Datasheet General Purpose CMOS Logic IC 8bit Static Shift/Store Register BU4094BC BU4094BCF BU4094BCFV Key Specifications General Description The BU4094BC/BCF/BCFV are shift/store register composed of 8 bit shift register and 8 bit latch. The read data in the shift register can be taken in the latch through the asynchronous strobe input; therefore, the data transfer mode can hold output. Packages W(Typ) x D(Typ) x H(Max) 19.40mm x 6.50mm x 7.95mm 10.00mm x 6.20mm x 1.71mm 5.00mm x 6.40mm x 1.35mm DIP16 SOP16 SSOP-B16 Features Operating Supply Voltage Range: 3V to 16V Input Voltage Range: VSS to VDD Operating Temperature Range: -40°C to +85°C Low Power Consumption Wide Operating Supply Voltage Range High Input Impedance High Fan Out 2 L-TTL Inputs or 1 LS-TTL Input can be directly driven DIP16 SOP16 SSOP-B16 Truth Table CLOCK Parallel data outputs OUTPUT ENABLE STROBE SERIAL IN H H H Serial data outputs Q1 QN QS Q'S L L QN-1 Q7 NC H H H QN-1 Q7 NC H L * NC NC Q7 NC L * * HZ HZ Q7 NC H * * NC NC NC QS L * * HZ HZ NC QS *: Don’t Care NC: No Change HZ: High Impedance 〇Product structure : Silicon monolithic integrated circuit .www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Pin Configuration (TOP VIEW) STROBE 1 16 VDD SERIAL IN 2 15 OUTPUT ENABLE CLOCK 3 14 Q5 Q1 4 13 Q6 Q2 5 12 Q7 Q3 6 11 Q8 Q4 7 10 Q’S VSS 8 9 QS Pin Description Pin No. Pin Name I/O 1 STROBE I Latch input 2 SERIAL IN I Data input 3 CLOCK I Clock input 4 Q1 O Parallel data input Q1 5 Q2 O Parallel data input Q2 6 Q3 O Parallel data input Q3 7 Q4 O Parallel data input Q4 8 VSS ― Power supply(-) 9 QS O Serial data output QS 10 Q’S O Serial data output Q’S 11 Q8 O Parallel data output Q8 12 Q7 O Parallel data output Q7 13 Q6 O Parallel data output Q6 14 Q5 O Parallel data output Q5 15 OUTPUT ENABLE I Output enable 16 VDD ― www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Function Power supply (+) 2/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Block Diagram SERIAL IN QS Serial Outputs 8-STAGE SHIFT REGISTER Q'S CLOCK STROBE 8-BIT LATCHES OUTPUT ENABLE 3-STATE OUTPUTS Q1 Q8 Parallel Outputs Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit Supply Voltage VDD -0.3 to +18.0 V Input Voltage VIN (VSS-0.3) to (VDD+0.3) V Input Current IIN ±10 mA Operating Temperature Topr -40 to +85 °C Storage Temperature Tstg -55 to +150 °C Maximum Junction Temperature Tjmax +150 °C Power Dissipation PD DIP16 1.25 (Note 1) SOP16 0.62 (Note 2) 0.87 (Note 3) SSOP-B16 W (Note 1) Reduce 10mW/°C above 25°C. (Note 2) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5mW /°C above 25°C. (Note 3) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 7mW /°C above 25°C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta= -40°C to +85°C) Parameter Symbol Min Typ Max Unit Supply Voltage VDD 3.0 - 16 V Input Voltage VIN VSS - VDD V www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Electrical Characteristics (Unless otherwise specified VSS=0V, Ta=25°C) Parameter Symbol Min Typ Max 3.5 - - 7.0 - - 11.0 - - - - 1.5 - - 3.0 Unit Conditions DC Characteristics Input “H” voltage VIH VDD=5V V VDD=10V - VDD=15V VDD=5V Input “L” voltage VIL - - 4.0 Input “H” current IIH - - 0.3 uA VDD=15V VIH=15V Input “L” current IIL - -0.3 - uA VDD=15V VIL=0V 4.95 - 9.95 - - V 14.95 - - - VDD=15V - 0.05 VDD=5V - - 0.05 - - -0.44 - 0.05 - -1.1 - - -3.0 - - 0.44 - - 1.1 - - 3.0 - - - - 5 - - 10 - - 20 VDD=15V - 100 200 VDD=5V - 50 100 - 40 80 VDD=15V - 100 200 VDD=5V - 50 100 - 40 80 VDD=15V - 350 600 VDD=5V - 125 250 - 95 190 - 230 460 - 110 220 - 75 150 - 420 840 - 195 390 - 135 270 VDD=15V - 290 580 VDD=5V - 145 290 - 100 200 VDD=15V - 140 280 VDD=5V - 75 150 - 55 110 Output “H” voltage Output “L” voltage Output “H” current Output “L” current Quiescent supply current VOH VOL IOH IOL IDD V VDD=10V - VDD=15V VDD=5V V VDD=10V VDD=10V IO=0mA IO=0mA VDD=15V mA mA VDD=5V VO=4.6V VDD=10V VO=9.5V VDD=15V VO=13.5V VDD=5V VO=0.4V VDD=10V VO=0.5V VDD=15V VO=1.5V VDD=5V µA VDD=10V VIN=VDD or VSS Switching Characteristics, CL=50pF Output rising time Output falling time Propagation delay time CLOCK－QS Propagation delay time CLOCK－Q’S Propagation delay time CLOCK－QN Propagation delay time STROBE－QN 3state Propagation delay time OUTPUT ENABLE－QN www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 tTLH tTHL tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL tPHZ tPZH 4/19 ns ns ns VDD=10V VDD=10V VDD=10V - - - VDD=15V VDD=5V ns VDD=10V - VDD=15V VDD=5V ns ns ns VDD=10V VDD=10V VDD=10V - - RL=1kΩ VDD=15V TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Electrical Characteristics - continued Parameter Symbol Min Typ Max Unit Conditions - 140 280 - 75 150 - 55 110 - 20 125 - 8 55 - 6 35 VDD=15V - 10 40 VDD=5V - 10 20 - 5 15 VDD=15V - 100 200 VDD=5V - 50 100 - 40 80 1.25 2.5 - 2.5 5 - 3.0 12.5 - - 100 200 - 40 80 - 35 70 - 5 Switching Characteristics, CL=50pF 3state Propagation delay time OUTPUT ENABLE－QN tPLZ tPZL Minimum set up time DATA－CLOCK tSU Minimum hold time CLOCK－DATA tH Minimum clock pulse width tW Maximum clock Frequency fCL Minimum strobe pulse width tWL Input capacitance CIN - VDD=5V ns RL=1kΩ VDD=10V VDD=15V VDD=5V ns - VDD=10V ns - VDD=10V ns - VDD=10V VDD=15V VDD=5V MHz - VDD=10V VDD=15V VDD=5V ns - VDD=10V VDD=15V pF - - Waveforms of Switching Characteristics tR tW CLOCK 50% tF 90% 50% 50% 10% DATA tSU tH tWL STROBE OUTPUT ENABLE 50% tPLH Q1～ Q7 50% 10% tPHL 90% 90% tTLH QS Q'S www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 tPLH tPZL tPHZ 50% 10% tTHL 50% tPZH 50% 10% tPLH 50% 90% tPLZ 90% 10% tPHL 50% tPHL tPLH 50% 5/19 50% TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Typical Performance Curves 0 50 VDD=5V 85℃ 25℃ -40℃ VDD=10V 85℃ 25℃ -40℃ -20 VDD=15V -30 VDD=15V 40 Output ''L'' Current [mA] Output ''H'' Current [mA] -10 85℃ 25℃ -40℃ -40°C 25° C 85°C 30 VDD=10V -40°C 20 25° 85°C C VDD=5V 10 -40 -40°C 25° 85°C C -50 0 0 5 10 15 Output Voltage [V] 20 0 10 15 Output Voltage [V] 20 Figure 2. Output “L” Current vs Output Voltage Figure 1. Output “H” Current vs Output Voltage 500 500 Operating Temperature Range Propagation Delay Time (CLOCK–QS) [ns] Propagation Delay Time (CLOCK–QS) [ns] 5 400 VDD=3V 300 200 VDD=5V VDD=10V 100 VDD=16V Operating Temperature Range 400 VDD=3V 300 200 VDD=5V VDD=10V 100 VDD=16V 0 0 -50 -25 0 25 50 75 Ambient Temperature [°C] -50 100 0 25 50 75 Ambient Temperature [°C] 100 Figure 4. Propagation Delay Time tPHL (CLOCK–QS) vs Ambient Temperature Figure 3. Propagation Delay Time tPLH (CLOCK–QS) vs Ambient Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -25 6/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Typical Performance Curves - continued 500 Operating Temperature Range Propagation Delay Time (CLOCK–Q's) [ns] Propagation Delay Time (CLOCK–Q's) [ns] 500 400 VDD=3V 300 200 VDD=5V VDD=10V 100 VDD=16V 0 400 VDD=3V 300 200 VDD=5V VDD=10V 100 VDD=16V 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 -50 Figure 5. Propagation Delay Time tPLH (CLOCK–Q’S) vs Ambient Temperature -25 0 25 50 75 Ambient Temperature [°C] 100 Figure 6. Propagation Delay Time tPHL (CLOCK–Q’S) vs Ambient Temperature 500 500 Operating Temperature Range Propagation Delay Time (CLOCK–QN) [ns] Propagation Delay Time (CLOCK–QN) [ns] Operating Temperature Range VDD=3V 400 300 VDD=5V 200 VDD=10V 100 VDD=16V 0 Operating Temperature Range VDD=3V 400 300 VDD=5V 200 VDD=10V 100 VDD=16V 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 -50 0 25 50 75 Ambient Temperature [°C] 100 Figure 8. Propagation Delay Time tPHL (CLOCK–QN) vs Ambient Temperature Figure 7. Propagation Delay Time tPLH (CLOCK–QN) vs Ambient Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -25 7/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Typical Performance Curves - continued 500 Operating Temperature Range Propagation Delay Time (STROBE–QN) [ns] Propagation Delay Time (STROBE–QN) [ns] 500 400 VDD=3V 300 200 VDD=5V VDD=10V 100 VDD=16V 0 400 VDD=3V 300 200 VDD=5V VDD=10V 100 VDD=16V 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 -50 200 200 Propagation Delay Time 150 VDD=3V VDD=5V VDD=10V 50 (OUTPUT ENABLE–QN) [ns] Operating Temperature Range 100 -25 0 25 50 75 Ambient Temperature [°C] 100 Figure 10. Propagation Delay Time tPHL (STROBE–QN) vs Ambient Temperature Figure 9. Propagation Delay Time tPLH (STROBE–QN) vs Ambient Temperature Propagation Delay Time (OUTPUT ENABLE–QN) [ns] Operating Temperature Range Operating Temperature Range 150 VDD=3V 100 VDD=5V VDD=10V 50 VDD=16V VDD=16V 0 0 -50 -25 0 25 50 75 Ambient Temperature [°C] -50 100 Figure11. Propagation Delay Time tPZH (OUTPUT ENABLE–QN) vs Ambient Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -25 0 25 50 75 Ambient Temperature [°C] 100 Figure12. Propagation Delay Time tPHZ (OUTPUT ENABLE–QN) vs Ambient Temperature 8/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Typical Performance Curves - continued 200 200 Operating Temperature Range Operating Temperature Range VDD=3V VDD=5V 100 VDD=10V 50 VDD=16V (OUTPUT ENABLE–QN) [ns] 150 Propagation Delay Time (OUTPUT ENABLE–QN) [ns] Propagation Delay Time VDD=3V 150 100 VDD=5V VDD=10V 50 VDD=16V 0 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 -50 40 Hold Time (CLK －DATA) [ns] Setup Time (DATA－CLOCK) [ns] 200 Operating Temperature Range 30 VDD=3V 20 VDD=5V 10 VDD=10V 0 25 50 75 Ambient Temperature [°C] 100 Figure14. Propagation Delay Time tPLZ (OUTPUT ENABLE–QN) vs Ambient Temperature Figure13. Propagation Delay Time tPZL (OUTPUT ENABLE–QN) vs Ambient Temperature 50 -25 Operating Temperature Range 150 VDD=3V 100 VDD=5V 50 VDD=10V VDD=16V VDD=16V 0 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 -50 Figure15. Set up time tSU (DATA－CLOCK) vs Ambient Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 -25 0 25 50 75 Ambient Temperature [°C] 100 Figure16. Hold Time tH (CLOCK－DATA) vs Ambient Temperature 9/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Typical Performance Curves - continued Minimum Clock Pulse Width [ns] 200 Operating Temperature Range 150 100 VDD=3V 50 VDD=16V VDD=10V VDD=5V 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 Figure17. Minimum Clock Pulse Width tW vs Ambient Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Timing Chart OUTPUT ENABLE STROBE CLOCK SERIAL IN DS1 3 2 1 DS2 5 4 DS4 DS3 6 DS5 7 DS6 DS7 10 9 8 DS8 DS9 DS10 11 DS11 Q1 DP1 DS1 DS2 DS3 DS4 DS6 DS7 DS8 Z Z Q2 DP2 DP1 DS1 DS2 DS3 DS5 DS6 DS7 Z Z Q6 DP6 DP5 DP4 DP3 DP2 DS1 DS2 DS3 Z Z Q7 DP7 DP6 DP5 DP4 DP3 DP1 DS1 DS2 Z Z Q8 DP8 DP7 DP6 DP5 DP4 DP2 DP1 DS1 Z Z QS DP7 DP6 DP5 DP4 DP1 DS1 DS2 ・ ・ ・ DP3 DP2 2 Q’S www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 DP7 DP6 DP8 DP4 11/19 DP3 DP2 DP1 DS1 DS2 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Power Dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at T A=25°C(normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θ JA [°C/W].The temperature of IC inside the package can be estimated by this thermal resistance. Figure 18 shows the model of thermal resistance of the package. Thermal resistance θJA, ambient temperature TA, maximum junction temperature TJmax, and power dissipation PD can be calculated by the equation below: θJA = (TJmax - TA) / PD [°C/W] Derating curve in Figure 19 indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θJA. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. 1.6 1.4 BU4094BC (DIP16) θJA =( TJmax - TA)/ PD Power Dissipation [W] 1.2 [°C/W ] 周囲温度 Ta [℃] TA [℃] Ambient temperature 1.0 BU4094BCFV (SSOP-B16) 0.8 0.6 0.4 BU4094BCF (SOP16) 0.2 0.0 Chip surface temperature TJ[℃] チップ 表面温度 Tj [℃] 0 25 50 75 85 100 125 150 消費電力 P [W] Ambient Temperature [℃] Figure 18. Thermal resistance Figure 19. Derating Curve I/O Equivalent Circuits Pin No. Input Terminals 1,2,3,15 VDD VDD Output Terminals 4,5,6,7,9,10,11,12,13,14 VDD VDD VDD VDD VDD VDD Equivalence Circuit GND VSS www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 GND GND VSS VSS 12/19 GND VSS TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Ordering Information B U 4 0 9 4 Part Number B C x Package None : DIP16 F : SOP16 FV : SSOP-B16 x - x x Packaging and forming specification None : Tube E2 : Embossed tape and reel Marking Diagram DIP16(TOP VIEW) SOP16(TOP VIEW) Part Number Marking BU4094BC Part Number Marking BU4094BCF LOT Number LOT Number 1PIN MARK SSOP-B16(TOP VIEW) Part Number Marking 4094C LOT Number 1PIN MARK www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 DIP16 16/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Physical Dimension, Tape and Reel Information - continued Package Name SOP16 (Max 10.35 (include.BURR)) (UNIT : mm) PKG : SOP16 Drawing No. : EX114-5001 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Physical Dimension, Tape and Reel Information - continued Package Name www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SSOP-B16 18/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 BU4094BC BU4094BCF BU4094BCFV Revision History Date Revision 11.Aug.2014 001 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Changes New Release 19/19 TSZ02201-0RDR0GZ00240-1-2 11.Aug.2014 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BU4094BC - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BU4094BC DIP16 1000 25 Tube inquiry Yes