HEF4094B 8-stage shift-and-store bus register Rev. 04 — 30 October 2008 Product data sheet 1. General description The HEF4094B is an 8-stage serial shift register. It has a storage latch associated with each stage for strobing data from the serial input to parallel buffered 3-state outputs QP0 to QP7. The parallel outputs may be connected directly to common bus lines. Data is shifted on positive-going clock transitions. The data in each shift register stage is transferred to the storage register when the strobe (STR) input is HIGH. Data in the storage register appears at the outputs whenever the output enable (OE) signal is HIGH. Two serial outputs (QS1 and QS2) are available for cascading a number of HEF4094B devices. Serial data is available at QS1 on positive-going clock edges to allow high-speed operation in cascaded systems with a fast clock rise time. The same serial data is available at QS2 on the next negative going clock edge. This is used for cascading HEF4094B devices when the clock has a slow rise time. It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS (usually ground). Unused inputs must be connected to VDD, VSS, or another input. It is also suitable for use over the industrial (−40 °C to +85 °C) and automotive (−40 °C to +125 °C) temperature ranges. 2. Features n n n n n n Fully static operation 5 V, 10 V, and 15 V parametric ratings Standardized symmetrical output characteristics Operates across the automotive temperature range −40 °C to +125 °C Complies with JEDEC standard JESD 13-B ESD protection: u HBM JESD22-A114E exceeds 2000 V u MM JESD22-A115-A exceeds 200 V 3. Ordering information Table 1. Ordering information All types operate from −40 °C to +125 °C. Type number Package Name Description Version HEF4094BP DIP16 plastic dual in-line package; 16-leads (300 mil) SOT38-4 HEF4094BT SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 HEF4094BTS SSOP16 plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register 4. Functional diagram 2 3 15 1 CP STR D 8-STAGE SHIFT REGISTER CP QS2 QS1 1 3 STR 10 9 2 3-STATE OUTPUTS Fig 1. 5 6 7 14 13 12 11 Functional diagram D 15 001aaf119 Fig 2. STAGE 0 D 4 QP1 5 QP2 6 QP3 7 QP4 14 QP5 13 QP6 12 QP7 11 D 001aaf111 Logic symbol STAGES 1 TO 6 Q 10 QP0 OE QP0 QP1 QP2 QP3 QP4 QP5 QP6 QP7 4 9 QS2 D 8-BIT STORAGE REGISTER OE QS1 STAGE 7 Q D QS1 Q CP CP D FF 7 FF 0 CP CP Q QS2 CP LATCH D Q D Q CP CP LATCH 0 LATCH 7 STR OE QP1 Fig 3. QP4 QP2 QP0 QP3 001aag799 QP6 QP5 QP7 Logic diagram HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 2 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register 5. Pinning information 5.1 Pinning HEF4094B STR 1 16 VDD D 2 15 OE CP 3 14 QP4 QP0 4 13 QP5 QP1 5 12 QP6 QP2 6 11 QP7 QP3 7 10 QS2 VSS 8 9 QS1 001aae662 Fig 4. Pin configuration 5.2 Pin description Table 2. Pin description Symbol Pin Description STR 1 strobe input D 2 data input CP 3 clock input QP0 to QP7 4, 5, 6, 7, 14, 13, 12, 11 parallel output VSS 8 ground supply voltage QS1 9 serial output QS2 10 serial output OE 15 output enable input VDD 16 supply voltage 6. Functional description Table 3. Function table[1] Inputs Parallel outputs Serial outputs CP OE STR D QP0 QPn QS1 QS2 ↑ L X X Z Z Q6S NC ↓ L X X Z Z NC Q7S ↑ H L X NC NC QS6 NC ↑ H H L L QPn −1 QS6 NC ↑ H H H H QPn −1 QS6 NC HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 3 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register Table 3. Function table[1] …continued Inputs Parallel outputs Serial outputs CP OE STR D QP0 QPn QS1 QS2 ↓ H H H NC NC NC Q7S [1] At the positive clock edge, the information in the 7th register stage is transferred to the 8th register stage and the QSn outputs. H = HIGH voltage level; L = LOW voltage level; X = don’t care; ↑ = positive-going transition; ↓ = negative-going transition; Z = HIGH-impedance OFF-state; NC = no change; Q6S = the data in register stage 6 before the LOW to HIGH clock transition; Q7S = the data in register stage 7 before the HIGH to LOW clock transition. CLOCK INPUT DATA INPUT STROBE INPUT OUTPUT ENABLE INPUT INTERNAL Q0S (FF 0) Z-state OUTPUT QP0 INTERNAL Q6S (FF 6) Z-state OUTPUT QP6 SERIAL OUTPUT QS1 SERIAL OUTPUT QS2 001aaf117 Fig 5. Timing diagram 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground). Symbol Parameter VDD supply voltage IIK input clamping current VI input voltage IOK output clamping current II/O IDD Conditions Min −0.5 +18 V VI < 0.5 V or VI > VDD + 0.5 V - ±10 mA −0.5 Max VDD + 0.5 Unit V - ±10 mA input/output current - ±10 mA supply current - 50 mA Tstg storage temperature −65 +150 °C Tamb ambient temperature −40 +125 °C total power dissipation Ptot P power dissipation VO < 0.5 V or VO > VDD + 0.5 V DIP16 [1] - 750 mW SO16 [2] - 500 mW - 100 mW per output [1] For DIP16 packages: above Tamb = 70 °C, Ptot derates linearly with 12 mW/K. [2] For SO16 packages: above Tamb = 70 °C, Ptot derates linearly with 8 mW/K. HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 4 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter VDD Conditions Min Typ Max Unit supply voltage 3 - 15 V VI input voltage 0 - VDD V Tamb ambient temperature in free air −40 - +125 °C ∆t/∆V input transition rise and fall rate VDD = 5 V - - 3.75 ns/V VDD = 10 V - - 0.5 ns/V VDD = 15 V - - 0.08 ns/V 9. Static characteristics Table 6. Static characteristics VSS = 0 V; VI = VSS or VDD; unless otherwise specified. Symbol Parameter VIH VIL Conditions HIGH-level input voltage |IO| < 1 µA LOW-level input voltage |IO| < 1 µA |IO| < 1 µA Tamb = −40 °C Tamb = +25 °C Tamb = +85 °C Tamb = +125 °C Unit Min Max Min Max Min Max Min Max 5V 3.5 - 3.5 - 3.5 - 3.5 - V 10 V 7.0 - 7.0 - 7.0 - 7.0 - V 15 V 11.0 - 11.0 - 11.0 - 11.0 - V 5V - 1.5 - 1.5 - 1.5 - 1.5 V 10 V - 3.0 - 3.0 - 3.0 - 3.0 V 15 V - 4.0 - 4.0 - 4.0 - 4.0 V 5V 4.95 - 4.95 - 4.95 - 4.95 - V 10 V 9.95 - 9.95 - 9.95 - 9.95 - V 15 V 14.95 - 14.95 - 14.95 - 14.95 - V 5V - 0.05 - 0.05 - 0.05 - 0.05 V 10 V - 0.05 - 0.05 - 0.05 - 0.05 V 15 V - 0.05 - 0.05 - 0.05 - 0.05 V VO = 2.5 V 5V −1.7 - −1.4 - −1.1 - −1.1 - mA VO = 4.6 V 5V −0.64 - −0.5 - −0.36 - −0.36 - mA VO = 9.5 V 10 V −1.6 - −1.3 - −0.9 - −0.9 - mA VO = 13.5 V 15 V −4.2 - −3.4 - −2.4 - −2.4 - mA LOW-level output current VO = 0.4 V 5V 0.64 - 0.5 - 0.36 - 0.36 - mA VO = 0.5 V 10 V 1.6 - 1.3 - 0.9 - 0.9 - mA VO = 1.5 V 15 V 4.2 - 3.4 - 2.4 - 2.4 - mA IOZ OFF-state output current QPn output is HIGH; VO = 15 V 15 V - 0.4 - 0.4 - 12 - 12 µA II input leakage current 15 V - ±0.1 - ±0.1 - ±1.0 - ±1.0 µA VOH VOL IOH IOL HIGH-level output voltage VDD LOW-level output voltage HIGH-level output current |IO| < 1 µA HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 5 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register Table 6. Static characteristics …continued VSS = 0 V; VI = VSS or VDD; unless otherwise specified. Symbol Parameter IDD CI supply current Conditions VDD 5V all valid input combinations; 10 V IO = 0 A 15 V input capacitance Tamb = −40 °C Tamb = +25 °C Tamb = +85 °C Tamb = +125 °C Unit Min Max Min Max Min Max Min Max - 5 - 5 - 150 - 150 µA - 10 - 10 - 300 - 300 µA - 20 - 20 - 600 - 600 µA - - - 7.5 - - - - pF Extrapolation formula Min Typ Max Unit 108 ns + (0.55 ns/pF) CL - 135 270 ns 10 V 54 ns + (0.23 ns/pF) CL - 65 130 ns 15 V 42 ns + (0.16 ns/pF) CL - 50 100 ns 10. Dynamic characteristics Table 7. Dynamic characteristics VSS = 0 V; Tamb = 25 °C; for test circuit see Figure 10; unless otherwise specified. Symbol Parameter Conditions tPHL HIGH to LOW propagation delay CP to QS1; see Figure 6 CP to QS2; see Figure 6 CP to QPn; see Figure 6 STR to QPn; see Figure 7 VDD 5V [1] 5V 78 ns + (0.55 ns/pF) CL - 105 210 ns 10 V 39 ns + (0.23 ns/pF) CL - 50 100 ns 15 V 32 ns + (0.16 ns/pF) CL - 40 80 ns 5V 138 ns + (0.55 ns/pF) CL - 165 330 ns 10 V 64 ns + (0.23 ns/pF) CL - 75 150 ns 15 V 47 ns + (0.16 ns/pF) CL - 55 110 ns 5V 83 ns + (0.55 ns/pF) CL - 110 220 ns 10 V 39 ns + (0.23 ns/pF) CL - 50 100 ns 27 ns + (0.16 ns/pF) CL - 35 70 ns 78 ns + (0.55 ns/pF) CL - 105 210 ns 10 V 39 ns + (0.23 ns/pF) CL - 50 100 ns 15 V 32 ns + (0.16 ns/pF) CL - 40 80 ns 15 V tPLH LOW to HIGH propagation delay, CP to QS1; see Figure 6 CP to QS2; see Figure 6 CP to QPn; see Figure 6 STR to QPn; see Figure 7 5V [1] 5V 78 ns + (0.55 ns/pF) CL - 105 210 ns 10 V 39 ns + (0.23 ns/pF) CL - 50 100 ns 15 V 32 ns + (0.16 ns/pF) CL - 40 80 ns 5V 123 ns + (0.55 ns/pF) CL - 150 300 ns 10 V 59 ns + (0.23 ns/pF) CL - 70 140 ns 15 V 47 ns + (0.16 ns/pF) CL - 55 110 ns 5V 73 ns + (0.55 ns/pF) CL - 100 200 ns 10 V 34 ns + (0.23 ns/pF) CL - 45 90 ns 27 ns + (0.16 ns/pF) CL - 35 70 ns 10 ns + (1.00 ns/pF) CL - 60 120 ns 10 V 9 ns + (0.42 ns/pF) CL - 30 60 ns 15 V 6 ns + (0.28 ns/pF) CL - 20 40 ns 15 V tt transition time 5V [1] HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 6 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register Table 7. Dynamic characteristics …continued VSS = 0 V; Tamb = 25 °C; for test circuit see Figure 10; unless otherwise specified. Symbol Parameter Conditions tPZH OFF-state to HIGH propagation delay OE to QPn; see Figure 8 OFF-state to LOW propagation delay OE to QPn; see Figure 8 tPZL HIGH to OFF-state propagation delay tPHZ LOW to OFF-state propagation delay tPLZ OE to QPn; see Figure 8 set-up time tsu D to CP; see Figure 9 hold time th maximum frequency fmax Extrapolation formula Min Typ Max Unit 5V - 40 80 MHz 10 V - 25 50 MHz 15 V - 20 40 MHz 5V - 40 80 MHz 10 V - 25 50 MHz 15 V - 20 40 MHz 5V - 75 150 MHz 10 V - 40 80 MHz 15 V - 30 60 MHz 5V - 80 160 MHz 10 V - 40 80 MHz 15 V - 30 60 MHz 5V 60 30 - ns 10 V 20 10 - ns 15 V 15 5 - ns 5V +5 −15 - ns 10 V 20 5 - ns 15 V 20 5 - ns minimum LOW 5 V clock pulse; 10 V see Figure 6 15 V 60 30 - ns 30 15 - ns 24 12 - ns minimum HIGH 5 V strobe pulse; 10 V see Figure 7 15 V 40 20 - ns 30 15 - ns 24 12 - ns 5V 5 10 - MHz 10 V 11 22 - MHz 15 V 14 28 - MHz D to CP; see Figure 9 pulse width tW [1] OE to QPn; see Figure 8 VDD see Figure 6 The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF). Table 8. Dynamic power dissipation VSS = 0 V; tr = tf ≤ 20 ns; Tamb = 25 °C. Symbol PD Parameter dynamic power dissipation VDD Typical formula for PD (µW) where: 5V PD = 2100 × fi + Σ(fo × CL) × VDD2 fi = input frequency in MHz, 10 V PD = 9700 × fi + Σ(fo × CL) × VDD2 15 V PD = 26000 × fi + Σ(fo × CL) × VDD fo = output frequency in MHz, 2 CL = output load capacitance in pF, VDD = supply voltage in V, Σ(CL × fo) = sum of the outputs. HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 7 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register 11. Waveforms 1/fmax VI CP input VM GND tW tPHL tPLH VOH QPn, QS1 output VM VOL tPHL tPLH VOH QS2 output VM VOL 001aaf113 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage drops that occur with the output load. Fig 6. Clock to outputs propagation delays, and clock pulse width and maximum frequency Table 9. Measurement points Supply voltage Input Output VDD VM VM VX VY 5 V to 15 V 0.5VDD 0.5VDD 0.1VDD 0.9VDD VI STR input VM GND tW tPHL tPLH VOH QPn output VM VOL 001aaj058 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage drops that occur with the output load. Fig 7. Strobe to output propagation delays, and strobe pulse width, set up and hold times HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 8 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register VI VM OE input GND tPZL tPLZ VDD output LOW-to-OFF OFF-to-LOW VOL VM VX tPHZ tPZH VOH output HIGH-to-OFF OFF-to-HIGH GND VY VM outputs enabled outputs enabled outputs disabled 001aai545 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage drops that occur with the output load. Fig 8. 3-state output enable and disable times for OE input VI VM CP input GND t su t su th th VI VM D input GND VOH VM QPn, QS1, QS2 output VOL 001aaf115 Measurement points are given in Table 9. Logic levels: VOL and VOH are typical output voltage drops that occur with the output load. Fig 9. Data input data set up and hold times HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 9 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register VI 90 % input pulse VSS 10 % tf tr VEXT VDD G VI RL VO DUT CL RT 001aag804 Test data is given in Table 10. Definitions for test circuit: DUT = Device Under Test. CL = load capacitance including jig and probe capacitance. RT = termination resistance should be equal to the output impedance Zo of the pulse generator. Fig 10. Test circuit Table 10. Test data Supply voltage Input VEXT Load VDD VI tr, tf tPHL, tPLH tPHZ, tPZH tPLZ, tPZL CL RL 5 V to 15 V VSS or VDD ≤ 20 ns open VDD VSS 50 pF 1 kΩ HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 10 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register 12. Application information Some examples of applications for the HEF4094B are: • Serial-to-parallel data conversion • Remote control holding register DIGITALLY CONTROLLED EQUIPMENT (REQUIRES CONTINUOUS DIGITAL CONTROL) O0 D DIGITALLY CONTROLLED EQUIPMENT O7 HEF4094B STR CP OS2 O0 D DIGITALLY CONTROLLED EQUIPMENT O0 O7 HEF4094B STR OS2 CP D O7 HEF4094B STR CP CONTROL AND SYNC CIRCUITRY data clock from remote control panel 001aae666 Fig 11. Remote control holding register HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 11 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register 13. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.30 0.53 0.38 1.25 0.85 0.36 0.23 19.50 18.55 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 0.76 inches 0.17 0.02 0.13 0.068 0.051 0.021 0.015 0.049 0.033 0.014 0.009 0.77 0.73 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.03 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 95-01-14 03-02-13 SOT38-4 Fig 12. Package outline SOT38-4 (DIP16) HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 12 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.39 0.014 0.0075 0.38 0.039 0.016 0.028 0.020 inches 0.010 0.057 0.069 0.004 0.049 0.16 0.15 0.05 0.244 0.041 0.228 0.01 0.01 0.028 0.004 0.012 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 13. Package outline SOT109-1 (SO16) HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 13 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm D SOT338-1 E A X c y HE v M A Z 9 16 Q A2 A (A 3) A1 pin 1 index θ Lp L 8 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.00 0.55 8 o 0 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-150 Fig 14. Package outline SOT338-1 (SSOP16) HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 14 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register 14. Abbreviations Table 11. Abbreviations Acronym Description DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 15. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes HEF4094B_4 20081030 Product data sheet - HEF4094B_CNV_3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • Legal texts have been adapted to the new company name where appropriate. • Section 7 “Limiting values” and Section 9 “Static characteristics” added, taken from the HE4000B Family Specifications data sheet. • • Section 9 “Static characteristics” IOH, IOL, II and IDD values updated. Temperature range maximum value increased from 85 °C to 125 °C. Section 2 “Features” added. Package version SOT38-1 changed to SOT38-4 in Section 3, and Figure 12. Package SOT74 removed from Section 3. Package SOT338-1 added to Section 3, and Figure 14. Section 14 “Abbreviations” added. HEF4094B_CNV_3 19950101 Product specification - HEF4094B_CNV_2 HEF4094B_CNV_2 19950101 Product specification - - HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 15 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] HEF4094B_4 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 04 — 30 October 2008 16 of 17 HEF4094B NXP Semiconductors 8-stage shift-and-store bus register 18. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 30 October 2008 Document identifier: HEF4094B_4