Renesas H838086R Renesas 16-bit single-chip microcomputer h8 family/h8/300h super low power sery Datasheet

REJ09B0182-0300
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
16
H8/38086R Group
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer
H8 Family/H8/300H Super Low Power Series
H8/38086RF
H8/38086R
H8/38085R
H8/38084R
H8/38083R
Rev.3.00
Revision Date: Aug 23, 2006
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any thirdparty's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
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diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
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Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
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contained therein.
Rev. 3.00 Aug 23, 2006 Page ii of lxxviii
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a passthrough current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product's state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system's
operation is not guaranteed if they are accessed.
Rev. 3.00 Aug 23, 2006 Page iii of lxxviii
Configuration of This Manual
This manual comprises the following items:
1. General Precautions on Handling of Product
2. Configuration of This Manual
3. Preface
4. Main Revisions for This Edition
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
5. Contents
6. Overview
7. Description of Functional Modules
•
CPU and System-Control Modules
•
On-Chip Peripheral Modules
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
8. List of Registers
9. Electrical Characteristics
10. Appendix
11. Index
Rev. 3.00 Aug 23, 2006 Page iv of lxxviii
Preface
H8/38086R Group is single-chip microcomputers made up of the high-speed H8/300H CPU
employing Renesas Technology original architecture as their cores, and the peripheral functions
required to configure a system. The H8/300H CPU has an instruction set that is compatible with
the H8/300 CPU.
Target Users: This manual was written for users who will be using the H8/38086R Group in the
design of application systems. Target users are expected to understand the
fundamentals of electrical circuits, logical circuits, and microcomputers.
Objective:
This manual was written to explain the hardware functions and electrical
characteristics of the H8/38086R Group to the target users.
Refer to the H8/300H Series Software Manual for a detailed description of the
instruction set.
Notes on reading this manual:
• In order to understand the overall functions of the chip
Read the manual according to the contents. This manual can be roughly categorized into parts
on the CPU, system control functions, peripheral functions, and electrical characteristics.
• In order to understand the details of the CPU's functions
Read the H8/300H Series Software Manual.
• In order to understand the details of a register when its name is known
Read the index that is the final part of the manual to find the page number of the entry on the
register. The addresses, bits, and initial values of the registers are summarized in section 24,
List of Registers.
Example:
Register name:
The following notation is used for cases when the same or a
similar function, e.g. serial communication interface, is
implemented on more than one channel:
XXX_N (XXX is the register name and N is the channel
number)
Bit order:
The MSB is on the left and the LSB is on the right.
Rev. 3.00 Aug 23, 2006 Page v of lxxviii
Notes:
When using an on-chip debugger (such as the E7 or E8) for H8/38086R program development and
debugging, the following restrictions must be noted.
1. The NMI pin is reserved for the on-chip debugger, and cannot be used.
2. Pins P16, P36, and P37 cannot be used. In order to use these pins, additional hardware must be
provided on the user board.
3. Area H'C000 to H'CFFF is used by the on-chip debugger, and is not available to the user.
4. Area H′F380 to H′F77F must on no account be accessed.
5. When the on-chip debugger is used, address breaks can be set as either available to the user or
for use by the on-chip debugger. If address breaks are set as being used by the on-chip
debugger, the address break control registers must not be accessed.
6. When the on-chip debugger is used, NMI is an input pin, P16 and P36 are input pins, and P37
is an output pin.
7. When on-board programming/erasing is performed in boot mode, the SCI3 (P41/RXD and
P42/TXD) is used.
8. When using the on-chip debugger, set the FROMCKSTP bit in clock halt register 1 to 1.
Related Manuals:
The latest versions of all related manuals are available from our web site.
Please ensure you have the latest versions of all documents you require.
http://www.renesas.com/
H8/38086R Group manuals:
Document Title
Document No.
H8/38086R Group Hardware Manual
This manual
H8/300H Series Software Manual
REJ09B0213
User's manuals for development tools:
Document Title
Document No.
H8S, H8/300 Series C/C++ Compiler, Assembler, Optimizing Linkage Editor
User's Manual
REJ10B0058
H8S, H8/300 Series Simulator/Debugger User's Manual
ADE-702-282
H8S, H8/300 Series High-performance Embedded Workshop 3 Tutorial
REJ10B0024
H8S, H8/300 Series High-performance Embedded Workshop 3
User's Manual
REJ10B0026
Rev. 3.00 Aug 23, 2006 Page vi of lxxviii
Application notes:
Document Title
Document No.
F-ZTAT Microcomputer On-Board Programming
REJ05B0523
Rev. 3.00 Aug 23, 2006 Page vii of lxxviii
Rev. 3.00 Aug 23, 2006 Page viii of lxxviii
Main Revisions for This Edition
Item
Page
Revision (See Manual for Details)
All
—
(Before) E7 → (After) on-chip debugger
Preface
vi
When using an on-chip debugger (such as the E7 or E8) for
H8/38086R program development and debugging, ...
1.1 Features
2
• Compact package
Table amended
1.2 Internal Block
Diagram
3
Code
Old Code
Body Size
Pin Pitch
QFP-80
PRQP0080JB-A
FP-80A
14 × 14 mm
0.65 mm
TQFP-80
PTQP0080KC-A
TFP-80C
P-TFLGA-85
PTLG0085JA-A
TLP-85V
Figure 2.1 Memory
Map
0.5 mm
0.65 mm
Note 2 amended
19
Table amended
Pin No.
Type
FP-80A,
TFP-80C TLP-85V
Pad
No.*1
Pad
No.*2
I/O
Functions
80
A3
81
80
I/O
Pins for the TGR1A input capture
input or output compare output, or
PWM output.
TIOCB1
1
B1
1
1
Input
Pins for the TGR1B input capture
input.
TIOCA2
2
C1
2
2
I/O
Pins for the TGR2A input capture
input or output compare output, or
PWM output.
TIOCB2
3
B2
3
3
Input
Pins for the TGR2B input capture
input.
Symbol
16-bit timer TIOCA1
pulse unit
(TPU)
2.1 Address Space
and Memory Map
12 × 12 mm
7 × 7 mm
Remarks
2. The SCK4, SI4, SO4, and NMI pins are not available when the
E7 or on-chip debugger is used.
Figure1.1 Internal
Block Diagram of
H8/38076R Group
1.4 Pin Functions
Table 1.4 Pin
Functions
Package
26
Note amended
Note: The areas from H'C000 to H'CFFF and from H'F380 to
H'F77F are used by the on-chip debugger.
They are not available to the user when the on-chip debugger is
being used.
Rev. 3.00 Aug 23, 2006 Page ix of lxxviii
Item
Page
Revision (See Manual for Details)
2.8.3 Bit-Manipulation 57
Instruction
• Prior to executing BSET instruction
59
• Prior to executing BCLR instruction
MOV.B #H'80, R0L
MOV.B #H'3F, R0L
3.1 Exception
Sources and Vector
Address
62
Table 3.1 Exception
Sources and Vector
Address
3.2 Reset
63, 64
3.3 Interrupts
65
Table amended
Source Origin
Exception Sources
Vector
Number
Vector Address
Address break
Break conditions satisfied
5
H'000A to H'000B
Internal interrupts*

19 to 43
H'0026 to H'0057
Priority
Low
Replaced
Description amended
.. The interrupt controller can set interrupts other than NMI to one
of three mask levels in order to control multiple interrupts. The
interrupt priority registers A to E (IPRA to IPRE) of the interrupt
controller set the interrupt mask level.
3.5.1 Notes on Stack 68
Area Use
Description amended
To save register values, use PUSH.W Rn (MOV.W Rn, @–SP)
or PUSH.L ERn (MOV.L ERn, @–SP). To restore register values,
use POP.W Rn (MOV.W @SP+, Rn) or POP.L ERn (MOV.L
@SP+, ERn).
During interrupt exception handling or when an RTE instruction is
executed, CCR contents are saved and restored in word size.
Section 4 Interrupt
Controller
4.1 Features
73
Description amended
• Mask levels settable with IPR
An interrupt priority register (IPR) is provided for setting interrupt
mask levels. Three mask levels can be set for each module for
all interrupts except NMI and address break.
Rev. 3.00 Aug 23, 2006 Page x of lxxviii
Item
Page
4.3.8 Interrupt Priority 84
Registers A to E (IPRA
to IPRE)
Revision (See Manual for Details)
Description amended
IPR sets mask levels (levels 2 to 0) for interrupts other than NMI
and address break. ...
Setting a value in the range from H'0 to H'3 in the 2-bit groups of
bits 7 and 6, 5 and 4, 3 and 2, and 1 and 0 sets the mask level of
the corresponding interrupt. ...
Table amended
(Before) Priority level → (After) Mask level
4.3.9 Interrupt Mask
Register (INTM)
85
4.4.1 External
Interrupts
86
Table amended
(Before) Priority level → (After) Mask level
(2) WKP7 to WKP0 Interrupts
... The interrupt mask level can be set by IPR.
(3) IRQ4, IRQ3, IRQ1, and IRQ0 Interrupts
... The interrupt mask level can be set by IPR.
(4) IRQAEC Interrupts
... The interrupt mask level can be set by IPR.
4.4.2 Internal
Interrupts
87
• The interrupt mask level can be set by IPR.
4.5 Interrupt
Exception Handling
Vector Table
87
Description amended
... The lower the vector number, the higher the priority. The
priority within a module is fixed. Mask levels for Interrupts other
than NMI and address break can be modified by IPR.
Rev. 3.00 Aug 23, 2006 Page xi of lxxviii
Item
Page
Revision (See Manual for Details)
4.6 Operation
90
Table amended
(Before) priority level → (After) mask level
Table 4.3 Interrupt
Control States
90, 91
Description amended
2. The following control operations are performed by referencing
the INTM1 and INTM0 bits in INTM and the I bit in CCR.
• When the I bit is set to 1, the interrupt request is held pending.
• When the I bit is cleared to 0 and the INTM1 bit is set to 1,
interrupts with mask level 1 or below are held pending.
• When the I bit is cleared to 0, the INTM1 bit is cleared to 0,
and the INTM0 bit is set to 1, interrupt requests with mask level 0
are held pending.
• When the I bit, INTM1 bit, and INTM0 bit are all cleared to 0,
all interrupt requests are accepted.
3. If contention occurs between interrupts that are not held
pending by the INTM1 and INTM0 bits in the INTM register and
the I bit in CCR, the interrupt with the highest priority as shown in
table 4.2 is selected, regardless of the IPR setting.
Figure 4.2 Flowchart
of Procedure Up to
Interrupt Acceptance
92
Figure amended
Program execution state
Interrupt generated?
No
Yes
Yes
NMI or address
break?
No
INTM1 = 0?
INTM0 = 0?
No
Yes
INTM1 = 0?
INTM0 = 1?
No
I = 0?
Yes
No
Yes
Mask level
1 or 2 interrupt?
No
Mask level 2
interrupt?
Yes
No
Yes
No
I = 0?
I = 0?
Yes
Yes
Rev. 3.00 Aug 23, 2006 Page xii of lxxviii
No
Item
Page
Revision (See Manual for Details)
4.6.1 Interrupt
Exception Handling
Sequence
93
Figure amended
(Before) Address bus → (After) Internal address bus
(Before) RD → (After) Internal read signal
Figure 4.3 Interrupt
Exception Handling
Sequence
4.6.2 Interrupt
Response Times
(Before) HWR, LWR → (After) Internal write signal
(Before) D15 to D0 → (After) Internal data bus
94
Table 4.4 Interrupt
Response Times
(States)
Table amended
No.
Execution Status
Number of States
1
Interrupt mask level determination
1 or 2*
1
Note 1 amended
1. One state for internal interrupts and two states for external
interrupts.
4.7.2 Instructions that 96
Disable Interrupts
Section 5 Clock
Pulse Generators
98
Figure amended
on-chip
oscillator
OSC1
OSC2
101
Figure 5.2 Typical
Connection to Crystal
Resonator
5.2.4 On-Chip
Oscillator Selection
Method (Supported
only by the Masked
ROM Version)
When an interrupt request is generated, an interrupt is request is
sent to the CPU after the interrupt controller has determined the
mask level.
IRQAEC
Figure 5.1 Block
Diagram of Clock
Pulse Generators
(Masked ROM
Version) (2)
5.2 System Clock
Generator
Description amended
ROSC
φOSC
(fOSC)
Figure amended
Frequency
4.19 MHz
102
System
clock
oscillator
Manufacturer
C1, C2
Product Type Recommendation Value
Kyocera Kinseki HC-491U-S
Corporation
22 pF ±20%
Description amended
... The setting takes effect when the rest is cleared. When the onchip oscillator is selected, ...
Rev. 3.00 Aug 23, 2006 Page xiii of lxxviii
Item
Page
Revision (See Manual for Details)
5.3.1 Connecting
32.768-kHz/38.4-kHz
Crystal Resonator
103
Description amended
Clock pulses can be supplied to the subclock generator by
connecting a 32.768-kHz or 38.4-kHz crystal resonator, ...
Figure 5.5 Typical
Connection to
32.768-kHz/38.4-kHz
Crystal Resonator
Figure amended
Manufacturer
Products
Name
C1, C2
Recommendation Value
Equivalent Series
Resistance
Epson Toyocom
C-4-TYPE
7 pF
30 kΩ max
C-001R
7 pF
35 kΩ max
Frequency
38.4 kHz
32.768 kHz Epson Toyocom
Figure 5.6 Equivalent 104
Circuit of 32.768kHz/38.4-kHz Crystal
Resonator
104
Figure amended
Co = 0.9 pF(typ.)
Rs = 35 kΩ (max.)
Description added
Notes on Use of Subclock Generator Circuit
The drive capacity of the subclock generator circuit is limited in
order to reduce current consumption when operating in the
subclock mode. As a result, there may not be sufficient additional
margin to accommodate some resonators. Be sure to select a
resonator with an equivalent series resistance (RS) corresponding
to that shown in figure 5.6.
5.3.3 External Clock
105
Title amended
Input Method
5.4.1 Prescaler S
Description amended
The output from prescaler S is shared by the on-chip peripheral
In active (medium-speed) mode and sleep
modules.
(medium-speed) mode,
5.5.3 Definition of
108, 109 Replaced
Oscillation Stabilization
Wait Time
5.5.6 Note on Using
Power-On Reset
Circuit
110
Description amended
The LSI’s internal power-on reset circuit can be adjusted by
connecting an external capacitor to the RES pin. Adjust the
capacitance of the external capacitor to ensure sufficient
oscillation stabilization time before reset clearing. For details, see
section 22, Power-On Reset Circuit.
Rev. 3.00 Aug 23, 2006 Page xiv of lxxviii
Item
Page
6.1.1 System Control 112
Register 1 (SYSCR1)
6.1.2 System
Control Register 2
(SYSCR2)
114
Revision (See Manual for Details)
Table amended
Bit
Bit Name
Initial
Value
R/W
Description
6
5
4
STS2
STS1
STS0
0
0
0
R/W
R/W
R/W
When an external clock is to be used, the minimum
value (STS2 = 1, STS1 = 0, STS0 = 1) is recommended.
If the internal oscillator is used, the settings CTCS2 = 0,
STS = 1, and STS0 = 0 are recommended.
If the setting other than the recommended value is
made, operation may start before the end of the waiting
time.
Table amended
Bit
Bit Name
Initial
Value
R/W
4
NESEL
1
R/W
Description
Noise Elimination Sampling Frequency Select
The subclock pulse generator generates the watch clock
signal (φW) and the system clock pulse generator
generates the oscillator clock (φOSC). This bit selects the
sampling frequency of φOSC when φW is sampled. When
φOSC = 2 to 10 MHz, clear this bit to 0. Set it to 1 if the
internal oscillator is used.
0: Sampling rate is φOSC/16.
1: Sampling rate is φOSC/4.
1
SA1
0
R/W
Subactive Mode Clock Select 1 and 0
0
SA0
0
R/W
Select the operating clock frequency in subactive and
subsleep modes. The values of SA1 and SA0 do not
change if they are written to in subactive mode.
00: φW/8
01: φW/4
1X: φW/2
6.1.3 Clock Halt
Registers 1 and 2
(CKSTPR1 and
CKSTPR2)
115
Table amended
Bit
Bit Name
1
4
Initial
Value
R/W
1
R/W*
7
S4CKSTP* *
1
FROMCKSTP* *4 1
Description
1
SCI4 Module Standby
SCI4 enters standby mode when this bit is cleared to 0.
1
R/W
Flash Memory Module Standby
Flash memory enters standby mode when this bit is
cleared to 0.
Rev. 3.00 Aug 23, 2006 Page xv of lxxviii
Item
Page
6.2 Mode Transitions 118
and States of LSI
Figure 6.1 Mode
Transition Diagram
Table 6.2 Transition
Mode after SLEEP
Instruction Execution
and Interrupt
Handling
Table 6.3 Internal
State in Each
Operating Mode
120
Revision (See Manual for Details)
Note amended
A transition between different modes cannot be made to occur
simply because an interrupt request is generated. Make sure to
enable interrupt requests.
Table amended
Transition
Mode after
State
SLEEP
Transition
Before
Instruction Mode due to
Transition LSON MSON SSBY TMA3 DTON Execution Interrupt
Active
(mediumspeed)
mode
122
Symbol in
Figure 6.1
0
0
0
*
1
Active
(highspeed)
mode
(direct
transition)

f
0
1
0
*
1
Active
(mediumspeed)
mode
(direct
transition)


Note amended
Subactive
Watch Mode Mode
Function
Peripheral
modules
Subsleep
Mode
Standby
Mode
Functioning/ Functioning/
8
8
retained*
retained*
Functioning/
8
retained*
RTC
Functioning/
8
retained*
Asynchronous
event counter
Functioning*5 Functioning
Timer F
Functioning/
retained*6
TPU
Retained
WDT
Functioning* /
retained
Functioning* / Functioning* / Functioning* /
retained
retained
retained
SCI3/IrDA
R eset
Functioning/ Functioning/
retained*2
retained*2
7
Functioning*5
Functioning
Functioning/r Functioning/
etained*6
retained*6
Retained
Retained
Retained
Retained
7
7
7
Reset
Notes:
5. Only incrementing of the external event timer by ECL/ECH and
overflow interrupts operate.
6. Functioning if φw/4 is selected as an internal clock. Halted and
retained otherwise.
7. Functioning if the on-chip oscillator is selected.
8. Functioning if the internal time keeping time-base function is
selected and retained if the interval timer is selected.
Rev. 3.00 Aug 23, 2006 Page xvi of lxxviii
Item
Page
Revision (See Manual for Details)
6.2.5 Subactive
Mode
125
Description amended
stops but
In subactive mode, the system clock oscillator
on-chip peripheral modules other than TPU, IIC2, the ∆Σ A/D
converter, the A/D converter, and PWM function.
The operating frequency of subactive mode is selected from φW/2,
φW/4, and φW/8 by the SA1 and SA0 bits in SYSCR2.
6.3 Direct Transition
126
Description amended
... operating frequency modification in active
mode. ...
If the direct transition interrupt is disabled by IENR2, no direct
transition takes place and a transition is made instead to sleep or
watch mode.
Note: If a direct transition is attempted while the I bit in CCR is
set to 1, the device remains in sleep or watch mode, and
recovery is not possible.
6.3.1 Direct Transition 127
from Active (HighSpeed) Mode to Active
(Medium-Speed) Mode
6.3.2 Direct Transition 128
from Active (HighSpeed) Mode to
Subactive Mode
Description amended
Example:
When φOSC/8 is selected as the CPU operating clock following transition
Direct transition time = (2 + 1) × 1tosc + 14 × 8tosc = 115tosc
Description amended
Example:
When φosc/8 is selected as the CPU operating clock following transition
Direct transition time = (2 + 1) × 1tosc + 14 × 1tsubcyc = 3tosc + 14tsubcyc
6.3.3 Direct Transition
from Active (MediumSpeed) Mode to Active
(High-Speed) Mode
Description amended
6.3.4 Direct Transition 129
from Active (MediumSpeed) Mode to
Subactive Mode
Description amended
6.3.5 Direct Transition
from Subactive Mode
to Active (High-Speed)
Mode
6.3.6 Direct Transition 130
from Subactive Mode
to Active (MediumSpeed) Mode
Example:
When φOSC/8 is selected as the CPU operating clock before transition
Direct transition time = (2 + 1) × 8tosc + 14 × 1tosc = 38tosc
Example:
When φosc/8 is selected as the CPU operating clock before transition
Direct transition time = (2 + 1) × 8tosc + 14 × 1tsubcyc = 24tosc + 14tsubcyc
Description amended
Example:
When φw/8 is selected as the CPU operating clock before transition and wait
time = 8192 states
Direct transition time = (2 + 1) × 8tw + (8192 + 14) × tosc = 24tw + 8206tosc
Description amended
Example:
When φw/8 is selected as the CPU operating clock before transition, φOSC/8 is
selected as the CPU operating clock following transition, and the wait time is
8,192 states
Direct transition time = (2 + 1) × 8tw + (8192 + 14) × 8tosc
= 24tw + 65648tosc
Rev. 3.00 Aug 23, 2006 Page xvii of lxxviii
Item
Page
Revision (See Manual for Details)
7.3 On-Board
Programming Modes
142
... The boot program transfers the programming control program
from the externally-connected host to on-chip RAM via SCI3
(channel 2). ...
7.6 Programmer
Mode
153
7.8 Notes on Setting 154
Module Standby Mode
9.1.5 Pin Functions
Description amended
... with the on-chip 64-kbyte flash memory (FZTAT64V3).
163
Description amended
Even if an interrupt source occurs while the interrupt is enabled
in module standby mode, program runaway may occur because
the vector cannot be fetched.
Description amended
• P15/TIOCB2 pin
TPU Channel 2
Setting
Next table
(1)
Next table
(2)
Next table (3)
PCR15

0
1
0
1
Pin Function

P15 input
pin
P15 output
pin
P15 input
pin
P15 output
pin
TIOCB2 input pin*
Note:
*
When the MD1 and MD0 bits are set to B'00 and the IOB3 bit to 1, the pin function
becomes the TIOCB2 input pin.
Clear PCR15 to 0 when using TIOCB2 as an input pin.
(2)
(3)
B'0000
B'1xxx
TPU Channel 2
Setting
MD1, MD0
IOB3 to IOB0
(1)
B'00
B'10, B'01, B'11
B'0001 to B'0111
CCLR1, CCLR0

Output Function
[Legend]
164
B'xxxx
B'xx
Setting prohibited
x: Don't care.
• P14/TIOCA2/TCLKC pin
Notes: 1. When the MD1 and MD0 bits are set to B'00 and the IOA3 bit to 1, the pin function
becomes the TIOCA2 input pin.
Clear PCR14 to 0 when using TIOCA2 as an input pin.
2. When the TPSC2 to TPSC0 bits in TCR_2 are set to B'110, the pin function becomes
the TCLKC input pin.
Clear PCR14 to 0 when using TCLKC as an input pin.
TPU Channel 2
Setting
(2)
(1)
(2)
B'1x
B'10
B'11
B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
B'xx00
Other than
B'xx00
Other than B'xx00
CCLR1, CCLR0




Other than
B'01
B'01
Output Function

Output
compare
output

PWM mode
1* output
PWM
mode 2
output

MD1, MD0
IOA3 to IOA0
[Legend]
Note: *
Rev. 3.00 Aug 23, 2006 Page xviii of lxxviii
B'00
x: Don't care.
The output of the TIOCB2 pin is disabled.
(1)
(1)
(2)
Item
Page
Revision (See Manual for Details)
9.1.5 Pin Functions
165
Description amended
• P13/TIOCB1/TCLKB pin
TPU Channel 1
Setting
Next table
(1)
Next table (2)
Next table (3)
PCR13

0
1
0
1
Pin Function

P13 input pin
P13 output
pin
P13 input pin
P13 output
pin
TIOCB1 input pin
TCLKB input pin*
Note:
*
When the TPSC2 to TPSC0 bits in TCR_1 or TCR_2 are set to B'101, the pin function
becomes the TCLKB input pin.
Clear PCR13 to 0 when using TCLKB as an input pin.
TPU Channel 1
Setting
(2)
(3)
B'0000
B'1xxx
MD1, MD0
IOB3 to IOB0
(1)
B'00
B'10, B'01, B'11
B'0001 to B'0111
CCLR1, CCLR0

Output Function
[Legend]
166
B'xxxx
B'xx
Setting prohibited
x: Don't care.
• P12/TIOCA1/TCLKA pin
Notes: 1. When the MD1 and MD0 bits are set to B'00 and the IOA3 bit to 1, the pin function
becomes the TIOCA1 input pin.
Clear PCR12 to 0 when using TIOCA1 as an input pin.
2. When the TPSC2 to TPSC0 bits in TCR_1 or TCR_2 are set to B'100, the pin function
becomes the TCLKA input pin.
Clear PCR12 to 0 when using TCLKA as an input pin.
TPU Channel 1
Setting
(2)
(1)
(2)
B'1x
B'10
B'11
B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
B'xx00
Other
than
B'xx00
Other than B'xx00
CCLR1, CCLR0




Other than
B'01
B'01
Output Function

Output
compare
output

PWM
mode 1*
output
PWM
mode 2
output

MD1, MD0
IOA3 to IOA0
[Legend]
Note: *
B'00
(1)
(1)
(2)
x: Don't care.
The output of the TIOCB1 pin is disabled.
Rev. 3.00 Aug 23, 2006 Page xix of lxxviii
Item
Page
Revision (See Manual for Details)
9.2.5 Pin Functions
171
Description amended
• P32/TXD32/SCL pin
The pin function is switched as shown below according to the combination of the PCR32 bit in
PCR3, ICE bit in ICRR1, TE bit in SCR32, and SPC32 bit in SPCR.
ICE
0
1
SPC32
0
1
x
TE
x
x
x
PCR32
Pin Function
[Legend]
Note: *
0
1
x
x
P32 input pin
P32 output pin
TXD32 output
pin*
SCL I/O pin
x: Don't care.
If SPC32 is set to 1 and TE is cleared to 0, the mark state is entered and 1 is output
from the TXD32 output pin.
• P31/RXD32/SDA pin
The pin function is switched as shown below according to the combination of the PCR31 bit in
PCR3, ICE bit in ICCR1, and RE bit in SCR32.
ICE
0
RE
PCR31
Pin Function
[Legend]
172
1
0
1
x
0
1
x
x
P31 input pin
P31 output pin
RXD32 output
pin
SDA I/O pin
x: Don't care.
• P30/SCK32/TMOW pin
The pin function is switched as shown below according to the combination of the TMOW bit
in PMR3, PCR30 bit in PCR3, CKE 1 and CKE 0 bits in SCR32, and COM
bit in SMR32.
TMOW
0
CKE
1
CKE
0
0
COM
0
PCR30
Pin Function
[Legend]
9.3.3 Port Mode
Register 4 (PMR4)
175
1
0
1
1
x
1
x
x
x
x
x
0
1
x
x
x
P30 input
pin
P30
output
pin
SCK32 output
pin
SCK32 input
pin
TMOW output
pin
x: Don't care.
Description amended
Bit
Bit Name
Initial
Value
R/W
Description
0
TMIF
0
R/W
P40/SCK31/TMIF Pin Function Switch
Selects whether pin P40/SCK31/TMIF is used as
P40/SCK31 or as TMIF.
0: P40/SCK31 I/O pin
1: TMIF input pin
Rev. 3.00 Aug 23, 2006 Page xx of lxxviii
Item
Page
Revision (See Manual for Details)
9.3.4 Pin Functions
176
Description amended
• P42/TXD31/IrTXD/TMOFH pin
TMOFH
0
1
TE
x
x
IrE
x
Pin Function
[Legend]
Note: *
1
x
1
x
x
x
P42 input pin
P42 output
pin
TXD31 output
pin*
IrTXD output
pin*
TMOFH
output pin
x: Don't care.
If SPC31 is set to 1 and TE is cleared to 0, the mark state is entered, 1 is output from
the TXD32 output pin, and 0 is output from the IrTXD pin.
• P40/SCK31/TMIF pin
0
CKE1
1
0
COM
1
0
PCR40
Pin Function
[Legend]
1
0
CKE0
192
x
0
TMIF
9.8.4 Pin Functions
x
0
PCR42
177
1
0
SPC31
1
x
x
0
1
x
x
x
x
0
1
x
x
x
x
P40 input
pin
P40 output
pin
SCK31
output pin
SCK31
input pin
Setting
prohibited
TMIF input
pin
x: Don't care.
Description amended
• P92/IRQ4 pin
IRQ4
0
PCR92
Pin Function
9.9.3 Pin Functions
194, 195 Replaced
9.10.3 Pin Functions
198
1
0
1
0
1
P92 input pin
P92 output pin
IRQ4 input pin
Setting
prohibited
Description amended
• PB2/AN2/IRQ3 pin
IRQ3
Other than
B'0110
B'0110
x
Pin Function
PB2 input pin
AN2 input pin
IRQ3 input pin
[Legend]
199
1
0
CH3 to CH0
x: Don't care.
• PB1/AN1/IRQ1 pin
IRQ1
0
1
CH3 to CH0
Other than
B'0101
B'0101
x
Pin Function
PB1 input pin
AN1 input pin
IRQ1 input pin
[Legend]
x: Don't care.
Rev. 3.00 Aug 23, 2006 Page xxi of lxxviii
Item
Page
Revision (See Manual for Details)
9.10.3 Pin Functions
199
Description amended
• PB0/AN0/IRQ0 pin
IRQ0
0
Other than
B'0100
B'0100
x
Pin Function
PB0 input pin
AN0 input pin
IRQ0 input pin
[Legend]
9.11.1 Serial Port
Control Register
(SPCR)
201
1
CH3 to CH0
x: Don't care.
Table amended
(Before) output data → (After) the output data polarity
(Before) input data → (After) the input data polarity
9.12.1 How to Handle 202
Unused Pin
Description amended
• If an unused pin is an output pin, it is recommended to handle it
in one of the following ways:
 Set the output of the unused pin to high and pull it up to Vcc
with an external resistor of approximately 100 kΩ.
 Set the output of the unused pin to low and pull it down to
GND with an external resistor of approximately 100 kΩ.
10.3.5 RTC Control
208
Register 1 (RTCCR1)
Table amended
Bit
Bit Name
Initial
Value
R/W
Description
3
—
0
R/W
Reserved
2 to 0
—
All 0
—
Only 0 can be written to this bit.
Reserved
These bits are always read as 0.
10.3.7 Clock Source
Select Register
(RTCCSR)
210
Description amended
... A free running counter controls start/stop of counter operation
by the RUN bit in RTCCR1. When a clock other than φw/4 is
selected, ...
Bit
Bit Name
Initial
Value
R/W
Description
3
RCS3
1
R/W
Clock Source Selection
2
RCS2
0
R/W
0000: φ/8⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
1
RCS1
0
R/W
0001: φ/32⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0
RCS0
0
R/W
0010: φ/128⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0011: φ/256⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0100: φ/512⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0101: φ/2048⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0110: φ/4096⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0111: φ/8192⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
1000: φw/4 ⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ RTC operation
Settings other than the above are prohibited.
Rev. 3.00 Aug 23, 2006 Page xxii of lxxviii
Item
Page
Revision (See Manual for Details)
10.4.2 Initial Setting
Procedure
212
Figure amended
Figure 10.3 Initial
Setting Procedure
RUN in RTCCR1 = 0
RST in RTCCR1 = 1
RST in RTCCR1 = 0
Set RTCCSR, RSECDR,
RMINDR, RHRDR,
RWKDR, 12/24 in
RTCCR1, and PM
RUN in RTCCR1 = 1
10.6.2 Notes on
Using Interrupts
215
Added
11.6.1 16-Bit Timer
Mode
228
Description amended
11.6.2 8-Bit Timer
Mode
228
RTC operation is stopped.
RTC registers and clock count
controller are reset.
Clock output and clock source are
selected and second, minute, hour,
day-of-week, operating mode, and
a.m/p.m are set.
RTC operation is started.
If an OCRFL write and compare match signal generation occur
simultaneously, the compare match signal is invalid. However, a
compare match signal may or may not be generated when the
written data and the counter value match. ...
Description amended
(1) TCFH, OCRFH
If an OCRFH write and compare match signal generation occur
simultaneously, the compare match signal is invalid. However, a
compare match signal may or may not be generated when the
written data and the counter value match. ...
229
Description amended
(2) TCFL, OCRFL
If an OCRFL write and compare match signal generation occur
simultaneously, the compare match signal is invalid. However, a
compare match signal may or may not be generated when the
written data and the counter value match. ...
11.6.3 Flag Clearing
229
Description amended
For ST of (1) formula, please substitute the longest number of
execution states in used instruction.
Rev. 3.00 Aug 23, 2006 Page xxiii of lxxviii
Item
Page
Revision (See Manual for Details)
Section 12 16-Bit
Timer Pulse Unit
(TPU)
233
Description amended
A maximum 2-phase PWM output is possible in combination with
synchronous operation
12.1 Features
Table 12.1 TPU
Functions
234
Table amended
Item
Compare
match
output
Figure 12.1 Block
Diagram of TPU
235
Channel 1
Channel 2
0 output
O
—
1 output
O
—
Toggle output
O
—
Figure amended
Input/output pins
Channel 1:
Channel 2:
TIOCA1
TIOCA2
Input pins
Channel 1:
Channel 2:
12.2 Input/Output
Pins
Table 12.2 Pin
Configuration
235
TIOCB1
TIOCB2
Table amended
Channel
Symbol
I/O
Common
TCLKA
Input
Function
External clock A input pin
TCLKB
Input
External clock B input pin
TCLKC
Input
External clock C input pin
1
TIOCA1
I/O
TGRA_1 input capture input/output compare
output/PWM output pin
TIOCB1
Input
TGRB_1 input capture input
2
TIOCA2
I/O
TGRA_2 input capture input/output compare
output/PWM output pin
TIOCB2
Input
TGRB_2 input capture input
Rev. 3.00 Aug 23, 2006 Page xxiv of lxxviii
Item
Page
Revision (See Manual for Details)
12.3.3 Timer I/O
Control Register
(TIOR)
241
Table amended
Description
Table 12.7 TIOR_1
(Channel 1)
Bit 7
IOB3
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
TGRB_1
Function
0
0
0
0
Output
compare
register
1
1
TIOCB1 Pin Function
Output disabled
Setting prohibited
0
1
1
0
0
1
1
0
1
Table 12.8 TIOR_2
(Channel 2)
242
Table amended
Description
Bit 7
IOB3
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
TGRB_2
Function
0
0
0
0
Output
compare
register
1
1
TIOCB2 Pin Function
Output disabled
Setting prohibited
0
1
1
0
0
1
1
0
1
12.4.2 8-Bit Registers 250
Description amended
Registers other than TCNT and TGR are 8-bit. They can be read
and written to in 8-bit units.
Examples of 8-bit register access operation are shown in figures
.
12.3 and 12.4
Figure 12.5 8-Bit
Register Access
Operation [CPU ↔
TCR and TMDR (16
Bits)]
—
Deleted
Rev. 3.00 Aug 23, 2006 Page xxv of lxxviii
Item
Page
Revision (See Manual for Details)
12.5.1 Basic
Functions
254
Description amended
Figure 12.9 shows an example of 1 output.
(2) Waveform Output
by Compare Match
Figure 12.9 Example
of 1 Output
Operation
… and settings have been made such that 1 is output by
. ...
compare match A
255
Figure title and figure amended
TCNT value
H'FFFF
TGRA
Time
H'0000
No change
1 output
TIOCA
Figure 12.10
Example of Toggle
Output Operation
255
No change
Figure amended
TCNT value
Counter cleared by TGRB compare match
H'FFFF
TGRA
Time
H'0000
TIOCA
12.5.4 PWM Modes
261
Description amended
Table 12.12 PWM
Output Registers and
Output Pins
262
Table amended
(4) Examples of
PWM Mode
Operation
263
Toggle output
In PWM mode 2, PWM output is enabled up to 2 phases.
(2) PWM Mode 2
(Before) TIOCB1 → (After) —
(Before) TIOCB2 → (After) —
Description amended
Figure 12.18 shows an example of PWM mode 1 operation.
, and 1 is set
........, 0 is set for the TGRA initial output value
as the TGRB output value.
… TGRB_2 compare match is set as the TCNT clearing source,
and 0 is set for the initial output value and 1 for the output value
of the other TGR registers (TGRA_1, TGRB_1, and TGRA_2),
outputting a 2-phase PWM waveform.
In this case, the value set in TGRB_2 is used as the cycle, …
Rev. 3.00 Aug 23, 2006 Page xxvi of lxxviii
Item
Page
Revision (See Manual for Details)
12.5.4 PWM Modes
264
Figure amended
Synchronous clearing by
TGRB_2 compare match
Figure 12.19
Example of PWM
Mode Operation (2)
TCNT_1 and TCNT_2
TGRB_2
TGRA_2
TGRA_1
Time
H'0000
TIOCA1
TIOCA2
13.3.1 Event
Counter PWM
Compare Register
(ECPWCR)
283
13.3.2 Event
Counter PWM Data
Register (ECPWDR)
284
Description added
Always read or write to this register in word size.
13.3.6 Event Counter 289
H (ECH)
Description added
Always write to this register in word size.
Table amended
Bit
Bit Name
Initial
Value
R/W
Description
7
ECH7
0
R
6
ECH6
0
R
5
ECH5
0
R
4
ECH4
0
R
Either the external asynchronous event AEVH pin, φ/2,
φ/4, or φ/8, or the overflow signal from lower 8-bit
counter ECL can be selected as the input clock source.
ECH can be cleared to H'00 by clearing CRCH in
ESSCR to 0.
3
ECH3
0
R
2
ECH2
0
R
1
ECH1
0
R
0
ECH0
0
R
Rev. 3.00 Aug 23, 2006 Page xxvii of lxxviii
Item
Page
13.3.7 Event Counter 289
L (ECL)
13.4.4 Event Counter 292
PWM Operation
Revision (See Manual for Details)
Table amended
Bit
Bit Name
Initial
Value
R/W
Description
7
ECL7
0
R
6
ECL6
0
R
5
ECL5
0
R
Either the external asynchronous event AEVL pin, φ/2,
φ/4, or φ/8 can be selected as the input clock source.
ECL can be cleared to H'00 by clearing CRCL in ESSCR
to 0.
4
ECL4
0
R
3
ECL3
0
R
2
ECL2
0
R
1
ECL1
0
R
0
ECL0
0
R
Figure amended
toff = (T × (Ndr +1)) − tcyc
Figure 13.4 Event
Counter Operation
Waveform
Clock input enable time
Clock input disable time
One conversion period
ECPWM input clock cycle
Value of ECPWDR
Fixed low when Ndr =H'FFFF
Ncm: Value of ECPWCR
tcyc: System cock (φ) cycle time
ton:
toff:
tcm:
T:
Ndr:
ton
tcm = T × (Ncm +1)
Table 13.2 Examples 293
of Event Counter PWM
Operation
13.5 Operating States 294
of Asynchronous Event
Counter
Table amended
Clock
Clock
toff =
Source
Source
ECPWCR
ECPWDR
(T × (Ndr + 1)) tcm =
ton =
Selection Cycle (T)* Value (Ncm) Value (Ndr) – tcyc
T × (Ncm + 1) tcm – toff
φ/2
0.5 µs
H'7A11
H'16E3
2.92975 ms
15.625 ms
12.69525 ms
φ/4
1 µs
D'31249
D'5859
5.85975 ms
31.25 ms
25.39025 ms
φ/8
2 µs
11.71975 ms
62.5 ms
50.78025 ms
φ/16
4 µs
23.43975 ms
125.0 ms
101.56025 ms
φ/32
8 µs
46.87975 ms
250.0 ms
203.12025 ms
φ/64
16 µs
93.75975 ms
500.0 ms
406.24025 ms
Notes: 1. When an asynchronous external event is input, the
counter increments. However, an interrupt request is issued
when the counter overflows.
Table 13.3 Operating
States of
Asynchronous Event
Counter
13.6 Usage Notes
296
Description added
7. If the flash memory version was used with the IRQAEC pin
fixed high level and then the chip is replaced with the masked
ROM version, the internal oscillator must be used.
Rev. 3.00 Aug 23, 2006 Page xxviii of lxxviii
Item
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Revision (See Manual for Details)
14.1 Features
297
… or the WDT on-chip oscillator
timer-counter clock.
Figure 14.1 Block
Diagram of
Watchdog Timer
298
Figure amended
WDT
on-chip
oscillator
φ
14.2.1 Timer
Control/Status
Register WD1
(TCSRWD1)
can be selected as the
300
PSS
Note * added
Bit
Bit Name
Initial
Value
R/W
Description
2
WDON
0
R/W
Watchdog Timer On*
TCWD starts counting up when the WDON bit is set to
1 and halts when the WDON bit is cleared to 0.
Note: * When transitioning to the watch mode or standby mode while the main internal clock is
selected (CKS3 = 1) using timer mode register WD (TMWD), make sure to clear WDON to
0 to halt operation of TCWD.
14.2.2 Timer
302
Control/Status Register
WD2 (TCSRWD2)
Note 4 amended
14.2.4 Timer Mode
Register WD
(TMWD)
Description amended
14.3.1 Watchdog
Timer Mode
303
304
Figure 14.3 Interval
Timer Mode Operation
Bit
Bit Name
Initial
Value
R/W
Description
3
CKS3
1
R/W
0XXX: WDT on-chip oscillator: counts on Rosc/2048
2
CKS2
1
R/W
1
CKS1
1
R/W
For the WDT on-chip oscillator overflow periods, see
section 25, Electrical Characteristics.
0
CKS0
1
R/W
In active (medium-speed) mode or sleep (mediumspeed) mode, the setting of B'0XXX and interval timer
mode is disabled.
Description amended
… The internal reset signal is output for a period of 256 φOSC clock
cycles. …
Figure 14.2 Example
of Watchdog Timer
Operation
14.3.2 Interval Timer
Mode
4. In subactive mode, clear this flag after setting the CKS3 to
CKS0 bits in TMWD to B'0XXX (WDT on-chip oscillator).
Figure amended
(Before) 512φOSC clock cycles → (After) 256φOSC clock cycles
305
Figure amended
(Before) WT/IT = 0 → (After) WT/IT = 1
TME = 1
Rev. 3.00 Aug 23, 2006 Page xxix of lxxviii
Item
Page
Section 15 Serial
307
Communication
Interface 3 (SCI3, IrDA)
Revision (See Manual for Details)
Description amended
The serial communication interface 3 (SCI3) can handle both
asynchronous and clocked synchronous serial communication. ...
or an Asynchronous Communication Interface Adapter (ACIA).
The SCI3_1 can transmit and receive IrDA ...
15.3.5 Serial Mode
Register (SMR)
314
Table amended
Bit
Bit Name
Initial
Value
R/W
Description
2
MP
0
R/W
5-Bit Communication
When this bit is set to 1, the 5-bit communication
format is enabled. When writing 1 to this bit, always
write 1 to bit 5 (RE) at the same time. In addition, 1
must be written to bit 3 (MPIE) in the serial control
register (SCR) before writing 1 to this bit.
315
Bit
Bit Name
Initial
Value
R/W
Description
1
CKS1
0
R/W
Clock Select 0 and 1
0
CKS0
0
R/W
These bits select the clock source for the on-chip baud
rate generator.
00: φ clock (n = 0)
01: φw/2 or φ w clock (n = 1)
10: φ/16 clock (n = 2)
11: φ/64 clock (n = 3)
When the setting value is 01 in active (mediumspeed/high-speed) mode and sleep (mediumspeed/high-speed) mode φw/2 clock is set. In subacive
mode and subsleep mode, φw clock is set. The SCI3 is
enabled only, when φw/2 is selected for the CPU
operating clock.
For the relationship between the bit rate register setting
and the baud rate, see section 15.3.8, Bit Rate
Register (BRR). n is the decimal representation of the
value of n in BRR (see section 15.3.8, Bit Rate
Register (BRR)).
15.3.6 Serial Control
Register (SCR)
15.3.7 Serial Status
Register (SSR)
317
320
Table amended
Bit
Bit Name
Initial
Value
R/W
Description
3
MPIE
0
R/W
Reserved
Table amended
Bit
Bit Name
Initial
Value
R/W
Description
1
MPBR
0
R
Reserved
This bit is read-only and reserved. It cannot be written
to.
0
MPBT
0
R/W
Reserved
The write value should always be 0.
Rev. 3.00 Aug 23, 2006 Page xxx of lxxviii
Item
Page
15.3.8 Bit Rate
Register (BRR)
321
Revision (See Manual for Details)
Description amended
[Asynchronous Mode]
Active (medium-speed/high-speed) or sleep (medium-speed/high-speed)
OSC
–1
32 × 22n × B
N=
Error (%) =
B (bit rate obtained from n, N, φ) – R (bit rate in left-hand column in table 15.3)
R (bit rate in left-hand column in table 15.3)
× 100
Subactive or subsleep
OSC
–1
64 × 22n × B
N=
[Legend] B:
Bit rate (bit/s)
BRR setting for baud rate generator (0 ≤ N ≤ 255)
N:
OSC: φOSC value (Hz)
n:
Baud rate generator input clock number (n = 0, 2, or 3)
(The relation between n and the clock is shown in table 15.3)
Table 15.3
Examples of BRR
Settings for Various
Bit Rates
(Asynchronous
Mode) (1)
Table 15.3
Examples of BRR
Settings for Various
Bit Rates
(Asynchronous
Mode) (2)
322
Table amended
32.8kHz
Bit Rate
(bit/s) n
323
N
38.4kHz
Error
(%)
n
N
2MHz
2.097152MHz
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
—
—
—
—
—
—
2
35
–1.36
2
36
0.64
150
—
—
—
0
3
0.00
2
25
0.16
2
26
1.14
200
—
—
—
0
2
0.00
2
19
–2.34
3
4
2.40
250
0
1
2.50
—
—
—
0
249
0.00
3
3
2.40
300
—
—
—
0
1
0.00
0
207
0.16
0
217
0.21
600
—
—
—
0
0
0.00
0
103
0.16
0
108
0.21
1200
—
—
—
—
—
—
0
51
0.16
0
54
–0.70
2400
—
—
—
—
—
—
0
25
0.16
0
26
1.14
Table amended
Bit
Rate
(bit/s) n
2.4576MHz
N
Error
(%)
3MHz
n
N
3.6864MHz
Error
(%)
n
N
Error
(%)
4MHz
n
N
Error
(%)
4.194MHz
n
N
Error
(%)
110
3
10 –0.83
2
52
0.50
2
64
0.70
2
70
0.03
2
73
0.63
150
3
7
0.00
2
38
0.16
3
11
0.00
2
51
0.16
2
54
–0.71
200
3
5
0.00
2
28
1.02
3
8
0.00
2
38
0.16
2
40
–0.10
250
2
18 1.05
2
22
1.90
2
28
–0.69
2
30
0.81
2
32
–0.71
300
3
3
0.00
3
4
–2.34
3
5
0.00
2
25
0.16
2
26
1.13
600
3
1
0.00
0
155 0.16
3
2
0.00
0
207 0.16
0
217
0.20
Rev. 3.00 Aug 23, 2006 Page xxxi of lxxviii
Item
Page
Revision (See Manual for Details)
15.3.8 Bit Rate
Register (BRR)
324
Table amended
4.9152MHz
Table 15.3
Examples of BRR
Settings for Various
Bit Rates
(Asynchronous
Mode) (3)
Table 15.5
Maximum Bit Rate
for Each Frequency
(Asynchronous
Mode)
Table 15.6 BRR
Settings for Various
Bit Rates (Clocked
Synchronous Mode)
(1)
326
5MHz
n
N
Error
(%)
2
106
–0.44
2
108
0.08
2
77
0.16
3
19
0.00
2
58
–0.69
3
14
0.00
46
–0.27
3
11
0.00
38
0.16
3
9
0.00
–2.34
3
4
0.00
2
88
–0.25
2
64
0.16
2
48
–0.35
2
38
0.16
2
2
32
–1.36
2
255
1.73
3
4
2
86
0.31
3
15
0.00
200
3
11
0.00
250
2
37
1.05
300
3
7
0.00
600
3
3
0.00
0
150
N
n
n
6.144MHz
Error
(%)
N
N
110
6MHz
Error
(%)
Error
(%)
Bit Rate
(bit/s) n
1200
3
1
0.00
0
129
0.16
0
155
0.16
2
9
0.00
2400
3
0
0.00
0
64
0.16
0
77
0.16
2
4
0.00
4800
2
1
0.00
0
32
–1.36
0
38
0.16
0
39
0.00
9600
2
0
0.00
2
0
1.73
0
19
–2.34
0
19
0.00
19200
0
7
0.00
0
7
1.73
0
9
–2.34
0
9
0.00
31250
0
4
–1.70
0
4
0.00
0
5
0.00
0
5
2.4
38400
0
3
0.00
0
3
1.73
0
4
–2.34
0
4
0.00
Table amended
Setting
327
φ (MHz)
Maximum Bit Rate (bit/s)
n
N
0.0328
512.5
0
0
0.0384
600
0
0
2
62500
0
0
Table amended
φ
32.8 kHz
2 MHz
38.4 kHz
Bit Rate
(bit/s)
n
N
Error (%)
n
N
Error (%)
n
N
Error (%)
200
0
20
−2.38
0
23
0.00
2
155
0.16
250
0
15
2.50
0
18
1.05
2
124
0.00
300
0
13
−2.38
0
15
0.00
2
103
0.16
500
0
7
2.50
0


2
62
−0.79
1k
0
3
2.50



2
30
0.81
2.5k






0
199
0.00
Rev. 3.00 Aug 23, 2006 Page xxxii of lxxviii
Item
Page
Revision (See Manual for Details)
15.3.8 Bit Rate
Register (BRR)
328
Table and note amended
φ
Table 15.6 BRR
Settings for Various
Bit Rates (Clocked
Synchronous Mode)
(2)
4 MHz
8 MHz
Bit Rate
(bit/s)
n
N
Error (%)
n
N
10k
0
99
0.00
0
199 0.00
Note:
*
Error (%)
10 MHz
n
N
Error (%)
2
15
–2.34
Continuous transmission/reception is not possible.
The value set in BRR is given by the following formula:
Active (medium-speed/high-speed) or sleep (medium-speed/high-speed)
N=
OSC
4 × 22n × B
–1
Subactive or subsleep
N=
B:
N:
OSC:
n:
15.3.9 Serial Port
Control Register
(SPCR)
330
OSC
8 × 22n × B
–1
Bit rate (bit/s)
BRR setting for baud rate generator (0 ≤ N ≤ 255)
φOSC value (Hz)
Baud rate generator input clock number (n = 0, 2, or 3)
(The relation between n and the clock is shown in table 15.7.)
Table amended
Bit
Bit Name
Initial
Value
R/W
Description
3
SCINV3
0
R/W
TXD32 Pin Output Data Inversion Switch
Selects whether the polarity of output data of the
TXD32 pin is inverted or not.
0: Output data of TXD32 pin is not inverted.
1: Output data of TXD32 pin is inverted.
2
SCINV2
0
R/W
RXD32 Pin Input Data Inversion Switch
Selects whether the polarity of input data of the RXD32
pin is inverted or not.
0: Output data of RXD32 pin is not inverted.
1: Output data of RXD32 pin is inverted.
1
SCINV1
0
R/W
TXD31 Pin Output Data Inversion Switch
Selects whether the polarity of output data of the
TXD31 pin is inverted or not.
0: Output data of TXD31 pin is not inverted.
1: Output data of TXD31 pin is inverted.
0
SCINV0
0
R/W
RXD31 Pin Input Data Inversion Switch
Selects whether the polarity of input data of the RXD31
pin is inverted or not.
0: Input data of RXD31 pin is not inverted.
1: Input data of RXD31 pin is inverted.
Rev. 3.00 Aug 23, 2006 Page xxxiii of lxxviii
Item
Page
Revision (See Manual for Details)
15.4.1 Clock
334
Table amended
Table 15.8 Data
Transfer Formats
(Asynchronous Mode)
Table 15.9 SMR
Settings and
Corresponding Data
Transfer Formats
SMR
335
Serial Data Transfer Format and Frame Length
CHR
PE
MP
STOP
0
0
1
0
Setting prohibited
0
0
1
1
Setting prohibited
1
0
1
0
Setting prohibited
1
0
1
1
Setting prohibited
1
2
3
4
5
6
7
8
9
SMR
Bit 6
CHR
Bit 2
MP
Bit 5
PE
Bit 3
STOP
0
0
1
0
0
Mode
Data Length
Asynchronous
mode
Setting
prohibited
5-bit data
0
Parity Bit
No
1
1
0
1
Stop Bit
Length
1 bit
2 bits
0
Setting
prohibited
1
0
5-bit data
1
Yes
1 bit
2 bits
Figure amended
[4] Wait at least one bit interval, then set the TE bit or RE bit in
SCR to 1. Setting bits TE and RE enables the TXD31 (TXD32)
and RXD31 (RXD32) pins to be used. Also set the RIE, TIE, and
bits, ...
TEIE
Figure 15.4 Sample
SCI3 Initialization
Flowchart
15.4.3 Data
Transmission
12
Data Transfer Format
Bit 7
COM
1
337
11
Table amended
1
15.4.2 SCI3
Initialization
10
339
Figure amended
No
[3]
Figure 15.6 Sample
Serial Transmission
Flowchart
(Asynchronous Mode)
Break output?
Yes
Clear PDR to 0 and
set PCR to 1
Clear SPC31 (SPC32) bit in SPCR
and TE bit in SCR to 0*
<End>
Note: * When SPC31 (SPC32) in SPCR is cleared to 0, the corresponding pin becomes an I/O port.
15.6 Multiprocessor
Communication
Function

Deleted
Rev. 3.00 Aug 23, 2006 Page xxxiv of lxxviii
Item
Page
Revision (See Manual for Details)
15.6.1 Transmission
350
Description amended
... a high-level pulse width of at least 1.41 µs to 1.6 µs can be
specified.
Figure 15.16 IrDA
Transmission and
Reception
351
15.6.2 Reception
351
Figure amended
(Before) ... 3/16 bit cycle → (After) ... 3/16 bit rate
Description amended
If a pulse has a high-level width of less than 1.41 µs, ...
15.8.2 Mark State
and Break Sending
356
Description amended
Regardless of the value of TE, when the SPCR31 (SPCR32) bit
in SPCR is cleared to 0, the TXD31 (TXD32) pin is used as an
I/O port whose direction (input or output) and level are
determined by PCR and PDR. This can be used to set the
TXD31 (TXD32) pin to mark state (high level) or send a break
during serial data transmission. To maintain the communication
line at mark state (1) until SPCR31 (SPCR32) in SPCR is set to
1, set both PCR and PDR to 1. As SPCR31 (SPCR32) in SPCR
is cleared to 0 at this point, the TXD31 (TXD32) pin becomes an
I/O port, and 1 is output from the TXD31 (TXD32) pin. To send a
break during serial transmission, first set PCR to 1 and PDR to 0,
and then clear SPCR31 (SPCR32) and TE to 0. If TE is cleared
to 0 immediately after SPCR31 (SPCR32) is cleared to 0, the
transmitter is initialized regardless of the current transmission
state after TE is cleared, and when SPCR31 (SPCR32) is
cleared to 0 the TXD31 (TXD32) pin becomes an I/O port and 0
is output from it.
Rev. 3.00 Aug 23, 2006 Page xxxv of lxxviii
Item
Page
Revision (See Manual for Details)
17.3.2 PWM Data
Register (PWDR)
383
Description amended
When data is written to the lower 14 bits of PWDR, …
The initial value of PWDR is 0, and it is always read as H'FFFF.
Always write to this register in word size.
17.4 Operation
384, 385 Replaced
17.5 PWM Operating 386
States
Added
17.6 Usage Notes
18.3.1 A/D Result
Register (ADRR)
389
18.7.1 Permissible
Signal Source
Impedance
398
19.3.1 A/D Data
Register (ADDR)
403
19.3.2 BGR Control
Register (BGRMR)
404
19.3.4 A/D
Start/Status Register
(ADSSR)
407
Description added
Always read this register in word size.
Description amended
If a large capacitance is provided externally as a
countermeasure, the input load essentially comprises only the
internal input resistance of 10 kΩ, and the signal source
impedance can be ignored.
Description added
Always read this register in word size.
Note amended
… 1.2 V is approximately 100 µs.
Table and note amended
Bit
Bit Name
Initial
Value
R/W
Description
2 to
0



Reserved
These bits cannot be modified.
Note: When the BYPGA bit is set to 1 and the PGA factor is 1, the factor of analog input voltage is
also 1. However, analog input voltage is limited to range from 0 to Vref [V] when the
BYPGA bit is set to 1 and from 0.2 to 0.9 Vref [V] when the PGA factor is 1. Therefore when
the factor of analog input voltage is 1, the setting when the BYPGA bit is set to 1 should be
used.
Rev. 3.00 Aug 23, 2006 Page xxxvi of lxxviii
A/D conversion (1)
Set*
↓ Read conversion result
A/D conversion result (1)
Idle
Clear*
A/D conversion (2)
Set*
↓ Read conversion result
A/D conversion result (2)
Idle
Page
Revision (See Manual for Details)
19.5.2 Continuous
Mode
411
Fugure amended
Note: * ↓indicates instruction execution by software.
ADDR
Idle
A/D conversion starts
Set*
Figure 19.2
Example of ∆Σ A/D
Conversion
Operation (Wait
Mode)
Channel 1
(Ain1)
operating
state
ADS
ADST
IENSAD
Interrupt
(IRRSDADCN)
Item
Rev. 3.00 Aug 23, 2006 Page xxxvii of lxxviii
Item
Page
Revision (See Manual for Details)
19.6.5 PB5/Vref/REF
Pin
414
Newly added
20.3.1 LCD Port
Control Register
(LPCR)
418
If VREF1 and VREF0 in the ADCR register are set to b'01 or b'11
and the ∆∑ A/D converter is not operating, switch the
PB5/Vref/REF pin to PB5 input operation to prevent current from
flowing from the pin to GND.
Table amended
Bit 7:
DTS1
Bit 6:
DTS0
Bit 5:
CMX
Duty
Cycle
Common Drivers
Notes*
0
0
0
Static
COM1
Leave COM4, COM3, and COM2 in open drain
state
COM4 to COM1
COM4, COM3, and COM2 output the same
waveform as COM1
1
0
COM2 to COM1
Leave COM4 and COM3 in open drain state
COM4 to COM1
COM4 outputs the same waveform as
COM3, and COM2 outputs the same
waveform as COM1
Table 20.2 Duty Cycle
and Common Function
Selection
1
1/2 duty
1
1
0
0
1/3 duty
1
1
0
1/4 duty
COM3 to COM1
Leave COM4 in open drain state
COM4 to COM1
Leave COM4 in open drain state
COM4 to COM1
—
1
Note: *
20.3.2 LCD Control
Register (LCR)
Table 20.4 Frame
Frequency Selection
421
If SGS3 to SGS0 are set to B'0000, the power supply voltage level of PA0 to PA3 and COM1 to
COM4 is Vcc. If the setting of SGS3 to SGS0 is other than B'0000, the power supply voltage level of
PA0 to PA3 and COM1 to COM4 is the LCD drive power supply voltage level.
Note 3 amended
3. This is the frame frequency in active (medium-speed, φOSC/8)
mode when φOSC = 2 MHz.
Rev. 3.00 Aug 23, 2006 Page xxxviii of lxxviii
Item
Page
Revision (See Manual for Details)
20.3.4 LCD
Trimming Register
(LTRMR)
424
Note amended
Notes: Setting Method for LCD Trimming Register (LTRMR) and
BRG Control Register (BGRMR)
Assuming the following definitions,
V1 initial state voltage: A
LTRMR register
TRM3 to TRM0: B
CTRM2 to CTRM0: C
BGRMR register
BTRM2 to BTRM0: D
rough guidelines for the voltages after trimming are as
follows:
V1 voltage = A + B + C + 3 × D/1.2
V2 voltage = (A + B + C + 3 × D/1.2) × 2/3
V3 voltage = (A + B + C + 3 × D/1.2) / 3
After monitoring voltage A, set B, C, and D so the V1
voltage is 3 V.
The BRG control register is used both for ∆∑ A/D
converter REF output adjustment and 3 V constantvoltage power supply circuit adjustment. Therefore, make
sure to choose settings that satisfy the specifications for
both functions.
20.4.3 3-V Constant- 434
Voltage Power Supply
Circuit
Note 4 added
20.5 Usage Notes
Added
436
4. Initially, the step-up circuit output voltage differs among
individual devices due to production variation. Therefore, make
sure to adjust the settings of the LCD trimming register (LTRMR)
and BRG control register (BGRMR) individually for each device.
20.5.1 Pin Processing
when No LCD
Controller/Driver Is
Used
20.5.2 Pin Processing
when No 3 V Constant
Voltage Circuit Is Used
Rev. 3.00 Aug 23, 2006 Page xxxix of lxxviii
Item
2
21.3.5 I C Bus
Status Register
(ICSR)
Page
Revision (See Manual for Details)
450
Table amended
Bit
Bit Name
Initial
Value
R/W
Description
3
STOP
0
R/W
Stop Condition Detection Flag
[Setting conditions]
•
When a stop condition is detected after completion of a
frame transfer in master mode
•
When a stop condition is detected after the first byte
slave address and SAR match following a general call
and detection of a start condition in slave mode
[Clearing condition]
•
22.2.1 Power-On
Reset Circuit
476
24.1 Register
Addresses (Address
Order)
488
Description amended
If the RES pin rising time is t, the capacitance (CRES) connected
to the RES pin can be computed using the formula below. For
information about the on-chip resistor (Rp), see section 25,
Electrical Characteristics. The power supply rising time should
not exceed half the RES rising time (t). The RES rising time (t)
should also equal or exceed the oscillation stabilization time (trc).
Table amended
Abbreviation
Register Name
494
495
Module
Bit No. Address Name
Data
Bus
Access
Width State
Event counter H
ECH
8
H'FF96
AEC*
1
8/16
2
Event counter L
ECL
8
H'FF97
AEC*
1
8/16
2
Register Name
Abbreviation
Module
Bit No. Address Name
Data
Bus
Access
Width State
8-bit timer counter FH
TCFH
8
H'FFB8
Timer F
8/16
2
8-bit timer counter FL
TCFL
8
H'FFB9
Timer F
8/16
2
Output compare register FH
OCRFH
8
H'FFBA
Timer F
8/16
2
Output compare register FL
OCRFL
8
H'FFBB
Timer F
8/16
2
489
24.2 Register Bits
When 0 is written in STOP after reading STOP = 1
Table amended
Register
Abbreviation Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
IPRA
IPRA6
IPRA5
IPRA4
IPRA3
IPRA2
IPRA1
IPRA0
Interrupts
Register
Abbreviation Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
SMR3_2
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
SCI3_2
BRR3_2
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
SCR3_2
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
TDR3_2
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
SSR3_2
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
RDR3_2
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
Rev. 3.00 Aug 23, 2006 Page xl of lxxviii
IPRA7
Item
Page
Revision (See Manual for Details)
24.3 Register States
in Each Operating
Mode
498
Table amended
499
25.1 Absolute
Maximum Ratings for
F-ZTAT Version
Table 25.1 Absolute
Maximum Ratings
503
Register
Abbreviation
Reset
Sleep
Watch
Subactive Subsleep Standby
Module
SCR4
Initialized 





SCR4
SCSR4
Initialized 





TDR4
Initialized 





RDR4
Initialized 





TSTR
Initialized 





TSYR
Initialized 





TCR_1
Initialized 





TMDR_1
Initialized 





TIOR_1
Initialized 





TIER_1
Initialized 





TSR_1_
Initialized 





TCNT_1
Initialized 





TGRA_1
Initialized 





TGRB_1
Initialized 





TCR_2
Initialized 





TMDR_2
Initialized 





TIOR_2
Initialized 





TIER_2
Initialized 





TSR_2
Initialized 





TCNT_2
Initialized 





TGRA_2
Initialized 





TGRB_2
Initialized 





Active
TPU
TPU_1
TPU_2
Register
Abbreviation
Reset
Active
Sleep
Watch
Subactive Subsleep Standby
Module
RTCFLG







RTC
RSECDR







RMINDR







RHRDR







Item
Symbol
Value
Unit Note
Power supply voltage
VCC
–0.3 to +4.3
V
Analog power supply voltage
AVCC
–0.3 to +4.3
V
DVCC
–0.3 to +4.3
V
Input voltage
Other than port B
Vin
–0.3 to VCC +0.3
V
Ports B0 to B2
AVin
–0.3 to AVCC + 0.3
V
Ports B5 to B7
DVin
–0.3 to DVCC + 0.3
V
Table amended
*1
Rev. 3.00 Aug 23, 2006 Page xli of lxxviii
Item
Page
25.2.1 Power Supply 504
Voltage and Operating
Range
Revision (See Manual for Details)
Note 1 amended
... the minimum value of fosc is 2 MHz.
(1) Power Supply
Voltage and Oscillation
Frequency Range
(2) Power Supply
Voltage and
Operating Frequency
Range
505
25.2.2 DC
Characteristics
507
Note 1 amended
… the minimum operating frequency (φ ) is 2 MHz
Condition and table amended
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V,
VSS = AVSS = 0.0 V, unless otherwise specified.
Table 25.2 DC
Characteristics
Values
Item
Symbol
Applicable Pins
Input high
VIH
RES, NMI*3, WKP0
voltage
Test Condition
Min.
Typ.
Max.
Unit
0.9VCC
—
VCC + 0.3
V
IRQ0, IRQ1, IRQ3
0.9VCC
—
AVCC + 0.3
RXD32, RXD31
0 .8VCC
—
VCC + 0.3
PB0 to PB2
0.8VCC
—
AVCC + 0.3
PB5 to PB7
0.8VCC
—
DVCC + 0.3
IRQAEC
0.9VCC
—
VCC + 0.3
Notes
to WKP7, IRQ4,
AEVL, AEVH,
TMIF, ADTRG,
SCK32, SCK31,
SCK4
512
Note 1 amended
Mode
RES
Pin
Watch mode
VCC
Internal State
Only time base operates, CPU
stops
Other
Pins
LCD Power
Supply
VCC
Halted
On-chip WDT oscillator is off
Subclock oscillator:
crystal resonator
TCSRWD1 (WDON) = 0
Standby mode
VCC
CPU and timers both stop
On-chip WDT oscillator is off
TCSRWD1 (WDON) = 0
Rev. 3.00 Aug 23, 2006 Page xlii of lxxviii
Oscillator Pins
System clock oscillator:
crystal resonator
VCC
Halted
System clock oscillator:
crystal resonator
Subclock oscillator:
Pin X1 = GND
(32KSTOP = 0)
Item
Page
Revision (See Manual for Details)
25.2.3 AC
Characteristics
513
Condition amended
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V,
VSS = AVSS = 0.0 V, unless otherwise specified.
Table 25.3 Control
Signal Timing
Table 25.4 Serial
Interface Timing
2
516
Table 25.5 I C Bus
Interface Timing
517
25.2.4 A/D
Converter
Characteristics
518
Condition amended
VCC = 1.8 V to 3.6 V, AVCC= 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V,
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise specified.
Condition and table amended
VCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V,
unless otherwise specified.
Table 25.6 A/D
Converter
Characteristics.
Applicable
Item
Symbol
Pins
Conversion time
Values
Test Condition
Min.
Typ.
Max.
Unit
AVCC = 2.7 V to 3.6 V
VCC = 2.7 V to 3.6 V
6.2
—
124
µs
AVCC = 2.0 V to 3.6 V
VCC = 2.0 V to 3.6 V
14.7
—
124
Other than above
31
—
124
Notes
Note 4 amended
4. Conversion time = 31 µs
25.2.5 ∆∑ A/D
Converter
Characteristics
Table 25.7 ∆∑ A/D
Converter
Characteristics
519
Condition added
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V,
VSS = AVSS = 0.0 V, unless otherwise specified.
520
Table amended
Values
Applicable
Item
Symbol
External
Pins
Test Condition
Min.
Typ.
Max.
Unit
Vref
0.2 DVcc
—
0.9 DVcc
V
Vref
—
18
—
kΩ
Notes
reference voltage
Vref–GND
resistance
25.2.6 LCD
Characteristics
Table 25.8 LCD
Characteristics
522
RVref
REF
Condition amended
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V,
VSS = AVSS = 0.0 V, unless otherwise specified.
Rev. 3.00 Aug 23, 2006 Page xliii of lxxviii
Item
Page
Revision (See Manual for Details)
25.2.7 Power-On
Reset Circuit
Characteristics
523
Condition and table amended
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V,
Ta = −20 to +75˚C (regular specifications), Ta = −40 to +85˚C (wide-range specifications), unless
otherwise specified.
Table 25.9 PowerOn Reset Circuit
Characteristics
Values
Item
Symbol
Reset voltage
V_rst
Test Condition
Power supply rise time t_vtr
Reference
Min.
Typ.
Max.
Unit
Figure
0.7Vcc
0.8Vcc
0.9Vcc
V
Figure 25.1
The Vcc rise time should be shorter than half the
RES rise time.
—
µs
Reset count time
t_out
0.8
Count start time
t_cr
Adjustable by the value of the external capacitor
8.0
On-chip pull-up
Rp
of the RES pin.
Vcc = 3.0 V
60
100
—
kΩ
Figure 22.1
resistance
25.2.8 Watchdog
Timer Characteristics
523
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V,
VSS = AVSS = 0.0 V, …
Table 25.10
Watchdog Timer
Characteristics
25.2.9 Flash
Memory
Characteristics
Preliminary
524
Table 25.12
Absolute Maximum
Ratings
Condition A amended
AVCC = 2.7 V to 3.6 V, DVCC = 2.7 V to 3.6 V, VSS = AVSS = 0.0 V,
VCC = 2.7 V to 3.6 V (operating voltage range in reading), …
Condition B amended
Table 25.11 Flash
Memory
Characteristics
25.3 Absolute
Maximum Ratings for
Masked ROM
Version
Condition amended
AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V,
VCC = 1.8 V to 3.6 V (operating voltage range in reading), …
526
Table amended
Item
Symbol
Value
Unit
Note
Power supply voltage
VCC
–0.3 to +4.3
V
*1
Analog power supply voltage
AVCC
–0.3 to +4.3
V
DVCC
–0.3 to +4.3
V
Input voltage
Other than port B
Vin
–0.3 to VCC +0.3
V
Ports B0 to B2
AVin
–0.3 to AVCC + 0.3
V
Ports B5 to B7
DVin
–0.3 to DVCC + 0.3
V
Rev. 3.00 Aug 23, 2006 Page xliv of lxxviii
Item
Page
25.4.1 Power Supply 527
Voltage and Operating
Range
Revision (See Manual for Details)
Note 1 amended
... the minimum value of fosc is 2 MHz.
(1) Power Supply
Voltage and Oscillation
Frequency Range
(2) Power Supply
528
Voltage and Operating
Frequency Range
... the minimum operating frequency (φ) is 2 MHz
25.4.2 DC
Characteristics
Condition and table amended
530
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AV SS = 0.0 V, unless
otherwise specified.
Table 25.13 DC
Characteristics
Values
Item
Symbol
Applicable Pins
Input high
VIH
RES, NMI, WKP0 to
voltage
Test Condition
Min.
Typ.
Max.
Unit
0.9VCC
—
VCC + 0.3
V
IRQ0, IRQ1, IRQ2
0.9VCC
—
AVCC + 0.3
RXD32, RXD31
0.8VCC
—
VCC + 0.3
PB0 to PB2
0.8VCC
—
AVCC + 0.3
PB5 to PB7
0.8VCC
—
DVCC + 0.3
IRQAEC
0.9VCC
—
VCC + 0.3
Notes
WKP7, IRQ4,
AEVL, AEVH,
TMIF, ADTRG,
SCK32, SCK31,
SCK4
535
Note 1 amended
RES
Other
LCD Power
Pins
Supply
Oscillator Pins
Halted
System clock oscillator:
Mode
Pin
Internal State
Watch mode
VCC
Only time base operates, CPU VCC
stops
crystal resonator
On-chip WDT oscillator is off
Subclock oscillator:
crystal resonator
TCSRWD1 (WDON) = 0
Standby mode
VCC
CPU and timers both stop
On-chip WDT oscillator is off
TCSRWD1 (WDON) = 0
VCC
Halted
System clock oscillator:
crystal resonator
Subclock oscillator:
Pin X1 = GND
(32KSTOP = 0)
Rev. 3.00 Aug 23, 2006 Page xlv of lxxviii
Item
Page
Revision (See Manual for Details)
25.4.3 AC
Characteristics
536
Conditions and table amended
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AV SS = 0.0 V, unless
otherwise specified.
Table 25.14 Control
Signal Timing
Applicable
Values
Reference
Item
Symbol
Pins
Test Condition
Min.
Typ.
Max.
Unit
System clock
fOSC
OSC1, OSC2
VCC = 2.7 to 3.6 V
2.0
—
10.0
MHz
Figure
oscillation frequency
On-chip oscillator
ROSC
VCC = 1.8 to 3.6 V
2.0
—
4.2
On-chip oscillator
1.0
—
10
0.5
—
4.2
100
—
*
4
is used
oscillation frequency
VCC = 2.7 to 3.6 V
On-chip oscillator
is used
VCC = 1.8 to 2.7 V
OSC clock (φOSC) cycle tOSC
OSC1, OSC2
VCC = 2.7 to 3.6 V
time
500
ns
Figure 25.2
*2
(1000)
VCC = 1.8 to 3.6 V
238
—
500
(1000)
On-chip oscillator
On-chip oscillator
tROSC
clock (φROSC) cycle time
100
—
1000
238
—
2000
*4
is used
VCC = 2.7 to 3.6 V
On-chip oscillator
is used
VCC = 1.8 to 2.7 V
Applicable
537
Item
Symbol
Oscillation stabilization trc
time
538
Values
Reference
Pins
Test Condition
Min.
Typ.
Max.
Unit
OSC1, OSC2
Other than above
—
—
50
ms
On-chip oscillator
is used
—
—
100
µs
Figure
*4
Note 4 amended
4. Characteristics vary due to variations in factors such as
temperature, power supply voltage, and production lot. When
designing the system, give due consideration to the actual usage
conditions. For actual data on this product, please contact a
Renesas representative.
Table 25.15 Serial
Interface Timing
2
Table 25.16 I C Bus
Interface Timing
539
Condition amended
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V,
VSS = AVSS = 0.0 V, unless otherwise specified.
540
Condition amended
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V,
VSS = 0.0 V, Ta = –20 to +75°C, unless otherwise specified.
Rev. 3.00 Aug 23, 2006 Page xlvi of lxxviii
Item
Page
Revision (See Manual for Details)
25.4.4 A/D
Converter
Characteristics
541
Condition amended
Table 25.17 A/D
Converter
Characteristics
542
25.4.5 ∆∑ A/D
Converter
Characteristics
543
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V,
VSS = 0.0 V, unless otherwise specified.
Note 4 amended
4. Conversion time = 31 µs
Condition added and table amended
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AV SS = 0.0 V, unless
otherwise specified.
Values
Applicable
Table 25.18 ∆∑ A/D
Converter
Characteristics
Item
Symbol
Pins
Analog power supply
DVcc
DVcc
Test Condition
Min.
Typ.
Max.
Unit
Notes
2.2/2.7

3.6
V
*1 * 8

3.0
—
LSB
*
—
-7.0
—
voltage
Integral lineality error
PGA bypass
7
(DVcc = 3.0 V,
Vref = 2.7 V,
conversion speed = 32
µs)*
544
6
Values
Applicable
Item
Symbol
Pins
Test Condition
Min.
Typ.
Max.
Unit
Notes
Differential lineality
PGA bypass
—
1.3
—
LSB
*
error
(DVcc = 3.0 V,
—
-0.8
—
—
10
—
mV
*7
—
28.0
—
mV
*7
—
6
—
mV
*
—
7
—
mV
—
-20
—
mV
—
-44
—
mV
REF
—
1.17
—
V
Vref
0.2 DVcc —
7
Vref = 2.7 V, conversion
speed = 32 µs)*6
PGA bypass
Offset error
(DVcc = 3.0 V,
Vref = 2.7 V, conversion
speed = 32 µs)*6
P GA bypass
Full scale error
(DVcc = 3.0 V,
Vref = 2.7 V, conversion
speed = 32 µs)*6
PGA gain error
Tad
PGA = 1/3,
7
DVcc = 3.0 V
PGA = 1,
DVcc = 3.0 V
PGA = 2,
DVcc = 3.0 V
PGA = 4,
DVcc = 3.0 V
Internal reference
4
5
* *
voltage
External reference
0.9 DVcc V
voltage
Rev. 3.00 Aug 23, 2006 Page xlvii of lxxviii
Item
Page
Revision (See Manual for Details)
25.4.5 ∆∑ A/D
Converter
Characteristics
545
Notes amended
Notes:
4. BGR stabilization time = 150 µs (Ta = 25°C, V = 3.0 V)
cc
Table 25.18 ∆∑ A/D
Converter
Characteristics
The BGR stabilization time is started after setting bit 7
(BTRSTPN) in BGR control register (BGRMR) to 1. The
stabilization time may vary due to factors such as the
capacitance connected to the REF pin, so careful evaluation is
necessary.
5. Before using the system, the internal reference value must be
tested because there is dispersion in sample data.
6. This is the value when the BGR is not used.
7. The error for each item varies depending on factors such as
temperature, voltage, conversion time, and sample variation. It is
therefore necessary to perform careful evaluation under actual
usage conditions.
25.4.6 LCD
Characteristics
546
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V,
VSS = AVSS = 0.0 V, unless otherwise specified.
Table 25.19 LCD
Characteristics
25.4.7 Power-On
Reset Circuit
Characteristics
Condition amended
547
Condition and table amended
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V,
Ta = −20 to +75˚C (regular specifications), Ta = −40 to +85˚C (wide-range specifications), unless
otherwise specified.
Table 25.20 PowerOn Reset Circuit
Characteristics
Values
Reference
Min.
Typ.
Max.
Unit
Figure
V_rst
0.7Vcc
0.8Vcc
0.9Vcc
V
Figure 25.1
Power supply rise time
t_vtr
The Vcc rise time should be shorter than half
Reset count time
t_out
0.8
Count start time
t_cr
Adjustable by the value of the external
On-chip pull-up resistance
Rp
Item
Symbol
Reset voltage
Test Condition
the RES rise time.
—
4.0
µs
capacitor of the RES pin.
25.4.8 Watchdog
Timer Characteristics
548
Vcc = 3.0 V
60
100
—
(Before) On-chip oscillator overflow time →
(After) WDT on-chip oscillator overflow time
Table 25.21
Watchdog Timer
Characteristics
Rev. 3.00 Aug 23, 2006 Page xlviii of lxxviii
kΩ
Figure 22.1
Item
Page
Revision (See Manual for Details)
25.7 Recommended
Resonators
552
Table amended
Table 25.22
Recommended Crystal
Resonators
B.1 I/O Port Block
Diagrams
590
Frequency (MHz)
Manufacturer
Product Type
4.194
Kyocera Kinseki Corporation
HC-491U-S
10
Kyocera Kinseki Corporation
HC-491U-S
Figure amended
SBY
Figure B.2 (g) Port 3
Block Diagram (P30)
VCC
VCC
P30
VSS
Figure B.3 (b) Port 4
Block Diagram (P41)
592
Figure amended
SBY
VCC
P41
VSS
Rev. 3.00 Aug 23, 2006 Page xlix of lxxviii
Rev. 3.00 Aug 23, 2006 Page l of lxxviii
Contents
Section 1 Overview .................................................................................................................. 1
1.1
1.2
1.3
1.4
Features.................................................................................................................................. 1
Internal Block Diagram.......................................................................................................... 3
Pin Assignment ...................................................................................................................... 4
Pin Functions ....................................................................................................................... 17
Section 2 CPU ......................................................................................................................... 25
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Address Space and Memory Map ........................................................................................ 26
Register Configuration......................................................................................................... 27
2.2.1 General Registers .................................................................................................... 28
2.2.2 Program Counter (PC) ............................................................................................ 29
2.2.3 Condition-Code Register (CCR) ............................................................................. 29
Data Formats........................................................................................................................ 31
2.3.1 General Register Data Formats ............................................................................... 31
2.3.2 Memory Data Formats ............................................................................................ 33
Instruction Set ...................................................................................................................... 34
2.4.1 Table of Instructions Classified by Function .......................................................... 34
2.4.2 Basic Instruction Formats ....................................................................................... 44
Addressing Modes and Effective Address Calculation ........................................................ 45
2.5.1 Addressing Modes .................................................................................................. 45
2.5.2 Effective Address Calculation ................................................................................ 49
Basic Bus Cycle ................................................................................................................... 51
2.6.1 Access to On-Chip Memory (RAM, ROM)............................................................ 51
2.6.2 On-Chip Peripheral Modules .................................................................................. 52
CPU States ........................................................................................................................... 53
Usage Notes ......................................................................................................................... 54
2.8.1 Notes on Data Access to Empty Areas ................................................................... 54
2.8.2 EEPMOV Instruction.............................................................................................. 54
2.8.3 Bit-Manipulation Instruction .................................................................................. 55
Section 3 Exception Handling ............................................................................................ 61
3.1
3.2
3.3
Exception Sources and Vector Address ............................................................................... 62
Reset..................................................................................................................................... 63
3.2.1 Reset Exception Handling....................................................................................... 63
3.2.2 Interrupt Immediately after Reset ........................................................................... 64
Interrupts.............................................................................................................................. 65
Rev. 3.00 Aug 23, 2006 Page li of lxxviii
3.4
3.5
Stack Status after Exception Handling................................................................................. 66
3.4.1 Interrupt Response Time......................................................................................... 67
Usage Notes ......................................................................................................................... 68
3.5.1 Notes on Stack Area Use ........................................................................................ 68
3.5.2 Notes on Rewriting Port Mode Registers ............................................................... 69
3.5.3 Method for Clearing Interrupt Request Flags ......................................................... 72
Section 4 Interrupt Controller ............................................................................................. 73
4.1
4.2
4.3
4.4
4.5
4.6
4.7
Features................................................................................................................................ 73
Input/Output Pins................................................................................................................. 74
Register Descriptions ........................................................................................................... 74
4.3.1 Interrupt Edge Select Register (IEGR) ................................................................... 75
4.3.2 Wakeup Edge Select Register (WEGR).................................................................. 76
4.3.3 Interrupt Enable Register 1 (IENR1) ...................................................................... 77
4.3.4 Interrupt Enable Register 2 (IENR2) ...................................................................... 78
4.3.5 Interrupt Request Register 1 (IRR1) ....................................................................... 79
4.3.6 Interrupt Request Register 2 (IRR2) ....................................................................... 80
4.3.7 Wakeup Interrupt Request Register (IWPR)........................................................... 82
4.3.8 Interrupt Priority Registers A to E (IPRA to IPRE)................................................ 84
4.3.9 Interrupt Mask Register (INTM) ............................................................................ 85
Interrupt Sources.................................................................................................................. 85
4.4.1 External Interrupts .................................................................................................. 85
4.4.2 Internal Interrupts ................................................................................................... 87
Interrupt Exception Handling Vector Table......................................................................... 87
Operation ............................................................................................................................. 90
4.6.1 Interrupt Exception Handling Sequence ................................................................. 92
4.6.2 Interrupt Response Times ....................................................................................... 94
Usage Notes ......................................................................................................................... 95
4.7.1 Contention between Interrupt Generation and Disabling........................................ 95
4.7.2 Instructions that Disable Interrupts......................................................................... 96
4.7.3 Interrupts during Execution of EEPMOV Instruction ............................................ 96
4.7.4 IENR Clearing ........................................................................................................ 96
Section 5 Clock Pulse Generators...................................................................................... 97
5.1
5.2
Register Description............................................................................................................. 99
5.1.1 SUB32k Control Register (SUB32CR)................................................................... 99
5.1.2 Oscillator Control Register (OSCCR)................................................................... 100
System Clock Generator .................................................................................................... 101
5.2.1 Connecting Crystal Resonator .............................................................................. 101
5.2.2 Connecting Ceramic Resonator ............................................................................ 102
Rev. 3.00 Aug 23, 2006 Page lii of lxxviii
5.2.3
5.2.4
5.3
5.4
5.5
External Clock Input Method................................................................................ 102
On-Chip Oscillator Selection Method
(Supported only by the Masked ROM Version) ................................................... 102
Subclock Generator............................................................................................................ 103
5.3.1 Connecting 32.768-kHz/38.4-kHz Crystal Resonator........................................... 103
5.3.2 Pin Connection when not Using Subclock............................................................ 104
5.3.3 External Clock Input Method................................................................................ 105
Prescalers ........................................................................................................................... 105
5.4.1 Prescaler S............................................................................................................. 105
Usage Notes ....................................................................................................................... 106
5.5.1 Note on Resonators............................................................................................... 106
5.5.2 Notes on Board Design ......................................................................................... 108
5.5.3 Definition of Oscillation Stabilization Wait Time ................................................ 108
5.5.4 Note on Subclock Stop State................................................................................. 110
5.5.5 Note on Using Resonator ...................................................................................... 110
5.5.6 Note on Using Power-On Reset Circuit ................................................................ 110
Section 6 Power-Down Modes ......................................................................................... 111
6.1
6.2
6.3
6.4
Register Descriptions ......................................................................................................... 112
6.1.1 System Control Register 1 (SYSCR1) .................................................................. 112
6.1.2 System Control Register 2 (SYSCR2) .................................................................. 114
6.1.3 Clock Halt Registers 1 and 2 (CKSTPR1 and CKSTPR2) ................................... 115
Mode Transitions and States of LSI................................................................................... 117
6.2.1 Sleep Mode ........................................................................................................... 123
6.2.2 Standby Mode ....................................................................................................... 123
6.2.3 Watch Mode.......................................................................................................... 124
6.2.4 Subsleep Mode...................................................................................................... 124
6.2.5 Subactive Mode .................................................................................................... 125
6.2.6 Active (Medium-Speed) Mode ............................................................................. 125
Direct Transition ................................................................................................................ 126
6.3.1 Direct Transition from Active (High-Speed) Mode to Active (Medium-Speed)
Mode ..................................................................................................................... 127
6.3.2 Direct Transition from Active (High-Speed) Mode to Subactive Mode............... 128
6.3.3 Direct Transition from Active (Medium-Speed) Mode to Active (High-Speed)
Mode ..................................................................................................................... 128
6.3.4 Direct Transition from Active (Medium-Speed) Mode to Subactive Mode ......... 129
6.3.5 Direct Transition from Subactive Mode to Active (High-Speed) Mode............... 129
6.3.6 Direct Transition from Subactive Mode to Active (Medium-Speed) Mode ......... 130
6.3.7 Notes on External Input Signal Changes before/after Direct Transition............... 130
Module Standby Function.................................................................................................. 131
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6.5
Usage Notes ....................................................................................................................... 131
6.5.1 Standby Mode Transition and Pin States .............................................................. 131
6.5.2 Notes on External Input Signal Changes before/after Standby Mode................... 132
Section 7 ROM ...................................................................................................................... 135
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
Block Configuration .......................................................................................................... 136
Register Descriptions ......................................................................................................... 138
7.2.1 Flash Memory Control Register 1 (FLMCR1) ..................................................... 138
7.2.2 Flash Memory Control Register 2 (FLMCR2) ..................................................... 139
7.2.3 Erase Block Register 1 (EBR1) ............................................................................ 140
7.2.4 Flash Memory Power Control Register (FLPWCR) ............................................. 141
7.2.5 Flash Memory Enable Register (FENR)............................................................... 141
On-Board Programming Modes......................................................................................... 142
7.3.1 Boot Mode ............................................................................................................ 143
7.3.2 Programming/Erasing in User Program Mode...................................................... 145
Flash Memory Programming/Erasing ................................................................................ 147
7.4.1 Program/Program-Verify ...................................................................................... 147
7.4.2 Erase/Erase-Verify................................................................................................ 150
7.4.3 Interrupt Handling when Programming/Erasing Flash Memory........................... 150
Program/Erase Protection .................................................................................................. 152
7.5.1 Hardware Protection ............................................................................................. 152
7.5.2 Software Protection .............................................................................................. 152
7.5.3 Error Protection .................................................................................................... 152
Programmer Mode ............................................................................................................. 153
Power-Down States for Flash Memory.............................................................................. 153
Notes on Setting Module Standby Mode ........................................................................... 154
Section 8 RAM ...................................................................................................................... 157
Section 9 I/O Ports ............................................................................................................... 159
9.1
9.2
Port 1.................................................................................................................................. 159
9.1.1 Port Data Register 1 (PDR1)................................................................................. 160
9.1.2 Port Control Register 1 (PCR1) ............................................................................ 160
9.1.3 Port Pull-Up Control Register 1 (PUCR1)............................................................ 161
9.1.4 Port Mode Register 1 (PMR1) .............................................................................. 161
9.1.5 Pin Functions ........................................................................................................ 162
9.1.6 Input Pull-Up MOS............................................................................................... 167
Port 3.................................................................................................................................. 168
9.2.1 Port Data Register 3 (PDR3)................................................................................. 168
9.2.2 Port Control Register 3 (PCR3) ............................................................................ 169
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9.2.3 Port Pull-Up Control Register 3 (PUCR3)............................................................ 169
9.2.4 Port Mode Register 3 (PMR3) .............................................................................. 170
9.2.5 Pin Functions ........................................................................................................ 170
9.2.6 Input Pull-Up MOS............................................................................................... 172
9.3 Port 4.................................................................................................................................. 173
9.3.1 Port Data Register 4 (PDR4)................................................................................. 173
9.3.2 Port Control Register 4 (PCR4) ............................................................................ 174
9.3.3 Port Mode Register 4 (PMR4) .............................................................................. 175
9.3.4 Pin Functions ........................................................................................................ 176
9.4 Port 5.................................................................................................................................. 177
9.4.1 Port Data Register 5 (PDR5)................................................................................. 178
9.4.2 Port Control Register 5 (PCR5) ............................................................................ 178
9.4.3 Port Pull-Up Control Register 5 (PUCR5)............................................................ 179
9.4.4 Port Mode Register 5 (PMR5) .............................................................................. 179
9.4.5 Pin Functions ........................................................................................................ 180
9.4.6 Input Pull-Up MOS............................................................................................... 181
9.5 Port 6.................................................................................................................................. 181
9.5.1 Port Data Register 6 (PDR6)................................................................................. 182
9.5.2 Port Control Register 6 (PCR6) ............................................................................ 182
9.5.3 Port Pull-Up Control Register 6 (PUCR6)............................................................ 183
9.5.4 Pin Functions ........................................................................................................ 183
9.5.5 Input Pull-Up MOS............................................................................................... 184
9.6 Port 7.................................................................................................................................. 185
9.6.1 Port Data Register 7 (PDR7)................................................................................. 185
9.6.2 Port Control Register 7 (PCR7) ............................................................................ 186
9.6.3 Pin Functions ........................................................................................................ 186
9.7 Port 8.................................................................................................................................. 187
9.7.1 Port Data Register 8 (PDR8)................................................................................. 188
9.7.2 Port Control Register 8 (PCR8) ............................................................................ 188
9.7.3 Pin Functions ........................................................................................................ 189
9.8 Port 9.................................................................................................................................. 190
9.8.1 Port Data Register 9 (PDR9)................................................................................. 190
9.8.2 Port Control Register 9 (PCR9) ............................................................................ 191
9.8.3 Port Mode Register 9 (PMR9) .............................................................................. 191
9.8.4 Pin Functions ........................................................................................................ 192
9.9 Port A................................................................................................................................. 193
9.9.1 Port Data Register A (PDRA)............................................................................... 193
9.9.2 Port Control Register A (PCRA) .......................................................................... 194
9.9.3 Pin Functions ........................................................................................................ 194
9.10 Port B ................................................................................................................................. 196
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9.10.1 Port Data Register B (PDRB) ............................................................................... 196
9.10.2 Port Mode Register B (PMRB)............................................................................. 197
9.10.3 Pin Functions ........................................................................................................ 198
9.11 Input/Output Data Inversion .............................................................................................. 200
9.11.1 Serial Port Control Register (SPCR)..................................................................... 200
9.12 Usage Notes ....................................................................................................................... 202
9.12.1 How to Handle Unused Pin .................................................................................. 202
Section 10 Realtime Clock (RTC) ................................................................................... 203
10.1 Features.............................................................................................................................. 203
10.2 Input/Output Pin ................................................................................................................ 204
10.3 Register Descriptions ......................................................................................................... 204
10.3.1 Second Data Register/Free Running Counter Data Register (RSECDR) ............. 205
10.3.2 Minute Data Register (RMINDR)......................................................................... 205
10.3.3 Hour Data Register (RHRDR) .............................................................................. 206
10.3.4 Day-of-Week Data Register (RWKDR) ............................................................... 207
10.3.5 RTC Control Register 1 (RTCCR1) ..................................................................... 208
10.3.6 RTC Control Register 2 (RTCCR2) ..................................................................... 209
10.3.7 Clock Source Select Register (RTCCSR) ............................................................. 210
10.3.8 RTC Interrupt Flag Register (RTCFLG) .............................................................. 211
10.4 Operation ........................................................................................................................... 212
10.4.1 Initial Settings of Registers after Power-On ......................................................... 212
10.4.2 Initial Setting Procedure ....................................................................................... 212
10.4.3 Data Reading Procedure ....................................................................................... 213
10.5 Interrupt Sources................................................................................................................ 214
10.6 Usage Note......................................................................................................................... 215
10.6.1 Note on Clock Count ............................................................................................ 215
10.6.2 Notes on Using Interrupts ..................................................................................... 215
Section 11 Timer F ............................................................................................................... 217
11.1 Features.............................................................................................................................. 217
11.2 Input/Output Pins............................................................................................................... 218
11.3 Register Descriptions ......................................................................................................... 219
11.3.1 Timer Counters FH and FL (TCFH, TCFL) ......................................................... 219
11.3.2 Output Compare Registers FH and FL (OCRFH, OCRFL).................................. 220
11.3.3 Timer Control Register F (TCR)........................................................................... 221
11.3.4 Timer Control/Status Register F (TCSRF) ........................................................... 222
11.4 Operation ........................................................................................................................... 224
11.4.1 Timer F Operation ................................................................................................ 224
11.4.2 TCF Increment Timing ......................................................................................... 225
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11.4.3 TMOFH/TMOFL Output Timing ......................................................................... 226
11.4.4 TCF Clear Timing................................................................................................. 226
11.4.5 Timer Overflow Flag (OVF) Set Timing .............................................................. 226
11.4.6 Compare Match Flag Set Timing.......................................................................... 227
11.5 Timer F Operating States ................................................................................................... 227
11.6 Usage Notes ....................................................................................................................... 228
11.6.1 16-Bit Timer Mode ............................................................................................... 228
11.6.2 8-Bit Timer Mode ................................................................................................. 228
11.6.3 Flag Clearing......................................................................................................... 229
11.6.4 Timer Counter (TCF) Read/Write......................................................................... 231
Section 12 16-Bit Timer Pulse Unit (TPU) ................................................................... 233
12.1 Features.............................................................................................................................. 233
12.2 Input/Output Pins ............................................................................................................... 235
12.3 Register Descriptions ......................................................................................................... 236
12.3.1 Timer Control Register (TCR).............................................................................. 237
12.3.2 Timer Mode Register (TMDR) ............................................................................. 239
12.3.3 Timer I/O Control Register (TIOR) ...................................................................... 240
12.3.4 Timer Interrupt Enable Register (TIER) ............................................................... 245
12.3.5 Timer Status Register (TSR)................................................................................. 246
12.3.6 Timer Counter (TCNT)......................................................................................... 247
12.3.7 Timer General Register (TGR) ............................................................................. 247
12.3.8 Timer Start Register (TSTR)................................................................................. 248
12.3.9 Timer Synchro Register (TSYR) .......................................................................... 249
12.4 Interface to CPU ................................................................................................................ 250
12.4.1 16-Bit Registers .................................................................................................... 250
12.4.2 8-Bit Registers ...................................................................................................... 250
12.5 Operation ........................................................................................................................... 252
12.5.1 Basic Functions..................................................................................................... 252
12.5.2 Synchronous Operation......................................................................................... 257
12.5.3 Operation with Cascaded Connection................................................................... 259
12.5.4 PWM Modes ......................................................................................................... 261
12.6 Interrupt Sources................................................................................................................ 266
12.7 Operation Timing............................................................................................................... 267
12.7.1 Input/Output Timing ............................................................................................. 267
12.7.2 Interrupt Signal Timing ........................................................................................ 270
12.8 Usage Notes ....................................................................................................................... 272
12.8.1 Module Standby Function Setting......................................................................... 272
12.8.2 Input Clock Restrictions ....................................................................................... 272
12.8.3 Caution on Period Setting ..................................................................................... 273
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12.8.4 Contention between TCNT Write and Clear Operation ....................................... 273
12.8.5 Contention between TCNT Write and Increment Operation ................................ 274
12.8.6 Contention between TGR Write and Compare Match .......................................... 275
12.8.7 Contention between TGR Read and Input Capture............................................... 276
12.8.8 Contention between TGR Write and Input Capture.............................................. 277
12.8.9 Contention between Overflow and Counter Clearing........................................... 278
12.8.10 Contention between TCNT Write and Overflow .................................................. 279
12.811 Multiplexing of I/O Pins ....................................................................................... 279
12.8.12 Interrupts when Module Standby Function is Used.............................................. 279
Section 13 Asynchronous Event Counter (AEC) ........................................................ 281
13.1 Features.............................................................................................................................. 281
13.2 Input/Output Pins............................................................................................................... 282
13.3 Register Descriptions ......................................................................................................... 283
13.3.1 Event Counter PWM Compare Register (ECPWCR) ........................................... 283
13.3.2 Event Counter PWM Data Register (ECPWDR).................................................. 284
13.3.3 Input Pin Edge Select Register (AEGSR)............................................................. 285
13.3.4 Event Counter Control Register (ECCR).............................................................. 286
13.3.5 Event Counter Control/Status Register (ECCSR)................................................. 287
13.3.6 Event Counter H (ECH)........................................................................................ 289
13.3.7 Event Counter L (ECL)......................................................................................... 289
13.4 Operation ........................................................................................................................... 290
13.4.1 16-Bit Counter Operation ..................................................................................... 290
13.4.2 8-Bit Counter Operation ....................................................................................... 291
13.4.3 IRQAEC Operation............................................................................................... 292
13.4.4 Event Counter PWM Operation............................................................................ 292
13.4.5 Operation of Clock Input Enable/Disable Function.............................................. 293
13.5 Operating States of Asynchronous Event Counter............................................................. 294
13.6 Usage Notes ....................................................................................................................... 295
Section 14 Watchdog Timer .............................................................................................. 297
14.1 Features.............................................................................................................................. 297
14.2 Register Descriptions ......................................................................................................... 298
14.2.1 Timer Control/Status Register WD1 (TCSRWD1)............................................... 299
14.2.2 Timer Control/Status Register WD2 (TCSRWD2)............................................... 301
14.2.3 Timer Counter WD (TCWD)................................................................................ 303
14.2.4 Timer Mode Register WD (TMWD) .................................................................... 303
14.3 Operation ........................................................................................................................... 304
14.3.1 Watchdog Timer Mode......................................................................................... 304
14.3.2 Interval Timer Mode............................................................................................. 305
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14.3.3 Timing of Overflow Flag (OVF) Setting .............................................................. 305
14.4 Interrupt ............................................................................................................................. 306
14.5 Usage Notes ....................................................................................................................... 306
14.5.1 Switching between Watchdog Timer Mode and Interval Timer Mode................. 306
14.5.2 Module Standby Mode Control ............................................................................ 306
Section 15 Serial Communication Interface 3 (SCI3, IrDA) ................................... 307
15.1 Features.............................................................................................................................. 307
15.2 Input/Output Pins ............................................................................................................... 311
15.3 Register Descriptions ......................................................................................................... 311
15.3.1 Receive Shift Register (RSR) ............................................................................... 312
15.3.2 Receive Data Register (RDR) ............................................................................... 312
15.3.3 Transmit Shift Register (TSR) .............................................................................. 312
15.3.4 Transmit Data Register (TDR).............................................................................. 312
15.3.5 Serial Mode Register (SMR)................................................................................. 313
15.3.6 Serial Control Register (SCR)............................................................................... 316
15.3.7 Serial Status Register (SSR) ................................................................................. 318
15.3.8 Bit Rate Register (BRR) ....................................................................................... 321
15.3.9 Serial Port Control Register (SPCR)..................................................................... 329
15.3.10 IrDA Control Register (IrCR) ............................................................................... 331
15.4 Operation in Asynchronous Mode ..................................................................................... 332
15.4.1 Clock..................................................................................................................... 333
15.4.2 SCI3 Initialization................................................................................................. 337
15.4.3 Data Transmission ................................................................................................ 338
15.4.4 Serial Data Reception ........................................................................................... 340
15.5 Operation in Clocked Synchronous Mode ......................................................................... 344
15.5.1 Clock..................................................................................................................... 344
15.5.2 SCI3 Initialization................................................................................................. 344
15.5.3 Serial Data Transmission ...................................................................................... 345
15.5.4 Serial Data Reception (Clocked Synchronous Mode)........................................... 347
15.5.5 Simultaneous Serial Data Transmission and Reception........................................ 349
15.6 IrDA Operation .................................................................................................................. 350
15.6.1 Transmission......................................................................................................... 350
15.6.2 Reception .............................................................................................................. 351
15.6.3 High-Level Pulse Width Selection........................................................................ 352
15.7 Interrupt Requests .............................................................................................................. 353
15.8 Usage Notes ....................................................................................................................... 356
15.8.1 Break Detection and Processing ........................................................................... 356
15.8.2 Mark State and Break Sending ............................................................................. 356
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15.8.3 Receive Error Flags and Transmit Operations
(Clocked Synchronous Mode Only) ..................................................................... 356
15.8.4 Receive Data Sampling Timing and Reception Margin in Asynchronous
Mode..................................................................................................................... 357
15.8.5 Note on Switching SCK31 (SCK32) Pin Function ............................................... 358
15.8.6 Relation between Writing to TDR and Bit TDRE ................................................ 358
15.8.7 Relation between RDR Reading and bit RDRF.................................................... 359
15.8.8 Transmit and Receive Operations when Making State Transition........................ 359
15.8.9 Setting in Subactive or Subsleep Mode ................................................................ 360
15.8.10 Oscillator when Serial Communication Interface 3 is Used
(Supported only by the Masked ROM Version) ................................................... 360
Section 16 Serial Communication Interface 4 (SCI4) ............................................... 361
16.1 Features.............................................................................................................................. 361
16.2 Input/Output Pins............................................................................................................... 362
16.3 Register Descriptions ......................................................................................................... 363
16.3.1 Serial Control Register 4 (SCR4) ......................................................................... 363
16.3.2 Serial Control/Status Register 4 (SCSR4) ............................................................ 366
16.3.3 Transmit Data Register 4 (TDR4)......................................................................... 369
16.3.4 Receive Data Register 4 (RDR4) .......................................................................... 369
16.3.5 Shift Register 4 (SR4)........................................................................................... 369
16.4 Operation ........................................................................................................................... 370
16.4.1 Clock..................................................................................................................... 370
16.4.2 Data Transfer Format............................................................................................ 370
16.4.3 Data Transmission/Reception ............................................................................... 371
16.4.4 Data Transmission ................................................................................................ 372
16.4.5 Data Reception...................................................................................................... 374
16.4.6 Simultaneous Data Transmission and Reception.................................................. 376
16.5 Interrupt Sources................................................................................................................ 377
16.6 Usage Notes ....................................................................................................................... 378
16.6.1 Relationship between Writing to TDR4 and TDRE ............................................. 378
16.6.2 Receive Error Flag and Transmission................................................................... 378
16.6.3 Relationship between Reading RDR4 and RDRF ................................................ 378
16.6.4 SCK4 Output Waveform when Internal Clock of φ/2 is Selected......................... 379
Section 17 14-Bit PWM ..................................................................................................... 381
17.1 Features.............................................................................................................................. 381
17.2 Input/Output Pins............................................................................................................... 382
17.3 Register Descriptions ......................................................................................................... 382
17.3.1 PWM Control Register (PWCR) .......................................................................... 382
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17.3.2 PWM Data Register (PWDR) ............................................................................... 383
17.4 Operation ........................................................................................................................... 384
17.4.1 Pulse-Division Type PWM Operating Principle................................................... 384
17.4.2 Pulse-Division Type PWM Setting Method ......................................................... 384
17.4.3 Pulse-Div ision Type PWM Operating ................................................................. 384
17.4.4 Setting for Standard PWM Operation ................................................................... 385
17.5 PWM Operating States....................................................................................................... 386
17.6 Usage Notes ....................................................................................................................... 386
17.6.1 Timing of Effect on PWM Waveform After Writing to PWDR ........................... 386
Section 18 A/D Converter .................................................................................................. 387
18.1 Features.............................................................................................................................. 387
18.2 Input/Output Pins ............................................................................................................... 389
18.3 Register Descriptions ......................................................................................................... 389
18.3.1 A/D Result Register (ADRR) ............................................................................... 389
18.3.2 A/D Mode Register (AMR) .................................................................................. 390
18.3.3 A/D Start Register (ADSR)................................................................................... 391
18.4 Operation ........................................................................................................................... 391
18.4.1 A/D Conversion .................................................................................................... 391
18.4.2 External Trigger Input Timing.............................................................................. 392
18.4.3 Operating States of A/D Converter....................................................................... 392
18.5 Example of Use.................................................................................................................. 393
18.6 A/D Conversion Accuracy Definitions .............................................................................. 396
18.7 Usage Notes ....................................................................................................................... 398
18.7.1 Permissible Signal Source Impedance .................................................................. 398
18.7.2 Influences on Absolute Accuracy ......................................................................... 398
18.7.3 Usage Notes .......................................................................................................... 399
Section 19 ∆Σ A/D Converter ........................................................................................... 401
19.1 Features.............................................................................................................................. 401
19.2 Input/Output Pins ............................................................................................................... 403
19.3 Register Descriptions ......................................................................................................... 403
19.3.1 A/D Data Register (ADDR).................................................................................. 403
19.3.2 BGR Control Register (BGRMR)......................................................................... 404
19.3.3 A/D Control Register (ADCR) ............................................................................. 405
19.3.4 A/D Start/Status Register (ADSSR)...................................................................... 407
19.4 Operation ........................................................................................................................... 408
19.4.1 Wait Mode ............................................................................................................ 408
19.4.2 Continuous Mode.................................................................................................. 408
19.4.3 Operating States of ∆Σ A/D Converter ................................................................. 409
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19.5 Example of Use.................................................................................................................. 409
19.5.1 Wait Mode ............................................................................................................ 409
19.5.2 Continuous Mode.................................................................................................. 410
19.6 Usage Notes ....................................................................................................................... 414
19.6.1 Reference Voltage ................................................................................................ 414
19.6.2 Analog Voltage Stabilization Pin (ACOM Pin).................................................... 414
19.6.3 Module Standby Mode ......................................................................................... 414
19.6.4 Influences on Accuracy ........................................................................................ 414
19.6.5 PB5/Vref/REF Pin ................................................................................................ 414
Section 20 LCD Controller/Driver .................................................................................. 415
20.1 Features.............................................................................................................................. 415
20.2 Input/Output Pins............................................................................................................... 417
20.3 Register Descriptions ......................................................................................................... 417
20.3.1 LCD Port Control Register (LPCR)...................................................................... 418
20.3.2 LCD Control Register (LCR)................................................................................ 419
20.3.3 LCD Control Register 2 (LCR2)........................................................................... 421
20.3.4 LCD Trimming Register (LTRMR)...................................................................... 423
20.3.5 BGR Control Register (BGRMR)......................................................................... 425
20.4 Operation ........................................................................................................................... 426
20.4.1 Settings up to LCD Display .................................................................................. 426
20.4.2 Relationship between LCD RAM and Display..................................................... 428
20.4.3 3-V Constant-Voltage Power Supply Circuit........................................................ 433
20.4.4 Operation in Power-Down Modes ........................................................................ 434
20.4.5 Boosting LCD Drive Power Supply and Fine Adjustment ................................... 435
20.5 Usage Notes ....................................................................................................................... 436
20.5.1 Pin Processing when No LCD Controller/Driver Is Used..................................... 436
20.5.2 20.5.2 Pin Processing when No 3 V Constant Voltage Circuit Is Used................ 436
Section 21 I2C Bus Interface 2 (IIC2) ............................................................................. 437
21.1 Features.............................................................................................................................. 437
21.2 Input/Output Pins............................................................................................................... 439
21.3 Register Descriptions ......................................................................................................... 440
2
21.3.1 I C Bus Control Register 1 (ICCR1)..................................................................... 440
2
21.3.2 I C Bus Control Register 2 (ICCR2)..................................................................... 443
2
21.3.3 I C Bus Mode Register (ICMR)............................................................................ 445
2
21.3.4 I C Bus Interrupt Enable Register (ICIER) ........................................................... 447
2
21.3.5 I C Bus Status Register (ICSR)............................................................................. 449
21.3.6 Slave Address Register (SAR).............................................................................. 451
2
21.3.7 I C Bus Transmit Data Register (ICDRT) ............................................................ 452
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2
21.4
21.5
21.6
21.7
21.3.8 I C Bus Receive Data Register (ICDRR) .............................................................. 452
2
21.3.9 I C Bus Shift Register (ICDRS) ............................................................................ 452
Operation ........................................................................................................................... 453
2
21.4.1 I C Bus Format...................................................................................................... 453
21.4.2 Master Transmit Operation ................................................................................... 454
21.4.3 Master Receive Operation..................................................................................... 456
21.4.4 Slave Transmit Operation ..................................................................................... 459
21.4.5 Slave Receive Operation....................................................................................... 461
21.4.6 Clocked Synchronous Serial Format..................................................................... 463
21.4.7 Noise Canceler ...................................................................................................... 466
21.4.8 Example of Use..................................................................................................... 466
Interrupt Request................................................................................................................ 471
Bit Synchronous Circuit..................................................................................................... 472
Usage Notes ....................................................................................................................... 473
Section 22 Power-On Reset Circuit................................................................................. 475
22.1 Feature ............................................................................................................................... 475
22.2 Operation ........................................................................................................................... 476
22.2.1 Power-On Reset Circuit ........................................................................................ 476
Section 23 Address Break .................................................................................................. 479
23.1 Register Descriptions ......................................................................................................... 480
23.1.1 Address Break Control Register 2 (ABRKCR2)................................................... 480
23.1.2 Address Break Status Register 2 (ABRKSR2) ..................................................... 482
23.1.3 Break Address Registers 2 (BAR2H, BAR2L)..................................................... 482
23.1.4 Break Data Registers 2 (BDR2H, BDR2L) .......................................................... 482
23.2 Operation ........................................................................................................................... 483
23.3 Operating States of Address Break .................................................................................... 484
Section 24 List of Registers ............................................................................................... 485
24.1 Register Addresses (Address Order) .................................................................................. 486
24.2 Register Bits....................................................................................................................... 492
24.3 Register States in Each Operating Mode ........................................................................... 498
Section 25 Electrical Characteristics............................................................................... 503
25.1 Absolute Maximum Ratings for F-ZTAT Version ............................................................ 503
25.2 Electrical Characteristics for F-ZTAT Version.................................................................. 504
25.2.1 Power Supply Voltage and Operating Range........................................................ 504
25.2.2 DC Characteristics ................................................................................................ 507
25.2.3 AC Characteristics ................................................................................................ 513
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25.3
25.4
25.5
25.6
25.7
25.8
25.2.4 A/D Converter Characteristics.............................................................................. 517
25.2.5 ∆Σ A/D Converter Characteristics ........................................................................ 519
25.2.6 LCD Characteristics.............................................................................................. 522
25.2.7 Power-On Reset Circuit Characteristics ............................................................... 523
25.2.8 Watchdog Timer Characteristics........................................................................... 523
25.2.9 Flash Memory Characteristics Preliminary................................................... 524
Absolute Maximum Ratings for Masked ROM Version ................................................... 526
Electrical Characteristics for Masked ROM Version......................................................... 527
25.4.1 Power Supply Voltage and Operating Range ....................................................... 527
25.4.2 DC Characteristics ................................................................................................ 530
25.4.3 AC Characteristics ................................................................................................ 536
25.4.4 A/D Converter Characteristics.............................................................................. 541
25.4.5 ∆Σ A/D Converter Characteristics ........................................................................ 543
25.4.6 LCD Characteristics.............................................................................................. 546
25.4.7 Power-On Reset Circuit Characteristics ............................................................... 547
25.4.8 Watchdog Timer Characteristics........................................................................... 548
Operation Timing............................................................................................................... 548
Output Load Circuit ........................................................................................................... 551
Recommended Resonator .................................................................................................. 552
Usage Note......................................................................................................................... 552
Appendix ................................................................................................................................... 553
A.
B.
C.
D.
E.
F.
G.
Instruction Set .................................................................................................................... 553
A.1 Instruction List.......................................................................................................... 553
A.2 Operation Code Map................................................................................................. 568
A.3 Number of Execution States ..................................................................................... 571
A.4 Combinations of Instructions and Addressing Modes .............................................. 582
I/O Ports............................................................................................................................. 583
B.1 I/O Port Block Diagrams .......................................................................................... 583
B.2 Port States in Each Operating State .......................................................................... 601
Product Code Lineup ......................................................................................................... 602
Package Dimensions .......................................................................................................... 604
Chip Form Specifications .................................................................................................. 608
Bonding Pad Form ............................................................................................................. 609
Chip Tray Specifications.................................................................................................... 610
Index ........................................................................................................................................... 613
Rev. 3.00 Aug 23, 2006 Page lxiv of lxxviii
Figures
Section 1 Overview
Figure 1.1 Internal Block Diagram of H8/38086R Group ........................................................... 3
Figure 1.2 Pin Assignment of H8/38086R Group (FP-80A, TFP-80C)....................................... 4
Figure 1.3 Pin Assignment of H8/38086R Group (TLP-85V)..................................................... 5
Figure 1.4 Pad Assignment of HCD64F38086R (Top View)...................................................... 9
Figure 1.5 Pad Assignment of HCD64338086R (Top View) .................................................... 13
Section 2 CPU
Figure 2.1 Memory Map............................................................................................................ 26
Figure 2.2 CPU Registers .......................................................................................................... 27
Figure 2.3 Usage of General Registers ...................................................................................... 28
Figure 2.4 Relationship between Stack Pointer and Stack Area ................................................ 29
Figure 2.5 General Register Data Formats (1) ........................................................................... 31
Figure 2.5 General Register Data Formats (2) ........................................................................... 32
Figure 2.6 Memory Data Formats.............................................................................................. 33
Figure 2.7 Instruction Formats................................................................................................... 44
Figure 2.8 Branch Address Specification in Memory Indirect Mode ........................................ 48
Figure 2.9 On-Chip Memory Access Cycle............................................................................... 51
Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access).................................... 52
Figure 2.11 CPU Operating States............................................................................................... 53
Figure 2.12 State Transitions ....................................................................................................... 54
Figure 2.13 Example of Timer Configuration with Two Registers Allocated
to Same Address....................................................................................................... 55
Section 3 Exception Handling
Figure 3.1 Reset Exception Handling Sequence........................................................................ 64
Figure 3.2 Interrupt Sources and their Numbers........................................................................ 65
Figure 3.3 Stack Status after Exception Handling ..................................................................... 66
Figure 3.4 Operation when Odd Address is Set in SP ............................................................... 68
Figure 3.5 Port Mode Register (or AEGSR) Setting and Interrupt Request Flag Clearing
Procedure.................................................................................................................. 71
Section 4 Interrupt Controller
Figure 4.1 Block Diagram of Interrupt Controller ..................................................................... 73
Figure 4.2 Flowchart of Procedure Up to Interrupt Acceptance ................................................ 92
Figure 4.3 Interrupt Exception Handling Sequence................................................................... 93
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Figure 4.4
Contention between Interrupt Generation and Disabling ......................................... 95
Section 5 Clock Pulse Generators
Figure 5.1 Block Diagram of Clock Pulse Generators (Flash Memory Version) (1) ................ 97
Figure 5.1 Block Diagram of Clock Pulse Generators (Masked ROM Version) (2) ................. 98
Figure 5.2 Typical Connection to Crystal Resonator............................................................... 101
Figure 5.3 Typical Connection to Ceramic Resonator............................................................. 102
Figure 5.4 Example of External Clock Input ........................................................................... 102
Figure 5.5 Typical Connection to 32.768-kHz/38.4-kHz Crystal Resonator........................... 103
Figure 5.6 Equivalent Circuit of 32.768-kHz/38.4-kHz Crystal Resonator............................. 104
Figure 5.7 Pin Connection when not Using Subclock ............................................................. 104
Figure 5.8 Pin Connection when Inputting External Clock ..................................................... 105
Figure 5.9 Example of Crystal and Ceramic Resonator Arrangement..................................... 106
Figure 5.10 Negative Resistance Measurement and Circuit Modification Suggestions ............ 107
Figure 5.11 Example of Incorrect Board Design ....................................................................... 108
Figure 5.12 Oscillation Stabilization Wait Time ....................................................................... 109
Section 6 Power-Down Modes
Figure 6.1 Mode Transition Diagram ...................................................................................... 118
Figure 6.2 Standby Mode Transition and Pin States................................................................ 131
Figure 6.3 External Input Signal Capture when Signal Changes before/after Standby Mode
or Watch Mode....................................................................................................... 132
Section 7 ROM
Figure 7.1 Flash Memory Block Configuration....................................................................... 137
Figure 7.2 Programming/Erasing Flowchart Example in User Program Mode ....................... 146
Figure 7.3 Program/Program-Verify Flowchart ...................................................................... 148
Figure 7.4 Erase/Erase-Verify Flowchart ................................................................................ 151
Figure 7.5 Module Standby Mode Setting............................................................................... 155
Section 9 I/O Ports
Figure 9.1 Port 1 Pin Configuration......................................................................................... 159
Figure 9.2 Port 3 Pin Configuration......................................................................................... 168
Figure 9.3 Port 4 Pin Configuration......................................................................................... 173
Figure 9.4 Port 5 Pin Configuration......................................................................................... 177
Figure 9.5 Port 6 Pin Configuration......................................................................................... 181
Figure 9.6 Port 7 Pin Configuration......................................................................................... 185
Figure 9.7 Port 8 Pin Configuration......................................................................................... 187
Figure 9.8 Port 9 Pin Configuration......................................................................................... 190
Figure 9.9 Port A Pin Configuration........................................................................................ 193
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Figure 9.10 Port B Pin Configuration ........................................................................................ 196
Figure 9.11 Input/Output Data Inversion Function.................................................................... 200
Section 10
Figure 10.1
Figure 10.2
Figure 10.3
Figure 10.4
Realtime Clock (RTC)
Block Diagram of RTC .......................................................................................... 203
Definition of Time Expression ............................................................................... 208
Initial Setting Procedure ......................................................................................... 212
Example: Reading of Inaccurate Time Data........................................................... 213
Section 11
Figure 11.1
Figure 11.2
Figure 11.3
Timer F
Block Diagram of Timer F ..................................................................................... 218
TMOFH/TMOFL Output Timing........................................................................... 226
Clear Interrupt Request Flag when Interrupt Source Generation Signal
is Valid ................................................................................................................... 231
Section 12 16-Bit Timer Pulse Unit (TPU)
Figure 12.1 Block Diagram of TPU........................................................................................... 235
Figure 12.2 16-Bit Register Access Operation [CPU ↔ TCNT (16 Bits)]................................ 250
Figure 12.3 8-Bit Register Access Operation [CPU ↔ TCR (Upper 8 Bits)] ........................... 250
Figure 12.4 8-Bit Register Access Operation [CPU ↔ TMDR (Lower 8 Bits)] ....................... 251
Figure 12.5 Example of Counter Operation Setting Procedure ................................................. 252
Figure 12.6 Free-Running Counter Operation ........................................................................... 253
Figure 12.7 Periodic Counter Operation .................................................................................... 254
Figure 12.8 Example of Setting Procedure for Waveform Output by Compare Match............. 254
Figure 12.9 Example of 0 Output/1 Output Operation .............................................................. 255
Figure 12.10 Example of Toggle Output Operation .................................................................... 255
Figure 12.11 Example of Setting Procedure for Input Capture Operation................................... 256
Figure 12.12 Example of Input Capture Operation...................................................................... 256
Figure 12.13 Example of Synchronous Operation Setting Procedure ......................................... 257
Figure 12.14 Example of Synchronous Operation....................................................................... 258
Figure 12.15 Setting Procedure for Operation with Cascaded Operation.................................... 259
Figure 12.16 Example of Operation with Cascaded Connection ................................................. 260
Figure 12.17 Example of PWM Mode Setting Procedure ........................................................... 262
Figure 12.18 Example of PWM Mode Operation (1) .................................................................. 263
Figure 12.19 Example of PWM Mode Operation (2) .................................................................. 264
Figure 12.20 Example of PWM Mode Operation (3) .................................................................. 265
Figure 12.21 Count Timing in Internal Clock Operation............................................................. 267
Figure 12.22 Count Timing in External Clock Operation............................................................ 267
Figure 12.23 Output Compare Output Timing............................................................................. 268
Figure 12.24 Input Capture Input Signal Timing......................................................................... 269
Rev. 3.00 Aug 23, 2006 Page lxvii of lxxviii
Figure 12.25
Figure 12.26
Figure 12.27
Figure 12.28
Figure 12.29
Figure 12.30
Figure 12.31
Figure 12.32
Figure 12.33
Figure 12.34
Figure 12.35
Figure 12.36
Figure 12.37
Counter Clear Timing (Compare Match) ............................................................... 269
Counter Clear Timing (Input Capture) ................................................................... 270
TGI Interrupt Timing (Compare Match) ................................................................ 270
TGI Interrupt Timing (Input Capture) .................................................................... 271
TCIV Interrupt Setting Timing............................................................................... 271
Timing for Status Flag Clearing by CPU ............................................................... 272
Contention between TCNT Write and Clear Operation ......................................... 273
Contention between TCNT Write and Increment Operation.................................. 274
Contention between TGR Write and Compare Match ........................................... 275
Contention between TGR Read and Input Capture ................................................ 276
Contention between TGR Write and Input Capture ............................................... 277
Contention between Overflow and Counter Clearing ............................................ 278
Contention between TCNT Write and Overflow.................................................... 279
Section 13
Figure 13.1
Figure 13.2
Figure 13.3
Figure 13.4
Figure 13.5
Asynchronous Event Counter (AEC)
Block Diagram of Asynchronous Event Counter ................................................... 282
Software Procedure when Using ECH and ECL as 16-Bit Event Counter............. 290
Software Procedure when Using ECH and ECL as 8-Bit Event Counters ............. 291
Event Counter Operation Waveform...................................................................... 292
Example of Clock Control Operation..................................................................... 293
Section 14
Figure 14.1
Figure 14.2
Figure 14.3
Figure 14.4
Watchdog Timer
Block Diagram of Watchdog Timer ....................................................................... 298
Example of Watchdog Timer Operation ................................................................ 304
Interval Timer Mode Operation.............................................................................. 305
Timing of OVF Flag Setting .................................................................................. 305
Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Figure 15.1 (1) Block Diagram of SCI3_1 .................................................................................. 309
Figure 15.1 (2) Block Diagram of SCI3_2 .................................................................................. 310
Figure 15.2 Data Format in Asynchronous Communication ..................................................... 332
Figure 15.3 Relationship between Output Clock and Transfer Data Phase
(Asynchronous Mode) (Example with 8-Bit Data, Parity, Two Stop Bits) ............ 333
Figure 15.4 Sample SCI3 Initialization Flowchart .................................................................... 337
Figure 15.5 Example SCI3 Operation in Transmission in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit) .......................................................................... 338
Figure 15.6 Sample Serial Transmission Flowchart (Asynchronous Mode) ............................. 339
Figure 15.7 Example SCI3 Operation in Reception in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit) .......................................................................... 341
Figure 15.8 Sample Serial Data Reception Flowchart (Asynchronous Mode) (1) .................... 342
Rev. 3.00 Aug 23, 2006 Page lxviii of lxxviii
Figure 15.8
Figure 15.9
Figure 15.10
Figure 15.11
Figure 15.12
Figure 15.13
Figure 15.14
Sample Serial Data Reception Flowchart (Asynchronous Mode) (2)..................... 343
Data Format in Clocked Synchronous Communication ......................................... 344
Example of SCI3 Operation in Transmission in Clocked Synchronous Mode....... 345
Sample Serial Transmission Flowchart (Clocked Synchronous Mode) ................. 346
Example of SCI3 Reception Operation in Clocked Synchronous Mode ................ 347
Sample Serial Reception Flowchart (Clocked Synchronous Mode)....................... 348
Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
(Clocked Synchronous Mode) ................................................................................ 349
Figure 15.15 IrDA Block Diagram .............................................................................................. 350
Figure 15.16 IrDA Transmission and Reception ......................................................................... 351
Figure 15.17 (a) RDRF Setting and RXI Interrupt ...................................................................... 355
Figure 15.17 (b) TDRE Setting and TXI Interrupt ...................................................................... 355
Figure 15.17 (c) TEND Setting and TEI Interrupt....................................................................... 355
Figure 15.18 Receive Data Sampling Timing in Asynchronous Mode ....................................... 357
Figure 15.19 Relation between RDR Read Timing and Data...................................................... 359
Section 16 Serial Communication Interface 4 (SCI4)
Figure 16.1 Block Diagram of SCI4 .......................................................................................... 362
Figure 16.2 Data Transfer Format ............................................................................................. 370
Figure 16.3 Flowchart Example of SCI4 Initialization.............................................................. 371
Figure 16.4 Flowchart Example of Data Transmission ............................................................. 372
Figure 16.5 Transmit Operation Example ................................................................................. 373
Figure 16.6 Flowchart Example of Data Reception................................................................... 374
Figure 16.7 Receive Operation Example ................................................................................... 375
Figure 16.8 Flowchart Example of Simultaneous Transmission and Reception ....................... 376
Figure 16.9 Relationship between Reading RDR4 and RDRF .................................................. 379
Figure 16.10 Transfer Format when Internal Clock of φ/2 is Selected ........................................ 379
Section 17
Figure 17.1
Figure 17.2
Figure 17.3
14-Bit PWM
Block Diagram of 14-Bit PWM.............................................................................. 381
Example of Pulse-Division Type PWM Using Division by Four........................... 384
PWM Output Waveform ........................................................................................ 385
Section 18
Figure 18.1
Figure 18.2
Figure 18.3
Figure 18.4
Figure 18.5
Figure 18.6
A/D Converter
Block Diagram of A/D Converter .......................................................................... 388
External Trigger Input Timing ............................................................................... 392
Example of A/D Conversion Operation ................................................................. 394
Flowchart of Procedure for Using A/D Converter (Polling by Software) .............. 395
Flowchart of Procedure for Using A/D Converter (Interrupts Used) ..................... 395
A/D Conversion Accuracy Definitions (1) ............................................................. 397
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Figure 18.7 A/D Conversion Accuracy Definitions (2)............................................................. 397
Figure 18.8 Example of Analog Input Circuit ........................................................................... 398
Section 19
Figure 19.1
Figure 19.2
Figure 19.3
Figure 19.4
Figure 19.5
∆Σ A/D Converter
Block Diagram of ∆Σ A/D Converter..................................................................... 402
Example of ∆Σ A/D Conversion Operation (Wait Mode) ...................................... 411
Flowchart of Procedure for Using ∆Σ A/D Converter (Polling by Software) ........ 412
Flowchart of Procedure for Using ∆Σ A/D Converter (Interrupts Used) ............... 412
Example of ∆Σ A/D Conversion Operation (Continuous Mode) ........................... 413
Section 20
Figure 20.1
Figure 20.2
Figure 20.3
Figure 20.4
Figure 20.5
Figure 20.6
Figure 20.7
Figure 20.8
Figure 20.9
LCD Controller/Driver
Block Diagram of LCD Controller/Driver ............................................................. 416
Handling of LCD Drive Power Supply when Using 1/2 Duty ............................... 426
LCD RAM Map (1/4 Duty).................................................................................... 428
LCD RAM Map (1/3 Duty).................................................................................... 429
LCD RAM Map (1/2 Duty).................................................................................... 429
LCD RAM Map (Static Mode)............................................................................... 430
Output Waveforms for Each Duty Cycle (A Waveform) ....................................... 431
Output Waveforms for Each Duty Cycle (B Waveform) ....................................... 432
Capacitance Connection when Using 3-V Constant-Voltage Power Supply
Circuit..................................................................................................................... 434
Figure 20.10 Connection of External Split Resistor .................................................................... 436
2
Section 21 I C Bus Interface 2 (IIC2)
2
Figure 21.1 Block Diagram of I C Bus Interface 2.................................................................... 438
Figure 21.2 External Circuit Connections of I/O Pins ............................................................... 439
2
Figure 21.3 I C Bus Formats...................................................................................................... 453
2
Figure 21.4 I C Bus Timing ....................................................................................................... 453
Figure 21.5 Master Transmit Mode Operation Timing (1) ........................................................ 455
Figure 21.6 Master Transmit Mode Operation Timing (2) ........................................................ 455
Figure 21.7 Master Receive Mode Operation Timing (1) ......................................................... 457
Figure 21.8 Master Receive Mode Operation Timing (2) ......................................................... 458
Figure 21.9 Slave Transmit Mode Operation Timing (1) .......................................................... 460
Figure 21.10 Slave Transmit Mode Operation Timing (2) .......................................................... 461
Figure 21.11 Slave Receive Mode Operation Timing (1)............................................................ 462
Figure 21.12 Slave Receive Mode Operation Timing (2)............................................................ 462
Figure 21.13 Clocked Synchronous Serial Transfer Format........................................................ 463
Figure 21.14 Transmit Mode Operation Timing.......................................................................... 464
Figure 21.15 Receive Mode Operation Timing ........................................................................... 465
Figure 21.16 Block Diagram of Noise Conceler ......................................................................... 466
Rev. 3.00 Aug 23, 2006 Page lxx of lxxviii
Figure 21.17
Figure 21.18
Figure 21.19
Figure 21.20
Figure 21.21
Sample Flowchart for Master Transmit Mode........................................................ 467
Sample Flowchart for Master Receive Mode ......................................................... 468
Sample Flowchart for Slave Transmit Mode.......................................................... 469
Sample Flowchart for Slave Receive Mode ........................................................... 470
Timing of Bit Synchronous Circuit ........................................................................ 472
Section 22 Power-On Reset Circuit
Figure 22.1 Power-On Reset Circuit.......................................................................................... 475
Figure 22.2 Power-On Reset Circuit Operation Timing ............................................................ 477
Section 23
Figure 23.1
Figure 23.2
Figure 23.2
Address Break
Block Diagram of Address Break........................................................................... 479
Address Break Interrupt Operation Example (1).................................................... 483
Address Break Interrupt Operation Example (2).................................................... 484
Section 25
Figure 25.1
Figure 25.2
Figure 25.3
Figure 25.4
Figure 25.5
Figure 25.6
Figure 25.7
Figure 25.8
Figure 25.9
Electrical Characteristics
Power-On Reset Circuit Reset Timing ................................................................... 547
Clock Input Timing ................................................................................................ 548
RES Low Width Timing......................................................................................... 548
Input Timing........................................................................................................... 549
SCK3 Input Clock Timing...................................................................................... 549
SCI3 Input/Output Timing in Clocked Synchronous Mode ................................... 550
Clock Input Timing for TCLKA to TCLKC Pins................................................... 550
2
I C Bus Interface Input/Output Timing .................................................................. 551
Output Load Condition........................................................................................... 551
Appendix
Figure B.1 (a)
Figure B.1 (b)
Figure B.1 (c)
Figure B.1 (d)
Figure B.2 (a)
Figure B.2 (b)
Figure B.2 (c)
Figure B.2 (d)
Figure B.2 (e)
Figure B.2 (f)
Figure B.2 (g)
Figure B.3 (a)
Figure B.3 (b)
Port 1 Block Diagram (P16) (F-ZTAT Version)................................................. 583
Port 1 Block Diagram (P16) (Masked ROM Version)........................................ 584
Port 1 Block Diagram (P15 to P12) .................................................................... 584
Port 1 Block Diagram (P11, P10) ....................................................................... 585
Port 3 Block Diagram (P37) (F-ZTAT Version)................................................. 586
Port 3 Block Diagram (P37) (Masked ROM Version)........................................ 586
Port 3 Block Diagram (P36) (F-ZTAT Version)................................................. 587
Port 3 Block Diagram (P36) (Masked ROM Version)........................................ 587
Port 3 Block Diagram (P32) ............................................................................... 588
Port 3 Block Diagram (P31) ............................................................................... 589
Port 3 Block Diagram (P30) ............................................................................... 590
Port 4 Block Diagram (P42) ............................................................................... 591
Port 4 Block Diagram (P41) ............................................................................... 592
Rev. 3.00 Aug 23, 2006 Page lxxi of lxxviii
Figure B.3 (c) Port 4 Block Diagram (P40) ............................................................................... 593
Figure B.4
Port 5 Block Diagram ......................................................................................... 594
Figure B.5
Port 6 Block Diagram ......................................................................................... 595
Figure B.6
Port 7 Block Diagram ......................................................................................... 595
Figure B.7
Port 8 Block Diagram ......................................................................................... 596
Figure B.8 (a) Port 9 Block Diagram (P93) ............................................................................... 596
Figure B.8 (b) Port 9 Block Diagram (P92) ............................................................................... 597
Figure B.8 (c) Port 9 Block Diagram (P91, P90) ....................................................................... 598
Figure B.9
Port A Block Diagram ........................................................................................ 598
Figure B.10 (a) Port B Block Diagram (PB7, PB6) ..................................................................... 599
Figure B.10 (b) Port B Block Diagram (PB5) .............................................................................. 599
Figure B.10 (c) Port B Block Diagram (PB2 to PB0) .................................................................. 600
Figure D.1 Package Dimensions (FP-80A) .............................................................................. 605
Figure D.2 Package Dimensions (TFP-80C) ............................................................................ 606
Figure D.3 Package Dimensions (TLP-85V)............................................................................ 607
Figure E.1 Cross-Sectional View of Chip
(HCD64338086R, HCD64338085R, HCD64338084R, and HCD64338083R)..... 608
Figure E.2 Cross-Sectional View of Chip (HCD64F38086R) ................................................. 608
Figure F.1 Bonding Pad Form
(HCD64F38086R, HCD64338086R, HCD64338085R, HCD64338084R,
and HCD64338083R)............................................................................................. 609
Figure G.1 Chip Tray Specifications
(HCD64338086R, HCD64338085R, HCD64338084R, and HCD64338083R)..... 610
Figure G.2 Chip Tray Specifications (HCD64F38086R) ......................................................... 611
Rev. 3.00 Aug 23, 2006 Page lxxii of lxxviii
Tables
Section 1 Overview
Table 1.1
TLP-85V Pin Correspondence .................................................................................... 6
Table 1.2
Pad Coordinate of HCD64F38086R.......................................................................... 10
Table 1.3
Pad Coordinate of HCD64338086R.......................................................................... 14
Table 1.4
Pin Functions............................................................................................................. 17
Section 2 CPU
Table 2.1
Operation Notation.................................................................................................... 34
Table 2.2
Data Transfer Instructions ......................................................................................... 35
Table 2.3
Arithmetic Operations Instructions (1)...................................................................... 36
Table 2.3
Arithmetic Operations Instructions (2)...................................................................... 37
Table 2.4
Logic Operations Instructions ................................................................................... 38
Table 2.5
Shift Instructions ....................................................................................................... 38
Table 2.6
Bit Manipulation Instructions (1) .............................................................................. 39
Table 2.6
Bit Manipulation Instructions (2) .............................................................................. 40
Table 2.7
Branch Instructions ................................................................................................... 41
Table 2.8
System Control Instructions ...................................................................................... 42
Table 2.9
Block Data Transfer Instructions .............................................................................. 43
Table 2.10 Addressing Modes..................................................................................................... 45
Table 2.11 Absolute Address Access Ranges ............................................................................. 47
Table 2.12 Effective Address Calculation (1) ............................................................................. 49
Table 2.12 Effective Address Calculation (2) ............................................................................. 50
Section 3 Exception Handling
Table 3.1
Exception Sources and Vector Address .................................................................... 62
Table 3.2
Reset Sources ............................................................................................................ 63
Table 3.3
Interrupt Wait States.................................................................................................. 67
Table 3.4
Conditions under which Interrupt Request Flag is Set to 1 ....................................... 70
Section 4 Interrupt Controller
Table 4.1
Pin Configuration ...................................................................................................... 74
Table 4.2
Interrupt Sources, Vector Addresses, and Interrupt Priorities ................................... 88
Table 4.3
Interrupt Control States ............................................................................................. 90
Table 4.4
Interrupt Response Times (States)............................................................................. 94
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Section 5 Clock Pulse Generators
Table 5.1
Selection Method for System Clock Oscillator and On-Chip Oscillator................. 103
Section 6 Power-Down Modes
Table 6.1
Operating Frequency and Waiting Time ................................................................. 113
Table 6.2
Transition Mode after SLEEP Instruction Execution and Interrupt Handling ........ 119
Table 6.3
Internal State in Each Operating Mode ................................................................... 122
Section 7 ROM
Table 7.1
Setting Programming Modes................................................................................... 142
Table 7.2
Boot Mode Operation.............................................................................................. 144
Table 7.3
System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate is
Possible ................................................................................................................... 145
Table 7.4
Reprogram Data Computation Table ...................................................................... 149
Table 7.5
Additional-Program Data Computation Table ........................................................ 149
Table 7.6
Programming Time ................................................................................................. 149
Table 7.7
Flash Memory Operating States .............................................................................. 154
Section 10 Realtime Clock (RTC)
Table 10.1 Pin Configuration .................................................................................................... 204
Table 10.2 Interrupt Sources ..................................................................................................... 214
Section 11 Timer F
Table 11.1 Pin Configuration .................................................................................................... 218
Table 11.2 Timer F Operating States ........................................................................................ 227
Section 12
Table 12.1
Table 12.2
Table 12.3
Table 12.4
Table 12.5
Table 12.6
Table 12.7
Table 12.8
Table 12.9
Table 12.10
Table 12.11
Table 12.12
Table 12.13
16-Bit Timer Pulse Unit (TPU)
TPU Functions ........................................................................................................ 234
Pin Configuration .................................................................................................... 235
CCLR1 and CCLR0 (Channels 1 and 2) ................................................................. 238
TPSC2 to TPSC0 (Channel 1)................................................................................. 238
TPSC2 to TPSC0 (Channel 2)................................................................................. 239
MD3 to MD0........................................................................................................... 240
TIOR_1 (Channel 1) ............................................................................................... 241
TIOR_2 (Channel 2) ............................................................................................... 242
TIOR_1 (Channel 1) ............................................................................................... 243
TIOR_2 (Channel 2) ............................................................................................... 244
Counter Combination in Operation with Cascaded Connection ............................. 259
PWM Output Registers and Output Pins................................................................. 262
TPU Interrupts......................................................................................................... 266
Rev. 3.00 Aug 23, 2006 Page lxxiv of lxxviii
Section 13 Asynchronous Event Counter (AEC)
Table 13.1 Pin Configuration .................................................................................................... 282
Table 13.2 Examples of Event Counter PWM Operation ......................................................... 293
Table 13.3 Operating States of Asynchronous Event Counter .................................................. 294
Table 13.4 Maximum Clock Frequency.................................................................................... 295
Section 15
Table 15.1
Table 15.2
Table 15.3
Table 15.3
Table 15.3
Table 15.3
Table 15.4
Table 15.5
Table 15.6
Table 15.6
Table 15.7
Table 15.8
Table 15.9
Table 15.10
Table 15.11
Table 15.12
Table 15.13
Table 15.14
Serial Communication Interface 3 (SCI3, IrDA)
SCI3 Channel Configuration ................................................................................... 308
Pin Configuration .................................................................................................... 311
Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1)......... 322
Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2)......... 323
Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (3)......... 324
Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (4)......... 325
Relation between n and Clock................................................................................. 325
Maximum Bit Rate for Each Frequency (Asynchronous Mode)............................. 326
BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (1).................. 327
BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (2).................. 328
Relation between n and Clock................................................................................. 329
Data Transfer Formats (Asynchronous Mode)........................................................ 334
SMR Settings and Corresponding Data Transfer Formats ...................................... 335
SMR and SCR Settings and Clock Source Selection .............................................. 336
SSR Status Flags and Receive Data Handling......................................................... 341
IrCKS2 to IrCKS0 Bit Settings ............................................................................... 352
SCI3 Interrupt Requests .......................................................................................... 353
Transmit/Receive Interrupts .................................................................................... 354
Section 16 Serial Communication Interface 4 (SCI4)
Table 16.1 Pin Configuration .................................................................................................... 362
Table 16.2 Prescaler Division Ratio and Transfer Clock Cycle (Internal Clock) ..................... 368
Table 16.3 SCI4 Interrupt Sources ............................................................................................ 377
Section 17 14-Bit PWM
Table 17.1 Pin Configuration .................................................................................................... 382
Table 17.2 Correspondence Between PWCR, PWRD, and Output Waveform......................... 385
Table 17.3 PWM Operating States............................................................................................ 386
Section 18 A/D Converter
Table 18.1 Pin Configuration .................................................................................................... 389
Table 18.2 Operating States of A/D Converter ......................................................................... 392
Rev. 3.00 Aug 23, 2006 Page lxxv of lxxviii
Section 19 ∆Σ A/D Converter
Table 19.1 Pin Configuration .................................................................................................... 403
Table 19.2 Operating States of ∆Σ A/D Converter ................................................................... 409
Section 20 LCD Controller/Driver
Table 20.1 Pin Configuration .................................................................................................... 417
Table 20.2 Duty Cycle and Common Function Selection ......................................................... 418
Table 20.3 Segment Driver Selection ....................................................................................... 419
Table 20.4 Frame Frequency Selection..................................................................................... 421
Table 20.5 Output Levels.......................................................................................................... 433
Table 20.6 Power-Down Modes and Display Operation........................................................... 435
2
Section 21 I C Bus Interface 2 (IIC2)
Table 21.1 Pin Configuration .................................................................................................... 439
Table 21.2 Transfer Rate........................................................................................................... 442
Table 21.3 Interrupt Requests ................................................................................................... 471
Table 21.4 Time for Monitoring SCL ....................................................................................... 472
Section 23 Address Break
Table 23.1 Access and Data Bus Used...................................................................................... 481
Table 23.2 Operating States of Address Break ......................................................................... 484
Section 25
Table 25.1
Table 25.2
Table 25.3
Table 25.4
Table 25.5
Table 25.6
Table 25.7
Table 25.8
Table 25.9
Table 25.10
Table 25.11
Table 25.12
Table 25.13
Table 25.14
Table 25.15
Table 25.16
Table 25.17
Electrical Characteristics
Absolute Maximum Ratings.................................................................................... 503
DC Characteristics .................................................................................................. 507
Control Signal Timing............................................................................................. 513
Serial Interface Timing ........................................................................................... 516
2
I C Bus Interface Timing......................................................................................... 517
A/D Converter Characteristics ................................................................................ 518
∆Σ A/D Converter Characteristics .......................................................................... 519
LCD Characteristics ................................................................................................ 522
Power-On Reset Circuit Characteristics.................................................................. 523
Watchdog Timer Characteristics ............................................................................. 523
Flash Memory Characteristics................................................................................. 524
Absolute Maximum Ratings.................................................................................... 526
DC Characteristics .................................................................................................. 530
Control Signal Timing............................................................................................. 536
Serial Interface Timing ........................................................................................... 539
2
I C Bus Interface Timing......................................................................................... 540
A/D Converter Characteristics ................................................................................ 541
Rev. 3.00 Aug 23, 2006 Page lxxvi of lxxviii
Table 25.18
Table 25.19
Table 25.20
Table 25.21
Table 25.22
Table 25.23
∆Σ A/D Converter Characteristics........................................................................... 543
LCD Characteristics ................................................................................................ 546
Power-On Reset Circuit Characteristics .................................................................. 547
Watchdog Timer Characteristics ............................................................................. 548
Recommended Crystal Resonators.......................................................................... 552
Recommended Ceramic Resonators........................................................................ 552
Appendix
Table A.1
Table A.2
Table A.2
Table A.2
Table A.3
Table A.4
Table A.5
Instruction Set ......................................................................................................... 555
Operation Code Map (1) ......................................................................................... 568
Operation Code Map (2) ......................................................................................... 569
Operation Code Map (3) ......................................................................................... 570
Number of Cycles in Each Instruction .................................................................... 572
Number of Cycles in Each Instruction .................................................................... 573
Combinations of Instructions and Addressing Modes............................................. 582
Rev. 3.00 Aug 23, 2006 Page lxxvii of lxxviii
Rev. 3.00 Aug 23, 2006 Page lxxviii of lxxviii
Section 1 Overview
Section 1 Overview
1.1
Features
• High-speed H8/300H central processing unit with an internal 16-bit architecture
Upward-compatible with H8/300 CPU on an object level
Sixteen 16-bit general registers
62 basic instructions
• Various peripheral functions
RTC (can be used as a free-running counter)
Asynchronous event counter (AEC)
LCD controller/driver
Timer F
16-bit timer pulse unit (TPU)
14-bit PWM
Watchdog timer
SCI (Asynchronous or clocked synchronous serial communication interface)
2
2
I C bus interface (conforms to the I C bus interface format that is advocated by Philips
Electronics)
10-bit A/D converter
14-bit ∆Σ A/D converter
Rev. 3.00 Aug 23, 2006 Page 1 of 616
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Section 1 Overview
• On-chip memory
Product Classification
Model
ROM
RAM
Flash memory version
(F-ZTATTM version)
H8/38086RF
HD64F38086R
52 kbytes*
2 kbytes
Masked ROM version
H8/38086R
HD64338086R
48 kbytes
2 kbytes
H8/38085R
HD64338085R
40 kbytes
2 kbytes
H8/38084R
HD64338084R
32 kbytes
1 kbyte
H8/38083R
HD64338083R
24 kbytes
1 kbyte
TM
Note: F-ZTAT is a trademark of Renesas Technology Corp.
* 4-kbyte area of 52-kbyte ROM is used for the on-chip debugger. When the on-chip
debugger is not used, 52-kbyte area is available.
• General I/O ports
I/O pins: 55 I/O pins, including 4 large current ports (IOL = 15 mA, @VOL = 1.0 V)
Input-only pins: 8 input pins
• Supports various power-down states
• Compact package
Package
Code
Old Code
Body Size
Pin Pitch
QFP-80
PRQP0080JB-A
FP-80A
14 × 14 mm
0.65 mm
TQFP-80
PTQP0080KC-A
TFP-80C
P-TFLGA-85
PTLG0085JA-A
TLP-85V
Rev. 3.00 Aug 23, 2006 Page 2 of 616
REJ09B0182-0300
12 × 12 mm
7 × 7 mm
0.5 mm
0.65 mm
Remarks
Section 1 Overview
1.2
Internal Block Diagram
X1
X2
OSC1
OSC2
Subclock generator
H8/300H CPU
System clock generator
System clock
on-chip generator*3
Port 6
P60/SEG9
P61/SEG10
P62/SEG11
P63/SEG12
P64/SEG13
P65/SEG14
P66/SEG15
P67/SEG16
14-bit PWM2
10-bit A/D converter
Realtime clock
Asynchronous
event counter
Timer F
I2C bus interface
LCD controller/driver
SCI3_1/IrDA
SCI3_2
Address break
SCI4*1
P90/PWM1
P91/PWM2
P92/IRQ4
P93
PA0/COM1
PA1/COM2
PA2/COM3
PA3/COM4
LCD power
supply
Port 8
14-bit PWM1
P80/SEG25
P81/SEG26
P82/SEG27
P83/SEG28
P84/SEG29
P85/SEG30
P86/SEG31
P87/SEG32
Port 9
Power-on reset circuit
Port A
Watchdog timer
Port 5
IRQAEC
P50/WKP0/SEG1
P51/WKP1/SEG2
P52/WKP2/SEG3
P53/WKP3/SEG4
P54/WKP4/SEG5
P55/WKP5/SEG6
P56/WKP6/SEG7
P57/WKP7/SEG8
Port 7
Port 1
Timer pulse unit
14-bit
∆Σ A/D converter
Port B
P40/SCK31/TMIF
P41/RXD31/IrRXD/TMOFL
P42/TXD31/IrTXD/TMOFH
RAM
Port 3
P30/SCK32/TMOW
P31/RXD32/SDA
P32/TXD32/SCL
1 2
P36/SI4 * *
1 2
*
P37/SO4 *
ROM
Port 4
P10/AEVH
P11/AEVL
P12/TIOCA1/TCLKA
P13/TIOCB1/TCLKB
P14/TIOCA2/TCLKC
P15/TIOCB2
1 2
P16/SCK4 * *
DVcc
Vcc
AVcc
Vss
AVss
RES
TEST/ADTRG
2
NMI *
P70/SEG17
P71/SEG18
P72/SEG19
P73/SEG20
P74/SEG21
P75/SEG22
P76/SEG23
P77/SEG24
V1
V2
V3
C1
C2
PB0/AN0/IRQ0
PB1/AN1/IRQ1
PB2/AN2/IRQ3
ACOM
PB5/Vref/REF
PB6/Ain2
PB7/Ain1
: Large current port (15 mA)
Notes: 1. The SCI4 pins, such as SCK4, SI4, and SO4, are supported only by the F-ZTAT version.
2. The SCK4, SI4, SO4, and NMI pins are not available when the E7 or on-chip
debugger is used. These pins are not available as ports.
3. Supported only by the masked ROM version.
Figure 1.1 Internal Block Diagram of H8/38086R Group
Rev. 3.00 Aug 23, 2006 Page 3 of 616
REJ09B0182-0300
Section 1 Overview
Pin Assignment
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
FP-80A, TFP-80C
(Top view)
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
P61/SEG10
P60/SEG9
P57/WKP7/SEG8
P56/WKP6/SEG7
P55/WKP5/SEG6
P54/WKP4/SEG5
P53/WKP3/SEG4
P52/WKP2/SEG3
P51/WKP1/SEG2
P50/WKP0/SEG1
PA3/COM4
PA2/COM3
PA1/COM2
PA0/COM1
V3
V2
V1 (also used with 3-V booster)
C2
C1
Vcc
P13/TIOCB1/TCLKB
P14/TIOCA2/TCLKC
P15/TIOCB2
P16/SCK4
P30/SCK32/TMOW
P31/RXD32/SDA
P32/TXD32/SCL
P36/SI4
P37/SO4
X1
X2
Vss
OSC2
OSC1
TEST/ADTRG
RES
NMI
P40/SCK31/TMIF
P41/RXD31/IrRXD/TMOFL
P42/TXD31/IrTXD/TMOFH
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
P86/SEG31
P87/SEG32
PB7/Ain1
PB6/Ain2
PB5/Vref/REF
ACOM
DVcc
AVss
AVcc
PB2/AN2/IRQ3
PB1/AN1/IRQ1
PB0/AN0/IRQ0
IRQAEC
P90/PWM1
P91/PWM2
P92/IRQ4
P93
P10/AEVH
P11/AEVL
P12/TIOCA1/TCLKA
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
P85/SEG30
P84/SEG29
P83/SEG28
P82/SEG27
P81/SEG26
P80/SEG25
P77/SEG24
P76/SEG23
P75/SEG22
P74/SEG21
P73/SEG20
P72/SEG19
P71/SEG18
P70/SEG17
P67/SEG16
P66/SEG15
P65/SEG14
P64/SEG13
P63/SEG12
P62/SEG11
1.3
Figure 1.2 Pin Assignment of H8/38086R Group (FP-80A, TFP-80C)
Rev. 3.00 Aug 23, 2006 Page 4 of 616
REJ09B0182-0300
Section 1 Overview
A10
B10
C10
D10
E10
F10
G10
H10
J10
K10
A9
B9
C9
D9
E9
F9
G9
H9
J9
K9
A8
B8
C8
D8
E8
F8
G8
H8
J8
K8
A7
B7
C7
H7
J7
K7
A6
B6
C6
H6
J6
K6
H5
J5
K5
H4
J4
K4
TLP-85V
(Top view)
A5
B5
C5
A4
B4
C4
D4
A3
B3
C3
D3
E3
F3
G3
H3
J3
K3
A2
B2
C2
D2
E2
F2
G2
H2
J2
K2
A1
B1
C1
D1
E1
F1
G1
H1
J1
K1
Note: For details on pin correspondence, refer to table 1.1.
Figure 1.3 Pin Assignment of H8/38086R Group (TLP-85V)
Rev. 3.00 Aug 23, 2006 Page 5 of 616
REJ09B0182-0300
Section 1 Overview
Table 1.1
TLP-85V Pin Correspondence
Pin Name
H8/38086R Group
Pin Symbol (TLP-85V)
P13/TIOCB1/TCLKB
B1
P14/TIOCA2/TCLKC
C1
P15/TIOCB2
B2
P16/SCK4
C2
P30/SCK32/TMOW
D1
P31/RXD32/SDA
D3
P32/TXD32/SCL
D2
P36/SI4
E1
P37/SO4
E3
X1
F2
X2
E2
Vss
F3
OSC2
G3
OSC1
F1
TEST/ADTRG
G2
RES
H2
NMI
G1
P40/SCK31/TMIF
H3
P41/RXD31/IrRXD/TMOFL
J1
P42/TXD31/IrTXD/TMOFH
H1
NC
K1
Vcc
K2
C1
K3
C2
J2
V1
J3
V2
K4
V3
H4
PA0/COM1
J4
PA1/COM2
K5
Rev. 3.00 Aug 23, 2006 Page 6 of 616
REJ09B0182-0300
Section 1 Overview
Pin Name
H8/38086R Group
Pin Symbol (TLP-85V)
PA2/COM3
H5
PA3/COM4
J6
P50/WKP0/SEG1
J5
P51/WKP1/SEG2
H6
P52/WKP2/SEG3
H7
P53/WKP3/SEG4
K6
P54/WKP4/SEG5
J7
P55/WKP5/SEG6
J8
P56/WKP6/SEG7
K7
P57/WKP7/SEG8
H8
P60/SEG9
K9
P61/SEG10
K8
NC
K10
P62/SEG11
J10
P63/SEG12
H10
P64/SEG13
J9
P65/SEG14
H9
P66/SEG15
G10
P67/SEG16
G8
P70/SEG17
G9
P71/SEG18
F10
P72/SEG19
F8
P73/SEG20
E9
P74/SEG21
F9
P75/SEG22
E8
P76/SEG23
D8
P77/SEG24
E10
P80/SEG25
D9
P81/SEG26
C9
P82/SEG27
D10
P83/SEG28
C8
Rev. 3.00 Aug 23, 2006 Page 7 of 616
REJ09B0182-0300
Section 1 Overview
Pin Name
H8/38086R Group
Pin Symbol (TLP-85V)
P84/SEG29
B10
P85/SEG30
C10
NC
A10
P86/SEG31
A9
P87/SEG32
A8
PB7/Ain1
B9
PB6/Ain2
B8
PB5/Vref/REF
A7
ACOM
C7
DVcc
B7
AVss
A6
AVcc
C6
PB2/AN2/IRQ3
B5
PB1/AN1/IRQ1
B6
PB0/AN0/IRQ0
C5
IRQAEC
C4
P90/PWM1
A5
P91/PWM2
B4
P92/IRQ4
B3
P93
A4
P10/AEVH
C3
P11/AEVL
A2
P12/TIOCA1/TCLKA
A3
NC
A1
NC
D4
Rev. 3.00 Aug 23, 2006 Page 8 of 616
REJ09B0182-0300
Section 1 Overview
81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64
63 62
Model name
61
1
60
2
59
3
58
4
57
5
56
6
7
55
Y
8
54
9
53
10
52
(0, 0)
11
51
X
50
12
13
14
49
48
15
16
17
47
46
18
45
19
44
43
20
42
21
22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41
Product model name
Model name on chip
HCD64F38086R
HD64F38086R
Chip size: 4.73mm × 4.73mm
Voltage level on the back of the chip: GND
: NC pad
Figure 1.4 Pad Assignment of HCD64F38086R (Top View)
Rev. 3.00 Aug 23, 2006 Page 9 of 616
REJ09B0182-0300
Section 1 Overview
Table 1.2
Pad Coordinate of HCD64F38086R
Coordinate
Pad No.
Pad Name
X (µ
µm)
Y (µ
µm)
1
P13/TIOCB1/TCLKB
–2223
1797
2
P14/TIOCA2/TCLKC
–2223
1615
3
P15/TIOCB2
–2223
1434
4
P16/SCK4
-2223
1295
5
P30/SCK32/TMOW
–2223
1150
6
P31/RXD32/SDA
–2223
941
7
P32/TXD32/SCL
–2223
732
8
P36/SI4
–2223
523
9
P37/SO4
–2223
314
10
X1
–2223
105
11
X2
–2223
–105
12
Vss
–2223
–314
13
Vss
–2223
–418
14
OSC2
–2223
–523
15
OSC1
–2223
–732
16
TEST/ADTRG
–2223
–941
17
RES
–2223
–1150
18
NMI
–2223
–1360
19
P40/SCK31/TMIF
–2223
–1569
20
P41/RXD31/IrRXD/TMOFL
–2223
–1778
21
P42/TXD31/IrTXD/TMOFH
–2223
–1987
22
Vcc
–1987
–2223
23
C1
–1775
–2223
24
C2
–1569
–2223
25
V1
–1360
–2223
26
V2
–1150
–2223
27
V3
–941
–2223
28
PA0/COM1
–732
–2223
29
PA1/COM2
–523
–2223
Rev. 3.00 Aug 23, 2006 Page 10 of 616
REJ09B0182-0300
Section 1 Overview
Coordinate
Pad No.
Pad Name
X (µ
µm)
Y (µ
µm)
30
PA2/COM3
–314
–2223
31
PA3/COM4
–105
–2223
32
P50/WKP0/SEG1
105
–2223
33
P51/WKP1/SEG2
314
–2223
34
P52/WKP2/SEG3
523
–2223
35
P53/WKP3/SEG4
732
–2223
36
P54/WKP4/SEG5
941
–2223
37
P55/WKP5/SEG6
1150
–2223
38
P56/WKP6/SEG7
1360
–2223
39
P57/WKP7/SEG8
1569
–2223
40
P60/SEG9
1778
–2223
41
P61/SEG10
1987
–2223
42
P62/SEG11
2223
–1987
43
P63/SEG12
2223
–1778
44
P64/SEG13
2223
–1569
45
P65/SEG14
2223
–1360
46
P66/SEG15
2223
–1150
47
P67/SEG16
2223
–941
48
P70/SEG17
2223
–732
49
P71/SEG18
2223
–523
50
P72/SEG19
2223
–314
51
P73/SEG20
2223
–105
52
P74/SEG21
2223
105
53
P75/SEG22
2223
314
54
P76/SEG23
2223
523
55
P77/SEG24
2223
660
56
P80/SEG25
2223
941
57
P81/SEG26
2223
1222
58
P82/SEG27
2223
1360
59
P83/SEG28
2223
1569
60
P84/SEG29
2223
1778
Rev. 3.00 Aug 23, 2006 Page 11 of 616
REJ09B0182-0300
Section 1 Overview
Coordinate
Pad No.
Pad Name
X (µ
µm)
Y (µ
µm)
61
P85/SEG30
2223
1987
62
P86/SEG31
1987
2223
63
P87/SEG32
1852
2223
64
PB7/Ain1
1483
2223
65
PB6/Ain2
1341
2223
66
PB5/Vref/REF
1150
2223
67
ACOM
941
2223
68
DVcc
732
2223
69
AVss
523
2223
70
AVcc
314
2223
71
PB2/AN2/IRQ3
105
2223
72
PB1/AN1/IRQ1
–105
2223
73
PB0/AN0/IRQ0
–314
2223
74
IRQAEC
–523
2223
75
P90/PWM1
–732
2223
76
P91/PWM2
–941
2223
77
P92/IRQ4
–1150
2223
78
P93
–1360
2223
79
P10/AEVH
–1569
2223
80
P11/AEVL
–1778
2223
81
P12/TIOCA1/TCLKA
–1987
2223
Note: The power supply (Vss) pads in pad numbers 12 and 13 must not be open but connected.
When the TEST pad in pad number 16 is not used as the ADTRG pin, it must be connected
to the Vss voltage level. If not, this LSI does not operate correctly.
When the TEST pad is used as the ADTRG pin, the function should be changed to the
ADTRG pin at Vss voltage level during a reset in advance.
Rev. 3.00 Aug 23, 2006 Page 12 of 616
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Section 1 Overview
80 79 78 77 76 75 74 73 72 71
70 69 68 67 66 65 64 63 62 61
Model name
1
60
2
59
3
58
4
57
5
56
6
55
7
54
Y
8
53
9
52
10
51
11
(0, 0)
X
50
12
49
13
48
14
47
15
46
16
45
17
44
18
43
19
42
20
41
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Product model name
Model name on chip
HCD64338086R
HD64338086R
Chip size: 3.60mm × 3.69mm
Voltage level on the back of the chip: GND
Figure 1.5 Pad Assignment of HCD64338086R (Top View)
Rev. 3.00 Aug 23, 2006 Page 13 of 616
REJ09B0182-0300
Section 1 Overview
Table 1.3
Pad Coordinate of HCD64338086R
Coordinate
Pad No.
Pad Name
X (µ
µm)
Y (µ
µm)
1
P13/TIOCB1/TCLKB
-1683
1484
2
P14/TIOCA2/TCLKC
-1683
1328
3
P15/TIOCB2
-1683
1172
4
P16
-1683
1016
5
P30/SCK32/TMOW
-1683
859
6
P31/RXD32/SDA
-1683
703
7
P32/TXD32/SCL
-1683
547
8
P36
-1683
391
9
P37
-1683
234
10
X1
-1683
97
11
X2
-1683
-29
12
VSS
-1683
-234
13
OSC2
-1683
-391
14
OSC1
-1683
-575
15
TEST/ADTRG
-1683
-703
16
RES
-1683
-859
17
NMI
-1683
-1016
18
P40/SCK31/TMIF
-1683
-1172
19
P41/RXD31/IrRXD/TMOFL
-1683
-1328
20
P42/TXD31/IrTXD/TMOFH
-1683
-1484
21
VCC
-1448
-1728
22
C1
-1208
-1728
23
C2
-1085
-1728
24
V1
-963
-1728
25
V2
-841
-1728
26
V3
-689
-1728
27
PA0/COM1
-536
-1728
28
PA1/COM2
-384
-1728
29
PA2/COM3
-231
-1728
Rev. 3.00 Aug 23, 2006 Page 14 of 616
REJ09B0182-0300
Section 1 Overview
Coordinate
Pad No.
Pad Name
X (µ
µm)
Y (µ
µm)
30
PA3/COM4
-79
-1728
31
P50/WKP0/SEG1
79
-1728
32
P51/WKP1/SEG2
231
-1728
33
P52/WKP2/SEG3
384
-1728
34
P53/WKP3/SEG4
536
-1728
35
P54/WKP4/SEG5
689
-1728
36
P55/WKP5/SEG6
841
-1728
37
P56/WKP6/SEG7
994
-1728
38
P57/WKP7/SEG8
1146
-1728
39
P60/SEG9
1298
-1728
40
P61/SEG10
1448
-1728
41
P62/SEG11
1683
-1484
42
P63/SEG12
1683
-1328
43
P64/SEG13
1683
-1159
44
P65/SEG14
1683
-1016
45
P66/SEG15
1683
-859
46
P67/SEG16
1683
-703
47
P70/SEG17
1683
-547
48
P71/SEG18
1683
-391
49
P72/SEG19
1683
-234
50
P73/SEG20
1683
-78
51
P74/SEG21
1683
78
52
P75/SEG22
1683
234
53
P76/SEG23
1683
391
54
P77/SEG24
1683
547
55
P80/SEG25
1683
703
56
P81/SEG26
1683
859
57
P82/SEG27
1683
1016
58
P83/SEG28
1683
1172
59
P84/SEG29
1683
1328
Rev. 3.00 Aug 23, 2006 Page 15 of 616
REJ09B0182-0300
Section 1 Overview
Coordinate
Pad No.
Pad Name
X (µ
µm)
Y (µ
µm)
60
P85/SEG30
1683
1484
61
P86/SEG31
1448
1728
62
P87/SEG32
1298
1728
63
PB7/Ain1
1146
1728
64
PB6/Ain2
994
1728
65
PB5/Vref/REF
841
1728
66
ACOM
689
1728
67
DVCC
536
1728
68
VSS/AVSS
377
1728
69
AVCC
181
1728
70
PB2/AN2/IRQ3
32
1728
71
PB1/AN1/IRQ1
-114
1728
72
PB0/AN0/IRQ0
-231
1728
73
IRQAEC
-384
1728
74
P90/PWM1
-536
1728
75
P91/PWM2
-689
1728
76
P92/IRQ4
-841
1728
77
P93
-994
1728
78
P10/AEVH
-1146
1728
79
P11/AEVL
-1298
1728
80
P12/TIOCA1/TCLKA
-1448
1728
Note: The power supply (Vss) pads in pad number 12 must not be open but connected. When the
TEST pad in pad number 15 is not used as the ADTRG pin, it must be connected to the Vss
voltage level. If not, this LSI does not operate correctly.
When the TEST pad is used as the ADTRG pin, the function should be changed to the
ADTRG pin at Vss voltage level during a reset in advance.
Rev. 3.00 Aug 23, 2006 Page 16 of 616
REJ09B0182-0300
Section 1 Overview
1.4
Table 1.4
Pin Functions
Pin Functions
Pin No.
Type
FP-80A,
Pad
Symbol TFP-80C TLP-85V No.*1
Functions
67
B7
68
67
Input
Analog power supply pins for the ∆Σ
A/D converter. When the ∆Σ A/D
converter is not used, connect this pin
to the system power supply.
Vcc
21
K2
22
21
Input
Power supply pins. Connect this pin to
the system power supply.
Vss
12
F3
12, 13
12
Input
Ground pins. Connect this pin to the
system power supply (0 V).
AVcc
69
C6
70
69
Input
Analog power supply pins for the A/D
converter. When the A/D converter is
not used, connect this pin to the
system power supply.
AVss
68
(= Vss)
A6
(= Vss)
69
68
Input
Ground pins for the A/D converter.
Connect this pin to the system power
supply (0 V).
V1 to V3 24 to 26
J3, K4,
H4
25 to 27 24 to Input
26
Power supply pins for the LCD
controller/driver.
C1
22
K3
23
22
Input
Capacitance pins for stepping up the
LCD drive power supply.
C2
23
J2
24
23
Input
OSC1
14
F1
15
14
Input
OSC2
13
G3
14
13
Power
DVcc
supply pins
Clock pins
Pad
No.*2 I/O
These pins connect with crystal or
ceramic resonator for the system clock,
Output
or can be used to input an external
clock.
See section 5, Clock Pulse Generators,
for a typical connection.
System
control
X1
10
F2
10
10
X2
11
E2
11
11
These pins connect with a 32.768- or
38.4-kHz crystal resonator for the
Output
subclock. See section 5, Clock Pulse
Generators, for a typical connection.
RES
16
H2
17
16
Input
Input
Reset pins. The power-on reset circuit
is incorporated. When externally driven
low, the chip is reset.
Rev. 3.00 Aug 23, 2006 Page 17 of 616
REJ09B0182-0300
Section 1 Overview
Pin No.
Type
Symbol
FP-80A,
Pad
TFP-80C TLP-85V No.*1
Pad
No.*2
I/O
Functions
System
control
TEST
15
G2
16
15
Input
Test pins. Also used as the ADTRG
pin. When this pin is not used as the
ADTRG pin, users cannot use this
pin. Connect this pin to Vss. When
this pin is used as the ADTRG pin,
see section 18.4.2, External Trigger
Input Timing.
Interrupt
pins
NMI
17
G1
18
17
Input
NMI interrupt request pins.
Non-maskable interrupt request input
pin.
IRQ0
72
C5
73
72
Input
IRQ1
71
B6
72
71
Input
IRQ3
70
B5
71
70
Input
IRQ4
76
B3
77
76
Input
IRQAEC
73
C4
74
73
Input
External interrupt request input pins.
Can select the rising or falling edge.
Interrupt input pins for the
asynchronous event counter.
This pin enables the asynchronous
event input. In the masked ROM
version, this pin controls turning on/off
the on-chip oscillator during a reset.
WKP0 to
WKP7
31 to 38
J5, H6,
H7, K6,
J7, J8,
K7, H8
Rev. 3.00 Aug 23, 2006 Page 18 of 616
REJ09B0182-0300
32 to 39 31 to
38
Input
Wakeup interrupt request input pins.
Can select the rising or falling edge.
Section 1 Overview
Pin No.
Type
Symbol
FP-80A,
TFP-80C
Pad
TLP-85V No.*1
Pad
No.*2
I/O
Functions
System
control
TEST
15
G2
16
15
Input
Test pins. Also used as the ADTRG
pin. When this pin is not used as the
ADTRG pin, users cannot use this
pin. Connect this pin to Vss. When
this pin is used as the ADTRG pin,
see section 18.4.2, External Trigger
Input Timing.
80
A3
81
80
I/O
Pins for the TGR1A input capture
input or output compare output, or
PWM output.
TIOCB1
1
B1
1
1
Input
Pins for the TGR1B input capture
input.
TIOCA2
2
C1
2
2
I/O
Pins for the TGR2A input capture
input or output compare output, or
PWM output.
TIOCB2
3
B2
3
3
Input
Pins for the TGR2B input capture
input.
TCLKA
80
A3
81
80
Input
External clock input pins.
TCLKB
1
B1
1
1
Input
TCLKC
2
C1
2
2
Input
TMIF
18
H3
19
18
Input
TMOFL
19
J1
20
19
Output Output pins for waveforms generated
by the timer FL output compare
function.
TMOFH
20
H1
21
20
Output Output pins for waveforms generated
by the timer FH output compare
function.
AEVL
79
A2
80
79
Input
AEVH
78
C3
79
78
Input
TMOW
5
D1
5
5
Output Divided clock output pins for the RTC.
16-bit timer TIOCA1
pulse unit
(TPU)
Timer F
Asynchronous
event
counter
(AEC)
RTC
Event input pins for input to the timer
F counter.
Event input pins for input to the
asynchronous event counter.
Rev. 3.00 Aug 23, 2006 Page 19 of 616
REJ09B0182-0300
Section 1 Overview
Pin No.
FP-80A,
TFP-80C
Pad
TLP-85V No.*1
Pad
No.*2
14-bit PWM PWM1
74
A5
75
74
PWM2
75
B4
76
75
4
C2
4

I/O
Transfer clock pins for SCI4 data
transmission/reception. When the E7
or on-chip emulator debugger is used,
this pin is not available.
8
E1
8

Input
SCI4 data input pins. When the E7 or
on-chip emulator debugger is used,
this pin is not available.
9
E3
9

Output SCI4 data output pins. When the E7
or on-chip emulator debugger is used,
this pin is not available.
SCK31
18
H3
19
18
I/O
SCI3_1 clock I/O pins.
RXD31/
IrRXD
19
J1
20
19
Input
SCI3_1 data input pins or data input
pins for the IrDA format.
TXD31/
IrTXD
20
H1
21
20
Output SCI3_1 data output pins or data
output pins for the IrDA format.
SCK32
5
D1
5
5
I/O
SCI3_2 clock I/O pins.
RXD32
6
D3
6
6
Input
SCI3_2 data input pins.
TXD32
7
D2
7
7
Output SCI3_2 data output pins.
AN0 to
AN2
72 to 70
C5, B6,
B5
73 to 71 72 to
70
Input
Analog data input pins for the A/D
converter.
ADTRG
15
G2
16
Input
External trigger input pins for the A/D
converter.
Type
Symbol
Serial
SCK4
communication
interface 4
(SCI4)
SI4
(F-ZTAT
version
only)
SO4
Serial
communication
interface 3
(SCI3)
A/D
converter
Rev. 3.00 Aug 23, 2006 Page 20 of 616
REJ09B0182-0300
15
I/O
Functions
Output Output pins for waveforms generated
by the 14-bit PWM in PWM channels
Output
1 and 2.
Section 1 Overview
Pin No.
Type
Symbol
FP-80A,
TFP-80C
Pad
TLP-85V No.*1
Pad
No.*2
∆Σ A/D
converter
ACOM
66
C7
67
66
Output Pins for stabilizing analog block
voltage of the ∆Σ A/D converter.
A capacitor should be connected
between ∆Σ A/D converter and GND.
REF
65
A7
66
65
Output Output pins for internal reference
voltage of the ∆Σ A/D converter.
These pins output internal reference
voltage.
Vref
65
A7
66
65
Input
External reference voltage pins of the
∆Σ A/D converter. These pins input
reference voltage.
Ain2
64
B8
65
64
Input
Analog input pins for the ∆Σ A/D
converter.
Ain1
63
B9
64
63
Input
Analog input pins for the ∆Σ A/D
converter.
6
D3
6
6
I/O
IIC data I/O pins.
7
D2
7
7
I/O
IIC clock I/O pins.
COM1 to 27 to 30
COM4
J4, K5,
H5, J6
28 to 31 27 to
30
Output LCD common output pins.
SEG1 to
SEG8
31 to 38
J5, H6,
H7, K6,
J7, J8,
K7, H8
32 to 39 31 to
38
Output LCD segment output pins.
SEG9 to
SEG16
39 to 46
40 to 47 39 to
K9, K8,
46
J10 H10,
J9, H9,
G8
Output
I2C bus
SDA
interface 2
SCL
(IIC2)
LCD
controller/
driver
I/O
Functions
SEG17 to 47 to 54
SEG24
G9, F10,
F8, E9,
F9, E8,
D8, E10
48 to 55 47 to
54
Output
SEG25 to 55 to 62
SEG32
56 to 63 55 to
D9, C9,
62
D10, C8,
B10, C10,
A9, A8
Output
Rev. 3.00 Aug 23, 2006 Page 21 of 616
REJ09B0182-0300
Section 1 Overview
Pin No.
FP-80A,
Pad
TFP-80C TLP-85V No.*1
Pad
No.*2
I/O
Functions
I/O
7-bit I/O pins. Input or output can be
designated for each bit by means of
the port control register 1 (PCR1).
5 to 9
I/O
5-bit I/O pins. Input or output can be
designated for each bit by means of
the port control register 3 (PCR3).
H3, J1,
H1
19 to 21 18 to
20
I/O
3-bit I/O pins. Input or output can be
designated for each bit by means of
the port control register 4 (PCR4).
31 to 38
J5, H6,
H7, K6,
J7, J8,
K7, H8
32 to 39 31 to
38
I/O
8-bit I/O pins. Input or output can be
designated for each bit by means of
the port control register 5 (PCR5).
P60 to
P67
39 to 46
40 to 47 39 to
K9, K8,
46
J10, H10,
J9, H9,
G10, G8
I/O
8-bit I/O pins. Input or output can be
designated for each bit by means of
the port control register 6 (PCR6).
P70 to
P77
47 to 54
G9, F10,
F8, E9,
F9, E8,
D8, E10
48 to 55 47 to
54
I/O
8-bit I/O pins. Input or output can be
designated for each bit by means of
the port control register 7 (PCR7).
P80 to
P87
55 to 62
56 to 63 55 to
D9, C9,
62
D10, C8,
B10, C10,
A9, A8
I/O
8-bit I/O pins. Input or output can be
designated for each bit by means of
the port control register 8 (PCR8).
P90 to
P93
74 to 77
A5, B4,
B3, A4
I/O
4-bit I/O pins. Input or output can be
designated for each bit by means of
the port control register 9 (PCR9).
Type
Symbol
I/O ports
P10 to
P12
78 to 80
C3, A2,
A3
79 to 81 78 to
80
P13 to
P16
1 to 4
B1, C1,
B2, C2
1 to 4
1 to 4
P30 to
5 to 9
P32,
P36, P37
D1, D3,
D2, E1,
E3
5 to 9
P40 to
P42
18 to 20
P50 to
P57
Rev. 3.00 Aug 23, 2006 Page 22 of 616
REJ09B0182-0300
75 to 78 74 to
77
Section 1 Overview
Pin No.
Type
I/O ports
FP-80A,
Pad
Symbol TFP-80C TLP-85V No.*1
Pad
No.*2
PA0 to
PA3
27 to 30
J4, K5,
H5, J6
28 to
31
27 to
30
PB0 to
PB2,
PB5 to
PB7
72 to 70,
65 to 63
C5, B6,
B5, A7,
B8, B9
73 to
72 to
71, 66 70
to 64
65 to
63
I/O
Functions
I/O
4-bit I/O pins. Input or output can be
designated for each bit by means of the
port control register A (PCRA).
Input
6-bit input-only pins
Notes: 1. Pad no. for the flash memory version.
2. Pad no. for the masked ROM version.
Rev. 3.00 Aug 23, 2006 Page 23 of 616
REJ09B0182-0300
Section 1 Overview
Rev. 3.00 Aug 23, 2006 Page 24 of 616
REJ09B0182-0300
Section 2 CPU
Section 2 CPU
This LSI has an H8/300H CPU with an internal 32-bit architecture that is upward-compatible with
the H8/300 CPU, and supports only normal mode, which has a 64-kbyte address space.
• Upward-compatible with H8/300 CPUs
Can execute H8/300 CPUs object programs
Additional eight 16-bit extended registers
32-bit transfer and arithmetic and logic instructions are added
Signed multiply and divide instructions are added.
• General-register architecture
Sixteen 16-bit general registers also usable as sixteen 8-bit registers and eight 16-bit registers,
or eight 32-bit registers
• Sixty-two basic instructions
8/16/32-bit data transfer and arithmetic and logic instructions
Multiply and divide instructions
Powerful bit-manipulation instructions
• Eight addressing modes
Register direct [Rn]
Register indirect [@ERn]
Register indirect with displacement [@(d:16,ERn) or @(d:24,ERn)]
Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn]
Absolute address [@aa:8, @aa:16, @aa:24]
Immediate [#xx:8, #xx:16, or #xx:32]
Program-counter relative [@(d:8,PC) or @(d:16,PC)]
Memory indirect [@@aa:8]
• 64-kbyte address space
• High-speed operation
All frequently-used instructions execute in one or two states
8/16/32-bit register-register add/subtract : 2 state
8 × 8-bit register-register multiply
: 14 states
16 ÷ 8-bit register-register divide
: 14 states
16 × 16-bit register-register multiply
: 22 states
32 ÷ 16-bit register-register divide
: 22 states
CPU30H2C_000220040500
Rev. 3.00 Aug 23, 2006 Page 25 of 616
REJ09B0182-0300
Section 2 CPU
• Power-down state
Transition to power-down state by SLEEP instruction
2.1
Address Space and Memory Map
The address space of this LSI is 64 kbytes, which includes the program area and the data area.
Figure 2.1 shows the memory map.
HD64338086R
(Masked ROM version)
HD64F38086R
(Flash memory version)
H'0000
H'0057
H'0058
Interrupt vector
H'0000
H'0057
H'0058
On-chip ROM
(52 kbytes)
H'BFFF
H'C000
H'CFFF
H'D000
H'EFFF
H'F000
Flash memory
Not used
Internal I/O registers
Interrupt vector
On-chip ROM
(48 kbytes)
H'BFFF
H'C000
H'9FFF
H'A000
H'F37F
H'F380
H'F37F
H'F380
Not used
H'F77F
H'F780
On-chip RAM
(3 kbytes)
On-chip RAM
(2 kbytes)
H'F36F
H'F370
H'F37F
H'F380
LCD RAM (16 bytes)
H'F37F
H'F380
Not used
On-chip RAM
(2 kbytes)
H'FFFF
H'FB7F
H'FB80
Internal I/O registers
(128 bytes)
H'FFFF
Not used
H'FB7F
H'FB80
On-chip RAM
(1 kbytes)
H'FF7F
H'FF80
H'FF7F
H'FF80
Internal I/O registers
(128 bytes)
Internal I/O registers
(128 bytes)
H'FFFF
Not used
LCD RAM (16 bytes)
H'F77F
H'F780
H'FF7F
H'FF80
H'FF7F
H'FF80
Internal I/O registers
H'F09F
H'F0A0
Not used
H'F77F
H'F780
User area
Not used
Not used
LCD RAM (16 bytes)
H'F37F
H'F380
On-chip ROM
(24 kbytes)
H'5FFF
H6000
Internal I/O registers
H'F36F
H'F370
H'F36F
H'F370
Interrupt vector
H'F02F
H'F030
H'F09F
H'F0A0
Not used
LCD RAM (16 bytes)
On-chip ROM
(32 kbytes)
HD64338083R
(Masked ROM version)
H'0000
H'0057
H'0058
Not used
Internal I/O registers
Not used
LCD RAM (16 bytes)
H'7FFF
H8000
Interrupt vector
H'F02F
H'F030
H'F09F
H'F0A0
H'F36F
H'F370
H'F36F
H'F370
H'0000
H'0057
H'0058
Not used
H'F02F
H'F030
Internal I/O registers
Not used
Interrupt vector
On-chip ROM
(40 kbytes)
Not used
H'F02F
H'F030
H'F09F
H'F0A0
H'F09F
H'F0A0
HD64338084R
(Masked ROM version)
HD64338085R
(Masked ROM version)
H'0000
H'0057
H'0058
On-chip RAM
(1 kbytes)
H'FF7F
H'FF80
Internal I/O registers
(128 bytes)
H'FFFF
Internal I/O registers
(128 bytes)
H'FFFF
Note: The areas from H'C000 to H'CFFF and from H'F380 to H'F77F are used by the on-chip debugger.
They are not available to the user when the on-chip debugger is being used.
Figure 2.1 Memory Map
Rev. 3.00 Aug 23, 2006 Page 26 of 616
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Section 2 CPU
2.2
Register Configuration
The H8/300H CPU has the internal registers shown in figure 2.2. There are two types of registers;
general registers and control registers. The control registers are a 24-bit program counter (PC), and
an 8-bit condition-code register (CCR).
General Registers (ERn)
15
0 7
0 7
0
ER0
E0
R0H
R0L
ER1
E1
R1H
R1L
ER2
E2
R2H
R2L
ER3
E3
R3H
R3L
ER4
E4
R4H
R4L
ER5
E5
R5H
R5L
ER6
E6
R6H
R6L
ER7
E7
R7H
R7L
(SP)
Control Registers (CR)
23
0
PC
7 6 5 4 3 2 1 0
CCR I UI H U N Z V C
[Legend]
SP:
PC:
CCR:
I:
UI:
Stack pointer
Program counter
Condition-code register
Interrupt mask bit
User bit
H:
U:
N:
Z:
V:
C:
Half-carry flag
User bit
Negative flag
Zero flag
Overflow flag
Carry flag
Figure 2.2 CPU Registers
Rev. 3.00 Aug 23, 2006 Page 27 of 616
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Section 2 CPU
2.2.1
General Registers
The H8/300H CPU has eight 32-bit general registers. These general registers are all functionally
identical and can be used as both address registers and data registers. When a general register is
used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. Figure 2.3 illustrates
the usage of the general registers. When the general registers are used as 32-bit registers or address
registers, they are designated by the letters ER (ER0 to ER7).
The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R
(R0 to R7). These registers are functionally equivalent, providing a maximum of sixteen 16-bit
registers. The E registers (E0 to E7) are also referred to as extended registers.
The R registers divide into 8-bit registers designated by the letters RH (R0H to R7H) and RL (R0L
to R7L). These registers are functionally equivalent, providing a maximum of sixteen 8-bit
registers.
The usage of each register can be selected independently.
• Address registers
• 32-bit registers
• 16-bit registers
• 8-bit registers
E registers (extended registers)
(E0 to E7)
ER registers
(ER0 to ER7)
RH registers
(R0H to R7H)
R registers
(R0 to R7)
RL registers
(R0L to R7L)
Figure 2.3 Usage of General Registers
General register ER7 has the function of the stack pointer (SP) in addition to its general-register
function, and is used implicitly in exception handling and subroutine calls. Figure 2.4 shows the
relationship between the stack pointer and the stack area.
Rev. 3.00 Aug 23, 2006 Page 28 of 616
REJ09B0182-0300
Section 2 CPU
Empty area
SP (ER7)
Stack area
Figure 2.4 Relationship between Stack Pointer and Stack Area
2.2.2
Program Counter (PC)
This 24-bit counter indicates the address of the next instruction the CPU will execute. The length
of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. (When an
instruction is fetched, the least significant PC bit is regarded as 0). The PC is initialized when the
start address is loaded by the vector address generated during reset exception-handling sequence.
2.2.3
Condition-Code Register (CCR)
This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and
half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. The I bit is initialized to 1
by reset exception-handling sequence, but other bits are not initialized.
Some instructions leave flag bits unchanged. Operations can be performed on the CCR bits by the
LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used as branching
conditions for conditional branch (Bcc) instructions.
For the action of each instruction on the flag bits, see Appendix A.1, Instruction List.
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Bit
Bit Name
Initial
Value
R/W
Description
7
I
1
R/W
Interrupt Mask Bit
Masks interrupts other than NMI when set to 1. NMI is
accepted regardless of the I bit setting. The I bit is set
to 1 at the start of an exception-handling sequence.
6
UI
Undefined R/W
User Bit
Can be written and read by software using the LDC,
STC, ANDC, ORC, and XORC instructions.
5
H
Undefined R/W
Half-Carry Flag
When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B,
or NEG.B instruction is executed, this flag is set to 1 if
there is a carry or borrow at bit 3, and cleared to 0
otherwise. When the ADD.W, SUB.W, CMP.W, or
NEG.W instruction is executed, the H flag is set to 1 if
there is a carry or borrow at bit 11, and cleared to 0
otherwise. When the ADD.L, SUB.L, CMP.L, or NEG.L
instruction is executed, the H flag is set to 1 if there is a
carry or borrow at bit 27, and cleared to 0 otherwise.
4
U
Undefined R/W
User Bit
Can be written and read by software using the LDC,
STC, ANDC, ORC, and XORC instructions.
3
N
Undefined R/W
Negative Flag
Stores the value of the most significant bit of data as a
sign bit.
2
Z
Undefined R/W
Zero Flag
Set to 1 to indicate zero data, and cleared to 0 to
indicate non-zero data.
1
V
Undefined R/W
Overflow Flag
Set to 1 when an arithmetic overflow occurs, and
cleared to 0 at other times.
0
C
Undefined R/W
Carry Flag
Set to 1 when a carry occurs, and cleared to 0
otherwise. Used by:
•
Add instructions, to indicate a carry
•
Subtract instructions, to indicate a borrow
•
Shift and rotate instructions, to indicate a carry
The carry flag is also used as a bit accumulator by bit
manipulation instructions.
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2.3
Data Formats
The H8/300H CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit
(longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2,
…, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two
digits of 4-bit BCD data.
2.3.1
General Register Data Formats
Figure 2.5 shows the data formats in general registers.
Data Type
General Register
Data Format
7
RnH
1-bit data
0
Don't care
7 6 5 4 3 2 1 0
7
1-bit data
RnL
4-bit BCD data
RnH
4-bit BCD data
RnL
Byte data
RnH
Don't care
7
4 3
Upper
0
7 6 5 4 3 2 1 0
0
Lower
Don't care
7
Don't care
7
4 3
Upper
0
Don't care
MSB
LSB
7
Byte data
RnL
0
Lower
0
Don't care
MSB
LSB
Figure 2.5 General Register Data Formats (1)
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Data Type
General
Register
Word data
Rn
Data Format
15
Word data
MSB
En
15
MSB
Longword
data
0
LSB
0
LSB
ERn
31
16 15
MSB
[Legend]
ERn: General register ER
En:
General register E
Rn:
General register R
RnH: General register RH
RnL: General register RL
MSB: Most significant bit
LSB: Least significant bit
Figure 2.5 General Register Data Formats (2)
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0
LSB
Section 2 CPU
2.3.2
Memory Data Formats
Figure 2.6 shows the data formats in memory. The H8/300H CPU can access word data and
longword data in memory, however word or longword data must begin at an even address. If an
attempt is made to access word or longword data at an odd address, an address error does not
occur, however the least significant bit of the address is regarded as 0, so access begins the
preceding address. This also applies to instruction fetches.
When ER7 (SP) is used as an address register to access the stack area, the operand size should be
word or longword.
Data Type
Address
Data Format
7
1-bit data
Address L
7
Byte data
Address L
MSB
Word data
Address 2M
MSB
0
6
5
4
3
2
Address 2N
0
LSB
LSB
Address 2M+1
Longword data
1
MSB
Address 2N+1
Address 2N+2
LSB
Address 2N+3
Figure 2.6 Memory Data Formats
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2.4
Instruction Set
2.4.1
Table of Instructions Classified by Function
The H8/300H CPU has 62 instructions. Tables 2.2 to 2.9 summarize the instructions in each
functional category. The notation used in tables 2.2 to 2.9 is defined in table 2.1.
Table 2.1
Operation Notation
Symbol
Description
Rd
General register (destination)*
Rs
General register (source)*
Rn
General register*
ERn
General register (32-bit register or address register)
(EAd)
Destination operand
(EAs)
Source operand
CCR
Condition-code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
PC
Program counter
SP
Stack pointer
#IMM
Immediate data
disp
Displacement
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
Logical AND
∨
Logical OR
⊕
Logical XOR
→
Move
¬
NOT (logical complement)
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Symbol
Description
:3/:8/:16/:24
3-, 8-, 16-, or 24-bit length
Note:
*
General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0
to R7, E0 to E7), and 32-bit registers/address register (ER0 to ER7).
Table 2.2
Data Transfer Instructions
Instruction
Size*
Function
MOV
B/W/L
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
MOVFPE
B
(EAs) → Rd
Cannot be used in this LSI.
MOVTPE
B
Rs → (EAs)
Cannot be used in this LSI.
POP
W/L
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn.
PUSH
W/L
Rn → @–SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
Note:
*
Refers to the operand size.
B: Byte
W: Word
L: Longword
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Table 2.3
Arithmetic Operations Instructions (1)
Instruction
Size*
Function
ADD
SUB
B/W/L
Rd ± Rs → Rd, Rd ± #IMM → Rd
Performs addition or subtraction on data in two general registers, or on
immediate data and data in a general register (immediate byte data
cannot be subtracted from byte data in a general register. Use the SUBX
or ADD instruction.)
ADDX
SUBX
B
Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Performs addition or subtraction with carry on byte data in two general
registers, or on immediate data and data in a general register.
INC
DEC
B/W/L
Rd ± 1 → Rd, Rd ± 2 → Rd
Increments or decrements a general register by 1 or 2. (Byte operands
can be incremented or decremented by 1 only.)
ADDS
SUBS
L
Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd
Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register.
DAA
DAS
B
Rd (decimal adjust) → Rd
Decimal-adjusts an addition or subtraction result in a general register by
referring to the CCR to produce 4-bit BCD data.
MULXU
B/W
Rd × Rs → Rd
Performs unsigned multiplication on data in two general registers: either
8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
MULXS
B/W
Rd × Rs → Rd
Performs signed multiplication on data in two general registers: either 8
bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
DIVXU
B/W
Rd ÷ Rs → Rd
Performs unsigned division on data in two general registers: either 16
bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits →
16-bit quotient and 16-bit remainder.
Note:
*
Refers to the operand size.
B: Byte
W: Word
L: Longword
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Table 2.3
Arithmetic Operations Instructions (2)
Instruction
Size*
Function
DIVXS
B/W
Rd ÷ Rs → Rd
Performs signed division on data in two general registers: either 16 bits ÷
8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit
quotient and 16-bit remainder.
CMP
B/W/L
Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general register
or with immediate data, and sets CCR bits according to the result.
NEG
B/W/L
0 – Rd → Rd
Takes the two's complement (arithmetic complement) of data in a
general register.
EXTU
W/L
Rd (zero extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by padding with zeros on the
left.
EXTS
W/L
Rd (sign extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by extending the sign bit.
Note:
*
Refers to the operand size.
B: Byte
W: Word
L: Longword
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Table 2.4
Logic Operations Instructions
Instruction
Size*
Function
AND
B/W/L
Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register and another
general register or immediate data.
OR
B/W/L
Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another
general register or immediate data.
XOR
B/W/L
Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register and
another general register or immediate data.
NOT
B/W/L
¬ (Rd) → (Rd)
Takes the one's complement (logical complement) of general register
contents.
Note:
*
Refers to the operand size.
B: Byte
W: Word
L: Longword
Table 2.5
Shift Instructions
Instruction
Size*
Function
SHAL
SHAR
B/W/L
Rd (shift) → Rd
Performs an arithmetic shift on general register contents.
SHLL
SHLR
B/W/L
Rd (shift) → Rd
Performs a logical shift on general register contents.
ROTL
ROTR
B/W/L
Rd (rotate) → Rd
Rotates general register contents.
ROTXL
ROTXR
B/W/L
Rd (rotate) → Rd
Rotates general register contents through the carry flag.
Note:
*
Refers to the operand size.
B: Byte
W: Word
L: Longword
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Table 2.6
Bit Manipulation Instructions (1)
Instruction
Size*
Function
BSET
B
1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory operand to 1. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BCLR
B
0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory operand to 0. The
bit number is specified by 3-bit immediate data or the lower three bits of
a general register.
BNOT
B
¬ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory operand. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BTST
B
¬ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory operand and sets or
clears the Z flag accordingly. The bit number is specified by 3-bit
immediate data or the lower three bits of a general register.
BAND
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIAND
B
C ∧ ¬ (<bit-No.> of <EAd>) → C
ANDs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag.
BOR
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIOR
B
C ∨ ¬ (<bit-No.> of <EAd>) → C
ORs the carry flag with the inverse of a specified bit in a general register
or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
The bit number is specified by 3-bit immediate data.
Note:
*
Refers to the operand size.
B: Byte
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Table 2.6
Bit Manipulation Instructions (2)
Instruction
Size*
Function
BXOR
B
C ⊕ (<bit-No.> of <EAd>) → C
XORs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIXOR
B
C ⊕ ¬ (<bit-No.> of <EAd>) → C
XORs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BLD
B
(<bit-No.> of <EAd>) → C
Transfers a specified bit in a general register or memory operand to the
carry flag.
BILD
B
¬ (<bit-No.> of <EAd>) → C
Transfers the inverse of a specified bit in a general register or memory
operand to the carry flag.
The bit number is specified by 3-bit immediate data.
BST
B
C → (<bit-No.> of <EAd>)
Transfers the carry flag value to a specified bit in a general register or
memory operand.
BIST
B
¬ C → (<bit-No.> of <EAd>)
Transfers the inverse of the carry flag value to a specified bit in a general
register or memory operand.
The bit number is specified by 3-bit immediate data.
Note:
*
Refers to the operand size.
B: Byte
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Table 2.7
Branch Instructions
Instruction
Size
Function
Bcc*

Branches to a specified address if a specified condition is true. The
branching conditions are listed below.
Mnemonic
Description
Condition
BRA(BT)
Always (true)
Always
BRN(BF)
Never (false)
Never
BHI
High
C∨Z=0
BLS
Low or same
C∨Z=1
BCC(BHS)
Carry clear
(high or same)
C=0
BCS(BLO)
Carry set (low)
C=1
BNE
Not equal
Z=0
BEQ
Equal
Z=1
BVC
Overflow clear
V=0
BVS
Overflow set
V=1
BPL
Plus
N=0
BMI
Minus
N=1
BGE
Greater or equal
N⊕V=0
BLT
Less than
N⊕V=1
BGT
Greater than
Z∨(N ⊕ V) = 0
BLE
Less or equal
Z∨(N ⊕ V) = 1
JMP

Branches unconditionally to a specified address.
BSR

Branches to a subroutine at a specified address.
JSR

Branches to a subroutine at a specified address.
RTS

Returns from a subroutine
Note:
*
Bcc is the general name for conditional branch instructions.
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Table 2.8
System Control Instructions
Instruction
Size*
Function
RTE

Returns from an exception-handling routine.
SLEEP

Causes a transition to a power-down state.
LDC
B/W
(EAs) → CCR
Moves the source operand contents to the CCR. The CCR size is one
byte, but in transfer from memory, data is read by word access.
STC
B/W
CCR → (EAd)
Transfers the CCR contents to a destination location. The condition code
register size is one byte, but in transfer to memory, data is written by
word access.
ANDC
B
CCR ∧ #IMM → CCR
Logically ANDs the CCR with immediate data.
ORC
B
CCR ∨ #IMM → CCR
Logically ORs the CCR with immediate data.
XORC
B
CCR ⊕ #IMM → CCR
Logically XORs the CCR with immediate data.
NOP

PC + 2 → PC
Only increments the program counter.
Note:
*
Refers to the operand size.
B: Byte
W: Word
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Table 2.9
Block Data Transfer Instructions
Instruction
Size
Function
EEPMOV.B

if R4L ≠ 0 then
Repeat @ER5+ → @ER6+,
R4L–1 → R4L
Until R4L = 0
else next;
EEPMOV.W

if R4 ≠ 0 then
Repeat @ER5+ → @ER6+,
R4–1 → R4
Until R4 = 0
else next;
Transfers a data block. Starting from the address set in ER5, transfers
data for the number of bytes set in R4L or R4 to the address location set
in ER6.
Execution of the next instruction begins as soon as the transfer is
completed.
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2.4.2
Basic Instruction Formats
H8/300H CPU instructions consist of 2-byte (1-word) units. An instruction consists of an
operation field (op), a register field (r), an effective address extension (EA), and a condition field
(cc).
Figure 2.7 shows examples of instruction formats.
(1)
Operation Field
Indicates the function of the instruction, the addressing mode, and the operation to be carried out
on the operand. The operation field always includes the first four bits of the instruction. Some
instructions have two operation fields.
(2)
Register Field
Specifies a general register. Address registers are specified by 3 bits, and data registers by 3 bits or
4 bits. Some instructions have two register fields. Some have no register field.
(3)
Effective Address Extension
8, 16, or 32 bits specifying immediate data, an absolute address, or a displacement. A24-bit
address or displacement is treated as a 32-bit data in which the first 8 bits are 0 (H'00).
(4)
Condition Field
Specifies the branching condition of Bcc instructions.
(1) Operation field only
op
NOP, RTS, etc.
(2) Operation field and register fields
op
rm
rn
ADD.B Rn, Rm, etc.
(3) Operation field, register fields, and effective address extension
op
rn
rm
MOV.B @(d:16, Rn), Rm
EA(disp)
(4) Operation field, effective address extension, and condition field
op
cc
EA(disp)
BRA d:8
Figure 2.7 Instruction Formats
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2.5
Addressing Modes and Effective Address Calculation
The following describes the H8/300H CPU. In this LSI, the upper eight bits are ignored in the
generated 24-bit address, so the effective address is 16 bits.
2.5.1
Addressing Modes
The H8/300H CPU supports the eight addressing modes listed in table 2.10. Each instruction uses
a subset of these addressing modes. Addressing modes that can be used differ depending on the
instruction. For details, refer to Appendix A.4, Combinations of Instructions and Addressing
Modes.
Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer
instructions can use all addressing modes except program-counter relative and memory indirect.
Bit-manipulation instructions use register direct, register indirect, or the absolute addressing mode
(@aa:8) to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST instructions)
or immediate (3-bit) addressing mode to specify a bit number in the operand.
Table 2.10 Addressing Modes
No.
Addressing Mode
Symbol
1
Register direct
Rn
2
Register indirect
@ERn
3
Register indirect with displacement
@(d:16,ERn)/@(d:24,ERn)
4
Register indirect with post-increment
Register indirect with pre-decrement
@ERn+
@–ERn
5
Absolute address
@aa:8/@aa:16/@aa:24
6
Immediate
#xx:8/#xx:16/#xx:32
7
Program-counter relative
@(d:8,PC)/@(d:16,PC)
8
Memory indirect
@@aa:8
(1)
Register Direct
Rn
The register field of the instruction specifies an 8-, 16-, or 32-bit general register containing the
operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7
can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers.
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(2)
Register Indirect
@ERn
The register field of the instruction code specifies an address register (ERn), the lower 24 bits of
which contain the address of the operand on memory.
(3)
Register Indirect with Displacement
@(d:16, ERn) or @(d:24, ERn)
A 16-bit or 24-bit displacement contained in the instruction is added to an address register (ERn)
specified by the register field of the instruction, and the lower 24 bits of the sum the address of a
memory operand. A 16-bit displacement is sign-extended when added.
(4)
Register Indirect with Post-Increment or Pre-Decrement
@ERn+ or @-ERn
• Register indirect with post-increment@ERn+
The register field of the instruction code specifies an address register (ERn) the lower 24 bits
of which contains the address of a memory operand. After the operand is accessed, 1, 2, or 4 is
added to the address register contents (32 bits) and the sum is stored in the address register.
The value added is 1 for byte access, 2 for word access, or 4 for longword access. For the word
or longword access, the register value should be even.
• Register indirect with pre-decrement@-ERn
The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field
in the instruction code, and the lower 24 bits of the result is the address of a memory operand.
The result is also stored in the address register. The value subtracted is 1 for byte access, 2 for
word access, or 4 for longword access. For the word or longword access, the register value
should be even.
(5)
Absolute Address
@aa:8, @aa:16, @aa:24
The instruction code contains the absolute address of a memory operand. The absolute address
may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24)
For an 8-bit absolute address, the upper 16 bits are all assumed to be 1 (H'FFFF). For a 16-bit
absolute address the upper 8 bits are a sign extension. A 24-bit absolute address can access the
entire address space.
The access ranges of absolute addresses for this LSI are those shown in table 2.11, because the
upper 8 bits are ignored.
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Table 2.11 Absolute Address Access Ranges
Absolute Address
Access Range
8 bits (@aa:8)
H'FF00 to H'FFFF
16 bits (@aa:16)
H'0000 to H'FFFF
24 bits (@aa:24)
H'0000 to H'FFFF
(6)
Immediate
#xx:8, #xx:16, or #xx:32
The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an
operand.
The ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. Some bit
manipulation instructions contain 3-bit immediate data in the instruction code, specifying a bit
number.
(7)
Program-Counter Relative
@(d:8, PC) or @(d:16, PC)
This mode is used in the BSR instruction. An 8-bit or 16-bit displacement contained in the
instruction is sign-extended and added to the 24-bit PC contents to generate a branch address. The
PC value to which the displacement is added is the address of the first byte of the next instruction,
so the possible branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to +32768
bytes (–16383 to +16384 words) from the branch instruction. The resulting value should be an
even number.
(8)
Memory Indirect
@@aa:8
This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit
absolute address specifying a memory operand. This memory operand contains a branch address.
The memory operand is accessed in words, generating a 16-bit branch address. Figure 2.8 shows
how to specify branch address for in memory indirect mode. The upper bits of the absolute address
are all assumed to be 0, so the address range is 0 to 255 (H'0000 to H'00FF).
Note that the first part of the address range is also the exception vector area.
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Specified
by @aa:8
Branch address
Figure 2.8 Branch Address Specification in Memory Indirect Mode
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2.5.2
Effective Address Calculation
Table 2.12 indicates how effective addresses are calculated in each addressing mode. In this LSI
the upper 8 bits of the effective address are ignored in order to generate a 16-bit effective address.
Table 2.12 Effective Address Calculation (1)
No
1
Addressing Mode and Instruction Format
op
2
Effective Address Calculation
Effective Address (EA)
Register direct(Rn)
rm
Operand is general register contents.
rn
Register indirect(@ERn)
0
31
23
0
23
0
23
0
23
0
General register contents
op
3
r
Register indirect with displacement
@(d:16,ERn) or @(d:24,ERn)
0
31
General register contents
op
r
disp
0
31
Sign extension
4
Register indirect with post-increment or
pre-decrement
•Register indirect with post-increment @ERn+
op
0
31
General register contents
r
•Register indirect with pre-decrement @-ERn
disp
1, 2, or 4
31
0
General register contents
op
r
1, 2, or 4
The value to be added or subtracted is 1 when the
operand is byte size, 2 for word size, and 4 for
longword size.
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Table 2.12 Effective Address Calculation (2)
No
5
Addressing Mode and Instruction Format
Effective Address Calculation
Effective Address (EA)
Absolute address
@aa:8
8 7
23
op
abs
0
H'FFFF
@aa:16
23
op
abs
16 15
0
Sign extension
@aa:24
op
0
23
abs
6
Immediate
#xx:8/#xx:16/#xx:32
op
7
Operand is immediate data.
IMM
23
Program-counter relative
0
PC contents
@(d:8,PC)/@(d:16,PC)
op
disp
23
0
Sign
extension
8
disp
23
0
Memory indirect @@aa:8
23
op
abs
8 7
0
abs
H'0000
15
0
Memory contents
[Legend]
r, rm,rn :
op :
disp :
IMM :
abs :
Register field
Operation field
Displacement
Immediate data
Absolute address
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23
16 15
H'00
0
Section 2 CPU
2.6
Basic Bus Cycle
CPU operation is synchronized by a system clock (φ) or a subclock (φSUB). The period from a rising
edge of φ or φSUB to the next rising edge is called one state. A bus cycle consists of two states or
three states. The cycle differs depending on whether access is to on-chip memory or to on-chip
peripheral modules.
2.6.1
Access to On-Chip Memory (RAM, ROM)
Access to on-chip memory takes place in two states. The data bus width is 16 bits, allowing access
in byte or word size. Figure 2.9 shows the on-chip memory access cycle.
Bus cycle
T1 state
T2 state
φor φ SUB
Internal address bus
Address
Internal read signal
Internal data bus
(read access)
Read data
Internal write signal
Internal data bus
(write access)
Write data
Figure 2.9 On-Chip Memory Access Cycle
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2.6.2
On-Chip Peripheral Modules
On-chip peripheral modules are accessed in two states or three states. The data bus width is 8 bits
or 16 bits depending on the register. For description on the data bus width and number of
accessing states of each register, refer to section 24.1, Register Addresses (Address Order).
Registers with 16-bit data bus width can be accessed by word size only. Registers with 8-bit data
bus width can be accessed by byte or word size. When a register with 8-bit data bus width is
accessed by word size, a bus cycle occurs twice. In two-state access, the operation timing is the
same as that for on-chip memory.
Figure 2.10 shows the operation timing in the case of three-state access to an on-chip peripheral
module.
Bus cycle
T1 state
T2 state
T3 state
φ or φ SUB
Internal
address bus
Address
Internal
read signal
Internal
data bus
(read access)
Read data
Internal
write signal
Internal
data bus
(write access)
Write data
Figure 2.10 On-Chip Peripheral Module Access Cycle (3-State Access)
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Section 2 CPU
2.7
CPU States
There are four CPU states: the reset state, program execution state, program halt state, and
exception-handling state. The program execution state includes active (high-speed or mediumspeed) mode and subactive mode. For the program halt state, there are sleep (high-speed or
medium-speed) mode, standby mode, watch mode, and subsleep mode. These states are shown in
figure 2.11. Figure 2.12 shows the state transitions. For details on program execution state and
program halt state, refer to section 6, Power-Down Modes. For details on exception handling, refer
to section 3, Exception Handling.
Reset state
The CPU is initialized
Program execution state
Active (high-speed) mode
The CPU executes successive program
instructions at high speed,
synchronized by the system clock
Active (medium-speed) mode
The CPU executes successive
program instructions at
reduced speed, synchronized
by the system clock
Subactive mode
The CPU executes successive
program instructions at reduced
speed, synchronized by the subclock
Program halt state
A state in which the CPU
operation is stopped to
reduce power consumption
Sleep (high-speed) mode
Power-down modes
CPU state
Sleep (medium-speed) mode
Standby mode
Watch mode
Subsleep mode
Exception-handling state
A transient state in which the CPU changes
the processing flow due to a reset or an interrupt
Figure 2.11 CPU Operating States
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Reset cleared
Reset state
Exception-handling state
Reset occurs
Reset
occurs
Reset
occurs
Interrupt
source
Program halt state
Interrupt
source
Exceptionhandling
complete
Program execution state
SLEEP instruction executed
Figure 2.12 State Transitions
2.8
Usage Notes
2.8.1
Notes on Data Access to Empty Areas
The address space of this LSI includes empty areas in addition to the ROM, RAM, and on-chip
I/O registers areas available to the user. When data is transferred from CPU to empty areas, the
transferred data will be lost. This action may also cause the CPU to malfunction. When data is
transferred from an empty area to CPU, the contents of the data cannot be guaranteed.
2.8.2
EEPMOV Instruction
EEPMOV is a block-transfer instruction and transfers the byte size of data indicated by R4L,
which starts from the address indicated by R5, to the address indicated by R6. Set R4L and R6 so
that the end address of the destination address (value of R6 + R4L) does not exceed H'FFFF (the
value of R6 must not change from H'FFFF to H'0000 during execution).
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2.8.3
Bit-Manipulation Instruction
The BSET, BCLR, BNOT, BST, and BIST instructions read data from the specified address in
byte units, manipulate the data of the target bit, and write data to the same address again in byte
units. Special care is required when using these instructions in cases where two registers are
assigned to the same address, or when a bit is directly manipulated for a port or a register
containing a write-only bit, because this may rewrite data of a bit other than the bit to be
manipulated.
(1)
Bit manipulation for two registers assigned to the same address
Example 1: Bit manipulation for the timer load register and timer counter
Figure 2.13 shows an example of a timer in which two timer registers are assigned to the same
address. When a bit-manipulation instruction accesses the timer load register and timer counter of
a reloadable timer, since these two registers share the same address, the following operations takes
place.
1. Data is read in byte units.
2. The CPU sets or resets the bit to be manipulated with the bit-manipulation instruction.
3. The written data is written again in byte units to the timer load register.
The timer is counting, so the value read is not necessarily the same as the value in the timer load
register. As a result, bits other than the intended bit in the timer counter may be modified and the
modified value may be written to the timer load register.
Read
Count clock
Timer counter
Reload
Write
Timer load register
Internal data bus
Figure 2.13 Example of Timer Configuration with Two Registers Allocated to Same
Address
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Example 2: When the BSET instruction is executed for port 5
P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at
P56. P55 to P50 are output pins and output low-level signals. An example to output a high-level
signal at P50 with a BSET instruction is shown below.
• Prior to executing BSET instruction
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
0
• BSET instruction executed instruction
BSET
#0,
@PDR5
The BSET instruction is executed for port 5.
• After executing BSET instruction
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5
0
0
1
1
1
1
1
1
PDR5
0
1
0
0
0
0
0
1
• Description on operation
1. When the BSET instruction is executed, first the CPU reads port 5.
Since P57 and P56 are input pins, the CPU reads the pin states (low-level and high-level
input).
P55 to P50 are output pins, so the CPU reads the value in PDR5. In this example PDR5 has a
value of H'80, but the value read by the CPU is H'40.
2. Next, the CPU sets bit 0 of the read data to 1, changing the PDR5 data to H'41.
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3. Finally, the CPU writes H'41 to PDR5, completing execution of BSET instruction.
As a result of the BSET instruction, bit 0 in PDR5 becomes 1, and P50 outputs a high-level
signal. However, bits 7 and 6 of PDR5 end up with different values. To prevent this problem,
store a copy of the PDR5 data in a work area in memory. Perform the bit manipulation on the
data in the work area, then write this data to PDR5.
• Prior to executing BSET instruction
MOV.B
MOV.B
MOV.B
#H'80, R0L
R0L,
@RAM0
R0L,
@PDR5
The PDR5 value (H'80) is written to a work area in
memory (RAM0) as well as to PDR5.
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
0
RAM0
1
0
0
0
0
0
0
0
• BSET instruction executed
BSET
#0,
@RAM0
The BSET instruction is executed designating the PDR5
work area (RAM0).
• After executing BSET instruction
MOV.B
MOV.B
@RAM0, R0L
R0L, @PDR5
The work area (RAM0) value is written to PDR5.
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
1
RAM0
1
0
0
0
0
0
0
1
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Section 2 CPU
(2)
Bit Manipulation in a Register Containing a Write-Only Bit
Example 3: BCLR instruction executed designating port 5 control register PCR5
P57 and P56 are input pins, with a low-level signal input at P57 and a high-level signal input at
P56. P55 to P50 are output pins that output low-level signals. An example of setting the P50 pin as
an input pin by the BCLR instruction is shown below. It is assumed that a high-level signal will be
input to this input pin.
• Prior to executing BCLR instruction
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
0
• BCLR instruction executed
BCLR
#0,
@PCR5
The BCLR instruction is executed for PCR5.
• After executing BCLR instruction
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Output
Output
Output
Output
Output
Output
Output
Input
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5
1
1
1
1
1
1
1
0
PDR5
1
0
0
0
0
0
0
0
• Description on operation
1. When the BCLR instruction is executed, first the CPU reads PCR5. Since PCR5 is a write-only
register, the CPU reads a value of H'FF, even though the PCR5 value is actually H'3F.
2. Next, the CPU clears bit 0 in the read data to 0, changing the data to H'FE.
3. Finally, H'FE is written to PCR5 and BCLR instruction execution ends.
As a result of this operation, bit 0 in PCR5 becomes 0, making P50 an input port. However,
bits 7 and 6 in PCR5 change to 1, so that P57 and P56 change from input pins to output pins.
To prevent this problem, store a copy of the PDR5 data in a work area in memory and
manipulate data of the bit in the work area, then write this data to PDR5.
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Section 2 CPU
• Prior to executing BCLR instruction
MOV.B
MOV.B
MOV.B
#H'3F, R0L
R0L,
@RAM0
R0L,
@PCR5
The PCR5 value (H'3F) is written to a work area in
memory (RAM0) as well as to PCR5.
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR5
0
0
1
1
1
1
1
1
PDR5
1
0
0
0
0
0
0
0
RAM0
0
0
1
1
1
1
1
1
• BCLR instruction executed
BCLR
#0,
@RAM0
The BCLR instructions executed for the PCR5 work area
(RAM0).
• After executing BCLR instruction
MOV.B
MOV.B
@RAM0, R0L
R0L, @PCR5
The work area (RAM0) value is written to PCR5.
P57
P56
P55
P54
P53
P52
P51
P50
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR5
0
0
1
1
1
1
1
0
PDR5
1
0
0
0
0
0
0
0
RAM0
0
0
1
1
1
1
1
0
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Section 2 CPU
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Section 3 Exception Handling
Section 3 Exception Handling
Exception handling may be caused by a reset or interrupts.
• Reset
A reset has the highest exception priority. Exception handling starts as soon as the reset is
cleared by the RES pin. The chip is also reset when the watchdog timer overflows, and
exception handling starts. Exception handling is the same as exception handling by the RES
pin.
• Interrupts
External interrupts other than NMI and internal interrupts other than address break are masked
by the I bit in CCR, and kept masked while the I bit is set to 1. Exception handling starts when
the current instruction or exception handling ends, if an interrupt request has been issued.
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Section 3 Exception Handling
3.1
Exception Sources and Vector Address
Table 3.1 shows the vector addresses and priority of each exception handling. When more than
one interrupt is requested, handling is performed from the interrupt with the highest priority.
Table 3.1
Exception Sources and Vector Address
Source Origin
Exception Sources
Vector
Number
Vector Address
Priority
Reset
RES, Watchdog Timer
0
H'0000 to H'0001
High
Reserved for
system use
Break instructions
1
H'0002 to H'0003
Reserved for
system use
Break interrupts
(mode transition)
2
H'0004 to H'0005
External interrupt
NMI
3
H'0006 to H'0007
Reserved for
system use
Break conditions satisfied
4
H'0008 to H'0009
Address break
Break conditions satisfied
5
H'000A to H'000B
External interrupts
Internal interrupts*
Note:
*
IRQ0
6
H'000C to H'000D
IRQ1
7
H'000E to H'000F
IRQAEC
8
H'0010 to H'0011
IRQ3
9
H'0012 to H'0013
IRQ4
10
H'0014 to H'0015
WKP0
11
H'0016 to H'0017
WKP1
12
H'0018 to H'0019
WKP2
13
H'001A to H'001B
WKP3
14
H'001C to H'001D
WKP4
15
H'001E to H'001F
WKP5
16
H'0020 to H'0021
WKP6
17
H'0022 to H'0023
WKP7
18
H'0024 to H'0025

19 to 43
H'0026 to H'0057
Low
For details on the vector table of internal interrupts, refer to section 4.5, Interrupt
Exception Handling Vector Table.
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Section 3 Exception Handling
3.2
Reset
A reset has the highest exception priority.
A reset can be triggered by three sources. These are listed in table 3.2.
Table 3.2
Reset Sources
Reset Source
Description
RES pin
Low-level input
Power-on reset circuit
Vcc rising edge
For details, see section 22, Power-On Reset Circuit.
Watchdog timer
Counter overflow
For details, see section 14, Watchdog Timer.
3.2.1
Reset Exception Handling
When a reset source occurs, all processing halts and the LSI enters the reset state. A reset
initializes the internal state of the CPU and the registers of on-chip peripheral modules.
To ensure that this LSI is reset using the RES pin, proceed as follows.
• At power-on, or if the system clock pulse generator is stopped
Hold the RES pin low until the operation of the clock pulse generator stabilizes.
• If the system clock pulse generator is running
Hold the RES pin for the duration of the tREL state specified in the electrical characteristics.
When a reset source is generated, reset exception handling starts and the LSI performs the
following operations.
1. The internal state of the CPU and the registers of the on-chip peripheral modules are initialized
and the I bit in CCR is set to 1.
2. The reset exception handling vector address (H'0000 and H'0001) is read and transferred to the
PC, and then program execution starts from the address indicated by the PC.
The reset exception handling sequence triggered by the RES pin is shown in figure 3.1.
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Section 3 Exception Handling
Reset cleared
Initial program
instruction prefetch
Vector fetch Internal
processing
RES
φ
Internal
address bus
(1)
(2)
Internal read
signal
Internal write
signal
Internal data
bus (16 bits)
(2)
(3)
(1) Reset exception handling vector address (H'0000)
(2) Program start address
(3) Initial program instruction
Figure 3.1 Reset Exception Handling Sequence
3.2.2
Interrupt Immediately after Reset
Immediately after a reset, if an interrupt is accepted before the stack pointer (SP) is initialized, PC
and CCR will not be pushed onto the stack correctly, resulting in program runaway. To prevent
this, immediately after reset exception handling all interrupts are masked. For this reason, the
initial program instruction is always executed immediately after a reset. This instruction should
initialize the stack pointer (e.g. MOV.L #xx: 32, SP).
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Section 3 Exception Handling
3.3
Interrupts
The interrupt sources include 14 external interrupts (NMI, IRQ0, IRQ1, IRQ3, IRQ4, IRQAEC,
and WKP7 to WKP0) and 26 internal interrupts (for the flash memory version) or 25 internal
interrupts (for the masked ROM version) from on-chip peripheral modules. Figure 3.2 shows the
interrupt sources and their numbers.
The on-chip peripheral modules which require interrupt sources are the watchdog timer (WDT),
address break, realtime clock (RTC), 16-bit timer pulse unit (TPU), asynchronous event counter
(AEC), timer F, serial communication interface (SCI), ∆Σ A/D converter, and A/D converter.
Interrupt vector addresses are allocated to individual sources.
NMI is an interrupt with the highest priority and accepted at all times. Interrupts are controlled by
the interrupt controller. The interrupt controller can set interrupts other than NMI to one of three
mask levels in order to control multiple interrupts. The interrupt priority registers A to E (IPRA to
IPRE) of the interrupt controller set the interrupt mask level.
For details on interrupts, see section 4, Interrupt Controller.
External interrupts
NMI (1)
IRQ0, IRQ1, IRQ3, IRQ4, and IRQAEC (5)
WKP0 to WKP7 (8)
Internal interrupts
WDT*1 (1)
Address break (1)
Realtime clock (8)
Asynchronous event counter (1)
16-bit timer pulse unit (6)
Timer F (2)
SCI3 (2)
SCI4*2 (1)
∆Σ A/D converter (1)
A/D converter (1)
SLEEP instruction execution (1)
IIC bus (1)
Interrupts
Notes: ( ) indicates the source number.
1. When the WDT is used as an interval timer, an interrupt request
is generated each time the counter overflows.
2. Available only for the F-ZTAT version.
Figure 3.2 Interrupt Sources and their Numbers
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Section 3 Exception Handling
3.4
Stack Status after Exception Handling
Figures 3.3 shows the stack after completion of interrupt exception handling.
SP – 4
SP (R7)
CCR
SP – 3
SP + 1
CCR*
SP – 2
SP + 2
PCH
SP – 1
SP + 3
PCL
SP (R7)
SP + 4
Even address
Stack area
Prior to start of interrupt
exception handling
PC and CCR
saved to stack
After completion of interrupt
exception handling
[Legend]
PCH : Upper 8 bits of program counter (PC)
PCL : Lower 8 bits of program counter (PC)
CCR: Condition code register
SP: Stack pointer
Notes: 1. PC shows the address of the first instruction to be executed upon return from the interrupt
handling routine.
2. Register contents must always be saved and restored by word length, starting from
an even-numbered address.
* Ignored when returning from the interrupt handling routine.
Figure 3.3 Stack Status after Exception Handling
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Section 3 Exception Handling
3.4.1
Interrupt Response Time
Table 3.3 shows the number of wait states after an interrupt request flag is set until the first
instruction of the interrupt handling-routine is executed.
Table 3.3
Interrupt Wait States
Item
States
Total
Waiting time for completion of executing instruction*
1 to 23
15 to 37
Saving of PC and CCR to stack
4
Vector fetch
2
Instruction fetch
4
Internal processing
4
Note:
*
Excluding EEPMOV instruction.
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Section 3 Exception Handling
3.5
Usage Notes
3.5.1
Notes on Stack Area Use
When word data is accessed in this LSI, the least significant bit of the address is regarded as 0.
Access to the stack always takes place in word size, so the stack pointer (SP: R7) should never
indicate an odd address. To save register values, use PUSH.W Rn (MOV.W Rn, @–SP) or
PUSH.L ERn (MOV.L ERn, @–SP). To restore register values, use POP.W Rn (MOV.W @SP+,
Rn) or POP.L ERn (MOV.L @SP+, ERn).
Setting an odd address in SP may cause a program to crash. An example is shown in figure 3.4.
SP →
SP →
PCH
PC L
R1L
PC L
SP →
H'FEFC
H'FEFD
H'FEFF
BSR instruction
SP set to H'FEFF
MOV. B R1L, @-R7
Stack accessed beyond SP
Contents of PCH are lost
[Legend]
PCH: Upper byte of program counter
PCL: Lower byte of program counter
R1L: General register R1L
SP: Stack pointer
Figure 3.4 Operation when Odd Address is Set in SP
During interrupt exception handling or when an RTE instruction is executed, CCR contents are
saved and restored in word size. Both the upper and lower bytes of word data are saved to the
stack; on return, the even address contents are restored to CCR while the odd address contents are
ignored.
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Section 3 Exception Handling
3.5.2
Notes on Rewriting Port Mode Registers
When a port mode register is rewritten to switch the functions of external interrupt pins and when
the value of the ECPWME bit in AEGSR is rewritten to switch between selection and nonselection of IRQAEC, the following points should be observed.
When a pin function is switched by rewriting a port mode register that controls an external
interrupt pin (IRQ4, IRQ3, IRQ1, IRQ0, or WKP7 to WKP0), the interrupt request flag is set to 1
at the time the pin function is switched, even if no valid interrupt is input at the pin. Be sure to
clear the interrupt request flag to 0 after switching the pin function. When the value of the
ECPWME bit in AEGSR that sets selection or non-selection of IRQAEC is rewritten, the interrupt
request flag may be set to 1, even if a valid edge has not arrived on the selected IRQAEC or
IECPWM (PWM output for the asynchronous event counter). Therefore, be sure to clear the
interrupt request flag to 0 after switching the pin function.
Table 3.4 shows the conditions under which interrupt request flags are set to 1 in this way.
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Section 3 Exception Handling
Table 3.4
Conditions under which Interrupt Request Flag is Set to 1
Interrupt Request
Flags Set to 1
IRR1
IRRI4
Conditions
When the IRQ4 bit in PMR9 is changed from 0 to 1 while the IRQ4 pin is
low and the IEG4 bit in IEGR is 0.
When the IRQ4 bit in PMR9 is changed from 1 to 0 while the IRQ4 pin is
low and the IEG4 bit in IEGR is 1.
IRRI3
When the IRQ3 bit in PMRB is changed from 0 to 1 while the IRQ3 pin is
low and the IEG3 bit in IEGR is 0.
When the IRQ3 bit in PMRB is changed from 1 to 0 while the IRQ3 pin is
low and the IEG3 bit in IEGR is 1.
IRREC2
When an edge as designated by the AIEGS1 and AIEGS0 bits in AEGSR
is detected because the values of the IRQAEC pin and of IECPWM at
switching are different (e.g., when the rising edge has been selected and
the ECPWME bit in AEGSR is changed from 1 to 0 while the IRQAEC pin
is low and IECPWM is 1).
IRRI1
When the IRQ1 bit in PMRB is changed from 0 to 1 while the IRQ1 pin is
low and the IEG1 bit in IEGR is 0.
When the IRQ1 bit in PMRB is changed from 1 to 0 while the IRQ1 pin is
low and the IEG1 bit in IEGR is 1.
IRRI0
When the IRQ0 bit in PMRB is changed from 0 to 1 while the IRQ0 pin is
low and the IEG0 bit in IEGR is 0.
When the IRQ0 bit in PMRB is changed from 1 to 0 while the IRQ0 pin is
low and the IEG0 bit in IEGR is 1.
IWPR
IWPF7
When the WKP7 bit in PMR5 is changed from 0 to 1 while the WKP7 pin is
low.
IWPF6
When the WKP6 bit in PMR5 is changed from 0 to 1 while the WKP6 pin is
low.
IWPF5
When the WKP5 bit in PMR5 is changed from 0 to 1 while the WKP5 pin is
low.
IWPF4
When the WKP4 bit in PMR5 is changed from 0 to 1 while the WKP4 pin is
low.
IWPF3
When the WKP3 bit in PMR5 is changed from 0 to 1 while the WKP3 pin is
low.
IWPF2
When the WKP2 bit in PMR5 is changed from 0 to 1 while the WKP2 pin is
low.
IWPF1
When the WKP1 bit in PMR5 is changed from 0 to 1 while the WKP1 pin is
low.
IWPF0
When the WKP0 bit in PMR5 is changed from 0 to 1 while the WKP0 pin is
low.
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Section 3 Exception Handling
Figure 3.5 shows the procedure for setting a bit in a port mode register and clearing the interrupt
request flag. This procedure also applies to AEGSR setting.
When switching a pin function, mask the interrupt before setting the bit in the port mode register
(or AEGSR). After accessing the port mode register (or AEGSR), execute at least one instruction
(e.g., NOP), then clear the interrupt request flag from 1 to 0. If the instruction to clear the flag to 0
is executed immediately after the port mode register (or AEGSR) access without executing an
instruction, the flag will not be cleared.
An alternative method is to avoid the setting of interrupt request flags when pin functions are
switched by keeping the pins at the high level so that the conditions in table 3.3 are not satisfied.
However, the procedure in figure 3.5 is recommended because IECPWM is an internal signal and
determining its value is complicated.
I bit in CCR ← 1
Interrupts masked. (Another possibility
is to disable the relevant interrupt in the
interrupt enable register 1.)
Set port mode register (or AEGSR) bit
Execute NOP instruction
After setting the port mode register
(or AEGSR) bit, first execute at least
one instruction (e.g., NOP), then clear
the interrupt request flag to 0
Clear interrupt request flag to 0
I bit in CCR ← 0
Interrupt mask cleared
Figure 3.5 Port Mode Register (or AEGSR) Setting and Interrupt Request Flag
Clearing Procedure
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Section 3 Exception Handling
3.5.3
Method for Clearing Interrupt Request Flags
Use the recommended method given below when clearing the flags in interrupt request registers
(IRR1, IRR2, and IWPR).
• Recommended method
Use a single instruction to clear flags. The bit manipulation instruction and byte-size data
transfer instruction can be used. Two examples of program code for clearing IRRI1 (bit 1 in
IRR1) are given below.
BCLR
#1,
@IRR1:8
MOV.B R1L, @IRR1:8 (set the value of R1L to B'11111101)
• Example of a malfunction
When flags are cleared with multiple instructions, other flags might be cleared during
execution of the instructions, even though they are currently set, and this will cause a
malfunction.
Here is an example in which IRRI0 is cleared and disabled in the process of clearing IRRI1
(bit 1 in IRR1).
MOV.B @IRR1:8,R1L ......... IRRI0 = 0 at this time
AND.B #B'11111101,R1L ..... Here, IRRI0 = 1
MOV.B R1L,@IRR1:8 ......... IRRI0 is cleared to 0
In the above example, it is assumed that an IRQ0 interrupt is generated while the AND.B
instruction is executing.
The IRQ0 interrupt is disabled because, although the original objective is clearing IRRI1,
IRRI0 is also cleared.
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Section 4 Interrupt Controller
Section 4 Interrupt Controller
4.1
Features
This LSI controls interrupts by the interrupt controller. The interrupt controller has the following
features.
• Mask levels settable with IPR
An interrupt priority register (IPR) is provided for setting interrupt mask levels. Three mask
levels can be set for each module for all interrupts except NMI and address break.
• Interrupts can be enabled or disabled in three levels by the INTM1 and INTM0 bits in the
interrupt mask register (INTM).
• Fourteen external interrupts
NMI is the highest-priority interrupt, and is accepted at all times. Rising or falling edge
sensing can be selected for NMI. Rising or falling edge sensing can be selected for IRQ0,
IRQ1, IRQ3, IRQ4, and WKP0 to WKP7. Rising, falling, or both edge sensing can be selected
for IRQAEC.
A block diagram of the interrupt controller is shown in figure 4.1.
NMI/IRQ/
WKP input
External interrupt
input
IENR1
Interrupt request
Mask level
determination
Internal interrupt source
TPU, SCI, etc.
Vector number
I
CCR
............
INTM
IPR
[Legend]
IENR1:
IPR:
CCR:
INTM:
IRQ enable register 1
Interrupt priority register
Condition code register
Interrupt mask register
Figure 4.1 Block Diagram of Interrupt Controller
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Section 4 Interrupt Controller
4.2
Input/Output Pins
Table 4.1 shows the pin configuration of the interrupt controller.
Table 4.1
Pin Configuration
Name
I/O
Function
NMI
Input
Nonmaskable external interrupt pin
Rising or falling edge can be selected
IRQAEC
Input
Maskable external interrupt pin
Rising, falling, or both edges can be selected
IRQ4
Input
IRQ3
Input
Maskable external interrupt pins
Rising or falling edge can be selected
IRQ1
Input
IRQ0
Input
WKP7 to WKP0
Input
4.3
Maskable external interrupt pins
Accepted at a rising or falling edge
Register Descriptions
The interrupt controller has the following registers.
• Interrupt edge select register (IEGR)
• Wakeup edge select register (WEGR)
• Interrupt enable register 1 (IENR1)
• Interrupt enable register 2 (IENR2)
• Interrupt request register 1 (IRR1)
• Interrupt request register 2 (IRR2)
• Wakeup interrupt request register (IWPR)
• Interrupt priority register A (IPRA)
• Interrupt priority register B (IPRB)
• Interrupt priority register C (IPRC)
• Interrupt priority register D (IPRD)
• Interrupt priority register E (IPRE)
• Interrupt mask register (INTM)
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Section 4 Interrupt Controller
4.3.1
Interrupt Edge Select Register (IEGR)
IEGR selects the sense of an edge that generates interrupt requests of the NMI, TMIF, ADTRG,
IRQ4, IRQ3, IRQ1, and IRQ0 pins.
Bit
Bit Name
Initial
Value
R/W
Descriptions
7
NMIEG
0
R/W
NMI Edge Select
0: Detects a falling edge of the NMI pin input
1: Detects a rising edge of the NMI pin input
6
TMIFEG
0
R/W
TMIF Edge Select
0: Detects a falling edge of the TMIF pin input
1: Detects a rising edge of the TMIF pin input
5
ADTRGNEG 0
R/W
ADTRG Edge Select
0: Detects a falling edge of the ADTRG pin input
1: Detects a rising edge of the ADTRG pin input
4
IEG4
0
R/W
IRQ4 Edge Select
0: Detects a falling edge of the IRQ4 pin input
1: Detects a rising edge of the IRQ4 pin input
3
IEG3
0
R/W
IRQ3 Edge Select
0: Detects a falling edge of the IRQ3 pin input
1: Detects a rising edge of the IRQ3 pin input
2



1
IEG1
0
R/W
Reserved
IRQ1 Edge Select
0: Detects a falling edge of the IRQ1 pin input
1: Detects a rising edge of the IRQ1 pin input
0
IEG0
0
R/W
IRQ0 Edge Select
0: Detects a falling edge of the IRQ0 pin input
1: Detects a rising edge of the IRQ0 pin input
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4.3.2
Wakeup Edge Select Register (WEGR)
WEGR selects the sense of an edge that generates interrupt requests of the WKP7 to WKP0 pins.
Bit
Bit Name
Initial
Value
R/W
7
WKEGS7
0
R/W
Description
WKP7 Edge Select
0: Detects a falling edge of the WKP7 pin input
1: Detects a rising edge of the WKP7 pin input
6
WKEGS6
0
R/W
WKP6 Edge Select
0: Detects a falling edge of the WKP6 pin input
1: Detects a rising edge of the WKP6 pin input
5
WKEGS5
0
R/W
WKP5 Edge Select
0: Detects a falling edge of the WKP5 pin input
1: Detects a rising edge of the WKP5 pin input
4
WKEGS4
0
R/W
WKP4 Edge Select
0: Detects a falling edge of the WKP4 pin input
1: Detects a rising edge of the WKP4 pin input
3
WKEGS3
0
R/W
WKP3 Edge Select
0: Detects a falling edge of the WKP3 pin input
1: Detects a rising edge of the WKP3 pin input
2
WKEGS2
0
R/W
WKP2 Edge Select
0: Detects a falling edge of the WKP2 pin input
1: Detects a rising edge of the WKP2 pin input
1
WKEGS1
0
R/W
WKP1 Edge Select
0: Detects a falling edge of the WKP1 pin input
1: Detects a rising edge of the WKP1 pin input
0
WKEGS0
0
R/W
WKP0 Edge Select
0: Detects a falling edge of the WKP0 pin input
1: Detects a rising edge of the WKP0 pin input
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Section 4 Interrupt Controller
4.3.3
Interrupt Enable Register 1 (IENR1)
IENR1 enables the RTC, WKP7 to WKP0, IRQ0, IRQ1, IRQ3, IRQ4, and IRQAEC interrupts.
Bit
Bit Name
Initial
Value
R/W
7
IENRTC
0
R/W
Description
RTC Interrupt Request Enable
The RTC interrupt request is enabled when this bit is
set to 1.
6

1
R/W
Reserved
This bit is always read as 1.
5
IENWP
0
R/W
Wakeup Interrupt Request Enable
The WKP7 to WKP0 interrupt requests are enabled
when this bit is set to 1.
4
IEN4
0
R/W
IRQ4 Interrupt Request Enable
The IRQ4 interrupt request is enabled when this bit is
set to 1.
3
IEN3
0
R/W
IRQ3 Interrupt Request Enable
The IRQ3 interrupt request is enabled when this bit is
set to 1.
2
IENEC2
0
R/W
IRQAEC Interrupt Request Enable
The IRQAEC interrupt request is enabled when this bit
is set to 1.
1
IEN1
0
R/W
IRQ1 Interrupt Request Enable
The IRQ1 interrupt request is enabled when this bit is
set to 1.
0
IEN0
0
R/W
IRQ0 Interrupt Request Enable
The IRQ0 interrupt request is enabled when this bit is
set to 1.
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Section 4 Interrupt Controller
4.3.4
Interrupt Enable Register 2 (IENR2)
IENR2 enables the direct transition, A/D converter, timer F, and asynchronous event counter
interrupts.
Bit
Bit Name
Initial
Value
R/W
Description
7
IENDT
0
R/W
Direct Transition Interrupt Request Enable
The direct transition interrupt request is enabled when
this bit is set to 1.
6
IENAD
0
R/W
A/D Converter Interrupt Request Enable
The A/D converter interrupt request is enabled when
this bit is set to 1.
5
IENSAD
0
R/W
∆Σ A/D Converter Interrupt Request Enable
The ∆Σ A/D converter interrupt request is enabled
when this bit is set to 1.
4
—
1
R/W
Reserved
This bit is always read as 1.
3
IENTFH
0
R/W
Timer FH Interrupt Request Enable
The timer FH interrupt request is enabled when this bit
is set to 1.
2
IENTFL
0
R/W
Timer FL Interrupt Request Enable
The timer FL interrupt request is enabled when this bit
is set to 1.
1

1
R/W
Reserved
This bit is always read as 1.
0
IENEC
0
R/W
Asynchronous Event Counter Interrupt Request Enable
The asynchronous event counter interrupt request is
enabled when this bit is set to 1.
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Section 4 Interrupt Controller
4.3.5
Interrupt Request Register 1 (IRR1)
IRR1 indicates the IRQ0, IRQ1, IRQ3, IRQ4, and IRQAEC interrupt request status.
Bit
Initial
Bit Name Value
R/W
Description
7 to 5

All 1
R/W
Reserved
4
IRRI4
0
These bits are always read as 1.
R/(W)*
IRQ4 Interrupt Request Flag
[Setting condition]
When the IRQ4 pin is set as the interrupt input pin and
the specified edge is detected
[Clearing condition]
When 0 is written to this bit
3
IRRI3
0
R/(W)*
IRQ3 Interrupt Request Flag
[Setting condition]
When the IRQ3 pin is set as the interrupt input pin and
the specified edge is detected
[Clearing condition]
When 0 is written to this bit
2
IRREC2
0
R/(W)*
IRQAEC Interrupt Request Flag
[Setting condition]
When the IRQAEC pin is set as the interrupt input pin
and the specified edge is detected
[Clearing condition]
When 0 is written to this bit
1
IRRI1
0
R/(W)*
IRQ1 Interrupt Request Flag
[Setting condition]
When the IRQ1 pin is set as the interrupt input pin and
the specified edge is detected
[Clearing condition]
When 0 is written to this bit
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Section 4 Interrupt Controller
Bit
Initial
Bit Name Value
R/W
Description
0
IRRI0
R/(W)*
IRQ0 Interrupt Request Flag
0
[Setting condition]
When the IRQ0 pin is set as the interrupt input pin and
the specified edge is detected
[Clearing condition]
When 0 is written to this bit
Note:
4.3.6
*
Only a write of 0 for flag clearing is possible.
Interrupt Request Register 2 (IRR2)
IRR2 indicates the interrupt request status of the direct transition, A/D converter, timer F, and
asynchronous event counter.
Bit
Bit Name
Initial
Value
R/W
Description
7
IRRDT
0
R/(W)*
Direct Transition Interrupt Request Flag
[Setting condition]
When the SLEEP instruction is executed and direct
transition is made while the DTON bit in SYSCR2 is set
to 1
[Clearing condition]
When 0 is written to this bit
6
IRRAD
0
R/(W)*
A/D Converter Interrupt Request Flag
[Setting condition]
When A/D conversion ends
[Clearing condition]
When 0 is written to this bit
5
IRRSAD
0
R/(W)*
∆Σ A/D Converter Interrupt Request Flag
[Setting condition]
When ∆Σ A/D conversion ends
[Clearing condition]
When 0 is written to this bit
4

1
R/W
Reserved
This bit is always read as 1.
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Section 4 Interrupt Controller
Bit
Bit Name
Initial
Value
R/W
Description
3
IRRTFH
0
R/(W)*
Timer FH Interrupt Request Flag
[Setting condition]
When the timer FH compare match or overflow occurs
[Clearing condition]
When 0 is written to this bit
2
IRRTFL
0
R/(W)*
Timer FL Interrupt Request Flag
[Setting condition]
When the timer FL compare match or overflow occurs
[Clearing condition]
When 0 is written to this bit
1

1
R/W
0
IRREC
0
R/(W)*
Reserved
This bit is always read as 1.
Asynchronous Event Counter Interrupt Request Flag
[Setting condition]
When the asynchronous event counter overflows
[Clearing condition]
When 0 is written to this bit
Note:
*
Only a write of 0 for flag clearing is possible.
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Section 4 Interrupt Controller
4.3.7
Wakeup Interrupt Request Register (IWPR)
IWPR has the WKP7 to WKP0 interrupt request status flags.
Bit
Bit Name
Initial
Value
R/W
7
IWPF7
0
R/W
Description
WKP7 Interrupt Request Flag
[Setting condition]
When the WKP7 pin is set as the interrupt input pin and
the specified edge is detected
[Clearing condition]
When 0 is written to this bit
6
IWPF6
0
R/W
WKP6 Interrupt Request Flag
[Setting condition]
When the WKP6 pin is set as the interrupt input pin and
the specified edge is detected
[Clearing condition]
When 0 is written to this bit
5
IWPF5
0
R/W
WKP5 Interrupt Request Flag
[Setting condition]
When the WKP5 pin is set as the interrupt input pin and
the specified edge is detected
[Clearing condition]
When 0 is written to this bit
4
IWPF4
0
R/W
WKP4 Interrupt Request Flag
[Setting condition]
When the WKP4 pin is set as the interrupt input pin and
the specified edge is detected
[Clearing condition]
When 0 is written to this bit
3
IWPF3
0
R/W
WKP3 Interrupt Request Flag
[Setting condition]
When the WKP3 pin is set as the interrupt input pin and
the specified edge is detected
[Clearing condition]
When 0 is written to this bit
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Bit
Bit Name
Initial
Value
R/W
Description
2
IWPF2
0
R/W
WKP2 Interrupt Request Flag
[Setting condition]
When the WKP2 pin is set as the interrupt input pin and
the specified edge is detected
[Clearing condition]
When 0 is written to this bit
1
IWPF1
0
R/W
WKP1 Interrupt Request Flag
[Setting condition]
When the WKP1 pin is set as the interrupt input pin and
the specified edge is detected
[Clearing condition]
When 0 is written to this bit
0
IWPF0
0
R/W
WKP0 Interrupt Request Flag
[Setting condition]
When the WKP0 pin is set as the interrupt input pin and
the specified edge is detected
[Clearing condition]
When 0 is written to this bit
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Section 4 Interrupt Controller
4.3.8
Interrupt Priority Registers A to E (IPRA to IPRE)
IPR sets mask levels (levels 2 to 0) for interrupts other than NMI and address break. The
correspondence between interrupt sources and IPR settings is shown in table 4.2.
Setting a value in the range from H'0 to H'3 in the 2-bit groups of bits 7 and 6, 5 and 4, 3 and 2,
and 1 and 0 sets the mask level of the corresponding interrupt. Bits 3 to 0 in IPRE are reserved.
Bit
Initial
Bit Name Value
R/W
Description
7
IPRn7
0
R/W
6
IPRn6
0
R/W
Set the mask level of the corresponding interrupt
source.
00: Mask level 0 (Lowest)
01: Mask level 1
1*: Mask level 2 (Highest)
5
IPRn5
0
R/W
4
IPRn4
0
R/W
Set the mask level of the corresponding interrupt
source.
00: Mask level 0 (Lowest)
01: Mask level 1
1*: Mask level 2 (Highest)
3
IPRn3
0
R/W
2
IPRn2
0
R/W
Set the mask level of the corresponding interrupt
source.
00: Mask level 0 (Lowest)
01: Mask level 1
1*: Mask level 2 (Highest)
1
IPRn1
0
R/W
0
IPRn0
0
R/W
Set the mask level of the corresponding interrupt
source.
00: Mask level 0 (Lowest)
01: Mask level 1
1*: Mask level 2 (Highest)
[Legend]
*: Don't care.
n = A to E
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Section 4 Interrupt Controller
4.3.9
Interrupt Mask Register (INTM)
INTM is an 8-bit readable/writable register that controls 3-level interrupt masking depending on
the combination of the INTM0 and INTM1 bits.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 2

All 1
R/W
Reserved
1
INTM1
0
R/W
Set the interrupt mask level.
0
INTM0
0
R/W
1*: Mask an interrupt with mask level 1 or less
These bits are always read as 1.
01: Mask an interrupt with mask level 0
00: Accept all interrupts
[Legend]
*: Don't care.
4.4
Interrupt Sources
4.4.1
External Interrupts
There are 14 external interrupts: NMI, WKP7 to WKP0, IRQ4, IRQ3, IRQAEC, IRQ1, and IRQ0.
(1)
NMI Interrupt
NMI is the highest-priority interrupt, and is always accepted by the CPU regardless of the state of
the I bit in CCR. The NMIEG bit in IEGR can be used to select whether an interrupt is requested
at a rising edge or a falling edge on the NMI pin.
(2)
WKP7 to WKP0 Interrupts
WKP7 to WKP0 interrupts are requested by the rising or falling edge input signals at the WKP7 to
WKP0 pins.
When the rising or falling edge is input while the WKP7 to WKP0 pin functions are selected by
PMR5, the corresponding bit in IWPR is set to 1 and an interrupt request is generated.
Clearing the IENWP bit in IENR1 to 0 disables the wakeup interrupt request to be accepted.
Setting the I bit in CCR to 1 masks all interrupts.
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When exception handling for the WKP7 to WKP0 interrupts is accepted, the I bit in CCR is set to
1. The interrupt mask level can be set by IPR.
(3)
IRQ4, IRQ3, IRQ1, and IRQ0 Interrupts
IRQ4, IRQ3, IRQ1, and IRQ0 interrupts are requested by input signals at IRQ4, IRQ3, IRQ1, and
IRQ0 pins.
Using the IEG4, IEG3, IEG1, and IEG0 bits in IEGR, it is possible to select whether an interrupt
is generated by a rising or falling edge at IRQ4, IRQ3, IRQ1, and IRQ0 pins.
When the specified edge is input while the IRQ4, IRQ3, IRQ1, and IRQ0 pin functions are
selected by PMRB and PMR9, the corresponding bit in IRR1 is set to 1 and an interrupt request is
generated.
Clearing the IEN4, IEN3, IEN1, and IEN0 bits in IENR1 to 0 disables the interrupt request to be
accepted. Setting the I bit in CCR to 1 masks all interrupts.
The interrupt mask level can be set by IPR.
(4)
IRQAEC Interrupts
An IRQAEC interrupt is requested by an input signal at the IRQAEC pin or IECPWM (PWM
output for the asynchronous event counter). When the IRQAEC pin is used as an external interrupt
pin, clear the ECPWME bit in AEGSR to 0.
Using the AIEGS1 and AIEGS0 bits in AEGSR, it is possible to select whether an interrupt is
generated by a rising edge, falling edge, or both edges.
When the IENEC2 bit in IENR1 is set to 1 and the specified edge is input, the corresponding bit in
IRR1 is set to 1 and an interrupt request is generated.
When exception handling for the IRQAEC interrupt is accepted, the I bit in CCR is set to 1.
The interrupt mask level can be set by IPR.
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Section 4 Interrupt Controller
4.4.2
Internal Interrupts
Internal interrupts generated from the on-chip peripheral modules have the following features:
• For each on-chip peripheral module, there are flags that indicate the interrupt request status,
and enable bits that select enabling or disabling of these interrupts. Internal interrupts can be
controlled independently. If an enable bit is set to 1, an interrupt request is sent to the interrupt
controller.
• The interrupt mask level can be set by IPR.
4.5
Interrupt Exception Handling Vector Table
Table 4.2 shows interrupt exception handling sources, vector addresses, and interrupt priorities.
The lower the vector number, the higher the priority. The priority within a module is fixed. Mask
levels for interrupts other than NMI and address break can be modified by IPR.
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Section 4 Interrupt Controller
Table 4.2
Interrupt Sources, Vector Addresses, and Interrupt Priorities
Origin of
Interrupt Source
Name
Vector
Number
Vector Address
IPR
Priority
Reset
RES, Watchdog Timer
0
H'0000

High
NMI
NMI
3
H'0006
Address break
Break conditions satisfied
5
H'000A
External pins
IRQ0
6
H'000C
IPRA7, IPRA6
IRQ1
7
H'000E
IPRA5, IPRA4
IRQAEC
8
H'0010
IPRA3, IPRA2
IRQ3
9
H'0012
IPRA1, IPRA0
IRQ4
10
H'0014
WKP0
11
H'0016
WKP1
12
H'0018
WKP2
13
H'001A
WKP3
14
H'001C
WKP4
15
H'001E
WKP5
16
H'0020
WKP6
17
H'0022
WKP7
18
H'0024
0.25-second overflow
19
H'0026
0.5-second overflow
20
H'0028
Second periodic overflow
21
H'002A
Minute periodic overflow
22
H'002C
Hour periodic overflow
23
H'002E
Day-of-week periodic
overflow
24
H'0030
Week periodic overflow
25
H'0032
Free-running overflow
26
H'0034
RTC
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IPRB7, IPRB6
IPRB5, IPRB4
Low
Section 4 Interrupt Controller
Origin of
Interrupt Source
Vector
Number
Vector Address
IPR
Priority
WDT
WDT overflow (interval
timer)
27
H'0036
IPRB3, IPRB2
High
AEC
AEC overflow
28
H'0038
IPRB1, IPRB0
TPU_1
TG1A (TG1A input
capture/compare match)
29
H'003A
IPRC7, IPRC6
TG1B (TG1B input
capture/compare match)
30
H'003C
TCI1V (overflow 1)
31
H'003E
TG2A (TG2A input
capture/compare match)
32
H'0040
TG2B (TG2B input
capture/compare match)
33
H'0042
TCI2V (overflow 2)
34
H'0044
Timer FL compare match
Timer FL overflow
35
H'0046
Timer FH compare match
Timer FH overflow
36
H'0048
SCI4*
Receive data full/transmit 37
data empty
Transmit end/receive error
H'004A
IPRC1, IPRC0
SCI3_1
Transmit
completion/transmit data
empty
Receive data full/overrun
error
Framing error/parity error
38
H'004C
IPRD7, IPRD6
SCI3_2
Transmit
completion/transmit data
empty
Receive data full/overrun
error
Framing error/parity error
39
H'004E
IPRD5, IPRD4
IIC2
Transmit data
empty/transmit end
Receive data full/overrun
error
NACK detection
Arbitration/overrun error
40
H'0050
IPRD3, IPRD2
14-bit ∆Σ A/D
converter
A/D conversion end
41
H'0052
IPRD1, IPRD0
TPU_2
Timer F
Name
IPRC5, IPRC4
IPRC3, IPRC2
Low
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Section 4 Interrupt Controller
Origin of
Interrupt Source
10-bit A/D
converter
Name
Vector
Number
Vector Address
IPR
Priority
A/D conversion end
42
H'0054
IPRE7, IPRE6
High
43
H'0056
IPRE5, IPRE4
(SLEEP instruction Direct transition
execution)
Note:
*
4.6
Low
Supported only by the F-ZTAT version.
Operation
NMI and address break interrupts are accepted at all times except in the reset state. In the case of
IRQ interrupts, WKP interrupts, and on-chip peripheral module interrupts, an enable bit is
provided for each interrupt. Clearing an enable bit to 0 disables the corresponding interrupt
request. Interrupt sources for which the enable bits are set to 1 are controlled by the interrupt
controller.
Table 4.3 shows the interrupt control states. Figure 4.2 shows a flowchart of the interrupt
acceptance operation.
Four-level interrupt masking is controlled according to the combination of the I bit in CCR and the
INTM1 and INTM0 bits in INTM.
Table 4.3
Interrupt Control States
CCR
INTM
I
INTM1
INTM0
States
1
*
*
All interrupts other than NMI and address break are masked.
0
1
*
Interrupts with mask level 1 or less are masked.
0
1
Interrupts with mask level 0 are masked.
0
0
All interrupts are accepted.
[Legend]*: Don't care.
1. If an interrupt source whose enable bit is set to 1 occurs, an interrupt request is sent to the
interrupt controller.
2. The following control operations are performed by referencing the INTM1 and INTM0 bits in
INTM and the I bit in CCR.
•
When the I bit is set to 1, the interrupt request is held pending.
•
When the I bit is cleared to 0 and the INTM1 bit is set to 1, interrupts with mask level 1 or
below are held pending.
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Section 4 Interrupt Controller
•
When the I bit is cleared to 0, the INTM1 bit is cleared to 0, and the INTM0 bit is set to 1,
interrupt requests with mask level 0 are held pending.
•
When the I bit, INTM1 bit, and INTM0 bit are all cleared to 0, all interrupt requests are
accepted.
3. If contention occurs between interrupts that are not held pending by the INTM1 and INTM0
bits in the INTM register and the I bit in CCR, the interrupt with the highest priority as shown
in table 4.2 is selected, regardless of the IPR setting.
4. When the CPU accepts an interrupt request, it starts interrupt exception handling after
execution of the current instruction has been completed.
5. PC and CCR are saved to the stack area by interrupt exception handling.
6. Next, the I bit in CCR is set to 1. This masks all interrupts except NMI and address break.
7. The CPU generates a vector address for the accepted interrupt and starts interrupt handling by
reading the interrupt routine start address in the vector table.
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Section 4 Interrupt Controller
Program execution state
Interrupt generated?
No
Yes
Yes
NMI or address
break?
No
INTM1 = 0?
INTM0 = 0?
No
Yes
INTM1 = 0?
INTM0 = 1?
Yes
No
I = 0?
Mask level
1 or 2 interrupt?
Yes
No
No
Mask level 2
interrupt?
No
Yes
No
Yes
I = 0?
No
I = 0?
Yes
Yes
Save PC and CCR
→
I
Hold pending
1
Read vector address
Branch to interrupt
handling routine
Figure 4.2 Flowchart of Procedure Up to Interrupt Acceptance
4.6.1
Interrupt Exception Handling Sequence
Figure 4.3 shows the interrupt exception handling sequence. The example shown is for the case
where the program area and stack area are in external memory with 16-bit and 2-state access
space.
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(4)
High
(3)
(6)
(5)
Stack
(8)
(7)
(10)
(9)
Vector fetch
(6)(8): Saved PC and saved CCR
SP-4
(7):
(14):
First instruction of interrupt handling rou
Interrupt handling routine start address ((13) = (10)(12))
SP-2
(5):
(13):
(10)(12): Interrupt handling routine start address (Vector address contents)
Instruction prefetch address (Not executed.)
(14)
(13)
Instruction prefetch
of interrupt handling
routine
(3):
(12)
(11)
Internal
processing
(9)(11): Vector address
Instruction prefetch address (Not executed. This is the contents of the saved PC and the return address.)
(2)
(1)
Internal
processing
(2)(4): Instruction code (Not executed.)
(1):
Internal
data
bus
Internal
write
signal
Internal
read
signal
Internal
address
bus
Interrupt
request
signal
φ
Instruction
prefetch
Interrupt accepted
Interrupt level determination
Wait for end of instruction
Section 4 Interrupt Controller
Figure 4.3 Interrupt Exception Handling Sequence
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Section 4 Interrupt Controller
4.6.2
Interrupt Response Times
Table 4.4 shows interrupt response times − the interval between generation of an interrupt request
and execution of the first instruction in the interrupt handling routine.
Table 4.4
Interrupt Response Times (States)
No.
Execution Status
Number of States
1
Interrupt mask level determination
1 or 2*
2
Maximum number of wait states until
executing instruction ends
1 to 23
3
PC, CCR stack
4
4
Vector fetch
5
6
1
4
Instruction fetch*
2
Internal processing*
4
3
Total
4
19 to 41
Notes: 1. One state for internal interrupts and two states for external interrupts.
2. Prefetch after interrupt acceptance and interrupt handling routine prefetch.
3. Internal processing after interrupt acceptance and internal processing after vector fetch.
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Section 4 Interrupt Controller
4.7
Usage Notes
4.7.1
Contention between Interrupt Generation and Disabling
When an interrupt enable bit is cleared to 0 to disable interrupts, the disabling becomes effective
after execution of the instruction. When an interrupt enable bit is cleared to 0 by an instruction
such as BCLR or MOV, and if an interrupt is generated during execution of the instruction, the
interrupt concerned will still be enabled on completion of the instruction, and so interrupt
exception handling for that interrupt will be executed on completion of the instruction. However,
if there is an interrupt request with higher priority than that interrupt, interrupt exception handling
will be executed for the higher-priority interrupt, and the lower-priority interrupt will be ignored.
The same also applies when an interrupt source flag is cleared to 0.
Figure 4.4 shows an example in which the TGIEA bit in TIER of the 16-bit timer pulse unit (TPU)
is cleared to 0.
TIER write cycle by CPU
TGIA exception handling
φ
Internal address
bus
TIER address
Internal write
signal
TGIEA
TGIA
TGIA interrupt
signal
Figure 4.4 Contention between Interrupt Generation and Disabling
The above contention will not occur if an enable bit or interrupt source flag is cleared to 0 while
the interrupt is masked.
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Section 4 Interrupt Controller
4.7.2
Instructions that Disable Interrupts
The instructions that disable interrupts are LDC, ANDC, ORC, and XORC.
When an interrupt request is generated, an interrupt is request is sent to the CPU after the interrupt
controller has determined the mask level. At that time, if the CPU is executing an instruction that
disables interrupts, the CPU always executes the next instruction after the instruction execution is
completed.
4.7.3
Interrupts during Execution of EEPMOV Instruction
Interrupt operation differs between the EEPMOV.B instruction and the EEPMOV.W instruction.
With the EEPMOV.B instruction, an interrupt request (including NMI) issued during transfer is
not accepted until the transfer is completed.
With the EEPMOV.W instruction, even if an interrupt request other than the NMI is issued during
transfer, the interrupt is not accepted until the transfer is completed. If the NMI interrupt request is
issued, NMI exception handling starts at a break in the transfer cycle. The PC value saved on the
stack in this case is the address of the next instruction.
Therefore, if an NMI interrupt is generated during execution of an EEPMOV.W instruction, the
following coding should be used.
L1: EEPMOV.W
4.7.4
MOV.W
R4,R4
BNE
L1
IENR Clearing
When an interrupt request is disabled by clearing the interrupt enable register or when the interrupt
request register is cleared, the interrupt request should be masked (I bit = 1). If the above operation
is executed while the I bit is 0 and contention between the instruction execution and the interrupt
request generation occurs, exception handling, which corresponds to the interrupt request
generated after instruction execution of the above operation is completed, is executed.
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Section 5 Clock Pulse Generators
Section 5 Clock Pulse Generators
The clock pulse generator is provided on-chip, including both a system clock pulse generator and
a subclock pulse generator. The system clock pulse generator consists of a system clock oscillator,
system clock divider, and on-chip oscillator (available only for the masked ROM version). The
subclock pulse generator consists of a subclock oscillator and subclock divider. Figure 5.1 (1)
shows a block diagram of the clock pulse generators for the flash memory version and figure 5.1
(2) shows that for the masked ROM version.
OSC1
OSC2
System
clock
oscillator
φOSC
(fOSC)
System
clock
divider
φOSC
φOSC/8
φOSC/16
φOSC/32
φOSC/64
System clock pulse generator
φ
Prescaler S
(13 bits)
φ/2
to
φ/8192
φw
φW/2
X1
X2
Subclock
oscillator
φW
(fW)
Subclock pulse generator
Subclock
divider
φW/4
φW/8
φw/4
φSUB
φw/2
Figure 5.1 Block Diagram of Clock Pulse Generators (Flash Memory Version) (1)
CPG0200A_010020040500
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Section 5 Clock Pulse Generators
IRQAEC
on-chip
oscillator
ROSC
OSC1
OSC2
System
clock
oscillator
φOSC
φOSC
(fOSC)
(fOSC)
System
clock
divider
φOSC
φOSC/8
φOSC/16
φOSC/32
φOSC/64
System clock pulse generator
φ
Prescaler S
(13 bits)
φ/2
to
φ/8192
φW
φW/2
X1
X2
Subclock
oscillator
fW
(fW)
Subclock
divider
φW/4
φW/8
φW/4
φSUB
Subclock pulse generator
φW/2
Figure 5.1 Block Diagram of Clock Pulse Generators (Masked ROM Version) (2)
The basic clock signals that drive the CPU and on-chip peripheral modules are φ and φSUB. The
system clock is divided by prescaler S to become a clock signal from φ/8192 to φ/2. Both the
system clock and subclock signals are provided to the on-chip peripheral modules.
Since the on-chip oscillator is available for the masked ROM version, the reference clock can be
selected to be output from the on-chip oscillator or system clock oscillator by the input level of the
IRQAEC pin.
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Section 5 Clock Pulse Generators
5.1
Register Description
• SUB32k control register (SUB32CR)
• Oscillator Control Register (OSCCR)
5.1.1
SUB32k Control Register (SUB32CR)
SUB32CR controls whether the subclock oscillator operates or stops.
Bit
Bit Name
Initial
Value
R/W
7
32KSTOP
0
R/W
Description
Subclock Oscillator Operation Control
0: Subclock oscillator operates
1: Subclock oscillator stops
6

0
R/W
Reserved
This bit is readable/writable.
5 to 0

All 0

Reserved
These bits cannot be modified.
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Section 5 Clock Pulse Generators
5.1.2
Oscillator Control Register (OSCCR)
OSCCR contains a flag indicating the selection status of the system clock oscillator and on-chip
oscillator, indications the input level of the IRQAEC pin during resets (Supported only by the
masked ROM version).
Bit
Bit Name
Initial
Value
R/W
Description
7 to 3
—
All 0
R/W
Reserved
2
IRQAECF
—
R
These bits are readable/writable enable reserves bits.
IRQAEC flag
This bit indicates the IRQAEC pin input level set during
resets.
0: IRQAEC pin set to GND during resets
1: IRQAEC pin set to Vcc during resets
1
OSCF
—
R
OSC flag
This bit indicates the oscillator operating with the system
clock pulse generator.
0: System clock oscillator operating (on-chip oscillator
stopped)
1: On-chip oscillator operating (system clock oscillator
stopped)
0
—
0
R/W
Reserved
Never write 1 to this bit, as it can cause the LSI to
malfunction.
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Section 5 Clock Pulse Generators
5.2
System Clock Generator
Clock pulses can be supplied to the system clock divider either by connecting a crystal or ceramic
resonator, or by providing external clock input.
As shown in figure 5.1 (2), a system clock oscillator and on-chip oscillator are selectable for the
masked ROM version. For the selection method, see section 5.2.4, On-Chip Oscillator Selection
Method (Supported only by the Masked ROM Version).
5.2.1
Connecting Crystal Resonator
Figure 5.2 shows a typical method of connecting a crystal resonator. An AT-cut parallel-resonance
crystal resonator should be used. For details, refer to section 25, Electrical Characteristics.
C1
OSC 1
OSC 2
R1
C2
R1 = 1 MΩ ±20%
Note: Consult with the crystal resonator manufacturer
to determine the circuit constants.
Frequency
4.19 MHz
Manufacturer
C1, C2
Product Type Recommendation Value
Kyocera Kinseki HC-491U-S
Corporation
22 pF ±20%
Figure 5.2 Typical Connection to Crystal Resonator
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Section 5 Clock Pulse Generators
5.2.2
Connecting Ceramic Resonator
Figure 5.3 shows a typical method of connecting a ceramic resonator.
C1
Rf = 1 MΩ ±20%
Note: Consult with the crystal resonator manufacturer
to determine the circuit constants.
OSC1
Rf
C2
OSC2
Frequency
Manufacturer
Product Type
C1, C2
Recommendation Value
4.194 MHz Murata Manufacturing CSTLS4M19G53-B0 15pF (on-chip)
Co., Ltd.
CSTLS4M19G56-B0 47pF (on-chip)
Figure 5.3 Typical Connection to Ceramic Resonator
5.2.3
External Clock Input Method
Connect an external clock signal to pin OSC1, and leave pin OSC2 open. Figure 5.4 shows a
typical connection. The duty cycle of the external clock signal must be 45 to 55%.
OSC1
OSC2
External clock input
Open
Figure 5.4 Example of External Clock Input
5.2.4
On-Chip Oscillator Selection Method (Supported only by the Masked ROM
Version)
The on-chip oscillator is selected by the input level of the IRQAEC pin during a reset. The
selection method of the system clock oscillator and the on-chip oscillator is listed in table 5.1. The
input level of the IRQAEC pin during a reset* should be fixed either to Vcc or GND, depending
on the oscillator type to be selected. The setting takes effect when the rest is cleared. When the onchip oscillator is selected, to connect a resonator to OSC1 or OSC2 is not necessary. In this case,
the OSC1 pin should be fixed to Vcc or GND.
Note: * This reset represents an external reset or power-on reset, but not a reset by the
watchdog timer.
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Section 5 Clock Pulse Generators
Table 5.1
Selection Method for System Clock Oscillator and On-Chip Oscillator
IRQAEC Input Level
(during a reset)
0
1
System clock oscillator
Enabled
Disabled
On-chip oscillator
Disabled
Enabled
5.3
Subclock Generator
5.3.1
Connecting 32.768-kHz/38.4-kHz Crystal Resonator
Clock pulses can be supplied to the subclock generator by connecting a 32.768-kHz or 38.4-kHz
crystal resonator, as shown in figure 5.5. Notes described in section 5.5.2, Notes on Board Design
also apply to this connection.
The 32KSTOP bit in the SUB32CR register can stop the subclock oscillator with the subclock
oscillator program. To stop the subclock oscillator, set the SUB32CR register in active mode.
When restoring from the subclock stopped condition, use the subclock after the oscillation
stabilization time has elapsed, as the same as for the power supply.
C1
X1
X2
C2
Frequency
38.4 kHz
Note: Consult with the crystal resonator manufacturer
to determine the circuit constants.
Manufacturer
Products
Name
C 1, C 2
Recommendation Value
Equivalent Series
Resistance
Epson Toyocom
C-4-TYPE
7 pF
30 kΩ max
C-001R
7 pF
35 kΩ max
32.768 kHz Epson Toyocom
Figure 5.5 Typical Connection to 32.768-kHz/38.4-kHz Crystal Resonator
Figure 5.6 shows the equivalent circuit of the crystal resonator.
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Section 5 Clock Pulse Generators
CS
LS
RS
X1
X2
CO
C O = 0.9 pF (typ.)
R S = 35 kΩ (max.)
f W = 32.768 kHz/38.4 kHz
Figure 5.6 Equivalent Circuit of 32.768-kHz/38.4-kHz Crystal Resonator
Notes on Use of Subclock Generator Circuit
The drive capacity of the subclock generator circuit is limited in order to reduce current
consumption when operating in the subclock mode. As a result, there may not be sufficient
additional margin to accommodate some resonators. Be sure to select a resonator with an
equivalent series resistance (RS) corresponding to that shown in figure 5.6.
5.3.2
Pin Connection when not Using Subclock
When the subclock is not used, connect the X1 pin to GND and leave the X2 pin open, as shown in
figure 5.7.
X1
GND
X2
Open
Figure 5.7 Pin Connection when not Using Subclock
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Section 5 Clock Pulse Generators
5.3.3
External Clock Input Method
Connect the external clock to the X1 pin and leave the X2 pin open, as shown in figure 5.8.
X1
External clock input
X2
Open
Figure 5.8 Pin Connection when Inputting External Clock
Frequency
Subclock (φ
φw)
Duty
45% to 55%
5.4
Prescalers
This LSI is equipped with an on-chip prescaler (prescaler S).
Prescaler S is a 13-bit counter using the system clock (φ) as its input clock. Its prescaled outputs
provide internal clock signals for on-chip peripheral modules.
5.4.1
Prescaler S
Prescaler S is a 13-bit counter using the system clock (φ) as its input clock. A divided output is
used as an internal clock of an on-chip peripheral module. Prescaler S is initialized to H'0000 at a
reset, and starts counting up on exit from the reset state. In standby mode, watch mode, subactive
mode, and subsleep mode, the system clock pulse generator stops. Prescaler S also stops and is
initialized to H'0000. The CPU cannot read from or write to prescaler S.
The output from prescaler S is shared by the on-chip peripheral modules. In active (mediumspeed) mode and sleep (medium-speed) mode, the clock input to prescaler S is determined by the
division ratio designated by the MA1 and MA0 bits in SYSCR2.
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Section 5 Clock Pulse Generators
5.5
Usage Notes
5.5.1
Note on Resonators
Resonator characteristics are closely related to board design and should be carefully evaluated by
the user in the masked ROM version and flash memory version, referring to the examples shown
in this section. Resonator circuit constants will differ depending on a resonator, stray capacitance
in its mounting circuit, and other factors. Suitable constants should be determined in consultation
with the resonator manufacturer. Design the circuit so that the oscillator pin is never applied
voltages exceeding its maximum rating. Figure 5.9 shows an example of crystal and ceramic
resonator arrangement.
P37
X1
X2
Vss
OSC2
OSC1
TEST
(Vss)
Figure 5.9 Example of Crystal and Ceramic Resonator Arrangement
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Section 5 Clock Pulse Generators
Figure 5.10 (1) shows an example measuring circuit with the negative resistance recommended by
the resonator manufacturer. Note that if the negative resistance of the circuit is less than that
recommended by the resonator manufacturer, it may be difficult to start the main oscillator.
If it is determined that oscillation does not occur because the negative resistance is lower than the
level recommended by the resonator manufacturer, the circuit must be modified as shown in figure
5.10 (2) through (4). Which of the modification suggestions to use and the capacitor capacitance
should be decided based upon evaluation results such as the negative resistance and the frequency
deviation.
Modification
point
OSC1
OSC1
C1
C1
Rf
Rf
OSC2
OSC2
C2
C2
Negative resistance,
addition of -R
(1) Negative Resistance Measuring Circuit
(2) Oscillator Circuit Modification Suggestion 1
Modification
point
Modification
point
C3
OSC1
C1
OSC1
C1
Rf
C2
Rf
OSC2
(3) Oscillator Circuit Modification Suggestion 2
OSC2
C2
(4) Oscillator Circuit Modification Suggestion 3
Figure 5.10 Negative Resistance Measurement and Circuit Modification Suggestions
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Section 5 Clock Pulse Generators
5.5.2
Notes on Board Design
When using a crystal resonator (ceramic resonator), place the resonator and its load capacitors as
close as possible to the OSC1 and OSC2 pins. Other signal lines should be routed away from the
resonator circuit to prevent induction from interfering with correct oscillation (see figure 5.11).
Avoid
Signal A
Signal B
C1
OSC1
C2
OSC2
Figure 5.11 Example of Incorrect Board Design
Note: When a crystal resonator or ceramic resonator is connected, consult with the crystal
resonator and ceramic resonator manufacturers to determine the circuit constants because
the constants differ according to the resonator, stray capacitance of the mounting circuit,
and so on.
5.5.3
Definition of Oscillation Stabilization Wait Time
Figure 5.12 shows the oscillation waveform (OSC2), system clock (φ), and microcomputer
operating mode when a transition is made from standby mode, watch mode, or subactive mode, to
active (high-speed/medium-speed) mode, with an resonator connected to the system clock
oscillator.
As shown in figure 5.12, when a transition is made from a mode in which the system clock
oscillator is halted to active (high-speed/medium-speed) mode, the sum of the following two times
(oscillation start time and wait time) is required.
(1)
Oscillation Start Time
The time from the point at which the system clock oscillator oscillation waveform starts to change
when an interrupt is generated, until generation of the system clock starts.
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Section 5 Clock Pulse Generators
(2)
Wait Time
The time required for the CPU and peripheral functions to begin operating after generation of the
oscillation waveform frequency and system clock have started, the oscillation amplitude has
increased, and the oscillation frequency has stabilized.
Oscillation waveform
(OSC1, OSC2)
System clock
(φ)
Oscillation
start time
Wait time
Operating
mode
Standby mode,
watch mode, or
subactive mode
Oscillation stabilization wait time
Active (high-speed) mode or
active (medium-speed) mode
Interrupt accepted
Figure 5.12 Oscillation Stabilization Wait Time
The required the oscillation stabilization time is the same as the “oscillation stabilization time tRC”
at power-on specified in the AC characteristics. Set STS2 to STS0 in SYSCR1 so that the duration
is equal to or greater than tRC.
If a resonator is connected to the system clock oscillator, it is important to carefully evaluate the
characteristics of the actual circuitry mounted on the board when a transition is made from standby
mode, watch mode, or subactive mode to active (high-speed/medium-speed) mode. Set a wait time
that will allow sufficient increase in the oscillation amplitude of OSC1 and OSC2. The oscillation
start time will differ depending on the mounted circuitry constants and stray capacitance.
Therefore, consult with the manufacturer of the resonator when setting the oscillation stabilization
wait time.
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Section 5 Clock Pulse Generators
5.5.4
Note on Subclock Stop State
To stop the subclock, a state transition should not be made except to mode in which the system
clock operates. If the state transition is made to other mode, it may result in incorrect operation.
5.5.5
Note on Using Resonator
When a microcomputer operates, the internal power supply potential fluctuates slightly in
synchronization with the system clock. Depending on the individual resonator characteristics, the
oscillation waveform amplitude may not be sufficiently large immediately after the oscillation
stabilization wait time, making the oscillation waveform susceptible to influence by fluctuations in
the power supply potential. In this state, the oscillation waveform may be disrupted, leading to an
unstable system clock and incorrect operation of the microcomputer.
If incorrect operation occurs, change the setting of the standby timer select bits 2 to 0 (STS2 to
STS0) (bits 6 to 4 in the system control register 1 (SYSCR1)) to give a longer wait time.
For example, if incorrect operation occurs with a wait time setting of 1,024 states, check the
operation with a wait time setting of 2,048 states or more.
If the same kind of incorrect operation occurs after a reset as after a state transition, hold the RES
pin low for a longer period.
5.5.6
Note on Using Power-On Reset Circuit
The LSI’s internal power-on reset circuit can be adjusted by connecting an external capacitor to
the RES pin. Adjust the capacitance of the external capacitor to ensure sufficient oscillation
stabilization time before reset clearing. For details, see section 22, Power-On Reset Circuit.
Rev. 3.00 Aug 23, 2006 Page 110 of 616
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Section 6 Power-Down Modes
Section 6 Power-Down Modes
This LSI has eight modes of operation after a reset. These include a normal active (high-speed)
mode and seven power-down modes, in which power consumption is significantly reduced. The
module standby function reduces power consumption by selectively halting on-chip module
functions.
• Active (medium-speed) mode
The CPU and all on-chip peripheral modules are operable on the system clock. The system
clock frequency can be selected from φosc/8, φosc/16, φosc/32, and φosc/64.
• Subactive mode
The CPU and all on-chip peripheral modules are operable on the subclock. The subclock
frequency can be selected from φw/2, φw/4, and φw/8.
• Sleep (high-speed) mode
The CPU halts. On-chip peripheral modules are operable on the system clock.
• Sleep (medium-speed) mode
The CPU halts. On-chip peripheral modules are operable on the system clock. The system
clock frequency can be selected from φosc/8, φosc/16, φosc/32, and φosc/64.
• Subsleep mode
The CPU halts. The on-chip peripheral modules are operable on the subclock. The subclock
frequency can be selected from φw/2, φw/4, and φw/8.
• Watch mode
The CPU halts. The on-chip peripheral modules are operable on the subclock.
• Standby mode
The CPU and all on-chip peripheral modules halt.
• Module standby function
Independent of the above modes, power consumption can be reduced by halting on-chip
peripheral modules that are not used in module units.
Note: In this manual, active (high-speed) mode and active (medium-speed) mode are collectively
called active mode.
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Section 6 Power-Down Modes
6.1
Register Descriptions
The registers related to power-down modes are as follows.
• System control register 1 (SYSCR1)
• System control register 2 (SYSCR2)
• Clock halt registers 1 and 2 (CKSTPR1 and CKSTPR2)
6.1.1
System Control Register 1 (SYSCR1)
SYSCR1 controls the power-down modes, as well as SYSCR2.
Bit
Bit Name
Initial
Value
R/W
Description
7
SSBY
0
R/W
6
5
4
STS2
STS1
STS0
0
0
0
R/W
R/W
R/W
Software Standby
Selects the mode to transit after the execution of the
SLEEP instruction.
0: A transition is made to sleep mode or subsleep mode.
1: A transition is made to standby mode or watch mode.
For details, see table 6.2.
Standby Timer Select 2 to 0
Designate the time the CPU and peripheral modules
wait for stable clock operation after exiting from standby
mode, subactive mode, subsleep mode, or watch mode
to active mode or sleep mode due to an interrupt. The
designation should be made according to the operating
frequency so that the waiting time is at least equal to the
oscillation stabilization time. The relationship between
the specified value and the number of wait states is
shown in table 6.1.
When an external clock is to be used, the minimum
value (STS2 = 1, STS1 = 0, STS0 = 1) is recommended.
If the internal oscillator is used, the settings CTCS2 = 0,
STS = 1, and STS0 = 0 are recommended.
If the setting other than the recommended value is
made, operation may start before the end of the waiting
time.
3
LSON
0
R/W
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Selects the system clock (φ) or subclock (φSUB) as the
CPU operating clock when watch mode is cleared.
0: The CPU operates on the system clock (φ)
1: The CPU operates on the subclock (φSUB)
Section 6 Power-Down Modes
Bit
Bit Name
Initial
Value
R/W
Description
2
TMA3
0
R/W
Selects the mode to which the transition is made after
the SLEEP instruction is executed with bits SSBY and
LSON in SYSCR1 and bits DTON and MSON in
SYSCR2. For details, see table 6.2.
1
0
MA1
MA0
1
1
R/W
R/W
Active Mode Clock Select 1 and 0
Select the operating clock frequency in active (mediumspeed) mode and sleep (medium-speed) mode. The
MA1 and MA0 bits should be written to in active (highspeed) mode or subactive mode.
00: φOSC/8
01: φOSC/16
10: φOSC/32
11: φOSC/64
Table 6.1
Operating Frequency and Waiting Time
Bit
Operating Frequency and Waiting Time
STS2
STS1
STS0
0
0
0
1
1
0
1
Waiting States
2 MHz
4.194 MHz
10 MHz
8,192 states
4.1
1.953
0.819
1
16,384 states
8.2
3.907
1.638
0
1,024 states
0.512
0.244
0.1024
1
2,048 states
1.024
0.488
0.2048
0
4,096 states
2.048
0.977
0.4096
1
2 states (external clock input)
0.001
0.0005
0.0002
0
8 states
0.004
0.0019
0.0008
1
16 states
0.008
0.0038
0.0016
Note: Time unit is ms.
When an external clock is input, bits STS2 to STS0 should be set as external clock input
mode before mode transition is executed. When an external clock is not used, these bits
should not be set as external clock input mode.
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Section 6 Power-Down Modes
6.1.2
System Control Register 2 (SYSCR2)
SYSCR2 controls the power-down modes, as well as SYSCR1.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 5

All 1

Reserved
These bits are always read as 1 and cannot be
modified.
4
NESEL
1
R/W
Noise Elimination Sampling Frequency Select
The subclock pulse generator generates the watch clock
signal (φW) and the system clock pulse generator
generates the oscillator clock (φOSC). This bit selects the
sampling frequency of φOSC when φW is sampled. When
φOSC = 2 to 10 MHz, clear this bit to 0. Set it to 1 if the
internal oscillator is used.
0: Sampling rate is φOSC/16.
1: Sampling rate is φOSC/4.
3
DTON
0
R/W
Direct Transfer on Flag
Selects the mode to which the transition is made after
the SLEEP instruction is executed with bits SSBY,
TMA3, and LSON in SYSCR1 and bit MSON in
SYSCR2. For details, see table 6.2.
2
MSON
0
R/W
Medium Speed on Flag
After standby, watch, or sleep mode is cleared, this bit
selects active (high-speed) or active (medium-speed)
mode.
0: Operation in active (high-speed) mode
1: Operation in active (medium-speed) mode
1
SA1
0
R/W
Subactive Mode Clock Select 1 and 0
0
SA0
0
R/W
Select the operating clock frequency in subactive and
subsleep modes. The values of SA1 and SA0 do not
change if they are written to in subactive mode.
00: φW/8
01: φW/4
1X: φW/2
[Legend]
X: Don't care.
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Section 6 Power-Down Modes
6.1.3
Clock Halt Registers 1 and 2 (CKSTPR1 and CKSTPR2)
CKSTPR1 and CKSTPR2 allow the on-chip peripheral modules to enter the standby state in
module units.
• CKSTPR1
Bit
7
Initial
Value
Bit Name
1
S4CKSTP* *
4
1
R/W
R/W*
Description
1
SCI4 Module Standby
SCI4 enters standby mode when this bit is cleared to 0.
6
S31CKSTP
1
R/W
SCI3 Module Standby*
2
SCI31 enters standby mode when this bit is cleared to 0.
5
S32CKSTP
1
R/W
SCI3 Module Standby*
2
SCI32 enters standby mode when this bit is cleared to
1
0.*
4
ADCKSTP
1
R/W
A/D Converter Module Standby
A/D converter enters standby mode when this bit is
cleared to 0.
3
DADCKSTP
1
R/W
∆Σ A/D Converter Module Standby
∆Σ A/D converter enters standby mode when this bit is
cleared to 0.
2
TFCKSTP
1
R/W
Timer F Module Standby
Timer F enters standby mode when this bit is cleared to
0.
1
FROMCKSTP*1 *4 1
R/W
Flash Memory Module Standby
Flash memory enters standby mode when this bit is
cleared to 0.
0
RTCCKSTP
1
R/W
RTC Module Standby
RTC enters standby mode when this bit is cleared to 0.
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Section 6 Power-Down Modes
• CKSTPR2
Initial
Value
Bit
Bit Name
7
ADBCKSTP 1
R/W
Description
R/W
Address Break Module Standby
The address break enters standby mode when this bit is
cleared to 0.
6
TPUCKSTP 1
R/W
TPU Module Standby
The TPU enters standby mode when this bit is cleared
to 0.
5
IICCKSTP
1
R/W
IIC2 Module Standby
The IIC2 enters standby mode when this bit is cleared to
0.
4
PW2CKSTP
1
R/W
PWM2 Module Standby
The PWM2 enters standby mode when this bit is cleared
to 0.
3
AECCKSTP 1
R/W
Asynchronous Event Counter Module Standby
The asynchronous event counter enters standby mode
when this bit is cleared to 0.
2
WDCKSTP
1
R/W*
3
Watchdog Timer Module Standby
The watchdog timer enters standby mode when this bit
is cleared to 0.
1
PW1CKSTP
1
R/W
PWM1 Module Standby
The PWM1 enters standby mode when this bit is cleared
to 0.
0
LDCKSTP
1
R/W
LCD Module Standby
The LCD controller/driver enters standby mode when
this bit is cleared to 0.
Notes: 1. This is a reserved bit which is not readable/writable in the masked ROM version.
2. When the SCI module standby is set, all registers in the SCI3 enter the reset state.
3. This bit is valid when the WDON bit in TCSRW is 0. If this bit is cleared to 0 while the
WDON bit is set to 1 (while the watchdog timer is operating), this bit is cleared to 0.
However, the watchdog timer does not enter module standby mode and continues
operating. When the watchdog timer stops operating and the WDON bit is cleared to 0
by software, this bit is valid and the watchdog timer enters module standby mode.
4. This bit should be set to 1 when the on-chip debugger is used.
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Section 6 Power-Down Modes
6.2
Mode Transitions and States of LSI
Figure 6.1 shows the possible transitions among these operating modes. A transition is made from
the program execution state to the program halt state of the program by executing a SLEEP
instruction. Interrupts allow for returning from the program halt state to the program execution
state of the program. A direct transition between active mode and subactive mode, which are both
program execution states, can be made without halting the program. RES input enables transitions
from a mode to the reset state. Table 6.2 shows the transition conditions of each mode after the
SLEEP instruction is executed and a mode to return by an interrupt. Table 6.3 shows the internal
states of the LSI in each mode.
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Section 6 Power-Down Modes
Program
execution state
Reset state
Program
SLEEP d
instruction
halt state
Standby
Active
(high-speed
mode)
a
EP ion
E
t
SL truc
s
in
g
d SLEEP
instruction
f
SLEEP
instruction
P n
EE tio
SL truc
s
in
SLEEP
instruction
Sleep
(high-speed)
mode
3
4
mode
Program
halt state
SLEEP
instruction a
4
b
SLEEP b
instruction
Active
(medium-speed)
mode
e
SLEEP
instruction
1
Sleep
(medium-speed)
mode
j
SLEEP
instruction
S
ins LE
tru EP
cti
on
e
i
1
SLEEP
instruction
SLEEP
instruction c
Subactive
1
mode
SLEEP
instruction
i
h
SLEEP
instruction
e
SLEEP
instruction
Watch
3
: Transition is made after exception handling
is executed.
Mode Transition Conditions (1)
Subsleep
mode
2
mode
Power-down modes
Mode Transition Conditions (2)
Interrupt Sources
LSON
MSON
SSBY
TMA3
DTON
a
0
0
0
*
0
b
0
1
0
*
0
c
1
*
0
1
0
d
0
*
1
0
0
e
*
*
1
1
0
f
0
0
0
*
1
3
All interrupts
g
0
1
0
*
1
4
IRQ1, IRQ0, WKP7 to WKP0
h
0
1
1
1
1
i
1
*
1
1
1
j
0
0
1
1
1
RTC, timer F, IRQ0 interrupt, Asynchronous
event counter, WKP7 to WKP0 interrupts
2
RTC, timer F, TPU, SCI3 interrupt, IRQ4, IRQ3,
IRQ1, IRQ0, IRQAEC interrupts, WKP7 to WKP0
interrupts, Asynchronous event counter
interrupts, Asynchronous event counter
1
* Don't care
Note: A transition between different modes cannot be made to occur simply because an interrupt
request is generated. Make sure to enable interrupt requests.
Figure 6.1 Mode Transition Diagram
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Section 6 Power-Down Modes
Table 6.2
Transition Mode after SLEEP Instruction Execution and Interrupt Handling
Transition
Mode after
State
SLEEP
Transition
Before
Instruction Mode due to
Transition LSON MSON SSBY TMA3 DTON Execution Interrupt
Active
(highspeed)
mode
Symbol in
Figure 6.1
0
0
0
*
0
Sleep
(highspeed)
mode
Active (highspeed) mode
a
0
1
0
*
0
Sleep
(mediumspeed)
mode
Active (medium- b
speed) mode
0
0
1
0
0
Standby
mode
Active (highspeed) mode
0
1
1
0
0
Standby
mode
Active (medium- d
speed) mode
0
0
1
1
0
Watch
mode
Active (highspeed) mode
0
1
1
1
0
Watch
mode
Active (medium- e
speed) mode
1
*
1
1
0
Watch
mode
Subactive mode e
0
0
0
*
1
Active
(highspeed)
mode
(direct
transition)


0
1
0
*
1
Active
(mediumspeed)
mode
(direct
transition)

g
1
*
1
1
1
Subactive
mode
(direct
transition)

i
d
e
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Section 6 Power-Down Modes
Transition
Mode after
State
SLEEP
Transition
Before
Instruction Mode due to
Transition LSON MSON SSBY TMA3 DTON Execution Interrupt
Active
(mediumspeed)
mode
Symbol in
Figure 6.1
0
0
0
*
0
Sleep
(highspeed)
mode
Active (highspeed) mode
0
1
0
*
0
Sleep
(mediumspeed)
mode
Active (medium- b
speed) mode
0
0
1
0
0
Standby
mode
Active (highspeed) mode
0
1
1
0
0
Standby
mode
Active (medium- d
speed) mode
0
0
1
1
0
Watch
mode
Active (highspeed) mode
0
1
1
1
0
Watch
mode
Active (medium- e
speed) mode
1
1
1
1
0
Watch
mode
Subactive mode e
0
0
0
*
1
Active
(highspeed)
mode
(direct
transition)

f
0
1
0
*
1
Active
(mediumspeed)
mode
(direct
transition)


1
*
1
1
1
Subactive
mode
(direct
transition)

i
Rev. 3.00 Aug 23, 2006 Page 120 of 616
REJ09B0182-0300
a
d
e
Section 6 Power-Down Modes
Transition
Mode after
State
SLEEP
Transition
Before
Instruction Mode due to
Transition LSON MSON SSBY TMA3 DTON Execution Interrupt
Subactive
mode
[Legend]
Symbol in
Figure 6.1
1
*
0
1
0
Subsleep
mode
Subactive mode c
0
0
1
1
0
Watch
mode
Active (highspeed) mode
0
1
1
1
0
Watch
mode
Active (medium- e
speed) mode
1
*
1
1
0
Watch
mode
Subactive mode e
0
0
1
1
1
Active
(highspeed)
mode
(direct
transition)

j
0
1
1
1
1
Active
(mediumspeed)
mode
(direct
transition)

h
1
*
1
1
1
Subactive
mode
(direct
transition)


e
*: Don't care.
Rev. 3.00 Aug 23, 2006 Page 121 of 616
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Section 6 Power-Down Modes
Table 6.3
Internal State in Each Operating Mode
Active Mode
Sleep Mode
Function
MediumHigh-speed speed
High-speed
Mediumspeed
Subactive
Watch Mode Mode
Subsleep
Mode
Standby
Mode
System clock oscillator
Functioning
Functioning
Functioning
Functioning
Halted
Halted
Halted
Halted
Subclock oscillator
Functioning
Functioning
Functioning
Functioning
Functioning
Functioning
Functioning
Functioning
CPU
Functioning
Functioning
Halted
Halted
Halted
Functioning
Halted
Halted
Retained
Retained
Retained
Retained
Retained
Instructions
RAM
Registers
Retained*1
I/O
External
interrupts
IRQ0
Functioning
Functioning
Functioning
Functioning
Functioning
Functioning
Functioning
Functioning
Retained*4
IRQ1
Retained*4
IRQ3
IRQ4
IRQAEC
WKP7 to WKP0
Peripheral
module
RTC
Functioning
Functioning
Functioning
Functioning
Functioning
Functioning
Functioning/
retained*8
Functioning/ Functioning/
retained*8
retained*8
Functioning/
retained*8
Asynchronous
event counter
Functioning*5 Functioning
Timer F
Functioning/
retained*6
TPU
Retained
WDT
Functioning* /
Functioning* / Functioning* / Functioning* /
retained
retained
SCI3/IrDA
Reset
Functioning/ Functioning/
retained*2
retained*2
IIC2
Retained
Retained
Retained
Retained
PWM
Retained
Retained
Retained
Retained
A/D converter
Retained
Retained
Retained
Retained
∆Σ A/D converter
Retained
Retained
Retained
Retained
LCD
Functioning/
retained*3
Functioning/ Functioning/
retained*3
retained*3
7
Functioning*5
Functioning
Functioning/ Functioning/
retained*6
retained*6
Retained
Retained
Retained
Retained
7
7
retained
7
retained
Reset
Retained
Notes: 1. Register contents are retained. Output is the high-impedance state.
2. Functioning if φW/2 is selected as an internal clock, or halted and retained otherwise.
3. Functioning if φw, φw/2, or φw/4 is selected as a clock to be used. Halted and retained
otherwise.
4. An external interrupt request is ignored. Contents of the interrupt request register are
not affected.
5. Only incrementing of the external event timer by ECL/ECH and overflow interrupts
operate.
6. Functioning if φw/4 is selected as an internal clock. Halted and retained otherwise.
7. Functioning if the on-chip oscillator is selected.
8. Functioning if the internal time keeping time-base function is selected and retained if the
interval timer is selected.
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Section 6 Power-Down Modes
6.2.1
Sleep Mode
In sleep mode, CPU operation is halted but the system clock oscillator, subclock oscillator, and
on-chip peripheral modules function. In sleep (medium-speed) mode, the on-chip peripheral
modules function at the clock frequency set by the MA1 and MA0 bits in SYSCR1. CPU register
contents are retained.
Sleep mode is cleared by an interrupt. When an interrupt is requested, sleep mode is cleared and
interrupt exception handling starts. Sleep mode is not cleared if the I bit in CCR is set to 1 or the
requested interrupt is disabled by the interrupt enable bit. After sleep mode is cleared, a transition
is made from sleep (high-speed) mode to active (high-speed) mode or from sleep (medium-speed)
mode to active (medium-speed) mode.
When the RES pin goes low, the CPU goes into the reset state and sleep mode is cleared. Since an
interrupt request signal is synchronous with the system clock, the maximum time of 2/φ (s) may be
delayed from the point at which an interrupt request signal occurs until the interrupt exception
handling is started.
Furthermore, it sometimes operates with half state early timing at the time of transition to sleep
(medium-speed) mode.
6.2.2
Standby Mode
In standby mode, the system clock oscillator stops, so the CPU and on-chip peripheral modules
stop functioning when the WDT disables the on-chip oscillator operation. However, as long as the
rated voltage is supplied, the contents of CPU registers, on-chip RAM, and some on-chip
peripheral module registers are retained. On-chip RAM contents will be retained as long as the
voltage set by the RAM data retention voltage is provided. The I/O ports go to the high-impedance
state.
Standby mode is cleared by an interrupt. When an interrupt is requested, the system clock pulse
generator starts. After the time set in bits STS2 to STS0 in SYSCR1 has elapsed, standby mode is
cleared and interrupt exception handling starts. After standby mode is cleared, a transition is made
to active (high-speed) or active (medium-speed) mode according to the MSON bit in SYSCR2.
Standby mode is not cleared if the I bit in CCR is set to 1 or the requested interrupt is disabled by
the interrupt enable bit.
When the RES pin goes low, the system clock oscillator starts. Since system clock signals are
supplied to the entire chip as soon as the system clock oscillator starts functioning, the RES pin
must be kept low until the system clock oscillator output stabilizes (except when the power-on
Rev. 3.00 Aug 23, 2006 Page 123 of 616
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Section 6 Power-Down Modes
reset circuit is used). After the oscillator output has stabilized, the CPU starts reset exception
handling if the RES pin is driven high (except when the power-on reset circuit is used).
6.2.3
Watch Mode
In watch mode, the system clock oscillator (when the WDT disables the on-chip oscillator
operation) and CPU operation stop and on-chip peripheral modules stop functioning except for the
RTC, timer F, asynchronous event counter, and LCD controller/driver. However, as long as the
rated voltage is supplied, the contents of CPU registers, some on-chip peripheral module registers,
and on-chip RAM are retained. The I/O ports retain their state before the transition.
Watch mode is cleared by an interrupt. When an interrupt is requested, watch mode is cleared and
interrupt exception handling starts. When watch mode is cleared by an interrupt, a transition is
made to active (high-speed) mode, active (medium-speed) mode, or subactive mode depending on
the settings of the LSON bit in SYSCR1 and the MSON bit in SYSCR2. When the transition is
made to active mode, after the time set in bits STS2 to STS0 in SYSCR1 has elapsed, interrupt
exception handling starts. Watch mode is not cleared if the I bit in CCR is set to 1 or the requested
interrupt is disabled by the interrupt enable register.
When the RES pin goes low, the system clock pulse generator starts. Since system clock signals
are supplied to the entire chip as soon as the system clock pulse generator starts functioning, the
RES pin must be kept low until the pulse generator output stabilizes. After the pulse generator
output has stabilized, the CPU starts reset exception handling if the RES pin is driven high.
6.2.4
Subsleep Mode
In subsleep mode, the CPU operation stops but on-chip peripheral modules other than TPU, IIC2,
the ∆Σ A/D converter, the A/D converter and PWM function. As long as a required voltage is
applied, the contents of CPU registers, the on-chip RAM, and some registers of the on-chip
peripheral modules are retained. I/O ports keep the same states as before the transition.
Subsleep mode is cleared by an interrupt. When an interrupt is requested, subsleep mode is cleared
and interrupt exception handling starts. After subsleep mode is cleared, a transition is made to
subactive mode. Subsleep mode is not cleared if the I bit in CCR is set to 1 or the requested
interrupt is disabled by the interrupt enable register.
When the RES pin goes low, the system clock pulse generator starts. Since system clock signals
are supplied to the entire chip as soon as the system clock pulse generator starts functioning, the
RES pin must be kept low until the pulse generator output stabilizes. After the pulse generator
output has stabilized, the CPU starts reset exception handling if the RES pin is driven high.
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Section 6 Power-Down Modes
6.2.5
Subactive Mode
In subactive mode, the system clock oscillator stops but on-chip peripheral modules other than
TPU, IIC2, the ∆Σ A/D converter, the A/D converter, and PWM function. As long as a required
voltage is applied, the contents of some registers of the on-chip peripheral modules are retained.
Subactive mode is cleared by the SLEEP instruction. When subacitve mode is cleared, a transition
to subsleep mode, active mode, or watch mode is made, depending on the combination of bits
SSBY, LSON, and TMA3 in SYSCR1 and bits MSON and DTON in SYSCR2. Subactive mode is
not cleared if the I bit in CCR is set to 1 or the requested interrupt is disabled by the interrupt
enable register.
When the RES pin goes low, the system clock pulse generator starts. Since system clock signals
are supplied to the entire chip as soon as the system clock pulse generator starts functioning, the
RES pin must be kept low until the pulse generator output stabilizes. After the pulse generator
output has stabilized, the CPU starts reset exception handling if the RES pin is driven high.
The operating frequency of subactive mode is selected from φW/2, φW/4, and φW/8 by the SA1 and
SA0 bits in SYSCR2.
6.2.6
Active (Medium-Speed) Mode
In active (medium-speed) mode, the system clock oscillator, subclock oscillator, CPU, and onchip peripheral module function.
Active (medium-speed) mode is cleared by the SLEEP instruction. When active (medium-speed)
mode is cleared, a transition to standby mode is made depending on the combination of bits
SSBY, LSON, and TMA3 in SYSCR1, a transition to watch mode is made depending on the
combination of bits SSBY and TMA3 in SYSCR1, or a transition to sleep mode is made
depending on the combination of bits SSBY and LSON in SYSCR1. Moreover, a transition to
active (high-speed) mode or subactive mode is made by a direct transition. Active (medium-sleep)
mode is not cleared if the I bit in CCR is set to 1 or the requested interrupt is disabled in the
interrupt enable register. When the RES pin goes low, the CPU goes into the reset state and active
(medium-sleep) mode is cleared.
Furthermore, it sometimes operates with half state early timing at the time of transition to active
(medium-speed) mode.
In active (medium-speed) mode, the on-chip peripheral modules function at the clock frequency
set by the MA1 and MA0 bits in SYSCR1.
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Section 6 Power-Down Modes
6.3
Direct Transition
The CPU can execute programs in two modes: active and subactive mode. A direct transition is a
transition between these two modes without stopping program execution. A direct transition can
be made by executing a SLEEP instruction while the DTON bit in SYSCR2 is set to 1. The direct
transition also enables operating frequency modification in active mode. If the direct transition
interrupt is disabled by IENR2, no direct transition takes place and a transition is made instead to
sleep or watch mode.
Note: If a direct transition is attempted while the I bit in CCR is set to 1, the device remains in
sleep or watch mode, and recovery is not possible.
(1) Direct transfer from active (high-speed) mode to active (medium-speed) mode
When a SLEEP instruction is executed in active (high-speed) mode while the SSBY and LSON
bits in SYSCR1 are cleared to 0 and the MSON and DTON bits in SYSCR2 are set to 1, a
transition is made to active (medium-speed) mode via sleep mode.
(2) Direct transfer from active (medium-speed) mode to active (high-speed) mode
When a SLEEP instruction is executed in active (medium-speed) mode while the SSBY and
LSON bits in SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is cleared to 0, and the DTON
bit in SYSCR2 is set to 1, a transition is made to active (high-speed) mode via sleep mode.
(3) Direct transfer from active (high-speed) mode to subactive mode
When a SLEEP instruction is executed in active (high-speed) mode while the SSBY, TMA3, and
LSON bits in SYSCR1 are set to 1 and the DTON bit in SYSCR2 is set to 1, a transition is made
to subactive mode via watch mode.
(4) Direct transfer from subactive mode to active (high-speed) mode
When a SLEEP instruction is executed in subactive mode while the SSBY and TMA3 bits in
SYSCR1 are set to 1, the LSON bit in SYSCR1 is cleared to 0, the MSON bit in SYSCR2 is
cleared to 0, and the DTON bit in SYSCR2 is set to 1, a transition is made directly to active (highspeed) mode via watch mode after the waiting time set in bits STS2 to STS0 in SYSCR1 has
elapsed.
(5) Direct transfer from active (medium-speed) mode to subactive mode
When a SLEEP instruction is executed in active (medium-speed) mode while the SSBY, TMA3,
and LSON bits in SYSCR1 are set to 1 and the DTON bit in SYSCR2 is set to 1, a transition is
made to subactive mode via watch mode.
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Section 6 Power-Down Modes
(6) Direct transfer from subactive mode to active (medium-speed) mode
When a SLEEP instruction is executed in subactive mode while the SSBY and TMA3 bits in
SYSCR1 are set to 1, the LSON bit in SYSCR1 is cleared to 0, and the MSON and DTON bits in
SYSCR2 are set to 1, a transition is made directly to active (medium-speed) mode via watch mode
after the waiting time set in bits STS2 to STS0 in SYSCR1 has elapsed.
6.3.1
Direct Transition from Active (High-Speed) Mode to Active (Medium-Speed) Mode
The time from the start of SLEEP instruction execution to the end of interrupt exception handling
(the direct transition time) is calculated by equation (1).
Direct transition time = {(Number of SLEEP instruction execution states) + (Number of internal
processing states)} × (tcyc before transition) + (Number of interrupt
exception handling execution states) × (tcyc after transition)
…………………(1)
Example:
When φOSC/8 is selected as the CPU operating clock following transition
Direct transition time = (2 + 1) × 1tosc + 14 × 8tosc = 115tosc
[Legend]
tosc: OSC clock cycle time
tcyc: System clock (φ) cycle time
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Section 6 Power-Down Modes
6.3.2
Direct Transition from Active (High-Speed) Mode to Subactive Mode
The time from the start of SLEEP instruction execution to the end of interrupt exception handling
(the direct transition time) is calculated by equation (2).
Direct transition time = {(Number of SLEEP instruction execution states) + (Number of internal
processing states)} × (tcyc before transition) + (Number of interrupt
exception handling execution states) × (tsubcyc after transition)
…………………(2)
Example:
When φosc/8 is selected as the CPU operating clock following transition
Direct transition time = (2 + 1) × 1tosc + 14 × 1tsubcyc = 3tosc + 14tsubcyc
[Legend]
tosc: OSC clock cycle time
tsubcyc: Subclock (φSUB) cycle time
6.3.3
Direct Transition from Active (Medium-Speed) Mode to Active (High-Speed) Mode
The time from the start of SLEEP instruction execution to the end of interrupt exception handling
(the direct transition time) is calculated by equation (3).
Direct transition time = {(Number of SLEEP instruction execution states) + (Number of internal
processing states)} × (tcyc before transition) + (Number of interrupt
exception handling execution states) × (tcyc after transition)
………………..(3)
Example:
When φOSC/8 is selected as the CPU operating clock before transition
Direct transition time = (2 + 1) × 8tosc + 14 × 1tosc = 38tosc
[Legend]
tosc: OSC clock cycle time
tcyc: System clock (φ) cycle time
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Section 6 Power-Down Modes
6.3.4
Direct Transition from Active (Medium-Speed) Mode to Subactive Mode
The time from the start of SLEEP instruction execution to the end of interrupt exception handling
(the direct transition time) is calculated by equation (4).
Direct transition time = {(Number of SLEEP instruction execution states) + (Number of internal
processing states)} × (tcyc before transition) + (Number of interrupt
exception handling execution states) × (tsubcyc after transition)
…………………(4)
Example:
When φosc/8 is selected as the CPU operating clock before transition
Direct transition time = (2 + 1) × 8tosc + 14 × 1tsubcyc = 24tosc + 14tsubcyc
[Legend]
tosc: OSC clock cycle time
tsubcyc: Subclock (φSUB) cycle time
6.3.5
Direct Transition from Subactive Mode to Active (High-Speed) Mode
The time from the start of SLEEP instruction execution to the end of interrupt exception handling
(the direct transition time) is calculated by equation (5).
Direct transition time = {(Number of SLEEP instruction execution states) + (Number of internal
processing states)} × (tsubcyc before transition) + {(Wait time set in bits
STS2 to STS0) + (Number of interrupt exception handling execution
states)} × (tcyc after transition)
………………..(5)
Example:
When φw/8 is selected as the CPU operating clock before transition and wait
time = 8192 states
Direct transition time = (2 + 1) × 8tw + (8192 + 14) × tosc = 24tw + 8206tosc
[Legend]
tosc: OSC clock cycle time
tw: Watch clock cycle time
tcyc: System clock (φ) cycle time
tsubcyc: Subclock (φSUB) cycle time
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Section 6 Power-Down Modes
6.3.6
Direct Transition from Subactive Mode to Active (Medium-Speed) Mode
The time from the start of SLEEP instruction execution to the end of interrupt exception handling
(the direct transition time) is calculated by equation (6).
Direct transition time = {(Number of SLEEP instruction execution states) + (Number of internal
processing states)} × (tsubcyc before transition) + {(Wait time set in bits
STS2 to STS0) + (Number of interrupt exception handling execution
states)} × (tcyc after transition)
………………..(6)
Example:
When φw/8 is selected as the CPU operating clock before transition, φOSC/8 is
selected as the CPU operating clock following transition, and the wait time is
8,192 states
Direct transition time = (2 + 1) × 8tw + (8192 + 14) × 8tosc
= 24tw + 65648tosc
[Legend]
tosc: OSC clock cycle time
tw: Watch clock cycle time
tcyc: System clock (φ) cycle time
tsubcyc: Subclock (φSUB) cycle time
6.3.7
(1)
Notes on External Input Signal Changes before/after Direct Transition
Direct transition from active (high-speed) mode to subactive mode
Since the mode transition is performed via watch mode, see section 6.5.2, Notes on External Input
Signal Changes before/after Standby Mode.
(2)
Direct transition from active (medium-speed) mode to subactive mode
Since the mode transition is performed via watch mode, see section 6.5.2, Notes on External Input
Signal Changes before/after Standby Mode.
(3)
Direct transition from subactive mode to active (high-speed) mode
Since the mode transition is performed via watch mode, see section 6.5.2, Notes on External Input
Signal Changes before/after Standby Mode.
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Section 6 Power-Down Modes
(4)
Direct transition from subactive mode to active (medium-speed) mode
Since the mode transition is performed via watch mode, see section 6.5.2, Notes on External Input
Signal Changes before/after Standby Mode.
6.4
Module Standby Function
The module-standby function can be set to any peripheral module. In module standby mode, the
clock supply to modules stops to enter the power-down mode. Module standby mode enables each
on-chip peripheral module to enter the standby state by clearing a bit that corresponds to each
module in CKSTPR1 and CKSTPR2 to 0 and cancels the mode by setting the bit to 1. (See section
6.1.3, Clock Halt Registers 1 and 2 (CKSTPR1 and CKSTPR2).)
6.5
Usage Notes
6.5.1
Standby Mode Transition and Pin States
When a SLEEP instruction is executed in active (high-speed) mode or active (medium-speed)
mode while the SSBY and TMA3 bits in SYSCR1 are set to 1 and the LSON bit in SYSCR1 is
cleared to 0, a transition is made to standby mode. At the same time, pins go to the highimpedance state (except pins for which the pull-up MOS is designated as on). Figure 6.2 shows
the timing in this case.
φ
Internal data bus
SLEEP instruction fetch
Next instruction fetch
SLEEP instruction execution
Pins
Internal processing
Port output
High-impedance
Active (high-speed) mode or active (medium-speed) mode
Standby mode
Figure 6.2 Standby Mode Transition and Pin States
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Section 6 Power-Down Modes
6.5.2
(1)
Notes on External Input Signal Changes before/after Standby Mode
When External Input Signal Changes before/after Standby Mode or Watch Mode
When an external input signal such as IRQ, WKP, or IRQAEC is input, both the high- and lowlevel widths of the signal must be at least two cycles of system clock φ or subclock φSUB (referred
to together in this section as the internal clock). As the internal clock stops in standby mode and
watch mode, the width of external input signals requires careful attention when a transition is
made via these operating modes. Ensure that external input signals conform to the conditions
stated in (3), Recommended Timing of External Input Signals, below.
(2)
When External Input Signals cannot be Captured because Internal Clock Stops
The case of falling edge capture is shown in figure 6.3.
As shown in the case marked "Capture not possible," when an external input signal falls
immediately after a transition to active mode or subactive mode, after oscillation is started by an
interrupt via a different signal, the external input signal cannot be captured if the high-level width
at that point is less than 2 tcyc or 2 tsubcyc.
(3)
Recommended Timing of External Input Signals
To ensure dependable capture of an external input signal, high- and low-level signal widths of at
least 2 tcyc or 2 tsubcyc are necessary before a transition is made to standby mode or watch mode, as
shown in "Capture possible: case 1."
External input signal capture is also possible with the timing shown in "Capture possible: case 2"
and "Capture possible: case 3," in which a 2 tcyc or 2 tsubcyc level width is secured.
Active (high-speed, medium-speed)
Operating mode mode or subactive mode
tcyc
tsubcyc
tcyc
tsubcyc
Standby mode or
watch mode
tcyc
tsubcyc
Wait for oscActive (high-speed, medium-speed)
illation
mode or subactive mode
stabilization
tcyc
tsubcyc
φ or φSUB
External input signal
Capture possible: case 1
Capture possible: case 2
Capture possible: case 3
Capture not possible
Interrupt by different signal
Figure 6.3 External Input Signal Capture when Signal Changes before/after Standby Mode
or Watch Mode
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Section 6 Power-Down Modes
(4)
Input Pins to which these Notes Apply
IRQ4, IRQ3, IRQ1, IRQ0, WKP7 to WKP0, IRQAEC, TMIF, ADTRG, TIOCA1, TIOCB1,
TIOCA2 and TIOCB2.
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Section 7 ROM
Section 7 ROM
The features of the 52-kbyte flash memory built into the flash memory (F-ZTAT) version are
summarized below.
• Programming/erase methods
The flash memory is programmed 128 bytes at a time. Erase is performed in single-block units.
The flash memory is configured as follows: 1 kbyte × 4 blocks, 28 kbytes × 1 block, 16 kbytes
× 1 block, and 4 kbytes × 1 block. To erase the entire flash memory, each block must be erased
in turn.
• On-board programming
On-board programming/erasing can be done in boot mode, in which the boot program built
into the chip is started to erase or program of the entire flash memory. In normal user program
mode, individual blocks can be erased or programmed.
• Programmer mode
Flash memory can be programmed/erased in programmer mode using a PROM programmer,
as well as in on-board programming mode.
• Automatic bit rate adjustment
For data transfer in boot mode, this LSI's bit rate can be automatically adjusted to match the
transfer bit rate of the host.
• Programming/erasing protection
Sets software protection against flash memory programming/erasing.
• Power-down mode
Operation of the power supply circuit can be partly halted in subactive mode. As a result, flash
memory can be read with low power consumption.
• Module standby mode
Use of module standby mode enables this module to be placed in standby mode independently
when not used. (For details, refer to section 6.4, Module Standby Function.) When the on-chip
debugger is used, the bit 1 (FROMCKSTP) in clock stop register 1 (CKSTPR1) should be set
to 1.
ROM3560A_000220040500
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Section 7 ROM
7.1
Block Configuration
Figure 7.1 shows the block configuration of flash memory. The thick lines indicate erasing units,
the narrow lines indicate programming units, and the values are addresses. The 52-kbyte flash
memory is divided into 1 kbyte × 4 blocks, 28 kbytes × 1 block, 16 kbytes × 1 block, and 4 kbytes
× 1 block. Erasing is performed in these units. Programming is performed in 128-byte units
starting from an address with lower eight bits H'00 or H'80.
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Section 7 ROM
Erase unit
H'0000
H'0001
H'0002
H'0080
H'0081
H'0082
H'0380
H'0381
H'0382
H'0400
H'0401
H'0402
H'0480
H'0481
H'0482
H'0780
H'0781
H'0782
H'0800
H'0801
H'0802
H'0880
H'0881
H'0882
H'0B80
H'0B81
H'0B82
H'0C00
H'0C01
H'0C02
H'0C80
H'0C81
H'0C82
H'0F80
H'0F81
H'0F82
H'1000
H'1001
H'1002
H'1080
H'1081
H'1082
Programming unit: 128 bytes
H'007F
H'00FF
1 kbyte
Erase unit
H'03FF
Programming unit: 128 bytes
H'047F
H'04FF
1 kbyte
Erase unit
H'07FF
Programming unit: 128 bytes
H'087F
H'08FF
1 kbyte
Erase unit
H'0BFF
Programming unit: 128 bytes
H'0C7F
H'0CFF
1 kbyte
Erase unit
H'0FFF
Programming unit: 128 bytes
H'107F
H'10FF
28 kbytes
Erase unit
H'7F80
H'7F81
H'7F82
H'8000
H'8001
H'8002
H'8080
H'8081
H'8082
H'80FF
H'7FFF
Programming unit: 128 bytes
H'807F
16 kbytes
H'BF80
H'BF81
H'BF82
H'C000
H'C001
H'C002
H'BFFF
H'C07F
Erase unit
H'C080
H'C081
H'C082
H'C0FF
4 kbytes
H'CF80
H'CF81
H'CF82
H'CFFF
Figure 7.1 Flash Memory Block Configuration
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Section 7 ROM
7.2
Register Descriptions
The flash memory has the following registers.
• Flash memory control register 1 (FLMCR1)
• Flash memory control register 2 (FLMCR2)
• Erase block register 1 (EBR1)
• Flash memory power control register (FLPWCR)
• Flash memory enable register (FENR)
7.2.1
Flash Memory Control Register 1 (FLMCR1)
FLMCR1 is a register that makes the flash memory change to program mode, program-verify
mode, erase mode, or erase-verify mode. For details on register setting, refer to section 7.4, Flash
Memory Programming/Erasing.
Bit
Bit Name
Initial
Value
R/W
Description
7

0

Reserved
This bit is always read as 0.
6
SWE
0
R/W
Software Write Enable
When this bit is set to 1, flash memory
programming/erasing is enabled. When this bit is
cleared to 0, other FLMCR1 register bits and all EBR1
bits cannot be set.
5
ESU
0
R/W
Erase Setup
When this bit is set to 1, the flash memory changes to
the erase setup state. When it is cleared to 0, the
erase setup state is cancelled. Set this bit to 1 before
setting the E bit to 1 in FLMCR1.
4
PSU
0
R/W
Program Setup
When this bit is set to 1, the flash memory changes to
the program setup state. When it is cleared to 0, the
program setup state is cancelled. Set this bit to 1
before setting the P bit in FLMCR1.
3
EV
0
R/W
Erase-Verify
When this bit is set to 1, the flash memory changes to
erase-verify mode. When it is cleared to 0, erase-verify
mode is cancelled.
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Section 7 ROM
Bit
Bit Name
Initial
Value
R/W
Description
2
PV
0
R/W
Program-Verify
When this bit is set to 1, the flash memory changes to
program-verify mode. When it is cleared to 0, programverify mode is cancelled.
1
E
0
R/W
Erase
When this bit is set to 1 while SWE=1 and ESU=1, the
flash memory changes to erase mode. When it is
cleared to 0, erase mode is cancelled.
0
P
0
R/W
Program
When this bit is set to 1 while SWE=1 and PSU=1, the
flash memory changes to program mode. When it is
cleared to 0, program mode is cancelled.
7.2.2
Flash Memory Control Register 2 (FLMCR2)
FLMCR2 is a register that displays the state of flash memory programming/erasing. FLMCR2 is a
read-only register, and should not be written to.
Bit
Bit Name
Initial
Value
R/W
Description
7
FLER
0
R
Flash Memory Error
Indicates that an error has occurred during an operation
on flash memory (programming or erasing). When
FLER is set to 1, flash memory goes to the errorprotection state.
See section 7.5.3, Error Protection, for details.
6 to 0

All 0

Reserved
These bits are always read as 0.
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Section 7 ROM
7.2.3
Erase Block Register 1 (EBR1)
EBR1 specifies the flash memory erase area block. EBR1 is initialized to H'00 when the SWE bit
in FLMCR1 is 0. Do not set more than one bit at a time, as this will cause all the bits in EBR1 to
be automatically cleared to 0.
Bit
Bit Name
Initial
Value
R/W
Description
7

0

Reserved
This bit is always read as 0.
6
EB6
0
R/W
When this bit is set to 1, 4 kbytes of H'C000 to H'CFFF
will be erased.
5
EB5
0
R/W
When this bit is set to 1, 16 kbytes of H'8000 to H'BFFF
will be erased.
4
EB4
0
R/W
When this bit is set to 1, 28 kbytes of H'1000 to H'7FFF
will be erased.
3
EB3
0
R/W
When this bit is set to 1, 1 kbyte of H'0C00 to H'0FFF
will be erased.
2
EB2
0
R/W
When this bit is set to 1, 1 kbyte of H'0800 to H'0BFF
will be erased.
1
EB1
0
R/W
When this bit is set to 1, 1 kbyte of H'0400 to H'07FF
will be erased.
0
EB0
0
R/W
When this bit is set to 1, 1 kbyte of H'0000 to H'03FF
will be erased.
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Section 7 ROM
7.2.4
Flash Memory Power Control Register (FLPWCR)
FLPWCR enables or disables a transition to the flash memory power-down mode when the LSI
switches to subactive mode. There are two modes: mode in which operation of the power supply
circuit of flash memory is partly halted in power-down mode and flash memory can be read, and
mode in which even if a transition is made to subactive mode, operation of the power supply
circuit of flash memory is retained and flash memory can be read.
Bit
Bit Name
Initial
Value
R/W
Description
7
PDWND
0
R/W
Power-Down Disable
When this bit is 0 and a transition is made to subactive
mode, the flash memory enters the power-down mode.
When this bit is 1, the flash memory remains in the
normal mode even after a transition is made to
subactive mode.
6 to 0

All 0

Reserved
These bits are always read as 0.
7.2.5
Flash Memory Enable Register (FENR)
Bit 7 (FLSHE) in FENR enables or disables the CPU access to the flash memory control registers,
FLMCR1, FLMCR2, EBR1, and FLPWCR.
Bit
Bit Name
Initial
Value
R/W
Description
7
FLSHE
0
R/W
Flash Memory Control Register Enable
Flash memory control registers can be accessed when
this bit is set to 1. Flash memory control registers
cannot be accessed when this bit is set to 0.
6 to 0

All 0

Reserved
These bits are always read as 0.
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7.3
On-Board Programming Modes
There are two modes for programming/erasing of the flash memory; boot mode, which enables onboard programming/erasing, and programmer mode, in which programming/erasing is performed
with a PROM programmer. On-board programming/erasing can also be performed in user
program mode. At reset-start in reset mode, this LSI changes to a mode depending on the TEST
pin settings, NMI pin settings, and input level of each port, as shown in table 7.1. The input level
of each pin must be defined four states before the reset ends.
When changing to boot mode, the boot program built into this LSI is initiated. The boot program
transfers the programming control program from the externally-connected host to on-chip RAM
via SCI3 (channel 2). After erasing the entire flash memory, the programming control program is
executed. This can be used for programming initial values in the on-board state or for a forcible
return when programming/erasing can no longer be done in user program mode. In user program
mode, individual blocks can be erased and programmed by branching to the user program/erase
control program prepared by the user.
Table 7.1
Setting Programming Modes
TEST
NMI
P36
PB0
PB1
PB2
LSI State after Reset End
0
1
X
X
X
X
User Mode
0
0
1
X
X
X
Boot Mode
1
X
X
0
0
0
Programmer Mode
[Legend]
X: Don't care.
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Section 7 ROM
7.3.1
Boot Mode
Table 7.2 shows the boot mode operations between reset end and branching to the programming
control program.
1. When boot mode is used, the flash memory programming control program must be prepared in
the host beforehand. Prepare a programming control program in accordance with the
description in section 7.4, Flash Memory Programming/Erasing.
2. SCI3 should be set to asynchronous mode, and the transfer format as follows: 8-bit data, 1 stop
bit, and no parity. The inversion function of TXD and RXD pins by SPCR is set to “Not to be
inverted,” so do not put the circuit for inverting a value between the host and this LSI.
3. When the boot program is initiated, the chip measures the low-level period of asynchronous
SCI communication data (H'00) transmitted continuously from the host. The chip then
calculates the bit rate of transmission from the host, and adjusts the SCI3 bit rate to match that
of the host. The reset should end with the RXD pin high. The RXD and TXD pins should be
pulled up on the board if necessary. After the reset is complete, it takes approximately 100
states before the chip is ready to measure the low-level period.
4. After matching the bit rates, the chip transmits one H'00 byte to the host to indicate the
completion of bit rate adjustment. The host should confirm that this adjustment end indication
(H'00) has been received normally, and transmit one H'55 byte to the chip. If reception could
not be performed normally, initiate boot mode again by a reset. Depending on the host's
transfer bit rate and system clock frequency of this LSI, there will be a discrepancy between
the bit rates of the host and the chip. To operate the SCI properly, set the host's transfer bit rate
and system clock frequency of this LSI within the ranges listed in table 7.3.
5. In boot mode, a part of the on-chip RAM area is used by the boot program. The area H'F780 to
H'FEEF is the area to which the programming control program is transferred from the host.
The boot program area cannot be used until the execution state in boot mode switches to the
programming control program.
6. Before branching to the programming control program, the chip terminates transfer operations
by SCI3 (by clearing the RE and TE bits in SCR to 0), however the adjusted bit rate value
remains set in BRR. Therefore, the programming control program can still use it for transfer of
program data or verify data with the host. The TXD pin is high (PCR42 = 1, P42 = 1). The
contents of the CPU general registers are undefined immediately after branching to the
programming control program. These registers must be initialized at the beginning of the
programming control program, as the stack pointer (SP), in particular, is used implicitly in
subroutine calls, etc.
7. Boot mode can be cleared by a reset. End the reset after driving the reset pin low, waiting at
least 20 states, and then setting the NMI pin. Boot mode is also cleared when a WDT overflow
occurs.
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Do not change the TEST pin and NMI pin input levels in boot mode.
8.
Boot Mode Operation
Host Operation
Communication Contents
Processing Contents
Transfer of number of bytes of
programming control program
Flash memory erase
Bit rate adjustment
Boot mode initiation
Item
Table 7.2
LSI Operation
Processing Contents
Branches to boot program at reset-start.
Boot program initiation
Continuously transmits data H'00
at specified bit rate.
Transmits data H'55 when data H'00
is received error-free.
H'00, H'00 . . . H'00
H'00
H'55
Boot program
erase error
H'AA reception
Transmits number of bytes (N) of
programming control program to be
transferred as 2-byte data
(low-order byte following high-order
byte)
Transmits 1-byte of programming
control program (repeated for N times)
H'AA reception
H'FF
H'AA
Upper bytes, lower bytes
Echoback
H'XX
Echoback
H'AA
• Measures low-level period of receive data
H'00.
• Calculates bit rate and sets BRR in SCI3.
• Transmits data H'00 to host as adjustment
end indication.
H'55 reception.
Checks flash memory data, erases all flash
memory blocks in case of written data
existing, and transmits data H'AA to host.
(If erase could not be done, transmits data
H'FF to host and aborts operation.)
Echobacks the 2-byte data
received to host.
Echobacks received data to host and also
transfers it to RAM.
(repeated for N times)
Transmits data H'AA to host.
Branches to programming control program
transferred to on-chip RAM and starts
execution.
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Table 7.3
System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate is
Possible
Host Bit Rate
System Clock Frequency Range of LSI
9,600 bps
8 to 10 MHz
4,800 bps
4 to 10 MHz
2,400 bps
2 to 10 MHz
7.3.2
Programming/Erasing in User Program Mode
On-board programming/erasing of an individual flash memory block can also be performed in user
program mode by branching to a user program/erase control program. The user must set branching
conditions and provide on-board means of supplying programming data. The flash memory must
contain the user program/erase control program or a program that provides the user program/erase
control program from external memory. As the flash memory itself cannot be read during
programming/erasing, transfer the user program/erase control program to on-chip RAM, as in boot
mode. Figure 7.2 shows a sample procedure for programming/erasing in user program mode.
Prepare a user program/erase control program in accordance with the description in section 7.4,
Flash Memory Programming/Erasing.
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Reset-start
No
Program/erase?
Yes
Transfer user program/erase control
program to RAM
Branch to flash memory application
program
Branch to user program/erase control
program in RAM
Execute user program/erase control
program (flash memory rewrite)
Branch to flash memory application
program
Figure 7.2 Programming/Erasing Flowchart Example in User Program Mode
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Section 7 ROM
7.4
Flash Memory Programming/Erasing
A software method using the CPU is employed to program and erase flash memory in the onboard programming modes. Depending on the FLMCR1 setting, the flash memory operates in one
of the following four modes: Program mode, program-verify mode, erase mode, and erase-verify
mode. The programming control program in boot mode and the user program/erase control
program in user program mode use these operating modes in combination to perform
programming/erasing. Flash memory programming and erasing should be performed in
accordance with the descriptions in section 7.4.1, Program/Program-Verify and section 7.4.2,
Erase/Erase-Verify, respectively.
7.4.1
Program/Program-Verify
When writing data or programs to the flash memory, the program/program-verify flowchart shown
in figure 7.3 should be followed. Performing programming operations according to this flowchart
will enable data or programs to be written to the flash memory without subjecting the chip to
voltage stress or sacrificing program data reliability.
1. Programming must be done to an empty address. Do not reprogram an address to which
programming has already been performed.
2. Programming should be carried out 128 bytes at a time. A 128-byte data transfer must be
performed even if writing fewer than 128 bytes. In this case, H'FF data must be written to the
extra addresses.
3. Prepare the following data storage areas in RAM: A 128-byte programming data area, a 128byte reprogramming data area, and a 128-byte additional-programming data area. Perform
reprogramming data computation according to table 7.4, and additional programming data
computation according to table 7.5.
4. Consecutively transfer 128 bytes of data in byte units from the reprogramming data area or
additional-programming data area to the flash memory. The program address and 128-byte
data are latched in the flash memory. The lower 8 bits of the start address in the flash memory
destination area must be H'00 or H'80.
5. The time during which the P bit is set to 1 is the programming time. Table 7.6 shows the
allowable programming times.
6. The watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc.
An overflow cycle of approximately 6.6 ms is allowed.
7.
For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower 2
bits are B'00. Verify data can be read in words or in longwords from the address to which a
dummy write was performed.
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8.
The maximum number of repetitions of the program/program-verify sequence of the same bit
is 1,000.
Write pulse application subroutine
START
Apply Write Pulse
Set SWE bit in FLMCR1
WDT enable
Wait 1 µs
Set PSU bit in FLMCR1
Store 128-byte program data in program
data area and reprogram data area
*
Wait 50 µs
n= 1
Set P bit in FLMCR1
m= 0
Wait (Wait time=programming time)
Write 128-byte data in RAM reprogram
data area consecutively to flash memory
Clear P bit in FLMCR1
Wait 5 µs
Apply Write pulse
Clear PSU bit in FLMCR1
Set PV bit in FLMCR1
Wait 4 µs
Wait 5 µs
Disable WDT
Set block start address as
verify address
End Sub
H'FF dummy write to verify address
n←n+1
Wait 2 µs
*
Read verify data
Increment address
No
Verify data =
write data?
m=1
Yes
n≤6?
No
Yes
Additional-programming data computation
Reprogram data computation
No
128-byte
data verification completed?
Yes
Clear PV bit in FLMCR1
Wait 2 µs
n ≤ 6?
No
Yes
Successively write 128-byte data from additionalprogramming data area in RAM to flash memory
Sub-Routine-Call
Apply Write Pulse
m= 0 ?
Yes
Clear SWE bit in FLMCR1
No
n ≤ 1000 ?
Wait 100 µs
Wait 100 µs
End of programming
Programming failure
Note: *The RTS instruction must not be used during the following 1. and 2. periods.
1. A period between 128-byte data programming to flash memory and the P bit clearing
2. A period between dummy writing of H'FF to a verify address and verify data reading
Figure 7.3 Program/Program-Verify Flowchart
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Yes
No
Clear SWE bit in FLMCR1
Section 7 ROM
Table 7.4
Reprogram Data Computation Table
Program Data
Verify Data
Reprogram Data
Comments
0
0
1
Programming completed
0
1
0
Reprogram bit
1
0
1

1
1
1
Remains in erased state
Table 7.5
Additional-Program Data Computation Table
Reprogram Data
Verify Data
Additional-Program
Data
Comments
0
0
0
Additional-program bit
0
1
1
No additional programming
1
0
1
No additional programming
1
1
1
No additional programming
n
Programming
(Number of Writes) Time
In Additional
Programming
Comments
1 to 6
30
10
7 to 1,000
200

Table 7.6
Programming Time
Note: Time shown in µs.
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7.4.2
Erase/Erase-Verify
When erasing flash memory, the erase/erase-verify flowchart shown in figure 7.4 should be
followed.
1. Prewriting (setting erase block data to all 0s) is not necessary.
2. Erasing is performed in block units. Make only a single-bit specification in the erase block
register (EBR1). To erase multiple blocks, each block must be erased in turn.
3. The time during which the E bit is set to 1 is the flash memory erase time.
4. The watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. An
overflow cycle of approximately 19.8 ms is allowed.
5. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower two
bits are B'00. Verify data can be read in longwords from the address to which a dummy write
was performed.
6. If the read data is not erased successfully, set erase mode again, and repeat the erase/eraseverify sequence as before. The maximum number of repetitions of the erase/erase-verify
sequence is 100.
7.4.3
Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including the NMI interrupt, are disabled while flash memory is being programmed
or erased, or while the boot program is executing, for the following three reasons:
1. Interrupt during programming/erasing may cause a violation of the programming or erasing
algorithm, with the result that normal operation cannot be assured.
2. If interrupt exception handling starts before the vector address is written or during
programming/erasing, a correct vector cannot be fetched and the CPU malfunctions.
3. If an interrupt occurs during boot program execution, normal boot mode sequence cannot be
carried out.
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Section 7 ROM
Erase start
SWE bit ← 1
Wait 1 µs
n←1
Set EBR1
Enable WDT
ESU bit ← 1
Wait 100 µs
E bit ← 1
Wait 10 ms
E bit ← 0
Wait 10 µs
ESU bit ← 10
10 µs
Disable WDT
EV bit ← 1
Wait 20 µs
Set block start address as verify address
H'FF dummy write to verify address
Wait 2 µs
*
n←n+1
Read verify data
No
Verify data + all 1s ?
Increment address
Yes
No
Last address of block ?
Yes
No
EV bit ← 0
EV bit ← 0
Wait 4 µs
Wait 4µs
All erase block erased ?
n ≤100 ?
Yes
No
Yes
SWE bit ← 0
SWE bit ← 0
Wait 100 µs
Wait 100 µs
End of erasing
Erase failure
Note: * The RTS instruction must not be used during a period between dummy writing of H'FF to a verify address and verify data reading.
Figure 7.4 Erase/Erase-Verify Flowchart
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Section 7 ROM
7.5
Program/Erase Protection
There are three kinds of flash memory program/erase protection; hardware protection, software
protection, and error protection.
7.5.1
Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly
disabled or aborted because of a transition to reset, subactive mode, subsleep mode, or standby
mode. Flash memory control register 1 (FLMCR1), flash memory control register 2 (FLMCR2),
and erase block register 1 (EBR1) are initialized. In a reset via the RES pin, the reset state is not
entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of
a reset during operation, hold the RES pin low for the RES pulse width specified in the AC
Characteristics section.
7.5.2
Software Protection
Software protection can be implemented against programming/erasing of all flash memory blocks
by clearing the SWE bit in FLMCR1. When software protection is in effect, setting the P or E bit
in FLMCR1 does not cause a transition to program mode or erase mode. By setting the erase
block register 1 (EBR1), erase protection can be set for individual blocks. When EBR1 is set to
H'00, erase protection is set for all blocks.
7.5.3
Error Protection
In error protection, an error is detected when CPU runaway occurs during flash memory
programming/erasing, or operation is not performed in accordance with the program/erase
algorithm, and the program/erase operation is forcibly aborted. Aborting the program/erase
operation prevents damage to the flash memory due to overprogramming or overerasing.
When the following errors are detected during programming/erasing of flash memory, the FLER
bit in FLMCR2 is set to 1, and the error protection state is entered.
• When the flash memory of the relevant address area is read during programming/erasing
(including vector read and instruction fetch)
• Immediately after exception handling excluding a reset during programming/erasing
• When a SLEEP instruction is executed during programming/erasing
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The FLMCR1, FLMCR2, and EBR1 settings are retained, however program mode or erase mode
is aborted at the point at which the error occurred. Program mode or erase mode cannot be reentered by re-setting the P or E bit. However, PV and EV bit settings are retained, and a transition
can be made to verify mode. Error protection can be cleared only by a reset.
7.6
Programmer Mode
In programmer mode, a PROM programmer can be used to perform programming/erasing via a
socket adapter, just as a discrete flash memory. Use a PROM programmer that supports the MCU
device type with the on-chip 64-kbyte flash memory (FZTAT64V3).
7.7
Power-Down States for Flash Memory
In user mode, the flash memory will operate in either of the following states:
• Normal operating mode
The flash memory can be read and written to at high speed.
• Power-down operating mode
The power supply circuit of flash memory can be partly halted. As a result, flash memory can
be read with low power consumption.
• Standby mode
All flash memory circuits are halted.
Table 7.7 shows the correspondence between the operating modes of this LSI and the flash
memory. In subactive mode, the flash memory can be set to operate in power-down mode with the
PDWND bit in FLPWCR. When the flash memory returns to its normal operating state from
power-down mode or standby mode, a period to stabilize operation of the power supply circuits
that were stopped is needed. When the flash memory returns to its normal operating state, bits
STS2 to STS0 in SYSCR1 must be set to provide a wait time of at least 20 µs, even when the
external clock is being used.
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Section 7 ROM
Table 7.7
Flash Memory Operating States
Flash Memory Operating State
LSI Operating State
PDWND = 0 (Initial Value)
PDWND = 1
Active mode
Normal operating mode
Normal operating mode
Subactive mode
Power-down mode
Normal operating mode
Sleep mode
Normal operating mode
Normal operating mode
Subsleep mode
Standby mode
Standby mode
Standby mode
Standby mode
Standby mode
7.8
Notes on Setting Module Standby Mode
When the flash memory is set to enter module standby mode, the system clock supply is stopped
to the module, the function is stopped, and the state is the same as that in standby mode. Also
program operation is stopped in the flash memory. Therefore operation program should be
transferred to the RAM and the program should run in the RAM. Then the flash memory should
be set to enter module standby mode.
Even if an interrupt source occurs while the interrupt is enabled in module standby mode, program
runaway may occur because the vector cannot be fetched.
Before the flash memory is set to enter module standby mode, the corresponding bit in the
interrupt enable register should be cleared to 0 and the I bit in CCR should be set to 1. Then after
the flash memory enters module standby mode, NMI and address break interrupt requests should
not be generated. Figure 7.5 shows a module standby mode setting.
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Section 7 ROM
Transfer execution program
to RAM (user area)
Clear corresponding bit in
interrupt enable register to 0
Set I bit in CCR to 1
Jump to address of
execution program in RAM
Clear FROMCKSTP
bit in CRSTPR1 to 0
Figure 7.5 Module Standby Mode Setting
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Section 8 RAM
Section 8 RAM
This LSI has an on-chip high-speed static RAM. The RAM is connected to the CPU by a 16-bit
data bus, enabling two-state access by the CPU to both byte data and word data.
Product Classification
RAM Size
RAM Address
Flash memory version
H8/38086RF
3 kbytes
H'F380 to H'FF7F
Masked ROM version
H8/38086R
2 kbytes
H'F780 to H'FF7F
H8/38085R
2 kbytes
H'F780 to H'FF7F
H8/38084R
1 kbyte
H'FB80 to H'FF7F
H8/38083R
1 kbyte
H'FB80 to H'FF7F
RAM0500A_000120030300
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Section 8 RAM
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Section 9 I/O Ports
Section 9 I/O Ports
The H8/38086R Group has 55 general I/O ports and six general input-only ports. Port 9 is a large
current port, which can drive 15 mA (@VOL = 1.0 V) when a low level signal is output. Any of
these ports can become an input port immediately after a reset. They can also be used as I/O pins
of the on-chip peripheral modules or external interrupt input pins, and these functions can be
switched depending on the register settings. The registers for selecting these functions can be
divided into two types: those included in I/O ports and those included in each on-chip peripheral
module. General I/O ports are comprised of the port control register for controlling inputs/outputs
and the port data register for storing output data and can select inputs/outputs in bit units.
For details on the execution of bit manipulation instructions to the port data register (PDR), see
section 2.8.3, Bit-Manipulation Instruction.
For details on block diagrams for each port, see Appendix B.1, I/O Port Block Diagrams.
9.1
Port 1
Port 1 is an I/O port also functioning as an SCI4 I/O pin, TPU I/O pin, and asynchronous event
counter input pin. Figure 9.1 shows its pin configuration.
P16/SCK4
Port 1
P15/TIOCB2
P14/TIOCA2/TCLKC
P13/TIOCB1/TCLKB
P12/TIOCA1/TCLKA
P11/AEVL
P10/AEVH
Figure 9.1 Port 1 Pin Configuration
Port 1 has the following registers.
• Port data register 1 (PDR1)
• Port control register 1 (PCR1)
• Port pull-up control register 1 (PUCR1)
• Port mode register 1 (PMR1)
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Section 9 I/O Ports
9.1.1
Port Data Register 1 (PDR1)
PDR1 is a register that stores data of port 1.
Bit
Bit Name
Initial
Value
R/W
Description
7

1

6
P16
0
R/W
5
P15
0
R/W
If port 1 is read while PCR1 bits are set to 1, the values
stored in PDR1 are read, regardless of the actual pin
states. If port 1 is read while PCR1 bits are cleared to 0,
the pin states are read.
4
P14
0
R/W
3
P13
0
R/W
2
P12
0
R/W
1
P11
0
R/W
0
P10
0
R/W
9.1.2
Port Control Register 1 (PCR1)
Bit 7 is reserved. This bit is always read as 1 and cannot
be modified.
PCR1 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 1.
Bit
Bit Name
Initial
Value
R/W
Description
7

1

6
PCR16
0
W
5
PCR15
0
W
4
PCR14
0
W
Setting a PCR1 bit to 1 makes the corresponding pin
(P16 to P10) an output pin, while clearing the bit to 0
makes the pin an input pin. The settings in PCR1 and in
PDR1 are valid when the corresponding pin is
designated as a general I/O pin.
3
PCR13
0
W
2
PCR12
0
W
1
PCR11
0
W
0
PCR10
0
W
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PCR1 is a write-only register. These bits are always
read as 1.
Bit 7 is reserved. This bit cannot be modified.
Section 9 I/O Ports
9.1.3
Port Pull-Up Control Register 1 (PUCR1)
PUCR1 controls the pull-up MOS of the port 1 pins in bit units.
Bit
Bit Name
Initial
Value
R/W
Description
7

1

6
PUCR16
0
R/W
5
PUCR15
0
R/W
When a PCR1 bit is cleared to 0, setting the
corresponding PUCR1 bit to 1 turns on the pull-up MOS
for the corresponding pin, while clearing the bit to 0
turns off the pull-up MOS.
4
PUCR14
0
R/W
3
PUCR13
0
R/W
2
PUCR12
0
R/W
1
PUCR11
0
R/W
0
PUCR10
0
R/W
9.1.4
Port Mode Register 1 (PMR1)
Bit 7 is reserved. This bit is always read as 1 and
cannot be modified.
PMR1 controls the selection of functions for port 1 pins.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 2

All 1

Reserved
1
AEVL
0
R/W
These bits are always read as 1 and cannot be modified.
P11/AEVL Pin Function Switch
Selects whether pin P11/AEVL is used as P11 or as
AEVL.
0: P11 I/O pin
1: AEVL input pin
0
AEVH
0
R/W
P10/AEVH Pin Function Switch
Selects whether pin P10/AEVH is used as P10 or as
AEVH.
0: P10 I/O pin
1: AEVH input pin
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Section 9 I/O Ports
9.1.5
Pin Functions
The relationship between the register settings and the port functions is shown below.
• P16/SCK4 pin
The pin function is switched as shown below according to the combination of the CKS3 to
CKS0 bits in SCSR4 and PCR16 bit in PCR1.
CKS3*
1
1*
1
B'111*
x
Other than B'111*
PCR16
0
P16 input pin
0*
1
CKS2 to CKS0*
Pin Function
1
1
P16 output pin
SCK4 input pin*
[Legend] x: Don't care.
TM
Notes: 1. Supported only by the F-ZTAT version.
2. Only port function is available for the masked ROM version.
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1
x*
1
1
x
2
SCK4 output
2
pin*
Section 9 I/O Ports
• P15/TIOCB2 pin
The pin function is switched as shown below according to the combination of the TPU channel
2 setting by the MD1 and MD0 bits in TMDR_2, IOB3 to IOB0 bits in TIOR_2, and CCLR1
and CCLR0 bits in TCR_2, and the PCR15 bit in PCR1.
TPU Channel 2
Setting
Next table
(1)
Next table
(2)
Next table
(3)
PCR15

0
1
0
1
Pin Function

P15 input pin
P15 output
pin
P15 input
pin
P15 output
pin
TIOCB2 input pin*
Note:
*
When the MD1 and MD0 bits are set to B'00 and the IOB3 bit to 1, the pin function
becomes the TIOCB2 input pin.
Clear PCR15 to 0 when using TIOCB2 as an input pin.
TPU Channel 2
Setting
(2)
(3)
MD1, MD0
IOB3 to IOB0
B'00
B'0000
B'1xxx
CCLR1, CCLR0
Output Function
[Legend]
(1)
B'10, B'01, B'11
B'0001 to B'0111
B'xxxx
B'xx

Setting prohibited
x: Don't care.
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Section 9 I/O Ports
• P14/TIOCA2/TCLKC pin
The pin function is switched as shown below according to the combination of the TPU channel
2 setting by the MD1 and MD0 bits in TMDR_2, IOA3 to IOA0 bits in TIOR_2, and CCLR1
and CCLR0 bits in TCR_2, the TPSC2 to TPSC0 bits in TCR_2, and the PCR14 bit in PCR1.
TPU Channel 2
Setting
Next table (1)

0
1
TIOCA2 output pin
P14 input pin
P14 output pin
PCR14
Pin Function
Next table (2)
TIOCA2 input pin*
TCLKC input pin*
1
2
Notes: 1. When the MD1 and MD0 bits are set to B'00 and the IOA3 bit to 1, the pin function
becomes the TIOCA2 input pin.
Clear PCR14 to 0 when using TIOCA2 as an input pin.
2. When the TPSC2 to TPSC0 bits in TCR_2 are set to B'110, the pin function becomes
the TCLKC input pin.
Clear PCR14 to 0 when using TCLKC as an input pin.
TPU Channel 2
Setting
(2)
(1)
(2)
B'1x
B'10
B'11
B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
B'xx00
Other than
B'xx00
Other than B'xx00
CCLR1, CCLR0




Other than
B'01
B'01
Output Function

Output
compare
output

PWM mode
1* output
PWM
mode 2
output

MD1, MD0
IOA3 to IOA0
[Legend]
Note: *
B'00
x: Don't care.
The output of the TIOCB2 pin is disabled.
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(1)
(1)
(2)
Section 9 I/O Ports
• P13/TIOCB1/TCLKB pin
The pin function is switched as shown below according to the combination of the TPU channel
1 setting by the MD1 and MD0 bits in TMDR_1, IOB3 to IOB0 bits in TIOR_1, and CCLR1
and CCLR0 bits in TCR_1, the TPSC2 to TPSC0 bits in TCR_1 and TCR_2, and the PCR13
bit in PCR1.
TPU Channel 1
Setting
Next table
(1)
Next table (2)
Next table (3)
PCR13

0
1
0
1
Pin Function

P13 input
pin
P13 output
pin
P13 input
pin
P13 output
pin
TIOCB1 input pin
TCLKB input pin*
Note:
*
When the TPSC2 to TPSC0 bits in TCR_1 or TCR_2 are set to B'101, the pin function
becomes the TCLKB input pin.
Clear PCR13 to 0 when using TCLKB as an input pin.
TPU Channel 1
Setting
(2)
(3)
MD1, MD0
IOB3 to IOB0
B'00
B'0000
B'1xxx
CCLR1, CCLR0
Output Function
[Legend]
(1)
B'10, B'01, B'11
B'0001 to B'0111
B'xxxx
B'xx

Setting prohibited
x: Don't care.
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Section 9 I/O Ports
• P12/TIOCA1/TCLKA pin
The pin function is switched as shown below according to the combination of the TPU channel
1 setting by the MD1 and MD0 bits in TMDR_1, IOA3 to IOA0 bits in TIOR_1, and CCLR1
and CCLR0 bits in TCR_1, the TPSC2 to TPSC0 bits in TCR_1 and TCR_2, and the PCR12
bit in PCR1.
TPU Channel 1
Setting
Next table (1)

0
1
TIOCA1 output pin
P12 input pin
P12 output pin
PCR12
Pin Function
Next table (2)
TIOCA1 input pin*
1
2
TCLKA input pin*
Notes: 1. When the MD1 and MD0 bits are set to B'00 and the IOA3 bit to 1, the pin function
becomes the TIOCA1 input pin.
Clear PCR12 to 0 when using TIOCA1 as an input pin.
2. When the TPSC2 to TPSC0 bits in TCR_1 or TCR_2 are set to B'100, the pin function
becomes the TCLKA input pin.
Clear PCR12 to 0 when using TCLKA as an input pin.
TPU Channel 1
Setting
(2)
MD1, MD0
IOA3 to IOA0
(1)
B'00
(2)
(1)
(1)
(2)
B'1x
B'10
B'11
Other than B'xx00
B'0000
B'0100
B'1xxx
B'0001 to
B'0011
B'0101 to
B'0111
B'xx00
Other
than
B'xx00
CCLR1, CCLR0




Other than
B'01
B'01
Output Function

Output
compare
output

PWM
mode 1*
output
PWM
mode 2
output

[Legend]
Note: *
x: Don't care.
The output of the TIOCB1 pin is disabled.
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Section 9 I/O Ports
• P11/AEVL pin
The pin function is switched as shown below according to the combination of the AEVL bit in
PMR1 and PCR11 bit in PCR.
AEVL
0
PCR11
Pin Function
[Legend]
1
0
1
x
P11 input pin
P11 output pin
AEVL input pin
x: Don't care.
• P10/AEVH pin
The pin function is switched as shown below according to the combination of the AEVH bit in
PMR1 and PCR10 bit in PCR.
AEVH
0
PCR10
Pin Function
[Legend]
9.1.6
1
0
1
x
P10 input pin
P10 output pin
AEVH input pin
x: Don't care.
Input Pull-Up MOS
Port 1 has an on-chip input pull-up MOS function that can be controlled by software. When a
PCR1 bit is cleared to 0, setting the corresponding PUCR1 bit to 1 turns on the input pull-up MOS
for that pin. The input pull-up MOS function is in the off state after a reset.
(n = 6 to 0)
PCR1n
0
PUCR1n
Input Pull-Up MOS
[Legend]
1
0
1
x
Off
On
Off
x: Don't care.
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Section 9 I/O Ports
9.2
Port 3
Port 3 is an I/O port also functioning as an SCI4 I/O pin, SCI3_2 I/O pin, IIC2 I/O pin, and RTC
output pin. Figure 9.2 shows its pin configuration.
P37/SO4
Port 3
P36/SI4
P32/TXD32/SCL
P31/RXD32/SDA
P30/SCK32/TMOW
Figure 9.2 Port 3 Pin Configuration
Port 3 has the following registers.
• Port data register 3 (PDR3)
• Port control register 3 (PCR3)
• Port pull-up control register 3 (PUCR3)
• Port mode register 3 (PMR3)
9.2.1
Port Data Register 3 (PDR3)
PDR3 is a register that stores data of port 3.
Bit
Bit Name
Initial
Value
R/W
Description
7
P37
0
R/W
6
P36
0
R/W
5

1

If port 3 is read while PCR3 bits are set to 1, the values
stored in PDR3 are read, regardless of the actual pin
states. If port 3 is read while PCR3 bits are cleared to 0,
the pin states are read.
4

1

3

1

2
P32
0
R/W
1
P31
0
R/W
0
P30
0
R/W
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Bits 5 to 3 are reserved. These bits are always read as 1
and cannot be modified.
Section 9 I/O Ports
9.2.2
Port Control Register 3 (PCR3)
PCR3 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 3.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR37
0
W
6
PCR36
0
W
5

1

4

1

Setting a PCR3 bit to 1 makes the corresponding pin
(P37, P36, P32 to P30) an output pin, while clearing the
bit to 0 makes the pin an input pin. The settings in PCR3
and in PDR3 are valid when the corresponding pin is
designated as a general I/O pin.
3

1

2
PCR32
0
W
1
PCR31
0
W
0
PCR30
0
W
9.2.3
Port Pull-Up Control Register 3 (PUCR3)
PCR3 is a write-only register. These bits are always
read as 1.
Bits 5 to 3 are reserved. These bits cannot be modified.
PUCR3 controls the pull-up MOS of the port 3 pins in bit units.
Bit
Bit Name
Initial
Value
R/W
Description
7
PUCR37
0
R/W
6
PUCR36
0
R/W
5

1

When a PCR3 bit is cleared to 0, setting the
corresponding PUCR3 bit to 1 turns on the pull-up MOS
for the corresponding pin, while clearing the bit to 0
turns off the pull-up MOS.
4

1

3

1

2

1

1

1

0
PUCR30
0
R/W
Bits 5 to 1 are reserved. These bits are always read as 1
and cannot be modified.
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Section 9 I/O Ports
9.2.4
Port Mode Register 3 (PMR3)
PMR3 controls the selection of functions for port 3 pins.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 1

All 1

Reserved
These bits are always read as 1 and cannot be modified.
0
TMOW
0
R/W
P30/SCK32/TMOW Pin Function Switch
Selects whether pin P30/SCK32/TMOW is used as
P30/SCK32 or as TMOW.
0: P30/SCK32 I/O pin
1: TMOW output pin
9.2.5
Pin Functions
The relationship between the register settings and the port functions is shown below.
• P37/SO4 pin
The pin function is switched as shown below according to the combination of the TE bit in
SCR4 and PCR37 bit in PCR3.
TE*
1
PCR37
Pin Function
0*
1
1*
0
1
x
P37 input pin
P37 output pin
SO4 output pin*
[Legend] x: Don't care.
TM
Notes: 1. Supported only by the F-ZTAT version.
2. Only port function is available for the masked ROM version.
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1
2
Section 9 I/O Ports
• P36/SI4 pin
The pin function is switched as shown below according to the combination of the RE bit in
SCR4 and PCR36 bit in PCR3.
RE*
1
0*
PCR36
Pin Function
1
1*
1
0
1
x
P36 input pin
P36 output pin
SI4 input pin*
2
[Legend] x: Don't care.
TM
Notes: 1. Supported only by the F-ZTAT version.
2. Only port function is available for the masked ROM version.
• P32/TXD32/SCL pin
The pin function is switched as shown below according to the combination of the PCR32 bit in
PCR3, ICE bit in ICRR1, TE bit in SCR32, and SPC32 bit in SPCR.
ICE
0
1
SPC32
0
1
x
TE
x
x
x
PCR32
Pin Function
[Legend]
Note: *
0
1
x
x
P32 input pin
P32 output pin
TXD32 output
pin*
SCL I/O pin
x: Don't care.
If SPC32 is set to 1 and TE is cleared to 0, the mark state is entered and 1 is output
from the TXD32 output pin.
• P31/RXD32/SDA pin
The pin function is switched as shown below according to the combination of the PCR31 bit in
PCR3, ICE bit in ICCR1, and RE bit in SCR32.
ICE
0
RE
0
PCR31
Pin Function
[Legend]
1
1
x
0
1
x
x
P31 input pin
P31 output pin
RXD32 output
pin
SDA I/O pin
x: Don't care.
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Section 9 I/O Ports
• P30/SCK32/TMOW pin
The pin function is switched as shown below according to the combination of the TMOW bit
in PMR3, PCR30 bit in PCR3, CKE1 and CKE0 bits in SCR32, and COM bit in SMR32.
TMOW
0
CKE1
0
CKE0
0
COM
0
PCR30
Pin Function
[Legend]
9.2.6
1
1
1
x
1
x
x
x
x
x
0
1
x
x
x
P30 input
pin
P30
output
pin
SCK32 output
pin
SCK32 input
pin
TMOW output
pin
x: Don't care.
Input Pull-Up MOS
Port 3 has an on-chip input pull-up MOS function that can be controlled by software. When a
PCR3 bit is cleared to 0, setting the corresponding PUCR3 bit to 1 turns on the input pull-up MOS
for that pin. The input pull-up MOS function is in the off state after a reset.
(n = 7, 6, 0)
PCR3n
0
PUCR3n
Input Pull-Up MOS
[Legend]
0
1
x
Off
On
Off
x: Don't care.
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1
Section 9 I/O Ports
9.3
Port 4
Port 4 is an I/O port also functioning as an SCI3_1 data I/O pin and timer F I/O pin. Figure 9.3
shows its pin configuration.
Port 4
P42/TXD31/IrTXD/TMOFH
P41/RXD31/IrRXD/TMOFL
P40/SCK31/TMIF
Figure 9.3 Port 4 Pin Configuration
Port 4 has the following registers.
• Port data register 4 (PDR4)
• Port control register 4 (PCR4)
• Port mode register 4 (PMR4)
9.3.1
Port Data Register 4 (PDR4)
PDR4 is a register that stores data of port 4.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 3

All 1

Reserved
These bits are always read as 1 and cannot be modified.
2
P42
0
R/W
1
P41
0
R/W
0
P40
0
R/W
If port 4 is read while PCR4 bits are set to 1, the values
stored in PDR4 are read, regardless of the actual pin
states. If port 4 is read while PCR4 bits are cleared to 0,
the pin states are read.
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Section 9 I/O Ports
9.3.2
Port Control Register 4 (PCR4)
PCR4 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 4.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 3

All 1

Reserved
These bits are always read as 1 and cannot be modified.
2
PCR42
0
W
1
PCR41
0
W
0
PCR40
0
W
Setting a PCR4 bit to 1 makes the corresponding pin an
output pin, while clearing the bit to 0 makes the pin an
input pin. The settings in PCR4 and in PDR4 are valid
when the corresponding pin is designated as a general
I/O pin.
PCR4 is a write-only register. These bits are always
read as 1.
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Section 9 I/O Ports
9.3.3
Port Mode Register 4 (PMR4)
PMR4 controls the selection of functions for port 4 pins.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 3

All 1

Reserved
These bits are always read as 1 and cannot be modified.
2
TMOFH
0
R/W
P42/TXD31/IrTXD/TMOFH Pin Function Switch
Selects whether pin P42/TXD31/IrTXD/TMOFH is used
as P42 or TXD31/IrTXD, or as TMOFH.
0: P42 I/O pin or TXD31/IrTXD output pin
1: TMOFH output pin
1
TMOFL
0
R/W
P41/RXD31/IrRXD/TMOFL Pin Function Switch
Selects whether pin P41/RXD31/IrRXD/TMOFL is used
as P41 or RXD31/IrRXD, or as TMOFL.
0: P41 I/O pin or RXD31/IrRXD input pin
1: TMOFL output pin
0
TMIF
0
R/W
P40/SCK31/TMIF Pin Function Switch
Selects whether pin P40/SCK31/TMIF is used as
P40/SCK31 or as TMIF.
0: P40/SCK31 I/O pin
1: TMIF input pin
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Section 9 I/O Ports
9.3.4
Pin Functions
The relationship between the register settings and the port functions is shown below.
• P42/TXD31/IrTXD/TMOFH pin
The pin function is switched as shown below according to the combination of the TMOFH bit
in PMR4, PCR42 bit in PCR4, IrE bit in IrCR, TE bit in SCR3, and SPC31 bit in SPCR.
TMOFH
0
1
SPC31
0
1
x
TE
x
x
x
IrE
x
PCR42
Pin Function
[Legend]
Note: *
0
1
x
0
1
x
x
x
P42 input pin
P42 output
pin
TXD31 output
pin*
IrTXD output
pin*
TMOFH
output pin
x: Don't care.
If SPC31 is set to 1 and TE is cleared to 0, the mark state is entered, 1 is output from
the TXD32 output pin, and 0 is output from the IrTXD pin.
• P41/RXD31/IrRXD/TMOFL pin
The pin function is switched as shown below according to the combination of the TMOFL bit
in PMR4, PCR41 bit in PCR4, IrE bit in IrCR, and RE bit in SCR3.
TMOFL
0
RE
0
IrE
x
PCR41
Pin Function
[Legend]
x
0
1
x
0
1
x
x
x
P41 input
pin
P41 output
pin
RXD31 input
pin
IrRXD input
pin
TMOFL
output pin
x: Don't care.
Rev. 3.00 Aug 23, 2006 Page 176 of 616
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1
1
Section 9 I/O Ports
• P40/SCK31/TMIF pin
The pin function is switched as shown below according to the combination of the TMIF bit in
PMR4, PCR40 bit in PCR4, CKE1 and CKE0 bits in SCR3, and COM bit in SMR3.
TMIF
0
CKE1
0
CKE0
0
PCR40
Pin Function
9.4
1
0
COM
[Legend]
1
1
x
1
0
1
x
x
x
x
x
0
1
x
x
x
x
P40 input
pin
P40 output
pin
SCK31
output pin
SCK31
input pin
Setting
prohibited
TMIF input
pin
x: Don't care.
Port 5
Port 5 is an I/O port also functioning as a wakeup interrupt input pin and LCD segment output pin.
Figure 9.4 shows its pin configuration.
P57/WKP7/SEG8
P56/WKP6/SEG7
Port 5
P55/WKP5/SEG6
P54/WKP4/SEG5
P53/WKP3/SEG4
P52/WKP2/SEG3
P51/WKP1/SEG2
P50/WKP0/SEG1
Figure 9.4 Port 5 Pin Configuration
Port 5 has the following registers.
• Port data register 5 (PDR5)
• Port control register 5 (PCR5)
• Port pull-up control register 5 (PUCR5)
• Port mode register 5 (PMR5)
Rev. 3.00 Aug 23, 2006 Page 177 of 616
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Section 9 I/O Ports
9.4.1
Port Data Register 5 (PDR5)
PDR5 is a register that stores data of port 5.
Bit
Bit Name
Initial
Value
R/W
Description
7
P57
0
R/W
6
P56
0
R/W
5
P55
0
R/W
If port 5 is read while PCR5 bits are set to 1, the values
stored in PDR5 are read, regardless of the actual pin
states. If port 5 is read while PCR5 bits are cleared to 0,
the pin states are read.
4
P54
0
R/W
3
P53
0
R/W
2
P52
0
R/W
1
P51
0
R/W
0
P50
0
R/W
9.4.2
Port Control Register 5 (PCR5)
PCR5 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 5.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR57
0
W
6
PCR56
0
W
5
PCR55
0
W
4
PCR54
0
W
Setting a PCR5 bit to 1 makes the corresponding pin an
output pin, while clearing the bit to 0 makes the pin an
input pin. The settings in PCR5 and in PDR5 are valid
when the corresponding pin is designated as a general
I/O pin.
3
PCR53
0
W
2
PCR52
0
W
1
PCR51
0
W
0
PCR50
0
W
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PCR5 is a write-only register. These bits are always
read as 1.
Section 9 I/O Ports
9.4.3
Port Pull-Up Control Register 5 (PUCR5)
PUCR5 controls the pull-up MOS of the port 5 pins in bit units.
Bit
Bit Name
Initial
Value
R/W
Description
7
PUCR57
0
R/W
6
PUCR56
0
R/W
5
PUCR55
0
R/W
When a PCR5 bit is cleared to 0, setting the
corresponding PUCR5 bit to 1 turns on the pull-up MOS
for the corresponding pin, while clearing the bit to 0
turns off the pull-up MOS.
4
PUCR54
0
R/W
3
PUCR53
0
R/W
2
PUCR52
0
R/W
1
PUCR51
0
R/W
0
PUCR50
0
R/W
9.4.4
Port Mode Register 5 (PMR5)
PMR5 controls the selection of functions for port 5 pins.
Bit
Bit Name
Initial
Value
R/W
Description
7
WKP7
0
R/W
P5n/WKPn/SEGn+1 Pin Function Switch
6
WKP6
0
R/W
5
WKP5
0
R/W
4
WKP4
0
R/W
When pin P5n/WKPn/SEGn+1 is not used as SEGn+1,
these bits select whether the pin is used as P5n or
WKPn.
3
WKP3
0
R/W
2
WKP2
0
R/W
1
WKP1
0
R/W
0
WKP0
0
R/W
0: P5n I/O pin
1: WKPn input pin
(n = 7 to 0)
Note: For use as SEGn+1, see section 20.3.1, LCD Port Control Register (LPCR).
Rev. 3.00 Aug 23, 2006 Page 179 of 616
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Section 9 I/O Ports
9.4.5
Pin Functions
The relationship between the register settings and the port functions is shown below.
• P57/WKP7/SEG8 to P54/WKP4/SEG5 pins
The pin function is switched as shown below according to the combination of the WKPn bit in
PMR5, PCR5n bit in PCR5, and SGS3 to SGS0 bits in LPCR.
(n = 7 to 4)
SGS3 to SGS0
Other than B'0010, B'0011, B'0100,
B'0101, B'0110, B'0111, B'1000, B'1001
WKPn
0
PCR5n
Pin Function
[Legend]
B'0010, B'0011, B'0100, B'0101,
B'0110, B'0111, B'1000, B'1001
1
x
0
1
x
x
P5n input
pin
P5n output
pin
WKPn input
pin
SEGn+1 output pin
x: Don't care.
• P53/WKP3/SEG4 to P50/WKP0/SEG1 pins
The pin function is switched as shown below according to the combination of the WKPm bit in
PMR5, PCR5m bit in PCR5, and SGS3 to SGS0 bits in LPCR.
(m = 3 to 0)
SGS3 to SGS0
Other than B'0001, B'0010, B'0011,
B'0100, B'0101, B'0110, B'0111, B'1000
WKPm
0
PCR5m
Pin Function
[Legend]
1
x
0
1
x
x
P5m input
pin
P5m
output pin
WKPm input
pin
SEGm+1 output pin
x: Don't care.
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B'0001, B'0010, B'0011, B'0100,
B'0101, B'0110, B'0111, B'1000
Section 9 I/O Ports
9.4.6
Input Pull-Up MOS
Port 5 has an on-chip input pull-up MOS function that can be controlled by software. When the
PCR5 bit is cleared to 0, setting the corresponding PUCR5 bit to 1 turns on the input pull-up MOS
for that pin. The input pull-up MOS function is in the off state after a reset.
(n = 7 to 0)
PCR5n
0
PUCR5n
Input Pull-Up MOS
[Legend]
9.5
1
0
1
x
Off
On
Off
x: Don't care.
Port 6
Port 6 is an I/O port also functioning as an LCD segment output pin. Figure 9.5 shows its pin
configuration.
P67/SEG16
P66/SEG15
Port 6
P65/SEG14
P64/SEG13
P63/SEG12
P62/SEG11
P61/SEG10
P60/SEG9
Figure 9.5 Port 6 Pin Configuration
Port 6 has the following registers.
• Port data register 6 (PDR6)
• Port control register 6 (PCR6)
• Port pull-up control register 6 (PUCR6)
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Section 9 I/O Ports
9.5.1
Port Data Register 6 (PDR6)
PDR6 is a register that stores data of port 6.
Bit
Bit Name
Initial
Value
R/W
Description
7
P67
0
R/W
6
P66
0
R/W
5
P65
0
R/W
If port 6 is read while PCR6 bits are set to 1, the values
stored in PDR6 are read, regardless of the actual pin
states. If port 6 is read while PCR6 bits are cleared to 0,
the pin states are read.
4
P64
0
R/W
3
P63
0
R/W
2
P62
0
R/W
1
P61
0
R/W
0
P60
0
R/W
9.5.2
Port Control Register 6 (PCR6)
PCR6 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 6.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR67
0
W
6
PCR66
0
W
5
PCR65
0
W
4
PCR64
0
W
Setting a PCR6 bit to 1 makes the corresponding pin an
output pin, while clearing the bit to 0 makes the pin an
input pin. The settings in PCR6 and in PDR6 are valid
when the corresponding pin is designated as a general
I/O pin.
3
PCR63
0
W
2
PCR62
0
W
1
PCR61
0
W
0
PCR60
0
W
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PCR6 is a write-only register. These bits are always
read as 1.
Section 9 I/O Ports
9.5.3
Port Pull-Up Control Register 6 (PUCR6)
PUCR6 controls the pull-up MOS of the port 6 pins in bit units.
Bit
Bit Name
Initial
Value
R/W
Description
7
PUCR67
0
R/W
6
PUCR66
0
R/W
5
PUCR65
0
R/W
When a PCR6 bit is cleared to 0, setting the
corresponding PUCR6 bit to 1 turns on the pull-up MOS
for the corresponding pin, while clearing the bit to 0
turns off the pull-up MOS.
4
PUCR64
0
R/W
3
PUCR63
0
R/W
2
PUCR62
0
R/W
1
PUCR61
0
R/W
0
PUCR60
0
R/W
9.5.4
Pin Functions
The relationship between the register settings and the port functions is shown below.
• P67/SEG16 to P64/SEG13 pins
The pin function is switched as shown below according to the combination of the PCR6n bit in
PCR6 and SGS3 to SGS0 bits in LPCR.
(n = 7 to 4)
SGS3 to SGS0
Other than B'0100, B'0101, B'0110,
B'0111, B'1000, B'1001, B'1010, B'1011
PCR6n
Pin Function
[Legend]
B'0100, B'0101, B'0110, B'0111,
B'1000, B'1001, B'1010, B'1011
0
1
x
P6n input pin
P6n output pin
SEGn+9 output pin
x: Don't care.
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Section 9 I/O Ports
• P63/SEG12 to P60/SEG9 pins
The pin function is switched as shown below according to the combination of the PCR6m bit
in PCR6 and SGS3 to SGS0 bits in LPCR.
(m = 3 to 0)
SGS3 to SGS0
Other than B'0011, B'0100, B'0101,
B'0110, B'0111, B'1000, B'1001, B'1010
PCR6m
Pin Function
[Legend]
9.5.5
B'0011, B'0100, B'0101, B'0110,
B'0111, B'1000, B'1001, B'1010
0
1
x
P6m input pin
P6m output pin
SEGm+9 output pin
x: Don't care.
Input Pull-Up MOS
Port 6 has an on-chip input pull-up MOS function that can be controlled by software. When the
PCR6 bit is cleared to 0, setting the corresponding PUCR6 bit to 1 turns on the input pull-up MOS
for that pin. The input pull-up MOS function is in the off state after a reset.
(n = 7 to 0)
PCR6n
0
PUCR6n
Input Pull-Up MOS
[Legend]
0
1
x
Off
On
Off
x: Don't care.
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1
Section 9 I/O Ports
9.6
Port 7
Port 7 is an I/O port also functioning as an LCD segment output pin. Figure 9.6 shows its pin
configuration.
P77/SEG24
P76/SEG23
Port 7
P75/SEG22
P74/SEG21
P73/SEG20
P72/SEG19
P71/SEG18
P70/SEG17
Figure 9.6 Port 7 Pin Configuration
Port 7 has the following registers.
• Port data register 7 (PDR7)
• Port control register 7 (PCR7)
9.6.1
Port Data Register 7 (PDR7)
PDR7 is a register that stores data of port 7.
Bit
Bit Name
Initial
Value
R/W
Description
7
P77
0
R/W
6
P76
0
R/W
5
P75
0
R/W
If port 7 is read while PCR7 bits are set to 1, the values
stored in PDR7 are read, regardless of the actual pin
states. If port 7 is read while PCR7 bits are cleared to 0,
the pin states are read.
4
P74
0
R/W
3
P73
0
R/W
2
P72
0
R/W
1
P71
0
R/W
0
P70
0
R/W
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Section 9 I/O Ports
9.6.2
Port Control Register 7 (PCR7)
PCR7 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 7.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR77
0
W
6
PCR76
0
W
5
PCR75
0
W
4
PCR74
0
W
Setting a PCR7 bit to 1 makes the corresponding pin an
output pin, while clearing the bit to 0 makes the pin an
input pin. The settings in PCR7 and in PDR7 are valid
when the corresponding pin is designated as a general
I/O pin.
3
PCR73
0
W
2
PCR72
0
W
1
PCR71
0
W
0
PCR70
0
W
9.6.3
Pin Functions
PCR7 is a write-only register. These bits are always
read as 1.
The relationship between the register settings and the port functions is shown below.
• P77/SEG24 to P74/SEG21 pins
The pin function is switched as shown below according to the combination of the PCR7n bit in
PCR7 and SGS3 to SGS0 bits in LPCR.
(n = 7 to 4)
SGS3 to SGS0
Other than B'0110, B'0111, B'1000,
B'1001, B'1010, B'1011, B'1100, B'1101
PCR7n
Pin Function
[Legend]
0
1
x
P7n input pin
P7n output pin
SEGn+17 output pin
x: Don't care.
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B'0110, B'0111, B'1000, B'1001,
B'1010, B'1011, B'1100, B'1101
Section 9 I/O Ports
• P73/SEG20 to P70/SEG17 pins
The pin function is switched as shown below according to the combination of the PCR7m bit
in PCR7 and SGS3 to SGS0 bits in LPCR.
(m = 3 to 0)
SGS3 to SGS0
Other than B'0101, B'0110, B'0111,
B'1000, B'1001, B'1010, B'1011, B'1100
PCR7m
Pin Function
[Legend]
9.7
B'0101, B'0110, B'0111, B'1000,
B'1001, B'1010, B'1011, B'1100
0
1
x
P7m input pin
P7m output pin
SEGm+17 output pin
x: Don't care.
Port 8
Port 8 is an I/O port also functioning as an LCD segment output pin. Figure 9.7 shows its pin
configuration.
P87/SEG32
P86/SEG31
Port 8
P85/SEG30
P84/SEG29
P83/SEG28
P82/SEG27
P81/SEG26
P80/SEG25
Figure 9.7 Port 8 Pin Configuration
Port 8 has the following registers.
• Port data register 8 (PDR8)
• Port control register 8 (PCR8)
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Section 9 I/O Ports
9.7.1
Port Data Register 8 (PDR8)
PDR8 is a register that stores data of port 8.
Bit
Bit Name
Initial
Value
R/W
Description
7
P87
0
R/W
6
P86
0
R/W
5
P85
0
R/W
If port 8 is read while PCR8 bits are set to 1, the values
stored in PDR8 are read, regardless of the actual pin
states. If port 8 is read while PCR8 bits are cleared to 0,
the pin states are read.
4
P84
0
R/W
3
P83
0
R/W
2
P82
0
R/W
1
P81
0
R/W
0
P80
0
R/W
9.7.2
Port Control Register 8 (PCR8)
PCR8 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 8.
Bit
Bit Name
Initial
Value
R/W
Description
7
PCR87
0
W
6
PCR86
0
W
5
PCR85
0
W
4
PCR84
0
W
Setting a PCR8 bit to 1 makes the corresponding pin
(P87 to P80) an output pin, while clearing the bit to 0
makes the pin an input pin. The settings in PCR8 and in
PDR8 are valid when the corresponding pin is
designated as a general I/O pin.
3
PCR83
0
W
2
PCR82
0
W
1
PCR81
0
W
0
PCR80
0
W
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PCR8 is a write-only register. These bits are always
read as 1.
Section 9 I/O Ports
9.7.3
Pin Functions
The relationship between the register settings and the port functions is shown below.
• P87/SEG32 to P84/SEG29 pins
The pin function is switched as shown below according to the combination of the PCR8n bit in
PCR8 and SGS3 to SGS0 bits in LPCR.
(n = 7 to 4)
SGS3 to SGS0
Other than B'1000, B'1001, B'1010,
B'1011, B'1100, B'1101, B'1110, B'1111
PCR8n
Pin Function
[Legend]
B'1000, B'1001, B'1010, B'1011,
B'1100, B'1101, B'1110, B'1111
0
1
x
P8n input pin
P8n output pin
SEGn+25 output pin
x: Don't care.
• P83/SEG28 to P80/SEG25 pins
The pin function is switched as shown below according to the combination of the PCR8m bit
in PCR8 and SGS3 to SGS0 bits in LPCR.
(m = 3 to 0)
SGS3 to SGS0
Other than B'0111, B'1000, B'1001,
B'1010, B'1011, B'1100, B'1101, B'1110
PCR8m
Pin Function
[Legend]
B'0111, B'1000, B'1001, B'1010,
B'1011, B'1100, B'1101, B'1110
0
1
x
P8m input pin
P8m output pin
SEGm+25 output pin
x: Don't care.
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Section 9 I/O Ports
9.8
Port 9
Port 9 is an I/O port also functioning as an external interrupt input pin and PWM output pin.
Figure 9.8 shows its pin configuration.
Port 9
P93
P92/IRQ4
P91/PWM2
P90/PWM1
Figure 9.8 Port 9 Pin Configuration
Port 9 has the following registers.
• Port data register 9 (PDR9)
• Port control register 9 (PCR9)
• Port mode register 9 (PMR9)
9.8.1
Port Data Register 9 (PDR9)
PDR9 is a register that stores data of port 9.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 4

All 1

Reserved
These bits are always read as 1 and cannot be modified.
3
P93
1
R/W
2
P92
1
R/W
1
P91
1
R/W
0
P90
1
R/W
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If port 9 is read while PCR9 bits are set to 1, the values
stored in PDR9 are read, regardless of the actual pin
states. If port 9 is read while PCR9 bits are cleared to 0,
the pin states are read.
Section 9 I/O Ports
9.8.2
Port Control Register 9 (PCR9)
PCR9 selects inputs/outputs in bit units for pins to be used as general I/O ports of port 9.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 4

All 1

Reserved
These bits are always read as 1 and cannot be modified.
3
PCR93
0
W
2
PCR92
0
W
1
PCR91
0
W
0
PCR90
0
W
Setting a PCR9 bit to 1 makes the corresponding pin an
output pin, while clearing the bit to 0 makes the pin an
input pin. The settings in PCR9 and in PDR9 are valid
when the corresponding pin is designated as a general
I/O pin.
PCR9 is a write-only register. These bits are always read
as 1.
9.8.3
Port Mode Register 9 (PMR9)
PMR9 controls the selection of functions for port 9 pins.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 4

All 1

Reserved
These bits are always read as 1 and cannot be modified.
3

0
R/W
Reserved
Although this bit is readable/writable, 1 should not be
written to this bit.
2
IRQ4
0
R/W
P92/IRQ4 Pin Function Switch
Selects whether pin P92/IRQ4 is used as P92 or as IRQ4.
0: P92 I/O pin
1: IRQ4 input pin
1
PWM2
0
R/W
P9n/PWMn+1 Pin Function Switch
0
PWM1
0
R/W
Select whether pin P9n/PWMn+1 is used as P9n or as
PWMn+1. (n = 1, 0)
0: P9n I/O pin
1: PWMn+1 output pin
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Section 9 I/O Ports
9.8.4
Pin Functions
The relationship between the register settings and the port functions is shown below.
• P93 pin
The pin function is switched as shown below according to the PCR93 bit in PCR9.
PCR93
Pin Function
0
1
P93 input pin
P93 output pin
• P92/IRQ4 pin
The pin function is switched as shown below according to the combination of the IRQ4 bit in
PMR9 and PCR92 bit in PCR9.
IRQ4
0
PCR92
Pin Function
1
0
1
0
1
P92 input pin
P92 output pin
IRQ4 input pin
Setting
prohibited
• P91/PWM2, P90/PWM1 pins
The pin function is switched as shown below according to the combination of the PWMn+1 bit
in PMR9 and PCR9n bit in PCR9.
(n = 1, 0)
PWMn+1
0
PCR9n
Pin Function
[Legend]
0
1
x
P9n input pin
P9n output pin
PWMn+1 output pin
x: Don't care.
Rev. 3.00 Aug 23, 2006 Page 192 of 616
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1
Section 9 I/O Ports
9.9
Port A
Port A is an I/O port also functioning as an LCD common output pin. Figure 9.9 shows its pin
configuration.
Port A
PA3/COM4
PA2/COM3
PA1/COM2
PA0/COM1
Figure 9.9 Port A Pin Configuration
Port A has the following registers.
• Port data register A (PDRA)
• Port control register A (PCRA)
9.9.1
Port Data Register A (PDRA)
PDRA is a register that stores data of port A.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 4

All 1

Reserved
These bits are always read as 1 and cannot be modified.
3
PA3
0
R/W
2
PA2
0
R/W
1
PA1
0
R/W
0
PA0
0
R/W
If port A is read while PCRA bits are set to 1, the values
stored in PDRA are read, regardless of the actual pin
states. If port A is read while PCRA bits are cleared to 0,
the pin states are read.
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Section 9 I/O Ports
9.9.2
Port Control Register A (PCRA)
PCRA selects inputs/outputs in bit units for pins to be used as general I/O ports of port A.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 4

All 1

Reserved
These bits are always read as 1 and cannot be modified.
3
PCRA3
0
W
2
PCRA2
0
W
1
PCRA1
0
W
0
PCRA0
0
W
Setting a PCRA bit to 1 makes the corresponding pin an
output pin, while clearing the bit to 0 makes the pin an
input pin. The settings in PCRA and in PDRA are valid
when the corresponding pin is designated as a general
I/O pin.
PCRA is a write-only register. These bits are always
read as 1.
9.9.3
Pin Functions
The relationship between the register settings and the port functions is shown below.
• PA3/COM4 pin
The pin function depends on bit PCRA3 in PCRA and bits DTS1 and DTS0, bit CMX, and bits
SGS3 to SGS0 in LPCR.
DTS1 to DTS0, CMX
x
SGS3 to SGS0
PCRA3
Pin Function
Other than
B'000,
B'010,
B'10*
B'0000
B'000, B'010, B'10*
Other than B'0000
0
1
x
0
1
PA3 input
1
pin*
PA3 output
1
pin*
COM4
output pin
Leave
2
open*
Leave
2
open*
[Legend] x: Don't care.
Note: 1. The board power supply level is Vcc.
2. The board power supply level is the LCD drive power supply voltage level.
Rev. 3.00 Aug 23, 2006 Page 194 of 616
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Section 9 I/O Ports
• PA2/COM3 pin
The pin function depends on bit PCRA2 in PCRA and bits DTS1 and DTS0, bit CMX, and bits
SGS3 to SGS0 in LPCR.
DTS1 to DTS0, CMX
x
SGS3 to SGS0
PCRA2
Pin Function
Other than
B'000,
B'010
B'0000
B'000, B'010
Other than B'0000
0
1
x
0
1
PA2 input
1
pin*
PA2 output
1
pin*
COM3
output pin
Leave
2
open*
Leave
2
open*
[Legend] x: Don't care.
Note: 1. The board power supply level is Vcc.
2. The board power supply level is the LCD drive power supply voltage level.
• PA1/COM2 pin
The pin function depends on bit PCRA1 in PCRA and bits DTS1 and DTS0, bit CMX, and bits
SGS3 to SGS0 in LPCR.
DTS1 to DTS0, CMX
x
SGS3 to SGS0
PCRA1
Pin Function
Other than
B'000
B'0000
B'000
Other than B'0000
0
1
x
0
1
PA1 input
1
pin*
PA1 output
1
pin*
COM2
output pin
Leave
2
open*
Leave
2
open*
[Legend] x: Don't care.
Note: 1. The board power supply level is Vcc.
2. The board power supply level is the LCD drive power supply voltage level.
• PA0/COM1 pin
The pin function depends on bit PCRA0 in PCRA and bits DTS1 and DTS0, bit CMX, and bits
SGS3 to SGS0 in LPCR.
DTS1 to DTS0, CMX
x
SGS3 to SGS0
PCRA0
Pin Function
[Legend]
B'0000
Other than B'0000
0
1
x
PA0 input pin
PA0 output pin
COM1 output pin
x: Don't care.
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Section 9 I/O Ports
9.10
Port B
Port B is an I/O port also functioning as an interrupt input pin, analog input pin, output pin for
internal reference voltage of the ∆Σ A/D converter and external reference voltage of the ∆Σ A/D
converter. Figure 9.10 shows its pin configuration.
PB7/Ain1
PB6/Ain2
Port B
PB5/Vref/REF
ACOM
PB2/AN2/IRQ3
PB1/AN1/IRQ1
PB0/AN0/IRQ0
Figure 9.10 Port B Pin Configuration
Port B has the following registers.
• Port data register B (PDRB)
• Port mode register B (PMRB)
9.10.1
Port Data Register B (PDRB)
PDRB is a register that stores data of port B.
Bit
Bit Name
Initial
Value
7
PB7
Undefined R
6
PB6
Undefined R
5
PB5
Undefined R
4

Undefined 
3

Undefined 
2
PB2
Undefined R
1
PB1
Undefined R
0
PB0
Undefined R
R/W
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Description
Reading PDRB always gives the pin states. However, if
a port B pin is selected as an analog input channel by
the CH3 to CH0 bits in AMR of the A/D converter or the
AIN1 and AIN0 bits in ADSSR of the ∆Σ A/D converter,
that pin is read as 0 regardless of the input voltage. If bit
5 is selected as an external reference voltage (Vref) by
the VREF1 and VREF0 bits in ADCR of the ∆Σ A/D
converter, the pin is read as 0 regardless of the input
voltage.
Section 9 I/O Ports
9.10.2
Port Mode Register B (PMRB)
PMRB controls the selection of the port B pin functions.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 5

All 1

Reserved
These bits are always read as 1 and cannot be modified.
4
ADTSTCHG 0
R/W
TEST/ADTRG Pin Function Switch
Selects whether pin TEST/ADTRG is used as TEST or
as ADTRG.
0: TEST pin
1: ADTRG input pin
For details on the setting of the ADTRG input pin, refer
to section 18.4.2, External Trigger Input Timing.
3

1

Reserved
This bit is always read as 1 and cannot be modified.
2
IRQ3
0
R/W
PB2/AN2/IRQ3 Pin Function Switch
Selects whether pin PB2/AN2/IRQ3 is used as PB2/AN2
or as IRQ3.
0: PB2/AN2 input pin
1: IRQ3 input pin
1
IRQ1
0
R/W
PB1/AN1/IRQ1 Pin Function Switch
Selects whether pin PB1/AN1/IRQ1 is used as PB1/AN1
or as IRQ1.
0: PB1/AN1 input pin
1: IRQ1 input pin
0
IRQ0
0
R/W
PB0/AN0/IRQ0 Pin Function Switch
Selects whether pin PB0/AN0/IRQ0 is used as PB0/AN0
or as IRQ0.
0: PB0/AN0 input pin
1: IRQ0 input pin
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Section 9 I/O Ports
9.10.3
Pin Functions
The relationship between the register settings and the port functions is shown below.
• PB7/Ain1 pin
The pin function is switched as shown below according to the AIN1 and AIN2 bits in ADSSR.
AIN1 and AIN2
Pin Function
Other than B'01
B'01
PB7 input pin
Ain1 input pin
• PB6/Ain2 pin
The pin function is switched as shown below according to the AIN1 and AIN2 bits in ADSSR.
AIN1 and AIN2
Pin Function
Other than B'10
B'10
PB6 input pin
Ain2 input pin
• PB5/Vref/REF pin
The pin function is switched as shown below according to the VREF1 and VREF2 bits in
ADCR.
VREF1 and
VREF2
Other than B'00
B'01
B'10, B'11
Pin Function
PB5 input pin
Vref input pin
REF output pin
Note: When these bits are set to B'10 or B'11, the PB5/Vref/REF pin functions as a REF output
pin. Thus the power should not be input to the pin. If the power is input, it is short-circuited
internally with the REF output and will cause a failure.
• PB2/AN2/IRQ3 pin
The pin function is switched as shown below according to the combination of the CH3 to CH0
bits in AMR and IRQ3 bit in PMRB.
IRQ3
0
1
CH3 to CH0
Other than
B'0110
B'0110
x
Pin Function
PB2 input pin
AN2 input pin
IRQ3 input pin
[Legend]
x: Don't care.
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Section 9 I/O Ports
• PB1/AN1/IRQ1 pin
The pin function is switched as shown below according to the combination of the CH3 to CH0
bits in AMR and IRQ1 bit in PMRB.
IRQ1
0
1
CH3 to CH0
Other than
B'0101
B'0101
x
Pin Function
PB1 input pin
AN1 input pin
IRQ1 input pin
[Legend]
x: Don't care.
• PB0/AN0/IRQ0 pin
The pin function is switched as shown below according to the combination of the CH3 to CH0
bits in AMR and IRQ0 bit in PMRB.
IRQ0
0
1
CH3 to CH0
Other than
B'0100
B'0100
x
Pin Function
PB0 input pin
AN0 input pin
IRQ0 input pin
[Legend]
x: Don't care.
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Section 9 I/O Ports
9.11
Input/Output Data Inversion
9.11.1
Serial Port Control Register (SPCR)
SPCR switches input/output data inversion of the RXD (IrRXD) and TXD (IrTXD) pins.
Figure 9.11 shows a input/output data inversion function.
SCINV0
SCINV2
RXD32
RXD31/IrRXD
P31/RXD32
P41/RXD31/IrRXD
SCINV1
SCINV3
P32/TXD32
P42/TXD31/IrTXD
TXD32
TXD31/IrTXD
Figure 9.11 Input/Output Data Inversion Function
Bit
Bit Name
Initial
Value
R/W
Description
7, 6

All 1

Reserved
These bits are always read as 1 and cannot be modified.
5
SPC32
0
R/W
P32/TXD32/SCL Pin Function Switch
Selects whether pin P32/TXD32/SCL is used as
P32/SCL or as TXD32.
0: P32/SCL I/O pin
1: TXD32 output pin*
Note: * Set the TE32 bit in SCR32 after setting this bit to
1.
4
SPC31
0
R/W
P42/TXD31/IrTXD/TMOFH Pin Function Switch
Selects whether pin P42/TXD31/IrTXD/TMOFH is used
as P42/TMOFH or as TXD31/IrTXD.
0: P42 I/O pin or TMOFH output pin
1: TXD31/IrTXD output pin*
Note: * Set the TE bit in SCR3 after setting this bit to 1.
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Section 9 I/O Ports
Bit
Bit Name
Initial
Value
R/W
Description
3
SCINV3
0
R/W
TXD32 Pin Output Data Inversion Switch
Specifies whether the output data polarity of the TXD32
pin is to be inverted or not.
0: TXD32 output data is not inverted
1: TXD32 output data is inverted
2
SCINV2
0
R/W
RXD32 Pin Input Data Inversion Switch
Specifies whether the input data polarity of the RXD32
pin is to be inverted or not.
0: RXD32 input data is not inverted
1: RXD32 input data is inverted
1
SCINV1
0
R/W
TXD31/IrTXD Pin Output Data Inversion Switch
Specifies whether the output data polarity of the
TXD31/IrTXD pin is to be inverted or not.
0: TXD31/IrTXD output data is not inverted
1: TXD31/IrTXD output data is inverted
0
SCINV0
0
R/W
RXD31/IrRXD Pin Input Data Inversion Switch
Specifies whether the input data polarity of the RXD31/
IrRXD pin is to be inverted or not.
0: RXD31/IrRXD input data is not inverted
1: RXD31/IrRXD input data is inverted
Note: When the serial port control register is modified, the data being input or output up to that
point is inverted immediately after the modification, and an invalid data change is input or
output. When modifying the serial port control register, modification must be made in a state
in which data changes are invalidated.
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Section 9 I/O Ports
9.12
9.12.1
Usage Notes
How to Handle Unused Pin
If an I/O pin not used by the user system is floating, pull it up or down.
• If an unused pin is an input pin, it is recommended to handle it in one of the following ways:
 Pull it up to Vcc with an on-chip pull-up MOS.
 Pull it up to Vcc with an external resistor of approximately 100 kΩ.
 Pull it down to Vss with an external resistor of approximately 100 kΩ.
 For a pin also used by the A/D converter, pull it up to AVcc. With an external resistor of
approximately 100 kΩ.
• If an unused pin is an output pin, it is recommended to handle it in one of the following ways:
 Set the output of the unused pin to high and pull it up to Vcc with an external resistor of
approximately 100 kΩ.
 Set the output of the unused pin to low and pull it down to GND with an external resistor of
approximately 100 kΩ.
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Section 10 Realtime Clock (RTC)
Section 10 Realtime Clock (RTC)
The realtime clock (RTC) is a timer used to count time ranging from a second to a week.
Interrupts can be generated ranging from 0.25 seconds to a week. Figure 10.1 shows the block
diagram of the RTC.
10.1
Features
• Counts seconds, minutes, hours, and day-of-week
• Start/stop function
• Reset function
• Readable/writable counter of seconds, minutes, hours, and day-of-week with BCD codes
• Periodic (0.25 seconds, 0.5 seconds, one second, minute, hour, day, and week) interrupts
• 8-bit free running counter
• Selection of clock source
• Use of module standby mode enables this module to be placed in standby mode independently
when not used. (For details, refer to section 6.4, Module Standby Function.)
PSS
32-kHz
oscillator
circuit
RTCCSR
1/4
RMINDR
RHRDR
TMOW
Clock count
control circuit
RWKDR
Internal data bus
RSECDR
RTCCR1
RTCCR2
RTCFLG
[Legend]
RTCCSR: Clock source select register
RSECDR: Second date register/
free running counter data register
RMINDR: Minute date register
RHRDR: Hour date register
Interrupt
control circuit
RWKDR:
RTCCR1:
RTCCR2:
RTCFLG:
PSS:
Interrupt
Day-of-week date register
RTC control register 1
RTC control register 2
RTC interrupt flag register
Prescaler S
Figure 10.1 Block Diagram of RTC
RTC3000A_0000220040500
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Section 10 Realtime Clock (RTC)
10.2
Input/Output Pin
Table 10.1 shows the RTC input/output pin.
Table 10.1 Pin Configuration
Name
Abbreviation
I/O
Function
Clock output
TMOW
Output
RTC divided clock output
10.3
Register Descriptions
The RTC has the following registers.
• Second data register/free running counter data register (RSECDR)
• Minute data register (RMINDR)
• Hour data register (RHRDR)
• Day-of-week data register (RWKDR)
• RTC control register 1 (RTCCR1)
• RTC control register 2 (RTCCR2)
• Clock source select register (RTCCSR)
• RTC Interrupt flag register (RTCFLG)
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Section 10 Realtime Clock (RTC)
10.3.1
Second Data Register/Free Running Counter Data Register (RSECDR)
RSECDR counts the BCD-coded second value. The setting range is decimal 00 to 59. It is an 8-bit
read register used as a counter, when it operates as a free running counter. For more information
on reading seconds, minutes, hours, and day-of-week, see section 10.4.3, Data Reading Procedure.
Bit
Bit Name
Initial
Value
R/W
Description
7
BSY
—
R
RTC Busy
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6
5
4
3
2
1
0
SC12
SC11
SC10
SC03
SC02
SC01
SC00
—
—
—
—
—
—
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Counting Ten's Position of Seconds
Counts on 0 to 5 for 60-second counting.
10.3.2
Minute Data Register (RMINDR)
Counting One's Position of Seconds
Counts on 0 to 9 once per second. When a carry is
generated, 1 is added to the ten's position.
RMINDR counts the BCD-coded minute value on the carry generated once per minute by the
RSECDR counting. The setting range is decimal 00 to 59.
Bit
Bit Name
Initial
Value
R/W
Description
7
BSY
—
R
RTC Busy
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6
5
4
3
2
1
0
MN12
MN11
MN10
MN03
MN02
MN01
MN00
—
—
—
—
—
—
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Counting Ten's Position of Minutes
Counts on 0 to 5 for 60-minute counting.
Counting One's Position of Minutes
Counts on 0 to 9 once per minute. When a carry is
generated, 1 is added to the ten's position.
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Section 10 Realtime Clock (RTC)
10.3.3
Hour Data Register (RHRDR)
RHRDR counts the BCD-coded hour value on the carry generated once per hour by RMINDR.
The setting range is either decimal 00 to 11 or 00 to 23 by the selection of the 12/24 bit in
RTCCR1.
Bit
Bit Name
Initial
Value
R/W
Description
7
BSY
—
R
RTC Busy
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6
—
0
—
Reserved
This bit is always read as 0.
5
HR11
—
R/W
Counting Ten's Position of Hours
4
HR10
—
R/W
Counts on 0 to 2 for ten's position of hours.
3
HR03
—
R/W
Counting One's Position of Hours
2
HR02
—
R/W
1
HR01
—
R/W
Counts on 0 to 9 once per hour. When a carry is
generated, 1 is added to the ten's position.
0
HR00
—
R/W
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Section 10 Realtime Clock (RTC)
10.3.4
Day-of-Week Data Register (RWKDR)
RWKDR counts the BCD-coded day-of-week value on the carry generated once per day by
RHRDR. The setting range is decimal 0 to 6 using bits WK2 to WK0.
Bit
Bit Name
Initial
Value
R/W
Description
7
BSY
—
R
RTC Busy
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6 to 3
—
All 0
—
Reserved
These bits are always read as 0.
2
WK2
—
R/W
Day-of-Week Counting
1
WK1
—
R/W
Day-of-week is indicated with a binary code
0
WK0
—
R/W
000: Sunday
001: Monday
010: Tuesday
011: Wednesday
100: Thursday
101: Friday
110: Saturday
111: Setting prohibited
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Section 10 Realtime Clock (RTC)
10.3.5
RTC Control Register 1 (RTCCR1)
RTCCR1 controls start/stop and reset of the clock timer. For the definition of time expression, see
figure 10.2.
Bit
Bit Name
Initial
Value
R/W
Description
7
RUN
—
R/W
RTC Operation Start
0: Stops RTC operation
1: Starts RTC operation
6
12/24
—
R/W
Operating Mode
0: RTC operates in 12-hour mode. RHRDR counts on 0
to 11.
1: RTC operates in 24-hour mode. RHRDR counts on 0
to 23.
5
PM
—
R/W
A.m./P.m.
0: Indicates a.m. when RTC is in the 12-hour mode.
1: Indicates p.m. when RTC is in the 12-hour mode.
4
RST
0
R/W
Reset
0: Normal operation
1: Resets registers and control circuits except RTCCSR
and this bit. Clear this bit to 0 after having been set
to 1.
3
—
0
R/W
Reserved
Only 0 can be written to this bit.
2 to 0
—
All 0
—
Reserved
These bits are always read as 0.
Noon
24-hour count 0
12-hour count 0
PM
1
1
2
2
3
3
4
4
5 6 7
5 6 7
0 (Morning)
8
8
9 10 11 12 13 14 15 16 17
9 10 11 0 1 2 3 4 5
1 (Afternoon)
24-hour count 18 19 20 21 22 23 0
12-hour count 6 7 8 9 10 11 0
1 (Afternoon)
0
PM
Figure 10.2 Definition of Time Expression
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Section 10 Realtime Clock (RTC)
10.3.6
RTC Control Register 2 (RTCCR2)
RTCCR2 controls RTC periodic interrupts of week, day, hour, minute, one second, 0.5 seconds,
and 0.25 seconds. Enabling interrupts of week, day, hour, minute, one second, 0.5 seconds, and
0.25 seconds sets the corresponding flag to 1 in the RTC interrupt flag register (RTCFLG) when
an interrupt occurs. It also controls an overflow interrupt of a free running counter when RTC
operates as a free running counter.
Bit
Bit Name
Initial
Value
R/W
Description
7
FOIE
—
R/W
Free Running Counter Overflow Interrupt Enable
0: Disables an overflow interrupt
1: Enables an overflow interrupt
6
WKIE
—
R/W
Week Periodic Interrupt Enable
0: Disables a week periodic interrupt
1: Enables a week periodic interrupt
5
DYIE
—
R/W
Day Periodic Interrupt Enable
0: Disables a day periodic interrupt
1: Enables a day periodic interrupt
4
HRIE
—
R/W
Hour Periodic Interrupt Enable
0: Disables an hour periodic interrupt
1: Enables an hour periodic interrupt
3
MNIE
—
R/W
Minute Periodic Interrupt Enable
0: Disables a minute periodic interrupt
1: Enables a minute periodic interrupt
2
1SEIE
—
R/W
One-Second Periodic Interrupt Enable
0: Disables a one-second periodic interrupt
1: Enables a one-second periodic interrupt
1
05SEIE
—
R/W
0.5-Second Periodic Interrupt Enable
0: Disables a 0.5-second periodic interrupt
1: Enables a 0.5-second periodic interrupt
0
025SEIE
—
R/W
0.25-Second Periodic Interrupt Enable
0: Disables a 0.25-second periodic interrupt
1: Enables a 0.25-second periodic interrupt
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Section 10 Realtime Clock (RTC)
10.3.7
Clock Source Select Register (RTCCSR)
RTCCSR selects clock source. A free running counter controls start/stop of counter operation by
the RUN bit in RTCCR1. When a clock other than φw/4 is selected, the RTC is disabled and
operates as an 8-bit free running counter. When the RTC operates as an 8-bit free running counter,
RSECDR enables counter values to be read. An interrupt can be generated by setting 1 to the
FOIE bit in RTCCR2 and enabling an overflow interrupt of the free running counter. A clock in
which the system clock is divided by 32, 16, 8, or 4 is output in active or sleep mode.
Bit
Bit Name
Initial
Value
R/W
Description
7
—
0
—
Reserved
6
RCS6
0
R/W
Clock Output Selection
5
RCS5
0
R/W
4
SUB32K
0
R/W
Select a clock output from the TMOW pin when setting
the TMOW bit in PMR3 to 1.
This bit is always read as 0.
000: φ/4
010: φ/8
100: φ/16
110: φ/32
xx1: φw
3
RCS3
1
R/W
Clock Source Selection
2
RCS2
0
R/W
0000: φ/8⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
1
RCS1
0
R/W
0001: φ/32⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0
RCS0
0
R/W
0010: φ/128⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0011: φ/256⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0100: φ/512⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0101: φ/2048⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0110: φ/4096⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0111: φ/8192⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
1000: φw/4⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ RTC operation
Settings other than the above are prohibited.
[Legend]
x: Don't care.
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Section 10 Realtime Clock (RTC)
10.3.8
RTC Interrupt Flag Register (RTCFLG)
RTCFLG sets the corresponding flag when an interrupt occurs. Each flag is not cleared
automatically even if the interrupt is accepted. To clear the flag, 0 should be written to the flag.
Bit
Bit Name
Initial
Value
R/W
Description
7
FOIFG

R/W*
6
WKIFG

R/W*
5
DYIFG

R/W*
4
HRIFG

R/W*
3
MNIFG

R/W*
2
SEIFG

R/W*
1
05SEIFG

R/W*
0
025SEIFG 
R/W*
[Setting condition]
When a free running counter overflows
[Clearing condition]
0 is written to FOIFG when FOIFG = 1
[Setting condition]
When a week periodic interrupt occurs
[Clearing condition]
0 is written to WKIFG when WKIFG = 1
[Setting condition]
When a day periodic interrupt occurs
[Clearing condition]
0 is written to DYIFG when DYIFG = 1
[Setting condition]
When an hour periodic interrupt occurs
[Clearing condition]
0 is written to HRIFG when HRIFG = 1
[Setting condition]
When a minute periodic interrupt occurs
[Clearing condition]
0 is written to MNIFG when MNIFG = 1
[Setting condition]
When a one-second periodic interrupt occurs
[Clearing condition]
0 is written to SEIFG when SEIFG = 1
[Setting condition]
When a 0.5-second periodic interrupt occurs
[Clearing condition]
0 is written to 05SEIFG when 05SEIFG = 1
[Setting condition]
When a 0.25-second periodic interrupt occurs
[Clearing condition]
0 is written to 025SEIFG when 025SEIFG = 1
Note:
*
Only 0 can be written to clear the flag.
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Section 10 Realtime Clock (RTC)
10.4
Operation
10.4.1
Initial Settings of Registers after Power-On
The RTC registers that store second, minute, hour, and day-of week data are not reset by a RES
input. Therefore, all registers must be set to their initial values after power-on.
10.4.2
Initial Setting Procedure
Figure 10.3 shows the procedure for the initial setting of the RTC. To set the RTC again, also
follow this procedure.
RUN in RTCCR1 = 0
RST in RTCCR1 = 1
RST in RTCCR1 = 0
Set RTCCSR, RSECDR,
RMINDR, RHRDR,
RWKDR, 12/24 in
RTCCR1, and PM
RUN in RTCCR1 = 1
RTC operation is stopped.
RTC registers and clock count
controller are reset.
Clock output and clock source are
selected and second, minute, hour,
day-of-week, operating mode, and
a.m/p.m are set.
RTC operation is started.
Figure 10.3 Initial Setting Procedure
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Section 10 Realtime Clock (RTC)
10.4.3
Data Reading Procedure
When the seconds, minutes, hours, or day-of-week datum is updated while time data is being read,
the data obtained may not be correct, and so the time data must be read again. Figure 10.4 shows
an example in which correct data is not obtained. In this example, since only RSECDR is read
after data update, about 1-minute inconsistency occurs.
To avoid reading in this timing, the following processing must be performed.
1. Check the setting of the BSY bit, and when the BSY bit changes from 1 to 0, read from the
second, minute, hour, and day-of-week registers. When about 62.5 ms is passed after the BSY
bit is set to 1, the registers are updated, and the BSY bit is cleared to 0.
2. Making use of interrupts, read from the second, minute, hour, and day-of week registers after
the corresponding flag of RTCFLG is set to 1 and the BSY bit is confirmed to be 0.
3. Read from the second, minute, hour, and day-of week registers twice in a row, and if there is
no change in the read data, the read data is used.
Before update
RWKDR = H'03, RHDDR = H'13, RMINDR = H'46, RSECDR = H'59
Processing flow
BSY bit = 0
(1) Day-of-week data register read
H'03
(2) Hour data register read
H'13
(3) Minute data register read
H'46
BSY bit -> 1 (under data update)
After update
RWKDR = H'03, RHDDR = H'13, RMINDR = H'47, RSECDR = H'00
BSY bit -> 0
(4) Second data register read
H'00
Figure 10.4 Example: Reading of Inaccurate Time Data
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Section 10 Realtime Clock (RTC)
10.5
Interrupt Sources
There are eight kinds of RTC interrupts: a free-running counter overflow, week interrupt, day
interrupt, hour interrupt, minute interrupt, one-second interrupt, 0.5-second interrupt, and 0.25second interrupt.
When using an interrupt, initiate the RTC last after other registers are set.
When an interrupt request of the RTC occurs, the corresponding flag in RTCFLG is set to 1. When
clearing the flag, write 0.
Table 10.2 shows a interrupt sources.
Table 10.2 Interrupt Sources
Interrupt Name
Interrupt Source
Interrupt Enable Bit
Overflow interrupt
Occurs when the free running counter is
overflown.
FOIE
Week periodic interrupt
Occurs every week when the day-of-week date WKIE
register value becomes 0.
Day periodic interrupt
Occurs every day when the day-of-week date
register is counted.
Hour periodic interrupt
Occurs every hour when the hour date register HRIE
is counted.
Minute periodic interrupt
Occurs every minute when the minute date
register is counted.
MNIE
One-second periodic
interrupt
Occurs every second when the one-second
date register is counted.
1SEIE
0.5-second periodic
interrupt
Occurs every 0.5 seconds.
05SEIE
0.25-second periodic
interrupt
Occurs every 0.25 seconds.
025SEIE
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DYIE
Section 10 Realtime Clock (RTC)
10.6
Usage Note
10.6.1
Note on Clock Count
The subclock must be connected to the 32.768-kHz resonator. When the 38.4-kHz resonator etc. is
connected, the correct time count is not possible.
10.6.2
Notes on Using Interrupts
The RTC register is not initialized by a reset trigged by the RES pin, the power-on reset circuit, or
a WDT overflow. As a result, its contents are undefined after power-on. Therefore, when using the
RTC interrupt, always initialize the RTC register before setting IENRTC in IENR1 to 1.
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Section 10 Realtime Clock (RTC)
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Section 11 Timer F
Section 11 Timer F
The timer F is a 16-bit timer having an output compare function. The timer F also provides for
external event counting, and counter resetting, interrupt request generation, toggle output, etc.,
using compare match signals. Thus, it can be applied to various systems. The timer F can also be
used as two independent 8-bit timers (timer FH and timer FL). Figure 11.1 shows a block diagram
of the timer F.
11.1
Features
• Choice of five counter input clocks
Internal clocks (φ/32, φ/16, φ/4, and φW/4) or external clocks can be selected.
• Toggle output function
Toggle output is performed to the TMOFH or TMOFL pin using a compare match signal.
The initial value of toggle output can be set.
• Counter resetting by a compare match signal
• Two interrupt sources: One compare match, one overflow
• Choice of 16-bit or 8-bit mode by settings of bits CKSH2 to CKSH0 in TCRF
• Can operate in watch mode, subactive mode, and subsleep mode
When φW/4 is selected as an internal clock, the timer F can operate in watch mode, subactive
mode, and subsleep mode.
• Use of module standby mode enables this module to be placed in standby mode independently
when not used. (For details, refer to section 6.4, Module Standby Function.)
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Section 11 Timer F
φ
PSS
IRRTFL
TCRF
φW/4
TMIF
TCFL
Toggle
circuit
Comparator
Internal data bus
TMOFL
OCRFL
TCFH
Toggle
circuit
TMOFH
Comparator
[Legend]
TCRF:
TCSRF:
TCFH:
TCFL:
OCRFH:
OCRFL:
IRRTFH:
IRRTFL:
PSS:
OCRFH
Timer control register F
Timer control status register F
8-bit timer counter FH
8-bit timer counter FL
Output compare register FH
Output compare register FL
Timer FH interrupt request flag
Timer FL interrupt request flag
Prescaler S
TCSRF
IRRTFH
Figure 11.1 Block Diagram of Timer F
11.2
Input/Output Pins
Table 11.1 shows the input/output pins of the timer F.
Table 11.1 Pin Configuration
Name
Abbreviation
I/O
Function
Timer F event input
TMIF
Input
Event input pin to TCFL
Timer FH output
TMOFH
Output
Timer FH toggle output pin
Timer FL output
TMOFL
Output
Timer FL toggle output pin
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Match
Section 11 Timer F
11.3
Register Descriptions
The timer F has the following registers.
• Timer counters FH and FL (TCFH, TCFL)
• Output compare registers FH and FL (OCRFH, OCRFL)
• Timer control register F (TCRF)
• Timer control/status register F (TCSRF)
11.3.1
Timer Counters FH and FL (TCFH, TCFL)
TCF is a 16-bit read/write up-counter configured by cascaded connection of 8-bit timer counters
TCFH and TCFL. In addition to the use of TCF as a 16-bit counter with TCFH as the upper 8 bits
and TCFL as the lower 8 bits, TCFH and TCFL can also be used as independent 8-bit counters.
TCFH and TCFL are initialized to H'00 upon a reset.
(1)
16-Bit Mode (TCF)
When CKSH2 is cleared to 0 in TCRF, TCF operates as a 16-bit counter. The TCF input clock is
selected by bits CKSL2 to CKSL0 in TCRF.
TCF can be cleared in the event of a compare match by means of CCLRH in TCSRF.
When TCF overflows from H'FFFF to H'0000, OVFH is set to 1 in TCSRF. If OVIEH in TCSRF
is 1 at this time, IRRTFH is set to 1 in IRR2, and if IENTFH in IENR2 is 1, an interrupt request is
sent to the CPU.
(2)
8-Bit Mode (TCFH/TCFL)
When CKSH2 is set to 1 in TCRF, TCFH and TCFL operate as two independent 8-bit counters.
The TCFH (TCFL) input clock is selected by bits CKSH2 to CKSH0 (CKSL2 to CKSL0) in
TCRF.
TCFH (TCFL) can be cleared in the event of a compare match by means of CCLRH (CCLRL) in
TCSRF.
When TCFH (TCFL) overflows from H'FF to H'00, OVFH (OVFL) is set to 1 in TCSRF. If
OVIEH (OVIEL) in TCSRF is 1 at this time, IRRTFH (IRRTFL) is set to 1 in IRR2, and if
IENTFH (IENTFL) in IENR2 is 1, an interrupt request is sent to the CPU.
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Section 11 Timer F
11.3.2
Output Compare Registers FH and FL (OCRFH, OCRFL)
OCRF is a 16-bit read/write register composed of the two registers OCRFH and OCRFL. In
addition to the use of OCRF as a 16-bit register with OCRFH as the upper 8 bits and OCRFL as
the lower 8 bits, OCRFH and OCRFL can also be used as independent 8-bit registers.
(1)
16-Bit Mode (OCRF)
When CKSH2 is cleared to 0 in TCRF, OCRF operates as a 16-bit register. OCRF contents are
constantly compared with TCF, and when both values match, CMFH is set to 1 in TCSRF. At the
same time, IRRTFH is set to 1 in IRR2. If IENTFH in IENR2 is 1 at this time, an interrupt request
is sent to the CPU.
Toggle output can be provided from the TMOFH pin by means of compare matches, and the
output level can be set by means of the TOLH bit in TCRF.
(2)
8-Bit Mode (OCRFH/OCRFL)
When CKSH2 is set to 1 in TCRF, OCRFH and OCRFL operate as two independent 8-bit
registers. OCRFH contents are compared with TCFH, and OCRFL contents are with TCFL. When
the OCRFH (OCRFL) and TCFH (TCFL) values match, CMFH (CMFL) is set to 1 in TCSRF. At
the same time, IRRTFH (IRRTFL) is set to 1 in IRR2. If IENTFH (IENTFL) in IENR2 is 1 at this
time, an interrupt request is sent to the CPU.
Toggle output can be provided from the TMOFH pin (TMOFL pin) by means of compare
matches, and the output level can be set by means of the TOLH (TOLL) bit in TCRF.
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Section 11 Timer F
11.3.3
Timer Control Register F (TCR)
TCRF switches between 16-bit mode and 8-bit mode, selects the input clock from among four
internal clock sources, and selects the output level of the TMOFH and TMOFL pins.
Bit
Bit Name
Initial
Value
R/W
Description
7
TOLH
0
W
Toggle Output Level H
Sets the TMOFH pin output level.
0: Low level
1: High level
6
5
4
CKSH2
CKSH1
CKSH0
0
0
0
W
W
W
Clock Select H
Select the clock input to TCFH from among four internal
clock sources or TCFL overflow.
000: 16-bit mode, counting on TCFL overflow signal
001: 16-bit mode, counting on TCFL overflow signal
010: 16-bit mode, counting on TCFL overflow signal
011: Using prohibited
100: 8-bit mode, counting on φ/32
101: 8-bit mode, counting on φ/16
110: 8-bit mode, counting on φ/4
111: 8-bit mode, counting on φW/4
3
TOLL
0
W
Toggle Output Level L
Sets the TMOFL pin output level.
0: Low level
1: High level
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Section 11 Timer F
Bit
Bit Name
Initial
Value
R/W
Description
2
1
0
CKSL2
CKSL1
CKSL0
0
0
0
W
W
W
Clock Select L
Select the clock input to TCFL from among four internal
clock sources or external event input.
000: Counting on a rising or falling edge of an external
event (TMIF pin)*
001: Counting on a rising or falling edge of an external
event (TMIF pin)*
010: Counting on a rising or falling edge of an external
event (TMIF pin)*
011: Using prohibited
100: Internal clock: counting on φ/32
101: Internal clock: counting on φ/16
110: Internal clock: counting on φ/4
111: Internal clock: counting on φW/4
Note:
11.3.4
*
The TMIFEG bit in IEGR selects which edge of an external event is used for counting.
Timer Control/Status Register F (TCSRF)
TCSRF performs counter clear selection, overflow flag setting, and compare match flag setting,
and controls enabling of overflow interrupt requests.
Bit
Bit Name
Initial
Value
R/W
Description
7
OVFH
0
R/W*
Timer Overflow Flag H
[Setting condition]
When TCFH overflows from H'FF to H'00
[Clearing condition]
When this bit is written to 0 after reading OVFH = 1
6
CMFH
0
R/W*
Compare Match Flag H
This is a status flag indicating that TCFH has matched
OCRFH.
[Setting condition]
When the TCFH value matches the OCRFH value
[Clearing condition]
When this bit is written to 0 after reading CMFH = 1
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Section 11 Timer F
Bit
Bit Name
Initial
Value
R/W
Description
5
OVIEH
0
R/W
Timer Overflow Interrupt Enable H
Selects enabling or disabling of interrupt generation
when TCFH overflows.
0: TCFH overflow interrupt request is disabled
1: TCFH overflow interrupt request is enabled
4
CCLRH
0
R/W
Counter Clear H
In 16-bit mode, this bit selects whether TCF is cleared
when TCF and OCRF match. In 8-bit mode, this bit
selects whether TCFH is cleared when TCFH and
OCRFH match.
In 16-bit mode:
0: TCF clearing by compare match is disabled
1: TCF clearing by compare match is enabled
In 8-bit mode:
0: TCFH clearing by compare match is disabled
1: TCFH clearing by compare match is enabled
3
OVFL
0
R/W*
Timer Overflow Flag L
This is a status flag indicating that TCFL has
overflowed.
[Setting condition]
When TCFL overflows from H'FF to H'00
[Clearing condition]
When this bit is written to 0 after reading OVFL = 1
2
CMFL
0
R/W*
Compare Match Flag L
This is a status flag indicating that TCFL has matched
OCRFL.
[Setting condition]
When the TCFL value matches the OCRFL value
[Clearing condition]
When this bit is written to 0 after reading CMFL = 1
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Section 11 Timer F
Bit
Bit Name
Initial
Value
R/W
Description
1
OVIEL
0
R/W
Timer Overflow Interrupt Enable L
Selects enabling or disabling of interrupt generation
when TCFL overflows.
0: TCFL overflow interrupt request is disabled
1: TCFL overflow interrupt request is enabled
0
CCLRL
0
R/W
Counter Clear L
Selects whether TCFL is cleared when TCFL and
OCRFL match.
0: TCFL clearing by compare match is disabled
1: TCFL clearing by compare match is enabled
Note:
*
11.4
Only 0 can be written to clear the flag.
Operation
The timer F is a 16-bit counter that increments on each input clock pulse. The timer F value is
constantly compared with the value set in the output compare register F, and the counter can be
cleared, an interrupt requested, or port output toggled, when the two values match. The timer F
can also be used as two independent 8-bit timers.
11.4.1
Timer F Operation
The timer F has two operating modes, 16-bit timer mode and 8-bit timer mode. The operation in
each of these modes is described below.
(1)
Operation in 16-Bit Timer Mode
When the CKSH2 bit is cleared to 0 in TCRF, the timer F operates as a 16-bit timer.
Following a reset, TCF is initialized to H'0000, OCRF to H'FFFF, and TCRF and TCSRF to H'00.
The counter is incremented by an input signal from an external event (TMIF pin). The TMIFEG
bit in IEGR selects which edge of an external event is used for counting.
The timer F operating clock can be selected from internal clocks or external events according to
settings of bits CKSL2 to CKSL0 in TCRF.
OCRF contents are constantly compared with TCF, and when both values match, CMFH is set to
1 in TCSRF. If IENTFH in IENR2 is 1 at this time, an interrupt request is sent to the CPU, and at
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Section 11 Timer F
the same time, TMOFH pin output is toggled. If CCLRH in TCSRF is 1, TCF is cleared. The
output level of the TMOFH pin can be set by the TOLH bit in TCRF.
When TCF overflows from H'FFFF to H'0000, OVFH is set to 1 in TCSRF. If OVIEH in TCSRF
and IENTFH in IENR2 are both 1, an interrupt request is sent to the CPU.
(2)
Operation in 8-Bit Timer Mode
When CKSH2 is set to 1 in TCRF, TCF operates as two independent 8-bit timers, TCFH and
TCFL. The TCFH/TCFL input clock is selected by CKSH2 to CKSH0/CKSL2 to CKSL0 in
TCRF.
When the OCRFH/OCRFL and TCFH/TCFL values match, CMFH/CMFL is set to 1 in TCSRF. If
IENTFH/IENTFL in IENR2 is 1, an interrupt request is sent to the CPU, and at the same time,
TMOFH pin/TMOFL pin output is toggled. If CCLRH/CCLRL in TCSRF is 1, TCFH/TCFL is
cleared. The output level of the TMOFH pin/TMOFL pin can be set by TOLH/TOLL in TCRF.
When TCFH/TCFL overflows from H'FF to H'00, OVFH/OVFL is set to 1 in TCSRF. If
OVIEH/OVIEL in TCSRF and IENTFH/IENTFL in IENR2 are both 1, an interrupt request is sent
to the CPU.
11.4.2
(1)
TCF Increment Timing
Internal Clock Operation
TCF is incremented by internal clock or external event input. Bits CKSH2 to CKSH0 or CKSL2 to
CKSL0 in TCRF select one of internal clock sources (φ/32, φ/16, φ/4, or φW/4) created by dividing
the system clock (φ or φW).
(2)
External Event Operation
When the CKSL2 bit in TCRF is cleared to 0, external event input is selected. The counter is
incremented at both rising and falling edges of external events. The TMIFEG bit in IEGR selects
which edge of an external event is used for counting. The external event pulse width requires
clock time longer than 2 system clocks (φ), or 2 subclocks (φSUB), depending on the operating
mode. Note that an external event does not operate correctly with the lower pulse width.
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Section 11 Timer F
11.4.3
TMOFH/TMOFL Output Timing
In TMOFH/TMOFL output, the value set in TOLH/TOLL in TCRF is output. The output is
toggled by the occurrence of a compare match.
Figure 11.2 shows the output timing.
φ
TMIF
(TMIFEG = 1)
Count input clock
N
TCF
OCRF
N+1
N
N
N
Compare match signal
TMOFH, TMOFL
Figure 11.2 TMOFH/TMOFL Output Timing
11.4.4
TCF Clear Timing
TCF can be cleared by a compare match with OCRF.
11.4.5
Timer Overflow Flag (OVF) Set Timing
OVF is set to 1 when TCF overflows from H'FFFF to H'0000.
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N+1
Section 11 Timer F
11.4.6
Compare Match Flag Set Timing
The compare match flag (CMFH or CMFL) is set to 1 when the TCF and OCRF values match.
The compare match signal is generated in the last state during which the values match (when TCF
is updated from the matching value to a new value). When TCF matches OCRF, the compare
match signal is not generated until the next counter clock.
11.5
Timer F Operating States
The timer F operating states are shown in table 11.2.
Table 11.2 Timer F Operating States
Operating
Mode
Reset
Active
Sleep
Watch
Sub-active Sub-sleep Standby
Module
Standby
TCF
Reset
Functions*
Functions*
Functions/
Functions/
Functions/
Halted
Halted
Halted*
Halted*
Halted*
OCRF
Reset
Functions
Retained
Retained
Functions
Retained
Retained
Retained
TCRF
Reset
Functions
Retained
Retained
Functions
Retained
Retained
Retained
TCSRF
Reset
Functions
Retained
Retained
Functions
Retained
Retained
Retained
Note:
*
When φW/4 is selected as the TCF internal clock in active mode or sleep mode, since
the system clock and internal clock are mutually asynchronous, synchronization is
maintained by a synchronization circuit. This results in a maximum count cycle error of
1/φ (s). When the counter is operated in subactive mode, watch mode, or subsleep
mode, φW /4 must be selected as the internal clock. The counter will not operate if any
other internal clock is selected.
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Section 11 Timer F
11.6
Usage Notes
The following types of contention and operation can occur when the timer F is used.
11.6.1
16-Bit Timer Mode
In toggle output, TMOFH pin output is toggled when all 16 bits match and a compare match
signal is generated. If a TCRF write by a MOV instruction and generation of the compare match
signal occur simultaneously, TOLH data is output to the TMOFH pin as a result of the TCRF
write. TMOFL pin output is unstable in 16-bit mode, and should not be used; the TMOFL pin
should be used as a port pin.
If an OCRFL write and compare match signal generation occur simultaneously, the compare
match signal is invalid. However, a compare match signal may or may not be generated when the
written data and the counter value match. As the compare match signal is output in
synchronization with the TCFL clock, a compare match will not result in compare match signal
generation if the clock is stopped.
Compare match flag CMFH is set when all 16 bits match and a compare match signal is generated.
Compare match flag CMFL is set if the setting conditions for the lower 8 bits are satisfied.
When TCF overflows, OVFH is set. OVFL is set if the setting conditions are satisfied when the
lower 8 bits overflow. If a TCFL write and overflow signal output occur simultaneously, the
overflow signal is not output.
11.6.2
(1)
8-Bit Timer Mode
TCFH, OCRFH
In toggle output, TMOFH pin output is toggled when a compare match occurs. If a TCRF write by
a MOV instruction and generation of the compare match signal occur simultaneously, TOLH data
is output to the TMOFH pin as a result of the TCRF write.
If an OCRFH write and compare match signal generation occur simultaneously, the compare
match signal is invalid. However, a compare match signal may or may not be generated when the
written data and the counter value match. The compare match signal is output in synchronization
with the TCFH clock.
If a TCFH write and overflow signal output occur simultaneously, the overflow signal is not
output.
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Section 11 Timer F
(2)
TCFL, OCRFL
In toggle output, TMOFL pin output is toggled when a compare match occurs. If a TCRF write by
a MOV instruction and generation of the compare match signal occur simultaneously, TOLL data
is output to the TMOFL pin as a result of the TCRF write.
If an OCRFL write and compare match signal generation occur simultaneously, the compare
match signal is invalid. However, a compare match signal may or may not be generated when the
written data and the counter value match. As the compare match signal is output in
synchronization with the TCFL clock, a compare match will not result in compare match signal
generation if the clock is stopped.
If a TCFL write and overflow signal output occur simultaneously, the overflow signal is not
output.
11.6.3
Flag Clearing
When φW/4 is selected as the internal clock, "Interrupt source generation signal" will be operated
with φW and the signal will be outputted with φW width. And, "Overflow signal" and "Compare
match signal" are controlled with 2 cycles of φW signals. Those signals are output with 2-cycle
width of φW (figure 11.3)
In active (high-speed, medium-speed) mode, even if you cleared interrupt request flag during the
term of validity of "Interrupt source generation signal", same interrupt request flag is set. (1 in
figure 11.3) And, the timer overflow flag and compare match flag cannot be cleared during the
term of validity of "Overflow signal" and "Compare match signal".
For interrupt request flag is set right after interrupt request is cleared, interrupt process to one time
timer FH, timer FL interrupt might be repeated. (2 in figure 11.3) Therefore, to definitely clear
interrupt request flag in active (high-speed, medium-speed) mode, clear should be processed after
the time that calculated with below (1) formula. And, to definitely clear timer overflow flag and
compare match flag, clear should be processed after read timer control status register F (TCSRF)
after the time that calculated with below (1) formula.
For ST of (1) formula, please substitute the longest number of execution states in used instruction.
In subactive mode, there are not limitation for interrupt request flag, timer overflow flag, and
compare match flag clear.
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Section 11 Timer F
The term of validity of "Interrupt source generation signal"
= 1 cycle of φW + waiting time for completion of executing instruction
+ interrupt time synchronized with φ
= 1/φW + ST × (1/φ) + (2/φ) (second).....(1)
ST: Executing number of execution states
Method 1 is recommended to operate for time efficiency.
Method 1
1.
Prohibit interrupt in interrupt handling routine (set IENFH, IENFL to 0).
2.
After program process returned normal handling, clear interrupt request flags (IRRTFH,
IRRTFL) after more than that calculated with (1) formula.
3.
After reading the timer control status register F (TCSRF), clear the timer overflow flags
(OVFH, OVFL) and compare match flags (CMFH, CMFL).
4.
Enable interrupts (set IENFH, IENFL to 1).
Method 2
1.
Set interrupt handling routine time to more than time that calculated with (1) formula.
2.
Clear interrupt request flags (IRRTFH, IRRTFL) at the end of interrupt handling routine.
3.
After read timer control status register F (TCSRF), clear timer overflow flags (OVFH,
OVFL) and compare match flags (CMFH, CMFL).
All above attentions are also applied in 16-bit mode and 8-bit mode.
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Section 11 Timer F
Interrupt request
flag clear
2
Program processing
Interrupt
Interrupt request
flag clear
Interrupt
Normal
φW
Interrupt source generation
signal (internal signal,
nega-active)
Overflow signal, compare
match signal (internal signal,
nega-active)
Interrupt request flag
(IRRTFH, IRRTFL)
1
Figure 11.3 Clear Interrupt Request Flag when
Interrupt Source Generation Signal is Valid
11.6.4
Timer Counter (TCF) Read/Write
When φW/4 is selected as the internal clock in active (high-speed, medium-speed) mode, write on
TCF is impossible. And when reading TCF, as the system clock and internal clock are mutually
asynchronous, TCF synchronizes with synchronization circuit. This results in a maximum TCF
read value error of ±1.
When reading or writing TCF in active (high-speed, medium-speed) mode is needed, please select
the internal clock except for φW/4 before read/write is performed.
In subactive mode, even if φW /4 is selected as the internal clock, TCF can be read from or written
to normally.
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Section 11 Timer F
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Section 12 16-Bit Timer Pulse Unit (TPU)
Section 12 16-Bit Timer Pulse Unit (TPU)
The H8/38086R Group have an on-chip 16-bit timer pulse unit (TPU) comprised of two 16-bit
timer channels. The function list of the TPU is shown in table 12.1. A block diagram of the TPU is
shown in figure 12.1.
12.1
Features
• Maximum 4-pulse input/output
• Selection of 7 or 8 counter input clocks for each channel
• The following operations can be set for each channel:
Waveform output at compare match
Input capture function
Counter clear operation
Multiple timer counters (TCNT) can be written to simultaneously
Simultaneous clearing by compare match and input capture is possible
Register synchronous input/output is possible by synchronous counter operation
PWM output with any duty level is possible
A maximum 2-phase PWM output is possible in combination with synchronous operation
• Operation with cascaded connection
• Fast access via internal 16-bit bus
• 6-type interrupt sources
• Register data can be transmitted automatically
• Use of module standby mode enables this module to be placed in standby mode independently
when not used. (For details, refer to section 6.4, Module Standby Function.)
TIMTPU3B_000020020700
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Section 12 16-Bit Timer Pulse Unit (TPU)
Table 12.1 TPU Functions
Item
Channel 1
Channel 2
Count clock
φ/1
φ/4
φ/16
φ/64
φ/256
TCLKA
TCLKB
φ/1
φ/4
φ/16
φ/64
φ/1024
TCLKA
TCLKB
TCLKC
General registers (TGR)
TGRA_1
TGRB_1
TGRA_2
TGRB_2
I/O pins
TIOCA1
TIOCB1
TIOCA2
TIOCB2
Counter clear function
TGR compare match or input
capture
TGR compare match or input
capture
Compare
match
output
0 output
O
—
1 output
O
—
Toggle output
O
—
Input capture function
O
O
Synchronous operation
O
O
PWM mode
O
3 sources
O
3 sources
•
Compare match or input
capture 1A
•
Compare match or
input capture 2A
•
Compare match or
input capture 1B
•
Compare match or
input capture 2B
•
Overflow
•
Overflow
Interrupt sources
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Section 12 16-Bit Timer Pulse Unit (TPU)
TGRB
TGRB
TCNT
TCNT
TGRA
TSR
Module data bus
TIER
TIER
TSR
TIOR
TIOR
TGRA
Bus
interface
Internal data bus
TSTR
Control logic
TMDR
Channel 2
TCR
TMDR
Common
[Legend]
TSTR: Timer start register
TSYR: Timer synchro register
TCR: Timer control register
TMDR: Timer mode register
TCNT: Timer counter
Channel 1
Input pins
Channel 1: TIOCB1
Channel 2: TIOCB2
TCR
Input/output pins
Channel 1: TIOCA1
Channel 2: TIOCA2
Control logic for channels 1 and 2
External clock:
φ/4
φ/16
φ/64
φ/256
φ/1024
TCLKA
TCLKB
TCLKC
TSYR
Clock input
Internal clock: φ/1
Interrupt request signals
Channel 1: TGI1A
TGI1B
TCI1V
Channel 2: TGI2A
TGI2B
TCI2V
TIOR:
Timer I/O control registers
TIER:
Timer interrupt enable register
TSR:
Timer status register
TGR (A, B): TImer general registers (A, B)
Figure 12.1 Block Diagram of TPU
12.2
Input/Output Pins
Table 12.2 Pin Configuration
Channel
Symbol
I/O
Function
Common
TCLKA
Input
External clock A input pin
TCLKB
Input
External clock B input pin
TCLKC
Input
External clock C input pin
TIOCA1
I/O
TGRA_1 input capture input/output compare
output/PWM output pin
TIOCB1
Input
TGRB_1 input capture input
TIOCA2
I/O
TGRA_2 input capture input/output compare
output/PWM output pin
TIOCB2
Input
TGRB_2 input capture input
1
2
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.3
Register Descriptions
The TPU has the following registers for each channel.
Channel 1:
• Timer control register_1 (TCR_1)
• Timer mode register_1 (TMDR_1)
• Timer I/O control register_1 (TIOR_1)
• Timer interrupt enable register_1 (TIER_1)
• Timer status register_1 (TSR_1)
• Timer counter_1 (TCNT_1)
• Timer general register A_1 (TGRA_1)
• Timer general register B_1 (TGRB_1)
Channel 2:
• Timer control register_2 (TCR_2)
• Timer mode register_2 (TMDR_2)
• Timer I/O control register_2 (TIOR_2)
• Timer interrupt enable register_2 (TIER_2)
• Timer status register_2 (TSR_2)
• Timer counter_2 (TCNT_2)
• Timer general register A_2 (TGRA_2)
• Timer general register B_2 (TGRB_2)
Common:
• Timer start register (TSTR)
• Timer synchro register (TSYR)
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.3.1
Timer Control Register (TCR)
TCR controls TCNT operation for each channel. The TPU has a total of two TCR registers, one
for each channel. TCR should be set when TCNT operation is stopped.
Bit
Bit Name
Initial
Value
R/W
Description
7

0

Reserved
6
CCLR1
0
R/W
Counter Clear 1 and 0
5
CCLR0
0
R/W
These bits select the TCNT counter clearing source.
See table 12.3 for details.
4
CKEG1
0
R/W
Clock Edge 1 and 0
3
CKEG0
0
R/W
These bits select the input clock edge. When the
internal clock is counted using both edges, the input
clock period is halved (e.g. φ/4 both edges = φ/2 rising
edge). Internal clock edge selection is valid when the
input clock is φ/4 or slower. If the input clock is φ/1, this
setting is ignored and count at a rising edge is selected.
This bit is always read as 0 and cannot be modified.
00: Count at rising edge
01: Count at falling edge
1X: Count at both edges
[Legend] X: Don't care
2
TPSC2
0
R/W
Timer Prescaler 2 to 0
1
TPSC1
0
R/W
0
TPSC0
0
R/W
These bits select the TCNT counter clock. The clock
source can be selected independently for each
channel. See tables12.4 and 12.5 for details.
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Section 12 16-Bit Timer Pulse Unit (TPU)
Table 12.3 CCLR1 and CCLR0 (Channels 1 and 2)
Channel
Bit 6
CCLR1
Bit 5
CCLR0
Description
1, 2
0
0
TCNT clearing disabled
1
TCNT cleared by TGRA compare match/input capture
0
TCNT cleared by TGRB compare match/input capture
1
TCNT cleared by counter clearing for another channel
performing synchronous clearing/synchronous
operation*
1
Note:
*
Synchronous operation is selected by setting the SYNC bit in TSYR to 1.
Table 12.4 TPSC2 to TPSC0 (Channel 1)
Bit 2
Channel TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
1
0
0
Internal clock: counts on φ/1
1
Internal clock: counts on φ/4
0
Internal clock: counts on φ/16
1
Internal clock: counts on φ/64
0
External clock: counts on TCLKA pin input
1
External clock: counts on TCLKB pin input
0
Internal clock: counts on φ/256
1
Counts on TCNT_2 overflow
0
1
1
0
1
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Section 12 16-Bit Timer Pulse Unit (TPU)
Table 12.5 TPSC2 to TPSC0 (Channel 2)
Bit 2
Channel TPSC2
Bit 1
TPSC1
Bit 0
TPSC0
Description
2
0
0
Internal clock: counts on φ/1
1
Internal clock: counts on φ/4
0
Internal clock: counts on φ/16
1
Internal clock: counts on φ/64
0
External clock: counts on TCLKA pin input
1
External clock: counts on TCLKB pin input
0
External clock: counts on TCLKC pin input
1
Internal clock: counts on φ/1024
0
1
1
0
1
12.3.2
Timer Mode Register (TMDR)
TMDR sets the operating mode for each channel. The TPU has a total of two TMDR registers, one
for each channel. TMDR should be set when TCNT operation is stopped.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6

All 1

Reserved
These bits are always read as 1 and cannot be
modified.
5, 4

All 0

Reserved
These bits are always read as 0 and cannot be
modified.
3, 2

All 0

Reserved
The write value should always be 0.
1
MD1
0
R/W
Modes 1 and 0
0
MD0
0
R/W
These bits set the timer operating mode.
See table 12.6 for details.
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Section 12 16-Bit Timer Pulse Unit (TPU)
Table 12.6 MD3 to MD0
Bit 1
MD1
Bit 0
MD0
Description
0
0
Normal operation
1
Reserved
0
PWM mode 1
1
PWM mode 2
1
12.3.3
Timer I/O Control Register (TIOR)
TIOR controls TGR. The TPU has a total of two TIOR registers, one for each channel. Care is
required as TIOR is affected by the TMDR setting.
The initial output specified by TIOR is valid when the counter is stopped (the CST bit in TSTR is
cleared to 0). Note also that, in PWM mode 2, the output at the point at which the counter is
cleared to 0 is specified.
• TIOR_1, TIOR_2
Bit
Bit Name
Initial
Value
R/W
Description
7
IOB3
All 0
R/W
I/O Control B3 to B0
6
IOB2
R/W
Specify the function of TGRB.
5
IOB1
R/W
For details, refer to tables 12.7 and 12.8.
4
IOB0
R/W
3
IOA3
2
All 0
R/W
I/O Control A3 to A0
IOA2
R/W
Specify the function of TGRA.
1
IOA1
R/W
For details, refer to tables 12.9 and 12.10.
0
IOA0
R/W
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Section 12 16-Bit Timer Pulse Unit (TPU)
Table 12.7 TIOR_1 (Channel 1)
Description
Bit 7
IOB3
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
TGRB_1
Function
0
0
0
0
Output
compare
register
1
1
0
0
0
TIOCB1 Pin Function
Output disabled
Setting prohibited
1
1
1
1
0
1
1
0
0
0
Input capture Capture input source is TIOCB1 pin
register
Input capture at rising edge
1
Capture input source is TIOCB1 pin
Input capture at falling edge
1
X
Capture input source is TIOCB1 pin
Input capture at both edges
1
X
X
Setting prohibited
[Legend]
X: Don't care
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Section 12 16-Bit Timer Pulse Unit (TPU)
Table 12.8 TIOR_2 (Channel 2)
Description
Bit 7
IOB3
Bit 6
IOB2
Bit 5
IOB1
Bit 4
IOB0
TGRB_2
Function
0
0
0
0
Output
compare
register
1
1
0
0
0
TIOCB2 Pin Function
Output disabled
Setting prohibited
1
1
1
1
0
1
1
X
0
0
Input capture Capture input source is TIOCB2 pin
register
Input capture at rising edge
1
Capture input source is TIOCB2 pin
Input capture at falling edge
1
X
Capture input source is TIOCB2 pin
Input capture at both edges
[Legend]
X: Don't care
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Section 12 16-Bit Timer Pulse Unit (TPU)
Table 12.9 TIOR_1 (Channel 1)
Description
Bit 3
IOA3
Bit 2
IOA2
Bit 1
IOA1
Bit 0
IOA0
TGRA_1
Function
0
0
0
0
Output
compare
register
1
TIOCA1 Pin Function
Output disabled
Initial output is 0
0 output at compare match
1
0
Initial output is 0
1 output at compare match
1
Initial output is 0
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1
0 output at compare match
1
0
Initial output is 1
1 output at compare match
1
Initial output is 1
Toggle output at compare match
1
0
0
0
1
Input
capture
register
Capture input source is TIOCA1 pin
Input capture at rising edge
Capture input source is TIOCA1 pin
Input capture at falling edge
1
X
Capture input source is TIOCA1 pin
Input capture at both edges
1
X
X
Setting prohibited
[Legend]
X: Don't care
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Section 12 16-Bit Timer Pulse Unit (TPU)
Table 12.10 TIOR_2 (Channel 2)
Description
Bit 3
IOA3
Bit 2
IOA2
Bit 1
IOA1
Bit 0
IOA0
TGRA_2
Function
0
0
0
0
Output
compare
register
1
TIOCA2 Pin Function
Output disabled
Initial output is 0
0 output at compare match
1
0
Initial output is 0
1 output at compare match
1
Initial output is 0
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1
0 output at compare match
1
0
Initial output is 1
1 output at compare match
1
Initial output is 1
Toggle output at compare match
1
X
0
0
Input capture Capture input source is TIOCA2 pin
register
Input capture at rising edge
1
Capture input source is TIOCA2 pin
Input capture at falling edge
1
X
Capture input source is TIOCA2 pin
Input capture at both edges
[Legend]
X: Don't care
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.3.4
Timer Interrupt Enable Register (TIER)
TIER controls enabling or disabling of interrupt requests for each channel. The TPU has a total of
two TIER registers, one for each channel.
Bit
Bit Name
Initial
Value
R/W
Description
7

0
R/W
Reserved
6

1

This bit is readable/writable.
Reserved
This bit is always read as 1 and cannot be modified.
5

0

Reserved
The write value should always be 0.
4
TCIEV
0
R/W
Overflow Interrupt Enable
Enables or disables interrupt requests (TCIV) by the
TCFV flag when the TCFV flag in TSR is set to 1.
0: Interrupt requests (TCIV) by TCFV disabled
1: Interrupt requests (TCIV) by TCFV enabled
3, 2

All 0

Reserved
These bits are always read as 0 and cannot be
modified.
1
TGIEB
0
R/W
TGR Interrupt Enable B
Enables or disables interrupt requests (TGIB) by the
TGFB bit when the TGFB bit in TSR is set to 1.
0: Interrupt requests (TGIB) by TGFB bit disabled
1: Interrupt requests (TGIB) by TGFB bit enabled
0
TGIEA
0
R/W
TGR Interrupt Enable A
Enables or disables interrupt requests (TGIA) by the
TGFA bit when the TGFA bit in TSR is set to 1.
0: Interrupt requests (TGIA) by TGFA bit disabled
1: Interrupt requests (TGIA) by TGFA bit enabled
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.3.5
Timer Status Register (TSR)
TSR indicates the status for each channel. The TPU has a total of two TSR registers, one for each
channel.
Bit
Bit Name
Initial
Value
R/W
Description
7, 6

All 1

Reserved
5

0

These bits are always read as 1 and cannot be modified.
Reserved
This bit is always read as 0 and cannot be modified.
4
TCFV
0
R/(W)* Overflow Flag
Status flag that indicates that TCNT overflow has
occurred.
[Setting condition]
When the TCNT value overflows (changes from H'FFFF
to H'0000 )
[Clearing condition]
When 0 is written to TCFV after reading TCFV = 1
3, 2

All 0

Reserved
These bits are always read as 0 and cannot be modified.
1
TGFB
0
R/(W)* Input Capture/Output Compare Flag B
Status flag that indicates the occurrence of TGRB input
capture or compare match.
[Setting conditions]
•
When TCNT = TGRB and TGRB is functioning as
output compare register
•
When TCNT value is transferred to TGRB by input
capture signal and TGRB is functioning as input
capture register
[Clearing condition]
•
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When 0 is written to TGFB after reading TGFB = 1
Section 12 16-Bit Timer Pulse Unit (TPU)
Bit
Bit Name
Initial
value
R/W
0
TGFA
0
R/(W)* Input Capture/Output Compare Flag A
Description
Status flag that indicates the occurrence of TGRA input
capture or compare match.
[Setting conditions]
•
When TCNT = TGRA and TGRA is functioning as
output compare register
•
When TCNT value is transferred to TGRA by input
capture signal and TGRA is functioning as input
capture register
[Clearing condition]
•
Note:
12.3.6
*
When 0 is written to TGFA after reading TGFA = 1
Only 0 can be written to clear the flag.
Timer Counter (TCNT)
TCNT is a 16-bit readable/writable counter. The TPU has a total of two TCNT counters, one for
each channel.
TCNT is initialized to H'0000 by a reset or in hardware standby mode.
TCNT cannot be accessed in 8-bit units; it must always be accessed in 16-bit units.
12.3.7
Timer General Register (TGR)
TGR is a 16-bit readable/writable register, functioning as either output compare or input capture
register. The TPU has a total of four TGR registers, two for each channel. TGR is initialized to
H'FFFF by a reset. TGR cannot be accessed in 8-bit units; it must always be accessed in 16-bit
units.
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.3.8
Timer Start Register (TSTR)
TSTR selects TCNT operation/stoppage for channels 1 and 2. TCNT starts counting for channel in
which the corresponding bit is set to 1. When setting the operating mode in TMDR or setting the
TCNT count clock in TCR, first stop the TCNT operation.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 3

All 0

Reserved
The write value should always be 0.
2
CST2
0
R/W
Counter Start 2 and 1
1
CST1
0
R/W
These bits select operation or stoppage for TCNT.
If 0 is written to the CST bit during operation with the
TIOC pin designated for output, the counter stops but the
output compare output level of the TIOC pin is retained. If
TIOR is written to when the CST bit is cleared to 0, the
pin output level will be changed to the set initial output
value.
0: TCNT_n count operation is stopped
1: TCNT_n performs count operation
(n = 2 or 1)
0

0

Reserved
The write value should always be 0.
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.3.9
Timer Synchro Register (TSYR)
TSYR selects independent operation or synchronous operation of TCNT for each channel.
Synchronous operation is performed for channel in which the corresponding bit in TSYR is set to
1.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 3

All 0

Reserved
The write value should always be 0.
2
SYNC2
0
R/W
Timer Synchro 2 and 1
1
SYNC1
0
R/W
These bits select whether operation is independent of or
synchronized with other channels.
When synchronous operation is selected, the TCNT
synchronous presetting of multiple channels, and
synchronous clearing by counter clearing on another
channel, are possible.
To set synchronous operation, the SYNC bits must be
set to 1. To set synchronous clearing, in addition to the
SYNC bit, the TCNT clearing source must also be set by
means of bits CCLR1 and CCLR0 in TCR.
0: TCNT_n operates independently (TCNT presetting/
clearing is unrelated to other channels)
1: TCNT_n performs synchronous operation
TCNT synchronous presetting/synchronous clearing
is possible
(n = 2 or 1)
0

0

Reserved
The write value should always be 0.
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.4
Interface to CPU
12.4.1
16-Bit Registers
TCNT and TGR are 16-bit registers. As the data bus to the CPU is 16 bits wide, these registers
cannot be read or written to in 8-bit units; 16-bit access must always be used.
An example of 16-bit register access operation is shown in figure 12.2.
CPU
Internal data bus
H
L
Module data bus
Bus interface
TCNTH
TCNTL
Figure 12.2 16-Bit Register Access Operation [CPU ↔ TCNT (16 Bits)]
12.4.2
8-Bit Registers
Registers other than TCNT and TGR are 8-bit. They can be read and written to in 8-bit units.
Examples of 8-bit register access operation are shown in figures 12.3 and 12.4.
Internal data bus
CPU
H
L
Module data bus
Bus interface
TCR
Figure 12.3 8-Bit Register Access Operation [CPU ↔ TCR (Upper 8 Bits)]
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Section 12 16-Bit Timer Pulse Unit (TPU)
CPU
Internal data bus
H
L
Module data bus
Bus interface
TMDR
Figure 12.4 8-Bit Register Access Operation [CPU ↔ TMDR (Lower 8 Bits)]
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.5
Operation
12.5.1
Basic Functions
Each channel has TCNT and TGR. TCNT performs up-counting, and is also capable of freerunning operation, periodic counting, and external event counting.
TGR can be used as an input capture register or output compare register.
(1)
Counter Operation
When one of bits CST1 and CST2 is set to 1 in TSTR, TCNT for the corresponding channel
begins counting. TCNT can operate as a free-running counter, periodic counter, for example.
(a)
Example of Count Operation Setting Procedure
Figure 12.5 shows an example of the count operation setting procedure.
Operation selection
Select counter clock
[1]
Periodic counter
Select counter clearing source
Free-running counter
[2]
[3]
Select output compare register
Set period
[4]
Start count operation
[5]
<Periodic counter>
Start count operation
<Free-running counter>
[1] Select the counter
clock with bits
TPSC2 to TPSC0 in
TCR. At the same
time, select the
input clock edge
with bits CKEG1
and CKEG0 in TCR.
[2] For periodic counter
operation, select
TGR to be used as
the TCNT clearing
source with bits
CCLR1 and CCLR0 in
TCR.
[3] Designate TGR
selected in [2] as an
output compare
register by means of
TIOR.
[4] Set the periodic
counter cycle in
TGR selected in [2].
[5] Set the CST bit in
TSTR to 1 to start
the counter
operation.
Figure 12.5 Example of Counter Operation Setting Procedure
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Section 12 16-Bit Timer Pulse Unit (TPU)
(b) Free-Running Count Operation and Periodic Count Operation
Immediately after a reset, the TPU's TCNT counters are all designated as free-running counters.
When the relevant bit in TSTR is set to 1, the corresponding TCNT starts up-count operation as a
free-running counter. When TCNT overflows (from H'FFFF to H'0000), the TCFV bit in TSR is
set to 1. If the value of the corresponding TCIEV bit in TIER is 1 at this point, the TPU requests
an interrupt. After overflow, TCNT starts counting up again from H'0000.
Figure 12.6 illustrates free-running counter operation.
TCNT value
H'FFFF
H'0000
Time
CST bit
TCFV
Figure 12.6 Free-Running Counter Operation
When compare match is selected as the TCNT clearing source, TCNT for the relevant channel
performs periodic count operation. TGR for setting the period is designated as an output compare
register, and counter clearing by compare match is selected by means of bits CCLR0 and CCLR1
in TCR. After the settings have been made, TCNT starts up-count operation as a periodic counter
when the corresponding bit in TSTR is set to 1. When the count value matches the value in TGR,
the TGF bit in TSR is set to 1 and TCNT is cleared to H'0000.
If the value of the corresponding TGIE bit in TIER is 1 at this point, the TPU requests an interrupt.
After a compare match, TCNT starts counting up again from H'0000.
Figure 12.7 illustrates periodic counter operation.
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Section 12 16-Bit Timer Pulse Unit (TPU)
TCNT value
Counter cleared by TGR
compare match
TGR
H'0000
Time
CST bit
Flag cleared by software
TGF
Figure 12.7 Periodic Counter Operation
(2)
Waveform Output by Compare Match
The TPU can perform 0, 1, or toggle output from the corresponding output pin using compare
match.
(a)
Example of Setting Procedure for Waveform Output by Compare Match
Figure 12.8 shows an example of the setting procedure for waveform output by compare match.
Input selection
[1]
Select waveform output mode
[2]
[3]
Set output timing
[1] Select 0 output or 1 output for initial value, and
0 output, 1 output, or toggle output, by for compare
match output value means of TIOR. The set
initial value is output at the TIOC pin until the
first compare match occurs.
[2] Set the timing for compare match generation in
TGR.
[3] Set the CST bit in TSTR to 1 to start the count
operation.
Start count operation
< Waveform output >
Figure 12.8 Example of Setting Procedure for Waveform Output by Compare Match
(b) Examples of Waveform Output Operation
Figure 12.9 shows an example of 1 output.
In this example, TCNT has been designated as a free-running counter, and settings have been
made such that 1 is output by compare match A. When the set level and the pin level match, the
pin level does not change.
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Section 12 16-Bit Timer Pulse Unit (TPU)
TCNT value
H'FFFF
TGRA
Time
H'0000
No change
No change
1 output
TIOCA
Figure 12.9 Example of 0 Output/1 Output Operation
Figure 12.10 shows an example of toggle output.
In this example, TCNT has been designated as a periodic counter (with counter clearing on
compare match A), and settings have been made such that the output is toggled by compare match
A.
TCNT value
Counter cleared by TGRB compare match
H'FFFF
TGRA
Time
H'0000
Toggle output
TIOCA
Figure 12.10 Example of Toggle Output Operation
(3)
Input Capture Function
The TCNT value can be transferred to TGR on detection of the TIOC pin input edge.
Rising edge, falling edge, or both edges can be selected as the detected edge.
(a)
Example of Input Capture Operation Setting Procedure
Figure 12.11 shows an example of the setting procedure for input capture operation.
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Section 12 16-Bit Timer Pulse Unit (TPU)
Input selection
Select input capture input
Start count
[1] Designate TGR as an input capture register by
means of TIOR, and select the input capture source
and, rising edge, falling edge, or both edges as the
input signal edge.
[1] [2] Set the CST bit in TSTR to 1 to start the count
operation.
[2]
<Input capture operation>
Figure 12.11 Example of Setting Procedure for Input Capture Operation
(b) Example of Input Capture Operation
Figure 12.12 shows an example of input capture operation.
In this example, both rising and falling edges have been selected as the input capture input edge of
the TIOCA pin, the falling edge has been selected as the input capture input edge of the TIOCB
pin, and counter clearing by TGRB input capture has been designated for TCNT.
Counter cleared by TIOCB
input (falling edge)
TCNT value
H'0180
H'0160
H'0010
H'0005
Time
H'0000
TIOCA
TGRA
H'0005
H'0160
H'0010
TIOCB
TGRB
H'0180
Figure 12.12 Example of Input Capture Operation
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.5.2
Synchronous Operation
In synchronous operation, the values in multiple TCNT counters can be rewritten simultaneously
(synchronous presetting). Also, multiple TCNT counters can be cleared simultaneously by making
the appropriate setting in TCR (synchronous clearing).
Synchronous operation enables TGR to be incremented with respect to a single time base.
Synchronous operation can be set for each channel.
(1)
Example of Synchronous Operation Setting Procedure
Figure 12.13 shows an example of the synchronous operation setting procedure.
Synchronous operation
selection
Set synchronous
operation
[1]
Synchronous presetting
Set TCNT
Synchronous clearing
[2]
Clearing
source generation
channel?
No
Yes
<Synchronous presetting>
Select counter
clearing source
[3]
Set synchronous
counter clearing
[4]
Start count
[5]
Start count
[5]
<Counter clearing>
<Synchronous clearing>
[1] Set 1 to the SYNC bits in TSYR corresponding to the channels to be designated for synchronous
operation.
[2] When the TCNT counter of any of the channels designated for synchronous operation is
written to, the same value is simultaneously written to the other TCNT counters.
[3] Use bits CCLR1 and CCLR0 in TCR to specify TCNT clearing by input capture/output compare,
etc.
[4] Use bits CCLR1 and CCLR0 in TCR to designate synchronous clearing for the counter clearing
source.
[5] Set 1 to the CST bits in TSTR for the relevant channels, to start the count operation.
Figure 12.13 Example of Synchronous Operation Setting Procedure
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Section 12 16-Bit Timer Pulse Unit (TPU)
(2)
Example of Synchronous Operation
Figure 12.14 shows an example of synchronous operation.
In this example, synchronous operation and PWM mode 1 have been designated for channels 1
and 2, TGRB_1 compare match has been set as the channel 1 counter clearing source, and
synchronous clearing has been set for the channel 2 counter clearing source.
Two-phase PWM waveforms are output from pins TIOC1A and TIOC2A. At this time,
synchronous presetting, and synchronous clearing by TGRB_1 compare match, are performed for
channel 1 and 2 TCNT counters, and the data set in TGRB_1 is used as the PWM cycle.
For details on PWM modes, see section 12.5.4, PWM Modes.
Synchronous clearing by TGRB_1 compare match
TCNT_1 and TCNT_2
TGRB_1
TGRB_2
TGRA_1
TGRA_2
Time
H'0000
TIOCA1
TIOCA2
Figure 12.14 Example of Synchronous Operation
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.5.3
Operation with Cascaded Connection
Operation as a 32-bit counter can be performed by cascading two 16-bit counter channels.
This function is enabled when the TPSC2 to TPSC0 bits in TCR are set to count on TCNT2
overflow for the channel 1 counter clock.
Table 12.11 shows the counter combination used in operation with the cascaded connection.
Table 12.11 Counter Combination in Operation with Cascaded Connection
Combination
Upper 16 bits
Lower 16 bits
Channel 1 and channel 2
TCNT1
TCNT2
(1)
Setting Procedure for Operation with Cascaded Connection
Figure 12.15 shows the setting procedure for cascaded connection operation.
Operation with cascaded
connection
[1] Set bits TPSC2 to TPSC0 in TCR in
channel 1 to B'111 to select to count
on TCNT2 overflow.
Set operation with cascaded
connection
[1]
Start count
[2]
[2] Set 1 to the CST bit in TSTR corresponding
the upper and lower channels to start
counting.
<Operation with cascaded connection>
Figure 12.15 Setting Procedure for Operation with Cascaded Operation
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Section 12 16-Bit Timer Pulse Unit (TPU)
(2)
Example of Operation with Cascaded Connection
Figure 12.16 shows an example of operation with cascaded connection, where TCNT1 is set to
count TCNT2 overflow, TCRA_1 and TCRA_2 are set to be input capture registers, and the TIOC
pin rising edge is selected.
If rising edges are input simultaneously to the TIOCA1 and TIOCA2 pins, the upper 16 bits of 32bit data are transferred to TGRA_1 and the lower 16 bits are transferred to TGRA_2.
TCNT1
clock
TCNT1
H'03A1
H'03A2
TCNT2
clock
TCNT2
H'FFFF
H'0000
H'0001
TIOCA1
TIOCA2
TGRA_1
TGRA_2
H'03A2
H'0000
Figure 12.16 Example of Operation with Cascaded Connection
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.5.4
PWM Modes
In PWM mode, PWM waveforms are output from the output pins. The output level can be selected
as 0, 1, or toggle output in response to a compare match of each TGR.
Designating TGR compare match as the counter clearing source enables the period to be set in that
register. All channels can be designated for PWM mode independently. Synchronous operation is
also possible.
There are two PWM modes, as described below.
(1)
PWM Mode 1
PWM output is generated from the TIOCA pin by pairing TGRA with TGRB. The level specified
by bits IOA0 to IOA3 in TIOR is output from the TIOCA pin at compare match A, and the level
specified by bits IOB0 to IOB3 in TIOR is output at compare match B. The initial output value is
the value set in TGRA. If the set values of paired TGRs are identical, the output value does not
change even if a compare match occurs.
In PWM mode 1, PWM output is enabled up to 2 phases.
(2)
PWM Mode 2
PWM output is generated using one TGR as the cycle register and the others as duty registers. The
output specified in TIOR is performed by means of compare matches. Upon counter clearing by a
synchronization register compare match, the output value of each pin is the initial value set in
TIOR. If the set values of the cycle and duty registers are identical, the output value does not
change even if a compare match occurs.
In PWM mode 2, PWM output is enabled up to 2 phases.
The correspondence between PWM output pins and registers is shown in table 12.12.
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Section 12 16-Bit Timer Pulse Unit (TPU)
Table 12.12 PWM Output Registers and Output Pins
Output Pins
Channel
Registers
PWM Mode 1
PWM Mode 2*
1
TGRA_1
TIOCA1
TIOCA1
TGRB_1
2
—
TGRA_2
TIOCA2
TGRB_2
Note:
(3)
*
TIOCA2
—
In PWM mode 2, PWM output is not possible for TGR in which the period is set.
Example of PWM Mode Setting Procedure
Figure 12.17 shows an example of the PWM mode setting procedure.
PWM mode
Select counter clock
[1]
Select counter clearing source
[2]
Select waveform output level
[3]
Set TGR
[4]
Set PWM mode
[5]
Start count
[6]
[1] Select the counter clock with bits TPSC2 to
TPSC0 in TCR. At the same time, select the
input clock edge with bits CKEG1 and CKEG0
in TCR.
[2] Use bits CCLR1 and CCLR0 in TCR to select the
TGR to be used as the TCNT clearing source.
[3] Use TIOR to designate the TGR as an output
compare register, and select the initial value and
output value.
[4] Set the cycle in the TGR selected in [2], and set
the duty in the other TGR.
[5] Select the PWM mode with bits MD3 to MD0 in
TMDR.
[6] Set the CST bit in TSTR to 1 start the count
operation.
<PWM mode>
Figure 12.17 Example of PWM Mode Setting Procedure
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Section 12 16-Bit Timer Pulse Unit (TPU)
(4)
Examples of PWM Mode Operation
Figure 12.18 shows an example of PWM mode 1 operation. In this example, TGRA compare
match is set as the TCNT clearing source, 0 is set for the TGRA initial output value, and 1 is set as
the TGRB output value.
In this case, the value set in TGRA is used as the period, and the values set in TGRB are used as
the duty levels.
TCNT value
Counter cleared by
TGRA compare match
TGRA
TGRB
H'0000
Time
TIOCA
Figure 12.18 Example of PWM Mode Operation (1)
Figure 12.19 shows an example of PWM mode 2 operation. In this example, synchronous
operation is designated for channels 1 and 2, TGRB_2 compare match is set as the TCNT clearing
source, and 0 is set for the initial output value and 1 for the output value of the other TGR registers
(TGRA_1, TGRB_1, and TGRA_2), outputting a 2-phase PWM waveform.
In this case, the value set in TGRB_2 is used as the cycle, and the values set in the other TGRs are
used as the duty levels.
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Section 12 16-Bit Timer Pulse Unit (TPU)
Synchronous clearing by
TGRB_2 compare match
TCNT_1 and TCNT_2
TGRB_2
TGRA_2
TGRA_1
Time
H'0000
TIOCA1
TIOCA2
Figure 12.19 Example of PWM Mode Operation (2)
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Section 12 16-Bit Timer Pulse Unit (TPU)
Figure 12.20 shows examples of PWM waveform output with 0% duty and 100% duty in PWM
mode.
TCNT value
TGRB rewritten
TGRA
TGRB
TGRB rewritten
TGRB
rewritten
H'0000
Time
0% duty
TIOCA
Output does not change when cycle register and duty register
compare matches occur simultaneously
TCNT value
TGRB rewritten
TGRA
TGRB rewritten
TGRB rewritten
TGRB
H'0000
Time
100% duty
TIOCA
Output does not change when cycle register and duty
register compare matches occur simultaneously
TCNT value
TGRB rewritten
TGRA
TGRB rewritten
TGRB
TGRB rewritten
Time
H'0000
TIOCA
100% duty
0% duty
Figure 12.20 Example of PWM Mode Operation (3)
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.6
Interrupt Sources
There are two kinds of TPU interrupt source; TGR input capture/compare match and TCNT
overflow. Each interrupt source has its own status flag and enable/disable bit, allowing the
generation of interrupt request signals to be enabled or disabled individually.
When an interrupt source is generated, the corresponding status flag in TSR is set to 1. If the
corresponding enable/disable bit in TIER is set to 1 at this time, an interrupt is requested. The
interrupt request is cleared by clearing the status flag to 0.
Channel priority can be changed by the interrupt controller, however the priority within a channel
is fixed. For details, see section 4, Interrupt Controller.
Table 12.13 lists the TPU interrupt sources.
Table 12.13 TPU Interrupts
Channel
Name
Interrupt Source
1
TGI1A
TGRA_1 input capture/compare match
TGFA_1
TGI1B
TGRB_1 input capture/compare match
TGFB_1
TCI1V
TCNT_1 overflow
TCFV_1
TGI2A
TGRA_2 input capture/compare match
TGFA_2
TGI2B
TGRB_2 input capture/compare match
TGFB_2
TCI2V
TCNT_2 overflow
TCFV_2
2
(1)
Interrupt Flag Priority
High
Low
Input Capture/Compare Match Interrupt
An interrupt is requested if the TGIE bit in TIER is set to 1 when the TGF flag in TSR is set to 1
by the occurrence of a TGR input capture/compare match on a particular channel. The interrupt
request is cleared by clearing the TGF flag to 0. The TPU has a total of four input capture/compare
match interrupts, two for each channel.
(2)
Overflow Interrupt
An interrupt is requested if the TCIEV bit in TIER is set to 1 when the TCFV flag in TSR is set to
1 by the occurrence of TCNT overflow on a channel. The interrupt request is cleared by clearing
the TCFV flag to 0. The TPU has a total of two overflow interrupts, one for each channel.
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.7
Operation Timing
12.7.1
Input/Output Timing
(1)
TCNT Count Timing
Figure 12.21 shows TCNT count timing in internal clock operation, and figure 12.22 shows TCNT
count timing in external clock operation.
φ
Internal clock
Rising edge
Falling edge
TCNT
input clock
N−1
TCNT
N
N+1
N+2
Figure 12.21 Count Timing in Internal Clock Operation
φ
External clock
Rising edge
Falling edge
Falling edge
TCNT
input clock
TCNT
N−1
N
N+1
N+2
Figure 12.22 Count Timing in External Clock Operation
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Section 12 16-Bit Timer Pulse Unit (TPU)
(2)
Output Compare Output Timing
A compare match signal is generated in the last state in which TCNT and TGR match (the point at
which the count value matched by TCNT is updated). When a compare match signal is generated,
the output value set in TIOR is output at the output compare output pin (TIOC pin). After a match
between TCNT and TGR, the compare match signal is not generated until the TCNT input clock is
generated.
Figure 12.23 shows output compare output timing.
φ
TCNT
input clock
TCNT
TGR
N
N+1
N
Compare
match signal
TIOC pin
Figure 12.23 Output Compare Output Timing
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Section 12 16-Bit Timer Pulse Unit (TPU)
(3)
Input Capture Signal Timing
Figure 12.24 shows input capture signal timing.
φ
Input capture
input
Input capture
signal
TCNT
N
N+1
N+2
N
TGR
N+2
Figure 12.24 Input Capture Input Signal Timing
(4)
Timing for Counter Clearing by Compare Match/Input Capture
Figure 12.25 shows the timing when counter clearing on compare match is specified, and figure
12.26 shows the timing when counter clearing on input capture is specified.
φ
Compare
match signal
Counter
clear signal
TCNT
N
TGR
N
H'0000
Figure 12.25 Counter Clear Timing (Compare Match)
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Section 12 16-Bit Timer Pulse Unit (TPU)
φ
Input capture
signal
Counter clear
signal
H'0000
N
TCNT
N
TGR
Figure 12.26 Counter Clear Timing (Input Capture)
12.7.2
(1)
Interrupt Signal Timing
TGF Flag Setting Timing in Case of Compare Match
Figure 12.27 shows the timing for setting of the TGF flag in TSR on compare match, and TGI
interrupt request signal timing.
φ
TCNT input
clock
TCNT
N
TGR
N
N+1
Compare
match signal
TGF flag
TGI interrupt
Figure 12.27 TGI Interrupt Timing (Compare Match)
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Section 12 16-Bit Timer Pulse Unit (TPU)
(2)
TGF Flag Setting Timing in Case of Input Capture
Figure 12.28 shows the timing for setting of the TGF flag in TSR on input capture, and TGI
interrupt request signal timing.
φ
Input capture
signal
N
TCNT
TGR
N
TGF flag
TGI interrupt
Figure 12.28 TGI Interrupt Timing (Input Capture)
(3)
TCFV Flag Setting Timing
Figure 12.29 shows the timing for setting of the TCFV flag in TSR on overflow, and TCIV
interrupt request signal timing.
φ
TCNT input
clock
TCNT
(overflow)
H'FFFF
H'0000
Overflow
signal
TCFV flag
TCIV interrupt
Figure 12.29 TCIV Interrupt Setting Timing
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Section 12 16-Bit Timer Pulse Unit (TPU)
(4)
Status Flag Clearing Timing
After a status flag is read as 1 by the CPU, it is cleared by writing 0 to it. Figure 12.30 shows the
timing for status flag clearing by the CPU.
TSR write cycle
T2
T1
φ
TSR address
Address
Write signal
Status flag
Interrupt
request
signal
Figure 12.30 Timing for Status Flag Clearing by CPU
12.8
12.8.1
Usage Notes
Module Standby Function Setting
TPU operation can be disabled or enabled using the clock stop register. The initial setting is for
the TPU to operate. Register access is enabled by clearing the module standby function. For
details, refer to section 6.4, Module Standby Function.
12.8.2
Input Clock Restrictions
The input clock pulse width must be at least 1.5 states in the case of single-edge detection, and at
least 2.5 states in the case of both-edge detection. The TPU will not operate properly at narrower
pulse widths.
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.8.3
Caution on Period Setting
When counter clearing on compare match is set, TCNT is cleared in the last state in which it
matches the TGR value (the point at which the count value matched by TCNT is updated).
Consequently, the actual counter frequency is given by the following formula:
φ
f=
(N + 1)
Where
12.8.4
f: Counter frequency
φ: Operating frequency
N: TGR set value
Contention between TCNT Write and Clear Operation
If the counter clear signal is generated in the T2 state of a TCNT write cycle, TCNT clearing takes
priority and the TCNT write is not performed.
Figure 12.31 shows the timing in this case.
TCNT write cycle
T1
T2
φ
TCNT address
Address
Write signal
Counter clear
signal
TCNT
N
H'0000
Figure 12.31 Contention between TCNT Write and Clear Operation
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.8.5
Contention between TCNT Write and Increment Operation
If incrementing occurs in the T2 state of a TCNT write cycle, the TCNT write takes priority and
TCNT is not incremented.
Figure 12.32 shows the timing in this case.
TCNT write cycle
T1
T2
φ
TCNT address
Address
Write signal
TCNT input
clock
TCNT
N
M
TCNT write data
Figure 12.32 Contention between TCNT Write and Increment Operation
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.8.6
Contention between TGR Write and Compare Match
If a compare match occurs in the T2 state of a TGR write cycle, the TGR write takes priority and
the compare match signal is inhibited. A compare match does not occur even if the previous value
is written.
Figure 12.33 shows the timing in this case.
TGR write cycle
T1
T2
φ
TGR address
Address
Write signal
Compare
match signal
Inhibited
TCNT
N
N+1
TGR
N
M
TGR write data
Figure 12.33 Contention between TGR Write and Compare Match
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.8.7
Contention between TGR Read and Input Capture
If an input capture signal is generated in the T1 state of a TGR read cycle, data that is read will be
data after input capture transfer.
Figure 12.34 shows the timing in this case.
TGR read cycle
T2
T1
φ
TGR address
Address
Read signal
Input capture
signal
TGR
Internal
data bus
X
M
M
Figure 12.34 Contention between TGR Read and Input Capture
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.8.8
Contention between TGR Write and Input Capture
If an input capture signal is generated in the T2 state of a TGR write cycle, the input capture
operation takes priority and the write to TGR is not performed.
Figure 12.35 shows the timing in this case.
TGR write cycle
T2
T1
φ
Address
TGR address
Write signal
Input capture
signal
TCNT
TGR
M
M
Figure 12.35 Contention between TGR Write and Input Capture
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.8.9
Contention between Overflow and Counter Clearing
If overflow and counter clearing occur simultaneously, the TCFV flag in TSR is not set and TCNT
clearing takes priority.
Figure 12.36 shows the operation timing when a TGR compare match is specified as the clearing
source, and when H'FFFF is set in TGR.
φ
TCNT input
clock
TCNT
H'FFFF
H'0000
Counter
clear signal
TGF
TCFV
Disabled
Figure 12.36 Contention between Overflow and Counter Clearing
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Section 12 16-Bit Timer Pulse Unit (TPU)
12.8.10 Contention between TCNT Write and Overflow
If there is an up-count in the T2 state of a TCNT write cycle and overflow occurs, the TCNT write
takes priority and the TCFV flag in TSR is not set.
Figure 12.37 shows the operation timing when there is contention between TCNT write and
overflow.
TCNT write cycle
T2
T1
φ
TCNT address
Address
Write signal
TCNT
TCNT write data
H'FFFF
M
TCFV flag
Figure 12.37 Contention between TCNT Write and Overflow
12.8.11 Multiplexing of I/O Pins
The TIOCA1 I/O pin is multiplexed with the TCLKA input pin, the TIOCB1 I/O pin with the
TCLKB input pin, and the TIOCA2 I/O pin with the TCLKC input pin. When an external clock is
input, compare match output should not be performed from a multiplexed pin.
12.8.12 Interrupts when Module Standby Function is Used
If the module standby function is used when an interrupt has been requested, it will not be possible
to clear the CPU interrupt source. Interrupts should therefore be disabled before using the module
standby function.
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Section 12 16-Bit Timer Pulse Unit (TPU)
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Section 13 Asynchronous Event Counter (AEC)
Section 13 Asynchronous Event Counter (AEC)
The asynchronous event counter (AEC) is an event counter that is incremented by external event
clock or internal clock input. Figure 13.1 shows a block diagram of the asynchronous event
counter.
13.1
Features
• Can count asynchronous events
Can count external events input asynchronously without regard to the operation of system
clocks (φ) or subclocks (φSUB).
• Can be used as two-channel independent 8-bit event counter or single-channel independent 16bit event counter.
• Event/clock input is enabled when IRQAEC goes high or event counter PWM output
(IECPWM) goes high.
• Both edge sensing can be used for IRQAEC or event counter PWM output (IECPWM)
interrupts. When the asynchronous counter is not used, they can be used as independent
interrupts.
• When an event counter PWM is used, event clock input enabling/disabling can be controlled at
a constant cycle.
• Selection of four clock sources
Three internal clocks (φ/2, φ/4, or φ/8) or external event can be selected.
• Both edge counting is possible for the AEVL and AEVH pins.
• Counter resetting and halting of the count-up function can be controlled by software.
• Automatic interrupt generation on detection of an event counter overflow
• Use of module standby mode enables this module to be placed in standby mode independently
when not used. (For details, refer to section 6.4, Module Standby Function.)
• The IRQAEC pin can select the on-chip oscillator and the system clock oscillator during a
reset, though this function does not apply to a reset by the watchdog timer. (Supported only by
the masked ROM version.)
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Section 13 Asynchronous Event Counter (AEC)
IRREC
φ
ECCR
PSS
ECCSR
OVH
AEVH
AEVL
Edge sensing
circuit
OVL
ECH
(8 bits)
CK
ECL
(8 bits)
CK
Edge sensing
circuit
IRQAEC
IECPWM
Edge sensing
circuit
To CPU interrupt
(IRREC2)
Internal data bus
φ/2
φ/4, φ/8
ECPWCR
PWM waveform generator
φ/2, φ/4,
φ/8, φ/16,
φ/32, φ/64
ECPWDR
AEGSR
[Legend]
ECPWCR: Event counter PWM compare register
ECL: Event counter L
ECPWDR: Event counter PWM data register
ECCR: Event counter control register
AEGSR: Input pin edge select register
ECH: Event counter H
ECCSR: Event counter control/status register
Figure 13.1 Block Diagram of Asynchronous Event Counter
13.2
Input/Output Pins
Table 13.1 shows the pin configuration of the asynchronous event counter.
Table 13.1 Pin Configuration
Name
Abbreviation
I/O
Function
Asynchronous event AEVH
input H
Input
Event input pin for input to event counter H
Asynchronous event AEVL
input L
Input
Event input pin for input to event counter L
Event input enable
interrupt input
Input
IRQAEC
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Input pin for interrupt enabling event input
Input pin to select the on-chip oscillator and the
system clock oscillator (supported only by the
masked ROM version)
Section 13 Asynchronous Event Counter (AEC)
13.3
Register Descriptions
The asynchronous event counter has the following registers.
• Event counter PWM compare register (ECPWCR)
• Event counter PWM data register (ECPWDR)
• Input pin edge select register (AEGSR)
• Event counter control register (ECCR)
• Event counter control/status register (ECCSR)
• Event counter H (ECH)
• Event counter L (ECL)
13.3.1
Event Counter PWM Compare Register (ECPWCR)
ECPWCR sets the one conversion period of the event counter PWM waveform.
Always read or write to this register in word size.
Bit
Bit Name
15
Initial
Value
R/W
Description
ECPWCR15 1
R/W
14
ECPWCR14 1
R/W
One Conversion Period of Event Counter PWM
Waveform
13
ECPWCR13 1
R/W
12
ECPWCR12 1
R/W
11
ECPWCR11 1
R/W
10
ECPWCR10 1
R/W
9
ECPWCR9
1
R/W
8
ECPWCR8
1
R/W
7
ECPWCR7
1
R/W
6
ECPWCR6
1
R/W
5
ECPWCR5
1
R/W
4
ECPWCR4
1
R/W
3
ECPWCR3
1
R/W
2
ECPWCR2
1
R/W
1
ECPWCR1
1
R/W
0
ECPWCR0
1
R/W
When the ECPWME bit in AEGSR is 1, the event
counter PWM is operating and therefore ECPWCR
should not be modified.
When changing the conversion period, the event
counter PWM must be halted by clearing the ECPWME
bit in AEGSR to 0 before modifying ECPWCR.
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Section 13 Asynchronous Event Counter (AEC)
13.3.2
Event Counter PWM Data Register (ECPWDR)
ECPWDR controls data of the event counter PWM waveform generator.
Always write to this register in word size.
Bit
Bit Name
Initial
Value
R/W
Description
15
ECPWDR15
0
W
14
ECPWDR14
0
W
Data Control of Event Counter PWM Waveform
Generator
13
ECPWDR13
0
W
12
ECPWDR12
0
W
11
ECPWDR11
0
W
10
ECPWDR10
0
W
9
ECPWDR9
0
W
8
ECPWDR8
0
W
7
ECPWDR7
0
W
6
ECPWDR6
0
W
5
ECPWDR5
0
W
4
ECPWDR4
0
W
3
ECPWDR3
0
W
2
ECPWDR2
0
W
1
ECPWDR1
0
W
0
ECPWDR0
0
W
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When the ECPWME bit in AEGSR is 1, the event
counter PWM is operating and therefore ECPWDR
should not be modified.
When changing the conversion cycle, the event counter
PWM must be halted by clearing the ECPWME bit in
AEGSR to 0 before modifying ECPWDR.
Section 13 Asynchronous Event Counter (AEC)
13.3.3
Input Pin Edge Select Register (AEGSR)
AEGSR selects rising, falling, or both edge sensing for the AEVH, AEVL, and IRQAEC pins.
Bit
Bit Name
Initial
Value
R/W
Description
7
AHEGS1
0
R/W
AEC Edge Select H
6
AHEGS0
0
R/W
Select rising, falling, or both edge sensing for the AEVH
pin.
00: Falling edge on AEVH pin is sensed
01: Rising edge on AEVH pin is sensed
10: Both edges on AEVH pin are sensed
11: Setting prohibited
5
ALEGS1
0
R/W
AEC Edge Select L
4
ALEGS0
0
R/W
Select rising, falling, or both edge sensing for the AEVL
pin.
00: Falling edge on AEVL pin is sensed
01: Rising edge on AEVL pin is sensed
10: Both edges on AEVL pin are sensed
11: Setting prohibited
3
AIEGS1
0
R/W
IRQAEC Edge Select
2
AIEGS0
0
R/W
Select rising, falling, or both edge sensing for the
IRQAEC pin.
00: Falling edge on IRQAEC pin is sensed
01: Rising edge on IRQAEC pin is sensed
10: Both edges on IRQAEC pin are sensed
11: Setting prohibited
1
ECPWME
0
R/W
Event Counter PWM Enable
Controls operation of event counter PWM and selection
of IRQAEC.
0: AEC PWM halted, IRQAEC selected
1: AEC PWM enabled, IRQAEC not selected
0

0
R/W
Reserved
This bit can be read from or written to. However, this bit
should not be set to 1.
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Section 13 Asynchronous Event Counter (AEC)
13.3.4
Event Counter Control Register (ECCR)
ECCR controls the counter input clock and IRQAEC/IECPWM.
Bit
Bit Name
Initial
Value
R/W
Description
7
ACKH1
0
R/W
AEC Clock Select H
6
ACKH0
0
R/W
Select the clock used by ECH.
00: AEVH pin input
01: φ/2
10: φ/4
11: φ/8
5
ACKL1
0
R/W
AEC Clock Select L
4
ACKL0
0
R/W
Select the clock used by ECL.
00: AEVL pin input
01: φ/2
10: φ/4
11: φ/8
3
PWCK2
0
R/W
Event Counter PWM Clock Select
2
PWCK1
0
R/W
Select the event counter PWM clock.
1
PWCK0
0
R/W
000: φ/2
001: φ/4
010: φ/8
011: φ/16
1X0: φ/32
1X1 φ/64
0

0
R/W
Reserved
This bit can be read from or written to. However, this bit
should not be set to 1.
[Legend] X: Don't care.
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Section 13 Asynchronous Event Counter (AEC)
13.3.5
Event Counter Control/Status Register (ECCSR)
ECCSR controls counter overflow detection, counter resetting, and count-up function.
Bit
Bit Name
Initial
Value
R/W
Description
7
OVH
0
R/W*
Counter Overflow H
This is a status flag indicating that ECH has overflowed.
[Setting condition]
When ECH overflows from H'FF to H'00
[Clearing condition]
When this bit is written to 0 after reading OVH = 1
6
OVL
0
R/W*
Counter Overflow L
This is a status flag indicating that ECL has overflowed.
[Setting condition]
When ECL overflows from H'FF to H'00 while CH2 is set
to 1
[Clearing condition]
When this bit is written to 0 after reading OVL = 1
5

0
R/W
Reserved
Although this bit is readable/writable, it should not be set
to 1.
4
CH2
0
R/W
Channel Select
Selects how ECH and ECL event counters are used
0: ECH and ECL are used together as a single-channel
16-bit event counter
1: ECH and ECL are used as two-channel 8-bit event
counter
3
CUEH
0
R/W
Count-Up Enable H
Enables event clock input to ECH.
0: ECH event clock input is disabled (ECH value is
retained)
1: ECH event clock input is enabled
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Section 13 Asynchronous Event Counter (AEC)
Bit
Bit Name
Initial
Value
R/W
Description
2
CUEL
0
R/W
Count-Up Enable L
Enables event clock input to ECL.
0: ECL event clock input is disabled (ECL value is
retained)
1: ECL event clock input is enabled
1
CRCH
0
R/W
Counter Reset Control H
Controls resetting of ECH.
0: ECH is reset
1: ECH reset is cleared and count-up function is
enabled
0
CRCL
0
R/W
Counter Reset Control L
Controls resetting of ECL.
0: ECL is reset
1: ECL reset is cleared and count-up function is enabled
Note:
*
Only 0 can be written to clear the flag.
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Section 13 Asynchronous Event Counter (AEC)
13.3.6
Event Counter H (ECH)
ECH is an 8-bit read-only up-counter that operates as an independent 8-bit event counter. ECH
also operates as the upper 8-bit up-counter of a 16-bit event counter configured in combination
with ECL.
Bit
Bit Name
Initial
Value
R/W
Description
7
ECH7
0
R
6
ECH6
0
R
5
ECH5
0
R
4
ECH4
0
R
Either the external asynchronous event AEVH pin, φ/2,
φ/4, or φ/8, or the overflow signal from lower 8-bit
counter ECL can be selected as the input clock source.
ECH can be cleared to H'00 by clearing CRCH in
ESSCR to 0.
3
ECH3
0
R
2
ECH2
0
R
1
ECH1
0
R
0
ECH0
0
R
13.3.7
Event Counter L (ECL)
ECL is an 8-bit read-only up-counter that operates as an independent 8-bit event counter. ECL
also operates as the upper 8-bit up-counter of a 16-bit event counter configured in combination
with ECH.
Bit
Bit Name
Initial
Value
R/W
Description
7
ECL7
0
R
6
ECL6
0
R
5
ECL5
0
R
Either the external asynchronous event AEVL pin, φ/2,
φ/4, or φ/8 can be selected as the input clock source.
ECL can be cleared to H'00 by clearing CRCL in
ESSCR to 0.
4
ECL4
0
R
3
ECL3
0
R
2
ECL2
0
R
1
ECL1
0
R
0
ECL0
0
R
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Section 13 Asynchronous Event Counter (AEC)
13.4
Operation
13.4.1
16-Bit Counter Operation
When bit CH2 is cleared to 0 in ECCSR, ECH and ECL operate as a 16-bit event counter.
Any of four input clock sources—φ/2, φ/4, φ/8, or AEVL pin input—can be selected by means of
bits ACKL1 and ACKL0 in ECCR. When AEVL pin input is selected, input sensing is selected
with bits ALEGS1 and ALEGS0.
Note that the input clock is enabled when IRQAEC is high or IECPWM is high. When IRQAEC is
low or IECPWM is low, the input clock is not input to the counter, which therefore does not
operate. Figure 13.2 shows the software procedure when ECH and ECL are used as a 16-bit event
counter.
Start
Clear CH2 to 0
Set ACKL1, ACKL0, ALEGS1, and ALEGS0
Clear CUEH, CUEL, CRCH, and CRCL to 0
Clear OVH and OVL to 0
Set CUEH, CUEL, CRCH, and CRCL to 1
End
Figure 13.2 Software Procedure when Using ECH and ECL as 16-Bit Event Counter
As CH2 is cleared to 0 by a reset, ECH and ECL operate as a 16-bit event counter after a reset,
and as ACKL1 and ACKL0 are cleared to B'00, the operating clock is asynchronous event input
from the AEVL pin (using falling edge sensing).
When the next clock is input after the count value reaches H'FF in both ECH and ECL, ECH and
ECL overflow from H'FFFF to H'0000, the OVH flag is set to 1 in ECCSR, the ECH and ECL
count values each return to H'00, and counting up is restarted. When an overflow occurs, the
IRREC bit is set to 1 in IRR2. If the IENEC bit in IENR2 is 1 at this time, an interrupt request is
sent to the CPU.
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Section 13 Asynchronous Event Counter (AEC)
13.4.2
8-Bit Counter Operation
When bit CH2 is set to 1 in ECCSR, ECH and ECL operate as independent 8-bit event counters.
φ/2, φ/4, φ/8, or AEVH pin input can be selected as the input clock source for ECH by means of
bits ACKH1 and ACKH0 in ECCR, and φ/2, φ/4, φ/8, or AEVL pin input can be selected as the
input clock source for ECL by means of bits ACKL1 and ACKL0 in ECCR. Input sensing is
selected with bits AHEGS1 and AHEGS0 when AEVH pin input is selected, and with bits
ALEGS1 and ALEGS0 when AEVL pin input is selected.
Note that the input clock is enabled when IRQAEC is high or IECPWM is high. When IRQAEC is
low or IECPWM is low, the input clock is not input to the counter, which therefore does not
operate. Figure 13.3 shows the software procedure when ECH and ECL are used as 8-bit event
counters.
Start
Set CH2 to 1
Set ACKH1, ACKH0, ACKL1, ACKL0,
AHEGS1, AHEGS0, ALEGS1, and ALEGS0
Clear CUEH, CUEL, CRCH, and CRCL to 0
Clear OVH and OVL to 0
Set CUEH, CUEL, CRCH, and CRCL to 1
End
Figure 13.3 Software Procedure when Using ECH and ECL as 8-Bit Event Counters
When the next clock is input after the ECH count value reaches H'FF, ECH overflows, the OVH
flag is set to 1 in ECCSR, the ECH count value returns to H'00, and counting up is restarted.
Similarly, when the next clock is input after the ECL count value reaches H'FF, ECL overflows,
the OVL flag is set to 1 in ECCSR, the ECL count value returns to H'00, and counting up is
restarted. When an overflow occurs, the IRREC bit is set to 1 in IRR2. If the IENEC bit in IENR2
is 1 at this time, an interrupt request is sent to the CPU.
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Section 13 Asynchronous Event Counter (AEC)
13.4.3
IRQAEC Operation
When the ECPWME bit in AEGSR is 0, the ECH and ECL input clocks are enabled when
IRQAEC goes high. When IRQAEC goes low, the input clocks are not input to the counters, and
so ECH and ECL do not count. ECH and ECL count operations can therefore be controlled from
outside by controlling IRQAEC. In this case, ECH and ECL cannot be controlled individually.
IRQAEC can also operate as an interrupt source.
Interrupt enabling is controlled by IENEC2 in IENR1. When an IRQAEC interrupt is generated,
IRR1 interrupt request flag IRREC2 is set to 1. If IENEC2 in IENR1 is set to 1 at this time, an
interrupt request is sent to the CPU.
Rising, falling, or both edge sensing can be selected for the IRQAEC input pin with bits AIAGS1
and AIAGS0 in AEGSR.
13.4.4
Event Counter PWM Operation
When the ECPWME bit in AEGSR is 1, the ECH and ECL input clocks are enabled when event
counter PWM output (IECPWM) is high. When IECPWM is low, the input clocks are not input to
the counters, and so ECH and ECL do not count. ECH and ECL count operations can therefore be
controlled cyclically from outside by controlling event counter PWM. In this case, ECH and ECL
cannot be controlled individually.
IECPWM can also operate as an interrupt source.
Interrupt enabling is controlled by IENEC2 in IENR1. When an IECPWM interrupt is generated,
IRR1 interrupt request flag IRREC2 is set to 1. If IENEC2 in IENR1 is set to 1 at this time, an
interrupt request is sent to the CPU.
Rising, falling, or both edge detection can be selected for IECPWM interrupt sensing with bits
AIAGS1 and AIAGS0 in AEGSR.
Figure 13.4 and table 13.2 show examples of event counter PWM operation.
toff = (T × (Ndr +1)) − tcyc
ton
tcm = T × (Ncm +1)
ton:
toff:
tcm:
T:
Ndr:
Clock input enable time
Clock input disable time
One conversion period
ECPWM input clock cycle
Value of ECPWDR
Fixed low when Ndr =H'FFFF
Ncm: Value of ECPWCR
tcyc: System clock (φ) cycle time
Figure 13.4 Event Counter Operation Waveform
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Section 13 Asynchronous Event Counter (AEC)
Note: Ndr and Ncm above must be set so that Ndr < Ncm. If the settings do not satisfy this
condition, the output of the event counter PWM is fixed low.
Table 13.2 Examples of Event Counter PWM Operation
Conditions: fosc = 4 MHz, fφ = 4 MHz, high-speed active mode, ECPWCR value (Ncm) =
H'7A11, ECPWDR value (Ndr) = H'16E3
Clock
Clock
toff =
Source
Source
ECPWCR
ECPWDR
(T × (Ndr + 1)) tcm =
ton =
Selection Cycle (T)* Value (Ncm) Value (Ndr) – tcyc
T × (Ncm + 1) tcm – toff
φ/2
0.5 µs
H'7A11
H'16E3
2.92975 ms
15.625 ms
12.69525 ms
φ/4
1 µs
D'31249
D'5859
5.85975 ms
31.25 ms
25.39025 ms
φ/8
2 µs
11.71975 ms
62.5 ms
50.78025 ms
φ/16
4 µs
23.43975 ms
125.0 ms
101.56025 ms
φ/32
8 µs
46.87975 ms
250.0 ms
203.12025 ms
φ/64
16 µs
93.75975 ms
500.0 ms
406.24025 ms
Note:
13.4.5
*
toff minimum width
Operation of Clock Input Enable/Disable Function
The clock input to the event counter can be controlled by the IRQAEC pin when ECPWME in
AEGSR is 0, and by the event counter PWM output, IECPWM when ECPWME in AEGSR is 1.
As this function forcibly terminates the clock input by each signal, a maximum error of one count
will occur depending on the IRQAEC or IECPWM timing. Figure 13.5 shows an example of the
operation.
Input event
IRQAEC or IECPWM
Edge generated by clock return
Actually counted clock source
Counter value
N
N+1
N+2
N+3
N+4
N+5
N+6
Clock stopped
Figure 13.5 Example of Clock Control Operation
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Section 13 Asynchronous Event Counter (AEC)
13.5
Operating States of Asynchronous Event Counter
The operating states of the asynchronous event counter are shown in table 13.3.
Table 13.3 Operating States of Asynchronous Event Counter
Operating
Mode
Reset
Active
Sleep
Watch
AEGSR
Reset
Functions
Functions
Retained*
ECCR
Reset
Functions
Functions
1
Functions
1
Retained*
Reset
Functions
Functions
Retained*
ECH
Reset
Functions
Functions
Functions* *
Reset
Functions
Functions
2
1
2
Functions
2
2
Retained
1
Retained
Retained*
1
Functions
Functions*
1
Retained*
Functions
Functions
1
Functions* *
Retained*
Functions*
2
Functions*
2
Retained
1
2
Halted
1
2
Halted
Functions* *
Functions* *
Reset
Functions
Functions
Retained*
Functions
Functions
Retained*
Retained*4
Event counter Reset
Functions
Functions
Retained
Retained
Retained
Retained
Retained
IRQAEC
3
Functions
Functions
1
ECCSR
ECL
Module
Standby
Sub-active Sub-sleep Standby
3
PWM
Notes: 1. When an asynchronous external event is input, the counter increments. However, an
interrupt request is issued when the counter overflows.
2. Functions when asynchronous external events are selected; halted and retained
otherwise.
3. Clock control by IRQAEC operates, but interrupts do not.
4. As the clock is stopped in module standby mode, IRQAEC has no effect.
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Section 13 Asynchronous Event Counter (AEC)
13.6
Usage Notes
1. When reading the values in ECH and ECL, first clear bits CUEH and CUEL to 0 in ECCSR in
8-bit mode and clear bit CUEL to 0 in 16-bit mode to prevent asynchronous event input to the
counter. The correct value will not be returned if the event counter increments while being
read.
2. For input to the AEVH and AEVL pins, use a clock with a frequency of up to 4.2 MHz within
the range from 1.8 to 3.6 V and up to 10 MHz within the range from 2.7 to 3.6 V. For the high
and low widths of the clock, see section 25, Electrical Characteristics. The duty cycle is
arbitrary.
Table 13.4 shows a maximum clock frequency.
Table 13.4 Maximum Clock Frequency
Mode
Maximum Clock Frequency
Input to AEVH/AEVL Pin
Active (high-speed), sleep (high-speed)
10 MHz
Active (medium-speed), sleep (medium-speed)
(φOSC/8)
2 · fOSC
(φOSC/16)
fOSC
(φOSC/32)
1/2 · fOSC
fOSC = 1 MHz to 4 MHz
(φOSC/64)
1/4 · fOSC
Watch, subactive, subsleep, standby
(φW/2)
1000 kHz
(φW/4)
500 kHz
(φW/8)
250 kHz
φW = 32.768 kHz or 38.4 kHz
3. When AEC uses with 16-bit mode, set CUEH in ECCSR to 1 first, set CRCH in ECCSR to 1
second, or set both CUEH and CRCH to 1 at same time before clock input. When AEC is
operating on 16-bit mode, do not change CUEH. Otherwise, ECH will be miscounted up.
4. When ECPWME in AEGSR is 1, the event counter PWM is operating and therefore ECPWCR
and ECPWDR should not be modified.
When changing the data, clear the ECPWME bit in AEGSR to 0 (halt the event counter PWM)
before modifying these registers.
5. The event counter PWM data register and event counter PWM compare register must be set so
that event counter PWM data register < event counter PWM compare register. If the settings
do not satisfy this condition, do not set ECPWME to 1 in AEGSR.
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Section 13 Asynchronous Event Counter (AEC)
6. As synchronization is established internally when an IRQAEC interrupt is generated, a
maximum error of 1 tcyc will occur between clock halting and interrupt acceptance.
7. If the flash memory version was used with the IRQAEC pin fixed high level and then the chip
is replaced with the masked ROM version, the internal oscillator must be used.
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Section 14 Watchdog Timer
Section 14 Watchdog Timer
This LSI incorporates the watchdog timer (WDT). The WDT is an 8-bit timer that can generate an
internal reset signal if a system becomes uncontrolled and prevents the CPU from writing to the
timer counter, thus allowing it to overflow.
When this watchdog timer function is not needed, the WDT can be used as an interval timer. In
interval timer operation, an interval timer interrupt is generated each time the counter overflows.
14.1
Features
The WDT features are described below.
• Selectable from nine counter input clocks
Eight internal clock sources (φ/64, φ/128, φ/256, φ/512, φ/1024, φ/2048, φ/4096, and φ/8192)
or the WDT on-chip oscillator can be selected as the timer-counter clock.
• Watchdog timer mode
If the counter overflows, this LSI is internally reset.
• Interval timer mode
If the counter overflows, an interval timer interrupt is generated.
• Use of module standby mode enables this module to be placed in standby mode independently
when not used. (For details, refer to section 6.4, Module Standby Function.)
Figure 14.1 shows a block diagram of the WDT.
WDT0110A_010020040500
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Section 14 Watchdog Timer
φ
TCSRWD1
PSS
TCWD
Internal data bus
TMWD
WDT
on-chip
oscillator
TCSRWD2
[Legend]
TCSRWD1:
TCSRWD2:
TCWD:
TMWD:
PSS:
Timer control/status register WD1
Timer control/status register WD2
Timer counter WD
Timer mode register WD
Prescaler S
Interrupt/reset control
Figure 14.1 Block Diagram of Watchdog Timer
14.2
Register Descriptions
The watchdog timer has the following registers.
• Timer control/status register WD1 (TCSRWD1)
• Timer control/status register WD2 (TCSRWD2)
• Timer counter WD (TCWD)
• Timer mode register WD (TMWD)
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Internal reset signal or
interrupt request signal
Section 14 Watchdog Timer
14.2.1
Timer Control/Status Register WD1 (TCSRWD1)
TCSRWD1 performs the TCSRWD1 and TCWD write control. TCSRWD1 also controls the
watchdog timer operation and indicates the operating state. TCSRWD1 must be rewritten by using
the MOV instruction. The bit manipulation instruction cannot be used to change the setting value.
Bit
Bit Name
Initial
Value
R/W
Description
7
B6WI
1
R/W
Bit 6 Write Inhibit
The TCWE bit can be written only when the write value
of the B6WI bit is 0.
This bit is always read as 1.
6
TCWE
0
R/W
Timer Counter WD Write Enable
TCWD can be written when the TCWE bit is set to 1.
When writing data to this bit, the write value for bit 7
must be 0.
5
B4WI
1
R/W
Bit 4 Write Inhibit
The TCSRWE bit can be written only when the write
value of the B4WI bit is 0. This bit is always read as 1.
4
TCSRWE
0
R/W
Timer Control/Status Register WD Write Enable
The WDON and WRST bits can be written when the
TCSRWE bit is set to 1.
When writing data to this bit, the write value for bit 5
must be 0.
3
B2WI
1
R/W
Bit 2 Write Inhibit
The WDON bit can be written only when the write value
of the B2WI bit is 0. This bit is always read as 1.
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Section 14 Watchdog Timer
Bit
Bit Name
Initial
Value
R/W
Description
2
WDON
0
R/W
Watchdog Timer On*
TCWD starts counting up when the WDON bit is set to
1 and halts when the WDON bit is cleared to 0.
[Setting condition]
When 1 is written to the WDON bit and 0 to the B2WI
bit while the TCSRWE bit is 1
[Clearing conditions]
1
B0WI
1
R/W
•
Reset by RES pin
•
When 0 is written to the WDON bit and 0 to the
B2WI bit while the TCSRWE bit is 1
Bit 0 Write Inhibit
The WRST bit can be written only when the write value
of the B0WI bit is 0. This bit is always read as 1.
0
WRST
0
R/W
Watchdog Timer Reset
[Setting condition]
When TCWD overflows and an internal reset signal is
generated
[Clearing conditions]
Note:
*
•
Reset by RES pin
•
When 0 is written to the WRST bit and 0 to the
B0WI bit while the TCSRWE bit is 1
When transitioning to the watch mode or standby mode while the main internal clock is
selected (CKS3 = 1) using timer mode register WD (TMWD), make sure to clear WDON
to 0 to halt operation of TCWD.
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Section 14 Watchdog Timer
14.2.2
Timer Control/Status Register WD2 (TCSRWD2)
TCSRWD2 performs the TCSRWD2 write control, mode switching, and interrupt control.
TCSRWD2 must be rewritten by using the MOV instruction. The bit manipulation instruction
cannot be used to change the setting value.
Bit
Bit Name
Initial
Value
7
OVF
0
R/(W)* Overflow Flag
Indicates that TCWD has overflowed (changes from
H'FF to H'00).
[Setting condition]
When TCWD overflows (changes from H'FF to H'00)
When internal reset request generation is selected in
watchdog timer mode, this bit is cleared automatically
by the internal reset after it has been set.
[Clearing condition]
• When TCSRWD2 is read when OVF = 1, then 0 is
4
written to OVF*
6
B5WI
1
5
WT/IT
0
4
B3WI
1
3
IEOVF
0
R/(W)* Bit 5 Write Inhibit
The WT/IT bit can be written only when the write value
of the B5WI bit is 0. This bit is always read as 1.
3
R/(W)* Timer Mode Select
Selects whether the WDT is used as a watchdog timer
or interval timer.
0: Watchdog timer mode
1: Interval timer mode
2
R/(W)* Bit 3 Write Inhibit
The IEOVF bit can be written only when the write value
of the B3WI bit is 0. This bit is always read as 1.
3
R/(W)* Overflow Interrupt Enable
Enables or disables an overflow interrupt request in
interval timer mode.
0: Disables an overflow interrupt
1: Enables an overflow interrupt
R/W
Description
1
2
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Section 14 Watchdog Timer
Bit
Bit Name
Initial
Value
R/W
Description
2 to 0

All 1

Reserved
These bits are always read as 1.
Notes: 1. Only 0 can be written to clear the flag.
2. Write operation is necessary because this bit controls data writing to other bit. This bit is
always read as 1.
3. Writing is possible only when the write conditions are satisfied.
4. In subactive mode, clear this flag after setting the CKS3 to CKS0 bits in TMWD to
B'0XXX (WDT on-chip oscillator).
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Section 14 Watchdog Timer
14.2.3
Timer Counter WD (TCWD)
TCWD is an 8-bit readable/writable up-counter. When TCWD overflows from H'FF to H'00, the
internal reset signal is generated in watchdog timer mode, the WRST bit in TCSRWD1 is set to 1,
and the OVF bit in TCSRWD2 is set to 1. TCWD is initialized to H'00.
14.2.4
Timer Mode Register WD (TMWD)
TMWD selects the input clock.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 4

All 1

Reserved
These bits are always read as 1.
3
CKS3
1
R/W
Clock Select 3 to 0
2
CKS2
1
R/W
Select the clock to be input to TCWD.
1
CKS1
1
R/W
1000: Internal clock: counts on φ/64
0
CKS0
1
R/W
1001: Internal clock: counts on φ/128
1010: Internal clock: counts on φ/256
1011: Internal clock: counts on φ/512
1100: Internal clock: counts on φ/1024
1101: Internal clock: counts on φ/2048
1110: Internal clock: counts on φ/4096
1111: Internal clock: counts on φ/8192
0XXX: WDT on-chip oscillator: counts on ROSC/2048
For the WDT on-chip oscillator overflow periods, see
section 25, Electrical Characteristics.
In active (medium-speed) mode or sleep (mediumspeed) mode, the setting of B'0XXX and interval timer
mode is disabled.
[Legend]
X: Don't care.
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Section 14 Watchdog Timer
14.3
Operation
14.3.1
Watchdog Timer Mode
The watchdog timer is provided with an 8-bit up-counter. To use it as the watchdog timer, clear
the WT/IT bit in TCSRWD2 to 0. (To write the WT/IT bit, two write accesses are required.) If 1 is
written to the WDON bit and 0 to the B2WI bit simultaneously when the TCSRWE bit in
TCSRWD1 is set to 1, TCWD begins counting up. (To operate the watchdog timer, two write
accesses to TCSRWD1 are required.) When a clock pulse is input after the TCWD count value has
reached H'FF, the watchdog timer overflows and an internal reset signal is generated. The internal
reset signal is output for a period of 256 φosc clock cycles. TCWD is a writable counter, and when a
value is set in TCWD, the count-up starts from that value. An overflow period in the range of 1 to
256 input clock cycles can therefore be set, according to the TCWD set value.
Figure 14.2 shows an example of watchdog timer operation.
Example:
With 30-ms overflow period when φ = 4 MHz
4 × 106
8192
× 30 × 10–3 = 14.6
Therefore, 256 – 15 = 241 (H'F1) is set in TCW.
TCWD overflow
H'FF
H'F1
TCWD
count value
H'00
Start
H'F1 written
to TCWD
H'F1 written to TCWD
Reset generated
Internal reset
signal
256 φosc clock cycles
Figure 14.2 Example of Watchdog Timer Operation
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Section 14 Watchdog Timer
14.3.2
Interval Timer Mode
Figure 14.3 shows the operation in interval timer mode. To use the WDT as an interval timer, set
the WT/IT bit in TCSRWD2 to 1.
When the WDT is used as an interval timer, an interval timer interrupt request is generated each
time the TCNT overflows. Therefore, an interval timer interrupt can be generated at intervals.
H'FF
TCNT
count value
Time
H'00
WT/IT = 1
Interval timer
Interval timer
Interval timer
Interval timer
Interval timer
interrupt
interrupt
interrupt
interrupt
interrupt
request generated request generated request generated request generated request generated
Figure 14.3 Interval Timer Mode Operation
14.3.3
Timing of Overflow Flag (OVF) Setting
Figure 14.4 shows the timing of the OVF flag setting. The OVF flag in TCSRWD2 is set to 1 if
TCNT overflows. At the same time, a reset signal is output in watchdog timer mode and an
interval timer interrupt is generated in interval timer mode.
φ
H'FF
TCNT
H'00
Overflow signal
OVF
Figure 14.4 Timing of OVF Flag Setting
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Section 14 Watchdog Timer
14.4
Interrupt
During interval timer mode operation, an overflow generates an interval timer interrupt. The
interval timer interrupt is requested whenever the OVF flag is set to 1 while the IEOVF bit in
TCSRWD2 is set to 1. The OVF flag must be cleared to 0 in the interrupt handling routine.
14.5
Usage Notes
14.5.1
Switching between Watchdog Timer Mode and Interval Timer Mode
If the mode is switched between watchdog timer and interval timer, while the WDT is operating,
errors could occur in the incrementation. Software must stop the watchdog timer (by clearing the
WDON bit to 0) before switching the mode.
14.5.2
Module Standby Mode Control
The WDCKSTP bit in CKSTPR2 is valid when the WDON bit in the timer control/status register
1 (TCSRWD1) is cleared to 0. The WDCKSTP bit can be cleared to 0 while the WDON bit is set
to 1 (while the watchdog timer is operating). However, the watchdog timer does not enter module
standby mode but continues operating. When the WDON bit is cleared to 0 by software after the
watchdog timer stops operating, the WDCKSTP bit is valid at the same time and the watchdog
timer enters module standby mode.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Section 15 Serial Communication Interface 3 (SCI3, IrDA)
The serial communication interface 3 (SCI3) can handle both asynchronous and clocked
synchronous serial communication. In the asynchronous method, serial data communication can
be carried out using standard asynchronous communication chips such as a Universal
Asynchronous Receiver/Transmitter (UART) or an Asynchronous Communication Interface
Adapter (ACIA).
The SCI3_1 can transmit and receive IrDA communication waveforms based on the Infrared Data
Association (IrDA) standard version 1.0.
15.1
Features
• Choice of asynchronous or clocked synchronous serial communication mode
• Full-duplex communication capability
The transmitter and receiver are mutually independent, enabling transmission and reception to
be executed simultaneously.
Double-buffering is used in both the transmitter and the receiver, enabling continuous
transmission and continuous reception of serial data.
• On-chip baud rate generator allows any bit rate to be selected
• On-chip baud rate generator, internal clock, or external clock can be selected as a transfer
clock source.
• Six interrupt sources
Transmit-end, transmit-data-empty, receive-data-full, overrun error, framing error, and parity
error.
• Use of module standby mode enables this module to be placed in standby mode independently
when not used. (For details, refer to section 6.4, Module Standby Function.)
Asynchronous mode
• Data length: 7, 8, or 5 bits
• Stop bit length: 1 or 2 bits
• Parity: Even, odd, or none
• Receive error detection: Parity, overrun, and framing errors
• Break detection: Break can be detected by reading the RXD32 pin level directly in the case of
a framing error
Note: When using serial communication interface 3 in the masked ROM version, do not use the
on-chip oscillator.
SCI0012A_010020040500
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Clocked synchronous mode
• Data length: 8 bits
• Receive error detection: Overrun errors detected
Table 15.1 SCI3 Channel Configuration
1
Channel
Abbreviation
Pin*
Channel 1
SCI3_1
SCK31
RXD31
TXD31
Channel 2
SCI3_2
SCK32
RXD32
TXD32
2
Register*
Register Address
SMR3_1
H'FF98
BRR3_1
H'FF99
SCR3_1
H'FF9A
TDR3_1
H'FF9B
SSR3_1
H'FF9C
RDR3_1
H'FF9D
RSR3_1

TSR3_1

IrCR
H'FFA7
SMR3_2
H'FFA8
BRR3_2
H'FFA9
SCR3_2
H'FFAA
TDR3_2
H'FFAB
SSR3_2
H'FFAC
RDR3_2
H'FFAD
RSR3_2

TSR3_2

Notes: 1. Pin names SCK3, RXD3, and TXD3 are used in the text for all channels, omitting the
channel designation.
2. In the text, channel description is omitted for registers and bits.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Figure 15.1 (1) shows a block diagram of the SCI3_1 and figure 15.1 (2) shows that of the
SCI3_2.
SCK31
Internal clock (φ/64, φ/16, φw/2, φ)
External clock
Baud rate generator
BRC3_1
BRR3_1
SMR3_1
Transmit/receive
control circuit
SCR3_1
SSR3_1
TXD31
TSR3_1
TDR3_1
RSR3_1
RDR3_1
Internal data bus
Clock
SPCR
IrCR
Interrupt request
(TEI31, TXI31, RXI31, ERI31)
RXD31
[Legend]
RSR3_1: Receive shift register 3_1
RDR3_1:Receive data register 3_1
TSR3_1: Transmit shift register 3_1
TDR3_1: Transmit data register 3_1
SMR3_1:Serial mode register 3_1
SCR3_1: Serial control register 3_1
SSR3_1: Serial status register 3_1
BRR3_1: Bit rate register 3_1
BRC3_1: Bit rate counter 3_1
SPCR: Serial port control register
IrDA control register
IrCR:
Figure 15.1 (1) Block Diagram of SCI3_1
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
SCK32
Internal clock (φ/64, φ/16, φw/2, φ)
External clock
Baud rate generator
BRC3_2
BRR3_2
SMR3_2
Transmit/receive
control circuit
SCR3_2
SSR3_2
TXD32
RXD32
TSR3_2
TDR3_2
RSR3_2
RDR3_2
Internal data bus
Clock
SPCR
Interrupt request
(TEI32, TXI32, RXI32, ERI32)
[Legend]
RSR3_2:
RDR3_2:
TSR3_2:
TDR3_2:
SMR3_2:
SCR3_2:
SSR3_2:
BRR3_2:
BRC3_2:
SPCR:
Receive shift register 3_2
Receive data register 3_2
Transmit shift register 3_2
Transmit data register 3_2
Serial mode register 3_2
Serial control register 3_2
Serial status register 3_2
Bit rate register 3_2
Bit rate counter 3_2
Serial port control register
Figure 15.1 (2) Block Diagram of SCI3_2
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.2
Input/Output Pins
Table 15.2 shows the SCI3 pin configuration.
Table 15.2 Pin Configuration
Pin Name
Abbreviation I/O
Function
SCI3 clock
SCK31,
SCK32
I/O
SCI3 clock input/output
SCI3 receive data
input
RXD31,
RXD32
Input
SCI3 receive data input
SCI3 transmit data
output
TXD31,
TXD32
Output
SCI3 transmit data output
15.3
Register Descriptions
The SCI3 has the following registers for each channel.
• Receive shift register 3 (RSR3)*
• Receive data register 3 (RDR3)*
• Transmit shift register 3 (TSR3)*
• Transmit data register 3 (TDR3)*
• Serial mode register 3 (SMR3)*
• Serial control register 3 (SCR3)*
• Serial status register 3 (SSR3)*
• Bit rate register 3 (BRR3)*
• Serial port control register (SPCR)
• IrDA control register (IrCR)
Note: * These register names are abbreviated to RSR, RDR, TSR, TDR, SMR, SCR, SSR, and
BRR in the text.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.3.1
Receive Shift Register (RSR)
RSR is a shift register that receives serial data input from the RXD31 or RXD32 pin and converts
it into parallel data. When one byte of data has been received, it is transferred to RDR
automatically. RSR cannot be directly accessed by the CPU.
15.3.2
Receive Data Register (RDR)
RDR is an 8-bit register that stores receive data. When the SCI3 has received one byte of serial
data, it transfers the received serial data from RSR to RDR, where it is stored. After this, RSR is
receive-enabled. As RSR and RDR function as a double buffer in this way, continuous receive
operations are possible. After confirming that the RDRF bit in SSR is set to 1, read RDR only
once. RDR cannot be written to by the CPU. RDR is initialized to H'00.
RDR is initialized to H'00 by a reset or in standby mode, watch mode, or module standby mode.
15.3.3
Transmit Shift Register (TSR)
TSR is a shift register that transmits serial data. To perform serial data transmission, the SCI3 first
transfers transmit data from TDR to TSR automatically, then sends the data that starts from the
LSB to the TXD31 or TXD32 pin. Data transfer from TDR to TSR is not performed if no data has
been written to TDR (if the TDRE bit in SSR is set to 1). TSR cannot be directly accessed by the
CPU.
15.3.4
Transmit Data Register (TDR)
TDR is an 8-bit register that stores data for transmission. When the SCI3 detects that TSR is
empty, it transfers the transmit data written in TDR to TSR and starts transmission. The doublebuffered structure of TDR and TSR enables continuous serial transmission. If the next transmit
data has already been written to TDR during transmission of one-frame data, the SCI3 transfers
the written data to TSR to continue transmission. To achieve reliable serial transmission, write
transmit data to TDR only once after confirming that the TDRE bit in SSR is set to 1. TDR is
initialized to H'FF.
TDR is initialized to H'FF by a reset or in standby mode, watch mode, or module standby mode.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.3.5
Serial Mode Register (SMR)
SMR sets the SCI3's serial communication format and selects the clock source for the on-chip
baud rate generator.
SMR is initialized to H'00 by a reset or in standby mode, watch mode, or module standby mode.
Bit
Bit Name
Initial
Value
R/W
7
COM
0
R/W
Description
Communication Mode
0: Asynchronous mode
1: Clocked synchronous mode
6
CHR
0
R/W
Character Length (enabled only in asynchronous mode)
0: Selects 8 or 5 bits as the data length.
1: Selects 7 or 5 bits as the data length.
When 7-bit data is selected. the MSB (bit 7) in TDR is
not transmitted. To select 5 bits as the data length, set
1 to both the PE and MP bits. The three most
significant bits (bits 7, 6, and 5) in TDR are not
transmitted. In clocked synchronous mode, the data
length is fixed to 8 bits regardless of the CHR bit
setting.
5
PE
0
R/W
Parity Enable (enabled only in asynchronous mode)
When this bit is set to 1, the parity bit is added to
transmit data before transmission, and the parity bit is
checked in reception. In clocked synchronous mode,
parity bit addition and checking is not performed
regardless of the PE bit setting.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Bit
Bit Name
Initial
Value
R/W
Description
4
PM
0
R/W
Parity Mode (enabled only when the PE bit is 1 in
asynchronous mode)
0: Selects even parity.
1: Selects odd parity.
When even parity is selected, a parity bit is added in
transmission so that the total numver of 1 bits in the
transmit data plus the parity bit is an even number, in
reception, a check is carried out to confirm that the
number of 1 bits in the receive data plus the parity bit is
an enen number.
When odd parity is selected, a parity bit is added in
transmission so that the total numver of 1 bits in the
transmit data plus the parity bit is an odd numver, in
reception, a check is carried out to confirm that the
numver of 1bits in the receive data plus the parity bit is
an odd numver.
If parity bit addition and checking is disabled in clocked
synchronous mode and asynchronous mode, the PM
bit setting is invalid.
3
STOP
0
R/W
Stop Bit Length (enabled only in asynchronous mode)
Selects the stop bit length in transmission.
0: 1 stop bit
1: 2 stop bits
For reception, only the first stop bit is checked,
regardless of the value in the bit. If the second stop bit
is 0, it is treated as the start bit of the next transmit
character.
2
MP
0
R/W
5-Bit Communication
When this bit is set to 1, the 5-bit communication format
is enabled. When writing 1 to this bit, always write 1 to
bit 5 (RE) at the same time. In addition, 1 must be
written to bit 3 (MPIE) in the serial control register
(SCR) before writing 1 to this bit.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Bit
Bit Name
Initial
Value
R/W
Description
1
CKS1
0
R/W
Clock Select 0 and 1
0
CKS0
0
R/W
These bits select the clock source for the on-chip baud
rate generator.
00: φ clock (n = 0)
01: φw/2 or φ w clock (n = 1)
10: φ/16 clock (n = 2)
11: φ/64 clock (n = 3)
When the setting value is 01 in active (mediumspeed/high-speed) mode and sleep (mediumspeed/high-speed) mode φw/2 clock is set. In subacive
mode and subsleep mode, φw clock is set. The SCI3 is
enabled only, when φw/2 is selected for the CPU
operating clock.
For the relationship between the bit rate register setting
and the baud rate, see section 15.3.8, Bit Rate Register
(BRR). n is the decimal representation of the value of n
in BRR (see section 15.3.8, Bit Rate Register (BRR)).
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.3.6
Serial Control Register (SCR)
SCR enables or disables SCI3 transfer operations and interrupt requests, and selects the transfer
clock source. For details on interrupt requests, refer to section 15.8, Interrupt Requests.
SCR is initialized to H'00 by a reset or in standby mode, watch mode, or module standby mode.
Bit
Bit Name
Initial
Value
R/W
7
TIE
0
R/W
Description
Transmit Interrupt Enable
When this bit is set to 1, the TXI (TXI32) interrupt
request is enabled. TXI (TXI32) can be released by
clearing the TDRE it or TI bit to 0.
6
RIE
0
R/W
Receive Interrupt Enable
When this bit is set to 1, RXI and ERI interrupt requests
are enabled.
RXI (RXI32) and ERI (ERI32) can be released by
clearing the RDRF bit or the FER, PER, or OER error
flag to 0, or by clearing the RIE bit to 0.
5
TE
0
R/W
Transmit Enable
When this bit is set to 1, transmission is enabled. When
this bit is 0, the TDRE bit in SSR is fixed at 1. When
transmit data is written to TDR while this bit is 1, Bit
TDRE in SSR is cleared to 0 and serial data
tansmission is started. Be sure to carry out SMR
settings, and setting of bit SPC31 or SPC32 in SPCR,
to decide the transmission format before setting bit TE
to 1.
4
RE
0
R/W
Receive Enable
When this bit is set to 1, reception is enabled. In this
state, serial data reception is started when a start bit is
detected in asynchronous mode or serial clock input is
detected in clocked synchronous mode. Be sure to
carry out the SMR settings to decide the reception
format before setting bit RE to 1.
Note that the RDRF, FER, PER, and OER flags in SSR
are not affected when bit RE is cleared to 0, and retain
their previous state
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Bit
Bit Name
Initial
Value
R/W
Description
3
MPIE
0
R/W
Reserved
2
TEIE
0
R/W
Transmit End Interrupt Enable
When this bit is set to 1, the TEI interrupt request is
enabled. TEI can be released by clearing bit TDRE to 0
and clearing bit TEND to 0 in SSR, or by clearing bit
TEIE to 0.
1
CKE1
0
R/W
Clock Enable 0 and 1
0
CKE0
0
R/W
Select the clock source.
Asynchronous mode:
00: Internal baud rate generator (SCK31 or SCK32 pin
functions as an I/O port)
01: Internal baud rate generator (Outputs a clock of the
same frequency as the bit rate from the SCK31 or
SCK32 pin)
10: External clock (Inputs a clock with a frequency 16
times the bit rate from the SCK31 or SCK32 pin)
11: Reserved
Clocked synchronous mode:
00: Internal clock (SCK31 or SCK32 pin functions as
clock output)
01: Reserved
10: External clock (SCK31 or SCK32 pin functions as
clock input)
11: Reserved
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.3.7
Serial Status Register (SSR)
SSR consists of status flags of the SCI3 and multiprocessor bits for transfer. 1 cannot be written to
flags TDRE, RDRF, OER, PER, and FER; they can only be cleared.
SSR is initialized to H'84 by a reset or in standby mode, watch mode, or module standby mode.
Bit
Bit Name
Initial
Value
R/W
7
TDRE
1
R/(W)* Transmit Data Register Empty
Description
Indicates that transmit data is stored in TDR.
[Setting conditions]
•
When the TE bit in SCR is 0
•
When data is transferred from TDR to TSR
[Clearing conditions]
6
RDRF
0
•
When 0 is written to TDRE after reading TDRE = 1
•
When the transmit data is written to TDR
R/(W)* Receive Data Register Full
Indicates that the received data is stored in RDR.
[Setting condition]
•
When serial reception ends normally and receive
data is transferred from RSR to RDR
[Clearing conditions]
•
When 0 is written to RDRF after reading RDRF = 1
When data is read from RDR
If an error is detected in reception, or if the RE bit in
SCR has been cleared to 0, RDR and bit RDRF are not
affected and retain their previous state.
Note that if data reception is completed while bit RDRF
is still set to 1, an overrun error (OER) will occur and
the receive data will be lost.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Bit
Bit Name
Initial
Value
R/W
5
OER
0
R/(W)* Overrun Error
Description
[Setting condition]
•
When an overrun error occurs in reception
[Clearing condition]
•
When 0 is written to OER after reading OER = 1
When bit RE in SCR is cleared to 0, bit OER is not
affected and retains its previous state.
When an overrun error occurs, RDR retains the receive
data it held before the overrun error occurred, and data
received after the error is lost. Reception cannot be
continued with bit OER set to 1, and in clocked
synchronous mode, transmission cannot be continued
either.
4
FER
0
R/(W)* Framing Error
[Setting condition]
•
When a framing error occurs in reception
[Clearing condition]
•
When 0 is written to FER after reading FER = 1
When bit RE in SCR is cleared to 0, bit FER is not
affected and retains its previous state.
Note that, in 2-stop-bit mode, only the first stop bit is
checked for a value of 1, and the second stop bit is not
checked. When a framing error occurs, the receive
data is transferred to RDR but bit RDRF is not set.
Reception cannot be continued with bit FER set to 1. In
clocked synchronous mode, neither transmission nor
reception is possible when bit FER is set to 1.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Bit
Bit Name
Initial
Value
R/W
3
PER
0
R/(W)* Parity Error
Description
[Setting condition]
•
When a parity error is generated during reception
[Clearing condition]
•
When 0 is written to PER after reading PER = 1
When bit RE in SCR is cleared to 0, bit PER is not
affected and retains its previous state.
•
2
TEND
1
R
Receive data in which a parity error has occurred is
still transferred to RDR, but bit RDRF is not set.
Reception cannot be continued with bit PER set to
1. In clocked synchronous mode, neither
transmission nor reception is possible when bit
PER is set to 1.
Transmit End
[Setting conditions]
•
When the TE bit in SCR is 0
•
When TDRE = 1 at transmission of the last bit of a
1-byte serial transmit character
[Clearing conditions]
1
MPBR
0
R
•
When 0 is written to TDRE after readingTDRE = 1
•
When the transmit data is written to TDR
Reserved
This bit is read-only and reserved. It cannot be written
to.
0
MPBT
0
R/W
Reserved
The write value should always be 0.
Note:
*
Only 0 can be written to clear the flag.
Rev. 3.00 Aug 23, 2006 Page 320 of 616
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.3.8
Bit Rate Register (BRR)
BRR is an 8-bit readable/writable register that adjusts the bit rate. BRR is initialized to H'FF.
Table 15.3 shows the relationship between the N setting in BRR and the n setting in bits CKS1
and CKS0 in SMR in asynchronous mode. Table 15.5 shows the maximum bit rate for each
frequency in asynchronous mode. The values shown in both tables 15.3 and 15.5 are values in
active (high-speed) mode. Table 15.6 shows the relationship between the N setting in BRR and the
n setting in bits CKS1 and CKS0 in SMR in clocked synchronous mode. The values shown in
table 15.6 are values in active (high-speed) mode. The N setting in BRR and error for other
operating frequencies and bit rates can be obtained by the following formulas:
[Asynchronous Mode]
Active (medium-speed/high-speed) or sleep (medium-speed/high-speed):
N=
OSC
–1
32 × 22n × B
Error (%) =
B (bit rate obtained from n, N, φ) – R (bit rate in left-hand column in table 15.3)
R (bit rate in left-hand column in table 15.3)
× 100
Subactive or subsleep:
N=
[Legend] B:
N:
OSC
–1
64 × 22n × B
Bit rate (bit/s)
BRR setting for baud rate generator (0 ≤ N ≤ 255)
OSC: φosc value (Hz)
n:
Baud rate generator input clock number (n = 0, 2, or 3)
(The relation between n and the clock is shown in table 15.3)
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Table 15.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (1)
32.8kHz
38.4kHz
2MHz
2.097152MHz
Bit Rate
(bit/s) n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
—
—
—
—
—
—
2
35
–1.36
2
36
0.64
150
—
—
—
0
3
0.00
2
25
0.16
2
26
1.14
200
—
—
—
0
2
0.00
2
19
–2.34
3
4
2.40
250
0
1
2.50
—
—
—
0
249
0.00
3
3
2.40
300
—
—
—
0
1
0.00
0
207
0.16
0
217
0.21
600
—
—
—
0
0
0.00
0
103
0.16
0
108
0.21
1200
—
—
—
—
—
—
0
51
0.16
0
54
–0.70
2400
—
—
—
—
—
—
0
25
0.16
0
26
1.14
4800
—
—
—
—
—
—
0
12
0.16
0
13
–2.48
9600
—
—
—
—
—
—
—
—
—
0
6
–2.48
19200
—
—
—
—
—
—
—
—
—
—
—
—
31250
—
—
—
—
—
—
0
1
0.00
—
—
—
38400
—
—
—
—
—
—
—
—
—
—
—
—
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Table 15.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (2)
Bit
Rate
(bit/s) n
2.4576MHz
N
3MHz
3.6864MHz
4MHz
4.194MHz
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
3
10 –0.83
2
52
0.50
2
64
0.70
2
70
0.03
2
73
0.63
150
3
7
0.00
2
38
0.16
3
11
0.00
2
51
0.16
2
54
–0.71
200
3
5
0.00
2
28
1.02
3
8
0.00
2
38
0.16
2
40
–0.10
250
2
18 1.05
2
22
1.90
2
28
–0.69
2
30
0.81
2
32
–0.71
300
3
3
0.00
3
4
–2.34
3
5
0.00
2
25
0.16
2
26
1.13
600
3
1
0.00
0
155 0.16
3
2
0.00
0
207 0.16
0
217
0.20
1200
3
0
0.00
0
77
0.16
2
5
0.00
0
103 0.16
0
108
0.20
2400
2
1
0.00
0
38
0.16
2
2
0.00
0
51
0.16
0
54
–0.71
4800
2
0
0.00
0
19
–2.34
0
23
0.00
0
25
0.16
0
26
1.13
9600
0
7
0.00
0
9
–2.34
0
11
0.00
0
12
0.16
0
13
–2.48
19200 0
3
0.00
0
4
–2.34
0
5
0.00
— —
—
0
6
–2.48
31250 — —
—
0
2
0.00
—
—
—
0
0.00
—
—
—
38400 0
0.00
—
—
—
0
2
0.00
— —
—
—
—
—
1
3
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Table 15.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (3)
4.9152MHz
5MHz
6MHz
6.144MHz
Bit Rate
(bit/s) n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
86
0.31
2
88
–0.25
2
106
–0.44
2
108
0.08
150
3
15
0.00
2
64
0.16
2
77
0.16
3
19
0.00
200
3
11
0.00
2
48
–0.35
2
58
–0.69
3
14
0.00
250
2
37
1.05
2
38
0.16
2
46
–0.27
3
11
0.00
300
3
7
0.00
2
32
–1.36
2
38
0.16
3
9
0.00
600
3
3
0.00
0
255
1.73
3
4
–2.34
3
4
0.00
1200
3
1
0.00
0
129
0.16
0
155
0.16
2
9
0.00
2400
3
0
0.00
0
64
0.16
0
77
0.16
2
4
0.00
4800
2
1
0.00
0
32
–1.36
0
38
0.16
0
39
0.00
9600
2
0
0.00
2
0
1.73
0
19
–2.34
0
19
0.00
19200
0
7
0.00
0
7
1.73
0
9
–2.34
0
9
0.00
31250
0
4
–1.70
0
4
0.00
0
5
0.00
0
5
2.4
38400
0
3
0.00
0
3
1.73
0
4
–2.34
0
4
0.00
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Table 15.3 Examples of BRR Settings for Various Bit Rates (Asynchronous Mode) (4)
7.3728MHz
8MHz
9.8304MHz
10MHz
Bit Rate
(bit/s) n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
130
–0.07
2
141
0.03
2
174
–0.26
2
177
–0.25
150
3
23
0.00
2
103
0.16
3
31
0.00
2
129
0.16
200
3
17
0.00
2
77
0.16
3
23
0.00
2
97
–0.35
250
2
57
–0.69
2
62
–0.79
2
76
–0.26
2
77
0.16
300
3
11
0.00
2
51
0.16
3
15
0.00
2
64
0.16
600
3
5
0.00
2
25
0.16
3
7
0.00
2
32
–1.36
1200
3
2
0.00
2
12
0.16
3
3
0.00
2
15
1.73
2400
2
5
0.00
0
103
0.16
3
1
0.00
0
129
0.16
4800
2
2
0.00
0
51
0.16
3
0
0.00
0
64
0.16
9600
0
23
0.00
0
25
0.16
2
1
0.00
0
32
–1.36
19200
0
11
0.00
0
12
0.16
2
0
0.00
0
15
1.73
31250
—
—
—
0
7
0.00
0
9
–1.70
0
9
0.00
38400
0
5
0.00
—
—
—
0
7
0.00
0
7
1.73
Table 15.4 Relation between n and Clock
SMR Setting
CKS1
CKS0
0
0
0
1
φ/16
1
0
φ/64
1
1
n
Clock
0
φ
0
φW/2* /φW*
2
3
1
2
Notes: 1. φW/2 clock in active (medium-speed/high-speed) mode and sleep (medium-speed/highspeed) mode
2. φW clock in subactive mode and subsleep mode
In subactive or subsleep mode, the SCI3 can be operated only when CPU clock is φW/2.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Table 15.5 Maximum Bit Rate for Each Frequency (Asynchronous Mode)
Setting
φ (MHz)
Maximum Bit Rate (bit/s)
0.0328
512.5
0
0
0.0384
600
0
0
2
62500
0
0
2.097152
65535
0
0
2.4576
76800
0
0
3
93750
0
0
3.6864
115200
0
0
4
125000
0
0
4.194
131065
0
0
4.9152
153595
0
0
5
156250
0
0
6
187500
0
0
6.144
192000
0
0
7.3728
230400
0
0
8
250000
0
0
9.8304
307200
0
0
312500
0
0
10
Note:
*
When CKS1 = 0 and CKS0 = 1 in SMR
Rev. 3.00 Aug 23, 2006 Page 326 of 616
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n
N
Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Table 15.6 BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (1)
φ
32.8 kHz
38.4 kHz
2 MHz
Bit Rate
(bit/s)
n
N
Error (%)
n
N
Error (%)
n
N
Error (%)
200
0
20
−2.38
0
23
0.00
2
155
0.16
250
0
15
2.50
0
18
1.05
2
124
0.00
300
0
13
−2.38
0
15
0.00
2
103
0.16
500
0
7
2.50
0


2
62
−0.79
1k
0
3
2.50



2
30
0.81
2.5k






0
199
0.00
5k






0
99
0.00
10k






0
49
0.00
25k






0
19
0.00
50k






0
9
0.00
100k






0
4
0.00
250k






0
1
0.00
500k






0*
0*
0.00*









1M
Note:
*
Continuous transmission/reception is not possible.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Table 15.6 BRR Settings for Various Bit Rates (Clocked Synchronous Mode) (2)
φ
4 MHz
8 MHz
Bit Rate
(bit/s)
n
N
Error (%)
n
N
200
3
77
0.16
3
250
2
249 0.00
300
2
500
n
N
Error (%)
155 0.16
3
194
0.16
3
124 0.00
3
155
0.16
207 0.16
3
103 0.16
3
129
0.16
2
124 0.00
2
249 0.00
3
77
0.16
1k
2
62
−0.79
2
124 0.00
2
155
0.16
2.5k
2
24
0.00
2
49
0.00
2
62
−0.79
5k
0
199 0.00
2
24
0.00
2
30
0.81
10k
0
99
0.00
0
199 0.00
2
15
−2.34
25k
0
39
0.00
0
79
0.00
0
99
0.00
50k
0
19
0.00
0
39
0.00
0
49
0.00
100k
0
9
0.00
0
19
0.00
0
24
0.00
250k
0
3
0.00
0
7
0.00
0
9
0.00
500k
0
1
0.00
0
3
0.00
0
4
0.00
0*
0*
0.00*
0
1
0.00



1M
Note:
*
Error (%)
10 MHz
Continuous transmission/reception is not possible.
The value set in BRR is given by the following formula.
Active (medium-speed/high-speed) or sleep (medium-speed/high-speed):
N=
OSC
4 × 22n × B
Subactive or subsleep:
OSC
N=
8 × 22n × B
B:
N:
OSC:
n:
–1
–1
Bit rate (bit/s)
BRR setting for baud rate generator (0 ≤ N ≤ 255)
φosc value (Hz)
Baud rate generator input clock number (n = 0, 2, or 3)
(The relation between n and the clock is shown in table 15.7.)
Rev. 3.00 Aug 23, 2006 Page 328 of 616
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Table 15.7 Relation between n and Clock
SMR Setting
CKS1
CKS0
0
0
0
1
φ/16
1
0
φ/64
1
1
n
Clock
0
φ
0
φW/2* /φW*
2
3
1
2
Notes: 1. φW/2 clock in active (medium-speed/high-speed) mode and sleep (medium-speed/highspeed) mode
2. φW clock in subactive or subsleep mode
In subactive or subsleep mode, the SCI3_1 and SCI3_2 can be operated only when
CPU clock is φW/2.
15.3.9
Serial Port Control Register (SPCR)
SPCR selects the functions of the TXD32 and TXD31 pins.
Bit
Bit Name
Initial
Value
R/W
Description
7

1

Reserved
6

1

These bits are always read as 1 and cannot be
modified.
5
SPC32
0
R/W
P32/TXD33 Pin Function Switch
Selects whether pin P32/TXD32 is used as P32 or as
TXD32.
0: P32 I/O pin
1: TXD32 output pin
Set the TE32 bit in SCR32 after setting this bit to 1.
4
SPC31
0
R/W
P42/TXD31 Pin Function Switch
Selects whether pin P42/TXD31 is used as P42 or as
TXD31.
0: P42 I/O pin
1: TXD31 output pin
Set the TE bit in SCR after setting this bit to 1.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Bit
Bit Name
Initial
Value
R/W
Description
3
SCINV3
0
R/W
TXD32 Pin Output Data Inversion Switch
Selects whether the polarity of output data of the
TXD32 pin is inverted or not.
0: Output data of TXD32 pin is not inverted.
1: Output data of TXD32 pin is inverted.
2
SCINV2
0
R/W
RXD32 Pin Input Data Inversion Switch
Selects whether the polarity of input data of the RXD32
pin is inverted or not.
0: Output data of RXD32 pin is not inverted.
1: Output data of RXD32 pin is inverted.
1
SCINV1
0
R/W
TXD31 Pin Output Data Inversion Switch
Selects whether the polarity of output data of the
TXD31 pin is inverted or not.
0: Output data of TXD31 pin is not inverted.
1: Output data of TXD31 pin is inverted.
0
SCINV0
0
R/W
RXD31 Pin Input Data Inversion Switch
Selects whether the polarity of input data of the RXD31
pin is inverted or not.
0: Input data of RXD31 pin is not inverted.
1: Input data of RXD31 pin is inverted.
Note: When the serial port control register is modified, the data being input or output up to that
point is inverted immediately after the modification, and an invalid data change is input or
output. When modifying the serial port control register, modification must be made in a state
in which data changes are invalidated.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.3.10
IrDA Control Register (IrCR)
IrCR controls the IrDA operation of the SCI3_1.
Bit
Bit Name
Initial
Value
R/W
7
IrE
0
R/W
Description
IrDA Enable
Selects whether the SCI3_1 I/O pins function as the
SCI or IrDA.
0: TXD31/IrTXD or RXD31/IrRXD pin functions as
TXD31 or RXD31
1: TXD31/IrTXD or RXD31/IrRXD pin functions as
IrTXD or IrRXD
6
IrCKS2
0
R/W
IrDA Clock Select
5
IrCKS1
0
R/W
4
IrCKS0
0
R/W
If the IrDA function is enabled, these bits set the highpulse width when encoding the IrTXD output pulse.
000: Bit rate × 3/16
001: φ/2
010: φ/4
011: φ/8
100: φ/16
101: Setting prohibited
11x: Setting prohibited
3 to 0

0

Reserved
These bits are always read as 0 and cannot be
modified.
[Legend] x: Don't care.
Rev. 3.00 Aug 23, 2006 Page 331 of 616
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.4
Operation in Asynchronous Mode
Figure 15.2 shows the general format for asynchronous serial communication. One frame consists
of a start bit (low level), followed by data (in LSB-first order), a parity bit (high or low level), and
finally stop bits (high level). In asynchronous mode, synchronization is performed at the falling
edge of the start bit during reception. The data is sampled on the 8th pulse of a clock with a
frequency 16 times the bit period, so that the transfer data is latched at the center of each bit.
Inside the SCI3, the transmitter and receiver are independent units, enabling full duplex. Both the
transmitter and the receiver also have a double-buffered structure, so data can be read or written
during transmission or reception, enabling continuous data transfer. Table 15.8 shows the 16 data
transfer formats that can be set in asynchronous mode. The format is selected by the settings in
SMR as shown in table 15.9.
LSB
Serial Start
data
bit
1 bit
MSB
Transmit/receive data
5, 7, or 8 bits
1
Parity
bit
1 bit,
or none
Stop bit
1 or
2 bits
One unit of transfer data (character or frame)
Figure 15.2 Data Format in Asynchronous Communication
Rev. 3.00 Aug 23, 2006 Page 332 of 616
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Mark state
Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.4.1
Clock
Either an internal clock generated by the on-chip baud rate generator or an external clock input at
the SCK31 (SCK32) pin can be selected as the SCI3's serial clock source, according to the setting
of the COM bit in SMR and the CKE0 and CKE1 bits in SCR. When an external clock is input at
the SCK31 (SCK32) pin, the clock frequency should be 16 times the bit rate used. For details on
selection of the clock source, see table 15.10. When the SCI3 is operated on an internal clock, the
clock can be output from the SCK31 (SCK32) pin. The frequency of the clock output in this case
is equal to the bit rate, and the phase is such that the rising edge of the clock is in the middle of the
transfer data, as shown in figure 15.3.
Clock
Serial data
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
1 character (frame)
Figure 15.3 Relationship between Output Clock and Transfer Data Phase
(Asynchronous Mode) (Example with 8-Bit Data, Parity, Two Stop Bits)
Rev. 3.00 Aug 23, 2006 Page 333 of 616
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Table 15.8 Data Transfer Formats (Asynchronous Mode)
SMR
Serial Data Transfer Format and Frame Length
CHR
PE
MP
STOP
1
0
0
0
0
START
8-bit data
STOP
0
0
0
1
START
8-bit data
STOP
STOP
0
0
1
0
Setting prohibited
0
0
1
1
Setting prohibited
0
1
0
0
START
8-bit data
P
STOP
0
1
0
1
START
8-bit data
P
STOP
0
1
1
0
START
5-bit data
STOP
0
1
1
1
START
5-bit data
STOP
1
0
0
0
START
7-bit data
STOP
1
0
0
1
START
7-bit data
STOP
STOP
1
0
1
0
Setting prohibited
1
0
1
1
Setting prohibited
1
1
0
0
START
7-bit data
P
STOP
1
1
0
1
START
7-bit data
P
STOP
1
1
1
0
START
5-bit data
P
STOP
1
1
1
1
START
5-bit data
P
STOP
[Legend]
START: Start bit
STOP: Stop bit
P:
Parity bit
MPB:
Multiprocessor bit
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2
3
4
5
6
7
8
9
10
11
STOP
STOP
STOP
12
STOP
Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Table 15.9 SMR Settings and Corresponding Data Transfer Formats
SMR
Data Transfer Format
Bit 7
COM
Bit 6
CHR
Bit 2
MP
Bit 5
PE
Bit 3
STOP Mode
Data Length Parity Bit
Stop Bit
Length
0
0
0
0
0
8-bit data
1 bit
1
1
Asynchronous
mode
No
2 bits
Yes
0
1
1
0
2 bits
0
7-bit data
No
1
1
1
0
1
0
Yes
0
0
1
Setting
prohibited
0
5-bit data
No
0
Setting
prohibited
5-bit data
0
Yes
1
1
*
[Legend]
0
*
*
1 bit
2 bits
1
1
1 bit
2 bits
1
1
1 bit
2 bits
1
0
1 bit
1 bit
2 bits
Clocked
synchronous
mode
8-bit data
No
No
*: Don't care.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Table 15.10 SMR and SCR Settings and Clock Source Selection
SMR
SCR
Transmit/Receive Clock
Bit 7
Bit 1
Bit 0
COM
CKE1
CKE0
Mode
Clock Source
SCK Pin Function
0
0
0
Asynchronous
mode
Internal
I/O port (SCK31 or SCK32 pin
not used)
1
1
Outputs clock with same
frequency as bit rate
1
0
External
0
0
Inputs clock with frequency 16
times bit rate
1
0
Clocked
Internal
synchronous mode External
0
1
1
Reserved (Do not specify these combinations)
1
0
1
1
1
1
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Outputs serial clock
Inputs serial clock
Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.4.2
SCI3 Initialization
Follow the flowchart as shown in figure 15.4 to initialize the SCI3. When the TE bit is cleared to
0, the TDRE flag is set to 1. Note that clearing the RE bit to 0 does not initialize the contents of
the RDRF, PER, FER, and OER flags, or the contents of RDR. When the external clock is used in
asynchronous mode, the clock must be supplied even during initialization. When the external
clock is used in clocked synchronous mode, the clock must not be supplied during initialization.
[1]
Start initialization
When the clock output is selected in
asynchronous mode, clock is output
immediately after CKE1 and CKE0
settings are made. When the clock
output is selected at reception in clocked
synchronous mode, clock is output
immediately after CKE1, CKE0, and RE
are set to 1.
Clear TE and RE bits in SCR to 0
[1]
Set CKE1 and CKE0 bits in SCR3
Set data transfer format in SMR
[2]
Set value in BRR
[3]
Wait
[2]
Set the data transfer format in SMR.
[3]
Write a value corresponding to the bit
rate to BRR. Not necessary if an
external clock is used.
[4]
Wait at least one bit interval, then set the
TE bit or RE bit in SCR to 1. Setting bits
TE and RE enables the TXD31 (TXD32)
and RXD31 (RXD32) pins to be used.
Also set the RIE, TIE, and TEIE bits,
depending on whether interrupts are
required. In asynchronous mode, the bits
are marked at transmission and idled at
reception to wait for the start bit.
No
1-bit interval elapsed?
Yes
Set SPC32 (SPC31) bit in SPCR to 1
Set TE and RE bits in
SCR to 1, and set RIE, TIE, TEIE,
and MPIE bits.
[4]
Set the clock selection in SCR.
Be sure to clear bits RIE, TIE, TEIE, and
MPIE, and bits TE and RE, to 0.
<Initialization completion>
Figure 15.4 Sample SCI3 Initialization Flowchart
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.4.3
Data Transmission
Figure 15.5 shows an example of operation for transmission in asynchronous mode. In
transmission, the SCI3 operates as described below.
1. The SCI3 monitors the TDRE flag in SSR. If the flag is cleared to 0, the SCI3 recognizes that
data has been written to TDR, and transfers the data from TDR to TSR.
2. After transferring data from TDR to TSR, the SCI3 sets the TDRE flag to 1 and starts
transmission. If the TIE bit in SCR is set to 1 at this time, a TXI31 (TXI32) interrupt request is
generated. Continuous transmission is possible because the TXI31 (TXI32) interrupt routine
writes next transmit data to TDR before transmission of the current transmit data has been
completed.
3. The SCI3 checks the TDRE flag at the timing for sending the stop bit.
4. If the TDRE flag is 0, the data is transferred from TDR to TSR, the stop bit is sent, and then
serial transmission of the next frame is started.
5. If the TDRE flag is 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the “mark
state” is entered, in which 1 is output. If the TEIE bit in SCR is set to 1 at this time, a TEI
interrupt request is generated.
6. igure 15.6 shows a sample flowchart for transmission in asynchronous mode.
Start
bit
Serial
data
1
0
Transmit
data
D0
D1
D7
1 frame
Parity Stop Start
bit
bit bit
0/1
1
0
Transmit
data
D0
D1
D7
Parity Stop
bit
bit
0/1
1
Mark
state
1
1 frame
TDRE
TEND
LSI
TXI31 (TXI32)
operation interrupt
request
User
generated
processing
TDRE flag
cleared to 0
TXI31 (TXI32) interrupt request
generated
TEI31 (TEI32) interrupt request
generated
Data written
to TDR
Figure 15.5 Example SCI3 Operation in Transmission in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit)
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Start transmission
Set SPC32 (SPC31) bit in SPCR to 1
[1]
Read TDRE flag in SSR
No
TDRE = 1
Yes
Write transmit data to TDR
Yes
[2]
All data transmitted?
No
Read TEND flag in SSR
[1] Read SSR and check that the
TDRE flag is set to 1, then write
transmit data to TDR. When data is
written to TDR, the TDRE flag is
automaticaly cleared to 0.
(After the TE bit is set to 1, one
frame of 1 is output, then
transmission is possible.)
[2] To continue serial transmission,
read 1 from the TDRE flag to
confirm that writing is possible,
then write data to TDR. When data
is written to TDR, the TDRE flag is
automaticaly cleared to 0.
[3] To output a break in serial
transmission, after setting PCR to 1
and PDR to 0, clear the TE bit in
SCR to 0.
No
TEND = 1
Yes
[3]
No
Break output?
Yes
Clear PDR to 0 and
set PCR to 1
Clear SPC31 (SPC32) bit in SPCR
and TE bit in SCR to 0*
<End>
Note: * When SPC31 (SPC32) in SPCR is cleared to 0, the corresponding pin becomes an I/O port.
Figure 15.6 Sample Serial Transmission Flowchart (Asynchronous Mode)
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.4.4
Serial Data Reception
Figure 15.7 shows an example of operation for reception in asynchronous mode. In serial
reception, the SCI operates as described below.
1. The SCI3 monitors the communication line. If a start bit is detected, the SCI3 performs
internal synchronization, receives data in RSR, and checks the parity bit and stop bit.
• Parity check
The SCI3 checks that the number of 1 bits in the receive data conforms to the parity (odd or
even) set in bit PM in the serial mode register (SMR).
• Stop bit check
The SCI3 checks that the stop bit is 1. If two stop bits are used, only the first is checked.
• Status check
The SCI3 checks that bit RDRF is set to 0, indicating that the receive data can be transferred
from RSR to RDR.
2. If an overrun error occurs (when reception of the next data is completed while the RDRF flag
is still set to 1), the OER bit in SSR is set to 1. If the RIE bit in SCR is set to 1 at this time, an
ERI31 (ERI32) interrupt request is generated. Receive data is not transferred to RDR.
3. If a parity error is detected, the PER bit in SSR is set to 1 and receive data is transferred to
RDR. If the RIE bit in SCR is set to 1 at this time, an ERI31 (ERI32) interrupt request is
generated.
4. If a framing error is detected (when the stop bit is 0), the FER bit in SSR is set to 1 and receive
data is transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an ERI31 (ERI32)
interrupt request is generated.
5. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an RXI31 (RXI32) interrupt
request is generated. Continuous reception is possible because the RXI31 (RXI32) interrupt
routine reads the receive data transferred to RDR before reception of the next receive data has
been completed.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Start
bit
Serial
data
1
0
Receive
data
D0
D1
D7
Parity Stop Start
bit
bit bit
0/1
1
0
Receive
data
D0
D1
1 frame
Parity Stop
bit
bit
D7
0/1
Mark state
(idle state)
0
1
1 frame
RDRF
FER
LSI
operation
RXI31 (RXI32) RDRF
cleared to 0
request
User
processing
0 stop bit
detected
RDR data read
ERI request in
response to
framing error
Framing error
processing
Figure 15.7 Example SCI3 Operation in Reception in Asynchronous Mode
(8-Bit Data, Parity, One Stop Bit)
Table 15.11 shows the states of the SSR status flags and receive data handling when a receive
error is detected. If a receive error is detected, the RDRF flag retains its state before receiving
data. Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the
OER, FER, PER, and RDRF bits to 0 before resuming reception. Figure 15.8 shows a sample
flowchart for serial data reception.
Table 15.11 SSR Status Flags and Receive Data Handling
SSR Status Flag
RDRF*
OER
FER
PER
Receive Data
Receive Error Type
1
1
0
0
Lost
Overrun error
0
0
1
0
Transferred to RDR
Framing error
0
0
0
1
Transferred to RDR
Parity error
1
1
1
0
Lost
Overrun error + framing error
1
1
0
1
Lost
Overrun error + parity error
0
0
1
1
Transferred to RDR
Framing error + parity error
1
1
1
1
Lost
Overrun error + framing error +
parity error
Note:
*
The RDRF flag retains the state it had before data reception. However, note that if RDR
is read after an overrun error has occurred in a frame because reading of the receive
data in the previous frame was delayed, the RDRF flag will be cleared to 0.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Start reception
Read OER, PER, and
FER flags in SSR
[1]
Yes
OER+PER+FER = 1
[4]
No
Error processing
(Continued on next page)
Read RDRF flag in SSR
[2]
No
RDRF = 1
Yes
Read receive data in RDR
[1] Read the OER, PER, and FER flags in
SSR to identify the error. If a receive
error occurs, performs the appropriate
error processing.
[2] Read SSR and check that RDRF = 1,
then read the receive data in RDR.
The RDRF flag is cleared automatically.
[3] To continue serial reception, before the
stop bit for the current frame is
received, read the RDRF flag and read
RDR.
The RDRF flag is cleared automatically.
[4] If a receive error occurs, read the OER,
PER, and FER flags in SSR to identify
the error. After performing the
appropriate error processing, ensure
that the OER, PER, and FER flags are
all cleared to 0. Reception cannot be
resumed if any of these flags are set to
1. In the case of a framing error, a
break can be detected by reading the
value of the input port corresponding to
the RXD31 (RXD32) pin.
Yes
All data received?
[3]
No
(A)
Clear RE bit in SCR to 0
<End>
Figure 15.8 Sample Serial Data Reception Flowchart (Asynchronous Mode) (1)
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
[4]
Error processing
No
OER = 1
Yes
Overrun error processing
No
FER = 1
Yes
Yes
Break?
No
Framing error processing
No
PER = 1
Yes
Parity error processing
(A)
Clear OER, PER, and
FER flags in SSR to 0
<End>
Figure 15.8 Sample Serial Data Reception Flowchart (Asynchronous Mode) (2)
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.5
Operation in Clocked Synchronous Mode
Figure 15.9 shows the general format for clocked synchronous communication. In clocked
synchronous mode, data is transmitted or received synchronous with clock pulses. A single
character in the transmit data consists of the 8-bit data starting from the LSB. In clocked
synchronous serial communication, data on the transmission line is output from one falling edge of
the serial clock to the next. In clocked synchronous mode, the SCI3 receives data in synchronous
with the rising edge of the serial clock. After 8-bit data is output, the transmission line holds the
MSB state. In clocked synchronous mode, no parity or multiprocessor bit is added. Inside the
SCI3, the transmitter and receiver are independent units, enabling full-duplex communication
through the use of a common clock. Both the transmitter and the receiver also have a doublebuffered structure, so data can be read or written during transmission or reception, enabling
continuous data transfer.
8-bit
One unit of transfer data (character or frame)
*
*
Synchronization
clock
LSB
Bit 0
Serial data
MSB
Bit 1
Don't care
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Don't care
Note: * High except in continuous transfer
Figure 15.9 Data Format in Clocked Synchronous Communication
15.5.1
Clock
Either an internal clock generated by the on-chip baud rate generator or an external
synchronization clock input at the SCK31 (SCK32) pin can be selected, according to the setting of
the COM bit in SMR and CKE0 and CKE1 bits in SCR. When the SCI3 is operated on an internal
clock, the serial clock is output from the SCK31 (SCK32) pin. Eight serial clock pulses are output
in the transfer of one character, and when no transfer is performed the clock is fixed high.
15.5.2
SCI3 Initialization
Before transmitting and receiving data, the SCI3 should be initialized as described in a sample
flowchart in figure 15.4.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.5.3
Serial Data Transmission
Figure 15.10 shows an example of SCI3 operation for transmission in clocked synchronous mode.
In serial transmission, the SCI3 operates as described below.
1. The SCI3 monitors the TDRE flag in SSR, and if the flag is 0, the SCI recognizes that data has
been written to TDR, and transfers the data from TDR to TSR.
2. The SCI3 sets the TDRE flag to 1 and starts transmission. If the TIE bit in SCR is set to 1 at
this time, a TXI31 (TXI32) interrupt request is generated.
3. 8-bit data is sent from the TXD31 (TXD32) pin synchronized with the output clock when
output clock mode has been specified, and synchronized with the input clock when use of an
external clock has been specified. Serial data is transmitted sequentially from the LSB (bit 0),
from the TXD31 (TXD32) pin.
4. The SCI checks the TDRE flag at the timing for sending the MSB (bit 7).
5.
If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, and serial transmission
of the next frame is started.
6.
If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, and the TDRE flag maintains
the output state of the last bit. If the TEIE bit in SCR is set to 1 at this time, a TEI31 (TEI32)
is generated.
7.
The SCK31 (SCK32) pin is fixed high.
Figure 15.11 shows a sample flowchart for serial data transmission. Even if the TDRE flag is
cleared to 0, transmission will not start while a receive error flag (OER, FER, or PER) is set to 1.
Make sure that the receive error flags are cleared to 0 before starting transmission.
Serial
clock
Serial
data
Bit 0
Bit 1
Bit 7
Bit 0
Bit 1
1 frame
Bit 6
Bit 7
1 frame
TDRE
TEND
TXI31 (TXI32)
LSI
operation interrupt
request
generated
User
processing
TDRE flag
cleared
to 0
TXI31 (TXI32) interrupt request
generated
TEI31 (TEI32) interrupt request
generated
Data written
to TDR
Figure 15.10 Example of SCI3 Operation in Transmission in Clocked Synchronous Mode
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Start transmission
Set SPC32 (SPC31) bit in SPCR to 1
[1]
[1]
Read TDRE flag in SSR
No
TDRE = 1
[2]
Yes
Write transmit data to TDR
[2]
All data transmitted?
Read SSR and check that the TDRE flag is
set to 1, then write transmit data to TDR.
When data is written to TDR, the TDRE flag
is automatically cleared to 0. When clock
output is selected and data is written to
TDR, clocks are output to start the data
transmission.
To continue serial transmission, be sure to
read 1 from the TDRE flag to confirm that
writing is possible, then write data to TDR.
When data is written to TDR, the TDRE flag
is automatically cleared to 0.
Yes
No
Read TEND flag in SSR
No
TEND = 1
Yes
Clear TE bit in SCR to 0
<End>
Figure 15.11 Sample Serial Transmission Flowchart (Clocked Synchronous Mode)
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.5.4
Serial Data Reception (Clocked Synchronous Mode)
Figure 15.12 shows an example of SCI3 operation for reception in clocked synchronous mode. In
serial reception, the SCI3 operates as described below.
1. The SCI3 performs internal initialization synchronous with a synchronous clock input or
output, starts receiving data.
2. The SCI3 stores the received data in RSR.
3. If an overrun error occurs (when reception of the next data is completed while the RDRF flag
in SSR is still set to 1), the OER bit in SSR is set to 1. If the RIE bit in SCR is set to 1 at this
time, an ERI31 (ERI32) interrupt request is generated, receive data is not transferred to RDR,
and the RDRF flag remains to be set to 1.
4. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an RXI31 (RXI32) interrupt
request is generated.
Serial
clock
Serial
data
Bit 7
Bit 0
Bit 7
Bit 0
Bit 1
Bit 6
1 frame
Bit 7
1 frame
RDRF
OER
LSI
operation
User
processing
RDRF flag
RXI31 (RXI32)
cleared
interrupt
to 0
request
generated
RDR data read
ERI interrupt request
generated by
overrun error
RXI31 (RXI32)interrupt
request generated
RDR data has
not been read
(RDRF = 1)
Overrun error
processing
Figure 15.12 Example of SCI3 Reception Operation in Clocked Synchronous Mode
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the OER,
FER, PER, and RDRF bits to 0 before resuming reception. Figure 15.13 shows a sample flowchart
for serial data reception.
Start reception
[1]
[1]
Read OER flag in SSR
[2]
Yes
OER = 1?
[4]
No
[3]
Overrun error processing
(Continued below)
Read RDRF flag in SSR
[2]
[4]
No
RDRF = 1?
Yes
Read the OER flag in SSR to determine if
there is an error. If an overrun error has
occurred, execute overrun error processing.
Read SSR and check that the RDRF flag is
set to 1, then read the receive data in RDR.
When data is read from RDR, the RDRF
flag is automatically cleared to 0.
To continue serial reception, before the
MSB (bit 7) of the current frame is received,
reading the RDRF flag and reading RDR
should be finished. When data is read from
RDR, the RDRF flag is automatically
cleared to 0.
If an overrun error occurs, read the OER
flag in SSR, and after performing the
appropriate error processing, clear the OER
flag to 0. Reception cannot be resumed if
the OER flag is set to 1.
Read receive data in RDR
Yes
Data reception continued?
[3]
No
Clear RE bit in SCR to 0
<End>
[4]
Start overrun error processing
Overrun error processing
Clear OER flag in SSR to 0
<End>
Figure 15.13 Sample Serial Reception Flowchart (Clocked Synchronous Mode)
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.5.5
Simultaneous Serial Data Transmission and Reception
Figure 15.14 shows a sample flowchart for simultaneous serial transmit and receive operations.
The following procedure should be used for simultaneous serial data transmit and receive
operations. To switch from transmit mode to simultaneous transmit and receive mode, after
checking that the SCI3 has finished transmission and the TDRE and TEND flags are set to 1, clear
TE to 0. Then simultaneously set TE and RE to 1 with a single instruction. To switch from receive
mode to simultaneous transmit and receive mode, after checking that the SCI3 has finished
reception, clear RE to 0. Then after checking that the RDRF and receive error flags (OER, FER,
and PER) are cleared to 0, simultaneously set TE and RE to 1 with a single instruction.
Start transmission/reception
Set SPC32 (SPC31) bit in SPCR to 1
No
No
Yes
Read SSR and check that the TDRE
flag is set to 1, then write transmit
data to TDR.
When data is written to TDR, the
Read TDRE flag in SSR
[1]
TDRE flag is automatically cleared to
0.
[2] Read SSR and check that the RDRF
TDRE = 1
flag is set to 1, then read the receive
data in RDR.
Yes
When data is read from RDR, the
RDRF flag is automatically cleared to
Write transmit data to TDR
0.
[3] To continue serial transmission/
reception, before the MSB (bit 7) of
Read OER flag in SSR
the current frame is received, finish
reading the RDRF flag, reading RDR.
Yes
Also, before the MSB (bit 7) of the
OER = 1
[4]
current frame is transmitted, read 1
from the TDRE flag to confirm that
Overrun error processing
No
writing is possible. Then write data to
TDR.
When data is written to TDR, the
Read RDRF flag in SSR
[2]
TDRE flag is automatically cleared to
0. When data is read from RDR, the
RDRF flag is automatically cleared to
RDRF = 1
0.
[4] If an overrun error occurs, read the
Yes
OER flag in SSR, and after
performing the appropriate error
processing, clear the OER flag to 0.
Read receive data in RDR
Transmission/reception cannot be
resumed if the OER flag is set to 1.
For overrun error processing, see
figure 15.13.
Data transmission/reception
continued?
[1]
[3]
No
Clear TE and RE bits in SCR to 0
<End>
Figure 15.14 Sample Flowchart of Simultaneous Serial Transmit and Receive Operations
(Clocked Synchronous Mode)
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.6
IrDA Operation
IrDA operation can be used with the SCI3_1. Figure 15.15 shows an IrDA block diagram.
If the IrDA function is enabled using the IrE bit in IrCR, the TXD31 and RXD31 pins in the
SCI3_1 are allowed to encode and decode the waveform based on the IrDA standard version 1.0
(function as the IrTXD and IrRXD pins). Connecting these pins to the infrared data
transceiver/receiver achieves infrared data communication based on the system defined by the
IrDA standard version 1.0.
In the system defined by the IrDA standard version 1.0, communication is started at a transfer rate
of 9600 bps, which can be modified as required. The IrDA interface provided by this LSI does not
incorporate the capability of automatic modification of the transfer rate; the transfer rate must be
modified through programming.
IrDA
TXD31/IrTXD
Phase inversion
Pulse encoder
RXD31/IrRXD
Phase inversion
Pulse decoder
SCI3_1
TXD
RXD
IrCR
Figure 15.15 IrDA Block Diagram
15.6.1
Transmission
During transmission, the output signals from the SCI (UART frames) are converted to IR frames
using the IrDA interface (see figure 15.16).
For serial data of level 0, a high-level pulse having a width of 3/16 of the bit rate (1-bit interval) is
output (initial setting). The high-level pulse can be selected using the IrCKS2 to IrCKS0 bits in
IrCR.
The high-level pulse width is defined to be 1.41 µs at minimum and (3/16 + 2.5%) × bit rate or
(3/16 × bit rate) +1.08 µs at maximum. For example, when the frequency of system clock φ is 10
MHz, a high-level pulse width of at least 1.41 µs to 1.6 µs can be specified.
For serial data of level 1, no pulses are output.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
UART frame
Data
Start
bit
0
1
0
1
0
0
Stop
bit
1
Transmission
1
0
1
Reception
IR frame
Data
Start
bit
0
Bit
cycle
1
0
1
0
0
Stop
bit
1
1
0
1
Pulse width is 1.6 µs to
3/16 bit rate
Figure 15.16 IrDA Transmission and Reception
15.6.2
Reception
During reception, IR frames are converted to UART frames using the IrDA interface before
inputting to the SCI3_1.
Data of level 0 is output each time a high-level pulse is detected and data of level 1 is output when
no pulse is detected in a bit cycle. If a pulse has a high-level width of less than 1.41 µs, the
minimum width allowed, the pulse is recognized as level 0.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.6.3
High-Level Pulse Width Selection
Table 15.12 shows possible settings for bits IrCKS2 to IrCKS0 (minimum pulse width), and this
LSI's operating frequencies and bit rates, for making the pulse width shorter than 3/16 times the bit
rate in transmission.
Table 15.12 IrCKS2 to IrCKS0 Bit Settings
Bit Rate (bps) (Upper Row) / Bit Interval × 3/16 (µs) (Lower Row)
Operating
Frequency
φ (MHz)
2400
9600
19200
38400
78.13
19.53
9.77
4.88
2
010
010
010
010
2.097152
010
010
010
010
2.4576
010
010
010
010
3
011
011
011
011
3.6864
011
011
011
011
4.194
011
011
011
011
4.9152
011
011
011
011
5
011
011
011
011
6
100
100
100
100
6.144
100
100
100
100
7.3728
100
100
100
100
8
100
100
100
100
9.8304
100
100
100
100
10
100
100
100
100
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.7
Interrupt Requests
The SCI3 creates the following six interrupt requests: transmit end, transmit data empty, receive
data full, and receive errors (overrun error, framing error, and parity error). Table 15.13 shows the
interrupt sources.
Table 15.13 SCI3 Interrupt Requests
Interrupt Requests
Abbreviation
Interrupt Sources
Receive Data Full
RXI
Setting RDRF in SSR
Transmit Data Empty
TXI
Setting TDRE in SSR
Transmission End
TEI
Setting TEND in SSR
Receive Error
ERI
Setting OER, FER, and PER in SSR
Each interrupt request can be enabled or disabled by means of bits TIE and RIE in SCR.
When the TDRE bit in SSR is set to 1, a TXI31 (TXI32) interrupt is requested. When the TEND
bit in SSR is set to 1, a TEI31 (TEI32) interrupt is requested. These two interrupts are generated
during transmission.
The initial value of the TDRE flag in SSR is 1. Thus, when the TIE bit in SCR is set to 1 before
transferring the transmit data to TDR, a TXI31 (TXI32) interrupt request is generated even if the
transmit data is not ready. The initial value of the TEND flag in SSR is 1. Thus, when the TEIE bit
in SCR is set to 1 before transferring the transmit data to TDR, a TEI31 (TEI32) interrupt request
is generated even if the transmit data has not been sent. It is possible to make use of the most of
these interrupt requests efficiently by transferring the transmit data to TDR in the interrupt routine.
To prevent the generation of these interrupt requests (TXI31 and TEI31), set the enable bits (TIE
and TEIE) that correspond to these interrupt requests to 1, after transferring the transmit data to
TDR.
When the RDRF bit in SSR is set to 1, an RXI31 (RXI32) interrupt is requested, and if any of bits
OER, PER, and FER is set to 1, an ERI31 (ERI32) interrupt is requested. These two interrupt
requests are generated during reception.
The SCI3 can carry out continuous reception using an RXI31 (RXI32) and continuous
transmission using a TXI31 (TXI32).
These interrupts are shown in table 15.14.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
Table 15.14 Transmit/Receive Interrupts
Interrupt
Flags
Interrupt Request Conditions
Notes
RXI31
RDRF
(RXI32)
RIE
When serial reception is
performed normally and receive
data is transferred from RSR to
RDR, bit RDRF is set to 1, and if
bit RIE is set to 1 at this time, an
RXI31 (RXI32) is enabled and an
interrupt is requested. (See figure
15.17 (a).)
The RXI31 (RXI32) interrupt
routine reads the receive data
transferred to RDR and clears bit
RDRF to 0. Continuous reception
can be performed by repeating
the above operations until
reception of the next RSR data is
completed.
TXI31
TDRE
(TXI32)
TIE
When TSR is found to be empty
(on completion of the previous
transmission) and the transmit
data placed in TDR is transferred
to TSR, bit TDRE is set to 1. If bit
TIE is set to 1 at this time, a
TXI31 (TXI32) is enabled and an
interrupt is requested. (See figure
15.17 (b).)
The TXI31 (TXI32) interrupt
routine writes the next transmit
data to TDR and clears bit TDRE
to 0. Continuous transmission can
be performed by repeating the
above operations until the data
transferred to TSR has been
transmitted.
TEI31
TEND
(TEI32)
TEIE
When the last bit of the character
in TSR is transmitted, if bit TDRE
is set to 1, bit TEND is set to 1. If
bit TEIE is set to 1 at this time, a
TEI31 (TEI32) is enabled and an
interrupt is requested. (See figure
15.17 (c).)
A TEI31 (TEI32) indicates that the
next transmit data has not been
written to TDR when the last bit of
the transmit character in TSR is
transmitted.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
RDR
RDR
RSR↑ (reception completed, transfer)
RSR (reception in progress)
RXD31 (RXD32) pin
RXD31 (RXD32) pin
→
RDRF
RDRF = 0
1
(RXI request when RIE = 1)
Figure 15.17 (a) RDRF Setting and RXI Interrupt
TDR (next transmit data)
TDR
TSR (transmission in progress)
↓
TSR (transmission completed, transfer)
TXD31 (TXD32) pin
TXD31 (TXD32) pin
TDRE
→
TDRE = 0
1
(TXI request when TIE = 1)
Figure 15.17 (b) TDRE Setting and TXI Interrupt
TDR
TDR
TSR (transmission in progress)
TSR (transmission completed)
TXD31 (TXD32) pin
TXD31 (TXD32) pin
TEND
→
TEND = 0
1
(TEI request when TEIE = 1)
Figure 15.17 (c) TEND Setting and TEI Interrupt
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.8
Usage Notes
15.8.1
Break Detection and Processing
When framing error detection is performed, a break can be detected by reading the RXD31
(RXD32) pin value directly. In a break, the input from the RXD31 (RXD32) pin becomes all 0,
setting the FER flag, and possibly the PER flag. Note that as the SCI3 continues the receive
operation after receiving a break, even if the FER flag is cleared to 0, it will be set to 1 again.
15.8.2
Mark State and Break Sending
Regardless of the value of TE, when the SPCR31 (SPCR32) bit in SPCR is cleared to 0, the
TXD31 (TXD32) pin is used as an I/O port whose direction (input or output) and level are
determined by PCR and PDR. This can be used to set the TXD31 (TXD32) pin to mark state (high
level) or send a break during serial data transmission. To maintain the communication line at mark
state (1) until SPCR31 (SPCR32) in SPCR is set to 1, set both PCR and PDR to 1. As SPCR31
(SPCR32) in SPCR is cleared to 0 at this point, the TXD31 (TXD32) pin becomes an I/O port, and
1 is output from the TXD31 (TXD32) pin. To send a break during serial transmission, first set
PCR to 1 and PDR to 0, and then clear SPCR31 (SPCR32) and TE to 0. If TE is cleared to 0
immediately after SPCR31 (SPCR32) is cleared to 0, the transmitter is initialized regardless of the
current transmission state after TE is cleared, and when SPCR31 (SPCR32) is cleared to 0 the
TXD31 (TXD32) pin becomes an I/O port and 0 is output from it.
15.8.3
Receive Error Flags and Transmit Operations (Clocked Synchronous Mode Only)
Transmission cannot be started when a receive error flag (OER, PER, or FER) is set to 1, even if
the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 before starting
transmission. Note also that receive error flags cannot be cleared to 0 even if the RE bit is cleared
to 0.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.8.4
Receive Data Sampling Timing and Reception Margin in Asynchronous Mode
In asynchronous mode, the SCI3 operates on a basic clock with a frequency of 16 times the
transfer rate. In reception, the SCI3 samples the falling edge of the start bit using the basic clock,
and performs internal synchronization. Receive data is latched internally at the rising edge of the
8th pulse of the basic clock as shown in figure 15.18.
Thus, the reception margin in asynchronous mode is given by formula (1) below.


1
D – 0.5
M = (0.5 –
)–
– (L – 0.5) F × 100(%)
2N
N


Where N:
D:
L:
F:
... Formula (1)
Ratio of bit rate to clock (N = 16)
Clock duty (D = 0.5 to 1.0)
Frame length (L = 9 to 12)
Absolute value of clock rate deviation
Assuming values of F (absolute value of clock rate deviation) = 0 and D (clock duty) = 0.5 in
formula (1), the reception margin can be given by the formula.
M = {0.5 – 1/(2 × 16)} × 100 [%] = 46.875%
However, this is only the computed value, and a margin of 20% to 30% should be allowed for in
system design.
16 clocks
8 clocks
0
7
15 0
7
15 0
Internal basic
clock
Receive data
(RXD31/RXD32)
Start bit
D0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 15.18 Receive Data Sampling Timing in Asynchronous Mode
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.8.5
Note on Switching SCK31 (SCK32) Pin Function
If pin SCK31 (SCK32) is used as a clock output pin by the SCI3 in clocked synchronous mode
and is then switched to a general input/output pin (a pin with a different function), the pin outputs
a low level signal for half a system clock (φ) cycle immediately after it is switched.
This can be prevented by either of the following methods according to the situation.
(1)
When SCK31 (SCK32) Function is Switched from Clock Output to Non Clock-Output
When stopping data transfer, issue one instruction to clear bits TE and RE to 0 and to set bits
CKE1 and CKE0 in SCR to 1 and 0, respectively.
In this case, bit COM in SMR should be left 1. The above prevents the SCK31 (SCK32) pin from
being used as a general input/output pin. To avoid an intermediate level of voltage from being
applied to the SCK31 (SCK32) pin, the line connected to the SCK31 (SCK32) pin should be
pulled up to the VCC level via a resistor, or supplied with output from an external device.
(2)
When SCK31 (SCK32) Function is Switched from Clock Output to General
Input/Output
When stopping data transfer,
1. Issue one instruction to clear bits TE and RE to 0 and to set bits CKE1 and CKE0 in SCR to 1
and 0, respectively.
2. Clear bit COM in SMR to 0
3. Clear bits CKE1 and CKE0 in SCR to 0. Note that special care is also needed here to avoid an
intermediate level of voltage from being applied to the SCK31 (SCK32) pin.
15.8.6
Relation between Writing to TDR and Bit TDRE
Bit TDRE in the serial status register (SSR) is a status flag that indicates that data for serial
transmission has not been prepared in TDR. When data is written to TDR, bit TDRE is cleared to
0 automatically. When the SCI3 transfers data from TDR to TSR, bit TDRE is set to 1.
Data can be written to TDR irrespective of the state of bit TDRE, but if new data is written to
TDR while bit TDRE is cleared to 0, the data previously stored in TDR will be lost if it has not yet
been transferred to TSR. Accordingly, to ensure that serial transmission is performed dependably,
you should first check that bit TDRE is set to 1, then write the transmit data to TDR only once (not
two or more times).
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.8.7
Relation between RDR Reading and bit RDRF
In a receive operation, the SCI3 continually checks the RDRF flag. If bit RDRF is cleared to 0
when reception of one frame ends, normal data reception is completed. If bit RDRF is set to 1, this
indicates that an overrun error has occurred.
When the contents of RDR are read, bit RDRF is cleared to 0 automatically. Therefore, if RDR is
read more than once, the second and subsequent read operations will be performed while bit
RDRF is cleared to 0. Note that, when an RDR read is performed while bit RDRF is cleared to 0,
if the read operation coincides with completion of reception of a frame, the next frame of data may
be read. This is shown in figure 15.19.
Communication line
Frame 1
Frame 2
Frame 3
Data 1
Data 2
Data 3
Data 1
Data 2
RDRF
RDR
(A)
RDR read
(B)
RDR read
Data 1 is read at point (A)
Data 2 is read at point (B)
Figure 15.19 Relation between RDR Read Timing and Data
In this case, only a single RDR read operation (not two or more) should be performed after first
checking that bit RDRF is set to 1. If two or more reads are performed, the data read the first time
should be transferred to RAM, etc., and the RAM contents used. Also, ensure that there is
sufficient margin in an RDR read operation before reception of the next frame is completed. To be
precise in terms of timing, the RDR read should be completed before bit 7 is transferred in clocked
synchronous mode, or before the STOP bit is transferred in asynchronous mode.
15.8.8
Transmit and Receive Operations when Making State Transition
Make sure that transmit and receive operations have completely finished before carrying out state
transition processing.
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Section 15 Serial Communication Interface 3 (SCI3, IrDA)
15.8.9
Setting in Subactive or Subsleep Mode
In subactive or subsleep mode, the SCI3 can operate only when the CPU clock is φW/2. The SA1
bit in SYSCR2 should be set to 1.
15.8.10 Oscillator when Serial Communication Interface 3 is Used (Supported only by the
Masked ROM Version)
When serial communication interface 3 is used in the masked ROM version, do not use the onchip oscillator. For details on selecting the system clock oscillator or on-chip oscillator, see
section 5.2.4, On-Chip Oscillator Selection Method (Supported only by the Masked ROM
Version).
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Section 16 Serial Communication Interface 4 (SCI4)
Section 16 Serial Communication Interface 4 (SCI4)
The serial communication interface 4 (SCI4) can handle clocked synchronous serial
communication with the 8-bit buffer. The SCI4 is supported only by the F-ZTAT version. When
the on-chip emulator debugger etc. is used, the SCK4, SI4, and SO4 pins in SCI4 are used by the
system. Therefore the SCI4 is not available for the user.
16.1
Features
• Eight internal clocks (φ/1024, φ/256, φ/64, φ/32, φ/16, φ/8, φ/4, φ/2) or external clock can be
selected as a clock source.
• Receive error detection: Overrun errors detected
• Four interrupt sources
Transmit-end, transmit-data-empty, receive-data-full, and overrun error
• Full-duplex communication capability
Buffering is used in both the transmitter and the receiver, enabling continuous transmission
and continuous reception of serial data.
• When the on-chip emulator debugger etc. is not used, the SCI4 is available for the user.
• Use of module standby mode enables this module to be placed in standby mode independently
when not used. (For details, refer to section 6.4, Module Standby Function.)
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Section 16 Serial Communication Interface 4 (SCI4)
Figure 16.1 shows a block diagram of the SCI4.
φ
PSS
SCSR4
SCK4
SCR4
TDR4
SR4
SI4
SO4
Internal data bus
Transmit/receive
control circuit
RDR4
TEI
TXI
RXI
ERI
[Legend]
SCSR4: Serial control status register 4
SCR4: Serial control register 4
TDR4: Transmit data register 4
SR4:
Shift register 4
RDR4: Receive data register 4
Figure 16.1 Block Diagram of SCI4
16.2
Input/Output Pins
Table 16.1 shows the SCI4 pin configuration.
Table 16.1 Pin Configuration
Pin Name
Abbreviation
I/O
Function
SCI4 clock
SCK4
I/O
SCI4 clock input/output
SCI4 data input
SI4
Input
SCI4 receive data input
SCI4 data output
SO4
Output
SCI4 transmit data output
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Section 16 Serial Communication Interface 4 (SCI4)
16.3
Register Descriptions
The SCI4 has the following registers.
• Serial control register 4 (SCR4)
• Serial control/status register 4 (SCSR4)
• Transmit data register 4 (TDR4)
• Receive data register 4 (RDR4)
• Shift Register 4 (SR4)
16.3.1
Serial Control Register 4 (SCR4)
SCR4 enables or disables interrupt requests and controls SCI4 transfer operations.
Bit
Bit Name
Initial
Value
R/W
Description
7
TIE
0
R/W
Transmit Interrupt Enable
Enables or disables a transmit data empty interrupt
(TXI) request when serial transmit data is transferred
from TDR4 to SR4 and the TDRE flag in SCSR4 is set
to 1. TXI can be cleared by clearing the TDRE flag in
SCSR4 to 0 after the flag is read as 1 or clearing this
bit to 0.
0: Transmit data empty interrupt (TXI) request disabled
1: Transmit data empty interrupt (TXI) request enabled
6
RIE
0
R/W
Receive Interrupt Enable
Enables or disables a receive data full interrupt (RXI)
request and receive error interrupt (ERI) request when
serial receive data is transferred from SR4 to RDR4
and the RDRF flag in SCSR4 is set to 1. RXI and ERI
can be cleared by clearing the RDRF or ORER flag in
SCSR4 to 0 after the flag is read as 1 or clearing this
bit to 0.
0: Receive data full interrupt (RXI) request and receive
error interrupt (ERI) request disabled
1: Receive data full interrupt (RXI) request and receive
error interrupt (ERI) request enabled
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Section 16 Serial Communication Interface 4 (SCI4)
Bit
Bit Name
Initial
Value
R/W
Description
5
TEIE
0
R/W
Transmit End Interrupt Enable
Enables or disables a transmit end interrupt (TEI)
request when there is no valid transmit data in TDR4
during transmission of MSB data. TEI can be cleared
by clearing the TEND flag in SCSR4 to 0 after the flag
is read as 1 or clearing this bit to 0.
0: Transmit end interrupt (TEI) request disabled
1: Transmit end interrupt (TEI) request enabled
4
SOL
0
R/W
Extended Data
Sets the output level of the SO4 pin. When this bit is
read, the output level of the SO4 pin is read. The
output of the SO4 pin retains the value of the last bit of
transmit data after transmission is completed.
However, if this bit is changed before or after
transmission, the output level of the SO4 pin can be
changed. When the output level of the SO4 pin is
changed, the SOLP bit should be cleared to 0 and the
MOV instruction should be used. Note that this bit
should not be changed during transmission because
incorrect operation may occur.
[When reading]
0: The output level of the SO4 pin is low.
1: The output level of the SO4 pin is high.
[When writing]
0: The output level of the SO4 pin is changed to low.
1: The output level of the SO4 pin is changed to high.
3
SOLP
1
R/W
SOL Write Protect
Controls change of the output level of the SO4 pin due
to the change of the SOL bit. When the output level of
the SO4 pin is changed, the setting of SOL = 1 and
SOLP = 0 or SOL = 0 and SOLP = 0 is made by the
MOV instruction. This bit is always read as 1.
0: When writing, the output level is changed according
to the value of the SOL pin.
1: When reading, this bit is always read as 1 and
cannot be modified.
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Section 16 Serial Communication Interface 4 (SCI4)
Bit
Bit Name
Initial
Value
R/W
Description
2
SRES
0
R/W
Forcible Reset
When the internal sequencer is forcibly initialized, 1
should be written to this bit. When 1 is written to this
flag, the internal sequencer is forcibly reset and then
this flag is automatically cleared to 0. Note that the
values of the internal registers are retained. (The TDRE
flag in SCSR4 is set to 1 and the RDRF, ORER, and
TEND flags are cleared to 0. The TE and RE bits in
SCR4 are cleared to 0.)
0: Normal operation
1: Internal sequencer is forcibly reset
1
TE
0
R/W
Transmit Enable
Enables or disables start of the SCI4 serial
transmission. When this bit is cleared to 0, the TERE
flag in SCSR4 is fixed to 1. When transmit data is
written to TDR4 while this bit is set to 1, the TDRE flag
in SCSR4 is automatically cleared to 0 and serial data
transmission is started.
0: Transmission disabled (SO4 pin functions as I/O
port)
1: Transmission enabled (SO4 pin functions as transmit
data pin)
0
RE
0
R/W
Receive Enable
Enables or disables start of the SCI4 serial reception.
Note that the RDRF and ORER flags in SCSR4 are not
affected even if this bit is cleared to 0, and retain their
previous state. Serial data reception is started when
the synchronous clock input is detected while this bit is
set to 1 (when an external clock is selected). When an
internal clock is selected, the synchronous clock is
output and serial data reception is started.
0: Reception disabled (SI4 pin functions as I/O port)
1: Reception enabled (SI4 pin functions as receive data
pin)
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Section 16 Serial Communication Interface 4 (SCI4)
16.3.2
Serial Control/Status Register 4 (SCSR4)
SCSR4 indicates the operating state and error state, selects the clock source, and controls the
prescaler division ratio.
SCSR4 can be read from or written to by the CPU at any time. 1 cannot be written to flags TDRE,
RDRF, ORER, and TEND. To clear these flags to 0, 1 should be read from them in advance.
Bit
Bit Name
Initial
Value
R/W
7
TDRE
1
R/(W)* Transmit Data Empty
Description
Indicates that data is transferred from TDR4 to SR4
and the next serial transmit data can be written to
TDR4.
[Setting conditions]
•
When the TE bit in SCR4 is 0
•
When data is transferred from TDR4 to SR4 and
data can be written to TDR4
[Clearing conditions]
6
RDRF
0
•
When 0 is written to TDRE after reading TDRE = 1
•
When data is written to TDR4
R/(W)* Receive Data Full
Indicates that the receive data is stored in RDR4.
[Setting condition]
•
When serial reception ends normally and receive
data is transferred from SR4 to RDR4
[Clearing conditions]
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•
When 0 is written to RDRF after reading RDRF = 1
•
When data is read from RDR4
Section 16 Serial Communication Interface 4 (SCI4)
Bit
Bit Name
Initial
Value
R/W
5
ORER
0
R/(W)* Overrun Error
Description
Indicates that an overrun error occurs during reception
and then abnormal termination occurs. In transfer
mode, the output level of the SO4 pin is fixed to low
while this flag is set to 1. When the RE bit in SCR4 is
cleared to 0, the ORER flag is not affected and retains
its previous state. When RDR4 retains the receive data
it held before the overrun error occurred, and data
received after the error is lost. Reception cannot be
continued with the ORER flag set to 1, and
transmission cannot be continued either.
[Setting condition]
•
When the next serial reception is completed while
RDRF = 1
[Clearing condition]
•
4
TEND
0
When 0 is written to ORER after reading ORER = 1
R/(W)* Transmit End
Indicates that the TDRE flag has been set to 1 at
transmission of the last bit of transmit data.
[Setting condition]
•
When TDRE = 1 at transmission of the last bit of
transmit data
[Clearing conditions]
•
When 0 is written to TEND after reading TEND = 1
•
When data is written to TDR4 with an instruction
3
CKS3
1
R/W
Clock Source Select and Pin Function
2
CKS2
0
R/W
1
CKS1
0
R/W
0
CKS0
0
R/W
Select the clock source to be supplied and set the
input/output for the SCK4 pin. The prescaler division
ratio and transfer clock cycle when an internal clock is
selected are shown in table 16.2. When an external
clock is selected, the external clock cycle should be at
least 4/φ.
Note:
*
Only 0 can be written to clear the flag.
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Section 16 Serial Communication Interface 4 (SCI4)
Table 16.2 shows a prescaler division ratio and transfer clock cycle.
Table 16.2 Prescaler Division Ratio and Transfer Clock Cycle (Internal Clock)
Bit 3
Bit 2
Bit 1
Bit 0
CKS3
CKS2
CKS1
0
0
0
Transfer Clock Cycle
Function
CKS0
Prescaler
Division
Ratio
φ=
5 MHz
φ=
2.5 MHz
Clock
Resource
Pin
Function
0
0
φ/1024
204.8 µs
409.6 µs
Internal
clock
SCK4
output pin
0
0
1
φ/256
51.2 µs
102.4 µs
Internal
clock
SCK4
output pin
0
0
1
0
φ/64
12.8 µs
25.6 µs
Internal
clock
SCK4
output pin
0
0
1
1
φ/32
6.4 µs
12.8 µs
Internal
clock
SCK4
output pin
0
1
0
0
φ/16
3.2 µs
6.4 µs
Internal
clock
SCK4
output pin
0
1
0
1
φ/8
1.6 µs
3.2 µs
Internal
clock
SCK4
output pin
0
1
1
0
φ/4
0.8 µs
1.6 µs
Internal
clock
SCK4
output pin
0
1
1
1
φ/2

0.8 µs
Internal
clock
SCK4
output pin
1
0
0
0



I/O port (initial value)
1
0
0
1



I/O port
1
0
1
0



I/O port
1
0
1
1



I/O port
1
1
0
0



I/O port
1
1
0
1



I/O port
1
1
1
0



I/O port
1
1
1
1



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External
clock
SCK4 input
pin
Section 16 Serial Communication Interface 4 (SCI4)
16.3.3
Transmit Data Register 4 (TDR4)
TDR4 is an 8-bit register that stores data for serial transmission. When the SCI4 detects that SR4
is empty, it transfers the transmit data written in TDR4 to SR4 and starts serial transmission. If the
next transmit data is written to TDR4 while serial data in SR4 is being transmitted, continuous
serial transmission is possible. TDR4 can be read from or written to by the CPU at any time.
TDR4 is initialized to H'FF.
16.3.4
Receive Data Register 4 (RDR4)
RDR4 is an 8-bit register that stores receive data. When the SCI4 has received one byte of serial
data, it transfers the received serial data from SR4 to RDR4, where it is stored. Then receive
operation is completed. After this, SR4 is receive-enabled. RDR4 cannot be written to by the CPU.
RDR4 is initialized to H'00.
16.3.5
Shift Register 4 (SR4)
SR4 is a register that receives or transmits serial data. SR4 cannot be directly read from or written
to by the CPU.
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Section 16 Serial Communication Interface 4 (SCI4)
16.4
Operation
The SCI4 is a serial communication interface that transmits and receives data in synchronization
with a clock pulse and is suitable for high-speed serial communication. The data transfer format is
fixed to 8-bit data. The internal clock or external clock can be selected as a clock source. An
overrun error during reception can be detected. The transmit and receive units are configured with
double buffering mechanism. Since the mechanism enables to write data during transmission and
to read data during reception, data is consecutively transmitted and received.
16.4.1
Clock
The eight internal clocks or an external clock can be selected as a transfer clock. When the
external clock is selected, the SCK4 pin is a clock input pin. When the internal clock is selected,
the SCK4 pin is a synchronous clock output pin. The synchronous clock is output eight pulses for
1-character transmission or reception. While neither transmission nor reception is being
performed, the signal is fixed high.
When the internal clock or external clock is not selected according to the combination of the
CKS3 to CKS0 bits in SCSR4, the SCK4 pin functions as an I/O port.
16.4.2
Data Transfer Format
Figure 16.2 shows the SCI4 transfer format.
SCK4
SO4/SI4
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Figure 16.2 Data Transfer Format
In clocked synchronous communication, data on the communication line is output from the falling
edge to the next falling edge of the synchronous clock. The data is guaranteed to be settled at the
rising edge of the synchronous clock. One character starts with the LSB and ends with the MSB.
After transmitting the MSB, the communication line retains the MSB level.
The SCI4 latches data at the rising edge of the synchronous clock on reception. The data transfer
format is fixed to 8-bit data. While transmission is stopped, the output level on the SO4 pin can be
changed by the SOL setting in SCR4.
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Section 16 Serial Communication Interface 4 (SCI4)
16.4.3
Data Transmission/Reception
Before data transmission and reception, clear the TE and RE bits in SCR4 to 0 and then initialize
as the following procedure of figure 16.3.
Note: Before changing operating modes or communication format, the TE and RE bits must be
cleared to 0. Clearing the TE bit to 0 sets the TDRE flag to 1. Note that clearing the RE bit
to 0 does not affect the RDRF or ORER flag and the contents of RDR4.
When the external clock is used, the clock must not be supplied during operation including
initialization.
Start of Initialization
Clear TE and RE bits in SCR4 to 0
Clear CKS3 to CKS0 bits in
SCSR4 to 0
Set TE and RE bits in SCR4 to 1.
Set RIE, TIE, and TEIE bits.
<Transmission/reception started>
Figure 16.3 Flowchart Example of SCI4 Initialization
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Section 16 Serial Communication Interface 4 (SCI4)
16.4.4
Data Transmission
Figure 16.4 shows an example flowchart of data transmission. Data transmission should be
performed as the following procedure after the SCI4 initialization.
Initialization
[1]
[1]
Start transmission (TE = 1)
Read TDRE in SCSR4
[2]
[2]
[3]
TDRE = 1?
No
Pin SO4 functions as output pin for transmit
data
After reading SCSR4 and confirming TDRE
= 1, write transmit data in TDR4. Writing data
in TDR4 clears the TDRE bit to 0 automatically. At this time, the clock is output to start
data transmission.
To consecutively transmit data, read TDRE
= 1 to confirm that TDR4 is ready. After that,
write data in TDR4. Writing data in TDR4
clears the TDRE bit to 0 automatically.
Yes
Write transmit data in TDR4
TDRE bit cleared to 0 automatically
Data transferred from TDR4 to SR4
Start transmission by setting
TDRE bit to 1
Transmission will
continue?
Yes
[3]
No
Read TEND in SCSR4
TEND = 1?
No
Yes
TEI occurs (TEIE = 1)
Clear TE bit in SCR4 to 0
<Transmission completed>
Note: Hatching area indicates SCI internal operation.
Figure 16.4 Flowchart Example of Data Transmission
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Section 16 Serial Communication Interface 4 (SCI4)
During transmission, the SCI4 operates as shown below.
1. The SCI4 sets the TE bit to 1 and clears the TDRE flag to 0 when transmit data is written to in
TDR4 to transmit data from TDR4 to SR4. After that, the SCI4 sets the TDRE flag to 1 to start
transmission. At this time, when the TIE bit in SCR4 is set to 1, a TXI is generated.
2. In clock output mode, the SCI4 outputs eight pulses of the synchronous clock. When the
external clock is selected, the SCI4 outputs data in synchronization with the input clock.
3. Serial data is output from the LSB (bit 0) to MSB (bit 7) on pin SO4. The SCI4 checks the
TDRE flag at the timing of outputting the MSB (bit 7).
4. When TDRE = 0, data in TDR4 is transmitted to SR4 and then the data of the next frame starts
to be transmitted. When TDRE = 1, the SCI4 sets the TEND bit to 1 and holds the output level
after transmitting the MSB (bit 7). At this time, when the TEIE bit in SCR4 is set to 1, a TEI is
generated.
5. After the transmission, the output level on pin SCK4 is fixed high.
Note: Transmission cannot be performed when the error flag (ORER) which indicates the data
reception status is set to 1. Before transmission, confirm that the ORER flag is cleared to
0.
Figure 16.5 shows the example of transmission operation.
Synchronous clock
Serial data
Bit 0
Bit 1
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
1 frame
1 frame
TDRE
TEND
LSI operation
User operation
TXI
generated
TDRE
cleared
TXI
generated
TEI
generated
Data written
to TDR4
Figure 16.5 Transmit Operation Example
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Section 16 Serial Communication Interface 4 (SCI4)
16.4.5
Data Reception
Figure 16.6 shows an example flowchart of data reception. Data reception should be performed as
the following procedure after the SCI4 initialization.
Initialization
[1]
[1]
Start reception (RE = 1)
Read ORER in SCSR4
ORER = 1?
[2]
Yes
[3]
Error
processing
No
Read RDRF in SCSR4
No
(Shown below)
[4]
Pin SI4 functions as input pin for receive
data
[2][3] When a reception error occurs, read the ORER
flag in SCSR4 and then clears the ORER flag
to 0 after executing the error processing. When
the ORER flag is set to 1, both transmission
and reception cannot be restarted.
[4]
After reading SCSR4 and confirming RDRF = 1,
read the receive data in RDR4. The RDRF flag
is automatically cleared to 0. Changes in the
RDRF flag from 0 to 1 can be notified by an RXI
interrupt.
[5]
To consecutively receive data, reading the RDRF
flag and RDR4 must be completed before
receiving the MSB (bit 7) of the current frame.
RDRF = 1?
Yes
Read received data in RDR4
RDRF cleared to 0 automatically
Yes
Data transfer will
continue?
[5]
No
Clear RE bit in SCR4 to 0
<Reception completed>
Error processing
[3]
Overrun error processing
Clear ORER flag in SCSR4 to 0
<Completed>
Note: Hatching area indicates SCI internal operation.
Figure 16.6 Flowchart Example of Data Reception
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Section 16 Serial Communication Interface 4 (SCI4)
During reception, the SCI4 operates as shown below.
1. The SCI4 initialization is performed in synchronization with the synchronous clock input or
output and starts reception.
2. The SCI4 stores received data from the LSB to MSB of SR4.
3. After reception, the SCI4 checks that RDRF = 0 and whether receive data is ready for being
transferred from SR4 to RDR4.
4. When confirms that an overrun error has not occurred, the RDRF bit is set to 1 and the
received data is stored in RDR4. At this time, when the RIE bit in SCR4 is set to 1, an RXI is
generated. When an overrun error is detected by checking, the ORER flag is set to 1. The
RDRF bit retains the previously set value. If the RIE bit in SCR4 is set to 1, an ERI is
generated.
5. An overrun error is detected when the next data reception is completed with the RDRF bit in
SCSR4 set to 1. The received data is not transferred from SR4 to RDR4.
Note: Reception cannot be performed when the error flag is set to 1. Before reception, confirm
that the ORER and RDRF flags are cleared to 0.
Figure 16.7 shows an operation example of reception.
Synchronous clock
Serial data
Bit 7
Bit 0
Bit 7
1 frame
Bit 0
Bit 1
Bit 6
Bit 7
1 frame
RDRF
ORER
LSI operation
User operation
RXI
generated
RDRF
cleared
Data read
from RDR4
RXI
generated
ERI generated
by overrun error
RDR4 has not
been read from
(RDRF = 1)
Overrun error
processing
Figure 16.7 Receive Operation Example
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Section 16 Serial Communication Interface 4 (SCI4)
16.4.6
Simultaneous Data Transmission and Reception
Figure 16.8 shows an example flowchart of simultaneous data transmission and reception.
Simultaneous data transmission and reception should be performed as the following procedure
after the SCI4 initialization.
[1]
[1]
Initialization
Start transmission (TE = 1, RE = 1)
[2]
[2]
Read TDRE in SCSR4
TDRE = 1?
No
[3]
Yes
Write transmit data in TDR4
[4]
TDRE bit cleared to 0 automatically
Data transferred from TDR4 to SR4
[5]
Start transmission/reception
by setting TDRE bit to 1
Read ORER in SCSR4
ORER = 1?
Yes
Error
processing
No
Read RDRF in SCSR4
No
Pin SO4 functions as output pin for transmit
data and pin SI4 functions as input pin for
receive data. Simultaneous transmission and
reception is enabled.
After reading SCSR4 and confirming TDRE
= 1, write transmit data in TDR4. Writing data
in TDR4 clears the TDRE bit to 0 automatically. At this time, the clock is output to start
data transfer.
When a reception error occurs, read the ORER
flag in SCSR4 and then clear the ORER flag
to 0 after executing the error processing. When
the ORER flag is set to 1, both transmission
and reception cannot be restarted.
After reading SCSR4 and confirming RDRF = 1,
read receive data in RDR4 and clear the RDRF
flag to 0. An RXI interrupt can also be used to
confirm that the RDRF flag value has been changed
from 0 to 1.
To consecutively transmit and receive data, the
following operation must be completed: reading
the RDRF flag and reading RDR4 before receiving
the MSB (bit 7) of the current frame: confirming
that TDR4 is ready for writing by reading TDRE
= 1 before transmitting the MSB (bit 7) and writing
data to TDR4 to clear the TDRE flag to 0.
[3]
[4]
RDRF = 1?
Yes
Read received data in RDR4
RDRF cleared to 0 automatically
Data transfer will
continue?
Yes
[5]
No
Clear TE and RE bits in SCR4 to 0
Note: Hatching area indicates SCI internal operation.
<Transmission and reception completed>
Figure 16.8 Flowchart Example of Simultaneous Transmission and Reception
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Section 16 Serial Communication Interface 4 (SCI4)
Notes: 1. When switching from transmission to simultaneous data transmission and reception,
confirm that the SCI4 completes transmission and both the TDRE and TEND bits are
set to 1. After that, clear the TE bit to 0 and then set both the TE and RE bits to 1.
2. When switching from reception to simultaneous data transmission and reception,
confirm that the SCI4 completes reception and both the RDRF and ORER flags are
cleared to 0 after clearing the RE bit to 0. After that, set both the TE and RE bits to 1.
16.5
Interrupt Sources
The SCI4 has four interrupt sources: transmit end, transmit data empty, receive data full, and
receive error (overrun error).
Table 16.3 lists the descriptions of the interrupt sources.
Table 16.3 SCI4 Interrupt Sources
Abbreviation
Condition
Interrupt Source
RXI
RIE = 1
Receive data full (RDRF)
TXI
TIE = 1
Transmit data empty (TDRE)
TEI
TEIE = 1
Transmit end (TEND)
ERI
RIE = 1
Receive error (ORER)
The interrupt requests can be enabled/disabled by the TIE and RIE bits in SCR4.
When the TDRE flag in SCSR4 is set to 1, a TXI is generated. When the TEND bit in SCSR4 is
set to 1, a TEI is generated. These two interrupt requests are generated during transmission.
The TDRE flag in SCSR4 is initialized to 1. Therefore, if a TXI request is enabled by setting the
TIE bit in SCR4 to 1 before transmit data is transferred to TDR4, a TXI is generated even when
transmit data is not ready.
If transmit data is transferred to TDR4 in the interrupt handling routine, these interrupt requests
can be effectively used.
To avoid the occurrence of the interrupt requests (TXI and TEI), clear the corresponding interrupt
enable bits (TIE and TEIE) to 0 after transmit data is transferred to TDR4.
When the RDRF bit in SCSR4 is set to 1, an RXI is generated. When the ORER flag is set to 1, an
ERI is generated. These two interrupt requests are generated during reception.
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Section 16 Serial Communication Interface 4 (SCI4)
16.6
Usage Notes
When using the SCI4, keep in mind the following.
16.6.1
Relationship between Writing to TDR4 and TDRE
The TDRE flag in SCSR4 is a status flag that indicates that data to be transmitted has not been
stored in TDR4. When writing data to TDR4, the TDRE flag is automatically cleared to 0. The
TDRE flag is set to 1 when the SCI4 transfers data from TDR4 to SR4.
Data is written to TDR4 regardless of the TDRE flag value. However, if data is written to TDR4
with TDRE = 0, the previous data is lost unless the previous data has been transferred to SR4.
Accordingly, to ensure transmission, writing transmit data to TDR4 must be performed once after
confirming that the TDRE flag has been set to 1. (Do not write more than once.)
16.6.2
Receive Error Flag and Transmission
While the receive error flag (ORER) is set to 1, transmission cannot be started even if the TDRE
flag is cleared to 0. To start transmission, the ORER flag must be cleared to 0.
Note that the ORER flag cannot be cleared to 0 even if the RE bit is cleared to 0.
16.6.3
Relationship between Reading RDR4 and RDRF
The SCI4 always checks the RDRF flag status during reception. When the RDRF flag is cleared to
0 at the end of a frame, the reception is completed without error. When the RDRF flag is set to 1,
it indicates that an overrun has occurred.
Since reading RDR4 clears the RDRF flag to 0 automatically, if RDR4 is read twice or more, the
data is read with the RDRF flag cleared to 0. In this case, when the timing of the read operation
matches that of the data reception of the next frame, the read data may be the next frame data.
Figure 16.9 shows this operation.
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Section 16 Serial Communication Interface 4 (SCI4)
Number of transfer
Frame 1
Frame 2
Frame 3
Data 1
Data 2
Data 3
Data 1
Data 2
RDRF
RDR4
(A)
RDR4 read
(B)
RDR4 read
At the timing of (A), data 1 is read.
At the timing of (B), data 2 is read.
Figure 16.9 Relationship between Reading RDR4 and RDRF
In this case, RDR4 must be read only once after confirming RDRF = 1. If reading RDR4 twice or
more, store the read data in the RAM, and use the stored data. In addition, there should be a
margin from the timing of reading RDR4 to completion of the next frame reception. (Reading
RDR4 should be completed before the bit 7 transfer.)
16.6.4
SCK4 Output Waveform when Internal Clock of φ/2 is Selected
When the internal clock of φ/2 is selected by the CKS3 to CKS0 bits in SCSR4 and continuous
transmission or reception is performed, one pulse of high period is lengthened after eight pulses of
the clock has been output as shown in figure 16.10.
SCK4
SO4/SI4
Bit0
Bit1
Bit2
Bit3
Bit4
Bit5
Bit6
Bit7
Bit0
Bit1
Bit2
Figure 16.10 Transfer Format when Internal Clock of φ/2 is Selected
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Section 16 Serial Communication Interface 4 (SCI4)
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Section 17 14-Bit PWM
Section 17 14-Bit PWM
This LSI has an on-chip 14-bit pulse width modulator (PWM) with two channels. Connecting the
PWM to the low-pass filter enables the PWM to be used as a D/A converter. The standard PWM
or pulse-division type PWM can be selected by software. Figure 17.1 shows a block diagram of
the 14-bit PWM.
17.1
Features
• Choice of four conversion periods
A conversion period of 131,072/φ with a minimum modulation width of 8/φ, a conversion
period of 65,536/φ with a minimum modulation width of 4/φ, a conversion period of 32,768/φ
with a minimum modulation width of 2/φ, or a conversion period of 16,384/φ with a minimum
modulation width of 1/φ, can be selected.
• Pulse division method for less ripple
• Use of module standby mode enables this module to be placed in standby mode independently
when not used. (For details, refer to section 6.4, Module Standby Function.)
• The standard PWM or pulse-division type PWM can be selected by software.
φ/2
φ/4
φ/8
φ/16
Internal data bus
PWDR
PWM waveform
generator
PWCR
PWM
Pulse-division type waveform
Standard waveform
Asynchronous event counter
[Legend]
PWDR:
PWCR:
PWM data register
PWM control register
PWM waveform
generator
Figure 17.1 Block Diagram of 14-Bit PWM
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Section 17 14-Bit PWM
17.2
Input/Output Pins
Table 17.1 shows the 14-bit PWM pin configuration.
Table 17.1 Pin Configuration
Name
Abbreviation
I/O
Function
PWM1 output pin
PWM1
Output
Standard PWM/pulse-division type
PWM waveform output (PWM1)
PWM2 output pin
PWM2
Output
Standard PWM/pulse-division type
PWM waveform output (PWM2)
17.3
Register Descriptions
The 14-bit PWM has the following registers.
• PWM1 control register (PWCR1)
• PWM1 data register (PWDR1)
• PWM2 control register (PWCR2)
• PWM2 data register (PWDR2)
17.3.1
PWM Control Register (PWCR)
PWCR selects the input clocks and selects whether the standard PWM or pulse-division type
PWM is used.
Bit
Bit Name
Initial
Value
R/W
Description
7 to 3

All 1

Reserved
These bits are always read as 1 and cannot be
modified.
2
PWCRm2
0
W
PWM Output Waveform Select
Selects whether the standard PWM waveform or pulsedivision type PWM waveform is output.
0: Pulse-division type PWM waveform is output
1: Standard PWM waveform is output
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Section 17 14-Bit PWM
Bit
Bit Name
Initial
Value
R/W
Description
1
PWCRm1
0
W
Clock Select 1 and 0
0
PWCRm0
0
W
Select the clock supplied to the 14-bit PWM. These bits
are write-only bits and always read as 1.
00: The input clock is φ/2 (tφ* = 2/φ)
 A conversion period is 16,384/φ, with a
minimum modulation width of 1/φ
01: The input clock is φ/4 (tφ* = 4/φ)
 A conversion period is 32,768/φ, with a
minimum modulation width of 2/φ
10: The input clock is φ/8 (tφ* = 8/φ)
 A conversion period is 65,536/φ, with a
minimum modulation width of 4/φ
11: The input clock is φ/16 (tφ* = 16/φ)
 A conversion period is 131,072/φ, with a
minimum modulation width of 8/φ
Note:
17.3.2
* tφ: Period of PWM clock input
m = 2 or 1
PWM Data Register (PWDR)
PWDR is a 14-bit write-only register. PWDR indicates high level width in one PWM waveform
cycle when the pulse-division type PWM is selected.
When data is written to the lower 14 bits of PWDR, the contents are latched in the PWM
waveform generator and the PWM waveform generation data is updated.
The initial value of PWDR is 0, and it is always read as H'FFFF.
Always write to this register in word size.
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Section 17 14-Bit PWM
17.4
Operation
17.4.1
Pulse-Division Type PWM Operating Principle
In pulse-division type PWM, the high and low periods of normal PWM output are divided into
equal segments and output alternately. This is done to reduce ripple when using a low-pass filter
as a D/A converter. Figure 17.2 shows an example of division by four. With 14-bit PWM, the
division is into 64 pulses.
One conversion period
Normal PWM
(1)
Pulse-division
type PWM
(division by four)
(1)
(2)
(5)
(3)
(2)
(6)
(4)
(3)
(5)
(7)
(6)
(4)
(7)
(8)
(8)
Figure 17.2 Example of Pulse-Division Type PWM Using Division by Four
17.4.2
Pulse-Division Type PWM Setting Method
When using the pulse-division type PWM, set the registers in this sequence:
1. Set the PWM1 or PWM2 bit in PMR9 (corresponding to the PWM channel used) to 1 to set
the P90/PWM1 or P91/PWM2 pin to function as a PWM pin.
2. Set PWCR to define one conversion period.
3. Set the output waveform data in PWDR. When the data is written to PWDR, the contents are
latched in the PWM waveform generator, and the PWM waveform generation data is updated.
17.4.3
Pulse-Div ision Type PWM Operating
One conversion period consists of 64 pulses, as shown in figure 17.3. The total high-level width
during this period (TH) corresponds to the data in PWDR. Table 17.2 shows this relation.
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Section 17 14-Bit PWM
One conversion period
tf1
tf2
tH1
tH2
tf63
tH3
tH63
tf64
tH64
TH = tH1 + tH2 + tH3 + . . . tH64
tf1 = tf2 = tf3
. . . = tH64
Figure 17.3 PWM Output Waveform
Table 17.2 Correspondence Between PWCR, PWRD, and Output Waveform
PWCRm Setting Value
PWCRm1
PWCRm0
One Conversion
Period [tcyc]
TH
[tcyc]
tfn (n = 1 to 64)
[tcyc]
0
0
16384
(PWDRm+64) * 1
256
0
1
32768
(PWDRm+64) * 2
512
1
0
65536
(PWDRm+64) * 4
1024
1
1
131072
(PWDRm+64) * 8
2048
Note: m = 2, 1
17.4.4
Setting for Standard PWM Operation
When using the standard PWM, set the registers in this sequence:
1. Set the PWM1 or PWM2 bit in PMR9 (according to the PWM channel used) to 1 to set the
P90/PWM1 or P91/PWM2 pin to function as a PWM pin.
2. Set PWCRm2 to 1 to select the standard PWM waveform. (m = 2 or 1)
3. Set the event counter PWM in the asynchronous event counter. For the setting method, see
description of the event counter PWM operation in the asynchronous event counter.
4. The PWM pin outputs the PWM waveform set by the event counter.
Note: When the standard waveform is used, 16-bit counter operation, 8-bit counter operation,
and IRQAEC operation for the asynchronous event counter are not available because the
PWM for the asynchronous event counter is used.
When the IECPWM signal of the asynchronous event counter goes high, ECH and ECL
increment. However, when the signal goes low, these counters stop. (For details, refer to
section 13.4, Operation.)
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Section 17 14-Bit PWM
17.5
PWM Operating States
The PWM operating states are shown in table 17.3.
Table 17.3 PWM Operating States
Operating
Mode
Reset
Active
Sleep
Watch
Subactive Subsleep Standby
Module
Standby
PWCRm
Reset
Functions
Functions
Retained
Functions*
Retained
Retained
Retained
PWDRm
Reset
Functions
Functions
Retained
Retained
Retained
Retained
Retained
Notes: m = 2 or 1
* Write-enabled
17.6
Usage Notes
17.6.1
Timing of Effect on PWM Waveform After Writing to PWDR
If PWDR is rewritten during PWM waveform output, the effects on the PWM waveform are as
follows, depending on the timing of the write operation:
(1) Write performed during low-level output.
New setting takes effect from next pulse.
(2) Write performed during low-level output.
a. Duty increased.
New setting takes effect immediately after write.
b. Duty decreased.
•
High width at time of write exceeds PWDR high width after write.
High-level output for one pulse period.
•
High width at time of write does not exceed PWDR high width after write.
New setting takes effect immediately after write.
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Section 18 A/D Converter
Section 18 A/D Converter
This LSI includes a successive approximation type 10-bit A/D converter that allows up to three
analog input channels to be selected. The block diagram of the A/D converter is shown in figure
18.1.
18.1
Features
• 10-bit resolution
• Input channels: Three channels
• High-speed conversion: 12.4 µs per channel (at 5-MHz operation)
• Sample and hold function
• Conversion start method
A/D conversion can be started by software and external trigger.
• Interrupt source
An A/D conversion end interrupt request can be generated.
• Use of module standby mode enables this module to be placed in standby mode independently
when not used. (For details, refer to section 6.4, Module Standby Function.)
ADCMS4AA_000020040500
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Section 18 A/D Converter
ADTRG
AMR
ADSR
AN0
Internal data bus
Multiplexer
AN1
AN2
AVCC
+
Comparator
Control logic
-
AVCC
Reference
voltage
AVSS
ADRR
AVSS
[Legend]
AMR:
ADSR:
ADRR:
IRRAD:
A/D mode register
A/D start register
A/D result register
A/D conversion end interrupt request flag
Figure 18.1 Block Diagram of A/D Converter
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IRRAD
Section 18 A/D Converter
18.2
Input/Output Pins
Table 18.1 shows the input pins used by the A/D converter.
Table 18.1 Pin Configuration
Pin Name
Abbreviation
I/O
Function
Analog power supply pin
AVcc
Input
Power supply and reference voltage of
analog part
Analog ground pin
AVss
Input
Ground and reference voltage of analog
part
Analog input pin 0
Analog input pin 1
AN0
AN1
Input
Input
Analog input pins
Analog input pin 2
External trigger input pin
AN2
ADTRG
Input
Input
18.3
External trigger input that controls the
A/D conversion start.
Register Descriptions
The A/D converter has the following registers.
• A/D result register (ADRR)
• A/D mode register (AMR)
• A/D start register (ADSR)
18.3.1
A/D Result Register (ADRR)
ADRR is a 16-bit read-only register that stores the results of A/D conversion. The upper 10 bits of
the data are stored in ADRR. ADRR can be read by the CPU at any time, but the ADRR value
during A/D conversion is undefined. After A/D conversion is completed, the conversion result is
stored as 10-bit data, and this data is retained until the next conversion operation starts. The initial
value of ADRR is undefined.
Always read this register in word size.
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Section 18 A/D Converter
18.3.2
A/D Mode Register (AMR)
AMR sets the A/D conversion time, and selects the external trigger and analog input pins.
Bit
Bit Name
Initial
Value
R/W
7
CKS
0
R/W
Description
Clock Select
Selects the clock source for A/D conversion.
0: φ/4 (conversion time = 62 states (max.) (basic clock =
φ))
1: φ/2 (conversion time = 31 states (max.) (basic clock =
φ))
6
TRGE
0
R/W
External Trigger Select
Enables or disables the A/D conversion start by the
external trigger input.
0: Disables the A/D conversion start by the external
trigger input.
1: Starts A/D conversion at the rising or falling edge of
the ADTRG pin
The edge of the ADTRG pin is selected by the
ADTRGNEG bit in IEGR.
5

1

Reserved
4

1

These bits are always read as 1 and cannot be
modified.
3
CH3
0
R/W
Channel Select 3 to 0
2
CH2
0
R/W
Select the analog input channel.
1
CH1
0
R/W
00xx: No channel selected
0
CH0
0
R/W
0100: AN0
0101: AN1
0110: AN2
0111: Using prohibited
1xxx: Using prohibited
The channel selection should be made while the ADSF
bit is cleared to 0.
[Legend]
x: Don't care.
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Section 18 A/D Converter
18.3.3
A/D Start Register (ADSR)
ADSR starts and stops the A/D conversion.
Bit
Bit Name
Initial
Value
R/W
Description
7
ADSF
0
R/W
When this bit is set to 1, A/D conversion is started.
When conversion is completed, the converted data is
set in ADRR and at the same time this bit is cleared to
0. If this bit is written to 0, A/D conversion can be
forcibly terminated.
6 to 0

All 1

Reserved
These bits are always read as 1 and cannot be
modified.
18.4
Operation
The A/D converter operates by successive approximation with 10-bit resolution. When changing
the conversion time or analog input channel, in order to prevent incorrect operation, first clear the
bit ADSF to 0 in ADSR.
18.4.1
A/D Conversion
1.
A/D conversion is started from the selected channel when the ADSF bit in ADSR is set to 1,
according to software.
2.
When A/D conversion is completed, the result is transferred to the A/D result register.
3.
On completion of conversion, the IRRAD flag in IRR2 is set to 1. If the IENAD bit in IENR2
is set to 1 at this time, an A/D conversion end interrupt request is generated.
4.
The ADSF bit remains set to 1 during A/D conversion. When A/D conversion ends, the
ADSF bit is automatically cleared to 0 and the A/D converter enters the wait state.
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Section 18 A/D Converter
18.4.2
External Trigger Input Timing
The A/D converter can also start A/D conversion by input of an external trigger signal. External
trigger input is enabled at the ADTRG pin when the ADTSTCHG bit in PMRB is set to 1* and
TRGE bit in AMR is set to 1. Then when the input signal edge designated in the ADTRGNEG bit
in IEGR is detected at the ADTRG pin, the ADSF bit in ADSR will be set to 1, starting A/D
conversion.
Figure 18.2 shows the timing.
Note: * The ADTRG input pin is shared with the TEST pin. Therefore when the pin is used as
the ADTRG pin, reset should be cleared while the 0-fixed or 1-fixed signal is input to
the TEST pin. Then the ADTSTCHG bit should be set to 1 after the TEST signal is
fixed.
φ
ADTRG
(when
ADTRGNEG = 0)
ADSF
A/D conversion
Figure 18.2 External Trigger Input Timing
18.4.3
Operating States of A/D Converter
Table 18.2 shows the operating states of the A/D converter.
Table 18.2 Operating States of A/D Converter
Operating
Mode
Reset
Active
Sleep
Watch
Subactive
Subsleep
Standby
Module
Standby
AMR
Reset
Functions
Functions
Retained
Retained
Retained
Retained
Retained
ADSR
Reset
Functions
Functions
Retained
Retained
Retained
Retained
Retained
ADRR
Retained*
Functions
Functions
Retained
Retained
Retained
Retained
Retained
Note:
*
Undefined at a power-on reset.
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Section 18 A/D Converter
18.5
Example of Use
An example of how the A/D converter can be used is given below, using channel 1 (pin AN1) as
the analog input channel. Figure 18.3 shows the operation timing.
1.
Bits CH3 to CH0 in the A/D mode register (AMR) are set to 0101, making pin AN1 the
analog input channel. A/D interrupts are enabled by setting bit IENAD to 1, and A/D
conversion is started by setting bit ADSF to 1.
2.
When A/D conversion is completed, bit IRRAD is set to 1, and the A/D conversion result is
stored in ADRR. At the same time bit ADSF is cleared to 0, and the A/D converter goes to the
idle state.
3.
Bit IENAD = 1, so an A/D conversion end interrupt is requested.
4.
The A/D interrupt handling routine starts.
5.
The A/D conversion result is read and processed.
6.
The A/D interrupt handling routine ends.
If bit ADSF is set to 1 again afterward, A/D conversion starts and steps 2 through 6 take place.
Figures 18.4 and 18.5 show flowcharts of procedures for using the A/D converter.
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Idle
A/D conversion starts
A/D conversion (1)
Set*
Set*
Note: * ↓ indicates instruction execution by software.
ADRR
Channel 1
(AN1)
operating
state
ADSF
IENAD
Interrupt
(IRRAD)
A/D conversion result (1)
↓ Read conversion result
Idle
A/D conversion (2)
Set*
↓ Read conversion result
A/D conversion result (2)
Idle
Section 18 A/D Converter
Figure 18.3 Example of A/D Conversion Operation
Section 18 A/D Converter
Start
Set A/D conversion speed and input channel
Disable A/D conversion end interrupt
Start A/D conversion
Read ADSR
No
ADSF = 0?
Yes
Read ADRR data
Yes
Perform A/D conversion?
No
End
Figure 18.4 Flowchart of Procedure for Using A/D Converter (Polling by Software)
Start
Set A/D conversion speed and input channel
Enable A/D conversion end interrupt
Start A/D conversion
A/D conversion end
interrupt generated?
Yes
No
Clear IRRAD bit in IRR2 to 0
Read ADRR data
Yes
Perform A/D conversion?
No
End
Figure 18.5 Flowchart of Procedure for Using A/D Converter (Interrupts Used)
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Section 18 A/D Converter
18.6
A/D Conversion Accuracy Definitions
This LSI's A/D conversion accuracy definitions are given below.
• Resolution
The number of A/D converter digital output codes
• Quantization error
The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 18.6).
• Offset error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from the minimum voltage value 0000000000 to 0000000001
(see figure 18.7).
• Full-scale error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from 1111111110 to 1111111111 (see figure 18.7).
• Nonlinearity error
The error with respect to the ideal A/D conversion characteristics between zero voltage and
full-scale voltage. Does not include offset error, full-scale error, or quantization error.
• Absolute accuracy
The deviation between the digital value and the analog input value. Includes offset error, fullscale error, quantization error, and nonlinearity error.
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Section 18 A/D Converter
Digital output
Ideal A/D conversion
characteristic
111
110
101
100
011
010
Quantization error
001
000
1
8
2
8
3
8
4
8
5
8
6
8
7 FS
8
Analog
input voltage
Figure 18.6 A/D Conversion Accuracy Definitions (1)
Digital output
Full-scale error
Ideal A/D conversion
characterist
Nonlinearity
error
Actual A/D conversion
characteristic
Offset error
FS
Analog
input voltage
Figure 18.7 A/D Conversion Accuracy Definitions (2)
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Section 18 A/D Converter
18.7
18.7.1
Usage Notes
Permissible Signal Source Impedance
This LSI's analog input is designed such that conversion accuracy is guaranteed for an input signal
for which the signal source impedance is 10 kΩ or less. This specification is provided to enable
the A/D converter's sample-and-hold circuit input capacitance to be charged within the sampling
time; if the sensor output impedance exceeds 10 kΩ, charging may be insufficient and it may not
be possible to guarantee A/D conversion accuracy. If a large capacitance is provided externally as
a countermeasure, the input load essentially comprises only the internal input resistance of 10 kΩ,
and the signal source impedance can be ignored. However, as a low-pass filter effect is obtained in
this case, it may not be possible to follow an analog signal with a large differential coefficient
(e.g., 5 mV/µs or greater) (see figure 18.8). When converting a high-speed analog signal, a lowimpedance buffer should be inserted.
18.7.2
Influences on Absolute Accuracy
Adding capacitance results in coupling with GND, and therefore noise in GND may adversely
affect absolute accuracy. Be sure to make the connection to an electrically stable GND.
Care is also required to ensure that filter circuits do not interfere with digital signals or act as
antennas on the mounting board.
This LSI
Sensor output
impedance
up to 10 kΩ
A/D converter
equivalent circuit
10 kΩ
Sensor input
Low-pass
filter C
up to 0.1 µF
Cin =
15 pF
Figure 18.8 Example of Analog Input Circuit
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48 pF
Section 18 A/D Converter
18.7.3
Usage Notes
1.
ADRR should be read only when the ADSF bit in ADSR is cleared to 0.
2.
Changing the digital input signal at an adjacent pin during A/D conversion may adversely
affect conversion accuracy.
3.
When A/D conversion is started after clearing module standby mode, wait for 10φ clock
cycles before starting A/D conversion.
4.
In active mode and sleep mode, the analog power supply current flows in the ladder resistance
even when the A/D converter is on standby. Therefore, if the A/D converter is not used, it is
recommended that AVcc be connected to the system power supply and the ADCKSTP bit be
cleared to 0 in CKSTPR1.
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Section 18 A/D Converter
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Section 19 ∆Σ A/D Converter
Section 19 ∆Σ A/D Converter
This LSI includes a ∆Σ modulation (Σ∆ modulation or SDM) type 14-bit ∆Σ A/D converter that
allows up to two analog input channels to be selected. Note that the ∆Σ A/D converter is not
available for the audio equipment. The block diagram of the ∆Σ A/D converter is shown in figure
19.1.
19.1
Features
• 14-bit resolution
• Two input channels
• Conversion method: Secondary ∆Σ and 320-times oversampling type
• Conversion time: 200 µs per channel (at 1.6 MHz operation)
• Interrupt source
An A/D conversion end interrupt request can be generated.
• Use of module standby mode enables this module to be placed in standby mode independently
when not used. (For details, refer to section 6.4, Module Standby Function.)
ADCMS3AA_000020040600
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Section 19 ∆Σ A/D Converter
System clock (φ)
PSS
fovs = φ/2, φ/4, φ/8, φ/16, φ/32
fovs = φ
IRRSDADCN
Programmable gain amplifier
Ain1
Multiplexer
Vref/REF
Clock interrupt
control circuit
PGA
Reference voltage
generator
Dout (16 bits;
14 bits are valid)
Secondary ∆Σ
A/D converter
ADCR
ACOM
ADSSR
ADDR (16 bits)
LCD drive power supply circuit
Buffer
Band-gap
reference circuit
LCD
BGRMR
[Legend]
ADCR:
ADSSR:
IRRSDADCN:
ADDR:
BGRMR:
A/D control register
A/D start/status register
A/D conversion end interrupt request flag
A/D data register
BGA control register
Figure 19.1 Block Diagram of ∆Σ A/D Converter
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Internal data bus
Ain2
Section 19 ∆Σ A/D Converter
19.2
Input/Output Pins
Table 19.1 shows the pins used by the ∆Σ A/D converter.
Table 19.1 Pin Configuration
Pin Name
Abbreviation
I/O
Function
Reference voltage pin
Vref
Input
External reference voltage input
Internal reference
voltage output pin
REF
Output
Internal reference voltage output
Analog voltage
stabilization pin
Analog input pin 1
ACOM
Output
Ain1
Input
Stabilization capacitance connection
(for 0.1µF capacitor connection)
Analog input pins
Analog input pin 2
Ain2
DVcc
Input
Input
Power supply pin
Analog power supply
pin for the ∆Σ A/D
converter
19.3
Register Descriptions
The ∆Σ A/D converter has the following registers.
• A/D data register (ADDR)
• BGR control register (BGRMR)
• A/D control register (ADCR)
• A/D start/status register (ADSSR)
19.3.1
A/D Data Register (ADDR)
ADDR is a 16-bit read-only register that stores the results of A/D conversion. ADDR can be read
by the CPU at any time, but the ADDR value during A/D conversion is undefined. After A/D
conversion is completed, 14-bit data of the conversion result is stored in upper 14 bits in ADDR,
and this data is retained until the next conversion operation starts. The initial value of ADDR is
undefined.
Always read this register in word size.
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Section 19 ∆Σ A/D Converter
19.3.2
BGR Control Register (BGRMR)
BGRMR controls operation of the band-gap reference circuit (BGR) and adjusts the internal
reference voltage output from the REF pin (BGR output voltage).
Bit
Bit Name
Initial
Value
R/W
7
BGRSTPN*
0
R/W
Description
Band-Gap Reference Circuit Control
Sets operation or stop of the band-gap reference circuit.
0: Band-gap reference circuit stops
1: Band-gap reference circuit operates
6 to
3

2
BTRM2
0
R/W
BGR Output Voltage Trimming
1
BTRM1
0
R/W
Adjust approximately 1.2-V BGR output voltage.
0
BTRM0
0
R/W
000: ±0 V
All 1

Reserved
These bits are always read as 1 and cannot be modified.
001: +0.14 V
010: +0.09 V
011: +0.04 V
100: −0.04 V
101: −0.09 V
110: −0.14 V
111: −0.18 V
Note:
*
When the BGRSTPN bit is 0 (when the band-gap reference circuit is halted), the 3-V
constant-voltage power supply circuit of the LCD is halted.
The time from the point at which the BGRSTPN bit is set to 1 until the BGR output
voltage is stabilized to approximately 1.2 V is approximately 100 µs.
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Section 19 ∆Σ A/D Converter
19.3.3
A/D Control Register (ADCR)
ADCR sets the conversion mode, PGA multiplication ratio, and reference voltage, and selects the
analog input channel and oversampling frequency.
Bit
Bit Name
Initial Value R/W
Description
7
MOD
0
Conversion Mode Select
R/W
Sets the conversion mode. When the MOD bit is set to 1,
A/D conversion is executed regardless of the ADS bit in
ADSSR.
0: Wait mode
1: Continuous mode
6
OVS2
0
R/W
Oversampling Frequency Select
5
OVS1
0
R/W
Select the oversampling frequency.
4
OVS0
0
R/W
000: φ
001: φ/2
010: φ/4
011: φ/8
100: φ/16
101: φ/32
11x: Setting prohibited
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Section 19 ∆Σ A/D Converter
Bit
Bit Name
Initial
Value
R/W
Description
3
VREF1
0
R/W
2
VREF0
0
R/W
PB5/Vref/REF Pin Function Switch and Reference
Voltage Select
These bits specify whether the PB5/Vref/REF pin
functions as a PB5 pin, Vref pin, or REF pin. In addition,
these bits select the external reference voltage (Vref) or
internal reference voltage (REF) as the reference voltage
of the ∆Σ A/D converter. When the REF is to be selected,
set these bits after the BGRSTPN bit in BGRMR has been
set to 1 to operate the BGR.
00: Functions as a PB5 input pin
01: Functions as a Vref input pin, and the external
reference voltage (Vref) is input to the reference
generator
10: Functions as a REF output pin
11: Functions as a REF output pin, and the internal
reference voltage (REF) is input to the reference
generator
When these bits are set to B'11, the REF voltage is input
to the reference voltage generator in the ∆Σ A/D converter
at the same timing as the internal reference voltage (REF)
is output from the REF pin. To operate the ∆Σ A/D
converter with the internal reference voltage (REF), set
these bits to B'11.
1
PGA1
0
R/W
PGA Gain Select
0
PGA0
0
R/W
Set the analog input voltage multiplication ratio ranging
from 1/3 times to 4 times.
00: 1 time
01: 2 times
10: 4 times
11: 1/3 times
[Legend]
x: Don’t care.
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Section 19 ∆Σ A/D Converter
19.3.4
A/D Start/Status Register (ADSSR)
ADSSR consists of the A/D conversion status flag, analog input channel select bit, and bypass
select bit.
Bit
Bit Name
Initial
Value
R/W
Description
7
ADS
0
R/W
A/D Start
When this bit is set to 1 in wait mode (the MOD bit in
ADCR is cleared to 0), A/D conversion is started.
6
ADST
0
R
A/D Status Flag
When this bit is read in wait mode (the MOD bit in ADCR
is cleared to 0), A/D conversion status can be identified.
0: In the idle state
1: During A/D conversion
5
AIN1
0
R/W
Analog Input Channel Select
4
AIN0
0
R/W
Select the analog input channel.
00: Not selected
01: Ain1
10: Ain2
11: Not selected
3
BYPGA
0
R/W
PGA Bypass Select
Selects whether the analog input is to the PGA or
secondary ∆Σ A/D converter.
0: To the PGA
1: To the secondary ∆Σ A/D converter
2 to
0



Reserved
These bits cannot be modified.
Note: When the BYPGA bit is set to 1 and the PGA factor is 1, the factor of analog input voltage is
also 1. However, analog input voltage is limited to range from 0 to Vref [V] when the
BYPGA bit is set to 1 and from 0.2 to 0.9 Vref [V] when the PGA factor is 1. Therefore when
the factor of analog input voltage is 1, the setting when the BYPGA bit is set to 1 should be
used.
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Section 19 ∆Σ A/D Converter
19.4
Operation
The ∆Σ A/D converter uses the ∆Σ modulator and converts the analog input voltage range
specified by the Vref pin to digital data with 14-bit resolution. The ∆Σ A/D converter is
configured of two blocks: the analog block whose main part is a ∆Σ modulator and digital block
consisted of the digital filter control circuit.
In the analog block, voltage of the analog input pins (Vin1 and Vin2) is sampled by the frequency
320 times the conversion frequency (oversampling frequency) and then converted to the 1-bit
digital row with the secondary ∆Σ modulator. The conversion result is output as 14-bit data with
unsigned binary coded to ADDR via the decimation filter in the digital block. The ADD13 bit in
ADDR is MSB and the ADD0 bit is LSB.
19.4.1
Wait Mode
In wait mode, A/D conversion is executed once for the specified one analog input channel as
follows.
1. A/D conversion is started from the selected channel when the ADS bit in ADSSR is set to 1,
according to software.
2. When A/D conversion is completed, the result is transferred to the A/D data register.
3. On completion of conversion, the IRRSAD flag in IRR2 is set to 1. If the IENSAD bit in
IENR2 is set to 1 at this time, an A/D conversion end interrupt request is generated.
4. The ADST bit remains set to 1 during A/D conversion. When A/D conversion ends, the ADS
bit is automatically cleared to 0 and the ∆Σ A/D converter enters the wait state.
19.4.2
Continuous Mode
In continuous mode, A/D conversion is executed continuously for the specified single analog input
channel as follows.
1. A/D conversion is started from the selected channel when the MOD bit in ADCR is set to 1,
according to software.
2. When A/D conversion is completed, the result is transferred to the A/D data register.
3. On completion of conversion, the IRRSAD flag in IRR2 is set to 1. If the IENSAD bit in
IENR2 is set to 1 at this time, an A/D conversion end interrupt request is generated.
4. Then steps 2 and 3 are repeated. To stop continuous mode, a reset should be executed, a
transition should be made to watch, subactive, subsleep, or standby mode, or the MOD bit in
ADCR should be cleared to 0.
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Section 19 ∆Σ A/D Converter
Operating States of ∆Σ A/D Converter
19.4.3
Table 19.2 shows the operating states of the ∆Σ A/D converter.
Table 19.2 Operating States of ∆Σ A/D Converter
Operating
Mode
Reset
Active
Sleep
Watch
Sub-active Sub-sleep Standby
Module
Standby
ADCR
Reset
Functions
Retained
Retained
Retained
Retained
Retained
Retained
ADSSR
Reset
Functions
Functions
Retained
Retained
Retained
Retained
Retained
ADDR
Retained*
Functions
Functions
Retained
Retained
Retained
Retained
Retained
BGRMR
Reset
Functions
Retained
Retained
Functions
Retained
Retained
Retained
Note:
*
Undefined at a power-on reset.
19.5
Example of Use
19.5.1
Wait Mode
An example of how the ∆Σ A/D converter can be used is given below, using channel 1 (pin Ain1)
as the analog input channel. Figure 19.2 shows the operation timing.
1.
The AIN1 and AIN0 bits in ADSSR are set to B'01, making pin Ain1 the analog input
channel. A/D conversion is started (the ADS bit is set to 1) by setting the IENSAD bit to 1.
2.
When A/D conversion is completed, the IRRSAD bit is set to 1, and the A/D conversion
result is stored in ADDR. At the same time the ADST bit is cleared to 0, and the ∆Σ A/D
converter enters the idle state.
3.
The IENSAD bit is set to 1, so an A/D conversion end interrupt is requested.
4.
The A/D interrupt handling routine starts.
5.
The A/D conversion result is read and processed.
6.
The A/D interrupt handling routine ends.
If the ADS bit is cleared to 0 and then set to 1, A/D conversion starts and steps 2 to 6 take place.
Figures 19.3 and 19.4 show flowcharts of procedures for using the ∆Σ A/D converter.
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Section 19 ∆Σ A/D Converter
19.5.2
Continuous Mode
An example of how the ∆Σ A/D converter can be used is given below, using channel 1 (pin Ain1)
as the analog input channel. Figure 19.5 shows the operation timing.
1.
The AIN1 and AIN0 bits in ADSSR are set to B'01, making pin Ain1 the analog input
channel. The IENSAD bit is set to 1.
2.
A/D conversion is started (the MOD bit in ADCR is set to 1).
3.
When A/D conversion is completed, the IRRSAD bit is set to 1, and the A/D conversion
result is stored in ADDR.
4.
The IENSAD bit is set to 1, so an A/D conversion end interrupt is requested.
5.
The A/D interrupt handling routine starts.
6.
The A/D conversion result is read and processed.
7.
The A/D interrupt handling routine ends.
Then steps 3 to 7 are repeated. To stop continuous mode, a reset should be executed, a transition
should be made to watch, subactive, subsleep, or standby mode, or the MOD bit in ADCR should
be cleared to 0.
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Idle
A/D conversion starts
A/D conversion (1)
Set*
Set*
Note: * ↓indicates instruction execution by software.
ADDR
Channel 1
(Ain1)
operating
state
ADS
ADST
IENSAD
Interrupt
(IRRSDADCN)
↓ Read conversion result
A/D conversion result (1)
Idle
Clear*
A/D conversion (2)
Set*
↓ Read conversion result
A/D conversion result (2)
Idle
Section 19 ∆Σ A/D Converter
Figure 19.2 Example of ∆Σ A/D Conversion Operation (Wait Mode)
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Section 19 ∆Σ A/D Converter
Start
Set A/D conversion speed and input channel
Disable A/D conversion end interrupt
Start A/D conversion
Read ADSSR
No
ADDR = 0?
Yes
Read ADRR data
Yes
Perform A/D conversion?
No
End
Figure 19.3 Flowchart of Procedure for Using ∆Σ A/D Converter (Polling by Software)
Start
Set A/D conversion speed and input channel
Enable A/D conversion end interrupt
Start A/D conversion
Yes
A/D conversion end
interrupt generated?
No
Clear IRRSAD bit in IRR2 to 0
Read ADDR data
Yes
Perform A/D conversion?
No
End
Figure 19.4 Flowchart of Procedure for Using ∆Σ A/D Converter (Interrupts Used)
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Set*
Set*
A/D conversion (1)
Note: * ↓ indicates instruction execution by software.
ADDR
Idle
A/D
conversion
starts
Channel 1
(Ain1)
operating
state
MOD
IENSAD
Interrupt
(IRRSDADCN)
↓ Read conversion result
A/D conversion result (1)
A/D conversion (2)
Read conversion result
A/D conversion result (2)
A/D conversion (3)
Section 19 ∆Σ A/D Converter
Figure 19.5 Example of ∆Σ A/D Conversion Operation (Continuous Mode)
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Section 19 ∆Σ A/D Converter
19.6
19.6.1
Usage Notes
Reference Voltage
In normal operation, pulse current of several µA flows to the Vref pin which is the reference
power supply pin. Connect the reference voltage which can apply stable voltage to the Vref pin.
19.6.2
Analog Voltage Stabilization Pin (ACOM Pin)
The ACOM pin is used to connect a capacitor (0.1 µF) to GND because of the internal amplifier
phase compensation of the ∆Σ A/D Converter. Do not connect the ACOM pin to the devices other
than capacitors or circuits.
19.6.3
Module Standby Mode
When A/D conversion is started after clearing module standby mode, wait for 10φ clock cycles
before starting A/D conversion. When this module is in module standby mode, registers cannot be
written.
19.6.4
Influences on Accuracy
1.
Changing the digital input signal at an adjacent pin during A/D conversion may adversely
affect conversion accuracy.
2.
Noise in GND may adversely affect accuracy. Be sure to make the connection to an
electrically stable GND. Care is also required to ensure that filter circuits do not interfere with
digital signals or act as antennas on the mounting board.
19.6.5
PB5/Vref/REF Pin
If VREF1 and VREF0 in the ADCR register are set to b'01 or b'11 and the ∆∑ A/D converter is
not operating, switch the PB5/Vref/REF pin to PB5 input operation to prevent current from
flowing from the pin to GND.
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Section 20 LCD Controller/Driver
Section 20 LCD Controller/Driver
This LSI has an on-chip segment-type LCD control circuit, LCD driver, and power supply circuit,
enabling it to directly drive an LCD panel.
20.1
Features
• Display capacity
Duty Cycle
Internal Driver
Static
32 SEG
1/2
32 SEG
1/3
32 SEG
1/4
32 SEG
• LCD RAM capacity
8 bits × 16 bytes (128 bits)
• Word access to LCD RAM
• The segment output pins can be used as ports.
SEG32 to SEG1 pins can be used as ports in groups of four.
• Common output pins not used because of the duty cycle can be used for common doublebuffering (parallel connection).
With 1/2 duty, parallel connection of COM1 to COM2, and of COM3 to COM4, can be used
In static mode, parallel connection of COM1 to COM2, COM3, and COM4 can be used
• Choice of 11 frame frequencies
• A or B waveform selectable by software
• On-chip power supply split-resistor
• Display possible in operating modes other than standby mode
• On-chip 3-V constant-voltage power supply circuit
This power circuit can constantly supply 3 V to LCD drive power supply without using Vcc
voltage.
• Output of the 3-V constant-voltage power supply circuit adjustable
• Use of module standby mode enables this module to be placed in standby mode independently
when not used. (For details, refer to section 6.4, Module Standby Function.)
LCDSG02A_000120040500
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Section 20 LCD Controller/Driver
Figure 20.1 shows a block diagram of the LCD controller/driver.
Vcc
LCD drive
power supply
(On-chip 3-V
constant-voltage
power supply circuit)
C1
C2
V1
V2
V3
Vss
φ/2 to φ/256
Common
data latch
φw, φw/2, and φw/4
Common
driver
LTRMR
Internal data bus
LPCR
LCR
LCR2
Display timing generator
32-bit
shift
register
LCD RAM
16 bytes
LCD port control register
LCD control register
LCD control register 2
LCD trimming register
BGR control register
Figure 20.1 Block Diagram of LCD Controller/Driver
Rev. 3.00 Aug 23, 2006 Page 416 of 616
Segment
driver
SEG1
SEGn (n = 1 to 32)
REJ09B0182-0300
COM4
SEG32
SEG31
SEG30
SEG29
SEG28
BGRMR
[Legend]
LPCR:
LCR:
LCR2:
LTRMR:
BGRMR:
COM1
Section 20 LCD Controller/Driver
20.2
Input/Output Pins
Table 20.1 shows the LCD controller/driver pin configuration.
Table 20.1 Pin Configuration
Name
Symbol
Segment output
pins
SEG32 to SEG1 Output
Common output
pins
COM4 to COM1 Output
LCD power supply
pins
V1, V2, V3
—
Used when a bypass capacitor is connected
externally, and when an external power supply
circuit is used
LCD step-up
capacitance pins
C1, C2
—
Capacitance pins for stepping up the LCD drive
power supply
20.3
I/O
Function
LCD segment drive pins
All pins are multiplexed as port pins (setting
programmable)
LCD common drive pins
Pins can be used in parallel with static or
1/2 duty
Register Descriptions
The LCD controller/driver has the following registers.
• LCD port control register (LPCR)
• LCD control register (LCR)
• LCD control register 2 (LCR2)
• LCD trimming register (LTRMR)
• BGR control register (BGRMR)
• LCDRAM
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Section 20 LCD Controller/Driver
20.3.1
LCD Port Control Register (LPCR)
LPCR selects the duty cycle, LCD driver, and pin functions.
Bit
Bit Name
Initial
Value
R/W
Description
7
DTS1
0
R/W
Duty Cycle Select 1 and 0
6
DTS0
0
R/W
Common Function Select
5
CMX
0
R/W
The combination of DTS1 and DTS0 selects static,
1/2, 1/3, or 1/4 duty. CMX specifies whether or not
the same waveform is to be output from multiple pins
to increase the common drive power when not all
common pins are used because of the duty setting.
For details, see table 20.2.
4
—
—
W
Reserved
Only 0 can be written to this bit.
3
SGS3
0
R/W
Segment Driver Select 3 to 0
2
SGS2
0
R/W
Select the segment drivers to be used.
1
SGS1
0
R/W
For details, see table 20.3.
0
SGS0
0
R/W
Table 20.2 Duty Cycle and Common Function Selection
Bit 7:
DTS1
Bit 6:
DTS0
Bit 5:
CMX
Duty Cycle
Common Drivers
Notes*
0
0
0
Static
COM1
Leave COM4, COM3, and COM2 in open
drain state
COM4 to COM1
COM4, COM3, and COM2 output the same
waveform as COM1
COM2 to COM1
Leave COM4 and COM3 in open drain state
COM4 to COM1
COM4 outputs the same waveform as
COM3, and COM2 outputs the same
waveform as COM1
1
1
0
1/2 duty
1
1
0
0
1/3 duty
1
1
0
1/4 duty
COM3 to COM1
Leave COM4 in open drain state
COM4 to COM1
Leave COM4 in open drain state
COM4 to COM1
—
1
Note: * If SGS3 to SGS0 are set to B'0000, the power supply voltage level of PA0 to PA3 and COM1 to COM4
is Vcc. If the setting of SGS3 to SGS0 is other than B'0000, the power supply voltage level of PA0 to
PA3 and COM1 to COM4 is the LCD drive power supply voltage level.
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Section 20 LCD Controller/Driver
Table 20.3 Segment Driver Selection
Function of Pins SEG32 to SEG1
Bit 3: Bit 2: Bit 1: Bit 0:
SGS3 SGS2 SGS1 SGS0
0
0
0
1
1
0
1
1
0
0
1
1
0
1
20.3.2
SEG32 to SEG28 to SEG24 to SEG20 to SEG16 to SEG12 to SEG8 to
SEG21
SEG17
SEG13
SEG9
SEG5
SEG29
SEG25
SEG4 to
SEG1
0
Port
Port
Port
Port
Port
Port
Port
Port
1
Port
Port
Port
Port
Port
Port
Port
SEG
0
Port
Port
Port
Port
Port
Port
SEG
SEG
1
Port
Port
Port
Port
Port
SEG
SEG
SEG
0
Port
Port
Port
Port
SEG
SEG
SEG
SEG
1
Port
Port
Port
SEG
SEG
SEG
SEG
SEG
0
Port
Port
SEG
SEG
SEG
SEG
SEG
SEG
1
Port
SEG
SEG
SEG
SEG
SEG
SEG
SEG
0
SEG
SEG
SEG
SEG
SEG
SEG
SEG
SEG
1
SEG
SEG
SEG
SEG
SEG
SEG
SEG
Port
0
SEG
SEG
SEG
SEG
SEG
SEG
Port
Port
1
SEG
SEG
SEG
SEG
SEG
Port
Port
Port
0
SEG
SEG
SEG
SEG
Port
Port
Port
Port
1
SEG
SEG
SEG
Port
Port
Port
Port
Port
0
SEG
SEG
Port
Port
Port
Port
Port
Port
1
SEG
Port
Port
Port
Port
Port
Port
Port
LCD Control Register (LCR)
LCR controls LCD drive power supply and display data, and selects the frame frequency.
Bit
Bit Name
Initial
Value
R/W
Description
7
—
1
—
Reserved
This bit is always read as 1 and cannot be modified.
6
PSW
0
R/W
LCD Drive Power Supply Control
Can be used to turn off the LCD drive power supply
when LCD display is not required in power-down
mode, or when an external power supply is used.
When the ACT bit is cleared to 0 or in standby mode,
the LCD drive power supply is turned off regardless
of the setting of this bit.
0: LCD drive power supply is turned off
1: LCD drive power supply is turned on
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Section 20 LCD Controller/Driver
Bit
Bit Name
Initial
Value
R/W
Description
5
ACT
0
R/W
Display Function Activate
Specifies whether or not the LCD controller/driver is
used. Clearing this bit to 0 halts operation of the LCD
controller/driver. The LCD drive power supply is also
turned off, regardless of the setting of the PSW bit.
However, register contents are retained.
0: LCD controller/driver halts
1: LCD controller/driver operates
4
DISP
0
R/W
Display Data Control
Specifies whether the LCD RAM contents are
displayed or blank data is displayed regardless of the
LCD RAM contents.
0: Blank data is displayed
1: LCD RAM data is displayed
3
CKS3
0
R/W
Frame Frequency Select 3 to 0
2
CKS2
0
R/W
1
CKS1
0
R/W
0
CKS0
0
R/W
Select the operating clock and the frame frequency.
However, in subactive mode, watch mode, and
subsleep mode, the system clock (φ) is halted.
Therefore display operations are not performed if one
of the clocks from φ/2 to φ/256 is selected. If LCD
display is required in these modes, φW, φW/2, or φW/4
must be selected as the operating clock.
For details, see table 20.4.
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Section 20 LCD Controller/Driver
Table 20.4 Frame Frequency Selection
Frame Frequency*
Bit 3:
CKS3
Bit 2:
CKS2
Bit 1:
CKS1
Bit 0:
CKS0
Operating Clock
φ = 2 MHz
0
X
0
0
φW
128 Hz*
1
φW/2
64 Hz*
2
64 Hz*
2
1
X
φW/4
32 Hz*
2
32 Hz*
2
0
0
φ/2
—
244 Hz
1
φ/4
977 Hz
122 Hz
0
φ/8
488 Hz
61 Hz
1
φ/16
244 Hz
30.5 Hz
0
0
φ/32
122 Hz
—
1
φ/64
61 Hz
—
1
0
φ/128
30.5 Hz
—
1
φ/256
—
—
1
0
1
1
2
1
φ = 250 kHz*
128 Hz*
3
2
[Legend]
X:
Don't care
Notes: 1. When 1/3 duty is selected, the frame frequency is 4/3 times the value shown.
2. This is the frame frequency when φW = 32.768 kHz.
3. This is the frame frequency in active (medium-speed, φOSC/8) mode when φOSC = 2 MHz.
20.3.3
LCD Control Register 2 (LCR2)
LCR2 controls switching between the A waveform and B waveform, selection of the step-up clock
for the 3-V constant-voltage circuit, connection with the LCD power-supply split resistor, and
turning on or off 3-V constant-voltage power supply.
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Section 20 LCD Controller/Driver
Bit
Bit Name
Initial
Value
R/W
Description
7
LCDAB
0
R/W
A Waveform/B Waveform Switching Control
Specifies whether the A waveform or B waveform is
used as the LCD drive waveform.
0: Drive using A waveform
1: Drive using B waveform
6
HCKS
0
R/W
Step-Up Clock Selection for 3-V Constant-Voltage
Power Supply Circuit
Selects a step-up clock for use in the 3-V constantvoltage power supply circuit. The step-up clock is
obtained by dividing the clock selected by the CKS3 to
CKS0 bits in LCR into 4 or 8.
0: Divided into 4
1: Divided into 8
5
CHG
0
R/W
Connection Control of LCD Power-Supply Split
Resistor
Selects whether an LCD power-supply split resistor is
disconnected or connected from or to LCD drive power
supply.
0: Disconnected
1: Connected
4
SUPS
0
R/W
3-V Constant-Voltage Power Supply Control
Can be used to turn off the 3-V constant-voltage power
supply when LCD display is not required in powerdown mode, or when an external power supply is used.
When the BGRSTPN bit in BGRMR is cleared to 0 or in
standby mode, the 3-V constant-voltage power supply
is turned off regardless of the setting of this bit.
0: 3-V constant-voltage power supply is turned off
1: 3-V constant-voltage power supply is turned on
3 to 0
—
—
W
Reserved
Only 0 can be written to these bits.
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Section 20 LCD Controller/Driver
20.3.4
LCD Trimming Register (LTRMR)
LTRMR adjusts 3-V constant-voltage used for LCD drive power supply and trims the output
voltage adjustment of 3-V constant-voltage power supply circuit.
Bit
Bit Name
Initial
Value
R/W
Description
7
TRM3
0
R/W
6
TRM2
0
R/W
Output Voltage Adjustment of 3-V Constant-Voltage
Power Supply Circuit*
5
TRM1
0
R/W
4
TRM0
0
R/W
By adjusting reference voltage that generates 3-V
constant voltage, LCD drive power supply can be set to
3 V. Following values indicate the voltage of the V1 pin.
Set this register so that the voltage on the V1 pin
should be 3 V.
0000: 3.00 V 1000: 3.48 V
0001: 2.94 V 1001: 3.42 V
0010: 2.88 V 1010: 3.36 V
0011: 2.85 V 1011: 3.30 V
0100: 2.79 V 1100: 3.24 V
0101: 2.76 V 1101: 3.18 V
0110: 2.70 V 1110: 3.12 V
0111: 2.67 V 1111: 3.06 V
3
—
1
—
Reserved
This bit is always read as 1 and cannot be modified.
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Section 20 LCD Controller/Driver
Bit
Bit Name
Initial
Value
R/W
Description
2
CTRM2
0
R/W
1
CTRM1
0
R/W
Variable Voltage Adjustment of 3-V Constant-Voltage
Power Supply*
0
CTRM0
0
R/W
The LCD drive power supply adjusted by the TRM bits
can further be adjusted.
If an LCD panel does not function normally due to a
temperature in which LCD is used, set these bits to
adjust it.
000: 3.00 V
001: 3.09 V
010: 3.18 V
011: 3.27 V
100: 2.64 V
101: 2.73 V
110: 2.82 V
111: 2.91 V
Notes: Setting Method for LCD Trimming Register (LTRMR) and BRG Control Register (BGRMR)
Assuming the following definitions,
V1 initial state voltage: A
LTRMR register
TRM3 to TRM0: B
CTRM2 to CTRM0: C
BGRMR register
BTRM2 to BTRM0: D
rough guidelines for the voltages after trimming are as follows:
V1 voltage = A + B + C + 3 × D/1.2
V2 voltage = (A + B + C + 3 × D/1.2) × 2/3
V3 voltage = (A + B + C + 3 × D/1.2) / 3
After monitoring voltage A, set B, C, and D so the V1 voltage is 3 V.
The BRG control register is used both for ∆∑ A/D converter REF output adjustment and 3 V
constant-voltage power supply circuit adjustment. Therefore, make sure to choose settings
that satisfy the specifications for both functions.
*
These are approximate values and are not guaranteed. Therefore these values should
be used as reference values.
Rev. 3.00 Aug 23, 2006 Page 424 of 616
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Section 20 LCD Controller/Driver
20.3.5
BGR Control Register (BGRMR)
BGRMR controls whether the band-gap reference circuit (BGR) which generates the reference
voltage of the 3-V constant-voltage power supply and ∆Σ A/D converter operates or halts, and
adjusts the reference voltage.
Bit
Bit Name
Initial
Value
R/W
Description
7
BGRSTPN
0
R/W
Band-Gap Reference Circuit Control
Controls whether the band-gap reference circuit
operates or halts.
0: Band-gap reference circuit halts
1: Band-gap reference circuit operates
6 to 3

All 1

Reserved
These bits are always read as 1 and cannot be
modified.
2
BTRM2
0
R/W
BGR Output Voltage Trimming
1
BTRM1
0
R/W
BGR Output Voltage Trimming
0
BTRM0
0
R/W
Adjust approximately 1.2-V BGR output voltage.
000: ±0 V
001: +0.14 V
010: +0.09 V
011: +0.04 V
100: −0.04 V
101: −0.09 V
110: −0.14 V
111: −0.18 V
Notes: Setting Method for LCD Trimming Register (LTRMR)
Assuming the following definitions,
V1 initial state voltage: A
LTRMR register
TRM3 to TRM0: B
CTRM2 to CTRM0: C
rough guidelines for the voltages after trimming are as follows:
V1 voltage = A + B + C
V2 voltage = (A + B + C) × 2/3
V3 voltage = (A + B + C) / 3
After monitoring voltage A, set B and C so the V1 voltage is 3 V.
Rev. 3.00 Aug 23, 2006 Page 425 of 616
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Section 20 LCD Controller/Driver
*
These are approximate values and are not guaranteed. Therefore these values should
be used as reference values.
20.4
Operation
20.4.1
Settings up to LCD Display
To perform LCD display, the hardware and software related items described below must first be
determined.
(1)
Hardware Settings
(a)
Using 1/2 duty
When 1/2 duty is used, interconnect pins V2 and V3 as shown in figure 20.2.
VCC
V1
V2
V3
VSS
Figure 20.2 Handling of LCD Drive Power Supply when Using 1/2 Duty
(b) Large-Panel Display
As the impedance of the on-chip power supply split-resistor is large, it may not be suitable for
driving a panel which requires a current more than the current value calculated by the on-chip
power supply split-resistor and voltage of the LCD power supply. If the display lacks sharpness
when using a large panel, refer to section 20.4.5, Boosting LCD Drive Power Supply and Fine
Adjustment. When static or 1/2 duty is selected, the common output drive capability can be
increased. Set CMX to 1 when selecting the duty cycle. In this mode, with a static duty cycle pins
COM4 to COM1 output the same waveform, and with 1/2 duty the COM1 waveform is output
from pins COM2 and COM1, and the COM2 waveform is output from pins COM4 and COM3.
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Section 20 LCD Controller/Driver
(c)
LCD Drive Power Supply Setting
With this LSI, there are two ways of providing LCD power: by using the on-chip power supply
circuit, or by using an external power supply circuit.
When an external power supply circuit is used for the LCD drive power supply, connect the
external power supply to the V1 pin.
(2)
Software Settings
(a)
Duty Selection
Any of four duty cycles—static, 1/2 duty, 1/3 duty, or 1/4 duty—can be selected with bits DTS1
and DTS0.
(b) Segment Driver Selection
The segment drivers to be used can be selected with bits SGS3 to SGS0.
(c)
Frame Frequency Selection
The frame frequency can be selected by setting bits CKS3 to CKS0. The frame frequency should
be selected in accordance with the LCD panel specification. For the clock selection method in
watch mode, subactive mode, and subsleep mode, see section 20.4.4, Operation in Power-Down
Modes.
(d) A or B Waveform Selection
Either the A or B waveform can be selected as the LCD waveform to be used by means of
LCDAB.
(e)
LCD Drive Power Supply Selection
When an external power supply circuit is used, turn the LCD drive power supply off with the PSW
bit.
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Section 20 LCD Controller/Driver
20.4.2
Relationship between LCD RAM and Display
The relationship between the LCD RAM and the display segments differs according to the duty
cycle. LCD RAM maps for the different duty cycles are shown in figures 20.3 to 20.6.
After setting the registers required for display, data is written to the part corresponding to the duty
using the same kind of instruction as for ordinary RAM, and display is started automatically when
turned on. Word- or byte-access instructions can be used for RAM setting.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'F370
SEG2
SEG2
SEG2
SEG2
SEG1
SEG1
SEG1
SEG1
H'F37F
SEG32
SEG32
SEG32
SEG32
SEG31
SEG31
SEG31
SEG31
COM4
COM3
COM2
COM1
COM4
COM3
COM2
COM1
Figure 20.3 LCD RAM Map (1/4 Duty)
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Section 20 LCD Controller/Driver
Bit 7
Bit 6
Bit 5
Bit 4
H'F370
SEG2
SEG2
H'F37F
SEG32
COM3
Bit 3
Bit 2
Bit 1
Bit 0
SEG2
SEG1
SEG1
SEG1
SEG32
SEG32
SEG31
SEG31
SEG31
COM2
COM1
COM3
COM2
COM1
Space not used for display
Figure 20.4 LCD RAM Map (1/3 Duty)
H'F370
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SEG4
SEG4
SEG3
SEG3
SEG2
SEG2
SEG1
SEG1
Display space
H'F377
SEG32
SEG32 SEG31
SEG31
SEG30
SEG30
SEG29
SEG29
Space not used
for display
H'F37F
COM2
COM1
COM2
COM1
COM2
COM1
COM2
COM1
Figure 20.5 LCD RAM Map (1/2 Duty)
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Section 20 LCD Controller/Driver
H'F370
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
Display space
H'F373
SEG32
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
Space not used
for display
H'F37F
COM1
COM1
COM1
COM1
COM1
COM1
COM1
COM1
Figure 20.6 LCD RAM Map (Static Mode)
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Section 20 LCD Controller/Driver
Figure 20.7 shows a output waveforms for each duty cycle (A waveform).
1 frame
1 frame
M
M
Data
Data
COM1
V1
V2
V3
VSS
COM1
V1
V2
V3
VSS
COM2
V1
V2
V3
VSS
COM2
V1
V2
V3
VSS
COM3
V1
V2
V3
VSS
COM3
V1
V2
V3
VSS
COM4
V1
V2
V3
VSS
SEGn
V1
V2
V3
VSS
SEGn
V1
V2
V3
VSS
(b) Waveform with 1/3 duty
(a) Waveform with 1/4 duty
1 frame
1 frame
M
M
Data
Data
COM1
V1
V2,V3
VSS
COM1
COM2
V1
V2,V3
VSS
SEGn
V1
V2,V3
VSS
SEGn
(c) Waveform with 1/2 duty
V1
VSS
V1
VSS
(d) Waveform with static output
M: LCD alternation signal
Figure 20.7 Output Waveforms for Each Duty Cycle (A Waveform)
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Section 20 LCD Controller/Driver
Figure 20.8 shows a output waveforms for each duty cycle (B waveform).
1 frame 1 frame 1 frame 1 frame
1 frame 1 frame 1 frame 1 frame
M
M
Data
Data
COM1
V1
V2
V3
VSS
COM1
V1
V2
V3
VSS
COM2
V1
V2
V3
VSS
COM2
V1
V2
V3
VSS
COM3
V1
V2
V3
VSS
COM3
V1
V2
V3
VSS
COM4
V1
V2
V3
VSS
SEGn
V1
V2
V3
VSS
SEGn
V1
V2
V3
VSS
(a) Waveform with 1/4 duty
(b) Waveform with 1/3 duty
1 frame 1 frame 1 frame 1 frame
1 frame 1 frame 1 frame 1 frame
M
M
Data
Data
COM1
COM2
V1
V2,V3
VSS
COM1
V1
V2,V3
VSS
SEGn
V1
V2,V3
VSS
SEGn
V1
VSS
V1
VSS
(d) Waveform with static output
M: LCD alternation signal
(c) Waveform with 1/2 duty
Figure 20.8 Output Waveforms for Each Duty Cycle (B Waveform)
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Section 20 LCD Controller/Driver
Table 20.5 shows a output levels.
Table 20.5 Output Levels
Static
1/2 duty
1/3 duty
1/4 duty
M:
20.4.3
Data
0
0
1
1
M
0
1
0
1
Common output
V1
VSS
V1
VSS
Segment output
V1
VSS
VSS
V1
Common output
V2, V3
V2, V3
V1
VSS
Segment output
V1
VSS
VSS
V1
Common output
V3
V2
V1
VSS
Segment output
V2
V3
VSS
V1
Common output
V3
V2
V1
VSS
Segment output
V2
V3
VSS
V1
LCD alternation signal
3-V Constant-Voltage Power Supply Circuit
This LSI incorporates a 3-V constant-voltage power supply circuit consisting of a band gap
reference circuit (BGR), a triple step-up circuit, etc. This allows the 3 V constant voltage to drive
LCD driver independently of Vcc.
Before activating a step-up circuit, LCD controller/driver operates and set the duty cycle, pin
function of the LCD driver or I/O, display data, frame frequencies, etc. Insert a capacitance of 0.1
µF between the C1 pin and C2 pin, and connect a capacitance of 0.1 µF to each of V1, V2, and V3
pins. (See figure 20.9.)
After this setting, setting the BGRSTPN bit in the BGR control register (BGRMR) to 1 activates
the band gap reference circuit, generating 1 V constant voltage (VLCD3) at the V3 pin. Furthermore,
selecting the step-up circuit clock of the LCD control register 2 (LCR2) and setting the SUPS bit
to 1 activates the triple step-up circuit, generating 2 V constant voltage, twice VLCD3, at the V2 pin,
and generating 3 V constant voltage, triple VLCD3, at the V1 pin.
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Section 20 LCD Controller/Driver
Notes: 1. Power supply might be insufficient when a large panel is driven. In this case, use Vcc
for power supply, or use an external power supply circuit.
2. Do not use a polarized capacitance such as an electrolytic capacitor for connection
between the C1 pin and C2 pin.
3. A 3-V constant-voltage power supply circuit is turned on by SUSP bit regardless of the
setting of the PSW bit.
4. Initially, the step-up circuit output voltage differs among individual devices due to
production variation. Therefore, make sure to adjust the settings of the LCD trimming
register (LTRMR) and BRG control register (BGRMR) individually for each device.
C1
C
C2
V1
V2
V3
C
C
C
C: 0.1 µF
Figure 20.9 Capacitance Connection when Using 3-V Constant-Voltage
Power Supply Circuit
20.4.4
Operation in Power-Down Modes
In this LSI, the LCD controller/driver can be operated even in the power-down modes. The
operating state of the LCD controller/driver in the power-down modes is summarized in table
20.6.
In subactive mode, watch mode, and subsleep mode, the system clock oscillator stops, and
therefore, unless φW, φW/2, or φW/4 has been selected by bits CKS3 to CKS0, the clock will not be
supplied and display will halt. The subclock can be turned on or off by setting the 32KSTOP bit in
the SUB32K control register (SUB32CR). When it is turned off, display will halt. Since there is a
possibility that a direct current will be applied to the LCD panel in this case, it is essential to
ensure that the subclock is turned on and φW, φW/2, or φW/4 is selected.
In active (medium-speed) mode, the system clock is switched, and therefore bits CKS3 to CKS0
must be modified to ensure that the frame frequency does not change.
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Section 20 LCD Controller/Driver
Table 20.6 Power-Down Modes and Display Operation
Module
Mode
Clock
Display
operation
Reset
Active
Sleep
Watch
Subactive
Subsleep
Standby
Standby
φ
Runs
Runs
Runs
Stops
Stops
Stops
Stops
Stops*
4
φw
Runs
Runs
Runs
Runs*
4
ACT = 0 Stops
Stops
Stops
Stops
ACT = 1 Stops
5
Runs*
5
Runs*
Stops
3 5
Functions Functions Functions* *
5
Stops
3 5
Functions* *
3 5
Functions* *
Stops*
1
Stops*
Stops*
2
Stops
Stops*
2
Stops
Notes: 1. The subclock oscillator does not stop, but clock supply is halted.
2. The LCD drive power supply is turned off regardless of the setting of the PSW bit.
3. Display operation is performed only if φW, φW/2, or φW/4 is selected as the operating
clock.
4. The clock supplied to the LCD stops.
5. When the 32KSTOP bit in SUB32CR is set to 1, the subclock φW halts and display
operation halts.
20.4.5
Boosting LCD Drive Power Supply and Fine Adjustment
When a large panel is driven, the on-chip power supply capacity may be insufficient. In this case,
the power supply impedance must be reduced. This can be done by connecting bypass capacitors
of around 0.1 to 0.3 µF to pins V1 to V3, as shown in figure 20.10, or by adding a split resistor
externally. The voltage on the V1 pin can further be adjusted by connecting a variable resistor
(VR) between the VCC and V1 pins.
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Section 20 LCD Controller/Driver
VCC
VR
V1
R
This LSI
R = several kΩ to
several MΩ
V2
R
C = 0.1 to 0.3 µF
V3
R
VSS
Figure 20.10 Connection of External Split Resistor
20.5
Usage Notes
20.5.1
Pin Processing when No LCD Controller/Driver Is Used
(1) V1, V2, V3
Connect to GND. In this case, CHG in LCR2 should not be changed from its initial value of 0
(LCD power-supply split resistor disconnected).
(2) C1, C2
Leave open.
20.5.2
Pin Processing when No 3 V Constant Voltage Circuit Is Used
Leave pins C1 and C2 open.
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Section 21 I2C Bus Interface 2 (IIC2)
2
Section 21 I C Bus Interface 2 (IIC2)
2
2
The I C bus interface 2 conforms to and provides a subset of the Philips I C bus (inter-IC bus)
2
interface functions. The register configuration that controls the I C bus differs partly from the
2
Philips configuration, however. Figure 21.1 shows a block diagram of the I C bus interface 2.
Figure 21.2 shows an example of I/O pin connections to external circuits.
21.1
Features
• Selection of I C format or clocked synchronous serial format
2
• Continuous transmission/reception
Since the shift register, transmit data register, and receive data register are independent from
each other, the continuous transmission/reception can be performed.
• Use of module standby mode enables this module to be placed in standby mode independently
when not used. (For details, refer to section 6.4, Module Standby Function.)
2
I C bus format
• Start and stop conditions generated automatically in master mode
• Selection of acknowledge output levels when receiving
• Automatic loading of acknowledge bit when transmitting
• Bit synchronization/wait function
In master mode, the state of SCL is monitored per bit, and the timing is synchronized
automatically.
If transmission/reception is not yet possible, set the SCL to low until preparations are
completed.
• Six interrupt sources
Transmit data empty (including slave-address match), transmit end, receive data full (including
slave-address match), arbitration lost, NACK detection, and stop condition detection
• Direct bus drive
Two pins, SCL and SDA pins, function as CMOS outputs in normal operation (when the
port/serial function is selected) and NMOS outputs when the bus drive function is selected.
Clocked synchronous format
• Four interrupt sources
Transmit-data-empty, transmit-end, receive-data-full, and overrun error
IFIIC10A_000020020200
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Section 21 I2C Bus Interface 2 (IIC2)
Transfer clock
generation
circuit
SCL
Transmission/
reception
control circuit
Output
control
ICCR1
ICCR2
ICMR
Internal data bus
Noise canceler
ICDRT
SDA
Output
control
SAR
ICDRS
Address
comparator
Noise canceler
ICDRR
Bus state
decision circuit
Arbitration
decision circuit
[Legend]
ICCR1:
ICCR2:
ICMR:
ICSR:
ICIER:
ICDRT:
ICDRR:
ICDRS:
SAR:
I2C bus control register 1
I2C bus control register 2
I2C bus mode register
I2C bus status register
I2C bus interrupt enable register
I2C bus transmit data register
I2C bus receive data register
I2C bus shift register
Slave address register
ICSR
ICIER
Interrupt
generator
2
Figure 21.1 Block Diagram of I C Bus Interface 2
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Interrupt request
Section 21 I2C Bus Interface 2 (IIC2)
Vcc
SCL in
Vcc
SCL
SCL
SDA
SDA
SDA in
(Master)
SCL
SDA
SDA out
SCL in
SCL out
SCL
SDA
SCL out
SCL in
SCL out
SDA in
SDA in
SDA out
SDA out
(Slave 1)
(Slave 2)
Figure 21.2 External Circuit Connections of I/O Pins
21.2
Input/Output Pins
2
Table 21.1 summarizes the input/output pins used by the I C bus interface 2.
Table 21.1 Pin Configuration
Name
Abbreviation
I/O
Function
Serial clock pin
SCL
I/O
IIC serial clock input/output
Serial data pin
SDA
I/O
IIC serial data input/output
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Section 21 I2C Bus Interface 2 (IIC2)
21.3
Register Descriptions
2
The I C bus interface 2 has the following registers.
• I C bus control register 1 (ICCR1)
2
• I C bus control register 2 (ICCR2)
2
• I C bus mode register (ICMR)
2
• I C bus interrupt enable register (ICIER)
2
• I C bus status register (ICSR)
2
• Slave address register (SAR)
• I C bus transmit data register (ICDRT)
2
• I C bus receive data register (ICDRR)
2
• I C bus shift register (ICDRS)
2
21.3.1
2
I C Bus Control Register 1 (ICCR1)
2
ICCR1 enables or disables the I C bus interface 2, controls transmission or reception, and selects
master or slave mode, transmission or reception, and transfer clock frequency in master mode.
Bit
Bit Name
Initial
Value
R/W
Description
7
ICE
0
R/W
I C Bus Interface 2 Enable
2
0: This module is halted. (SCL and SDA pins are set to
the port/serial function.)
1: This bit is enabled for transfer operations. (SCL and
SDA pins are bus drive state.)
6
RCVD
0
R/W
Reception Disable
This bit enables or disables the next operation when
TRS is 0 and ICDRR is read.
0: Enables next reception
1: Disables next reception
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Section 21 I2C Bus Interface 2 (IIC2)
Bit
Bit Name
Initial
Value
R/W
Description
5
MST
0
R/W
Master/Slave Select
4
TRS
0
R/W
Transmit/Receive Select
2
In master mode with the I C bus format, when
arbitration is lost, MST and TRS are both reset by
hardware, causing a transition to slave receive mode.
Modification of the TRS bit should be made between
transfer frames.
After data receive has been started in slave receive
mode, when the first seven bits of the receive data
agree with the slave address that is set to SAR and the
eighth bit is 1, TRS is automatically set to 1. If an
overrun error occurs in master mode with the clock
synchronous serial format, MST is cleared to 0 and
slave receive mode is entered.
Operating modes are described below according to
MST and TRS combination. When clocked
synchronous serial format is selected and MST is 1,
clock is output.
00: Slave receive mode
01: Slave transmit mode
10: Master receive mode
11: Master transmit mode
3
CKS3
0
R/W
Transfer Clock Select 3 to 0
2
CKS2
0
R/W
1
CKS1
0
R/W
0
CKS0
0
R/W
In master mode, set these bits according to the
necessary transfer rate (see table 21.2). In slave mode,
these bits are used to secure the data setup time in
transmission mode. When CKS3 = 0, the data setup
time is 10 tcyc and when CKS3 = 1, the data setup time
is 20 tcyc.
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Section 21 I2C Bus Interface 2 (IIC2)
Table 21.2 Transfer Rate
Bit 3
Bit 2
Bit 1
Bit 0
CKS3
CKS2
CKS1
CKS0
Clock
φ = 2 MHz
φ = 5 MHz
φ = 10 MHz
0
0
0
0
φ/28
71.4 kHz
179 kHz
357 kHz
1
φ/40
50.0 kHz
125 kHz
250 kHz
1
1
0
1
1
0
0
1
1
0
1
0
φ/48
41.7 kHz
104 kHz
208 kHz
1
φ/64
31.3 kHz
78.1 kHz
156 kHz
0
φ/80
25.0 kHz
62.5 kHz
125 kHz
1
φ/100
20.0 kHz
50.0 kHz
100 kHz
0
φ/112
17.9 kHz
44.6 kHz
89.3 kHz
1
φ/128
15.6 kHz
39.1 kHz
78.1 kHz
0
φ/56
35.7 kHz
89.3 kHz
179 kHz
1
φ/80
25.0 kHz
62.5 kHz
125 kHz
0
φ/96
20.8 kHz
52.1 kHz
104 kHz
1
φ/128
15.6 kHz
39.1 kHz
78.1 kHz
0
φ/160
12.5 kHz
31.3 kHz
62.5 kHz
1
φ/200
10.0 kHz
25.0 kHz
50.0 kHz
0
φ/224
8.9 kHz
22.3 kHz
44.6 kHz
1
φ/256
7.8 kHz
19.5 kHz
39.1 kHz
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Transfer Rate
Section 21 I2C Bus Interface 2 (IIC2)
21.3.2
2
I C Bus Control Register 2 (ICCR2)
ICCR1 issues start/stop conditions, manipulates the SDA pin, monitors the SCL pin, and controls
2
reset in the control part of the I C bus interface 2.
Bit
Bit Name
Initial
Value
R/W
Description
7
BBSY
0
R/W
Bus Busy
2
This bit enables to confirm whether the I C bus is
occupied or released and to issue start/stop conditions
in master mode. With the clocked synchronous serial
2
format, this bit has no meaning. With the I C bus format,
this bit is set to 1 when the SDA level changes from
high to low under the condition of SCL = high, assuming
that the start condition has been issued. This bit is
cleared to 0 when the SDA level changes from low to
high under the condition of SCL = high, assuming that
the stop condition has been issued. Write 1 to BBSY
and 0 to SCP to issue a start condition. Follow this
procedure when also re-transmitting a start condition.
Write 0 in BBSY and 0 in SCP to issue a stop condition.
To issue start/stop conditions, use the MOV instruction.
6
SCP
1
R/W
Start/Stop Issue Condition Disable
The SCP bit controls the issue of start/stop conditions in
master mode.
To issue a start condition, write 1 in BBSY and 0 in
SCP. A retransmit start condition is issued in the same
way. To issue a stop condition, write 0 in BBSY and 0 in
SCP. This bit is always read as 1. If 1 is written, the
data is not stored.
5
SDAO
1
R/W
SDA Output Value Control
This bit is used with SDAOP when modifying output
level of SDA. This bit should not be manipulated during
transfer.
0: When reading, SDA pin outputs low.
When writing, SDA pin is changed to output low.
1: When reading, SDA pin outputs high.
When writing, SDA pin is changed to output Hi-Z
(outputs high by external pull-up resistance).
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Section 21 I2C Bus Interface 2 (IIC2)
Bit
Bit Name
Initial
Value
R/W
4
SDAOP
1
R/W
Description
SDAO Write Protect
This bit controls change of output level of the SDA pin
by modifying the SDAO bit. To change the output level,
clear SDAO and SDAOP to 0 or set SDAO to 1 and
clear SDAOP to 0 by the MOV instruction. This bit is
always read as 1.
3
SCLO
1
R
This bit monitors SCL output level. When SCLO is 1,
SCL pin outputs high. When SCLO is 0, SCL pin
outputs low.
2

1

Reserved
This bit is always read as 1, and cannot be modified.
1
IICRST
0
R/W
IIC Control Part Reset
2
This bit resets the control part except for I C registers. If
this bit is set to 1 when hang-up occurs because of
2
2
communication failure during I C operation, I C control
part can be reset without setting ports and initializing
registers.
0

1

Reserved
This bit is always read as 1, and cannot be modified.
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Section 21 I2C Bus Interface 2 (IIC2)
21.3.3
2
I C Bus Mode Register (ICMR)
ICMR selects whether the MSB or LSB is transferred first, performs master mode wait control,
and selects the transfer bit count.
Bit
Bit Name
Initial
Value
R/W
Description
7
MLS
0
R/W
MSB-First/LSB-First Select
0: MSB-first
1: LSB-first
2
Set this bit to 0 when the I C bus format is used.
6
WAIT
0
R/W
Wait Insertion Bit
2
In master mode with the I C bus format, this bit selects
whether to insert a wait after data transfer except the
acknowledge bit. When WAIT is set to 1, after the fall of
the clock for the final data bit, low period is extended for
two transfer clocks. If WAIT is cleared to 0, data and
acknowledge bits are transferred consecutively with no
wait inserted.
The setting of this bit is invalid in slave mode with the
2
I C bus format or with the clocked synchronous serial
format.
5, 4

All 1

Reserved
These bits are always read as 1, and cannot be
modified.
3
BCWP
1
R/W
BC Write Protect
This bit controls the BC2 to BC0 modifications. When
modifying BC2 to BC0, this bit should be cleared to 0
and use the MOV instruction. In clock synchronous
serial mode, BC should not be modified.
0: When writing, values of BC2 to BC0 are set.
1: When reading, 1 is always read.
When writing, settings of BC2 to BC0 are invalid.
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Section 21 I2C Bus Interface 2 (IIC2)
Bit
Bit Name
Initial
Value
R/W
Description
2
BC2
0
R/W
Bit Counter 2 to 0
1
BC1
0
R/W
0
BC0
0
R/W
These bits specify the number of bits to be transferred
next. When read, the remaining number of transfer bits
2
is indicated. With the I C bus format, the data is
transferred with one addition acknowledge bit. Bit BC2
to BC0 settings should be made during an interval
between transfer frames. If bits BC2 to BC0 are set to a
value other than 000, the setting should be made while
the SCL pin is low. The value returns to 000 at the end
of a data transfer, including the acknowledge bit. With
the clock synchronous serial format, these bits should
not be modified.
2
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I C Bus Format
Clock Synchronous Serial Format
000: 9 bits
000: 8 bits
001: 2 bits
001: 1 bits
010: 3 bits
010: 2 bits
011: 4 bits
011: 3 bits
100: 5 bits
100: 4 bits
101: 6 bits
101: 5 bits
110: 7 bits
110: 6 bits
111: 8 bits
111: 7 bits
Section 21 I2C Bus Interface 2 (IIC2)
21.3.4
2
I C Bus Interrupt Enable Register (ICIER)
ICIER enables or disables interrupt sources and acknowledge bits, sets acknowledge bits to be
transferred, and confirms acknowledge bits to be received.
Bit
Bit Name
Initial
Value
R/W
Description
7
TIE
0
R/W
Transmit Interrupt Enable
When the TDRE bit in ICSR is set to 1, this bit enables
or disables the transmit data empty interrupt (TXI).
0: Transmit data empty interrupt request (TXI) is
disabled.
1: Transmit data empty interrupt request (TXI) is
enabled.
6
TEIE
0
R/W
Transmit End Interrupt Enable
This bit enables or disables the transmit end interrupt
(TEI) at the rising of the ninth clock while the TDRE bit
in ICSR is 1. TEI can be canceled by clearing the TEND
bit or the TEIE bit to 0.
0: Transmit end interrupt request (TEI) is disabled.
1: Transmit end interrupt request (TEI) is enabled.
5
RIE
0
R/W
Receive Interrupt Enable
This bit enables or disables the receive data full
interrupt request (RXI) and the overrun error interrupt
request (ERI) with the clocked synchronous format,
when a receive data is transferred from ICDRS to
ICDRR and the RDRF bit in ICSR is set to 1. RXI can
be canceled by clearing the RDRF or RIE bit to 0.
0: Receive data full interrupt request (RXI) and overrun
error interrupt request (ERI) with the clocked
synchronous format are disabled.
1: Receive data full interrupt request (RXI) and overrun
error interrupt request (ERI) with the clocked
synchronous format are enabled.
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Section 21 I2C Bus Interface 2 (IIC2)
Bit
Bit Name
Initial
Value
R/W
Description
4
NAKIE
0
R/W
NACK Receive Interrupt Enable
This bit enables or disables the NACK receive interrupt
request (NAKI) and the overrun error (setting of the
OVE bit in ICSR) interrupt request (ERI) with the
clocked synchronous format, when the NACKF and AL
bits in ICSR are set to 1. NAKI can be canceled by
clearing the NACKF, OVE, or NAKIE bit to 0.
0: NACK receive interrupt request (NAKI) is disabled.
1: NACK receive interrupt request (NAKI) is enabled.
3
STIE
0
R/W
Stop Condition Detection Interrupt Enable
0: Stop condition detection interrupt request (STPI) is
disabled.
1: Stop condition detection interrupt request (STPI) is
enabled.
2
ACKE
0
R/W
Acknowledge Bit Judgement Select
0: The value of the receive acknowledge bit is ignored,
and continuous transfer is performed.
1: If the receive acknowledge bit is 1, continuous
transfer is halted.
1
ACKBR
0
R
Receive Acknowledge
In transmit mode, this bit stores the acknowledge data
that are returned by the receive device. This bit cannot
be modified.
0: Receive acknowledge = 0
1: Receive acknowledge = 1
0
ACKBT
0
R/W
Transmit Acknowledge
In receive mode, this bit specifies the bit to be sent at
the acknowledge timing.
0: 0 is sent at the acknowledge timing.
1: 1 is sent at the acknowledge timing.
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Section 21 I2C Bus Interface 2 (IIC2)
21.3.5
2
I C Bus Status Register (ICSR)
ICSR performs confirmation of interrupt request flags and status.
Bit
Bit Name
Initial
Value
R/W
7
TDRE
0
R/W
Description
Transmit Data Register Empty
[Setting condition]
•
When data is transferred from ICDRT to ICDRS and
ICDRT becomes empty
•
When TRS is set
•
When a start condition (including re-transfer) has been
issued
•
When transmit mode is entered from receive mode in
slave mode
[Clearing conditions]
6
TEND
0
R/W
•
When 0 is written in TDRE after reading TDRE = 1
•
When data is written to ICDRT with an instruction
Transmit End
[Setting conditions]
•
When the ninth clock of SCL rises with the I C bus
format while the TDRE flag is 1
•
When the final bit of transmit frame is sent with the
clock synchronous serial format
2
[Clearing conditions]
5
RDRF
0
R/W
•
When 0 is written in TEND after reading TEND = 1
•
When data is written to ICDRT with an instruction
Receive Data Register Full
[Setting condition]
•
When a receive data is transferred from ICDRS to
ICDRR
[Clearing conditions]
•
When 0 is written in RDRF after reading RDRF = 1
•
When ICDRR is read with an instruction
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Section 21 I2C Bus Interface 2 (IIC2)
Bit
Bit Name
Initial
Value
R/W
Description
4
NACKF
0
R/W
No Acknowledge Detection Flag
[Setting condition]
•
When no acknowledge is detected from the receive
device in transmission while the ACKE bit in ICIER is 1
[Clearing condition]
•
3
STOP
0
R/W
When 0 is written in NACKF after reading NACKF = 1
Stop Condition Detection Flag
[Setting conditions]
•
When a stop condition is detected after completion of a
frame transfer in master mode
•
When a stop condition is detected after the first byte
slave address and SAR match following a general call
and detection of a start condition in slave mode
[Clearing condition]
•
2
AL/OVE
0
R/W
When 0 is written in STOP after reading STOP = 1
Arbitration Lost Flag/Overrun Error Flag
This flag indicates that arbitration was lost in master mode
2
with the I C bus format and that the final bit has been
received while RDRF = 1 with the clocked synchronous
format.
When two or more master devices attempt to seize the bus
2
at nearly the same time, if the I C bus interface detects
data differing from the data it sent, it sets AL to 1 to
indicate that the bus has been taken by another master.
[Setting conditions]
•
If the internal SDA and SDA pin disagree at the rise of
SCL in master transmit mode
•
When the SDA pin outputs high in master mode while a
start condition is detected
•
When the final bit is received with the clocked
synchronous format while RDRF = 1
[Clearing condition]
•
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When 0 is written in AL/OVE after reading AL/OVE=1
Section 21 I2C Bus Interface 2 (IIC2)
Bit
Bit Name
Initial
Value
R/W
Description
1
AAS
0
R/W
Slave Address Recognition Flag
In slave receive mode, this flag is set to 1 if the first frame
following a start condition matches bits SVA6 to SVA0 in
SAR.
[Setting conditions]
•
When the slave address is detected in slave receive
mode
•
When the general call address is detected in slave
receive mode.
[Clearing condition]
•
0
ADZ
0
R/W
When 0 is written in AAS after reading AAS=1
General Call Address Recognition Flag
2
This bit is valid in I C bus format slave receive mode.
[Setting condition]
•
When the general call address is detected in slave
receive mode
[Clearing conditions]
•
21.3.6
When 0 is written in ADZ after reading ADZ=1
Slave Address Register (SAR)
SAR selects the communication format and sets the slave address. When the chip is in slave mode
2
with the I C bus format, if the upper 7 bits of SAR match the upper 7 bits of the first frame
received after a start condition, the chip operates as the slave device.
Initial
Value
R/W
Description
SVA6 to
SVA0
All 0
R/W
Slave Address 6 to 0
FS
0
Bit
Bit Name
7 to 1
0
These bits set a unique address in bits SVA6 to SVA0,
differing form the addresses of other slave devices
2
connected to the I C bus.
R/W
Format Select
2
0: I C bus format is selected.
1: Clocked synchronous serial format is selected.
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Section 21 I2C Bus Interface 2 (IIC2)
21.3.7
2
I C Bus Transmit Data Register (ICDRT)
ICDRT is an 8-bit readable/writable register that stores the transmit data. When ICDRT detects the
space in the shift register (ICDRS), it transfers the transmit data which is written in ICDRT to
ICDRS and starts transferring data. If the next transfer data is written to ICDRT during
transferring data of ICDRS, continuous transfer is possible. If the MLS bit of ICMR is set to 1
and when the data is written to ICDRT, the MSB/LSB inverted data is read. The initial value of
ICDRT is H'FF. The initial value of ICDRT is H'FF.
21.3.8
2
I C Bus Receive Data Register (ICDRR)
ICDRR is an 8-bit register that stores the receive data. When data of one byte is received, ICDRR
transfers the receive data from ICDRS to ICDRR and the next data can be received. ICDRR is a
receive-only register, therefore the CPU cannot write to this register. The initial value of ICDRR
is H'FF.
21.3.9
2
I C Bus Shift Register (ICDRS)
ICDRS is a register that is used to transfer/receive data. In transmission, data is transferred from
ICDRT to ICDRS and the data is sent from the SDA pin. In reception, data is transferred from
ICDRS to ICDRR after data of one byte is received. This register cannot be read directly from the
CPU.
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Section 21 I2C Bus Interface 2 (IIC2)
21.4
Operation
2
2
The I C bus interface can communicate either in I C bus mode or clocked synchronous serial mode
by setting FS in SAR.
21.4.1
2
I C Bus Format
2
2
Figure 21.3 shows the I C bus formats. Figure 21.4 shows the I C bus timing. The first frame
following a start condition always consists of 8 bits.
(a) I2C bus format (FS = 0)
S
SLA
R/W
A
DATA
A
A/A
P
1
7
1
1
n
1
1
1
n: Transfer bit count
(n = 1 to 8)
m: Transfer frame count
(m ≥ 1)
m
1
(b) I2C bus format (Start condition retransmission, FS = 0)
S
SLA
R/W
A
DATA
A/A
S
SLA
R/W
A
DATA
A/A
P
1
7
1
1
n1
1
1
7
1
1
n2
1
1
1
m1
1
m2
n1 and n2: Transfer bit count (n1 and n2 = 1 to 8)
m1 and m2: Transfer frame count (m1 and m2 ≥ 1)
2
Figure 21.3 I C Bus Formats
SDA
SCL
S
1 to 7
8
9
SLA
R/W
A
1 to 7
8
DATA
9
1 to 7
A
DATA
8
9
A
P
2
Figure 21.4 I C Bus Timing
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Section 21 I2C Bus Interface 2 (IIC2)
[Legend]
S:
Start condition. The master device drives SDA from high to low while SCL is high.
SLA: Slave address
R/W: Indicates the direction of data transfer: from the slave device to the master device when
R/W is 1, or from the master device to the slave device when R/W is 0.
A:
Acknowledge. The receive device drives SDA to low.
DATA:Transfer data
P:
21.4.2
Stop condition. The master device drives SDA from low to high while SCL is high.
Master Transmit Operation
In master transmit mode, the master device outputs the transmit clock and transmit data, and the
slave device returns an acknowledge signal. For master transmit mode operation timing, refer to
figures 21.5 and 21.6. The transmission procedure and operations in master transmit mode are
described below.
1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCR1 to 1. (Initial setting)
2. Read the BBSY flag in ICCR2 to confirm that the bus is free. Set the MST and TRS bits in
ICCR1 to select master transmit mode. Then, write 1 to BBSY and 0 to SCP using MOV
instruction. (Start condition issued) This generates the start condition.
3. After confirming that TDRE in ICSR has been set, write the transmit data (the first byte data
show the slave address and R/W) to ICDRT. At this time, TDRE is automatically cleared to 0,
and data is transferred from ICDRT to ICDRS. TDRE is set again.
4. When transmission of one byte data is completed while TDRE is 1, TEND in ICSR is set to 1
at the rise of the 9th transmit clock pulse. Read the ACKBR bit in ICIER, and confirm that the
slave device has been selected. Then, write second byte data to ICDRT. When ACKBR is 1,
the slave device has not been acknowledged, so issue the stop condition. To issue the stop
condition, write 0 to BBSY and SCP using MOV instruction. SCL is fixed low until the
transmit data is prepared or the stop condition is issued.
5. The transmit data after the second byte is written to ICDRT every time TDRE is set.
6. Write the number of bytes to be transmitted to ICDRT. Wait until TEND is set (the end of last
byte data transmission) while TDRE is 1, or wait for NACK (NACKF in ICSR = 1) from the
receive device while ACKE in ICIER is 1. Then, issue the stop condition to clear TEND or
NACKF.
7. When the STOP bit in ICSR is set to 1, the operation returns to the slave receive mode.
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Section 21 I2C Bus Interface 2 (IIC2)
SCL
(Master output)
1
2
3
4
5
6
SDA
(Master output)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
7
8
Bit 1
Slave address
9
1
Bit 0
2
Bit 7
Bit 6
R/W
SDA
(Slave output)
A
TDRE
TEND
Address + R/W
ICDRT
ICDRS
Data 1
Address + R/W
User
processing
[2] Instruction of start
condition issuance
Data 2
Data 1
[4] Write data to ICDRT (second byte)
[5] Write data to ICDRT (third byte)
[3] Write data to ICDRT (first byte)
Figure 21.5 Master Transmit Mode Operation Timing (1)
SCL
(Master output)
9
SDA
(Master output)
SDA
(Slave output)
1
2
3
4
5
6
7
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
8
9
Bit 0
A/A
A
TDRE
TEND
Data n
ICDRT
ICDRS
Data n
User
[5] Write data to ICDRT
processing
[6] Issue stop condition. Clear TEND.
[7] Set slave receive mode
Figure 21.6 Master Transmit Mode Operation Timing (2)
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Section 21 I2C Bus Interface 2 (IIC2)
21.4.3
Master Receive Operation
In master receive mode, the master device outputs the receive clock, receives data from the slave
device, and returns an acknowledge signal. For master receive mode operation timing, refer to
figures 21.7 and 21.8. The reception procedure and operations in master receive mode are shown
below.
1. Clear the TEND bit in ICSR to 0, then clear the TRS bit in ICCR1 to 0 to switch from master
transmit mode to master receive mode. Then, clear the TDRE bit to 0 and set the ACKBT bit
in ICIER.
2. When ICDRR is read (dummy data read), reception is started, and the receive clock is output,
and data received, in synchronization with the internal clock. The master device outputs the
level specified by ACKBT in ICIER to SDA, at the 9th receive clock pulse.
3. After the reception of first frame data is completed, the RDRF bit in ICST is set to 1 at the rise
of 9th receive clock pulse. At this time, the receive data is read by reading ICDRR, and RDRF
is cleared to 0.
4. The continuous reception is performed by reading ICDRR every time RDRF is set. If 8th
receive clock pulse falls after reading ICDRR by the other processing while RDRF is 1, SCL is
fixed low until ICDRR is read.
5. If next frame is the last receive data, set the RCVD bit in ICCR1 and set the ACKBT bit in
ICIER. to 1 before reading ICDRR. This enables the issuance of the stop condition after the
next reception.
6. When the RDRF bit is set to 1 at rise of the 9th receive clock pulse, and clearing the STOP bit
in ICSR issue the stage condition.
7. When the STOP bit in ICSR is set to 1, read ICDRR. Then clear the RCVD bit to 0.
8. Clear the MST bit in ICCR1 and then, the operation returns to the slave receive mode.
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Section 21 I2C Bus Interface 2 (IIC2)
Master transmit mode
SCL
(Master output)
Master receive mode
9
1
2
3
4
5
6
7
8
SDA
(Master output)
SDA
(Slave output)
9
1
A
A
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
TDRE
TEND
TRS
RDRF
ICDRS
Data 1
ICDRR
User
processing
Data 1
[3] Read ICDRR
[1] Clear TDRE after clearing [2] Read ICDRR (dummy read)
TEND and TRS
Figure 21.7 Master Receive Mode Operation Timing (1)
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Section 21 I2C Bus Interface 2 (IIC2)
SCL
(Master output)
9
SDA
(Master output)
A
SDA
(Slave output)
1
2
3
4
5
6
7
8
9
A/A
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RDRF
RCVD
ICDRS
Data n
Data n-1
ICDRR
User
processing
Data n
Data n-1
[5] Read ICDRR after setting RCVD
[7] Read ICDRR,
and clear RCVD
[6] Issue stop
condition [8] Set slave
receive mode
Figure 21.8 Master Receive Mode Operation Timing (2)
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Section 21 I2C Bus Interface 2 (IIC2)
21.4.4
Slave Transmit Operation
In slave transmit mode, the slave device outputs the transmit data, while the master device outputs
the receive clock and returns an acknowledge signal. For slave transmit mode operation timing,
refer to figures 21.9 and 21.10.
The transmission procedure and operations in slave transmit mode are described below.
1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCR1 to 1. (Initial setting) Set the MST and TRS bits in ICCR1 to select slave receive
mode, and wait until the slave address matches.
2. When the slave address matches in the first frame following detection of the start condition,
the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th
clock pulse. At this time, if the 8th bit data (R/W) is 1, the TRS and ICSR bits in ICCR1 are
set to 1, and the mode changes to slave transmit mode automatically. The continuous
transmission is performed by writing transmit data to ICDRT every time TDRE is set.
3. If TDRE is set after writing last transmit data to ICDRT, wait until TEND in ICSR is set to 1,
with TDRE = 1. When TEND is set, clear TEND.
4. Clear TRS for the end processing, and read ICDRR (dummy read). SCL is free.
5. Clear TDRE.
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Section 21 I2C Bus Interface 2 (IIC2)
Slave receive mode
SCL
(Master output)
Slave transmit mode
9
1
2
3
4
5
6
7
8
SDA
(Master output)
9
1
A
SCL
(Slave output)
SDA
(Slave output)
A
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
TDRE
TEND
TRS
Data 1
ICDRT
ICDRS
Data 2
Data 1
Data 3
Data 2
ICDRR
User
processing
[2] Write data to ICDRT (data 1)
[2] Write data to ICDRT (data 2)
[2] Write data to ICDRT (data 3)
Figure 21.9 Slave Transmit Mode Operation Timing (1)
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Section 21 I2C Bus Interface 2 (IIC2)
Slave receive
mode
Slave transmit mode
SCL
(Master output)
9
SDA
(Master output)
A
1
2
3
4
5
6
7
8
9
A
SCL
(Slave output)
SDA
(Slave output)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
TDRE
TEND
TRS
ICDRT
ICDRS
Data n
ICDRR
User
processing
[3] Clear TEND
[4] Read ICDRR (dummy read) [5] Clear TDRE
after clearing TRS
Figure 21.10 Slave Transmit Mode Operation Timing (2)
21.4.5
Slave Receive Operation
In slave receive mode, the master device outputs the transmit clock and transmit data, and the
slave device returns an acknowledge signal. For slave receive mode operation timing, refer to
figures 21.11 and 21.12. The reception procedure and operations in slave receive mode are
described below.
1. Set the ICE bit in ICCR1 to 1. Set the MLS and WAIT bits in ICMR and the CKS3 to CKS0
bits in ICCR1 to 1. (Initial setting) Set the MST and TRS bits in ICCR1 to select slave receive
mode, and wait until the slave address matches.
2. When the slave address matches in the first frame following detection of the start condition,
the slave device outputs the level specified by ACKBT in ICIER to SDA, at the rise of the 9th
clock pulse. At the same time, RDRF in ICSR is set to read ICDRR (dummy read). (Since the
read data show the slave address and R/W, it is not used.)
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Section 21 I2C Bus Interface 2 (IIC2)
3. Read ICDRR every time RDRF is set. If 8th receive clock pulse falls while RDRF is 1, SCL is
fixed low until ICDRR is read. The change of the acknowledge before reading ICDRR, to be
returned to the master device, is reflected to the next transmit frame.
4. The last byte data is read by reading ICDRR.
SCL
(Master output)
9
SDA
(Master output)
1
2
3
4
5
6
7
8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
9
1
Bit 7
SCL
(Slave output)
SDA
(Slave output)
A
A
RDRF
ICDRS
Data 1
Data 2
ICDRR
User
processing
Data 1
[2] Read ICDRR
[2] Read ICDRR (dummy read)
Figure 21.11 Slave Receive Mode Operation Timing (1)
SCL
(Master output)
9
SDA
(Master output)
1
2
3
4
5
6
7
8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
9
SCL
(Slave output)
SDA
(Slave output)
A
A
RDRF
ICDRS
Data 2
Data 1
ICDRR
Data 1
User
processing
[3] Set ACKBT
[3] Read ICDRR [4] Read ICDRR
Figure 21.12 Slave Receive Mode Operation Timing (2)
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Section 21 I2C Bus Interface 2 (IIC2)
21.4.6
Clocked Synchronous Serial Format
This module can be operated with the clocked synchronous serial format, by setting the FS bit in
SAR to 1. When the MST bit in ICCR1 is 1, the transfer clock output from SCL is selected. When
MST is 0, the external clock input is selected.
(1)
Data Transfer Format
Figure 21.13 shows the clocked synchronous serial transfer format.
The transfer data is output from the rise to the fall of the SCL clock, and the data at the rising edge
of the SCL clock is guaranteed. The MLS bit in ICMR sets the order of data transfer, in either the
MSB first or LSB first. The output level of SDA can be changed during the transfer wait, by the
SDAO bit in ICCR2.
SCL
SDA
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5 Bit 6
Bit 7
Figure 21.13 Clocked Synchronous Serial Transfer Format
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Section 21 I2C Bus Interface 2 (IIC2)
(2)
Transmit Operation
In transmit mode, transmit data is output from SDA, in synchronization with the fall of the transfer
clock. The transfer clock is output when MST in ICCR1 is 1, and is input when MST is 0. For
transmit mode operation timing, refer to figure 21.14. The transmission procedure and operations
in transmit mode are described below.
1. Set the ICE bit in ICCR1 to 1. Set the MST and CKS3 to CKS0 bits in ICCR1 to 1. (Initial
setting)
2. Set the TRS bit in ICCR1 to select the transmit mode. Then, TDRE in ICSR is set.
3. Confirm that TDRE has been set. Then, write the transmit data to ICDRT. The data is
transferred from ICDRT to ICDRS, and TDRE is set automatically. The continuous
transmission is performed by writing data to ICDRT every time TDRE is set. When changing
from transmit mode to receive mode, clear TRS while TDRE is 1.
SCL
1
2
7
8
1
7
8
1
SDA
(Output)
Bit 0
Bit 1
Bit 6
Bit 7
Bit 0
Bit 6
Bit 7
Bit 0
TRS
TDRE
Data 1
ICDRT
Data 1
ICDRS
User
processing
Data 2
[3] Write data [3] Write data
to ICDRT
to ICDRT
[2] Set TRS
Data 3
Data 2
Data 3
[3] Write data
to ICDRT
Figure 21.14 Transmit Mode Operation Timing
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[3] Write data
to ICDRT
Section 21 I2C Bus Interface 2 (IIC2)
(3)
Receive Operation
In receive mode, data is latched at the rise of the transfer clock. The transfer clock is output when
MST in ICCR1 is 1, and is input when MST is 0. For receive mode operation timing, refer to
figure 21.15. The reception procedure and operations in receive mode are described below.
1. Set the ICE bit in ICCR1 to 1. Set the MST and CKS3 to CKS0 bits in ICCR1 to 1. (Initial
setting)
2. When the transfer clock is output, set MST to 1 to start outputting the receive clock.
3. When the receive operation is completed, data is transferred from ICDRS to ICDRR and
RDRF in ICSR is set. When MST = 1, the next byte can be received, so the clock is
continually output. The continuous reception is performed by reading ICDRR every time
RDRF is set. When the 8th clock is risen while RDRF is 1, the overrun is detected and
AL/OVE in ICSR is set. At this time, the previous reception data is retained in ICDRR.
4. To stop receiving when MST = 1, set RCVD in ICCR1 to 1, then read ICDRR. Then, SCL is
fixed high after receiving the next byte data.
SCL
1
2
7
8
1
7
8
SDA
(Input)
Bit 0
Bit 1
Bit 6
Bit 7
Bit 0
Bit 6
Bit 7
1
2
Bit 0
MST
TRS
RDRF
ICDRS
Data 1
Data 3
Data 1
ICDRR
User
processing
Data 2
[2] Set MST
(when outputting the clock)
[3] Read ICDRR
Data 2
[3] Read ICDRR
Figure 21.15 Receive Mode Operation Timing
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Section 21 I2C Bus Interface 2 (IIC2)
21.4.7
Noise Canceler
The logic levels at the SCL and SDA pins are routed through noise cancelers before being latched
internally. Figure 21.16 shows a block diagram of the noise canceler circuit.
The noise canceler consists of two cascaded latches and a match detector. The SCL (or SDA)
input signal is sampled on the system clock, but is not passed forward to the next circuit unless the
outputs of both latches agree. If they do not agree, the previous value is held.
Sampling clock
C
SCL or SDA
input signal
D
C
Q
Q
D
Latch
Latch
Match detector
Internal
SCL or SDA
signal
System clock
period
Sampling
clock
Figure 21.16 Block Diagram of Noise Conceler
21.4.8
Example of Use
2
Flowcharts in respective modes that use the I C bus interface are shown in figures 21.17 to 21.20.
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Section 21 I2C Bus Interface 2 (IIC2)
Start
Initialize
[1]
Test the status of the SCL and SDA lines.
[2]
Set master transmit mode.
[3]
Issue the start candition.
[2]
[4]
Set the first byte (slave address + R/W) of transmit data.
Write 1 to BBSY
and 0 to SCP.
[3]
[5]
Wait for 1 byte to be transmitted.
Write transmit data
in ICDRT
[4]
[6]
Test the acknowledge transferred from the specified slave device.
[7]
Set the second and subsequent bytes (except for the final byte) of transmit data.
[8]
Wait for ICDRT empty.
[9]
Set the last byte of transmit data.
Read BBSY in ICCR2
[1]
No
BBSY=0 ?
Yes
Set MST and TRS
in ICCR1 to 1.
Read TEND in ICSR
[5]
No
TEND=1 ?
Yes
Read ACKBR in ICIER
[6]
ACKBR=0 ?
[10] Wait for last byte to be transmitted.
No
[11] Clear the TEND flag.
Yes
Transmit
mode?
Yes
No
Write transmit data in ICDRT
Mater receive mode
[7]
[13] Issue the stop condition.
Read TDRE in ICSR
No
[8]
TDRE=1 ?
Yes
No
[12] Clear the STOP flag.
[14] Wait for the creation of stop condition.
[15] Set slave receive mode. Clear TDRE.
Last byte?
[9]
Yes
Write transmit data in ICDRT
Read TEND in ICSR
No
[10]
TEND=1 ?
Yes
Clear TEND in ICSR
[11]
Clear STOP in ICSR
[12]
Write 0 to BBSY
and SCP
[13]
Read STOP in ICSR
No
[14]
STOP=1 ?
Yes
Set MST to 1 and TRS
to 0 in ICCR1
[15]
Clear TDRE in ICSR
End
Figure 21.17 Sample Flowchart for Master Transmit Mode
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Section 21 I2C Bus Interface 2 (IIC2)
Mater receive mode
[1]
Clear TEND, select master receive mode, and then clear TDRE.*
[2]
Set acknowledge to the transmit device.*
[3]
Dummy-read ICDDR.*
[4]
Wait for 1 byte to be received
[5]
Check whether it is the (last receive - 1).
[6]
Read the receive data.
[7]
Set acknowledge of the final byte. Disable continuous reception (RCVD = 1).
[8]
Read the (final byte - 1) of receive data.
[9]
Wait for the last byte to be receive.
Clear TEND in ICSR
Clear TRS in ICCR1 to 0
[1]
Clear TDRE in ICSR
Clear ACKBT in ICIER to 0
[2]
Dummy-read ICDRR
[3]
Read RDRF in ICSR
No
[4]
RDRF=1 ?
Yes
Last receive
- 1?
No
Read ICDRR
Yes
[5]
[10] Clear the STOP flag.
[6]
[11] Issue the stop condition.
[12] Wait for the creation of stop condition.
Set ACKBT in ICIER to 1
[7]
Set RCVD in ICCR1 to 1
Read ICDRR
[13] Read the last byte of receive data.
[14] Clear RCVD.
[8]
[15] Set slave receive mode.
Read RDRF in ICSR
No
RDRF=1 ?
[9]
Yes
Clear STOP in ICSR.
Write 0 to BBSY
and SCP
[10]
[11]
Read STOP in ICSR
No
[12]
STOP=1 ?
Yes
Read ICDRR
[13]
Clear RCVD in ICCR1 to 0
[14]
Clear MST in ICCR1 to 0
[15]
Note: When 1 byte is received, skip steps [2] to [6] after [1] and then jump
to step [7].
In step [8], dummy-read ICDRR.
* Do not activate an interrupt during the execution of steps [1] to [3].
End
Figure 21.18 Sample Flowchart for Master Receive Mode
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Section 21 I2C Bus Interface 2 (IIC2)
[1] Clear the AAS flag.
Slave transmit mode
Clear AAS in ICSR
[1]
Write transmit data
in ICDRT
[2]
[3] Wait for ICDRT empty.
[4] Set the last byte of transmit data.
Read TDRE in ICSR
No
[5] Wait for the last byte to be transmitted.
[3]
TDRE=1 ?
Yes
No
[6] Clear the TEND flag .
[7] Set slave receive mode.
Last
byte?
Yes
[2] Set transmit data for ICDRT (except for the last data).
[8] Dummy-read ICDRR to release the SCL line.
[4]
[9] Clear the TDRE flag.
Write transmit data
in ICDRT
Read TEND in ICSR
No
[5]
TEND=1 ?
Yes
Clear TEND in ICSR
[6]
Clear TRS in ICCR1 to 0
[7]
Dummy read ICDRR
[8]
Clear TDRE in ICSR
[9]
End
Figure 21.19 Sample Flowchart for Slave Transmit Mode
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Section 21 I2C Bus Interface 2 (IIC2)
Slave receive mode
[1] Clear the AAS flag.
Clear AAS in ICSR
[1]
Clear ACKBT in ICIER to 0
[2]
Dummy-read ICDRR
[3]
[2] Set acknowledge to the transmit device.
[3] Dummy-read ICDRR.
[5] Check whether it is the (last receive - 1).
Read RDRF in ICSR
No
[4]
RDRF=1 ?
[6] Read the receive data.
[7] Set acknowledge of the last byte.
Yes
Last receive
- 1?
[4] Wait for 1 byte to be received.
Yes
No
Read ICDRR
[5]
[8] Read the (last byte - 1) of receive data.
[9] Wait the last byte to be received.
[6]
[10] Read for the last byte of receive data.
Set ACKBT in ICIER to 1
[7]
Read ICDRR
[8]
Read RDRF in ICSR
No
[9]
RDRF=1 ?
Yes
Read ICDRR
[10]
Note: When 1 byte is received, skip steps [2] to [6]
after [1] and then jump to step [7].
In step [8], dummy-read ICDRR.
End
Figure 21.20 Sample Flowchart for Slave Receive Mode
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Section 21 I2C Bus Interface 2 (IIC2)
21.5
Interrupt Request
There are six interrupt requests in this module; transmit data empty, transmit end, receive data full,
NACK receive, STOP recognition, and arbitration lost/overrun. Table 21.3 shows the contents of
each interrupt request.
Table 21.3 Interrupt Requests
Interrupt Request
Abbreviation
Interrupt Condition
Clocked
Synchronous
2
I C Mode Mode
Transmit Data Empty
TXI
(TDRE=1) • (TIE=1)
!
!
Transmit End
TEI
(TEND=1) • (TEIE=1)
!
!
Receive Data Full
RXI
(RDRF=1) • (RIE=1)
!
!
STOP Recognition
STPI
(STOP=1) (STIE=1)
!
×
NACK Receive
NAKI
{(NACKF=1)+(AL=1)}
(NAKIE=1)
Arbitration
Lost/Overrun
•
•
!
×
!
!
When interrupt conditions described in table 21.3 are 1 and the I bit in CCR is 0, the CPU
executes interrupt exception processing. Interrupt sources should be cleared in the exception
processing. TDRE and TEND are automatically cleared to 0 by writing the transmit data to
ICDRT. RDRF are automatically cleared to 0 by reading ICDRR. TDRE is set to 1 again at the
same time when transmit data is written to ICDRT. When TDRE is cleared to 0, then an excessive
data of one byte may be transmitted.
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Section 21 I2C Bus Interface 2 (IIC2)
21.6
Bit Synchronous Circuit
In master mode,this module has a possibility that high level period may be short in the two states
described below.
• When SCL is driven to low by the slave device
• When the rising speed of SCL is lowered by the load of the SCL line (load capacitance or pullup resistance)
Therefore, it monitors SCL and communicates by bit with synchronization.
Figure 21.21 shows the timing of the bit synchronous circuit and table 21.4 shows the time when
SCL output changes from low to Hi-Z then SCL is monitored.
SCL monitor
timing reference
clock
VIH
SCL
Internal SCL
Figure 21.21 Timing of Bit Synchronous Circuit
Table 21.4 Time for Monitoring SCL
CKS3
CKS2
Time for Monitoring SCL
0
0
7.5 tcyc
1
19.5 tcyc
0
17.5 tcyc
1
41.5 tcyc
1
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Section 21 I2C Bus Interface 2 (IIC2)
21.7
Usage Notes
1. Confirm the ninth falling edge of the clock before issuing a stop or a repeated start condition.
The ninth falling edge can be confirmed by monitoring the SCLO bit in the I2C bus control
register B (ICCRB).
If a stop or a repeated start condition is issued at certain timing in either of the following cases,
the stop or repeated start condition may be issued incorrectly.
 The rising time of the SCL signal exceeds the time given in section 21.6, Bit Synchronous
Circuit, because of the load on the SCL bus (load capacitance or pull-up resistance).
 The bit synchronous circuit is activated because a slave device holds the SCL bus low
during the eighth clock.
2. The WAIT bit in the I2C bus mode register (ICMR) must be held 0.
If the WAIT bit is set to 1, when a slave device holds the SCL signal low more than one
transfer clock cycle during the eighth clock, the high level period of the ninth clock may be
shorter than a given period.
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Section 21 I2C Bus Interface 2 (IIC2)
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Section 22 Power-On Reset Circuit
Section 22 Power-On Reset Circuit
This LSI has an on-chip power-on reset circuit. A block diagram of the power-on reset circuit is
shown in figure 22.1.
22.1
Feature
• Power-on reset circuit
An internal reset signal is generated at turning the power on by externally connecting a
capacitor.
Vcc
Rp
(Recommended)
RES
CRES
System
clock
3-bit
counter
Internal reset signal
Voltage
detector
Figure 22.1 Power-On Reset Circuit
PSCKT11A_000120040500
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Section 22 Power-On Reset Circuit
22.2
22.2.1
Operation
Power-On Reset Circuit
The operation timing of the power-on reset circuit is shown in figure 22.2. As the power supply
voltage rises, the capacitor, which is externally connected to the RES pin, is gradually charged
through the on-chip pull-up resistor (100 kΩ). The low level of the RES pin is sent to the chip and
the whole chip is reset. When the level of the RES pin reaches to the predetermined level, a
voltage detection circuit detects it. Then a 3-bit counter starts counting up. When the 3-bit counter
counts φ for 8 times, an overflow signal is generated and an internal reset signal is cleared.
If the RES pin rising time is t, the capacitance (CRES) connected to the RES pin can be computed
using the formula below. For information about the on-chip resistor (Rp), see section 25, Electrical
Characteristics. The power supply rising time should not exceed half the RES rising time (t). The
RES rising time (t) should also equal or exceed the oscillation stabilization time (trc).
CRES =
t
Rp
(t > trc, t > t_vtr × 2)
Note: Adjust the capacitor connected to the RES pin so that t_vtr × 2 exceeds the oscillation
stabilization time.
Note that the power supply voltage (Vcc) must fall below Vpor = 100 mV and rise after charge on
the RES pin is removed. To remove charge on the RES pin, it is recommended that the diode
should be placed near Vcc. If the power supply voltage (Vcc) rises from the point above Vpor, a
power-on reset may not occur.
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Section 22 Power-On Reset Circuit
t_vtr
Vcc
t_vtr × 2
RES
V_rst
Internal reset
signal
t_cr
t_out (eight states)
Figure 22.2 Power-On Reset Circuit Operation Timing
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Section 22 Power-On Reset Circuit
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Section 23 Address Break
Section 23 Address Break
The address break simplifies on-board program debugging. It requests an address break interrupt
when the set break condition is satisfied. The interrupt request is not affected by the I bit in CCR.
Break conditions that can be set include instruction execution at a specific address and a
combination of access and data at a specific address. With the address break function, the
execution start point of a program containing a bug is detected and execution is branched to the
correcting program. Use of module standby mode enables this module to be placed in standby
mode independently when not used. (For details, refer to section 6.4, Module Standby Function.)
Figure 23.1 shows a block diagram of the address break.
Internal address bus
Comparator
BAR2L
ABRKCR2
Interrupt
generation
control circuit
ABRKSR2
BDR2H
Internal data bus
BAR2H
BDR2L
Comparator
Interrupt
[Legend]
BAR2H, BAR2L:
BDR2H, BDR2L:
ABRKCR2:
ABRKSR2:
Break address register 2
Break data register 2
Address break control register 2
Address break status register 2
Figure 23.1 Block Diagram of Address Break
ABK0002A_000020030700
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Section 23 Address Break
23.1
Register Descriptions
The address break has the following registers.
• Address break control register 2 (ABRKCR2)
• Address break status register 2 (ABRKSR2)
• Break address register 2 (BAR2H, BAR2L)
• Break data register 2 (BDR2H, BDR2L)
23.1.1
Address Break Control Register 2 (ABRKCR2)
ABRKCR2 sets address break conditions.
Bit
Bit Name
Initial
Value
R/W
Description
7
RTINTE2
1
R/W
RTE Interrupt Enable
When this bit is 0, the interrupt immediately after
executing RTE is masked and then one instruction must
be executed. When this bit is 1, the interrupt is not
masked.
6
CSEL21
0
R/W
Condition Select 1 and 0
5
CSEL20
0
R/W
These bits set address break conditions.
00: Instruction execution cycle (no data comparison)
01: CPU data read cycle
10: CPU data write cycle
11: CPU data read/write cycle
4
ACMP22
0
R/W
Address Compare Condition Select 2 to 0
3
ACMP21
0
R/W
2
ACMP20
0
R/W
These bits set the comparison condition between the
address set in BAR2 and the internal address bus.
000: Compares 16-bit addresses
001: Compares upper 12-bit addresses
010: Compares upper 8-bit addresses
011: Compares upper 4-bit addresses
1xx: Setting prohibited
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Section 23 Address Break
Bit
Bit Name
Initial
Value
R/W
Description
1
DCMP21
0
R/W
Data Compare Condition Select 1 and 0
0
DCMP20
0
R/W
These bits set the comparison condition between the
data set in BDR2 and the internal data bus.
00: No data comparison
01: Compares lower 8-bit data between BDR2L and
data bus
10: Compares upper 8-bit data between BDR2H and
data bus
11: Compares 16-bit data between BDR2 and data bus
[Legend]
x: Don't care.
When an address break is set in the data read cycle or data write cycle, the data bus used will
depend on the combination of the byte/word access and address. Table 23.1 shows the access and
data bus used. When an I/O register space with an 8-bit data bus width is accessed in word size, a
byte access is generated twice. For details on data widths of each register, see section 24.1,
Register Addresses (Address Order).
Table 23.1 Access and Data Bus Used
Word Access
Byte Access
Even Address
Odd Address
Even Address
Odd Address
ROM space
Upper 8 bits
Lower 8 bits
Upper 8 bits
Upper 8 bits
RAM space
Upper 8 bits
Lower 8 bits
Upper 8 bits
Upper 8 bits
I/O register with
8-bit data bus width
Upper 8 bits
Upper 8 bits
Upper 8 bits
Upper 8 bits
I/O register with
1
16-bit data bus width*
Upper 8 bits
Lower 8 bits
—
—
I/O register with
2
16-bit data bus width*
Upper 8 bits
Lower 8 bits
Upper 8 bits
Upper 8 bits
Notes: 1. Registers whose addresses do not range from H'FF96 and H'FF97, and H'FFB8 to
H'FFBB with 16-bit data bus width.
2. Registers whose addresses range from H'FF96 and H'FF97, and H'FFB8 to H'FFBB.
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Section 23 Address Break
23.1.2
Address Break Status Register 2 (ABRKSR2)
ABRKSR2 consists of the address break interrupt flag and the address break interrupt enable bit.
Bit
Bit Name
Initial
Value
R/W
7
ABIF2
0
R/W
Description
Address Break Interrupt Flag
[Setting condition]
When the condition set in ABRKCR2 is satisfied
[Clearing condition]
When 0 is written after ABIF=1 is read
6
ABIE2
0
R/W
Address Break Interrupt Enable
When this bit is 1, an address break interrupt request is
enabled.
5 to 0
—
All 1
—
Reserved
These bits are always read as 1.
23.1.3
Break Address Registers 2 (BAR2H, BAR2L)
BAR2H and BAR2L are 16-bit read/write registers that set the address for generating an address
break interrupt. When setting the address break condition to the instruction execution cycle, set the
first byte address of the instruction. The initial value of this register is H'FFFF.
23.1.4
Break Data Registers 2 (BDR2H, BDR2L)
BDR2H and BDR2L are 16-bit read/write registers that set the data for generating an address
break interrupt. BDR2H is compared with the upper 8-bit data bus. BDR2L is compared with the
lower 8-bit data bus. When memory or registers are accessed by byte, the upper 8-bit data bus is
used for even and odd addresses in the data transmission. Therefore, comparison data must be set
in BDR2H for byte access. For word access, the data bus used depends on the address. See section
23.1.1, Address Break Control Register 2 (ABRKCR2), for details. The initial value of this
register is undefined.
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Section 23 Address Break
23.2
Operation
When the ABIF2 and ABIE2 bits in ABRKSR2 are set to 1, the address break function generates
an interrupt request to the CPU. The ABIF2 bit in ABRKSR2 is set to 1 by the combination of the
address set in BAR2, the data set in BDR2, and the conditions set in ABRKCR2. When the
interrupt request is accepted, interrupt exception handling starts after the instruction being
executed ends. The address break interrupt is not masked by the I bit in CCR of the CPU.
Figures 23.2 show the operation examples of the address break interrupt setting.
When the address break is specified in instruction execution cycle
Register setting
• ABRKCR2 = H'80
• BAR2 = H'025A
Program
0258
* 025A
025C
0260
0262
:
NOP
NOP
MOV.W @H'025A,R0
NOP
NOP
:
Underline indicates the address
to be stacked.
NOP
MOV
MOV
NOP
instruc- instruc- instruc- instruction
tion 1
tion 2
Internal
tion
prefetch prefetch prefetch prefetch processing
Stack save
φ
Address
bus
0258
025A
025C
025E
SP-2
SP-4
Interrupt
request
Interrupt acceptance
Figure 23.2 Address Break Interrupt Operation Example (1)
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Section 23 Address Break
When the address break is specified in the data read cycle
Register setting
• ABRKCR2 = H'A0
• BAR2 = H'025A
Program
0258
025A
* 025C
0260
0262
:
NOP
NOP
MOV.W @H'025A,R0
NOP
Underline indicates the address
NOP
to be stacked.
:
MOV
NOP
MOV
NOP
Next
MOV
instruc- instruc- instruc- instruc- instruc- instrution 2
tion
tion
tion
ction
Internal Stack
tion 1
prefetch prefetch prefetch execution prefetch prefetch processing save
φ
Address
bus
025C
025E
0260
025A
0262
0264
SP-2
Interrupt
request
Interrupt acceptance
Figure 23.2 Address Break Interrupt Operation Example (2)
23.3
Operating States of Address Break
The operating states of the address break are shown in table 23.2.
Table 23.2 Operating States of Address Break
Operating
Mode
Reset
Active
Sleep
Watch
Subactive
Sub-sleep Standby
Module
Standby
ABRKCR2
Reset
Functions
Retained
Retained
Functions
Retained
Retained
Retained
ABRKSR2
Reset
Functions
Retained
Retained
Functions
Retained
Retained
Retained
BAR2H
Reset
Functions
Retained
Retained
Functions
Retained
Retained
Retained
BAR2L
Reset
Functions
Retained
Retained
Functions
Retained
Retained
Retained
BDR2H
Retained*
Functions
Retained
Retained
Functions
Retained
Retained
Retained
BDR2L
Retained*
Functions
Retained
Retained
Functions
Retained
Retained
Retained
Note:
*
Undefined at a power-on reset
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Section 24 List of Registers
Section 24 List of Registers
The register list gives information on the on-chip I/O register addresses, how the register bits are
configured, and the register states in each operating mode. The information is given as shown
below.
1. Register addresses (address order)
• Registers are listed from the lower allocation addresses.
• Registers are classified by functional modules.
• The data bus width is indicated.
• The number of access states is indicated.
2. Register bits
• Bit configurations of the registers are described in the same order as the register addresses.
• Reserved bits are indicated by  in the bit name column.
• When registers consist of 16 bits, bits are described from the MSB side.
3. Register states in each operating mode
• Register states are described in the same order as the register addresses.
• The register states described here are for the basic operating modes. If there is a specific reset
for an on-chip peripheral module, refer to the section on that on-chip peripheral module.
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Section 24 List of Registers
24.1
Register Addresses (Address Order)
The data bus width indicates the number of bits by which the register is accessed.
The number of access states indicates the number of states based on the specified reference clock.
Register Name
Abbreviation
Module
Bit No. Address Name
Data
Bus
Access
Width State
Serial control register 4
SCR4
8
H'F00C
SCI4
8
2
Serial control/status register 4
SCSR4
8
H'F00D
SCI4
8
2
Transmit data register 4
TDR4
8
H'F00E
SCI4
8
2
Receive data register 4
RDR4
8
H'F00F
SCI4
8
2
Flash memory control register 1
FLMCR1
8
H'F020
ROM
8
2
Flash memory control register 2
FLMCR2
8
H'F021
ROM
8
2
Flash memory power control register
FLPWCR
8
H'F022
ROM
8
2
Erase block register1
EBR1
8
H'F023
ROM
8
2
Flash memory enable register
FENR
8
H'F02B
ROM
8
2
Timer start register
TSTR
8
H'F030
TPU
8
2
Timer synchro register
TSYR
8
H'F031
TPU
8
2
Timer control register_1
TCR_1
8
H'F040
TPU_1
8
2
Timer mode register_1
TMDR_1
8
H'F041
TPU_1
8
2
Timer I/O control register_1
TIOR_1
8
H'F042
TPU_1
8
2
Timer interrupt enable register_1
TIER_1
8
H'F044
TPU_1
8
2
Timer status register_1
TSR_1
8
H'F045
TPU_1
8
2
Timer counter_1
TCNT_1
16
H'F046
TPU_1
16
2
Timer general register A_1
TGRA_1
16
H'F048
TPU_1
16
2
Timer general register B_1
TGRB_1
16
H'F04A
TPU_1
16
2
Timer control register_2
TCR_2
8
H'F050
TPU_2
8
2
Timer mode register_2
TMDR_2
8
H'F051
TPU_2
8
2
Timer I/O control register_2
TIOR_2
8
H'F052
TPU_2
8
2
Timer interrupt enable register_2
TIER_2
8
H'F054
TPU_2
8
2
Timer status register_2
TSR_2
8
H'F055
TPU_2
8
2
Timer counter_2
TCNT_2
16
H'F056
TPU_2
16
2
Rev. 3.00 Aug 23, 2006 Page 486 of 616
REJ09B0182-0300
Section 24 List of Registers
Register Name
Abbreviation
Module
Bit No. Address Name
Data
Bus
Access
Width State
Timer general register A_2
TGRA_2
16
H'F058
TPU_2
16
2
Timer general register B_2
TGRB_2
16
H'F05A
TPU_2
16
2
A/D control register
ADCR
8
H'F060
∆Σ A/D
converter
8
2
A/D start/status register
ADSSR
8
H'F061
∆Σ A/D
converter
8
2
A/D data register
ADDR
16
H'F062
∆Σ A/D
converter
16
2
RTC interrupt flag register
RTCFLG
8
H'F067
RTC
8
2
Second data register/free running RSECDR
counter data register
8
H'F068
RTC
8
2
Minute data register
RMINDR
8
H'F069
RTC
8
2
Hour data register
RHRDR
8
H'F06A
RTC
8
2
Day-of-week data register
RWKDR
8
H'F06B
RTC
8
2
RTC control register 1
RTCCR1
8
H'F06C
RTC
8
2
RTC control register 2
RTCCR2
8
H'F06D
RTC
8
2
SUB32k control register
SUB32CR 8
H'F06E
Clock pulse 8
generator
2
Clock source select register
RTCCSR
8
H'F06F
RTC
8
2
2
ICCR1
8
H'F078
IIC2
8
2
2
I C bus control register 1
I C bus control register 2
ICCR2
8
H'F079
IIC2
8
2
2
ICMR
8
H'F07A
IIC2
8
2
2
ICIER
8
H'F07B
IIC2
8
2
2
I C bus status register
ICSR
8
H'F07C
IIC2
8
2
Slave address register
I C bus mode register
I C bus interrupt enable register
SAR
8
H'F07D
IIC2
8
2
2
ICDRT
8
H'F07E
IIC2
8
2
2
I C bus receive data register
ICDRR
8
H'F07F
IIC2
8
2
Interrupt priority register A
IPRA
8
H'F080
Interrupts
8
2
Interrupt priority register B
IPRB
8
H'F081
Interrupts
8
2
Interrupt priority register C
IPRC
8
H'F082
Interrupts
8
2
Interrupt priority register D
IPRD
8
H'F083
Interrupts
8
2
Interrupt priority register E
IPRE
8
H'F084
Interrupts
8
2
I C bus transmit data register
Rev. 3.00 Aug 23, 2006 Page 487 of 616
REJ09B0182-0300
Section 24 List of Registers
Register Name
Address break control register 2
ABRKCR2 8
H'F096
Address
break
8
2
Address break status register 2
ABRKSR2 8
H'F097
Address
break
8
2
Break address register 2H
BAR2H
8
H'F098
Address
break
8
2
Break address register 2L
BAR2L
8
H'F099
Address
break
8
2
Break data register 2H
BDR2H
8
H'F09A
Address
break
8
2
Break data register 2L
BDR2L
8
H'F09B
Address
break
8
2
Event counter PWM compare
register
ECPWCR 16
H'FF8C
AEC*
1
16
2
Event counter PWM data register
ECPWDR 16
H'FF8E
AEC*
1
16
2
Wakeup edge select register
WEGR
8
H'FF90
Interrupts
8
2
Serial port control register
SPCR
8
H'FF91
SCI3
Input pin edge select register
Event counter control register
AEGSR
ECCR
Module
Bit No. Address Name
Data
Bus
Access
Width State
Abbreviation
8
8
H'FF92
H'FF94
8
2
AEC*
1
8
2
AEC*
1
8
2
8
2
Event counter control/status
register
ECCSR
8
H'FF95
AEC*
1
Event counter H
ECH
8
H'FF96
AEC*
1
8/16
2
1
8/16
2
Event counter L
ECL
8
H'FF97
AEC*
Serial mode register 3_1
SMR3_1
8
H'FF98
SCI3_1
8
3
Bit rate register 3_1
BRR3_1
8
H'FF99
SCI3_1
8
3
Serial control register 3_1
SCR3_1
8
H'FF9A
SCI3_1
8
3
Transmit data register 3_1
TDR3_1
8
H'FF9B
SCI3_1
8
3
Serial status register 3_1
SSR3_1
8
H'FF9C
SCI3_1
8
3
Receive data register 3_1
RDR3_1
8
H'FF9D
SCI3_1
LCD port control register
LCD control register
LCD control register 2
LCD trimming register
LPCR
LCR
LCR2
LTRMR
Rev. 3.00 Aug 23, 2006 Page 488 of 616
REJ09B0182-0300
8
8
8
8
H'FFA0
H'FFA1
H'FFA2
H'FFA3
8
3
LCD*
3
8
2
LCD*
3
8
2
LCD*
3
8
2
LCD*
3
8
2
Section 24 List of Registers
Register Name
Abbreviation
Module
Bit No. Address Name
BGR control register
BGRMR
8
H'FFA4
LCD*
IrDA control register
IrCR
8
H'FFA7
Serial mode register 3_2
SMR3_2
8
Bit rate register 3_2
BRR3_2
8
Serial control register 3_2
SCR3_2
Transmit data register 3_2
3
Data
Bus
Access
Width State
8
2
IrDA
8
3
H'FFA8
SCI3_2
8
3
H'FFA9
SCI3_2
8
3
8
H'FFAA
SCI3_2
8
3
TDR3_2
8
H'FFAB
SCI3_2
8
3
Serial status register 3_2
SSR3_2
8
H'FFAC
SCI3_2
8
3
Receive data register 3_2
RDR3_2
8
H'FFAD
SCI3_2
Timer mode register WD
TMWD
8
Timer control/status register WD1 TCSRWD1 8
H'FFB0
H'FFB1
8
3
WDT*
2
8
2
WDT*
2
8
2
8
2
8
2
Timer control/status register WD2 TCSRWD2 8
H'FFB2
WDT*
2
Timer counter WD
TCWD
8
H'FFB3
WDT*
2
Timer control register F
TCRF
8
H'FFB6
Timer F
8
2
Timer control/status register F
TCSRF
8
H'FFB7
Timer F
8
2
8-bit timer counter FH
TCFH
8
H'FFB8
Timer F
8/16
2
8-bit timer counter FL
TCFL
8
H'FFB9
Timer F
8/16
2
Output compare register FH
OCRFH
8
H'FFBA
Timer F
8/16
2
Output compare register FL
OCRFL
8
H'FFBB
Timer F
8/16
2
A/D result register
ADRR
16
H'FFBC
A/D
converter
16
2
A/D mode register
AMR
8
H'FFBE
A/D
converter
8
2
A/D start register
ADSR
8
H'FFBF
A/D
converter
8
2
Port mode register 1
PMR1
8
H'FFC0
I/O ports
8
2
Oscillator Control Register
OSCCR
8
H'FFC1
Clock pulse 8
generator
2
Port mode register 3
PMR3
8
H'FFC2
I/O ports
8
2
Port mode register 4
PMR4
8
H'FFC3
I/O ports
8
2
Port mode register 5
PMR5
8
H'FFC4
I/O ports
8
2
Port mode register 9
PMR9
8
H'FFC8
I/O ports
8
2
Port mode register B
PMRB
8
H'FFCA
I/O ports
8
2
Rev. 3.00 Aug 23, 2006 Page 489 of 616
REJ09B0182-0300
Section 24 List of Registers
Data
Bus
Access
Width State
Register Name
Abbreviation
Module
Bit No. Address Name
PWM2 control register
PWCR22
8
H'FFCD
14-bit PWM 8
2
PWM2 data register
PWDR2
16
H'FFCE
14-bit PWM 16
2
PWM1 control register
PWCR1
8
H'FFD0
14-bit PWM 8
2
PWM1 data register
PWDR1
16
H'FFD2
14-bit PWM 16
2
Port data register 1
PDR1
8
H'FFD4
I/O ports
8
2
Port data register 3
PDR3
8
H'FFD6
I/O ports
8
2
Port data register 4
PDR4
8
H'FFD7
I/O ports
8
2
Port data register 5
PDR5
8
H'FFD8
I/O ports
8
2
Port data register 6
PDR6
8
H'FFD9
I/O ports
8
2
Port data register 7
PDR7
8
H'FFDA
I/O ports
8
2
Port data register 8
PDR8
8
H'FFDB
I/O ports
8
2
Port data register 9
PDR9
8
H'FFDC
I/O ports
8
2
Port data register A
PDRA
8
H'FFDD
I/O ports
8
2
Port data register B
PDRB
8
H'FFDE
I/O ports
8
2
Port pull-up control register 1
PUCR1
8
H'FFE0
I/O ports
8
2
Port pull-up control register 3
PUCR3
8
H'FFE1
I/O ports
8
2
Port pull-up control register 5
PUCR5
8
H'FFE2
I/O ports
8
2
Port pull-up control register 6
PUCR6
8
H'FFE3
I/O ports
8
2
Port control register 1
PCR1
8
H'FFE4
I/O ports
8
2
Port control register 3
PCR3
8
H'FFE6
I/O ports
8
2
Port control register 4
PCR4
8
H'FFE7
I/O ports
8
2
Port control register 5
PCR5
8
H'FFE8
I/O ports
8
2
Port control register 6
PCR6
8
H'FFE9
I/O ports
8
2
Port control register 7
PCR7
8
H'FFEA
I/O ports
8
2
Port control register 8
PCR8
8
H'FFEB
I/O ports
8
2
Port control register 9
PCR9
8
H'FFEC
I/O ports
8
2
Port control register A
PCRA
8
H'FFED
I/O ports
8
2
System control register 1
SYSCR1
8
H'FFF0
System
8
2
System control register 2
SYSCR2
8
H'FFF1
System
8
2
IRQ edge select register
IEGR
8
H'FFF2
Interrupts
8
2
Rev. 3.00 Aug 23, 2006 Page 490 of 616
REJ09B0182-0300
Section 24 List of Registers
Register Name
Abbreviation
Module
Bit No. Address Name
Data
Bus
Access
Width State
Interrupt enable register 1
IENR1
8
H'FFF3
Interrupts
8
2
Interrupt enable register 2
IENR2
8
H'FFF4
Interrupts
8
2
Interrupt mask register
INTM
8
H'FFF5
Interrupts
8
2
Interrupt request register 1
IRR1
8
H'FFF6
Interrupts
8
2
Interrupt request register 2
IRR2
8
H'FFF7
Interrupts
8
2
8
H'FFF9
Interrupts
8
2
Clock stop register 1
CKSTPR1 8
H'FFFA
System
8
2
Clock stop register 2
CKSTPR2 8
H'FFFB
System
8
2
Wakeup interrupt request register IWPR
Notes: 1. AEC: Asynchronous event counter
2. WDT: Watchdog timer
3. LCD: LCD controller/driver
Rev. 3.00 Aug 23, 2006 Page 491 of 616
REJ09B0182-0300
Section 24 List of Registers
24.2
Register Bits
Register bit names of the on-chip peripheral modules are described below.
Register
Abbreviation Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
SCR4
TIE
RIE
TEIE
SOL
SOLP
SRES
TE
RE
SCI4
SCSR4
TDRE
RDRF
ORER
TEND
CKS3
CKS2
CKS1
CKS0
TDR4
TDR47
TDR46
TDR45
TDR44
TDR43
TDR42
TDR41
TDR40
RDR4
RDR47
RDR46
RDR45
RDR44
RDR43
RDR42
RDR41
RDR40
FLMCR1

SWE
ESU
PSU
EV
PV
E
P
FLMCR2
FLER







FLPWCR
PDWND 






EBR1

EB6
EB5
EB4
EB3
EB2
EB1
EB0
FENR
FLSHE







TSTR





CST2
CST1

TSYR





SYNC2
SYNC1

TCR_1

CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
TMDR_1






MD1
MD0
TIOR_1
IOB3
IOB2
IOB1
IOB0
IOA3
IOA2
IOA1
IOA0
TIER_1



TCIEV


TGIEB
TGIEA
TSR_1_



TCFV


TGFB
TGFA
TCNT_1
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TGRA_1
TGRB_1
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
TCR_2

CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
TMDR_2






MD1
MD0
TIOR_2
IOB3
IOB2
IOB1
IOB0
IOA3
IOA2
IOA1
IOA0
TIER_2



TCIEV


TGIEB
TGIEA
TSR_2



TCFV


TGFB
TGFA
Rev. 3.00 Aug 23, 2006 Page 492 of 616
REJ09B0182-0300
ROM
TPU
TPU_1
TPU_2
Section 24 List of Registers
Register
Abbreviation Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
TPU_2
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
ADCR
MOD
OVS2
OVS1
OVS0
VREF1
VREF0
PGA1
PGA0
ADSSR
ADS
ADST
AIN1
AIN0
BYPGA



TCNT_2
TGRA_2
TGRB_2
ADDR
∆Σ A/D
converter
ADD13
ADD12
ADD11
ADD10
ADD9
ADD8
ADD7
ADD6
ADD5
ADD4
ADD3
ADD2
ADD1
ADD0


RTCFLG
FOIFG
WKIFG
DYIFG
HRIFG
MNIFG
SEIFG
05SEIFG 025SEIFG RTC
RSECDR
BSY
SC12
SC11
SC10
SC03
SC02
SC01
SC00
RMINDR
BSY
MN12
MN11
MN10
MN03
MN02
MN01
MN00
RHRDR
BSY

HR11
HR10
HR03
HR02
HR01
HR00
RWKDR
BSY




WK2
WK1
WK0
RTCCR1
RUN
12/24
PM
RST




RTCCR2
FOIE
WKIE
SUB32CR
32KSTOP 
DYIE
HRIE
MNIE
1SEIE
05SEIE
025SEIE






Clock pulse
generator
RTCCSR

RCS6
RCS5
SUB32K
RCS3
RCS2
RCS1
RCS0
RTC
ICCR1
ICE
RCVD
MST
TRS
CKS3
CKS2
CKS1
CKS0
IIC2
ICCR2
BBSY
SCP
SDAO
SDAOP
SCLO

IICRST

ICMR
MLS
WAIT


BCWP
BC2
BC1
BC0
ICIER
TIE
TEIE
RIE
NAKIE
STIE
ACKE
ACKBR
ACKBT
ICSR
TDRE
TEND
RDRF
NACKF
STOP
AL/OVE
AAS
ADZ
SAR
SVA6
SVA5
SVA4
SVA3
SVA2
SVA1
SVA0
FS
ICDRT
ICDRT7 ICDRT6
ICDRT5 ICDRT4
ICDRT3
ICDRT2
ICDRT1
ICDRT0
ICDRR
ICDRR7 ICDRR6 ICDRR5 ICDRR4
ICDRR3
ICDRR2 ICDRR1
ICDRR0
Rev. 3.00 Aug 23, 2006 Page 493 of 616
REJ09B0182-0300
Section 24 List of Registers
Register
Abbreviation Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
IPRA
IPRA7
IPRA6
IPRA5
IPRA4
IPRA3
IPRA2
IPRA1
IPRA0
Interrupts
IPRB
IPRB7
IPRB6
IPRB5
IPRB4
IPRB3
IPRB2
IPRB1
IPRB0
IPRC
IPRC7
IPRC6
IPRC5
IPRC4
IPRC3
IPRC2
IPRC1
IPRC0
IPRD
IPRD7
IPRD6
IPRD5
IPRD4
IPRD3
IPRD2
IPRD1
IPRD0
IPRE
IPRE7
IPRE6
IPRE5
IPRE4




ABRKCR2
RTINTE2 CSEL21
CSEL20
ABRKSR2
ABIF2

ACMP22 ACMP21 ACMP20 DCMP21 DCMP20 Address
break





BAR2H
BARH27 BARH26 BARH25 BARH24 BARH23 BARH22 BARH21
BARH20
BAR2L
BARL27
BARL20
BDR2H
BDRH27 BDRH26 BDRH25 BDRH24 BDRH23 BDRH22 BDRH21 BDRH20
BDR2L
BDRL27 BDRL26 BDRL25 BDRL24 BDRL23 BDRL22 BDRL21
BDRL20
ECPWCR
ECPWCR15 ECPWCR14 ECPWCR13 ECPWCR12 ECPWCR11 ECPWCR10 ECPWCR9
ECPWCR8
ECPWCR7
ECPWCR1
ECPWCR0
ECPWDR15 ECPWDR14 ECPWDR13 ECPWDR12 ECPWDR11 ECPWDR10 ECPWDR9
ECPWDR8
ECPWDR7
ECPWDR6
ECPWDR5
ECPWDR4
ECPWDR3
ECPWDR2
ECPWDR1
ECPWDR0
WKEGS7
WKEGS6
WKEGS5
WKEGS4
WKEGS3
WKEGS2
WKEGS1
WKEGS0 Interrupts
SPCR


SPC32
SPC31
SCINV3
SCINV2
SCINV1
SCINV0 SCI3
AEGSR
AHEGS1 AHEGS0 ALEGS1 ALEGS0 AIEGS1
AIEGS0
ECPWME 
ECCR
ACKH1
ACKH0
ACKL1
ACKL0
PWCK2
PWCK1
PWCK0

ECCSR
OVH
OVL

CH2
CUEH
CUEL
CRCH
CRCL
ECH
ECH7
ECH6
ECH5
ECH4
ECH3
ECH2
ECH1
ECH0
ECL
ECL7
ECL6
ECL5
ECL4
ECL3
ECL2
ECL1
ECL0
SMR3_1
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
BRR3_1
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
ECPWDR
WEGR
ABIE2
BARL26
ECPWCR6
BARL25
ECPWCR5
BARL24
ECPWCR4
BARL23
ECPWCR3
BARL22
ECPWCR2
BARL21
SCR3_1
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
TDR3_1
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
SSR3_1
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
RDR3_1
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
Rev. 3.00 Aug 23, 2006 Page 494 of 616
REJ09B0182-0300
AEC*1
AEC*1
SCI3_1
Section 24 List of Registers
Register
Abbreviation Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
LPCR
DTS1
DTS0
CMX

SGS3
SGS2
SGS1
SGS0
LCD*3
LCR

PSW
ACT
DISP
CKS3
CKS2
CKS1
CKS0
LCR2
LCDAB
HCKS
CHG
SUPS




LTRMR
TRM3
TRM2
TRM1
TRM0

CTRM2
CTRM1
CTRM0
BGRMR
BGRSTPN 



BTRM2
BTRM1
BTRM0
IrCR
IrE
IrCKS2
IrCKS1
IrCKS0




IrDA
SMR3_2
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
SCI3_2
BRR3_2
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
SCR3_2
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
TDR3_2
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
SSR3_2
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
RDR3_2
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
TMWD




CKS3
CKS2
CKS1
CKS0
TCSRWD1
B6WI
TCWE
B4WI
TCSRWE B2WI
WDON
BOWI
WRST
TCSRWD2
OVF
B5WI
WT/IT
B3WI
IEOVF



TCWD
TCW7
TCW6
TCW5
TCW4
TCW3
TCW2
TCW1
TCW0
WDT*2
Timer F
TCRF
TOLH
CKSH2
CKSH1
CKSH0
TOLL
CKSL2
CKSL1
CKSL0
TCSRF
OVFH
CMFH
OVIEH
CCLRH
OVFL
CMFL
OVIEL
CCLRL
TCFH
TCFH7
TCFH6
TCFH5
TCFH4
TCFH3
TCFH2
TCFH1
TCFH0
TCFL
TCFL7
TCFL6
TCFL5
TCFL4
TCFL3
TCFL2
TCFL1
TCFL0
OCRFH
OCRFH7 OCRFH6 OCRFH5 OCRFH4 OCRFH3 OCRFH2 OCRFH1 OCRFH0
OCRFL
OCRFL7 OCRFL6 OCRFL5 OCRFL4 OCRFL3 OCRFL2 OCRFL1 OCRFL0
ADRR
ADR9
ADR8
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
ADR0






AMR
CKS
TRGE


CH3
CH2
CH1
CH0
ADSR
ADSF







PMR1






AEVL
AEVH
I/O ports
OSCCR





IRQAECF OSCF
—
Clock pulse
A/D
converter
generator
Rev. 3.00 Aug 23, 2006 Page 495 of 616
REJ09B0182-0300
Section 24 List of Registers
Register
Abbreviation Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
I/O ports
PMR3







TMOW
PMR4





TMOFH
TMOFL
TMIF
PMR5
WKP7
WKP6
WKP5
WKP4
WKP3
WKP2
WKP1
WKP0
PMR9





IRQ4
PWM2
PWM1
PMRB



ADTSTCHG

IRQ3
IRQ1
IRQ0
PWCR22





PWDR2


PWCR22 PWCR21 PWCR20 14-bit
PWM
PWDR213 PWDR212 PWDR211 PWDR210 PWDR29 PWDR28
PWDR27 PWDR26 PWDR25 PWDR24 PWDR23 PWDR22 PWDR21 PWDR20
PWCR1



PWDR1


PWDR113 PWDR112 PWDR111 PWDR110 PWDR19 PWDR18


PWCR12 PWCR11 PWCR10
PWDR17 PWDR16 PWDR15 PWDR14 PWDR13 PWDR12 PWDR11 PWDR10
PDR1

P16
P15
P14
P13
P12
P11
P10
PDR3
P37
P36



P32
P31
P30
PDR4





P42
P41
P40
PDR5
P57
P56
P55
P54
P53
P52
P51
P50
PDR6
P67
P66
P65
P64
P63
P62
P61
P60
PDR7
P77
P76
P75
P74
P73
P72
P71
P70
PDR8
P87
P86
P85
P84
P83
P82
P81
P80
PDR9




P93
P92
P91
P90
PDRA




PA3
PA2
PA1
PA0
PDRB
PB7
PB6
PB5


PB2
PB1
PB0
PUCR1

PUCR16 PUCR15 PUCR14 PUCR13 PUCR12 PUCR11 PUCR10
PUCR3
PUCR37 PUCR36 
PUCR5
PUCR57 PUCR56 PUCR55 PUCR54 PUCR53 PUCR52 PUCR51 PUCR50




PUCR30
PUCR6
PUCR67 PUCR66 PUCR65 PUCR64 PUCR63 PUCR62 PUCR61 PUCR60
PCR1

PCR16
PCR15
PCR14
PCR13
PCR12
PCR11
PCR10
PCR3
PCR37
PCR36



PCR32
PCR31
PCR30
PCR4





PCR42
PCR41
PCR40
PCR5
PCR57
PCR56
PCR55
PCR54
PCR53
PCR52
PCR51
PCR50
PCR6
PCR67
PCR66
PCR65
PCR64
PCR63
PCR62
PCR61
PCR60
PCR7
PCR77
PCR76
PCR75
PCR74
PCR73
PCR72
PCR71
PCR70
Rev. 3.00 Aug 23, 2006 Page 496 of 616
REJ09B0182-0300
I/O ports
Section 24 List of Registers
Register
Abbreviation Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
I/O ports
PCR8
PCR87
PCR86
PCR85
PCR84
PCR83
PCR82
PCR81
PCR80
PCR9




PCR93
PCR92
PCR91
PCR90
PCRA




PCRA3
PCRA2 PCRA1
PCRA0
SYSCR1
SSBY
STS2
STS1
STS0
LSON
TMA3
MA1
MA0
SYSCR2



NESEL
DTON
MSON
SA1
SA0
IEGR
NMIEG
TMIFG
ADTRGNEG
IEG4
IEG3

IEG1
IEG0
IENR1
IENRTC

IENWP
IEN4
IEN3
IENEC2 IEN1
IEN0
IENR2
IENDT
IENAD
IENSAD

IENTFH
IENTFL 
IENEC
INTM






IRR1



IRR4
IRR3
IRREC2 IRRI1
IRR2
IRRDT
IRRAD
IRRSAD

IRRTFH IRRTFL 
IWPR
IWPF7
IWPF6
IWPF5
IWPF4
IWPF3
CKSTPR1
S4CKSTP*
CKSTPR2
ADBCKSTP TPUCKSTP IICCKSTP
Notes: 1.
2.
3.
4.
4
S31CKSTP
S32CKSTP
ADCKSTP
—
IWPF2
TFCKSTP
INTM1
PW2CKSTP AECCKSTP WDCKSTP PW1CKSTP
Interrupts
INTM0
IRRI0
IRREC
IWPF1
FROMCKSTP*
System
IWPF0
4
RTCCKSTP
System
LDCKSTP
AEC: Asynchronous event counter
WDT: Watchdog timer
LCD: LCD controller/driver
This bit is available only for the flash memory version. In the masked ROM version, this
bit is reserved.
Rev. 3.00 Aug 23, 2006 Page 497 of 616
REJ09B0182-0300
Section 24 List of Registers
24.3
Register States in Each Operating Mode
Register
Abbreviation
Reset
SCR4
Active
Sleep
Watch
Subactive Subsleep Standby
Module
Initialized 





SCR4
SCSR4
Initialized 





TDR4
Initialized 





RDR4
Initialized 





FLMCR1
Initialized 




Initialized ROM
FLMCR2
Initialized 





FLPWCR
Initialized 





EBR1
Initialized 




Initialized
FENR
Initialized 





TSTR
Initialized 





TSYR
Initialized 





TCR_1
Initialized 





TMDR_1
Initialized 





TIOR_1
Initialized 





TIER_1
Initialized 





TSR_1_
Initialized 





TCNT_1
Initialized 





TGRA_1
Initialized 





TGRB_1
Initialized 





TCR_2
Initialized 





TMDR_2
Initialized 





TIOR_2
Initialized 





TIER_2
Initialized 





TSR_2
Initialized 





TCNT_2
Initialized 





TGRA_2
Initialized 





TGRB_2
Initialized 





Rev. 3.00 Aug 23, 2006 Page 498 of 616
REJ09B0182-0300
TPU
TPU_1
TPU_2
Section 24 List of Registers
Register
Abbreviation
Reset
Active
Sleep
Watch
Subactive Subsleep Standby
Module
∆Σ A/D
converter
ADCR
Initialized 





ADSSR
Initialized 





ADDR







RTCFLG







RSECDR







RMINDR







RHRDR







RWKDR







RTCCR1







RTCCR2







SUB32CR
Initialized 





Clock pulse
generator
RTCCSR
Initialized 





RTC
ICCR1
Initialized 





IIC2
ICCR2
Initialized 





ICMR
Initialized 





ICIER
Initialized 





ICSR
Initialized 





SAR
Initialized 





ICDRT
Initialized 





ICDRR
Initialized 





IPRA
Initialized 





IPRB
Initialized 





IPRC
Initialized 





IPRD
Initialized 





IPRE
Initialized 





ABRKCR2
Initialized 





ABRKSR2
Initialized 





BAR2H
Initialized 





BAR2L
Initialized 





BDR2H







BDR2L







RTC
Interrupts
Address break
Rev. 3.00 Aug 23, 2006 Page 499 of 616
REJ09B0182-0300
Section 24 List of Registers
Register
Abbreviation
Reset
ECPWCR
Active
Sleep
Watch
Subactive Subsleep Standby
Module
Initialized 





AEC*1
ECPWDR
Initialized 





WEGR
Initialized 





Interrupts
SPCR
Initialized 





SCI3
AEGSR
Initialized 





AEC*1
ECCR
Initialized 





ECCSR
Initialized 





ECH
Initialized 





ECL
Initialized 





SMR3_1
Initialized 

Initialized 

Initialized SCI3_1
BRR3_1
Initialized 

Initialized 

Initialized
SCR3_1
Initialized 

Initialized 

Initialized
TDR3_1
Initialized 

Initialized 

Initialized
SSR3_1
Initialized 

Initialized 

Initialized
RDR3_1
Initialized 

Initialized 

Initialized
LPCR
Initialized 





LCR
Initialized 





LCR2
Initialized 





LTRMR
Initialized 





BGRMR
Initialized 





IrCR
Initialized 

Initialized 

Initialized IrDA
SMR3_2
Initialized 

Initialized 

Initialized SCI3_2
BRR3_2
Initialized 

Initialized 

Initialized
SCR3_2
Initialized 

Initialized 

Initialized
TDR3_2
Initialized 

Initialized 

Initialized
SSR3_2
Initialized 

Initialized 

Initialized
RDR3_2
Initialized 

Initialized 

Initialized
TMWD
Initialized 





TCSRWD1
Initialized 





TCSRWD2
Initialized 





TCWD
Initialized 





Rev. 3.00 Aug 23, 2006 Page 500 of 616
REJ09B0182-0300
LCD*3
WDT*2
Section 24 List of Registers
Register
Abbreviation
Reset
Active
Sleep
Watch
Subactive Subsleep Standby
Module
Timer F
TCRF
Initialized 





TCSRF
Initialized 





TCFH
Initialized 





TCFL
Initialized 





OCRFH
Initialized 





OCRFL
Initialized 





ADRR







AMR
Initialized 





ADSR
Initialized 





PMR1
Initialized 





PMR3
Initialized 





PMR4
Initialized 





PMR5
Initialized 





PMR9
Initialized 





PMRB
Initialized 





PWCR2
Initialized 





PWDR2
Initialized 





PWCR1
Initialized 





PWDR1
Initialized 





PDR1
Initialized 





I/O ports
OSCCR
Initialized 





Clock pulse
generator
PDR3
Initialized 





I/O ports
PDR4
Initialized 





PDR5
Initialized 





PDR6
Initialized 





PDR7
Initialized 





PDR8
Initialized 





PDR9
Initialized 





PDRA
Initialized 





PDRB
Initialized 





A/D converter
I/O ports
14-bit PWM
Rev. 3.00 Aug 23, 2006 Page 501 of 616
REJ09B0182-0300
Section 24 List of Registers
Register
Abbreviation
Reset
PUCR1
PUCR3
Active
Sleep
Watch
Subactive Subsleep Standby
Module
Initialized 





I/O ports
Initialized 





PUCR5
Initialized 





PUCR6
Initialized 





PCR1
Initialized 





PCR3
Initialized 





PCR4
Initialized 





PCR5
Initialized 





PCR6
Initialized 





PCR7
Initialized 





PCR8
Initialized 





PCR9
Initialized 





PCRA
Initialized 





SYSCR1
Initialized 





SYSCR2
Initialized 





IEGR
Initialized 





IENR1
Initialized 





IENR2
Initialized 





INTM
Initialized 





IRR1
Initialized 





IRR2
Initialized 





IWPR
Initialized 





CKSTPR1
Initialized 





CKSTPR2
Initialized 





Notes:  is not initialized.
1. AEC: Asynchronous event counter
2. WDT: Watchdog timer
3. LCD: LCD controller/driver
Rev. 3.00 Aug 23, 2006 Page 502 of 616
REJ09B0182-0300
System
Interrupts
System
Section 25 Electrical Characteristics
Section 25 Electrical Characteristics
25.1
Absolute Maximum Ratings for F-ZTAT Version
Table 25.1 lists the absolute maximum ratings.
Table 25.1 Absolute Maximum Ratings
Item
Symbol
Value
Unit Note
Power supply voltage
VCC
–0.3 to +4.3
V
Analog power supply voltage
AVCC
–0.3 to +4.3
V
DVCC
–0.3 to +4.3
V
Other than port B
Vin
–0.3 to VCC +0.3
V
Ports B0 to B2
AVin
–0.3 to AVCC + 0.3
V
Ports B5 to B7
DVin
–0.3 to DVCC + 0.3
V
Topr
–20 to +75
2
(regular specifications)*
°C
Input voltage
Operating temperature
*1
–40 to +85
2
(wide-range specifications)*
+75
3
(products shipped as chips)*
Storage temperature
Tstg
–55 to +125
°C
Notes: 1. Permanent damage may occur to the chip if absolute maximum ratings are exceeded.
Normal operation should be under the conditions specified in Electrical Characteristics.
Exceeding these values can result in incorrect operation and reduced reliability.
2. When the operating voltage (Vcc) for reading the flash memory is from 2.7 V to 3.6 V,
the operating temperature (Ta) for programming/erasing ranges from -20 to +75°C.
When the operating voltage (Vcc) for reading the flash memory is from 1.8 V to 3.6 V,
the operating temperature (Ta) for programming/erasing ranges from -20 to +50°C.
3. Power may be applied when the temperature is between –20 to +75°C.
Rev. 3.00 Aug 23, 2006 Page 503 of 616
REJ09B0182-0300
Section 25 Electrical Characteristics
25.2
Electrical Characteristics for F-ZTAT Version
25.2.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range are indicated by the shaded region in the figures.
(1)
Power Supply Voltage and Oscillation Frequency Range
38.4
fW (kHz)
fosc (MHz)
[10-MHz version]
10.0
32.768
4.2
2.0
1.8
2.7
3.6
VCC (V)
2.7
· Active (high-speed) mode
· All operating mode
· Sleep (high-speed) mode
· Refer to no. 2 in the note.
· Refer to no.1 in the note.
[4-MHz version]
fosc (MHz)
1.8
10.0
4.2
2.0
1.8
2.7
3.6
VCC (V)
· Active (high-speed) mode
· Sleep (high-speed) mode
· Refer to no.1 in the note.
Rev. 3.00 Aug 23, 2006 Page 504 of 616
REJ09B0182-0300
3.6
VCC (V)
Notes: 1.The fosc values are those when a resonator
is used; when an external clock is used, the
minimum value of fosc is 2 MHz.
2. When a resonator is used, hold VCC at
2.2 V to 3.6 V from power-on until the
oscillation settling time has elapsed.
Section 25 Electrical Characteristics
(2)
Power Supply Voltage and Operating Frequency Range
φ (MHz)
[10-MHz version]
19.2
10
16.384
4.2
2.0
(1.0)
2.7
3.6
VCC (V)
· Active (high-speed) mode
· Sleep (high-speed) mode (except CPU)
· Refer to no.1 in the note.
9.6
φ SUB (kHz)
1.8
8.192
φ (MHz)
4.8
1250
4.096
525
1.8
2.7
31.25
(15.625)
1.8
2.7
3.6
VCC (V)
· Active (medium-speed) mode
· Sleep (medium-speed) mode
(except A/D converter)
· Refer to no.2 in the note.
· Subactive mode
· Subsleep mode (except CPU)
· Watch mode (except CPU)
Notes: 1. The value in parentheses is the minimum operating
frequency when an external clock is input. When
using a resonator, the minimum operating frequency
(φ ) is 2 MHz
[4-MHz version]
φ (MHz)
3.6
VCC (V)
10
2. The value in parentheses is the minimum operating
frequency when an external clock is input. When
using a resonator, the minimum operating frequency
(φ ) is 31.25 kHz.
4.2
2.0
(1.0)
1.8
2.7
3.6
VCC (V)
φ (MHz)
· Active (high-speed) mode
· Sleep (high-speed) mode (except CPU)
· Refer to no.1 in the note.
1250
525
31.25
(15.625)
1.8
2.7
3.6
VCC (V)
· Active (medium-speed) mode
· Sleep (medium-speed) mode
(except A/D converter)
· Refer to no.2 in the note.
Rev. 3.00 Aug 23, 2006 Page 505 of 616
REJ09B0182-0300
Section 25 Electrical Characteristics
(3)
Analog Power Supply Voltage and A/D Converter Operating Frequency Range
[10-MHz version]
φ (MHz)
φ (MHz)
10.0
4.2
2.0
(1.0)
1.8
2.7
1250
31.25
(15.625)
3.6
AVCC(V)
2.7
· Active (high-speed) mode
· Active (medium-speed) mode
· Sleep (high-speed) mode
· Sleep (medium-speed) mode
· Refer to no.1 in the note.
· Refer to no.2 in the note.
3.6
AVCC(V)
[4-MHz version]
φ (MHz)
φ (MHz)
10.0
4.2
2.0
(1.0)
1.8
2.7
525
31.25
(15.625)
3.6
AVCC(V)
2.7
· Active (high-speed) mode
· Active (medium-speed) mode
· Sleep (high-speed) mode
· Sleep (medium-speed) mode
· Refer to no.1 in the note.
· Refer to no.2 in the note.
Notes: 1. The minimum operating frequency (φ) is 2 MHz when using a resonator;
and 1 MHz when using an external clock.
2. The minimum operating frequency (φ) is 31.25 kHz when using a resonator;
and 15.625 kHz when using an external clock.
Rev. 3.00 Aug 23, 2006 Page 506 of 616
REJ09B0182-0300
3.6
AVCC(V)
Section 25 Electrical Characteristics
25.2.2
DC Characteristics
Table 25.2 lists the DC characteristics.
Table 25.2 DC Characteristics
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless
otherwise specified.
Values
Item
Input high
voltage
Symbol
Applicable Pins
VIH
RES, NMI* , WKP0
Test Condition
Min.
Typ.
Max.
Unit
0.9VCC
—
VCC + 0.3
V
IRQ0, IRQ1, IRQ3
0.9VCC
—
AVCC + 0.3
RXD32, RXD31
0.8VCC
—
VCC + 0.3
OSC1
0.9VCC
—
VCC + 0.3
0.9VCC
—
VCC + 0.3
0.8VCC
—
VCC + 0.3
PB0 to PB2
0.8VCC
—
AVCC + 0.3
PB5 to PB7
0.8VCC
—
DVCC + 0.3
IRQAEC
0.9VCC
—
VCC + 0.3
3
Notes
to WKP7, IRQ4,
AEVL, AEVH,
TMIF, ADTRG,
SCK32, SCK31,
SCK4
X1
P10 to P16,
VCC = 2.7 to 3.6 V
P30 to P32,
P36, P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
P90 to P93,
PA0 to PA3,
TCLKA, TCLKB,
TCLKC, TIOCA1,
TIOCA2, TIOCB1,
TIOCB2, SCL, SDA
Rev. 3.00 Aug 23, 2006 Page 507 of 616
REJ09B0182-0300
Section 25 Electrical Characteristics
Applicable
Item
Input low
Symbol
Pins
VIL
RES, NMI* ,
Values
Test Condition
Min.
Typ.
Max.
Unit
–0.3
—
0.1VCC
V
RXD32, RXD31
–0.3
—
0.2VCC
OSC1
–0.3
—
0.1VCC
–0.3
—
0.1VCC
–0.3
—
0.2VCC
VCC – 1.0
—
—
VCC – 0.3
—
—
VCC – 1.0
—
—
VCC – 0.3
—
—
3
WKP0 to WKP7,
voltage
IRQ0, IRQ1, IRQ3,
IRQ4, IRQAEC,
AEVL, AEVH,
TMIF, ADTRG,
SCK32, SCK31,
SCK4
X1
VCC = 2.7 to 3.6 V
P10 to P16,
P30 to P32,
P36, P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
P90 to P93,
PA0 to PA3,
TCLKA, TCLKB,
TCLKC, TIOCA1,
TIOCB1, TIOCA2,
TIOCB2, SCL,
SDA,
PB0 to PB2,
PB5 to PB7
Output high
VOH
voltage
P10 to P16,
–IOH = 1.0 mA
P30 to P32,
VCC = 2.7 to 3.6 V
P36, P37,
–IOH = 0.1 mA
P50 to P57,
VCC = 1.8 to 3.6 V
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
P90 to P93
IOH = 1.0 mA
VCC = 2.7 to 3.6 V
IOH = 0.1 mA
Rev. 3.00 Aug 23, 2006 Page 508 of 616
REJ09B0182-0300
V
Notes
Section 25 Electrical Characteristics
Applicable
Values
Item
Symbol
Pins
Test Condition
Min.
Typ.
Max.
Unit
Output low
VOL
P10 to P16,
IOL = 0.4 mA
—
—
0.5
V
IOL = 15 mA,
—
—
1.0
—
—
0.5
IOL = 8 mA
—
—
0.5
VCC = 2.0 to 3.6 V
—
—
0.4
—
—
0.2Vcc
—
—
1.0
—
—
1.0
30
—
180
voltage
Notes
P30 to P32,
P36, P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
P90 to P93
VCC = 2.7 to 3.6 V
IOL = 10 mA,
VCC = 2.2 to 3.6 V
SCL, SDA
IOL = 3.0 mA
VCC = 1.8 to 2.0 V
IOL = 3.0 mA
NMI*3 OSC1, X1,
VIN = 0.5 V to
leakage
P10 to P16,
VCC – 0.5 V
current
P30 to P32,
Input/output
| IIL |
µA
P36, P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
IRQAEC,
PA0 to PA3,
P90 to P93
Pull-up MOS
current
–Ip
PB0 to PB2,
VIN = 0.5 V to
PB5 to PB7
AVCC – 0.5 V
P10 to P16,
VCC = 3.0 V,
P30,
VIN = 0 V
µA
P36, P37,
P50 to P57,
P60 to P67
Rev. 3.00 Aug 23, 2006 Page 509 of 616
REJ09B0182-0300
Section 25 Electrical Characteristics
Applicable
Item
Input
capacitance*
Active mode
Values
Symbol
Pins
Test Condition
Min.
Typ.
Max.
Unit
CIN
All input pins
f = 1 MHz,
—
—
15.0
pF
except power
VIN =0 V,
supply pin
Ta = 25°C
VCC
Active (high-speed)
—
1.1
—
mA
3
IOPE1
current
consumption
Notes
*1*2*4
mode,
Max.
VCC = 1.8 V,
guideline =
fOSC = 2 MHz
1.1 × typ.
Active (high-speed)
—
3.0
*1*2
—
mode,
Max.
VCC = 3.0 V,
guideline =
fOSC = 4 MHz
1.1 × typ.
Active (high-speed)
—
6.6
10
—
0.4
—
*1*2
mode,
VCC = 3.0 V,
fOSC = 10 MHz
IOPE2
VCC
Active (medium-
mA
*1*2*4
speed) mode,
Max.
VCC = 1.8 V,
guideline =
fOSC = 2 MHz,
1.1 × typ.
φosc/64
Active (medium-
—
0.7
1 2
—
**
speed) mode,
Max.
VCC = 3.0 V,
guideline =
fOSC = 4 MHz,
1.1 × typ.
φosc/64
Active (medium-
—
1.1
1.8
—
0.7
—
1 2
**
speed) mode,
VCC = 3.0 V,
fOSC = 10 MHz,
φosc/64
Sleep mode
ISLEEP
current
VCC
VCC= 1.8 V,
fOSC= 2 MHz
mA
1 2 4
***
Max.
consumption
guideline =
1.1 × typ.
VCC= 3.0 V,
—
1.7
—
fOSC= 4 MHz
*1*2
Max.
guideline =
1.1 × typ.
VCC= 3.0 V,
fOSC= 10 MHz
Rev. 3.00 Aug 23, 2006 Page 510 of 616
REJ09B0182-0300
—
3.5
5.0
*1*2
Section 25 Electrical Characteristics
Applicable
Values
Item
Symbol
Pins
Test Condition
Min.
Typ.
Max.
Unit
Notes
Subactive
mode current
consumption
ISUB
VCC
VCC = 1.8 V,
LCD on, 32-kHz
crystal resonator
(φSUB = φw/2)
—
5.9
—
µA
**
Reference
value
VCC = 2.7 V,
LCD on, 32-kHz
crystal resonator
(φSUB = φw/8)
—
10
—
**
Reference
value
VCC = 2.7 V,
LCD on, 32-kHz
crystal resonator
(φSUB = φw/2)
—
25
50
**
1 2
1 2
1 2
1 2
Subsleep
mode current
consumption
ISUBSP
VCC
VCC = 2.7 V,
LCD on, 32-kHz
crystal resonator
(φSUB = φw/2)
—
4.8
16.0
µA
**
Watch mode
current
consumption
IWATCH
VCC
VCC = 1.8 V,
Ta = 25°C,
32-kHz crystal
resonator,
LCD not used
—
0.4
—
µA
*1*2*4
Reference
value
VCC = 2.7 V,
32-kHz crystal
resonator,
LCD not used
—
2.0
6.0
VCC = 1.8 V,
Ta = 25°C,
32-kHz crystal
resonator
not used
—
0.4
—
VCC = 3.0 V,
Ta = 25°C,
32-kHz crystal
resonator not used
—
0.6
—
*1*2
Reference
value
32-kHz crystal
resonator not used
—
1.0
5.0
*1*2
Vcc = 3.0 V
32KSTOP = 1
—
0.3
—
*1*2
Reference
value
1.5
—
—
Standby mode ISTBY
current
consumption
RAM data
retaining
voltage
VRAM
VCC
VCC
*1*2
µA
*1*2
Reference
value
V
Rev. 3.00 Aug 23, 2006 Page 511 of 616
REJ09B0182-0300
Section 25 Electrical Characteristics
Applicable
Item
Symbol
Pins
Allowable
output low
current
(per pin)
IOL
Allowable
∑ IOL
output low
Test Condition
Min.
Typ.
Max.
Unit
Output pins
except port 9
—
—
0.5
mA
P90 to P93
—
—
15.0
Output pins
—
—
20.0
Notes
mA
except port 9
current (total)
Allowable
Values
–IOH
Port 9

—
—
60.0
All output pins
VCC = 2.7 V to 3.6 V
—
—
2.0
VCC = 1.8 V to 3.6 V
—
—
0.2
—
—
10.0
mA
output high
current
(per pin)
∑ – IOH
Allowable
All output pins
mA
output high
current (total)
Notes: 1. Pin states during current measurement.
Mode
Active (high-speed)
mode (IOPE1)
RES
Pin
Internal State
Other
Pins
LCD Power
Supply
VCC
Only CPU operates
VCC
Halted
On-chip WDT oscillator is off
System clock oscillator:
crystal resonator
Subclock oscillator:
Pin X1 = GND
Active (medium-speed)
mode (IOPE2)
Sleep mode
Oscillator Pins
VCC
Only on-chip timers operate
VCC
Halted
VCC
Halted
VCC
Halted
VCC
Halted
VCC
Halted
On-chip WDT oscillator is off
Subactive mode
VCC
Only CPU operates
On-chip WDT oscillator is off
Subsleep mode
VCC
Only on-chip timers operate,
CPU stops
System clock oscillator:
crystal resonator
Subclock oscillator:
crystal resonator
On-chip WDT oscillator is off
Watch mode
VCC
Only time base operates, CPU
stops
On-chip WDT oscillator is off
TCSRWD1 (WDON) = 0
Standby mode
VCC
CPU and timers both stop
On-chip WDT oscillator is off
TCSRWD1 (WDON) = 0
2. Excludes current in pull-up MOS transistors and output buffers.
3. Except for the package for the TLP-85V.
4. Supported only by the 4MHz version.
Rev. 3.00 Aug 23, 2006 Page 512 of 616
REJ09B0182-0300
System clock oscillator:
crystal resonator
Subclock oscillator:
Pin X1 = GND
(32KSTOP = 0)
Section 25 Electrical Characteristics
25.2.3
AC Characteristics
Table 25.3 lists the control signal timing, table 25.4 lists the serial interface timing, and table 25.5
2
lists the I C bus interface timing.
Table 25.3 Control Signal Timing
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless
otherwise specified.
Applicable
Values
Reference
Item
Symbol
Pins
Test Condition
Min.
Typ.
Max.
Unit
System clock
fOSC
OSC1, OSC2
VCC = 2.7 to 3.6 V
2.0
—
10.0
MHz
VCC = 1.8 to 3.6 V
2.0
—
4.2
VCC = 2.7 to 3.6 V
100
—
500
Figure
oscillation frequency
OSC clock (φOSC) cycle tOSC
OSC1, OSC2
time
ns
VCC = 1.8 to 3.6 V
238
—
Figure 25.2
*2
(1000)
500
(1000)
System clock (φ) cycle tcyc
time
Subclock oscillation
fW
X1, X2
1
—
64
tOSC
—
—
64
µs
—
32.768
—
kHz
frequency
or 38.4
Watch clock (φW) cycle tW
X1, X2
—
time
Subclock (φSUB) cycle
30.5 or —
µs
Figure 25.2
*1
26.0
tsubcyc
2
—
8
tW
2
—
—
tcyc
time
Instruction cycle time
tsubcyc
Oscillation stabilization trc
time
OSC1, OSC2
Crystal resonator
—
0.8
2.0
—
1.2
3
—
20
45
—
80
—
—
—
50
ms
(VCC = 2.7 to 3.6 V)
Crystal resonator
(VCC = 2.2 to 3.6 V)
Ceramic resonator
µs
(VCC = 2.2 to 3.6 V)
Ceramic resonator
(other than above)
Other than above
ms
Rev. 3.00 Aug 23, 2006 Page 513 of 616
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Section 25 Electrical Characteristics
Applicable
Item
Symbol
Oscillation stabilization trc
tCPH
Reference
Pins
Test Condition
Min.
Typ.
Max.
Unit
Figure
X1, X2
VCC = 2.2 to 3.6 V
—
—
2.0
s
Figure 5.7
Other than above
—
4
—
VCC = 2.7 to 3.6 V
40
—
—
ns
Figure 25.2
VCC = 1.8 to 3.6 V
95
—
—
—
15.26
—
µs
ns
time
External clock high
Values
OSC1
width
X1
or
13.02
External clock low
tCPL
OSC1
VCC = 2.7 to 3.6 V
40
—
—
VCC = 1.8 to 3.6 V
95
—
—
—
15.26
—
µs
ns
Figure 25.2
width
X1
or
13.02
External clock F time
tCPr
OSC1
VCC = 2.7 to 3.6 V
—
—
10
VCC = 1.8 to 3.6 V
—
—
24
X1
External clock fall time tCPf
—
—
55.0
ns
VCC = 2.7 to 3.6 V
—
—
10
ns
VCC = 1.8 to 3.6 V
—
—
24
X1
—
—
55.0
ns
OSC1
Figure 25.2
Figure 25.2
RES pin low width
tREL
RES
10
—
—
tcyc
Figure
25.3*3
Input pin high width
tIH
IRQ0, IRQ1,
2
—
—
tcyc
Figure 25.4
NMI,
IRQ3, IRQ4,
tsubcyc
IRQAEC,
WKP0 to WKP7,
TMIF, ADTRG
AEVL, AEVH
VCC = 2.7 to 3.6 V
VCC = 1.8 to 3.6 V
tTCKWH
TCLKA, TCLKB, Single edge
specified
TCLKC,
50
—
—
110
—
—
1.5
—
—
2.5
—
—
TIOCA1,
TIOCB1,
TIOCA2,
TIOCB2
Both edges
specified
Rev. 3.00 Aug 23, 2006 Page 514 of 616
REJ09B0182-0300
ns
tcyc
Figure 25.7
Section 25 Electrical Characteristics
Applicable
Item
Symbol
Pins
Input pin low width
tIL
IRQ0, IRQ1,
Values
Test Condition
Reference
Min.
Typ.
Max.
Unit
Figure
2
—
—
tcyc
Figure 25.4
NMI,
tsubcyc
IRQ3, IRQ4,
IRQAEC,
WKP0 to WKP7,
TMIF, ADTRG
AEVL, AEVH
tTCKWL
VCC = 2.7 to 3.6 V
50
—
—
VCC = 1.8 to 3.6 V
110
—
—
1.5
—
—
2.5
—
—
TCLKA, TCLKB, Single edge
TCLKC,
ns
tcyc
Figure 25.7
specified
TIOCA1,
TIOCB1,
TIOCA2,
TIOCB2
Both edges
specified
Notes: 1. Selected with the SA1 and SA0 bits in the system control register 2 (SYSCR2).
2. The value in parentheses is tOSC (max.) when an external clock is used.
3. For details on the power-on reset characteristics, refer to table 25.9 and figure 25.1.
Rev. 3.00 Aug 23, 2006 Page 515 of 616
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Section 25 Electrical Characteristics
Table 25.4 Serial Interface Timing
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless
otherwise specified.
Values
Item
Input clock
cycle
Symbol
Asynchronous
Test Condition
tscyc
Clocked
Reference
Min.
Typ.
Max.
Unit
Figure
4
—
—
tcyc or
Figure 25.5
6
—
—
t
subcyc
synchronous
Input clock pulse width
tSCKW
0.4
—
0.6
Transmit data delay time
tTXD
—
—
1
(clocked synchronous)
Receive data setup time
tscyc
Figure 25.5
tcyc or
Figure 25.6
tsubcyc
tRXS
238
—
—
ns
Figure 25.6
—
—
ns
Figure 25.6
(clocked synchronous)
VCC = 2.7 to 3.6 V
Receive data hold time
tRXH
100
238
(clocked synchronous)
VCC = 2.7 to 3.6 V
Rev. 3.00 Aug 23, 2006 Page 516 of 616
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100
Section 25 Electrical Characteristics
2
Table 25.5 I C Bus Interface Timing
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = 0.0 V,
Ta = –20 to +75°C, unless otherwise specified.
Test
Item
Symbol
SCL input cycle time
Reference
Min.
Typ.
Max.
Unit
Figure
tSCL
12tcyc + 600
—
—
ns
Figure 25.8
SCL input high width
tSCLH
3tcyc + 300
—
—
ns
SCL input low width
tSCLL
5tcyc + 300
—
—
ns
SCL and SDA input fall time tSf
—
—
300
ns
SCL and SDA input spike
pulse removal time
tSP
—
—
1tcyc
ns
SDA input bus-free
time
tBUF
5tcyc
—
—
ns
Start condition input hold
time
tSTAH
3tcyc
—
—
ns
Retransmission start
condition input setup time
tSTAS
3tcyc
—
—
ns
Setup time for stop condition tSTOS
input
3tcyc
—
—
ns
Data-input setup time
tSDAS
1tcyc + 20
—
—
ns
Data-input hold time
tSDAH
0
—
—
ns
Capacitive load of
SCL and SDA
Cb
0
—
400
pF
SCL and SDA output fall
time
tSf
—
—
300
ns
25.2.4
Condition
Values
A/D Converter Characteristics
Table 25.6 lists the A/D converter characteristics.
Rev. 3.00 Aug 23, 2006 Page 517 of 616
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Section 25 Electrical Characteristics
Table 25.6 A/D Converter Characteristics
VCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless otherwise specified.
Applicable
Item
Symbol
Pins
Values
Test Condition
Min.
Typ.
Max.
Unit
Notes
*
Analog power
supply voltage
AVCC
AVCC
1.8
—
3.6
V
Analog input
voltage
AVIN
AN0 to AN2
–0.3
—
AVCC +
0.3
V
Analog power
supply current
AIOPE
AVCC
—
—
1.0
mA
AISTOP1
AVCC
—
600
—
µA
AVCC = 3.0 V
1
2
*
Reference
value
AISTOP2
AVCC
—
—
5
µA
Analog input
capacitance
CAIN
AN0 to AN2
—
—
15.0
pF
Allowable signal
source
impedance
RAIN
—
—
10.0
kΩ
—
—
10
Bits
AVCC = 2.7 V to 3.6 V
VCC = 2.7 V to 3.6 V
—
—
±3.5
LSB
AVCC = 2.0 V to 3.6 V
VCC = 2.0 V to 3.6 V
—
—
±5.5
Other than above
—
—
±7.5
—
—
±0.5
LSB
AVCC = 2.7 V to 3.6 V
VCC = 2.7 V to 3.6 V
—
—
±4.0
LSB
AVCC = 2.0 V to 3.6 V
VCC = 2.0 V to 3.6 V
—
—
±6.0
Other than above
—
—
±8.0
AVCC = 2.7 V to 3.6 V
VCC = 2.7 V to 3.6 V
6.2
—
124
AVCC = 2.0 V to 3.6 V
VCC = 2.0 V to 3.6 V
14.7
—
124
Other than above
31
—
124
Resolution (data
length)
Nonlinearity error
Quantization
error
Absolute
accuracy
Conversion time
3
*
*4
*4
µs
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at a reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
4. Conversion time = 31 µs.
Rev. 3.00 Aug 23, 2006 Page 518 of 616
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Section 25 Electrical Characteristics
25.2.5
∆Σ A/D Converter Characteristics
Table 25.7 lists the ∆Σ A/D converter characteristics.
Table 25.7 ∆Σ A/D Converter Characteristics
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless
otherwise specified.
Values
Applicable
Item
Symbol
Pins
Analog power
DVcc
DVcc
Test Condition
supply voltage
Analog power
Min.
Typ.
Max.
Unit
Notes
2.2/

3.6
V
*1*4
2.0

mA
2.7
DIOPE
DVcc
supply current
PGA not used,

BGR = OFF,
Reference
value
DVcc = 3.0 V,
DISTOP1
DVcc
fOVS = 2.0 MHz

0.1

µA
*2
Reference
value
DISTOP2

DVcc
0.1

µA
*3
Reference
value
Resolution
Oversampling
fOVS
DVcc = 2.2 to 3.6 V,
14
14
14
Bits
0.25

4.2
MHz
0.25

10
MHz
0.78

13.125
kHz
0.78

31.25
kHz
76.19

1280
µs
32.0

1280
µs
—
3.0
—
LSB
—
-7.0
—
Vcc = 2.2 to 3.6 V
frequency
DVcc = 2.7 to 3.6 V,
Vcc = 2.7 to 3.6 V
Sampling
frequency
fS
DVcc = 2.2 to 3.6 V,
Vcc = 2.2 to 3.6 V
DVcc = 2.7 to 3.6 V,
Vcc = 2.7 to 3.6 V
Conversion speed
DVcc = 2.2 to 3.6 V,
Vcc = 2.2 to 3.6 V
DVcc = 2.7 to 3.6 V,
Vcc = 2.7 to 3.6 V
Integral lineality
PGA bypass
error
(DVcc = 3.0 V,
Vref = 2.7 V, conversion
speed = 32 µs)*7
Rev. 3.00 Aug 23, 2006 Page 519 of 616
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Section 25 Electrical Characteristics
Values
Applicable
Item
Symbol
Pins
Test Condition
Min.
Typ.
Max.
Unit
Differential
PGA bypass
—
1.3
—
LSB
lineality error
(DVcc = 3.0 V,
—
-0.8
—
—
10
—
mV
—
28.0
—
mV
—
1/3
—
V/V
—
1
—
V/V
—
2
—
V/V
—
4
—
V/V
—
16
—
mV
—
-4
—
mV
—
-8
—
mV
—
-18
—
mV
REF
—
1.17
—
V
Vref
0.2 DVcc
—
0.9 DVcc
V
Vref
—
18
—
kΩ
Vref = 2.7 V, conversion
speed = 32 µs)*7
Offset error
PGA bypass
Notes
(DVcc = 3.0 V,
Vref = 2.7 V, conversion
speed = 32 µs)*7
Full scale error
PGA bypass
(DVcc = 3.0 V,
Vref = 2.7 V, conversion
speed = 32 µs)*
7
PGA gain
PGA gain error
Tad
PGA = 1/3,
DVcc = 3.0 V
PGA = 1,
DVcc = 3.0 V
PGA = 2,
DVcc = 3.0 V
PGA = 4,
DVcc = 3.0 V
Internal reference
voltage
External
reference voltage
Vref–GND
RVref
resistance
REF
Rev. 3.00 Aug 23, 2006 Page 520 of 616
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*5*6
Section 25 Electrical Characteristics
Values
Applicable
Item
Symbol
Pins
Test Condition
Min.
Typ.
Max.
Unit
Analog data input
Ain
Ain1, Ain2
PGA = 1/3
0.6
—
2.7 Vref
V
Notes
(2.7 Vref <
voltage
DVcc)
2.7 REF
(2.7 REF
< DVcc)
PGA = 1, bypass
0.2
—
Vref
V
REF
PGA = 2
0.1
—
0.5 Vref
V
0.5 REF
PGA = 4
0.05
—
0.25 Vref
V
0.25 REF
Operating
Ta
0
—
50
°C
temperature
Notes: 1. Set DVcc = Vcc when the ∆Σ A/D converter is not used.
2. DISTOP1 is the current in active and sleep modes while the ∆Σ A/D converter is idle.
3. DISTOP2 is the current at a reset and in standby, watch, subactive, and subsleep modes
while the ∆Σ A/D converter is idle.
4. Minimum values are 2.2 V and 2.7 V for the 4 MHz version and 10 MHz version,
respectively. DVcc should be connected to Vcc when the ∆Σ A/D converter is not used.
5. BGR stabilization time = 10 µs (Ta = 25°C, Vcc = 3.0 V)
The BGR stabilization time is started after setting bit 7 (BTRSTPN) in BGR control
register (BGRMR) to 1.
6. Before using the system, the internal reference value must be tested because there is
dispersion in sample data.
7. This is the value when the BGR is not used.
Rev. 3.00 Aug 23, 2006 Page 521 of 616
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Section 25 Electrical Characteristics
25.2.6
LCD Characteristics
Table 25.8 shows the LCD characteristics.
Table 25.8 LCD Characteristics
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless
otherwise specified.
Values
Applicable
Item
Symbol
Pins
Test Condition
Min.
Typ.
Max.
Unit
Notes
Segment driver drop
VDS
SEG1 to
ID = 2 µA
—
—
0.6
V
*
SEG32
V1 = 2.7 V to 3.6 V
COM1 to
ID = 2 µA
—
—
0.3
V
*1
COM4
V1 = 2.7 V to 3.6 V
1.5
3.0
7.0
MΩ
2.2
—
3.6
V
*2
voltage
Common driver drop
VDC
voltage
LCD power supply
RLCD
Between V1 and VSS
1
split-resistance
LCD display voltage
VLCD
V1
V3 power supply
VLCD3
V3
Between V3 and VSS
0.9
1.0
1.1
V
*3*4
VLCD2
V2
Between V2 and VSS
—
2.0
—
V
*3*4
—
V
*3*4
—
µA
voltage
V2 power supply
(VLCD3 × 2)
voltage
V1 power supply
VLCD1
V1
Between V1 and VSS
—
3-V constant voltage
3.0
(VLCD3 × 3)
voltage
ILCD
Vcc
LCD power supply
circuit current
Vcc = 3.0 V
Booster clock:
—
20
Reference
value*4*5
125 kHz
consumption
Notes: 1. The voltage drop from power supply pins V1, V2, V3, and VSS to each segment pin or
common pin.
2. When the LCD display voltage is supplied from an external power source, ensure that
the following relationship is maintained: V1 ≥ V2 ≥ V3 ≥ VSS.
3. The value when the LCD power supply split-resistor is separated and 3-V constant
voltage power supply circuit is driven.
4. For details on the register (BGRMR) setting range when the voltage of the V3 pin is set
to 1.0 V, refer to section 20.3.5, BGR Control Register (BGRMR).
5. Includes the current consumption of the band-gap reference circuit (BGR) (operation).
Rev. 3.00 Aug 23, 2006 Page 522 of 616
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Section 25 Electrical Characteristics
25.2.7
Power-On Reset Circuit Characteristics
Table 25.9 lists the power-on reset circuit characteristics.
Table 25.9 Power-On Reset Circuit Characteristics
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V,
Ta = −20 to +75°C (regular specifications), Ta = −40 to +85°C (wide-range specifications), unless
otherwise specified.
Values
Item
Symbol
Reset voltage
V_rst
Test Condition
Power supply rise time t_vtr
Reference
Min.
Typ.
Max.
Unit
Figure
0.7Vcc
0.8Vcc
0.9Vcc
V
Figure 25.1
The Vcc rise time should be shorter than half the
RES rise time.
Reset count time
t_out
Count start time
t_cr
0.8
—
µs
8.0
Adjustable by the value of the external capacitor
of the RES pin.
On-chip pull-up
Rp
Vcc = 3.0 V
60
100
—
kΩ
Figure 22.1
resistance
25.2.8
Watchdog Timer Characteristics
Table 25.10 Watchdog Timer Characteristics
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V,
Ta = −20 to +75°C (regular specifications), Ta = −40 to +85°C (wide-range specifications),
unless otherwise specified.
Applicable
Item
Symbol
On-chip oscillator
tovf
Pins
Values
Test Condition
Min.
Typ.
Max.
Unit
0.2
0.4
—
s
Notes
overflow time
Rev. 3.00 Aug 23, 2006 Page 523 of 616
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Section 25 Electrical Characteristics
25.2.9
Flash Memory Characteristics Preliminary

Table 25.11 lists the flash memory characteristics.
Table 25.11 Flash Memory Characteristics
Condition A:
AVCC = 2.7 V to 3.6 V, DVCC = 2.7 V to 3.6 V, VSS = AVSS = 0.0 V, VCC = 2.7 V to 3.6 V (operating
voltage range in reading), VCC = 3.0 V to 3.6 V (operating voltage range in
programming/erasing), Ta = -20 to +75°C (operating temperature range in
programming/erasing: regular specifications, wide-range specifications, products shipped
as chips)
Condition B:
AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, VCC = 1.8 V to 3.6 V (operating
voltage range in reading), VCC = 3.0 V to 3.6 V (operating voltage range in
programming/erasing), Ta = -20 to +50°C (operating temperature range in
programming/erasing: regular specifications, wide-range specifications)
Test
Item
Symbol
Min.
Typ.
Max.
Unit
Programming time (per 128 bytes)*1*2*4
tP
—
7
200
ms
Erase time (per block)*1*3*6
tE
—
100
1200
ms
Maximum number of reprogrammings
NWEC
1000*8*11
10000*9 —
100*8*12
10000*9 —
tDRP
10*10
—
—
Years
µs
Data retention time
Programming
Wait time after SWE bit setting*
1
Condition
Values
Times
x
1
—
—
Wait time after PSU bit setting*1
y
50
—
—
µs
Wait time after P bit setting*1*4
z1
1≤n≤6
28
30
32
µs
z2
7 ≤ n ≤ 1000
198
200
202
µs
z3
Additionalprogramming
8
10
12
µs
α
5
—
—
µs
1
Wait time after PSU bit clear*
β
5
—
—
µs
Wait time after PV bit setting*1
γ
4
—
—
µs
Wait time after dummy write*1
ε
2
—
—
µs
Wait time after PV bit clear*
η
2
—
—
µs
Wait time after SWE bit clear*1
θ
100
—
—
µs
Maximum programming count*1*4*5
N
—
—
1000
Times
Wait time after P bit clear*1
1
Rev. 3.00 Aug 23, 2006 Page 524 of 616
REJ09B0182-0300
Section 25 Electrical Characteristics
Test
Item
Min.
Typ.
Max.
Unit
x
Symbol
1
—
—
µs
y
100
—
—
µs
z
10
—
100
ms
α
10
—
—
µs
1
β
10
—
—
µs
1
γ
20
—
—
µs
ε
2
—
—
µs
Wait time after EV bit clear*
η
4
—
—
µs
Wait time after SWE bit clear*1
θ
100
—
—
µs
N
—
—
120
Times
Wait time after SWE bit setting*1
Erase
Values
1
Wait time after ESU bit setting*
1
Wait time after E bit setting* *
Wait time after E bit clear*
6
1
Wait time after ESU bit clear*
Wait time after EV bit setting*
Wait time after dummy write*1
1
1
6 7
Maximum erase count* * *
Condition
Notes: 1.
2.
Make the time settings in accordance with the program/erase algorithms.
The programming time for 128 bytes. (Indicates the total time for which the P bit in the
flash memory control register 1 (FLMCR1) is set. The program-verify time is not
included.)
3. The time required to erase one block. (Indicates the total time for which the E bit in the
flash memory control register 1 (FLMCR1) is set. The erase-verify time is not
included.)
4. Programming time maximum value (tP (max.)) = wait time after P bit setting (z) ×
maximum number of programmings (N)
5. Set the maximum number of programmings (N) according to the actual set values of
z1, z2, and z3, so that it does not exceed the programming time maximum value (tP
(max.)). The wait time after P bit setting (z1, z2) should be changed as follows
according to the value of the number of programmings (n).
Number of programmings (n)
1≤n≤6
z1 = 30 µs
7 ≤ n ≤ 1000 z2 = 200 µs
6. Erase time maximum value (tE (max.)) = wait time after E bit setting (z) × maximum
number of erases (N)
7. Set the maximum number of erases (N) according to the actual set value of (z), so that
it does not exceed the erase time maximum value (tE (max.)).
8. The minimum number of times in which all characteristics are guaranteed following
reprogramming. (The guarantee covers the range from 1 to the minimum value.)
9. Reference value at 25°C. (Guideline showing number of reprogrammings over which
functioning will be retained under normal circumstances.)
10. Data retention characteristics within the range indicated in the specifications, including
the minimum value for reprogrammings.
11. Applies to an operating voltage range when reading data of 2.7 to 3.6 V.
12. Applies to an operating voltage range when reading data of 1.8 to 3.6 V.
Rev. 3.00 Aug 23, 2006 Page 525 of 616
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Section 25 Electrical Characteristics
25.3
Absolute Maximum Ratings for Masked ROM Version
Table 25.12 lists the absolute maximum ratings.
Table 25.12 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Note
Power supply voltage
VCC
–0.3 to +4.3
V
*1
Analog power supply voltage
AVCC
–0.3 to +4.3
V
DVCC
–0.3 to +4.3
V
Vin
–0.3 to VCC +0.3
V
Ports B0 to B2
AVin
–0.3 to AVCC + 0.3
V
Ports B5 to B7
DVin
–0.3 to DVCC + 0.3
V
Topr
–20 to +75
(regular specifications)
°C
Input voltage
Other than port B
Operating temperature
–40 to +85
(wide-range specifications)
+75 (products shipped as
chips)*2
Storage temperature
Tstg
–55 to +125
°C
Notes: 1. Permanent damage may occur to the chip if absolute maximum ratings are exceeded.
Normal operation should be under the conditions specified in Electrical Characteristics.
Exceeding these values can result in incorrect operation and reduced reliability.
2. Power may be applied when the temperature is between –20 and +75°C.
Rev. 3.00 Aug 23, 2006 Page 526 of 616
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Section 25 Electrical Characteristics
25.4
Electrical Characteristics for Masked ROM Version
25.4.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range are indicated by the shaded region in the figures.
(1)
Power Supply Voltage and Oscillation Frequency Range
fW (kHz)
fosc (MHz)
38.4
10.0
32.768
4.2
2.0
1.8
2.7
3.6
VCC (V)
1.8
2.7
· Active (high-speed) mode
· All operating mode
· Sleep (high-speed) mode
· Refer to no.2 in the note.
· Refer to no.1 in the note.
3.6
VCC (V)
Notes: 1.The fosc values are those when a resonator
is used; when an external clock is used, the
minimum value of fosc is 2 MHz.
2. When a resonator is used, hold VCC at
2.2 V to 3.6 V from power-on until the
oscillation settling time has elapsed.
Rev. 3.00 Aug 23, 2006 Page 527 of 616
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Section 25 Electrical Characteristics
φ (MHz)
(2)
Power Supply Voltage and Operating Frequency Range
19.2
10
16.384
4.2
2.0
(1.0)
2.7
3.6
VCC (V)
· Active (high-speed) mode
· Sleep (high-speed) mode (except CPU)
· Refer to no.1 in the note.
9.6
φ SUB (kHz)
1.8
8.192
φ (MHz)
4.8
1250
4.096
525
1.8
2.7
31.25
(15.625)
3.6
VCC (V)
1.8
2.7
3.6
VCC (V)
· Active (medium-speed) mode
· Sleep (medium-speed) mode
(except A/D converter)
· Refer to no.2 in the note.
· Subactive mode
· Subsleep mode (except CPU)
· Watch mode (except CPU)
Notes: 1. The value in parentheses is the minimum operating
frequency when an external clock is input. When
using a resonator, the minimum operating frequency
(φ ) is 2 MHz.
2. The value in parentheses is the minimum operating
frequency when an external clock is input. When
using a resonator, the minimum operating frequency
(φ ) is 31.25 kHz.
Rev. 3.00 Aug 23, 2006 Page 528 of 616
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Section 25 Electrical Characteristics
Analog Power Supply Voltage and A/D Converter Operating Frequency Range
10.0
1250
φ (MHz)
φ (MHz)
(3)
4.2
2.0
(1.0)
1.8
2.7
525
31.25
(15.625)
3.6
AVCC(V)
2.7
· Active (high-speed) mode
· Active (medium-speed) mode
· Sleep (high-speed) mode
· Sleep (medium-speed) mode
· Refer to no.1 in the note.
· Refer to no.2 in the note.
3.6
AVCC(V)
Notes: 1. The minimum operating frequency (φ) is 2 MHz when using a resonator;
and 1 MHz when using an external clock.
2. The minimum operating frequency (φ) is 31.25 kHz when using a resonator;
and 15.625 kHz when using an external clock.
Rev. 3.00 Aug 23, 2006 Page 529 of 616
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Section 25 Electrical Characteristics
25.4.2
DC Characteristics
Table 25.13 lists the DC characteristics.
Table 25.13 DC Characteristics
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless
otherwise specified.
Values
Item
Symbol
Input high
VIH
voltage
Applicable Pins
Test Condition
Min.
Typ.
Max.
Unit
0.9VCC
—
VCC + 0.3
V
IRQ0, IRQ1, IRQ2
0.9VCC
—
AVCC + 0.3
RXD32, RXD31
0.8VCC
—
VCC + 0.3
OSC1
0.9VCC
—
VCC + 0.3
0.9VCC
—
VCC + 0.3
0.8VCC
—
VCC + 0.3
PB0 to PB2
0.8VCC
—
AVCC + 0.3
PB5 to PB7
0.8VCC
—
DVCC + 0.3
IRQAEC
0.9VCC
—
VCC + 0.3
RES, NMI, WKP0 to
WKP7, IRQ4,
AEVL, AEVH,
TMIF, ADTRG,
SCK32, SCK31,
SCK4
X1
P10 to P16,
VCC = 2.7 to 3.6 V
P30 to P32,
P36, P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
P90 to P93,
PA0 to PA3,
TCLKA, TCLKB,
TCLKC, TIOCA1,
TIOCA2, TIOCB1,
TIOCB2, SCL, SDA
Rev. 3.00 Aug 23, 2006 Page 530 of 616
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Notes
Section 25 Electrical Characteristics
Values
Item
Symbol
Input low
VIL
Applicable Pins
Test Condition
RES, NMI, WKP0 to
Min.
Typ.
Max.
Unit
–0.3
—
0.1VCC
V
–0.3
—
0.2VCC
Notes
WKP7, IRQ0, IRQ1,
voltage
IRQ3, IRQ4,
IRQAEC, AEVL,
AEVH, TMIF,
ADTRG, SCK32,
SCK31, SCK4
RXD32, RXD31
OSC1
X1
VCC = 2.7 to 3.6 V
P10 to P16,
–0.3
—
0.1VCC
–0.3
—
0.1VCC
–0.3
—
0.2VCC
VCC – 1.0
—
—
P30 to P32,
P36, P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
P90 to P93,
PA0 to PA3,
TCLKA, TCLKB,
TCLKC, TIOCA1,
TIOCB1, TIOCA2,
TIOCB2, SCL,
SDA,
PB0 to PB2,
PB5 to PB7
Output high
voltage
VOH
P10 to P16,
–IOH = 1.0 mA
P30 to P32,
VCC = 2.7 to 3.6 V
P36, P37,
–IOH = 0.1 mA
VCC – 0.3
—
—
–IOH = 1.0 mA
VCC – 1.0
—
—
VCC – 0.3
—
—
P40 to P42,
V
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
P90 to P93
VCC = 2.7 to 3.6 V
–IOH = 0.1 mA
Rev. 3.00 Aug 23, 2006 Page 531 of 616
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Section 25 Electrical Characteristics
Values
Item
Symbol
Applicable Pins
Test Condition
Min.
Typ.
Max.
Unit
Output low
VOL
P10 to P16,
IOL = 0.4 mA
—
—
0.5
V
IOL = 15 mA
—
—
1.0
—
—
0.5
—
—
0.5
—
—
0.4
—
—
0.2VCC
—
—
1.0
—
—
1.0
30
—
180
µA
—
—
15.0
pF
voltage
P30 to P32,
P36, P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
PA0 to PA3
P90 to P93
VCC = 2.7 to 3.6 V
IOL = 10 mA
VCC = 2.2 to 3.6 V
IOL = 8.0 mA
VCC = 1.8 to 3.6 V
SCL, SDA
VCC = 2.0 to 3.6 V
V
IOL = 3.0 mA
VCC = 1.8 to 2.0 V
IOL = 3.0 mA
NMI, OSC1, X1,
VIN = 0.5 V to
leakage
P10 to P16,
VCC – 0.5 V
current
P30 to P32,
Input/output
| IIL |
µA
P36, P37,
P40 to P42,
P50 to P57,
P60 to P67,
P70 to P77,
P80 to P87,
IRQAEC,
PA0 to PA3,
P90 to P93
Pull-up MOS
–Ip
current
PB0 to PB2,
VIN = 0.5 V to
PB5 to PB7
AVCC – 0.5 V
P10 to P16,
VCC = 3.0 V,
P30,
VIN = 0 V
P36, P37,
P50 to P57,
P60 to P67
Input
capacitance*
CIN
3
All input pins except f = 1 MHz,
power supply pin
VIN =0 V,
Ta = 25°C
Rev. 3.00 Aug 23, 2006 Page 532 of 616
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Notes
Section 25 Electrical Characteristics
Values
Item
Symbol
Applicable Pins
Test Condition
Min.
Active mode
IOPE1
VCC
Active (high-speed) mode, —
Typ.
Max.
Unit
Notes
0.7
—
mA
*1*2
current
VCC = 1.8 V,
Max.
consumption
fOSC = 2 MHz
guideline =
1.1 × typ.
Active (high-speed) mode, —
2.6
*1*2
—
VCC = 3.0 V,
Max.
fOSC = 4 MHz
guideline =
1.1 × typ.
Active (high-speed) mode, —
6.6
10.0
0.2
—
1 2
**
VCC = 3.0 V,
fOSC = 10 MHz
IOPE2
VCC
Active (medium-speed)
—
mA
1 2
**
mode,
Max.
VCC = 1.8 V,
guideline =
fOSC = 2 MHz,
1.1 × typ.
φosc/64
Active (medium-speed)
—
0.4
*1*2
—
mode,
Max.
VCC = 3.0 V,
guideline =
fOSC = 4 MHz,
1.1 × typ.
φosc/64
Active (medium-speed)
—
0.8
1.8
—
0.3
—
*1*2
mode,
VCC = 3.0 V,
fOSC = 10 MHz,
φosc/64
Sleep mode
current
ISLEEP
VCC
VCC= 1.8 V,
fOSC= 2 MHz
mA
1 2
**
Max.
consumption
guideline =
1.1 × typ.
VCC= 3.0 V,
—
1.2
—
fOSC= 4 MHz
*1*2
Max.
guideline =
1.1 × typ.
VCC= 3.0 V,
—
3.0
5.0
1 2
**
fOSC= 10 MHz
Rev. 3.00 Aug 23, 2006 Page 533 of 616
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Section 25 Electrical Characteristics
Values
Item
Symbol
Applicable Pins
Test Condition
Min.
Typ.
Max.
Unit
Notes
Subactive
ISUB
VCC
VCC = 1.8 V,
—
5.9
—
µA
*1*2
mode current
LCD on, 32-kHz crystal
Reference
consumption
resonator (φSUB = φw/2)
value
VCC = 2.7 V,
—
5.7
1 2
—
**
LCD on, 32-kHz crystal
Reference
resonator (φSUB = φw/8)
value
VCC = 2.7 V,
*1*2
—
10.9
50
—
4.5
10
µA
**
—
0.5
—
µA
*1*2
LCD on, 32-kHz crystal
resonator (φSUB = φw/2)
Subsleep
ISUBSP
VCC
VCC = 2.7 V,
mode current
LCD on, 32-kHz crystal
consumption
resonator (φSUB = φw/2)
Watch mode
IWATCH
VCC
VCC = 1.8 V,
1 2
current
Ta = 25°C,
Reference
consumption
32-kHz crystal resonator,
value
LCD not used
VCC = 2.7 V,
—
1.6
6.0
—
0.4
—
*1*2
32-kHz crystal resonator,
LCD not used
Standby mode ISTBY
VCC
VCC = 1.8 V,
µA
*1*2
current
Ta = 25°C,
Reference
consumption
32-kHz crystal resonator
value
not used
VCC = 3.0 V,
—
0.6
*1*2
—
Ta = 25°C,
Reference
32-kHz crystal resonator
value
not used
32-kHz crystal resonator
—
1.0
5.0
*1*2
—
0.3
—
**
not used
VCC = 3.0 V
1 2
Reference
32KSTOP = 1
value
RAM data
VRAM
VCC
1.5
—
—
V
IOL
Output pins
—
—
0.5
mA
—
—
15.0
retaining
voltage
Allowable
output low
current
(per pin)
except port 9
P90 to P93
Rev. 3.00 Aug 23, 2006 Page 534 of 616
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Section 25 Electrical Characteristics
Values
Item
Symbol
Applicable Pins
Allowable
∑ IOL
Output pins
output low
Test Condition
Min.
Typ.
Max.
Unit
—
—
20.0
mA
—
—
60.0
VCC = 2.7 to 3.6 V
—
—
2.0
VCC = 1.8 to 3.6 V
—
—
0.2
—
—
10.0
Notes
except port 9
current (total)
Port 9
–IOH
Allowable
All output pins
mA
output high
current
(per pin)
∑ – IOH
Allowable
All output pins
mA
output high
current (total)
Notes: 1. Pin states during current measurement.
RES
Other
LCD Power
Mode
Pin
Internal State
Pins
Supply
Oscillator Pins
Active (high-speed)
VCC
Only CPU operates
VCC
Halted
System clock oscillator:
mode (IOPE1)
crystal resonator
On-chip WDT oscillator is off
Active (medium-speed)
Subclock oscillator:
mode (IOPE2)
Pin X1 = GND
Sleep mode
VCC
Only on-chip timers operate
VCC
Halted
VCC
Halted
On-chip WDT oscillator is off
Subactive mode
VCC
Only CPU operates
Subsleep mode
VCC
Only on-chip timers operate,
System clock oscillator:
crystal resonator
On-chip WDT oscillator is off
VCC
Halted
Only time base operates, CPU VCC
Halted
CPU stops
Subclock oscillator:
crystal resonator
On-chip WDT oscillator is off
Watch mode
VCC
stops
On-chip WDT oscillator is off
TCSRWD1 (WDON) = 0
Standby mode
VCC
CPU and timers both stop
VCC
Halted
System clock oscillator:
crystal resonator
On-chip WDT oscillator is off
Subclock oscillator:
TCSRWD1 (WDON) = 0
Pin X1 = GND
(32KSTOP = 0)
2. Excludes current in pull-up MOS transistors and output buffers.
3. Except for the package for the TLP-85V.
Rev. 3.00 Aug 23, 2006 Page 535 of 616
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Section 25 Electrical Characteristics
25.4.3
AC Characteristics
Table 25.14 lists the control signal timing, table 25.15 lists the serial interface timing, and table
2
25.16 lists the I C bus interface timing.
Table 25.14 Control Signal Timing
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless
otherwise specified.
Applicable
Values
Reference
Item
Symbol
Pins
Test Condition
Min.
Typ.
Max.
Unit
System clock
oscillation frequency
fOSC
OSC1, OSC2
VCC = 2.7 to 3.6 V
2.0
—
10.0
MHz
VCC = 1.8 to 3.6 V
2.0
—
4.2
On-chip oscillator
is used
VCC = 2.7 to 3.6 V
1.0
—
10
On-chip oscillator
is used
VCC = 1.8 to 2.7 V
0.5
—
4.2
VCC = 2.7 to 3.6 V
100
—
500
(1000)
VCC = 1.8 to 3.6 V
238
—
500
(1000)
On-chip oscillator
is used
VCC = 2.7 to 3.6 V
100
—
1000
On-chip oscillator
is used
VCC = 1.8 to 2.7 V
238
—
2000
1
—
64
tOSC
—
—
64
µs
On-chip oscillator
oscillation frequency
ROSC
OSC clock (φOSC) cycle tOSC
time
OSC1, OSC2
On-chip oscillator
tROSC
clock (φROSC) cycle time
Figure
4
*
ns
Figure 25.2
2
*
*4
System clock (φ)
cycle time
tcyc
Subclock oscillation
frequency
fW
X1, X2
—
32.768 —
or 38.4
kHz
Figure 25.7
Watch clock (φW) cycle tW
time
X1, X2
—
30.5 or —
26.0
µs
Figure 25.2
2
—
8
tW
*1
2
—
—
tcyc
tsubcyc
Subclock (φSUB) cycle
time
tsubcyc
Instruction cycle time
Rev. 3.00 Aug 23, 2006 Page 536 of 616
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Section 25 Electrical Characteristics
Applicable
Item
Symbol
Oscillation stabilization trc
time
tCPH
Test Condition
Min.
Typ.
Max.
Unit
OSC1, OSC2
Crystal resonator
VCC = 2.7 to 3.6 V
—
0.8
2.0
ms
Crystal resonator
VCC = 2.2 to 3.6 V
—
1.2
3.0
Ceramic resonator
VCC = 2.2 to 3.6 V
—
20
45
Ceramic resonator
Other than above
—
80
—
Other than above
—
—
50
ms
On-chip oscillator
is used
—
—
100
µs
*
s
Figure 5.7
ns
Figure 25.2
OSC1
VCC = 2.2 to 3.6 V
—
—
2.0
Other than above
—
4
—
VCC = 2.7 to 3.6 V
40
—
—
VCC = 1.8 to 3.6 V
X1
External clock low
width
tCPL
OSC1
VCC = 2.7 to 3.6 V
VCC = 1.8 to 3.6 V
tCPr
RES pin low width
tREL
—
—
15.26
or
13.02
—
µs
40
—
—
ns
—
—
15.26
or
13.02
—
µs
VCC = 2.7 to 3.6 V
—
—
10
ns
VCC = 1.8 to 3.6 V
—
—
24
—
—
55.0
ns
VCC = 2.7 to 3.6 V
—
—
10
ns
VCC = 1.8 to 3.6 V
—
—
24
X1
—
—
55.0
ns
RES
10
—
—
tcyc
X1
External clock fall time tCPf
95
—
95
OSC1
OSC1
Figure
µs
—
X1
External clock rise
time
Reference
Pins
X1, X2
External clock high
width
Values
4
Figure 25.2
Figure 25.2
Figure 25.2
Figure 25.3*3
Rev. 3.00 Aug 23, 2006 Page 537 of 616
REJ09B0182-0300
Section 25 Electrical Characteristics
Applicable
Item
Symbol
Pins
Input pin high width
tIH
IRQ0, IRQ1,
NMI, IRQ3,
IRQ4, IRQAEC,
WKP0 to WKP7,
TMIF, ADTRG
Input pin low width
tIL
Test Condition
Typ.
Figure
Unit
Figure
2
—
—
tcyc
tsubcyc
Figure 25.4
VCC = 2.7 to 3.6 V
50
—
—
ns
VCC = 1.8 to 3.6 V
110
—
—
TCLKA, TCLKB, Single edge
specified
TCLKC,
TIOCA1,
TIOCB1,
TIOCA2,
TIOCB2
1.5
—
—
Both edges
specified
2.5
—
—
2
—
50
IRQ0, IRQ1,
NMI, IRQ3,
IRQ4,
IRQAEC,
WKP0 to WKP7,
TMIF, ADTRG
AEVL, AEVH
VCC = 2.7 to 3.6 V
VCC = 1.8 to 3.6 V
tTCKWL
Notes: 1.
2.
3.
4.
Reference
Min.
AEVL, AEVH
tTCKWH
Values
tcyc
Figure 25.7
—
tcyc
tsubcyc
Figure 25.4
—
—
ns
110
—
—
TCLKA, TCLKB, Single edge
specified
TCLKC,
TIOCA1,
TIOCB1,
TIOCA2,
TIOCB2
1.5
—
—
Both edges
specified
2.5
—
—
tcyc
Figure 25.7
Selected with the SA1 and SA0 bits in the system control register 2 (SYSCR2).
The value in parentheses is tOSC (max.) when an external clock is used.
For details on the power-on reset characteristics, refer to table 25.20 and figure 25.1.
Characteristics vary due to variations in factors such as temperature, power supply
voltage, and production lot. When designing the system, give due consideration to the
actual usage conditions. For actual data on this product, please contact a Renesas
representative.
Rev. 3.00 Aug 23, 2006 Page 538 of 616
REJ09B0182-0300
Section 25 Electrical Characteristics
Table 25.15 Serial Interface Timing
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless
otherwise specified.
Values
Item
Input clock
cycle
Symbol
Asynchronous
Test Condition
tscyc
Clocked
Reference
Min.
Typ.
Max.
Unit
Figure
4
—
—
tcyc or tsubcyc
Figure 25.5
6
—
—
0.4
—
0.6
tscyc
Figure 25.5
—
1
tcyc or tsubcyc
Figure 25.6
—
—
ns
Figure 25.6
—
—
ns
Figure 25.6
synchronous
Input clock pulse width
tSCKW
Transmit data delay time
tTXD
(clocked synchronous)
Receive data setup time
tRXS
238
(clocked synchronous)
VCC = 2.7 to 3.6 V
Receive data hold time
tRXH
100
238
(clocked synchronous)
VCC = 2.7 to 3.6 V
100
Rev. 3.00 Aug 23, 2006 Page 539 of 616
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Section 25 Electrical Characteristics
2
Table 25.16 I C Bus Interface Timing
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = 0.0 V, Ta = –20 to
+75°C, unless otherwise specified.
Test
Item
Symbol
SCL input cycle time
Condition
Values
Reference
Min.
Typ.
Max.
Unit
Figure
tSCL
12tcyc + 600
—
—
ns
Figure 25.8
SCL input high width
tSCLH
3tcyc + 300
—
—
ns
SCL input low width
tSCLL
5tcyc + 300
—
—
ns
SCL and SDA input fall time tSf
—
—
300
ns
SCL and SDA input spike
pulse removal time
tSP
—
—
1tcyc
ns
SDA input bus-free
time
tBUF
5tcyc
—
—
ns
Start condition input hold
time
tSTAH
3tcyc
—
—
ns
Retransmission start
condition input setup time
tSTAS
3tcyc
—
—
ns
Setup time for stop condition tSTOS
input
3tcyc
—
—
ns
Data-input setup time
tSDAS
1tcyc + 20
—
—
ns
Data-input hold time
tSDAH
0
—
—
ns
Capacitive load of
SCL and SDA
Cb
0
—
400
pF
SCL and SDA output fall
time
tSf
—
—
300
ns
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Section 25 Electrical Characteristics
25.4.4
A/D Converter Characteristics
Table 25.17 lists the A/D converter characteristics.
Table 25.17 A/D Converter Characteristics
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless
otherwise specified.
Applicable
Item
Symbol
Pins
Values
Test Condition
Min.
Typ.
Max.
Unit
Notes
*
1
*
2
Analog power supply
voltage
AVCC
AVCC
1.8
—
3.6
V
Analog input voltage
AVIN
AN0 to AN2
–0.3
—
AVCC +
0.3
V
AIOPE
AVCC
AISTOP1
AVCC
Analog power supply
current
AVCC = 3.0 V
—
—
1.0
mA
—
600
—
µA
Reference
value
AISTOP2
AVCC
—
—
5
µA
Analog input
capacitance
CAIN
AN0 to AN7
—
—
15.0
pF
Allowable signal
source impedance
RAIN
—
—
10.0
kΩ
—
—
10
Bits
AVCC = 2.7 V to 3.6 V
VCC = 2.7 V to 3.6 V
—
—
±3.5
LSB
AVCC = 2.0 V to 3.6 V
VCC = 2.0 V to 3.6 V
—
—
±5.5
Other than above
—
—
±7.5
—
—
±0.5
LSB
AVCC = 2.7 V to 3.6 V
VCC = 2.7 V to 3.6 V
—
—
±4.0
LSB
AVCC = 2.0 V to 3.6 V
VCC = 2.0 V to 3.6 V
—
—
±6.0
Other than above
—
—
±8.0
Resolution (data
length)
Nonlinearity error
Quantization error
Absolute accuracy
3
*
4
*
4
*
Rev. 3.00 Aug 23, 2006 Page 541 of 616
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Section 25 Electrical Characteristics
Applicable
Item
Symbol
Pins
Conversion time
Values
Test Condition
Min.
Typ.
Max.
Unit
AVCC = 2.7 V to 3.6 V
VCC = 2.7 V to 3.6 V
6.2
—
124
µs
AVCC = 2.2 V to 3.6 V
VCC = 2.2 V to 3.6 V
14.7
—
124
Other than above
31
—
124
Notes
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AISTOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AISTOP2 is the current at a reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
4. Conversion time = 31 µs
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Section 25 Electrical Characteristics
25.4.5
∆Σ A/D Converter Characteristics
Table 25.18 lists the ∆Σ A/D converter characteristics.
Table 25.18 ∆Σ A/D Converter Characteristics
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless
otherwise specified.
Values
Applicable
Item
Symbol
Pins
Analog power supply
DVcc
DVcc
DIOPE
DVcc
Test Condition
Min.
Typ.
Max.
Unit
Notes
2.2/2.7

3.6
V
*1 *8

2.0

mA
voltage
Analog power supply
current
PGA not used,
DISTOP1
DVcc
DVcc = 3.0 V,
fOVS = 2.0 MHz
Reference
value
BGR = OFF,

0.1

µA
*2
Reference
value
DISTOP2

DVcc
0.1

µA
*3
Reference
value
Resolution
Oversampling frequency fOVS
DVcc = 2.2 to 3.6 V,
14
14
14
Bits
0.25

4.2
MHz
0.25

10
MHz
0.78

13.125
kHz
0.78

31.25
kHz
76.19

1280
µs
32.0

1280
µs
—
3.0
—
LSB
—
-7.0
—
Vcc = 2.2 to 3.6 V
DVcc = 2.7 to 3.6 V,
Vcc = 2.7 to 3.6 V
Sampling frequency
fS
DVcc = 2.2 to 3.6 V,
Vcc = 2.2 to 3.6 V
DVcc = 2.7 to 3.6 V,
Vcc = 2.7 to 3.6 V
Conversion speed
DVcc = 2.2 to 3.6 V,
Vcc = 2.2 to 3.6 V
DVcc = 2.7 to 3.6 V,
Vcc = 2.7 to 3.6 V
Integral lineality error
PGA bypass
*7
(DVcc = 3.0 V,
Vref = 2.7 V,
conversion speed = 32
µs)*
6
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Section 25 Electrical Characteristics
Values
Applicable
Item
Symbol
Pins
Test Condition
Min.
Typ.
Max.
Unit
Notes
Differential lineality
PGA bypass
—
1.3
—
LSB
*7
error
(DVcc = 3.0 V,
—
-0.8
—
—
10
—
mV
*
7
—
28.0
—
mV
*
7
—
1/3
—
V/V
—
1
—
V/V
—
2
—
V/V
—
4
—
V/V
—
6
—
mV
—
7
—
mV
—
-20
—
mV
—
-44
—
mV
REF
—
1.17
—
V
Vref
0.2 DVcc —
Vref = 2.7 V, conversion
speed = 32 µs)*6
Offset error
PGA bypass
(DVcc = 3.0 V,
Vref = 2.7 V, conversion
speed = 32 µs)*
6
Full scale error
PGA bypass
(DVcc = 3.0 V,
Vref = 2.7 V, conversion
speed = 32 µs)*
6
PGA gain
PGA gain error
Tad
PGA = 1/3,
*7
DVcc = 3.0 V
PGA = 1,
DVcc = 3.0 V
PGA = 2,
DVcc = 3.0 V
PGA = 4,
DVcc = 3.0 V
Internal reference
voltage
External reference
voltage
Rev. 3.00 Aug 23, 2006 Page 544 of 616
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0.9 DVcc V
*4 *5
Section 25 Electrical Characteristics
Values
Applicable
Item
Symbol
Pins
Test Condition
Min.
Typ.
Analog data input
Ain
Ain1, Ain2
PGA = 1/3
0.6
—
Max.
Unit
2.7 Vref
V
Notes
(2.7 Vref
voltage
< DVcc)
2.7
REF
(2.7
REF <
DVcc)
PGA = 1, bypass
0.2
—
Vref
V
REF
PGA = 2
0.1
—
0.5 Vref
V
0.5
REF
PGA = 4
0.05
—
0.25 Vref V
0.25
REF
Operating temperature
Ta
0
—
50
°C
Notes: 1. Set DV = V when the ∆Σ A/D converter is not used.
2. DISTOP1 is the current in active and sleep modes while the ∆Σ A/D converter is idle.
3. DISTOP2 is the current at a reset and in standby, watch, subactive, and subsleep modes
while the ∆Σ A/D converter is idle.
4. BGR stabilization time = 150 µs (Ta = 25°C, V = 3.0 V)
The BGR stabilization time is started after setting bit 7 (BTRSTPN) in BGR control
register (BGRMR) to 1. The stabilization time may vary due to factors such as the
capacitance connected to the REF pin, so careful evaluation is necessary.
5. Before using the system, the internal reference value must be tested because there is
dispersion in sample data.
6. This is the value when the BGR is not used.
7. The error for each item varies depending on factors such as temperature, voltage,
conversion time, and sample variation. It is therefore necessary to perform careful
evaluation under actual usage conditions.
cc
cc
cc
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Section 25 Electrical Characteristics
25.4.6
LCD Characteristics
Table 25.19 shows the LCD characteristics.
Table 25.19 LCD Characteristics
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V, unless
otherwise specified.
Values
Applicable
Item
Symbol
Pins
Test Condition
Min.
Typ.
Max.
Unit
Notes
Segment driver drop
VDS
SEG1 to
ID = 2 µA
—
—
0.6
V
*
SEG32
V1 = 2.7 V to 3.6 V
COM1 to
ID = 2 µA
—
—
0.3
V
*1
COM4
V1 = 2.7 V to 3.6 V
1.5
3.0
7.0
MΩ
2.2
—
3.6
V
*2
voltage
Common driver drop
VDC
voltage
LCD power supply split- RLCD
Between V1 and VSS
1
resistance
LCD display voltage
VLCD
V1
V3 power supply
VLCD3
V3
Between V3 and VSS
0.9
1.0
1.1
V
*3*4
VLCD2
V2
Between V2 and VSS
—
2.0
—
V
*3*4
—
V
**
—
µA
Reference
voltage
V2 power supply
(VLCD3 ×
voltage
2)
V1 power supply
VLCD1
V1
Between V1 and VSS
—
3.0
3 4
(VLCD3 ×
voltage
3)
3-V constant voltage
ILCD
Vcc
LCD power supply
circuit current
VCC = 3.0 V
—
20
4 5
Booster clock:
value* *
125 kHz
consumption
Notes: 1. The voltage drop from power supply pins V1, V2, V3, and VSS to each segment pin or
common pin.
2. When the LCD display voltage is supplied from an external power source, ensure that
the following relationship is maintained: V1 ≥ V2 ≥ V3 ≥ VSS.
3. The value when the LCD power supply split-resistor is separated and 3-V constant
voltage power supply circuit is driven.
4. For details on the register (BGRMR) setting range when the voltage of the V3 pin is set
to 1.0 V, refer to section 20.3.5, BGR Control Register (BGRMR).
5. Includes the current consumption of the band-gap reference circuit (BGR) (operation).
Rev. 3.00 Aug 23, 2006 Page 546 of 616
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Section 25 Electrical Characteristics
25.4.7
Power-On Reset Circuit Characteristics
Table 25.20 lists the power-on reset circuit characteristics.
Table 25.20 Power-On Reset Circuit Characteristics
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, DVCC = 2.2 V to 3.6 V, VSS = AVSS = 0.0 V,
Ta = −20 to +75°C (regular specifications), Ta = −40 to +85°C (wide-range specifications), unless
otherwise specified.
Values
Item
Symbol
Reset voltage
Power supply rise time
Test Condition
Reference
Min.
Typ.
Max.
Unit
Figure
V_rst
0.7Vcc
0.8Vcc
0.9Vcc
V
Figure 25.1
t_vtr
The Vcc rise time should be shorter than half
the RES rise time.
Reset count time
t_out
Count start time
t_cr
0.8
—
4.0
µs
Adjustable by the value of the external
capacitor of the RES pin.
On-chip pull-up resistance
Rp
Vcc = 3.0 V
60
100
—
kΩ
Figure 22.1
t_vtr
Vcc
t_vtr × 2
RES
V_rst
Internal reset
signal
t_cr
t_out (eight states)
Figure 25.1 Power-On Reset Circuit Reset Timing
Rev. 3.00 Aug 23, 2006 Page 547 of 616
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Section 25 Electrical Characteristics
25.4.8
Watchdog Timer Characteristics
Table 25.21 Watchdog Timer Characteristics
VCC = 1.8 V to 3.6 V, AVCC = 1.8 V to 3.6 V, VSS = AVSS = 0.0 V,
Ta = −20 to +75°C (regular specifications), Ta = −40 to +85°C (wide-range specifications),
unless otherwise specified.
Applicable
Item
Symbol
WDT on-chip oscillator
tovf
Values
Pins
Test Condition
Min.
Typ.
Max.
Unit
0.2
0.4
—
s
overflow time
25.5
Operation Timing
Figures 25.2 to 25.7 show operation timings.
t OSC, tw
V IH
OSC1
x1
V IL
t CPH
t CPL
t CPr
t CPf
Figure 25.2 Clock Input Timing
RES
V IL
t REL
Figure 25.3 RES Low Width Timing
Rev. 3.00 Aug 23, 2006 Page 548 of 616
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Notes
Section 25 Electrical Characteristics
NMI, IRQ0, IRQ1, IRQ3,
V
IRQ4,TMIF, ADTRG,
WKP0 to WKP7,
IRQAEC, AEVL, AEVH
V
IH
IL
t
IL
t
IH
Figure 25.4 Input Timing
t SCKW
SCK31
SCK32
t scyc
Figure 25.5 SCK3 Input Clock Timing
Rev. 3.00 Aug 23, 2006 Page 549 of 616
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Section 25 Electrical Characteristics
t scyc
SCK31
SCK32
VIH or VOH*
VIL or VOL*
t TXD
VOH*
VOL*
TXD31
TXD32
(transmit data)
t RXS
t RXH
RXD31
RXD32
(receive data)
Note: * Output timing reference levels
Output high
VOH = 1/2 Vcc + 0.2 V
Output low
VOL = 0.8 V
Load conditions are shown in figure 25.9.
Figure 25.6 SCI3 Input/Output Timing in Clocked Synchronous Mode
TCLKA to TCLKC
tTCKWL
tTCKWH
Figure 25.7 Clock Input Timing for TCLKA to TCLKC Pins
Rev. 3.00 Aug 23, 2006 Page 550 of 616
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Section 25 Electrical Characteristics
VIH
SDA
VIL
tBUF
tSTAH
tSCLH
tSP
tSTAS
tSTOS
SCL
P*
S*
tSf
Sr*
tSCLL
P*
tSDAS
tSr
tSCL
tSDAH
Note: * S, P, and Sr represent the following:
S: Start condition
P: Stop condition
Sr: Retransmission start condition
2
Figure 25.8 I C Bus Interface Input/Output Timing
25.6
Output Load Circuit
VCC
2.4 kΩ
LSI output pin
30 pF
12 kΩ
Figure 25.9 Output Load Condition
Rev. 3.00 Aug 23, 2006 Page 551 of 616
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Section 25 Electrical Characteristics
25.7
Recommended Resonator
Table 25.22 Recommended Crystal Resonators
Frequency (MHz)
Manufacturer
Product Type
4.194
Kyocera Kinseki Corporation
HC-491U-S
10
Kyocera Kinseki Corporation
HC-491U-S
Table 25.23 Recommended Ceramic Resonators
Frequency (MHz)
Manufacturer
Product Type
2
Murata Manufacturing Co., Ltd.
CSTCC2M00G53-B0
Murata Manufacturing Co., Ltd.
CSTCC2M00G56-B0
Murata Manufacturing Co., Ltd.
CSTLS4M19G53-B0
Murata Manufacturing Co., Ltd.
CSTLS4M19G56-B0
Murata Manufacturing Co., Ltd.
CSTLS10M0G53-B0
Murata Manufacturing Co., Ltd.
CSTLS10M0G56-B0
4.194
10
25.8
Usage Note
The F-ZTAT and masked ROM versions satisfy the electrical characteristics shown in this
manual, but actual electrical characteristic values, operating margins, noise margins, and other
properties may vary due to differences in manufacturing process, on-chip ROM, layout patterns,
and so on.
When system evaluation testing is carried out using the F-ZTAT version, the same evaluation
testing should also be conducted for the masked ROM version when changing over to that version.
Rev. 3.00 Aug 23, 2006 Page 552 of 616
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Appendix
Appendix
A.
Instruction Set
A.1
Instruction List
Condition Code
Symbol
Description
Rd
General destination register
Rs
General source register
Rn
General register
ERd
General destination register (address register or 32-bit register)
ERs
General source register (address register or 32-bit register)
ERn
General register (32-bit register)
(EAd)
Destination operand
(EAs)
Source operand
PC
Program counter
SP
Stack pointer
CCR
Condition-code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
disp
Displacement
→
Transfer from the operand on the left to the operand on the right, or transition from
the state on the left to the state on the right
+
Addition of the operands on both sides
–
Subtraction of the operand on the right from the operand on the left
×
Multiplication of the operands on both sides
÷
Division of the operand on the left by the operand on the right
∧
Logical AND of the operands on both sides
∨
Logical OR of the operands on both sides
⊕
Logical exclusive OR of the operands on both sides
Rev. 3.00 Aug 23, 2006 Page 553 of 616
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Appendix
Symbol
Description
¬
NOT (logical complement)
( ), < >
Contents of operand
Note: General registers include 8-bit registers (R0H to R7H and R0L to R7L) and 16-bit registers
(R0 to R7 and E0 to E7).
Symbol
Description
↔
Condition Code Notation (cont)
Changed according to execution result
*
Undetermined (no guaranteed value)
0
Cleared to 0
1
Set to 1
—
Not affected by execution of the instruction
∆
Varies depending on conditions, described in notes
Rev. 3.00 Aug 23, 2006 Page 554 of 616
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Appendix
Table A.1
Instruction Set
1. Data Transfer Instructions
Condition Code
MOV.B @(d:16, ERs), Rd
B
4
@(d:16, ERs) → Rd8
— —
MOV.B @(d:24, ERs), Rd
B
8
@(d:24, ERs) → Rd8
— —
MOV.B @ERs+, Rd
B
@ERs → Rd8
ERs32+1 → ERs32
— —
MOV.B @aa:8, Rd
B
2
@aa:8 → Rd8
— —
MOV.B @aa:16, Rd
B
4
@aa:16 → Rd8
— —
MOV.B @aa:24, Rd
B
6
@aa:24 → Rd8
— —
MOV.B Rs, @ERd
B
Rs8 → @ERd
— —
MOV.B Rs, @(d:16, ERd)
B
4
Rs8 → @(d:16, ERd)
— —
MOV.B Rs, @(d:24, ERd)
B
8
Rs8 → @(d:24, ERd)
— —
MOV.B Rs, @–ERd
B
ERd32–1 → ERd32
Rs8 → @ERd
— —
MOV.B Rs, @aa:8
B
2
Rs8 → @aa:8
— —
MOV.B Rs, @aa:16
B
4
Rs8 → @aa:16
— —
MOV.B Rs, @aa:24
B
6
Rs8 → @aa:24
— —
MOV.W #xx:16, Rd
W 4
#xx:16 → Rd16
— —
MOV.W Rs, Rd
W
Rs16 → Rd16
— —
MOV.W @ERs, Rd
W
@ERs → Rd16
— —
2
2
2
2
2
2
MOV.W @(d:16, ERs), Rd W
4
@(d:16, ERs) → Rd16
— —
MOV.W @(d:24, ERs), Rd W
8
@(d:24, ERs) → Rd16
— —
@ERs → Rd16
ERs32+2 → @ERd32
— —
MOV.W @ERs+, Rd
W
MOV.W @aa:16, Rd
W
4
@aa:16 → Rd16
— —
MOV.W @aa:24, Rd
W
6
@aa:24 → Rd16
— —
MOV.W Rs, @ERd
W
Rs16 → @ERd
— —
2
2
MOV.W Rs, @(d:16, ERd) W
4
Rs16 → @(d:16, ERd)
— —
MOV.W Rs, @(d:24, ERd) W
8
Rs16 → @(d:24, ERd)
— —
0 —
0 —
0 —
Advanced
— —
B
↔ ↔ ↔ ↔ ↔ ↔
@ERs → Rd8
MOV.B @ERs, Rd
2
↔ ↔ ↔ ↔ ↔ ↔
— —
B
C
0 —
↔ ↔ ↔ ↔ ↔ ↔ ↔
Rs8 → Rd8
MOV.B Rs, Rd
V
↔ ↔ ↔ ↔ ↔ ↔ ↔
Z
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
I
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
N
— —
↔ ↔ ↔ ↔ ↔
H
#xx:8 → Rd8
Normal
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
2
Rn
B
No. of
States*1
↔ ↔ ↔ ↔ ↔
MOV MOV.B #xx:8, Rd
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
0 —
2
0 —
4
0 —
6
0 —
10
0 —
6
4
0 —
6
0 —
8
0 —
4
0 —
6
0 —
10
0 —
6
4
0 —
6
0 —
8
0 —
4
0 —
2
0 —
4
0 —
6
0 —
10
0 —
6
6
0 —
8
0 —
4
0 —
6
0 —
10
Rev. 3.00 Aug 23, 2006 Page 555 of 616
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Appendix
No. of
States*1
Condition Code
— —
@(d:24, ERs) → ERd32
— —
@ERs → ERd32
ERs32+4 → ERs32
— —
6
@aa:16 → ERd32
— —
8
@aa:24 → ERd32
— —
ERs32 → @ERd
— —
ERs32 → @(d:16, ERd)
— —
ERs32 → @(d:24, ERd)
— —
ERd32–4 → ERd32
ERs32 → @ERd
— —
6
ERs32 → @aa:16
— —
8
ERs32 → @aa:24
— —
0 —
0 —
POP POP.W Rn
W
2 @SP → Rn16
SP+2 → SP
— —
POP.L ERn
L
4 @SP → ERn32
SP+4 → SP
— —
0 —
PUSH PUSH.W Rn
W
2 SP–2 → SP
Rn16 → @SP
— —
0 —
PUSH.L ERn
L
4 SP–4 → SP
ERn32 → @SP
— —
0 —
MOVFPE
MOVFPE @aa:16, Rd
B
4
Cannot be used in
this LSI
Cannot be used in
this LSI
MOVTPE
MOVTPE Rs, @aa:16
B
4
Cannot be used in
this LSI
Cannot be used in
this LSI
W
MOV.W Rs, @aa:16
W
MOV.W Rs, @aa:24
W
MOV.L #xx:32, ERd
L
MOV.L ERs, ERd
L
MOV.L @ERs, ERd
L
MOV.L @(d:16, ERs), ERd
L
6
MOV.L @(d:24, ERs), ERd
L
10
MOV.L @ERs+, ERd
L
MOV.L @aa:16, ERd
L
MOV.L @aa:24, ERd
L
MOV.L ERs, @ERd
L
MOV.L ERs, @(d:16, ERd)
L
6
MOV.L ERs, @(d:24, ERd)
L
10
MOV.L ERs, @–ERd
L
MOV.L ERs, @aa:16
L
MOV.L ERs, @aa:24
L
2
6
2
4
4
4
Rev. 3.00 Aug 23, 2006 Page 556 of 616
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4
Advanced
@(d:16, ERs) → ERd32
↔
— —
↔
@ERs → ERd32
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
— —
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
ERs32 → ERd32
↔ ↔ ↔ ↔ ↔ ↔
— —
↔ ↔ ↔ ↔ ↔ ↔
#xx:32 → ERd32
0 —
↔ ↔ ↔
— —
↔ ↔ ↔
— —
Rs16 → @aa:24
↔
Rs16 → @aa:16
6
C
↔
4
V
↔
Z
↔
I
↔
N
— —
↔
H
ERd32–2 → ERd32
Rs16 → @ERd
0 —
MOV MOV.W Rs, @–ERd
Normal
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
6
6
0 —
8
0 —
6
0 —
2
0 —
8
0 —
10
0 —
14
0 —
10
10
0 —
12
0 —
8
0 —
10
0 —
14
0 —
10
10
0 —
12
0 —
6
10
6
10
Appendix
2. Arithmetic Instructions
No. of
States*1
Condition Code
Z
V
C
↔ ↔
— (2)
↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
ERd32+ERs32 →
ERd32
— (2)
↔
↔
(3)
↔ ↔
Rd16+Rs16 → Rd16
— (1)
ERd32+#xx:32 →
ERd32
2
Rd8+#xx:8 +C → Rd8
—
2
B
2
Rd8+Rs8 +C → Rd8
—
ADDS ADDS.L #1, ERd
L
2
ERd32+1 → ERd32
— — — — — —
2
ADDS.L #2, ERd
L
2
ERd32+2 → ERd32
— — — — — —
2
ADDS.L #4, ERd
L
2
ERd32+4 → ERd32
— — — — — —
2
INC.B Rd
B
2
Rd8+1 → Rd8
— —
INC.W #1, Rd
W
2
Rd16+1 → Rd16
— —
INC.W #2, Rd
W
2
Rd16+2 → Rd16
— —
INC.L #1, ERd
L
2
ERd32+1 → ERd32
— —
INC.L #2, ERd
L
2
ERd32+2 → ERd32
— —
DAA
DAA Rd
B
2
Rd8 decimal adjust
→ Rd8
— *
SUB
SUB.B Rs, Rd
B
2
SUB.W #xx:16, Rd
W 4
SUB.W Rs, Rd
W
SUB.L #xx:32, ERd
L
SUB.L ERs, ERd
L
ADD.W Rs, Rd
W
ADD.L #xx:32, ERd
L
ADD.L ERs, ERd
L
ADDX ADDX.B #xx:8, Rd
ADDX.B Rs, Rd
6
2
2
Rd8–Rs8 → Rd8
—
Rd16–#xx:16 → Rd16
— (1)
Rd16–Rs16 → Rd16
— (1)
(3)
2
4
2
6
2
—
2
—
2
—
2
—
2
—
2
* —
2
—
SUBS SUBS.L #1, ERd
L
2
ERd32–1 → ERd32
— — — — — —
2
SUBS.L #2, ERd
L
2
ERd32–2 → ERd32
— — — — — —
2
SUBS.L #4, ERd
L
2
ERd32–4 → ERd32
— — — — — —
2
B
2
Rd8–1 → Rd8
— —
DEC.W #1, Rd
W
2
Rd16–1 → Rd16
— —
DEC.W #2, Rd
W
2
Rd16–2 → Rd16
— —
2
ERd32–ERs32 → ERd32 — (2)
Rd8–#xx:8–C → Rd8
—
↔ ↔
2
(3)
(3)
↔ ↔ ↔
DEC DEC.B Rd
ERd32–#xx:32 → ERd32 — (2)
6
↔ ↔ ↔
Rd8–Rs8–C → Rd8
SUBX.B Rs, Rd
B
↔
2
SUBX SUBX.B #xx:8, Rd
2
↔ ↔ ↔
2
B
↔ ↔ ↔ ↔ ↔ ↔ ↔
INC
B
2
↔ ↔ ↔ ↔ ↔
W 4
↔ ↔ ↔ ↔ ↔ ↔
ADD.W #xx:16, Rd
2
↔ ↔ ↔ ↔ ↔
B
↔ ↔ ↔ ↔ ↔ ↔ ↔
ADD.B Rs, Rd
↔ ↔ ↔ ↔ ↔ ↔ ↔
ADD ADD.B #xx:8, Rd
↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔
— (1)
↔ ↔ ↔ ↔ ↔
Rd16+#xx:16 → Rd16
2
↔
—
↔ ↔
Rd8+Rs8 → Rd8
↔
—
Advanced
N
↔ ↔
I
Rd8+#xx:8 → Rd8
Normal
H
↔ ↔
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
2
@ERn
B
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
4
2
6
2
2
2
—
2
—
2
—
2
Rev. 3.00 Aug 23, 2006 Page 557 of 616
REJ09B0182-0300
Appendix
No. of
States*1
Condition Code
Advanced
V
C
ERd32–1 → ERd32
— —
L
2
ERd32–2 → ERd32
— —
↔ ↔
—
2
DAS.Rd
B
2
Rd8 decimal adjust
→ Rd8
— *
↔ ↔ ↔
2
DEC.L #2, ERd
↔ ↔ ↔
—
* —
2
B
2
Rd8 × Rs8 → Rd16
(unsigned multiplication)
— — — — — —
14
W
2
Rd16 × Rs16 → ERd32
(unsigned multiplication)
— — — — — —
22
B
4
Rd8 × Rs8 → Rd16
(signed multiplication)
— —
↔
W
4
Rd16 × Rs16 → ERd32
(signed multiplication)
— —
B
2
W
DIVXU DIVXU. B Rs, Rd
DIVXU. W Rs, ERd
DIVXS DIVXS. B Rs, Rd
DIVXS. W Rs, ERd
CMP CMP.B #xx:8, Rd
16
— —
24
Rd16 ÷ Rs8 → Rd16
(RdH: remainder,
RdL: quotient)
(unsigned division)
— — (6) (7) — —
14
2
ERd32 ÷ Rs16 → ERd32
(Ed: remainder,
Rd: quotient)
(unsigned division)
— — (6) (7) — —
22
B
4
Rd16 ÷ Rs8 → Rd16
(RdH: remainder,
RdL: quotient)
(signed division)
— — (8) (7) — —
16
W
4
ERd32 ÷ Rs16 → ERd32
(Ed: remainder,
Rd: quotient)
(signed division)
— — (8) (7) — —
24
Rd8–#xx:8
—
Rd8–Rs8
—
Rd16–#xx:16
— (1)
Rd16–Rs16
— (1)
ERd32–#xx:32
— (2)
ERd32–ERs32
— (2)
B
2
CMP.B Rs, Rd
B
CMP.W #xx:16, Rd
W 4
CMP.W Rs, Rd
W
CMP.L #xx:32, ERd
L
CMP.L ERs, ERd
L
2
2
6
2
Rev. 3.00 Aug 23, 2006 Page 558 of 616
REJ09B0182-0300
↔ ↔ ↔ ↔ ↔ ↔
MULXS. W Rs, ERd
— —
↔ ↔ ↔ ↔ ↔ ↔
MULXS MULXS. B Rs, Rd
↔ ↔ ↔ ↔ ↔ ↔
MULXU. W Rs, ERd
↔ ↔
MULXU MULXU. B Rs, Rd
↔ ↔ ↔ ↔ ↔ ↔
DAS
I
Normal
Z
2
↔
N
L
↔
H
DEC DEC.L #1, ERd
↔
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
2
4
2
4
2
Appendix
No. of
States*1
Condition Code
W
2
0–Rd16 → Rd16
—
NEG.L ERd
L
2
0–ERd32 → ERd32
—
EXTU EXTU.W Rd
W
2
0 → (<bits 15 to 8>
of Rd16)
— — 0
EXTU.L ERd
L
2
0 → (<bits 31 to 16>
of ERd32)
— — 0
EXTS EXTS.W Rd
W
2
(<bit 7> of Rd16) →
(<bits 15 to 8> of Rd16)
— —
EXTS.L ERd
L
2
(<bit 15> of ERd32) →
(<bits 31 to 16> of
ERd32)
— —
Advanced
↔ ↔ ↔
NEG.W Rd
Normal
C
↔ ↔ ↔
—
↔ ↔ ↔
V
↔ ↔ ↔ ↔
0–Rd8 → Rd8
2
0 —
2
↔
2
0 —
2
↔
H
B
0 —
2
↔
Z
↔
I
NEG NEG.B Rd
↔ ↔ ↔
N
↔
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
0 —
2
2
2
Rev. 3.00 Aug 23, 2006 Page 559 of 616
REJ09B0182-0300
Appendix
3. Logic Instructions
AND.B Rs, Rd
B
AND.W #xx:16, Rd
W 4
AND.W Rs, Rd
W
AND.L #xx:32, ERd
L
AND.L ERs, ERd
L
OR.B #xx:8, Rd
B
OR.B Rs, Rd
B
OR.W #xx:16, Rd
W 4
OR.W Rs, Rd
W
OR.L #xx:32, ERd
L
OR.L ERs, ERd
L
XOR.B #xx:8, Rd
B
XOR.B Rs, Rd
B
XOR.W #xx:16, Rd
W 4
XOR.W Rs, Rd
W
XOR.L #xx:32, ERd
L
XOR.L ERs, ERd
L
4
ERd32⊕ERs32 → ERd32 — —
NOT.B Rd
B
2
¬ Rd8 → Rd8
— —
NOT.W Rd
W
2
¬ Rd16 → Rd16
— —
NOT.L ERd
L
2
¬ Rd32 → Rd32
— —
Z
Rd8∧Rs8 → Rd8
— —
Rd16∧#xx:16 → Rd16
— —
Rd16∧Rs16 → Rd16
— —
4
2
2
2
ERd32∧ERs32 → ERd32 — —
Rd8∨#xx:8 → Rd8
— —
Rd8∨Rs8 → Rd8
— —
Rd16∨#xx:16 → Rd16
— —
Rd16∨Rs16 → Rd16
— —
ERd32∨#xx:32 → ERd32 — —
6
4
2
2
2
ERd32∨ERs32 → ERd32 — —
Rd8⊕#xx:8 → Rd8
— —
Rd8⊕Rs8 → Rd8
— —
Rd16⊕#xx:16 → Rd16
— —
Rd16⊕Rs16 → Rd16
— —
ERd32⊕#xx:32 → ERd32 — —
6
V
C
Advanced
I
Normal
—
@@aa
@(d, PC)
@aa
N
— —
ERd32∧#xx:32 → ERd32 — —
6
Rev. 3.00 Aug 23, 2006 Page 560 of 616
REJ09B0182-0300
H
Rd8∧#xx:8 → Rd8
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
2
Operation
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
NOT
2
@(d, ERn)
2
@ERn
B
Rn
#xx
XOR
Condition Code
Operand Size
OR
No. of
States*1
AND.B #xx:8, Rd
Mnemonic
AND
@–ERn/@ERn+
Addressing Mode and
Instruction Length (bytes)
0 —
2
0 —
2
0 —
4
0 —
2
0 —
6
0 —
4
0 —
2
0 —
2
0 —
4
0 —
2
0 —
6
0 —
4
0 —
2
0 —
2
0 —
4
0 —
2
0 —
6
0 —
4
0 —
2
0 —
2
0 —
2
Appendix
4. Shift Instructions
W
2
SHAL.L ERd
L
2
SHAR SHAR.B Rd
B
2
SHAR.W Rd
W
2
SHAR.L ERd
L
2
SHLL SHLL.B Rd
B
2
SHLL.W Rd
W
2
SHLL.L ERd
L
2
SHLR SHLR.B Rd
B
2
SHLR.W Rd
W
2
SHLR.L ERd
L
2
ROTXL ROTXL.B Rd
B
2
ROTXL.W Rd
W
2
ROTXL.L ERd
L
2
B
2
ROTXR.W Rd
W
2
ROTXR.L ERd
L
2
ROTL ROTL.B Rd
B
2
ROTL.W Rd
W
2
ROTL.L ERd
L
2
ROTR ROTR.B Rd
B
2
ROTR.W Rd
W
2
ROTR.L ERd
L
2
ROTXR ROTXR.B Rd
0
MSB
LSB
V
C
— —
— —
— —
C
MSB
— —
LSB
— —
— —
C
0
MSB
LSB
— —
— —
— —
0
C
MSB
LSB
— —
— —
— —
C
— —
MSB
LSB
— —
— —
C
MSB
LSB
— —
— —
— —
C
— —
MSB
LSB
— —
— —
C
MSB
LSB
— —
— —
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Advanced
Z
Normal
—
@@aa
@(d, PC)
@aa
@–ERn/@ERn+
@(d, ERn)
I
C
N
↔ ↔ ↔
SHAL.W Rd
H
— —
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
2
Condition Code
Operation
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
B
No. of
States*1
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
SHAL SHAL.B Rd
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Rev. 3.00 Aug 23, 2006 Page 561 of 616
REJ09B0182-0300
Appendix
5. Bit-Manipulation Instructions
B
BSET #xx:3, @aa:8
B
BSET Rn, Rd
B
BSET Rn, @ERd
B
BSET Rn, @aa:8
B
B
BCLR #xx:3, @ERd
B
BCLR #xx:3, @aa:8
B
BCLR Rn, Rd
B
BCLR Rn, @ERd
B
BCLR Rn, @aa:8
B
BNOT BNOT #xx:3, Rd
B
BNOT #xx:3, @ERd
B
BNOT #xx:3, @aa:8
B
BNOT Rn, Rd
B
BNOT Rn, @ERd
B
BNOT Rn, @aa:8
B
BTST BTST #xx:3, Rd
B
BTST #xx:3, @ERd
B
BTST #xx:3, @aa:8
B
BTST Rn, Rd
B
BTST Rn, @ERd
B
BTST Rn, @aa:8
B
BLD #xx:3, Rd
B
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
H
N
Z
V
C
Advanced
I
Normal
—
@@aa
@(d, PC)
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
2
Rev. 3.00 Aug 23, 2006 Page 562 of 616
REJ09B0182-0300
Condition Code
Operation
(#xx:3 of Rd8) ← 1
— — — — — —
2
(#xx:3 of @ERd) ← 1
— — — — — —
8
(#xx:3 of @aa:8) ← 1
— — — — — —
8
(Rn8 of Rd8) ← 1
— — — — — —
2
(Rn8 of @ERd) ← 1
— — — — — —
8
(Rn8 of @aa:8) ← 1
— — — — — —
8
(#xx:3 of Rd8) ← 0
— — — — — —
2
(#xx:3 of @ERd) ← 0
— — — — — —
8
(#xx:3 of @aa:8) ← 0
— — — — — —
8
(Rn8 of Rd8) ← 0
— — — — — —
2
(Rn8 of @ERd) ← 0
— — — — — —
8
(Rn8 of @aa:8) ← 0
— — — — — —
8
(#xx:3 of Rd8) ←
¬ (#xx:3 of Rd8)
— — — — — —
2
(#xx:3 of @ERd) ←
¬ (#xx:3 of @ERd)
— — — — — —
8
(#xx:3 of @aa:8) ←
¬ (#xx:3 of @aa:8)
— — — — — —
8
(Rn8 of Rd8) ←
¬ (Rn8 of Rd8)
— — — — — —
2
(Rn8 of @ERd) ←
¬ (Rn8 of @ERd)
— — — — — —
8
(Rn8 of @aa:8) ←
¬ (Rn8 of @aa:8)
— — — — — —
8
¬ (#xx:3 of Rd8) → Z
— — —
¬ (#xx:3 of @ERd) → Z
— — —
¬ (#xx:3 of @aa:8) → Z
— — —
¬ (Rn8 of @Rd8) → Z
— — —
¬ (Rn8 of @ERd) → Z
— — —
¬ (Rn8 of @aa:8) → Z
— — —
(#xx:3 of Rd8) → C
— — — — —
— —
2
— —
6
— —
6
— —
2
— —
6
— —
6
↔
BSET #xx:3, @ERd
BCLR BCLR #xx:3, Rd
BLD
B
No. of
States*1
↔ ↔ ↔ ↔ ↔ ↔
BSET BSET #xx:3, Rd
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
Appendix
B
BLD #xx:3, @aa:8
B
BILD BILD #xx:3, Rd
BST
BILD #xx:3, @ERd
B
BILD #xx:3, @aa:8
B
BST #xx:3, Rd
B
BST #xx:3, @ERd
B
BST #xx:3, @aa:8
B
BIST BIST #xx:3, Rd
B
BIST #xx:3, @ERd
B
BIST #xx:3, @aa:8
B
BAND BAND #xx:3, Rd
B
BAND #xx:3, @ERd
B
BAND #xx:3, @aa:8
B
BIAND BIAND #xx:3, Rd
BOR
B
B
BIAND #xx:3, @ERd
B
BIAND #xx:3, @aa:8
B
BOR #xx:3, Rd
B
BOR #xx:3, @ERd
B
BOR #xx:3, @aa:8
B
BIOR BIOR #xx:3, Rd
B
BIOR #xx:3, @ERd
B
BIOR #xx:3, @aa:8
B
BXOR BXOR #xx:3, Rd
B
BXOR #xx:3, @ERd
B
BXOR #xx:3, @aa:8
B
BIXOR BIXOR #xx:3, Rd
B
BIXOR #xx:3, @ERd
B
BIXOR #xx:3, @aa:8
B
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
H
N
Z
V
C
(#xx:3 of @ERd) → C
— — — — —
6
(#xx:3 of @aa:8) → C
— — — — —
¬ (#xx:3 of Rd8) → C
— — — — —
¬ (#xx:3 of @ERd) → C
— — — — —
¬ (#xx:3 of @aa:8) → C
— — — — —
C → (#xx:3 of Rd8)
— — — — — —
2
C → (#xx:3 of @ERd24)
— — — — — —
8
C → (#xx:3 of @aa:8)
— — — — — —
8
¬ C → (#xx:3 of Rd8)
— — — — — —
2
¬ C → (#xx:3 of @ERd24)
— — — — — —
8
¬ C → (#xx:3 of @aa:8)
— — — — — —
8
C∧(#xx:3 of Rd8) → C
— — — — —
2
C∧(#xx:3 of @ERd24) → C
— — — — —
C∧(#xx:3 of @aa:8) → C
— — — — —
C∧ ¬ (#xx:3 of Rd8) → C
— — — — —
C∧ ¬ (#xx:3 of @ERd24) → C — — — — —
4
4
2
4
4
2
C∧ ¬ (#xx:3 of @aa:8) → C
— — — — —
C∨(#xx:3 of Rd8) → C
— — — — —
C∨(#xx:3 of @ERd24) → C
— — — — —
C∨(#xx:3 of @aa:8) → C
— — — — —
C∨ ¬ (#xx:3 of Rd8) → C
— — — — —
C∨ ¬ (#xx:3 of @ERd24) → C — — — — —
4
4
2
4
4
2
C∨ ¬ (#xx:3 of @aa:8) → C
— — — — —
C⊕(#xx:3 of Rd8) → C
— — — — —
C⊕(#xx:3 of @ERd24) → C
— — — — —
C⊕(#xx:3 of @aa:8) → C
— — — — —
C⊕ ¬ (#xx:3 of Rd8) → C
— — — — —
C⊕ ¬ (#xx:3 of @ERd24) → C — — — — —
4
4
Advanced
I
Normal
—
@@aa
@(d, PC)
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
Condition Code
Operation
↔ ↔ ↔ ↔ ↔
BLD #xx:3, @ERd
No. of
States*1
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
BLD
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
C⊕ ¬ (#xx:3 of @aa:8) → C
— — — — —
6
2
6
6
6
6
2
6
6
2
6
6
2
6
6
2
6
6
2
6
6
Rev. 3.00 Aug 23, 2006 Page 563 of 616
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Appendix
6. Branching Instructions
Bcc
No. of
States*1
Condition Code
BRA d:8 (BT d:8)
—
2
BRA d:16 (BT d:16)
—
4
BRN d:8 (BF d:8)
—
2
BRN d:16 (BF d:16)
—
4
BHI d:8
—
2
BHI d:16
—
4
BLS d:8
—
2
BLS d:16
—
4
BCC d:8 (BHS d:8)
—
2
BCC d:16 (BHS d:16)
—
4
BCS d:8 (BLO d:8)
—
2
BCS d:16 (BLO d:16)
—
4
BNE d:8
—
2
BNE d:16
—
4
BEQ d:8
—
2
BEQ d:16
—
4
BVC d:8
—
2
BVC d:16
—
4
BVS d:8
—
2
BVS d:16
—
4
BPL d:8
—
2
BPL d:16
—
4
BMI d:8
—
2
BMI d:16
—
4
BGE d:8
—
2
BGE d:16
—
4
BLT d:8
—
2
BLT d:16
—
BGT d:8
I
H
N
Z
V
C
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
— — — — — —
6
— — — — — —
4
4
— — — — — —
6
—
2
Z∨ (N⊕V) = 0 — — — — — —
4
BGT d:16
—
4
— — — — — —
6
BLE d:8
—
2
Z∨ (N⊕V) = 1 — — — — — —
4
BLE d:16
—
4
— — — — — —
6
Rev. 3.00 Aug 23, 2006 Page 564 of 616
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If condition Always
is true then
PC ← PC+d
Never
else next;
Advanced
Branch
Condition
Normal
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
C∨ Z = 0
C∨ Z = 1
C=0
C=1
Z=0
Z=1
V=0
V=1
N=0
N=1
N⊕V = 0
N⊕V = 1
Appendix
JMP
BSR
JSR
RTS
JMP @ERn
—
JMP @aa:24
—
JMP @@aa:8
—
BSR d:8
—
BSR d:16
—
JSR @ERn
—
JSR @aa:24
—
JSR @@aa:8
—
RTS
—
No. of
States*1
Condition Code
H
N
Z
V
C
Advanced
I
Normal
—
@@aa
@(d, PC)
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
PC ← ERn
— — — — — —
PC ← aa:24
— — — — — —
PC ← @aa:8
— — — — — —
8
10
2
PC → @–SP
PC ← PC+d:8
— — — — — —
6
8
4
PC → @–SP
PC ← PC+d:16
— — — — — —
8
10
PC → @–SP
PC ← ERn
— — — — — —
6
8
PC → @–SP
PC ← aa:24
— — — — — —
8
10
PC → @–SP
PC ← @aa:8
— — — — — —
8
12
2 PC ← @SP+
— — — — — —
8
10
2
4
2
2
4
2
4
6
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Appendix
7. System Control Instructions
@(d:24, ERs) → CCR
LDC @ERs+, CCR
W
LDC @aa:16, CCR
W
6
@aa:16 → CCR
LDC @aa:24, CCR
W
8
@aa:24 → CCR
@ERs → CCR
ERs32+2 → ERs32
4
2
↔
↔
↔
↔
Advanced
↔
Normal
↔
↔ ↔ ↔ ↔ ↔
10
↔
W
↔ ↔
LDC @(d:24, ERs), CCR
↔ ↔ ↔ ↔ ↔
@(d:16, ERs) → CCR
↔
6
↔ ↔
W
↔ ↔ ↔ ↔ ↔
LDC @(d:16, ERs), CCR
@ERs → CCR
4
↔
W
10
2
↔ ↔
LDC @ERs, CCR
Rs8 → CCR
2
C
↔ ↔ ↔ ↔ ↔
B
V
↔
B
LDC Rs, CCR
Z
↔ ↔
#xx:8 → CCR
2
LDC #xx:8, CCR
N
↔ ↔ ↔ ↔ ↔
Transition to powerdown state
H
↔ ↔ ↔ ↔ ↔
—
@@aa
@(d, PC)
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
—
I
2
2
6
8
12
8
8
10
CCR → Rd8
2
CCR → @ERd
6
6
CCR → @(d:16, ERd)
8
STC CCR, @(d:24, ERd)
W
10
CCR → @(d:24, ERd)
12
STC CCR, @–ERd
W
ERd32–2 → ERd32
CCR → @ERd
8
STC CCR, @aa:16
W
6
CCR → @aa:16
8
STC CCR, @aa:24
W
8
CCR → @aa:24
10
ANDC ANDC #xx:8, CCR
B
2
CCR∧#xx:8 → CCR
B
2
CCR∨#xx:8 → CCR
B
2
CCR⊕#xx:8 → CCR
2 PC ← PC+2
ORC
ORC #xx:8, CCR
XORC XORC #xx:8, CCR
NOP
NOP
4
—
Rev. 3.00 Aug 23, 2006 Page 566 of 616
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↔ ↔ ↔
W
↔ ↔ ↔
STC CCR, @(d:16, ERd)
4
↔ ↔ ↔
W
↔ ↔ ↔
B
STC CCR, @ERd
↔ ↔ ↔
STC CCR, Rd
↔ ↔ ↔
STC
CCR ← @SP+
PC ← @SP+
↔
LDC
—
↔
SLEEP SLEEP
Condition Code
Operation
↔ ↔
RTE
No. of
States*1
↔ ↔
RTE
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
2
2
2
Appendix
8. Block Transfer Instructions
EEPMOV
No. of
States*1
H
N
Z
V
C
Normal
—
@@aa
@(d, PC)
I
EEPMOV. B
—
4 if R4L ≠ 0 then
repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4L–1 → R4L
until
R4L=0
else next
— — — — — — 8+
4n*2
EEPMOV. W
—
4 if R4 ≠ 0 then
repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4–1 → R4
until
R4=0
else next
— — — — — — 8+
4n*2
Advanced
Condition Code
Operation
@aa
@–ERn/@ERn+
@(d, ERn)
@ERn
Rn
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
Notes: 1. The number of states in cases where the instruction code and its operands are located
in on-chip memory is shown here. For other cases, see Appendix A.3, Number of
Execution States.
2. n is the value set in register R4L or R4.
(1)
(2)
(3)
(4)
(5)
Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0.
Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0.
Retains its previous value when the result is zero; otherwise cleared to 0.
Set to 1 when the adjustment produces a carry; otherwise retains its previous value.
The number of states required for execution of an instruction that transfers data in
synchronization with the E clock is variable.
(6) Set to 1 when the divisor is negative; otherwise cleared to 0.
(7) Set to 1 when the divisor is zero; otherwise cleared to 0.
(8) Set to 1 when the quotient is negative; otherwise cleared to 0.
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Rev. 3.00 Aug 23, 2006 Page 568 of 616
MULXU
5
STC
Table A.2
(2)
LDC
3
SUBX
OR
XOR
AND
MOV
C
D
E
F
BILD
BIST
BLD
BST
TRAPA
BEQ
B
BIAND
BAND
AND
RTE
BNE
CMP
BIXOR
BXOR
XOR
BSR
BCS
A
BIOR
BOR
OR
RTS
BCC
MOV.B
Table A.2
(2)
LDC
7
ADDX
BTST
DIVXU
BLS
AND.B
ANDC
6
9
BCLR
MULXU
BHI
XOR.B
XORC
5
ADD
BNOT
DIVXU
BRN
OR.B
ORC
4
8
7
BSET
BRA
6
2
1
Table A.2 Table A.2 Table A.2 Table A.2
(2)
(2)
(2)
(2)
NOP
4
3
2
1
0
0
MOV
BVS
9
B
JMP
BPL
BMI
MOV
Table A.2 Table A.2
(2)
(2)
Table A.2 Table A.2
(2)
(2)
A
Table A.2 Table A.2
EEPMOV
(2)
(2)
SUB
ADD
Table A.2
(2)
BVC
8
BSR
BGE
C
CMP
MOV
Instruction when most significant bit of BH is 1.
Instruction when most significant bit of BH is 0.
E
JSR
BGT
SUBX
ADDX
Table A.2
(3)
BLT
D
BLE
Table A.2
(2)
Table A.2
(2)
F
Table A.2
AL
1st byte 2nd byte
AH AL BH BL
A.2
AH
Instruction code:
Appendix
Operation Code Map
Operation Code Map (1)
MOV
7A
BRA
58
MOV
DAS
1F
79
SUBS
1B
1
CMP
CMP
ADD
BHI
2
ADD
BRN
NOT
17
DEC
ROTXR
13
1A
ROTXL
12
DAA
0F
SHLR
ADDS
0B
11
INC
0A
SHLL
MOV
01
10
0
SUB
SUB
BLS
OR
OR
XOR
XOR
BCS
AND
AND
BEQ
BVC
SUB
9
BVS
NEG
NOT
DEC
ROTR
ROTXR
DEC
ROTL
ADDS
SLEEP
8
ROTXL
EXTU
INC
7
SHAR
BNE
6
SHLR
EXTU
INC
5
SHAL
BCC
LDC/STC
4
SHLL
3
1st byte 2nd byte
AH AL BH BL
BPL
A
MOV
BMI
NEG
CMP
SUB
ROTR
ROTL
SHAR
C
D
BGE
BLT
DEC
EXTS
INC
Table A-2 Table A-2
(3)
(3)
ADD
SHAL
B
BGT
E
BLE
DEC
EXTS
INC
Table A-2
(3)
F
Table A.2
BH
AH AL
Instruction code:
Appendix
Operation Code Map (2)
Rev. 3.00 Aug 23, 2006 Page 569 of 616
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Rev. 3.00 Aug 23, 2006 Page 570 of 616
DIVXS
3
BSET
7Faa7 * 2
BNOT
BNOT
BCLR
BCLR
Notes: 1. r is the register designation field.
2. aa is the absolute address field.
BSET
7Faa6 * 2
BTST
BCLR
7Eaa7 * 2
BNOT
BTST
BSET
7Dr07 * 1
7Eaa6 * 2
BSET
7Dr06 * 1
BTST
BCLR
MULXS
2
7Cr07 * 1
BNOT
DIVXS
1
BTST
MULXS
0
7Cr06 * 1
01F06
01D05
01C05
01406
CL
BIOR
BOR
BIOR
BOR
OR
4
BIXOR
BXOR
BIXOR
BXOR
XOR
5
BIAND
BAND
BIAND
BAND
AND
6
7
BIST
BILD
BST
BLD
BIST
BILD
BST
BLD
1st byte 2nd byte 3rd byte 4th byte
AH AL BH BL CH CL DH DL
8
LDC
STC
9
A
LDC
STC
B
C
LDC
STC
D
E
LDC
STC
F
Instruction when most significant bit of DH is 1.
Instruction when most significant bit of DH is 0.
Table A.2
AH
ALBH
BLCH
Instruction code:
Appendix
Operation Code Map (3)
Appendix
A.3
Number of Execution States
The status of execution for each instruction of the H8/300H CPU and the method of calculating
the number of states required for instruction execution are shown below. Table A.4 shows the
number of cycles of each type occurring in each instruction, such as instruction fetch and data
read/write. Table A.3 shows the number of states required for each cycle. The total number of
states required for execution of an instruction can be calculated by the following expression:
Execution states = I × SI + J × SJ + K × SK + L × SL + M × SM + N × SN
Examples: When instruction is fetched from on-chip ROM, and an on-chip RAM is accessed.
BSET #0, @FF00
From table A.4:
I = L = 2, J = K = M = N= 0
From table A.3:
SI = 2, SL = 2
Number of states required for execution = 2 × 2 + 2 × 2 = 8
When instruction is fetched from on-chip ROM, branch address is read from on-chip ROM, and
on-chip RAM is used for stack area.
JSR @@ 30
From table A.4:
I = 2, J = K = 1,
L=M=N=0
From table A.3:
SI = SJ = SK = 2
Number of states required for execution = 2 × 2 + 1 × 2+ 1 × 2 = 8
Rev. 3.00 Aug 23, 2006 Page 571 of 616
REJ09B0182-0300
Appendix
Table A.3
Number of Cycles in Each Instruction
Access Location
Execution Status
(Instruction Cycle)
On-Chip Memory
On-Chip Peripheral Module
2
—
Instruction fetch
SI
Branch address read
SJ
Stack operation
SK
Byte data access
SL
2 or 3*
Word data access
SM
—
Internal operation
SN
Note:
*
1
Depends on which on-chip peripheral module is accessed. See section 24.1, Register
Addresses (Address Order).
Rev. 3.00 Aug 23, 2006 Page 572 of 616
REJ09B0182-0300
Appendix
Table A.4
Number of Cycles in Each Instruction
Instruction Mnemonic
Instruction
Fetch
I
ADD
ADD.B #xx:8, Rd
1
ADD.B Rs, Rd
1
ADD.W #xx:16, Rd
2
ADD.W Rs, Rd
1
ADD.L #xx:32, ERd
3
ADD.L ERs, ERd
1
ADDS
ADDS #1/2/4, ERd
1
ADDX
ADDX #xx:8, Rd
1
ADDX Rs, Rd
1
AND.B #xx:8, Rd
1
AND.B Rs, Rd
1
AND.W #xx:16, Rd
2
AND.W Rs, Rd
1
AND.L #xx:32, ERd
3
AND.L ERs, ERd
2
ANDC
ANDC #xx:8, CCR
1
BAND
BAND #xx:3, Rd
1
BAND #xx:3, @ERd
2
1
BAND #xx:3, @aa:8
2
1
BRA d:8 (BT d:8)
2
BRN d:8 (BF d:8)
2
BHI d:8
2
BLS d:8
2
BCC d:8 (BHS d:8)
2
BCS d:8 (BLO d:8)
2
BNE d:8
2
BEQ d:8
2
BVC d:8
2
BVS d:8
2
BPL d:8
2
BMI d:8
2
BGE d:8
2
AND
Bcc
Branch
Stack
Addr. Read Operation
J
K
Byte Data
Access
L
Word Data
Access
M
Internal
Operation
N
Rev. 3.00 Aug 23, 2006 Page 573 of 616
REJ09B0182-0300
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
Bcc
BLT d:8
2
BGT d:8
2
BLE d:8
2
BRA d:16(BT d:16)
2
2
BRN d:16(BF d:16)
2
2
BHI d:16
2
2
BLS d:16
2
2
BCC d:16(BHS d:16)
2
2
BCS d:16(BLO d:16)
2
2
BNE d:16
2
2
BEQ d:16
2
2
BVC d:16
2
2
BVS d:16
2
2
BPL d:16
2
2
BMI d:16
2
2
BGE d:16
2
2
BLT d:16
2
2
BGT d:16
2
2
BLE d:16
2
2
BCLR #xx:3, Rd
1
BCLR #xx:3, @ERd
2
2
BCLR #xx:3, @aa:8
2
2
BCLR Rn, Rd
1
BCLR Rn, @ERd
2
2
BCLR Rn, @aa:8
2
2
BIAND #xx:3, Rd
1
BIAND #xx:3, @ERd
2
1
BIAND #xx:3, @aa:8
2
1
BILD #xx:3, Rd
1
BILD #xx:3, @ERd
2
1
BILD #xx:3, @aa:8
2
1
BCLR
BIAND
BILD
Rev. 3.00 Aug 23, 2006 Page 574 of 616
REJ09B0182-0300
Stack
K
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
BIOR
BIOR #xx:3, Rd
1
BIOR #xx:3, @ERd
2
1
BIOR #xx:3, @aa:8
2
1
BIST #xx:3, Rd
1
BIST #xx:3, @ERd
2
2
BIST #xx:3, @aa:8
2
2
BIXOR #xx:3, Rd
1
BIXOR #xx:3, @ERd
2
1
BIXOR #xx:3, @aa:8
2
1
BLD #xx:3, Rd
1
BLD #xx:3, @ERd
2
1
BLD #xx:3, @aa:8
2
1
BNOT #xx:3, Rd
1
BNOT #xx:3, @ERd
2
2
BNOT #xx:3, @aa:8
2
2
BNOT Rn, Rd
1
BNOT Rn, @ERd
2
2
BNOT Rn, @aa:8
2
2
BOR #xx:3, Rd
1
BOR #xx:3, @ERd
2
1
BOR #xx:3, @aa:8
2
1
BSET #xx:3, Rd
1
BSET #xx:3, @ERd
2
2
BSET #xx:3, @aa:8
2
2
BSET Rn, Rd
1
BSET Rn, @ERd
2
2
BSET Rn, @aa:8
2
2
BSR d:8
2
1
BSR d:16
2
1
BST #xx:3, Rd
1
BST #xx:3, @ERd
2
2
BST #xx:3, @aa:8
2
2
BIST
BIXOR
BLD
BNOT
BOR
BSET
BSR
BST
Stack
K
2
Rev. 3.00 Aug 23, 2006 Page 575 of 616
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Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
BTST
BTST #xx:3, Rd
1
BTST #xx:3, @ERd
2
1
BTST #xx:3, @aa:8
2
1
BTST Rn, Rd
1
BTST Rn, @ERd
2
1
1
BXOR
CMP
BTST Rn, @aa:8
2
1
BXOR #xx:3, @ERd
2
1
BXOR #xx:3, @aa:8
2
1
CMP.B #xx:8, Rd
1
CMP.B Rs, Rd
1
CMP.W #xx:16, Rd
2
CMP.W Rs, Rd
1
CMP.L #xx:32, ERd
3
CMP.L ERs, ERd
1
DAA Rd
1
DAS
DAS Rd
1
DEC
DEC.B Rd
1
DEC.W #1/2, Rd
1
DEC.L #1/2, ERd
1
DIVXU
EEPMOV
EXTS
EXTU
K
BXOR #xx:3, Rd
DAA
DUVXS
Stack
DIVXS.B Rs, Rd
2
12
DIVXS.W Rs, ERd
2
20
DIVXU.B Rs, Rd
1
12
DIVXU.W Rs, ERd
1
20
1
EEPMOV.B
2
2n+2*
EEPMOV.W
2
2n+2*1
EXTS.W Rd
1
EXTS.L ERd
1
EXTU.W Rd
1
EXTU.L ERd
1
Rev. 3.00 Aug 23, 2006 Page 576 of 616
REJ09B0182-0300
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
INC
INC.B Rd
1
INC.W #1/2, Rd
1
INC.L #1/2, ERd
1
JMP @ERn
2
JMP @aa:24
2
JMP @@aa:8
2
JMP
JSR
LDC
MOV
Stack
K
2
1
2
JSR @ERn
2
1
JSR @aa:24
2
1
JSR @@aa:8
2
LDC #xx:8, CCR
1
LDC Rs, CCR
1
LDC@ERs, CCR
2
1
LDC@(d:16, ERs), CCR
3
1
LDC@(d:24,ERs), CCR
5
1
LDC@ERs+, CCR
2
1
LDC@aa:16, CCR
3
1
LDC@aa:24, CCR
4
1
MOV.B #xx:8, Rd
1
MOV.B Rs, Rd
1
MOV.B @ERs, Rd
1
1
MOV.B @(d:16, ERs), Rd
2
1
MOV.B @(d:24, ERs), Rd
4
1
MOV.B @ERs+, Rd
1
1
MOV.B @aa:8, Rd
1
1
MOV.B @aa:16, Rd
2
1
MOV.B @aa:24, Rd
3
1
MOV.B Rs, @Erd
1
1
MOV.B Rs, @(d:16, ERd)
2
1
MOV.B Rs, @(d:24, ERd)
4
1
MOV.B Rs, @-ERd
1
1
MOV.B Rs, @aa:8
1
1
1
2
1
2
2
2
Rev. 3.00 Aug 23, 2006 Page 577 of 616
REJ09B0182-0300
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
MOV
MOV.B Rs, @aa:16
2
1
MOV.B Rs, @aa:24
3
1
MOV.W #xx:16, Rd
2
MOV.W Rs, Rd
1
MOV.W @ERs, Rd
1
1
MOV.W @(d:16,ERs), Rd
2
1
MOV.W @(d:24,ERs), Rd
4
1
MOV.W @ERs+, Rd
1
1
MOV.W @aa:16, Rd
2
1
MOV.W @aa:24, Rd
3
1
MOV.W Rs, @ERd
1
1
MOV.W Rs, @(d:16,ERd)
2
1
MOV.W Rs, @(d:24,ERd)
4
1
MOV
Stack
K
MOV.W Rs, @-ERd
1
1
MOV.W Rs, @aa:16
2
1
MOV.W Rs, @aa:24
3
1
MOV.L #xx:32, ERd
3
MOV.L ERs, ERd
1
MOV.L @ERs, ERd
2
2
MOV.L @(d:16,ERs), ERd
3
2
MOV.L @(d:24,ERs), ERd
5
2
MOV.L @ERs+, ERd
2
2
MOV.L @aa:16, ERd
3
2
MOV.L @aa:24, ERd
4
2
MOV.L ERs,@ERd
2
2
MOV.L ERs, @(d:16,ERd)
3
2
MOV.L ERs, @(d:24,ERd)
5
2
MOV.L ERs, @-ERd
2
2
MOV.L ERs, @aa:16
3
2
4
2
MOV.L ERs, @aa:24
MOVFPE
MOVFPE @aa:16, Rd*
MOVTPE
MOVTPE Rs,@aa:16*2
2
2
1
2
1
Rev. 3.00 Aug 23, 2006 Page 578 of 616
REJ09B0182-0300
2
2
2
2
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
MULXS
MULXS.B Rs, Rd
2
12
MULXS.W Rs, ERd
2
20
MULXU.B Rs, Rd
1
12
MULXU.W Rs, ERd
1
20
NEG.B Rd
1
NEG.W Rd
1
MULXU
NEG
NEG.L ERd
1
NOP
NOP
1
NOT
NOT.B Rd
1
NOT.W Rd
1
NOT.L ERd
1
OR
Stack
K
OR.B #xx:8, Rd
1
OR.B Rs, Rd
1
OR.W #xx:16, Rd
2
OR.W Rs, Rd
1
OR.L #xx:32, ERd
3
OR.L ERs, ERd
2
ORC
ORC #xx:8, CCR
1
POP
POP.W Rn
1
1
2
POP.L ERn
2
2
2
PUSH.W Rn
1
1
2
PUSH.L ERn
2
2
2
ROTL.B Rd
1
ROTL.W Rd
1
ROTL.L ERd
1
ROTR.B Rd
1
ROTR.W Rd
1
ROTR.L ERd
1
ROTXL.B Rd
1
ROTXL.W Rd
1
ROTXL.L ERd
1
PUSH
ROTL
ROTR
ROTXL
Rev. 3.00 Aug 23, 2006 Page 579 of 616
REJ09B0182-0300
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
ROTXR
ROTXR.B Rd
1
ROTXR.W Rd
1
ROTXR.L ERd
1
RTE
RTE
2
2
2
RTS
RTS
2
1
2
SHAL
SHAL.B Rd
1
SHAL.W Rd
1
SHAL.L ERd
1
SHAR.B Rd
1
SHAR.W Rd
1
SHAR.L ERd
1
SHAR
SHLL
SHLR
SHLL.B Rd
1
SHLL.W Rd
1
SHLL.L ERd
1
SHLR.B Rd
1
SHLR.W Rd
1
Stack
K
SHLR.L ERd
1
SLEEP
SLEEP
1
STC
STC CCR, Rd
1
STC CCR, @ERd
2
1
STC CCR, @(d:16,ERd)
3
1
STC CCR, @(d:24,ERd)
5
1
STC CCR,@-ERd
2
1
STC CCR, @aa:16
3
1
STC CCR, @aa:24
4
1
SUB.B Rs, Rd
1
SUB.W #xx:16, Rd
2
SUB.W Rs, Rd
1
SUB.L #xx:32, ERd
3
SUB.L ERs, ERd
1
SUBS #1/2/4, ERd
1
SUB
SUBS
Rev. 3.00 Aug 23, 2006 Page 580 of 616
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2
Appendix
Instruction
Branch
Byte Data
Word Data
Internal
Fetch
Addr. Read Operation
Access
Access
Operation
Instruction Mnemonic
I
J
L
M
N
SUBX
SUBX #xx:8, Rd
1
SUBX. Rs, Rd
1
XOR.B #xx:8, Rd
1
XOR.B Rs, Rd
1
XOR.W #xx:16, Rd
2
XOR.W Rs, Rd
1
XOR.L #xx:32, ERd
3
XOR.L ERs, ERd
2
XORC #xx:8, CCR
1
XOR
XORC
Stack
K
Notes: 1. n: Specified value in R4L. The source and destination operands are accessed n+1
times respectively.
2. It can not be used in this LSI.
Rev. 3.00 Aug 23, 2006 Page 581 of 616
REJ09B0182-0300
Appendix
A.4
Combinations of Instructions and Addressing Modes
Table A.5
Combinations of Instructions and Addressing Modes
—
Arithmetic
operations
BWL BWL
WL BWL
B
B
—
L
— BWL
—
B
— BW
ADD, CMP
SUB
ADDX, SUBX
ADDS, SUBS
INC, DEC
DAA, DAS
MULXU,
MULXS,
DIVXU,
DIVXS
NEG
EXTU, EXTS
Logical
AND, OR, XOR
operations NOT
Shift operations
Bit manipulations
Branching
BCC, BSR
instructions JMP, JSR
System
control
instructions
RTS
RTE
SLEEP
LDC
STC
ANDC, ORC,
XORC
NOP
Block data transfer instructions
—
—
—
—
—
—
—
—
—
—
—
B
—
B
—
—
—
—
—
—
—
—
—
WL
—
—
—
—
—
BWL BWL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BWL
WL
BWL
BWL
BWL
B
—
—
—
—
—
—
B
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
B
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
B
B
—
W
W
—
W
W
—
W
W
—
W
W
—
—
—
—
W
W
—
W
W
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Rev. 3.00 Aug 23, 2006 Page 582 of 616
REJ09B0182-0300
—
—
@@aa:8
B
—
@(d:16.PC)
BWL BWL BWL BWL BWL BWL
—
—
—
—
—
—
—
—
—
—
—
—
@(d:8.PC)
Data
MOV
transfer
POP, PUSH
instructions
MOVFPE,
MOVTPE
@aa:24
@aa:16
@aa:8
@ERn+/@ERn
@(d:24.ERn)
@ERn
Rn
Instructions
#xx
Functions
@(d:16.ERn)
Addressing Mode
—
—
BW
Appendix
B.
I/O Ports
B.1
I/O Port Block Diagrams
SBY (Low at a reset or in standby mode)
PUCR16
VCC
P16
PDR16
VSS
PCR16
Internal data bus
VCC
SCI4 module
PDR1:
Port data register 1
PCR1:
Port control register 1
SCKO4
SCKI4
SCKIE
SCKOE
PUCR1: Port pull-up control register 1
Figure B.1 (a) Port 1 Block Diagram (P16) (F-ZTAT Version)
Rev. 3.00 Aug 23, 2006 Page 583 of 616
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Appendix
SBY
PUCR16
VCC
VCC
P16
Internal data bus
PDR16
PCR16
VSS
PDR1:
Port data register 1
PCR1:
Port control register 1
PUCR1: Port pull-up control register 1
Figure B.1 (b) Port 1 Block Diagram (P16) (Masked ROM Version)
SBY
TPU module
TO1AE (P12)
TO1BE (P13)
TO2AE (P14)
TO2BE (P15)
PUCR1n
VCC
P1n
PDR1n
VSS
PCR1n
PDR1: Port data register 1
PCR1: Port control register 1
PUCR1: Port pull-up control register 1
n = 5 to 2
Figure B.1 (c) Port 1 Block Diagram (P15 to P12)
Rev. 3.00 Aug 23, 2006 Page 584 of 616
REJ09B0182-0300
Internal data bus
VCC
TO1A (P12)
TO1B (P13)
TO2A (P14)
TO2B (P15)
TI1A (P12)
TI1B (P13)
TI2A (P14)
TI2B (P15)
TCLKA (P12)
TCLKB (P13)
TCLKC (P14)
Appendix
SBY
PUCR1n
VCC
VCC
P1n
PDR1n
VSS
PCR1n
Internal data bus
PMR1n
AEC module
AEVH(P10)
AEVL(P11)
PDR1: Port data register 1
PCR1: Port control register 1
PMR1: Port mode register 1
PUCR1: Port pull-up control register 1
n = 1, 0
Figure B.1 (d) Port 1 Block Diagram (P11, P10)
Rev. 3.00 Aug 23, 2006 Page 585 of 616
REJ09B0182-0300
Appendix
SBY
PUCR37
VCC
P37
Internal data bus
VCC
PDR37
VSS
PCR37
SCI4 module
SO4
TE4
PDR3:
Port data register 3
PCR3:
Port control register 3
PUCR3: Port pull-up control register 3
Figure B.2 (a) Port 3 Block Diagram (P37) (F-ZTAT Version)
SBY
PUCR37
VCC
PDR37
P37
PCR37
VSS
PDR3:
Port data register 3
PCR3:
Port control register 3
PUCR3: Port pull-up control register 3
Figure B.2 (b) Port 3 Block Diagram (P37) (Masked ROM Version)
Rev. 3.00 Aug 23, 2006 Page 586 of 616
REJ09B0182-0300
Internal data bus
VCC
Appendix
SBY
PUCR36
VCC
P36
Internal data bus
VCC
PDR36
VSS
PCR36
SCI4 module
SI
RE
PDR3:
Port data register 3
PCR3:
Port control register 3
PUCR3: Port pull-up control register 3
Figure B.2 (c) Port 3 Block Diagram (P36) (F-ZTAT Version)
SBY
PUCR36
VCC
VCC
P36
Internal data bus
PDR36
PCR36
VSS
PDR3:
Port data register 3
PCR3:
Port control register 3
PUCR3: Port pull-up control register 3
Figure B.2 (d) Port 3 Block Diagram (P36) (Masked ROM Version)
Rev. 3.00 Aug 23, 2006 Page 587 of 616
REJ09B0182-0300
Appendix
SBY
SPC32
SCI3_2 module
VCC
TXD32
P32
PDR32
Internal data bus
SCINV3
PCR32
VSS
I2C bus 2 module
ICE
SCLO
SCLI
VSS
PDR3: Port data register 3
PCR:
Port control register 3
Figure B.2 (e) Port 3 Block Diagram (P32)
Rev. 3.00 Aug 23, 2006 Page 588 of 616
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Appendix
SBY
SCI3_2 module
VCC
PDR31
VSS
PCR31
Internal data bus
P31
RE32
RXD32
SCINV2
VSS
I2C bus 2 module
ICE
SDAO
SDAI
PDR3: Port data register 3
PCR3: Port control register 3
Figure B.2 (f) Port 3 Block Diagram (P31)
Rev. 3.00 Aug 23, 2006 Page 589 of 616
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Appendix
SBY
PUCR30
VCC
VCC
RTC module
P30
PDR30
VSS
PCR30
Internal data bus
PMR30
TMOW
SCI3_2 module
SCKIE32
SCKOE32
SCKO32
SCKI32
PDR3:
Port data register 3
PCR3:
Port control register 3
PMR3:
Port mode register 3
PUCR3: Port pull-up control register 3
Figure B.2 (g) Port 3 Block Diagram (P30)
Rev. 3.00 Aug 23, 2006 Page 590 of 616
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Appendix
Timer F module
SBY
TMOFH
SCINV1
VCC
SPC31
SCI3_1 module
P42
PDR42
PCR42
Internal data bus
TXD31/IrTXD
VSS
PMR42
PDR4: Port data register 4
PCR4: Port contol register 4
PMR4: Port mode register 4
Figure B.3 (a) Port 4 Block Diagram (P42)
Rev. 3.00 Aug 23, 2006 Page 591 of 616
REJ09B0182-0300
Appendix
SBY
SCI3_1 module
VCC
RE31
RXD31/IrRXD
PMR41
P41
PCR41
VSS
Internal data bus
PDR41
Timer F module
TMOFL
PDR4: Port data register 4
SCINV0
PCR4: Port control register 4
PMR4: Port mode register 4
Figure B.3 (b) Port 4 Block Diagram (P41)
Rev. 3.00 Aug 23, 2006 Page 592 of 616
REJ09B0182-0300
Appendix
SBY
SCI3_1 module
SCKIE31
SCKOE31
VCC
SCKO31
SCKI31
P40
PCR40
VSS
PMR40
Internal data bus
PDR40
Timer F module
TMIF
PDR4: Port data register 4
PCR4: Port control register 4
PMR4: Port mode register 4
Figure B.3 (c) Port 4 Block Diagram (P40)
Rev. 3.00 Aug 23, 2006 Page 593 of 616
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Appendix
SBY
PUCR5n
VCC
VCC
PMR5n
P5n
VSS
PCR5n
Internal data bus
PDR5n
WKPn
PDR5:
Port data register 5
PCR5:
Port control register 5
PMR5:
Port mode register 5
PUCR5: Port pull-up control register 5
n = 7 to 0
Figure B.4 Port 5 Block Diagram
Rev. 3.00 Aug 23, 2006 Page 594 of 616
REJ09B0182-0300
Appendix
SBY
PUCR6n
VCC
PCR6n
P6n
Internal data bus
PDR6n
VCC
VSS
PDR6:
Port data register 6
PCR6:
Port control register 6
PUCR6: Port pull-up control register 6
n = 7 to 0
Figure B.5 Port 6 Block Diagram
SBY
VCC
PCR7n
P7n
Internal data bus
PDR7n
VSS
PDR7: Port data register 7
PCR7: Port control register 7
n = 7 to 0
Figure B.6 Port 7 Block Diagram
Rev. 3.00 Aug 23, 2006 Page 595 of 616
REJ09B0182-0300
Appendix
SBY
PDR8n
PCR8n
P8n
Internal data bus
VCC
VSS
PDR8: Port data register 8
PCR8: Port control register 8
n = 7 to 0
Figure B.7 Port 8 Block Diagram
SBY
PDR93
PCR93
P93
VSS
PDR9: Port data register 9
PCR9: Port control register 9
Figure B.8 (a) Port 9 Block Diagram (P93)
Rev. 3.00 Aug 23, 2006 Page 596 of 616
REJ09B0182-0300
Internal data bus
VCC
Appendix
SBY
VCC
P92
PDR92
VSS
PCR92
Internal data bus
PMR92
IRQ4
PDR9: Port data register 9
PCR9: Port control register 9
PMR9: Port mode register 9
Figure B.8 (b) Port 9 Block Diagram (P92)
Rev. 3.00 Aug 23, 2006 Page 597 of 616
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Appendix
PWM module
SBY
PWMn+1
VCC
P9n
Internal data bus
PMR9n
PDR9n
VSS
PCR9n
PDR9: Port data register 9
PCR9: Port control register 9
PMR9: Port mode register 9
n = 1, 0
Figure B.8 (c) Port 9 Block Diagram (P91, P90)
SBY
VCC
PCRAn
PAn
VSS
PDRA: Port data register A
PCRA: Port control register A
n = 3 to 0
Figure B.9 Port A Block Diagram
Rev. 3.00 Aug 23, 2006 Page 598 of 616
REJ09B0182-0300
Internal data bus
PDRAn
Internal data bus
Appendix
PBn
∆Σ A/D module
DEC
ADSSR5, ADSSR4
Ain1, Ain2
n = 7, 6
Internal data bus
Figure B.10 (a) Port B Block Diagram (PB7, PB6)
PB5
∆Σ A/D module
DEC
ADCR3, ADCR2
Vref
Figure B.10 (b) Port B Block Diagram (PB5)
Rev. 3.00 Aug 23, 2006 Page 599 of 616
REJ09B0182-0300
Appendix
PMRBn
PBn
Internal data bus
IRQm
A/D module
DEC
AMR3 to AMR0
VIN
n = 2 to 0
m = 3, 1, 0
Figure B.10 (c) Port B Block Diagram (PB2 to PB0)
Rev. 3.00 Aug 23, 2006 Page 600 of 616
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Appendix
B.2
Port States in Each Operating State
Sleep
Active
(High-Speed/
Port
P16 to P10
(High-Speed/
Reset
Medium-Speed)
Subsleep
High
Retained
Retained
impedance
P37, P36,
High
P32 to P30
impedance
P42 to P40
High
High
Retained
Retained
High
Retained
Retained
High
Retained
Retained
High
Retained
Retained
High
Retained
Retained
High
Retained
Retained
High
PB2 to PB0
impedance
Notes: *
Retained
Functioning
Functioning
Retained
Functioning
Functioning
Retained
Functioning
Functioning
Retained
Functioning
Functioning
Retained
Functioning
Functioning
Retained
Functioning
Functioning
Retained
Functioning
Functioning
Retained
Functioning
Functioning
Retained
High
High impedance
High
High
High
High
High
High
High
impedance*
Retained
Retained
High
impedance*
Retained
Retained
impedance
PB7 to PB5,
Functioning
impedance*
impedance
PA3 to PA0
Functioning
impedance*
impedance
P93 to P90
High
impedance*
impedance
P87 to P80
Watch
impedance*
impedance
P77 to P70
Medium-Speed)
impedance*
impedance
P67 to P60
Subactive
impedance*
impedance
P57 to P50
Standby
High
impedance*
High impedance
High
High
impedance impedance*
impedance
impedance
Registers are retained and output level is high impedance.
Rev. 3.00 Aug 23, 2006 Page 601 of 616
REJ09B0182-0300
Appendix
C.
Product Code Lineup
Package
Product Classification
H8/38086R
H8/38086R
Group
Product Code
Flash memory Regular specifications HD64F38086RH4
version
Wide-range
Model Marking
(Package Code)
F38086H4
80 pin QFP (FP-80A)
HD64F38086RH10
F38086H10
HD64F38086RW4
F38086W4
HD64F38086RW10
F38086W10
HD64F38086RLP4V
F38086RLP4V
HD64F38086RLP10V
F38086RLP10V
HCD64F38086RC4
—
Chip
HCD64F38086RC10
—
Chip
HD64F38086RH10W
F38086H10
80 pin QFP (FP-80A)
HD64F38086RW10W
F38086R10
80 pin TQFP (TFP-80C)
HD64F38086RLP10WV
F38086RLP10WV
80 pin P-TFLGA
80 pin TQFP (TFP-80C)
80 pin P-TFLGA
(TLP-85V)
specifications
(TLP-85V)
Masked ROM Regular specifications HD64338086RH
version
38086(***)H
80 pin QFP (FP-80A)
HD64338086RW
38086(***)W
80 pin TQFP (TFP-80C)
HD64338086RLPV
38086R(***)LPV
80 pin P-TFLGA
(TLP-85V)
Wide-range
specifications
HCD64338086R
—
Chip
HD64338086RHW
38086(***)H
80 pin QFP (FP-80A)
HD64338086RWW
38086(***)W
80 pin TQFP (TFP-80C)
HD64338086RLPWV
38086R(***)LPWV
80 pin P-TFLGA
(TLP-85V)
Rev. 3.00 Aug 23, 2006 Page 602 of 616
REJ09B0182-0300
Appendix
Package
Product Classification
H8/38086R
H8/38085R
Group
Product Code
Model Marking
(Package Code)
38085(***)H
80 pin QFP (FP-80A)
HD64338085RW
38085(***)W
80 pin TQFP (TFP-80C)
HD64338085RLPV
38085R(***)LPV
80 pin P-TFLGA
Masked ROM Regular specifications HD64338085RH
version
(TLP-85V)
Wide-range
specifications
HCD64338085R
—
Chip
HD64338085RHW
38085(***)H
80 pin QFP (FP-80A)
HD64338085RWW
38085(***)W
80 pin TQFP (TFP-80C)
HD64338085RLPWV
38085R(***)LPWV
80 pin P-TFLGA
(TLP-85V)
H8/38084R
Masked ROM Regular specifications HD64338084RH
version
38084(***)H
80 pin QFP (FP-80A)
HD64338084RW
38084(***)W
80 pin TQFP (TFP-80C)
HD64338084RLPV
38084R(***)LPV
80 pin P-TFLGA
(TLP-85V)
Wide-range
HCD64338084R
—
Chip
HD64338084RHW
38084(***)H
80 pin QFP (FP-80A)
HD64338084RWW
38084(***)W
80 pin TQFP (TFP-80C)
HD64338084RLPWV
38084R(***)LPWV
80 pin P-TFLGA
specifications
(TLP-85V)
H8/38083R
Masked ROM Regular specifications HD64338083RH
version
38083(***)H
80 pin QFP (FP-80A)
HD64338083RW
38083(***)W
80 pin TQFP (TFP-80C)
HD64338083RLPV
38083R(***)LPV
80 pin P-TFLGA
(TLP-85V)
Wide-range
HCD64338083R
—
Chip
HD64338083RHW
38083(***)H
80 pin QFP (FP-80A)
HD64338083RWW
38083(***)W
80 pin TQFP (TFP-80C)
HD64338083RLPWV
38083R(***)LPWV
80 pin P-TFLGA
specifications
(TLP-85V)
[Legend]
(***): ROM code
Rev. 3.00 Aug 23, 2006 Page 603 of 616
REJ09B0182-0300
Appendix
D.
Package Dimensions
The package dimensions that are shown in the Renesas Semiconductor Packages Data Book have
priority.
Rev. 3.00 Aug 23, 2006 Page 604 of 616
REJ09B0182-0300
80
e
1
ZD
D
y
*3
bp
20
41
x
21
40
M
F
MASS[Typ.]
1.2g
Detail F
L1
L
Terminal cross section
b1
bp
θ
17.2
17.2
16.9
16.9
HD
HE
L1
1.6
0.8
0.83
ZE
L
0.83
ZD
1.1
0.12
8°
0.10
0.65
0.22
y
0.5
0°
0.15
0.17
0.30
0.40
0.25
3.05
17.5
17.5
Max
x
e
θ
c1
c
0.12
0.32
0.24
bp
b1
0.10
0.00
A1
A
2.70
14
14
Nom
Dimension in Millimeters
Min
A2
E
D
Reference
Symbol
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
c1
HD
E
*2
61
60
*1
Previous Code
FP-80A/FP-80AV
A2
A1
c
HE
ZE
RENESAS Code
PRQP0080JB-A
c
JEITA Package Code
P-QFP80-14x14-0.65
Appendix
Figure D.1 Package Dimensions (FP-80A)
Rev. 3.00 Aug 23, 2006 Page 605 of 616
REJ09B0182-0300
A
Figure D.2 Package Dimensions (TFP-80C)
80
e
ZD
1
HD
Index mark
D
y
*3
bp
20
41
x
F
M
21
40
E
*2
61
60
*1
Previous Code
TFP-80C/TFP-80CV
MASS[Typ.]
0.4g
Detail F
L1
L
Terminal cross section
b1
bp
θ
13.8
L1
1.0
0.5
1.25
ZE
L
1.25
ZD
0.6
0.10
8°
0.22
0.10
0.5
0.15
0.17
y
0.4
0°
0.12
0.27
0.20
1.20
14.2
14.2
Max
x
e
θ
c1
c
0.20
0.17
b1
0.10
0.22
0.00
bp
14.0
14.0
A1
A
13.8
A2
HD
12
1.00
E
HE
12
Nom
Dimension in Millimeters
Min
D
Reference
Symbol
NOTE)
1. DIMENSIONS"*1"AND"*2"
DO NOT INCLUDE MOLD FLASH
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
c1
A
A2
HE
ZE
RENESAS Code
PTQP0080KC-A
c
REJ09B0182-0300
A1
Rev. 3.00 Aug 23, 2006 Page 606 of 616
c
JEITA Package Code
P-TQFP80-12x12-0.50
Appendix
Appendix
JEITA Package Code
P-TFLGA85-7x7-0.65
RENESAS Code
PTLG0085JA-A
Previous Code
TLP-85V
MASS[Typ.]
0.1g
D
w S B
E
w S A
×4
v
y1 S
A
S
y
S
ZD
e
A
K
Reference
Symbol
e
J
H
G
B
F
E
Dimension in Millimeters
Min
Nom
D
7.0
E
7.0
Max
v
0.15
w
0.20
A
1.20
A1
D
0.65
e
C
ZE
b
B
A
0.30
0.35
0.40
x
0.08
y
0.10
y1
0.2
SD
1
2
3
4
5
6
φ b
7
φ
8
9
10
SE
×M S A B
ZD
0.575
ZE
0.575
Figure D.3 Package Dimensions (TLP-85V)
Rev. 3.00 Aug 23, 2006 Page 607 of 616
REJ09B0182-0300
Appendix
E.
Chip Form Specifications
Maximum dimensions
in chip's plane
X direction: TBD
Y direction: TBD
Max 0.03
0.28 ± 0.02
X direction: TBD
Y direction: TBD
Unit: mm
Figure E.1 Cross-Sectional View of Chip
(HCD64338086R, HCD64338085R, HCD64338084R, and HCD64338083R)
Maximum dimensions
in chip's plane
X direction: 4.73 ± 0.25
Y direction: 4.73 ± 0.25
Max 0.03
0.28 ± 0.02
X direction: 4.73 ± 0.05
Y direction: 4.73 ± 0.05
Unit: mm
Figure E.2 Cross-Sectional View of Chip (HCD64F38086R)
Rev. 3.00 Aug 23, 2006 Page 608 of 616
REJ09B0182-0300
Appendix
F.
Bonding Pad Form
Bonding area
5 µm
65 µm
Metallic film is visible from here
65 µm
5 µm
Figure F.1 Bonding Pad Form
(HCD64F38086R, HCD64338086R, HCD64338085R, HCD64338084R, and HCD64338083R)
Rev. 3.00 Aug 23, 2006 Page 609 of 616
REJ09B0182-0300
Appendix
G.
Chip Tray Specifications
3.69
51
51
3.60
5.50 ± 0.1
6.25 ± 0.1
1.8 ± 0.1
0.38 ± 0.05
3.80 ± 0.05
5.50 ± 0.1
6.25 ± 0.1
X'
4.0 ± 0.1
X
3.83 ± 0.05
Chip tray code
Nissen Chemitec Corporation
Product code: CT193
Characteristic engraving: CT2038038-038N
Unit: mm
Cross-sectional view: X to X'
Figure G.1 Chip Tray Specifications
(HCD64338086R, HCD64338085R, HCD64338084R, and HCD64338083R)
Rev. 3.00 Aug 23, 2006 Page 610 of 616
REJ09B0182-0300
Appendix
51
Chip
Product
name
4.73
Chip orientation
51
4.73
6.3 ± 0.1
6.6 ± 0.1
Cross-sectional view: X to X'
1.8 ± 0.1
0.6 ± 0.1
5.3 ± 0.05
6.3 ± 0.1
6.6 ± 0.1
X'
4.0 ± 0.1
X
5.3 ± 0.05
Chip tray code
Manufactured by DAINIPPON INK AND CHEMICALS,
INCORPORATED
Product code: CT030
Characteristic engraving: 2CT053053-060
Unit: mm
Figure G.2 Chip Tray Specifications (HCD64F38086R)
Rev. 3.00 Aug 23, 2006 Page 611 of 616
REJ09B0182-0300
Appendix
Rev. 3.00 Aug 23, 2006 Page 612 of 616
REJ09B0182-0300
Index
Numerics and symbol
D
∆Σ A/D converter ................................... 401
16-bit timer mode ................................... 224
16-bit timer pulse unit............................. 233
8-bit timer mode ..................................... 225
Data reading procedure ........................... 213
Data transfer instructions .......................... 35
E
A
A/D converter ......................................... 387
Absolute address....................................... 46
Acknowledge .......................................... 454
Address break ......................................... 479
Addressing modes..................................... 45
Arithmetic operations instructions............ 36
Asynchronous Event Counter (AEC)...... 281
Asynchronous mode ............................... 332
B
Bit manipulation instructions.................... 39
Bit rate .................................................... 321
Bit synchronous circuit ........................... 472
Block data transfer instructions ................ 43
Boot mode............................................... 143
Boot program.......................................... 142
Branch instructions ................................... 41
Break....................................................... 356
C
Clock pulse generators.............................. 97
Clocked synchronous mode .................... 344
Clocked synchronous serial format......... 463
Condition field .......................................... 44
Condition-code register (CCR) ................. 29
CPU .......................................................... 25
Effective address ....................................... 49
Effective address extension....................... 44
Erase/erase-verify.................................... 150
Erasing units............................................ 136
Error protection....................................... 152
Exception handling ................................... 61
F
Flash memory.......................................... 135
Framing error .......................................... 340
Free-running count operation.................. 253
G
General registers ....................................... 28
H
Hardware protection................................ 152
I
I/O ports .................................................. 159
I2C bus format ......................................... 453
I2C bus interface 2 (IIC2)........................ 437
Immediate ................................................. 47
Initial setting procedure .......................... 212
Instruction set............................................ 34
Rev. 3.00 Aug 23, 2006 Page 613 of 616
REJ09B0182-0300
Interrupt mask bit (I)................................. 29
IrDA........................................................ 350
Programmer mode................................... 153
Programming units.................................. 136
Programming/erasing in user program
mode ....................................................... 145
L
Large current ports...................................... 2
LCD controller/driver ............................. 415
LCD display............................................ 426
LCD RAM .............................................. 428
Logic operations instructions.................... 38
M
Mark state ............................................... 356
Memory indirect ....................................... 47
Memory map ............................................ 26
Module standby function ........................ 131
N
Noise canceler......................................... 466
O
On-board programming modes............... 142
Operation field.......................................... 44
Overrun error .......................................... 340
P
Package....................................................... 2
Parity error.............................................. 340
Pin assignment............................................ 4
Power-down modes ................................ 111
Power-down states.................................. 153
Power-on reset circuit ............................. 476
Program counter (PC) ............................... 29
Program/program-verify ......................... 147
Program-counter relative .......................... 47
Rev. 3.00 Aug 23, 2006 Page 614 of 616
REJ09B0182-0300
R
RAM ....................................................... 157
Realtime clock (RTC) ............................. 203
Register direct ........................................... 45
Register field............................................. 44
Register indirect ........................................ 46
Register indirect with displacement .......... 46
Register indirect with post-increment ....... 46
Register indirect with pre-decrement ........ 46
Registers
ABRKCR2 .................. 480, 488, 494, 499
ABRKSR2 .................. 482, 488, 494, 499
ADRR ......................... 389, 489, 495, 501
ADSR.......................... 391, 489, 495, 501
AEGSR ....................... 285, 488, 494, 500
AMR ........................... 390, 489, 495, 501
BAR2H ....................... 482, 488, 494, 499
BAR2L........................ 482, 488, 494, 499
BDR2H ....................... 482, 488, 494, 499
BDR2L........................ 482, 488, 494, 499
BGRMR ...................... 425, 489, 495, 500
BRR ............................ 321, 489, 495, 500
CKSTPR1 ................... 115, 491, 497, 502
CKSTPR2 ................... 115, 491, 497, 502
EBR1........................... 140, 486, 492, 498
ECCR .......................... 286, 488, 494, 500
ECCSR........................ 287, 488, 494, 500
ECH ............................ 289, 488, 494, 500
ECL............................. 289, 488, 494, 500
ECPWCR .................... 283, 488, 494, 500
ECPWDR.................... 284, 488, 494, 500
FENR .......................... 141, 486, 492, 498
FLMCR1..................... 138, 486, 492, 498
FLMCR2..................... 139, 486, 492, 498
FLPWCR .................... 141, 486, 492, 498
ICCR1......................... 440, 487, 493, 499
ICCR2......................... 443, 487, 493, 499
ICDRR ........................ 452, 487, 493, 499
ICDRS ................................................ 452
ICDRT ........................ 452, 487, 493, 499
ICIER.......................... 447, 487, 493, 499
ICMR .......................... 445, 487, 493, 499
ICSR ........................... 449, 487, 493, 499
IEGR............................. 75, 490, 497, 502
IENR............................. 77, 491, 497, 502
INTM............................ 85, 491, 497, 502
IPR................................ 84, 487, 494, 499
IrCR ............................ 331, 489, 495, 500
IRR................................ 79, 491, 497, 502
IWPR ............................ 82, 491, 497, 502
LCR ............................ 419, 488, 495, 500
LCR2 .......................... 421, 488, 495, 500
LPCR .......................... 418, 488, 495, 500
LTRMR ...................... 423, 488, 495, 500
OCR ............................ 220, 489, 495, 501
OSCCR ....................... 100, 489, 495, 501
PCR1........................... 160, 490, 496, 502
PCR3........................... 169, 490, 496, 502
PCR4........................... 174, 490, 496, 502
PCR5........................... 178, 490, 496, 502
PCR6........................... 182, 490, 496, 502
PCR7........................... 186, 490, 496, 502
PCR8........................... 188, 490, 497, 502
PCR9........................... 191, 490, 497, 502
PCRA.......................... 194, 490, 497, 502
PDR1 .......................... 160, 490, 496, 501
PDR3 .......................... 168, 490, 496, 501
PDR4 .......................... 173, 490, 496, 501
PDR5 .......................... 178, 490, 496, 501
PDR6 .......................... 182, 490, 496, 501
PDR7 .......................... 185, 490, 496, 501
PDR8 .......................... 188, 490, 496, 501
PDR9 .......................... 190, 490, 496, 501
PDRA.......................... 193, 490, 496, 501
PDRB .......................... 196, 490, 496, 501
PMR1 .......................... 161, 489, 495, 501
PMR3 .......................... 170, 489, 496, 501
PMR4 .......................... 175, 489, 496, 501
PMR5 .......................... 179, 489, 496, 501
PMR9 .......................... 191, 489, 496, 501
PMRB ......................... 197, 489, 496, 501
PUCR1 ........................ 161, 490, 496, 502
PUCR3 ........................ 169, 490, 496, 502
PUCR5 ........................ 179, 490, 496, 502
PUCR6 ........................ 183, 490, 496, 502
PWCR ......................... 382, 490, 496, 501
PWDR......................... 383, 490, 496, 501
RDR ............................ 312, 489, 495, 500
RHRDR....................... 206, 487, 493, 499
RMINDR..................... 205, 487, 493, 499
RSECDR ..................... 205, 487, 493, 499
RSR..................................................... 312
RTCCR1 ..................... 208, 487, 493, 499
RTCCR2 ..................... 209, 487, 493, 499
RTCCSR ..................... 210, 487, 493, 499
RTCFLG ..................... 211, 487, 493, 499
RWKDR...................... 207, 487, 493, 499
SAR............................. 451, 487, 493, 499
SCR3 ................... 316, 488, 489, 495, 500
SCR4 ........................... 363, 486, 492, 498
SCSR4......................... 366, 486, 492, 498
SMR ............................ 313, 489, 495, 500
SPCR........................... 329, 488, 494, 500
SSR ............................. 318, 489, 495, 500
SUB32CR ..................... 99, 487, 493, 499
SYSCR1...................... 112, 490, 497, 502
SYSCR2...................... 114, 490, 497, 502
TC ............................... 219, 489, 495, 501
TCNT .......................... 247, 486, 492, 498
TCR............................. 237, 486, 492, 498
TCRF .......................... 221, 489, 495, 501
TCSRF ........................ 222, 489, 495, 501
TCSRWD.................... 299, 489, 495, 500
TCWD......................... 303, 489, 495, 500
Rev. 3.00 Aug 23, 2006 Page 615 of 616
REJ09B0182-0300
TDR .............................312, 489, 495, 500
TGR .............................247, 486, 492, 498
TIER ............................245, 486, 492, 498
TIOR............................240, 486, 492, 498
TMDR..........................239, 486, 492, 498
TMWD ........................303, 489, 495, 500
TSR..............................246, 486, 492, 498
TSTR ...........................248, 486, 492, 498
TSYR...........................249, 486, 492, 498
WEGR ...........................76, 488, 494, 500
ROM ....................................................... 135
S
Serial Communication Interface 3
(SCI3, IrDA)........................................... 307
Serial Communication Interface 4
(SCI4) ..................................................... 361
Shift instructions....................................... 38
Slave address .......................................... 454
Sleep mode ............................................. 123
Software protection................................. 152
Stack pointer (SP)..................................... 28
Standby mode ......................................... 123
Rev. 3.00 Aug 23, 2006 Page 616 of 616
REJ09B0182-0300
Start condition......................................... 454
Stop condition ......................................... 454
Subactive mode....................................... 125
Subclock generator.................................. 103
Subsleep mode ........................................ 124
System clock generator ........................... 101
System control instructions....................... 42
T
Timer F ................................................... 217
Toggle output.......................................... 254
Transfer rate............................................ 442
V
Vector address........................................... 62
W
Watchdog timer....................................... 297
Waveform output by compare match...... 254
Renesas 16-Bit Single-Chip Microcomputer
Hardware Manual
H8/38086R Group
Publication Date: Rev.1.00, Jul. 09, 2004
Rev.3.00, August 23, 2006
Published by:
Sales Strategic Planning Div.
Renesas Technology Corp.
Edited by:
Customer Support Department
Global Strategic Communication Div.
Renesas Solutions Corp.
©2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
RENESAS SALES OFFICES
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
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Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
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Colophon 6.0
H8S/38086R Group
Hardware Manual