Material Content Data Sheet Sales Product Name IPB019N06L3 G MA# MA000472882 Package PG-TO263-3-2 Issued 29. August 2013 Weight* 1563.52 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 10.427 0.67 0.304 0.02 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.67 6669 6669 195 0.091 0.01 304.026 19.44 19.47 194450 58 194703 10.120 0.65 0.65 6472 6472 10.104 0.65 6462 111.139 7.11 552.329 35.31 43.07 353260 430806 9.657 0.62 0.62 6176 6176 0.228 0.01 0.001 0.00 0.168 0.01 0.134 0.01 6.412 0.41 0.165 0.01 0.548 0.04 547.666 35.03 71083 146 0.01 1 86 0.43 4101 2. 3. 351 35.08 350278 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4294 105 Important Remarks: 1. 146 107 350734 1000000