MBRP40030CTL Preferred Device POWERTAP II SWITCHMODE Power Rectifier The SWITCHMODE Power Rectifier uses the Schottky Barrier principle with a platinum barrier metal. This state-of-the-art device has the following features: http://onsemi.com • Dual Diode Construction – • • • • • May Be Paralleled for Higher Current Output Guardring for Stress Protection Low Forward Voltage Drop 150°C Operating Junction Temperature Recyclable Epoxy Improved Mechanical Ratings LOW VF SCHOTTKY BARRIER RECTIFIER 400 AMPERES 30 VOLTS Mechanical Characteristics • • • • • • • Case: Epoxy, Molded with metal heatsink base Weight: 80 grams (approximately) Finish: All External Surfaces Corrosion Resistant Top Terminal Torque: 25–40 lb–in max Base Plate Torques: See procedure given in the Package Outline Section Shipped 25 units per foam Marking: B40030L 1 3 2 2 1 MAXIMUM RATINGS Rating Symbol Value Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR Average Rectified Forward Current (At Rated VR, TC = 100°C) Per Leg Per Device IF(AV) Peak Repetitive Forward Current, (At Rated VR, Square Wave, 20 kHz, TC = 100°C) IFRM Non–Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Peak Repetitive Reverse Surge Current (2.0 s, 1.0 kHz) IRRM Storage Temperature Range Tstg –55 to +150 °C Operating Junction Temperature TJ –55 to +150 °C dv/dt 10,000 V/s Voltage Rate of Change (Rated VR) 3 Unit POWERTAP II CASE 357C PLASTIC V 30 A 200 400 MARKING DIAGRAM A YYWW B40030L 200 1500 B40030L = Device Code YY = Year WW = Work Week A A ORDERING INFORMATION 2.0 Device Package MBRP40030CTL POWERTAP II Shipping 25 Units/Tray Preferred devices are recommended choices for future use and best overall value. Semiconductor Components Industries, LLC, 2000 October, 2000 – Rev. 2 1 Publication Order Number: MBRP40030CTL/D MBRP40030CTL THERMAL CHARACTERISTICS Characteristic Thermal Resistance – Junction to Case (Note 1.) Symbol Value Unit RθJC 0.4 °C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 2.) (iF = 200 Amps, TC = +25°C) (iF = 200 Amps, TC = +100°C) VF Maximum Instantaneous Reverse Current (Note 2.) (Rated dc Voltage, TC = +25°C) (Rated dc Voltage, TC = +100°C) IR Volts 0.5 0.41 mA 20 1000 I F , INSTANTANEOUS FORWARD CURRENT (AMPS) i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 1. Rating applies when surface mounted on the minimum pad size recommended. 2. Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2%. 1000 100 10 1 TJ = 150°C 0 TJ = 100°C TJ = 25°C 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 0.5 Figure 1. Typical Instantaneous Forward Voltage 1000 100 10 1 TJ = 150°C 0 TJ = 100°C TJ = 25°C 0.1 0.2 0.3 0.4 0.5 0.6 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 2. Maximum Instantaneous Forward Voltage http://onsemi.com 2 10 1 I R , MAXIMUM REVERSE CURRENT (AMPS) I R , REVERSE CURRENT (AMPS) MBRP40030CTL TJ = 150°C 0.1 TJ = 100°C 0.01 0.001 TJ = 25°C 5 10 15 20 25 VR, REVERSE VOLTAGE (VOLTS) 30 1 TJ = 100°C 0.01 0.001 0.0001 0 35 TJ = 150°C 0.1 Figure 3. Typical Reverse Current TJ = 25°C 5 10 15 20 25 VR, REVERSE VOLTAGE (VOLTS) 10000 25°C 1000 0 5 30 Figure 4. Maximum Reverse Current 100000 C, CAPACITANCE (pF) 0.0001 0 10 10 15 20 25 VR, REVERSE VOLTAGE (VOLTS) Figure 5. Typical Capacitance http://onsemi.com 3 30 35 35 MBRP40030CTL MAXIMUM MECHANICAL RATINGS POWERTAP MECHANICAL DATA APPLIES OVER OPERATING TEMPERATURE Terminal Penetration: 0.235 max Terminal Torque: 25–40 in-lb max Mounting Torque – Outside Holes: 30–40 in-lb max Mounting Torque – Center Hole: 8–10 in-lb max Seating Plane Flatness 1 mil per in. (between mounting holes) 2″ Vertical Pull 250 lbs. max 2 in. Lever Pull 50 lbs. max Note: While the POWERTAP is capable of sustaining these vertical and levered tensions, the intimate contact Note: between POWERTAP and heat sink may be lost. This could lead to thermal runaway. The use of very Note: flexible leads is recommended for the anode connections. Use of thermal grease is highly recommended. MOUNTING PROCEDURE The POWERTAP package requires special mounting considerations because of the long longitudinal axis of the copper heat sink. It is important to follow the proper tightening sequence to avoid warping the heat sink, which can reduce thermal contact between the POWERTAP and heat sink. STEP 1: Locate the POWERTAP on the heat sink and start mounting bolts into the threads by hand (2 or 3 turns). 2–3 TURNS 2–3 TURNS POWER TAP HEAT SINK 2–3 TURNS STEP 2: Finger tighten the center bolt. The bolt may catch on the threads of the heat sink so it is important to make sure the face of the bolt or washer is in contact with the surface of the POWERTAP. STEP 3: Tighten each of the end bolts between 5 to 10 in-lb. STEP 4: Tighten the center bolt between 8 to 10 in-lb. FINGER-TIGHT TAP HEAT SINK FINGER-TIGHT 5–10 IN-LB POWER TAP HEAT SINK 8–10 IN-LB 5–10 IN-LB 5–10 IN-LB POWER TAP HEAT SINK 8–10 IN-LB 30–40 IN-LB 30–40 IN-LB POWER TAP HEAT SINK http://onsemi.com 4 2–3 TURNS POWER 5–10 IN-LB STEP 5: Finally, tighten the end bolts between 30 to 40 in-lb. 2–3 TURNS MBRP40030CTL PACKAGE DIMENSIONS CASE 357C–03 POWERTAP PLASTIC PACKAGE ISSUE E –A– W 0.25 (0.010) R G M T A M B M N –B– Q H 2 PL 0.25 (0.010) F –T– C E U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TERMINAL PENETRATION: 5.97 (0.235) MAXIMUM. M T A M SEATING PLANE V http://onsemi.com 5 B M DIM A B C E F G H N Q R U V W INCHES MIN MAX 3.450 3.635 0.700 0.810 0.615 0.640 0.120 0.130 0.435 0.445 1.370 1.380 0.007 0.030 1/4-20UNC-2B 0.270 0.285 31.50 BSC 0.600 0.630 0.330 0.375 0.170 0.190 MILLIMETERS MIN MAX 87.63 92.33 17.78 20.57 15.63 16.26 3.05 3.30 11.05 11.30 34.80 35.05 0.18 0.76 1/4-20UNC-2B 6.86 7.23 80.01 BSC 15.24 16.00 8.39 9.52 4.32 4.82 MBRP40030CTL Notes http://onsemi.com 6 MBRP40030CTL Notes http://onsemi.com 7 MBRP40030CTL POWERTAP and SWITCHMODE are trademarks of Semiconductor Components Industries, LLC. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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