Product Folder Sample & Buy Support & Community Tools & Software Technical Documents bq25895M SLUSCC8 – JULY 2015 bq25895M I2C Controlled Single Cell Fast Charger with MaxChargeTM Technology for High Input Voltage 1 Features • 1 • • • • • • • • • • • High Efficiency 1.5-MHz Switch Mode Buck Charge – 93% Charge Efficiency at 2 A and 91% Charge Efficiency at 3 A Charge Current – Optimize for High Voltage Input (9 V / 12 V) – Low Power PFM mode for Light Load Operations Boost Mode Operation with Adjustable Output from 4.5 V to 5.5 V – Selectable 500-KHz / 1.5-MHz Boost Converter with up-to 3.1 A Output – 93% Boost Efficiency at 5 V at 1 A Output – Support down-to 2.5V Battery – Support PWM only or PFM/PWM control for Light Load Efficiency Integrated Control to Switch Between Charge and Boost Mode Single Input to Support USB Input and Adjustable High Voltage Adapters – Support 3.9-V to 14-V Input Voltage Range – Input Current Limit (100 mA to 3.25 A with 50mA resolution) to Support USB2.0, USB3.0 standard and High Voltage Adapters – Maximum Power Tracking by Input Voltage Limit up-to 14V for Wide Range of Adapters Input Current Optimizer (ICO) to Maximize Input Power without Overloading Adapters Resistance Compensation (IRCOMP) from Charger Output to Cell Terminal Highest Battery Discharge Efficiency with 11-mΩ Battery Discharge MOSFET up to 9 A Integrated ADC for System Monitor (Voltage, Temperature, Charge Current) BATFET Control to Support Ship Mode, Wake Up, and Full System Reset Flexible Autonomous and I2C Mode for Optimal System Performance High Integration includes all MOSFETs, Current Sensing and Loop Compensation 12-µA Low Battery Leakage Current to Support Ship Mode • • High Accuracy – ±0.5% Charge Voltage Regulation – ±5% Charge Current Regulation – ±7.5% Input Current Regulation Safety – Battery Temperature Sensing for Charge and Boost Mode – Thermal Regulation and Thermal Shutdown 2 Applications • • • Power Bank, Mobile Wi-Fi Hotspot Wireless Bluetooth Speaker Portable Internet Devices 3 Description The bq25895M is a highly-integrated 5-A switchmode battery charge management and system power path management device for single cell Li-Ion and Lipolymer battery. The devices support high input voltage fast charging. The low impedance power path optimizes switch-mode operation efficiency, reduces battery charging time and extends battery life during discharging phase. The I2C Serial interface with charging and system settings makes the device a truly flexible solution. Device Information(1) PART NUMBER bq25895M PACKAGE BODY SIZE (NOM) WQFN (24) 4.00mm x 4.00mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Simplified Schematic OTG 5V at 3.1A Phone PMID Input 3.9V±14V at 3A USB VBUS SYS 3.5V±4.5V SW SYS Ichg=5A BAT I2C Bus Host QON bq25895M Host Control REGN Optional TS 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. bq25895M SLUSCC8 – JULY 2015 www.ti.com 4 Revision History 2 DATE REVISION NOTES July 2015 * Initial release. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: bq25895M bq25895M www.ti.com SLUSCC8 – JULY 2015 5 Description (Continued) The bq25895M is a highly-integrated 5-A switch-mode battery charge management and system power path management device for single cell Li-Ion and Li-polymer battery. It features fast charging with high input voltage support for a wide range of smartphone, tablet and portable devices. Its low impedance power path optimizes switch-mode operation efficiency, reduces battery charging time and extends battery life during discharging phase. It also integrates Input Current Optimizer (ICO) and Resistance Compensation (IRCOMP) to deliver maximum charging power to battery. The solution is highly integrated with input reverse-blocking FET (RBFET, Q1), high-side switching FET (HSFET, Q2), low-side switching FET (LSFET, Q3), and battery FET (BATFET, Q4) between system and battery. It also integrates the bootstrap diode for the high-side gate drive and battery monitor for simplified system design. The I2C serial interface with charging and system settings makes the device a truly flexible solution The device supports a wide range of input sources, including standard USB host port, USB charging port, and USB compliant adjustable high voltage adapter. To support fast charging using adjustable high voltage adapter, the bq25895M provides support MaxChargeTM handshake using D+/D- pins and DSEL pin for USB switch control. In addition, the device includes interface to support adjustable high voltage adapter using input current pulse protocol. To set the default input current limit, device uses the built-in USB interface. The device is compliant with USB 2.0 and USB 3.0 power spec with input current and voltage regulation. In addition, the Input Current Optimizer (ICO) supports the detection of maximum power point detection of the input source without overload. The device supports battery boost operation by supplying adjustable 4.5V-5.5V on PMID pin with up to 3.1A with integrated charge and boost mode detection The power path management regulates the system slightly above battery voltage but does not drop below 3.5V minimum system voltage (programmable). With this feature, the system maintains operation even when the battery is completely depleted or removed. When the input current limit or voltage limit is reached, the power path management automatically reduces the charge current to zero. As the system load continues to increase, the power path discharges the battery until the system power requirement is met. This operation prevents overloading the input source. The device initiates and completes a charging cycle without software control. It automatically detects the battery voltage and charges the battery in three phases: pre-conditioning, constant current and constant voltage. At the end of the charging cycle, the charger automatically terminates when the charge current is below a preset limit in the constant voltage phase. When the full battery falls below the recharge threshold, the charger will automatically start another charging cycle. The charger provides various safety features for battery charging and system operations, including battery temperature negative thermistor monitoring, charging safety timer and overvoltage/overcurrent protections. The thermal regulation reduces charge current when the junction temperature exceeds 120°C (programmable). The STAT output reports the charging status and any fault conditions. The INT immediately notifies host when fault occurs. The device also provides a 7-bit analog-to-digital converter (ADC) for monitoring charge current and input/battery/system (VBUS, BAT, SYS, TS) voltages. The QON pin provides BATFET enable/resôet control to exit low power ship mode or full system reset function. The device family is available in 24-pin, 4 x 4 mm2 x 0.75 mm thin WQFN package. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: bq25895M 3 bq25895M SLUSCC8 – JULY 2015 www.ti.com 6 Device and Documentation Support 6.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. 6.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 6.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 6.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 6.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 7 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: bq25895M PACKAGE OPTION ADDENDUM www.ti.com 6-Aug-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) BQ25895MRTWR ACTIVE WQFN RTW 24 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ 25895M BQ25895MRTWT ACTIVE WQFN RTW 24 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ 25895M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Aug-2015 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 6-Aug-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BQ25895MRTWR WQFN RTW 24 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 BQ25895MRTWT WQFN RTW 24 250 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 6-Aug-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ25895MRTWR WQFN RTW 24 3000 367.0 367.0 35.0 BQ25895MRTWT WQFN RTW 24 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated