Material Content Data Sheet Sales Product Name BSC120N03MS G MA# MA001321270 Package PG-TDSON-8-5 Issued 5. February 2015 Weight* 118.49 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper copper carbon black epoxy resin silicondioxide tin silver silver tin lead iron phosphorus copper iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 7439-89-6 7723-14-0 7440-50-8 0.614 0.52 0.038 0.03 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.52 5180 5180 319 0.011 0.01 37.762 31.86 31.90 318682 96 319097 0.055 0.05 0.05 462 462 0.088 0.07 739 6.215 5.24 37.463 31.62 36.93 316162 369348 1.452 1.23 1.23 12251 12251 0.166 0.14 0.14 1397 1397 0.024 0.02 0.020 0.02 0.932 0.79 0.011 0.01 0.003 0.00 11.320 9.55 0.022 0.02 0.007 0.01 22.292 18.81 52447 206 165 0.83 7865 29 9.56 95533 2. 3. 57 18.84 188126 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 95658 188 Important Remarks: 1. 8236 96 188371 1000000