DS485 www.ti.com SNLS122C – JULY 1998 – REVISED APRIL 2013 DS485 Low Power RS-485/RS-422 Multipoint Transceiver Check for Samples: DS485 FEATURES DESCRIPTION • • • • The DS485 is a low-power transceiver for RS-485 and RS-422 communication. The device contains one driver and one receiver. The drivers slew rate allows for operation up to 2.5 Mbps (see Applications Information section). 1 • • • • • • • • Meets TIA/EIA RS-485 Multipoint Standard ensured Full Load Output Voltage (V OD3) Low Quiescent Current: 200 μA typ −7V to +12V Common-Mode Input Voltage Range TRI-STATE Outputs on Driver and Receiver AC Performance: – Driver Transition Time: 25 ns typ – Driver Propagation Delay: 40 ns typ – Driver Skew: 1 ns typ – Receiver Propagation Delay: 200 ns typ – Receiver Skew: 20 ns typ Half-Duplex Flow Through Pinout Operates From a Single 5V Supply Allows Up To 32 Transceivers on the Bus Current-Limiting and Thermal Shutdown For Driver Overload Protection Industrial Temperature Range Operation Pin and Functional Compatible With MAX485 and LTC485 The transceiver draws 200 μA of supply current when unloaded or fully loaded with the driver disabled and operates from a single +5V supply. The driver is short-circuit current limited and is protected against excessive power dissipation by thermal shutdown circuitry that places the driver outputs into TRI-STATE (High Impedance state) under fault conditions. The driver ensures a minimum of 1.5V differential output voltage with maximum loading across the common mode range (VOD3). The receiver has a failsafe feature that ensures a logic-high output if the input is open circuit. The DS485 is available in 8-pin SOIC and PDIP packages and is characterized for Industrial and Commercial temperature range operation. TRUTH TABLE Connection and Logic Diagram DRIVER SECTION RE* DE DI A B X H H H L X H L L H X L X Z Z RECEIVER SECTION Figure 1. 8-Pin SOIC or PDIP See D or P Package (1) RE* DE A-B RO L L ≥+0.2V H L L ≤−0.2V L H X X Z L L OPEN* (1) H Non Terminated, Open Input only X = indeterminate Z = TRI-STATE 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated DS485 SNLS122C – JULY 1998 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) Supply Voltage (VCC) +12V Enable Input Voltage (RE*, DE) −0.5V to (VCC + 0.5V) Driver Input Voltage (DI) −0.5V to (VCC + 0.5V) −14V to +14V Driver Output Voltage (A, B) −14V to +14V Receiver Input Voltage (A, B) −0.5V to (VCC + 0.5V) Receiver Output Voltage (RO) Maximum Package Power Dissipation @ +25°C SOIC Package 1.19W PDIP Package 0.74W SOIC Package 0.76W Derate SOIC Package 9.5 mW/°C above +25°C Derate PDIP Package 6.0 mW/°C above +25°C Maximum Package Power Dissipation @ +70°C PDIP Package 0.47W −65°C to +150°C Storage Temperature Range Lead Temperature Range Soldering, 4 sec +260°C ≥2 kV ESD (HBM) (1) (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the devices should be operated at these limits. The table of ELECTRICAL CHARACTERISTICS specifies conditions of device operation. RECOMMENDED OPERATING CONDITIONS Supply Voltage (VCC) Operating Free Air Temperature (TA) DS485 DS485T Typ Max Units +5.0 +5.25 V 0 +25 +70 °C −40 +25 +85 °C +12 V −7 Bus Common Mode Voltage 2 Min +4.75 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS485 DS485 www.ti.com SNLS122C – JULY 1998 – REVISED APRIL 2013 ELECTRICAL CHARACTERISTICS Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified (1) (2) Symbol Parameter Conditions Pin Min Typ Units 5 V VOD1 Differential Driver Output Voltage (No Load) VOD2 Differential Driver Output Voltage with Load RL = 50Ω, (RS422), See Figure 2 2 2.8 RL = 27Ω, (RS485), See Figure 2 1.5 2.3 ΔVOD Change in Magnitude of Output Differential Voltage RL = 27Ω or 50Ω (3) VOD3 Differential Driver Output Voltage— Full Load with Max VCM R1 = 54Ω, R2 = 375Ω VTEST = −7V to +12V, See Figure 6 VOC Driver Common-Mode Output Voltage RL = 27Ω or 50Ω, See Figure 2 ΔVOC Change in Magnitude of Common-Mode Output Voltage RL = 27Ω or 50Ω, See Figure 2 (3) VIH Input High Voltage VIL Input Low Voltage IIN1 Input Current VIN = 0V or VCC IIN2 Input Current (4) DE = 0V, VCC = 0V or 5.25V VIN = +12V VTH Receiver Differential Threshold Voltage −7V ≤ VCM ≤ +12V ΔVTH Receiver Input Hysteresis VCM = 0V VOH Receiver Output High Voltage IO = −4 mA, VID = 0.2V VOL Receiver Output Low Voltage IO = 4 mA, VID = −0.2V 0.4 V IOZR TRI-STATE Output Current at Receiver 0.4V ≤ VO ≤ 2.4V ±1 μA RIN Receiver Input Resistance −7V ≤ VIN ≤ +12V A, B ICC (5) DE = VCC, RE* = 0V or VCC VCC No-Load Supply Current A, B Max 1.5 DI, DE, RE* Driver Short Circuit Current, VO = HIGH −7V ≤ VO ≤ +12V IOSD2 Driver Short Circuit Current, VO = LOW −7V ≤ VO ≤ +12V IOSR Receiver Short Circuit Current 0V ≤ VO ≤ VCC (2) (3) (4) (5) 0.2 |V| 5 V 3 V 0.2 |V| V A, B VIN = −7V IOSD1 V 2.0 −0.2 0.8 V ±2 μA 1.0 mA −0.8 mA 0.2 70 RO A, B RO V mV 3.5 V 12 kΩ μA 200 900 200 500 μA 35 250 mA 35 250 mA 7 85 mA DE = 0V, RE* = 0V or VCC (1) 2.0 V 5 Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD1/2/3 and VID. All typicals are given for: VCC = +5.0V, TA = +25°C. Δ|VOD| and Δ|VOC| are changes in magnitude of V OD and VOC respectively, that occur when the input changes state. IIN2 includes the receiver input current and driver TRI-STATE leakage current. Supply current specification is valid for loaded transmitters when DE = 0V or enabled (DE = H) with no load. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS485 3 DS485 SNLS122C – JULY 1998 – REVISED APRIL 2013 www.ti.com SWITCHING CHARACTERISTICS Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified (1) (2) (3) Symbol Parameter Conditions RL = 54Ω, CL = 100 pF Min Typ Max Units 10 40 65 ns 10 39 65 ns 1 10 ns 3 25 40 ns 3 25 tPLHD Driver Differential Propagation Delay—Low to High tPHLD Driver Differential Propagation Delay—High to Low tSKEW Differential Skew |tPHLD − tPLHD| tr Driver Rise Time tf Driver Fall Time 40 ns tZH Driver Enable to Output High CL = 100 pF 170 ns tZL Driver Enable to Output Low CL = 100 pF 170 ns tLZ Driver Disable from Output Low CL = 15 pF 170 ns tHZ Driver Disable from Output High CL = 15 pF 170 ns tPLHD Receiver Differential Propagation Delay—Low to High CL = 15 pF (RO) tPHLD Receiver Differential Propagation Delay—High to Low tSKEW Differential Skew |tPHLD − tPLHD| tZH Receiver Enable to Output High tZL 70 190 320 ns 70 210 320 ns 20 50 ns 110 ns Receiver Enable to Output Low 110 ns tLZ Receiver Disable from Output Low 110 ns tHZ Receiver Disable from Output High 110 fmax Maximum Data Rate (1) (2) (3) (4) 4 CL = 15 pF See (4) 2.5 ns Mbps All typicals are given for: VCC = +5.0V, TA = +25°C. f = 1 MHz, tr and tf ≤ 6 ns, ZO = 50Ω. CL includes jig and probe capacitance. fmax is the ensured data rate for 50 ft of twisted pair cable. f max may be conservatively determined from the ratio of driver transition time (tr) to the data rate unit interval (1/fmax). Using a 10% ratio yields fmax = (0.1)/40 ns = 2.5 Mb/s. Higher data rates may be supported by allowing larger ratios. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS485 DS485 www.ti.com SNLS122C – JULY 1998 – REVISED APRIL 2013 PARAMETER MEASUREMENT INFORMATION Figure 2. VOD Figure 3. Figure 4. Figure 5. Figure 6. VOD3 Figure 7. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS485 5 DS485 SNLS122C – JULY 1998 – REVISED APRIL 2013 www.ti.com Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. 6 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS485 DS485 www.ti.com SNLS122C – JULY 1998 – REVISED APRIL 2013 Figure 14. PIN DESCRIPTIONS Pin # I/O Name 1 O RO Receiver Output: If A > B by 200 mV, RO will be high; If A < B by 200 mV, RO will be low. RO will be high also if the inputs (A and B) are open (non-terminated). Function 2 I RE* Receiver Output Enable: RO is enabled when RE* is low; RO is in TRI-STATE when RE* is high. 3 I DE Driver Output Enable: The driver outputs (A and B) are enabled when DE is high; they are in TRI-STATE when DE is low. Pins A and B also function as the receiver input pins (see below). 4 I DI Driver Input: A low on DI forces A low and B high while a high on DI forces A high and B low when the driver is enabled. 5 NA GND 6 I/O A Non-inverting Driver Output and Receiver Input pin. Driver output levels conform to RS-485 signaling levels. 7 I/O B Inverting Driver Output and Receiver Input pin. Driver output levels conform to RS-485 signaling levels. 8 NA VCC Ground Power Supply: 4.75V ≤ VCC ≤ 5.25V Related TI Low Power RS-485 Transceivers Part Number DS36C278 DS36C278T DS36C279 DS36C279T DS36C280 DS36C280T Temperature Range Number of XCVRs on Bus 0°C to +70°C 128 Ultra Low Power Transceiver Comments −40°C to +85°C 64 Ultra Low Power Transceiver 0°C to +70°C 128 Auto-Sleep Mode −40°C to +85°C 64 Auto-Sleep Mode 0°C to +70°C 128 Adjustable Slew Rate Control −40°C to +85°C 64 Adjustable Slew Rate Control Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS485 7 DS485 SNLS122C – JULY 1998 – REVISED APRIL 2013 www.ti.com APPLICATIONS INFORMATION The DS485 is a low power transceiver designed for use in RS-485 multipoint applications. The DS485 can transmit data up to 2.5 Mbps based on a ratio of driver transition time to the unit interval (bit time) of 10%. This maximum data rate may be further limited by the interconnecting media. The DS485 provides a standard unit load to the RS-485 bus across the common mode range of −7V to +12V. This allows up to 32 transceivers (standard unit load) to be connected to the bus. More transceivers may be connected to the bus if they support a reduced unit load (see Related TI Low Power RS-485 Transceivers). The DS485 also ensures the driver's output differential voltage into a worst case load that models standard termination loads and 32 unit loads referenced to the maximum common mode voltage extremes. With a minimum of 1.5V swing into this load, a 1.3V differential noise margin is supported along with the standard common mode rejection range of the receivers. Due to the multipoint nature of the bus, contention between drivers may occur. This will not cause damage to the drivers since they feature short-circuit protection and also thermal shutdown protection. Thermal shutdown senses die temperature and puts the driver outputs into TRI-STATE if a fault condition occurs that causes excessive power dissipation which can elevate the junction temperature to +150°C. A typical multipoint application is shown in the following figure. Note that termination is typically required but is only located at the two ends of the cable (not on every node). Commonly pull up and pull down resistors may be required at one end of the bus to provide a failsafe bias. These resistors provide a bias to the line when all drivers are in TRI-STATE. See Application Note AN-847(SNLA031) for a complete discussion of failsafe biasing of differention buses. Figure 15. Multipoint RS-485 Application 8 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS485 DS485 www.ti.com SNLS122C – JULY 1998 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision B (April 2013) to Revision C • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 8 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS485 9 PACKAGE OPTION ADDENDUM www.ti.com 19-Mar-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS485M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 DS485 M DS485M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS485 M DS485MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS485 M DS485N/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 DS485 N DS485TM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 DS485 TM DS485TM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS485 TM DS485TMX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 DS485 TM DS485TMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS485 TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 19-Mar-2015 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS485MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS485TMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS485TMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS485MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 DS485TMX SOIC D 8 2500 367.0 367.0 35.0 DS485TMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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