HD74LV2GT157A 2-channle Multiplexer / CMOS Logic Level Shifter REJ03D0150–0200Z (Previous ADE-205-686A (Z)) Rev.2.00 Oct.23.2003 Description The HD74LV2GT157A has 2–channel multiplexer in 8 pin package. The input protection circuitry on this device allows over voltage tolerance on the input, allowing the device to be used as a logic–level translator from 3.0 V CMOS Logic to 5.0 V CMOS Logic or from 1.8 V CMOS logic to 3.0 V CMOS Logic while operating at the high-voltage power supply. Low voltage and high-speed operation is suitable for the battery powered products (e.g., notebook computers), and the low power consumption extends the battery life. Features • The basic gate function is lined up as Renesas uni logic series. • Supplied on emboss taping for high-speed automatic mounting. • TTL compatible input level. Supply voltage range : 3.0 to 5.5 V Operating temperature range : –40 to +85°C • Logic-level translate function 3.0 V CMOS logic → 5.0 V CMOS logic (@VCC = 5.0 V) 1.8 V or 2.5 V CMOS logic → 3.3 V CMOS logic (@VCC = 3.3 V) • All inputs VIH (Max.) = 5.5 V (@VCC = 0 V to 5.5 V) All outputs VO (Max.) = 5.5 V (@VCC = 0 V) • Output current ±6 mA (@VCC = 3.0 V to 3.6 V), ±12 mA (@VCC = 4.5 V to 5.5 V) • All the logical input has hysteresis voltage for the slow transition. • Ordering Information Part Name Package Type Package Code Package Abbreviation Taping Abbreviation (Quantity) HD74LV2GT157AUSE SSOP-8 pin TTP-8DBV US E (3,000 pcs/reel) Rev.2.00, Oct.23.2003, page 1 of 9 HD74LV2GT157A Outline and Article Indication • HD74LV2GT157A Index band Lot No. Y M W T 5 7 Y : Year code (the last digit of year) M : Month code W : Week code SSOP-8 Marking Function Table Inputs Outputs STB SEL A B Y Y H X X X L H L L L X L H L L H X H L L H X L L H L H X H H L H : High level L : Low level X : Immaterial Rev.2.00, Oct.23.2003, page 2 of 9 HD74LV2GT157A Pin Arrangement A 1 8 VCC B 2 7 STB Y 3 6 SEL GND 4 5 Y (Top view) Absolute Maximum Ratings Item Supply voltage range Input voltage range *1 Output voltage range *1, 2 Symbol Ratings Unit VCC –0.5 to 7.0 V VI –0.5 to 7.0 V VO –0.5 to VCC + 0.5 V –0.5 to 7.0 Test Conditions Output : H or L VCC : OFF Input clamp current IIK –20 mA VI < 0 Output clamp current IOK ±50 mA VO < 0 or VO > VCC Continuous output current IO ±25 mA VO = 0 to VCC Continuous current through VCC or GND ICC or IGND ±50 mA Maximum power dissipation *3 at Ta = 25°C (in still air) PT 200 mW Storage temperature Tstg –65 to 150 °C Notes: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 5.5 V maximum. 3. The maximum package power dissipation was calculated using a junction temperature of 150°C. Rev.2.00, Oct.23.2003, page 3 of 9 HD74LV2GT157A Recommended Operating Conditions Item Symbol Min Supply voltage range VCC 3.0 5.5 V Input voltage range VI 0 5.5 V Output voltage range VO 0 VCC V Output current IOL — 6 mA — 12 VCC = 4.5 to 5.5 V — –6 VCC = 3.0 to 3.6 V — –12 VCC = 4.5 to 5.5 V 0 100 0 20 –40 85 IOH Input transition rise or fall rate ∆t / ∆v Operating free-air temperature Ta Max Unit ns / V Conditions VCC = 3.0 to 3.6 V VCC = 3.0 to 3.6 V VCC = 4.5 to 5.5 V °C Note: Unused or floating inputs must be held high or low. Logic Diagram A Y B Select Strobe Rev.2.00, Oct.23.2003, page 4 of 9 Y HD74LV2GT157A Electrical Characteristic • Ta = –40 to 85°C Item Symbol VCC (V) * Input voltage VIH VIL Hysteresis voltage Output voltage VH VOH VOL Min Typ Max Unit 3.0 to 3.6 1.5 — — V 4.5 to 5.5 2.0 — — 3.0 to 3.6 — — 0.6 4.5 to 5.5 — — 0.8 3.3 — 0.10 — 5.0 — 0.15 — V V Test condition VT+ – VT– IOH = –50 µA Min to Max VCC–0.1 — — 3.0 2.48 — — IOH = –6 mA 4.5 3.8 — — IOH = –12 mA Min to Max — — 0.1 IOL = 50 µA 3.0 — — 0.44 IOL = 6 mA 4.5 — — 0.55 IOL = 12 mA Input current IIN 0 to 5.5 — — ±1 µA VIN = 5.5 V or GND Quiescent supply current ICC 5.5 — — 10 µA VIN = VCC or GND, IO = 0 ∆ICC 5.5 — — 1.5 mA One input VIN = 3.4 V, other input VCC or GND Output leakage current IOFF 0 — — 5 µA VIN or VO = 0 to 5.5 V Input capacitance CIN 5.0 — 3.0 — pF VIN = VCC or GND Note: For conditions shown as Min or Max, use the appropriate values under recommended operating conditions. Rev.2.00, Oct.23.2003, page 5 of 9 HD74LV2GT157A Switching Characteristics • VCC = 3.3 ±0.3 V Ta = 25°C Test Ta = –40 to 85°C FROM TO Item Symbol Min Typ Max Min Max Unit Conditions (Input) (Output) Propagation delay time tPLH tPHL — 7.5 11.5 1.0 13.0 ns A or B Y — 10.0 15.0 1.0 17.0 CL = 50 pF — 10.0 15.0 1.0 17.5 CL = 15 pF SEL Y — 12.5 18.5 1.0 21.0 CL = 50 pF — 8.5 14.0 1.0 16.0 CL = 15 pF STB Y — 11.0 17.5 1.0 19.5 CL = 50 pF FROM TO CL = 15 pF • VCC = 5.0 ±0.5 V Ta = 25°C Test Ta = –40 to 85°C Item Symbol Max Unit Conditions (Input) Min Typ Max Min (Output) Propagation delay time tPLH tPHL — 5.1 7.4 1.0 8.5 ns A or B Y — 6.6 — 6.3 9.4 1.0 10.5 CL = 50 pF 9.1 1.0 10.5 CL = 15 pF SEL Y — 7.8 11.1 1.0 12.5 CL = 50 pF — 5.6 8.6 1.0 10.0 CL = 15 pF STB Y — 7.1 10.6 1.0 12.0 CL = 50 pF CL = 15 pF Operating Characteristics • CL = 50 pF Ta = 25°C Item Symbol VCC (V) Min Typ Max Unit Test Conditions Power dissipation capacitance CPD 5.0 35.0 — pF f = 10 MHz Rev.2.00, Oct.23.2003, page 6 of 9 — HD74LV2GT157A Test Circuit Input Pulse Generator Z OUT = 50 Ω VCC See Function Table VCC A B Y or Y Output STB SEL CL = 15 or 50 pF Note: 1. C L includes probe and jig capacitance. Rev.2.00, Oct.23.2003, page 7 of 9 HD74LV2GT157A • Waveforms Input tr tf VI 90 % Vref 90 % Vref 10 % 10 % t PLH GND t PHL VOH In phase output 50% 50% t PHL VOL t PLH VOH 50% Out of phase output 50% VOL INPUTS VCC (V) VI Vref t r / tf 3.3±0.3 2.5 V ≤ 3.0 ns 50% ≤ 3.0 ns 1.5 V 5.0±0.5 3V Notes: 1. Input waveform : PRR ≤ 1 MHz, Zo = 50 Ω. 2. The output are measured one at a time with one transition per measurement. Rev.2.00, Oct.23.2003, page 8 of 9 HD74LV2GT157A Package Dimensions 2.0 ± 0.2 1.5 ± 0.2 + 0.1 (0.17) 8 − 0.2 − 0.05 Package Code JEDEC JEITA Mass (reference value) Rev.2.00, Oct.23.2003, page 9 of 9 + 0.1 0.13 − 0.05 0 − 0.1 0.7 ± 0.1 (0.4) 2.3 ± 0.1 (0.5) (0.5) (0.5) 3.1 ± 0.3 (0.4) Unit: mm TTP–8DBV 0.010 g Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 © 2003. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon 1.0