TI1 ADS1286U/2K5G4 12-bit micro power sampling analog-to-digital converter Datasheet

®
ADS
ADS1286
128
ADS
6
128
6
12-Bit Micro Power Sampling
ANALOG-TO-DIGITAL CONVERTER
FEATURES
DESCRIPTION
●
●
●
●
The ADS1286 is a 12-bit, 20kHz analog-to-digital
converter with a differential input and sample and hold
amplifier and consumes only 250µA of supply current. The ADS1286 offers an SPI and SSI compatible
serial interface for communications over a two or three
wire interface. The combination of a serial two wire
interface and micropower consumption makes the
ADS1286 ideal for remote applications and for those
requiring isolation.
The ADS1286 is available in a 8-pin plastic mini DIP
and a 8-lead SOIC.
SERIAL INTERFACE
GUARANTEED NO MISSING CODES
20kHz SAMPLING RATE
LOW SUPPLY CURRENT: 250µA
APPLICATIONS
●
●
●
●
REMOTE DATA ACQUISITION
ISOLATED DATA ACQUISITION
TRANSDUCER INTERFACE
BATTERY OPERATED SYSTEMS
Control
SAR
VREF
DOUT
+In
Serial
Interface
CDAC
–In
S/H Amp
Comparator
DCLOCK
CS/SHDN
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111
Twx: 910-952-1111 • Internet: http://www.burr-brown.com/ • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
©
SBAS053
1996 Burr-Brown Corporation
PDS-1335B
Printed in U.S.A. October, 1998
SPECIFICATIONS
At TA = TMIN to TMAX, +VCC = +5V, VREF = +5V, fSAMPLE = 12.5kHz, , fCLK = 16 • fSAMPLE, unless otherwise specified.
ADS1286, ADS1286A
PARAMETER
CONDITIONS
MIN
+In – (–In)
+In
–In
0
–0.2
–0.2
ANALOG INPUT
Full-Scale Input Range
Absolute Input Voltage
ADS1286K, ADS1286B
ADS1286C, ADS1286L
MAX
MIN
MAX
MIN
VREF
VCC +0.2
+0.2
✻
✻
✻
✻
✻
✻
✻
✻
✻
TYP
Capacitance
Leakage Current
✻
✻
25
±1
SYSTEM PERFORMANCE
Resolution
No Missing Codes
Integral Linearity
Differential Linearity
Offset Error
Gain Error
Noise
Power Supply Rejection
±2
±1.0
±3
±8
VIN =
VIN =
VIN =
VIN =
SINAD
Spurious Free Dynamic Range
REFERENCE INPUT
REF Input Range
Input Resistance
5.0Vp-p
5.0Vp-p
5.0Vp-p
5.0Vp-p
at
at
at
at
✻
✻
✻
✻
✻
✻
1.25
DIGITAL INPUT/OUTPUT
Logic Family
Logic Levels:
VIH
VIL
VOH
VOL
Data Format
✻
TEMPERATURE RANGE
Specified Performance
ADS1286, K, L
ADS1286A, B, C
✻
✻
–85
–83
72
90
✻
✻
✻
✻
✻
✻
✻
✻
dB
dB
dB
dB
VCC+0.05V
✻
2.5
20
20
3
0.0
3
0.0
5
200
250
0
–40
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
+VCC
0.8
+VCC
0.4
+4.50
±1
±0.75
✻
✻
Bits
Bits
LSB
LSB
LSB
LSB
µVrms
dB
✻
✻
✻
✻
✻
5.25
400
500
3
✻
✻
✻
✻
✻
+70
+85
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
V
MΩ
MΩ
µA
µA
µA
✻
✻
✻
✻
V
V
V
V
✻
✻
✻
✻
V
µA
µA
µA
✻
✻
°C
°C
✻
✻
✻
✻
✻
✻
Straight Binary
POWER SUPPLY REQUIREMENTS
Power Supply Voltage
VCC
Quiescent Current, VANA
tCYC ≥ 640µS, fCLK ≤ 25kHz
tCYC = 90µS, fCLK = 200kHz
Power Down
CS = VCC
V
V
V
pF
µA
500
CMOS
IIH = +5µA
IIL = +5µA
IOH = 250µA
IOL = 250µA
✻
✻
✻
Clk Cycles
Clk Cycles
kHz
2.5
5000
5000
0.01
2.4
2.4
CS = VCC
CS = GND, fCLK = 0Hz
CS = VCC
tCYC ≥ 640µs, fCLK ≤ 25kHz
tCYC = 80µs, fCLK = 200kHz
Current Drain
±0.5
±0.25
✻
✻
✻
✻
✻
±0.75
✻
✻
✻
1kHz
5kHz
1kHz
1kHz
UNITS
✻
12
1.5
DYNAMIC CHARACTERISTICS
Total Harmonic Distortion
MAX
✻
✻
±1
±0.5
0.75
±2
50
82
TYP
✻
✻
✻
12
12
SAMPLING DYNAMICS
Conversion Time
Acquisition Time
Small Signal Bandwidth
TYP
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻ Specifications same as grade to the left.
TIMING CHARACTERISTICS
fCLK = 200kHz, TA = TMIN to TMAX.
SYMBOL
PARAMETER
CONDITIONS
MIN
tSMPL
tSMPL (MAX)
tCONV
tdDO
tdis
ten
thDO
tf
tr
tCSD
tSUCS
Analog Input Sample Time
Maximum Sampling Frequency
Conversion Time
Delay TIme, DCLOCK↓ to DOUT Data Valid
Delay TIme, CS↑ to DOUT Hi-Z
Delay TIme, DCLOCK↓ to DOUT Enable
Output Data Remains Valid After DCLOCK↓
DOUT Fall Time
DOUT Rise Time
Delay Time, CS↓ to DCLOCK↓
Delay Time, CS↓ to DCLOCK↑
See Operating Sequence
ADS1286
See Operating Sequence
See Test Circuits
See Test Circuits
See Test Circuits
CLOAD = 100pF
See Test Circuits
See Test Circuits
See Operating Sequence
See Operating Sequence
1.5
®
ADS1286
2
15
30
TYP
12
85
25
50
30
70
60
MAX
UNITS
2.0
20
Clk Cycles
kHz
Clk Cycles
ns
ns
ns
ns
ns
ns
ns
ns
150
50
100
100
100
0
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
+VCC ..................................................................................................... +6V
Analog Input ....................................................... –0.3V to (+VCC + 300mV)
Logic Input ......................................................... –0.3V to (+VCC + 300mV)
Case Temperature ......................................................................... +100°C
Junction Temperature .................................................................... +150°C
Storage Temperature ..................................................................... +125°C
External Reference Voltage .............................................................. +5.5V
Electrostatic discharge can cause damage ranging from performance degradation to complete device failure. BurrBrown Corporation recommends that all integrated circuits
be handled and stored using appropriate ESD protection
methods.
NOTE: (1) Stresses above these ratings may permanently damage the device.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet
published specifications.
PIN CONFIGURATION
VREF
1
+In
2
8
+VCC
7
DCLOCK
ADS1286
–In
3
6
DOUT
GND
4
5
CS/SHDN
8-Pin Mini PDIP
8-Lead SOIC
PIN ASSIGNMENTS
PIN
NAME
1
VREF
DESCRIPTION
2
+In
Non Inverting Input.
3
–In
Inverting Input. Connect to ground or remote ground sense point.
Reference Input.
4
GND
5
CS/SHDN
Ground.
6
DOUT
7
DCLOCK
8
+VCC
Chip Select when low, Shutdown Mode when high.
The serial output data word is comprised of 12 bits of data. In operation the data is valid on the falling edge of DCLOCK. The
second clock pulse after the falling edge of CS enables the serial output. After one null bit the data is valid for the next 12 edges.
Data Clock synchronizes the serial data transfer and determines conversion speed.
Power Supply.
PACKAGE/ORDERING INFORMATION
PRODUCT
ADS1286P
ADS1286PK
ADS1286PL
ADS1286U
ADS1286UK
ADS1286UL
ADS1286PA
ADS1286PB
ADS1286PC
ADS1286UA
ADS1286UB
ADS1286UC
INTEGRAL
LINEARITY
TEMPERATURE
RANGE
PACKAGE
PACKAGE
DRAWING
NUMBER(1)
±2
±2
±1
±2
±2
±1
±2
±2
±1
±2
±2
±1
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Plastic DIP
Plastic DIP
Plastic DIP
SOIC
SOIC
SOIC
Plastic DIP
Plastic DIP
Plastic DIP
SOIC
SOIC
SOIC
006
006
006
182
182
182
006
006
006
182
182
182
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix
C of Burr-Brown IC Data Book.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN
assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject
to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not
authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
®
3
ADS1286
TYPICAL PERFORMANCE CURVES
At TA = +25, VCC = +5V, VREF = +5V, fSAMPLE = 12.5kHz, fCLK = 16 • fSAMPLE, unless otherwise specified.
REFERENCE CURRENT vs SAMPLE RATE
REFERENCE CURRENT vs TEMPERATURE
4.0
3.5
2.0
Reference Current (µA)
Reference Current (µA)
2.5
1.5
1.0
0.5
3.0
2.5
2.0
1.5
1.0
0
0
2
4
6
8
10
12
–55
–40
–25
Sample Rate (kHz)
0
25
70
85
Temperature (°C)
CHANGE IN OFFSET vs TEMPERATURE
CHANGE IN OFFSET vs REFERENCE VOLTAGE
0.6
5
0.4
4
Delta from 25°C (LSB)
Change in Offset (LSB)
4.5
3.5
3
2.5
2
1.5
1
0.2
0
–0.2
–0.4
0.5
–0.6
0
1
2
3
Reference Voltage (V)
4
–55
5
CHANGE IN INTEGRAL LINEARITY AND DIFFERENTIAL
LINEARITY vs REFERENCE VOLTAGE
–25
0
25
Temperature (°C)
70
85
CHANGE IN GAIN vs REFERENCE VOLTAGE
0.10
4
3.5
0.05
Change in Gain (LSB)
Delta from +5V Reference (LSB)
–40
Change in Differential
Linearity (LSB)
0.00
–0.05
–0.10
Change in Integral
Linearity (LSB)
–0.15
3
2.5
2
1.5
1
0.5
–0.20
0
1
2
3
Reference Voltage (V)
4
5
1
®
ADS1286
4
2
3
Reference Voltage (V)
4
5
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25, VCC = +5V, VREF = +5V, fSAMPLE = 12.5kHz, fCLK = 16 • fSAMPLE, unless otherwise specified.
EFFECTIVE NUMBER OF BITS
vs REFERENCE VOLTAGE
DIFFERENTIAL LINEARITY ERROR vs CODE
3.0
Differential Linearity Error (LSB)
11.75
11.5
11.25
11
10.75
10.5
10.25
2.0
1.0
0
–1.0
–2.0
–3.0
10
0.1
1
Reference Voltage (V)
10
0
100
100
90
90
Spurious Free Dynamic Range
and Signal-to-Noise Ratio (dB)
Signal-to-(Noise + Distortion) (dB)
2048
Code
4095
SPURIOUS FREE DYNAMIC RANGE
AND SIGNAL-TO-NOISE RATIO vs FREQUENCY
SIGNAL-TO-(NOISE + DISTORTION)
vs FREQUENCY
80
70
60
50
40
30
20
Spurious Free Dynamic Range
80
70
60
Signal-to-Noise Ratio
50
40
30
20
10
10
0
0
0.1
1
Frequency (kHz)
0.1
10
SIGNAL-TO-(NOISE + DISTORTION) vs INPUT LEVEL
1
Frequency (kHz)
10
TOTAL HARMONIC DISTORTION vs FREQUENCY
80
0
70
–10
Total Harmonic Distortion (dB)
Signal-to-(Noise + Distortion) (dB)
Effective Number of Bits (rms)
12
60
50
40
30
20
10
–20
–30
–40
–50
–60
–70
–80
–90
–100
0
–40
–35
–30
–25
–20
–15
Input Level (dB)
–10
–5
0.1
0
1
Frequency (kHz)
10
®
5
ADS1286
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25, VCC = +5V, VREF = +5V, fSAMPLE = 12.5kHz, fCLK = 16 • fSAMPLE, unless otherwise specified.
4096 POINT FFT
PEAK-TO-PEAK NOISE vs REFERENCE VOLTAGE
10
0
Peak-to-Peak Noise (LSB)
9
Magnitude (dB)
–25
–50
–75
–100
8
7
6
5
4
3
2
1
–125
0
0
2
4
0.1
6
1
Reference Voltage (V)
Frequency (kHz)
POWER SUPPLY REJECTION vs RIPPLE FREQUENCY
10
CHANGE GAIN vs TEMPERATURE
0
0.15
VRIPPLE = 20mV
–20
0.1
Delta from 25°C (LSB)
Power Supply Rejection (dB)
–10
–30
–40
–50
–60
–70
0.05
0
–0.05
–0.1
–80
–0.15
–90
1
10
100
1000
Ripple Frequency (kHz)
–55
10000
–25
0
25
70
85
Temperature (°C)
POWER DOWN SUPPLY CURRENT
vs TEMPERATURE
SUPPLY CURRENT vs TEMPERATURE
3
400
2.5
350
Supply Current (µA)
Supply Current (µA)
–40
2
1.5
1
0.5
300
fSAMPLE = 12.5kHz
250
200
fSAMPLE = 1.6kHz
150
0
100
–55
–40
–25
0
25
70
85
–55
Temperature (°C)
–25
0
25
Temperature (°C)
®
ADS1286
–40
6
70
85
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25, VCC = +5V, VREF = +5V, fSAMPLE = 12.5kHz, fCLK = 16 • fSAMPLE, unless otherwise specified.
DIGITAL INPUT LINE THRESHOLD
vs SUPPLY VOLTAGE
INTEGRAL LINEARITY ERROR vs CODE
Digital Input Threshold Voltage (V)
3
2.0
1.0
0
–1.0
–2.0
–3.0
2.5
2
1.5
1
0.5
0
0
2048
Code
4095
3
3.25 3.5 3.75
4
4.25 4.5 4.75
5
5.25 5.5
Supply Voltage (V)
INPUT LEAKAGE CURRENT vs TEMPERATURE
10
Leakage Current (nA)
Integral Linearity Error (LSB)
3.0
1
0.1
0.01
–55
–40
–25
0
25
70
85
Temperature (°C)
®
7
ADS1286
TIMING DIAGRAMS AND TEST CIRCUITS
1.4V
3kΩ
DOUT
VOH
DOUT
VOL
Test Point
tr
100pF
CLOAD
tf
Voltage Waveforms for DOUT Rise and Fall Times tr, and tf
Load Circuit for tdDO, tr, and tf
Test Point
DCLOCK
VIL
VCC
tdDO
DOUT
VOH
DOUT
tdis Waveform 2, ten
3kΩ
tdis Waveform 1
100pF
CLOAD
VOL
thDO
Load Circuit for tdis and tden
Voltage Waveforms for DOUT Delay Times, tdDO
VIH
CS/SHDN
DOUT
Waveform 1(1)
CS/SHDN
90%
DCLOCK
10%
DOUT
1
2
tdis
DOUT
Waveform 2(2)
ten
Voltage Waveforms for tdis
NOTES: (1) Waveform 1 is for an output with internal conditions such that
the output is HIGH unless disabled by the output control. (2) Waveform 2
is for an output with internal conditions such that the output is LOW unless
disabled by the output control.
Voltage Waveforms for ten
®
ADS1286
VOL
8
B11
tCYC
CS/SHDN
POWER
DOWN
tSUCS
DCLOCK
tCSD
DOUT
HI-Z
NULL
BIT
B11 B10 B9
(MSB)
tSMPL
NULL
BIT
HI-Z
B8
B7
B6
B5
B4
B3
B2
B1 B0(1)
tCONV
B11 B10
B9
B8
tDATA
Note: (1) After completing the data transfer, if further clocks are applied with CS
LOW, the ADC will output LSB-First data then followed with zeroes indefinitely.
tCYC
CS/SHDN
tSUCS
POWER DOWN
DCLOCK
tCSD
DOUT
HI-Z
tSMPL
NULL
BIT
B11 B10 B9
(MSB)
HI-Z
B8
B7
B6
B5
B4
B3
B2
B1
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9 B10 B11
(2)
tCONV
tDATA
Note: (2) After completing the data transfer, if further clocks are applied with CS
LOW, the ADC will output zeroes indefinitely.
tDATA: During this time, the bias current and the comparator power down and the reference input
becomes a high impedance node, leaving the CLK running to clock out LSB-First data or zeroes.
FIGURE 1. ADS1286 Operating Sequence.
SERIAL INTERFACE
leaving the DCLOCK running to clock out the LSB first
data or zeroes. If the CS input is not running rail-to-rail, the
input logic buffer will draw current. This current may be
large compared to the typical supply current. To obtain the
lowest supply current, bring the CS pin to ground when it is
low and to supply voltage when it is high.
The ADS1286 communicates with microprocessors and other
external digital systems via a synchronous 3-wire serial interface. DCLOCK synchronizes the data transfer with each bit
being transmitted on the falling DCLOCK edge and captured
on the rising DCLOCK edge in the receiving system. A falling
CS initiates data transfer as shown in Figure 1. After CS falls,
the second DCLOCK pulse enables DOUT. After one null bit,
the A/D conversion result is output on the DOUT line. Bringing
CS high resets the ADS1286 for the next data exchange.
Supply Current (µA)
1000
MICROPOWER OPERATION
With typical operating currents of 250µA and automatic
shutdown between conversions, the ADS1286 achieves extremely low power consumption over a wide range of
sample rates (see Figure 2). The auto-shutdown allows the
supply current to drop with sample rate.
100
10
1
0.1k
SHUTDOWN
The ADS1286 is equipped with automatic shutdown features. The device draws power when the CS pin is LOW and
shuts down completely when the pin is HIGH. The bias
circuit and comparator powers down and the reference input
becomes high impedance at the end of each conversion
TA = 25°C
VCC = 5V
VREF = 5V
fCLK = 16 • fSAMPLE
1k
10k
100k
Sample Rate (kHz)
FIGURE 2. Automatic Power Shutdown Between Conversions Allows Power Consumption to Drop with
Sample Rate.
®
9
ADS1286
REDUCED REFERENCE
OPERATION
MINIMIZING POWER DISSIPATION
In systems that have significant time between conversions,
the lowest power drain will occur with the minimum CS
LOW time. Bringing CS LOW, transferring data as quickly
as possible, and then bringing it back HIGH will result in the
lowest current drain. This minimizes the amount of time the
device draws power. After a conversion the A/D automatically shuts down even if CS is held LOW. If the clock is left
running to clock out LSB-data or zero, the logic will draw a
small amount of current (see Figure 3).
The effective resolution of the ADS1286 can be increased
by reducing the input span of the converter. The ADS1286
exhibits good linearity and gain over a wide range of
reference voltages (see Typical Performance Curves “ Change
in Linearity vs Reference Voltage” and “Change in Gain vs
Reference Voltage”). However, care must be taken when
operating at low values of VREF because of the reduced LSB
size and the resulting higher accuracy requirement placed on
the converter. The following factors must be considered
when operating at low VREF values:
6.00
TA = 25°C
VCC = +5V
VREF = +5V
fCLK = 16 • fSAMPLE
Supply Current (µA)
5.00
4.00
1. Offset
2. Noise
OFFSET WITH REDUCED VREF
CS = LOW
(GND)
3.00
The offset of the ADS1286 has a larger effect on the output
code. When the ADC is operated with reduced reference
voltage. The offset (which is typically a fixed voltage)
becomes a larger fraction of an LSB as the size of the LSB
is reduced. The Typical Performance Curve “Change in
Offset vs Reference Voltage” shows how offset in LSBs is
related to reference voltage for a typical value of VOS. For
example, a VOS of 122µV which is 0.1 LSB with a 5V
reference becomes 0.5LSB with a 1V reference and 2.5LSBs
with a 0.2V reference. If this offset is unacceptable, it can be
corrected digitally by the receiving system or by offsetting
the negative input of the ADS1286.
2.00
1.00
CS HIGH
(VCC)
0.00
0.1
1
10
100
Sample Rate (kHz)
FIGURE 3. Shutdown Current with CS HIGH is Lower than
with CS LOW.
RC INPUT FILTERING
It is possible to filter the inputs with an RC network as
shown in Figure 4. For large values of CFILTER (e.g., 1µF),
the capacitive input switching currents are averaged into a
net DC current. Therefore, a filter should be chosen with a
small resistor and large capacitor to prevent DC drops across
the resistor. The magnitude of the DC current is approximately IDC = 20pF x VIN/tCYC and is roughly proportional to
VIN. When running at the minimum cycle time of 64µs, the
input current equals 1.56µA at VIN = 5V. In this case, a filter
resistor of 75Ω will cause 0.1LSB of full-scale error. If a
larger filter resistor must be used, errors can be eliminated
by increasing the cycle time.
RFILTER
NOISE WITH REDUCED VREF
The total input referred noise of the ADS1286 can be
reduced to approximately 200µV peak-to-peak using a ground
plane, good bypassing, good layout techniques and minimizing noise on the reference inputs. This noise is insignificant
with a 5V reference but will become a larger fraction of an
LSB as the size of the LSB is reduced.
For operation with a 5V reference, the 200µV noise is only
0.15LSB peak-to-peak. In this case, the ADS1286 noise will
contribute virtually no uncertainty to the output code. However, for reduced references, the noise may become a significant fraction of an LSB and cause undesirable jitter in the
output code. For example, with a 2.5V reference this same
200µV noise is 0.3LSB peak-to-peak. If the reference is
further reduced to 1V, the 200µV noise becomes equal to
0.8LSBs and a stable code may be difficult to achieve. In
this case averaging multiple readings may be necessary.
IDC
VIN
CFILTER
ADS1286
FIGURE 4. RC Input Filtering.
®
ADS1286
10
+5V
+5V
+5V
R8
46kΩ
D1
R1
150kΩ
TC1
R9
1kΩ
OPA237
C2
0.1µF
R3
500kΩ
R2
59kΩ
0.4V
R7
10Ω
R6
1MΩ
C1
10µF
VREF
MUX
0.2V
ADS1286
DOUT
A0
CS/SHDN
A1
Thermocouple
TC3
R4
1kΩ
C4
10µF
ISO Thermal Block
R10
1kΩ
DCLOCK
C3
0.1µF
TC2
0.3V
U2
U1
R5
500Ω
U3
C5
0.1µF
R11
1kΩ
0.1V
R12
1kΩ
µP
3-Wire
Interface
U4
FIGURE 5. Thermocouple Application Using a MUX to Scale the Input Range of the ADS1286.
+VCC
REF200
(100µA)
0.1µF
VREF
1
8
DCLOCK
2
ADS1286
RTD
DOUT
µP
CS/SHDN
3
4
FIGURE 6. ADS1286 with RTD Sensor.
®
11
ADS1286
PACKAGE OPTION ADDENDUM
www.ti.com
12-Feb-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ADS1286P
LIFEBUY
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
ADS1286P
ADS1286PA
LIFEBUY
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
ADS1286P
A
ADS1286PAG4
LIFEBUY
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
ADS1286P
A
ADS1286PC
LIFEBUY
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
ADS1286P
C
ADS1286PG4
LIFEBUY
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
ADS1286P
ADS1286PK
LIFEBUY
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
ADS1286P
K
ADS1286PL
LIFEBUY
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
ADS1286P
L
ADS1286U
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
1286U
ADS1286U/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
1286U
ADS1286U/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
1286U
ADS1286UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
1286U
A
ADS1286UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
1286U
A
ADS1286UA/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
1286U
A
ADS1286UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
1286U
A
ADS1286UB
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
1286U
B
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-Feb-2016
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ADS1286UBG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
1286U
B
ADS1286UC
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
ADS
1286U
C
ADS1286UCG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
ADS
1286U
C
ADS1286UG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
1286U
ADS1286UL
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
1286U
L
ADS1286UL/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
1286U
L
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
12-Feb-2016
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ADS1286U/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
ADS1286UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
ADS1286UL/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS1286U/2K5
SOIC
D
8
2500
367.0
367.0
35.0
ADS1286UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
ADS1286UL/2K5
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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