ASM2P2304NZ January 2007 rev 1.1 Four Output PCI-X and General Purpose Buffer Features Functional Description • One input to four Output Buffer/Driver • General-purpose or PCI-X clock buffer The ASM2P2304NZ is a low-cost buffer designed to • Buffers all frequencies from DC to 140 MHz distribute • Output-to-output skew less than 100 pS applications. The device operates at 3.3V and outputs can • Available in 8-pin TSSOP and SOIC Packages run up to 140 MHz. • 3.3V operation high-speed clocks for PCI-X and Table 1. Function Table. Inputs Outputs BUF_IN OE Output [1:4] L H L H L L H H L L L H Block Diagram OE other Logic Control BUF_ IN OUTPUT 1 OUTPUT 2 OUTPUT 3 OUTPUT 4 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. ASM2P2304NZ January 2007 rev 1.1 Pin Configuration BUF_IN 1 8 OUTPUT 4 OE 2 7 OUTPUT 3 OUTPUT 1 3 ASM2P2304NZ GND 4 6 VDD 5 OUTPUT 2 Pin Description Pin # 1 Type Description 1 BUF_IN I Input clock. 5V Tolerant Input 2 OE I Input pin for Output Enable, active HIGH. Connect to VDD 3 Output 12 O Output 1 4 GND P Ground 2 5 Output 2 O Output 2 6 VDD 7 8 Notes : 1. 2. Pin Name P 3.3V Voltage Supply 2 O Output 3 2 O Output 4 Output 3 Output 4 Weak pull down on input Weak pull down on all outputs Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 2 of 9 ASM2P2304NZ January 2007 rev 1.1 Absolute Maximum Ratings Parameter Description Min Max Supply Voltage to Ground Potential -0.5 7 V DC Input Voltage (Except BUF_IN) -0.5 VDD + 0.5 V DC Input Voltage (BUF_IN) -0.5 7 V Storage Temperature -65 +150 °C Max. Soldering Temperature (10 sec) 260 °C Junction Temperature 150 °C Static Discharge Voltage (As per JEDEC STD22- A114-B) 2000 V Note: These are stress ratings only and functional usage is not implied. Exposure to absolute maximum ratings for prolonged periods can affect device reliability. Operating Conditions Parameter Description Min Max Unit VDD Supply Voltage 3.0 3.6 V TA Operating Temperature (Ambient Temperature) -40 85 °C CL Load Capacitance - 25 pF CIN Input Capacitance - 7 pF Operating Frequency DC 140 MHz Power-up time for all VDD's to reach minimum specified Voltage (Power ramps must be monotonic) 0.05 50 mS BUF_IN, OUTPUT [1:4] tPU Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 3 of 9 ASM2P2304NZ January 2007 rev 1.1 Electrical Characteristics Parameter Description VIL Min Max Unit Input LOW Voltage1 - 0.8 V VIH Input HIGH Voltage1 2.0 - V IIL Input LOW Current VIN = 0V -5 5 µA IIH Input HIGH Current VIN= VDD -5 12 µA Output LOW Voltage2 IOL= 24 mA - 0.8 V VOL IOL= 12 mA - 0.55 V IOH= –24 mA 2.0 - V IOH= –12 mA 2.4 - V Unloaded outputs at 66.66 MHz - 25 mA VOH IDD Test Conditions Output HIGH Voltage2 Supply Current Switching Characteristics for Commercial and Industrial Temperature Devices3 Parameter Name Description Min Typ Max Unit 40.0 50.0 60.0 % tD Duty Cycle2 = t2 ÷t1 Measured at 1.5V t3 Rise Time2 Measured between 0.8V and 2.0V - - 1.50 nS t4 Fall Time2 Measured between 2.0V and 0.8V - - 1.50 nS t5 Output to Output Skew2 All outputs equally loaded For Commercial parts - - 100 For Industrial parts - - 150 t6 Propagation Delay, BUF_IN Rising Edge to OUTPUT Rising Edge2 Measured at VDD/2 2.5 3.5 5 pS nS Note: 1. BUF_IN input has a threshold voltage of VDD/2. 2. Parameter is guaranteed by design and characterization. It is not 100% tested in production. 3. All parameters specified with loaded outputs. Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 4 of 9 ASM2P2304NZ January 2007 rev 1.1 Switching Waveforms Duty Cycle Timing All Outputs Rise/Fall Time Output-Output Skew Input-Output Propagation Delay Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 5 of 9 ASM2P2304NZ January 2007 rev 1.1 Package Information 8-lead Thin Shrunk Small Outline Package (4.40-MM Body) H E D A2 A C θ e A1 L B Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 6 of 9 ASM2P2304NZ January 2007 rev 1.1 Package Information 8-lead (150-mil) SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Min Max Millimeters Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 7 of 9 ASM2P2304NZ January 2007 rev 1.1 Ordering Codes Part Number Marking Package Type Temperature ASM2P2304NZF-08-ST 2P2304NZF 8-pin SOIC - Tube, Pb Free Commercial ASM2P2304NZF-08-SR 2P2304NZF 8-pin SOIC - Tape and Reel, Pb Free Commercial ASM2I2304NZF-08-ST 2I2304NZF 8-pin SOIC - Tube, Pb Free Industrial ASM2I2304NZF-08-SR 2I2304NZF 8-pin SOIC - Tape and Reel, Pb Free Industrial ASM2P2304NZG-08-ST 2P2304NZG 8-pin SOIC - Tube, Green Commercial ASM2P2304NZG-08-SR 2P2304NZG 8-pin SOIC - Tape and Reel, Green Commercial ASM2I2304NZG-08-ST 2I2304NZG 8-pin SOIC - Tube, Green Industrial ASM2I2304NZG-08-SR 2I2304NZG 8-pin SOIC - Tape and Reel, Green Industrial ASM2P2304NZF-08-TT 2P2304NZF 8-pin TSSOP - Tube, Pb Free Commercial ASM2P2304NZF-08-TR 2P2304NZF 8-pin TSSOP - Tape and Reel, Pb Free Commercial ASM2I2304NZF-08-TT 2I2304NZF 8-pin TSSOP - Tube, Pb Free Industrial ASM2I2304NZF-08-TR 2I2304NZF 8-pin TSSOP - Tape and Reel, Pb Free Industrial ASM2P2304NZG-08-TT 2P2304NZG 8-pin TSSOP - Tube, Green Commercial ASM2P2304NZG-08-TR 2P2304NZG 8-pin TSSOP - Tape and Reel, Green Commercial ASM2I2304NZG-08-TT 2I2304NZG 8-pin TSSOP - Tube, Green Industrial ASM2I2304NZG-08-TR 2I2304NZG 8-pin TSSOP - Tape and Reel, Green Industrial Device Ordering Information A S M 2 P 2 3 0 4 N Z F - 0 8 - T R R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved PulseCore Semiconductor Mixed Signal Product Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 8 of 9 ASM2P2304NZ January 2007 rev 1.1 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Part Number: ASM2P2304NZ Document Version: 1.1 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Four Output PCI-X and General Purpose Buffer Notice: The information in this document is subject to change without notice. 9 of 9