CYStech Electronics Corp. Spec. No. : C769HT Issued Date : 2014.04.29 Revised Date : Page No. : 1/ 3 Miniature Glass Passivated Single Phase Surface Mount Bridge Rectifiers Reverse Voltage 50 to 1000 Volts Forward Current 0.8 Ampere MBST MB05ST08 thru MB10ST08 Features • Plastic package has Underwriters Laboratory Flammability Classification 94V-0 • Save space on printed circuit boards • Glass passivated chip junction • High surge overload rating: 30A peak Equivalent Circuit Mechanical Data • Case: Molded plastic body over passivated junctions • Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026 • High temperature soldering guaranteed : 260°C/10 seconds, 0.375”(9.5mm) lead length, 5lbs(2.3kg) tension • Mounting position: Any. • Weight: 0.22gram, 0.078 oz. Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified.) Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage drop per leg at 0.4A Maximum average forward output rectified current @Ta=40°C Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) TA=25°C Maximum DC reverse current at rated DC blocking voltage per leg TA=100°C Typical thermal resistance per leg Typical diode junction capacitance @f=1MHz and applied 4V reverse voltage Operating junction and storage temperature range MB05ST08 thru MB10ST08 Type Symbol MB05S MB1S MB2S MB4S MB6S T08 T08 T08 T08 T08 VRRM 50 100 200 400 600 VRMS 35 70 140 280 420 VDC 50 100 200 400 600 MB8S T08 800 560 800 MB10S Units T08 1000 V 700 V 1000 V VF 1 V IF(AV) 0.8 A IFSM 30 A IR 5 500 μA RθJA RθJL RθJC 75 20 24 °C /W CJ 25 pF TJ ;Tstg -55 ~ +150 °C CYStek Product Specification CYStech Electronics Corp. Spec. No. : C769HT Issued Date : 2014.04.29 Revised Date : Page No. : 2/ 3 Ordering Information Device Package MBST (Pb-free lead plating and halogen-free package) MBXXST08-0-T8-X Shipping 750 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T8 : 750 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name Characteristic Curves MB05ST08 thru MB10ST08 CYStek Product Specification Spec. No. : C769HT Issued Date : 2014.04.29 Revised Date : Page No. : 3/ 3 CYStech Electronics Corp. MBST Dimension Marking : XX Date Code □□□□□□ Device Name MBST Plastic Surface Mounted Package CYStek Package Code: HT Type Marking MB05ST08 MB1ST08 MB2ST08 MB4ST08 MB6ST08 MB8ST08 MT10ST08 05ST08 Inches Min. Max. 0.165 0.181 0.023 0.031 0.177 0.193 0.049 0.057 0.900 0.106 DIM A B C D E 1ST08 2ST08 Millimeters Min. Max. 4.200 4.600 0.600 0.800 4.500 4.900 1.250 1.450 2.300 2.700 4ST08 DIM F G J L Q 6ST08 8ST08 Inches Min. Max. 0.008 0.275 0.006 0.010 0.650 0.024 0.028 10ST08 Millimeters Min. Max. 0.200 7.000 0.150 0.250 1.650 0.600 0.700 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Pure tin plated. • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MB05ST08 thru MB10ST08 CYStek Product Specification