D 8-Bit Serial-In, Parallel-Out Shift D Wide Operating Voltage Range of 2 V to 6 V D High-Current 3-State Outputs Can Drive Up D D D D D SCHS353 − JANUARY 2004 DW, E, M, NS, OR SM PACKAGE (TOP VIEW) QB QC QD QE QF QG QH GND To 15 LSTTL Loads Low Power Consumption, 80-µA Max ICC Typical tpd = 14 ns ±6-mA Output Drive at 5 V Low Input Current of 1 µA Max Shift Register Has Direct Clear 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC QA SER OE RCLK SRCLK SRCLR QH′ description/ordering information The CD74HC595 device contains an 8-bit serial-in, parallel-out shift register that feeds an 8-bit D-type storage register. The storage register has parallel 3-state outputs. Separate clocks are provided for both the shift and storage registers. The shift register has a direct overriding clear (SRCLR) input, serial (SER) input, and serial output for cascading. When the output-enable (OE) input is high, the outputs are in the high-impedance state. Both the shift register clock (SRCLK) and storage register clock (RCLK) are positive-edge triggered. If both clocks are connected together, the shift register always is one clock pulse ahead of the storage register. ORDERING INFORMATION PDIP − E SOIC − DW −55°C −55 C to 125 125°C C ORDERABLE PART NUMBER PACKAGE† TA SOIC − M SOP − NS SSOP − SM Tube of 25 CD74HC595E Tube of 40 CD74HC595DW Reel of 2000 CD74HC595DWR Tube of 40 CD74HC595M Reel of 2500 CD74HC595M96 Reel of 250 CD74HC595MT Reel of 2000 CD74HC595NSR Tube of 80 CD74HC595SM Reel of 2000 CD74HC595SM96 TOP-SIDE MARKING CD74HC595E HC595M HC595M HC595M HJ595 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated ! " #$%! " &$'(#! )!%* )$#!" # ! "&%##!" &% !+% !%" %," "!$%!" "!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCHS353 − JANUARY 2004 FUNCTION TABLE INPUTS 2 SER SRCLK X X X X X X L SRCLR FUNCTION RCLK OE X X H X X L Outputs QA−QH are disabled. Outputs QA−QH are enabled. L X X Shift register is cleared. ↑ H X X First stage of the shift register goes low. Other stages store the data of previous stage, respectively. H ↑ H X X First stage of the shift register goes high. Other stages store the data of previous stage, respectively. X X X ↑ X Shift-register data is stored in the storage register. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCHS353 − JANUARY 2004 logic diagram (positive logic) OE RCLK SRCLR SRCLK SER 13 12 10 11 14 1D C1 R 3R C3 3S 15 2S 2R C2 R 3R C3 3S 1 2S 2R C2 R 3R C3 3S 2 2S 2R C2 R 3R C3 3S 3 2S 2R C2 R 3R C3 3S 4 2S 2R C2 R 3R C3 3S 5 2S 2R C2 R 3R C3 3S 6 2S 2R C2 R 3R C3 3S 7 9 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 QA QB QC QD QE QF QG QH QH′ 3 SCHS353 − JANUARY 2004 timing diagram SRCLK SER RCLK SRCLR OE ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ QA QB QC QD QE QF QG QH QH’ NOTE: 4 ÎÎÎÎ ÎÎÎÎ implies that the output is in 3-State mode. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCHS353 − JANUARY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA Package thermal impedance, θJA (see Note 2): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57°C/W M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W SM package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) VCC VIH Supply voltage VCC = 2 V VCC = 4.5 V High-level input voltage VCC = 6 V VCC = 2 V VIL VI VO ∆t/∆v‡ MIN NOM MAX 2 5 6 Input voltage 3.15 0.5 1.35 Input transition rise/fall time V 1.8 0 VCC = 2 V VCC = 4.5 V V 4.2 0 Output voltage V 1.5 VCC = 4.5 V VCC = 6 V Low-level input voltage UNIT VCC VCC V V 1000 500 ns VCC = 6 V 400 TA Operating free-air temperature −55 125 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. ‡ If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state from induced grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device; however, functionally, the CLK inputs are not ensured while in the shift, count, or toggle operating modes. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SCHS353 − JANUARY 2004 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = −20 µA VOH VI = VIH or VIL QH′, IOH = −4 mA QA−QH, IOH = −6 mA QH′, IOH = −5.2 mA QA−QH, IOH = −7.8 mA IOL = 20 µA VOL VI = VIH or VIL QH′, IOL = 4 mA QA−QH, IOL = 6 mA QH′, IOL = 5.2 mA QA−QH, IOL = 7.8 mA 6 TYP 2V 1.9 1.998 1.9 1.9 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 3.98 4.3 3.7 3.84 3.98 4.3 3.7 3.84 5.48 5.8 5.2 5.34 5.48 5.8 5.2 5.34 4.5 V 6V MAX MIN MAX TA = -40°C TO 85°C MIN MIN UNIT MAX V 2V 0.002 0.1 0.1 0.1 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 0.17 0.26 0.4 0.33 0.17 0.26 0.4 0.33 0.15 0.26 0.4 0.33 0.15 0.26 0.4 0.33 6V ±0.1 ±100 ±1000 ±1000 nA ±0.01 ±0.5 ±10 ±5 µA 8 160 80 µA 10 10 10 pF 4.5 V 6V II IOZ VI = VCC or 0 VO = VCC or 0, QA−QH 6V ICC VI = VCC or 0, IO = 0 6V Ci TA = -55°C TO 125°C TA = 25°C VCC 2V to 6 V POST OFFICE BOX 655303 3 • DALLAS, TEXAS 75265 V SCHS353 − JANUARY 2004 timing requirements over recommended operating free-air temperature range (unless otherwise noted) VCC MIN fclock Clock frequency SRCLK or RCLK high or low tw Pulse duration SRCLR low SER before SRCLK↑ SRCLK↑ before RCLK↑† tsu Setup time SRCLR low before RCLK↑ SRCLR high (inactive) before SRCLK↑ th Hold time, SER after SRCLK SRCLK↑ TA = -55°C TO 125°C TA = 25°C MAX MIN MAX TA = -40°C TO 85°C MIN 2V 6 4.2 5 4.5 V 31 21 25 6V 36 25 29 2V 80 120 100 4.5 V 16 24 20 6V 14 20 17 2V 80 120 100 4.5 V 16 24 20 6V 14 20 17 2V 100 150 125 4.5 V 20 30 25 6V 17 25 21 2V 75 113 94 4.5 V 15 23 19 6V 13 19 16 2V 50 75 65 4.5 V 10 15 13 6V 9 13 11 2V 50 75 60 4.5 V 10 15 12 6V 9 13 11 2V 0 0 0 4.5 V 0 0 0 UNIT MAX MHz ns ns ns 6V 0 0 0 † This setup time allows the storage register to receive stable data from the shift register. The clocks can be tied together, in which case the shift register is one clock pulse ahead of the storage register. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SCHS353 − JANUARY 2004 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax SRCLK QH H′ tpd RCLK tPHL ten tdis SRCLR OE OE QA−QH QH H′ QA−QH QA−QH QA−QH tt QH H′ TA = -55°C TO 125°C TA = 25°C VCC MAX MIN MAX TA = -40°C TO 85°C MIN TYP MIN 2V 6 26 4.2 5 4.5 V 31 38 21 25 6V 36 42 25 29 UNIT MAX MHz 2V 50 160 240 200 4.5 V 17 32 48 40 6V 14 27 41 34 2V 50 150 225 187 4.5 V 17 30 45 37 6V 14 26 38 32 2V 51 175 261 219 4.5 V 18 35 52 44 6V 15 30 44 37 2V 40 150 225 187 4.5 V 15 30 45 37 6V 13 26 38 32 2V 42 200 300 250 4.5 V 23 40 60 50 6V 20 34 51 43 2V 28 60 90 75 4.5 V 8 12 18 15 6V 6 10 15 13 2V 28 75 110 95 4.5 V 8 15 22 19 6V 6 13 19 16 ns ns ns ns ns switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd ten tt 8 FROM (INPUT) TO (OUTPUT) VCC RCLK QA−QH OE QA−QH QA−QH TA = -55°C TO 125°C TA = 25°C MIN MIN MAX TA = -40°C TO 85°C TYP MAX MIN 2V 60 200 300 250 4.5 V 22 40 60 50 6V 19 34 51 43 2V 70 200 298 250 4.5 V 23 40 60 50 6V 19 34 51 43 2V 45 210 315 265 4.5 V 17 42 63 53 6V 13 36 53 45 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT MAX ns ns ns SCHS353 − JANUARY 2004 operating characteristics, TA = 25°C PARAMETER Cpd Power dissipation capacitance POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TEST CONDITIONS TYP UNIT No load 400 pF 9 SCHS353 − JANUARY 2004 PARAMETER MEASUREMENT INFORMATION VCC S1 Test Point From Output Under Test PARAMETER RL CL (see Note A) tPZH ten 1 kΩ tPZL tPHZ tdis S2 RL tPLZ tpd or tt 1 kΩ Data Input VCC 50% 10% 50% VCC 0V In-Phase Output 50% 10% tPHL 90% 90% tr tPHL Out-ofPhase Output 90% tf Open Closed Closed Open Open Open VCC th 90% 90% VCC 50% 10% 0 V tf 50% 10% Output Control (Low-Level Enabling) VCC 50% 50% 0V tPZL VOH 50% 10% V OL tf Output Waveform 1 (See Note B) tPLZ 90% VOH VOL Output Waveform 2 (See Note B) ≈VCC ≈VCC 50% 10% tPZH tPLH 50% 10% Open VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES 50% tPLH Closed tr VOLTAGE WAVEFORMS PULSE DURATIONS 50% Closed 0V 0V Input Open tsu 0V 50% 50 pF or 150 pF 50% 50% tw Low-Level Pulse S2 50 pF or 150 pF −− Reference Input VCC 50% S1 50 pF LOAD CIRCUIT High-Level Pulse CL VOL tPHZ 50% 90% VOH ≈0 V tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. D. For clock inputs, fmax is measured when the input duty cycle is 50%. E. The outputs are measured one at a time, with one input transition per measurement. F. tPLZ and tPHZ are the same as tdis. G. tPZL and tPZH are the same as ten. H. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CD74HC595DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC595M CD74HC595DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC595M CD74HC595E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC595E CD74HC595EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC595E CD74HC595M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC595M CD74HC595M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC595M CD74HC595MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC595M CD74HC595MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC595M CD74HC595NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC595M CD74HC595SM96 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HJ595 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CD74HC595DWR SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 12.0 16.0 Q1 DW 16 2000 330.0 16.4 10.75 10.7 2.7 CD74HC595M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74HC595NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD74HC595SM96 SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC595DWR SOIC DW 16 2000 367.0 367.0 38.0 CD74HC595M96 SOIC D 16 2500 333.2 345.9 28.6 CD74HC595NSR SO NS 16 2000 367.0 367.0 38.0 CD74HC595SM96 SSOP DB 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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