DS481 www.ti.com SNLS131B – JULY 2000 – REVISED MARCH 2013 DS481 Low Power RS-485/RS-422 Multipoint Transceiver with Sleep Mode Check for Samples: DS481 FEATURES DESCRIPTION • • • • • The DS481 is a low-power transceiver for RS-485 and RS-422 communication. The device contains one driver and one receiver. The drivers slew rate allows for operation up to 2.0 Mbps (see Applications Information). 1 2 • • • • • • • • Meets TIA/EIA RS-485 Multipoint Standard Sleep Mode Reduces ICC to 0.2 μA Guaranteed Full Load Output Voltage (VOD3) Low Quiescent Current: 200 μA typ −7V to +12V Common-mode Input Voltage Range TRI-STATE Outputs on Driver and Receiver AC Performance: – Driver Transition Time: 25 ns typ – Driver Propagation Delay: 40 ns typ – Driver Skew: 1 ns typ – Receiver Propagation Delay: 200 ns typ – Receiver Skew: 20 ns typ Half-duplex Flow Through Pinout Operates From a Single 5V Supply Allows up to 64 Transceivers on the Bus Current-limiting and Thermal Shutdown for Driver Overload Protection Industrial Temperature Range Operation Pin and Functional Compatible with MAX481C and MAX481E The transceiver draws 200 μA of supply current when unloaded or 0.2 μA when in the automatic sleep mode. Sleep mode is activated by inactivity on the enables (DE and RE (1)). Holding DE =L and RE (1) =H for greater than 600 ns will enable the sleep mode. The DS481 operates from a single +5V supply. The driver is short-circuit current limited and is protected against excessive power dissipation by thermal shutdown circuitry that places the driver outputs into TRI-STATE (High Impedance state) under fault conditions. The driver guarantees a minimum of 1.5V differential output voltage with maximum loading across the common mode range (VOD3). The receiver has a failsafe feature that guarantees a logic-high output if the input is open circuit. The DS481 is available in a surface mount package and is characterized for Industrial temperature range operation. (1) Non Terminated, Open Input only Connection and Logic Diagram *Non Terminated, Open Input only Figure 1. SOIC Package 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated DS481 SNLS131B – JULY 2000 – REVISED MARCH 2013 www.ti.com Table 1. Pin Descriptions Pin Name Number DESCRIPTION 1 Receiver Output: When RE (Receiver Enable) is LOW, the receiver is enabled (ON), if DO/RI ≥ DO (1)/RI (1) by 200 mV, RO will be HIGH. If DO/RI ≤ DO (1)/RI (1) by 200 mV, RO will be LOW. Additionally RO will be HIGH for OPEN (Non-terminated) Inputs. 2 Receiver Output Enable: When RE (1) is LOW the receiver output is enabled. When RE (1) is HIGH, the receiver output is in TRI-STATE (OFF). When RE (1) is HIGH and DE is LOW, the device will enter a low-current sleep mode after 600 ns. DE 3 Driver Output Enable: When DE is HIGH, the driver outputs are enabled. When DE is LOW, the driver outputs are in TRI-STATE (OFF). When RE (1) is HIGH and DE is LOW, the device will enter a low-current sleep mode after 600 ns. DI 4 Driver Input: When DE (Driver Enable) is HIGH, the driver is enabled, if DI is LOW, then DO/RI will be LOW and DO (1)/RI (1) will be HIGH. If DI is HIGH, then DO/RI is HIGH and DO (1)/RI (1) is LOW. GND 5 Ground Connection. RO RE (1) (1) DO/RI 6 Driver Output/Receiver Input, 485 Bus Pin. DO (1) /RI (1) 7 Driver Output/Receiver Input, 485 Bus Pin. VCC 8 Positive Power Supply Connection: Recommended operating range for VCC is +4.75V to +5.25V. Non Terminated, Open Input only Truth Table DRIVER SECTION RE (1) DE DI A (2) H H H L X (2) H L L H X (2) L X (2) Z (2) X B Z (2) (3) RECEIVER SECTION RE (1) DE A-B RO L ≥+0.2V H L (1) (2) (3) L L ≤−0.2V H X (2) X (2) L L OPEN L Z (1) (2) (3) H Non Terminated, Open Input only X = indeterminate Z = TRI-STATE Device enters sleep mode if enable conditions are held > 600 ns, DE = L and RE = H. RE is Non Terminated and Open Input only. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS481 DS481 www.ti.com SNLS131B – JULY 2000 – REVISED MARCH 2013 Absolute Maximum Ratings (1) (2) Supply Voltage (VCC) +12V Enable Input Voltage (RE (3), DE) −0.5V to (VCC + 0.5V) Driver Input Voltage (DI) −0.5V to (VCC + 0.5V) −14V to +14V Driver Output Voltage (A, B) −14V to +14V Receiver Input Voltage (A, B) −0.5V to (VCC + 0.5V) Receiver Output Voltage (RO) Maximum Package Power Dissipation @ +25°C D0008A Package 1.19W Derate D0008A Package 9.5 mW/°C above +25°C Maximum Package Power Dissipation @ +70°C D0008A Package 0.76W −65°C to +150°C Storage Temperature Range Lead Temperature Range (Soldering, 4 sec.) +260°C ≥2 kV ESD (HBM) (1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Non Terminated, Open Input only (2) (3) Recommended Operating Conditions Supply Voltage (VCC) Min Typ Max Units +4.75 +5.0 +5.25 V −40 +25 +85 °C +12 V Operating Free Air Temperature (TA) DS481T −7 Bus Common Mode Voltage Electrical Characteristics Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified Parameter Test Conditions (1) (2) Pin Min A, B 1.5 Typ VOD1 Differential Driver Output Voltage (No Load) VOD2 Differential Driver Output Voltage with Load RL = 50Ω, (RS422), Figure 2 2 2.8 RL = 27Ω, (RS485), Figure 2 1.5 2.3 (3) ΔVOD Change in Magnitude of Output Differential Voltage VOD3 Differential Driver Output Voltage— R1 = 54Ω, R2 = 375Ω Full Load with Max VCM VTEST = −7V to +12V, Figure 3 VOC Driver Common-Mode Output Voltage RL = 27Ω or 50Ω, Figure 2 ΔVOC Change in Magnitude of CommonMode Output Voltage RL = 27Ω or 50Ω, Figure 2 (1) (2) (3) RL = 27Ω or 50Ω (3) 1.5 0 2.0 Max Units 5 V V 5 V 0.2 |V| 5 V 3 V 0.2 |V| Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD1/2/3and VID. All typicals are given for: VCC = +5.0V, TA = +25°C. Δ|VOD| and Δ|VOC| are changes in magnitude of V OD and VOC respectively, that occur when the input changes state. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS481 3 DS481 SNLS131B – JULY 2000 – REVISED MARCH 2013 www.ti.com Electrical Characteristics (continued) Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified (1) (2) Parameter Test Conditions Pin Min DI, DE, RE (4) 2.0 Typ Max Units VIH Input High Voltage VIL Input Low Voltage IIN1 Input Current VIN = 0V or VCC IIN2 Input Current (5) DE = 0V, VCC = 0V or 5.25V VIN = +12V VTH Receiver Differential Threshold Voltage −7V ≤ VCM ≤ +12V ΔVTH Receiver Input Hysteresis VCM = 0V VOH Receiver Output High Voltage IO = −4 mA, VID = 0.2V VOL Receiver Output Low Voltage IO = 4 mA, VID = −0.2V 0.5 V IOZR TRI-STATE Output Current at Receiver 0.4V ≤ V O ≤ 2.4V ±1 μA RIN Receiver Input Resistance −7V ≤ VIN ≤ +12V ICC No-Load Supply Current (6) DS481T A, B VIN = −7V (4) (4) RO DS481T A, B = 0V or V CC VCC 190 500 μA 0 −100 −400 μA 0.2 V DE = GND RE (4)= VCC (Figure 15) VCC IOSD1 Driver Short Circuit Current, VO = HIGH −7V ≤ VO ≤ +12V A, B IOSD2 Driver Short Circuit Current, VO = LOW −7V ≤ VO ≤ +12V IOSR Receiver Short Circuit Current VO = GND RO mV 3.5 V 24 = 0V or VCC Sleep Mode Supply Current 4 μA 0 −0.2 ICCX (4) (5) (6) V ±2 70 DE = V CC, RE DE = 0V, RE V 0.8 kΩ 200 500 μA 200 500 μA 0.2 10 μA 250 mA −250 mA 85 mA 7 Non Terminated, Open Input only. IIN2 includes the receiver input current and driver TRI-STATE leakage current. Supply current specification is valid for loaded transmitters when DE = 0V or enabled (DE = H) with no load. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS481 DS481 www.ti.com SNLS131B – JULY 2000 – REVISED MARCH 2013 Switching Characteristics Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified Parameter (1) (2) (3) Test Conditions Min Typ Max Units RL = 54Ω, CL = 100 pF tPLHD Driver Differential Propagation Delay—Low to High 10 40 80 ns tPHLD Driver Differential Propagation Delay—High to Low 10 39 80 ns tSKEW Differential Skew |tPHLD − tPLHD| 0 1 10 ns tr Driver Rise Time 3 25 50 ns tf Driver Fall Time 3 25 50 ns tZH Driver Enable to Output High CL = 100 pF 50 200 ns tZL Driver Enable to Output Low CL = 100 pF 65 200 ns tLZ Driver Disable from Output Low CL = 15 pF 80 200 ns tHZ Driver Disable from Output High CL = 15 pF 80 200 ns tPSH Driver Enable from Sleep Mode to Output High CL = 100 pF (4) (Figure 6, Figure 7) 70 98 250 ns tPSL Driver Enable from Sleep Mode to Output Low CL = 100 pF (4) (Figure 8 ,Figure 9) 70 98 250 ns tPLHD Receiver Differential Propagation Delay—Low to High CL = 15 pF (RO) 30 190 400 ns tPHLD Receiver Differential Propagation Delay—High to Low 30 210 400 ns tSKEW Differential Skew |tPHLD − tPLHD| 0 20 50 ns tZH Receiver Enable to Output High 45 150 ns tZL Receiver Enable to Output Low 40 150 ns tLZ Receiver Disable from Output Low 50 150 ns tHZ Receiver Disable from Output High 55 150 ns tPSH Receiver Enable from Sleep Mode to Output High CL = 15 pF (4) (Figure 12, Figure 14) 70 97 250 ns tPSL Receiver Enable from Sleep Mode to Output Low CL = 15 pF (4) (Figure 12, Figure 13) 70 95 250 ns tSLEEP Time to Sleep (Device) DE = L and RE (Figure 15) 600 ns fmax (1) (2) (3) (4) (5) (6) Maximum Data Rate CL = 15 pF (5) (6) =H 50 2.0 Mbps All typicals are given for: VCC = +5.0V, TA = +25°C. f = 1 MHz, tr and tf ≤ 6 ns, ZO = 50Ω. CL includes jig and probe capacitance. For enable from sleep mode delays DE = L and RE = H for greater than 600 ns prior to test (device is in sleep mode). RE is Non Terminated, Open Input only. Non Terminated, Open Input only fmax is the guaranteed data rate for 50 ft of twisted pair cable. f max may be conservatively determined from the ratio of driver transition time (tr) to the data rate unit interval (1/fmax). Using a 10% ratio yields fmax = (0.1)/50 ns = 2.0 Mb/s. Higher data rates may be supported by allowing larger ratios. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS481 5 DS481 SNLS131B – JULY 2000 – REVISED MARCH 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure 2. VOD Figure 3. VOD3 Figure 4. Figure 5. 6 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS481 DS481 www.ti.com SNLS131B – JULY 2000 – REVISED MARCH 2013 Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS481 7 DS481 SNLS131B – JULY 2000 – REVISED MARCH 2013 www.ti.com Figure 13. Figure 14. *Note: Non Terminated, Open Input only Figure 15. Entering Sleep Mode Conditions (modes and exit parameters shown) 8 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS481 DS481 www.ti.com SNLS131B – JULY 2000 – REVISED MARCH 2013 Unit Load A unit load for an RS-485 receiver is defined by the input current versus the input voltage curve. The gray shaded region is the defined operating range from −7V to +12V. The top border extending from −3V at 0 mA to +12V at +1 mA is defined as one unit load. Likewise, the bottom border extending from +5V at 0 mA to −7V at −0.8 mA is also defined as one unit load (see Figure 16 ). An RS-485 driver is capable of driving up to 32 unit loads. This allows up to 32 nodes on a single bus. Although sufficient for many applications, it is sometimes desirable to have even more nodes. The DS481 has ½ unit load and will allow up to 64 nodes guaranteed over temperature. For a ½ UL device the top and bottom borders shown in Figure 16 are scaled. Both 0 mA reference points at +5V and −3V stay the same. The other reference points are +12V at +0.5 mA for the top border and −7V at −0.4 mA for the bottom border (see Figure 16). Again, both 0 mA reference points at +5V and −3V stay the same. The other reference points are +12V at +0.25 mA for the top border and −7V at −0.2 mA for the bottom border (see Figure 16). The advantage of the ½ UL device is the increased number of nodes on one bus. In a single master multi-slave type of application where the number of slaves exceeds 32, the DS481 may save in the cost of extra devices like repeaters, extra media like cable, and/or extra components like resistors. Figure 16. Input Current vs Input Voltage Operating Range Sleep Mode The DS481 features an automatic sleep mode that allows the device to save power when not transmitting data. Since the sleep mode is automatic, no external components are required. It may be used as little or as much as the application requires. The more the feature is utilized, the more power it saves. The sleep mode is automatically entered when both the driver and receiver are disabled. This occurs when both the DE pin is asserted to a logic low and the RE (7) pin is asserted to a logic high. Once both pins are asserted the device will enter sleep mode after 50 ns. The DS481 is guaranteed to go into sleep mode within 600 ns after both pins are asserted. The device wakes up (comes out of sleep mode) when either the DE pin is asserted to a logic high and/or the RE (7) pin is asserted to a logic low. After the device enters sleep mode it will take longer for the device to wake up than it does for the device to enable from TRI-STATE. Refer to datasheet specifications tPSL and tPSH and compare with tPZL and t PZH for timing differences. The benefit of the DS481 is definitely its power savings. When active the device has a maximum ICC of 500 μA. When in sleep mode the device has a maximum ICC of only 10 μA, which is 50 times less power than when active. The ICC when the device is active is already very low but when in sleep mode the ICCis ultra low. (7) Non Terminated, Open Input only Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS481 9 DS481 SNLS131B – JULY 2000 – REVISED MARCH 2013 www.ti.com APPLICATIONS INFORMATION Figure 17. Multipoint RS-485 Application 10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS481 DS481 www.ti.com SNLS131B – JULY 2000 – REVISED MARCH 2013 REVISION HISTORY Changes from Revision A (March 2013) to Revision B • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: DS481 11 PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS481TM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS481 TM DS481TMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS481 TM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DS481TMX/NOPB Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 5.4 2.0 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS481TMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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