 35 60 - Typ. 15 Max. -1 -1 -1 320 - Unit V V V uA V V MHz Test Conditions IC=-10uA, IE=0 IC=-50mA, IB=0 IE=-10uA, IC=0 VCB=-50V, IC=0 IC=-2A, IB=-0.2A IC=-1A, VCE=-4V IC=-0.1A, VCE=-4V IC=-1A, VCE=-4V VCE=-4V, IC=-500mA, f=100MHz *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE2 Rank hFE HSB857 B 60-120 C 100-200 D 160-320 HSMC Product Specification HI-SINCERITY Spec. No. : HE6705 Issued Date : 1995.01.27 Revised Date : 2001.09.13 Page No. : 2/3 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 1000 Saturation Voltage (mV) 10000 hFE @ VCE=4V hFE 100 10 1000 VBE(sat) @ IC=10IB 100 VBE(sat) @ IC=10IB 1 10 1 10 100 1000 10000 1 10 Collector Current (mA) 100 1000 10000 Collector Current (mA) On Voltage & Collector Current Switching Time & Collector Current 10000 10.00 Switching Times (us) On Voltage (mV) VCC=30V, IC=10IB1= -10IB2 1000 VBE(on) @ VCE=4V 100 Tstg 1.00 Tf 0.10 Ton 0.01 1 10 100 1000 10000 0.1 1.0 Collector Current (mA) 10.0 Collector Current (A) Capacitance & Reverse-Biased Voltage Safe Operating Area 100000 1000 PT=1ms PT=100ms Collector Current-IC (mA) Capacitance (pF) 10000 100 Cob 100 10 1 10 0.1 1 10 Reverse-Biased Voltage (V) HSB857 PT=1s 1000 100 1 10 100 Forward Voltage-VCE (V) HSMC Product Specification HI-SINCERITY Spec. No. : HE6705 Issued Date : 1995.01.27 Revised Date : 2001.09.13 Page No. : 3/3 MICROELECTRONICS CORP. TO-220AB Dimension Marking : A B D E C HSMC Logo Part Number Date Code Product Series Rank H K M I Style : Pin 1.Base 2.Collector 3.Emitter 3 G N 2 1 4 P O 3-Lead TO-220AB Plastic Package HSMC Package Code : E *:Typical Inches Min. Max. 0.2197 0.2949 0.3299 0.3504 0.1732 0.185 0.0453 0.0547 0.0138 0.0236 0.3803 0.4047 *0.6398 DIM A B C D E G H Millimeters Min. Max. 5.58 7.49 8.38 8.90 4.40 4.70 1.15 1.39 0.35 0.60 9.66 10.28 *16.25 DIM I K M N O P Inches Min. Max. *0.1508 0.0295 0.0374 0.0449 0.0551 *0.1000 0.5000 0.5618 0.5701 0.6248 Millimeters Min. Max. *3.83 0.75 0.95 1.14 1.40 *2.54 12.70 14.27 14.48 15.87 Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 HSB857 HSMC Product Specification