Low Power Ambient Light and Proximity Sensor with Internal IR-LED and Digital Output ISL29043 Features The ISL29043 is an integrated ambient and infrared light-to-digital converter with a built-in IR LED and I2C Interface (SMBus Compatible). This device uses two independent ADCs for concurrently measuring ambient light and proximity in parallel. The flexible interrupt scheme is designed for minimal microcontroller utilization. • Internal LED + Sensor = Complete Solution • Works Under All Light Sources Including Sunlight • Dual ADCs Measure ALS/Prox Concurrently • <1.0μA Supply Current When Powered Down • Temperature Compensated • Pb-Free (RoHS compliant) For ambient light sensor (ALS) data conversions, an ADC converts photodiode current (with a light sensitivity range up to 2000 Lux) in 100ms per sample. The ADC rejects 50Hz/60Hz flicker noise caused by artificial light sources. Intelligent and Flexible Interrupts • Independent ALS/Prox Interrupt Thresholds • Adjustable Interrupt Persistency - 1/4/8/16 Consecutive Triggers Required Before Interrupt For proximity sensor (Prox) data conversions, the built-in driver turns on an internal infrared LED and the proximity sensor ADC converts the reflected IR intensity to digital. This ADC rejects ambient IR noise (such as sunlight) and has a 540μs conversion time. Applications • Display and Keypad Dimming Adjustment and Proximity Sensing for: - Mobile Devices: Smart Phone, PDA, GPS - Computing Devices: Laptop PC, Netbook, Tablet PC - Consumer Devices: LCD-TV, Digital Picture Frame, Digital Camera - Industrial and Medical Light and Proximity Sensing The ISL29043 provides low power operation of ALS and proximity sensing with a typical 136μA normal operation current (110μA for sensors and internal circuitry, ~28μA for LED) with 220mA current pulses for a net 100μs, repeating every 800ms (or under). The ISL29043 uses both a hardware pin and software bits to indicate an interrupt event has occurred. An ALS interrupt is defined as a measurement that is outside a set window. A proximity interrupt is defined as a measurement over a threshold limit. The user may also require that both ALS/Prox interrupts occur at once, up to 16 times in a row before activating the interrupt pin. Related Literature • See AN1436, “Proximity Sensors” The ISL29043 is designed to operate from 2.25V to 3.63V over the -40°C to +85°C ambient temperature range. It is packaged in a clear, lead-free 10 Ld ODFN package. R2 10kΩ R1 10kΩ VDD C2 1µF VLED R3 10kΩ VI2C PULL-UP INT SDA SCL SLAVE_0 1 LED+ LEDC1 1.0µF 2 ADDR0 IRDR 3V INT DD C3 4 GND SDA 0.1µF 5 REXT SCL I2C MASTER µCONTROLLER 10 9 SLAVE_1 SDA 8 SCL I2C SLAVE_n SDA SCL 7 6 ISL29043 REXT 499kΩ PROX COUNTS (8-BIT) 255 204 110mA (18% GREY CARD) 220mA (18% GREY CARD) 153 110mA (WHITE COPY PAPER) 102 220mA (WHITE COPY PAPER) 51 0 0 25 50 75 100 125 150 DISTANCE (mm) FIGURE 1. TYPICAL APPLICATION DIAGRAM February 9, 2012 FN7935.0 1 FIGURE 2. PROXIMITY RESPONSE vs DISTANCE CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2012. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL29043 ISL29043 Block Diagram VDD 3 ALS PHOTODIODE ARRAY COMMAND REGISTER LIGHT DATA PROCESS ALS AND IR DUAL CHANNEL ADCs DATA REGISTER 2 I2C IR PHOTODIODE ARRAY SCL 7 SDA INTERRUPT 8 INT IR DRIVER 9 IRDR IREF FOSC 5 4 1 REXT GND LED+ Pin Configuration 1 10 LED- ADDR0 2 9 IR D R VDD 3 8 IN T GND 4 7 SDA REXT 5 6 SCL 10 LED- Pin Descriptions ISL29043 (10 LD 2.1x3.5 (mm) OPTICAL CO-PACKAGE) TOP VIEW LED+ ADDR0 6 PIN # PIN NAME *T H E R M A L P A D M U S T B E L E F T F L O A T IN G DESCRIPTION 0 T-PAD Thermal pad. Floating - do not connect to GND or VDD 1 LED+ Anode of IR-LED 2 ADDR0 I2C address pin - pull high or low (do not float) 3 VDD Positive supply: 2.25V to 3.63V 4 GND Ground 5 REXT External resistor (499kΩ; 1%) connects this pin to ground. 6 SCL I2C clock line 7 SDA I2C data line 8 INT Interrupt pin; Logic output (open-drain) for interrupt 9 IRDR IR-LED driver pin - current flows into ISL29043 from LED cathode 10 LED- Cathode of IR-LED The I2C bus lines can be pulled from 1.7V to above VDD, 3.63V max. Ordering Information PART NUMBER (Notes 1, 2, 3) TEMP. RANGE (°C) ISL29043IROMZ-T7 -40 to +85 ISL29043IROMZ-EVALZ PACKAGE Tape & Reel (Pb-free) 10 Ld Optical Co-package PKG. DWG. # L10.2.1x3.5E Evaluation Board NOTES: 1. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets: molding compounds, die attach materials, NiPdAu plate (e4 termination finish), which are all RoHS compliant. The ISL29043 is compatible with limited SnPb and Pb-free soldering operations. The ISL29043 is MSL classified. See Tech Brief TB489 (Surface Mount Guidelines for Optical Co-packages) for reflow profile and more information. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL29043. For more information on MSL please see tech brief TB477. 2 FN7935.0 February 9, 2012 ISL29043 Absolute Maximum Ratings Thermal Information (TA = +25°C) VDD Supply Voltage between VDD and GND . . . . . . . . . . . . . . . . . . . . . .4.0V I2C Bus Pin Voltage (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.0V I2C Bus Pin Current (SCL, SDA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA REXT Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD + 0.5V IRDR Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5.5V ADDR0 Pin Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VDD + 0.5V INT Pin Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 4.0V INT Pin Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <10mA ESD Rating Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (Note 6) 2kV Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 10 Ld Optical Module Package (Notes 4, 5) 113 58 Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +90°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB489 http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. 6. ESD is rated at 2kV HBM on all pins except IRDR, which is rated at 1kV. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications PARAMETER VDD VDD = 3.0V, TA = +25°C, REXT = 499kΩ 1% tolerance. DESCRIPTION CONDITION Power Supply Range MIN MAX (Note 7) TYP (Note 7) UNIT 2.25 3.0 3.63 V SR_VDD Input Power-up Slew Rate VDD Rising Edge between 0.4V and 2.25V IDD_OFF Supply Current when Powered Down ALS_EN = 0; PROX_EN = 0 0.1 0.8 µA Supply Current for ALS+Prox in Sleep Time ALS_EN = 1; PROX_EN = 1 110 125 µA Supply Current for Prox in Sleep Time ALS_EN = 0; PROX_EN = 1 80 µA Supply Current for ALS ALS_EN = 1; PROX_EN = 0 96 µA 5.25 MHz IDD_NORM IDD_PRX_SLP IDD_ALS fOSC 0.5 Internal Oscillator Frequency tINTGR_ALS 12-bit ALS Integration/Conversion Time tINTGR_PROX 8-bit Prox Integration/Conversion Time 88 V/ms 100 112 0.54 DATAALS_0 ALS Result when Dark EAMBIENT = 0 lux, 2k Range DATAALS_F Full Scale ALS ADC Code EAMBIENT > Selected Range Maximum Lux (Note 10) 1 ms ms 3 Counts 4095 Counts Count Output Variation Over Three Light Sources: Ambient Light Sensing Fluorescent, Incandescent and Sunlight ±10 % DATAALS_1 Light Count Output with LSB of 0.029 lux/count E = 47 lux, Green LED (Note 10), ALS_RANGE = 0 1638 Counts DATAALS_2 Light Count Output With LSB of 0.469 lux/count E = 288 lux, Green LED, ALS_RANGE = 1 DATAPROX_0 Prox Measurement IR LED off (Note 8) DATAPROX_F Full Scale Prox ADC Code ΔDATA DATA 460 614 768 Counts 1 3 Counts 255 Counts tr Rise Time for IRDR Sink Current RLOAD = 15Ω at IRDR pin, 20% to 80% 500 ns tf Fall time for IRDR Sink Current RLOAD = 15Ω at IRDR pin, 80% to 20% 500 ns IIRDR_0 IRDR Sink Current PROX_DR = 0; VIRDR = 0.5V IIRDR_1 IRDR Sink Current PROX_DR = 1; VIRDR = 0.5V IRDR Leakage Current PROX_EN = 0; VDD = 3.63V (Note 9) Acceptable Voltage Range on IRDR Pin Register bit PROX_DR = 0 IIRDR_LEAK VIRDR 3 90 110 130 220 0.001 0.5 mA mA 1 µA 4.3 V FN7935.0 February 9, 2012 ISL29043 Electrical Specifications PARAMETER tPULSE VDD = 3.0V, TA = +25°C, REXT = 499kΩ 1% tolerance. (Continued) DESCRIPTION MIN MAX (Note 7) TYP (Note 7) UNIT CONDITION Net IIRDR On Time Per PROX Reading 100 µs VREF Voltage of REXT Pin 0.52 V FI2C I2C Clock Rate Range VI2C Supply Voltage Range for I2C Interface 1.7 400 kHz 3.63 V 0.55 V VIL SCL and SDA Input Low Voltage VIH SCL and SDA Input High Voltage ISDA SDA Current Sinking Capability VOL = 0.4V 3 5 mA IINT INT Current Sinking Capability VOL = 0.4V 3 5 mA (ΔIIRDR)/(ΔVIRDR) PROX_DR = 0; VIRDR = 0.5V to 4.3V 3 mA/V PSRRIRDR 1.25 V NOTES: 7. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. 8. An 850nm infrared LED is used to test PROX/IR sensitivity in an internal test mode. 9. Ability to guarantee IIRDR leakage of ~1nA is limited by test hardware. 10. For ALS applications under light-distorting glass, please see the section titled “ALS Range 1 Considerations” on page 10. IR-LED Specifications TA = +25°C PARAMETER VF DESCRIPTION IR-LED Forward Voltage Drop CONDITION MIN (Note 7) TYP MAX (Note 7) UNIT IF = 100mA 1.6 V IF = 200mA 1.8 V 5 µA IR IR-LED Reverse-Bias Current VR = 5.5V λP IR-LED Peak Output Wavelength IF = 100mA 855 nm Δλ IR-LED Spectral Half-Width IF = 100mA 30 nm ΦE IR-LED Radiant Power IF = 100mA 27 mW IR-LED Radiant Intensity (in 0.01sr) IF = 100mA 10 mW/sr I I2C Electrical Specifications (Note 11). PARAMETER For SCL and SDA unless otherwise noted, VDD = 3V, TA = +25°C, REXT = 499kΩ 1% tolerance DESCRIPTION CONDITION MIN (Note 7) MAX TYP (Note 7) UNIT 1.7 3.63 V VI2C Supply Voltage Range for I2C Interface fSCL SCL Clock Frequency 400 kHz VIL SCL and SDA Input Low Voltage 0.55 V VIH SCL and SDA Input High Voltage Vhys Hysteresis of Schmitt Trigger Input VOL Low-level Output Voltage (Open-drain) at 4mA Sink Current Ii Input Leakage for each SDA, SCL Pin 1.25 V 0.05VDD V -10 0.4 V 10 µA tSP Pulse Width of Spikes that must be Suppressed by the Input Filter 50 ns tAA SCL Falling Edge to SDA Output Data Valid 900 ns 10 pF Ci Capacitance for each SDA and SCL Pin 4 FN7935.0 February 9, 2012 ISL29043 I2C Electrical Specifications (Note 11). (Continued) PARAMETER tHD:STA For SCL and SDA unless otherwise noted, VDD = 3V, TA = +25°C, REXT = 499kΩ 1% tolerance DESCRIPTION CONDITION MIN (Note 7) MAX TYP (Note 7) UNIT Hold Time (Repeated) START Condition After this period, the first clock pulse is generated. 600 ns tLOW LOW Period of the SCL Clock Measured at the 30% of VDD crossing. 1300 ns tHIGH HIGH period of the SCL Clock 600 ns tSU:STA Set-up Time for a Repeated START Condition 600 ns tHD:DAT Data Hold Time 30 ns tSU:DAT Data Set-up Time 100 ns tR Rise Time of both SDA and SCL Signals (Note 12) 20 + 0.1xCb ns tF Fall Time of both SDA and SCL Signals (Note 12) 20 + 0.1xCb ns Set-up Time for STOP Condition 600 ns Bus Free Time Between a STOP and START Condition 1300 ns tSU:STO tBUF Cb Capacitive Load for Each Bus Line 400 Maximum is determined by tR and tF 1 pF Rpull-up SDA and SCL System Bus Pull-up Resistor kΩ tVD;DAT Data Valid Time 0.9 µs tVD:ACK Data Valid Acknowledge Time 0.9 µs VnL Noise Margin at the Low Level 0.1VDD V VnH Noise Margin at the High Level 0.2VDD V NOTES: 11. All parameters in I2C Electrical Specifications table are guaranteed by design and simulation. 12. Cb is the capacitance of the bus in pF. FIGURE 3. I2C TIMING DIAGRAM 5 FN7935.0 February 9, 2012 ISL29043 Register Map There are ten 8-bit registers accessible via I2C. Registers 0x1 and 0x2 define the operation mode of the device. Registers 0x3 through 0x7 store the various ALS/IR/Prox thresholds, which trigger interrupt events. Registers 0x8 through 0xA store the results of ALS/IR/Prox ADC conversions. TABLE 1. ISL29043 REGISTERS AND REGISTER BITS BIT ADDR REG NAME 7 6 5 4 3 2 1 0 DEFAULT PROX_DR ALS_EN ALS_RANGE ALSIR_MODE 0x00 INT_CTRL 0x00 0x00 (n/a) 0x01 CONFIGURE PROX EN (Reserved) 0x02 INTERRUPT PROX_FLAG 0x03 PROX_LT PROX_LT[7:0] 0x04 PROX_HT PROX_HT[7:0] 0xFF 0x05 ALSIR_TH1 ALSIR_LT[7:0] 0x00 0x06 ALSIR_TH2 0x07 ALSIR_TH3 0x08 PROX_DATA PROX_DATA[7:0] 0x00 0x09 ALSIR_DT1 ALSIR_DATA[7:0] 0x00 0x0A ALSIR_DT2 0x0E TEST1 (Write as 0x00) 0x00 0x0F TEST2 (Write as 0x00) 0x00 PROX_SLP[2:0] PROX_PRST[1:0] (Write 0) ALS_FLAG ALSIR_HT[3:0] (n/a) ALS_PRST[1:0] 0x00 ALSIR_LT[11:8] ALSIR_HT[11:4] (Unused) 6 0xF0 0xFF ALSIR_DATA[11:8] 0x00 FN7935.0 February 9, 2012 ISL29043 Register Descriptions TABLE 2. REGISTER 0x00 (RESERVED) BIT # ACCESS DEFAULT NAME 7:0 RO (n/a) (n/a) FUNCTION/OPERATION Reserved - no need to read or write TABLE 3. REGISTER 0x01 (CONFIGURE) - PROX/ALS CONFIGURATION BIT # ACCESS DEFAULT NAME FUNCTION/OPERATION 7 RW 0x00 PROX_EN (Prox Enable) When = 0, proximity sensing is disabled When = 1, continuous proximity sensing is enabled. Prox data will be ready 0.54ms after this bit is set high 6:4 RW 0x00 PROX_SLP (Prox Sleep) For bits 6:4 = (see the following) 111; sleep time between prox IR LED pulses is 0.0ms (run continuously) 110; sleep time between prox IR LED pulses is 12.5ms 101; sleep time between prox IR LED pulses is 50ms 100; sleep time between prox IR LED pulses is 75ms 011; sleep time between prox IR LED pulses is 100ms 010; sleep time between prox IR LED pulses is 200ms 001; sleep time between prox IR LED pulses is 400ms 000; sleep time between prox IR LED pulses is 800ms 3 RW 0x00 PROX_DR (Prox Drive) When = 0, IRDR behaves as a pulsed 110mA current sink When = 1, IRDR behaves as a pulsed 220mA current sink 2 RW 0x00 ALS_EN (ALS Enable) When = 0, ALS/IR sensing is disabled When = 1, continuous ALS/IR sensing is enabled with new data ready every 100ms 1 RW 0x00 ALS_RANGE (ALS Range) When = 0, ALS is in low-lux range When = 1, ALS is in high-lux range 0 RW 0x00 ALSIR_MODE (ALSIR Mode) When = 0, ALS/IR data register contains visible ALS sensing data When = 1, ALS/IR data register contains IR spectrum sensing data TABLE 4. REGISTER 0x02 (INTERRUPT) - PROX/ALS INTERRUPT CONTROL BIT # 7 ACCESS FLAG DEFAULT BIT NAME 0x00 PROX_FLAG (Prox Flag) When = 0, no Prox interrupt event has occurred since power-on or last “clear” When = 1, a Prox interrupt event occurred. Clearable by writing “0” For bits 6:5 = (see the following) 00; set PROX_FLAG if 1 conversion result trips the threshold value 01; set PROX_FLAG if 4 conversion results trip the threshold value 10; set PROX_FLAG if 8 conversion results trip the threshold value 11; set PROX_FLAG if 16 conversion results trip the threshold value 6:5 RW 0x00 PROX_PRST (Prox Persist) 4 RW 0x00 Unused (Write 0) 3 FLAG 0x00 ALS_FLAG (ALS FLAG) 2:1 RW 0x00 0 RW 0x00 ALS_PRST (ALS Persist) FUNCTION/OPERATION Unused register bit - write 0 When = 0, no ALS interrupt event has occurred since power-on or last “clear” When = 1, an ALS interrupt event occurred. Clearable by writing “0” For bits 2:1 = (see the following) 00; set ALS_FLAG if 1 conversion is outside the set window 01; set ALS_FLAG if 4 conversions are outside the set window 10; set ALS_FLAG if 8 conversions are outside the set window 11; set ALS_FLAG if 16 conversions are outside the set window INT_CTRL When = 0, set INT pin low if PROX_FLAG or ALS_FLAG high (logical OR) (Interrupt Control) When = 1, set INT pin low if PROX_FLAG and ALS_FLAG high (logical AND) TABLE 5. REGISTER 0x03 (PROX_LT) - INTERRUPT LOW THRESHOLD FOR PROXIMITY SENSOR BIT # ACCESS DEFAULT BIT NAME 7:0 RW 0x00 PROX_LT (Prox Threshold) 7 FUNCTION/OPERATION 8-bit interrupt low threshold for proximity sensing FN7935.0 February 9, 2012 ISL29043 TABLE 6. REGISTER 0x04 (PROX_HT) - INTERRUPT HIGH THRESHOLD FOR PROXIMITY SENSOR BIT # ACCESS DEFAULT BIT NAME FUNCTION/OPERATION 7:0 RW 0xFF PROX_HT (Prox Threshold) 8-bit interrupt high threshold for proximity sensing TABLE 7. REGISTER 0x05 (ALSIR_TH1) - INTERRUPT LOW THRESHOLD FOR ALS/IR BIT # ACCESS DEFAULT BIT NAME 0x00 ALSIR_LT[7:0] (ALS/IR Low Thr.) FUNCTION/OPERATION Lower 8 bits (of 12 bits) for ALS/IR low interrupt threshold 7:0 RW BIT # ACCESS DEFAULT BIT NAME 7:4 RW 0x0F ALSIR_HT[3:0] (ALS/IR High Thr.) Lower 4 bits (of 12 bits) for ALS/IR high interrupt threshold 3:0 RW 0x00 ALSIR_LT[11:8] (ALS/IR Low Thr.) Upper 4 bits (of 12 bits) for ALS/IR low interrupt threshold TABLE 8. REGISTER 0x06 (ALSIR_TH2) - INTERRUPT LOW/HIGH THRESHOLDS FOR ALS/IR FUNCTION/OPERATION TABLE 9. REGISTER 0x07 (ALSIR_TH3) - INTERRUPT HIGH THRESHOLD FOR ALS/IR BIT # 7:0 ACCESS RW DEFAULT BIT NAME 0xFF ALSIR_HT[11:4] (ALS/IR High Thr.) FUNCTION/OPERATION Upper 8 bits (of 12 bits) for ALS/IR high interrupt threshold TABLE 10. REGISTER 0x08 (PROX_DATA) - PROXIMITY SENSOR DATA BIT # 7:0 ACCESS RO DEFAULT BIT NAME 0x00 PROX_DATA (Proximity Data) FUNCTION/OPERATION Results of 8-bit proximity sensor ADC conversion TABLE 11. REGISTER 0x09 (ALSIR_DT1) - ALS/IR SENSOR DATA (LOWER 8 BITS) BIT # 7:0 ACCESS RO DEFAULT BIT NAME 0x00 ALSIR_DATA (ALS/IR Data) FUNCTION/OPERATION Lower 8 bits (of 12 bits) from result of ALS/IR sensor conversion TABLE 12. REGISTER 0x0A (ALSIR_DT2) - ALS/IR SENSOR DATA (UPPER 4 BITS) BIT # ACCESS DEFAULT BIT NAME 7:4 RO 0x00 (Unused) 3:0 RO 0x00 ALSIR_DATA (ALS/IR Data) FUNCTION/OPERATION Unused bits. Upper 4 bits (of 12 bits) from result of ALS/IR sensor conversion TABLE 13. REGISTER 0x0E (TEST1) - TEST MODE BIT # ACCESS DEFAULT BIT NAME 7:0 RW 0x00 (Write as 0x00) FUNCTION/OPERATION Test mode register. When 0x00, in normal operation. TABLE 14. REGISTER 0x0F (TEST2) - TEST MODE 2 BIT # ACCESS DEFAULT BIT NAME 7:0 RW 0x00 (Write as 0x00) 8 FUNCTION/OPERATION Test mode register. When 0x00, in normal operation. FN7935.0 February 9, 2012 ISL29043 I2C DATA DEVICE ADDRESS START I2C SDA MASTER REGISTER ADDRESS W A A6 A5 A4 A3 A2 A1 A0 W A R7 R6 R5 R4 R3 R2 R1 R0 A I2C SDA SLAVE (ISL29043) SDA DRIVEN BY MASTER I2C CLK 1 2 3 4 5 6 7 A 8 9 2 3 4 5 6 7 8 SDA DRIVEN BY MASTER 1 9 2 3 4 5 6 DATA BYTE0 A A6 A5 A4 A3 A2 A1 A0 W A SDA DRIVEN BY MASTER 1 DEVICE ADDRESS STOP START SDA DRIVEN BY ISL29043 A A D7 D6 D5 D4 D3 D2 D1 D0 7 8 9 1 2 3 4 5 6 7 8 9 FIGURE 4. I2C DRIVER TIMING DIAGRAM FOR MASTER AND SLAVE CONNECTED TO COMMON BUS from I2C registers 0x9 and 0xA when the ADC conversion is completed. Principles of Operation I2C Interface The ISL29043’s I2C interface slave address is internally hardwired as 0b100010<x>, where “0b” signifies binary notation and x represents the logic level on pin ADDR0. Figure 4 shows a sample one-byte read. The I2C bus master always drives the SCL (clock) line, while either the master or the slave can drive the SDA (data) line. Every I2C transaction begins with the master asserting a start condition (SDA falling while SCL remains high). The first transmitted byte is initiated by the master and includes 7 address bits and a R/W bit. The slave is responsible for pulling SDA low during the ACK bit after every transmitted byte. Each I2C transaction ends with the master asserting a stop condition (SDA rising while SCL remains high). For more information about the I2C standard, please consult the Philips™ I2C specification documents. Photodiodes and ADCs The ISL29043 contains two photodiode arrays which convert photons (light) into current. The ALS photodiodes are constructed to mimic the human eye’s wavelength response curve to visible light (see Figure 11). The ALS photodiodes’ current output is digitized by a 12-bit ADC in 100ms. These 12 bits can be accessed by reading The ALS converter is a charge-balancing integrating 12-bit ADC. Charge-balancing is best for converting small current signals in the presence of periodic AC noise. Integrating over 100ms highly rejects both 50Hz and 60Hz light flicker by picking the lowest integer number of cycles for both 50Hz/60Hz frequencies. The proximity sensor is an 8-bit ADC, which operates in a similar fashion. When proximity sensing is enabled, the IRDR pin will drive the internal infrared LED, the emitted IR reflects off an object (e.g., a human head) back into the ISL29043, and a sensor converts the reflected IR wave to a current signal in 0.54ms. The ADC subtracts the IR reading before and after the LED is driven (to remove ambient IR such as sunlight), and converts this value to a digital count stored in Register 0x8. The ISL29043 is designed to run two conversions concurrently: a proximity conversion and an ALS (or IR) conversion. Please note that because of the conversion times, the user must let the ADCs perform one full conversion first before reading from I2C Registers PROX_DATA (wait 0.54ms) or ALSIR_DT1/2 (wait 100ms). The timing between ALS and Prox conversions is arbitrary (as shown in Figure 5). The ALS runs continuously with new data available every 100ms. The proximity sensor runs continuously with a time between conversions decided by PROX_SLP (Register 1 Bits [6:4]). ALS CONVERSION TIME = 100ms (FIXED) SEVERAL µs BETWEEN CONVERSIONS ALS ACTIVE 100ms PROX SENSOR ACTIVE 100ms 100ms 100ms 100ms TIME 0.54ms FOR PROX CONVERSION TIME IRDR (CURRENT DRIVER) SERIES OF CURRENT PULSES TOTALING 0.1ms TIME SLEEP TIME (PROX_SLP) FIGURE 5. TIMING DIAGRAM FOR PROX/ALS EVENTS - NOT TO SCALE 9 FN7935.0 February 9, 2012 ISL29043 Ambient Light and IR Sensing The ISL29043 is set for ambient light sensing when Register bit ALSIR_MODE = 0 and ALS_EN = 1. The light-wavelength response of the ALS appears as shown in Figure 11. ALS measuring mode (as opposed to IR measuring mode) is set by default. When the part is programmed for infrared (IR) sensing (ALSIR_MODE = 1; ALS_EN = 1), infrared light is converted into a current and digitized by the same ALS ADC. The result of an IR conversion is strongly related to the amount of IR energy incident on our sensor, but is unitless and is referred to in digital counts. Proximity Sensing When proximity sensing is enabled (PROX_EN = 1), the internal IR LED is driven for 0.1ms by the built-in IR LED driver through the IRDR pin. The amplitude of the IR LED current depends on Register 1 bit 3: PROX_DR. If this bit is low, the load will see a fixed 110mA current pulse. If this bit is high, the load on IRDR will see a fixed 220mA current pulse, as seen in Figure 6. LED+ INTERNAL IR-LED LED- 220mA (PROX_DR = 1) PCB TRACE 110mA (PROX_DR = 0) (IRDR IS HI-Z WHEN NOT DRIVING) FIGURE 6. CURRENT DRIVE MODE OPTIONS When the IR from the LED reaches an object and gets reflected back into the ISL29043, the reflected IR light is converted into current as per the IR spectral response shown in Figure 11. One entire proximity measurement takes 0.54ms for one conversion (which includes 0.1ms spent driving the LED), and the period between proximity measurements is decided by PROX_SLP (sleep time) in Register 1 Bits 6:4. Average LED driving current consumption is given by Equation 1. (EQ. 1) A typical IRDR scheme is 220mA amplitude pulses every 800ms, which yields 28μA DC. Total Current Consumption Total current consumption is the sum of IDD and IIRDR. The IRDR pin sinks current (as shown in Figure 6) and the average IRDR current can be calculated using Equation 1. IDD depends on voltage and the mode-of-operation, as seen in Figure 15. Interrupt Function The ISL29043 has an intelligent interrupt scheme designed to shift some logic processing away from intensive microcontroller I2C polling routines (which consume power) and towards a more independent light sensor, which can instruct a system to “wake up” or “go to sleep”. 10 A proximity interrupt event (PROX_FLAG) is governed by the high and low thresholds in registers 3 and 4 (PROX_LT and PROX_HT). PROX_FLAG is set when the measured proximity data is more than the higher threshold X-times-in-a-row (X is set by user; see next paragraph). The proximity interrupt flag is cleared when the prox data is lower than the low proximity threshold X-times-in-a-row, or when the user writes “0” to PROX_FLAG. Interrupt persistency is another useful option available for both ALS and proximity measurements. Persistency requires X-in-arow interrupt flags before the INT pin is driven low. Both ALS and Prox have their own independent interrupt persistency options. See ALS_PRST and PROX_PRST bits in Register 2. The final interrupt option is the ability to AND or OR the two interrupt flags using Register 2 Bit 0 (INT_CTRL). If the user wants both ALS/Prox interrupts to happen at the same time before changing the state of the interrupt pin, set this bit high. If the user wants the interrupt pin to change state when either the ALS or the Proximity interrupt flag goes high, leave this bit to its default of 0. ALS Range 1 Considerations IRDR I lRDR ;PEAK × 100μs I lRDR ;AVE = -------------------------------------------------------T SLEEP An ALS interrupt event (ALS_FLAG) is governed by Registers 5 through 7. The user writes a high and low threshold value to these registers and the ISL29043 will issue an ALS interrupt flag if the actual count stored in Registers 0x9 and 0xA are outside the user’s programmed window. The user must write 0 to clear the ALS_FLAG. When measuring ALS counts higher than 1800 on range 1 (ALSIR_MODE = 0, ALS_RANGE = 0, ALS_DATA > 1800), switch to range 2 (change the ALS_RANGE bit from “0” to “1”) and re-measure ALS counts. This recommendation pertains only to applications where the light incident upon the sensor is IR-heavy and is distorted by tinted glass that increases the ratio of infrared to visible light. For more information, please contact the factory. VDD Power-up and Power Supply Considerations Upon power-up, please ensure a VDD slew rate of 0.5V/ms or greater. After power-up, or if the user’s power supply temporarily deviates from our specification (2.25V to 3.63V), Intersil recommends the user write the following: write 0x00 to register 0x01, write 0x29 to register 0x0F, write 0x00 to register 0x0E, and write 0x00 to register 0x0F. The user should then wait ~1ms or more and then rewrite all registers to the desired values. If the user prefers a hardware reset method instead of writing to test registers: set VDD = 0V for 1 second or more, power back up at the required slew rate, and write registers to the desired values. Power-Down To put the ISL29043 into a power-down state, the user can set both PROX_EN and ALS_EN bits to 0 in Register 1. Or more simply, set all of Register 1 to 0x00. Calculating Lux The ISL29043’s ADC output codes are directly proportional to lux when in ALS mode (see ALSIR_MODE bit). E calc = α RANGE × OUT ADC (EQ. 2) FN7935.0 February 9, 2012 ISL29043 In Equation 2, Ecalc is the calculated lux reading and OUT represents the ADC code. The constant α to plug in is determined by the range bit ALS_RANGE (register 0x1 bit 1) and is independent of the light source type. Table 15 shows two different scale factors: one for the low range (ALS_RANGE = 0) and the other for the high range (ALS_RANGE = 1). be attached to the PCB with a dispensed adhesive. Typical ISL29043 package height is 0.65 mm (see “Package Outline Drawing” on page 16) and the inside lower cavity of the baffle is 0.4mm deep. With the cavity depth less than the package height, the baffle does not reach fully to the PCB surface. This insures that the internal barrier rests squarely on the top surface of the package to prevent reflection of the IR-LED illumination toward the sensor. The example Light Baffle in Figure 7 is shown with a height of 1.1mm. However, the specific design-appropriate height varies according to actual system design requirements. If another material is chosen for a Light Baffle, the material should be soft and compliant and also should be matte black in finish to prevent reflection of the IR-LED illumination within a Light Baffle and surrounding structures underneath the cover-glass. Noise Rejection Suggested Light Baffle PCB Footprint Charge balancing ADC’s have excellent noise-rejection characteristics for periodic noise sources whose frequency is an integer multiple of the conversion rate. For instance, a 60Hz AC unwanted signal’s sum from 0ms to k*16.66ms (k = 1,2...ki) is zero. Similarly, setting the device’s integration time to be an integer multiple of the periodic noise signal greatly improves the light sensor output signal in the presence of noise. Since wall sockets may output at 60Hz or 50Hz, our integration time is 100ms: the lowest common integer number of cycles for both frequencies. The Light Baffle fits down over the entire ISL29043 package. The lower wall thickness of the Light Baffle around the ISL29043 package is 0.3mm. Therefore, the PCB layout should allow for a 0.3mm clear-zone immediately around the ISL29043 with no other surface components within this zone. TABLE 15. ALS SENSITIVITY AT DIFFERENT RANGES αRANGE ALS_RANGE (Lux/Count) 1 0.029 2 0.469 Proximity Detection of Various Objects Proximity sensing relies on the amount of IR reflected back from objects. A perfectly black object would absorb all light and reflect no photons. The ISL29043 is sensitive enough to detect black ESD foam, which reflects only 1% of IR. For biological objects, blonde hair reflects more than brown hair and customers may notice that skin tissue is much more reflective than hair. IR penetrates into the skin and is reflected or scattered back from within. As a result, the proximity count peaks at contact and monotonically decreases as skin moves away. The reflective characteristics of skin are very different from that of paper. Typical Opto-Mechanical Configuration Typical applications for the ISL29043 involve use under a cover-glass, or optical window. Typically, these glass components are not coated to prevent unwanted reflections. Standard glass and many plastic materials will reflect 4% of the incident light at each surface. Reflected light emanating from the internal IR-LED may be incident on the ALS/Proximity sensor and cause significant DC-Offset in the detected signals. To prevent this situation, the device should be used with a Light Baffle, as shown in Figure 7. A Light Baffle prevents unwanted illumination from the IR-LED from reaching the ALS/Proximity sensors while not interfering with normal Ambient Light Sensing or Proximity detection. The Baffle should be the limiting aperture for both the IR-LED and the ALS/Prox sensor. Care should be taken to insure there is no other obstruction in the light path. Operation Without a Light Baffle For some product designs, it may be advantageous to use the ISL29043 under the cover-glass without a Light Baffle. For these applications, it is recommended that the opto-mechanical design place the top surface of the ISL29043 package in direct contact with the inside surface of the cover-glass. This configuration significantly reduces the IR-LED illumination reflection from the inside surface of the cover-glass and reduces the DC-Offset of the proximity sensor. For typical operational performance comparison, Figure 8 shows a graph of the proximity response for a standard 18% Kodak Gray Card target over a range of 0 to 100 mm for the same ISL29043 device with: a. No cover-glass, b. Cover-glass (0.9 mm thick, ~75%T at 850nm) with Light Baffle, c. Cover-glass (0.9 mm thick, ~75%T at 850nm) without Light Baffle and in contact with cover-glass, and, d. Cover-glass (0.9 mm thick, ~75%T at 850nm) without Light Baffle and spaced 0.1 mm below cover-glass. Also, it is highly recommended that only IRDR = 110mA be used when operating the ISL29043 without a a Light Baffle as the IRDR = 220mA setting may cause a large DC-Offset even with the ISL29043 placed in direct contact with the inside surface of the cover glass. A Light Baffle is made from a soft, compliant plastic, or rubber material such as urethane, or silicone. The material should be mechanically compliant since a designer desires it to fill the separation between the PCB and the cover-glass and should not produce undue stress on the thin cover-glass. A Light Baffle is designed to fit completely over the ISL29043 package and may 11 FN7935.0 February 9, 2012 ISL29043 FIGURE 7. EXAMPLE LIGHT BAFFLE DESIGN Suggested PCB Footprint PROX ADC COUNT 250 It is important that users check the “Surface Mount Assembly Guidelines for Optical Dual FlatPack No Lead (ODFN) Package” before starting ODFN product board mounting. However, this device requires a special solder reflow profile as mentioned in Figure 4 in TB489 (Surface Mount Guidelines for Optical Co-packages). NO BAFFLE, 0.1mm FROM GLASS 200 AGAINST GLASS, NO BAFFLE 150 NO COVER GLASS 100 0 http://www.intersil.com/data/tb/TB489.pdf GLASS W/ BAFFLE 50 Layout Considerations 0 10 20 30 40 50 60 DISTANCE (mm) 70 80 90 FIGURE 8. PROXIMITY COMPARISON WITHOUT LIGHT BAFFLE (IRDR = 110mA) Typical Circuit A typical application for the ISL29043 is shown in Figure 9. The ISL29043’s I2C address is internally hardwired as 0b100010<x>, with x representing the logic state of input I2C address pin ADDR0. The device can be tied onto a system’s I2C bus together with other I2C compliant devices. The ISL29043 is relatively insensitive to layout. Like other I2C devices, it is intended to provide excellent performance even in significantly noisy environments. There are only a few considerations that will ensure best performance. Route the supply and I2C traces as far as possible from all sources of noise. 0.1µF and 1µF power supply decoupling capacitors need to be placed close to the device. Soldering Considerations Convection heating is recommended for reflow soldering; direct-infrared heating is not recommended. The plastic ODFN package requires a custom reflow soldering profile pursuant to Figure 4 in TB489 (Surface Mount Assembly Guidelines for Optical Dual Flat No Lead (ODFN) Co-Packages). 12 FN7935.0 February 9, 2012 ISL29043 VI2C PULL-UP R2 10kΩ R1 10kΩ I2C MASTER R3 10kΩ MICROCONTROLLER INT SDA SCL VDD VLED SLAVE_0 C1 1.0µF 1 LED+ C3 0.1µF 10 I2C SLAVE_n SLAVE_1 2 3 C2 1µF LED- 4 5 ADDR0 IRDR VDD INT GND SDA REXT SCL REXT 499kΩ 9 8 SDA SDA SCL SCL 7 6 ISL29043 FIGURE 9. ISL29043 TYPICAL CIRCUIT Typical Performance Curves VDD = 3.0V, REXT = 499kΩ. 1.0 1.0 0.9 FLUORESCENT NORMALIZED RESPONSE NORMALIZED INTENSITY 0.8 0.7 0.6 HALOGEN 0.5 INCAND. SUN 0.4 HUMAN EYE 0.9 0.3 0.2 0.1 0.8 IR/PROX ALS 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 350 550 750 0.0 300 950 400 500 600 1.0 4500 0.9 4000 0.8 0.7 0.6 0.5 0.4 0.3 3500 3000 500 30 FIGURE 12. ANGULAR SENSITIVITY 13 1100 60 90 FLUORESCENT 1500 1000 0 ANGLE (°) 1000 2000 0.1 -30 900 HALOGEN INCANDESCENT 2500 0.2 -60 800 FIGURE 11. ISL29043 SENSITIVITY TO DIFFERENT WAVELENGTHS ALS CODE (1-2 BIT) NORMALIZED SENSITIVITY FIGURE 10. SPECTRUM OF FOUR LIGHT SOURCES NORMALIZED BY LUMINOUS INTENSITY (LUX) 0 -90 700 WAVELENGTH (nm) WAVELENGTH (nm) 0 0 500 1000 1500 2000 LUX METER READING (lx) FIGURE 13. ALS LINEARITY OVER 2 LIGHT SOURCES (2000 LUX RANGE) FN7935.0 February 9, 2012 ISL29043 Typical Performance Curves VDD = 3.0V, REXT = 499kΩ. (Continued) 160 255 MEASURED IDD (µA) PROX COUNTS (8-BIT) ALS+PROX (DURING PROX SLEEP) 140 204 110mA (18% GREY CARD) 220mA (18% GREY CARD) 153 110mA (WHITE COPY PAPER) 102 220mA (WHITE COPY PAPER) ALS-ONLY 120 100 51 0 80 PROX (DURING PROX SLEEP) 60 0 25 50 75 100 125 40 2.25 150 2.40 2.55 2.70 220mA-MODE (PROX_DR = 1) IIRDR (mA) 200 180 160 140 120 110mA-MODE (PROX_DR = 0) 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VIRDR (V) FIGURE 16. IRDR PULSE AMPLITUDE vs VIRDR FIGURE 18. IR-LED LATERAL EMISSION PATTERN (NORMALIZED INTENSITY vs ΘLAT) 14 3.15 3.30 3.45 3.60 5.0 10 8 6 4 2 0 -2 -4 -6 -8 -10 " 240 100 3.00 FIGURE 15. VDD vs IDD FOR VARIOUS MODES OF OPERATION ALS OUTPUT CHANGE FROM +25°C (%) FIGURE 14. PROX COUNTS vs DISTANCE WITH 10cmx10cm REFLECTORS 220 2.85 INPUT VDD (V) DISTANCE (mm) -40 -20 0 20 40 60 80 TEMPERATURE (°C) FIGURE 17. STABILITY OF ALS COUNT OVER TEMP (AT 325 LUX) FIGURE 19. IR-LED TRANSVERSE EMISSION PATTERN (NORMALIZED INTENSITY vs ΘTRANS) FN7935.0 February 9, 2012 ISL29043 Typical Performance Curves VDD = 3.0V, REXT = 499kΩ. (Continued) θLateral θTransverse FIGURE 20. DEFINITION OF LATERAL AND TRANSVERSE AXES Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE REVISION February 9, 2012 FN7935.0 CHANGE Initial release. Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL29043 To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff FITs are available from our website at: http://rel.intersil.com/reports/sear For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 15 FN7935.0 February 9, 2012 ISL29043 Package Outline Drawing L10.2.1X3.5E 10 LEAD OPTICAL CO-PACKAGE Rev 2, 1/12 0.37 A 2.10 0.36 B PIN # 1 0.37 (0.39) 6 PIN 1 INDEX AREA 0.36 10 0.37 1.24 0.25 1.00 0.20 4 ISL29028 3.50 0.90 0.50 29030 0.49 6 (4X) 5 0.10 0.10 M C A B 0.63 0.63 0.41 TOP VIEW BOTTOM VIEW SEE DETAIL "X" 0.10 C C BASE PLANE SEATING PLANE 0.08 C 0.20 (0.17) 0.68 ± 0.065 SIDE VIEW C 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. DETAIL "X" 0.86 PACKAGE OUTLINE 0.44 0.37 0.03 (0.20) SIDE VIEW 0.37 1.00 0.15 NOTES: 0.50 0.20 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance: Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.015mm and 0.30mm from the terminal tip. 0.81 2.49 0.44 TYPICAL RECOMMENDED LAND PATTERN 16 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is guaranteed by the non-symmetry of the package created by the 2 omitted pads. FN7935.0 February 9, 2012