ATMEL AT17LV002-10SU Fpga configuration eeprom memory Datasheet

Features
• EE Programmable 65,536 x 1-, 131,072 x 1-, 262,144 x 1-, 524,288 x 1-, 1,048,576 x 1-,
•
•
•
•
•
•
•
•
•
•
•
•
2,097,152 x 1-, and 4,194,304 x 1-bit Serial Memories Designed to Store Configuration
Programs for Field Programmable Gate Arrays (FPGAs)
Supports both 3.3V and 5.0V Operating Voltage Applications
In-System Programmable (ISP) via Two-Wire Bus
Simple Interface to SRAM FPGAs
Compatible with Atmel AT6000, AT40K and AT94K Devices, Altera® FLEX®, APEX™
Devices, ORCA®, Xilinx® XC3000, XC4000, XC5200, Spartan®, Virtex® FPGAs
Cascadable Read-back to Support Additional Configurations or Higher-density Arrays
Very Low-power CMOS EEPROM Process
Programmable Reset Polarity
Available in 6 mm x 6 mm x 1 mm 8-lead LAP (Pin-compatible with 8-lead SOIC/VOIC
Packages), 8-lead PDIP, 8-lead SOIC, 20-lead PLCC, 20-lead SOIC and 44-lead TQFP
Packages
Emulation of Atmel’s AT24CXXX Serial EEPROMs
Low-power Standby Mode
High-reliability
– Endurance: 100,000 Write Cycles
– Data Retention: 90 Years for Industrial Parts (at 85° C) and 190 Years for
Commercial Parts (at 70° C)
Green (Pb/Halide-free/RoHS Compliant) Package Options Available
1. Description
The AT17LV series FPGA Configuration EEPROMs (Configurators) provide an easyto-use, cost-effective configuration memory for Field Programmable Gate Arrays. The
AT17LV series device is packaged in the 8-lead LAP, 8-lead PDIP, 8-lead SOIC, 20lead PLCC, 20-lead SOIC and 44-lead TQFP, see Table 1-1. The AT17LV series
Configurators uses a simple serial-access procedure to configure one or more FPGA
devices. The user can select the polarity of the reset function by programming four
EEPROM bytes. These devices also support a write-protection mechanism within its
programming mode.
The AT17LV series configurators can be programmed with industry-standard programmers, Atmel’s ATDH2200E Programming Kit or Atmel’s ATDH2225 ISP Cable.
FPGA
Configuration
EEPROM
Memory
AT17LV65
AT17LV128
AT17LV256
AT17LV512
AT17LV010
AT17LV002
AT17LV040
3.3V and 5V
System Support
2321I–CNFG–2/08
Table 1-1.
AT17LV Series Packages
AT17LV65/
AT17LV128/
AT17LV256
AT17LV512/
AT17LV010
AT17LV002
AT17LV040
8-lead LAP
Yes
Yes
Yes
(3)
8-lead PDIP
Yes
Yes
–
–
8-lead SOIC
Yes
Use 8-lead
LAP(1)
Use 8-lead
LAP(1)
(3)
20-lead PLCC
Yes
Yes
Yes
–
20-lead SOIC
Yes(2)
Yes(2)
Yes(2)
–
44-lead TQFP
–
–
Yes
Yes
Package
Notes:
1. The 8-lead LAP package has the same footprint as the 8-lead SOIC. Since an 8-lead SOIC
package is not available for the AT17LV512/010/002 devices, it is possible to use an 8-lead
LAP package instead.
2. The pinout for the AT17LV65/128/256 devices is not pin-for-pin compatible with the
AT17LV512/010/002 devices.
3. Refer to the AT17Fxxx datasheet, available on the Atmel web site.
2. Pin Configuration
Figure 2-1.
8-lead LAP
DATA
CLK
(1)
(WP ) RESET/OE
CE
Figure 2-2.
1
2
3
4
8
7
6
5
VCC
SER_EN
CEO (A2)
GND
VCC
SER_EN
CEO (A2)
GND
8-lead PDIP
DATA
CLK
(WP(1)) RESET/OE
CE
2
8
7
6
5
8-lead SOIC
DATA
CLK
(WP(1)) RESET/OE
CE
Figure 2-3.
1
2
3
4
1
2
3
4
8
7
6
5
VCC
SER_EN
CEO (A2)
GND
AT17LV65/128/256/512/010/002/040
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
20-lead PLCC
18
17
16
15
14
9
10
11
12
13
4
5
6
7
8
NC
SER_EN
NC
NC (READY(2))
CEO (A2)
NC
GND
NC
NC
NC
CLK
(WP1(2)) NC
(WP(1)) RESET/OE
(WP2(2)) NC
CE
3
2
1
20
19
NC
DATA
NC
VCC
NC
Figure 2-4.
Notes:
1. This pin is only available on AT17LV65/128/256 devices.
2. This pin is only available on AT17LV512/010/002 devices.
3. The CEO feature is not available on the AT17LV65 device.
Figure 2-5.
20-lead SOIC(1)
NC
DATA
NC
CLK
NC
RESET/OE
NC
CE
NC
GND
Note:
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VCC
NC
NC
SER_EN
NC
NC
CEO (A2)
NC
NC
NC
1. This pinout only applies to AT17LV65/128/256 devices.
3
2321I–CNFG–2/08
Figure 2-6.
20-lead SOIC(1)
DATA
NC
CLK
NC
NC
NC
NC
RESET/OE
NC
CE
Notes:
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VCC
NC
SER_EN
NC
NC
NC
NC
CEO
NC
GND
1. This pinout only applies to AT17LV512/010/002 devices.
2. The CEO feature is not available on the AT17LV65 device.
44 TQFP
44
43
42
41
40
39
38
37
36
35
34
NC
CLK
NC
NC
DATA
NC
VCC
NC
NC
SER_EN
NC
Figure 2-7.
33
32
31
30
29
28
27
26
25
24
23
1
2
3
4
5
6
7
8
9
10
11
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
READY
NC
RESET/OE
NC
CE
NC
NC
GND
NC
NC
CEO(A2)
NC
12
13
14
15
16
17
18
19
20
21
22
NC
NC
NC
NC
NC
NC
(WP1(1)) NC
NC
NC
NC
NC
Note:
4
1. This pin is only available on AT17LV002 devices.
AT17LV65/128/256/512/010/002/040
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
Figure 2-8.
Block Diagram
SER_EN
WP1(2)
WP2(2)
POWER ON
RESET
(2)
READY
Notes:
(1)
1. This pin is only available on AT17LV65/128/256 devices.
2. This pin is only available on AT17LV512/010/002 devices.
3. The CEO feature is not available on the AT17LV65 device.
5
2321I–CNFG–2/08
3. Device Description
The control signals for the configuration EEPROM (CE, RESET/OE and CCLK) interface directly
with the FPGA device control signals. All FPGA devices can control the entire configuration process and retrieve data from the configuration EEPROM without requiring an external intelligent
controller.
The configuration EEPROM RESET/OE and CE pins control the tri-state buffer on the DATA
output pin and enable the address counter. When RESET/OE is driven High, the configuration
EEPROM resets its address counter and tri-states its DATA pin. The CE pin also controls the
output of the AT17LV series configurator. If CE is held High after the RESET/OE reset pulse, the
counter is disabled and the DATA output pin is tri-stated. When OE is subsequently driven Low,
the counter and the DATA output pin are enabled. When RESET/OE is driven High again, the
address counter is reset and the DATA output pin is tri-stated, regardless of the state of CE.
When the configurator has driven out all of its data and CEO is driven Low, the device tri-states
the DATA pin to avoid contention with other configurators. Upon power-up, the address counter
is automatically reset.
This is the default setting for the device. Since almost all FPGAs use RESET Low and OE High,
this document will describe RESET/OE.
4. Pin Description
AT17LV65/
AT17LV128/
AT17LV256
AT17LV512/
AT17LV010
AT17LV002
AT17LV040
Name
I/O
8
DIP/
LAP/
SOIC
DATA
I/O
1
2
2
1
2
1
1
2
1
40
40
CLK
I
2
4
4
2
4
3
2
4
3
43
43
WP1
I
–
–
–
–
5
–
–
5
–
–
–
RESET/OE
I
3
6
6
3
6
8
3
6
8
13
13
WP2
I
–
7
–
–
7
–
–
–
CE
I
GND
20
SOIC
20
PLCC
20
SOIC
8
DIP/
LAP/
SOIC
20
PLCC
20
SOIC
44
TQFP
44
TQFP
4
8
8
4
8
10
4
8
10
15
15
5
10
10
5
10
11
5
10
11
18
18
6
14
14
6
14
6
14
21
21
O
CEO
13
13
A2
I
READY
O
–
–
–
–
15
–
–
15
–
23
23
SER_EN
I
7
17
17
7
17
18
7
17
18
35
35
8
20
20
8
20
20
8
20
20
38
38
VCC
Note:
6
20
PLCC
8
DIP/
LAP
–
–
1. The CEO feature is not available on the AT17LV65 device.
AT17LV65/128/256/512/010/002/040
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
4.1
DATA
Three-state DATA output for configuration. Open-collector bi-directional pin for programming.
4.2
CLK
Clock input. Used to increment the internal address and bit counter for reading and
programming.
4.3
WP1
WRITE PROTECT (1). Used to protect portions of memory during programming. Disabled
by default due to internal pull-down resistor. This input pin is not used during FPGA loading
operations. This pin is only available on AT17LV512/010/002 devices.
4.4
RESET/OE
Output Enable (active High) and RESET (active Low) when SER_EN is High. A Low level on
RESET/OE resets both the address and bit counters. A High level (with CE Low) enables the
data output driver. The logic polarity of this input is programmable as either RESET/OE or
RESET/OE. For most applications, RESET should be programmed active Low. This document
describes the pin as RESET/OE.
4.5
WP
Write protect (WP) input (when CE is Low) during programming only (SER_EN Low). When WP
is Low, the entire memory can be written. When WP is enabled (High), the lowest block of the
memory cannot be written. This pin is only available on AT17LV65/128/256 devices.
4.6
WP2
WRITE PROTECT (2). Used to protect portions of memory during programming. Disabled
by default due to internal pull-down resistor. This input pin is not used during FPGA loading
operations. This pin is only available on AT17LV512/010 devices.
4.7
CE
Chip Enable input (active Low). A Low level (with OE High) allows CLK to increment the address
counter and enables the data output driver. A High level on CE disables both the address and bit
counters and forces the device into a low-power standby mode. Note that this pin will not
enable/disable the device in the Two-Wire Serial Programming mode (SER_EN Low).
4.8
GND
Ground pin. A 0.2 µF decoupling capacitor between VCC and GND is recommended.
4.9
CEO
Chip Enable Output (active Low). This output goes Low when the address counter has reached
its maximum value. In a daisy chain of AT17LV series devices, the CEO pin of one device must
be connected to the CE input of the next device in the chain. It will stay Low as long as CE is
Low and OE is High. It will then follow CE until OE goes Low; thereafter, CEO will stay High until
the entire EEPROM is read again. This CEO feature is not available on the AT17LV65 device.
7
2321I–CNFG–2/08
4.10
A2
Device selection input, A2. This is used to enable (or select) the device during programming
(i.e., when SER_EN is Low). A2 has an internal pull-down resistor.
4.11
READY
Open collector reset state indicator. Driven Low during power-up reset, released when power-up
is complete. It is recommended to use a 4.7 kΩ pull-up resistor when this pin is used.
4.12
SER_EN
Serial enable must be held High during FPGA loading operations. Bringing SER_EN Low
enables the Two-Wire Serial Programming Mode. For non-ISP applications, SER_EN should be
tied to VCC.
4.13
VCC
3.3V (±10%) and 5.0V (±5% Commercial, ±10% Industrial) power supply pin.
5. FPGA Master Serial Mode Summary
The I/O and logic functions of any SRAM-based FPGA are established by a configuration program. The program is loaded either automatically upon power-up, or on command, depending
on the state of the FPGA mode pins. In Master mode, the FPGA automatically loads the configuration program from an external memory. The AT17LV Serial Configuration EEPROM has
been designed for compatibility with the Master Serial mode.
This document discusses the Atmel AT40K, AT40KAL and AT94KAL applications as well as Xilinx applications.
6. Control of Configuration
Most connections between the FPGA device and the AT17LV Serial EEPROM are simple and
self-explanatory.
• The DATA output of the AT17LV series configurator drives DIN of the FPGA devices.
• The master FPGA CCLK output drives the CLK input of the AT17LV series configurator.
• The CEO output of any AT17LV series configurator drives the CE input of the next
configurator in a cascaded chain of EEPROMs.
• SER_EN must be connected to VCC (except during ISP).
• The READY(1) pin is available as an open-collector indicator of the device’s reset status; it is
driven Low while the device is in its power-on reset cycle and released (tri-stated) when the
cycle is complete.
Note:
8
1. This pin is not available for the AT17LV65/128/256 devices.
AT17LV65/128/256/512/010/002/040
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
7. Cascading Serial Configuration EEPROMs
For multiple FPGAs configured as a daisy-chain, or for FPGAs requiring larger configuration
memories, cascaded configurators provide additional memory.
After the last bit from the first configurator is read, the clock signal to the configurator asserts its
CEO output Low and disables its DATA line driver. The second configurator recognizes the Low
level on its CE input and enables its DATA output.
After configuration is complete, the address counters of all cascaded configurators are reset if
the RESET/OE on each configurator is driven to its active (Low) level.
If the address counters are not to be reset upon completion, then the RESET/OE input can be
tied to its inactive (High) level.
The AT17LV65 devices do not have the CEO feature to perform cascaded configurations.
8. AT17LV Series Reset Polarity
The AT17LV series configurator allows the user to program the reset polarity as either
RESET/OE or RESET/OE. This feature is supported by industry-standard programmer
algorithms.
9. Programming Mode
The programming mode is entered by bringing SER_EN Low. In this mode the chip can be programmed by the Two-Wire serial bus. The programming is done at V CC supply only.
Programming super voltages are generated inside the chip.
10. Standby Mode
The AT17LV series configurators enter a low-power standby mode whenever CE is asserted
High. In this mode, the AT17LV65/128/256 configurator consumes less than 50 µA of current at
3.3V (100 µA for the AT17LV512/010 and 200 µA for the AT17LV002/040). The output remains
in a high-impedance state regardless of the state of the OE input.
9
2321I–CNFG–2/08
11. Absolute Maximum Ratings*
Operating Temperature................................... -40° C to +85° C
*NOTICE:
Storage Temperature .................................... -65° C to +150° C
Voltage on Any Pin
with Respect to Ground ..............................-0.1V to VCC +0.5V
Supply Voltage (VCC) .........................................-0.5V to +7.0V
Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those listed under operating conditions is not implied. Exposure to Absolute Maximum Rating conditions for extended
periods of time may affect device reliability.
Maximum Soldering Temp. (10 sec. @ 1/16 in.)............ 260° C
ESD (RZAP = 1.5K, CZAP = 100 pF)................................. 2000V
12. Operating Conditions
3.3V
Symbol
Description
Min
Max
Min
Max
Units
Commercial
Supply voltage relative to GND
-0° C to +70° C
3.0
3.6
4.75
5.25
V
Industrial
Supply voltage relative to GND
-40° C to +85° C
3.0
3.6
4.5
5.5
V
VCC
10
5V
AT17LV65/128/256/512/010/002/040
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
13. DC Characteristics
VCC = 3.3V ± 10%
AT17LV65/
AT17LV128/
AT17LV256
AT17LV512/
AT17LV010
AT17LV002/
AT17LV040
Symbol
Description
Min
Max
Min
Max
Min
Max
Units
VIH
High-level Input Voltage
2.0
VCC
2.0
VCC
2.0
VCC
V
VIL
Low-level Input Voltage
0
0.8
0
0.8
0
0.8
V
VOH
High-level Output Voltage (IOH = -2.5 mA)
VOL
Low-level Output Voltage (IOL = +3 mA)
VOH
High-level Output Voltage (IOH = -2 mA)
VOL
Low-level Output Voltage (IOL = +3 mA)
ICCA
Supply Current, Active Mode
IL
Input or Output Leakage Current (VIN = VCC or GND)
ICCS
Supply Current, Standby Mode
2.4
2.4
2.4
V
Commercial
0.4
2.4
0.4
2.4
0.4
2.4
V
V
Industrial
-10
0.4
0.4
0.4
V
5
5
5
mA
10
µA
10
-10
10
-10
Commercial
50
100
150
µA
Industrial
100
100
150
µA
14. DC Characteristics
VCC = 5V ± 5% Commercial; VCC = 5V ± 10% Industrial
AT17LV65/
AT17LV128/
AT17LV256
AT17LV512/
AT17LV010
AT17LV002/
AT17LV040
Symbol
Description
Min
Max
Min
Max
Min
Max
Units
VIH
High-level Input Voltage
2.0
VCC
2.0
VCC
2.0
VCC
V
VIL
Low-level Input Voltage
0
0.8
0
0.8
0
0.8
V
VOH
High-level Output Voltage (IOH = -2.5 mA)
VOL
Low-level Output Voltage (IOL = +3 mA)
VOH
High-level Output Voltage (IOH = -2 mA)
VOL
Low-level Output Voltage (IOL = +3 mA)
ICCA
Supply Current, Active Mode
IL
Input or Output Leakage Current (VIN = VCC or GND)
ICCS
Supply Current, Standby Mode
3.7
3.86
3.86
V
Commercial
0.32
3.6
0.32
3.76
0.32
3.76
V
V
Industrial
-10
0.37
0.37
0.37
V
10
10
10
mA
10
µA
10
-10
10
-10
Commercial
75
200
350
µA
Industrial
150
200
350
µA
11
2321I–CNFG–2/08
15. AC Waveforms
CE
TSCE
TSCE
THCE
RESET/OE
TLC
THOE
THC
CLK
TOE
TOH
TCAC
TDF
TCE
DATA
TOH
16. AC Waveforms when Cascading
RESET/OE
CE
CLK
TCDF
DATA
FIRST BIT
LAST BIT
TOCK
TOCE
TOOE
CEO
TOCE
12
AT17LV65/128/256/512/010/002/040
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
17. AC Characteristics
VCC = 3.3V ± 10%
AT17LV65/128/256
Commercial
Description
TOE(1)
OE to Data Delay
50
55
TCE(1)
CE to Data Delay
60
TCAC(1)
CLK to Data Delay
75
TOH
Data Hold from CE, OE, or CLK
TDF
Max
Industrial
Symbol
(2)
Min
AT17LV512/010/002/040
0
CE or OE to Data Float Delay
Min
Max
Min
Max
Industrial
Max
Units
50
55
ns
60
55
60
ns
80
55
60
ns
0
55
Commercial
0
Min
0
55
ns
50
50
ns
TLC
CLK Low Time
25
25
25
25
ns
THC
CLK High Time
25
25
25
25
ns
TSCE
CE Setup Time to CLK
(to guarantee proper counting)
35
60
30
35
ns
THCE
CE Hold Time from CLK
(to guarantee proper counting)
0
0
0
0
ns
THOE
OE High Time (guarantees counter is reset)
25
25
25
25
ns
FMAX
Maximum Clock Frequency
Notes:
10
10
15
10
MHz
1. AC test lead = 50 pF.
2. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steady-state active levels.
18. AC Characteristics when Cascading
VCC = 3.3V ± 10%
AT17LV65/128/256
Commercial
Symbol
Description
Min
Max
AT17LV512/010/002/040
Industrial
Min
Max
Units
50
50
ns
60
50
55
ns
CLK to Data Float Delay
60
60
TOCK
(1)
CLK to CEO Delay
55
TOCE
(1)
Min
Max
Industrial
Max
(2)
TCDF
Commercial
Min
CE to CEO Delay
55
60
35
40
ns
TOOE(1)
RESET/OE to CEO Delay
40
45
35
35
ns
FMAX
Maximum Clock Frequency
8
8
12.5
Notes:
10
MHz
1. AC test lead = 50 pF.
2. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steady-state active levels.
13
2321I–CNFG–2/08
19. AC Characteristics
VCC = 5V ± 5% Commercial; VCC = 5V ± 10% Industrial
AT17LV65/128/256
Commercial
Description
TOE(1)
OE to Data Delay
30
35
TCE(1)
CE to Data Delay
45
TCAC(1)
CLK to Data Delay
50
TOH
Data Hold from CE, OE, or CLK
TDF
Max
Industrial
Symbol
(2)
Min
AT17LV512/010/002/040
0
CE or OE to Data Float Delay
Min
Max
Min
Max
Industrial
Max
Units
30
35
ns
45
45
45
ns
55
50
50
ns
0
50
Commercial
0
Min
0
50
ns
50
50
ns
TLC
CLK Low Time
20
20
20
20
ns
THC
CLK High Time
20
20
20
20
ns
TSCE
CE Setup Time to CLK (to guarantee proper
counting)
35
40
20
25
ns
THCE
CE Hold Time from CLK (to guarantee proper
counting)
0
0
0
0
ns
THOE
OE High Time (guarantees counter is reset)
20
20
20
20
ns
FMAX
Maximum Clock Frequency
Notes:
12.5
12.5
15
15
MHz
1. AC test lead = 50 pF.
2. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steady-state active levels.
20. AC Characteristics when Cascading
VCC = 5V ± 5% Commercial; VCC = 5V ± 10% Industrial
AT17LV65/128/256
Commercial
Symbol
Description
Min
Max
AT17LV512/010/002/040
Industrial
Min
Max
Units
50
50
ns
40
35
40
ns
CLK to Data Float Delay
50
50
TOCK
(1)
CLK to CEO Delay
35
TOCE
(1)
Min
Max
Industrial
Max
(2)
TCDF
Commercial
Min
CE to CEO Delay
35
35
35
35
ns
TOOE(1)
RESET/OE to CEO Delay
30
35
30
30
ns
FMAX
Maximum Clock Frequency
10
10
12.5
12.5
MHz
Notes:
1. AC test lead = 50 pF.
2. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steady-state active levels.
14
AT17LV65/128/256/512/010/002/040
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
21. Thermal Resistance Coefficients(1)
AT17LV65/
AT17LV128/
AT17LV256
AT17LV512/
AT17LV010
AT17LV002
AT17LV040
θJC [° C/W]
45
45
45
–
θJA
[° C/W](2)
115.71
135.71
159.60
–
θJC [° C/W]
37
37
–
–
θJA
[° C/W](2)
107
107
–
–
θJC [° C/W]
45
–
–
–
θJA
[° C/W](2)
150
–
–
–
θJC [° C/W]
35
35
35
–
θJA
[° C/W](2)
90
90
90
–
Package Type
8CN
4
Leadless Array Package (LAP)
8P3
Plastic Dual Inline Package
(PDIP)
8S1
20J
20S2
44A
Notes:
Plastic Gull Wing Small Outline
(SOIC)
Plastic Leaded Chip Carrier
(PLCC)
Plastic Gull Wing Small Outline
(SOIC)
Thin Plastic Quad Flat
Package (TQFP)
θJC [° C/W]
–
θJA
[° C/W](2)
–
θJC [° C/W]
–
–
17
17
θJA
[° C/W](2)
–
–
62
62
1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site.
2. Airflow = 0 ft/min.
15
2321I–CNFG–2/08
Figure 21-1. Ordering Code
AT17LV65A-10PC
Voltage
Size (Bits)
Special Pinouts
Package
Temperature
3.0V to 5.5V
65
= 65K
A
= Altera
C
= 8CN4 C = Commercial
128
= 128K
P
= 8P3
I = Industrial
256
= 256K
Blank = Xilinx /Atmel/
Other
N
= 8S1
U = Fully Green
512
= 512K
J
= 20J
010
= 1M
S
= 20S2
002
= 2M
TQ = 44A
040
= 4M
BJ = 44J
Package Type
8CN4
8-lead, 6 mm x 6 mm x 1 mm, Leadless Array Package (LAP) – Pin-compatible with 8-lead SOIC/VOID Packages
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
20J
20-lead, Plastic J-leaded Chip Carrier (PLCC)
20S2
20-lead, 0.300" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
44A
44-lead, Thin (1.0 mm) Plastic Quad Flat Package Carrier (TQFP)
16
AT17LV65/128/256/512/010/002/040
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
22. Ordering Information
22.1
Standard Package Options
Memory Size
64-Kbit(1)
128-Kbit(1)
256-Kbit(1)
512-Kbit(1)
1-Mbit(1)
Ordering Code
Package(2)(3)
AT17LV65-10PC
8P3
AT17LV65-10NC
8S1
AT17LV65-10JC
20J
AT17LV65-10PI
8P3
AT17LV65-10NI
8S1
AT17LV65-10JI
20J
AT17LV128-10PC
8P3
AT17LV128-10NC
8S1
AT17LV128-10JC
20J
AT17LV128-10SC
20S2
AT17LV128-10PI
8P3
AT17LV128-10NI
8S1
AT17LV128-10JI
20J
AT17LV128-10SI
20S2
AT17LV256-10PC
8P3
AT17LV256-10NC
8S1
AT17LV256-10JC
20J
AT17LV256-10SC
20S2
AT17LV256-10PI
8P3
AT17LV256-10NI
8S1
AT17LV256-10JI
20J
AT17LV256-10SI
20S2
AT17LV512-10PC
8P3
AT17LV512-10JC
20J
AT17LV512-10PI
8P3
Operation Range
Industrial
(-40° C to 85° C)
Commercial
(0° C to 70° C)
Industrial
(-40° C to 85° C)
Commercial
(0° C to 70° C)
Industrial
(-40° C to 85° C)
Commercial
(0° C to 70° C)
Industrial
(-40° C to 85° C)
AT17LV512-10JI
20J
AT17LV010-10PC
8P3
AT17LV010-10JC
20J
AT17LV010-10PI
8P3
AT17LV010-10JI
20J
AT17LV002-10JC
20J
Commercial
(0° C to 70° C)
AT17LV002-10JI
20J
Industrial
(-40° C to 85° C)
2-Mbit(1)
Notes:
Commercial
(0° C to 70° C)
Commercial
(0° C to 70° C)
Industrial
(-40° C to 85° C)
1. For operating 5V operating voltage, please refer to the corresponding AC and DC Characteristics.
2. For the -10SC and -10SI packages, customers may migrate to the AT17LVXXX-10SU.
3. For the -10TQC and -10TQI packages, customers may migrate to the AT17LVXXX-10TQU.
17
2321I–CNFG–2/08
22.2
Green Package Options (Pb/Halide-free/RoHS Compliant)
Memory Size
256-Kbit(1)
512-Kbit(1)
1-Mbit(1)
2-Mbit(1)
4-Mbit(1)
Note:
18
Ordering Code
Package
AT17LV256-10CU
8CN4
AT17LV256-10JU
20J
AT17LV256-10NU
8S1
AT17LV256-10PU
8P3
AT17LV256-10SU
20S2
AT17LV512-10CU
8CN4
AT17LV512-10JU
20J
AT17LV010-10CU
8CN4
AT17LV010-10JU
20J
AT17LV010-10PU
8P3
AT17LV002-10CU
8CN4
AT17LV002-10JU
20J
AT17LV002-10SU
20S2
AT17LV002-10TQU
44A
AT17LV040-10TQU
44A
Operation Range
Industrial
(-40° C to 85° C)
1. For operating 5V operating voltage, please refer to the corresponding AC and DC Characteristics.
AT17LV65/128/256/512/010/002/040
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
23. Packaging Information
23.1
8CN4 – LAP
Marked Pin1 Indentifier
E
A
A1
D
Side View
Top View
Pin1 Corner
L1
0.10 mm
TYP
8
1
COMMON DIMENSIONS
(Unit of Measure = mm)
e
7
2
6
3
b
5
4
e1
L
Bottom View
Note:
SYMBOL
MIN
NOM
MAX
A
0.94
1.04
1.14
A1
0.30
0.34
0.38
b
0.45
0.50
0.55
D
5.89
5.99
6.09
E
5.89
5.99
6.09
e
1.27 BSC
e1
1.10 REF
NOTE
1
L
0.95
1.00
1.05
1
L1
1.25
1.30
1.35
1
1. Metal Pad Dimensions.
2. All exposed metal area shall have the following finished platings.
Ni: 0.0005 to 0.015 mm
Au: 0.0005 to 0.001 mm
2/15/08
Package Drawing Contact:
[email protected]
TITLE
8CN4, 8-lead (6 x 6 x 1.04 mm Body),
Lead Pitch 1.27mm,
Leadless Array Package (LAP)
GPC
DMH
DRAWING NO.
8CN4
REV.
D
19
2321I–CNFG–2/08
23.2
8P3 – PDIP
E
1
E1
N
Top View
c
eA
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
D
e
D1
A2 A
MIN
NOM
A2
0.115
0.130
0.195
b
0.014
0.018
0.022
5
b2
0.045
0.060
0.070
6
b3
0.030
0.039
0.045
6
c
0.008
0.010
0.014
D
0.355
0.365
0.400
D1
0.005
E
0.300
0.310
0.325
4
E1
0.240
0.250
0.280
3
SYMBOL
A
b2
L
b3
b
4 PLCS
Side View
Notes:
0.210
0.100 BSC
eA
0.300 BSC
0.115
NOTE
2
3
3
e
L
MAX
0.130
4
0.150
2
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
R
20
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
DRAWING NO.
REV.
8P3
B
AT17LV65/128/256/512/010/002/040
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
23.3
8S1 – SOIC
C
1
E
E1
L
N
Ø
TOP VIEW
END VIEW
e
b
COMMON DIMENSIONS
(Unit of Measure = mm)
A
A1
SYMBOL
MIN
NOM
MAX
A1
0.10
–
0.25
NOTE
D
SIDE VIEW
Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
3/17/05
R
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
DRAWING NO.
REV.
8S1
C
21
2321I–CNFG–2/08
23.4
20J – PLCC
PIN NO. 1
1.14(0.045) X 45˚
1.14(0.045) X 45˚
0.318(0.0125)
0.191(0.0075)
IDENTIFIER
e
E1
E
D2/E2
B1
B
A2
D1
A1
D
A
0.51(0.020)MAX
45˚ MAX (3X)
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MS-018, Variation AA.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
SYMBOL
MIN
NOM
MAX
A
4.191
–
4.572
A1
2.286
–
3.048
A2
0.508
–
–
D
9.779
–
10.033
D1
8.890
–
9.042
E
9.779
–
10.033
E1
8.890
–
9.042
D2/E2
7.366
–
8.382
B
0.660
–
0.813
B1
0.330
–
0.533
e
NOTE
Note 2
Note 2
1.270 TYP
10/04/01
R
22
2325 Orchard Parkway
San Jose, CA 95131
TITLE
20J, 20-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
REV.
20J
B
AT17LV65/128/256/512/010/002/040
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
23.5
20S2 – SOIC
23
2321I–CNFG–2/08
23.6
44A – TQFP
PIN 1
B
PIN 1 IDENTIFIER
E1
e
E
D1
D
C
0˚~7˚
A1
A2
A
L
COMMON DIMENSIONS
(Unit of Measure = mm)
Notes:
1. This package conforms to JEDEC reference MS-026, Variation ACB.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
SYMBOL
MIN
NOM
MAX
A
–
–
1.20
A1
0.05
–
0.15
A2
0.95
1.00
1.05
D
11.75
12.00
12.25
D1
9.90
10.00
10.10
E
11.75
12.00
12.25
E1
9.90
10.00
10.10
B
0.30
–
0.45
C
0.09
–
0.20
L
0.45
–
0.75
e
NOTE
Note 2
Note 2
0.80 TYP
10/5/2001
R
24
2325 Orchard Parkway
San Jose, CA 95131
TITLE
44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
DRAWING NO.
REV.
44A
B
AT17LV65/128/256/512/010/002/040
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
24. Revision History
Revision Level – Release Date
History
H – March 2006
Added last-time buy for AT17LVXXX-10CC and AT17LVXXX-10CI.
I – February 2008
Removed -10SC, 10SI, -10TQC, -10TQI, -10BJC and -10BJI
devices from ordering information.
25
2321I–CNFG–2/08
Headquarters
International
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Atmel Asia
Room 1219
Chinachem Golden Plaza
77 Mody Road Tsimshatsui
East Kowloon
Hong Kong
Tel: (852) 2721-9778
Fax: (852) 2722-1369
Atmel Europe
Le Krebs
8, Rue Jean-Pierre Timbaud
BP 309
78054 Saint-Quentin-enYvelines Cedex
France
Tel: (33) 1-30-60-70-00
Fax: (33) 1-30-60-71-11
Atmel Japan
9F, Tonetsu Shinkawa Bldg.
1-24-8 Shinkawa
Chuo-ku, Tokyo 104-0033
Japan
Tel: (81) 3-3523-3551
Fax: (81) 3-3523-7581
Technical Support
[email protected]
Sales Contact
www.atmel.com/contacts
Product Contact
Web Site
www.atmel.com
Literature Requests
www.atmel.com/literature
Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any
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2321I–CNFG–2/08
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