LITEON LTL-14CDJN Through hole lamp Datasheet

Through Hole Lamp
Product Data Sheet
LTL-14CDJNHBP1
Spec No.: DS20-2003-283
Effective Date: 12/10/2003
Revision: -
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Features
* Designed for ease in circuit board assembly.
* Solid state light source.
* Pre-trimmed leads for PC Board mounting.
* Reliable and rugged.
* Black case enhance contrast ratio.
* Holder material: PC.
Package Dimensions
Lamp Part No.
Lens
Source Color
LTL-14CDJN
White Diffused
Yellow / Green
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm(.010") unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. Specifications are subject to change without notice.
Part No. : LTL-14CDJNHBP1
BNS-OD-C131/A4
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Property of Lite-On Only
Absolute Maximum Ratings at TA=25℃
Parameter
Power Dissipation
Peak Forward Current
Yellow
Green
Unit
60
100
mW
60
90
mA
20
30
mA
0.25
0.4
mA/℃
(1/10 Duty Cycle, 0.1ms Pulse Width)
DC Forward Current
Derating Linear From 50℃
Operating Temperature Range
-55℃ to + 100℃
Storage Temperature Range
-55℃ to + 100℃
Lead Soldering Temperature
260℃ for 5 Seconds
[1.6mm(.063") From Body]
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Electrical / Optical Characteristics at TA=25℃
Parameter
Luminous Intensity
Symbol
Iv
Color
Min.
Typ.
Yellow
2.5
8.7
Green
3.7
12.6
Max.
Unit
Test Condition
IF = 20mA
mcd
IF = 20mA
Note 1,4
Viewing Angle
Peak Emission Wavelength
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Reverse Current
2θ1/2
λp
λd
Δλ
VF
IR
Yellow
80
Green
80
Yellow
585
Green
565
Yellow
588
Green
569
Yellow
35
Green
30
Yellow
2.1
2.6
Green
2.1
2.6
Yellow
deg
nm
C
Measurement
@Peak (Fig.1)
nm
Note 3
nm
100
V
μA
Green
Capacitance
Note 2 (Fig.6)
IF = 20mA
VR = 5V
Note 5
Yellow
15
Green
35
pF
VF = 0 , f = 1MHz
Note: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
(Commission International De L'Eclairage) eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
4. The Iv guarantee should be added ±15%.
5. Reverse current is controlled by dice source.
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Typical Electrical / Optical Characteristics Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications). Consult Liteon’s Sales in advance for information on
applications in which exceptional reliability is required, particularly when the failure or malfunction of the
LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment,
medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is
recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed
container with appropriate desiccant or in a dessicator with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use
the base of the leadframe as a fulcrum during forming. Lead forming must be done before soldering at normal
temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive
mechanical
stress
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point.
Dipping the lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition (for Lamp):
Soldering iron
Temperature
Soldering time
Wave soldering
300°C Max.
3 sec. Max.
(one time only)
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or
catastrophic failure of the LED.
6. Drive Method
An LED is a current operated device, In order to ensure intensity uniformity on multiple LEDs connected in
parallel in an application; it is recommended that a current limiting resistor be incorporated in the drive circuit. In
series with each LED as shown in Circuit A below.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit.
(B) The brightness of each LED might
appear different due to the differences
in the I-V characteristics of those
LEDs
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7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage.
■ Use a conductive wrist band or anti-electrostatic glove when handling these LEDs.
■ All devices , equipment , and machinery must be properly grounded.
■ Work tables , storage racks , etc. should be properly grounded .
■ Use ion blower to neutralize the static charge which might have built up on surface of the LED's plastic
lens as a result of friction between LEDs during storage and handling.
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward
voltage, or “no lightup” at low currents. To verify for ESD damage, check for “lightup” and Vf of the suspect
LEDs at low currents.
Suggested checking list :
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionize activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel strap or
conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe
workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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8. Reliability Test
Classification
Endurance Test
Test Item
Operation Life
Test Condition
Reference Standard
Ta = Under room temperature as per data
MIL-STD-750D : 1026 (1995)
sheet maximum rating
MIL-STD-883D : 1005 (1991)
*Test time = 1000hrs (-24hrs, +72hrs)
JIS C 7021 : B-1 (1982)
High Temperature High
Ta = 65±5℃
MIL-STD-202F: 103B(1980)
Humidity Storage
RH = 90 ~ 95%
JIS C 7021 : B-11(1982)
Test time = 240hrs±2hrs
High Temperature High
Ta = 65±5℃
Humidity Reverse Bias
RH = 90 ~ 95%
JIS C 7021 : B-11(1982)
VR = 5V
Test time = 500hrs (-24hrs, +48hrs)
Environmental
High Temperature
Ta = 105±5℃
MIL-STD-883D : 1008 (1991)
Storage
Test time = 1000hrs (-24hrs, +72hrs)
JIS C 7021 : B-10 (1982)
Low Temperature
Ta = -55±5℃
JIS C 7021 : B-12 (1982)
Storage
Test time = 1000hrs (-24hrs, +72hrs)
Temperature Cycling
105℃ ~ 25℃ ~ -55℃ ~ 25℃
MIL-STD-202F : 107D (1980)
30mins 5mins 30mins 5mins
MIL-STD-750D : 1051(1995)
Test
10 cycles
MIL-STD-883D : 1010 (1991)
JIS C 7021 : A-4(1982)
Thermal Shock
Solder Resistance
105 ± 5℃ ~ -55℃ ± 5℃
MIL-STD-202F : 107D(1980)
10mins
MIL-STD-750D : 1051(1995)
10mins
10 cycles
MIL-STD-883D : 1011 (1991)
T.sol = 260 ± 5℃
MIL-STD-202F : 210A(1980)
Dwell time = 10 ± 1secs
MIL-STD-750D : 2031(1995)
JIS C 7021 : A-1(1982)
Solderability
T.sol = 230 ± 5℃
MIL-STD-202F : 208D(1980)
Dwell time = 5 ± 1secs
MIL-STD-750D : 2026(1995)
MIL-STD-883D : 2003(1991)
JIS C 7021 : A-2(1982)
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice
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