ON AR0330CM1C00SHKA0-CR 1/3â inch cmos digital image sensor Datasheet

AR0330CM
1/3‐inch CMOS
Digital Image Sensor
Description
The AR0330 from ON Semiconductor is a 1/3-inch CMOS digital
image sensor with an active-pixel array of 2304 (H) × 1536 (V). It can
support 3.15 Mp (2048 (H) × 1536 (V)) digital still image capture and
a 1080p60 + 20% EIS (2304 (H) × 1296 (V)) digital video mode. It
incorporates sophisticated on-chip camera functions such as
windowing, mirroring, column and row sub-sampling modes, and
snapshot modes.
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CLCC48
CASE 848AU
Table 1. KEY PERFORMANCE PARAMETERS
Parameter
Typical Value
ORDERING INFORMATION
Optical Format
1/3-inch (6.0 mm)
Entire Array: 6.09 mm
Still Image: 5.63 mm (4:3)
HD Image: 5.82 mm (16:9)
Active Pixels
2304 (H) × 1536 (V): (Entire Array)
5.07mm (H) × 3.38mm (V)
2048 (H) × 1536 (V) (4:3, Still Mode)
2304 (H) × 1296 (V) (16:9, HD Mode)
Pixel Size
2.2 × 2.2 mm
Color Filter Array
RGB Bayer
Shutter Type
ERS and GRR
Input Clock Range
6–27 MHz
Output Clock Maximum
196 Mp/s (4-lane HiSPi or MIPI)
Output Video − 4-lane HiSPi
2304 × 1296 at 60 fps
< 450 mW (VCM 0.2 V, 198 MP/s)
2304 × 1296 at 30 fps
< 300 mW (VCM 0.2 V, 98 MP/s)
Responsivity
2.0 V/lux−sec
SNRMAX
39 dB
Dynamic Range
69.5 dB
Supply Voltage
Digital
Analog
HiSPi PHY
HiSPi I/O (SLVS)
HiSPi I/O (HiVCM)
I/O/Digital
–30°C to + 70°C
Package Options
CLCC − 11.4 mm × 11.4mm
CSP − 6.28 mm × 6.65 mm
Bare Die
© Semiconductor Components Industries, LLC, 2010
March, 2017 − Rev. 18
See detailed ordering and shipping information on page 2 of
this data sheet.
Features
• 2.2 mm Pixel with A−Pixt Technology
• Full HD support at 60 fps
•
•
•
•
•
•
1.7–1.9 V (1.8 V Nominal)
2.7–2.9 V
1.7–1.9 V (1.8 V Nominal)
0.3–0.9 V (0.4 or 0.8 V Nominal)
1.7–1.9 V (1.8 V Nominal)
1.7–1.9 V (1.8 V Nominal) or
2.4–3.1 V (2.8 V Nominal)
Operating Temperature
(Junction) −TJ
ODCSP64
CASE 570BH
•
•
•
•
(2304 (H) × 1296 (V)) for Maximum
Video Performance
Superior Low-light Performance
3.4 Mp (3:2) and 3.15 Mp (4:3) Still Images
Support for External Mechanical Shutter
Support for External LED or Xenon Flash
Data Interfaces: Four-lane Serial High-speed
Pixel Interface (HiSPi) Differential
Signaling (SLVS), Four-lane Serial MIPI
Interface, or Parallel
On-chip Phase-locked Loop (PLL)
Oscillator
Simple Two-wire Serial Interface
Auto Black Level Calibration
12-to-10 Bit Output A−Law Compression
Slave Mode for Precise Frame-rate Control
and for Synchronizing Two Sensors
Applications
• 1080p High-definition Digital Video
Camcorder
• Web Cameras and Video Conferencing
Cameras
• Security
1
Publication Order Number:
AR0330CM/D
AR0330CM
ORDERING INFORMATION
Table 2. AVAILABLE PART NUMBERS
Product Description
Part Number
Orderable Product Attribute Description
AR0330CM1C00SHAA0−DP
3 MP 1/3″ CIS
Dry Pack with Protective Film
AR0330CM1C00SHAA0−DR
3 MP 1/3″ CIS
Dry Pack without Protective Film
AR0330CM1C00SHAA0−TP
3 MP 1/3″ CIS
Tape & Reel with Protective Film
AR0330CM1C00SHKA0−CP
3 MP 1/3″ CIS
Chip Tray with Protective Film
AR0330CM1C00SHKA0−CR
3 MP 1/3″ CIS
Chip Tray without Protective Film
AR0330CM1C12SHAA0−DP
3 MP 1/3″ CIS
Dry Pack with Protective Film
AR0330CM1C12SHAA0−DR
3 MP 1/3″ CIS
Dry Pack without Protective Film
AR0330CM1C12SHKA0−CP
3 MP 1/3″ CIS
Chip Tray with Protective Film
AR0330CM1C12SHKA0−CR
3 MP 1/3″ CIS
Chip Tray without Protective Film
AR0330CM1C21SHKA0−CP
3 MP 1/3″ CIS
Chip Tray with Protective Film
AR0330CM1C21SHKA0−CR
3 MP 1/3″ CIS
Chip Tray without Protective Film
FUNCTIONAL OVERVIEW
GENERAL DESCRIPTION
The AR0330 can be operated in its default mode or
programmed for frame size, exposure, gain, and other
parameters. The default mode output is a 2304 × 1296 image
at 60 frames per second (fps). The sensor outputs 10- or
12-bit raw data, using either the parallel or serial (HiSPi,
MIPI) output ports.
The AR0330 is a progressive-scan sensor that generates
a stream of pixel data at a constant frame rate. It uses an
on-chip, phase-locked loop (PLL) that can generate all
internal clocks from a single master input clock running
between 6 and 27 MHz. The maximum output pixel rate is
196 Mp/s using a 4-lane HiSPi or MIPI serial interface and
98 Mp/s using the parallel interface.
Test Pattern
Generator
Ext
Clock
Analog Core
Row Noise Correction
Registers
Row Drivers
PLL
Timing
and
Control
12-bit
Digital Core
Output Data-Path
Compression (Optional)
Black Level Correction
Pixel
Array
Digital Gain
Column
Amplifiers
Data Pedestal
12-bit
12-bit
ADC
10- or 12-bit
8-,
10or 12-bit
12-bit
Two-wire
Serial I/F
Parallel I/O:
PIXCLK, FV,
LV, DOUT[11:0]
MIPI I/O:
CLK P/N,
DATA[11:0] P/N
HiSPi I/O:
SLVS C P/N,
SLVS[3:0] P/N
Figure 1. Block Diagram
controlled by varying the time interval between reset and
readout. Once a row has been read, the signal from the
column is amplified in a column amplifier and then digitized
in an analog-to-digital converter (ADC). The output from
the ADC is a 12-bit value for each pixel in the array.
The ADC output passes through a digital processing signal
chain (which provides further data path corrections and
applies digital gain).
User interaction with the sensor is through the two-wire
serial bus, which communicates with the array control,
analog signal chain, and digital signal chain. The core of the
sensor is a 3.4 Mp active-pixel sensor array. The timing and
control circuitry sequences through the rows of the array,
resetting and then reading each row in turn. In the time
interval between resetting a row and reading that row, the
pixels in the row integrate incident light. The exposure is
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AR0330CM
WORKING MODES
The AR0330 sensor working modes are specified from the
following aspect ratios:
Table 3. AVAILABLE ASPECT RATIOS IN THE AR0330 SENSOR
Aspect Ratio
Sensor Array Usage
3:2
Still Format #1
2256 (H) × 1504 (V)
4:3
Still Format #2
2048 (H) × 1536 (V)
16:10
Still Format #3
2256 (H) × 1440 (V)
16:9
HD Format
2304 (H) × 1296 (V)
The AR0330 supports the following working modes. To
operate the sensor at full speed (196 Mp/s) the sensor must
use the 4-lane HiSPi or MIPI interface. The sensor will
operate at half-speed (98 Mp/s) when using the parallel
interface.
Table 4. AVAILABLE WORKING MODES IN THE AR0330 SENSOR
Mode
Aspect
Ratio
Active
Readout
Window
Sensor
Output
Resolution
FPS
(4-lane MIPI/
HiSPi Interface)
FPS
(Parallel Interface)
Subsampling
FOV
1080p + EIS
16:9
2304 × 1296
2304 × 1296
60
N/A
−
100%
30
30
−
100%
−
100%
3M Still
4:3
2048 × 1536
2048 × 1536
30
25
3:2
2256 × 1504
2256 × 1504
30
25
−
100%
WVGA + EIS
16:9
2304 × 1296
1152 × 648
60
60
2×2
100%
WVGA + EIS
Slow-motion
16:9
2304 × 1296
1152 × 648
120
N/A
2×2
100%
VGA Video
16:10
2256 × 1440
752 × 480
60
60
3×3
96%
VGA Video
Slow-motion
16:10
2256 × 1440
752 × 480
215
107
3×3
96%
HiSPi POWER SUPPLY CONNECTIONS
The HiSPi interface requires two power supplies.
The VDD_HiSPi powers the digital logic while the
VDD_HiSPi_TX powers the output drivers. The digital logic
supply is a nominal 1.8 V and ranges from 1.7 to 1.9 V.
The HiSPi drivers can receive a supply voltage of 0.4 to
0.8 V or 1.7 to 1.9 V.
The common mode voltage is derived as half of the
VDD_HiSPi _TX supply. Two settings are available for the
output common mode voltage:
1. SLVS Mode:
The VDD_HiSPi_Tx supply must be in the range
of 0.4 to 0.8 V and the high_vcm register bit
R0x306E[9] must be set to “0”.
The output common mode voltage will be in the
range of 0.2 to 0.4 V.
2. HiVCM Mode:
The VDD_HiSPi_Tx supply must be in the range
of 1.7 to 1.9 V and the high_vcm register bit
R0x306E[9] must be set to “1”. The output
common mode voltage will be in the range of 0.76
to 1.07 V.
Two prior naming conventions have also been used with
the VDD_HiSPi and VDD_HiSPi_TX pins:
1. Digital logic supply was named VDD_SLVS while
the driver supply was named VDD_SLVS_TX.
2. Digital logic supply was named VDD_PHY while
the driver supply was named VDD_SLVS.
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AR0330CM
TYPICAL CONFIGURATIONS
Analog Analog
Power1 Power1
VAA
VDD_MIPI
PLL
Power1
VDD_PLL
VDD_HiSPi_TX
Master Clock
(6−27 MHz)
VDD
HiSPi
Power1
VDD_HiSPi
VDD_IO
1.5 kW3, 4
1.5 kW3
Digital Digital
Core
I/O
Power1 Power1
VAA_PIX
SLVS0_P
SLVS0_N
SLVS1_P
EXTCLK
SLVS1_N
SLVS2_P
OE_BAR
From
Controller
To Controller
(HiSPi-serial
Interface)
SLVS2_N
TRIGGER
SLVS3_P
SADDR
SLVS3_N
SCLK
SLVSC_P
SDATA
SLVSC_N
RESET_BAR
SHUTTER
FLASH
TEST
DGND
GND_SLVS
AGND
Digital
Ground
VDD_HiSPi_TX
1.0 mF
0.1 mF
1.0 mF
VDD_IO
0.1 mF
1.0 mF
VDD
0.1 mF
Analog
Ground
VDD_HiSPi
1.0 mF
0.1 mF
1.0 mF
VDD_PLL
0.1 mF
1.0 mF
VAA
0.1 mF
VAA_PIX
1.0 mF
0.1 mF
Notes:
1. All power supplies must be adequately decoupled. ON Semiconductor recommends having 1.0 mF and 0.1 mF decoupling capacitors for
every power supply. If space is a concern, then priority must be given in the following order: VAA, VAA_PIX, VDD_PLL, VDD_IO, and VDD.
Actual values and results may vary depending on layout and design considerations.
2. To allow for space constraints, ON Semiconductor recommends having 0.1 mF decoupling capacitor inside the module as close to the pads
as possible. In addition, place a 10 mF capacitor for each supply off-module but close to each supply.
3. ON Semiconductor recommends a resistor value of 1.5 kW, but a greater value may be used for slower two-wire speed.
4. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is
minimized.
6. TEST pin should be tied to DGND.
7. Set High_VCM (R0x306E[9]) to 0 (default) to use the VDD_HiSPi_TX in the range of 0.4–0.8 V. Set High_VCM to 1 to use a range of
1.7–1.9 V.
8. The package pins or die pads used for the MIPI data and clock as well as the parallel interface must be left floating.
9. The VDD_MIPI package pin and sensor die pad should be connected to a 2.8 V supply as VDD_MIPI is tied to the VDD_PLL supply both
in the package routing and also within the sensor die itself.
10. If the SHUTTER or FLASH pins or pads are not used, then they must be left floating.
11. If the TRIGGER pin or pad is not used then it should be tied to DGND.
12. The GND_SLVS pad must be tied to DGND. It is connected this way in the CLCC and CSP packages.
Figure 2. Serial 4-lane HiSPi Interface
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AR0330CM
Master Clock
(6−27 MHz)
VDD
Analog Analog
Power1 Power1
VAA
VDD_MIPI
PLL
Power1
VDD_PLL
VDD_IO
1.5 kW3, 4
1.5 kW3
Digital Digital
Core
I/O
Power1 Power1
VAA_PIX
DATA1_P
DATA1_N
DATA2_P
EXTCLK
DATA2_N
DATA3_P
From
Controller
OE_BAR
DATA3_N
TRIGGER
SADDR
DATA4_N
DATA4_P
SCLK
CLK_P
SDATA
CLK_N
To Controller
(MIPI-serial
Interface)
SHUTTER
RESET_BAR
FLASH
TEST
VDD_IO
1.0 mF
0.1 mF
1.0 mF
DGND
AGND
Digital
Ground
Analog
Ground
VDD
0.1 mF
VDD_PLL
1.0 mF
0.1 mF
1.0 mF
VAA
0.1 mF
VAA_PIX
1.0 mF
0.1 mF
Notes:
1. All power supplies must be adequately decoupled. ON Semiconductor recommends having 1.0 mF and 0.1 mF decoupling capacitors for
every power supply. If space is a concern, then priority must be given in the following order: VAA, VAA_PIX, VDD_PLL, VDD_MIPI, VDD_IO,
and VDD. Actual values and results may vary depending on layout and design considerations.
2. To allow for space constraints, ON Semiconductor recommends having 0.1 mF decoupling capacitor inside the module as close to the pads
as possible. In addition, place a 10 mF capacitor for each supply off-module but close to each supply.
3. ON Semiconductor recommends a resistor value of 1.5 kW, but a greater value may be used for slower two-wire speed.
4. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is
minimized.
6. TEST pin must be tied to DGND for the MIPI configuration.
7. ON Semiconductor recommends that GND_MIPI be tied to DGND.
8. VDD_MIPI is tied to VDD_PLL in both the CLCC and the CSP package. ON Semiconductor strongly recommends that VDD_MIPI must be
connected to a VDD_PLL in a module design since VDD_PLL and VDD_MIPI are tied together in the die.
9. The package pins or die pads used for the HiSPi data and clock as well as the parallel interface must be left floating.
10. HiSPi Power Supplies (VDD_HISPI and VDD_HISPI_TX) can be tied to ground.
11. If the SHUTTER or FLASH pins or pads are not used, then they must be left floating.
12. If the TRIGGER pin or pad is not used then it should be tied to DGND.
Figure 3. Serial MIPI
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1.5 kW3, 4
1.5 kW3
AR0330CM
Master Clock
(6−27 MHz)
Digital
I/O
Power1
Digital
Core
Power1
PLL
Power1
Analog
Power1
Analog
Power1
VDD_IO
VDD
VDD_PLL
VAA
VAA_PIX
EXTCLK
DOUT[11:0]
OE_BAR
LINE_VALID
PIXCLK
TRIGGER
From
Controller
To Controller
FRAME_VALID
SADDR
SCLK
SDATA
FLASH
SHUTTER
RESET_BAR
TEST
VDD_IO
1.0 mF
0.1 mF
1.0 mF
DGND
AGND
Digital
Ground
Analog
Ground
VDD
0.1 mF
VDD_PLL
1.0 mF
0.1 mF
1.0 mF
VAA
0.1 mF
VAA_PIX
1.0 mF
0.1 mF
Notes:
1. All power supplies must be adequately decoupled. ON Semiconductor recommends having 1.0 mF and 0.1 mF decoupling capacitors for
every power supply. If space is a concern, then priority must be given in the following order: VAA, VAA_PIX, VDD_PLL, VDD_IO, and VDD.
Actual values and results may vary depending on layout and design considerations.
2. To allow for space constraints, ON Semiconductor recommends having 0.1 mF decoupling capacitor inside the module as close to the pads
as possible. In addition, place a 10 mF capacitor for each supply off-module but close to each supply.
3. ON Semiconductor recommends a resistor value of 1.5 kW, but a greater value may be used for slower two-wire speed.
4. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.
5. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is
minimized.
6. TEST pin should be tied to the ground.
7. The data and clock package pins or die pads used for the HiSPi and MIPI interface must be left floating.
8. The VDD_MIPI package pin and sensor die pad should be connected to a 2.8 V supply as it is tied to the VDD_PLL supply both in the
package routing and also within the sensor die itself. HiSPi Power Supplies (VDD_HISPI and VDD_HISPI_TX) can be tied to ground.
9. If the SHUTTER or FLASH pins or pads are not used, then they must be left floating.
10. If the TRIGGER pin or pad is not used then it should be tied to DGND.
Figure 4. Parallel Pixel Data Interface
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AR0330CM
PIN DESCRIPTIONS
Table 5. PIN DESCRIPTIONS
Name
Type
RESET_BAR
Input
Asynchronous reset (active LOW). All settings are restored to factory default.
EXTCLK
Input
Master input clock, range 6−27 MHz.
Description
OE_BAR
Input
Output enable (active LOW). Only available on bare die version.
TRIGGER
Input
Receives slave mode VD signal for frame rate synchronization and trigger to start a GRR frame.
SADDR
Input
Two-wire serial address select.
SCLK
Input
Two-wire serial clock input.
SDATA
I/O
PIXCLK
Output
Pixel clock out. DOUT is valid on rising edge of this clock.
DOUT[11:0]
Output
Parallel pixel data output.
FLASH
Output
Flash output. Synchronization pulse for external light source. Can be left floating if not used.
FRAME_VALID
Output
Asserted when DOUT data is valid.
LINE_VALID
Output
Asserted when DOUT data is valid.
VDD
Power
Digital power.
VDD_IO
Power
IO supply power.
VDD_PLL
Power
PLL power supply. The MIPI power supply (VDD_MIPI) is tied to VDD_PLL in both packages.
DGND
Power
Digital GND.
VAA
Power
Analog power.
VAA_PIX
Power
Pixel power.
AGND
Power
Analog GND.
TEST
Input
SHUTTER
Output
Control for external mechanical shutter. Can be left floating if not used.
SLVS0_P
Output
HiSPi serial data, lane 0, differential P.
SLVS0_N
Output
HiSPi serial data, lane 0, differential N.
SLVS1_P
Output
HiSPi serial data, lane 1, differential P.
SLVS1_N
Output
HiSPi serial data, lane 1, differential N.
SLVS2_P
Output
HiSPi serial data, lane 2, differential P.
SLVS2_N
Output
HiSPi serial data, lane 2, differential N.
SLVS3_P
Output
HiSPi serial data, lane 3, differential P.
SLVS3_N
Output
HiSPi serial data, lane 3, differential N.
SLVSC_P
Output
HiSPi serial DDR clock differential P.
SLVSC_N
Output
HiSPi serial DDR clock differential N.
DATA1_P
Output
MIPI serial data, lane 1, differential P.
DATA1_N
Output
MIPI serial data, lane 1, differential N.
Two-wire serial data I/O.
Enable manufacturing test modes. Tie to DGND for normal sensor operation.
DATA2_P
Output
MIPI serial data, lane 2, differential P.
DATA2_N
Output
MIPI serial data, lane 2, differential N.
DATA3_P
Output
MIPI serial data, lane 3, differential P.
DATA3_N
Output
MIPI serial data, lane 3, differential N.
DATA4_P
Output
MIPI serial data, lane 4, differential P.
DATA4_N
Output
MIPI serial data, lane 4, differential N.
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AR0330CM
Table 5. PIN DESCRIPTIONS (continued)
Name
Type
Description
CLK_P
Output
Output MIPI serial clock, differential P.
CLK_N
Output
Output MIPI serial clock, differential N.
VDD_HiSPi
Power
1.8 V power port to HiSPi digital logic.
VDD_HiSPi_TX
Power
0.4−0.8 V or 1.7−1.9 V. Refer to “HiSPi Power Supply Connections”.
VAA_HV_NPIX
Power
Power supply pin used to program the sensor OTPM (one-time programmable memory).
This pin should be open if OTPM is not used.
Table 6. CSP (HiSPi/MIPI) PACKAGE PINOUT
1
2
3
4
5
6
7
8
A
VAA
VAA_HV_NPIX
AGND
AGND
VAA
VDD
TEST
DGND
B
DGND
NC
VAA_PIX
DGND
VDD_IO
TRIGGER
RESET_BAR
EXTCLK
C
VDD
SHUTTER
DGND
SLVSC_P
SLVS3_P
SLVS3_N
SLVS2_N
SLVS2_P
D
SADDR
SCLK
SDATA
FLASH
SLVSC_N
SLVS1_P
VDD_HiSPi_TX
VDD_HiSPi
E
VDD_IO
VDD_IO
CLK_N
CLK_P
DGND
SLVS1_N
SLVS0_N
SLVS0_P
F
DGND
VDD_IO
DGND
DGND
DATA4_P
DATA_N
DATA_P
VDD_PLL
G
VDD_IO
VDD
DGND
VDD_IO
DATA4_N
DATA3_N
DATA2_N
VDD
H
DGND
VDD_IO
VDD_IO
DGND
VDD_PLL
DATA3_P
DATA2_P
VDD_PLL
43
VAA_PIX
48
1
DGND
SDATA
FLASH
VDD_IO
VDD
SADDR
SCLK
VAA_HV_NPIX
NC
DGND
VDD
DGND
NOTE: NC = No Connection.
6
7
42
DATA4_N
AGND
DATA4_P
VAA
DATA3_N
DGND
DATA3_P
EXTCLK
CLK_N
RESET_BAR
CLK_P
TRIGGER
DATA2_N
SHUTTER
DATA2_P
TEST
DATA1_N
VDD
DATA1_P
VDD_IO
DGND
VDD_PLL
18
31
SLVS1_P
SLVS1_N
SLVS0_P
SLVS0_N
SLVSC_P
SLVSC_N
VDD_HiSPi
VDD_HiSPi_TX
19
SLVS3_P
SLVS3_N
SLVS2_P
SLVS2_N
30
DGND
NOTE: Pins labeled NC (Not Connected) should be tied to ground.
Figure 5. CLCC Package Pin Descriptions
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AR0330CM
SENSOR INITIALIZATION
Power-Up Sequence
6. Assert RESET_BAR for at least 1 ms.
7. Wait 150,000 EXTCLK periods (for internal
initialization into software standby.
8. Write R0x3152 = 0xA114 to configure the internal
register initialization process.
9. Write R0x304A = 0x0070 to start the internal
register initialization process.
10. Wait 150,000 EXTCLK periods.
11. Configure PLL, output, and image settings to
desired values.
12. Wait 1ms for the PLL to lock.
13. Set streaming mode (R0x301A[2] = 1).
The recommended power-up sequence for the AR0330CS
is shown in Figure 6. The available power supplies
(VDD_IO, VDD_PLL, VDD_MIPI, VAA, VAA_PIX) must
have the separation specified below.
1. Turn on VDD_PLL and VDD_MIPI power supplies.
2. After 100 ms, turn on VAA and VAA_PIX power
supply.
3. After 100 ms, turn on VDD power supply.
4. After 100 ms, turn on VDD_IO power supply.
5. After the last power supply is stable, enable
EXTCLK.
VDD_PLL,
VDD_MIPI (2.8)
VAA_PIX
VAA (2.8)
t0
t1
VDD (1.8)
t2
VDD_IO (1.8/2.8)
t3
RESET_BAR
t4
tX
Hard
Reset
Internal
Initialization
t5
R0x3152 = 0xA114
R0x304A = 0x0070
Internal
Initialization
t6
Software
Standby
PLL Clock
Streaming
EXTCLK
Notes:
1. A software reset (R0x301A[0] = 1) is not necessary after the procedure described above since a Hard Reset will automatically triggers
a software reset. Independently executing a software reset, should be followed by steps seven through thirteen above.
2. The sensor must be receiving the external input clock (EXTCLK) before the reset pin is toggled. The sensor will begin an internal initialization
sequence when the reset pin toggle from LOW to HIGH. This initialization sequence will run using the external input clock. Power on default
state is software standby state, need to apply two-wire serial commands to start streaming. Above power up sequence is a general power
up sequence. For different interface configurations, MIPI, and Parallel, some power rails are not needed. Those not needed power rails
should be ignored in the general power up sequence.
Figure 6. Power Up
Table 7. POWER-UP SEQUENCE
Symbol
Definition
Min
Typ
Max
Unit
t0
VDD_PLL, VDD_MIPI to VAA/VAA_PIX (Note 3)
0
100
–
ms
t1
VAA/VAA_PIX to VDD
0
100
–
ms
t2
VDD to VDD_IO
0
100
–
ms
tX
External Clock Settling Time (Note 1)
–
30
–
ms
t3
Hard Reset (Note 2)
1
–
–
ms
t4
Internal Initialization
150000
–
–
EXTCLKs
t5
Internal Initialization
150000
–
–
EXTCLKs
t6
PLL Lock Time
1
–
–
ms
1. External clock settling time is component-dependent, usually taking about 10–100 ms.
2. Hard reset time is the minimum time required after power rails are settled. In a circuit where Hard reset is held down by RC circuit, then the
RC time must include the all power rail settle time and Xtal settle time.
3. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered before or at least at the same time as the
others. If the case happens that VDD_PLL is powered after other supplies then sensor may have functionality issues and will experience high
current draw on this supply.
4. VDD_MIPI is tied to VDD_PLL in the both the CLCC and CSP packages and must be powered to 2.8 V. The VDD_HiSPi and VDD_HiSPi_TX
supplies do not need to be turned on if the sensor is configured to use the MIPI or parallel interface.
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9
AR0330CM
Power-Down Sequence
2. The soft standby state is reached after the current
row or frame, depending on configuration, has
ended.
3. Turn off VDD_HiSPi_TX.
4. Turn off VDD_IO.
5. Turn off VDD and VDD_HiSPi.
6. Turn off VAA/VAA_PIX.
7. Turn off VDD_PLL, VDD_MIPI.
The recommended power-down sequence for the AR0330
is shown in Figure 7. The available power supplies
(VDD_IO, VDD_HiSPi, VDD_HiSPi_TX, VDD_PLL,
VDD_MIPI, VAA, VAA_PIX) must have the separation
specified below.
1. Disable streaming if output is active by setting
standby R0x301a[2] = 0.
VDD_HiSPi_TX (0.4)
t0
VDD_IO (1.8/2.8)
t1
VDD,
VDD_HiSPi (1.8)
t2
VAA_PIX, VAA (2.8)
t3
VDD_PLL,
VDD_MIPI (2.8)
EXTCLK
t4
Power Down until Next
Power Up Cycle
Figure 7. Power Down
Table 8. POWER-DOWN SEQUENCE
Symbol
Parameter
Min
Typ
Max
Unit
t0
VDD_HiSPi_TX to VDD_IO
0
–
–
ms
t1
VDD_IO to VDD and VDD_HiSPi
0
–
–
ms
t2
VDD and VDD_HiSPi to VAA/VAA_PIX
0
–
–
ms
t3
VAA/VAA_PIX to VDD_PLL
0
–
–
ms
t4
PwrDn until Next PwrUp Time
100
–
–
ms
NOTE: t4 is required between power down and next power up time; all decoupling caps from regulators must be completely discharged.
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10
AR0330CM
ELECTRICAL CHARACTERISTICS
Table 9. DC ELECTRICAL DEFINITIONS AND CHARACTERISTICS (MIPI MODE)
(fEXTCLK = 24 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output Load = 68.5 pF; TJ = 60°C;
Data Rate = 588 Mbps; 2304 × 1296 at 60 fps)
Definition
Min
Typ
Max
Unit
Core Digital Voltage
1.7
1.8
1.9
V
I/O Digital Voltage
1.7
2.4
1.8
2.8
1.9
3.1
V
Analog Voltage
2.7
2.8
2.9
V
Symbol
VDD
VDD_IO
VAA
VAA_PIX
Pixel Supply Voltage
2.7
2.8
2.9
V
VDD_PLL
PLL Supply Voltage
2.7
2.8
2.9
V
VDD_MIPI
MIPI Supply Voltage
2.7
2.8
2.9
V
Digital Operating Current
−
114
136
mA
I/O Digital Operating Current
−
0
0
mA
Analog Operating Current
−
41
53
mA
I (VDD)
I (VDD_IO)
I (VAA)
I (VAA_PIX)
Pixel Supply Current
−
9.9
12
mA
I (VDD_PLL)
PLL Supply Current
−
15
27
mA
I (VDD_MIPI)
MIPI Digital Operating Current
−
35
49
mA
Table 10. DC ELECTRICAL DEFINITIONS AND CHARACTERISTICS (HiSPi MODE)
(fEXTCLK = 24 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; VDD_HiSPi = 1.8 V,
VDD_HiSPi_TX = 0.4 V; Output Load = 68.5 pF; TJ = 60°C; Data Rate = 588 Mbps; DLL Set to 0; 2304 × 1296 at 60 fps)
Min
Typ
Max
Unit
Core Digital Voltage
Definition
1.7
1.8
1.9
V
I/O Digital Voltage
1.7
2.4
1.8
2.8
1.9
3.1
V
Analog Voltage
2.7
2.8
2.9
V
VAA_PIX
Pixel Supply Voltage
2.7
2.8
2.9
V
VDD_PLL
PLL Supply Voltage
2.7
2.8
2.9
V
VDD_HiSPi
HiSPi Digital Voltage
1.7
1.8
1.9
V
VDD_HiSPi_TX
HiSPi I/O Digital Voltage
0.3
1.7
0.4
1.8
0.9
1.9
V
I (VDD)
Digital Operating Current
−
96.3
137
mA
I/O Digital Operating Current
−
0
0
mA
Analog Operating Current
−
45.1
53
mA
I (VAA_PIX)
Pixel Supply Current
−
10.5
12
mA
I (VDD_PLL)
PLL Supply Current
−
6.4
11
mA
HiSPi Digital Operating Current
−
21.8
36
mA
HiSPi I/O Digital Operating Current
−
22.3
40
mA
Symbol
VDD
VDD_IO
VAA
I (VDD_IO)
I (VAA)
I (VDD_HiSPi)
I (VDD_HiSPi_TX)
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11
AR0330CM
Table 11. DC ELECTRICAL DEFINITIONS AND CHARACTERISTICS (PARALLEL MODE)
(fEXTCLK = 24 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output Load = 68.5 pF; TJ = 60°C;
2304 × 1296 at 30 fps)
Definition
Min
Typ
Max
Unit
Core Digital Voltage
1.7
1.8
1.9
V
I/O Digital Voltage
1.7
2.4
1.8
2.8
1.9
3.1
V
Symbol
VDD
VDD_IO
Analog Voltage
2.7
2.8
2.9
V
VAA_PIX
VAA
Pixel Supply Voltage
2.7
2.8
2.9
V
VDD_PLL
PLL Supply Voltage
2.7
2.8
2.9
V
Digital Operating Current
−
66.5
75
mA
I/O Digital Operating Current
−
24
35
mA
Analog Operating Current
−
36
44
mA
I (VAA_PIX)
Pixel Supply Current
−
10.5
18
mA
I (VDD_PLL)
PLL Supply Current
−
6
11
mA
I (VDD)
I (VDD_IO)
I (VAA)
Table 12. STANDBY POWER
(fEXTCLK = 24 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output Load = 68.5 pF; TJ = 60°C)
Hard Standby (CLK OFF)
Soft Standby (CLK OFF)
Soft Standby (CLK ON)
Power
Typ
Max
Unit
Digital
19.8
35.8
mA
Analog
5.8
7.0
mA
Digital
23.5
39.7
mA
Analog
5.4
5.9
mA
Digital
15700
16900
mA
Analog
5.5
5.7
mA
CAUTION: Stresses greater than those listed in Table 13 may cause permanent damage to the device. This is a stress rating
only, and functional operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied.
Table 13. ABSOLUTE MAXIMUM RATINGS
Symbol
Min
Max
Unit
Core Digital Voltage
–0.3
2.4
V
I/O Digital Voltage
–0.3
4
V
VAA_MAX
Analog Voltage
–0.3
4
V
VDD_MAX
VDD_IO_MAX
Definition
VAA_PIX
Pixel Supply Voltage
–0.3
4
V
VDD_PLL
PLL Supply Voltage
–0.3
4
V
VDD_MIPI
MIPI Supply Voltage
–0.3
4
V
VDD_HiSPi_MAX
HiSPi Digital Voltage
–0.3
2.4
V
HiSPi I/O Digital Voltage
–0.3
2.4
V
Storage Temperature
–40
85
°C
VDD_HiSPi_TX_MAX
tST
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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12
AR0330CM
Two-Wire Serial Register Interface
The electrical characteristics of the two-wire serial
register interface (SCLK, SDATA) are shown in Figure 8 and
Table 14.
SDATA
tLOW
tf
tSU;DAT
tr
tf
tHD;STA
tBUF
tr
SCLK
tHD;STA
S
NOTE:
tHD;DAT
tSU;STA
tHIGH
tSU;STO
Sr
P
S
Read sequence: For an 8-bit READ, read waveforms start after WRITE command and register address are issued.
Figure 8. Two-Wire Serial Bus Timing Parameters
Table 14. TWO-WIRE SERIAL BUS CHARACTERISTICS
(fEXTCLK = 27 MHz; VDD = 1.8 V; VDD_IO = 2.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; TA = 25°C)
Standard Mode
Fast Mode
Symbol
Min
Max
Min
Max
Unit
tSCL
0
100
0
400
kHz
tHD;STA
4.0
−
0.6
−
ms
LOW Period of the SCLK Clock
tLOW
4.7
−
1.3
−
ms
HIGH Period of the SCLK Clock
tHIGH
4.0
−
0.6
−
ms
Set-up Time for a Repeated START
Condition
tSU;STA
4.7
−
0.6
−
ms
Data Hold Time
tHD;DAT
0
(Note 4)
3.45
(Note 5)
0
(Note 6)
0.9
(Note 5)
ms
Data Set-up Time
tSU;DAT
250
−
100
(Note 6)
−
ns
Rise Time of both SDATA and SCLK
Signals
tr
−
1000
20 + 0.1 Cb
(Note 7)
300
ns
Fall Time of both SDATA and SCLK
Signals
tf
−
300
20 + 0.1 Cb
(Note 7)
300
ns
Set-up Time for STOP Condition
tSU;STO
4.0
−
0.6
−
ms
tBUF
4.7
−
1.3
−
ms
Cb
−
400
−
400
pF
Parameter
SCLK Clock Frequency
Hold Time (Repeated) START Condition
After this Period, the First Clock Pulse is
Generated
Bus Free Time between a STOP and
START Condition
Capacitive Load for Each Bus Line
Serial Interface Input Pin Capacitance
SDATA Max Load Capacitance
SDATA Pull-up Resistor
CIN_SI
−
3.3
−
3.3
pF
CLOAD_SD
−
30
−
30
pF
RSD
1.5
4.7
1.5
4.7
kW
This table is based on I2C standard (v2.1 January 2000). Philips Semiconductor.
Two-wire control is I2C-compatible.
All values referred to VIHmin = 0.9 VDD and VILmax = 0.1 VDD levels. Sensor EXCLK = 27 MHz.
A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the undefined region of the falling edge of SCLK.
The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCLK signal.
A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This
will automatically be the case if the device does not stretch the LOW period of the SCLK signal. If such a device does stretch the LOW period
of the SCLK signal, it must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode
I2C-bus specification) before the SCLK line is released.
7. Cb = total capacitance of one bus line in pF.
1.
2.
3.
4.
5.
6.
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13
AR0330CM
tR
tF
90%
tRP
tFP
90%
10%
90%
10%
10%
90%
10%
tEXTCLK
EXTCLK
tCP
PIXCLK
tPD
Data[11:0]
tPD
Pxl_0
Pxl_1
Pxl_2
Pxl_n
tPFL
tPLL
tPLH
tPFH
FRAME_VALID/
LINE_VALID
FRAME_VALID Leads LINE_VALID
by 609 PIXCLKs
NOTE:
FRAME_VALID Trails LINE_VALID
by 16 PIXCLKs
PLL disabled for tCP.
Figure 9. I/O Timing Diagram
Table 15. I/O PARAMETERS
(fEXTCLK = 24 MHz; VDD = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output Load = 68.5 pF; TJ = 60°C; CLK_OP = 98 Mp/s)
Definition
Symbol
Condition
Min
Max
Unit
VIH
Input HIGH Voltage
VDD_IO = 1.8 V
VDD_IO = 2.8 V
1.4
2.4
VDD_IO + 0.3
VDD_IO + 0.3
V
VIL
Input LOW Voltage
VDD_IO = 1.8 V
VDD_IO = 2.8 V
GND – 0.3
GND – 0.3
0.4
0.8
mV
IIN
Input Leakage Current
No Pull-up Resistor; VIN = VDD OR DGND
–20
20
mA
VOH
Output HIGH Voltage
At Specified IOH
VDD_IO − 0.4
–
V
VOL
Output LOW Voltage
At Specified IOL
–
0.4
V
IOH
Output HIGH Current
At Specified VOH
–
–12
mA
IOL
Output LOW Current
At Specified VOL
–
9
mA
IOZ
Tri-state Output Leakage Current
–
10
mA
Table 16. I/O TIMING
(fEXTCLK = 24 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output load = 68.5 pF; TJ = 60°C;
CLK_OP = 98 Mp/s)
Definition
Symbol
Conditions
Min
Typ
Max
Unit
27
MHz
fEXTCLK
Input Clock Frequency
PLL Enabled
6
24
tEXTCLK
Input Clock Period
PLL Enabled
166
41
20
ns
tR
Input Clock Rise Time
0.5
–
Sine Wave
Rise Time
ns
tF
Input Clock Fall Time
0.5
–
Sine Wave
Fall Time
ns
Clock Duty Cycle
45
50
55
%
tJITTER
Output Pin Slew
fPIXCLK
Input Clock Jitter
Fastest
–
–
0.3
ns
CLOAD = 15 pF
–
0.7
–
V/ns
PIXCLK frequency
Default
–
80
–
MHz
tPD
PIXCLK to data valid
Default
–
–
3
ns
tPFH
PIXCLK to FRAME_VALID HIGH
Default
–
–
3
ns
tPLH
PIXCLK to LINE_VALID HIGH
Default
–
–
3
ns
tPFL
PIXCLK to FRAME_VALID LOW
Default
–
–
3
ns
tPLL
PIXCLK to LINE_VALID LOW
Default
–
–
3
ns
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14
AR0330CM
Table 17. PARALLEL I/O RISE SLEW RATE
(fEXTCLK = 24 MHz; VDD = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output Load = 68.5 pF; TJ = 60°C; CLK_OP = 98 Mp/s)
Parallel Slew Rate (R0x306E[15:13])
VDD_IO
0
1
2
3
4
5
6
7
Unit
1.70 V
0.069
0.115
0.172
0.239
0.325
0.43
0.558
0.836
V/ns
1.80 V
0.078
0.131
0.195
0.276
0.375
0.507
0.667
1.018
1.95 V
0.093
0.156
0.233
0.331
0.456
0.62
0.839
1.283
2.50 V
0.15
0.252
0.377
0.539
0.759
1.07
1.531
2.666
2.80 V
0.181
0.305
0.458
0.659
0.936
1.347
1.917
3.497
3.10 V
0.212
0.361
0.543
0.78
1.114
1.618
2.349
4.14
HiSPi TRANSMITTER
NOTE: Refer to “High-Speed Serial Pixel Interface Physical Layer Specification v2.00.00” for further explanation of the
HiSPi transmitter specification.
SLVS Electrical Specifications
Table 18. POWER SUPPLY AND OPERATING TEMPERATURE
(fEXTCLK = 24 MHz; VDD = 1.8 V; VDD_IO = 1.8 V; VAA = 2.8 V; VAA_PIX = 2.8 V; VDD_PLL = 2.8 V; Output load = 68.5 pF; TJ = 60°C;
CLK_OP = 98 Mp/s)
Symbol
Parameter
IDD_HiSPi_TX
IDD_HiSPi
TJ
1.
2.
3.
4.
Min
Typ
Max
Unit
SLVS Current Consumption (Notes 1, 2)
−
−
n × 18
mA
HiSPi PHY Current Consumption (Notes 1, 2, 3)
−
−
n × 45
mA
−30
−
70
°C
Operating Temperature (Note 4)
Where ‘n’ is the number of PHYs.
Temperature of 25°C.
Up to 700 Mbps.
Specification values may be exceeded when outside this temperature range.
Table 19. SLVS ELECTRICAL DC SPECIFICATION (TJ = 25°C)
Symbol
Parameter
Min
Typ
Max
Unit
VCM
SLVS DC Mean Common Mode Voltage
0.45 * VDD_TX
0.5 * VDD_TX
0.55 * VDD_TX
V
|VOD|
SLVS DC Mean Differential Output Voltage
0.36 * VDD_TX
0.5 * VDD_TX
0.64 * VDD_TX
V
DVCM
Change in VCM between Logic 1 and 0
−
−
25
mV
|VOD|
Change in |VOD| between Logic 1 and 0
−
−
25
mV
VOD Noise Margin
−
−
±30
%
|DVCM|
Difference in VCM between any Two Channels
−
−
50
mV
|DVOD|
Difference in VOD between any Two Channels
−
−
100
mV
VCM_AC
Common-mode AC Voltage (pk) without VCM Cap
Termination
−
−
50
mV
VCM_AC
Common-mode AC Voltage (pk) with VCM Cap
Termination
−
−
30
mV
VOD_AC
Maximum Overshoot Peak |VOD|
−
−
1.3 * |VOD|
V
VDiff_pk-pk
Maximum Overshoot VDiff_pk-pk
−
−
2.6 * VOD
V
RO
Single-ended Output Impedance
35
50
70
W
Output Impedance Mismatch
−
−
20
%
NM
DRO
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AR0330CM
Table 20. SLVS ELECTRICAL TIMING SPECIFICATION
Symbol
Min
Max
Unit
1/UI
Data Rate (Note 1)
280
700
Mbps
tPW
Bitrate Period (Note 1)
1.43
3.57
ns
tPRE
Max Setup Time from Transmitter (Notes 1, 2)
0.3
−
UI
tPOST
Max Hold Time from Transmitter (Notes 1, 2)
0.3
−
UI
tEYE
Eye Width (Notes 1, 2)
−
0.6
UI
Data Total Jitter (pk-pk) @1e−9 (Notes 1, 2)
−
0.2
UI
tCKJIT
Clock Period Jitter (RMS) (Note 2)
−
50
ps
tCYCJIT
Clock Cycle-to-Cycle Jitter (RMS) (Note 2)
−
100
ps
tTOTALJIT
Parameter
tR
Rise Time (20−80%) (Note 3)
150 ps
0.25
UI
tF
Fall Time (20−80%) (Note 3)
150 ps
0.25
UI
45
55
%
DCYC
Clock Duty Cycle (Note 2)
tCHSKEW
Mean Clock to Data Skew (Notes 1, 4)
−0.1
0.1
UI
tPHYSKEW
PHY-to-PHY Skew (Notes 1, 5)
−
2.1
UI
tDIFFSKEW
Mean Differential Skew (Note 6)
−100
100
ps
1. One UI is defined as the normalized mean time between one edge and the following edge of the clock.
2. Taken from the 0 V crossing point with the DLL off.
3. Also defined with a maximum loading capacitance of 10 pF on any pin. The loading capacitance may also need to be less for higher bitrates
so the rise and fall times do not exceed the maximum 0.3 UI.
4. The absolute mean skew between the Clock lane and any Data Lane in the same PHY between any edges.
5. The absolute skew between any Clock in one PHY and any Data lane in any other PHY between any edges.
6. Differential skew is defined as the skew between complementary outputs. It is measured as the absolute time between the two
complementary edges at mean VCM point. Note that differential skew also is related to the DVCM_AC spec which also must not be exceeded.
HiVCM Electrical Specifications
still scalable with VDD_HiSPi_TX, but with
VDD_HiSPi_TX nominal set to 1.8 V the common-mode is
elevated to around 0.9 V.
The HiSPi 2.0 specification also defines an alternative
signaling level mode called HiVCM. Both VOD and VCM are
Table 21. HiVCM POWER SUPPLY AND OPERATING TEMPERATURES
Symbol
IDD_HiSPi_TX
IDD_HiSPi
TJ
1.
2.
3.
4.
Parameter
Min
Typ
Max
Unit
HiVCM Current Consumption (Notes 1, 2)
−
−
n * 34
mA
HiSPi PHY Current Consumption (Notes 1, 2, 3)
−
−
n * 45
mA
−30
−
70
°C
Operating Temperature (Note 4)
Where ‘n’ is the number of PHYs.
Temperature of 25°C.
Up to 700 Mbps.
Specification values may be exceeded when outside this temperature range.
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16
AR0330CM
Table 22. HiVCM ELECTRICAL VOLTAGE AND IMPEDANCE SPECIFICATION (TJ = 25°C)
Symbol
Min
Typ
Max
Unit
VCM
HiVCM DC Mean Common Mode Voltage
0.76
0.90
1.07
V
|VOD|
HiVCM DC Mean Differential Output Voltage
200
280
350
mV
DVCM
Change in VCM between Logic 1 and 0
−
−
25
mV
|VOD|
Change in |VOD| between Logic 1 and 0
−
−
25
mV
VOD Noise Margin
−
−
±30
%
|DVCM|
Difference in VCM between any Two Channels
−
−
50
mV
|DVOD|
Difference in VOD between any Two Channels
−
−
100
mV
DVCM_AC
Common-mode AC Voltage (pk) without VCM Cap
Termination
−
−
50
mV
DVCM_AC
Common-mode AC Voltage (pk) with VCM Cap
Termination
−
−
30
mV
Maximum Overshoot Peak |VOD|
−
−
1.3 * |VOD|
V
Maximum Overshoot VDiff pk-pk
−
−
2.6 * VOD
V
Single-ended Output Impedance
40
70
100
W
Output Impedance Mismatch
−
−
20
%
NM
VOD_AC
VDiff_pk-pk
RO
DRO
Parameter
Table 23. HiVCM ELECTRICAL AC SPECIFICATION
Symbol
Parameter
Min
Max
Unit
1/UI
Data Rate (Note 1)
280
700
Mbps
tPW
Bitrate Period (Note 1)
1.43
3.57
ns
tPRE
Max Setup Time from Transmitter (Notes 1, 2)
0.3
−
UI
tPOST
Max Gold Time from Transmitter (Notes 1, 2)
0.3
−
UI
tEYE
Eye Width (Notes 1, 2)
−
0.6
UI
Data Total Jitter (pk-pk) @1e−9 (Notes 1, 2)
−
0.2
UI
tCKJIT
Clock Period Jitter (RMS) (Note 2)
−
50
ps
tCYCJIT
Clock Cycle-to-Cycle Jitter (RMS) (Note 2)
−
100
ps
tTOTALJIT
tR
Rise Time (20−80%) (Note 3)
150 ps
0.3
UI
tF
Fall Time (20−80%) (Note 3)
150 ps
0.3
UI
45
55
%
DCYC
Clock Duty Cycle (Note 2)
tCHSKEW
Clock to Data Skew (Notes 1, 4)
−0.1
0.1
UI
tPHYSKEW
PHY-to-PHY Skew (Notes 1, 5)
−
2.1
UI
tDIFFSKEW
Mean Differential Skew (Note 6)
−100
100
ps
1. One UI is defined as the normalized mean time between one edge and the following edge of the clock.
2. Taken from the 0 V crossing point with the DLL off.
3. Also defined with a maximum loading capacitance of 10 pF on any pin. The loading capacitance may also need to be less for higher bitrates
so the rise and fall times do not exceed the maximum 0.3 UI.
4. The absolute mean skew between the Clock lane and any Data Lane in the same PHY between any edges.
5. The absolute mean skew between any Clock in one PHY and any Data lane in any other PHY between any edges.
6. Differential skew is defined as the skew between complementary outputs. It is measured as the absolute time between the two
complementary edges at mean VCM point. Note that differential skew also is related to the DVCM_AC spec which also must not be exceeded.
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17
AR0330CM
Electrical Definitions
VCM use the DC test circuit shown in Figure 11 and set the
HiSPi PHY to constant Logic 1 and Logic 0. Measure Voa,
Vob and VCM with voltmeters for both Logic 1 and Logic 0.
Figure 10 is the diagram defining differential amplitude
VOD, VCM, and rise and fall times. To measure VOD and
Single-Ended Signals
Voa
VOD_AC
VOD
V CM +
V oa ) V ob
2
Vob
Differential Signal
80%
VDiff
VOD =
|Voa − Vob|
tR
0V
VOD =
|Vob − Voa|
tF
Vdiff_pkpk
20%
Figure 10. Single-Ended and Differential Signals
50 W
Voa
VCM
V
Vob
50 W
V
Figure 11. DC Test Circuit
V OD(m) + ŤV oa(m) * V ob(m)Ť
Both VOD and VCM are measured for all output channels.
The worst case DVOD is defined as the largest difference in
VOD between all channels regardless of logic level. And the
worst case DVCM is similarly defined as the largest
difference in VCM between all channels regardless of logic
level.
(eq. 1)
Where m is either “1” for logic 1 or “0” for logic 0.
V OD +
V OD(1) ) V OD(0)
2
(eq. 2)
V Diff + V OD(1) ) V OD(0)
(eq. 3)
DV OD + ŤV OD(1) * V OD(0)Ť
(eq. 4)
V CM +
V CM(1) ) V CM(0)
2
DV CM + ŤV CM(1) * V CM(0)Ť
(eq. 5)
(eq. 6)
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18
AR0330CM
Timing Definitions
edge, as shown in Figure 12. This time is
compared with the ideal Data transition point of
0.5 UI with the difference being the Clock-to-Data
Skew (see Equation 7).
1. Timing measurements are to be taken using the
Square Wave test mode.
2. Rise and fall times are measured between 20% to
80% positions on the differential waveform, as
shown in Figure 10.
3. Mean Clock-to-Data skew should be measured
from the 0 V crossing point on Clock to the 0 V
crossing point on any Data channel regardless of
t CHSKEW(ps) + Dt *
t CHSKEW(UI) +
t pw
2
Dt
* 0.5
t pw
(eq. 7)
(eq. 8)
tpw
1 UI
Clock
0.5 UI
Dt
tCHSKEW
Data
Figure 12. Clock-to-Data Skew Timing Diagram
4. The differential skew is measured on the two
single-ended signals for any channel. The time is
taken from a transition on Voa signal to
corresponding transition on Vob signal at VCM
crossing point.
VCM
tDIFFSKEW
Common-mode AC Signal
VCM_AC
VCM
VCM_AC
Figure 13. Differential Skew
Figure 13 also shows the corresponding AC VCM
common-mode signal. Differential skew between the Voa
and Vob signals can cause spikes in the common-mode,
which the receiver needs to be able to reject. VCM_AC is
measured as the absolute peak deviation from the mean DC
VCM common-mode.
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19
AR0330CM
Transmitter Eye Mask
1.3 * VOD
VOD
Eye Width
Eye Height
Differential Amplitude
0.7 * VOD
0
−0.7 * VOD
tPRE
−VOD
tPOST
−1.3 * VOD
0
0.2
0.37
0.5
0.63
0.8
1
Normalized Time
Figure 14. Transmitter Eye Mask
Figure 14 defines the eye mask for the transmitter. 0.5 UI
point is the instantaneous crossing point of the Clock. The
area in white shows the area Data is prohibited from crossing
into. The eye mask also defines the minimum eye height, the
data tPRE and tPOST times, and the total jitter pk-pk +mean
skew (tTJSKEW ) for Data.
Clock Signal
tHCLK is defined as the high clock period, and tLCLK is
defined as the low clock period as shown in Figure 15. The
clock duty cycle DCYC is defined as the percentage time the
clock is either high (tHCLK) or low (tLCLK) compared with
the clock period T.
T
2 UI
tHCLK
Clock
tLCLK
Figure 15. Clock Duty Cycle
D CYC(1) +
D CYC(0) +
t HCLK
T
t LCLK
T
t pw +
(eq. 9)
T
2
(i.e, 1 UI)
(eq. 11)
1
t pw
(eq. 12)
Bitrate +
(eq. 10)
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20
AR0330CM
Figure 16 shows the definition of clock jitter for both the
period and the cycle-to-cycle jitter.
tHCLK
tLCLK
tCKJIT (RMS)
tpw
Figure 16. Clock Jitter
Period Jitter (tCKJIT) is defined as the deviation of the
instantaneous clock tPW from an ideal 1 UI. This should be
measured for both the clock high period variation DtHCLK,
and the clock low period variation DtLCLK taking the RMS
or 1-sigma standard deviation and quoting the worse case
jitter between DtHCLK and DtLCLK.
Cycle-to-cycle jitter (tCYCJIT) is defined as the difference
in time between consecutive clock high and clock low
periods tHCLK and tLCLK, quoting the RMS value of the
variation D(tHCLK − tLCLK).
If pk-pk jitter is also measured, this should be limited to
±3-sigma.
Table 24. HiVCM ELECTRICAL AC SPECIFICATION
Symbol
Parameter
Min
Max
Unit
1/UI
Data Rate (Note 1)
280
700
Mbps
tPW
Bitrate Period (Note 1)
1.43
3.57
ns
tPRE
Max Setup Time from Transmitter (Notes 1, 2)
0.3
−
UI
tPOST
Max Gold Time from Transmitter (Notes 1, 2)
0.3
−
UI
tEYE
Eye Width (Notes 1, 2)
−
0.6
UI
Data Total Jitter (pk-pk) @1e−9 (Notes 1, 2)
−
0.2
UI
tCKJIT
Clock Period Jitter (RMS) (Note 2)
−
50
ps
tCYCJIT
Clock Cycle-to-Cycle Jitter (RMS) (Note 2)
−
100
ps
tTOTALJIT
tR
Rise Time (20−80%) (Note 3)
150 ps
0.3
UI
tF
Fall Time (20−80%) (Note 3)
150 ps
0.3
UI
45
55
%
DCYC
Clock Duty Cycle (Note 2)
tCHSKEW
Clock to Data Skew (Notes 1, 4)
−0.1
0.1
UI
tPHYSKEW
PHY-to-PHY Skew (Notes 1, 5)
−
2.1
UI
tDIFFSKEW
Mean Differential Skew (Note 6)
−100
100
ps
1. One UI is defined as the normalized mean time between one edge and the following edge of the clock.
2. Taken from the 0 V crossing point with the DLL off.
3. Also defined with a maximum loading capacitance of 10 pF on any pin. The loading capacitance may also need to be less for higher bitrates
so the rise and fall times do not exceed the maximum 0.3 UI.
4. The absolute mean skew between the Clock lane and any Data Lane in the same PHY between any edges.
5. The absolute mean skew between any Clock in one PHY and any Data lane in any other PHY between any edges.
6. Differential skew is defined as the skew between complementary outputs. It is measured as the absolute time between the two
complementary edges at mean VCM point. Note that differential skew also is related to the DVCM_AC spec which also must not be exceeded.
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21
AR0330CM
SENSOR PLL
SEQUENCER
The sequencer digital block determines the order and
timing of operations required to sample pixel data from the
array during each row period. It is controlled by an
instruction set that is programmed into RAM from the
sensor OTPM (One Time Programmable Memory). The
OTPM is configured during production.
The instruction set determines the length of the sequencer
operation that determines the “ADC Readout Limitation”
(Equation 5) listed in the Sensor Frame Rate section. The
instruction set can be shortened through register writes in
order to achieve faster frame rates. Instructions for
shortening the sequencer can be found in the AR0330
Developer Guide.
The sequencer digital block can be reprogrammed using
the following instructions:
Program a new sequencer.
1. Place the sensor in standby.
2. Write 0x8000 to R0x3088 (“seq_ctrl_port”).
3. Write each instruction incrementally to R0x3086.
Each write must be 16-bit consisting of two bytes
{Byte[N], Byte[N+1]}.
4. If the sequencer consists of an odd number of
bytes, set the last byte to “0”.
VCO
The sensor contains a phase-locked loop (PLL) that is
used for timing generation and control. The required VCO
clock frequency is attained through the use of a pre-PLL
clock divider followed by a multiplier (see Figure 17). The
multiplier is followed by set of dividers used to generate the
output clocks required for the sensor array, the pixel analog
and digital readout paths, and the output parallel and serial
interfaces.
Dual Readout Paths
There are two readout paths within the sensor digital block
(see Figure 18).
The sensor row timing calculations refers to each
data-path individually. For example, the sensor default
configuration uses 1248 clocks per row (line_length_pck) to
output 2304 active pixels per row. The aggregate clocks per
row seen by the receiver will be 2496 clocks (1248 × 2
readout paths).
Read the instructions stored in the sequencer.
1. Place the sensor in standby.
2. Write 0xC000 to R0x3088 (“seq_ctrl_port”).
3. Sequentially read one byte at a time from R0x3086
with 8-bit read command.
pre_pll_clk_div
2(1−64)
EXTCLK
(6−27 MHz)
pll_multiplier
58(32−384)
FVCO
Figure 17. Relationship between Readout Clock and Peak Pixel Rate
All Digital
Blocks
CLK_PIX
Serial Output
(MIPI or HiSPi)
Pixel Array
Pixel Rate = 2 × CLK_PIX
= # Data Lanes × CLK_OP (HiSPi or MIPI)
= CLK_OP (Parallel)
All Digital
Blocks
CLK_PIX
Figure 18. Sensor Dual Readout Paths
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22
AR0330CM
Parallel PLL Configuration
FVCO
pre_pll_clk_div
2(1−64)
EXTCLK
(6−27 MHz)
vt_sys_clk_div
1(1, 2, 4, 6, 8,
10, 12, 14, 16)
pll_multiplier
58(32−384)
vt_pix_clk_div
6(4−16)
CLK_OP
(Max 98 Mpixel/s)
1/2
CLK_PIX
(Max 49 Mpixel/s)
Figure 19. PLL for the Parallel Interface
(The parallel interface has a maximum output data-rate of 98 Mpixel/s)
The maximum output of the parallel interface is
98 Mpixel/s (CLK_OP). This will limit the readout clock
(CLK_PIX) to 49 Mpixel/s. The sensor will not use the
FSERIAL, FSERIAL_CLK, or CLK_OP when configured to use
the parallel interface.
Table 25. PLL PARAMETERS FOR THE PARALLEL INTERFACE
Symbol
Parameter
EXTCLK
External Clock
FVCO
VCO Clock
Min
Max
Unit
6
27
MHz
384
768
MHz
CLK_PIX
Readout Clock
49
Mpixel/s
CLK_OP
Output Clock
98
Mpixel/s
Table 26. EXAMPLE PLL CONFIGURATION FOR THE PARALLEL INTERFACE
Parameter
Value
Output
FVCO
588 MHz (Max)
vt_sys_clk_div
1
vt_pix_clk_div
6
CLK_PIX
49 Mpixel/s (= 588 MHz/12)
CLK_OP
98 Mpixel/s (= 588 MHz/6)
Output Pixel Rate
98 Mpixel/s
Serial PLL Configuration
FVCO
EXTCLK
(6−27 MHz)
pre_pll_clk_div
2(1−64)
pll_multiplier
58(32−384)
FVCO
vt_sys_clk_div
1(1, 2, 4, 6, 8,
10, 12, 14, 16)
vt_pix_clk_div
6(4−16)
CLK_PIX
op_sys_clk_div
Constant − 1
op_pix_clk_div
12(8, 10, 12)
CLK_OP
FSERIAL
1/2
FSERIAL_CLK
Figure 20. PLL for the Serial Interface
The sensor will use op_sys_clk_div and op_pix_clk_div
to configure the output clock per lane (CLK_OP). The
configuration will depend on the number of active lanes
(1, 2, or 4) configured. To configure the sensor protocol and
number of lanes, refer to “Serial Configuration”.
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23
AR0330CM
Table 27. PLL PARAMETERS FOR THE SERIAL INTERFACE
Symbol
EXTCLK
FVCO
Parameter
External Clock
VCO Clock
Min
Max
Unit
6
27
MHz
384
768
MHz
CLK_PIX
Readout Clock
−
98
Mpixel/s
CLK_OP
Output Clock
−
98
Mpixel/s
FSERIAL
Output Serial Data Rate Per Lane
HiSPi
MIPI
300
384
700
768
Output Serial Clock Speed Per Lane
HiSPIi
MIPI
150
192
350
384
FSERIAL_CLK
The serial output should be configured so that it adheres
to the following rules:
• The maximum data-rate per lane (FSERIAL) is
768 Mbps/lane (MIPI) and 700 Mbps/lane (HiSPi).
• The output pixel rate per lane (CLK_OP) should be
configured so that the sensor output pixel rate matches
the peak pixel rate (2 × CLK_PIX):
♦
♦
♦
Mbps
MHz
4-lane: 4 × CLK_OP = 2 × CLK_PIX = Pixel Rate
(max: 196 Mpixel/s)
2-lane: 2 × CLK_OP = 2 × CLK_PIX = Pixel Rate
(max: 98 Mpixel/s)
1-lane: 1 × CLK_OP = 2 × CLK_PIX = Pixel Rate
(max: 76 Mpixel/s)
Table 28. EXAMPLE PLL CONFIGURATIONS FOR THE SERIAL INTERFACE
4-lane
2-lane
1-lane
Parameter
12-bit
10-bit
12-bit
10-bit
12-bit
10-bit
8-bit
Unit
MHz
FVCO
588
490
588
490
768
768
768
vt_sys_clk_div
1
1
2
2
4
4
4
vt_pix_clk_div
6
5
6
5
6
5
4
op_sys_clk_div
1
1
1
1
1
1
1
op_pix_clk_div
12
10
12
10
12
10
8
FSERIAL
588
490
588
490
768
768
768
FSERIAL_CLK
294
245
294
245
384
384
384
MHz
CLK_PIX
98
98
49
49
32
38.4
48
Mpixel/s
CLK_OP
49
49
49
49
64
76.8
96
Mpixel/s
Pixel Rate
196
196
98
98
64
76.8
96
Mpixel/s
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24
MHz
AR0330CM
PIXEL OUTPUT INTERFACES
Parallel Interface
When the parallel pixel data interface is in use, the serial
data output signals can be left unconnected. Set
reset_register[12] to disable the serializer while in parallel
output mode.
The parallel pixel data interface uses these output-only
signals:
• FV
• LV
• PIXCLK
• DOUT[11:0]
Output Enable Control
When the parallel pixel data interface is enabled, its
signals can be switched asynchronously between the driven
and High−Z under pin or register control, as shown in
Table 29. OE_BAR pin is only available on the bare die
version.
The parallel pixel data interface is disabled by default at
power up and after reset. It can be enabled by programming
R0x301A. Table 30 shows the recommended settings.
Table 29. OUTPUT ENABLE CONTROL
OE_BAR Pin
Drive Signals R0x301A−B[6]
Description
Disabled
0
Interface High−Z
Disabled
1
Interface Driven
1
0
Interface High−Z
X
1
Interface Driven
0
X
Interface Driven
Configuration of the Pixel Data Interface
Fields in R0x301A are used to configure the operation of
the pixel data interface. The supported combinations are
shown in Table 30.
Table 30. CONFIGURATION OF THE PIXEL DATA INTERFACE
Serializer
Disable
R0x301A−B[12]
Parallel
Enable
R0x301A−B[7]
Standby
End-of-Frame
R0x301A−B[7]
0
0
1
Power up default. Serial pixel data interface and its clocks are enabled.
Transitions to soft standby are synchronized to the end of frames on the
serial pixel data interface.
1
1
0
Parallel pixel data interface, sensor core data output. Serial pixel data
interface and its clocks disabled to save power. Transitions to soft standby
are synchronized to the end of the current row readout on the parallel pixel
data interface.
1
1
1
Parallel pixel data interface, sensor core data output. Serial pixel data
interface and its clocks disabled to save power. Transitions to soft standby
are synchronized to the end of frames in the parallel pixel data interface.
Description
High Speed Serial Pixel Data Interface
The HiSPi interface supports three protocols, Streaming
S, Streaming SP, and Packetized SP. The streaming
protocols conform to a standard video application where
each line of active or intra-frame blanking provided by the
sensor is transmitted at the same length. The Packetized SP
protocol will transmit only the active data ignoring
line-to-line and frame-to-frame blanking data.
These protocols are further described in the High-Speed
Serial Pixel (HiSPi) Interface Protocol Specification
V1.00.00.
The HiSPi interface building block is a unidirectional
differential serial interface with four data and one double
data rate (DDR) clock lanes. One clock for every four serial
data lanes is provided for phase alignment across multiple
lanes. Figure 21 shows the configuration between the HiSPi
transmitter and the receiver.
The High Speed Serial Pixel (HiSPi) interface uses four
data and one clock low voltage differential signaling
(LVDS) outputs.
• SLVSC_P
• SLVSC_N
• SLVS0_P
• SLVS0_N
• SLVS1_P
• SLVS1_N
• SLVS2_P
• SLVS2_N
• SLVS3_P
• SLVS3_N
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25
AR0330CM
A Camera Containing
the HiSPi Transmitter
Tx
PHY0
A Host (DSP) Containing
the HiSPi Receiver
Dp0
Dp0
Dn0
Dn0
Dp1
Dp1
Dn1
Dn1
Dp2
Dp2
Dn2
Dn2
Dp3
Dp3
Dn3
Dn3
Cp0
Cp0
Cn0
Cn0
Rx
PHY0
Figure 21. HiSPi Transmitter and Receiver Interface Block Diagram
The PHY will serialize a 10-, 12-, 14- or 16-bit data word
and transmit each bit of data centered on a rising edge of the
clock, the second on the falling edge of clock. Figure 22
shows bit transmission. In this example, the word is
transmitted in order of MSB to LSB. The receiver latches
data at the rising and falling edge of the clock.
HiSPi Physical Layer
The HiSPi physical layer is partitioned into blocks of four
data lanes and an associated clock lane. Any reference to the
PHY in the remainder of this document is referring to this
minimum building block.
TxPost
cp
….
cn
TxPre
dp
MSB
….
LSB
dn
1 UI
Figure 22. Timing Diagram
DLL Timing Adjustment
The specification includes a DLL to compensate for
differences in group delay for each data lane. The DLL is
connected to the clock lane and each data lane, which acts as
a control master for the output delay buffers. Once the DLL
has gained phase lock, each lane can be delayed in 1/8 unit
interval (UI) steps. This additional delay allows the user to
increase the setup or hold time at the receiver circuits and
can be used to compensate for skew introduced in PCB
design.
If the DLL timing adjustment is not required, the data and
clock lane delay settings should be set to a default code of
0x000 to reduce jitter, skew, and power dissipation.
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26
del3[2:0]
del2[2:0]
delclock[2:0]
del1[2:0]
del0[2:0]
AR0330CM
Delay
Delay
Delay
Delay
Delay
data_lane0
data_lane1
clock_lane0
data_lane2
data_lane3
Figure 23. Block Diagram of DLL Timing Adjustment
1 UI
dataN (delN = 000)
cp (delclock = 000)
cp (delclock = 001)
cp (delclock = 010)
cp (delclock = 011)
cp (delclock = 100)
cp (delclock = 101)
cp (delclock = 110)
cp (delclock =111)
increasing delclock_[2:0] increases clock delay
Figure 24. Delaying the Clock_lane with Respect to the Data_lane
cp (delclock = 000)
dataN (delN = 000)
dataN (delN = 001)
dataN (delN = 010)
dataN (delN = 011)
dataN (delN = 100)
dataN (delN = 101)
dataN (delN = 110)
dataN (delN = 111)
tDLLSTEP
increasing delN_[2:0] increases data delay
1 UI
Figure 25. Delaying the Data_lane with Respect to the Clock_lane
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27
AR0330CM
Serial Configuration
HiSPi Streaming Mode Protocol Layer
The HiSPi protocol is described HiSPi Protocol V1.00.00
A.
The serial format should be configured using R0x31AC.
This register should be programmed to 0x0C0C when using
the parallel interface.
The R0x0112−3 register can be programmed to any of the
following data format settings that are supported:
• 0x0C0C – Sensor supports RAW12 uncompressed data
format
• 0x0C0A – The sensor supports RAW12 compressed
format (10-bit words) using 12−10 bit A−LAW
Compression. See “Compression” section
• 0x0A0A – Sensor supports RAW10 uncompressed data
format. This mode is supported by discarding all but the
upper 10 bits of a pixel value
• 0x0808 – Sensor supports RAW8 uncompressed data
format. This mode is supported by discarding all but the
upper 8 bits of a pixel value (MIPI only).
MIPI Interface
The serial pixel data interface uses the following
output-only signal pairs:
• DATA1_P
• DATA1_N
• DATA2_P
• DATA2_N
• DATA3_P
• DATA3_N
• DATA4_P
• DATA4_N
• CLK_P
• CLK_N
The serial_format register (R0x31AE) register controls
which serial interface is in use when the serial interface is
enabled (reset_register[12] = 0). The following serial
formats are supported:
• 0x0201 – Sensor supports single-lane MIPI operation
• 0x0202 – Sensor supports dual-lane MIPI operation
• 0x0204 – Sensor supports quad-lane MIPI operation
• 0x0304 − Sensor supports quad-lane HiSPi operation
The signal pairs use both single-ended and differential
signaling, in accordance with the the MIPI Alliance
Specification for D−PHY v1.00.00. The serial pixel data
interface is enabled by default at power up and after reset.
The DATA0_P, DATA0_N, DATA1_P, DATA1_N,
CLK_P and CLK_N pads are set to the Ultra Low Power
State (ULPS) if the serial disable bit is asserted
(R0x301A−B[12] = 1) or when the sensor is in the hardware
standby or soft standby system states.
When the serial pixel data interface is used, the
LINE_VALID,
FRAME_VALID,
PIXCLK
and
DOUT[11:0] signals (if present) can be left unconnected.
The MIPI timing registers must be configured differently
for 10-bit or 12-bit modes. These modes should be
configured when the sensor streaming is disabled. See
Table 31.
Table 31. RECOMMENDED MIPI TIMING CONFIGURATION
Configuration
10-bit, 490 Mbps/Lane
12-bit, 588 Mbps/Lane
Clocking: Continuous
Register
Description
0x31B0
40
36
Frame Preamble
0x31B2
14
12
Line Preamble
0x31B4
0x2743
0x2643
MIPI Timing 0
0x31B6
0x114E
0x114E
MIPI Timing 1
0x31B8
0x2049
0x2048
MIPI Timing 2
0x31BA
0x0186
0x0186
MIPI Timing 3
0x31BC
0x8005
0x8005
MIPI Timing 4
0x31BE
0x2003
0x2003
MIPI Config Status
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28
AR0330CM
PIXEL SENSITIVITY
Row Integration
(tINTEGRATION)
Row Reset
(Start of Integration)
Row Readout
Figure 26. Integration Control in ERS Readout
A pixel’s integration time is defined by the number of
clock periods between a row’s reset and read operation. Both
the read followed by the reset operations occur within a row
period (TROW) where the read and reset may be applied to
different rows. The read and reset operations will be applied
to the rows of the pixel array in a consecutive order.
The integration time in an ERS frame is defined as:
T INTEGRATION + T COARSE * T FINE
(eq. 13)
The coarse integration time is defined by the number of
row periods (TROW) between a row’s reset and the row read.
The row period is the defined as the time between row read
operations (see Sensor Frame Rate section).
T COARSE + T ROW
coarse_integration_time
(eq. 14)
TCOARSE =
coarse_integration_time × TROW
8.33 ms = 654 Rows × 12.7 ms/Row
Read
Reset
Horizontal Blanking
Vertical Blanking
Image
TFRAME = frame_length_lines × TROW
16.6 ms = 1308 Rows × 12.7 ms/Row
Time
Vertical Blanking
Figure 27. Example of 8.33 ms Integration in 16.6 ms Frame
The fine integration is then defined by the number of pixel
clock periods between the row reset and row read operation
within TROW. This period
fine_integration_time register.
Start of Read Row N
and Reset Row K
is
defined
by
the
Start of Read Row N+1
and Reset Row K+1
Read Row N
Reset Row K
TFINE = fine_integration_time × (1 / CLK_PIX)
TROW = line_length_pck × (1 / CLK_PIX)
Figure 28. Row Read and Row Reset Showing Fine Integration
T FINE +
fine_integration_time
clk_pix
ON Semiconductor
recommends
that
fine_integration_time in the AR0330 be left at zero.
(eq. 15)
The maximum allowed value for fine_integration_time is
line_length_pck − 1204.
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29
the
AR0330CM
Read
Pointer
TCOARSE =
coarse_integration_time × TROW
20.7 ms = 1634 Rows × 12.7 ms/Row
Horizontal Blanking
Vertical Blanking
Image
TFRAME = frame_length_lines × TROW
16.6 ms = 1308 Rows × 12.7 ms/Row
Vertical Blanking
Extended Vertical Blanking
Shutter
Pointer
Horizontal Blanking
Time
4.1 ms
Image
Figure 29. The Row Integration Time is Greater than the Frame Readout Time
The minimum frame-time is defined by the number of row
periods per frame and the row period. The sensor frame-time
will increase if the coarse_integration_time is set to a value
equal to or greater than the frame_length_lines.
The maximum integration time can be limited to the frame
time by setting R0x30CE[5] to 1.
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30
AR0330CM
GAIN STAGES
The analog gain stages of the AR0330 sensor are shown
in Figure 30. The sensor analog gain stage consists of
column amplifiers and a variable ADC reference. The sensor
will apply the same analog gain to each color channel.
Digital gain can be configured to separate levels for each
color channel.
ADC
Reference
Digital Gain
with Dithering
Coarse Gain:
1x, 2x, 4x, 8x
Fine Gain:
1−2x: 16 Steps
2−4x: 8 Steps
4−8x: 4 Steps
1x to 15.992x
(128 Steps per 6 dB)
“xxxx.yyyy”
xxxx(15−0)
yyyyyyy(127/128 to 0)
Figure 30. Gain Stages in AR0330 Sensor
The level of analog gain applied is controlled by the
coarse_gain and fine_gain registers. The analog readout can
be configured differently for each gain level. The
recommended gain tables are listed in Table 32. It is
recommended that these registers are configured before
streaming images.
Table 32. RECOMMENDED SENSOR ANALOG GAIN TABLES
COARSE_GAIN
FINE_GAIN
Total Gain
COARSE_GAIN
FINE_GAIN
Total Gain
R0x3060[5:4]
Gain
(x)
R0x3060[3:0]
Gain
(x)
(x)
(dB)
R0x3060[5:4]
Gain
(x)
R0x3060[3:0]
Gain
(x)
(x)
(dB)
0
1
0
1.00
1.00
0.00
0
1x
15
1.88
1.88
5.49
0
1
1
1.03
1.03
0.26
1
2x
0
1.00
2.00
6.00
0
1
2
1.07
1.07
0.56
1
2x
2
1.07
2.13
6.58
0
1
3
1.10
1.10
0.86
1
2x
4
1.14
2.29
7.18
0
1
4
1.14
1.14
1.16
1
2x
6
1.23
2.46
7.82
0
1
5
1.19
1.19
1.46
1
2x
8
1.33
2.67
8.52
0
1
6
1.23
1.23
1.80
1
2x
10
1.45
2.91
9.28
0
1
7
1.28
1.28
2.14
1
2x
12
1.60
3.20
10.10
0
1
8
1.33
1.33
2.50
1
2x
14
1.78
3.56
11.02
0
1
9
1.39
1.39
2.87
2
4x
0
1.00
4.00
12.00
0
1
10
1.45
1.45
3.25
2
4x
4
1.14
4.57
13.20
0
1
11
1.52
1.52
3.66
2
4x
8
1.33
5.33
14.54
0
1
12
1.60
1.60
4.08
2
4x
12
1.60
6.40
16.12
0
1
13
1.68
1.68
4.53
3
8x
0
1.00
8.00
18.00
0
1
14
1.78
1.78
5.00
Each digital gain can be configured from a gain of 0 to
15.875. The digital gain supports 128 gain steps per 6 dB of
gain. The format of each digital gain register is
“xxxx.yyyyyyy” where “xxxx” refers an integer gain of 1 to
15 and “yyyyyyy” is a fractional gain ranging from 0/128 to
127/128.
The sensor includes a digital dithering feature to reduce
quantization resulting from using digital gain can be
implemented by setting R0x30BA[5] to 1. The default value
is 0. Refer to “Real-Time Context Switching” for the analog
and digital gain registers in both context A and context B
modes.
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31
AR0330CM
DATA PEDESTAL
The data pedestal is a constant offset that is added to pixel
values at the end of datapath. The default offset is 168 and
is a 12-bit offset. This offset matches the maximum range
used by the corrections in the digital readout path.
The data pedestal value can be changed if the lock register
bit (R0x301A[3]) is set to “0”. This bit is set to “1” by
default.
•
SENSOR READOUT
Image Acquisition Modes
The AR0330 supports two image acquisition modes:
• Electronic Rolling Shutter (ERS) Mode:
This is the normal mode of operation. When the
AR0330 is streaming; it generates frames at a fixed
rate, and each frame is integrated (exposed) using the
ERS. When the ERS is in use, timing and control logic
within the sensor sequences through the rows of the
array, resetting and then reading each row in turn. In the
time interval between resetting a row and subsequently
reading that row, the pixels in the row integrate incident
light. The integration (exposure) time is controlled by
varying the time between row reset and row readout.
For each row in a frame, the time between row reset
and row readout is the same, leading to a uniform
integration time across the frame. When the integration
time is changed (by using the two-wire serial interface
to change register settings), the timing and control logic
controls the transition from old to new integration time
in such a way that the stream of output frames from the
AR0330 switches cleanly from the old integration time
to the new while only generating frames with uniform
integration. See “Changes to Integration Time” in the
AR0330 Register Reference.
Global Reset Mode:
This mode can be used to acquire a single image at the
current resolution. In this mode, the end point of the
pixel integration time is controlled by an external
electromechanical shutter, and the AR0330 provides
control signals to interface to that shutter.
The benefit of using an external electromechanical
shutter is that it eliminates the visual artifacts
associated with ERS operation. Visual artifacts arise in
ERS operation, particularly at low frame rates, because
an ERS image effectively integrates each row of the
pixel array at a different point in time.
Window Control
The sequencing of the pixel array is controlled by the
x_addr_start, y_addr_start, x_addr_end, and y_addr_end
registers. The x_addr_start equal to 6 is the minimum setting
value. The y_addr_start equal to 6 is the minimum setting
value. Please refer to Table 33 and Table 34 for details.
Table 33. PIXEL COLUMN CONFIGURATION
Column Address
Number
Type
0–5
6
Active
Border columns
6–2309
2304
Active
Active columns
2310–2315
6
Active
Border columns
Notes
Table 34. PIXEL ROW CONFIGURATION
Row Address
Number
Type
2–5
4
Active
Not used in case of “edge effects”
6–1549
1544
Active
Active rows
1550–1555
6
Active
Not used in case of “edge effects”
Notes
Readout Modes
Horizontal Mirror
When the horizontal_mirror bit (R0x3040[14]) is set in
the image_orientation register, the order of pixel readout
within a row is reversed, so that readout starts from
x_addr_end + 1and ends at x_addr_start. Figure 31 shows
a sequence of 6 pixels being read out with R0x3040[14] = 0
and R0x3040[14] = 1. Changing R0x3040[14] causes the
Bayer order of the output image to change; the new Bayer
order is reflected in the value of the pixel_order register.
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32
AR0330CM
LINE_VALID
Horizontal_mirror = 0
DOUT[11:0]
G0[11:0]
R0[11:0]
G1[11:0]
R1[11:0]
G2[11:0]
R2[11:0]
Horizontal_mirror = 1
DOUT[11:0]
G3[11:0]
R2[11:0]
G2[11:0]
R1[11:0]
G1[11:0]
R0[11:0]
Figure 31. Effect of Horizontal Mirror on Readout Order
Vertical Flip
When the vertical_flip bit (R0x3040[15]) is set in the
image_orientation register, the order in which pixel rows are
read out is reversed, so that row readout starts from
y_addr_end and ends at y_addr_start. Figure 32 shows
a sequence of 6 rows being read out with R0x3040[15] = 0
and R0x3040[15] = 1. Changing this bit causes the Bayer
order of the output image to change; the new Bayer order is
reflected in the value of the pixel_order register.
FRAME_VALID
Vertical_flip = 0
DOUT[11:0]
Row0[11:0]
Row1[11:0]
Row2[11:0]
Row3[11:0]
Row4[11:0]
Row5[11:0]
Vertical_flip = 1
DOUT[11:0]
Row6[11:0]
Row5[11:0]
Row4[11:0]
Row3[11:0]
Row2[11:0]
Row1[11:0]
Figure 32. Effect of Vertical Flip on Readout Order
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33
AR0330CM
SUBSAMPLING
The AR0330 supports subsampling. Subsampling allows
the sensor to read out a smaller set of active pixels by either
skipping or binning pixels within the readout window. The
Isb
working modes described in the data sheet that use
subsampling are configured to use either 2x2 or 3x3
subsampling.
Isb
Isb
Isb
Isb
Isb
Figure 33. Horizontal Binning in the AR0330 Sensor
Horizontal binning is achieved either in the pixel readout
or the digital readout. The sensor will sample the combined
2x or 3x adjacent pixels within the same color plane.
e−
e−
e−
e−
Figure 34. Vertical Row Binning in the AR0330 Sensor
read together. As well, that the sensor will read a Gr-R row
first followed by a B-Gb row.
Vertical row binning is applied in the pixel readout. Row
binning can be configured of 2x or 3x rows within the same
color plane. ON Semiconductor recommends not to use 3x
binning in AR0330 as it may introduce some image artifacts.
Pixel skipping can be configured up to 2x and 3x in both
the x-direction and y-direction. Skipping pixels in the
x-direction will not reduce the row time. Skipping pixels in
the y-direction will reduce the number of rows from the
sensor effectively reducing the frame time. Skipping will
introduce image artifacts from aliasing.
The sensor increments its x and y address based on the
x_odd_inc and y_odd_inc value. The value indicates the
addresses that are skipped after each pair of pixels or rows
has been read.
The sensor will increment x and y addresses in multiples
of 2. This indicates that a GreenR and Red pixel pair will be
x subsampling factor +
y subsampling factor +
1 ) x_odd_inc
2
1 ) y_odd_inc
2
(eq. 16)
(eq. 17)
A value of 1 is used for x_odd_inc and y_odd_inc when
no pixel subsampling is indicated. In this case, the sensor is
incrementing x and y addresses by 1 + 1 so that it reads
consecutive pixel and row pairs. To implement a 2x skip in
the x direction, the x_odd_inc is set to 3 so that the x address
increment is 1 + 3, meaning that sensor will skip every other
Gr-R pair.
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34
AR0330CM
Table 35. CONFIGURATION FOR HORIZONTAL SUBSAMPLING
x_odd_inc
Restrictions
No Subsampling
x_odd_inc = 1
Skip = (1+1) * 0.5 = 1x
The horizontal FOV must be programmed to meet the following rule:
Skip 2x
x_odd_inc = 3
Skip = (1+3) * 0.5 = 2x
Skip 3x
x_odd_inc = 5
Skip = (1+5) * 0.5 = 3x
Analog Bin 2x
x_odd_inc = 3
Skip = (1+3) * 0.5 = 2x
col_sf_bin_en = 1
Analog Bin 3x
x_odd_inc = 5
Skip = (1+5) * 0.5 = 3x
col_sf_bin_en = 1
Digital Bin 2x
x_odd_inc = 3
Skip = (1+3) * 0.5 =2x
col_bin =1
Digital Bin 3x
x_odd_inc = 5
Skip = (1+5) * 0.5 = 3x
col_bin = 1
x_addr_end * x_addr_start ) 1
+ even number
x_odd_inc
2
Table 36. CONFIGURATION FOR VERTICAL SUBSAMPLING
No Subsampling
Skip 2x
y_odd_inc
Restrictions
y_odd_inc = 1
Skip = (1+1) * 0.5 = 1x
row_bin = 0
The horizontal FOV must be programmed to meet the following rule:
y_addr_end * y_addr_start ) 1
y_odd_inc
y_odd_inc = 3
skip = (1+3) * 0.5 = 2x
row_bin = 0
Skip 3x
y_odd_inc = 5
skip = (1+5) * 0.5 = 3x
row_bin = 0
Analog Bin 2x
y_odd_inc = 3
skip = (1+3) * 0.5 = 2x
row_bin = 1
Analog Bin 3x
y_odd_inc = 5
skip = (1+5) * 0.5 = 3x
row_bin = 1
2
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35
+ even number
AR0330CM
SENSOR FRAME RATE
The time required to read out an image frame (TFRAME)
can be derived from the number of clocks required to output
each image and the pixel clock.
The frame-rate is the inverse of the frame period.
fps +
1
T FRAME
Row Period (TROW)
The line_length_pck will determine the number of clock
periods per row and the row period (TROW) when combined
with the sensor readout clock. The line_length_pck includes
both the active pixels and the horizontal blanking time per
row. The sensor utilizes two readout paths, as seen in
Figure 18, allowing the sensor to output two pixels during
each pixel clock.
The minimum line_length_pck is defined as the
maximum of the following three equations:
ADC Readout Limitation:
(eq. 18)
The number of clocks can be simplified further into the
following parameters:
• The number of clocks required for each sensor row
(line_length_pck) This parameter also determines the
sensor row period when referenced to the sensor
readout clock.
(TROW = line_length_pck × 1/CLK_PIX)
• The number of row periods per frame
(frame_length_lines)
• An extra delay between frames used to achieve
a specific output frame period (extra_delay)
1
CLK_PIX
or
Options to modify this limit, as mentioned in the
“Sequencer” section, can be found in the AR0330 Developer
Guide.
Digital Readout Limitation:
1
3
(eq. 19)
(frame_length_lines
line_length_pck ) extra_delay)
Vertical Blanking (VB)
Active Rows
Active Columns
Horizontal
Blanking
(HB)
(eq. 20)
1116 (ADC_HIGH_SPEED) + 1(0)
* x_addr_start
ǒx_addr_end
Ǔ
(x_odd_inc ) 1)
0.5
(eq. 21)
Output Interface Limitations:
1
2
frame_length_lines = Active Rows + VB
T FRAME +
1024 (ADC_HIGH_SPEED) + 0
* x_addr_start
ǒx_addr_end
Ǔ ) 96
(x_odd_inc ) 1)
0.5
(eq. 22)
Row Periods per Frame
The frame_length_lines determines the number of row
periods (TROW) per frame. This includes both the active and
blanking rows. The minimum_vertical_blanking value is
defined by the number of OB rows read per frame, two
embedded data rows, and two blank rows.
Minimum frame_length_lines +
extra_delay
y_addr_end * y_addr_start
y_odd_inc)1
2
)
(eq. 23)
) minimum_vertical_blanking
line_length_pck = Active Columns + HB
The sensor is configured to output frame information in
two embedded data rows by setting R0x3064[8] to 1
(default). If R0x3064[8] is set to 0, the sensor will instead
output two blank rows. The data configured in the two
embedded rows is defined in MIPI CSI−2 Specification
V1.00.
Figure 35. Frame Period Measured in Clocks
Table 37. MINIMUM VERTICAL BLANKING CONFIGURATION
R0x3180[0x00F0]
OB Rows
minimum_vertical_blanking
0x8 (Default)
8 OB Rows
8 OB + 4 = 12
0x4
4 OB Rows
4 OB + 4 = 8
0x2
2 OB Rows
2 OB + 4 = 6
The locations of the OB rows, embedded rows, and blank
rows within the frame readout are identified in Figure 36.
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36
AR0330CM
SLAVE MODE
The slave mode feature of the AR0330 supports triggering
the start of a frame readout from a VD signal that is supplied
from an external ASIC. The slave mode signal allows for
precise control of frame rate and register change updates.
VD Signal
Start of frame N
Time
Frame Valid
The VD signal is input to the trigger pin. Both the GPI_EN
(R0x301A[8]) and the SLAVE_MODE (R0x30CE[4]) bits
must be set to “1” to enable the slave mode.
OB Rows (2, 4, or 8 rows)
Embedded Data Row (2 rows)
Active Data Rows
Blank Rows (2 rows)
Extra Vertical Blanking
(frame_length_lines − min_frame_length_lines)
Extra Delay (clocks)
The period between the
rising edge of the VD signal
and the slave mode ready
state is TFRAME = 16 clocks.
Slave Mode Active State
End of frame N
Start of frame N + 1
Figure 36. Slave Mode Active State and Vertical Blanking
slave mode will remain inactive for the period of one frame
time minus 16 clock periods (TFRAME − (16 / CLK_PIX)).
After this period, the slave mode will re-enter the active state
and will respond to the VD signal.
If the slave mode is disabled, the new frame will begin
after the extra delay period is finished.
The slave mode will react to the rising edge of the input
VD signal if it is in an active state. When the VD signal is
received, the sensor will begin the frame readout and the
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37
AR0330CM
Frame
Valid
Rising
Edge
Rising
Edge
Rising
Edge
VD Signal
Slave Mode
Trigger
Inactive
Active
Inactive
Active
Row reset and read
operations begin
after the rising edge
of the VD signal.
Rising edge of VD
signal triggers the start
of the frame readout.
Row Reset
(start of integration)
Row Readout
Programmed Integration
Row 0
Integration due to
Slave Mode Delay
Row N
The Slave Mode will become “Active” after the last row period.
Both the row reset and row read operations will wait until the rising edge of the VD signal.
Figure 37. Slave Mode Example with Equal Integration and Frame Readout Periods
(The integration of the last row is therefore started before the end of the programmed integration for the first row)
2. If the sensor integration time is configured to be
less than the frame period, then the sensor will not
have reset all of the sensor rows before it begins
waiting for the input VD signal. This error can be
minimized by configuring the frame period to be
as close as possible to the desired frame rate
(period between VD signals).
The row shutter and read operations will stop when the
slave mode becomes active and is waiting for the VD signal.
The following should be considered when configuring the
sensor to use the slave mode:
1. The frame period (TFRAME) should be configured
to be less than the period of the input VD signal.
The sensor will disregard the input VD signal if it
appears before the frame readout is finished.
Frame
Valid
Rising
Edge
Rising
Edge
Rising
Edge
VD Signal
Slave Mode
Trigger
Inactive
8.33 ms 8.33 ms
Row0
Active
Inactive
Active
Row reset and read
operations begin after
the rising edge of the
Vd signal.
Row Reset
(start of integration)
Row Readout
Programmed Integration
Integration due to
Slave Mode Delay
Row N
Reset operation is held during slave mode “Active” state.
Figure 38. Slave Mode Example where the Integration Period is Half of the Frame Readout Period
(The sensor read pointer will have paused at row 0 while the shutter pointer pauses at row N/2. The extra integration caused
by the slave mode delay will only be seen by rows 0 to N/2. The example below is for a frame readout period of 16.6ms while
the integration time is configured to 8.33 ms)
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38
AR0330CM
To avoid uneven exposure, programmed integration time
cannot be larger than VD period. To increase integration
time more than current VD period, the AR0330 must be
configured to work at a lower frame rate and read out image
with new VD to match the new timing.
The period between slave mode pulses must also be
greater than the frame period. If the rising edge of the VD
pulse arrives while the slave mode is inactive, the VD pulse
will be ignored and will wait until the next VD pulse has
arrived.
When the slave mode becomes active, the sensor will
pause both row read and row reset operations.
NOTE: The row integration period is defined as the
period from row reset to row read.
When the AR0330 is working in slave mode, the external
trigger signal VD must have accurately controlled timing to
avoid uneven exposure in the output image. The VD timing
control should make the slave mode “wait period” less than
32 pixel clocks.
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39
AR0330CM
FRAME READOUT
The sensor readout begins with vertical blanking rows
followed by the active rows. The frame readout period can
be defined by the number of row periods within a frame
(frame_length_lines) and the row period (line_length_pck).
1/60s
1/60s
Row Reset
The sensor will read the first vertical blanking row at the
beginning of the frame period and the last active row at the
end of the row period.
Row Read
Row Reset
Row Read
Vertical Blanking
Active Rows
Time
Row Reset
Row Read
Row Reset
Row Read
End of Frame
Readout
VB
(12 Rows)
Serial SYNC Codes
Start of Vertical Blanking
Start of Frame
Start of Active Row
End of Line
HB (192 Pixels/Column)
2304 x 1296
VB
(12 Rows)
End of Frame
Readout
HB (192 Pixels/Column)
2304 x 1296
End of Frame
Frame Valid
Line Valid
Figure 39. Example of the Sensor Output of a 2304 y 1296 Frame at 60 fps
(The frame valid and line valid signals mentioned in this diagram represent internal signals within the sensor.
The SYNC codes represented in this diagram represent the HiSPi Streaming SP protocol)
Frame 39 aligns the frame integration and readout
operation to the sensor output. It also shows the sensor
output using the HiSPi Streaming SP protocol. Different
sensor protocols will list different SYNC codes.
Table 38. SERIAL SYNC CODES INCLUDED WITH EACH PROTOCOL INCLUDED WITH THE AR0330 SENSOR
Interface/Protocol
Parallel
Start of Vertical
Blanking Row
(SOV)
Start of Frame
(SOF)
Start of Active Line
(SOA)
End of Line
(EOL)
End of Frame
(EOF)
Parallel Interface Uses FRAME VALID (FV) and LINE VALID (LV) Outputs to Denote Start and End of Line and
Frame.
HiSPi Streaming S
Yes
Send SOV
Yes
No SYNC Code
No SYNC Code
HiSPi Streaming SP
Yes
Yes
Yes
Yes
Yes
HiSPi Packetized SP
No SYNC Code
Yes
Yes
Yes
Yes
MIPI
No SYNC Code
Yes
Yes
Yes
Yes
2304 × 1296 frame rate from 60 fps to 30 fps without
increasing the delay between the readout of the first and last
active row.
Figure 40 illustrates how the sensor active readout time
can be minimized while reducing the frame rate. 1308 VB
rows were added to the output frame to reduce the
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40
AR0330CM
1/30s
1/30s
Row Reset
Row Read
Row Reset
Row Read
Vertical Blanking
Active Rows
Row Reset
Time
Row Read
Row Reset
Row Read
End of Frame
Readout
End of Frame
Readout
Serial SYNC Codes
Start of Vertical Blanking
Start of Frame
Start of Active Row
End of Line
VB
(1320 Rows)
2304 x 1296
HB (192 Pixels)
End of Frame
VB
(1320 Rows)
2304 x 1296
HB (192 Pixels)
Frame Valid
Line Valid
Figure 40. Example of the Sensor Output of a 2304 y 1296 Frame at 30 fps
(The frame valid and line valid signals mentioned in this diagram represent internal signals within the sensor.
The SYNC codes represented in this diagram represent the HiSPi Streaming SP protocol)
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41
AR0330CM
CHANGING SENSOR MODES
Register Changes
bit in R0x30B0[13]. When the context switch is configured
to context A the sensor will reference the “Context A
Registers”. If the context switch is changed from A to B
during the readout of frame n, the sensor will then reference
the context B coarse_integration_time registers in frame
n+1 and all other context B registers at the beginning of
reading frame n+2. The sensor will show the same behavior
when changing from context B to context A.
All register writes are delayed by 1x frame. A register that
is written to during the readout of frame n will not be updated
to the new value until the readout of frame n+2. This
includes writes to the sensor gain and integration registers.
Real-Time Context Switching
In the AR0330, the user may switch between two full
register sets A and B by writing to a context switch change
Table 39. LIST OF CONFIGURABLE REGISTERS FOR CONTEXT A AND CONTEXT B
Context A
Register Description
Coarse_integration_time
Context B
Address
Register Description
Address
0x3012
Coarse_integration_time_CB
0x3016
Fine_integration_time
0x3014
Fine_integration_time_CB
0x3018
Line_length_pck
0x300C
Line_length_pck_CB
0x303E
Frame_length_lines
0x300A
Frame_length_lines_CB
0x30AA
COL_SF_BIN_EN
0x3040[9]
COL_SF_BIN_EN_CB
0x3040[8]
ROW_BIN
0x3040[12]
ROW_BIN_CB
0x3040[10]
COL_BIN
0x3040[13]
COL_BIN_CB
0x3040[11]
FINE_GAIN
0x3060[3:0]
FINE_GAIN_CB
COARSE_GAIN
0x3060[5:4]
COARSE_GAIN_CB
0x3060[11:8]
0x3060[13:12]
x_addr_start
0x3004
x_addr_start_CB
0x308A
y_addr_start
0x3002
y_addr_start_CB
0x308C
x_addr_end
0x3008
x_addr_end_CB
0x308E
y_addr_end
0x3006
y_addr_end_CB
0x3090
Y_odd_inc
0x30A6
Y_odd_inc_CB
0x30A8
0x30A2
X_odd_inc_CB
X_odd_inc
ADC_HIGH_SPEED
0x30BA[6]
ADC_HIGH_SPEED_CB
0x30AE
0x30BA[7]
GREEN1_GAIN
0x3056
GREEN1_GAIN_CB
0x30BC
BLUE_GAIN
0x3058
BLUE_GAIN_CB
0x30BE
RED_GAIN
0x305A
RED_GAIN_CB
0x30C0
GREEN2_GAIN
0x305C
GREEN2_GAIN_CB
0x30C2
GLOBAL_GAIN
0x305E
GLOBAL_GAIN_CB
0x30C4
NOTE:
ON Semiconductor recommends leaving fine_integration_time at 0.
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42
AR0330CM
1/60s
1/60s
1/54s
Vertical Blanking
Active Rows
Start of Frame
Start of Active Row
End of Line
End of Frame
HB (192 Pixels/Column)
2304 x 1296
Frame N
VB
(12 Rows)
Serial SYNC Codes
Start of Vertical Blanking
VB
(12 Rows)
End of Frame
Readout
HB (192 Pixels/Column)
2304 x 1296
Frame N+1
Integration time of context
B mode implemented
during readout of frame
N+1
Write context A to B
during readout of Frame N
End of Frame
Readout
VB
(12 Rows)
Time
HB (192 Pixels/Column)
2048 x 1536
Frame N+2
Context B mode is
implemented in frame N+2
Figure 41. Example of Changing the Sensor from Context A to Context B
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43
End of Frame
Readout
AR0330CM
COMPRESSION
The sensor can optionally compress 12-bit data to 10-bit
using A-law compression. The compression is applied after
the data pedestal has been added to the data. See Figure 1.
The A-law compression is disabled by default and can be
enabled by setting R0x31D0 from “0” to “1”.
Table 40. A-LAW COMPRESSION TABLE FOR 12−10 BITS
Input Values
Compressed Codeword
Input Range
11
10
9
8
7
6
5
4
3
2
1
0
9
8
7
6
5
4
3
2
1
0
0 to 127
0
0
0
0
0
a
b
c
d
e
f
g
0
0
0
a
b
c
d
e
f
g
128 to 255
0
0
0
0
1
a
b
c
d
e
f
g
0
0
1
a
b
c
d
e
f
g
256 to 511
0
0
0
1
a
b
c
d
e
f
g
X
0
1
0
a
b
c
d
e
f
g
512 to 1023
0
0
1
a
b
c
d
e
f
g
X
X
0
1
1
a
b
c
d
e
f
g
1024 to 2047
0
1
a
b
c
d
e
f
g
h
X
X
1
0
a
b
c
d
e
f
g
h
2048 to 4095
1
a
b
c
d
e
f
g
h
X
X
X
1
1
a
b
c
d
e
f
g
h
TEST PATTERNS
The AR0330 has the capability of injecting a number of
test patterns into the top of the datapath to debug the digital
logic. With one of the test patterns activated, any of the
datapath functions can be enabled to exercise it in
a deterministic fashion. Test patterns are selected by
Test_Pattern_Mode register (R0x3070). Only one of the test
patterns can be enabled at a given point in time by setting the
Test_Pattern_Mode register according to Table 41. When
test patterns are enabled the active area will receive the value
specified by the selected test pattern and the dark pixels will
receive the value in Test_Pattern_Green (R0x3074 and
R0x3078) for green pixels, Test_Pattern_Blue (R0x3076)
for blue pixels, and Test_Pattern_Red (R0x3072) for red
pixels.
Table 41. TEST PATTERN MODES
Test_Pattern_Mode
Test Pattern Output
0
No Test Pattern (Normal Operation)
1
Solid Color
2
100% Vertical Color Bars
3
Fade-to-Gray Vertical Color Bars
256
Walking 1s Test Pattern (12-bit)
Solid Color
When the color field mode is selected, the value for each
pixel is determined by its color. Green pixels will receive the
value in Test_Pattern_Green, red pixels will receive the
value in Test_Pattern_Red, and blue pixels will receive the
value in Test_Pattern_Blue.
Vertical Color Bars
When the vertical color bars mode is selected, a typical
color bar pattern will be sent through the digital pipeline.
Walking 1s
When the walking 1s mode is selected, a walking 1s
pattern will be sent through the digital pipeline. The first
value in each row is 1.
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44
AR0330CM
TWO-WIRE SERIAL REGISTER INTERFACE
The two-wire serial interface bus enables read/write
access to control and status registers within the AR0330.
This interface is designed to be compatible with the
electrical characteristics and transfer protocols of the I2C
specification.
The interface protocol uses a master/slave model in which
a master controls one or more slave devices. The sensor acts
as a slave device. The master generates a clock (SCLK) that
is an input to the sensor and is used to synchronize transfers.
Data is transferred between the master and the slave on
a bidirectional signal (SDATA). SDATA is pulled up to
VDD_IO off-chip by a 1.5 kW resistor. Either the slave or
master device can drive SDATA LOW − the interface protocol
determines which device is allowed to drive SDATA at any
given time.
The protocols described in the two-wire serial interface
specification allow the slave device to drive SCLK LOW; the
AR0330 uses SCLK as an input only and therefore never
drives it LOW.
[0] indicates a WRITE, and a “1” indicates a READ. The
default slave addresses used by the AR0330 sensor are 0x20
(write address) and 0x21 (read address). Alternate slave
addresses of 0x30 (WRITE address) and 0x31 (READ
address) can be selected by asserting the SADDR signal (tie
HIGH).
Alternate slave addresses can also be programmed
through R0x31FC.
Message Byte
Message bytes are used for sending register addresses and
register write data to the slave device and for retrieving
register read data.
Acknowledge Bit
Each 8-bit data transfer is followed by an acknowledge bit
or a no-acknowledge bit in the SCLK clock period following
the data transfer. The transmitter (which is the master when
writing, or the slave when reading) releases SDATA. The
receiver indicates an acknowledge bit by driving SDATA
LOW. As for data transfers, SDATA can change when SCLK
is LOW and must be stable while SCLK is HIGH.
Protocol
No-Acknowledge Bit
The no-acknowledge bit is generated when the receiver
does not drive SDATA LOW during the SCLK clock period
following a data transfer. A no-acknowledge bit is used to
terminate a read sequence.
Data transfers on the two-wire serial interface bus are
performed by a sequence of low-level protocol elements:
1. a (repeated) start condition
2. a slave address/data direction byte
3. an (a no-) acknowledge bit
4. a message byte
5. a stop condition
Typical Sequence
A typical READ or WRITE sequence begins by the
master generating a start condition on the bus. After the start
condition, the master sends the 8-bit slave address/data
direction byte. The last bit indicates whether the request is
for a read or a write, where a “0” indicates a write and a “1”
indicates a read. If the address matches the address of the
slave device, the slave device acknowledges receipt of the
address by generating an acknowledge bit on the bus.
If the request was a WRITE, the master then transfers the
16-bit register address to which the WRITE should take
place. This transfer takes place as two 8-bit sequences and
the slave sends an acknowledge bit after each sequence to
indicate that the byte has been received. The master then
transfers the data as an 8-bit sequence; the slave sends an
acknowledge bit at the end of the sequence. The master stops
writing by generating a (re)start or stop condition.
If the request was a READ, the master sends the 8-bit write
slave address/data direction byte and 16-bit register address,
the same way as with a WRITE request. The master then
generates a (re)start condition and the 8-bit read slave
address/data direction byte, and clocks out the register data,
eight bits at a time. The master generates an acknowledge bit
after each 8-bit transfer. The slave’s internal register address
is automatically incremented after every 8 bits are
transferred. The data transfer is stopped when the master
sends a no-acknowledge bit.
The bus is idle when both SCLK and SDATA are HIGH.
Control of the bus is initiated with a start condition, and the
bus is released with a stop condition. Only the master can
generate the start and stop conditions.
Start Condition
A start condition is defined as a HIGH-to-LOW transition
on SDATA while SCLK is HIGH. At the end of a transfer, the
master can generate a start condition without previously
generating a stop condition; this is known as a “repeated
start” or “restart” condition.
Stop Condition
A stop condition is defined as a LOW-to-HIGH transition
on SDATA while SCLK is HIGH.
Data Transfer
Data is transferred serially, 8 bits at a time, with the MSB
transmitted first. Each byte of data is followed by an
acknowledge bit or a no-acknowledge bit. This data transfer
mechanism is used for both the slave address/data direction
byte and for message bytes.
One data bit is transferred during each SCLK clock period.
SDATA can change when SCLK is LOW and must be stable
while SCLK is HIGH.
Slave Address/Data Direction Byte
Bits [7:1] of this byte represent the device slave address
and bit [0] indicates the data transfer direction. A “0” in bit
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45
AR0330CM
Single READ From Random Location
This sequence (Figure 42) starts with a dummy WRITE to
the 16-bit address that is to be used for the READ. The
master terminates the WRITE by generating a restart
condition. The master then sends the 8-bit read slave
address/data direction byte and clocks out one byte of
register data. The master terminates the READ by
generating a no-acknowledge bit followed by a stop
condition. Figure 42 shows how the internal register address
maintained by the AR0330 is loaded and incremented as the
sequence proceeds.
Previous Reg Address, N
S
Slave
Address
0 A
S = Start Condition
P = Stop Condition
Sr = Restart Condition
A = Acknowledge
A = No-acknowledge
Reg
Address[15:8]
Reg Address, M
Reg
Address[7:0]
A
A Sr
1 A
Slave Address
M+1
A
Read Data
P
Slave to Master
Master to Slave
Figure 42. Single READ from Random Location
Single READ From Current Location
The master terminates the READ by generating
a no-acknowledge bit followed by a stop condition. The
figure shows two independent READ sequences.
This sequence (Figure 43) performs a read using the
current value of the AR0330 internal register address.
Previous Reg Address, N
S
Slave Address
1 A
Reg Address, N+1
A P
Read Data
S
Slave Address
1 A
N+2
Read Data
A P
Figure 43. Single READ from Current Location
Sequential READ, Start From Random Location
This sequence (Figure 44) starts in the same way as the
single READ from random location (Figure 42). Instead of
generating a no-acknowledge bit after the first byte of data
has been transferred, the master generates an acknowledge
bit and continues to perform byte READs until “L” bytes
have been read.
Previous Reg Address, N
S
Slave Address
0 A Reg Address[15:8]
M+1
Read Data
A Reg Address[7:0]
M+2
A
Read Data
Reg Address, M
M+3
A Sr
Slave Address
M+L−2
A
Read Data
1 A
M+L−1
A
Read Data
Figure 44. Sequential READ, Start from Random Location
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46
M+1
Read Data
M+L
A P
A
AR0330CM
Sequential READ, Start From Current Location
This sequence (Figure 45) starts in the same way as the
single READ from current location (Figure 43). Instead of
generating a no-acknowledge bit after the first byte of data
Previous Reg Address, N
S Slave Address 1 A
has been transferred, the master generates an acknowledge
bit and continues to perform byte READs until “L” bytes
have been read.
N+1
Read Data
A
N+2
Read Data
A
N+L−1
Read Data
A
N+L
Read Data
A
P
Figure 45. Sequential READ, Start from Current Location
Single WRITE to Random Location
then LOW bytes of the register address that is to be written.
The master follows this with the byte of write data. The
WRITE is terminated by the master generating a stop
condition.
This sequence (Figure 46) begins with the master
generating a start condition. The slave address/data
direction byte signals a WRITE and is followed by the HIGH
Previous Reg Address, N
S
Slave Address
0 A
Reg Address[15:8]
Reg Address, M
A
A
Reg Address[7:0]
M+1
A
A
Write Data
P
Figure 46. Single WRITE to Random Location
Sequential WRITE, Start at Random Location
This sequence (Figure 47) starts in the same way as the
single WRITE to random location (Figure 46). Instead of
generating a stop condition after the first byte of data has
been transferred, the master continues to perform byte
WRITEs until “L” bytes have been written. The WRITE is
terminated by the master generating a stop condition.
Previous Reg Address, N
S
Slave Address
0 A
M+1
Write Data
Reg Address[15:8]
A
M+2
A
Write Data
Reg Address, M
Reg Address[7:0]
M+3
A
Write Data
M+L−2
A
Write Data
47
A
M+L−1
A
Figure 47. Sequential WRITE, Start at Random Location
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M+1
Write Data
M+L
A
A
P
AR0330CM
SPECTRAL CHARACTERISTICS
70
Red
Green
Blue
60
Quantum Efficiency (%)
50
40
30
20
10
0
350
400
450
500
550
600
650
700
750
800
850
900
950 1000 1050 1100 1150
Wavelength (nm)
Figure 48. Bare Die Quantum Efficiency
CRA vs. Image Height Plot
0
0
0
5
0.152
0.80
19
10
0.305
1.66
18
15
0.457
2.54
20
0.609
3.42
15
25
0.761
4.28
14
30
0.914
5.11
13
35
1.066
5.94
11
40
1.218
6.75
10
45
1.371
7.57
9
50
1.523
8.37
7
55
1.675
9.16
6
60
1.828
9.90
5
65
1.980
10.58
70
2.132
11.15
2
75
2.284
11.57
1
80
2.437
11.80
0
85
2.589
11.78
90
2.741
11.48
95
2.894
10.88
100
3.046
9.96
17
16
Chief Ray Angle (Degrees)
CRA
(deg)
(mm)
20
AR0330 CRA Characteristic
12
8
4
3
0
10
20
30
40
50
60
70
80
90
100
Image Height (%)
NOTE:
Image Height
(%)
110
The CRA listed in the advanced data sheet described the 2048 × 1536 field of view (2.908 mm image height). This information was
sufficient for configuring the sensor to read both the 4:3 (2048 × 1536) and 16:9 (2304 × 1296) aspect ratios. The CRA information
listed in the data sheet has now been updated to represent the entire pixel array (2304 × 1536).
Figure 49. Chief Ray Angle (CRA) − 125
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48
AR0330CM
CRA vs. Image Height Plot
0
0
0
5
0.152
1.10
28
10
0.305
2.20
26
15
0.457
3.30
20
0.609
4.40
25
0.761
5.50
30
0.914
6.60
35
1.066
7.70
40
1.218
8.80
45
1.371
9.90
50
1.523
11.00
55
1.675
12.10
60
1.828
13.20
65
1.980
14.30
70
2.132
15.40
75
2.284
16.50
80
2.437
17.60
85
2.589
18.70
90
2.741
19.80
95
2.894
20.90
100
3.046
22.00
24
Chief Ray Angle (Degrees)
CRA
(deg)
(mm)
30
AR0330 CRA Characteristic
22
20
18
16
14
12
10
8
6
4
2
0
0
10
20
30
40
50
60
70
80
90
100
110
Image Height (%)
NOTE:
Image Height
(%)
The CRA listed in the advanced data sheet described the 2048 × 1536 field of view (2.908 mm image height). This information was
sufficient for configuring the sensor to read both the 4:3 (2048 × 1536) and 16:9 (2304 × 1296) aspect ratios. The CRA information
listed in the data sheet has now been updated to represent the entire pixel array (2304 × 1536).
Figure 50. Chief Ray Angle (CRA) − 215
CRA vs. Image Height Plot
0
0
0
5
0.152
2.24
28
10
0.305
4.50
26
15
0.457
6.75
20
0.609
8.95
25
0.761
11.11
30
0.914
13.19
35
1.066
15.20
40
1.218
17.10
45
1.371
18.88
50
1.523
20.50
55
1.675
21.95
60
1.828
23.18
65
1.980
24.17
70
2.132
24.89
75
2.284
25.35
80
2.437
25.54
85
2.589
25.51
90
2.741
25.33
95
2.894
25.11
100
3.046
25.01
24
Chief Ray Angle (Degrees)
CRA
(deg)
(mm)
30
AR0330 CRA Characteristic
22
20
18
16
14
12
10
8
6
4
2
0
0
10
20
30
40
50
60
70
80
90
100
Image Height (%)
NOTE:
Image Height
(%)
110
The CRA listed in the advanced data sheet described the 2048 × 1536 field of view (2.908 mm image height). This information was
sufficient for configuring the sensor to read both the 4:3 (2048 × 1536) and 16:9 (2304 × 1296) aspect ratios. The CRA information
listed in the data sheet has now been updated to represent the entire pixel array (2304 × 1536).
Figure 51. Chief Ray Angle (CRA) − 255
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49
AR0330CM
Read the Sensor CRA
Follow the steps below to obtain the CRA value of the
Image Sensor:
1. Set the register bit field R0x301A[5] = 1.
2. Read the register bit fields R0x31FA[11:9].
3. Determine the CRA value according to Table 42.
Table 42. CRA VALUE
Binary Value of
R0x31FA[11:9]
CRA Value
000
0
001
21
010
25
011
12
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50
AR0330CM
PACKAGES
The AR0330 comes in two packages:
• CLCC Package
• CSP HiSPi/MIPI Package
PACKAGE DIMENSIONS
CLCC48
CASE 848AU
ISSUE O
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51
AR0330CM
PACKAGE DIMENSIONS
ODCSP64
CASE 570BH
ISSUE O
2
3
4
A
5
6
7
S1
8
8
J1
7
65
4
3
21
S2
1
First clear pixel(−1987.5,2776.5)
A
J2
A
B
B
C
C
Package Center=Die Center(0,0)
D
B
D
Package Center=Die Center(0,0)
Optical center(−290,230)
E
Optical center(290,230)
F
E
E
E
F
G
G
Last clear pixel(1407.5,−2316.5)
H
H
Notch
Bottom View (BGA side)
Unit:um
Package Size:6278.15*6648.15
Ball diameter:250
Ball pitch:650
C
C3
C2
C1
C4
Top View (Image side)
Cross−section View (E−E)
Table 43. CSP (MIPI/HISPI) PACKAGE DIMENSIONS
Nom
Parameter
Min
Max
Nom
Millimeters
Symbol
Min
Max
Inches
Package Body Dimension X
A
6.278
6.253
6.303
0.247
0.246
0.248
Package Body Dimension Y
B
6.648
6.623
6.673
0.262
0.261
0.263
Package Height
C
0.700
0.645
0.745
0.028
0.025
0.029
Cavity Height (Glass to Pixel Distance)
C4
0.041
0.037
0.045
0.002
0.001
0.002
Glass Thickness
C3
0.400
0.390
0.410
0.016
0.015
0.016
Package Body Thickness
C2
0.570
0.535
0.605
0.022
0.021
0.024
Ball Height
C1
0.130
0.100
0.160
0.005
0.004
0.006
Ball Diameter
D
0.250
0.220
0.280
0.010
0.009
0.011
Total Ball Count
N
64
Ball Count X Axis
N1
8
Ball Count Y Axis
N2
8
UBM
U
0.280
0.270
0.290
0.011
0.011
0.011
Pins Pitch X Axis
J1
0.650
0.026
Pins Pitch Y Axis
J2
0.650
0.026
BGA Ball Center to Package Center Offset in X-direction
X
0.000
−0.025
0.025
0.000
−0.001
0.001
BGA Ball Center to Package Center Offset in Y-direction
Y
0.000
−0.025
0.025
0.000
−0.001
0.001
BGA Ball Center to Chip Center Offset in X-direction
X1
0.000
−0.014
0.014
0.000
−0.001
0.001
BGA Ball Center to Chip Center Offset in Y-direction
Y1
0.000
−0.014
0.014
0.000
−0.001
0.001
Edge to Ball Center Distance along X
S1
0.864
0.834
0.894
0.034
0.033
0.035
Edge to Ball Center Distance along Y
S2
1.049
1.019
1.079
0.041
0.040
0.042
www.onsemi.com
52
AR0330CM
PACKAGE ORIENTATION IN CAMERA DESIGN
In a camera design, the package should be placed in a PCB
so that the first clear pixel is located at the bottom left of the
package (look at the package). This orientation will ensure
that the image captured using a lens will be oriented
correctly.
Lens
The package is oriented so
that the first clear pixel is
located in bottom left.
Figure 52. Image Orientation with Relation to Camera Lens
The package pin locations after the sensor has been
oriented correctly can be shown below.
CSP Package
CLCC Package
1−−−−−−−−−−−−8
(0,0)
(2304,1536)
(2304,1536)
Pixel Array
First Clear
Pixel
First Clear
Pixel
(0,0)
A −−−−−−−−−−−−−−−H
48 1
Pin Orientation
Figure 53. First Clear Pixel and Pin Location
(Looking Down on Cover Glass)
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AR0330CM/D