AP4409AGM-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
P-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Simple Drive Requirement
D
D
▼ Low On-resistance
D
D
▼ Fast Switching Characteristic
G
▼ RoHS Compliant & Halogen-Free
SO-8
S
S
BVDSS
-30V
RDS(ON)
7.2mΩ
ID
-15A
S
D
Description
AP4409A series are from Advanced Power innovated design and silicon
process technology to achieve the lowest possible on-resistance and
fast switching performance. It provides the designer with an extreme
efficient device for use in a wide range of power applications.
The SO-8 package is widely preferred for all commercial-industrial
surface mount applications using infrared reflow technique and suited
for voltage conversion or switch applications.
G
S
Absolute Maximum Ratings
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID@TA=25℃
ID@TA=70℃
Rating
Units
-30
V
+20
V
3
-15
A
3
-12
A
Continuous Drain Current
Continuous Drain Current
1
IDM
Pulsed Drain Current
-50
A
PD@TA=25℃
Total Power Dissipation
2.5
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Rthj-a
Parameter
Maximum Thermal Resistance, Junction-ambient
Data and specifications subject to change without notice
3
Value
Unit
50
℃/W
1
201211211
AP4409AGM-HF
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
BVDSS
Drain-Source Breakdown Voltage
VGS=0V, ID=-250uA
-30
-
-
V
RDS(ON)
Static Drain-Source On-Resistance2
VGS=-10V, ID=-10A
-
5.7
7.2
mΩ
VGS=-4.5V, ID=-7A
-
8.3
10.8
mΩ
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=-250uA
-1
-1.7
-3
V
gfs
Forward Transconductance
VDS=-10V, ID=-10A
-
24
-
S
IDSS
Drain-Source Leakage Current
VDS=-24V, VGS=0V
-
-
-10
uA
IGSS
Gate-Source Leakage
VGS=+20V, VDS=0V
-
-
+100
nA
Qg
Total Gate Charge
ID=-10A
-
50
80
nC
Qgs
Gate-Source Charge
VDS=-15V
-
13
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=-4.5V
-
23
-
nC
td(on)
Turn-on Delay Time
VDS=-15V
-
14
-
ns
tr
Rise Time
ID=-1A
-
13
-
ns
td(off)
Turn-off Delay Time
RG=3.3Ω
-
82
-
ns
tf
Fall Time
VGS=-10V
-
48
-
ns
Ciss
Input Capacitance
VGS=0V
-
4500 7200
pF
Coss
Output Capacitance
VDS=-15V
-
745
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
685
-
pF
Rg
Gate Resistance
f=1.0MHz
-
2.2
4.4
Ω
Min.
Typ.
Source-Drain Diode
Symbol
Parameter
2
Test Conditions
Max. Units
VSD
Forward On Voltage
IS=-2.1A, VGS=0V
-
-
-1.2
V
trr
Reverse Recovery Time
IS=-10A, VGS=0V,
-
45
-
ns
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
-
33
-
nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in2 copper pad of FR4 board, t < 10s ; 125 ℃/W when mounted on Min. copper pad.
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP4409AGM-HF
100
100
80
-ID , Drain Current (A)
-ID , Drain Current (A)
80
-10V
-7.0V
-6.0V
-5.0V
V G = - 4.0V
T A = 150 o C
-10V
-7.0V
-6.0V
-5.0V
V G = - 4.0V
o
T A = 25 C
60
40
20
60
40
20
0
0
0
1
2
3
4
0
-V DS , Drain-to-Source Voltage (V)
1
2
3
4
5
6
-V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
1.8
10
ID=-7A
T A =25 ℃
I D = -10A
V G = -10V
Normalized RDS(ON)
RDS(ON\) (mΩ)
9
8
7
1.4
1.0
6
0.6
5
2
4
6
8
10
-50
0
50
100
150
o
-V GS , Gate-to-Source Voltage (V)
T j , Junction Temperature ( C)
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
2.0
10
I D = -250uA
1.6
-IS(A)
T j =150 o C
Normalized VGS(th)
8
T j =25 o C
6
4
2
1.2
0.8
0.4
0
0.0
0
0.2
0.4
0.6
0.8
1
-V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.2
-50
0
50
100
150
T j , Junction Temperature ( o C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP4409AGM-HF
8
f=1.0MHz
8000
6
6000
C (pF)
-VGS , Gate to Source Voltage (V)
I D = - 10 A
V DS = - 15 V
4
2
2000
0
0
0
20
40
60
80
C iss
4000
C oss
C rss
1
5
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
13
17
21
25
29
Fig 8. Typical Capacitance Characteristics
100
1
100us
Normalized Thermal Response (Rthja)
Duty factor=0.5
Operation in this area
limited by RDS(ON)
10
1ms
-ID (A)
9
-V DS , Drain-to-Source Voltage (V)
10ms
1
100ms
1s
0.1
T A =25 o C
Single Pulse
DC
0.01
0.2
0.1
0.1
0.05
0.02
PDM
0.01
t
0.01
T
Duty factor = t/T
Peak Tj = PDM x Rthja + T a
Single Pulse
Rthja=125oC/W
0.001
0.01
0.1
1
10
0.0001
100
0.001
0.01
-V DS , Drain-to-Source Voltage (V)
0.1
1
10
100
1000
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
80
20
V DS = -5V
-ID , Drain Current (A)
-ID , Drain Current (A)
16
60
40
T j =150 o C
12
8
20
4
T j =25 o C
T j = -40 o C
0
0
0
1
2
3
4
-V GS , Gate-to-Source Voltage (V)
Fig 11. Transfer Characteristics
5
25
50
75
100
125
150
T A , Ambient Temperature ( o C )
Fig 12. Maximum Continuous Drain Current
v.s. Ambient Temperature
4