CC2567-PAN1327 CC2567-PAN1317 www.ti.com SWRS099B – DECEMBER 2010 – REVISED JANUARY 2011 ® ANT + Bluetooth Single-Chip, Dual-Mode Module FEATURES 1 • 2 • • • • • • • • • • • • Fully Qualified Bluetooth v2.1 + Enhanced Data Rate (EDR) ANT+ capable Bluetooth and ANT Smart Priority Mechanism Allows Flexible Coexistence and Simultaneous Operation +10 dBm Typical Tx Power with Transmit Power Control - 93 dBm Typical Receiver Sensitivity Support for Bluetooth Power Saving Modes (Sniff, Hold) Low Power Scan Method for Page and Inquiry Scans at 1/3rd Normal Power Fast Algorithm for Both ACL and eSCO Host Controlled Interface (HCI) Supports Three and Four Wire UART Transport with Rates of up to 4Mbps Hardware and Software Pre-integration with TI’s MSP430 Ultra Low-power Microcontroller Dimensions: 9 mm x 9.5 mm x 1.8 mm (CC2567-PAN1327, Integrated Antenna); 6.5 mm x 9.5 mm x 1.8 mm (CC2567-PAN1317, Without Antenna)” Bluetooth, FCC, CE, IC Certified Operating Temperature Range: -20C° to 70°C APPLICATIONS • • • • • ANT+ and Bluetooth Aggregators Sports and fitness devices Health and wellness devices Ability to add ultra low-power ANT+ technology to existing Bluetooth solutions Connect current ANT+ applications to mobile phones and computers via Bluetooth DESCRIPTION The following product brief applies to Panasonic’s Bluetooth module, series number: PAN1327 and PAN1317. The Bluetooth chip used is the CC2567 from Texas Instruments. The CC2567-PAN1327/17 is the first dual-mode, ANT and Bluetooth solution in the market. This solution is a highly-integrated class 2 HCI module with increased output power capabilities offered by Panasonic using TI's CC2567 ANT+ and Bluetooth 2.1 + Enhanced Data Rate (EDR) dual-mode transceiver. Based on TI's 7th generation Bluetooth technology, the solution provides best-in-class Bluetooth RF performance of +10 dBm typical Tx power and -93 dBm typical receiver sensitivity. The CC2567-PAN1327/17 module allows customers to connect to mobile phones and computers over Bluetooth from ANT+ enabled devices, and allows customers with Bluetooth solutions to add ultra low-power ANT+ connectivity. This solution is provided as a module to help customers reduce development time, lower manufacturing costs, save board space, ease certification, and minimize RF expertise required. For evaluation and development, a platform is available that integrates the CC2567-PAN1327/17 module, Bluetooth stack, Serial Port Profile, ANT+ solution and sample source applications running on a TI host controller – MSP430. The full specification and purchasing of the CC2567-PAN1327/17 can be found on Panasonic’s website (www.panasonic.com/ti). The development kit for this solution is available for order today through the ANT + Bluetooth Health and Fitness Aggregator Kit tool folder (www.ti.com/cc2567_pan1327_antbtkit). More information on TI’s wireless platform solutions can be found on TI's Wireless Connectivity Wiki (www.ti.com/connectivitywiki). Disclaimer: All content in and linked to this product brief is provided by TI "AS IS" without express or implied warranties of any kind, and it may contain errors, omissions and technical inaccuracies. TI does not endorse or warrant any of the third party products or services referenced on this product brief. This information is provided subject to TI’s Terms of Use. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Bluetooth is a registered trademark of Bluetooth SIG, Inc. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2011, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com Wireless www.ti.com/wireless-apps RF/IF and ZigBee® Solutions www.ti.com/lprf TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated