HLMP-AD85, HLMP-AD87, HLMP-AM86, HLMP-AM87, HLMP-AB86, HLMP-AB87 Precision Optical Performance Red, ����� Green ���������� and Blue ���� 5mm Mini Oval LEDs ���� Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED material is used in these lamps: Aluminium Indium Gallium Phosphide (AlInGaP) for red and Indium Gallium Nitride (InGaN) for blue and green. Each lamp is made with an advance optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. • Well defined spatial radiation pattern • High brightness material • Available in red, green and blue color - Red AlInGaP 630nm - ������������ Green InGaN 525nm ����� - ����������� Blue InGaN 470nm ����� • Superior resistance to moisture • Tinted and diffused The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight. Applications Benefits • Viewing angle designed for wide field of view applications • Superior performance for outdoor environments. • Full color signs • Commercial outdoor advertising Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions A 24.00MIN. 0.945 1.0MIN. 0.038 8.70±0.20 .342±.008 Measured at base of lens 3.80±0.20 .150±.008 CATHODE LEAD NOTE 1 2.54±0.3 0.100±0.012 5.20±0.2 .205±.008 B 24.00 0.945 11.50±0.20 0.453±.008 8.70±0.20 0.342±.008 1.25±0.20 0.049±0.008 0.016±0.00 1.0MIN. 0.038 Measured at base of lens 3.8±0.2 .150±.008 CATHODE LEAD 2.54±0.3 5.20±0.20 0.205±.008 0.100±0.012 0.8MAX. Epoxy 0.032 0.50±0.10 0.020±0.004 NOTES: Dimensions in Millimeters (Inches) For Blue and Green if heat-sinking application is required, the terminal for heat sink is anode. 0.4±0.1 0.50±0.10 0.020±0.004 0.8MAX. Epoxy Meniscus .016. 0.40±0.10 0.016±0.00 Device Selection Guide Part Number Color Typ. Dominant Wavelength ld (nm) HLMP-AD85-RU0xx Red HLMP-AD87-RU0xx Luminous Intensity Iv (cd) at 20mA Min. Max. Lens Type Standoffs Package Drawing 630 1.50 4.20 Tinted, diffused No A Red 630 1.50 4.20 Tinted, diffused Yes B HLMP-AM86-TW0xx Green 525 2.50 7.20 Tinted, diffused No A HLMP-AM87-TW0xx Green 525 2.50 7.20 Tinted, diffused Yes B HLMP-AB86-MQ0xx Blue 470 0.52 1.50 Tinted, diffused No A HLMP-AB87-MQ0xx Blue 470 0.52 1.50 Tinted, diffused Yes B Notes: 1. Tolerance for luminous intensity measurement is ±15% 2. The luminous intensity is measured on the mechanical axis of the lamp package. 3. The optical axis is closely aligned with the package mechanical axis. 4. The dominant wavelength λd is derived from the Chromaticity Diagram and represents the color of the lamp. 5. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper safety equipment. Part Numbering System H L M P - x x 8x - x x x xx Mechanical Option 00: Bulk DD: Ammo Pack ZZ: Flexi-Bin, Ammo pack Color Bin Options 0: Full color bin distribution Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Color B: Blue 470nm M: Green 525nm D: Red 630nm Package A: 5mm Mini Oval Absolute Maximum Rating at TA = 25oC Parameters Blue and Green Red Unit DC forward current [1] 30 50 mA Peak pulsed forward current Power dissipation 100 [2] 100 [3] 116 120 mA mW LED junction temperature Operating temperature range Storage temperature range 130 -40 to +85 -40 to +100 130 -40 to +100 -40 to +120 oC oC oC Notes: 1. Derate linearly as shown in figure 3 and figure 7. 2. Duty factor 10%, frequency 1KHz. 3. Duty factor 30%, frequency 1KHz. Electrical/Optical Characteristics TA = 25oC Parameters Forward voltage Red Green Blue Reverse Voltage Red Green Blue Thermal resistance [1] Dominant wavelength [2, 3] Red Green Blue Peak wavelength Red Green Blue Spectral half width Red Green Blue Luminous Efficacy [4] Red Green Blue Luminous Flux Red Green Blue Luminous Efficiency [5] Red Green Blue Value Min. Typ. Max. Units Test Condition VF 2.0 2.8 2.8 2.20 3.3 3.2 2.40 3.85 3.85 V IF = 20 mA VR 5.0 5.0 5.0 V oC/W IR = 100 mA IR = 10 mA IR = 10 mA LED Junction-to-pin nm IF = 20 mA nm Peak of wavelength of spectral distribution at IF = 20 mA nm Wavelength width at spectral distribution 1/2 power point at IF = 20 mA Symbol RqJ-PIN ld 240 622 520 460 630 525 470 634 540 480 lPEAK 639 516 464 Dl1/2 17 32 23 hv 155 520 75 lm/W Emitted luminous power/Emitted radiant power jV 1300 3000 600 mlm IF = 20 mA he 30 50 10 lm/W Luminous Flux/Electrical Power IF = 20 mA Notes: 1. For AlInGaP Red, the thermal resistance applied to LED junction to cathode lead. For InGaN Blue and Green, the thermal resistance applied to LED junction to anode lead. 2. The dominant wavelength λd is derived from the Chromaticity Diagram and represents the color of the lamp. 3. Tolerance for each color bin limit is ±0.5 nm 4. The radiant intensity, Ie in watts/steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. 5. he = jV / IF x VF , where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage. AlInGaP Red 50 IF - FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 0.5 0 550 600 650 40 30 20 10 0 700 0.5 1.0 1.5 2.0 2.5 V F - FORWARD VOLTAGE - V 0 WAVELENGTH – nm Figure 2. Forward current vs. forward voltage 2.5 50 2.0 RELATIVE INTENSITY (NORMALIZED AT 20 mA) 60 40 30 20 10 0 0 IF MAX. - MAXIMUM FORWARD CURRENT - mA Figure 1. Relative intensity vs. wavelength 3.0 1.5 1.0 0.5 0 20 40 60 80 100 TA- AMBIENT TEMPERATURE - o C Figure 3. Forward current vs. ambient temperature 0 10 30 20 40 FORWARD CURRENT - mA 50 Figure 4. Relative luminous intensity vs. forward current InGaN Blue and Green 1.00 BLUE FORWARD CURRENT - mA RELATIVE INTENSITY GREEN 0.60 0.40 0.20 400 450 500 550 600 WAVELENGTH - nm Figure 5. Relative Intensity vs. Wavelength I F – MAXIMUM FORWARD CURRENT – mA 30 0.80 0 350 35 35 650 25 20 15 10 5 0 0 1 2 3 4 FORWARD VOLTAGE - V Figure 6. Forward current vs. forward voltage. 30 25 20 15 10 5 0 0 20 40 60 80 100 TA – AMBIENT TEMPERATURE – °C Figure 7. Forward Current vs. Ambient Temperature. 1.020 1.4 1.2 RELATIVE DOMINANT WAVELENGTH RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.6 1.0 0.8 0.6 0.4 1.015 1.010 GREEN 1.005 BLUE 1.000 0.2 0 0.995 0 5 10 15 20 25 30 Figure 8. Relative intensity vs. forward current NORMALIZED INTENSITY 0.5 0 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES Figure 10. Spatial radiation pattern for RGB – major axis NORMALIZED INTENSITY 1 0.5 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 11. Spatial radiation pattern for RGB – minor axis 10 20 30 Figure 9.Relative dominant wavelength vs. DC forward current 1 -90 0 FORWARD CURRENT, mA DC FORWARD CURRENT - mA 60 90 Intensity Bin Limit Table Blue Color Bin Table Intensity (mcd) at 20 mA Bin Min Dom Max Dom Xmin Ymin Xmax Ymax Min Max 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 M 520 680 0.1818 0.0904 0.1374 0.0374 N 680 880 0.1374 0.0374 0.1699 0.1062 P 880 1150 0.1766 0.0966 0.1291 0.0495 Q 1150 1500 0.1291 0.0495 0.1616 0.1209 R 1500 1900 0.1699 0.1062 0.1187 0.0671 S 1900 2500 0.1187 0.0671 0.1517 0.1423 T 2500 3200 0.1616 0.1209 0.1063 0.0945 U 3200 4200 0.1063 0.0945 0.1397 0.1728 V 4200 5500 0.1517 0.1423 0.0913 0.1327 W 5500 7200 Bin 2 3 4 5 464.0 468.0 472.0 476.0 468.0 472.0 476.0 480.0 Tolerance for each bin limit is ±0.5 nm Tolerance for each bin limit is ± 15% Green Color Bin Table Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 2 3 4 5 524.0 528.0 532.0 536.0 528.0 532.0 536.0 540.0 Tolerance for each bin limit is ±0.5 nm Red Color Bin Table Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 622 634 0.6904 0.3094 0.6945 0.2888 0.6726 0.3106 0.7135 0.2865 Tolerance for each bin limit is ± 0.5 nm Avago Color Bin on CIE 1931 Chromaticity Diagram. 1.000 0.800 Green 1 2 3 4 5 Y 0.600 0.400 Red 0.200 5 4 3 Blue 2 1 0.000 0.000 0.100 0.200 0.300 0.400 0.500 0.600 X RELATIVE LIGHT OUTPUT (NORMALIZED at TJ = 25°C) 10 GREEN 1 0.1 RED -40 -20 0 20 40 BLUE 60 80 T J - JUNCTION TEMPERATURE - °C 100 120 0.700 0.800 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.�9mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. CATHODE AlInGaP Device ANODE InGaN Device Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) 200 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 50 PREHEAT 0 10 20 30 40 50 60 TIME (MINUTES) 70 80 90 100 Ammo Packs Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) CATHODE 20.5 ± 1.00 (0.8071 ± 0.0394) 9.125 ± 0.625 (0.3593 ± 0.0246) 18.00 ± 0.50 (0.7087 ± 0.0197) A 12.70 ± 0.30 (0.50 ± 0.0118) 0.70 ± 0.20 (0.0276 ± 0.0079) A ∅ 4.00 ± 0.20 TYP. (0.1575 ± 0.008) VIEW A–A ALL DIMENSIONS IN MILLIMETERS (INCHES). Note: The ammo-packs drawing is applicable for packaging option –DD & –ZZ and regardless of standoff or non-standoff. 10 Packaging Box for Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. A + O AG ES AV LOGI O HN E OD AN TEC E OD TH CA – ANODE LEAD LEAVES THE BOX FIRST. C EL AB RL HE T MO Note: For InGaN device, the ammo pack packaging box contains ESD logo. Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1T) Lot: Lot Number STANDARD LABEL LS0002 RoHS Compliant e1 max temp 250C (Q) QTY: Quantity LPN CAT: Intensity Bin (9D) MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: REV: (V) Vendor ID DeptID: (1P) Item: Part Number Made In: Country of Origin 11 (ii) Avago Baby Label (Only available on bulk packaging) RoHS Compliant e1 max temp 250C PART #: Part Number LOT#: Lot Number MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) Example: (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin BIN: 2VB VB: VF bin “VB” 2: Color bin 2 only DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. Obsoletes AV01-0304EN AV02-0388EN - July 11, 2007