Intersil ISL6112EVAL1Z Dual slot pci-express power controller Datasheet

ISL6112
®
Data Sheet
September 28, 2007
FN6456.0
Dual Slot PCI-Express Power Controller
Features
The ISL6112 targets the PCI-Express add-in card hot plug
application. Together with two each of N-Channel and
P-Channel MOSFETs, four current sense resistors and
several external passive components the ISL6112 provides
a compliant hot plug power control solution to any
combination of two PCI-Express X1, X4, X8 or X16 slots.
• Supports Two Independent PCI Express Slots
• Highest Available Accuracy External RSENSE Current
Monitoring on Main Supplies
• Programmable Current Regulation Protection Function for
X1, X4, X8, X16 Connectors
The ISL6112 features the ability to program a maximum
current regulated level for each of the MAIN outputs for a
common programmable duration so that both fault isolation
protection and imperviousness to electrical transients (OC
and soft-start protection) are provided to each system
supply. For each 12VMAIN supply, the current regulated
(CR) level is set by a resistor value dependant on the size of
the PCI-Express connector (X1, X4/X8 or X16) to be
powered. This resistor is a sub ohm standard value current
sense resistor one each for each of the 3VMAIN and
12VMAIN supplies. The voltage across this resistor is
compared to a 50mV reference providing a nominal CR
protection level which would be set above the maximum
specified slot limits. The 3.3V supply can use a 15mΩ sense
resistor compared to a 50mV reference to provide a nominal
regulated current limit of 3.3A to all connector sizes. A
shutdown without a CR duration delay is invoked if RSENSE
voltage is >100mV. The VAUX is internally monitored and
controlled to provide nominal limiting to 1A of load current.
The ISL6112 is System Management Interface (SMI)
capable with an integrated SMBus link for communication,
control, monitoring and reporting of IC and slot conditions.
Information such as UV, OC, STATUS, power level etc. are
available. Additionally the IC has a minimum of I/O for
implementations where Hot-Plug Hardware Interface (HPI) is
implemented.
• 12V, 3.3V, and 3.3VAUX Supplies Supported per PCI
Express Specification V1.0A
• Voltage Tolerant I/O SMBus Interface for Slot Power
Control and Status, compatible with SMBus 2.0 Systems
• Programmable Current Regulation Duration
• Programmable In-rush Current Limiting
• Dual Level Fault Detection for Quick Fault Response
without Nuisance Tripping
• Slot to Slot Electrical and Thermal Isolation
• Two General Purpose Input Pins Suitable for Interface to
Logic and Switches.
• TQFP or QFN Pb-Free Package Options
- TQFP is pin for pin equivalent to MIC2592B-2YTQ and
is compatible with the TPS2363 pinout
- The QFN package is 40% smaller and has lower die to
case thermal impedance than the TQFP
• Pb-Free (RoHS Compliant)
Applications
• PCI Express V1.0A hot-plug power control
• PCI-Express Servers
• Power Supply Distribution and Control
Ordering Information
PART NUMBER
(Note)
PART MARKING
PACKAGE
(Pb-Free)
TEMP RANGE (°C)
PKG. DWG. #
ISL6112IRZA
ISL6112 IRZ
-40 to +85
48 Ld 7x7 QFN
L48.7x7
ISL6112IRZA-T*
ISL6112 IRZ
-40 to +85
48 Ld 7x7 QFN Tape and Reel
L48.7x7
ISL6112INZA
ISL6112 INZ
-40 to +85
48 Ld 7x7 TQFP
Q48.7x7
ISL6112INZA-T*
ISL6112 INZ
-40 to +85
48 Ld 7x7 TQFP Tape and Reel
Q48.7x7
ISL6112EVAL1Z
Evaluation Platform
*Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2007. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL6112
Functional Block Diagram (1 Channel)
ON
AUXEN
VSTBY
12VIN
POWER-ON
RESET
250µs
VSTBY
UVLO
12VGATE
VAUX CHARGE
PUMP AND
MOSFET
VAUX
12VSENSE
12VIN
50mV
VAUX
OVERCURRENT
12V
UVLO
3VIN
50mV
ON/OFF
3VGATE
12V BIAS
ON/OFF
3VSENSE
3VIN
100mV*
PWRGD
THERMAL
SHUTDOWN
ON/OFF
100mV*
ON/OFF
3V
UVLO
FAULT
ON/
OFF
VSTBY
IREF
VAUX
PWRGD
LOGIC CIRCUITS
12VPWRGD
12VOUT
CFILTER
10.5V
1.25V
3VPWRGD
3VOUT
DIGITAL CORE/SERIAL INTERFACE
2.8V
VSTBY
INT
40kΩ x 3
FORCE_ON
GND
GPI
SCL SDA
A2 A1 A0
BOTH A AND B SLOTS SHARE THE SCL, SDA, A0, A1, A2, INT PINS.
2
FN6456.0
September 28, 2007
ISL6112
Pinouts
INT
GPI_B0
A2
A1
A0
AUXENB
ONB
ONA
AUXENA
GND
SCL
SDA
ISL6112
(48 LD 7X7 TQFP)
TOP VIEW
48 47 46 45 44 43 42 41 40 39 38 37
FAULTA
1
36
CFILTERA
2
35
CFILTERB
12VGATEA
3
34
12VGATEB
GPI_A0
4
33
GND
12VINA
5
32
12VINB
PWRGDA
PWRGDB
FAULTB
6
31
NC
7
30
NC
12VSENSEA
8
29
12VSENSEB
FORCE_ONA
9
28
FORCE_ONB
12VOUTA
10
27
12VOUTB
VSTBYA
11
26
VSTBYB
3VINA
12
25
3VINB
3VSENSEB
3VGATEB
VAUXB
3VOUTB
NC
NC
NC
GND
3VOUTA
VAUXA
3VGATEA
3VSENSEA
13 14 15 16 17 18 19 20 21 22 23 24
INT
GPI_B0
A2
A1
A0
AUXENB
ONB
ONA
AUXENA
GND
SCL
SDA
ISL6112
(48 LD 7X7 QFN)
TOP VIEW
48 47 46 45 44 43 42 41 40 39 38 37
FAULTA
1
36
FAULTB
CFILTERA
2
35
CFILTERB
12VGATEA
3
34
12VGATEB
GPI_A0
4
33
GND
12VINA
5
32
12VINB
PWRGDA
6
31
PWRGDB
NC
7
30
NC
12VSENSEA
8
29
12VSENSEB
FORCE_ONA
9
28
FORCE_ONB
12VOUTA 10
27
12VOUTB
VSTBYA 11
26
VSTBYB
3VINA 12
25
3VINB
GND
(EXPOSED BOTTOM PAD)
3
3VSENSEB
3VGATEB
VAUXB
3VOUTB
NC
NC
NC
GND
3VOUTA
VAUXA
3VGATEA
3VSENSEA
13 14 15 16 17 18 19 20 21 22 23 24
FN6456.0
September 28, 2007
ISL6112
Pin Descriptions (Pin Numbers and Names are Related)
PIN NUMBER
PIN NAME
PIN FUNCTION
5, 32
12VINA, 12VINB
Provides 12VMAIN power supply and the high side of the sense resistor inputs. This must be a Kelvin
connection between IC and sense resistor. An undervoltage lockout circuit (UVLO) prevents the switches
from turning on while this input is less than its lockout threshold.
12, 25
3VINA, 3VINB
Provides 3.3VMAIN power supply and the high side of the sense resistor inputs. This must be a Kelvin
connection between IC and sense resistor. An undervoltage lockout circuit (UVLO) prevents the switches
from turning on while this input is less than its lockout threshold.
16, 21
3VOUTA, 3VOUTB 3.3VOUT. Connected to 3.3V FET source. These are used to monitor the 3.3V output voltages for Power
Good status.
10, 27
12VOUTA,
12VOUTB
8, 29
12VSENSEA,
12VSENSEB
12VMAIN low side of sense resistor connection. When either current limit threshold of the load current
across the sense resistor = 50mV is reached, the related 12VGATE pin is modulated to maintain a
constant voltage across the sense resistor and thus a constant current into the load. If the 50mV threshold
is exceeded for tFLT, the isolation protection is tripped and the GATE pin for the affected supply’s external
MOSFET is immediately pulled high. This must be a Kelvin connection between IC and sense resistor.
13, 24
3VSENSEA,
3VSENSEB
3.3VMAIN low side of sense resistor connection. When either current limit threshold of the load current
across the sense resistor = 50mV is reached, the related 3V GATE pin is modulated to maintain a constant
voltage across the sense resistor and thus a constant current into the load. If the 50mV threshold is
exceeded for tFLT, the isolation protection is tripped and the GATE pin for the affected supply’s external
MOSFET is immediately pulled low. This must be a Kelvin connection between IC and sense resistor.
3, 34
12VGATEA
12VGATEB
12V Gate Drive Outputs: Each pin connects to the gate of an external P-Channel MOSFET. During
power-up, the CGATE and the CGS of the MOSFETs are connected to a 25µA current sink. This controls
the value of dv/dt seen at the source of the MOSFETs. During current limit events, the voltage at this pin
is adjusted to maintain constant current through the switch for a period of tFLT. Whenever an overcurrent,
thermal shutdown, or input undervoltage fault condition occurs, the GATE pin for the affected slot is
immediately brought high. These pins are charged by an internal current source during power-down.
14, 23
3VGATEA
3VGATEB
3V Gate Drive Outputs: Each pin connects to the gate of an external N-Channel MOSFET. During powerup, the CGATE and the CGS of the MOSFETs are connected to a 25µA current source. This controls the
value of dv/dt seen at the source of the MOSFETs, and hence the current flowing into the load capacitance.
During current limit events, the voltage at this pin is adjusted to maintain constant current through the
switch for a period of tFLT. Whenever an overcurrent, thermal shutdown, or input undervoltage fault
condition occurs, the GATE pin for the affected slot is immediately brought low. During power-down, these
pins are discharged by an internal current source.
11, 26
12VOUT. Connected to 12V FET drain. These are used to monitor the 3.3V output voltages for Power
Good status.
VSTBYA, VSTBYB 3.3V Standby Input Voltage: Required to support PCI Express VAUX output. Additionally, the SMBus logic
and internal registers run off of VSTBY to ensure that the chip is accessible during standby modes. A
UVLO circuit prevents turn-on of this supply until VSTBY rises above its UVLO threshold. Both pins must
be externally connected together at the ISL6112 controller.
15, 22
VAUXA, VAUXB
3.3VAUX Outputs to PCI Express Card Slots: These outputs connect the 3.3AUX pin of the PCI Express
connectors to VSTBY via internal 400mΩ MOSFETs. These outputs are 1A current limited and protected
against short-circuit faults.
44, 43
ONA, ONB
Enable Inputs: Rising-edge triggered. Used to enable or disable the MAINA and MAINB (+3.3V and +12V)
outputs. Taking ON low after a fault resets the +12V and/or +3.3V fault latches for the affected slot. Tie
these pins to GND if using SMI power control. Also, see pin description for FAULTA and FAULTB.
45, 42
AUXENA, AUXENB Level sensitive auxiliary enable Inputs. Used to enable or disable the VAUX outputs. Taking AUXEN low
after a fault resets the respective slot’s Aux Output Fault Latch. Tie these pins to GND if using SMI power
control. Also, see pin description for FAULTA and FAULTB.
2, 35
CFILTERA,
CFILTERB
Overcurrent Timers: Capacitors connected between these pins and GND set the duration of CRTIM.
CRTIM is the amount of time for which a slot remains in current limit before its isolation protection is
invoked.
6, 31
PWRGDA
PWRGDB
Power-is-Good Outputs: Open-drain, active-low. Asserted when a slot has been commanded to turn on
and has successfully begun delivering power to its respective +12V, +3.3V, and VAUX outputs. Each pin
requires an external pull-up resistor to VSTBY.
4
FN6456.0
September 28, 2007
ISL6112
Pin Descriptions (Pin Numbers and Names are Related)
(Continued)
PIN NUMBER
PIN NAME
PIN FUNCTION
1, 36
FAULTA, FAULTB
Fault Outputs: Open-drain, active-low. Asserted whenever the isolation protection trips due to a fault
condition (overcurrent, input undervoltage, over-temperature). Each pin requires an external pull-up
resistor to VSTBY. Bringing the slot’s ON pin low resets FAULT if FAULT was asserted in response to a
fault condition on one of the slot’s MAIN outputs (+12V or +3.3V). FAULT is reset by bringing the slot’s
AUXEN pin low if FAULT was asserted in response to a fault condition on the slot’s VAUX output. If a fault
condition occurred on both the MAIN and VAUX outputs of the same slot, then both ON and AUXEN must
be brought low to de-assert the FAULT output.
9, 28
FORCE_ONA
FORCE_ONB
Enable Inputs: Active-low, level-sensitive. Asserting a FORCE_ON input will turn on all three of the
respective slot’s outputs (+12V, +3.3V, and VAUX), while specifically defeating all protections on those
supplies. This explicitly includes all overcurrent and short circuit protections, and on-chip thermal
protection for the VAUX supplies. Additionally included are the UVLO protections for the +3.3V and
+12VMAIN supplies. The FORCE_ON pins do not disable UVLO protection for the VAUX supplies. These
input pins are intended for diagnostic purposes only. Asserting FORCE_ON will cause the respective slot’s
PWRGD and FAULT pins to enter their open-drain state. Note that the SMBus register set will continue to
reflect the actual state of each slot’s supplies. There is a pair of register bits, accessible via the SMBus,
which can be set to disable (unconditionally de-assert) either or both of the FORCE_ON pins -- See
CNTRL Register Bit D[2].
4, 38
GPI_A0, GPI_B0
39, 40, 41
A2, A1, A0
48
SDA
Bidirectional SMBus data line.
47
SCL
SMBus Clock Input.
37
INT
Interrupt Output. Open-drain, active-low. output. Asserted whenever a power fault is detected if the
INTMSK bit (CS Register Bit D[3]) is a logical “0”. This output is cleared by performing an “echo reset” to
the appropriate fault bit(s) in the STAT and/or CS registers. This pin requires an external pull-up resistor
to VSTBY.
17, 33, 46
GND
7, 18, 19, 20, 30
NC
General Purpose Inputs: The states of these two inputs are available by reading the Common Status
Register, Bits [4:5]. If not used, connect each pin to GND.
SMBus Address Select Pins. Connect to ground or leave open in order to program device SMBus base
address. These inputs have internal pull-up resistors to VSTBY. Address programmed on rising VSTBY.
IC Reference pins. Connect together and tie directly to the system’s analog GND plane directly at the
device.
Reserved: Make no external connections to these pins.
5
FN6456.0
September 28, 2007
ISL6112
Absolute Maximum Ratings (Note 4)
Thermal Information
12VIN, 12VSENSE, 12VOUT . . . . . . . . . . . . . . . . . . . . . . . . +14.5V
VSTBY, 3VIN, 3VSENSE, 3VOUT . . . . . . . . . . . . . . . . . . . . . . . +7V
12VGATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 12VI
3VGATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 12VI
Logic I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +5.5V
VAUX Output Current . . . . . . . . . . . . . . . . . .Short Circuit Protected
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .200V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1kV
Thermal Resistance (Typical)
θJA (°C/W)
θJC (°C/W)
48 Ld 7x7 TQFP Package (Note 1) . . .
57
N/A
48 Ld 7x7 QFN Package (Notes 2, 3) .
27
3
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
12VMAIN Supply Voltage Range. . . . . . . . . . . . . . . . . +12V ± -10%
3.3VMAIN Supply Voltage Range . . . . . . . . . . . . . . . . +3.3V ± -10%
AUXI Supply Voltage Range . . . . . . . . . . . . . . . . . . . . +3.3V ± -10%
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
4. All voltages are relative to GND, unless otherwise specified.
Electrical Specifications
12VIN = 12V, 3VIN = 3.3V, VSTBY = 3.3V, TA = TJ = -40°C to +85°C, Unless Otherwise Noted.
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX
UNITS
0.9
1.5
mA
ICC3.3
0.1
0.2
mA
ICCSTBY
5
6
mA
POWER CONTROL AND LOGIC SECTIONS
Supply Current
ICC12
Undervoltage Lockout Thresholds
HPI Enabled or SMI enabled with no load
VUVLO(12V)
12VIN increasing
8
9
10
V
VUVLO(3V)
3VIN increasing
2.1
2.5
2.75
V
VSTBY increasing
2.8
2.9
2.96
VUVLO(STBY)
V
Undervoltage Lockout Hysteresis
12VIN, 3VIN
VHYSUV
180
mV
Undervoltage Lockout Hysteresis
VSTBY
VHYSSTBY
50
mV
Power-Good Undervoltage
Thresholds
VUVTH(12V)
12VOUT decreasing
VUVTH(3V)
VUVTH(VAUX)
Power-Good Detect Hysteresis
10.15
10.5
10.75
V
3VOUT decreasing
2.7
2.8
2.9
V
VAUX decreasing
2.55
2.8
3
V
0
0.4
0.55
17
25
35
µA
35
72
-
mA
VHYSPG
12VGATE Voltage
VGATE (12V)
12VGATE Sink Current
30
Max. Gate Voltage when Enabled
IGATE(12VSINK) Start Cycle
12VGATE Pull-up Current (Fault Off)
3VGATE Voltage
IGATE
(12VPULL-UP)
VGATE(3V)
3VGATE Charge Current
IGATE
(3VCHARGE)
3VGATE Sink Current (Fault Off)
IGATE(3VSINK)
6
Any fault condition
(VDD – VGATE) = 2.5V
Minimum Gate Voltage when Enabled
mV
12VIN – 0.3 12VIN – 0.2 12VIN
Start Cycle
17
25
Any fault condition
VGATE = 2.5V
80
105
35
V
V
µA
mA
FN6456.0
September 28, 2007
ISL6112
Electrical Specifications
12VIN = 12V, 3VIN = 3.3V, VSTBY = 3.3V, TA = TJ = -40°C to +85°C, Unless Otherwise Noted. (Continued)
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX
UNITS
1.20
1.25
1.30
V
2
2.5
3
µA
CFILTER OVERCURRENT DELAY TIME PINS 2 AND 35 FLOATING
CFILTER Threshold Voltage
VFILTER
CFILTER Charging Current
Nominal Current Limit Duration =
CCFILTER x 550k
IFILTER
VXVIN – VXSENSE > VTHILIMIT
tFILTER
CFILTER Open
Current Limit Threshold Voltages
VTHILIMIT
VXIN – VXVSENSE
Fast-Trip Threshold Voltages
VTHFAST
VXVIN – VXVSENSE
XVSENSE Input Current
50
52.5
mV
85
100
115
mV
0.1
ISENSE
LOW-Level Input Voltage ON,
AUXEN, GPI, FORCE_ON, PRSNT
VIL
Output LOW Voltage FAULT,
PWRGD
VOL
HIGH-Level Input Voltage ON,
AUXEN, GPI, FORCE_ON
VIH
Internal Pull-ups to VSTBY (Note 5)
RPULL-UP
12VIN, 3VIN Input Leakage Current
ILKG,OFF XVIN
Input Leakage Current, ON, AUXEN,
FORCE_ON
IIL
Off-State Leakage Current FAULT,
PWRGD, GPI
ILKG(OFF)
Over-temperature Shutdown and
Reset Thresholds, with Overcurrent
On Slot
TOV
Over-temperature Shutdown and
Reset Thresholds, All Other
Conditions (All Outputs Will Latch Off)
Output MOSFET Resistance VAUX
MOSFET
Off-State Output Offset Voltage VAUX
rDS(AUX)
VOFF(VAUX)
µs
10
47.5
0.8
V
0.4
V
5
V
40
50
kΩ
0.5
1
µA
-2
2
µA
-2
2
µA
IOL = 3mA
2.1.
VSTBY = +3.3V, 12VIN = OFF; 3VIN = OFF
GPI ILKG for these two pins measured with
VAUX OFF
µA
TJ increasing, each slot (Note 5)
140
°C
TJ decreasing, each slot (Note 5)
130
°C
TJ increasing, each slot (Note 5)
160
°C
TJ decreasing, each slot (Note 5)
150
°C
350
mΩ
25
40
mV
1
1.2
A
IDS = 375mA
VAUX = Off
0.8
Regulated Current Level
ILIM(AUX)
Output Discharge Resistance
RDIS(12V)
12VOUT = 6.0V
1400
1850
Ω
RDIS(3V)
3VOUT = 1.65V
140
180
Ω
RDIS(VAUX)
3VAUX = 1.65V
350
400
Ω
12V Current Limit Response Time
(See “Typical Application Diagram”
on page 9).
tOFF(12V)
CGATE = 25pF
VIN – VSENSE = 140mV
1
2.1
µs
3.3V Current Limit Response Time
(See “Typical Application Diagram”
on page 9).
tOFF(3V)
CGATE = 25pF
VIN – VSENSE = 140mV
0.3
1
µs
VAUX Current Limit Response Time
(See “Typical Application Diagram”
on page 9).
tSC
VAUX = 0V, VSTBY = +3.3V
2.5
µs
1
µs
1
µs
Delay from MAIN Overcurrent to
FAULT Output
CFILTER = 0
tPROP
(12V FAULT or 3V VIN – VSENSE = 140mV
FAULT)
Delay from VAUX Overcurrent to
FAULT Output
tPROP
(VAUXFAULT)
ILIM(AUX) to FAULT output CFILTER = 0
VAUX Output Grounded
ON, AUXEN, PRSNT Minimum Pulse
Width
tW
(Note 5)
100
ns
Power-On Reset Time after VSTBY
Becomes Valid
tPOR
(Note 5)
250
µs
7
FN6456.0
September 28, 2007
ISL6112
Electrical Specifications
12VIN = 12V, 3VIN = 3.3V, VSTBY = 3.3V, TA = TJ = -40°C to +85°C, Unless Otherwise Noted. (Continued)
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX
UNITS
SMBUS TIMING
SCL (clock) period
t1
(Note 5)
2.5
µs
Data In setup time to SCL HIGH
t2
(Note 5)
100
ns
Data Out stable after SCL LOW
t3
(Note 5)
300
ns
Data LOW setup time to SCL LOW
t4
(Note 5)
100
ns
Data HIGH hold time after SCL HIGH
t5
(Note 5)
100
ns
NOTE:
5. Limits established by design and are not production tested.
8
FN6456.0
September 28, 2007
ISL6112
Typical Application Diagram
+12V
SYSTEM
POWER +3.3V
SUPPLY
VSTBY
0.1µF
PCI-EXPRESS CONNECTOR
0.1µF
11
26
15
VSTBYA VSTBYB VAUXA
12VINA
2 CFILTERA
VSTBY
35 CFILTERB
C1
C2
100k
100k
100k 100k
9
FORCE_ONA
28
FORCE_ONB
4
GPI_A0
38
GPI_B0
VSTBY
AUXENA
AUXENB
ONA
ONB
VSTBY
HOT-PLUG
CONTROLLER
PWRGDA
PWRGDB
FAULTA
FAULTB
40
VSTBY
RSENSE^
#CGS
22nF
3
12VGATEA
#CGD
6800pF
12VOUTA 10
3VINA 12
FORCE_ONB
12V
2.1A (x4/x8)
0.1µF
RSENSE^
0.015Ω
3VSENSEA 13
GPI_B0
3VGATEB 23
A0
A1
39
A2
37 INT
47 SCL
15Ω
17
#CGATE
22nF
GND
GND
33
3.3V
3.0A
RSENSE^
12V
2.1A (x4/x8)
RSENSE^
0.015Ω
*R3VGATEB
3VOUTB 21
VAUXB 22
48 SDA
3.3V
3.0A
3.3AUX
375mA
GND 46
PCI
EXPRESS
DATA BUS
10k x 3
SMBUS I/O
SDA
SDA
SCL
SCL MANAGEMENT
CONTROLLER
INT
INT
3.3AUX
375mA
*R12VGATEA
15Ω
*R3VGATEA
3VGATEA 14
15Ω
3VOUTA 16
# CGATE
ISL6112
22nF
10k x 4
12VINB 32
0.1µF
45
AUXENA
42
12VSENSEB 29
AUXENB
44
#CGS *R12VGATEB
ONA
22nF
43
15Ω
34
ONB
12VGATEB
#CGD
6800pF
12VOUTB 27
10k x 4
0.1µF
6
PWRGDA
31
3VINB
PWRGDB
25
1
FAULTA
24
36
3VSENSEB
FAULTB
41
SMBUS
BASE
ADDRESS
5
12VSENSEA 8
FORCE_ONA
GPI_A0
PCI
EXPRESS
BUS
0.1µF
PCI-EXPRESS CONNECTOR
* Values for R12VGATE and R3VGATE may vary
depending upon the CGS of the external MOSFETs.
# These components are not required for ISL6112
operation but can be implemented for GATE output
slew rate control (application specific)
• Bold lines indicate high current paths
^ RSENSE value is application specific
9
FN6456.0
September 28, 2007
ISL6112
Functional Description
Current Regulation (CR) Duration
The ISL6112 protects the power supplies in PCI-Express
systems that utilize hot-pluggable add-in cards. This IC
together with two each of N-Channel and P-Channel
MOSFETs, four current sense resistors and a few external
passive components, provide a compliant hot plug power
control solution to any combination of two PCI-Express X1,
X4, X8 or X16 slots.
The CR duration for each slot is set by an external capacitor
between the associated CFILTER pin and ground. This
feature masks current transients and overcurrents prior to
supply turn-off. Once the CR duration has expired, the IC
then quickly turns-off the associated MAIN outputs via its
external FETs or the failed AUX output, unloading the faulted
load card from the supply voltage rails.
The ISL6112 primarily features start-up in-rush current
protection, maximum current regulated (CR) levels for each
of the MAIN and AUX outputs, programmable CR duration
so that both fault isolation protection and imperviousness to
electrical transients are provided. The ISL6112 also offers
input and output voltage supervisory functions and two
operational system interfaces for implementation flexibility.
UVLO, Power Good and FAULT
In-Rush Current Protection
When any electronic circuitry is powered up, there is an
in-rush of current due to the charging of bulk capacitance
that resides across the circuit board’s supply pins. This
transient in-rush current may cause the systems supply
voltages to temporarily droop out of regulation, causing data
loss or system lock-up. The ISL6112 addresses these issues
by limiting the in-rush currents to the PCI-Express add-in
cards, and thereby controlling the rate at which the loads
circuits turn-on. See Figures 2, 3, 4, 5, 6 and 7 for AUX and
MAIN turn-on examples illustrating the current limiting
capabilities across a variety of compensation component
values.
MAIN Supply Overcurrent Protection
For each of the 3VMAIN and 12VMAIN supplies, the current
regulated (CR) levels are set by a sub ohm value sense
resistor. The value for the 12VMAIN is dependant on the size
of the PCI-Express connector (X1, X4/X8 or X16) to be
powered. The voltage across this resistor is compared to a
50mV internal reference providing a nominal CR protection
level which would be set above the maximum specified slot
limits. The 3.3VMAIN supply can use a 15mΩ sense resistor
compared to a 50mV reference to provide a nominal
regulated current limit of 3.3A, as this supply has a common
3A maximum across all slot sizes. For both MAIN supplies,
there is a Way Overcurrent (WOC) shutdown protocol that is
without a CR duration. WOC is invoked if the load current
causes the RSENSE voltage to be >100mV. See Figures 10
and 11.
VAUX Supply Overcurrent Protection
The VAUX load current is internally monitored and controlled
via an internal power FET. This FET has a typical rDS(ON) of
320mW at a VAUX current of 375mA to minimize distribution
losses to typically <100mV through the IC. Using active
monitoring and control, the ISL6112 provides nominal
limiting to ~1000mA of load current across the temperature
range and for various loading conditions. See Figures 2, 12
and 13 for examples of this performance.
10
The ISL6112 incorporates undervoltage lock out (UVLO)
protections on each of the four MAIN VIN and two VSTBY
supplies to prevent operation during a ‘brown out’ condition.
Likewise on the outputs are minimum voltage compliances
that must be satisfied for the Power Good output, PWRGD to
be asserted. There is some hysteresis on the UVLO levels
as the voltage on VIN decreases to ensure IC operation
below the minimum operating supply standards. The FAULT
output is asserted (low) whenever there is an OC, OT or UV
condition. The FAULT is cleared once the appropriate enable
is deasserted.
Operational System Interfaces
The ISL6112 employs two system interfaces: the hardware
Hot-Plug Interface (HPI) and the System Management
Interface (SMI). The HPI I/O includes ON, AUXEN, FAULT
and PWRGD]; the SMI I/O consists of SDA, SCL, and INT,
whose signals conform to the levels and timing of the SMBus
specification; see “SMI only Control Applications” on
page 17 The ISL6112 can be operated exclusively from
either the SMI or HPI, or can employ the HPl for power
control while continuing to use the SMI for access to all but
the power control registers.
In addition to the basic power control features of the ISL6112
accessible by the HPI, the SMI also gives the host access to
the following information from the part:
• Fault conditions occurring on each supply. These faults
include Overcurrent, Over-Temperature and undervoltage
• GPI pin status when using the System
When using the System Management Interface for power
control, do not use the Hot-Plug Interface. Conversely, when
using the Hot-Plug Interface for power control, do not execute
power control commands over the System Management
Interface bus (all other register accesses via the SMI bus
remain permissible while in the HPI control mode). When
utilizing the SMI exclusively, the HPI input pins (ON, AUXEN,
and FORCE_ON) should be configured, as shown in Figure 1
(disabling HPI when SMI control is used). This configuration
safeguards the power slots in the event that the SMBus
communication link is disconnected for any reason.
Additionally, when utilizing the HPI exclusively, the SMBus
(or SMI) will be inactive if the input pins (SDA, SCL, A0, A1,
and A2) are configured as shown in Figure 1.
FN6456.0
September 28, 2007
ISL6112
VSTBY
INT
100k
100k
100k
SCL
SDA
INT#
A2
A1
A0
deasserted or else the ISL6112 will assert its FAULT outputs.
If an undervoltage condition on either of the MAIN supply
inputs is detected, the INT will also assert if interrupts are
enabled.
VAUX
VAUX
DISABLING SMI WHEN HPI CONTROL IS USED
AUXEN
AUXEN
VSTBY
100k 9
100k 28
45
42
44
43
FORON#_A
FORON#_B
AUXENA
AUXENB
ONA
ONB
IAUX
IAUX
DISABLING HPI WHEN SMI CONTROL IS USED
FIGURE 1. I/O CONFIGURATION FOR DISABLING HPI/SMI
CONTROL
FIGURE 2. VAUX TURN-ON RLOAD = 10Ω, CLOAD = 100µF
ISL6112 Bias, Power-On Reset and Power Cycling
The ISL6112 utilizes VSTBY as the only supply source.
VSTBY is required for proper operation of the ISL6112’s
SMBus and registers and must be applied at all times. A
Power-On Reset (POR) cycle is initiated after VSTBY rises
above its UVLO threshold and remains satisfied for 250µs.
All internal registers are cleared after POR. If VSTBY is
recycled, the ISL6112 enters a new power-on-reset cycle.
VSTBY must be the first supply voltage applied followed by
the MAIN supply inputs of 12VIN and 3VIN. The SMBus is
ready for access at the end of the POR cycle (250µs after
VSTBY is valid). During tPOR, all outputs remain off.
Enabling the VAUX Outputs
Upon asserting an AUXEN input, the related internal power
switch turns on connecting the nominally 3.3V VSTBY
supply to its VAUX load. The turn-on is slew rate limited and
invokes the ICs current regulation feature so as to not droop
the supply due to in-rush current load. Figure 2 illustrates the
VAUX turn-on performance into a 10Ω, 100µF load.
Standby Mode
Standby mode is entered when one or more of the MAIN
supply inputs (12VIN and/or 3VIN) is absent, below its
respective UVLO threshold or OFF. The ISL6112 also has
3.3V auxiliary outputs (VAUXA and VAUXB), satisfying an
optional PCI Express requirement. These outputs are fed
from the VSTBY input pins, they are independent of the
MAIN outputs and are controlled by the AUXEN input pins or
via their respective bits in the control registers. Should the
MAIN supply inputs fall below their respective UVLO
thresholds, VAUX will still function as long as VSTBY is
compliant. Prior to standby mode, ONA and ONB (or the
control registers' MAINA and MAINB bits) inputs must be
11
Enabling the MAIN GATE outputs
When a slot's MAIN supplies are off, the 12VGATE pin is
held high with an internal pull-up to the 12VIN voltage.
Similarly, the 3VGATE pin is internally held low to GND.
When the MAIN supplies of the ISL6112 are enabled by
asserting ON, the related 3VGATE and 12VGATE pins are
each connected to a constant current supply. For the
3VGATE pin, this is nominally a 25µA current source and for
the 12VGATE pin, this is nominally a -25µA current sink. The
3VGATE will be charged up to the 12VIN voltage whereas
the 12GATE will be pulled down to GND for maximum
enhancement of the N-Channel and P-Channel FETs,
respectively.
Estimating In-Rush Current and VOUT Slew Rate at
Start-up
The expected in-rush current can be estimated by using
Equation 1:
⎛ C LOAD⎞
I IN – RUSH NOMINALLY = 25μA ⎜ --------------------⎟
⎝ C GATE⎠
(EQ. 1)
with 25µA being the GATE pin charge current, CLOAD is the
load capacitance, and CGATE is the total GATE capacitance
including CISS of the external MOSFET and any external
capacitance connected from the GATE output pin to the
GATE reference, GND or source.
An estimate for the output slew rate of 3.3V outputs and 12V
outputs where there is little or no external 12VGATE output
capacitors, can be had from Equation 2:
I LIM
dv/dt VOUT NOMINALLY = -------------------C LOAD
(EQ. 2)
FN6456.0
September 28, 2007
ISL6112
where ILIM = 50mV/RSENSE and CLOAD is the load
capacitance. As a consequence, the CR duration, tFILTER,
must be programmed to exceed the time it will take to fully
charge the output load to the input rail voltage level.
12VOUT
MAIN Outputs (Start-up Delay and Slew-Rate
Control)
12VGATE
The 3.3V outputs act as source followers. In this mode of
operation, VSOURCE = [VGATE – VTH(ON)] until the
associated output reaches 3.3V. The voltage on the gate of
the MOSFET will then continue to rise until it reaches 12V,
which ensures minimum rDS(ON). For the 12V outputs, when
the MOSFET is optionally configured as a Miller integrator to
adjust the VOUT ramp time by having a CGD capacitor,
which is connected between the MOSFET’s gate and drain.
In this configuration, the feedback action from drain to gate
of the MOSFET causes the voltage at the drain of the
MOSFET to slew in a linear fashion at a rate estimated by
Equation 3:
25μA
dv/dt VOUT NOMINALLY = --------------C GD
12IOUT
CFILTER
CGD = 6800pF
CGS = 22nF
FIGURE 3. 12VMAIN START-UP RLOAD = 10Ω,
CLOAD = 470µF
(EQ. 3)
3VOUT
Table 1 approximates the output slew-rate for various values
of CGATE when start-up is dominated by GATE capacitance
(external CGATE from GATE pin to ground plus CGS of the
external MOSFET for the 3.3V rail; CGD for the 12V rail).
3VGATE
3IOUT
TABLE 1. 3.3V AND 12V OUTPUT SLEW-RATE SELECTION
FOR GATE CAPACITANCE DOMINATED START-UP
| IGATE | = 25µA
CGATE or CGD
dv/dt (load)
0.01µF*
2.5V/ms
0.022µF*
1.136V/ms
0.047µF
0.532 V/ms
0.1µF
0.250V/ms
CFILTER
CFILTER RESPONDING TO UNSHOWN MAIN SUPPLY
CGATE = 22nF
FIGURE 4. 3VMAIN START-UP RLOAD = 2Ω, CLOAD = 470µF
*Values in this range will be affected by the internal parasitic
capacitances of the MOSFETs used, and should be verified
experimentally.
12VOUT
Note that all of these performance estimates are useful only for
first order time and loading expectations as they do not look at
other significant loading factors. Figures 3, 4, 5, 6 and 7
illustrate empirically the discussed turn-on performance with the
noted loading and compensation conditions.
12VGATE
12IOUT
Notice the degree of control over the in-rush current and the
GATE ramp rate as the and values are changed thus providing
for highly customizable turn-on characteristics.
In some scope shots although the CFILTER shows a ramping
in the absence of excessive displayed loading current the
CFILTER is responding to the other MAIN supply current that
is not displayed.
All scope shots were taken from the ISL6112EVAL1Z with
any component changes noted.
12
CFILTER
CGD = 6800pF
CGS = 2200pF
FIGURE 5. 12VMAIN START-UP RLOAD = 10Ω,
CLOAD = 470µF
FN6456.0
September 28, 2007
ISL6112
.
3VGATE
12VOUT
12VGATE
3VOUT
12IOUT
3IOUT
CFILTER
CFILTER
CFILTER RESPONDING TO UNSHOWN MAIN SUPPLY
CGATE = 2200pF
FIGURE 6. 3VMAIN START-UP RLOAD = 2Ω, CLOAD = 470µF
FIGURE 8. 12VMAIN CR AND SHUT-DOWN
12VOUT
3IOUT
12VGATE
3VOUT
12IOUT
3VGATE
CFILTER
CFILTER
CGD = 9800pF
CGS = 2200pF
FIGURE 7. 12VMAIN START-UP RLOAD = 10Ω,
CLOAD = 470µF
FIGURE 9. 3VMAIN CR AND SHUT-DOWN
Current Regulation (CR) Function
The ISL6112 provides a current regulation and limiting
function that protects the input voltage supplies against
excessive loads, including short circuits. When the current
from any of a slots MAIN outputs exceeds the current limit
threshold (ILIM = 50mV/RSENSE) for a duration greater than
tFILTER, the isolation protection is tripped and both related
MAIN supplies are shut off, as shown in Figures 8 and 9.
Should the load current cause a MAIN outputs VSENSE to
exceed VTHFAST, the outputs are immediately shut off with
no tFILTER delay, as shown in Figures 10 and 11.
12VGATE
12VOUT
12IOUT
CFILTER
FIGURE 10. 12VMAIN WOC SHUT-DOWN
13
FN6456.0
September 28, 2007
ISL6112
3VGATE
VAUX
CFILTER
CFILTER
3VOUT
3IOUT
FIGURE 11. 3VMAIN WOC SHUT-DOWN
The VAUX outputs have a different isolation protection
function. The VAUX isolation circuit does not incorporate a
fast-trip detector, instead they regulate the output current
into a fault to avoid exceeding their operating current limit.
The protection circuit will trip due to an overcurrent on VAUX
when the programmable CR duration timer, tFILTER expires.
This use of the tFILTER timer prevents the circuit from
tripping prematurely due to brief current transients. See
Figures 12 and 13 for illustrations of the VAUX protection
performance into a slight OC and more severe OC condition
respectively. The ISL6112 AUX current control responds
proportionally to the severity of the OC condition resulting in
faster VAUX pull-down and current regulation until tFILTER
has expired.
VAUX
CFILTER
IAUX
IAUX
FIGURE 13. VAUX WOC REGULATION AND SHUT-DOWN
Following a fault condition, the outputs can be turned on
again via the ON inputs (if the fault occurred on one of the
MAIN outputs), via the AUXEN inputs (if the fault occurred
on the AUX outputs), or by cycling both ON and AUXEN (if
faults occurred on both the MAIN and AUX outputs). A fault
condition can alternatively be cleared under SMI control of
the ENABLE bits in the CNTRL registers (See “Control
Register Bits D[1:0]” on page 19). When the circuit
protection trips, FAULT will be asserted if the outputs were
enabled through the Hot-Plug Interface inputs. If SMI is
enabled, INT will be asserted (unless interrupts are
masked). Note that INT is deasserted by writing a Logic 1
back into the respective fault bit position(s) in the STAT
register or the “Common Status Register (CS) 8-Bits,
Read/Write” on page 23.
The ISL6112 current regulation duration (tFILTER) is
individually set for each slot by an external capacitor at the
CFILTER pin to GND. Once the CR mode is entered, the
external cap is charged with a 2.5µA current source to
1.25V. Once this threshold has been reached, the IC then
turns-off only the related faulted output(s), either both of the
MAIN (external FETs) and or the AUX (internal FET) and
sets the FAULT output low. For a desired tFILTER, the value
for CFILTER is given by Equation 4:
nominal t FILTER
C FILTER = -------------------------------------------500kΩ
FIGURE 12. VAUX OC REGULATION AND SHUT-DOWN
14
(EQ. 4)
where 500kΩ is the nominal VFILTER/nominal IFILTER and
where tFILTER is the desired response time with the values
for IFILTER and VFILTER being found in the “Electrical
Specifications Table” on page 6. See Table 2 for nominal
tFILTER times for given CFILTER cap values.
FN6456.0
September 28, 2007
ISL6112
For the ISL6112, there is a minimum tFILTER consideration
since the ISL6112 has its CR feature invoked as it turns-on the
FETs into the load. There is a maximum bulk capacitance
specified for each power level supported that needs to be
charged at the CR limit. This in-rush current time must be
considered when determining the tFILTER duration.
TABLE 2.
NOMINAL tFILTER DURATION
condition exists. A +160°C over-temperature condition
additionally sets the over-temperature bit (OT_INT) in the
“Common Status Register (CS) 8-Bits, Read/Write” on
page 23.
PWRGD Outputs
The ISL6112 has two PWRGD outputs, one for each slot.
These are open-drain, active-low outputs that require an
external pull-up resistor to VSTBY. Each output is asserted
when a slot has been enabled and has successfully begun
delivering power to its respective +12V, +3.3V, and VAUX
outputs. An equivalent logic diagram for PWRGD is shown in
Figure 14.
CFILTER CAPACITANCE (µF)
TIME (ms)
Open
0.01
0.01
5
0.022
11
FORCE_ON Inputs
0.047
24
0.1
50
These level-sensitive, active-low inputs are provided to facilitate
designing or debugging systems using the ISL6112. Asserting
FORCE_ON will turn on all three of the respective slot’s
outputs (12MAIN, 3MAIN, and VAUX), while specifically
defeating all overcurrent and short circuit protections, and onchip thermal protection for the VAUX supplies. Additionally,
asserting FORCE_ON will disable all of the input and output
UVLO protections, with the sole exception of the VSTBY input
UVLO.
NOTE: Nominal CR_DUR = CFILTER cap (μF) * 500kΩ.
.
Power-Down Cycle
When a slot is turned off either under HPI or SMI control ,
internal discharge FETs are connected to the output load
providing a discharge path for load capacitance connected to
the part’s outputs ensuring that the outputs are pulled to
GND. This is a compliancy requirement if a replacement add
in card will be inserted into the slot.
Thermal Shutdown
The internal VAUX MOSFETs are protected against damage
not only by current limiting, but by a dual-mode
over-temperature protection scheme as well. Each slot
controller on the ISL6112 is thermally isolated from the other.
Should an overcurrent condition raise the junction
temperature of one slot’s controller and pass elements to
+140°C, all of the outputs for that slot (including VAUX) will
be shut off and the slots FAULT output will be asserted. The
other slots operating condition will remain unaffected.
However, should the ISL6112’s die temperature exceed
+160°C, both slots (all outputs, including VAUXA and
VAUXB) will be shut off, whether or not a current limit
Asserting FORCE_ON will cause the slot PWRGD and
FAULT outputs to enter their open-drain state. Additionally,
there are two SMBus accessible register bits (See Control
Register Bit D[2] in Tables 5 and 7), which can be set to
disable the corresponding slot’s FORCE_ON pins. This
allows system software to prevent these hardware
overrides from being inadvertently activated during normal
use. When not used, each FORCE_ON pin can be
connected to VSTBY using an external pull-up resistor or
simply shorted to VSTBY.
General Purpose Input (GPI) Pins
Two pins on the ISL6112 are available for use as GPI pins. The
logic state of each of these pins can be determined by polling
Bits [4:5] of Common Status Register. Both of these inputs are
compliant to 3.3V. If GPI is unused, connect each to GND.
VSTBY
(1)
AUXEN
(2)
VAUX
(3)
3VAUX_UV
PWRGD
(1)
ON
(4)
MAIN
12VOUT_UV
3VOUT_UV
(1) External pin
(3)
(2) CNTRL Register Bit D[0]
(3)
(3) Internal flag
(1)
(4) CNTRL Register Bit D[1]
FORCE_ON
(5) CNTRL Register Bit D[2]
(5)
FORCE_EN
FIGURE 14. PWRGD LOGIC DIAGRAM
15
FN6456.0
September 28, 2007
ISL6112
Timing Diagrams
SCL
t5
t2
t4
SDA
DATA IN
t3
SDA
DATA OUT
FIGURE 15. SMBUS TIMING
+3.3V
UVLO
VSTBY
VIH
AUXEN
VIH
VIL
0
tPOR
VAUX_OUT
0
ILIM(AUX)
tFLT
ISTEADY-STATE
0
I
AUX_OUT
VIH
ON
VIH
VIL
0
12VOUT
0
3VOUT
0
PWRGD_
0
ILIM(3V)
tFLT
ISTEADY-STATE
0
I3VOUT
FAULT_
0
INT*
*
*
0
* INT DE-ASSERTED BY SOFTWARE
FIGURE 16. HOT-PLUG INTERFACE OPERATION
ISL6112 DEVICE ADDRESS
DATA
COMMAND BYTE TO ISL6112
DATA BYTE TO ISL6112
S 1 0 0 0 A2 A1 A0 0 A 0 0 0 0 0 X X X A D7 D6 D5 D4 D3 D2 D1 D0 A P
START
R/W = WRITE
ACKNOWLEDGE ACKNOWLEDGE
ACKNOWLEDGE
CLK
MASTER TO DEVICE TRANSFER,
i.e., DATA DRIVEN BY MASTER.
DEVICE TO MASTER TRANSFER,
i.e., DATA DRIVEN BY DEVICE.
FIGURE 17. WRITE_BYTE PROTOCOL
16
FN6456.0
September 28, 2007
ISL6112
Timing Diagrams
(Continued)
COMMAND BYTE TO ISL6112
ISL6112 DEVICE ADDRESS
DATA
ISL6112 DEVICE ADDRESS
DATA READ FROM ISL6112
S 1 0 0 0 A2 A1 A0 0 A 0 0 0 0 0 X X X A S 1 0 0 0 A2 A1 A0 1 A D7 D6 D5 D4 D3 D2 D1 D0 /A P
R/W = WRITE ACKNOWLEDGE ACKNOWLEDGE START
START
R/W = READ ACKNOWLEDGE NOT ACKNOWLEDGE
CLK
MASTER TO DEVICE TRANSFER,
i.E., DATA DRIVEN BY MASTER.
DEVICE TO MASTER TRANSFER,
i.e., DATA DRIVEN BY DEVICE.
FIGURE 18. READ_BYTE PROTOCOL
ISL6112 DEVICE ADDRESS
DATA
BYTE READ FROM ISL6112
S 1 0 0 0 A2 A1 A0 1 A D7 D6 D5 D4 D3 D2 D1 D0 /A P
START
R/W = READ
ACKNOWLEDGE NOT ACKNOWLEDGE STOP
CLK
MASTER TO DEVICE TRANSFER,
i.e., DATA DRIVEN BY MASTER.
DEVICE TO MASTER TRANSFER,
i.e., DATA DRIVEN BY DEVICE.
FIGURE 19. RECEIVE_BYTE PROTOCOL
Hot-Plug Interface (HPI)
Once the input supplies are above their respective UVLO
thresholds, the Hot-Plug Interface can be utilized for power
control by enabling the control input pins (AUXEN and ON)
for each slot. In order for the ISL6112 to switch on the VAUX
supply for either slot, the AUXEN control must be enabled
after the power-on-reset delay, tPOR (typically, 250µs), has
elapsed.
System Management Interface (SMI)
The ISL6112’s System Management Interface uses the
Read_Byte and Write_Byte subset of the SMBus protocols
to communicate with its host via the System Management
Interface bus. The INT output signals the controlling
processor that one or more events need attention, if an
interrupt-driven architecture is used. Note that the ISL6112
does not participate in the SMBus Alert Response Address
(ARA) portion of the SMBus protocol.
Fault Reporting and Interrupt Generation
SMI ONLY CONTROL APPLICATIONS
In applications where the ISL6112 is controlled only by the
SMI, ON and AUXEN are connected to GND and the
FORCE_ON pins are connected to VSTBY either as shown
in Figure 1 or shorted. In these cases, the ISL6112’s FAULT
outputs and STATUS Register Bit D[7] (FAULT) are not
activated as fault status is determined by polling STATUS
Register Bits D[4], D[2], D[0] and CS (Common Status)
17
Register Bits D[2:1]. Individual fault bits in STAT and CS
registers are asserted after power-on-reset when:
• Either or both CNTRL Register Bits D[1:0] are asserted,
AND
• 12VIN, 3VIN, or VSTBY input voltage is lower than its
respective ULVO threshold, OR
• The fast OC circuit isolation protection has tripped, OR
• The slow OC circuit isolation protection has tripped AND
its filter time-out has expired, OR
• The slow OC circuit isolation protection has tripped AND
Slot die temperature > +140°C, OR
• The ISL6112’s global die temperature > +160°C
Once asserted, to clear any one or all STATUS Register Bits
D[4], D[2], D[0] and/or CS Register Bits D[2], D[1], a
software subroutine can perform an “echo reset” where a
Logical “1” is written back to those register bit locations that
have indicated a fault. This method of “echo reset” allows
data to be retained in the STATUS and/or CS registers until
such time as the system is prepared to operate on that data.
The ISL6112 can operate in interrupt mode or polled mode.
For interrupt-mode operation, the open-drain, active-LOW
INT output signal is activated after power-on-reset if the
INTMSK bit (CS Register Bit D[3]) has been reset to Logical
“0”. Once activated, the INT output is asserted by any one of
the fault conditions previously listed and deasserted when
one or all STAT Register Bits D[4], D[2], D[0] and/or CS
Register Bits D[2], D[1] are reset upon the execution of an
SMBus “echo reset” WRITE_BYTE cycle. For polled-mode
operation, the INTMSK bit should be set to Logical “1,”
thereby inhibiting INT output pin operation.
FN6456.0
September 28, 2007
ISL6112
For those SMI control applications where the FORCE_ON
inputs are needed for diagnostic purposes, the FORCE_ON
inputs must be enabled; that is, CNTRL Register Bit D[2]
should read Logical “0.” Once FORCE_ON inputs are
asserted, all output voltages are present with all circuit
protection features disabled, including over-temperature
protection on VAUX outputs. To inhibit FORCE_ON
operation, a Logical “1” shall be written to the CNTRL
Register Bit D[2] location(s)
HPI-ONLY CONTROL APPLICATIONS
In applications where the ISL6112 is controlled only by HPI,
SMBus signals SCL, SDA, and INT signals are connected to
VSTBY as shown in Figure 1. In this configuration, the
ISL6112’s FAULT outputs are activated after power-on-reset
and become asserted when:
Either or both external ON and AUXEN input signals are
asserted, AND
• 12VIN, 3VIN, or VSTBY input voltage is lower than its
respective ULVO threshold, OR
and 19 show the formats for these data read and data write
procedures.
The Command Register is eight bits (one byte) wide. This
byte carries the address of the ISL6112’s register to be
operated upon. The command byte values corresponding to
the various ISL6112 register addresses are shown in Table 4.
Command byte values other than 0000 0XXXb = 00h – 07h
are reserved and should not be used.
ISL6112 SMBus Address Configuration
The ISL6112 responds to its own unique SMBus address,
which is assigned using A2, A1, and A0. These represent
the 3 LSBs of its 7-bit address, as shown in Table 3. These
address bits are assigned only during power-up of the
VSTBY supply input. These address bits allow up to eight
ISL6112 devices in a single system. These pins are either
grounded or left unconnected to specify a logical 0 or logical
1, respectively. A pin designated as a logical 1 may also be
pulled up to VSTBY.
TABLE 3. ISL6112 SMBUS ADDRESSING
INPUTS
• The fast OC circuit isolation protection has tripped, OR
ISL6112 DEVICE ADDRESS
• The slow OC circuit isolation protection has tripped AND
its filter time-out has expired, OR
A2
A1
A0
0
0
0
1000 000X*b
80h
• The slow OC circuit isolation protection has tripped AND
Slot die temperature > +140°C, OR.
0
0
1
1000 001Xb
82h
0
1
0
1000 010Xb
84h
0
1
1
1000 011Xb
86h
1
0
0
1000 100Xb
88h
1
0
1
1000 101Xb
8Ah
1
1
0
1000 110Xb
8Ch
1
1
1
1000 111Xb
8Eh
• The ISL6112’s global die temperature > +160°C
In order to clear FAULT outputs once asserted, either or both
ON and AUXEN input signals must be deasserted. Please
see FAULT pin description for additional information. If the
FORCE_ON inputs are used for diagnostic purposes, both
FAULT and PWRGD outputs are deasserted once
FORCE_ON inputs are asserted.
BINARY
HEX
.
* Where X = “1” for READ and “0” for WRITE
Serial Port Operation
The ISL6112 uses standard SMBus Write_Byte and
Read_Byte operations for communication with its host. The
SMBus Write_Byte operation involves sending the devices
target address, with the R/W bit (LSB) set to the low (write)
state, followed by a command byte and a data byte. The
SMBus Read_Byte operation is similar, but is a composite
write and read operation: the host first sends the devices
target address followed by the command byte, as in a write
operation. A new “Start” bit must then be sent to the
ISL6112, followed by a repeat of the device address with the
R/W bit set to the high (read) state. The data to be read from
the part may then be clocked out. There is one exception to
this rule: If the location latched in the pointer register from
the last write operation is known to be correct (i.e., points to
the desired register within the ISL6112), then the
“Receive_Byte” procedure may be used. To perform a
Receive_Byte operation, the host sends an address byte to
select the target ISL6112, with the R/W bit set to the high
(read) state, and then retrieves the data byte. Figures 17, 18
18
FN6456.0
September 28, 2007
ISL6112
ISL6112 Register Set and Programmer’s Model
TABLE 4. ISL6112 REGISTER ADDRESSES
TARGET REGISTER
LABEL
COMMAND BYTE VALUE
DESCRIPTION
READ
WRITE
POWER-ON
DEFAULT
CNTRLA
Control Register Slot A
02h
02h
00h
CNTRLB
Control Register Slot B
03h
03h
00h
STATA
Slot A Status
04h
04h
00h
STATB
Slot B Status
05h
05h
00h
CS
Common Status Register
06h
06h
xxxx 0000b
Reserved
Reserved/Do Not Use
07h - FFh
07h - FFh
Undefined
Detailed Register Descriptions
Control Register, Slot A (CNTRLA)
8-Bits, Read/Write
TABLE 5. CONTROL REGISTER, SLOT A (CNTRLA)
D[7]
D[6]
D[5]
D[4]
D[3]
D[2]
D[1]
D[0]
read-only
read-only
read only
read only
read-only
read/write
read/write
read/write
AUXAPG
MAINAPG
Reserved
Reserved
Reserved
FORCE_A
MAINA
VAUXA
ENABLE
BIT(s)
FUNCTION
OPERATION
AUXAPG
AUX output power-good status, Slot A
1 = Power-is-Good (VAUXA Output is above its UVLO
threshold)
MAINAPG
MAIN output power-good status, Slot A
1 = Power-is-Good (MAINA Outputs are above their UVLO
thresholds)
D[5]
Reserved
Always read as zero
D[4]
Reserved
Always read as zero
D[3]
Reserved
Always read as zero
FORCE_A
ENABLE
Allows or inhibits the operation of the FORCE_ONA input pin
0 = FORCE_ONA is enabled
1 = FORCE_ONA is disabled
MAINA
MAIN enable control, Slot A
0 = Off, 1 = On
VAUXA
VAUX enable control, Slot A
0 = Off, 1 = On
Power-Up Default Value:
Read Command_Byte Value (R/W):
0000 0000b = 00h
0000 0010b = 02h
The power-up default value is 00h. Slot is disabled upon power-up, i.e., all supply outputs are off.
NOTES:
6. The state of the PWRGDA pin is the logical AND of the values of the AUXAPG and the MAINAPG bits, except when FORCE_ONA is asserted.
If FORCE_ONA is asserted (the pin is pulled low), and FORCE_AENABLE is set to a logic zero, the PWRGDA pin will be unconditionally
forced to its open-drain (“Power Not Good”) state.
7. The values of the MAINAPG and AUXAPG register bits are not affected by FORCE_ONA, but will instead continue to read as high if power is
“Good,” and as low if the conditions which indicate that power is good are not met.
19
FN6456.0
September 28, 2007
ISL6112
Status Register Slot A (STATUSA)
8-Bits, Read-Only
TABLE 6. STATUS REGISTER, SLOT A (STATA)
D[7]
D[6]
D[5]
D[4]
D[3]
D[2]
D[1]
D[0]
read-only
read-only
read-only
read/write
read-only
read/write
read-only
read/write
FAULTA
MAINA
VAUXA
VAUXAF
Reserved
12VAF
Reserved
3VAF
BIT(s)
FUNCTION
OPERATION
FAULTA
FAULT Status - Slot A
1 = Fault pin asserted (FAULTA pin is LOW) 0 = Fault pin
deasserted (FAULTA pin is HIGH) See Notes 8, 9, and 10.
MAINA
MAIN Enable Status - Slot A
Represents the actual state (on/off) of the two Main Power
outputs for Slot A (+12V and +3.3V) 1 = Main Power ON 0 =
Main Power OFF
VAUXA
VAUX Enable Status - Slot A
Represents the actual state (on/off) of the Auxiliary Power
output for Slot A 1 = AUX Power ON 0 = AUX Power OFF
VAUXAF
Overcurrent Fault: VAUXA supply
1 = Fault 0 = No fault
D[3]
Reserved
Always read as zero
12VAF
Overcurrent Fault: +12V supply
1 = Fault 0 = No fault
D[1]
Reserved
Always read as zero
3VAF
Overcurrent Fault: 3.3V supply
1 = Fault 0 = No fault
Power-Up Default Value:
Command_Byte Value (R/W):
0000 0000b = 00h
0000 0100b = 04h
The power-up default value is 00h. Both slots are disabled upon power-up, i.e., all supply outputs are off. In response to an overcurrent fault
condition, writing a logical 1 back into the active (or set) bit position will clear the bit and deassert INT. The status of the FAULTA pin is not affected
by reading the Status Register or by clearing active status bits.
NOTES:
8. If FAULTA has been set by an overcurrent condition on one or more of the MAIN outputs, the ONA input must go LOW to reset FAULTA. If
FAULTA has been set by a VAUXA overcurrent event, the AUXENA input must go LOW to reset FAULTA. If an overcurrent has occurred on
both a MAIN output and the VAUX output of slot A, both ONA and AUXENA of the slot must go low to reset FAULTA.
9. Neither the FAULTA bits nor the FAULTA pins are active when the ISL6112 power paths are controlled by the System Management Interface.
When using SMI power path control, AUXENA and ONA pins for that slot must be tied to GND.
10. If FORCE_ONA is asserted (low), the FAULTA pin will be unconditionally forced to its open-drain state. Note, though, that the value in the
FAULTA register bit is not affected by FORCE_ONA, but will instead continue to read as a high if no faults are present on Slot A, and as a low
if any fault conditions exist, which would disable Slot A if FORCE_ONA was not asserted.
20
FN6456.0
September 28, 2007
ISL6112
Control Register, Slot B (CNTRLB)
8-Bits, Read/Write
TABLE 7. CONTROL REGISTER, SLOT B (CNTRLB)
D[7]
D[6]
D[5]
D[4]
D[3]
D[2]
D[1]
D[0]
read-only
read-only
read only
read only
read-only
read/write
read/write
read/write
AUXBPG
MAINBPG
Reserved
Reserved
Reserved
FORCE_B
ENABLE
MAINB
VAUXB
BIT(s)
FUNCTION
OPERATION
AUXBPG
AUX output power-good status, Slot B
1 = Power-is-Good (VAUXB Output is above its UVLO
threshold)
MAINBPG
MAIN output power-good status, Slot B
1 = Power-is-Good (MAINB Outputs are above their UVLO
thresholds)
D[5]
Reserved
Always read as zero
D[4]
Reserved
Always read as zero
D[3]
Reserved
Always read as zero
FORCE_B
ENABLE
Allows or inhibits the operation of the FORCE_ONB input pin
0 = FORCE_ONB is enabled
1 = FORCE_ONB is disabled
MAINB
MAIN enable control, Slot B
0 = Off, 1 = On
VAUXB
VAUX enable control, Slot B
0 = Off, 1 = On
0000 0000b = 00h
0000 0011b = 03h
Power-Up Default Value:
Command_Byte Value (R/W):
The power-up default value is 00h. Slot is disabled upon power-up, i.e., all supply outputs are off.
NOTES:
11. The state of the PWRGDB pin is the logical AND of the values of the AUXBPG and the MAINBPG bits, except when FORCE_ONB is asserted.
If FORCE_ONB is asserted (the pin is pulled low), and FORCE_BENABLE is set to a logic zero, the PWRGDB pin will be unconditionally
forced to its open-drain (“Power Not Good”) state.
12. The values of the MAINBPG and AUXBPG register bits are not affected by FORCE_ONB, but will instead continue to read as high if power is
“Good,” and as low if the conditions, which indicate that power is good, are not met.
21
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September 28, 2007
ISL6112
Status Register Slot B (STATB)
8-Bits, Read-Only
TABLE 8. STATUS REGISTER, SLOT B (STATB)
D[7]
D[6]
D[5]
D[4]
D[3]
D[2]
D[1]
D[0]
read-only
read-only
read-only
read/write
read-only
read/write
read-only
read/write
FAULTB
MAINB
VAUXB
VAUXBF
Reserved
12VBF
Reserved
3VBF
BIT(s)
FUNCTION
OPERATION
FAULTB
FAULT Pin Status - Slot B
1 = Fault pin asserted (FAULTB pin is LOW) 0 = Fault pin
deasserted (FAULTB pin is HIGH) See Notes 13, 14,
and 15.
MAINB
MAIN Enable Status - Slot B
Represents the actual state (on/off) of the four Main
Power outputs for Slot B (+12V and +3.3V)
1 = MAIN Power ON
0 = MAIN Power OFF
VAUXB
VAUX Enable Status - Slot B
Represents the actual state (on/off) of the Auxiliary
Power output for Slot B
1 = AUX Power ON
0 = AUX Power OFF
VAUXBF
Overcurrent Fault: VAUXB supply
1 = Fault 0 = No fault
D[3]
Reserved
Always read as zero
12VBF
Over current Fault: +12V supply
1 = Fault 0 = No fault
D[1]
Reserved
Always read as zero
3VBF
Over current Fault: 3.3V supply
1 = Fault 0 = No fault
Power-Up Default Value:
Command_Byte Value (R/W):
0000 0000h = 00h
0000 0101b = 05h
The power-up default value is 00h. Both slots are disabled upon power-up, i.e., all supply outputs are off. In response to an overcurrent fault
condition, writing a logical 1 back into the active (or set) bit position will clear the bit and deassert INT. The status of the FAULTB pin is not
affected by reading the Status Register or by clearing active status bits.
NOTES:
13. If FAULTB has been set by an overcurrent condition on one or more of the MAIN outputs, the ONB input must go LOW to reset FAULTB. If
FAULTB has been set by a VAUXB overcurrent event, the AUXENB input must go LOW to reset FAULTB. If an overcurrent has occurred on
both a MAIN output and the VAUX output of slot B, both ONB and AUXENB of the slot must go low to reset FAULTB.
14. Neither the FAULTB bits nor the FAULTB pins are active when the ISL6112 power paths are controlled by the System Management Interface.
When using SMI power path control, the AUXENB and ONB pins for that slot must be tied to GND.
15. If FORCE_ONB is asserted (low), the FAULTB pin will be unconditionally forced to its open-drain state. Note, though, that the value in the
FAULTB register bit is not affected by FORCE_ONB, but will instead continue to read as a high if no faults are present on Slot B, and as a low
if any fault conditions exist which would disable Slot B if FORCE_ONB was not asserted.
22
FN6456.0
September 28, 2007
ISL6112
Common Status Register (CS)
8-Bits, Read/Write
TABLE 9. COMMON STATUS REGISTER (CS)
D[7]
D[6]
D[5]
D[4]
D[3]
D[2]
D[1]
D[0]
read-write
read-write
read-only
read-only
read-write
read-write
read-write
read-only
Reserved
Reserved
GPI_B0
GPI_A0
INTMSK
UV_INT
OT_INT
Reserved
BIT(s)
FUNCTION
OPERATION
D[7]
Reserved
Always read as zero
D[6]
Reserved
Always read as zero
GPI_B0
General Purpose Input 0, Slot B
State of GPI_B0 pin
GPI_A0
General Purpose Input 0, Slot A
State of GPI_A0 pin
INTMSK
Interrupt Mask
0 = INT generation is enabled
1 = INT generation is disabled.
The ISL6112 does not participate in the SMBus Alert
Response Address (ARA) protocol
UV_INT
undervoltage Interrupt
0 = No UVLO fault
1 = UVLO fault
Set whenever a circuit isolation protection fault condition
occurs as a result of an undervoltage lockout condition on
one of the main supply inputs. This bit is only set if a UVLO
condition occurs while the ON pin is asserted or the MAIN
control bits are set
OT_INT
over-temperature Interrupt
0 = Die Temp < +160°C.
1 = Fault: Die Temp > +160°C.
Set if a fault occurs as a result of the ISL6112’s die
temperature exceeding +160°C
D[0]
Reserved
Undefined
Power-Up Default Value: 00000000b = 00h
Command_Byte Value (R/W): 00000110b = 06h
To reset the OT_INT and UV_INT fault bits, a logical 1 must be written back to these bits.
23
FN6456.0
September 28, 2007
ISL6112
PCI-Express Application
Recommendations
Using the ISL6112EVAL1Z Platform
For each of the 3.3VMAIN and +12VMAIN supplies, the CR
level is set by an external sense resistor value depending on
the maximum specified power for the various PCI-Express
connector and application implemented (X1, 10W or 25W;
X4, X8, 25W; X16, 25W or 75W; and X16 Graphics -ATX,
150W). The power rating is a combination of both main and
the optional auxiliary supplies. This sense resistor is a low
ohmic standard value current sense resistor (one for each
slot) and the voltage across this resistor is compared to a
50mV reference. Since the 3.3VMAIN supply is rated for 3A
max across all slots regardless of size and power, the use of
a 15mΩ sense resistor compared to the 50mV reference
provides a nominal CR of 3.3A or 11% above the 3A max
spec.
The primary ISL6112 evaluation platform is shown in
Figure 34 photographically and schematically on page 28.
This evaluation board highlights a PCB layout that confines
all necessary active and passive components in an area
measuring 12mmx55mm. This width is smaller than the
specified PCI-Express socket to socket spacing, allowing for
intimate co-location of the load power control and the load
itself.
Description and Introduction
On the 12VMAIN, for a 10W connector, a 75mΩ sense
resistor provides a nominal CR level of 0.66A, 32% above
the 0.5A max spec; for a 25W connector, a 20mΩ sense
resistor provides a nominal CR level of 2.5A, 19% above the
2.1A max specification; for a 75W connector a 8mΩ sense
resistor provides a nominal CR level of 6.25A, 14% above
the 5.5A max specification. The X16 Graphics-ATX 150W
card is a special case in that, the 150W is provided by 2
slots, each providing up to a maximum of 75W from the
12VMAIN as this type of card does not consume 3.3VMAIN
or AUX supply power. For each of the slots a 7mΩ sense
resistor provides a nominal CR level of 7.1A, 14% above the
6.25A max spec.
The ISL6112 provides a best in class ±5% current regulation
threshold spec over temperature for the MAIN supples
providing the highest accuracy and lowest variability for this
critical parameter. Table 10 provides recommended
12VMAIN sense resistor values for particular power levels.
TABLE 10.
NOMINAL CURRENT REGULATION LEVEL
12VMAIN RSENSE
(mΩ)
12VMAIN
CR (A)
PCI-E ADD IN BOARD POWER
LEVEL SUPPORTED (W)
75
0.7
10
20
2.5
25
8
6.2
75
7
7
150
Around the central highlighted layout are numerous labeled
test points and configuration jumpers where there are node
names such as AO(L/R). The pin name outside the
parentheses relates to the ISL6112. The ISL6113 and
ISL6114 also use this evaluation platform as all three parts
have a common pinout for the common pin functions. The
pin names in parentheses are for them. The specific
evaluation board as ordered and received will reflect the part
number in the area below the Intersil logo either by label or
silk screened lettering. For those pins not common across
the ISL6112 and ISL6113, ISL6114, there is a matrix
detailing the differences in the bottom left corner.
The ISL6112EVAL1Z is default provided in HPI mode with
the clock shorted to ground.
After correctly biasing the evaluation platform as noted
through the 6 banana jacks, on VSTBY first then the other
MAIN supplies, in any order. With the appropriate signaling
to the AUXEN and ON inputs, the user should see turn-on
waveforms as shown previously. The addition of external
current loading is necessary to demonstrate the OC and
WOC response performance.
For demonstration of SMI operation the SCL and SDA inputs
are in the top right quadrant of the evaluation board. The
board’s default address is configured as ‘000’ via three
jumpers located to the right labeled A0, A1, and A2. The HPI
inputs need to be disabled as shown in Figure 1. Additional
software to configure and control is needed. If necessary,
there is a LabView based program available from the factory
for demonstration of the ISL6112 functionality. User lab test
hardware and instrument support is not available.
Caution: The ISL6113EVAL1Z, ISL6114EVAL1Z get very hot
to the touch after operating it for a few minutes. The hottest
areas are marked on the evaluation board.
NOTE: CR Level = VTHILIMIT/RSENSE.
Providing a nominal CR protection level above the maximum
specified limits of the card ensures that the card is able to
draw its maximum specified loads, and, in addition has
enough headroom before a regulated current limiter is
invoked to protect against transients and other events. This
headroom margin can be adjusted up or down by utilizing
differing values of sense resistor.
24
FN6456.0
September 28, 2007
ISL6112
Typical Performance Curves
6.0
1.0
5.8
0.8
12V ICC
(HPI and SMI)
5.4
SMI ICCSTBY
5.2
ICC (mA)
ICCSTBY (mA)
5.6
5.0
4.8
HPI ICCSTBY
4.6
0.6
0.4
3.3V ICC
4.4
0.2
(HPI and SMI)
4.2
4.0
-60
-40
-20
0
20
40
60
80
100
0
-50
120
0
FIGURE 20. ICCSTBY CURRENT vs TEMPERATURE
WOC THRESHOLD VOLTAGE (V)
CURRENT LIMIT Vth (mV)
51
50
49
48
-40
-20
0
20
40
60
80
100
120
103
102
101
100
99
98
97
96
-60
-40
-20
TEMPERATURE (°C)
0
20
40
60
80
100
120
100
120
TEMPERATURE (°C)
FIGURE 22. CURRENT LIMIT THRESHOLD VOLTAGE vs
TEMPERATURE
FIGURE 23. FAST TRIP THRESHOLD VOLTAGE vs
TEMPERATURE
1200
400
1150
380
AUX RESISTANCE (mΩ)
AUX CURRENT LIMIT (mA)
150
104
52
1100
1050
1000
950
900
850
800
-60
100
FIGURE 21. ICC CURRENT vs TEMERATURE
53
47
-60
50
TEMPERATURE (°C)
TEMPERATURE (°C)
360
IAUX = 375mA
340
320
300
280
260
240
220
-40
-20
0
20
40
60
80
100
TEMPERATURE (°C)
FIGURE 24. AUX. CURRENT LIMIT vs TEMPERATURE
25
120
200
-60
-40
-20
0
20
40
60
80
TEMPERATURE (°C)
FIGURE 25. AUX rDS(ON) vs TEMPERATURE
FN6456.0
September 28, 2007
ISL6112
Typical Performance Curves (Continued)
AUX AND 3MAIN RISING UVLO (V)
12MAIN UVLO RISING (V)
9.30
9.25
9.20
9.15
9.10
9.05
-60
-40
-20
0
20
40
60
80
100
3.1
2.9
AUX
2.7
2.5
2.3
3MAIN
2.1
1.9
1.7
1.5
-60
120
-40
-20
TEMPERATURE (°C)
10.52
2.79
AUX AND 3MAIN UV Vth (V)
12MAIN UV Vth (V)
2.80
10.50
10.48
10.46
10.44
10.42
10.40
-20
0
20
40
60
80
100
2.78
3VGATE
24.5
24.0
23.5
12VGATE
23.0
22.5
20
40
60
80
100
TEMPERATURE (°C)
FIGURE 30. ISL6112 GATE TURN-ON CURRENT (ABS) vs
TEMPERATURE
26
120
3MAIN
2.75
2.74
2.73
AUX
2.72
2.71
-40
-20
0
20
40
60
80
100
120
FIGURE 29. AUX AND 3MAIN POWER GOOD THRESHOLD
VOLTAGE vs TEMPERATURE
GATE FAULT OFF CURRENT (mA)
TURN ON CURRENT (µA)
25.0
0
100
TEMPERATURE (°C)
25.5
-20
80
2.76
2.70
-60
120
FIGURE 28. 12MAIN POWER GOOD THRESHOLD VOLTAGE
vs TEMPERATURE
-40
60
2.77
TEMPERATURE (°C)
22.0
-60
40
FIGURE 27. AUX AND 3.3MAIN RISING UVLO THRESHOLD
VOLTAGE vs TEMPERATURE
10.54
-40
20
TEMPERATURE (°C)
FIGURE 26. 12MAIN RISING UVLO THRESHOLD VOLTAGE
vs TEMPERATURE
10.38
-60
0
120
120
100
3GATE
80
60
12GATE
40
20
0
-60
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
FIGURE 31. GATE FAULT OFF CURRENT (ABS) vs
TEMPERATURE
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ISL6112
Typical Performance Curves (Continued)
1.30
3.0
FILTER THRESHOLD (V)
FILTER CURRENT (µA)
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
-60
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
FIGURE 32. FILTER CHARGE CURRENT vs TEMPERATURE
27
1.28
1.26
1.24
1.22
1.20
-60
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
FIGURE 33. FILTER THRESHOLD VOLTAGE vs TEMPERATURE
FN6456.0
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ISL6112
CAUTION HOT
SDA
GND
SMI
ADDRESS
CAUTION HOT
SCL
CAUTION HOT
FIGURE 34. ISL6112EVAL1Z BOARD PHOTO
TABLE 11. ISL6112EVAL1Z BOARD COMPONENTS LISTING
COMPONENT DESIGNATOR
U1
COMPONENT FUNCTION
COMPONENT DESCRIPTION
ISL6112
PCI- Express Dual Slot Hot Plug Controller
Q1, Q4
Voltage Rail Switches
SI4405DY or equivalent, P-Channel MOSFET
Q2, Q3
Voltage Rail Switches
SI4820DY or equivalent, N-Channel MOSFET
Current Sense Resistor
0.020Ω 1%, 2512
Pull up resistors on FORCEON and GPI Inputs
100kΩ, 0201
I/O Pull up resistors
10kΩ, 0201
R2, R4, R5, R7
FET gate series resistance
15Ω, 0201
C1, C7, C8, C13
FET gate capacitance
22nF 10%, 16V, 0402
MAIN and VSTBY decoupling capacitance
1µF 10%, 6.3V, 0402
C2, C12
P-FET gate to drain capacitance
6.8nF 10%, 6.3V, 0201
C4, C9
CFILTER capacitance (5ms)
0.01µF 10%, 6.3V, 0201
R24, R25
AUX Load Resistance
10Ω 20%, 3W
C17, C18
AUX Load Capacitance
100µF 20%, 25V, Radial Electrolytic
R22, R26, R28, 29
12MAIN Load Resistance
20Ω 20%, 10W
R23, R27
3MAIN Load Resistance
2Ω 20%, 10W
12MAIN and 3MAIN Load Capacitance
470µF 20%, 16V, Radial Electrolytic
R1, R3, R6, R8
R9, R10, R17, R20
R11, R12, R13, 14, R15, R16, R18, 19, R21
C3, C5, C6, C10, C11, C14
C15, C16, C19, C20
28
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29
ISL6112
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ISL6112
Package Outline Drawing
L48.7x7
48 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 4, 10/06
4X 5.5
7.00
A
44X 0.50
B
37
6
PIN 1
INDEX AREA
6
PIN #1 INDEX AREA
48
1
7.00
36
4. 30 ± 0 . 15
12
25
(4X)
0.15
13
24
0.10 M C A B
48X 0 . 40± 0 . 1
TOP VIEW
4 0.23 +0.07 / -0.05
BOTTOM VIEW
SEE DETAIL "X"
( 6 . 80 TYP )
(
0.10 C
BASE PLANE
0 . 90 ± 0 . 1
4 . 30 )
C
SEATING PLANE
0.08 C
SIDE VIEW
( 44X 0 . 5 )
C
0 . 2 REF
5
( 48X 0 . 23 )
( 48X 0 . 60 )
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
30
FN6456.0
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ISL6112
Thin Plastic Quad Flatpack Packages (TQFP)
Q48.7x7 (JEDEC MS-026ABC ISSUE B)
48 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
D
D1
-D-
INCHES
-A-
-B-
E E1
e
PIN 1
SEATING
A PLANE
-H-
0.08
0.003
-C-
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.047
-
1.20
-
A1
0.002
0.005
0.05
0.15
-
A2
0.038
0.041
0.95
1.05
-
b
0.007
0.010
0.17
0.27
6
b1
0.007
0.009
0.17
0.23
-
D
0.350
0.358
8.90
9.10
3
D1
0.272
0.280
6.90
7.10
4, 5
E
0.350
0.358
8.90
9.10
3
E1
0.272
0.280
6.90
7.10
4, 5
L
0.018
0.029
0.45
0.75
N
48
48
e
0.020 BSC
0.50 BSC
7
Rev. 1 9/98
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
0.08
0.003 M
D S
C A-B S
b
11o-13o
0.020
0.008 MIN
b1
0o MIN
A2 A1
GAGE
PLANE
0o-7o
0.25
0.010
11o-13o
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003
inch).
0.09/0.16
0.004/0.006
BASE METAL
WITH PLATING
L
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
7. “N” is the number of terminal positions.
0.09/0.20
0.004/0.008
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31
FN6456.0
September 28, 2007