ADS7815 ADS 781 5 SBAS065B – DECEMBER 1996 – DECEMBER 2006 16-Bit 250kHz Sampling CMOS ANALOG-to-DIGITAL CONVERTER FEATURES DESCRIPTION ● ● ● ● ● ● The ADS7815 is a complete 16-bit sampling analog-todigital (A/D) converter featuring excellent AC performance and a 250kHz throughput rate. The design includes a 16-bit capacitor-based SAR A/D converter with an inherent sample and hold (S/H), a precision reference, and an internal clock. Spurious-free dynamic range with a 100kHz full-scale sinewave input is typically greater than 100dB. The ±2.5V input range allows development of precision systems using only ±5V supplies. The converter is available in a 28-lead SOIC package specified for operation over the industrial –25°C to +85°C temperature range. 250kHz SAMPLING RATE COMPLETE WITH S/H, REF, CLOCK, ETC. 96dB min SFDR WITH 100kHz INPUT 82dB min SINAD WITH 100kHz INPUT ±2.5V INPUT RANGE 28-LEAD SOIC APPLICATIONS ● ● ● ● WIRELESS BASE STATIONS SPECTRUM ANALYSIS IMAGING SYSTEMS DATA ACQUISITION R/C Clock Successive Approximation Register and Control Logic CS BUSY CDAC Output ±2.5V Input Latches and Comparator Three Parallel Data Bus State Drivers Buffer 5kΩ REF Out/In Internal +2.5V Ref Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright © 1996-2006, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ELECTROSTATIC DISCHARGE SENSITIVITY ABSOLUTE MAXIMUM RATINGS Analog Inputs: VIN ................................................................................ ±VS REF ............................................ GND –0.3V to +VS +0.3V CAP ............................................... Indefinite Short to GND Momentary Short to +VS +VS ......................................................................................................... 7V –VS ...................................................................................................... –7V Digital Inputs ...................................................... GND –0.3V to +VS +0.3V Maximum Junction Temperature ................................................... +165°C Internal Power Dissipation ............................................................. 825mW Lead Temperature (soldering, 10s) ............................................... +300°C PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE PACKAGE DESIGNATOR TEMPERATURE RANGE ADS7815U 28-Pin SOIC DW –25°C to +85°C This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at then end of this data sheet, or see the TI website at www.ti.com. 2 ADS7815 www.ti.com SBAS065B ELECTRICAL CHARACTERISTICS At TA = –25°C to +85°C, fS = 250kHz, +VS = +5V, and –VS = –5V, using internal reference, unless otherwise specified. ADS7815U PARAMETER CONDITIONS MIN TYP RESOLUTION ANALOG INPUT Voltage Range Impedance Capacitance THROUGHPUT SPEED Conversion Cycle Throughput Rate DC ACCURACY Integral Linearity Error No Missing Codes Transition Noise(2) Full Scale Error(3) Full Scale Error Drift Bipolar Zero Error Bipolar Zero Error Drift Power Supply Sensitivity AC ACCURACY Spurious-Free Dynamic Range Total Harmonic Distortion Signal-to-(Noise+Distortion) Signal-to-Noise Usable Bandwidth(5) Aperture Delay REFERENCE Internal Reference Voltage Internal Reference Source Current External Reference Voltage Range External Reference Current Drain Output Capacitance UNITS 16 Bits ±2.5V 100 30 Acquire and Convert V MΩ pF 4.0 250 ±4 15 0.8 ±0.1 ±7 ±2 ±2 ±6 +VS ±5%, –VS ±5% fIN = 100kHz fIN = 100kHz fIN = 100kHz –60dB Input fIN = 100kHz 96 100 –98 –94 28 82 1 40 2.45 2.3 2.5 1 2.5 VREF = +2.5V –0.3 +2.8 µs kHz LSB(1) Bits LSB % ppm/°C mV ppm/°C LSB 82 DIGITAL INPUTS Logic Levels VIL VIH IIL IIH DIGITAL OUTPUTS Data Format Data Coding VOL VOH Leakage Current MAX 2.55 dB(4) dB dB dB dB MHz ns 2.7 100 V µA V µA +0.8 +VS +0.3V ±10 ±10 V V µA µA +0.4 ±5 V V µA 15 pF 83 83 ns ns +5.25 –4.75 250 V V mA mA mW +85 +125 °C °C Parallel 16 bits Binary Two’s Complement ISINK = 1.6mA ISOURCE = 200µA High-Z State, VOUT = 0V to VDIG High-Z State +4 DIGITAL TIMING Bus Access Time Bus Relinquish Time POWER SUPPLIES +VS –VS +IS –IS Power Dissipation +4.75 –5.25 TEMPERATURE RANGE Specified Performance Storage –25 –55 +5 –5 +30 –10 200 NOTES: (1) LSB means Least Significant Bit. For the 16-bit, ±2.5V input ADS7815, one LSB is 76µV. (2) Typical rms noise at worst case transitions and temperatures. (3) Full scale error is the worst case of –Full Scale or +Full Scale untrimmed deviation from ideal first and last code transitions, divided by the transition voltage (not divided by the full-scale range) and includes the effect of offset error. (4) All specifications in dB are referred to a full-scale ±2.5V input. (5) Full-Power Bandwidth defined as Full-Scale input frequency at which Signal-to-(Noise+Distortion) degrades to 60dB, or 10 bits of accuracy. ADS7815 SBAS065B www.ti.com 3 PIN CONFIGURATION Top View SOIC VIN 1 28 +VS GND 2 27 +VS REF 3 26 BUSY CAP 4 25 CS GND 5 24 R/C D15 (MSB) 6 23 –VS D14 7 22 D0 (LSB) ADS7815 PIN # NAME 1 2 3 VIN GND REF 4 5 6 CAP GND D15 (MSB) 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 D14 D13 D12 D11 D10 D9 D8 GND D7 D6 D5 D4 D3 D2 D1 D0 (LSB) 23 24 –VS R/C 25 CS 26 BUSY 27 28 +VS +VS D13 8 21 D1 D12 9 20 D2 D11 10 19 D3 D10 11 18 D4 D9 12 17 D5 D8 13 16 D6 GND 14 15 D7 DESCRIPTION Analog Input. Full-scale input range is ±2.5V. Ground. Reference Input/Output. Outputs internal reference of +2.5V nominal. Can also be driven by external system reference. In both cases, connect to ground with a 0.1µF ceramic capacitor in parallel with 2.2µF tantalum capacitor. Reference compensation capacitor. Use a parallel combination of a 0.1µF ceramic capacitor and a 2.2µF tantalum capacitor. Ground. Data Bit 15. Most Significant Bit (MSB) of conversion results. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 14. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 13. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 12. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 11. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 10. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 9. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 8. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Ground. Data Bit 7. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 6. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 5. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 4. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 3. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 2. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 1. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Data Bit 0. Least Significant Bit (LSB) of conversion results. Hi-Z state when CS is HIGH, when R/C is LOW or when a conversion is in progress. Negative supply input. Nominally –5V. Decouple to analog ground with 0.1µF ceramic and 10µF tantalum capacitors. Read/convert input. With R/C HIGH, CS going LOW will enable the output data bits if a conversion is not in progress. With R/C LOW, CS going LOW will start a conversion if one is not already in progress. Chip select. With R/C LOW, CS going LOW will initiate a conversion if one is not already in progress. With R/C HIGH, CS going LOW will enable the output data bits if a conversion is not in progress. Busy output. Falls when a conversion is started, and remains LOW until the conversion is completed. With CS LOW and R/C HIGH, output data will be valid when BUSY rises, so that the rising edge can be used to latch the data. CS or R/C must be HIGH within 250ns after BUSY rises or another conversion will start without time for signal acquisition. Positive supply input. Nominally +5V. Connect directly to pin 28. Positive supply input. Nominally +5V. Connect directly to pin 27. Decouple to ground with 0.1µF ceramic and 10µF tantalum capacitors. TABLE I. Pin Assignments. 4 ADS7815 www.ti.com SBAS065B BASIC OPERATION is placed on these outputs. In the circuit shown in Figure 1, the rising edge of BUSY latches the result into the 74HC574s. Figure 1 shows the recommended circuit for operation of the ADS7815. A falling edge on the convert pulse signal places the sample and hold into the hold mode and initiates a conversion. When the conversion is complete, the pins D15 through D0 become active and the result of the conversion After the conversion is complete, the ADS7815 sample and hold returns to the sample mode and begins acquiring the input signal for the next conversion. Allowing 4µs between falling edges of the convert pulse signal assures accurate acquisition of the analog input. R1 75Ω +5V R2 10Ω OPA628 –5V 2.2µF C3 2.2µF C4 + + 0.1µF C5 0.1µF C6 1 VIN +VS 28 2 GND +VS 27 3 REF BUSY 26 4 CAP CS 25 5 GND R/C 24 6 D15 –VS 23 7 8 D14 D0 22 ADS7815 D13 D1 21 9 D12 D2 20 10 D11 D3 19 11 D10 D4 18 2 12 D9 D5 17 3 13 D8 D6 16 4 14 GND D7 15 5 0.1µF C1 + +5V 10µF C2 Convert Pulse 74HC00 –5V 100ns min 0.1µF C7 10µF + C8 OC 1 10 6 7 8 9 OC CLK 1D 1Q 2D 2Q 3D 3Q 4D 4Q 5D 5Q 6D 6Q 7D 7Q 8D 8Q µProcessor Bus 74HC574 1 10 2 3 4 5 6 7 8 9 OC CLK 1D 1Q 2D 2Q 3D 3Q 4D 4Q 5D 5Q 6D 6Q 7D 7Q 8D 8Q µProcessor Bus 74HC574 FIGURE 1. Basic Operation. ADS7815 SBAS065B www.ti.com 5 TIMING the digital outputs tri-stating while the sample and hold transitions to the hold mode. The change in digital outputs results in noise being coupled onto the hold capacitor. The timing shown in Figure 2 and Table II is the recommended method of operating the ADS7815. The falling edge of CS initiates the conversion. During the conversion, the digital outputs are tri-stated and BUSY is LOW. Near the end of the conversion, the digital outputs become active with the most recent conversion result. After a brief delay (see time t11 in Figure 2 and Table II), BUSY rises. The rising edge of BUSY is used to latch the digital result in Figure 1. If a conversion is not in progress or is just about to finish, the digital outputs will be active when R/C is HIGH and CS is LOW. This is shown in Figure 2 and Figure 3. It is possible to return CS HIGH during the initial part of the conversion (as is done with R/C) and prevent the digital outputs from becoming active. At a later time, the digital results could be read by taking CS LOW. It is also possible to leave R/C LOW, take CS HIGH during the conversion, and read the results at a later time by taking R/C HIGH and CS LOW. R/C AND CS The R/C (read/convert) and CS signals control the start of conversion and, when a conversion is not in progress, the status of the digital outputs D15 through D0. It is possible to start a conversion by taking CS LOW and then taking R/C LOW. However, this is not recommended and will result in a significant decrease in signal-to-noise ratio. This is due to SYMBOL DESCRIPTION MIN t1 CS to R/C Delay t2 CS to BUSY Delay TYP MAX UNITS 200 ns 40 Aperture Delay 40 ns t4 BUSY LOW 3.3 µs R/C LOW to CS LOW t6 BUSY HIGH to CS HIGH 100 t7 Bus Access Time 83 ns Bus Relinquish Time 10 83 ns t9 Throughput Time 4 µs Conversion Time Data Valid to BUSY HIGH 25 t12 CS to R/C Setup Time 40 t7 3.3 µs 35 ns t8 CS ns t8 t10 R/C ns 250 t11 t12 ns t3 t5 Following a conversion, if R/C and CS are both LOW 250ns after BUSY rises, then a new conversion will be initiated without allowing the proper acquisition period for the sample and hold. R/C must remain HIGH or CS must be taken HIGH within 250ns of BUSY rising. D15 - D0 DataValid Hi-Z State Hi-Z State Acquire MODE ns TABLE II. Conversion Timing. FIGURE 3. Bus Timing. t1 t5 R/C t6 t9 CS t2 t4 BUSY t8 Hi-Z State D15 - D0 DataValid Hi-Z State t11 t3 MODE Acquire Convert Acquire t10 FIGURE 2. ADS7815 Timing. 6 ADS7815 www.ti.com SBAS065B R/C and CS should remain static prior to that start of conversion and during the later part of a conversion. To start a conversion, R/C should be taken LOW at least 100ns before CS is taken LOW. R/C and/or CS should be taken HIGH during the early part of the conversion, preferably within 200ns of the start of the conversion. If these times are not observed, then there is risk that the transition of these digital signals may affect the conversion result. The three NAND gates shown in Figure 1 can be used to generate R/C and CS signals from a single negative going pulse. BUSY BUSY goes LOW when a conversion is started and remains LOW throughout the conversion. Just prior to BUSY going HIGH, the digital outputs become active with the conversion result. Time t11, shown in Figure 2, should provide adequate time for the ADS7815 to drive the digital outputs to a valid logic state before BUSY rises. As shown in Figure 1 and 2, the rising edge of BUSY can be used to latch the digital result into an external component. DIGITAL OUTPUT The ADS7815’s digital output is in Binary Two’s Complement (BTC) format. Table III shows the relationship between the digital output word and analog input voltage under ideal conditions. REFERENCE The ADS7815 can be operated with the internal 2.5V reference or an external reference. By applying an external reference to the REF pin, the internal reference is bypassed. The reference voltage at REF is buffered internally. The voltage at the reference input sets the full-scale range of the converter. With the internal 2.5V reference, the input range is ±2.5V. Thus, the input range of the converter’s analog input is simply ±VREF, where VREF is the voltage at the reference input. Because of internal gain and offset error, the input range will not be exactly ±VREF. The full-scale error of the converter with an external reference will typically be 0.25% or less. The bipolar zero error will be similar to that listed in the Electrical Characteristics table. The range for the external reference is 2.3V to 2.7V. REF PIN The REF pin itself should be bypassed with a 0.1µF ceramic capacitor in parallel with a 2.2µF tantalum capacitor. While both capacitors should be physically close to the ADS7815, it is very important that the ceramic capacitor be placed as close as possible. The REF voltage should not be used to drive a large load or any load which is dynamic. A large load will reduce the reference voltage and the corresponding input range of the converter. A dynamic load will modulate the reference voltage and this modulation will be present in the converter’s output data. DIGITAL OUTPUT DESCRIPTION ANALOG INPUT BINARY CODE HEX CODE 2.499924V 0111 1111 1111 1111 7FFF Full Scale Range ±2.5V Least Significant Bit (LSB) 76µV +Full Scale (2.5V – 1LSB) Midscale BINARY TWO’S COMPLEMENT 0V 0000 0000 0000 0000 0000 One LSB below Midscale –76µV 1111 1111 1111 1111 FFFF –Full Scale –2.5V 1000 0000 0000 0000 8000 Table III. Ideal Input Voltages and Output Codes. CAP PIN The voltage on the CAP pin is the output of the reference buffer. This pin should be bypassed with a 0.1µF ceramic capacitor in parallel with a 2.2µF tantalum capacitor. While both capacitors should be physically close to the ADS7815, it is very important that the ceramic capacitor be placed as close as possible. The CAP pin connects to the internal reference buffer and directly to the binary weighted capacitor array of the converter. Thus, the signal at the CAP pin has high-frequency glitches which occur at each bit decision. For this reason, the CAP voltage should not be used to provide a reference voltage for external circuitry. ADS7815 SBAS065B www.ti.com 7 LAYOUT The layout of the ADS7815 and accompanying components will be critical for optimum performance. Use of an analog ground plane is essential. Use of +5V and –5V power planes is not critical as long as the supplies are well bypassed, and the traces connecting +5V and –5V to the power connector are not too long or too thin. The two +VS power pins of the ADS7815 must be tied together. The voltage source for these pins should also power the input buffer and the 74HC00 shown in Figure 1. This supply should separate from the positive +5V supply for the system’s digital logic Three ground pins are present on the ADS7815: pin 2, pin 5, and pin 14. These should all be tied to the analog ground plane. The analog ground plane should extend underneath all analog signal conditioning components and up to the 74HC574s (or equivalent components) shown in Figure 1. The 74HC574s should not be located more than several inches from the ADS7815. The ground for the 74HC574s should be connected to the digital ground. The analog ground plane should extend up to the 74HC574s but should be kept at least 1/4" (6mm) distant from the digital ground plane (if present). The analog and digital grounds planes should not overlap at any point. INTERMEDIATE LATCHES The 74HC574s shown in Figure 1 isolate the ADS7815 from digital signals on a microprocessor, digital signal processor (DSP), or microcontroller bus. This is necessary because of the precision needed within the ADS7815. The weight of a 8 single LSB in the ADS7815 is 76µV, and the comparator must be able to resolve differences in voltage to this level. External digital signals which transition during the conversion can easily couple onto the substrate and produce voltages larger than this. In place of the 74HC574s, it might be possible to use a FIFO or similar type of memory device. For the majority of systems, it will be difficult to go directly from the ADS7815 into a microcontroller or DSP even if the ADS7815 is not connected to shared bus. The reason for this is that during a conversion, the ADS7815 outputs are tri-stated. The only chance to read the outputs are during the acquisition period. And, this is not recommended if the data will be read just prior to the converter going into the hold mode. SIGNAL CONDITIONING The ADS7815 input essentially consists of a switch and a capacitor. In the acquisition or sample mode, the switch is closed and the input signal drives the capacitor directly. When a conversion is started, the switch is opened capturing the input signal at that moment. This voltage is held on the capacitor for the remainder of the conversion. While this provides for a wide bandwidth sample and hold function and results in excellent AC performance, this architecture requires a high bandwidth, precision op amp to drive the analog input. The op amp and configuration shown in Figure 1 is highly recommended. The amplifier should be placed within 1 to 2 inches (25 to 50mm) of the ADS7815, and the layout guidelines in the OPA628 data sheet should be strictly followed. ADS7815 www.ti.com SBAS065B Revision History DATE REVISION 12/06 B 11/06 PAGE SECTION 1 Features — Entire Document 3 Electrical Characteristics DESCRIPTION Changed from "84dB min SINAD" to "82dB min SINAD WITH 100kHz INPUT" Updated document format to current standard; some page layout changed. Changed Total Harmonic Distortion max value from –96 to –94. A Changed Signal-to-(Noise+Distortion) min value from 84 to 82. Changed Signal-to-Noise min value from 84 to 82. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. ADS7815 SBAS065B www.ti.com 9 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) ADS7815U ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU-DCC Level-3-260C-168 HR -25 to 85 ADS7815U ADS7815U/1K ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU-DCC Level-3-260C-168 HR -25 to 85 ADS7815U ADS7815UE4 ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU-DCC Level-3-260C-168 HR -25 to 85 ADS7815U ADS7815UG4 ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU-DCC Level-3-260C-168 HR -25 to 85 ADS7815U (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2015 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device ADS7815U/1K Package Package Pins Type Drawing SOIC DW 28 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 32.4 Pack Materials-Page 1 11.35 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 18.67 3.1 16.0 32.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADS7815U/1K SOIC DW 28 1000 367.0 367.0 55.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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