MATERIAL DECLARATION SHEET Material Number CD143A Series Product Line Diode Products Compliance Date 13 July 2008 RoHS Compliant Yes No. Construction Element(subpart) MSL Homogeneous Material 1 Material weight [g] 1 Lead Frame Lead Frame 2 Die Silicon 0.010036 3 Gold Bond Wire Conductor 0.000234 4 Silver Paste Die Attach 0.000540 5 Molding Component Outer Total weight 0.017090 0.012000 Homogeneous Material\ Substances Copper Tin Silicon Other nonregulated materials Gold Silver Phenolic epoxy resin Silica fused Brominated Epoxy resin Phenol resin if applicable Materials Mass % Material Mass % of total unit wt. 7440-50-8 7440-31-5 7440-21-3 95 5 97 40.770 2.0600 23.420 3 0.4780 7440-57-5 7440-22-4 100 77 0.5867 1.05 9003-36-5 23 0.2963 60676-86-0 85 26.690 68928-70-1 10 3.1400 29690-62-2 5 1.8840 CASRN Subpart mass of total wt. (%) 42.8 23.9 0.6 1.3 31.4 0.039964 This Document was updated on: 18-March 2009 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1